Imprint apparatus, imprint method, and manufacturing method of article

Abstract

To provide an imprint apparatus, an imprint method, and a method for manufacturing an article that are advantageous in terms of suppressing transfer abnormalities.SOLUTION: An imprint apparatus that uses a mold to form a pattern in multiple shot areas on a substrate, includes a mold holding portion that holds the mold, a substrate holding portion that holds the substrate, a supply portion that supplies an imprint material onto the substrate, and a control portion that controls driving of the mold holding portion, the substrate holding portion, and the supply portion, and the control portion adjusts the supply of imprint material from the supply portion to a second shot area that subsequently uses the mold used to form the pattern in the first shot area, on the basis of a peripheral shape of a first shot area that includes the outer periphery of the substrate.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to an imprint apparatus, an imprint method, and a method for manufacturing an article.

Background Art

[0002] As a lithography technique for manufacturing semiconductor devices and the like, an imprint technique for molding an imprint material (curable composition) on a substrate using a mold is known. In an imprint apparatus using the imprint technique, an imprint material is applied onto a substrate by an application unit for applying the imprint material, the mold is brought into contact with the imprint material on the substrate, the imprint material is cured in a state where the imprint material is filled between the mold and the substrate, and by separating the mold from the cured imprint material, a pattern of the imprint material can be formed on the substrate.

[0003] In an imprint apparatus, it is required to accurately align a pattern region where a pattern of a mold is formed with a transfer region (shot region) of a substrate, and to perform transfer so that there is no omission in pattern transfer. This particularly causes many problems in a shot region (peripheral shot region), a so-called "chipped shot region", where a part of the mold protrudes from the outer periphery of the substrate and only a part of the pattern portion of the mold is transferred at the outer peripheral portion of the substrate.

[0004] Patent Document 1 describes a technique for reducing defects in pattern transfer and improving pattern transfer accuracy by adjusting the coating amount of the imprint material in a chipped shot region on the outer periphery of a substrate.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] However, it is difficult to accurately control the outermost peripheral position of the liquid film of the imprint material sandwiched between the mold and the outer peripheral portion of the substrate, that is, the position of the end portion of the liquid film before curing. In addition, there may be a region where the film thickness of the imprint material becomes partially thin at the end portion of the liquid film and adheres to the mold side. For this reason, in the conventional technology, when performing imprinting in the chipped shot region, when separating the mold and the substrate, the imprint material at the outermost peripheral portion may be peeled off from the substrate and adhere to the mold. In this case, due to the influence of the imprint material adhering to the mold, transfer abnormalities may occur in subsequent shots.

[0007] In view of the above problems, an object of the present invention is to provide an imprint apparatus that is advantageous in terms of suppressing transfer abnormalities.

Means for Solving the Problems

[0008] In order to achieve the object, an imprint apparatus as one aspect of the present invention is an imprint apparatus that forms a pattern in a plurality of shot regions on a substrate using a mold, a mold holding portion that holds the mold, a substrate holding portion that holds the substrate, a supply portion that supplies an imprint material onto the substrate, a control portion that controls the driving of the mold holding portion, the substrate holding portion, and the supply portion, and has, and the control portion adjusts the supply of the imprint material from the supply portion to a second shot region that uses the mold used for forming the pattern of the first shot region next, based on the outer peripheral shape of the first shot region including the outer periphery of the substrate. It is characterized by the above.

Effects of the Invention

[0009] According to the present invention, it is possible to provide an imprint method, an imprint apparatus, and a method for manufacturing an article that are advantageous in terms of suppressing transfer abnormalities.

Brief Description of the Drawings

[0010]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Embodiments for Carrying Out the Invention

[0011] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the invention according to the claims. Although a plurality of features are described in the embodiments, not all of these plurality of features are essential to the invention, and the plurality of features may be arbitrarily combined. Further, in the accompanying drawings, the same or similar configurations are denoted by the same reference numerals, and redundant explanations are omitted.

[0012] (First Embodiment) FIG. 1 is a schematic diagram showing the configuration of an imprint apparatus 100 as one aspect of the present invention. The imprint apparatus 100 is a type of lithography apparatus that is employed in a lithography process, which is a manufacturing process for devices such as semiconductor elements, liquid crystal display elements, and magnetic storage media as articles, and forms a pattern on a substrate. The imprint apparatus 100 performs an imprint process of forming a pattern of an imprint material on a substrate using a mold (mold). Specifically, the imprint apparatus 100 brings an uncured imprint material supplied (disposed) on the substrate into contact with the mold, and applies energy for curing to the imprint material, thereby forming a pattern of a cured product on which the pattern of the mold is transferred.

