Liquid ejection head

Abstract

To provide a liquid ejection head whose resistance to the deformation of a support member has been improved.SOLUTION: The liquid ejection head comprises: a first substrate having a first surface in which an ejection port configured to eject liquid is provided; a support member joined to the first surface of the first substrate and provided with an opening surrounding an area in which the ejection port in the first substrate is provided; and a second substrate joined to a second surface on an opposite side of the first surface of the first substrate. An area in which the support member and the first substrate are joined includes a first area in which adhesion strength between the support member and the first substrate is relatively high and a second area in which adhesion strength between the support member and the first substrate is relatively low.SELECTED DRAWING: Figure 10

Description

Technical Field

[0001] The present disclosure relates to a liquid ejection head.

Background Art

[0002] Patent Document 1 discloses a liquid ejection head in which a cover member (support member), a nozzle plate (first substrate), and an actuator substrate (second substrate) are adhered by an adhesive. According to the liquid ejection head of Patent Document 1, an adhesive is applied between the nozzle plate and the cover member, and intrusion of liquid (ink) from the adhesion portion between the nozzle plate and the cover member is suppressed, and improvement in liquid resistance is realized.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in a liquid ejection head such as that of Patent Document 1, when the support member is deformed, the stress generated by the deformation is transmitted to the first substrate adhered to the support member. The surface of the first substrate on the side opposite to the adhesion surface with the support member is adhered to the second substrate. Therefore, the stress generated by the deformation of the support member acts to peel the first substrate from the second substrate, and there is a risk that the adhesion portion in the liquid ejection head is damaged.

[0005] Therefore, an object of the present disclosure is to provide a liquid ejection head with improved resistance to deformation of the support member.

Means for Solving the Problems

[0006] The liquid ejection head of the present disclosure includes a first substrate having a first surface provided with ejection ports for ejecting liquid, a support member joined to the first surface of the first substrate and provided with an opening surrounding the region where the ejection ports are provided in the first substrate, and a second substrate joined to a second surface opposite to the first surface of the first substrate. The region where the support member and the first substrate are joined includes a first region where the adhesive force between the support member and the first substrate is relatively strong and a second region where the adhesive force between the support member and the first substrate is relatively weak.

Effect of the Invention

[0007] According to the liquid ejection head of the present disclosure, the resistance to deformation of the support member can be improved.

Brief Description of the Drawings

[0008]

Figure 1

Figure 2

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Figure 18

Embodiments for Carrying Out the Invention

[0009] [First Embodiment] <Liquid ejection device 100> FIG. 1 is a diagram showing an example of a liquid ejection device 100 to which the present embodiment can be applied.

[0010] First, the coordinate system shown in the figures referred to in this specification will be described. In the figures referred to in this specification, the -Y direction is the direction in which the recording medium 101 is conveyed, and the +Y direction is the upstream side in the conveyance direction. Also, the X direction is the longitudinal direction (width direction) of the liquid ejection head 103. At this time, the short-side direction (depth direction) of the liquid ejection head 103 is a direction along the Y direction. The Z direction is the height direction of the liquid ejection head 103. The liquid ejection head 103 ejects liquid toward the -Z direction to record an image on the recording medium 101.

[0011] In the present disclosure, "recording" does not only mean forming significant information (for example, characters or figures made manifest so that a human can perceive them visually). "Recording" also means forming unintentional information. Further, in the present disclosure, "recording" broadly means forming an image, pattern, pattern, structure, or a combination thereof, etc. on the recording medium 101, or performing processing on the medium.

[0012] As shown in FIG. 1, the liquid ejection apparatus 100 includes a conveyance unit 102 that conveys a recording medium 101 in the conveyance direction, a liquid ejection head 103 that ejects liquid onto the recording medium 101, and a mounting unit (not shown) for detachably mounting the liquid ejection head 103.

