Imaging unit and imaging apparatus

Abstract

SOLUTION: An imaging unit comprises: a mounting substrate on which an imaging device imaging a subject and a connector are mounted; an electric power source substrate on which the connector is mounted and includes an electric power source circuit unit including a regulator; and a flexible substrate with one end connected to the connector on the mounting substrate and the other end connected to the connector on the electric power source substrate, wherein the electric power source circuit unit outputs a first electric power source voltage, and feeds back a second electric power source voltage applied to the imaging device via the flexible substrate on the basis of the first electric power source voltage, via the flexible substrate, and corrects the first electric power source voltage on the basis of a third electric power source voltage appearing on the electric power source substrate side due to the feedback.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present invention relates to an imaging unit and an imaging device.

Background Art

[0002] A solid-state imaging device including a pixel array in which a plurality of pixels are arranged is known (for example, Patent Document 1). Conventionally, an increase in power consumption has been a problem. [Prior Art Document] [Patent Document] [Patent Document 1] Japanese Unexamined Patent Application Publication No. 2011-176616

Summary of the Invention

[0003] In a first aspect of the present invention, an imaging unit is provided. The imaging unit may include an imaging element that images a subject and a mounting substrate on which a connector is mounted. The imaging unit may include a power supply substrate on which a connector is mounted and that has a power supply circuit section including a regulator. The imaging unit may include a flexible substrate having one end connected to the connector of the mounting substrate and the other end connected to the connector of the power supply substrate. The power supply circuit section may output a first power supply voltage, feedback, via the flexible substrate, the second power supply voltage that is applied to the imaging element via the flexible substrate based on the first power supply voltage, and correct the first power supply voltage based on the third power supply voltage that appears on the power supply substrate side due to the feedback.

[0004] Note that the above summary of the invention does not list all of the necessary features of the present invention. Also, sub-combinations of these feature groups may also be inventions.

Brief Description of the Drawings

[0005]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Mode for Carrying Out the Invention

[0006] Hereinafter, the present invention will be described through embodiments of the invention. However, the following embodiments do not limit the invention according to the claims. Also, not all combinations of features described in the embodiments are essential for the solution means of the invention.

[0007] FIG. 1 is a schematic cross-sectional view of a camera 10 which is an example of an imaging device according to an embodiment. The camera 10 is, as an example, a digital compact camera. The camera 10 includes a lens unit 20 and a camera body 30.

[0008] The lens unit 20 includes an optical system in its lens barrel, and the optical axis 22 is defined by the optical system. The lens unit 20 is attached to the camera body 30. The lens unit 20 may be housed in the camera body 30 and may protrude outward as shown in the figure during use.

[0009] The lens unit 20 guides the incident subject light beam into the housing 31 of the camera body 30. Note that the lens unit 20 shown in FIG. 1 includes two lenses and a diaphragm for the sake of clarity of explanation, but is not limited to such a configuration.

[0010] The camera body 30 has an imaging unit 40 and a display unit 88. The subject light beam incident on the lens unit 20 is guided by the lens unit 20 to the imaging unit 40.

[0011] The imaging unit 40 includes an image sensor 100 that images a subject, a mounting substrate 120 having a first main surface 111 and a second main surface 112, a connector 180 mounted on the second main surface 112 of the mounting substrate 120, a first flexible substrate 250 and a second flexible substrate 260, and a substrate unit 60 including a substrate 62 connected to the mounting substrate 120 by the first flexible substrate 250 and the second flexible substrate 260. The imaging unit 40 in the present embodiment further includes a frame 140 and a cover glass 160. Note that the imaging unit 40 may not include the connector 180, the frame 140, and the cover glass 160. Note that the substrate 62 is an example of a power supply substrate. In the following description, the substrate 62 may be referred to as a power supply substrate.

[0012] The image sensor 100 is, for example, a CMOS image sensor or a CCD image sensor, and the shape of the main plane is rectangular. The image sensor 100 is mounted on the first main surface 111 of the mounting substrate 120. Note that the image sensor 100 is an example of an image sensor.

[0013] Here, in the present embodiment, the direction along the optical axis 22 is defined as the z-axis direction. That is, the direction in which the subject light beam is incident on the imaging surface of the imaging device 100 is defined as the z-axis direction. Specifically, the direction in which the subject light beam is incident is defined as the negative z-axis direction, and the opposite direction is defined as the positive z-axis direction. The longitudinal direction of the imaging device 100 is defined as the x-axis direction. The short-side direction of the imaging device 100 is defined as the y-axis direction. Specifically, the x-axis direction and the y-axis direction are defined in the directions shown in FIG. 1. The x-axis, y-axis, and z-axis are a right-handed orthogonal coordinate system.

[0014] When defined in this way, the mounting substrate 120, the substrate 62, and the display unit 88 in the present embodiment are arranged in order in the negative z-axis direction. For convenience of explanation, the positive z-axis direction may be referred to as the front, the front side, etc. Also, the negative z-axis direction may be referred to as the rear, the rear side, etc. The side in the negative z-axis direction may be referred to as the back side, etc.

[0015] The substrate 62 of the substrate unit 60 is arranged at a position in the negative z-axis direction of the imaging unit 40. On the substrate 62 of the substrate unit 60, a connector 182, a connector 184, an MPU 51, an ASIC 52, and a power supply unit 53 are mounted. Note that other electronic circuits may be additionally or alternatively mounted on the substrate 62. Note that the substrate unit 60 may include a plurality of substrates on which each component is individually mounted instead of a single substrate 62 on which components such as the power supply unit 53 are mounted, may include a plurality of substrates on which some components are collectively mounted, or may include a plurality of substrates combined thereof.

[0016] The MPU 51 is responsible for overall control of the camera 10. The ASIC 52 processes the image signal output from the imaging device 100. The ASIC 52 in the present embodiment receives the image signal from the imaging device 100 via the mounting substrate 120, the connector 180, the first flexible substrate 250, and the connector 184. In this way, one end of the first flexible substrate 250 is connected to the connector 180 of the mounting substrate 120, and the other end is connected to the connector 184 of the substrate 62.

[0017] The power supply unit 53 includes a battery attached to the camera 10 and a power supply circuit that supplies the power stored in the battery to each part of the camera 10. The power supply unit 53 in the present embodiment supplies current to the imaging device 100 via the connector 182, the second flexible substrate 260, the connector 180, and the mounting substrate 120. In this way, one end of the second flexible substrate 260 is connected to the connector 180 of the mounting substrate 120, and the other end is connected to the connector 182 of the substrate 62.

[0018] The ASIC 52 generates display image data based on the image signal from the imaging device 100. The ASIC 52 generates display image data by performing, for example, image processing and compression processing on the image signal of the imaging device 100.

[0019] The display image data generated by the ASIC 52 is output to the display unit 88. The image data may be recorded on a recording medium attached to the camera body 30. The recording medium may be configured to be detachable from the camera body 30.

