Lifting mechanism and substrate processing device

Abstract

To provide a technology that can achieve both reduced dust generation and space saving.SOLUTION: A lifting mechanism according to an embodiment of the present disclosure is a lifting mechanism that raises and lowers a substrate holder that holds multiple substrates in a shelf-like manner, and includes a support portion that supports the substrate holder, and a multi-joint arm whose tip is connected to the support portion and that raises and lowers the support portion.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure relates to a lifting mechanism and a substrate processing apparatus.

Background Art

[0002] An apparatus is known that carries a substrate holder on which a plurality of substrates are mounted into a processing container and performs processing on the plurality of substrates all at once (see, for example, Patent Documents 1 and 2). The substrate holder is carried into the processing container by, for example, a ball screw or an elevating mechanism with a bellows.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0004] The present disclosure provides a technology capable of achieving both reduction of dust generation and space saving.

Means for Solving the Problems

[0005] A lifting mechanism according to an aspect of the present disclosure is a lifting mechanism that raises and lowers a substrate holder that holds a plurality of substrates in a shelf shape, and includes a support portion that supports the substrate holder, and a multi-joint arm having a tip connected to the support portion and configured to raise and lower the support portion.

Effects of the Invention

[0006] According to the present disclosure, it is possible to achieve both reduction of dust generation and space saving.

Brief Description of the Drawings

[0007]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

MODE FOR CARRYING OUT THE INVENTION

[0008] Hereinafter, non-limiting exemplary embodiments of the present disclosure will be described with reference to the accompanying drawings. In all the accompanying drawings, the same or corresponding members or components are denoted by the same or corresponding reference numerals, and duplicate descriptions are omitted.

[0009] 〔First Embodiment〕 Referring to FIGS. 1 to 4, a substrate processing apparatus 100 according to the first embodiment will be described. The substrate processing apparatus 100 includes a processing chamber 110, a load lock chamber 120, a substrate transfer chamber 160, and a control unit 190.

[0010] The processing chamber 110 can have its interior depressurized. The processing chamber 110 can accommodate a substrate holder WB inside. The substrate holder WB holds a plurality of substrates W in a shelf-like manner. Although 5 substrates are shown in FIGS. 1 to 3, the number of substrates W is not limited. Inside the processing chamber 110, a plurality of substrates W held by the substrate holder WB are processed collectively. At the lower part of the processing chamber 110, a loading / unloading opening 110a for loading and unloading the substrate holder WB is provided. The processing chamber 110 is provided with a gas nozzle 111, an exhaust device 112, and a heater 113.

[0011] The gas nozzle 111 is provided around the substrate holder WB located inside the processing chamber 110. The gas nozzle 111 discharges a processing gas from the gas source GS toward the substrate holder WB and the substrates W from around the substrate holder WB located inside the processing chamber 110. The processing gas is selected according to the type of processing. The gas nozzle 111 may be one or two or more.

[0012] The exhaust device 112 depressurizes the interior of the processing chamber 110 by exhausting the inside of the processing chamber 110. The exhaust device 112 includes, for example, a vacuum pump and a pressure control valve. The exhaust device 112 controls the interior of the processing chamber 110 to a desired pressure by adjusting the opening degree of the pressure control valve while evacuating the inside of the processing chamber 110 with the vacuum pump.

[0013] The heater 113 is provided inside the processing chamber 110. The heater 113 may be provided around the substrate holder WB located inside the processing chamber 110. The heater 113 heats the substrate holder WB and the substrates W to a desired temperature from around the substrate holder WB located inside the processing chamber 110.