[0013] As the imprint material, a curable composition that cures when energy for curing is applied is used as the material. As the energy for curing, electromagnetic waves, heat, or the like is used. The electromagnetic waves include, for example, light selected from the range of wavelengths of 10 nm or more and 1 mm or less, specifically, infrared rays, visible light, ultraviolet rays, and the like.

[0014] The curable composition is a composition that cures by irradiation with light or by heating. The photocurable composition that cures by irradiation with light contains at least a polymerizable compound and a photoinitiator, and may further contain a non-polymerizable compound or a solvent as necessary. The non-polymerizable compound is at least one selected from the group consisting of a sensitizer, a hydrogen donor, an internal release agent, a surfactant, an antioxidant, a polymer component, and the like.

[0015] The imprint material may be applied in a film form on a substrate by a spin coater or a slit coater. Further, the imprint material may be applied on the substrate in a droplet form or in an island or film form formed by connecting a plurality of droplets by a liquid injection head. The viscosity of the imprint material (viscosity at 25°C) is, for example, 1 mPa·s or more and 100 mPa·s or less.

[0016] For the substrate, glass, ceramics, metal, semiconductor, resin, or the like is used, and a member made of a material different from the substrate may be formed on its surface as necessary. Specifically, the substrate includes a silicon wafer, a compound semiconductor wafer, quartz glass, and the like.

[0017] In this specification and the accompanying drawings, directions are indicated in an XYZ coordinate system in which the direction parallel to the surface on which the substrate is disposed is defined as the XY plane. The directions parallel to the X-axis, Y-axis, and Z-axis in the XYZ coordinate system are defined as the X-direction, Y-direction, and Z-direction, respectively, and the rotations around the X-axis, Y-axis, and Z-axis are defined as θX, θY, and θZ, respectively.

[0018] In the present embodiment, the imprint apparatus 100 adopts a configuration having a light irradiation unit that cures the imprint material by irradiating light as a cured portion of the imprint material, but is not limited thereto. For example, the imprint apparatus 100 can also adopt a thermal curing method that cures the imprint material by applying heat as a method for curing the imprint material.

[0019] As shown in FIG. 1, the imprint apparatus 100 includes a pre-alignment unit 7, a supply unit 8, an off-axis alignment measurement system 9, and an alignment measurement system 10. The imprint apparatus 100 also includes a light transmission member 13, a control unit 14, a console unit 15, an irradiation unit 16 as a curing unit for curing the imprint material, a filling monitor 17, a mold stage 5, and a substrate stage 6.

[0020] The irradiation unit 16 irradiates light (for example, ultraviolet light) onto the imprint material on the substrate through the mold 3. The irradiation unit 16 includes, for example, a light source unit 161 that emits light for curing the imprint material on the substrate, and an optical member 162 for guiding the light emitted from the light source unit 161 to the imprint material on the substrate. The optical member 162 includes optical elements for adjusting the light emitted from the light source unit 161 into light suitable for the imprint process.

[0021] The mold 3 has a rectangular outer peripheral shape. A three-dimensional pattern 3a is formed on the surface (pattern surface) of the mold 3 facing the substrate 1. The mold 3 is made of a material that can transmit light (ultraviolet light) from the irradiation unit 16, for example, quartz glass or the like. The mold 3 includes a cavity (recess) 3b for facilitating deformation of the pattern 3a. The cavity 3b has a circular planar shape, and its depth (thickness) is appropriately set according to the shape and material of the mold 3.

[0022] Above the cavity 3b, a light transmissive member 13 is disposed. The light transmissive member 13 is a member for sealing a space 12 surrounded by the cavity 3b and a part of an opening region provided in the mold stage 5 as a sealed space. By adjusting the pressure in the space 12 via a pressure adjusting device (not shown) connected to the space 12, the pattern 3a of the mold 3 can be deformed, for example, the pattern 3a of the mold 3 can be deformed into a convex shape on the substrate side.