[0020] The display unit 88 is disposed at a position in the minus z-axis direction of the substrate 62 of the substrate unit 60. As the display unit 88, for example, a liquid crystal panel or the like can be applied. The display surface of the display unit 88 appears on the back surface of the camera body 30. The display unit 88 displays an image based on the display image data generated by the ASIC 52.

[0021] Note that the imaging unit 40 may include two or more connectors. In other words, two or more connectors may be mounted on the second main surface 112 of the mounting substrate 120. Also, an individual flexible substrate may be connected to each of the two or more connectors. Each set of the respective connectors and flexible substrates may be specialized for a specific application. Also, the applications of a plurality of such sets may be partially or entirely common to each other.

[0022] FIG. 2 is a top view schematically showing a part of the imaging unit 40 according to an embodiment. FIG. 3 is a cross-sectional view schematically showing the A-A cross-section of FIG. 2. However, in FIG. 3, in addition to a part of the imaging unit 40 shown by a solid line, a bracket 150, a first flexible substrate 250, and a second flexible substrate 260 are shown by a broken line.

[0023] The imaging device 100 is configured to include an imaging area 101 and a peripheral area 102. As shown in FIG. 2, both the imaging area 101 and the peripheral area 102 are rectangular in plan view.

[0024] The imaging area 101 is formed in the central portion of the imaging device 100. In the imaging area 101, a plurality of photoelectric conversion elements for photoelectrically converting subject light are two-dimensionally arranged, whereby the imaging surface of the imaging device 100 is formed. Each pixel is configured to include one or a plurality of photoelectric conversion elements.

[0025] The peripheral area 102 is located around the imaging area 101. The peripheral area 102 includes a processing circuit 104 that reads out an image signal obtained by photoelectric conversion in the photoelectric conversion element and performs signal processing. The processing circuit 104 includes an AD conversion circuit that converts the output image signal into a digital signal. The processing circuit 104 also includes a transmission circuit 105 for transmitting the image signal.

[0026] The imaging device 100 is COB (Chip On Board) mounted on the mounting substrate 120. The imaging device 100 is fixed to the mounting substrate 120 by an adhesive portion 210. The adhesive portion 210 is, for example, a thermosetting adhesive. Other adhesive portions described later are also, for example, thermosetting adhesives.

[0027] The imaging device 100 is electrically connected to the mounting substrate 120 via bonding wires 110. The image signal converted into a digital signal by the AD conversion circuit of the imaging device 100 is output to the mounting substrate 120 via the bonding wires 110. Note that the imaging device 100 may be flip-chip mounted on the mounting substrate 120.

[0028] The mounting substrate 120 includes a first layer 121, a core layer 207, and a second layer 122. The first layer 121 includes a solder resist layer 201, a wiring layer 202, an insulating layer 203, a wiring layer 204, and an insulating layer 205. The second layer 122 includes an insulating layer 215, a wiring layer 214, an insulating layer 213, a wiring layer 212, and a solder resist layer 211. The mounting substrate 120 is a multilayer core substrate having the core layer 207 as a core layer.

[0029] In the mounting substrate 120, in the minus z-axis direction, the solder resist layer 201, the wiring layer 202, the insulating layer 203, the wiring layer 204, the insulating layer 205, the core layer 207, the insulating layer 215, the wiring layer 214, the insulating layer 213, the wiring layer 212, and the solder resist layer 211 are arranged in this order.

[0030] The insulating layers 203, 205, 215, and 213 are, for example, resin layers. The thickness of each of the insulating layers 203, etc. in the z-axis direction is, for example, 20 μm to 50 μm.

[0031] The wiring layers 202, 204, 214, and 212 include wiring patterns. As the material of the wiring layers 202, etc., an alloy of nickel and iron (for example, 42alloy, 56alloy), copper, aluminum, etc. can be used. The thickness of each wiring pattern of the wiring layers 202, etc. is, for example, 10 μm to 50 μm.

[0032] The core layer 207 is formed of metal. When the core layer 207 is formed of metal, for example, an alloy of nickel and iron (for example, 42alloy, 56alloy), copper, aluminum, etc. can be used as the material of the core layer 207. The thickness of the core layer 207 is thicker than the thickness of any of the wiring layers 202, etc. The thickness of the core layer 207 is thicker than the thickness of any of the insulating layers 203, etc. Specifically, the thickness of the core layer 207 is, for example, 0.1 mm to 0.8 mm.

[0033] The rigidity of the core layer 207 is higher than the rigidity of any of the wiring layers 202, etc. The rigidity of the core layer 207 may be higher than the rigidity of the first layer 121. The rigidity of the core layer 207 may be higher than the rigidity of the second layer 122.

[0034] Note that the core layer 207 may be formed of resin. When the core layer 207 is formed of resin, the core layer 207 may be formed using, for example, FR4 or a material having a higher elastic modulus than FR4. When the core layer 207 is formed of resin, the core layer 207 is sandwiched by wiring layers in the z-axis direction. For example, when the core layer 207 is formed of resin, in the minus z-axis direction, the solder resist layer 201, the wiring layer 202, the insulating layer 203, the wiring layer 204, the core layer 207, the wiring layer 214, the insulating layer 213, the wiring layer 212, and the solder resist layer 211 may be arranged in this order. When additionally arranging two wiring layers, between the wiring layer 204 and the core layer 207, an additional insulating layer in contact with the wiring layer 204 and an additional wiring layer in contact with the core layer 207 are arranged in order in the minus z-axis direction, and between the core layer 207 and the wiring layer 214, an additional wiring layer in contact with the core layer 207 and an additional insulating layer in contact with the wiring layer 214 are arranged in order in the minus z-axis direction.

[0035] Thus, the mounting substrate 120 is a multilayer core substrate having a metal core or a resin core. The thickness of the mounting substrate 120 may be, for example, 0.3 mm to 1.5 mm.

[0036] At least a part of the wiring layer 202 is used as a wiring pattern for receiving an image signal output from the imaging device 100 via the bonding wire 110. The wiring layer 202 includes a bonding pad 240 to which the bonding wire 110 is connected.

[0037] The wiring patterns included in the wiring layer 204 and the wiring patterns included in the wiring layer 214 can be used for, for example, ground lines, power lines, and the like.

[0038] The imaging device 100 is disposed on the solder resist layer 201 and is electrically connected to the bonding pad 240 by the bonding wire 110. The bonding pad 240 and the wiring layer 212 are electrically connected by a via 131 that penetrates the first layer 121 and the core layer 207. The via 131 is covered with an insulator 132. The image signal output from the imaging device 100 is transmitted to the wiring layer 212 via the wiring layer 202 and the via 131.