[0013] In the present embodiment, cut paper is used as the recording medium 101. The conveyance unit 102 includes a conveyance belt 102A and a conveyance roller 102B that rotates the conveyance belt 102A. Specifically, the conveyance unit 102 conveys the recording medium 101 by adsorbing and holding it on the conveyance belt 102A by a suction mechanism (not shown) and rotating. The recording medium 101 on which recording has been performed by the liquid ejection head 103 is peeled off from the conveyance belt 102A by a mechanism (not shown) on the downstream side and discharged to a paper discharge unit (not shown). The liquid ejection head 103 is a so-called page-wide type in which ejection ports are arranged corresponding to the width of the recording medium 101 (length in the X direction).

[0014] The liquid ejection head 103 is composed of liquid ejection heads 103C, 103M, 103Y, and 103K that eject cyan, magenta, yellow, and black liquids (for example, ink) in order from the upstream side in the conveyance direction of the recording medium 101. The liquid ejection head 103C that ejects cyan ink is configured by joining a head portion 103Ca and a head portion 103Cb. Similar to the liquid ejection head 103C, the liquid ejection head 103M for magenta ink is configured by joining a head portion 103Ma and a head portion 103Mb. Further, the liquid ejection head 103Y for yellow ink is configured by joining a head portion 103Ya and a head portion 103Yb, and the liquid ejection head 103K for black ink is configured by joining a head portion 103Ka and a head portion 103Kb. Hereinafter, when there is no need to particularly distinguish each of the head portions 103Ca, 103Cb, 103Ma, 103Mb, 103Ya, 103Yb, 103Ka, and 103Kb, they are simply referred to as head portions.

[0015] Each of the liquid ejection heads 103C, 103M, 103Y, and 103K has the same configuration. By supplying the ink of the corresponding color to each of the liquid ejection heads 103C, 103M, 103Y, and 103K, the above-described inks of each color are ejected. Hereinafter, when it is not necessary to particularly distinguish each of the liquid ejection heads 103C, 103M, 103Y, and 103K, it is simply referred to as the liquid ejection head 103. In the present embodiment, the liquid ejection head 103 can perform full-color printing on the conveyed recording medium 101 by ejecting cyan, magenta, yellow, and black inks.

[0016] <Liquid ejection head 103> FIG. 2 is a perspective view showing the upper surface of the liquid ejection head 103 in the present embodiment. In FIG. 2, one of the head portions of the liquid ejection head 103 according to the present embodiment described in FIG. 1 is shown.

[0017] As shown in FIG. 2, the liquid ejection head 103 includes a reference member 201 having a positioning function with respect to the liquid ejection device 100 (see FIG. 1). The reference member 201 is fixed to the common support member 203 by a reference fixing member 202. The liquid ejection head 103 includes a first cover 204 and a second cover 205 as an exterior portion.

[0018] The first cover 204 covers and protects an electric substrate (not shown) provided inside the liquid ejection head 103. The second cover 205 is openable and covers the periphery of an electrical connection terminal (not shown) provided inside the liquid ejection head 103. A liquid connection portion 206 is provided above the liquid ejection head 103. By connecting the liquid connection portion 206 to a liquid supply system (not shown) of the liquid ejection device 100 (see FIG. 1), liquid is supplied into the liquid ejection head 103.

[0019] Inside the liquid ejection head 103, a support unit (not shown) including a common support member 203 and the like are provided. The liquid flowing in from the liquid ejection device 100 side through the liquid connection portion 206 passes through a communication port (not shown) and is supplied to a liquid supply member (not shown) supported by the common support member 203.

[0020] FIG. 3 is a perspective view showing the bottom surface of the liquid ejection head 103 in the present embodiment.

[0021] As shown in FIG. 3, four liquid ejection units 300 capable of ejecting liquid are arranged in a staggered pattern on the common support member 203. A plurality of ejection ports 301 for ejecting liquid are formed in each liquid ejection unit 300.