[0023] The mold stage 5 includes a mold holding part 51 that holds the mold 3 by a vacuum suction force or an electrostatic force, a mold driving part 52 that drives the mold holding part 51 in the Z direction (the vertical direction in FIG. 1), and a mold deformation mechanism 53. The mold holding part 51, the mold driving part 52, and the mold stage 5 are provided with an opening region at the center thereof for irradiating the imprint material on the substrate with light from the irradiation part 16.

[0024] The mold driving part 52 includes, for example, an actuator such as a voice coil motor or an air cylinder. The mold driving part 52 drives the mold holding part 51 (the mold 3 held therein) in the Z direction in order to bring the mold 3 into contact with the imprint material on the substrate or separate the mold 3 from the imprint material on the substrate. Note that the mold driving part 52 may have a function of driving the mold holding part 51 not only in the Z direction but also in the X direction and the Y direction (that is, a function of adjusting the position of the mold 3 in the X direction and the Y direction). Further, the mold driving part 52 may have a function of adjusting the position of the mold holding part 51 in the θZ direction or a function of adjusting the inclination (tilt) of the mold holding part 51.

[0025] The mold deformation mechanism 53 deforms the mold 3 by applying an external force or displacement to the side surface of the mold 3 held by the mold holding part 51. That is, the pattern 3a of the mold 3 can be deformed and the shape of the mold 3 can be corrected. The mold deformation mechanism 53 includes, for example, a plurality of actuators and is configured to pressurize a plurality of locations on each side surface of the mold 3.

[0026] On the substrate 1, a plurality of shot regions are arranged in a matrix. Here, the shot region means a region (transfer region) where the pattern 3a of type 3 is transferred by one imprint process. In the present embodiment, in order to maximize the effective area of the substrate 1 (the total area of the region where the pattern 3a of type 3 is transferred), not only the inner shot regions of the substrate 1 but also the peripheral shot regions including the outer periphery of the substrate 1 are subjected to the imprint process. The peripheral shot region is a shot region that is partially missing (protrudes from the outer periphery of the substrate 1) and is also referred to as a missing shot region.

[0027] The substrate stage 6 includes a substrate holding portion 2 that holds the substrate 1, and a substrate driving portion 61 that drives the substrate holding portion 2 (the substrate 1 held therein) in the X direction and the Y direction. The substrate driving portion 61 includes, for example, a linear motor and may be composed of a plurality of driving systems such as a coarse driving system and a fine driving system. Further, the substrate driving portion 61 may have a function of driving the substrate holding portion 2 not only in the X direction and the Y direction but also in the Z direction (that is, a function of adjusting the position of the substrate 1 in the Z direction). Furthermore, the substrate driving portion 61 may have a function of adjusting the position of the substrate holding portion 2 in the θZ direction and a function of adjusting the inclination (tilt) of the substrate holding portion 2.

[0028] The pre-alignment portion 7 includes a pre-alignment stage (not shown) on which the substrate 1 is mounted, and a pre-alignment sensor (not shown) that measures the position of the substrate 1 mounted on the pre-alignment stage. The pre-alignment sensor measures the position of the substrate 1 by detecting a notch or an orientation flat provided on the substrate 1. Based on the measurement result of the pre-alignment sensor, the pre-alignment stage is driven, and at that position, the substrate 1 mounted on the pre-alignment stage is passed to a transfer hand (not shown). Then, the transfer hand arranges the substrate 1 on the substrate holding portion 2. Instead of driving the pre-alignment stage, based on the measurement result of the pre-alignment sensor, the position of the transfer hand (receiving position) that receives the substrate 1 from the pre-alignment stage and the position of the substrate holding portion 2 that receives the substrate 1 from the transfer hand may be changed.

[0029] In this embodiment, the position of the substrate stage 6 is measured using an encoder system including a scale provided on the housing and a head (optical device) provided on the substrate drive unit 61, but it is not limited thereto. For example, the position of the substrate stage 6 may be measured using an interferometer system including a laser interferometer provided on the housing and a reflection mirror provided on the substrate drive unit 61.