[0039] On the solder resist layer 211, electronic components such as a connector 180, a bypass capacitor group 185, and a circuit group 187 are mounted. In other words, these electronic components are mounted on the second main surface 112 of the mounting substrate 120, which is opposite to the first main surface 111 on which the imaging device 100 is mounted. On the solder resist layer 211, other electronic components may include, for example, resistors, regulators, transistors, and the like.

[0040] These electronic components are electrically connected to the wiring layer 212 by lead members. The lead members are fixed to the wiring layer 212 with solder or the like. A part of the wiring layer 212 is exposed to the outside through an opening formed in the solder resist layer 211 to provide electrodes such as lands.

[0041] The frame 140 is formed of resin. The frame 140 is adhered to the solder resist layer 201 of the mounting substrate 120 with an adhesive portion 220. That is, the mounting substrate 120 is fixed to the frame 140.

[0042] Note that the frame 140 may be configured by inserting a metal body into the resin. As the material of the metal body, an alloy of nickel and iron (for example, 42alloy, 56alloy), copper, or aluminum can be used. If a lightweight material such as aluminum is used as the material of the metal body, the weight of the frame 140 can be reduced. If a material with a relatively high thermal conductivity such as copper is used as the material of the metal body, the heat dissipation characteristics from the frame 140 can be enhanced.

[0043] Frame 140 has a first surface 141, a second surface 142, a third surface 143, a fourth surface 144, a fifth surface 145, and a sixth surface 146. The sixth surface 146 forms an opening 138. The sixth surface 146 forms the inner wall surface of the frame 140. The opening 138 is formed, for example, in the central portion within the xy plane. Inside the opening 138, the imaging element 100 mounted on the first main surface 111 of the mounting substrate 120 is positioned.

[0044] The first surface 141 is the surface adhered by the cover glass 160 and the adhesive portion 230. The first surface 141 is the surface that contacts the end of the sixth surface 146. The first surface 141 is formed along the outer edge of the sixth surface 146. The first surface 141 is a surface substantially parallel to the xy plane.

[0045] The second surface 142 is the surface that contacts the end of the first surface 141. The second surface 142 is the surface formed along the outer edge of the first surface 141. The second surface 142 has a surface substantially parallel to the yz plane and a surface substantially parallel to the xz plane.

[0046] The third surface 143 is the surface that contacts the end of the second surface 142. The third surface 143 is a surface substantially parallel to the xy plane and a surface substantially parallel to the first surface 141.

[0047] The fourth surface 144 is the surface that contacts the end of the third surface 143. The fourth surface 144 is the surface formed along the outer edge of the third surface 143. The fourth surface 144 has a surface substantially parallel to the yz plane and a surface substantially parallel to the xz plane.

[0048] The fifth surface 145 is the surface that contacts the end of the fourth surface 144. The fifth surface 145 is the surface formed along the outer edge of the fourth surface 144. The fifth surface 145 is a surface substantially parallel to the xy plane. The fifth surface 145 is a surface substantially parallel to the first surface 141 and the third surface 143. The fifth surface 145 is the surface adhered by the solder resist layer 201 of the mounting substrate 120 and the adhesive portion 220. The fifth surface 145 faces the adhesive portion 220. The fifth surface 145 is the surface that contacts the end of the sixth surface 146. The fifth surface 145 is formed along the outer edge of the sixth surface 146.

[0049] The frame 140 has a stepped portion formed by a first surface 141, a second surface 142, and a third surface 143. The frame 140 has mounting holes 148 as mounting portions. The frame 140 has, for example, three mounting holes 148. All three mounting holes 148 are holes that penetrate from the third surface 143 to the fifth surface 145. All three mounting holes 148 are used to mount the imaging unit 40 to another structure such as the housing 31 of the camera body 30.

[0050] The frame 140 is fixed to the bracket 150 by being screwed, for example, with screws 149 through the three mounting holes 148. The bracket 150 is fixed to the housing 31 of the camera body 30 by being screwed, for example. Therefore, the imaging unit 40 is fixed to the housing 31 of the camera body 30.

[0051] When the frame 140 and the bracket 150 are screwed together using the mounting holes 148 with, for example, metal screws 149, a heat transfer path can be formed to release the heat generated when the imaging element 100 is operating to the housing 31 through the screws 149.

[0052] The frame 140 has positioning holes 147. The frame 140 has, for example, two positioning holes 147. Both of the two positioning holes 147 are holes that penetrate from the third surface 143 to the fifth surface 145. Of the two positioning holes 147, one positioning hole is formed as a fitting hole, and the other positioning hole 147 is formed as a long hole.

[0053] The frame 140 is positioned with respect to the bracket 150 using the two positioning holes 147. For example, by inserting two positioning pins provided on the bracket 150 into the two positioning holes 147, the frame 140 and the bracket 150 are positioned. The frame 140 is fixed in a state of being positioned with respect to the bracket 150. Therefore, the imaging unit 40 is fixed in a state of being positioned with respect to the housing 31. Note that the frame 140 and the bracket 150 may be fixed to another structure other than the housing 31.

[0054] Incidentally, the imaging unit 40 may be fixed to the housing 31 without passing through the bracket 150. The imaging unit 40 may be fixed to the housing 31, for example, by being screwed through three mounting holes 148.

[0055] The cover glass 160 is formed of, for example, borosilicate glass, quartz glass, non-alkali glass, heat-resistant glass, crystal, or the like. The cover glass 160 has light transmissivity. The thickness of the cover glass 160 is, for example, 0.5 mm to 0.8 mm.

[0056] The cover glass 160 is used to seal the image sensor 100 housed in the opening 138 of the frame 140. More specifically, the cover glass 160 is fixed to the frame 140 so as to cover the opening 138 of the frame 140. The cover glass 160 is fixed to the frame 140 after the image sensor 100, the bonding wire 110, and the frame 140 are mounted on the mounting substrate 120. The cover glass 160 is adhered to the frame 140 by the adhesive portion 230. Since the cover glass 160 has light transmissivity, the adhesive portion 230 may be a photocurable adhesive.

[0057] The cover glass 160, together with the frame 140 and the mounting substrate 120, seals the space inside the opening 138. Accordingly, the image sensor 100 located inside the opening 138 is disposed in a space sealed by the mounting substrate 120, the frame 140, and the cover glass 160. Thereby, the image sensor 100 is hardly affected by the external environment. For example, the image sensor 100 is hardly affected by moisture existing outside the space. Thereby, deterioration of the image sensor 100 can be suppressed.

[0058] FIG. 4 is a schematic circuit diagram of the imaging unit 40 according to an embodiment. In the substrate 62 of the imaging unit 40, the power supply unit 53 has a power supply circuit portion 300.