[0022] The common support member 203 is provided with three holes for inserting the reference fixing member 202. With the reference fixing member 202 positioned with respect to these holes, the reference member 201 (see FIG. 2) is fixed to the reference fixing member 202, whereby the liquid ejection head 103 is fixed to the liquid ejection device 100. Inside the liquid ejection head 103, a liquid supply unit (not shown) for supplying liquid to the liquid ejection unit 300 via a support unit (not shown) and the like are provided. Inside the liquid supply member (not shown), a flow path for distributing liquid to each liquid ejection unit 300 is formed.

[0023] <Liquid ejection unit 300> FIG. 4 is a perspective view showing the ejection surface 400 of the liquid ejection unit 300 in the present embodiment.

[0024] As shown in FIG. 4, the liquid ejection unit 300 includes a first substrate 401 that ejects liquid, a flow path member 402 that supplies liquid to the first substrate 401, and a flexible wiring substrate 403 that is electrically connected to the first substrate 401. A drive circuit board 406 for driving an energy generating element (for example, a piezo element not shown) of the first substrate 401 is provided on the flexible wiring substrate 403. The liquid ejection device 100 (see FIG. 1) and the first substrate 401 are electrically connected via the flexible wiring substrate 403 and an electrical wiring substrate (not shown). The liquid ejection unit 300 includes a support member 407 joined to the ejection surface 400 of the first substrate 401.

[0025] FIG. 5 is a perspective view showing the upper surface of the liquid ejection unit 300 in the present embodiment.

[0026] As shown in FIG. 5, a communication port 501 is formed in the flow path member 402. Through this communication port 501, the flow path of the flow path member 402 and the flow path formed in the common support member 203 are connected.

[0027] FIG. 6 is an exploded perspective view of the liquid ejection unit 300 in the present embodiment.

[0028] As shown in FIG. 6, a flow path conversion member 601 is sandwiched between the first substrate 401 and the flow path member 402. Electrode portions (not shown) are provided at both ends of the first substrate 401 in the ±Y direction. The first substrate 401 and the flexible wiring substrate 403 are electrically connected by bringing the first electrical connection portion (not shown) on the flexible wiring substrate 403 into contact with the electrode portion on the first substrate 401. To prevent liquid from entering this electrical connection portion and to reinforce the first substrate 401, the support member 407 is joined to the ejection surface 400 from the -Z direction side.

[0029] FIG. 7 is a diagram for explaining the connection of each member constituting the liquid ejection unit 300 in the present embodiment.

[0030] As shown in FIG. 7, in the liquid ejection unit 300, the first substrate 401, the second substrate 705, the flow path conversion member 601, and the flow path member 402 are laminated in order from the -Z direction side. And the support member 407 is joined from the side (-Z direction side) of the ejection surface 400 of the first substrate 401. A plurality of ejection ports 301 are formed in the first substrate 401. Individual flow paths 706 for supplying and recovering liquid to / from each ejection port 301 are formed in the second substrate 705. A common flow path 704 for supplying liquid in common to the plurality of individual flow paths 706 is formed in the flow path conversion member 601. A plurality of communication ports 501 and liquid flow paths 702 connecting the communication ports 501 and the plurality of common flow paths 704 are formed in the flow path member 402. The communication port 501 is connected to a flow path (not shown) formed in the common support member 203 (not shown in FIG. 7).

[0031] The plurality of liquid flow paths 702 provided on the -Y direction side of the flow path member 402 in FIG. 7 and arranged along the X direction are used to supply liquid to the flow path conversion member 601. On the other hand, the plurality of liquid flow paths 702 provided on the +Y direction side of the flow path member 402 in FIG. 7 and arranged along the X direction are used to recover liquid from the flow path conversion member 601.

[0032] In the flow path for supplying liquid, one liquid flow path 702 is connected to a plurality of communication ports 703 formed in the flow path conversion member 601. The liquid flowing in from each communication port 703 passes through the common flow path 704 continuously formed from the communication port 703 and is supplied to the individual flow path 706 of the second substrate 705. The liquid flowing into the individual flow path 706 is supplied near the ejection port 301 of the first substrate 401.

