Heat transport device

Abstract

To provide a heat transport device capable of suppressing or preventing deterioration of heat transport efficiency due to uneven distribution of fluid in a heat transport unit.SOLUTION: A heat transport device 100 comprises a heat exchanger 1, a fluid supplier 2, and a supply flow path 3. The heat exchanger 1 has a circulation flow path 11 through which fluid F can circulate, and a first cooler 12 that cools the fluid F. The circulation flow path 11 includes a heat absorption flow path 111 arranged in a first heat source H1, and a heat release flow path 112 arranged in the first cooler 12. The supply flow path 3 connects the circulation flow path 11 of the heat exchanger 1 to the fluid supplier 2.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a heat transport device.

Background Art

[0002] Conventionally, heat transporters that perform heat transport using the circulation of a fluid have been known. Such heat transporters include a thermosiphon, a wick (capillary structure) type heat pipe, and the like.

[0003] For example, Patent Document 1 discloses a loop type thermosiphon in which a working fluid is enclosed inside a sealed container. The thermosiphon has an evaporation section and a condensation section. The evaporation section receives heat from a heating element and evaporates the working fluid. The evaporated gaseous working fluid flows toward the condensation section. The condensation section dissipates the heat of the gaseous working fluid to the outside, thereby condensing the gaseous working fluid into a liquid phase.

[0004] Also, in a wick type heat pipe, a working fluid is enclosed inside a sealed container. The working fluid evaporates due to the heat supplied at the evaporation section, flows to the condensation section, and condenses due to heat dissipation at the condensation section. Thereby, the heat pipe transports heat from the evaporation section to the outside of the condensation section. Note that the liquid-phase working fluid condensed at the condensation section refluxes to the evaporation section by the capillary force of the wick provided on the inner wall surface of the sealed container.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] However, if the working fluid is unevenly distributed within the heat transporter, the heat transport efficiency of the heat transporter may be significantly reduced. For example, if the temperature of the heating element is too high, a large amount of the working fluid in the gas phase may be generated due to rapid evaporation, and the amount of the working fluid in the liquid phase may decrease. In this case, it becomes difficult or impossible for the working fluid to circulate between the evaporation section and the condensation section, resulting in a decrease in the amount of heat transported by the heat transporter from the heat source to the evaporation section, and there is also a risk of the heat transporter becoming unable to transport heat. Furthermore, if the condensation capacity of the condensation section is insufficient relative to the amount of the working fluid in the gas phase, the working fluid in the gas phase may not be sufficiently condensed, and there is also a risk of overheating occurring within the heat transporter for the working fluid. This problem can also occur in a thermosiphon, a wick-type heat pipe, etc.

[0007] Regarding the heat transport efficiency, the thermosiphon of Patent Document 1 provides a multi-layer structure having a foamed metal layer in the evaporation section to improve the heat transfer efficiency to the working fluid in the evaporation section. In this case, since the evaporation of the working fluid in the evaporation section is promoted, if the temperature of the heat source is too high, a large amount of the working fluid in the gas phase is generated within the thermosiphon, so the above problem cannot be solved. That is, there is a risk that the working fluid is unevenly distributed and the heat transport efficiency of the thermosiphon is significantly reduced.

[0008] In view of the above situation, an object of the present invention is to provide a heat transport device capable of suppressing or preventing a decrease in heat transport efficiency due to uneven distribution of fluid within a heat transporter.

Means for Solving the Problem

[0009] To achieve the above object, a heat transport device according to one aspect of the present invention includes a heat exchanger, a fluid supplier, and a supply flow path. The heat exchanger has a circulation flow path through which a fluid can circulate and a first cooler for cooling the fluid. The circulation flow path includes a heat absorption flow path disposed within a first heat source and a heat dissipation flow path disposed within the first cooler. The supply flow path connects the circulation flow path of the heat exchanger and the fluid supplier.

[0010] Further features and advantages of the present invention will be further clarified by the embodiments shown below.

Effect of the Invention

[0011] According to the present invention, it is possible to provide a heat transport device that can suppress or prevent a decrease in heat transport efficiency due to uneven distribution of fluid in the heat transporter.

Brief Description of the Drawings

[0012]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Modes for Carrying Out the Invention

[0013] Embodiments of the present invention will be described below with reference to the drawings.

[0014] <1. First Embodiment> FIG. 1 is a conceptual diagram showing a configuration example of the heat transport device 100. FIG. 2 is a rear view of the heat transport device 100 installed in the exhaust duct H1 through which the high-temperature gas flow HG flows. Note that the exhaust duct H1 is an example of the "first heat source" of the present invention. Also, in FIGS. 1 and 2, the symbol Z indicates the "vertical direction", and the symbol Z1 indicates the "vertically upward direction". The symbol X is a direction perpendicular to the Z direction and is parallel to the direction in which the high-temperature gas flow HG flows in the exhaust duct H1 in the following description. The symbol Y is a direction perpendicular to both the Z direction and the X direction. The same applies to FIGS. 3 to 9 described later.

[0015] The heat transport device 100 is arranged at a location where there is a heat source such as the exhaust pipe of an incinerator or industrial waste heat, and transports the heat dissipated from this heat source to the outside. The heat transported to the factory is used, for example, for heat power generation. In the present embodiment, the heat source where the heat transport device 100 is arranged is the exhaust duct H1. In the exhaust duct H1, the high-temperature gas flow HG flows in the direction of the arrow from the left side to the right side of the paper surface of FIG. 1.

[0016] Also, each component of the heat transport device 100 is controlled by the control device 200. The heat transport device 100 may be configured to include the control device 200 or may be configured not to include the control device 200. That is, in the latter configuration, the control device 200 is an external device that controls the heat transport device 100.

[0017] <1-1. Heat transport device 100> As shown in FIGS. 1 and 2, the heat transport device 100 includes a heat exchanger 1, a fluid supplier 2, a supply flow path 3, and a connection flow path 4.

[0018] The heat exchanger 1 is installed in the exhaust duct H1 and transports heat to the outside of the exhaust duct H1 by the fluid F that circulates by natural convection without the need for mechanical devices such as pumps. The fluid F is water in this embodiment. However, it is not limited to this example, and the fluid F may be a liquid other than water, preferably a liquid capable of latent heat transport by gas-liquid phase change. There are a plurality of heat exchangers 1, which are connected to each other via the connecting flow path 4. Each heat exchanger 1 is a thermosiphon with the same configuration and performs latent heat transport using gas-liquid phase change. However, it is not limited to this example, and at least one heat exchanger 1 may be a device capable of heat transport other than a thermosiphon. For example, at least one heat exchanger 1 may be a wick-type heat pipe, or may be capable of heat transport without using gas-liquid phase change. Also, the above example does not exclude the configuration in which the heat exchanger 1 is singular. When the heat exchanger 1 is singular, the connecting flow path 4 is omitted.