[0059] The power supply circuit unit 300 mounted on the substrate 62 outputs a first power supply voltage V1. The power supply circuit unit 300 feeds back, via the second flexible substrate 260 or the like, a second power supply voltage V1' applied to the imaging element 100 based on the first power supply voltage V1 via the second flexible substrate 260 or the like. The power supply circuit unit 300 further corrects the first power supply voltage V1 based on a third power supply voltage that appears on the substrate 62 side due to the feedback. In the following description, the first power supply voltage V1 may be referred to as the output voltage V1 of the power supply circuit unit 300. Similarly, the second power supply voltage V1' may be referred to as the terminal voltage V1' of the imaging element 100.

[0060] In other words, the power supply circuit unit 300 forms a feedback path that feeds back the voltage applied to the imaging element 100 to the power supply circuit unit 300 together with the circuit group 187 of the mounting substrate 120 via the second flexible substrate 260 or the like in order to keep the voltage applied to the imaging element 100 constant. It can also be said that the power supply circuit unit 300 monitors the voltage applied to the imaging element 100.

[0061] More specifically, the power supply circuit unit 300 includes a DCDC311 which is an example of a regulator. The power supply circuit unit 300 according to the present embodiment further includes a coil 312, a resistance element 313, a resistance element 314, and a capacitor 315. The above-mentioned feedback path includes at least the coil 312, the resistance element 313, and the resistance element 314.

[0062] One end of the DCDC311 is connected to the positive power supply of the power supply unit 53, and a positive voltage Vcc is input from the positive power supply. The other end of the DCDC311 is electrically connected to the input terminal of the imaging element 100 via the connector 182, the power supply line 261 of the second flexible substrate 260, and the connector 180.

[0063] The DCDC311 duty-modulates (pulse-width modulates) the positive voltage Vcc input from the positive power supply and outputs the output voltage Vdcdc. By smoothing with the subsequent coil 312 and capacitor 315, it can be stepped down to a desired voltage. The terminal voltage V1' of the imaging device 100 is fed back to the DCDC311 via the above feedback path. The DCDC311 has a driving ability to adjust its own output voltage Vdcdc so that the fed-back, i.e., the feedback voltage V1', is within the normal voltage range Vsen of the terminal voltage defined by the imaging device 100.

[0064] The voltage V1' near the input terminal of the imaging device 100 changes as the consumption current flowing into the imaging device 100 changes. Therefore, for example, when the amount of current flowing through the DCDC311 increases and the terminal voltage V1' decreases, the DCDC311 increases the duty ratio of Vdcdc so that the terminal voltage V1' is within the normal voltage range Vsen. That is, it boosts the output voltage V1 of the power supply circuit unit 300 to pull up the terminal voltage V1'. Note that this boosting operation is possible within the driving ability of the DCDC311.

[0065] The coil 312 is disposed on the path between the other end of the DCDC311 and the connector 182. That is, the coil 312 is serially connected in order with the DCDC311 between the positive power supply of the power supply unit 53 and the imaging device 100. Note that the coil 312 has an inductance L.

[0066] The resistor element 313 and the resistor element 314 are serially connected in order between the imaging device 100 and the DCDC311. More specifically, one end of the resistor element 313 is electrically connected to the input terminal of the imaging device 100 via the connector 182, the feedback line 262 of the second flexible substrate 260, and the connector 180. The other end of the resistor element 313 is connected to one end of the resistor element 314 and the DCDC311. The other end of the resistor element 314 is connected to the ground Gnd and the DCDC311. The resistor element 313 and the resistor element 314 have resistance values Rfb1 and Rfb2, respectively.

[0067] The capacitor 315 indicated by the symbol C in the figure has one end connected to the ground Gnd of the substrate 62 and the other end connected to the output side of the DCDC 311, and smoothes the change in the current supplied from the positive power supply to the imaging element 100 via the DCDC 311. Similarly to the capacitor 315, the capacitor 188 indicated by the symbol C in the figure has one end connected to the ground Gcob of the mounting substrate 120 and the other end connected to the input terminal side of the imaging element 100, and smoothes the change in the current supplied from the positive power supply of the power supply unit 53 to the imaging element 100.

[0068] As shown in the figure, the power supply line 261 of the second flexible substrate 260 has a resistance value r2, and the pins of the connectors 180 and 182 connected to the power supply line 261 have a resistance value r1. Also, the feedback line 262 of the second flexible substrate 260 has a resistance value r2'', and the pins of the connectors 180 and 182 connected to the feedback line 262 have a resistance value r1''. Further, the ground line 263 of the second flexible substrate 260 has a resistance value r2', and the pins of the connectors 180 and 182 connected to the ground line 263 have a resistance value r1'.

[0069] In recent years, with the increase in the number of pixels and the high-speed readout of imaging elements, the power consumption or current consumption of imaging elements has tended to increase. Furthermore, stacked imaging elements equipped with large-scale circuits such as memories have emerged, further accelerating the increase in the power consumption of imaging elements. On the other hand, during the period when the imaging element is being driven, there are periods such as when charges are accumulated in the pixels, when the charges in each pixel are encoded into digital values corresponding to them, that is, during A / D conversion, when luminance data is output from the imaging element, and when digital data is stored in the memory within the imaging element. These periods may overlap with each other. Therefore, in the imaging element, even if the current consumption amount during a certain period is the normal amount, in the next period, the current consumption amount may suddenly increase to an excessive amount that greatly exceeds the normal amount, or in the next period, the current consumption amount may return to the normal amount. In other words, the current consumption amount may change suddenly.

[0070] As described above, a voltage range Vsen within which the imaging device can operate is defined for the terminal voltage V1' of the imaging device. When the terminal voltage V1' of the imaging device falls outside the voltage range Vsen, it is detected as an error. If the error occurs repeatedly, the operation of the imaging device may become unstable, making it impossible to acquire a normal image, or the operation of the imaging device may stop.

[0071] When a power supply unit that supplies power to the imaging device is mounted on a power supply board other than the mounting board on which the imaging device is mounted, and the mounting board and the power supply board are connected by a connector and a harness (hereinafter simply referred to as a harness with a connector), a voltage drop (sometimes referred to as a voltage droop) occurs due to the resistance component of the harness with a connector. The voltage drop is proportional to the amount of current supplied to the imaging device, and increases as the amount of current increases.

[0072] When a regulator for supplying a stable voltage to the imaging device is mounted on the power supply board and a feedback path for keeping the output voltage of the regulator constant is formed only on the power supply board, the terminal voltage V1' of the imaging device on the mounting board side is not fed back to the regulator on the power supply board side. Therefore, the output voltage of the regulator does not take into account the above voltage drop. Thus, when the current consumption of the imaging device is large, the terminal voltage V1' of the imaging device is more likely to transiently fall below the specified voltage lower limit of the voltage range Vsen due to the voltage droop.