[0033] In the flow path for recovering liquid, the plurality of communication ports 703 are connected to one liquid flow path 702. The liquid flowing in from each liquid flow path 702 passes through the communication port 501 and is returned to the liquid supply system of the liquid ejection device 100 (not shown in FIG. 7). Thus, in this embodiment, it is possible to circulate the liquid through the path of the liquid ejection device 100 (not shown in FIG. 7) and the path of the liquid ejection head 103 (not shown in FIG. 7).

[0034] In the individual flow path 706 of the second substrate 705, an energy generating element (for example, a piezo element not shown) for generating energy for discharging liquid is provided at a position corresponding to the discharge port 301. When the energy generating element receives a signal supplied via the flexible wiring board 403 (see FIG. 4), it expands itself to change the volume of the individual flow path 706 and discharges droplets from the discharge port 301. In the present embodiment, in this way, droplets are discharged from the discharge port 301 by driving the piezo element.

[0035] Further, one end of the individual flow path 706 is connected to the common flow path 704 on the supply side, and the other end is connected to the common flow path 704 on the recovery side. For this reason, the liquid near the discharge port 301 circulates, and fresh liquid is stably supplied to the discharge port 301 regardless of whether or not discharge is performed. For example, before discharging the liquid, the liquid can be heated while circulating the liquid to adjust it to a temperature suitable for discharging the liquid.

[0036] <Description of the problem> FIG. 8 is a diagram showing a reference example for explaining the problem in the present embodiment. Regarding the configuration identical to that of the present embodiment, the same name and reference numeral are given, and the description thereof is omitted. Hereinafter, a mechanism in which the first substrate 401 is deformed and peeled off from the second substrate 705 due to the difference between the linear expansion coefficient of the first substrate 401 and the linear expansion coefficient of the support member 407 will be described.

[0037] When the support member 407 is adhered to the first substrate 401, in consideration of liquid resistance, for example, a thermosetting adhesive may be used. Thermosetting adhesives are generally superior to adhesives cured at room temperature and the like in terms of adhesive strength, heat resistance, chemical resistance, and low linear expansion. Therefore, for example, when two flow path members are adhered to each other, a thermosetting adhesive is preferably used at a location that may come into contact with liquid and a location that is heated during use.

[0038] For example, in the maintenance process of the liquid ejection head 103, a suction cap (not shown) and a wiper or the like (not shown) come into contact with the support member 407. Therefore, it is preferable that the material of the support member 407 has sufficient strength against external forces and the like and is difficult to crack. However, when the material of the support member 407 is different from the material of the first substrate 401, a large stress 800 may be generated that peels off the joint portion 801 between the first substrate 401 and the second substrate 705 due to the difference in their linear expansion coefficients. In particular, since the process of curing the thermosetting adhesive is included during the manufacture of the liquid ejection unit 300, stress 800 may be generated in the support member 407, the first substrate 401, etc. due to the heat at this time, resulting in deformation and cracks.

[0039] Therefore, in the present embodiment, in order to suppress the influence of the above stress, the joint portion between the support member 407 and the first substrate 401 is made to have a feature.

[0040] FIG. 9(a) is an exploded perspective view for explaining the layer structure of the liquid ejection unit 300.

[0041] As shown in FIG. 9(a), the support member 407 is provided with an opening 904 that surrounds the region where the discharge port 301 (not shown in FIG. 9(a)) in the first substrate 401 is provided in a state where the support member 407 and the first substrate 401 are adhered.

[0042] The discharge surface 400 of the first substrate 401 is adhered to the upper surface of the support member 407 (the surface facing the +Z direction) by an adhesive 903 (not shown in FIG. 9(a)). As an example of the adhesive 903, a thermosetting adhesive can be mentioned.

[0043] The bottom surface (-Z direction-facing surface) of the second substrate 705 is joined to the first surface 900 (+Z direction-facing surface) of the first substrate 401. The bottom surface (-Z direction-facing surface) of the flow path conversion member 601 is joined to the upper surface (+Z direction-facing surface) of the second substrate 705. A supply path 901 for supplying liquid to the first substrate 401 is formed in the second substrate 705. By joining the bottom surface of the second substrate 705 to the first surface 900 of the first substrate 401, individual flow paths 706 are formed.