[0014] The load lock chamber 120 is located below the processing chamber 110. The load lock chamber 120 can have its interior depressurized. The load lock chamber 120 can accommodate a substrate holder WB therein. An inlet / outlet 120a for carrying the substrate holder WB in and out is provided at the upper part of the load lock chamber 120. The interior of the load lock chamber 120 communicates with the interior of the processing chamber 110 via the inlet / outlet 110a and the inlet / outlet 120a. The substrate holder WB is carried into the processing chamber 110 from within the load lock chamber 120 via the inlet / outlet 110a and the inlet / outlet 120a. The substrate holder WB is carried out of the processing chamber 110 into the load lock chamber 120 via the inlet / outlet 110a and the inlet / outlet 120a. Inside the load lock chamber 120, the loading of the substrate W onto the substrate holder WB and the unloading of the substrate W from the substrate holder WB are performed. An inlet / outlet 120b for carrying the substrate W in and out is provided on the side wall on the negative X-axis side of the load lock chamber 120. The substrate W is carried into the load lock chamber 120 from within the substrate transfer chamber 160 via the inlet / outlet 120b. The substrate W is carried out of the load lock chamber 120 into the substrate transfer chamber 160 via the inlet / outlet 120b. The load lock chamber 120 is provided with a lifting mechanism 121, an exhaust device 126, a cooling gas supply unit 127, and an exhaust duct 128.

[0015] The lifting mechanism 121 raises and lowers the substrate holder WB between the interior of the processing chamber 110 and the interior of the load lock chamber 120. The lifting mechanism 121 has a support part 122 and an articulated arm 123.

[0016] The support unit 122 supports the substrate holder WB. The support unit 122 includes a lid 122a, a seal member 122b, a rotating shaft 122c, and a support arm 122d. In a state where the substrate holder WB is located in the processing chamber 110 (Fig. 1), the lid 122a airtightly seals the carry-in outlet 110a and the carry-in outlet 120a using the seal member 122b. Thereby, the inside of the processing chamber 110 is airtightly sealed. The seal member 122b is, for example, an O-ring. A through hole penetrating the lid 122a in the vertical direction is provided at the center of the lid 122a. The rotating shaft 122c is inserted into the through hole. The gap between the lid 122a and the rotating shaft 122c is sealed by a magnetic fluid seal. The rotating shaft 122c rotatably supports the substrate holder WB around the vertical axis M11. The support arm 122d is connected to the lower part of the rotating shaft 122c. The support arm 122d supports the rotating shaft 122c.

[0017] The articulated arm 123 may be a vertical articulated arm. In this case, since torque is always applied to the joint part, the backlash of the gear is canceled and the positioning accuracy is improved. The base end of the articulated arm 123 is fixed to the side wall on the positive side in the Y-axis direction of the load lock chamber 120, and the tip end is connected to the support arm 122d. The articulated arm 123 raises and lowers the support unit 122 by pivoting about the base end as the pivot center C1. The articulated arm 123 carries the substrate holder WB from the inside of the load lock chamber 120 into the inside of the processing chamber 110 by raising the support unit 122. The articulated arm 123 carries the substrate holder WB from the inside of the processing chamber 110 into the inside of the load lock chamber 120 by lowering the support unit 122.

[0018] The rotation center C1 of the articulated arm 123 may be located in the middle of the stroke of the articulated arm 123. In this case, the lengths and the number of the arms constituting the articulated arm 123 can be minimized. For example, as shown in FIG. 1, let the vertical length between the rotation center C1 of the articulated arm 123 and the tip position P1 of the articulated arm 123 when the substrate holder WB is in the processing chamber 110 be L1. For example, as shown in FIG. 2, let the vertical length between the rotation center C1 of the articulated arm 123 and the tip position P1 of the articulated arm 123 when the substrate holder WB is in the load lock chamber 120 be L2. At this time, L1 = L2 may hold.

[0019] The articulated arm 123 may include a refrigerant flow path 124 through which refrigerant flows inside. In this case, since the heat of the articulated arm 123 can be dissipated even in a vacuum atmosphere, the positioning accuracy can be maintained.

[0020] The articulated arm 123 includes a base end portion 123a, a first arm 123b, and a second arm 123c.

[0021] The base end portion 123a is fixed to the side wall on the positive Y-axis side of the load lock chamber 120. The base end portion 123a may be located in the middle of the stroke of the articulated arm 123. In this case, the lengths and the number of the arms constituting the articulated arm 123 can be minimized. The first arm 123b is rotatable with respect to the base end portion 123a about the rotation axis M12. The second arm 123c is rotatable with respect to the first arm 123b about the rotation axis M13 and is also rotatable with respect to the support arm 122d about the rotation axis M14. The articulated arm 123 raises and lowers the substrate holder WB between the position in the processing chamber 110 (FIG. 1) and the position in the load lock chamber 120 (FIG. 2) by independently rotating the first arm 123b and the second arm 123c.