[0019] As shown in FIGS. 1 and 2, the heat exchanger 1 has a circulation flow path 11 and a cooler 12. Note that the cooler 12 is an example of the "first cooler" of the present invention. The circulation flow path 11 is a hollow tube that is loop-connected. In the circulation flow path 11, the fluid F can circulate. A part of the circulation flow path 11 is arranged in the exhaust duct H1, and another part is arranged in the cooler 12. For example, the circulation flow path 11 includes an endothermic flow path 111 and an exothermic flow path 112. The endothermic flow path 111 is a flow path of the fluid F arranged in the exhaust duct H1. The exothermic flow path 112 is a flow path of the fluid F arranged in the cooler 12. The cooler 12 cools the fluid F in the circulation flow path 11.

[0020] FIG. 4 is a cross-sectional view showing a configuration example of the fluid supply device 2. As shown in FIG. 4, the fluid supply device 2 has a fluid tank 21 and a cooling member 22. The fluid tank 21 is a storage unit that stores the fluid F that can be supplied to the heat exchanger 1. The cooling member 22 cools the fluid F in the fluid tank 21. In this embodiment, the cooling member 22 is a hollow tube through which the refrigerant flows in one direction and is arranged in the fluid tank 21. The inlet and outlet of the cooling member 22 are respectively arranged on the outer surface of the fluid tank 21 and are connected to a circulation device (not shown) such as a pump that circulates the refrigerant.

[0021] The supply flow path 3 is a hollow tube disposed between the heat exchanger 1 and the fluid supplier 2, and connects the circulation flow path 11 of the heat exchanger 1 and the fluid supplier 2. The fluid F can flow from one of the heat exchanger 1 and the fluid supplier 2 to the other through the supply flow path 3.

[0022] In the heat transport device 100, the fluid supplier 2 is connected to the circulation flow path 11 of the heat exchanger 1 through the supply flow path 3. Therefore, even if the fluid F for transporting heat is insufficient in the heat exchanger 1 due to uneven distribution, it can be supplied from the fluid supplier 2 to the heat exchanger 1. Accordingly, the heat transport device 100 can suppress or prevent a decrease in heat transport efficiency due to the uneven distribution of the fluid F, and can also prevent overheating in the heat exchanger 1.

[0023] <1-2. Heat Exchanger 1> Next, with reference to FIGS. 1 to 3, a configuration example of the heat exchanger 1 will be described in detail. FIG. 3 is a cross-sectional view showing a configuration example of the heat exchanger 1.

[0024] The circulation flow path 11 of the heat exchanger 1 further includes an inflow flow path 113 and an outflow flow path 114 in addition to the heat absorption flow path 111 and the heat dissipation flow path 112. In other words, the circulation flow path 11 is composed of a heat absorption flow path 111, a heat dissipation flow path 112, an inflow flow path 113, and an outflow flow path 114.

[0025] The heat absorption flow path 111 is a vaporization part that vaporizes the fluid F by the heat received from the high-temperature gas flow HG in the exhaust duct H1, and is a hollow tube that extends in a meandering manner. The inlet of the heat absorption flow path 111 is connected to the inlet port Pi of the exhaust duct H1. The outlet of the heat absorption flow path 111 is connected to the outlet port Po of the exhaust duct H1. The inlet port Pi and the outlet port Po are pipe connection ports disposed on the outer wall surface of the exhaust duct H1 (for example, the duct flange P1 attached to the exhaust duct H1). The fluid F flows into the heat absorption flow path 111 through the inlet port Pi and flows out of the heat absorption flow path 111 through the outlet port Po.

[0026] The heat dissipation flow path 112 is a condensation section where the vaporized fluid F is cooled by the cooler 12 and liquefied (i.e., condensed). The inlet of the heat dissipation flow path 112 is connected to the inlet port 121 of the cooler 12. The outlet of the heat dissipation flow path 112 is connected to the outlet port 122 of the cooler 12. Note that the inlet port 121 and the outlet port 122 are pipe connection ports arranged in the housing 120 of the cooler 12. The fluid F flows into the heat dissipation flow path 112 through the inlet port 121 and flows out of the heat dissipation flow path 112 through the outlet port 122.

[0027] The inflow flow path 113 is a flow path of the fluid F that is arranged between the inlet port Pi of the heat absorption flow path 111 and the outlet port 122 of the cooler 12 and connects the two. For example, one end of the inflow flow path 113 is connected to the inlet port Pi of the exhaust duct H1. The other end of the inflow flow path 113 is connected to the outlet port 122 of the cooler 12. The inflow flow path 113 allows the fluid F flowing out of the heat dissipation flow path 112 through the outlet port 122 of the cooler 12 to flow into the heat absorption flow path 111 through the inlet port Pi of the exhaust duct H1.

[0028] The outflow flow path 114 is a flow path of the fluid F that is arranged between the outlet port Po of the heat absorption flow path 111 and the inlet port 121 of the cooler 12 and connects the two. For example, one end of the outflow flow path 114 is connected to the outlet port Po of the exhaust duct H1. The other end of the outflow flow path 114 is connected to the inlet port 121 of the cooler 12. The outflow flow path 114 allows the fluid F flowing out of the heat absorption flow path 111 through the outlet port Po of the exhaust duct H1 to flow into the heat dissipation flow path 112 through the inlet port 121 of the cooler 12.

[0029] In each heat exchanger 1, the other end of the outflow flow path 114 (and the inlet port 121 of the cooler 12) is arranged vertically above Z1 from one end of the inflow flow path 113 (and the inlet port Pi of the exhaust duct H1) and the other end of the inflow flow path 113 (and the outlet port 122 of the cooler 12). In other words, the inlet and outlet of the heat dissipation flow path 112 are arranged vertically above Z1 from the inlet of the heat absorption flow path 111.

[0030] The temperature of the fluid F in the inflow channel 113 is lower than the temperature of the fluid in the outflow channel 114. Further, in the present embodiment, in normal operation, the liquid-phase fluid F flows in the inflow channel 113, and the gas-phase fluid F flows in the outflow channel 114. Therefore, the density of the fluid F in the inflow channel 113 is greater than the density of the fluid F in the outflow channel 114. Thus, by arranging the inlet and outlet of the heat dissipation channel 112 vertically above Z1 from the inlet of the heat absorption channel 111, due to the density difference between the fluid F in the inflow channel 113 and the fluid F in the outflow channel 114, the fluid F in the circulation channel 11 can circulate in the order of heat absorption channel 111 → outflow channel 114 → heat dissipation channel 112 → inflow channel 113 → heat absorption channel 111 → ···. That is, the fluid F in the circulation channel 11 can circulate naturally without requiring a device or the like for circulating the fluid F.

[0031] Next, the cooler 12 further has a refrigerant flow path 123. In the present embodiment, the refrigerant flow path 123 is a hollow tube through which the refrigerant flows in one direction and is disposed within the housing 120. The inlet and outlet of the refrigerant flow path 123 are respectively disposed on the outer surface of the housing 120 and are connected to a circulation device (such as a pump; not shown) for circulating the refrigerant. Note that the liquid-phase or gas-phase refrigerant sent out from the outlet of the refrigerant flow path 123 is sent to the circulation device after the waste heat is utilized. When the liquid-phase refrigerant is sent out, the refrigerant can be used for hot water supply, cold and heat heating, etc. Also, when the gas-phase refrigerant is sent out, it can be used for power generation in a power generation device such as a gas turbine.