[0044] FIG. 9(b) is an exploded perspective view showing the above layer structure from the side opposite to FIG. 9(a). In FIG. 9(b), the first projection line 905 indicates the outer periphery of the second substrate 705 when the second substrate 705 is projected onto the ejection surface 400. On the other hand, the second projection line 906 indicates the inner periphery of the support member 407 when the support member 407 is projected onto the ejection surface 400.

[0045] As shown in FIG. 9(b), a plurality of ejection ports 301 for ejecting liquid are formed in the ejection surface 400, which is the side opposite to the first surface 900 of the first substrate 401. The adhesive 903 is applied to the region surrounded by this first projection line 905 and the second projection line 906. That is, on the ejection surface 400, the adhesive 903 is applied to the overlapping region (the hatched portion in FIG. 9) where the projection region where the second substrate 705 is projected and the projection region where the support member 407 is projected overlap. On the other hand, on the ejection surface 400, in the regions (the regions at both ends in the ±Y direction) where the second substrate 705 is not projected and the support member 407 is projected, the adhesive 903 is not applied.

[0046] Also, in the Y direction, the second substrate 705 is smaller than the first substrate 401. That is, in the state where the first substrate 401 and the second substrate 705 are laminated, the end portion of the first substrate 401 in the Y direction protrudes from the second substrate 705.

[0047] The first substrate 401 can be formed, for example, by a silicon substrate. It is desirable that the coefficient of linear thermal expansion of the material in the support member 407 be as close as possible to the coefficient of linear thermal expansion in the first substrate 401. For example, when the first substrate 401 is a silicon substrate, it is desirable that the material of the support member 407 include any one or more of titanium, nickel alloy, stainless steel, tungsten, molybdenum, and ceramics. It is desirable that the coefficient of linear thermal expansion of the support member 407 be about 5 times or less that of the first substrate 401.

[0048] FIG. 10 is an enlarged view of region X in FIG. 7.

[0049] As shown in FIG. 10, the liquid ejection unit 300 includes a first substrate 401 having a first surface (in this embodiment, the ejection surface 400) provided with an ejection port 301 for ejecting liquid. The liquid ejection unit 300 includes a support member 407 joined to the ejection surface 400 of the first substrate 401 and provided with an opening 904 (see FIG. 9) surrounding the region where the ejection port 301 is provided in the first substrate 401. The liquid ejection unit 300 includes a second substrate 705 joined to the second surface (the surface facing the +Z direction in FIG. 10), which is opposite to the ejection surface 400 of the first substrate 401. The region where the support member 407 and the first substrate 401 are joined includes a first region 1001 where the adhesion between the support member 407 and the first substrate 401 is relatively strong and a second region 1002 where the adhesion between the support member 407 and the first substrate 401 is relatively weak.

[0050] In a state where the ejection surface 400 is viewed along the direction in which the support member 407, the first substrate 401, and the second substrate 705 are stacked, the first region 1001 includes an overlapping region where the projection region where the second substrate 705 is projected and the projection region where the support member 407 is projected overlap. In a state where the ejection surface 400 is viewed along the direction in which the support member 407, the first substrate 401, and the second substrate 705 are stacked, the second region 1002 includes a region where the second substrate 705 is not projected and the support member 407 is projected.

[0051] The width of the second substrate 705 (the size in the Y direction) is smaller than the width of the first substrate 401. Therefore, in a state where the discharge surface 400 is viewed along the direction in which the support member 407, the first substrate 401, and the second substrate 705 are stacked, the projection area of the second substrate 705 with respect to the first substrate 401 is smaller than the projection area of the first substrate 401.

[0052] In the present embodiment, the lower surface of the second substrate 705 (the surface facing the -Z direction in FIG. 10) and the second surface of the first substrate 401 (the surface facing the +Z direction in FIG. 10) are adhered by an adhesive 903 (not shown in FIG. 10).