[0073] On the other hand, when the above regulator is mounted on the mounting substrate, if the current flowing through the regulator increases, the switching noise and thermal noise of the regulator may increase, and the imaging performance of the imaging device may deteriorate. As an example, the switching noise is caused by the switching operation of the switching regulator (DCDC) resonating with the sequence operation inside the imaging device, and the thermal noise is caused by a linear regulator such as an LDO. The thermal noise is a deterioration of the imaging performance caused by the heat generated by the linear regulator being conducted to the imaging device through the mounting substrate. For example, it becomes easier to exceed the temperature upper limit, reducing the number of consecutive shots possible with the camera, shortening the exposure time possible with the camera, or causing part of the captured image to be whitewashed with white noise.

[0074] Therefore, according to the imaging unit 40, the substrate 62 connected to the mounting substrate 120 via the second flexible substrate 260 or the like has a power supply circuit unit 300 including the DCDC 311, and the power supply circuit unit 300 feeds back the voltage applied to the imaging device 100 on the mounting substrate 120 via the second flexible substrate 260 or the like. Further, according to the imaging unit 40, no regulator is provided on the mounting substrate 120.

[0075] More specifically, the power supply circuit unit 300 outputs a first power supply voltage V1, but the second power supply voltage V1' applied to the imaging device 100 via the second flexible substrate 260 or the like based on the first power supply voltage V1 is smaller than V1 by the voltage drop due to the contact resistance r1 of the connectors 180 and 182 and the transmission resistance r2 of the power supply line 261 of the second flexible substrate 260. If the current flowing through the DCDC 311, the connector 182, the second flexible substrate 260, and the connector 180 is I1, the voltage drop is I1(2r1 + r2) [V]. A part of the current I1 is shunted by the feedback current Ifb just before the input side of the imaging device 100 through the above feedback path. Therefore, the second power supply voltage V1' is V1' = V1 - (I1 - Ifb)(2r1 + r2) with respect to the ground potential Gnd of the substrate 62.

[0076] The power supply circuit unit 300 feeds back the second power supply voltage V1' to DCDC311 via the second flexible substrate 260 or the like. The third power supply voltage that appears on the substrate 62 side due to the feedback is smaller than V1' by the voltage drop Ifb(2r1'' + r2'') caused by the contact resistance r1'' of the connectors 180 and 182 and the transmission resistance r2'' of the feedback line 262 of the second flexible substrate 260. The feedback current Ifb is expressed as Ifb = V1' / (Rfb2 + Rfb1 + 2r1'' + r2'') using the terminal voltage V1'. For example, by making the resistance Rfb1 extremely large, the feedback current Ifb can be made extremely small compared to the current I1, and the voltage drop Ifb(2r1'' + r2'') in the feedback path can be made negligibly small. Since the feedback current Ifb flows to the ground Gnd via the resistance element 314, it can be expressed as Vfb = Ifb·Rfb2.

[0077] The power supply circuit unit 300 corrects the first power supply voltage V1 based on the third power supply voltage. More specifically, the power supply circuit unit 300 feeds back V1' to DCDC311 and outputs a voltage that compensates for the voltage drop I1(2r1 + r2) with respect to the first power supply voltage V1.

[0078] Thus, according to the imaging unit 40 according to the present embodiment, it is possible to output a voltage obtained by boosting in advance the voltage drop I1(2r1 + r2)[V] caused by the second flexible substrate 260 or the like from the power supply unit 53 of the substrate 62 other than the mounting substrate 120. As a result, the possibility that the terminal voltage V1' of the imaging element 100 falls below the specified voltage lower limit of the imaging element 100 as described above can be reduced.

[0079] Also, according to the imaging unit 40, the above feedback path is formed between the substrate 62 on which the power supply unit 53 is mounted, the second flexible substrate 260, etc., and the mounting substrate 120 on which the imaging element 100 is mounted. Thus, according to the imaging unit 40, even when the current consumption amount of the imaging element 100 is about to change rapidly as described above, the output voltage V1 of the power supply circuit unit 300 in the power supply unit 53 is adjusted by the DCDC311 of the power supply circuit unit 300, so that the terminal voltage V1' of the imaging element 100 can be kept within the above voltage range Vsen.

[0080] As described above, according to the imaging unit 40, since the specified voltage of the imaging element 100 can be complied with, stable operation of the imaging element 100 can be ensured.

[0081] The power supply unit 53 of the imaging unit 40 according to the present embodiment outputs a voltage corrected with reference to the ground potential Gnd of the substrate 62, and the feedback current I1-Ifb passing through the imaging element 100 is from the ground Gcob of the mounting substrate 120, through the connector 180, the ground line 263 of the second flexible substrate 260 and the connector 182 to the ground Gnd of the substrate 62. The voltage drop (I1-Ifb)(2r'+r2') when flowing is not corrected. Therefore, the terminal voltage V1' of the imaging element 100 may deviate from the above voltage range Vsen with reference to the ground potential Gcob of the mounting substrate 120. Therefore, the imaging unit 40 may increase the number of pins of the ground line 263 in the harness with a connector. Thereby, the imaging unit 40 can bring r' and r2' closer to 0Ω, and can reduce the influence of the above voltage drop (I1-Ifb)(2r'+r2') as much as possible. Therefore, the imaging unit 40 can further reduce the possibility that the terminal voltage V1' of the imaging element 100 deviates from the above voltage range Vsen.

[0082] Also, according to the imaging unit 40 according to the present embodiment, since no regulator is provided on the mounting substrate 120, it is possible to prevent the switching noise and thermal noise of the regulator from affecting the imaging element 100, and thus it is possible to prevent the imaging performance of the imaging element 100 from deteriorating.

[0083] In the power supply unit 53 of the substrate 62, the DCDC311 of the power supply circuit unit 300 may be a linear regulator such as an LDO. The same applies to the following embodiments, and duplicate explanations are omitted.

[0084] FIG. 5 is a schematic circuit diagram of an imaging unit 41 according to an embodiment. In the present embodiment, the same or corresponding reference numerals are assigned to the same configurations as those described with reference to FIGS. 1 to 4, and duplicate explanations are omitted. The same applies to the descriptions of the following embodiments.

[0085] In the present embodiment, as a difference from the embodiment described with reference to FIGS. 1 to 4, the power supply circuit unit 301 of the imaging unit 41 additionally has a detection unit 320 that feeds back the ground potential Gcob of the mounting substrate 120 via the second flexible substrate 260 and detects the second ground potential Vgs that appears on the substrate 62 side due to the feedback. As another difference, in addition to DCDC311, one end of the detection unit 320 is connected between the resistance element 313 and the resistance element 314 in the above feedback path.

[0086] FIG. 6 is a schematic circuit diagram of the power supply unit 53 in FIG. 5. The detection unit 320 includes an OP amplifier 321, four resistance elements 326, 322, 323, 325, and a transistor 324. In FIG. 6, the resistances of the resistance element 326 and the resistance element 322 are denoted by R1 and R2, respectively.

[0087] The non-inverting input terminal (+) of the OP amplifier 321 is connected to the ground potential Gcob of the mounting substrate 120 via the ground line 263 or the like of the second flexible substrate 260, that is, connected to the second ground potential Vgs.