[0032] Alternatively, the cooler 12 may further include one or more power generation members 124. The power generation member is a thermoelectric conversion element such as a Peltier element, which is housed in the housing 120 and generates power using the heat transported by the heat exchanger 1. For example, in the housing 120, the refrigerant flow path 123 faces the heat dissipation flow path 112 with the Peltier element interposed therebetween. In other words, the refrigerant flow path 123 is disposed on one side of the Peltier element. The heat dissipation flow path 112 is disposed on the other side of the Peltier element. The power generated by the power generation member 124 may be used as a power source for components that require power of the heat transport device 100 (for example, solenoid valves attached to the heat exchanger 1, the fluid supply device 2, the supply flow path 3, etc.), or may be transmitted outside the heat transport device 100.

[0033] Further, a solenoid valve 1231 for controlling the opening and closing of the refrigerant flow path 123 may be installed in the refrigerant flow path 123. The switching of the opening and closing of the solenoid valve 1231 is controlled by the control device 200. The solenoid valve 1231 is of the normally-on type and keeps the refrigerant flow path 123 open during normal operation to allow the refrigerant to flow. However, this example does not exclude a configuration in which the solenoid valve 1231 is not installed in the refrigerant flow path 123.

[0034] Also, in the present embodiment, as described above, there are a plurality of heat exchangers 1, and the heat transport device 100 further includes a connection flow path 4. The connection flow path 4 is a hollow tube through which the fluid F can flow, and connects the circulation flow paths 11 of each heat exchanger 1. For example, in FIGS. 1 and 2, the plurality of heat exchangers 1 are arranged in the direction in which the high-temperature gas flow HG in the exhaust duct H1 flows. The connection flow path 4 is disposed between the circulation flow paths 11 of two adjacent heat exchangers 1 in this direction, connected to both of them, and further connects them in series. That is, one end of the connection flow path 4 is connected to the circulation flow path 11 of one heat exchanger 1. The other end of the connection flow path 4 is connected to the circulation flow path 11 of the other heat exchanger 1. However, the present invention is not limited to the examples of FIGS. 1 and 2, and the connection flow path 4 may be disposed between the circulation flow paths 11 of three or more heat exchangers 1 and connected to each circulation flow path 11. Further, the connection flow path 4 may connect the circulation flow paths 11 of at least some of the heat exchangers 1 in parallel.

[0035] By connecting the connection flow paths 4 to the circulation flow paths 11 of the respective heat exchangers 1, the plurality of heat exchangers 1 can share the fluid F. That is, the fluid F is distributed among the respective heat exchangers 1 via the connection flow paths 4. Therefore, the pressure of the fluid F in each heat exchanger 1 is equalized. By equalizing the pressure, the saturation temperature of the fluid F in each heat exchanger 1 can be made uniform, so that the fluid F shared by the plurality of heat exchangers 1 is evenly heated by the exhaust duct H1. Therefore, even if the temperature of the portion of the exhaust duct H1 where the heat absorption flow paths 111 of the respective heat exchangers 1 are arranged is not uniform due to fluctuations or the like, the temperature of the fluid F shared by the plurality of heat exchangers 1 can be made uniform.

[0036] Note that due to the distribution of the fluid F among the respective heat exchangers 1, uneven distribution of the fluid F may occur, and there is a risk that the fluid F may be insufficient in some of the heat exchangers 1. In this case, the fluid F is supplied from the fluid supply device 2 to the heat exchanger 1. Therefore, the heat transport device 100 can suppress or prevent a decrease in heat transport efficiency due to the uneven distribution of the fluid F, and can also prevent overheating in the heat exchanger 1 where the fluid F is insufficient.

[0037] Preferably, at least one connection flow path 4 connects the inflow flow paths 113 of the respective heat exchangers 1. In the inflow flow path 113, the fluid F flowing into the heat absorption flow path 111 flows. Therefore, by connecting the inflow flow paths 113 of the respective heat exchangers 1 to each other with the connection flow path 4, the fluid F can be directly supplied to the inflow flow path 113 of the heat exchanger 1 where uneven distribution of the fluid F has occurred and the fluid F is insufficient. That is, the shortage of the fluid F flowing into the heat absorption flow path 111 can be more reliably eliminated, so that the decrease in heat transport efficiency in the heat exchanger 1 where uneven distribution of the fluid F has occurred can be more reliably suppressed or prevented. However, this example does not exclude a configuration in which at least one connection flow path 4 connects the outflow flow paths 114 of the respective heat exchangers 1, nor does it exclude a configuration in which all the connection flow paths 4 connect the inflow flow paths 113 of some of the heat exchangers 1 and the outflow flow paths of other parts.

[0038] Also, preferably, in at least one connecting flow path 4, one end and the other end of the connecting flow path 4 are arranged at the same height position in the vertical direction Z. By doing so, the pressure of the fluid F at one end of the connecting flow path 4 can be made the same as the pressure of the fluid F at the other end of the connecting flow path 4. Therefore, the pressure difference of the fluid F at one end and the other end of the connecting flow path 4 can be eliminated. Thus, the fluid F can flow smoothly between the circulation flow paths of the plurality of heat exchangers 1 without being affected by the pressure difference.

[0039] More preferably, one end and the other end of all the connecting flow paths 4 are arranged at the same height position in the vertical direction Z. By doing so, the pressure of the fluid F at one end and the other end of all the connecting flow paths 4 can be made the same. Therefore, the fluid F shared by the plurality of heat exchangers 1 can be distributed more uniformly without being affected by the difference in the pressure at different connecting flow paths 4.

[0040] However, the above examples do not exclude a configuration in which one end and the other end of the connecting flow path 4 are arranged at different height positions in the vertical direction Z in at least one connecting flow path 4, nor do they exclude a configuration in which one end and the other end of some of the connecting flow paths 4 and one end and the other end of some other connecting flow paths 4 are arranged at different height positions in the vertical direction Z.

[0041] Also, in this embodiment, all the heat exchangers 1 are installed in the same heat source (that is, the exhaust duct H1). However, it is not limited to this example. While some of the heat exchangers 1 are installed in the exhaust duct H1, some of the other heat exchangers 1 may be installed in a heat source other than the exhaust duct H1. Alternatively, each heat exchanger 1 may be arranged in a different heat source.

[0042] Next, preferably, at least one heat exchanger 1 further includes a sensor 13 for detecting superheat of the fluid F in the circulation flow path 11 of the heat exchanger 1. In the present embodiment, a specific heat exchanger 1a described later has the sensor 13. However, the present invention is not limited to this example, and the sensor 13 may be provided in a heat exchanger 1 other than the specific heat exchanger 1a, or may be provided in all heat exchangers 1. For example, the sensor 13 is a temperature sensor, is disposed in the circulation flow path 11, and detects the temperature of the outer surface of the circulation flow path 11. The detection result of the sensor 13 is output to the control device 200. The control device 200 detects the temperature of the fluid F flowing in the circulation flow path 11 and its change over time based on the output signal of the sensor 13 indicating the detection result.