[0053] The liquid discharge unit 300 has a first region 1001 in which the support member 407, the first substrate 401, and the second substrate 705 overlap along the height direction (Z direction). In the first region 1001 of the present embodiment, the support member 407 and the first substrate 401 are adhered by an adhesive 903 (not shown in FIG. 10).

[0054] Further, the liquid discharge unit 300 has a second region 1002 in which the support member 407 and the first substrate 401 overlap along the height direction (Z direction), but do not overlap with the second substrate 705.

[0055] In the present embodiment, the adhesive 903 (not shown in FIG. 10) is not applied to the second region 1002. That is, in the second region 1002, the first substrate 401 is not fixed to the support member 407.

[0056] Therefore, the adhesion force between the support member 407 and the first substrate 401 in the first region 1001 and the adhesion force between the support member 407 and the first substrate 401 in the second region 1002 are different. Specifically, the adhesion force between the support member 407 and the first substrate 401 in the second region 1002 is smaller than the adhesion force between the support member 407 and the first substrate 401 in the first region 1001.

[0057] For example, when the support member 407 and the first substrate 401 are adhered by a thermosetting adhesive, in the process of curing the thermosetting adhesive, due to the applied heat, the support member 407 may become hot and deform such as warping.

[0058] However, according to the configuration of the present embodiment, even when the support member 407 is slightly deformed, the first substrate 401 is not fixed to the support member 407 in the second region 1002. Therefore, in the second region 1002, the stress associated with the deformation of the support member 407 does not act on the first substrate 401. Thus, in the present embodiment, the region where the adhesive 903 is interposed between the support member 407 and the first substrate 401 is only a part (the first region 1001) of the region where the support member 407 and the first substrate 401 are laminated. Thereby, even when the linear expansion coefficient of the first substrate 401 and the linear expansion coefficient of the support member 407 are different, the risk of the first substrate 401 being damaged and the risk of the first substrate 401 peeling off from the second substrate 705 can be reduced.

[0059] In addition, in the present embodiment, the thickness (the length in the Z direction) of the first substrate 401 is 0.3 mm or less. That is, the thickness of the region (the thin plate portion 602) protruding from the second substrate 705 in the first substrate 401 is also 0.3 mm or less. By making the first substrate 401 thin, it becomes possible to reduce the stress generated in the thin plate portion 602 itself.

[0060] The adhesive used in the present embodiment is a thermosetting type in order to improve the liquid resistance, and it is desirable that the linear expansion coefficient is as small as possible. If the support member 407 and the first substrate 401 are not completely adhered in the second region 1002, the adhesive applied to the first region 1001 may protrude into the second region 1002. However, it is desirable that the amount of protrusion of the adhesive is as small as possible.

[0061] As described above, in the region where the support member and the first substrate are laminated, the liquid ejection head of the present embodiment has a first region where the support member and the first substrate are fixed via an adhesive, and a second region where the support member and the first substrate are not fixed via an adhesive. When the material of the first substrate is different from the material of the support member and the linear expansion coefficient of the first substrate is different from the linear expansion coefficient of the support member, the amount of deformation of the first substrate and the amount of deformation of the support member will be different from each other.

[0062] And, even when the support member is deformed by bonding the support member and the first substrate with a thermosetting adhesive under such circumstances, in the second region, the stress generated by the deformation is less likely to act.

[0063] In this way, in the present embodiment, there exists a region where the stress generated by the deformation of the support member is not transmitted to the first substrate laminated on the support member. As a result, it is possible to suppress the first substrate, which is fixed as if it were sandwiched between the support member and the second substrate, from being dragged by the deforming support member and peeled off from the second substrate. According to this configuration, even when the material of the first substrate is different from the material of the support member, it is possible to use a thermosetting adhesive.

[0064] Therefore, according to the liquid ejection head of the present embodiment, the resistance to deformation of the support member can be improved.

[0065] [Modification Example 1 of the First Embodiment] FIG. 11 is a perspective view showing a modification example of the first substrate 401.

[0066] As shown in FIG. 11, groove portions 1100 are provided along the X direction at both ends in the Y direction of the ejection surface 400 of the first substrate 401.

