Thermal medium supply device

Abstract

To provide a thermal medium supply device capable of decreasing a temperature of a thermal medium moving from a heating side tank to a cooling side tank without using external energy.SOLUTION: A thermal medium supply device 1 comprises: a pre-cooling heat exchanger 40 for cooling a thermal medium moving in a tank communication pipe 20 from a heating side tank 15 toward a cooling side tank 16; a pre-cooling thermal medium supply pipe 41 branched from a heating side return pipe 25 and extending until the pre-cooling heat exchanger 40; and a pre-cooling thermal medium return pipe 42 extending from the pre-cooling heat exchanger 40 and connected to the heating side return pipe 25. A branch point B1 of the pre-cooling thermal medium supply pipe 41 from the heating side return pipe 25 is positioned at an upstream side of a heating device 7 and the thermal medium before being heated by the heating device 7 is supplied to the pre-cooling heat exchanger 40. A connection point C1 of the pre-cooling thermal medium return pipe 42 and the heating side return pipe 25 is positioned at the upstream side of the heating device 7, and the thermal medium passing the pre-cooling heat exchanger 40 is supplied to the heating device 7 through the heating side return pipe 25.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a heat medium supply device that supplies a heat medium for adjusting the temperature of a semiconductor manufacturing device such as an etching device, a CVD device, or a PVD device to the semiconductor manufacturing device.

Background Art

[0002] A semiconductor manufacturing device (for example, an etching device, a CVD device, or a PVD device) for manufacturing a semiconductor device is configured to execute a manufacturing process while controlling a processing temperature. For example, in an etching device, the processing temperature of a wafer is adjusted by flowing a liquid as a temperature-adjusted heat medium through a flow path formed in a susceptor that supports the wafer.

[0003] FIG. 7 is a schematic diagram showing a conventional example of a heat medium supply device that supplies a heat medium to a semiconductor manufacturing device. The heat medium supply device 500 includes a heating device 501 that heats the heat medium and a cooling device 502 that cools the heat medium. The heat medium is stored in a heating-side tank 504 and a cooling-side tank 505. The heat medium heated by the heating device 501 is transferred to the heating-side tank 504 and further transferred from the heating-side tank 504 into the heat medium mixing device 507. On the other hand, the heat medium stored in the cooling-side tank 505 is transferred to the cooling device 502 and cooled by the cooling device 502. The cooled heat medium is transferred to the heat medium mixing device 507.

[0004] The heated heat medium and the cooled heat medium are mixed in the heat medium mixing device 507 and adjusted to the temperature required for the semiconductor manufacturing device 510. The heat medium with the adjusted temperature is sent to the semiconductor manufacturing device 510, whereby the semiconductor manufacturing device 510 is maintained at the target temperature. The heat medium that has passed through the semiconductor manufacturing device 510 is returned to the heat medium mixing device 507, diverted by the heat medium mixing device 507, and transferred to the heating-side tank 504 and the cooling-side tank 505. In this way, the heat medium circulates between the heat medium supply device 500 and the semiconductor manufacturing device 510.

[0005] Since the heated heat medium and the cooled heat medium used for temperature adjustment of the semiconductor manufacturing apparatus 510 are mixed in the heat medium mixing device 507, the flow rate of the heat medium sent from the heating side tank 504 to the semiconductor manufacturing apparatus 510 does not match the flow rate of the heat medium returning from the semiconductor manufacturing apparatus 510 to the heating side tank 504. Similarly, the flow rate of the heat medium sent from the cooling side tank 505 to the semiconductor manufacturing apparatus 510 does not match the flow rate of the heat medium returning from the semiconductor manufacturing apparatus 510 to the cooling side tank 505. As a result, a difference occurs in the liquid levels of the heat medium in the heating side tank 504 and the cooling side tank 505.

[0006] Therefore, when the difference in the liquid levels of the heat medium in the heating side tank 504 and the cooling side tank 505 becomes large, the on-off valve 520 is opened to move the heat medium from the heating side tank 504 to the cooling side tank 505 or from the cooling side tank 505 to the heating side tank 504. As a result, the amounts of the heat medium in the heating side tank 504 and the cooling side tank 505 can be balanced.

[0007] However, when the high-temperature heat medium moves from the heating side tank 504 to the cooling side tank 505, the temperature of the heat medium in the cooling side tank 505 rises, increasing the load on the cooling device 502. On the other hand, when the low-temperature heat medium moves from the cooling side tank 505 to the heating side tank 504, the temperature of the heat medium in the heating side tank 504 heated by the heating device 501 drops, resulting in heat loss. Furthermore, as a result of the temperature change in each tank, the temperature of the heat medium supplied to the semiconductor manufacturing apparatus 510 may change.

[0008] Therefore, in order to mitigate the temperature change of the heat medium in the heating side tank 504 and the cooling side tank 505, it has been proposed to heat or cool the heat medium moving between the heating side tank 504 and the cooling side tank 505 by the heater 522 and the chiller 523 (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0009]

Patent Document 1

[0010] However, since the heater 522 and the chiller 523 are devices that utilize externally supplied energy (mainly electricity), the overall energy consumption of the heat medium supply device 500 increases. In particular, in factories where many semiconductor manufacturing devices 510 are arranged, reduction of energy consumption is required.

[0011] Therefore, the present invention provides a heat medium supply device capable of lowering the temperature of a heat medium moving from a heating side tank to a cooling side tank without using external energy. Further, the present invention provides a heat medium supply device capable of raising the temperature of a heat medium moving from a cooling side tank to a heating side tank without using external energy. MEANS FOR SOLVING THE PROBLEMS

[0012] In one aspect, there is provided a heat medium supply device for supplying a heat medium for adjusting the temperature of a semiconductor manufacturing apparatus, the heat medium supply device including a heating device for heating the heat medium, a cooling device for cooling the heat medium, a heating medium transfer pipe for sending the heated heat medium to the semiconductor manufacturing apparatus, a cooling medium transfer pipe for sending the cooled heat medium to the semiconductor manufacturing apparatus, a heating-side tank and a cooling-side tank for holding the heat medium, a tank communication pipe for communicating the heating-side tank and the cooling-side tank, a heating-side return pipe for returning the heat medium that has passed through the semiconductor manufacturing apparatus to the heating-side tank, a cooling-side return pipe for returning the heat medium that has passed through the semiconductor manufacturing apparatus to the cooling-side tank, a precooling heat exchanger connected to the tank communication pipe and configured to cool the heat medium flowing through the tank communication pipe from the heating-side tank toward the cooling-side tank, a precooling heat medium supply pipe branching from the heating-side return pipe and extending to the precooling heat exchanger, and a precooling heat medium return pipe extending from the precooling heat exchanger and connected to the heating-side return pipe. The heating device is provided in the heating-side return pipe and configured to heat the heat medium flowing through the heating-side return pipe. A branch point of the precooling heat medium supply pipe from the heating-side return pipe is located upstream of the heating device and configured to supply the heat medium before being heated by the heating device to the precooling heat exchanger. A connection point between the precooling heat medium return pipe and the heating-side return pipe is located upstream of the heating device and configured to supply the heat medium that has passed through the precooling heat exchanger to the heating device through the heating-side return pipe. The precooling heat exchanger is configured to perform heat exchange between the heat medium flowing through the tank communication pipe from the heating-side tank toward the cooling-side tank and the heat medium supplied through the precooling heat medium supply pipe.