[0043] <1-3. Fluid supply device 2> Next, with reference to FIGS. 1 to 2 and FIGS. 4 to 5, a configuration example of the fluid supply device 2 will be described in detail. FIG. 5 is a schematic diagram showing another arrangement example of the fluid supply device 2.

[0044] In the present embodiment, the fluid supply device 2 is disposed in the heat source H2. The heat source H2 is an example of the "second heat source" of the present invention. Specifically, at least a part of the fluid tank 21 is disposed in the heat source H2. For example, in FIG. 4 and the like, a part of the fluid tank 21 is disposed in the heat source H2 through the outer wall surface of the heat source H2 (for example, the flange P2 attached to the outer wall surface).

[0045] For example, as shown in FIG. 1, the fluid supply device 2 may be installed in a heat source H2 that is a high-temperature body H2a different from the exhaust duct H1. In other words, the heat source H2 may be a high-temperature body H2a that requires cooling other than the exhaust duct H1. In this way, the fluid supply device 2 can transport heat to the outside of the heat source H2. Therefore, the fluid supply device 2 can function in the same manner as the heat exchanger 1.

[0046] Preferably, in FIG. 1, the heat source H2 is at a lower temperature than the portion of the exhaust duct H1 where the heat exchanger 1 is installed. By doing so, it is possible to effectively suppress or prevent the pressure of the fluid F in the fluid supply device 2 from becoming too large compared to the pressure of the fluid F in the heat exchanger 1. Therefore, it is possible to prevent the fluid F in the fluid tank 21 from being supplied to the heat exchanger 1 when the fluid F in the heat exchanger 1 is not insufficient. However, the above example does not exclude a configuration in which the temperature of the high-temperature body H2a is equal to or higher than the temperature of the portion H1a of the exhaust duct H1 where the heat exchanger 1 is installed. In this case, for example, by setting the cooling capacity of the cooling member 22 in the fluid supply device 2 higher, it is possible to prevent the fluid F in the fluid tank 21 from being supplied to the heat exchanger 1 when the fluid F in the heat exchanger 1 is not insufficient.

[0047] Alternatively, as shown in FIG. 5, the heat source H2 may be a portion H1b different from the portion H1a of the exhaust duct H1 where the heat exchanger 1 is installed. For example, the portion H1b may be a portion downstream of the high-temperature gas flow HG compared to the portion H1a where the heat exchanger 1 is installed. By doing so, the fluid supply device 2 can transport heat outside the exhaust duct H1. Therefore, the fluid supply device 2 can be made to function in the same manner as the heat exchanger 1.

[0048] Preferably, in FIG. 5, the fluid supply device 2 is installed in a portion (for example, portion H1b) in the exhaust duct H1 where the internal temperature is equal to or lower than a predetermined lower limit temperature Td. The lower limit temperature Td is set to a temperature at which the fluid F in the fluid tank 21 does not vaporize excessively. By doing so, it is possible to effectively suppress or prevent the pressure of the fluid F in the fluid supply device 2 from becoming too large compared to the pressure of the fluid F in the heat exchanger 1. Therefore, even if the fluid supply device 2 is installed in the same exhaust duct H1 as the heat exchanger 1, it is possible to prevent the fluid F from being supplied to the heat exchanger 1 when the fluid F in the heat exchanger 1 is not insufficient. However, the above example does not exclude a configuration in which the fluid supply device 2 is installed in a portion of the exhaust duct H1 that is higher than the lower limit temperature Td. In this case, for example, by setting the cooling capacity of the cooling member 22 in the fluid supply device 2 higher, it is possible to prevent the fluid F in the fluid tank 21 from being supplied to the heat exchanger 1 when the fluid F in the heat exchanger 1 is not insufficient.

[0049] The fluid F in the fluid tank 21 is heated by the heat received from the heat source H2, while it can be cooled by the cooling member 22 as described above. That is, the implementation and stop of the cooling by the cooling member 22 can be switched. In the present embodiment, a solenoid valve 221 controlled by the control device 200 is installed in the pipe between the inlet (or outlet) of the cooling member 22 and the device that circulates the refrigerant through the cooling member 22. The solenoid valve 221 switches the flow and stop of the refrigerant in the pipe. By switching the implementation and stop of the cooling of the cooling member 22, the supply state of the fluid F from one of the fluid supply device 2 and the heat exchanger 1 to the other can be adjusted without installing a switching device or a device that controls the flow of the fluid F in the supply flow path 3.

[0050] For example, in the fluid supply device 2, when the cooling of the cooling member 22 is stopped, the fluid F in the fluid tank 21 is pressurized due to the volume expansion accompanying the temperature rise. On the other hand, when a shortage of the fluid F occurs in the heat exchanger 1, the fluid F is depressurized in the heat exchanger 1. Therefore, in this case, in the fluid supply device 2, for example, the solenoid valve 221 is switched to the closed state to stop the cooling of the cooling member 22, and the fluid F in the fluid tank 21 is directly heated. As a result, the heat transport device 100 can supply the fluid F from the fluid supply device 2 to the heat exchanger 1. That is, when the pressure of the fluid F in the heat exchanger 1 becomes lower than the pressure of the fluid F in the fluid tank 21, naturally, the fluid F is supplied from the fluid tank 21 to the heat exchanger 1 through the supply flow path 3. Therefore, the heat transport device 100 can eliminate the shortage of the fluid F in the heat exchanger 1.

[0051] On the other hand, in the fluid supply device 2, when the cooling of the cooling member 22 is carried out, the fluid F in the fluid tank 21 is depressurized due to the volume contraction accompanying the temperature drop. On the other hand, when there is no shortage of the fluid F in the heat exchanger 1, the fluid F is not depressurized in the heat exchanger 1. In this case, in the fluid supply device 2, for example, the solenoid valve 221 is switched to the open state to carry out the cooling of the cooling member 22, and the fluid F in the fluid tank 21 is cooled by the cooling. As a result, it becomes difficult for the fluid F in the fluid tank 21 to be supplied to the heat exchanger 1. That is, when the pressure of the fluid F in the heat exchanger 1 becomes equal to or higher than the pressure of the fluid F in the fluid tank 21, naturally, the fluid F in the fluid tank 21 is not supplied to the heat exchanger 1. Further, in accordance with the increment of the pressure of the fluid F in the heat exchanger 1 with respect to the pressure of the fluid F in the fluid tank 21, the fluid F in the heat exchanger 1 is sent to the fluid tank 21 of the fluid supply device 2. Thereby, excessive pressurization of the fluid F in the heat exchanger 1 can be prevented.