[0030] The off-axis alignment measurement system 9 and the alignment measurement system 10 are used for pre-alignment measurement to measure the relative positions of the mold 3 and the substrate 1 (each shot area). The off-axis alignment measurement system 9 and the alignment measurement system 10 individually measure the positions of the substrate 1 and the mold 3 based on the device coordinates under the control of the control unit 14. The alignment measurement system 10 measures the position of the mold 3 based on the position reference of the alignment measurement system 10 by detecting (observing) the marks provided on the mold 3. On the other hand, the off-axis alignment measurement system 9 measures the position of the substrate 1 (each shot area) based on the position reference of the substrate holding unit 2 by detecting a plurality of marks provided on the substrate 1 held by the substrate holding unit 2. Then, statistical calculation processing (global alignment) for estimating the position coordinates of all shot areas of the substrate 1 is performed.

[0031] Furthermore, the alignment measurement system 10 measures the positional deviation in the X direction and the Y direction between the alignment mark provided on the substrate 1 and the alignment mark provided on the mold 3 (that is, the positional deviation between the substrate 1 and the mold 3). Under the control of the control unit 14, by adjusting the position of the substrate stage 6 based on the positional deviation measured by the alignment measurement system 10, the mold 3 (pattern 3a) and the substrate 1 (shot area) are overlapped (aligned).

[0032] The supply unit (dispenser) 8 has a function of disposing (supplying) an imprint material onto the substrate. The supply unit 8 discharges droplets of the imprint material, for example, onto each shot area on the substrate. The supply unit 8 may individually dispose the imprint material onto a plurality of shot areas on the substrate, or may dispose the imprint material collectively onto some of the shot areas.

[0033] The filling monitor 17 (spread camera) observes the contact state between the imprint material disposed (supplied) on the substrate (in the shot area) and the mold 3. By observing the contact state between the imprint material on the substrate and the mold 3 with the filling monitor 17, it becomes possible to identify defective locations due to particles or unfilled imprint material. The filling monitor 17 includes, for example, a light source, an imaging device, and an optical system. As the light source, an LED or the like that emits light having a wavelength to which the imprint material is not sensitive is used, and as the imaging device, a two-dimensional sensor such as a CCD sensor is used. The optical system includes an illumination system that uniformly illuminates the substrate 1 (in the shot area) with light from the light source, and an imaging system that optically conjugates the substrate 1 and the imaging device.

[0034] The control unit 14 is configured by a computer including, for example, a CPU and a memory, and operates the imprint apparatus 100 by comprehensively controlling each part of the imprint apparatus 100 according to a program stored in the memory.

[0035] In this embodiment, the control unit 14 controls the imprinting process of forming a pattern of the imprinting material on the substrate using mold 3 (transferring the pattern 3a of mold 3 to the imprinting material on the substrate) and processes related thereto. Here, the imprinting process typically includes an arrangement step, a contact step, a filling step, a curing step, and a demolding step. The arrangement step is a step of arranging (supplying) the imprinting material on the substrate. The contact step is a step of bringing the imprinting material on the substrate into contact with mold 3. The filling step is a step of filling the pattern 3a of mold 3 with the imprinting material while the imprinting material on the substrate is in contact with mold 3. The curing step is a step of curing the imprinting material while the imprinting material on the substrate is in contact with mold 3. The demolding step is a step of separating mold 3 from the cured imprinting material on the substrate.

[0036] The console unit 15 includes a computer equipped with an input device such as a keyboard and a mouse and a display, and is an interface for sharing information between the imprinting device 100 (control unit 14) and the user. The console unit 15 outputs (transmits) information regarding the imprinting process input by the user to the control unit 14. The information regarding the imprinting process input to the console unit 15 is recorded in the imprinting device 100 as a log and can be confirmed before and after the imprinting process. Here, the information regarding the imprinting process includes an imprint recipe in which various imprint conditions for forming a pattern of the imprinting material on the substrate are described. The imprint recipe includes, for example, the force applied to mold 3 (pressing force (imprinting force)) when bringing mold 3 into contact with the imprinting material on the substrate, a shot layout indicating the arrangement of shot regions on the substrate, a drop pattern indicating the arrangement of droplets of the imprinting material to be arranged on the substrate, and the like.