[0022] The multi-joint arm 123 may have an internal space that is hermetically isolated from the atmosphere in the load lock chamber 120 by a magnetic fluid seal or the like. In this case, the mechanism part of the multi-joint arm 123 can be arranged in the internal space hermetically isolated from the atmosphere in the load lock chamber 120. Therefore, the generation of dust when raising and lowering the substrate holder WB can be reduced. In the internal space of the multi-joint arm 123, a plurality of motors with decelerators and cables for driving the motors may be accommodated. The plurality of motors with decelerators independently rotate each arm of the multi-joint arm 123. The internal space of the multi-joint arm 123 may be set to atmospheric pressure.

[0023] The exhaust device 126 evacuates the inside of the load lock chamber 120 to reduce the pressure inside the load lock chamber 120. The exhaust device 126 includes, for example, a vacuum pump and a pressure control valve. The exhaust device 126 controls the inside of the load lock chamber 120 to a desired pressure by adjusting the opening degree of the pressure control valve while evacuating the inside of the load lock chamber 120 with the vacuum pump.

[0024] The cooling gas supply unit 127 is provided in the load lock chamber 120. The cooling gas supply unit 127 is attached to the side wall (the second side wall) on the negative side in the Y-axis direction of the load lock chamber 120. The cooling gas supply unit 127 is provided so as to face the substrate holder WB in the load lock chamber 120. The cooling gas supply unit 127 discharges cooling gas toward the substrate holder WB and the substrate W in the load lock chamber 120. The cooling gas cools the substrate holder WB and the substrate W in the load lock chamber 120. The cooling gas is, for example, nitrogen gas, argon gas, or clean dry air. The cooling gas supply unit 127 may be provided in a region including from the lower end to the upper end of the substrate holder WB in the load lock chamber 120 in the vertical direction. In this case, cooling gas can be efficiently discharged to all the substrates W held by the substrate holder WB. The cooling gas supply unit 127 may be provided in a region including from one end to the other end of the substrate W held by the substrate holder WB in the load lock chamber 120 in the X-axis direction. In this case, cooling gas can be discharged with in-plane uniformity to each substrate W held by the substrate holder WB. The cooling gas supply unit 127 may be provided on the entire surface of the side wall on the negative side in the Y-axis direction of the load lock chamber 120.

[0025] The exhaust duct 128 is provided in the load lock chamber 120. The exhaust duct 128 is attached to the side wall (the first side wall) on the positive Y-axis side of the load lock chamber 120. The exhaust duct 128 is provided so as to face the cooling gas supply unit 127 with the substrate holder WB in the load lock chamber 120 interposed therebetween. The exhaust duct 128 sucks and exhausts the atmosphere heated to a high temperature by the substrate holder WB and the substrate W in the load lock chamber 120. Thereby, the substrate holder WB and the substrate W in the load lock chamber 120 are cooled. The exhaust duct 128 may be provided in a region including from the lower end to the upper end of the substrate holder WB in the load lock chamber 120 in the vertical direction. The exhaust duct 128 may be provided in a region including from one end to the other end of the substrate W held by the substrate holder WB in the load lock chamber 120 in the X-axis direction. Since only the base end portion 123a of the articulated arm 123 is fixed to the side wall on the positive Y-axis side of the load lock chamber 120, the exhaust duct 128 can be provided on the entire surface of the side wall on the positive Y-axis side of the load lock chamber 120 except for the position where the base end portion 123a is fixed. In this case, since an air flow that flows over the entire surface of the substrate W can be formed from the cooling gas supply unit 127 toward the exhaust duct 128, the cooling efficiency of the substrate W is improved.

[0026] The substrate transfer chamber 160 is connected to the negative X-axis side of the load lock chamber 120. The inside of the substrate transfer chamber 160 can be depressurized. A substrate transfer robot 161 is provided in the substrate transfer chamber 160. An exhaust device may be provided in the substrate transfer chamber 160.