[0067] FIG. 12 is an enlarged cross-sectional view of the liquid ejection unit 300 in this modification example.

[0068] As shown in FIG. 12, in the liquid ejection unit 300 of this modified example, with the support member 407, the first substrate 401, and the second substrate 705 adhered, the groove portion 1100 is provided at the boundary portion between the second region 1002 in the first region 1001. According to this configuration, even when an amount of adhesive exceeding that suitable for adhering the first region 1001 is applied, the adhesive 903 (not shown in FIG. 12) can flow into the groove portion 1100 and be blocked. Therefore, it is possible to prevent the adhesive 903 that has oozed out from the first region 1001 from reaching the second region 1002.

[0069] In this modified example, although the groove portion 1100 is provided on the first substrate 401, as long as the oozed adhesive 903 can flow in, the groove portion 1100 may be provided on the support member 407, or may be provided on both the first substrate 401 and the support member 407.

[0070] By causing the adhesive 903 to flow into the groove portion 1100, as a result, it becomes difficult for the adhesive 903 to reach the second region 1002. Therefore, in the second region 1002, it is possible to suppress the fixation of the support member 407 and the first substrate 401. Accordingly, even when the support member 407 is deformed, the stress generated by the deformation is less likely to act on the second region 1002. That is, also in this modified example, it is possible to improve the resistance to deformation of the support member 407.

[0071] [Modified Example 2 of the First Embodiment] FIG. 13 is a perspective view of the first substrate 401 in this modified example.

[0072] As shown in FIG. 13, in the first substrate 401 of this modified example, a water-repellent treatment is performed on a part or all of the second region 1002.

[0073] FIG. 14 is an enlarged cross-sectional view of the liquid ejection unit 300 in this modified example.

[0074] As shown in FIG. 14, in this modification, a water-repellent processed portion 1400 subjected to water-repellent processing is included in part or all of the second region 1002. In the water-repellent processed portion 1400, the support member 407 and the first substrate 401 are less likely to be in close contact than in the first embodiment. Therefore, even when the support member 407 is heated and tries to deform, the stress generated by this deformation hardly acts on the thin plate portion 602.

[0075] Further, even when the adhesive 903 protrudes over the entire second region 1002, in the second region 1002 including the water-repellent processed portion 1400, the support member 407 is not completely fixed to the first substrate 401.

[0076] Therefore, according to the liquid ejection head of this modification, even when the adhesive protrudes into the second region, the resistance to deformation of the support member can be improved.

[0077] In this modification, the water-repellent processed portion 1400 is provided on the ejection surface 400 of the first substrate 401. However, the position where the water-repellent processed portion 1400 can be provided is not limited to the ejection surface 400. As long as the adhesive force in the second region 1002 can be made smaller than the adhesive force in the first region 1001, the water-repellent processed portion 1400 may be provided on the adhesion surface of the support member 407 with the ejection surface 400, or on both the first substrate 401 and the support member 407.

[0078] [Second Embodiment] Hereinafter, a second embodiment of the technology of the present disclosure will be described with reference to the drawings. In the following description, the same or corresponding configurations as those in the first embodiment are denoted by the same reference numerals and the description thereof is omitted, and the different points will be mainly described. In the first embodiment, the second region is provided outside the first region, but in this embodiment, the second region is provided inside the first region.

[0079] FIG. 15 is an exploded perspective view of a characteristic portion in this embodiment.

[0080] As shown in FIG. 15, the shape of the flow path formed in the second substrate 705 of the present embodiment is different from the shape of the flow path formed in the second substrate of the first embodiment. In the second substrate 705 of the present embodiment, a plurality of flow paths 1502 extending in the X direction and penetrating the second substrate 705 in the Z direction are arranged along the Y direction.

[0081] The upper surface (+Z direction facing surface) of the second substrate 705 is adhered to the bottom surface (-Z direction facing surface) of the flow path conversion member 601. The first surface 900 of the first substrate 401 is adhered to the bottom surface (-Z direction facing surface) of the second substrate 705. The upper surface (+Z direction facing surface) of the support member 407 is adhered to the discharge surface 400 of the first substrate 401.