[0088] When a current I1 greater than normal flows through the imaging unit 41, the second ground potential Vgs is the voltage drop (I1 - Ifb)(2r' + r2')[V] when the feedback current I1 - Ifb passing through the imaging element 100 flows from the ground Gcob of the mounting substrate 120 to the ground Gnd of the substrate 62 via the second flexible substrate 260 or the like. When no current I1 flows through the imaging unit 41 or the current I1 is very small, the second ground potential Vgs ≒ 0.

[0089] The inverting input terminal (-) of the OP amplifier 321 is connected to the output terminal of the OP amplifier 321 via the resistor element 322 and is also connected to one end of the resistor element 326. The other end of the resistor element 326 is connected to the ground potential Gnd of the power supply unit 53. The output terminal of the OP amplifier 321 is also connected to one end of a resistor element 323 connected in parallel with the resistor element 322, and the other end of the resistor element 323 is connected to the base of the transistor 324.

[0090] The collector of the transistor 324 is connected between the resistor element 313 and the resistor element 314 in the above feedback path via the resistor element 325. The emitter of the transistor 324 is connected to the ground potential Gnd.

[0091] When the detection unit 320 detects the second ground potential Vgs due to the flow of the current I1 through the imaging unit 41, the detection unit 320 causes a flow of a correction current Igc corresponding to the second ground potential Vgs, thereby introducing the second ground potential Vgs into the feedback potential Vfb of the DCDC 311. As a result, the power supply circuit unit 301 according to the present embodiment further corrects the first power supply voltage V1 based on the second ground potential Vgs detected by the detection unit 320. Note that the detection unit 320 including the OP amplifier 321, the transistor 324, etc. can also be said to be a circuit having a function of sinking, that is, sucking in, a current corresponding to the detection potential.

[0092] More specifically, for the detection unit 320, a conversion coefficient Kvi for converting the second ground potential Vgs into a correction current Igc is preset and defined as Igc = Kvi·Vgs. As described above, the feedback potential Vfb fed back to the DCDC 311 is represented by Vfb = Ifb·Rfb2. Here, when the above correction current Igc flows from between the resistance element 313 and the resistance element 314 in the above feedback path toward the detection unit 320, Vfb becomes Vfb = (Ifb - Igc)Rfb2 = (Ifb - Kvi·Vgs)Rfb2. That is, if the second ground potential Vgs is converted into the correction current Igc, the second ground potential Vgs can also be corrected as the feedback potential Vfb of the DCDC 311.

[0093] The operation of the detection unit 320 will be described in more detail. When the input terminal voltage of the OP amplifier 321 is of high impedance (≈∞ [Ω]), the voltage drops across the resistances (r1″, r2″) of the harness with connectors become negligibly small. In this case, Vgs = Gcob [V]. Also, the output terminal voltage of the OP amplifier 321 is defined by Vop = Vgs(1 + R2 / R1).

[0094] When no current I1 flows through the imaging unit 41 or the current I1 is very small, since the second ground potential Vgs≈0, the output potential Vop of the OP amplifier 321 becomes Vop≈0 [V]. In this case, no base current ib flows through the base of the transistor 324, so no correction current Igc flows through the collector of the transistor 324 as a collector current, and Igc = 0 [A]. Therefore, in this case, the power supply circuit unit 301 does not correct the first power supply voltage V1 based on the second ground potential Vgs.

[0095] When a current I1 greater than normal flows through the imaging unit 41 and the detection unit 320 detects the second ground potential Vgs, the output voltage of the OP amplifier 321 is Vop = Vgs(1 + R2 / R1). Since a base current ib flows through the base of the transistor 324, a correction current Igc flows through the collector of the transistor 324 as a collector current. In this case, Igc is defined by Igc = hFE·ib. Here, hFE is the DC current amplification factor of the transistor 324.

[0096] The imaging unit 41 according to the above embodiment also has the same effects as the embodiment described with reference to FIGS. 1 to 4. Further, according to the imaging unit 41 according to the present embodiment, not only the voltage drop I1(2r1 + r2) [V] when the current I1 flows from the power supply unit 53 of the substrate 62 to the mounting substrate 120 via the second flexible substrate 260 or the like with respect to the output voltage from the power supply unit 53 of the substrate 62, but also the feedback current I1 - Ifb passing through the imaging element 100, the voltage drop (I1 - Ifb)(2r′ + r2′) [V] when flowing from the ground Gcob of the mounting substrate 120 to the ground Gnd of the substrate 62 via the second flexible substrate 260 or the like can be boosted in advance and output.

[0097] FIG. 7 is a schematic circuit diagram of an imaging unit 42 according to an embodiment. In the present embodiment, as a difference from the embodiment described with reference to FIGS. 1 to 4, the power supply circuit unit 302 of the imaging unit 41 further has a differential amplifier circuit 330. The differential amplifier circuit 330 of the power supply circuit unit 302 is serially connected in order between the imaging element 100 and the DCDC 311 on the above feedback path together with the resistance element 313 and the resistance element 314.

[0098] The differential amplifier circuit 330 includes an OP amplifier 331 and four resistance elements 334, 332, 333, and 335. As shown in FIG. 7, the resistance values of the four resistance elements 334, 332, 333, and 335 are equal to R. When configured such that the resistance values of the four resistance elements 334, 332, 333, and 335 are the same, the differential amplifier circuit 330 becomes a differential amplifier circuit with a gain of 1 times.

[0099] The inverting input terminal (-) of the OP amplifier 331 is connected to the ground potential Gcob of the mounting substrate 120 via the ground line 263 of the second flexible substrate 260 and the like and the resistor element 334. The inverting input terminal (-) of the OP amplifier 331 is also connected to the output terminal of the OP amplifier 331 via the resistor element 335.

[0100] The non-inverting input terminal (+) of the OP amplifier 321 is connected to the input terminal side of the imaging element 100 via the resistor element 332 and the feedback line 262 of the second flexible substrate 260 and the like. One end of the resistor element 333 is connected between the non-inverting input terminal (+) of the OP amplifier 321 and the resistor element 332, and the other end of the resistor element 333 is connected to the ground potential Gnd. The output terminal of the OP amplifier 331 is also connected to the resistor element 313 connected in parallel with the resistor element 335.

[0101] Also, in the present embodiment, the resistances (r1″, r2″) of the paths through which the ground potential Gcob of the mounting substrate 120 is fed back in the connector 180 of the mounting substrate 120, the second flexible substrate 260, and the connector 182 of the substrate 62 are equal to the resistances (r1″, r2″) of the paths through which the second power supply voltage V1′ applied to the imaging element 100 is fed back. That is, the resistance values of both the ground line 263 and the feedback line 262 of the second flexible substrate 260 are r2″, and the pins of the connectors 180 and 182 connected to the ground line 263 and the feedback line 262 respectively have a resistance value of r1″.