[0037] Figure 2 is a view of the substrate 1 and the mold 3 of the present embodiment in the cross-sectional direction. (a) to (c) show the imprinting method in the chipped shot region (first shot region), and (d) to (f) show the imprinting method in the second shot region next to the chipped shot region. In (a), the imprinting material 21 has already been dropped onto the substrate 1, and the mold 3 descends. In (b), the mold and the imprinting material 21 come into contact, and the imprinting material 21 fills the space between the mold 3 and the substrate 1. At this time, the imprinting material 21 at the end of the outer periphery of the substrate spreads by wetting depending on the surface states of the substrate 1 and the mold 3 respectively. The spreading state is affected by the pattern structure, surface state of the mold 3, material properties of the imprinting material 21, etc. In (b), a state 22 where it has spread widely on the mold surface has occurred. In (c), the mold 3 ascends to release the mold, and it can be seen that a part of the imprinting material 21 that has spread by wetting adheres (23) to the mask after being peeled off from the substrate side. This adhesion occurs at a position corresponding to the outer peripheral shape of the substrate.

[0038] In the shot region next to the chipped shot region of (d) to (f), in (d), the mold 3 is in a state where the peeled-off imprinting material 21 has adhered, and the mold 3 descends in this state. At this time, among the imprinting material 21 previously dropped onto the substrate 1, in 24, the volume of the imprinting material is dropped in a small state in advance. This can be realized by grasping in advance the position and volume of the imprinting material 21 that adheres to the mold 3 generated corresponding to the outer peripheral shape of the substrate. That is, the supply position or supply amount of the imprinting material of the supply unit 8 for the next second shot region is adjusted so as to reduce the over-supply caused by the imprinting material 21 that adheres to the mold 3 in the imprinting for the first shot region. As a result, in (e), the adhered imprinting material 23 fills the imprinting material 21 between the mold 3 and the substrate 1 without causing film thickness unevenness or filling defects, and the mold release is completed in (f).

[0039] FIG. 3(a) shows the shot layout information of the substrate 1, the location 1aa where peeling of the end of the imprint material occurs in the missing shot area 1a, and the transfer position 1ba in the next shot area 1b. In the 1ba of the shot area 1b, the imprint material 1aa peeled off in the shot area 1a remains on the substrate as an excessive imprint 1ba material, resulting in film thickness unevenness and transfer abnormalities. FIGS. 3(b)(c)(d) show the droplet dropping arrangement of the imprint material 21 in the shot area 1b. FIG. 3(b) shows the initial droplet arrangement. If imprinting is performed in this state, film thickness unevenness will occur. Therefore, for the position 1ba where the peeled imprint material remains, in FIG. 3(c), a part of the droplets close to 1ba is removed from the droplet dropping target, and the dropping position is shifted like the droplet 21a. That is, in the next second shot area, by reducing the number of droplets ejected from the supply unit or changing the position of the droplets ejected from the supply unit, the supply amount of the imprint material arranged in the next second shot area is adjusted. Thereby, local unevenness of the film thickness can be reduced. In FIG. 3(d), the volume of a part of the droplets close to 1ba is reduced. It is also possible to reduce film thickness unevenness by this method, and the method of changing the droplet arrangement and volume is determined by the position and volume of the imprint material attached to the mold 3.

[0040] FIG. 4 shows an example of adjusting droplets in shot regions subsequent to the chipped shot region. When imprinting is performed in the substrate 1 shot region 1c in FIG. 4(a), the imprinting material adheres to the mold during demolding at the end 1ca of the imprinting material. In the shot regions 1d and 1e of the substrate 1 subsequent to the shot region 1c, since the imprinting material of 1ca adhering to the mold does not contact the imprinting material supplied to the substrate, the imprinting material adhering to the mold remains in the adhered state. In this case, droplet adjustment will be performed in the shot region 101a of the next substrate 101. Here, the supply amount of the imprinting material in the 101aa portion of the shot region 101a is adjusted, but a part of 101aa is outside the range of the supply region on the outer periphery of the substrate, and in the range outside the supply region of 101aa, the imprinting material of 1ca adhering to the mold does not contact the imprinting material supplied to the substrate. That is, a part of 101aa will be adjusted at 101ba in the next shot region 101b. In the shot region 101b, in addition, it is also necessary to adjust the imprinting material for 1da and 1ea generated in the shot regions 1d and 1e of the substrate 1.