[0027] The substrate transfer robot 161 is provided inside the substrate transfer chamber 160. The substrate transfer robot 161 carries the substrate W into the substrate holder WB in the load lock chamber 120 via the carry-in / outlet 120b, and carries out the substrate W held by the substrate holder WB in the load lock chamber 120 via the carry-in / outlet 120b. The substrate transfer robot 161 may include a horizontal articulated arm.

[0028] The control unit 190 can apply a computer having one or more processors 191, a memory 192, an input / output interface (not shown), and an electronic circuit. The processor 191 is a combination of one or more of a CPU, an ASIC, an FPGA, a circuit composed of a plurality of discrete semiconductors, etc. The memory 192 includes a volatile memory and a non-volatile memory (e.g., a compact disk, a DVD, a hard disk, a flash memory, etc.), and stores a program for operating the substrate processing apparatus 100 and a recipe such as process conditions of the process. The processor 191 controls each component of the substrate processing apparatus 100 by executing the program and the recipe stored in the memory 192, and performs various processes.

[0029] As described above, according to the first embodiment, the elevating mechanism 121 includes a support portion 122 that supports the substrate holder WB, and a multi-joint arm 123 whose tip is connected to the support portion 122 and that raises and lowers the support portion 122. Since the elevating mechanism 121 has the multi-joint arm 123, the mechanism portion for raising and lowering the substrate holder WB can be arranged in an internal space hermetically isolated from the atmosphere in the load lock chamber 120. Therefore, the generation of dust when raising and lowering the substrate holder WB can be reduced. Since the multi-joint arm 123 is housed in the load lock chamber 120 and operates in the load lock chamber 120, the operating area can be reduced. Therefore, space saving is possible. For example, since the height of the load lock chamber 120 can be lowered, the height of the processing chamber 110 can be increased while maintaining the height of the substrate processing apparatus 100. In this case, since the number of substrates W to be processed at once can be increased, the productivity is improved. In addition, since the pitch between adjacent substrates W can be widened, the heat uniformity and the processing uniformity are improved. Thus, according to the first embodiment, both reduction of dust generation and space saving can be achieved.

[0030] On the other hand, for example, when the substrate holder WB is moved up and down by a ball screw, there are concerns about the scattering of the lubricant used for the sliding part and outgassing from the lubricant. For example, when a shaft penetrating the bottom wall of the load lock chamber 120 is provided, and the substrate holder WB is connected to the upper end of the shaft, and the substrate holder WB is moved up and down by the lifting and lowering operation of the shaft, a space where the shaft can move is required below the load lock chamber 120.

[0031] In the first embodiment, the case where the articulated arm 123 has two arms (the first arm 123b and the second arm 123c) has been described, but the number of arms constituting the articulated arm 123 is not limited to this. The articulated arm 123 may have three or more arms.

[0032] 〔Second Embodiment〕 With reference to FIGS. 5 and 6, the substrate processing apparatus 200 according to the second embodiment will be described. The substrate processing apparatus 200 is different from the substrate processing apparatus 100 in a configuration having an articulated arm 223 whose rotation center is located below the middle of the stroke. Hereinafter, the description will focus on the configuration different from that of the substrate processing apparatus 100.

[0033] The substrate processing apparatus 200 includes a processing chamber 110, a load lock chamber 120, a substrate transfer chamber 160, and a control unit 190.

[0034] In the load lock chamber 120, a lifting mechanism 221, an exhaust device 126, a cooling gas supply unit 127, and an exhaust duct 128 are provided.

[0035] The lifting mechanism 221 moves the substrate holder WB up and down between the inside of the processing chamber 110 and the inside of the load lock chamber 120. The lifting mechanism 221 includes a support portion 122 and an articulated arm 223.

[0036] The articulated arm 223 includes a base end portion 223a, a first arm 223b, a second arm 223c, a third arm 223d, and a fourth arm 223e.