[0102] The differential amplifier circuit 330 outputs, as an output voltage Vop, the difference between the third power supply voltage Vfb that appears on the substrate 62 side due to feedback and the second ground potential, to the output terminal. The second ground potential is the voltage that appears on the substrate 62 side due to feedback by feeding back the ground potential Gcob of the mounting substrate 120 via the second flexible substrate 260 and the like. In FIG. 7, the second ground potential is shown as (Vfb).

[0103] As shown in FIG. 7, a feedback current Ifb flows into the non-inverting input terminal (+) of the OP amplifier 331, and a feedback current Ifb′ flows into the inverting input terminal (−) of the OP amplifier 331. The potential Vfb of the non-inverting input terminal (+) of the OP amplifier 331 connected to the terminal voltage V1′ side of the imaging element 100 via the feedback line 262 or the like is Vfb = V1′·R / (R + R) = V1′ / 2 with respect to the ground potential Gnd. Also, Ifb is represented by Ifb = V1′ / (R + R) = V1′ / 2R.

[0104] The output potential Vop of the OP amplifier 331 operates such that the potential of the inverting input terminal (−) of the OP amplifier 331, which is also connected to the output terminal of the OP amplifier 331 via the resistor element 335, becomes the same potential Vfb as the non-inverting input terminal (+). Specifically, considering the voltage drop R·Ifb caused by the feedback current Ifb flowing through the resistor element 335, it operates such that Vop = Vfb + R·Ifb. Substituting Vfb = V1′ / 2 and Ifb = V1′ / 2R into the equation, we get Vop = V1′. This indicates that the output voltage Vop of the differential amplifier circuit 330 directly outputs the terminal voltage V1′ of the imaging element 100 on the mounting substrate 120 with respect to the ground potential Gnd of the substrate 62, which is the power supply substrate.

[0105] That is, the power supply circuit unit 302 does not individually detect the voltage drop in the power supply line 261 or the like of the second flexible substrate 260 and the voltage drop in the ground line 263 or the like of the second flexible substrate 260 caused by the feedback current flowing from the ground potential Gcob of the mounting substrate 120 to the ground potential Gnd of the substrate 62. Instead, it reproduces the difference between these voltage drops as the output voltage of the differential amplifier circuit 330, that is, it directly detects the difference.

[0106] The power supply circuit unit 302 corrects the above-described first power supply voltage V1 based on the difference output as the output voltage Vop of the differential amplifier circuit 330. That is, the power supply circuit unit 302 corrects the output voltage V1 of the power supply circuit unit 302 by directly feeding back the terminal voltage V1′ of the imaging element 100 to the DCDC 311.

[0107] The imaging unit 42 according to the above embodiment also has the same effects as the embodiment described with reference to FIGS. 1 to 4. Further, according to the imaging unit 42 according to the present embodiment, the influence of the contact resistance and transmission resistance of the harness with the connector is eliminated, and the terminal voltage V1', which is the voltage far from the power supply unit 53, can be accurately reproduced based on the ground Gnd of the power supply unit 53. It can also be said that the imaging unit 42 has a high accuracy in correcting the voltage drop in the harness with the connector.

[0108] FIG. 8 is a schematic circuit diagram of an imaging unit 43 according to an embodiment. In the present embodiment, different from the embodiment described with reference to FIG. 7, the power supply circuit section 303 has a feedback path formed by a small feedback loop in the power supply unit 53 and a voltage dividing path between the output terminal of the differential amplifier circuit 330 and the ground Gnd of the substrate 62.

[0109] The feedback path is arranged such that the resistance element 313 and the resistance element 314 are connected in series, and on the substrate 62, the first power supply voltage V1 output by the power supply circuit section 303 is fed back to the DCDC 311 of the power supply circuit section 303. The voltage dividing path includes a resistance element 336 and a resistance element 337 connected in series on the path between the output terminal of the differential amplifier circuit 330 and the ground Gnd of the substrate 62.

[0110] As shown in FIG. 8, let the resistances of the resistance element 313 and the resistance element 314 be Rfb1 and Rfb2 respectively, and the resistances of the resistance element 336 and the resistance element 337 be Rfb1' and Rfb2' respectively.

[0111] The resistance ratio Rfb1':Rfb2' of the resistance element 336 and the resistance element 337 is the same as the resistance ratio Rfb1:Rfb2 of the resistance element 313 and the resistance element 314. Further, there is a short circuit between the resistance element 313 and the resistance element 314 and between the resistance element 336 and the resistance element 337.

[0112] As described with reference to FIG. 7, the differential amplifier circuit 330 outputs, to the output terminal, the difference between the above-described third power supply voltage Vfb and the second ground potential as the output voltage V1fb. The second ground potential is the voltage that appears on the substrate 62 side by feeding back the ground potential Gcob of the mounting substrate 120 to the substrate 62 side via the second flexible substrate 260 or the like.

[0113] When no current I1 flows through the imaging unit 43 or the current I1 is very small, there is no voltage drop in the second flexible substrate 260 or the like. Therefore, the output voltage V1fb of the differential amplifier circuit 330 becomes V1fb = V1'. Further, since the output potential of the differential amplifier circuit 330 is equal to the feedback potential Vfb' of the DCDC 311, no correction current Ifc flows from between the resistor elements 313 and 314 toward between the resistor elements 336 and 337.

[0114] The output voltage V1 of the power supply circuit unit 303 can be expressed as V1 = Ifb·Rfb1 + Vfb'. When a current I1 greater than normal flows through the imaging unit 43, a voltage drop occurs in the second flexible substrate 260 or the like, and V1fb > V1'. At this time, the electrical balance is disrupted, and the above-described correction current Ifc flows. As a result, the corrected output voltage V1' of the power supply circuit unit 303 becomes V1' = (Ifc + Ifb)·Rfb1 + Vfb'. That is, the output voltage V1' of the DCDC 311 becomes a higher voltage by the amount of the correction current Ifc flowing, which means that the DCDC 311 can correct and output the voltage drop in the second flexible substrate 260 or the like. Note that the DCDC 311 is controlled such that the reference voltage Vref and Vfb' that it constructs itself satisfy Vref = Vfb'.

[0115] The imaging unit 43 according to the above embodiment also has the same effects as the embodiments described with reference to a plurality of figures. Further, according to the imaging unit 43 according to the present embodiment, the voltage drop of the terminal voltage V1′, which is the voltage far from the power supply unit 53, from V1 is accurately reproduced based on the ground Gnd of the power supply unit 53. Since the voltage drop is significantly smaller than the terminal voltage V1′, the delay amount when correcting and following the voltage drop according to the increase and decrease of the current value can be suppressed compared to the case of reproducing the terminal voltage V1′, and the oscillation of the entire power supply system can be suppressed.