[0041] The position and volume of the imprinting material adhering to the mold 3 can be determined by imprinting in the droplet state of FIG. 4(b) in advance. By measuring the surface shape of the mold 3 in detail and comparing it with the surface shape before imprinting, the volume and position of the adhered imprinting material can be specified. Thereby, based on the amount and position of the imprinting material adhering to the mold measured after imprinting, the supply position and supply amount of the imprinting material to be supplied to the next shot region can be determined.

[0042] Also, equivalent results can be obtained by measuring the surface shape of the imprinting material on the substrate before and after imprinting. That is, by acquiring in advance as data at the time of imprinting in the shot region 1c based on these measurement results, the amount and position of the imprinting material adhering to the mold can be specified, and the supply position and supply amount of the imprinting material to be supplied to the second shot region (shot region 1d) to be performed next, and further the third and fourth shot regions thereafter can be determined.

[0043] By using these results and pre-adjusting the droplet placement conditions in the shot area 1b, transfer anomalies can be improved.

[0044] Regarding the droplets to be adjusted, an area within a maximum width of 5 mm with the 1ba in Fig. 3 as the center line is set. This 1ba corresponds to the position of the end portion 1aa of the imprint material in the shot area 1a. In the case of a process with a thin post-imprint film thickness (RLT) or a small pattern density of the mold (small concave volume of the mold), the interval between the droplets to be dropped becomes larger, and the range of droplets to be adjusted also becomes wider.

[0045] Fig. 5 shows the flow of the imprint operation in this embodiment. The mold is carried in at S101, and the substrate is carried in at S102. At S103, shot layout information conforming to the imprint conditions is acquired, and at S104, the placement information of the droplets in each shot area is acquired. Then, at S105, information on the outer peripheral shape of the outer peripheral shot area (position information of the end portion of the imprint material) is acquired, and at S106, the placement position of the droplets in the next shot area of the outer periphery is adjusted. In S105 and S106, the droplet placement information is updated according to the film thickness unevenness information (information on the amount of film thickness change) measured in advance. The imprint material for the shot area to be imprinted is supplied at S107, pressing is performed at S108, curing of the imprint material is performed at S109, and a mold release operation is performed at S110. If there is a shot area where imprinting has not been performed, imprinting is sequentially performed until all shots are completed, and then the substrate is carried out at S111 to complete.

[0046] As described above, according to this embodiment, the transfer performance due to imprinting on the outer peripheral portion of the substrate can be improved, and the yield can be enhanced.

[0047] (Second Embodiment) Method for Measuring the Adhesion Amount of the Imprint Material In the second embodiment, a method for measuring the amount of the imprint material adhering to the mold during demolding will be described. As the measurement method, in addition to the image information of the mold after demolding when the imprint is demolded, a method of directly measuring the surface state of the mold and the surface state of the substrate can also be considered. As the measurement method, in the case of an optical measurement method, examples include white interferometry, reflection spectroscopy, ellipsometry, laser length measurement, confocal type such as a laser microscope, etc. In the case of a contact measurement method, a stylus, SEM, TEM, AFM, micrometer, and in the case of an electrical measurement method, eddy current type, electrostatic type, etc. can also be considered, but it is not limited to this.

[0048] (Third Embodiment) Method for Manufacturing an Article The pattern of the cured product formed using the imprint apparatus is permanently used for at least a part of various articles, or temporarily used when manufacturing various articles. The article is an electric circuit element, an optical element, MEMS, a recording element, a sensor, or a mold, etc. Examples of the electric circuit element include volatile or non-volatile semiconductor memories such as DRAM, SRAM, flash memory, MRAM, and semiconductor elements such as LSI, CCD, image sensor, FPGA, etc. Examples of the mold include a mold for imprinting.

[0049] The pattern of the cured product is used as it is as at least a part of the constituent members of the above article, or temporarily used as a resist pattern. After etching, ion implantation, etc. are performed in the substrate processing step, the resist pattern is removed.

[0050] Next, a specific method for manufacturing an article will be described. As shown in Fig. 6(a), a substrate 1z such as a silicon wafer with a work material 2z such as an insulator formed on its surface is prepared, and then a photocurable material 3z is applied to the surface of the work material 2z by an inkjet method or the like. Here, a state where the photocurable material 3z in a plurality of droplet shapes is applied on the substrate is shown.