[0013] The precooling heat exchanger performs heat exchange between the heat medium flowing through the tank communication pipe from the heating side tank to the cooling side tank and the heat medium that has passed through the semiconductor manufacturing apparatus. The heat of the heat medium flowing through the tank communication pipe is recovered by the heat medium that has passed through the semiconductor manufacturing apparatus, whereby the temperature of the heat medium flowing from the heating side tank to the cooling side tank can be lowered without using an external energy source. In addition, the heat medium that has recovered heat in the precooling heat exchanger is sent to the heating device and heated by the heating device. Since the temperature of the heat medium that has recovered heat has already risen, the load on the heating device is reduced, and energy savings can be achieved.

[0014] In one aspect, the heat medium supply device further includes a communication valve provided in the tank communication pipe, a precooling supply valve provided in the precooling heat medium return pipe or the precooling heat medium supply pipe, and an operation control unit that controls the operations of the communication valve and the precooling supply valve. The operation control unit is configured to open the precooling supply valve while the communication valve is open.

[0015] While the communication valve is open, the precooling supply valve is opened, and the heat medium that has passed through the semiconductor manufacturing apparatus is sent to the precooling heat exchanger. Accordingly, the heat medium flowing through the tank communication pipe is cooled by the precooling heat exchanger. As a result, it is possible to prevent the high-temperature heat medium in the heating side tank from directly moving to the low-temperature side tank.

[0016] In one aspect, the heat medium supply device further includes a heating side return temperature measuring device provided in the heating side return pipe at a position upstream of the heating device, and a communication temperature measuring device provided in the tank communication pipe. The operation control unit is configured to open the communication valve and the precooling supply valve when the temperature of the heat medium in the heating side return pipe measured by the heating side return temperature measuring device is lower than the temperature of the heat medium in the tank communication pipe measured by the communication temperature measuring device.

[0017] At a certain stage in the manufacturing process executed by the semiconductor manufacturing apparatus, the heat medium may be heated by the semiconductor manufacturing apparatus. When the heat medium passing through the semiconductor manufacturing apparatus is at a high temperature, the heat medium cannot cool the heat medium flowing in the tank communication pipe and cannot recover the heat. Therefore, when the temperature of the heat medium in the heating side return pipe is lower than the temperature of the heat medium in the tank communication pipe, the operation control unit opens the communication valve and the pre-cooling supply valve. By such an operation, the heat medium passing through the semiconductor manufacturing apparatus can cool the heat medium flowing in the tank communication pipe and can recover the heat.

[0018] In one aspect, the heat medium supply device is connected to the tank communication pipe, and includes a preheating heat exchanger that heats the heat medium flowing through the tank communication pipe from the cooling side tank toward the heating side tank, a preheating heat medium supply pipe that branches from the cooling side return pipe and extends to the preheating heat exchanger, and a preheating heat medium return pipe that extends from the preheating heat exchanger and is connected to the cooling side return pipe. The cooling device is provided in the cooling side return pipe and is configured to cool the heat medium flowing through the cooling side return pipe. The branch point of the preheating heat medium supply pipe from the cooling side return pipe is located upstream of the cooling device and is configured to supply the heat medium before being cooled by the cooling device to the preheating heat exchanger. The connection point between the preheating heat medium return pipe and the cooling side return pipe is located upstream of the cooling device and is configured to supply the heat medium that has passed through the preheating heat exchanger to the cooling device through the cooling side return pipe. The preheating heat exchanger is configured to perform heat exchange between the heat medium flowing through the tank communication pipe from the cooling side tank toward the heating side tank and the heat medium supplied through the preheating heat medium supply pipe.

[0019] The preheating heat exchanger performs heat exchange between the heat medium flowing through the tank communication pipe from the cooling side tank toward the heating side tank and the heat medium that has passed through the semiconductor manufacturing apparatus. The heat of the heat medium that has passed through the semiconductor manufacturing apparatus is recovered by the heat medium flowing through the tank communication pipe, whereby the temperature of the heat medium flowing from the cooling side tank toward the heating side tank can be raised without using an external energy source. In addition, the heat medium deprived of heat by the preheating heat exchanger is sent to the cooling device and cooled by the cooling device. Since the temperature of the heat medium deprived of heat has already decreased, the load on the cooling device is reduced, and energy savings can be achieved.

[0020] In one aspect, the semiconductor manufacturing apparatus is a plurality of semiconductor manufacturing apparatuses, and each of the heating medium transfer pipe, the cooling medium transfer pipe, the heating side return pipe, and the cooling side return pipe is connected to the plurality of semiconductor manufacturing apparatuses.

[0021] In one aspect, there is provided a heat medium supply device for supplying a heat medium for adjusting the temperature of a semiconductor manufacturing apparatus, the heat medium supply device including a heating device for heating the heat medium, a cooling device for cooling the heat medium, a heating medium transfer pipe for sending the heated heat medium to the semiconductor manufacturing apparatus, a cooling medium transfer pipe for sending the cooled heat medium to the semiconductor manufacturing apparatus, a heating-side tank and a cooling-side tank for holding the heat medium, a tank communication pipe for communicating the heating-side tank and the cooling-side tank, a heating-side return pipe for returning the heat medium that has passed through the semiconductor manufacturing apparatus to the heating-side tank, a cooling-side return pipe for returning the heat medium that has passed through the semiconductor manufacturing apparatus to the cooling-side tank, a preheating heat exchanger connected to the tank communication pipe and configured to heat the heat medium flowing through the tank communication pipe from the cooling-side tank toward the heating-side tank, a preheating heat medium supply pipe branching from the cooling-side return pipe and extending to the preheating heat exchanger, and a preheating heat medium return pipe extending from the preheating heat exchanger and connected to the cooling-side return pipe. The cooling device is provided in the cooling-side return pipe and is configured to cool the heat medium flowing through the cooling-side return pipe. A branch point of the preheating heat medium supply pipe from the cooling-side return pipe is located upstream of the cooling device and is configured to supply the heat medium before being cooled by the cooling device to the preheating heat exchanger. A connection point of the preheating heat medium return pipe and the cooling-side return pipe is located upstream of the cooling device and is configured to supply the heat medium that has passed through the preheating heat exchanger to the cooling device through the cooling-side return pipe. The preheating heat exchanger is configured to perform heat exchange between the heat medium flowing through the tank communication pipe from the cooling-side tank toward the heating-side tank and the heat medium supplied through the preheating heat medium supply pipe.

[0022] The preheating heat exchanger performs heat exchange between the heat medium flowing through the tank communication pipe from the cooling side tank toward the heating side tank and the heat medium that has passed through the semiconductor manufacturing apparatus. The heat of the heat medium that has passed through the semiconductor manufacturing apparatus is recovered by the heat medium flowing through the tank communication pipe, whereby the temperature of the heat medium flowing from the cooling side tank toward the heating side tank can be raised without using an external energy source. In addition, the heat medium deprived of heat by the preheating heat exchanger is sent to the cooling device and cooled by the cooling device. Since the temperature of the heat medium deprived of heat has already decreased, the load on the cooling device is reduced and energy savings can be achieved.

[0023] In one aspect, the heat medium supply device further includes a communication valve provided in the tank communication pipe, a preheating supply valve provided in the preheating heat medium return pipe or the preheating heat medium supply pipe, and an operation control unit that controls the operations of the communication valve and the preheating supply valve. The operation control unit is configured to open the preheating supply valve while the communication valve is open.

[0024] While the communication valve is open, the preheating supply valve is opened, and the heat medium that has passed through the semiconductor manufacturing apparatus is sent to the preheating heat exchanger. Accordingly, the heat medium flowing through the tank communication pipe is heated by the preheating heat exchanger. As a result, it is possible to prevent the low-temperature heat medium in the cooling side tank from directly moving to the high-temperature side tank.

