Semiconductor layer structure
The nitride semiconductor layer structure with vertical nanowire structures effectively addresses the challenge of forming high-quality nitride layers on silicon substrates by encapsulating dislocations and reducing defects, thereby improving the crystal quality and performance of nitride semiconductor devices.
JP2025081746AActive Publication Date: 2025-05-27EPINOVATECH AB
Patent Information
- Application Number
- JP2025033832
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2019-12-11
- Filing Date
- 2025-03-04
- Publication Date
- 2025-05-27
- Estimated Expiration
- 2040-12-08
Smart Images

Figure 2025081746000001_ABST
Abstract
To provide nitride semiconductor layer structures, electronic devices based thereon, and methods of producing such structures and devices.SOLUTION: A semiconductor layer structure (100) comprises: an Si substrate (102) having a top surface (104); a first semiconductor layer (110) arranged on the substrate, the first semiconductor layer comprising a plurality of vertical nanowire structures (112) arranged perpendicularly to the top surface of the substrate, the first semiconductor layer comprising AIN; a second semiconductor layer (120) laterally and vertically enclosing the nanowire structures (112) on the first semiconductor layer, the second semiconductor layer comprising AlxGa1-xN, where 0≤x≤0.95; a third semiconductor layer (130) arranged on the second semiconductor layer (120), the third semiconductor layer comprising AlyGa1-yN, where 0≤y≤0.95; and a fourth semiconductor layer (140) arranged on the third semiconductor layer, the fourth semiconductor layer comprising GaN.SELECTED DRAWING: Figure 1
Need to check novelty before this filing date? Find Prior Art
Citation Information
Patent Citations
Nitride semiconductor device
JP2011108712A
Compound semiconductor device and manufacturing method of the same
JP2013042032A
Epitaxial substrate for formation of semiconductor device for high frequency, and method for manufacturing epitaxial substrate for formation of semiconductor device for high frequency
JP2013065883A
Semiconductor device
JP2014146744A
Method for producing crystal laminate structure
JP2014201457A