[0051] As shown in Fig. 6(b), the imprint mold 4z is opposed with the side on which the concavo-convex pattern is formed facing the photocurable material 3z on the substrate. As shown in Fig. 6(c), the substrate 1z provided with the photocurable material 3z is brought into contact with the mold 4z and pressure is applied. The photocurable material 3z is filled in the gap between the mold 4z and the workpiece 2z. When light is irradiated through the mold 4z as the energy for curing in this state, the photocurable material 3z cures.

[0052] As shown in Fig. 6(d), after the photocurable material 3z is cured and the mold 4z and the substrate 1z are separated, a pattern of the cured product of the photocurable material 3z is formed on the substrate 1z. The pattern of this cured product has a shape in which the concave portion of the mold corresponds to the convex portion of the cured product and the convex portion of the mold corresponds to the convex portion of the cured product, that is, the concavo-convex pattern of the mold 4z is transferred to the imprint material 3z.

[0053] As shown in Fig. 6(e), when etching is performed using the pattern of the cured product as an etching-resistant pattern, the portion of the surface of the workpiece 2z where the cured product is absent or remains thinly is removed to form a groove 5z. As shown in Fig. 6(f), when the pattern of the cured product is removed, an article having a groove 5z formed on the surface of the workpiece 2z can be obtained. Here, the pattern of the cured product is removed, but it may be used as a film for interlayer insulation included in, for example, a semiconductor element or the like without being removed after processing, that is, as a constituent member of the article.

[0054] <Summary of Embodiment> The disclosure of this specification includes an imprint apparatus, an imprint method, and a method for manufacturing an article.

[0055] (Item 1) An imprint apparatus for forming a pattern in a plurality of shot regions on a substrate using a mold, comprising: a mold holding part for holding the mold; a substrate holding part for holding the substrate; a supply part for supplying an imprint material onto the substrate; a control part for controlling the driving of the mold holding part, the substrate holding part, and the supply part. having, and the control unit Based on the outer peripheral shape of the first shot area including the outer periphery of the substrate, the supply of the imprint material of the supply unit is adjusted for the second shot area that will use the mold used for forming the pattern of the first shot area An imprint apparatus characterized by the above.

[0056] (Item 2) The control unit The imprint apparatus according to Item 1, wherein the supply amount of the imprint material of the supply unit for the second shot area is adjusted based on the outer peripheral shape of the first shot area.

[0057] (Item 3) The control unit By reducing the number of droplets ejected from the supply unit, The supply amount of the imprint material disposed in the second shot area is adjusted The imprint apparatus according to Item 2.

[0058] (Item 4) The control unit By changing the position of the droplets ejected from the supply unit, The supply amount of the imprint material disposed in the second shot area is adjusted The imprint apparatus according to Item 2.

[0059] (Item 5) By changing the volume of the droplets ejected from the supply unit, The supply amount of the imprint material disposed in the second shot area is adjusted The imprint apparatus according to Item 2.

[0060] (Item 6) The control unit Based on the information on the outer peripheral shape and the information on the amount of the imprint material attached to the mold in forming the pattern of the first shot area, the imprint device according to item 1, which adjusts the supply position and supply amount of the imprint material of the supply unit for the second shot area.

[0061] (Item 7) Determining the supply of the second shot area of the substrate based on the amount of film thickness change in the second shot area measured in advance on another substrate. The imprint device according to items 1 to 4.

[0062] (Item 8) The imprint device according to items 1 to 5, which sets a region within a width of 5 mm with the outer periphery of the first shot area as the center line, and adjusts the supply position and supply amount of the imprint material in the second shot area corresponding to the region within the range.

[0063] (Item 9) From the data during imprinting of the first shot area, Identifying the amount and position of the imprint material attached to the mold, Determining the supply position and supply amount of the imprint material to be supplied to the second shot area The imprint device according to items 1 to 6.

[0064] (Item 10) After imprinting the first shot area, Based on the amount and position of the imprint material attached to the mold measured, Determining the supply position and supply amount of the imprint material to be supplied to the second shot area. The imprint device according to items 1 to 6.

[0065] (Item 11) An imprint method for forming a pattern on a plurality of shot areas on a substrate using a mold, comprising: A step of imprinting on a first shot area including the outer periphery of the substrate using a mold; A supply step of supplying an imprint material to a second shot region on the substrate, and an imprint step of imprinting the second shot region supplied with the imprint material using the mold used in the first shot region next. The method has: The supply step adjusts the supply based on the outer peripheral shape of the first shot region An imprint method characterized by the above.