[0025] In one aspect, the heat medium supply device further includes a cooling side return temperature measuring device provided in the cooling side return pipe at a position upstream of the cooling device and a communication temperature measuring device provided in the tank communication pipe. The operation control unit is configured to open the communication valve and the preheating supply valve when the temperature of the heat medium in the cooling side return pipe measured by the cooling side return temperature measuring device is higher than the temperature of the heat medium in the tank communication pipe measured by the communication temperature measuring device.

[0026] At a certain stage in the manufacturing process executed by a semiconductor manufacturing apparatus, the heat medium may be cooled by the semiconductor manufacturing apparatus. When the heat medium that has passed through the semiconductor manufacturing apparatus is at a low temperature, the heat medium cannot heat the heat medium flowing in the tank communication pipe, and the heat medium flowing in the tank communication pipe cannot recover heat from the heat medium that has passed through the semiconductor manufacturing apparatus. Therefore, when the temperature of the heat medium in the cooling-side return pipe is higher than the temperature of the heat medium in the tank communication pipe, the operation control unit opens the communication valve and the preheating supply valve. By such an operation, the heat medium that has passed through the semiconductor manufacturing apparatus can heat the heat medium flowing in the tank communication pipe, and the heat medium flowing in the tank communication pipe can recover heat from the heat medium that has passed through the semiconductor manufacturing apparatus.

[0027] In one aspect, the heat medium supply device is connected to the tank communication pipe, and includes a precooling heat exchanger that cools the heat medium flowing through the tank communication pipe from the heating-side tank toward the cooling-side tank, a precooling heat medium supply pipe that branches from the heating-side return pipe and extends to the precooling heat exchanger, and a precooling heat medium return pipe that extends from the precooling heat exchanger and is connected to the heating-side return pipe. The heating device is provided in the heating-side return pipe and is configured to heat the heat medium flowing through the heating-side return pipe. The branch point of the precooling heat medium supply pipe from the heating-side return pipe is located upstream of the heating device and is configured to supply the heat medium before being heated by the heating device to the precooling heat exchanger. The connection point between the precooling heat medium return pipe and the heating-side return pipe is located upstream of the heating device and is configured to supply the heat medium that has passed through the precooling heat exchanger to the heating device through the heating-side return pipe. The precooling heat exchanger is configured to perform heat exchange between the heat medium flowing through the tank communication pipe from the heating-side tank toward the cooling-side tank and the heat medium supplied through the precooling heat medium supply pipe.

[0028] The pre-cooling heat exchanger performs heat exchange between the heat medium flowing through the tank communication pipe from the heating-side tank to the cooling-side tank and the heat medium that has passed through the semiconductor manufacturing apparatus. The heat of the heat medium flowing through the tank communication pipe is recovered by the heat medium that has passed through the semiconductor manufacturing apparatus, whereby the temperature of the heat medium flowing from the heating-side tank to the cooling-side tank can be lowered without using an external energy source. In addition, the heat medium that has recovered heat in the pre-cooling heat exchanger is sent to the heating device and heated by the heating device. Since the temperature of the heat medium that has recovered heat has already risen, the load on the heating device is reduced and energy savings can be achieved.

[0029] In one aspect, the semiconductor manufacturing apparatus is a plurality of semiconductor manufacturing apparatuses, and each of the heating medium transfer pipe, the cooling medium transfer pipe, the heating-side return pipe, and the cooling-side return pipe is connected to the plurality of semiconductor manufacturing apparatuses.

Advantages of the Invention

[0030] The heat medium supply device performs heat exchange between the heat medium flowing through the tank communication pipe and the heat medium that has passed through the semiconductor manufacturing apparatus. Since the heat medium that has passed through the semiconductor manufacturing apparatus is used as energy for temperature adjustment, the heat medium supply device can lower the temperature of the heat medium moving from the heating-side tank to the cooling-side tank or raise the temperature of the heat medium moving from the cooling-side tank to the heating-side tank without using external energy.

Brief Description of the Drawings

[0031]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Embodiments for Carrying Out the Invention

[0032] Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a schematic diagram showing an embodiment of a semiconductor manufacturing system including a heat medium supply device 1 and a semiconductor manufacturing device 2. The heat medium supply device 1 is configured to supply a heat medium for adjusting the temperature of the semiconductor manufacturing device 2 (for example, an etching device, a CVD device, a PVD device, etc.) to the semiconductor manufacturing device 2.

[0033] As shown in FIG. 1, the semiconductor manufacturing system includes a heat medium supply device 1, a heat medium mixing device 5 connected to the heat medium supply device 1, and a semiconductor manufacturing device 2 connected to the heat medium mixing device 5. The heat medium supply device 1 is connected to the semiconductor manufacturing device 2 via the heat medium mixing device 5. In the embodiment shown in FIG. 1, an etching device that performs a dry etching process on a wafer is used as the semiconductor manufacturing device 2, but the semiconductor manufacturing device 2 is not limited to this embodiment.

[0034] The heat medium supply device 1 includes a heating device 7 for heating the heat medium, a cooling device 8 for cooling the heat medium, a heating medium transfer pipe 11 for sending the heated heat medium to the semiconductor manufacturing device 2, and a cooling medium transfer pipe 12 for sending the cooled heat medium to the semiconductor manufacturing device 2. The heating medium transfer pipe 11 and the cooling medium transfer pipe 12 are connected to the heat medium mixing device 5 and communicate with the semiconductor manufacturing device 2 via the heat medium mixing device 5. The heat medium mixing device 5 is provided with a plurality of flow rate adjustment valves (not shown) respectively communicating with the heating medium transfer pipe 11 and the cooling medium transfer pipe 12. The heat medium mixing device 5 is configured to adjust the temperature required for the semiconductor manufacturing device 2 by mixing the heated heat medium and the cooled heat medium while adjusting the flow rate of the heated heat medium and the flow rate of the cooled heat medium.

[0035] In one embodiment, a fluorine-based inert liquid is used as the heat medium. Examples of the heating device 7 include an electric heater. Examples of the cooling device 8 include a vapor compression refrigerator, an absorption refrigerator, etc. The vapor compression refrigerator includes a turbo refrigerator, a screw refrigerator, a rotary refrigerator, a scroll refrigerator, etc., and these can be used. The configurations of the heating device 7 and the cooling device 8 are not particularly limited as long as they can heat and cool the heat medium.

[0036] The heat medium supply device 1 includes a heating side tank 15 and a cooling side tank 16 that hold the heat medium, a tank communication pipe 20 that communicates the heating side tank 15 and the cooling side tank 16, a communication valve 21 provided in the tank communication pipe 20, a heating side return pipe 25 that returns the heat medium that has passed through the semiconductor manufacturing apparatus 2 to the heating side tank 15, and a cooling side return pipe 26 that returns the heat medium that has passed through the semiconductor manufacturing apparatus 2 to the cooling side tank 16. The heating side return pipe 25 extends from the heat medium mixing device 5 to the heating side tank 15. The cooling side return pipe 26 extends from the heat medium mixing device 5 to the cooling side tank 16. The heating medium transfer pipe 11 extends from the heating side tank 15 to the heat medium mixing device 5. The cooling medium transfer pipe 12 extends from the cooling side tank 16 to the heat medium mixing device 5. The gas layer part of the heating side tank 15 and the gas layer part of the cooling side tank 16 communicate with each other through a gas layer communication pipe 17. The gas layer communication pipe 17 is located at a position higher than the liquid level of the heat medium in the heating side tank 15 and the cooling side tank 16.

[0037] The heating device 7 is provided in the heating side return pipe 25 and is configured to heat the heat medium flowing through the heating side return pipe 25. The heating device 7 is arranged upstream of the heating side tank 15. The heat medium heated by the heating device 7 is transferred to the heating side tank 15 through the heating side return pipe 25 and stored in the heating side tank 15. The heat medium supply device 1 includes a heating side liquid level detection device 31 that detects the liquid level of the heat medium in the heating side tank 15.