[0037] The base end portion 223a is fixed to the side wall on the positive Y-axis side of the load lock chamber 120. The base end portion 223a may be located below the middle of the stroke of the articulated arm 223. In this case, since the mechanism portion of the articulated arm 223 is always located below the substrate holder WB, the mechanism portion of the articulated arm 223 is less likely to receive radiant heat from the substrate W. The first arm 223b is rotatable with respect to the base end portion 223a about the rotation axis M22. The second arm 223c is rotatable with respect to the first arm 223b about the rotation axis M23. The third arm 223d is rotatable with respect to the second arm 223c about the rotation axis M24. The fourth arm 223e is rotatable with respect to the third arm 223d about the rotation axis M25 and is also rotatable with respect to the support arm 122d about the rotation axis M26. The articulated arm 223 raises and lowers the substrate holder WB between the position in the processing chamber 110 (FIG. 5) and the position in the load lock chamber 120 (FIG. 6) by independently rotating the first arm 223b, the second arm 223c, the third arm 223d, and the fourth arm 223e.

[0038] The articulated arm 223 may have an internal space that is hermetically isolated from the atmosphere in the load lock chamber 120 by a magnetic fluid seal or the like. In this case, the mechanism portion of the articulated arm 223 can be arranged in the internal space hermetically isolated from the atmosphere in the load lock chamber 120. Therefore, the generation of dust when raising and lowering the substrate holder WB can be reduced. A plurality of motors with speed reducers and cables for driving the motors may be accommodated in the internal space of the articulated arm 223. The plurality of motors with speed reducers independently rotate each arm of the articulated arm 223. The internal space of the articulated arm 223 may be set to atmospheric pressure.

[0039] As described above, according to the second embodiment, the elevating mechanism 221 includes a support portion 122 that supports the substrate holder WB and an articulated arm 223 whose tip is connected to the support portion 122 and that raises and lowers the support portion 122. In this case, the same effects as those of the first embodiment can be obtained.

[0040] In the second embodiment, the case where the articulated arm 223 has four arms (the first arm 223b, the second arm 223c, the third arm 223d, and the fourth arm 223e) has been described. However, the number of arms constituting the articulated arm 223 is not limited to this. The articulated arm 223 may have three or fewer arms or may have five or more arms.

[0041] 〔Third Embodiment〕 With reference to FIGS. 7 and 8, the substrate processing apparatus 300 according to the third embodiment will be described. The substrate processing apparatus 300 is different from the substrate processing apparatus 100 in a configuration having a frog-leg type articulated arm 323 in which the arms are arranged symmetrically with respect to the perpendicular to the locus of the center of gravity of the substrate holder WB. Hereinafter, the description will focus on the configuration different from that of the substrate processing apparatus 100.

[0042] The substrate processing apparatus 300 includes a processing chamber 110, a load lock chamber 120, a substrate transfer chamber 160, and a control unit 190.

[0043] The load lock chamber 120 is provided with an elevating mechanism 321, an exhaust device 126, a cooling gas supply unit 127, and an exhaust duct 128.

[0044] The elevating mechanism 321 raises and lowers the substrate holder WB between the inside of the processing chamber 110 and the inside of the load lock chamber 120. The elevating mechanism 321 includes a support portion 122 and an articulated arm 323.

[0045] The articulated arm 323 is a frog-leg type vertical articulated arm in which the arms are arranged symmetrically with respect to the perpendicular to the locus of the center of gravity of the substrate holder WB. In this case, since the load torque applied to each joint of the articulated arm 323 is halved, it is possible to reduce the size of the arm and improve the accuracy. The perpendicular to the locus of the center of gravity of the substrate holder WB may be the same as the vertical axis M11. The articulated arm 323 includes a base end portion 323a, a first arm 323b, a second arm 323c, a third arm 323d, and a fourth arm 323e.

[0046] The base end portion 323a is fixed to the side wall on the positive Y-axis side of the load lock chamber 120. The base end portion 323a may be located in the middle of the stroke of the articulated arm 323. In this case, the lengths of the respective arms constituting the articulated arm 323 and the number of arms can be minimized. The first arm 323b and the second arm 323c are each rotatable with respect to the base end portion 323a about the rotation axis M32. The third arm 323d is rotatable with respect to the second arm 323c about the rotation axis M33 and is also rotatable with respect to the support arm 122d about the rotation axis M35. The fourth arm 323e is rotatable with respect to the third arm 323d about the rotation axis M34 and is also rotatable with respect to the support arm 122d about the rotation axis M35. The articulated arm 323 raises and lowers the substrate holder WB between the position in the processing chamber 110 (FIG. 7) and the position in the load lock chamber 120 (FIG. 8) by independently rotating the first arm 323b, the second arm 323c, the third arm 323d, and the fourth arm 323e.