[0052] Preferably, the implementation and stop of the cooling of the fluid F in the fluid supply device 2 are switched based on the detection result of the sensor 13. For example, the cooling of the fluid F in the fluid supply device 2 is stopped in response to the detection of overheating of the fluid F by the sensor 13. That is, when the control device 200 detects the overheating of the fluid F in the heat exchanger 1 based on the detection result of the sensor 13, the solenoid valve 221 is closed, and the cooling of the fluid F in the fluid tank 21 by the cooling member 22 is stopped. Thereby, the fluid F is supplied from the fluid tank 21 to the heat exchanger 1 through the supply flow path 3. When overheating of the fluid F is not detected from the detection result of the sensor 13, the cooling of the fluid F in the fluid supply device 2 is implemented. In this way, when overheating of the fluid F in the circulation flow path 11 is detected, the fluid F can be supplied from the fluid supply device 2 to the heat exchanger 1. Therefore, the shortage of the fluid F in the circulation flow path 11 of the heat exchanger 1 can be eliminated more reliably and quickly, and the overheated fluid F can be cooled down. However, it is not limited to this example, and the cooling and cooling stop of the fluid F in the fluid supply device 2 may be switched manually.

[0053] In addition, in the fluid F supply mechanism as described above, the solenoid valve 221 is in an open state during normal operation (that is, when the fluid F is not insufficient in the heat exchanger 1), and is in a closed state when the fluid F is insufficient in the heat exchanger 1. Therefore, preferably, the solenoid valve 221 is of the normally-on type. In this way, since the solenoid valve 221 can be switched when the fluid F is insufficient in the heat exchanger 1, the power consumption of the solenoid valve 221 can be reduced. However, this example does not exclude a configuration in which the solenoid valve 221 is not of the normally-on type.

[0054] Also, in order to realize the fluid F supply mechanism as described above, the fluid tank 21 of the fluid supplier 2 is installed on the heat source H2 and heated. Therefore, the heat source H2 may be a heating element installed to heat the fluid F in the fluid tank 21. However, the above example does not exclude a configuration in which the fluid tank 21 of the fluid supplier 2 is not installed on the heat source H2. That is, the fluid F in the fluid tank 21 may not be heated. Even in this case, for example, by setting the cooling capacity of the cooling member 22 high, the supply mechanism of the fluid F as described above can be realized by the pressure increase and decrease according to the temperature difference between when the fluid F in the fluid tank 21 is cooled by the cooling member 22 and when the cooling is stopped.

[0055] <1-4. Supply flow path 3> Next, with reference to FIGS. 1 to 6, the supply flow path 3 will be described in detail. FIG. 6 is a conceptual diagram showing another configuration example of the heat transport device according to the first embodiment.

[0056] The supply flow path 3 connects the fluid tank 21 of the fluid supplier 2 and the circulation flow path 11 of the heat exchanger 1. For example, the fluid supplier 2 has a port 23. The port 23 is an example of the "first circulation port" of the present invention, and is a pipe connection port through which the fluid F can flow in and out of the fluid tank 21, and is arranged in the fluid tank 21. Further, the circulation flow path 11 of the heat exchanger 1 has a port 115. The port 115 is an example of the "second circulation port" of the present invention, and is a pipe connection port through which the fluid F can flow in and out of the circulation flow path 11, and is preferably arranged in the inflow flow path 113. One end of the supply flow path 3 is connected to the port 23 of the fluid supplier 2. The other end of the supply flow path 3 is connected to the port 115 of the heat exchanger 1.

[0057] Preferably, in the vertical direction Z, the height position of the port 23 of the fluid supplier 2 is the same as the height position of the port 115 of the heat exchanger 1. By doing so, the pressure of the fluid F at the port 23 (in other words, one end of the supply flow path 3) can be made the same as the pressure of the fluid F at the port 115 (in other words, the other end of the supply flow path 3). Therefore, the pressure difference of the fluid F between the two can be eliminated. Thus, the fluid F can flow smoothly between the heat exchanger 1 and the fluid supplier 2 without being affected by the pressure difference. However, this exemplification does not exclude a configuration in which the height position of the port 23 in the vertical direction Z is different from the height position of the port 115.

[0058] In the vertical direction Z, preferably, the height positions of one end and the other end of at least one connection flow path 4 are the same as the height position of the port 115 of the heat exchanger 1. More preferably, the height positions of one end and the other end of all the connection flow paths 4 are the same as the height position of the port 115 of the heat exchanger 1. By doing so, the pressure of the fluid F at one end and the other end of the supply flow path 3 can be made the same as the pressure of the fluid F at one end and the other end of the connection flow path 4. Therefore, the pressure difference of the fluid F between the two can be eliminated. Thus, the fluid F can flow smoothly between the heat exchanger 1 and the fluid supplier 2 and within the connection flow path 4 without being affected by the pressure difference. However, this exemplification does not exclude a configuration in which the height position of the port 115 of the heat exchanger 1 is different from the height positions of one end and the other end of all the connection flow paths 4.

[0059] Also, as shown in FIG. 1 etc., the other end of the supply flow path 3 is specifically connected to the circulation flow path 11 (port 115) of at least one heat exchanger 1.

[0060] For example, the other end of the supply flow path 3 is connected to the circulation flow path 11 (port 115) of a specific heat exchanger 1a. Note that the number of the specific heat exchangers 1a may be one or two or more. In the latter case, a branch flow path 31 is connected to the circulation flow path 11 (port 115) of each specific heat exchanger 1a respectively. Note that the branch flow path 31 is a hollow tube that branches on the other end side of the supply flow path 3.

[0061] For example, a specific heat exchanger 1a is a part of the plurality of heat exchangers 1, and is, for example, a heat exchanger 1 disposed in a portion of the exhaust duct H1 where the internal temperature is equal to or higher than a predetermined upper limit temperature Tu. The upper limit temperature Tu is set to a temperature at which the fluid F vaporizes excessively in the endothermic flow path 111, and is, for example, higher than the aforementioned lower limit temperature Td with respect to the fluid F in the fluid tank 21. Alternatively, the specific heat exchanger 1a (that is, a part of the heat exchangers 1 described above) may be disposed upstream of the exhaust duct H1 with respect to the remaining heat exchangers 1.

[0062] When fluctuations are unlikely to occur in the spatial temperature distribution within the exhaust duct H1, a large amount of the fluid F is likely to be distributed to the heat exchanger 1 in which the endothermic flow path 111 is disposed in a portion having a higher temperature than other portions. In particular, in the heat exchanger 1a disposed in a portion of the exhaust duct H1 where the internal temperature is equal to or higher than the upper limit temperature Tu, an even larger amount of the fluid F is distributed. Therefore, a shortage of the fluid F is likely to occur in the heat exchangers 1 other than the specific heat exchanger 1a. Accordingly, by connecting the supply flow path 3 to the circulation flow path 11 of the specific heat exchanger 1a and reliably supplying the fluid F from the fluid supply device 2 to the specific heat exchanger 1a, the amount of the fluid F distributed to the specific heat exchanger 1a can be reduced. Thus, the bias of the fluid F distributed to each heat exchanger 1 can be reduced, and a shortage of the fluid F in the heat exchangers 1 other than the specific heat exchanger 1a can be suppressed or prevented.