[0038] The heat medium supply device 1 includes a heating side pump 33 connected to the heating medium transfer pipe 11. When the heating side pump 33 is operated, the heat medium (heated heat medium) in the heating side tank 15 is sent to the heat medium mixing device 5 through the heating medium transfer pipe 11, and further sent from the heat medium mixing device 5 to the semiconductor manufacturing apparatus 2.

[0039] The cooling device 8 is provided in the cooling medium transfer pipe 12 and is configured to cool the heat medium flowing through the cooling medium transfer pipe 12. The cooling device 8 is arranged downstream of the cooling side tank 16. The heat medium supply device 1 includes a cooling side pump 34 connected to the cooling medium transfer pipe 12. When the cooling side pump 34 is operated, the heat medium is cooled by the cooling device 8 while flowing from the cooling side tank 16 through the cooling medium transfer pipe 12. The cooled heat medium is sent to the heat medium mixing device 5 through the cooling medium transfer pipe 12 and further sent from the heat medium mixing device 5 to the semiconductor manufacturing device 2. The heat medium supply device 1 includes a cooling side liquid level detection device 32 for detecting the liquid level of the heat medium in the cooling side tank 16.

[0040] The heated heat medium and the cooled heat medium are mixed by the heat medium mixing device 5 to generate a heat medium having a preset temperature. The heat medium having the preset temperature is transferred from the heat medium mixing device 5 to the semiconductor manufacturing device 2 and heats or cools a wafer (not shown) in the semiconductor manufacturing device 2 while passing through the semiconductor manufacturing device 2. The heat medium that has passed through the semiconductor manufacturing device 2 is returned to the heat medium mixing device 5 and is divided into two flows. One of the two flows flows into the heating side return pipe 25, and the other flows into the cooling side return pipe 26. The heat medium flowing into the heating side return pipe 25 is heated by the heating device 7 and then flows into the heating side tank 15. The heat medium flowing into the cooling side return pipe 26 flows into the cooling side tank 16 through the cooling side return pipe 26.

[0041] In this way, the heat medium circulates between the heating side tank 15 and the semiconductor manufacturing device 2 through the heating medium transfer pipe 11 and the heating side return pipe 25, and at the same time circulates between the cooling side tank 16 and the semiconductor manufacturing device 2 through the cooling medium transfer pipe 12 and the cooling side return pipe 26. As the heat medium circulates between the heat medium supply device 1 and the semiconductor manufacturing device 2, a difference occurs between the liquid level of the heat medium in the heating side tank 15 and the liquid level of the heat medium in the cooling side tank 16.

[0042] When the liquid level of the heat transfer medium in the heating-side tank 15 is too high or the liquid level of the heat transfer medium in the cooling-side tank 16 is too low, the heat transfer medium supply device 1 of the present embodiment is configured to move the heat transfer medium from the heating-side tank 15 to the cooling-side tank 16 as follows.

[0043] The heat transfer medium supply device 1 includes an operation control unit 35 that controls the operation of a communication valve 21 provided in a tank communication pipe 20. When the liquid level of the heat transfer medium in the heating-side tank 15 detected by the heating-side liquid level detection device 31 exceeds a preset upper limit level, or when the liquid level of the heat transfer medium in the cooling-side tank 16 detected by the cooling-side liquid level detection device 32 falls below a preset lower limit level, the operation control unit 35 opens the communication valve 21 to move the heat transfer medium from the heating-side tank 15 to the cooling-side tank 16 through the tank communication pipe 20. The driving force for moving the heat transfer medium is the difference in liquid head between the heating-side tank 15 and the cooling-side tank 16.

[0044] The operation control unit 35 includes at least one computer. The operation control unit 35 includes a storage device 35a in which a program and the like are stored, and an arithmetic device 35b that executes arithmetic operations according to instructions included in the program. The storage device 35a includes a main storage device such as a random access memory (RAM), and an auxiliary storage device such as a hard disk drive (HDD) and a solid state drive (SSD). Examples of the arithmetic device 35b include a CPU (central processing unit) and a GPU (graphics processing unit). However, the specific configuration of the operation control unit 35 is not limited to these examples.

[0045] When the liquid level of the heat transfer medium in the heating-side tank 15 decreases to a predetermined level or the liquid level of the heat transfer medium in the cooling-side tank 16 increases to a predetermined level as a result of the movement of the heat transfer medium, the operation control unit 35 is configured to close the communication valve 21. The communication valve 21 is an actuator-driven valve such as an electric valve.

[0046] When the communication valve 21 is open, the heat medium supply device 1 is configured to cool the heat medium that moves from the heating-side tank 15 to the cooling-side tank 16 through the tank communication pipe 20. More specifically, the heat medium supply device 1 is connected to the tank communication pipe 20 and includes a precooling heat exchanger 40 that cools the heat medium flowing through the tank communication pipe 20 from the heating-side tank 15 toward the cooling-side tank 16, a precooling heat medium supply pipe 41 that branches from the heating-side return pipe 25 and extends to the precooling heat exchanger 40, and a precooling heat medium return pipe 42 that extends from the precooling heat exchanger 40 and is connected to the heating-side return pipe 25.

[0047] The heat medium supply device 1 further includes a precooling supply valve 45 provided in the precooling heat medium return pipe 42. In the present embodiment, the precooling supply valve 45 is a three-way valve and is disposed at a connection point C1 between the precooling heat medium return pipe 42 and the heating-side return pipe 25. The precooling supply valve 45 is an actuator-driven valve such as an electric valve. In one embodiment, the precooling supply valve 45 may be a two-way valve (on-off valve). The precooling supply valve 45 is electrically connected to the operation control unit 35, and the operation of the precooling supply valve 45 is controlled by the operation control unit 35.

[0048] When the operation control unit 35 opens the precooling supply valve 45, the precooling heat medium return pipe 42 communicates with the heating-side return pipe 25. As a result, at least a part of the heat medium flowing through the heating-side return pipe 25 flows into the precooling heat medium supply pipe 41. The heat medium is transferred to the precooling heat exchanger 40 through the precooling heat medium supply pipe 41. When the operation control unit 35 closes the precooling supply valve 45, the communication between the precooling heat medium return pipe 42 and the heating-side return pipe 25 is blocked. As a result, the supply of the heat medium to the precooling heat exchanger 40 through the precooling heat medium supply pipe 41 is stopped.

[0049] The pre-cooling heat exchanger 40 is configured to perform heat exchange between the heat medium supplied through the pre-cooling heat medium supply pipe 41 and the heat medium flowing through the tank communication pipe 20 from the heating-side tank 15 toward the cooling-side tank 16. The heat medium flowing through the tank communication pipe 20 is the heat medium heated by the heating device 7 and is at a high temperature. On the other hand, the heat medium flowing through the pre-cooling heat medium supply pipe 41 is a mixture of the heated heat medium and the cooled heat medium. Therefore, the temperature of the heat medium flowing through the pre-cooling heat medium supply pipe 41 is lower than the temperature of the heat medium flowing through the tank communication pipe 20. In the pre-cooling heat exchanger 40, the heat of the heat medium flowing through the tank communication pipe 20 is recovered by the heat medium transferred through the pre-cooling heat medium supply pipe 41. As a result, the temperature of the heat medium flowing through the tank communication pipe 20 decreases, and then the heat medium with the decreased temperature flows into the cooling-side tank 16.

[0050] In this way, the pre-cooling heat exchanger 40 can lower the temperature of the heat medium flowing from the heating-side tank 15 toward the cooling-side tank 16 without using external energy. Since an excessive temperature rise of the heat medium in the cooling-side tank 16 is prevented, the load on the cooling device 8 can be reduced, and the heat medium supply device 1 can accurately control the temperature of the heat medium to be supplied to the semiconductor manufacturing device 2.