[0047] The articulated arm 323 may have an internal space hermetically isolated from the atmosphere in the load lock chamber 120 by a magnetic fluid seal or the like. In this case, the mechanism portion of the articulated arm 323 can be disposed in the internal space hermetically isolated from the atmosphere in the load lock chamber 120. For this reason, generation of dust when raising and lowering the substrate holder WB can be reduced. In the internal space of the articulated arm 323, a plurality of motors with speed reducers and cables for driving the motors may be accommodated. The plurality of motors with speed reducers independently rotate the respective arms of the articulated arm 323. The internal space of the articulated arm 323 may be set to atmospheric pressure.

[0048] As described above, according to the third embodiment, the elevating mechanism 321 includes a support portion 122 that supports the substrate holder WB and an articulated arm 323 having a tip connected to the support portion 122 and elevating the support portion 122. In this case, the same effects as those of the first embodiment can be obtained.

[0049] In the third embodiment, the case where the articulated arm 323 has four arms (the first arm 323b, the second arm 323c, the third arm 323d, and the fourth arm 323e) has been described, but the number of arms constituting the articulated arm 323 is not limited to this. The articulated arm 323 may have six or more arms.

[0050] The embodiments disclosed this time should be considered to be illustrative in all respects and not restrictive. The above embodiments may be omitted, replaced, or changed in various forms without departing from the scope and spirit of the appended claims.

Explanation of Reference Numerals

[0051] 121, 221, 321 Lifting mechanism 122 Support part 123, 223, 323 Articulated arm W Substrate WB Substrate holder

Claims

1. A lifting mechanism for lifting a substrate holder that holds a plurality of substrates in a shelf shape, comprising: a support portion that supports the substrate holder; a multi-joint arm having a tip connected to the support portion and configured to lift the support portion; The lifting mechanism.

2. The support portion includes a rotation axis for rotating the substrate holder around a vertical axis, The lifting mechanism according to claim 1.

3. The multi-joint arm includes a refrigerant flow path inside, The lifting mechanism according to claim 1 or 2.

4. A processing chamber for collectively processing a plurality of substrates held by a substrate holder; a load lock chamber located below the processing chamber and communicating with the processing chamber; a lifting mechanism for lifting the substrate holder between the processing chamber and the load lock chamber; Comprising, The lifting mechanism is a support portion that supports the substrate holder; a multi-joint arm having a tip connected to the support portion and configured to lift the support portion; Having, A substrate processing apparatus.

5. The support portion includes a rotation axis for rotating the substrate holder around a vertical axis, The substrate processing apparatus according to claim 4.

6. The multi-joint arm includes a refrigerant flow path inside, The substrate processing apparatus according to claim 4.

7. The load lock chamber is depressurizable, The substrate processing apparatus according to claim 4.

8. The support portion includes a lid for airtightly sealing the processing chamber in a state where the substrate holder is located in the processing chamber, The substrate processing apparatus according to claim 4.

9. The base end of the multi-joint arm is fixed to the first side wall of the load lock chamber, The substrate processing apparatus according to claim 4.

10. An exhaust duct provided on the first side wall of the load lock chamber; a cooling gas supply portion provided on a second side wall facing the first side wall and configured to discharge cooling gas; Comprising, The exhaust duct is provided on the entire surface of the first side wall except for the position where the base end of the multi-joint arm is fixed, The substrate processing apparatus according to claim 9.

11. The turning center of the multi-joint arm is located below the middle of the stroke of the multi-joint arm, The substrate processing apparatus according to claim 4.

12. The turning center of the multi-joint arm is located at the middle of the stroke of the multi-joint arm, The substrate processing apparatus according to claim 4.

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