[0063] Alternatively, as shown in FIG. 6, the other end of the supply flow path 3 may be connected to the circulation flow path 11 (port 115) of each heat exchanger 1. In this way, when the fluid F is insufficient in the heat exchanger 1, the fluid F can be supplied from the fluid tank 21 to each heat exchanger 1. Further, an amount of the fluid F corresponding to the difference between the pressure of the fluid F in the heat exchanger and the pressure of the fluid F in the fluid tank 21 is supplied to each heat exchanger 1. Therefore, for example, to the heat exchanger 1 in which the fluid F is insufficient due to excessive temperature rise, the larger the shortage amount, the larger the amount of the fluid F supplied. Also, to the heat exchanger 1 in which the fluid F is not insufficient, the supply amount of the fluid F is reduced, or the fluid F is not supplied.

[0064] Further, a solenoid valve 32 controlled by the control device 200 may be disposed in the supply channel 3. Specifically, the heat transport device 100 may further include a solenoid valve 32 for switching the opening and closing of the supply channel 3. The solenoid valve 32 may be disposed on one end side of the supply channel 3 (i.e., on the side of the fluid supplier 2), or may be disposed on the other end side of the supply channel 3 (e.g., each branch channel 31).

[0065] Preferably, the solenoid valve 32 switches the opening and closing state of the supply channel 3 by the control device 200 according to the detection result of the sensor 13. For example, the solenoid valve 32 switches the supply channel 3 to the open state in response to the detection of overheating of the fluid F by the sensor 13. That is, when the control device 200 detects overheating of the fluid F in the heat exchanger 1 based on the detection result of the sensor 13, the solenoid valve 32 is opened to enable the flow of the supply channel 3. In this way, when overheating of the fluid F in the circulation channel 11 is detected, the fluid F can be supplied from the fluid supplier 2 to the heat exchanger 1. However, the present invention is not limited to this example, and the opening and closing state of the solenoid valve 32 may be switched manually.

[0066] In addition, in the configuration in which the solenoid valve 32 is disposed in the supply channel 3, the fluid supplier 2 may or may not include a cooling member 22. In particular, in the latter case, by switching the opening and closing state of the solenoid valve 32, the supply and supply stop of the fluid F from the fluid tank 21 to the heat exchanger 1 can be switched.

[0067] However, the above example does not exclude the configuration in which the solenoid valve 32 is not disposed in the supply channel 3.

[0068] <2. Second Embodiment> Next, with reference to FIG. 7, the second embodiment will be described. FIG. 7 is a diagram showing a configuration example of the heat transport device 100 according to the second embodiment. Hereinafter, among the configurations of the second embodiment, the configurations different from those of the first embodiment will be described. In addition, the same reference numerals are given to the same components as those of the first embodiment, and the description thereof may be omitted.

[0069] In the heat transport device 100 according to the second embodiment, at least one heat exchanger 1 further includes a secondary cooler 14. The secondary cooler 14 is an example of the "second cooler" of the present invention, and is disposed between the heat absorption flow path 111 and the heat dissipation flow path 112 in the circulation flow path 11 to cool the fluid F in the circulation flow path 11. The secondary cooler 14 can supplement the cooling capacity of the cooler 12 and further cool the fluid F in the flow path between the heat absorption flow path 111 and the heat dissipation flow path 112. Therefore, the heat exchanger 1 can sufficiently cool the fluid F sent out from the heat absorption flow path 111 and allow the sufficiently cooled fluid F to flow into the heat absorption flow path 111. Thus, excessive temperature rise (in other words, vaporization) of the fluid F in the heat absorption flow path 111 can be effectively suppressed or prevented, and a shortage of the fluid F in the circulation flow path 11 can be prevented.

[0070] Preferably, the secondary cooler 14 is disposed in the inflow channel 113 to cool the fluid F in the inflow channel 113. For example, in FIG. 7, in all the heat exchangers 1, the secondary cooler 14 is disposed in the inflow channel 113. However, the present invention is not limited to this example, and in at least one heat exchanger 1, the secondary cooler 14 may be disposed in the outflow channel 114 to cool the fluid F in the outflow channel 114.

[0071] The secondary cooler 14 includes a housing 140 and a refrigerant flow path 141. In the present embodiment, the refrigerant flow path 141 is a hollow tube through which the refrigerant flows in one direction and is disposed in the housing 140. The inlet and outlet of the refrigerant flow path 141 are respectively disposed on the outer surface of the housing 140 and connected to a circulation device (such as a pump; not shown) that circulates the refrigerant. The liquid-phase or gas-phase refrigerant sent out from the outlet of the refrigerant flow path 141 may be sent to the circulation device after the waste heat is utilized. For example, the liquid-phase refrigerant can be used for hot water supply, cold and heat heating, etc. In addition, the gas-phase refrigerant can be used for power generation in power generation equipment such as gas turbines.

[0072] Also, the implementation and stop of the cooling of the secondary cooler 14 are switchable. For example, as shown in FIG. 7, a solenoid valve 142 is installed in the refrigerant flow path 141. The solenoid valve 142 is controlled by the control device 200 to control the opening and closing of the refrigerant flow path 141. The solenoid valve 142 is of the normally-on type and keeps the refrigerant flow path 141 open during normal operation to allow the refrigerant to flow through.

[0073] Preferably, the implementation and stop of the cooling of the fluid F by the secondary cooler 14 are switched by the control device 200 based on the detection result of the sensor 13. For example, the fluid F in the circulation flow path 11 is further cooled by the secondary cooler 14 in response to the detection of the superheat of the fluid F by the sensor 13. That is, when the control device 200 detects the superheat of the fluid F in the heat exchanger 1 based on the detection result of the sensor 13, it opens the solenoid valve 142 of the secondary cooler 14 arranged in the heat exchanger 1 where the superheat is detected, and allows the refrigerant in the refrigerant flow path 141 of the secondary cooler 14 to flow through. In this way, when the superheat of the fluid F in the circulation flow path 11 is detected, the secondary cooler 14 of the heat exchanger 1 where the superheat is detected can be activated. Therefore, it is possible to more reliably prevent the excessive temperature rise (in other words, vaporization) of the fluid F and the shortage of the fluid F in the circulation flow path 11. However, it is not limited to the above example, and in at least one heat exchanger 1, the opening and closing state of the solenoid valve 142 may be switched manually.

[0074] However, the above example does not exclude a configuration in which the implementation and stop of the cooling of the secondary cooler 14 are not switchable in at least one heat exchanger 1, nor does it exclude a configuration in which the solenoid valve 142 is not installed in the refrigerant flow path 141 in at least one heat exchanger 1.