[0051] The branch point B1 of the pre-cooling heat medium supply pipe 41 from the heating-side return pipe 25 is located upstream of the heating device 7 and supplies the heat medium before being heated by the heating device 7 to the pre-cooling heat exchanger 40. The connection point C1 between the pre-cooling heat medium return pipe 42 and the heating-side return pipe 25 is also located upstream of the heating device 7, and the heat medium that has passed through the pre-cooling heat exchanger 40 is supplied to the heating device 7 through the pre-cooling heat medium return pipe 42 and the heating-side return pipe 25. The branch point B1 is located upstream of the connection point C1.

[0052] The heat medium flowing through the pre-cooling heat medium return pipe 42 has already been heated by heat recovery in the pre-cooling heat exchanger 40. Therefore, the heat medium that has passed through the pre-cooling heat medium return pipe 42 is sent to the heating device 7 in a state where its temperature has risen, and is further heated by the heating device 7. Since the temperature of the heat medium that has recovered heat has already risen, the load on the heating device 7 is reduced, and energy savings can be achieved.

[0053] The operation control unit 35 is configured to open the pre-cooling supply valve 45 while the communication valve 21 is open. While the communication valve 21 is open, the pre-cooling supply valve 45 is opened, and the heat medium that has passed through the semiconductor manufacturing apparatus 2 is sent to the pre-cooling heat exchanger 40. Therefore, the heat medium flowing through the tank communication pipe 20 is cooled by the pre-cooling heat exchanger 40. As a result, it is possible to prevent the high-temperature heat medium in the heating-side tank 15 from directly moving to the low-temperature side tank.

[0054] The heat medium supply device 1 further includes a heating-side return temperature measuring device 47 provided in the heating-side return pipe 25 at a position upstream of the heating device 7, and a communication temperature measuring device 51 provided in the tank communication pipe 20. The communication temperature measuring device 51 is disposed between the heating-side tank 15 and the communication valve 21. The heating-side return temperature measuring device 47 and the communication temperature measuring device 51 are electrically connected to the operation control unit 35. The measured value of the temperature of the heat medium in the heating-side return pipe 25 measured by the heating-side return temperature measuring device 47 and the measured value of the temperature of the heat medium in the tank communication pipe 20 measured by the communication temperature measuring device 51 are sent to the operation control unit 35. The operation control unit 35 is configured to open the communication valve 21 and the pre-cooling supply valve 45 when the temperature of the heat medium in the heating-side return pipe 25 is lower than the temperature of the heat medium in the tank communication pipe 20.

[0055] At a certain stage in the manufacturing process executed by the semiconductor manufacturing apparatus 2, the heat medium may be heated by the semiconductor manufacturing apparatus 2. When the heat medium that has passed through the semiconductor manufacturing apparatus 2 is at a high temperature, the heat medium cannot cool the heat medium flowing in the tank communication pipe 20 and cannot recover heat. Therefore, when the temperature of the heat medium in the heating side return pipe 25 is lower than the temperature of the heat medium in the tank communication pipe 20, the operation control unit 35 opens the communication valve 21 and the precooling supply valve 45. By such an operation, the heat medium that has passed through the semiconductor manufacturing apparatus 2 can cool the heat medium flowing in the tank communication pipe 20 and can recover heat.

[0056] In the embodiment shown in FIG. 1, the precooling supply valve 45 is provided in the precooled heat medium return pipe 42. However, in one embodiment, the precooling supply valve 45 may be provided in the precooled heat medium supply pipe 41. For example, the precooling supply valve 45 may be provided at the branch point B1 from the heating side return pipe 25 of the precooled heat medium supply pipe 41. In this configuration, when the precooling supply valve 45 is opened, the precooled heat medium supply pipe 41 communicates with the heating side return pipe 25. As a result, at least a part of the heat medium flowing through the heating side return pipe 25 flows into the precooled heat medium supply pipe 41. When the precooling supply valve 45 is closed, the communication between the precooled heat medium supply pipe 41 and the heating side return pipe 25 is blocked. As a result, the supply of the heat medium to the precooling heat exchanger 40 through the precooled heat medium supply pipe 41 is stopped.

[0057] FIG. 2 is a schematic diagram showing another embodiment of the heat medium supply device 1. The configuration and operation of this embodiment not specifically described are the same as those of the embodiment described with reference to FIG. 1, and thus the overlapping description is omitted. In the embodiment shown in FIG. 2, the precooling supply valve 45 provided in the precooled heat medium return pipe 42 is a two-way valve (on-off valve). The precooling supply valve 45 is an actuator-driven valve such as an electric valve.

[0058] The heat medium supply device 1 includes a heating-side flow rate limiting device 55 provided in the heating-side return pipe 25. The heating-side flow rate limiting device 55 is arranged upstream of the heating device 7. More specifically, the heating-side flow rate limiting device 55 is located downstream of the branch point B1 from the heating-side return pipe 25 of the pre-cooling heat medium supply pipe 41 and upstream of the connection point C1 between the pre-cooling heat medium return pipe 42 and the heating-side return pipe 25.

[0059] The heating-side flow rate limiting device 55 is configured to limit the flow rate of the heat medium flowing through the heating-side return pipe 25. Specific examples of the heating-side flow rate limiting device 55 include an orifice, a flow control valve, and the like. A part of the heat medium flowing through the heating-side return pipe 25 is transferred to the pre-cooling heat exchanger 40 through the pre-cooling heat medium supply pipe 41, and the other part of the heat medium flowing through the heating-side return pipe 25 passes through the heating-side flow rate limiting device 55 and is transferred to the heating device 7.

[0060] Also in this embodiment, the pre-cooling heat exchanger 40 can lower the temperature of the heat medium flowing from the heating-side tank 15 toward the cooling-side tank 16 without using external energy. In addition, the heat medium that has recovered heat in the pre-cooling heat exchanger 40 is sent to the heating device 7 and heated by the heating device 7. Since the temperature of the heat medium that has recovered heat has already risen, the load on the heating device 7 is reduced, and energy savings can be achieved.

[0061] In the embodiment shown in FIG. 2, the pre-cooling supply valve 45 is provided in the pre-cooling heat medium return pipe 42. However, in one embodiment, the pre-cooling supply valve 45 may be provided in the pre-cooling heat medium supply pipe 41. In this configuration, when the pre-cooling supply valve 45 is opened, the pre-cooling heat medium supply pipe 41 communicates with the heating-side return pipe 25. As a result, a part of the heat medium flowing through the heating-side return pipe 25 flows into the pre-cooling heat medium supply pipe 41. When the pre-cooling supply valve 45 is closed, the communication between the pre-cooling heat medium supply pipe 41 and the heating-side return pipe 25 is blocked. As a result, the supply of the heat medium to the pre-cooling heat exchanger 40 through the pre-cooling heat medium supply pipe 41 is stopped.

[0062] FIG. 3 is a schematic diagram showing another embodiment of the heat medium supply device 1. The configuration and operation of this embodiment not specifically described are the same as those of the embodiment described with reference to FIG. 1, and thus the overlapping description is omitted. The heat medium supply device 1 of the embodiment shown in FIG. 3 includes a preheating heat exchanger 60 that heats the heat medium flowing through the tank communication pipe 20 from the cooling side tank 16 toward the heating side tank 15, instead of the precooling heat exchanger 40.