[0116] FIG. 9 is a graph showing an example of the relationship between the change in the power consumption current and the change in the terminal voltage of the image sensor 100 according to an embodiment. The graph shown in FIG. 9 may show the relationship between the change in the power consumption current and the change in the terminal voltage of the image sensor 100 in the plurality of embodiments described with reference to FIGS. 1 to 8.

[0117] The horizontal axis of the graph indicates time [s], and the vertical axis indicates the terminal voltage V2 [V] and the power consumption current [A] of the image sensor 100. In the graph, the above-described specified voltage upper limit and specified voltage lower limit are each indicated by a dashed straight line.

[0118] When a normal current α [A] flows into the image sensor 100, the terminal voltage V1′ drops by an amount equal to the voltage drop of the output voltage V1 of the power supply circuit unit due to the contact resistance r1 of the connectors 180 and 182 and the transmission resistance r2 of the second flexible substrate 260, that is, α(2r1 + r2) [V] (the voltage after the drop is V1α = V1 - α(2r1 + r2)). However, since the power supply circuit unit of the imaging unit according to each embodiment outputs a voltage obtained by correcting the voltage drop based on the feedback voltage of the terminal voltage V1′, it can be maintained so that the terminal voltage V1′ = Vsen.

[0119] Even when a large current β [A] flows into the imaging element 100, the power supply circuit section of the imaging unit according to each embodiment outputs a voltage obtained by correcting the voltage drop based on the feedback voltage of the terminal voltage V1′, so that the terminal voltage V1′ = Vsen can be maintained. That is, according to the imaging unit according to each embodiment, even when the current consumption amount of the imaging element 100 changes rapidly, the terminal voltage V1′ of the imaging element 100 can be maintained within the voltage range Vsen in which the imaging element 100 can operate. That is, it is possible to prevent an overshoot in which the terminal voltage V1′ of the imaging element 100 transiently exceeds the specified voltage upper limit of Vsen by exceeding the drive capability of the regulator of the power supply circuit section, or an undershoot in which the terminal voltage V1′ transiently falls below the specified voltage lower limit of Vsen. That is, since the imaging unit according to each embodiment can comply with the specified voltage of the imaging element 100, stable operation of the imaging element 100 can be ensured.

[0120] In the above-described plurality of embodiments, there may be a case where about 10 various power supply circuits are mounted on the imaging unit, and among them, there is a power supply circuit to be mounted on the mounting substrate, for example, an analog power supply circuit. For example, in order to prevent noise caused by power supply fluctuations from affecting the signal applied to the pixel system, the pixel power supply for supplying power to drive the pixel circuit of the imaging element is preferably mounted on the substrate on which the imaging element is mounted.

[0121] Therefore, in the imaging unit according to the plurality of embodiments, depending on the type of the power supply circuit, the arrangement of the first power supply circuit section and the second power supply circuit section on the mounting substrate and the power supply substrate may be made different. For example, for a power supply circuit that is vulnerable to noise, a regulator such as an LDO may be arranged on the mounting substrate to reduce noise mixing. For example, for a digital power supply circuit, since there is a relatively large margin even if it is affected by noise, a regulator such as a DCDC may be arranged on the power supply substrate. When both the first power supply circuit section and the second power supply circuit section are mounted on the mounting substrate of the imaging unit, the power supply substrate may be considered as an independent component not included in the imaging unit.

[0122] In the above-described multiple embodiments, a camera including a lens unit and a camera body has been taken as an example of an imaging device and described. However, the imaging device does not necessarily include a lens unit. For example, the camera body is an example of an imaging device. Further, the imaging device is a concept that includes lensless imaging devices in addition to lens-exchangeable imaging devices such as single-lens reflex cameras.

[0123] Note that in some cases, it may be referred to as an imaging unit including an ASIC, a power supply unit, etc. Also, additionally or alternatively, in some cases, it may be referred to as an imaging unit including a first flexible substrate, a second flexible substrate, etc.

[0124] As described above, the present invention has been described using embodiments, but the technical scope of the present invention is not limited to the scope described in the above embodiments. It is obvious to those skilled in the art that various changes or improvements can be made to the above embodiments. It is clear from the description of the claims that forms with such changes or improvements can also be included in the technical scope of the present invention.

[0125] It should be noted that the execution order of each process such as operations, procedures, steps, and stages in the devices, systems, programs, and methods shown in the claims, the specification, and the drawings is not explicitly indicated as "before" or "preceding" etc., and can be realized in any order unless the output of the previous process is used in the subsequent process. Regarding the operation flows in the claims, the specification, and the drawings, even if it is described using "first," "next," etc. for convenience, it does not mean that it must be implemented in this order.

Description of Reference Numerals

[0126] 10 Camera, 20 Lens unit, 22 Optical axis, 30 Camera body, 31 Housing, 40, 41, 42, 43 Imaging unit, 100 Image sensor, 101 Imaging area, 102 Peripheral area, 104 Processing circuit, 105 Transmission circuit, 110 Bonding wire, 120 Mounting substrate, 111 First main surface, 112 Second main surface, 121 First layer, 122 Second layer, 131 Via, 132 Insulator, 138 Opening, 180, 182, 184 Connector, 185 Bypass capacitor group, 187 Circuit group, 188 Capacitor, 201, 211 Solder resist layer, 202, 204, 212, 214 Wiring layer, 203, 205, 213, 215 Insulating layer, 207 Core layer, 210, 220, 230 Adhesive part, 240 Bonding pad, 140 Frame, 141 First surface, 142 Second surface, 143 Third surface, 144 Fourth surface, 145 Fifth surface, 146 Sixth surface, 147 Positioning hole, 148 Mounting hole, 149 Screw, 150 Bracket, 160 Cover glass, 250 First flexible substrate, 260 Second flexible substrate, 261 Power line, 262 Feedback line, 263 Ground line, 60 Substrate unit, 62 Substrate, 51 MPU, 52 ASIC, 53 Power supply unit, 88 Display unit, 300, 301, 302, 303 Power circuit unit, 311 DCDC, 312 Coil, 313, 314 Resistive element, 315 Capacitor, 320 Detection unit, 321 OP amplifier, 322, 323, 325, 326 Resistive element, 324 Transistor, 330 Differential amplifier circuit, 331 OP amplifier, 332, 333, 334, 335, 336, 337 Resistive element

Claims

[Claim 1] a mounting board on which an image sensor for capturing an image of a subject and a connector are mounted; a power supply board having a power supply circuit section including a regulator and a connector mounted thereon; a flexible substrate having one end connected to the connector of the mounting substrate and the other end connected to the connector of the power supply substrate; Equipped with the power supply circuit unit outputs a first power supply voltage, feeds back a second power supply voltage applied to the imaging element via the flexible substrate based on the first power supply voltage, via the flexible substrate, and corrects the first power supply voltage based on a third power supply voltage that appears on the power supply substrate side by the feedback. Imaging unit.

Images