[0075] <3. Third Embodiment> Next, referring to FIG. 8, the third embodiment will be described. FIG. 8 is a diagram showing a configuration example of the heat transport device 100 according to the third embodiment. Hereinafter, among the configurations of the third embodiment, the configurations different from those of the first embodiment and the second embodiment will be described. Also, the same reference numerals are given to the same components as those in the first embodiment and the second embodiment, and the description thereof may be omitted.

[0076] In the heat transport device 100 according to the third embodiment, some of the heat exchangers 1 are used as the fluid supplier 2 and are connected to the remaining heat exchangers 1 via the supply flow path 3. In other words, the plurality of heat exchangers 1 include a heat exchanger 1b and a heat exchanger 1c. The heat exchanger 1b is an example of the "first heat exchanger" of the present invention. The heat exchanger 1c is an example of the "second heat exchanger" of the present invention.

[0077] For example, in the third embodiment, the heat exchanger 1b is a heat exchanger 1 that functions as the fluid supplier 2 for supplying the fluid F to the heat exchanger 1c. It is used in the same manner as the fluid supplier 2. The number of the heat exchangers 1b may be one as shown in FIG. 8 or two or more.

[0078] The heat exchanger 1c is the remaining part of the heat exchangers 1, that is, the heat exchanger 1 other than the heat exchanger 1b among the plurality of heat exchangers 1. One end of the supply flow path 3 is connected to the circulation flow path 11 of the heat exchanger 1b. The other end (or the branch flow path 31) of the supply flow path 3 is connected to the circulation flow path 11 of the heat exchanger 1c.

[0079] In this way, it is not necessary to use a device different from the heat exchanger 1 as the fluid supplier 2. In other words, a device of the same type as the heat exchanger 1 can be used as the fluid supplier 2. Therefore, since it is not necessary to newly prepare the fluid supplier 2, the number of types of components of the heat transport device 100 can be reduced, and the manufacturing cost of the heat transport device 100 can be reduced.

[0080] <4. Fourth Embodiment> Next, with reference to FIG. 9, the fourth embodiment will be described. FIG. 9 is a diagram showing a configuration example of the heat transport device 100 according to the fourth embodiment. Hereinafter, among the configurations of the fourth embodiment, the configurations different from those of the first to third embodiments will be described. Also, the same reference numerals are given to the components similar to those of the first to third embodiments, and the description thereof may be omitted.

[0081] In the heat transport device 100 according to the fourth embodiment, among the plurality of heat exchangers 1 in which the circulation channels 11 are connected to each other via the connection channel 4, some of the heat exchangers 1d function as a fluid supplier 2 that supplies the fluid F to the remaining heat exchangers 1e. For example, in FIG. 9, all of the heat exchangers 1 are installed in the exhaust duct H1. Among these heat exchangers 1, the heat exchanger 1d installed in a portion of the exhaust duct H1 where the internal temperature is equal to or lower than the lower limit temperature Td functions as the fluid supplier 2. Further, at least a part of the connection channel 4 functions as a supply channel 3 through which the fluid F supplied from the heat exchanger 1d to the heat exchanger 1e passes. In other words, the supply channel 3 is omitted.

[0082] By connecting the plurality of heat exchangers 1 with the connection channel 4, the distribution of the fluid F among the plurality of heat exchangers 1 is naturally adjusted. For example, if there is a spatial temperature distribution in the exhaust duct H1, the distribution amount of the fluid F to the heat exchanger 1d arranged in the low temperature portion (for example, the portion equal to or lower than the lower limit temperature Td) of the exhaust duct H1 decreases. On the other hand, the distribution amount of the fluid F to the heat exchanger 1e arranged in the high temperature portion (for example, the portion higher than the lower limit temperature Td) of the exhaust duct H1 increases. Further, since at least a part of the connection channel 4 functions as the supply channel 3, it is not necessary to use a member different from the connection channel 4 as the supply channel 3. Therefore, the heat transport device 100 can suppress or prevent a decrease in heat transport efficiency due to uneven distribution of the fluid F without including a specific fluid supplier 2 and supply channel 3.

[0083] <5. Remarks> The embodiments of the present invention have been described above. It should be understood by those skilled in the art that the above-described embodiments are examples, and various modifications are possible in the combination of each component and each process, and that they are within the scope of the present invention.

[0084] <6. Summary> Hereinafter, the embodiments described so far will be summarized.

[0085] For example, the heat transport device 100 disclosed in this specification includes a heat exchanger 1, a fluid supplier 2, and a supply channel 3. The heat exchanger 1 is provided with a circulation flow path 11 through which the fluid F can circulate, a first cooler 12 for cooling the fluid F, and has the circulation flow path 11 includes a heat absorption flow path 111 disposed in the first heat source H1, a heat dissipation flow path 112 disposed in the first cooler 12, and includes the supply flow path 3 is configured (first configuration) to connect the circulation flow path 11 and the fluid supplier 2.

[0086] The heat transport device 100 having the above first configuration further includes a connection flow path 4 through which the fluid F can flow, the heat exchangers 1 are plural, the connection flow path 4 may be configured (second configuration) to connect the circulation flow paths 11 of the respective heat exchangers 1.

[0087] Also, the heat transport device 100 having the above second configuration the circulation flow path 11 further includes an inflow flow path 113 that connects the inlet of the heat absorption flow path 111 and the outlet of the heat dissipation flow path 112, the connection flow path 4 may be configured (third configuration) to connect the inflow flow paths 113 of the respective heat exchangers 1.

[0088] Also, the heat transport device 100 having the above second or third configuration the supply flow path 3 is connected to the circulation flow path 11 of some of the plurality of heat exchangers 1a, some of the heat exchangers 1a may be configured (fourth configuration) to be disposed upstream of the first heat source H1 with respect to the remaining heat exchangers 1.

[0089] Also, the heat transport device 100 having any of the above second to fourth configurations the plurality of heat exchangers 1 include a first heat exchanger 1b that functions as the fluid supplier 2, The second heat exchanger 1c, which is part of the remaining heat exchangers 1, includes, One end of the supply flow path 3 is connected to the circulation flow path 11 of the first heat exchanger 1b, The other end of the supply flow path 3 may be connected to the circulation flow path 11 of the second heat exchanger 1c (a fifth configuration).

[0090] Also, the heat transport device 100 having any one of the second to fourth configurations, Among the plurality of heat exchangers 1, some of the heat exchangers 1d function as the fluid supply device 2 with respect to the remaining heat exchangers 1e, At least a part of the connection flow path 4 may be configured to function as the supply flow path 3 (a sixth configuration).

[0091] Also, the heat transport device 100 having any one of the first to sixth configurations, The fluid supply device 2 has a first circulation port 23 to which one end of the supply flow path 3 is connected, The circulation flow path 11 further has a second circulation port 115 to which the other end of the supply flow path 3 is connected, In the vertical direction Z, the height position of the first circulation port 23 may be the same as the height position of the second circulation port 115 (a seventh configuration).

[0092] Also, the heat transport device 100 having any one of the first to seventh configurations, The fluid supply device 2, A housing portion 21 that houses the fluid F that can be supplied to the heat exchanger 1, A cooling member 22 that cools the fluid F in the housing portion 21, has, The cooling of the cooling member 22 can be switched between implementation and stop (an eighth configuration).