[0063] As shown in FIG. 3, the heat medium supply device 1 includes the preheating heat exchanger 60 connected to the tank communication pipe 20, a preheating heat medium supply pipe 61 that branches from the cooling side return pipe 26 and extends to the preheating heat exchanger 60, and a preheating heat medium return pipe 62 that extends from the preheating heat exchanger 60 and is connected to the cooling side return pipe 26. The cooling device 8 is provided in the cooling side return pipe 26 and is configured to cool the heat medium flowing through the cooling side return pipe 26. The heat medium cooled by the cooling device 8 is transferred to the cooling side tank 16 through the cooling side return pipe 26 and stored in the cooling side tank 16.

[0064] The heat medium supply device 1 of this embodiment is configured to move the heat medium from the cooling side tank 16 to the heating side tank 15 as follows when the liquid level of the heat medium in the cooling side tank 16 is too high or the liquid level of the heat medium in the heating side tank 15 is too low.

[0065] When the liquid level of the heat medium in the cooling side tank 16 detected by the cooling side liquid level detection device 32 exceeds a preset upper limit level, or when the liquid level of the heat medium in the heating side tank 15 detected by the heating side liquid level detection device 31 falls below a preset lower limit level, the operation control unit 35 opens the communication valve 21 and is configured to move the heat medium from the cooling side tank 16 to the heating side tank 15 through the tank communication pipe 20. The driving force for the movement of the heat medium is the difference in liquid head between the heating side tank 15 and the cooling side tank 16.

[0066] When the communication valve 21 is open, the preheating heat exchanger 60 is configured to heat the heat medium that moves from the cooling-side tank 16 to the heating-side tank 15 through the tank communication pipe 20. As a result of the movement of the heat medium, when the liquid level of the heat medium in the cooling-side tank 16 drops to a predetermined level, or when the liquid level of the heat medium in the heating-side tank 15 rises to a predetermined level, the operation control unit 35 is configured to close the communication valve 21.

[0067] The heat medium supply device 1 further includes a preheating supply valve 65 provided in the preheating heat medium return pipe 62. In the present embodiment, the preheating supply valve 65 is a three-way valve and is arranged at the connection point C2 between the preheating heat medium return pipe 62 and the cooling-side return pipe 26. The preheating supply valve 65 is an actuator-driven valve such as an electric valve. In one embodiment, the preheating supply valve 65 may be a two-way valve (on-off valve). The preheating supply valve 65 is electrically connected to the operation control unit 35, and the operation of the preheating supply valve 65 is controlled by the operation control unit 35.

[0068] When the operation control unit 35 opens the preheating supply valve 65, the preheating heat medium return pipe 62 communicates with the cooling-side return pipe 26. As a result, at least a part of the heat medium flowing through the cooling-side return pipe 26 flows into the preheating heat medium supply pipe 61. The heat medium is transferred to the preheating heat exchanger 60 through the preheating heat medium supply pipe 61. When the operation control unit 35 closes the preheating supply valve 65, the communication between the preheating heat medium return pipe 62 and the cooling-side return pipe 26 is blocked. As a result, the supply of the heat medium to the preheating heat exchanger 60 through the preheating heat medium supply pipe 61 is stopped.

[0069] The preheating heat exchanger 60 is configured to perform heat exchange between the heat medium supplied through the preheating heat medium supply pipe 61 and the heat medium flowing through the tank communication pipe 20 from the cooling side tank 16 toward the heating side tank 15. The heat medium flowing through the tank communication pipe 20 is the heat medium cooled by the cooling device 8 and is at a low temperature. On the other hand, the heat medium flowing through the preheating heat medium supply pipe 61 is a mixture of the heated heat medium and the cooled heat medium. Therefore, the temperature of the heat medium flowing through the preheating heat medium supply pipe 61 is higher than the temperature of the heat medium flowing through the tank communication pipe 20. In the preheating heat exchanger 60, the heat of the heat medium transferred through the preheating heat medium supply pipe 61 is recovered by the heat medium flowing through the tank communication pipe 20. As a result, the temperature of the heat medium flowing through the tank communication pipe 20 rises, and then the heat medium with the increased temperature flows into the heating side tank 15.

[0070] In this way, the preheating heat exchanger 60 can raise the temperature of the heat medium flowing from the cooling side tank 16 toward the heating side tank 15 without using external energy. Since excessive temperature drop of the heat medium in the heating side tank 15 is prevented, the load on the heating device 7 can be reduced, and the heat medium supply device 1 can accurately control the temperature of the heat medium to be supplied to the semiconductor manufacturing device 2.

[0071] The branch point B2 from the cooling side return pipe 26 of the preheating heat medium supply pipe 61 is located upstream of the cooling device 8 and supplies the heat medium before being cooled by the cooling device 8 to the preheating heat exchanger 60. The connection point C2 between the preheating heat medium return pipe 62 and the cooling side return pipe 26 is also located upstream of the cooling device 8, and the heat medium that has passed through the preheating heat exchanger 60 is supplied to the cooling device 8 through the preheating heat medium return pipe 62 and the cooling side return pipe 26. The branch point B2 is located upstream of the connection point C2.

[0072] The heat medium flowing through the preheating heat medium return pipe 62 has already been cooled because heat is taken away by the preheating heat exchanger 60. Therefore, the heat medium that has passed through the preheating heat medium return pipe 62 is sent to the cooling device 8 in a state where its temperature has decreased, and is further cooled by the cooling device 8. Since the temperature of the heat medium from which heat has been taken away has already decreased, the load on the cooling device 8 is reduced, and energy savings can be achieved.

[0073] The operation control unit 35 is configured to open the preheating supply valve 65 while the communication valve 21 is open. While the communication valve 21 is open, the preheating supply valve 65 is opened, and the heat medium that has passed through the semiconductor manufacturing apparatus 2 is sent to the preheating heat exchanger 60. Therefore, the heat medium flowing through the tank communication pipe 20 is heated by the preheating heat exchanger 60. As a result, it is possible to prevent the low-temperature heat medium in the cooling-side tank 16 from directly moving to the high-temperature side tank.

[0074] The heat medium supply device 1 further includes a cooling-side return temperature measuring device 67 provided in the cooling-side return pipe 26 at a position upstream of the cooling device 8, and a communication temperature measuring device 52 provided in the tank communication pipe 20. The communication temperature measuring device 52 is disposed between the cooling-side tank 16 and the communication valve 21. The cooling-side return temperature measuring device 67 and the communication temperature measuring device 52 are electrically connected to the operation control unit 35. The measured value of the temperature of the heat medium in the cooling-side return pipe 26 measured by the cooling-side return temperature measuring device 67 and the measured value of the temperature of the heat medium in the tank communication pipe 20 measured by the communication temperature measuring device 52 are sent to the operation control unit 35. The operation control unit 35 is configured to open the communication valve 21 and the preheating supply valve 65 when the temperature of the heat medium in the cooling-side return pipe 26 is higher than the temperature of the heat medium in the tank communication pipe 20.

[0075] At a certain stage in the manufacturing process executed by the semiconductor manufacturing apparatus 2, the heat medium may be cooled by the semiconductor manufacturing apparatus 2. When the heat medium that has passed through the semiconductor manufacturing apparatus 2 is at a low temperature, the heat medium cannot heat the heat medium flowing in the tank communication pipe 20, and the heat medium flowing in the tank communication pipe 20 cannot recover heat from the heat medium that has passed through the semiconductor manufacturing apparatus 2. Therefore, when the temperature of the heat medium in the cooling side return pipe 26 is higher than the temperature of the heat medium in the tank communication pipe 20, the operation control unit 35 opens the communication valve 21 and the preheating supply valve 65. By such an operation, the heat medium that has passed through the semiconductor manufacturing apparatus 2 can heat the heat medium flowing in the tank communication pipe 20, and the heat medium flowing in the tank communication pipe 20 can recover heat from the heat medium that has passed through the semiconductor manufacturing apparatus 2.