[0066] (Item 12) The supply step according to item 11, which is a step of adjusting the supply position or supply amount of the imprint material of the supply unit to the second shot region based on the outer peripheral shape of the first shot region.

[0067] (Item 13) The supply step according to item 12, which is a step of adjusting the supply position or supply amount of the imprint material of the supply unit to the second shot region so as to reduce the supply excess due to the imprint material adhering to the mold in the imprint on the first shot region.

[0068] (Item 14) A step of forming a pattern on a substrate using the imprint method according to any one of items 11 to 13; A step of processing the substrate using the pattern; A step of manufacturing an article from the processed substrate; A method for manufacturing an article, characterized by including the above.

Explanation of reference numerals

[0069] 1 Substrate 2 Substrate holding part 3 Mold

Claims

1. An imprint apparatus for forming a pattern in a plurality of shot regions on a substrate using a mold, comprising: a mold holding unit for holding the mold; a substrate holding unit for holding the substrate; a supply unit for supplying an imprint material onto the substrate; a control unit for controlling the driving of the mold holding unit, the substrate holding unit, and the supply unit; wherein the control unit adjusts the supply of the imprint material by the supply unit to a second shot region that will next use the mold used for forming the pattern of the first shot region, based on the outer peripheral shape of the first shot region including the outer periphery of the substrate. An imprint apparatus characterized by the above.

2. The control unit adjusts the supply amount of the imprint material by the supply unit to the second shot region based on the outer peripheral shape of the first shot region. The imprint apparatus according to claim 1.

3. The control unit reduces the number of droplets ejected from the supply unit, to adjust the supply amount of the imprint material disposed in the second shot region. The imprint apparatus according to claim 2.

4. The control unit changes the position of the droplets ejected from the supply unit, to adjust the supply amount of the imprint material disposed in the second shot region. The imprint apparatus according to claim 2.

5. By changing the volume of the droplets ejected from the supply unit, the supply amount of the imprint material disposed in the second shot region is adjusted. The imprint apparatus according to claim 2.

6. The control unit adjusts the supply position and supply amount of the imprint material by the supply unit to the second shot region based on the information on the outer peripheral shape and the information on the amount of the imprint material adhering to the mold in the formation of the pattern of the first shot region. The imprint apparatus according to claim 1.

7. Determines the supply to the second shot region of the substrate based on the film thickness change amount of the second shot region measured in advance on another substrate. The imprint apparatus according to claim 1.

8. Sets a region within a width of 5 mm with the outer periphery of the first shot region as the center line, and adjusts the supply position and supply amount of the imprint material in the second shot region corresponding to the region within the range. The imprint apparatus according to claim 1.

9. From the data at the time of imprinting of the first shot region, identifies the amount and position of the imprint material adhering to the mold. Determining the supply position and supply amount of the imprint material to be supplied to the second shot area The imprint apparatus according to claim 1.

10. Based on the amount and position of the imprint material adhering to the mold measured after imprinting in the first shot area, Determining the supply position and supply amount of the imprint material to be supplied to the second shot area, The imprint apparatus according to claim 1.

11. An imprint method for forming a pattern in a plurality of shot areas on a substrate using a mold, comprising: An imprinting step of imprinting on a first shot area including the outer periphery of the substrate using a mold; A supply step of supplying an imprint material to a second shot area on the substrate; An imprinting step of imprinting on the second shot area where the imprint material is supplied using the mold used in the first shot area next, and The supply step adjusts the supply based on the outer peripheral shape of the first shot area An imprint method characterized by this.

12. The supply step is a step of adjusting the supply position or supply amount of the imprint material of the supply unit with respect to the second shot area based on the outer peripheral shape of the first shot area, according to the imprint method of claim 11.

13. The supply step is a step of adjusting the supply position or supply amount of the imprint material of the supply unit with respect to the second shot area so as to reduce the supply excess due to the imprint material adhering to the mold in the imprinting on the first shot area, according to the imprint method of claim 12.

14. A step of forming a pattern on a substrate using the imprint method according to any one of claims 11 to 13; A step of processing the substrate using the pattern; A step of manufacturing an article from the processed substrate; A method for manufacturing an article, characterized by including this.

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