[0093] Also, the heat transport device 100 having any one of the first to eighth configurations, The heat exchanger 1 further has a sensor 13 for detecting overheating of the fluid F in the circulation flow path 11, The cooling of the fluid F in the fluid supplier 2 may be configured (ninth configuration) to be stopped in response to detection of overheating of the fluid F by the sensor 13.

[0094] Moreover, the heat transport device 100 having any one of the first to ninth configurations further includes a solenoid valve 32 that switches the opening and closing of the supply flow path 3, the heat exchanger 1 further has a sensor 13 for detecting overheating of the fluid F in the circulation flow path 11, the solenoid valve 32 may be configured (tenth configuration) to switch the supply flow path 3 to an open state in response to detection of overheating of the fluid F by the sensor 13.

[0095] Moreover, the heat transport device 100 having any one of the first to tenth configurations the fluid supplier 2 may be configured (eleventh configuration) to be installed in a second heat source H2 different from the first heat source H1.

[0096] Moreover, the heat transport device 100 having any one of the first to tenth configurations the fluid supplier 2 may be configured (twelfth configuration) to be installed in a portion (for example, portion H1b) where the internal temperature in the first heat source H1 is equal to or lower than a predetermined temperature Td.

[0097] Moreover, the heat transport device 100 having any one of the first to twelfth configurations in the heat exchanger 1, the inlet and outlet of the heat dissipation flow path 112 may be configured (thirteenth configuration) to be arranged at a position Z1 higher than the inlet of the heat absorption flow path 111.

[0098] Moreover, the heat transport device 100 having any one of the first to thirteenth configurations the heat exchanger 1 further has a second cooler 14, the second cooler 14 may be configured (fourteenth configuration) to be arranged between the heat absorption flow path 111 and the heat dissipation flow path 112 in the circulation flow path 11 and cool the fluid F in the circulation flow path 11.

[0099] Also, the heat transport device 100 of the above-described 14th configuration The heat exchanger 1 further includes a sensor 13 for detecting superheat of the fluid F in the circulation flow path 11. The implementation and stop of the cooling by the second cooler 14 are switchable. The fluid F in the circulation flow path 11 may be configured (15th configuration) to be further cooled by the second cooler 14 in response to detection of superheat of the fluid F by the sensor 13.

Explanation of Reference Numerals

[0100] 100 Heat transport device 200 Control device 1, 1a to 1e Heat exchangers 11 Circulation flow path 111 Heat absorption flow path 112 Heat dissipation flow path 113 Inflow flow path 114 Outflow flow path 115 Port 12 Cooler 120 Housing 121 Inlet port 122 Outlet port 123 Refrigerant flow path 1231 Solenoid valve 124 Power generation member 13 Sensor 14 Secondary cooler 140 Housing 141 Refrigerant flow path 142 Solenoid valve 2 Fluid supply device 21 Fluid tank 22 Cooling member 221 Solenoid valve 23 Port 3 Supply flow path 31 Branch flow path 32 Solenoid valve 4 Connection flow path H1 Exhaust duct H2 Heat source H2a High-temperature body HG High-temperature gas flow P1 Duct flange P1 flange Pi Inlet port Po Outlet port F Fluid Td Lower limit temperature Tu Upper limit temperature

Claims

1. A heat exchanger, a fluid supplier, and a supply flow path, wherein the heat exchanger has a circulation flow path through which a fluid can circulate, and a first cooler that cools the fluid, and the circulation flow path includes a heat absorption flow path disposed in a first heat source, and a heat dissipation flow path disposed in the first cooler, and the supply flow path is a heat transport device that connects the circulation flow path and the fluid supplier.

2. further includes a connection flow path through which the fluid can flow, wherein there are a plurality of the heat exchangers, and the connection flow path connects the circulation flow paths of each of the heat exchangers. The heat transport device according to claim 1.

3. The circulation flow path further includes an inflow flow path that connects an inlet of the heat absorption flow path and an outlet of the heat dissipation flow path, and the connection flow path connects the inflow flow paths of each of the heat exchangers. The heat transport device according to claim 2.

4. The supply flow path is connected to the circulation flow paths of some of the plurality of heat exchangers, and some of the heat exchangers are disposed upstream of the first heat source with respect to the remaining heat exchangers. The heat transport device according to claim 2.

5. The plurality of heat exchangers include a first heat exchanger that functions as the fluid supplier, and a second heat exchanger that is some of the remaining heat exchangers, and one end of the supply flow path is connected to the circulation flow path of the first heat exchanger, and the other end of the supply flow path is connected to the circulation flow path of the second heat exchanger. The heat transport device according to claim 2.

6. Among the plurality of heat exchangers, some of the heat exchangers function as the fluid supplier with respect to the remaining heat exchangers, and at least some of the connection flow paths function as the supply flow path. The heat transport device according to claim 2.

7. The fluid supplier has a first circulation port to which one end of the supply flow path is connected, the circulation flow path further has a second circulation port to which the other end of the supply flow path is connected, and in the vertical direction, the height position of the first circulation port is the same as the height position of the second circulation port. The heat transport device according to any one of claims 1 to 6.

8. The fluid supplier has a housing portion that houses the fluid that can be supplied to the heat exchanger, and a cooling member that cools the fluid in the housing portion, and the cooling of the cooling member can be switched between being implemented and stopped. The heat transport device according to any one of claims 1 to 6.

9. The heat exchanger further has a sensor for detecting overheating of the fluid in the circulation flow path, The cooling of the fluid in the fluid supply device is stopped in response to detection of overheating of the fluid by the sensor, the heat transport device according to any one of claims 1 to 6.

10. further comprising a solenoid valve for switching the opening and closing of the supply flow path, the heat exchanger further having a sensor for detecting overheating of the fluid in the circulation flow path, the solenoid valve switches the supply flow path to an open state in response to detection of overheating of the fluid by the sensor, the heat transport device according to any one of claims 1 to 6.

11. the fluid supply device is installed in a second heat source different from the first heat source, the heat transport device according to any one of claims 1 to 6.

12. the fluid supply device is installed in a portion where the internal temperature in the first heat source is equal to or lower than a predetermined temperature, the heat transport device according to any one of claims 1 to 6.

13. in the heat exchanger, an inlet and an outlet of the heat dissipation flow path are arranged above an inlet of the heat absorption flow path, the heat transport device according to any one of claims 1 to 6.

14. the heat exchanger further has a second cooler, the second cooler is arranged between the heat absorption flow path and the heat dissipation flow path in the circulation flow path and cools the fluid in the circulation flow path, the heat transport device according to any one of claims 1 to 6.

15. the heat exchanger further has a sensor for detecting overheating of the fluid in the circulation flow path, implementation and stop of cooling of the second cooler are switchable, the fluid in the circulation flow path is further cooled by the second cooler in response to detection of overheating of the fluid by the sensor, the heat transport device according to claim 14.

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