[0076] In the embodiment shown in FIG. 3, the preheating supply valve 65 is provided in the preheating heat medium return pipe 62. However, in one embodiment, the preheating supply valve 65 may be provided in the preheating heat medium supply pipe 61. For example, the preheating supply valve 65 may be provided at the branch point B2 from the cooling side return pipe 26 of the preheating heat medium supply pipe 61. In this configuration, when the preheating supply valve 65 is opened, the preheating heat medium supply pipe 61 communicates with the cooling side return pipe 26. As a result, at least a part of the heat medium flowing through the cooling side return pipe 26 flows into the preheating heat medium supply pipe 61. When the preheating supply valve 65 is closed, the communication between the preheating heat medium supply pipe 61 and the cooling side return pipe 26 is blocked. As a result, the supply of the heat medium to the preheating heat exchanger 60 through the preheating heat medium supply pipe 61 is stopped.

[0077] FIG. 4 is a schematic diagram showing another embodiment of the heat medium supply device 1. The configuration and operation of this embodiment not specifically described are the same as those of the embodiment described with reference to FIG. 3, so the overlapping description is omitted. In the embodiment shown in FIG. 4, the preheating supply valve 65 provided in the preheating heat medium return pipe 62 is a two-way valve (on-off valve). The preheating supply valve 65 is an actuator-driven valve such as an electric valve.

[0078] The heat medium supply device 1 includes a cooling side flow rate limiting device 75 provided in the cooling side return pipe 26. The cooling side flow rate limiting device 75 is arranged upstream of the cooling device 8. More specifically, the cooling side flow rate limiting device 75 is located downstream of the branch point B2 from the cooling side return pipe 26 of the preheating heat medium supply pipe 61 and upstream of the connection point C2 between the preheating heat medium return pipe 62 and the cooling side return pipe 26.

[0079] The cooling side flow rate limiting device 75 is configured to limit the flow rate of the heat medium flowing through the cooling side return pipe 26. Specific examples of the cooling side flow rate limiting device 75 include an orifice, a flow control valve, and the like. A part of the heat medium flowing through the cooling side return pipe 26 is transferred to the preheating heat exchanger 60 through the preheating heat medium supply pipe 61, and the other part of the heat medium flowing through the cooling side return pipe 26 passes through the cooling side flow rate limiting device 75 and is transferred to the cooling device 8.

[0080] Also in this embodiment, the preheating heat exchanger 60 can raise the temperature of the heat medium flowing from the cooling side tank 16 toward the heating side tank 16 without using external energy. In addition, the heat medium whose heat has been taken away by the preheating heat exchanger 60 is sent to the cooling device 8 and cooled by the cooling device 8. Since the temperature of the heat medium whose heat has been taken away has already decreased, the load on the cooling device 8 is reduced, and energy savings can be achieved.

[0081] In the embodiment shown in FIG. 4, the preheating supply valve 65 is provided in the preheating heat medium return pipe 62. However, in one embodiment, the preheating supply valve 65 may be provided in the preheating heat medium supply pipe 61. In this configuration, when the preheating supply valve 65 is opened, the preheating heat medium supply pipe 61 communicates with the cooling side return pipe 26. As a result, at least a part of the heat medium flowing through the cooling side return pipe 26 flows into the preheating heat medium supply pipe 61. When the preheating supply valve 65 is closed, the communication between the preheating heat medium supply pipe 61 and the cooling side return pipe 26 is blocked. As a result, the supply of the heat medium to the preheating heat exchanger 60 through the preheating heat medium supply pipe 61 is stopped.

[0082] FIG. 5 is a schematic diagram showing an embodiment of a heat medium supply device 1 that combines the embodiment shown in FIG. 1 and the embodiment shown in FIG. 3. The heat medium supply device 1 of the embodiment shown in FIG. 5 includes a pre-cooling heat exchanger 40 that cools the heat medium flowing through the tank communication pipe 20 from the heating-side tank 15 toward the cooling-side tank 16, and a pre-heating heat exchanger 60 that heats the heat medium flowing through the tank communication pipe 20 from the cooling-side tank 16 toward the heating-side tank 15. Other configurations of this embodiment not specifically described are the same as those of the embodiments shown in FIGS. 1 and 3, so duplicate descriptions thereof are omitted.

[0083] This embodiment equipped with the pre-cooling heat exchanger 40 and the pre-heating heat exchanger 60 can reduce the heat fluctuations in the heating-side tank 15 and the cooling-side tank 16 accompanying the movement of the heat medium, and can also reduce the loads of both the heating device 7 and the cooling device 8.

[0084] The heating-side flow rate limiting device 55 described with reference to FIG. 2 and the cooling-side flow rate limiting device 75 described with reference to FIG. 4 can also be applied to the embodiment shown in FIG. 5. The pre-cooling supply valve 45 may be provided in the pre-cooling heat medium supply pipe 41. The pre-heating supply valve 65 may be provided in the pre-heating heat medium supply pipe 61.

[0085] FIG. 6 is a schematic diagram showing another embodiment of a semiconductor manufacturing system including a heat medium supply device 1 and a plurality of semiconductor manufacturing devices 2. The heat medium supply device 1 is the heat medium supply device 1 of any of the embodiments described with reference to FIGS. 1 to 5. As shown in FIG. 6, the heat medium supply device 1 is connected to a plurality of semiconductor manufacturing devices 2 via a plurality of heat medium mixing devices 5. More specifically, each of the heating medium transfer pipe 11, the cooling medium transfer pipe 12, the heating-side return pipe 25, and the cooling-side return pipe 26 of the heat medium supply device 1 is connected to a plurality of semiconductor manufacturing devices 2 via a plurality of heat medium mixing devices 5. The heat medium supply device 1 of this embodiment can adjust the processing temperatures of the plurality of semiconductor manufacturing devices 2.

[0086] The above-described embodiments are described for the purpose of enabling a person having ordinary skill in the art to which the present invention pertains to practice the present invention. Various modifications of the above embodiments can be naturally made by those skilled in the art, and the technical idea of the present invention can also be applied to other embodiments. Therefore, the present invention is not limited to the described embodiments, but is to be construed in the broadest scope in accordance with the technical idea defined by the claims.

Explanation of Reference Numerals

[0087] 1 Heat medium supply device 2 Semiconductor manufacturing device 5 Heat medium mixing device 7 Heating device 8 Cooling device 11 Heating medium transfer pipe 12 Cooling medium transfer pipe 15 Heating side tank 16 Cooling side tank 20 Tank communication pipe 21 Communication valve 25 Heating side return pipe 26 Cooling side return pipe 17 Gas layer communication pipe 31 Heating side liquid level detection device 32 Cooling side liquid level detection device 33 Heating side pump 34 Cooling side pump 35 Operation control unit 40 Pre-cooling heat exchanger 41 Pre-cooling heat medium supply pipe 42 Pre-cooling heat medium return pipe 45 Pre-cooling supply valve 47 Heating side return temperature measuring device 51,52 Communication temperature measuring device 55 Heating side flow rate limiting device 60 Pre-heating heat exchanger 61 Pre-heating heat medium supply pipe 62 Pre-heating heat medium return pipe 65 Pre-heating supply valve 67 Cooling side return temperature measuring device 75 Cooling side flow rate limiting device Branch points B1 and B2 Connection points C1 and C2

Claims

1. A heat medium supply device for supplying a heat medium for adjusting the temperature of a semiconductor manufacturing apparatus, comprising: a heating device for heating the heat medium; a cooling device for cooling the heat medium; a heating medium transfer pipe for sending the heated heat medium to the semiconductor manufacturing apparatus; a cooling medium transfer pipe for sending the cooled heat medium to the semiconductor manufacturing apparatus; a heating side tank and a cooling side tank for holding the heat medium; a tank communication pipe for communicating the heating side tank and the cooling side tank; a heating side return pipe for returning the heat medium that has passed through the semiconductor manufacturing apparatus to the heating side tank; a cooling side return pipe for returning the heat medium that has passed through the semiconductor manufacturing apparatus to the cooling side tank; a precooling heat exchanger connected to the tank communication pipe and configured to cool the heat medium flowing through the tank communication pipe from the heating side tank toward the cooling side tank; a precooling heat medium supply pipe branched from the heating side return pipe and extending to the precooling heat exchanger; a precooling heat medium return pipe extending from the precooling heat exchanger and connected to the heating side return pipe, and comprising: the heating device is provided in the heating side return pipe and is configured to heat the heat medium flowing through the heating side return pipe; a branch point of the precooling heat medium supply pipe from the heating side return pipe is located upstream of the heating device and is configured to supply the heat medium before being heated by the heating device to the precooling heat exchanger; a connection point between the precooling heat medium return pipe and the heating side return pipe is located upstream of the heating device and is configured to supply the heat medium that has passed through the precooling heat exchanger to the heating device through the heating side return pipe; The precooling heat exchanger is configured to perform heat exchange between the heat medium flowing through the tank communication pipe from the heating side tank toward the cooling side tank and the heat medium supplied through the precooling heat medium supply pipe. A heat medium supply device.

2. a communication valve provided in the tank communication pipe; a precooling supply valve provided in the precooling heat medium return pipe or the precooling heat medium supply pipe; further comprising an operation control unit for controlling the operations of the communication valve and the precooling supply valve, The operation control unit is configured to open the precooling supply valve while the communication valve is open. The heat medium supply device according to claim 1.

3. a heating side return temperature measuring device provided in the heating side return pipe at a position upstream of the heating device; further comprising a communication temperature measuring device provided in the tank communication pipe. The operation control unit is configured to open the communication valve and the precooling supply valve when the temperature of the heat medium in the heating side return pipe measured by the heating side return temperature measuring device is lower than the temperature of the heat medium in the tank communication pipe measured by the communication temperature measuring device. The heat medium supply device according to claim 2.

4. A preheating heat exchanger connected to the tank communication pipe and heating the heat medium flowing through the tank communication pipe from the cooling side tank toward the heating side tank; A preheating heat medium supply pipe branched from the cooling side return pipe and extending to the preheating heat exchanger; Further comprising a preheating heat medium return pipe extending from the preheating heat exchanger and connected to the cooling side return pipe, The cooling device is provided in the cooling side return pipe and is configured to cool the heat medium flowing through the cooling side return pipe. The branch point of the preheating heat medium supply pipe from the cooling side return pipe is located upstream of the cooling device and is configured to supply the heat medium before being cooled by the cooling device to the preheating heat exchanger. The connection point between the preheating heat medium return pipe and the cooling side return pipe is located upstream of the cooling device and is configured to supply the heat medium that has passed through the preheating heat exchanger to the cooling device through the cooling side return pipe. The preheating heat exchanger is configured to perform heat exchange between the heat medium flowing through the tank communication pipe from the cooling side tank toward the heating side tank and the heat medium supplied through the preheating heat medium supply pipe. The heat medium supply device according to claim 1.

5. The semiconductor manufacturing apparatus is a plurality of semiconductor manufacturing apparatuses. Each of the heating medium transfer pipe, the cooling medium transfer pipe, the heating side return pipe, and the cooling side return pipe is connected to the plurality of semiconductor manufacturing apparatuses. The heat medium supply device according to claim 1.

6. A heat medium supply device for supplying a heat medium for adjusting the temperature of a semiconductor manufacturing apparatus, A heating device for heating the heat medium; A cooling device for cooling the heat medium; A heating medium transfer pipe for sending the heated heat medium to the semiconductor manufacturing apparatus; A cooling medium transfer pipe for sending the cooled heat medium to the semiconductor manufacturing apparatus; A heating side tank and a cooling side tank for holding the heat medium; A tank communication pipe for communicating the heating side tank and the cooling side tank; A heating side return pipe for returning the heat medium that has passed through the semiconductor manufacturing apparatus to the heating side tank; A cooling-side return pipe for returning the heat medium that has passed through the semiconductor manufacturing apparatus to the cooling-side tank, A preheating heat exchanger connected to the tank communication pipe and configured to heat the heat medium flowing through the tank communication pipe from the cooling-side tank toward the heating-side tank, A preheating heat medium supply pipe branching from the cooling-side return pipe and extending to the preheating heat exchanger, A preheating heat medium return pipe extending from the preheating heat exchanger and connected to the cooling-side return pipe, The cooling device is provided in the cooling-side return pipe and is configured to cool the heat medium flowing through the cooling-side return pipe, The branch point of the preheating heat medium supply pipe from the cooling-side return pipe is located upstream of the cooling device and is configured to supply the heat medium before being cooled by the cooling device to the preheating heat exchanger, The connection point between the preheating heat medium return pipe and the cooling-side return pipe is located upstream of the cooling device and is configured to supply the heat medium that has passed through the preheating heat exchanger to the cooling device through the cooling-side return pipe, The preheating heat exchanger is configured to perform heat exchange between the heat medium flowing through the tank communication pipe from the cooling-side tank toward the heating-side tank and the heat medium supplied through the preheating heat medium supply pipe. A heat medium supply device.

7. A communication valve provided in the tank communication pipe, A preheating supply valve provided in the preheating heat medium return pipe or the preheating heat medium supply pipe, Further comprising an operation control unit for controlling the operations of the communication valve and the preheating supply valve, The operation control unit is configured to open the preheating supply valve while the communication valve is open. The heat medium supply device according to claim 6.

8. A cooling-side return temperature measuring device provided in the cooling-side return pipe at a position upstream of the cooling device, Further comprising a communication temperature measuring device provided in the tank communication pipe, The operation control unit is configured to open the communication valve and the preheating supply valve when the temperature of the heat medium in the cooling-side return pipe measured by the cooling-side return temperature measuring device is higher than the temperature of the heat medium in the tank communication pipe measured by the communication temperature measuring device. The heat medium supply device according to claim 7.

9. A precooling heat exchanger connected to the tank communication pipe and configured to cool the heat medium flowing through the tank communication pipe from the heating-side tank toward the cooling-side tank, A pre-cooling heat medium supply pipe branched from the heating-side return pipe and extending to the pre-cooling heat exchanger; Further comprising a pre-cooling heat medium return pipe extending from the pre-cooling heat exchanger and connected to the heating-side return pipe; The heating device is provided in the heating-side return pipe and is configured to heat the heat medium flowing through the heating-side return pipe; The branch point of the pre-cooling heat medium supply pipe from the heating-side return pipe is located upstream of the heating device and is configured to supply the heat medium before being heated by the heating device to the pre-cooling heat exchanger; The connection point between the pre-cooling heat medium return pipe and the heating-side return pipe is located upstream of the heating device and is configured to supply the heat medium that has passed through the pre-cooling heat exchanger to the heating device through the heating-side return pipe; The pre-cooling heat exchanger is configured to perform heat exchange between the heat medium flowing through the tank communication pipe from the heating-side tank to the cooling-side tank and the heat medium supplied through the pre-cooling heat medium supply pipe. The heat medium supply device according to claim 6.

10. The semiconductor manufacturing apparatus is a plurality of semiconductor manufacturing apparatuses; Each of the heating medium transfer pipe, the cooling medium transfer pipe, the heating-side return pipe, and the cooling-side return pipe is connected to the plurality of semiconductor manufacturing apparatuses. The heat medium supply device according to claim 6.

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