[0082] The support member 407 is provided with an opening 1501 that surrounds the region where the discharge port 301 is provided in the first substrate 401 in a state where the support member 407 and the first substrate 401 are adhered. However, the opening 1501 of the present embodiment is smaller than the opening 904 (see FIG. 9) of the first embodiment. In a state where the flow path conversion member 601, the second substrate 705, the first substrate 401, and the support member 407 are adhered, a flow path connecting the flow path conversion member 601, the second substrate 705, and the first substrate 401 is formed.

[0083] Also in the present embodiment, in a state where the second substrate 705 and the support member 407 are projected onto the discharge surface 400 of the first substrate 401, an adhesive 903 is applied to a first region 1001 where the projected region of the second substrate 705 and the projected region of the support member 407 overlap each other. On the other hand, since the second substrate 705 of the present embodiment has a flow path 1502 that is a through hole, there is a region where the support member 407 is projected but the second substrate 705 is not projected in a state where the second substrate 705 and the support member 407 are projected onto the discharge surface 400. In the present embodiment, this region becomes the second region 1002. No adhesive 903 is applied to the second region 1002. In the discharge surface 400 of the present embodiment, the second region 1002 is located inside the first region 1001.

[0084] FIG. 16 is an enlarged cross-sectional view of the second liquid discharge unit 1600 in the present embodiment.

[0085] As shown in FIG. 16, in the ejection surface 400 of the present embodiment, in a state where the flow path conversion member 601, the second substrate 705, the first substrate 401, and the support member 407 are laminated, it is located at a position corresponding to the flow path 1502 of the second substrate 705. According to this configuration, in a state where the second substrate 705, the first substrate 401, and the support member 407 are laminated, at the position corresponding to the flow path 1502 of the second substrate 705, the support member 407 is projected, but the second substrate 705 is not projected.

[0086] As described above, in the present embodiment, the adhesive 903 is applied to the first region 1001, and the adhesive 903 is not applied to the second region 1002. Further, the second region 1002 may be subjected to a water repellent treatment. In addition, as long as the adhesive strength in the second region 1002 can be made smaller than the adhesive strength in the first region 1001, the water repellent treatment may be performed, for example, on the adhesion surface of the support member 407 with the first substrate 401.

[0087] According to the present embodiment, in the second region 1002, the support member 407 and the first substrate 401 are not adhered. Therefore, even when the support member 407 is heated and tries to deform, the stress generated by this deformation hardly acts on the thin plate portion 602.

[0088] Therefore, also with the liquid ejection head of the present embodiment, the resistance to deformation of the support member can be improved.

[0089] [Modification Example 1 of the Second Embodiment] FIG. 17 is a perspective view of the first substrate 401 in this modification example.

[0090] As shown in FIG. 17, a first region 1001 is provided along the outer periphery on the ejection surface 400 of this modification example. In this modification example, a groove portion 1100 is provided along the inner periphery of the first region 1001. Inside the groove portion 1100 of this modification example, second regions 1002 are provided along the X direction at both ends in the Y direction of the ejection surface 400, respectively. Further, a water-repellent treatment is applied to part or all of the second region 1002.

[0091] FIG. 18 is an enlarged cross-sectional view of the second liquid ejection unit 1600 in this modification example.

[0092] As shown in FIG. 18, in this modification example, the groove portion 1100 is provided at the boundary portion between the first region 1001 and the second region 1002. As described above, the adhesive 903 is applied to the first region 1001. On the other hand, a water-repellent treatment is applied to the second region 1002 without applying the adhesive 903. In the first region 1001, the support member 407 and the first substrate 401 are fixed via the adhesive 903. On the other hand, in the second region 1002, the support member 407 and the first substrate 401 are not fixed.

[0093] According to this configuration, even when the adhesive 903 protrudes from the first region 1001, exceeds the groove portion 1100, and reaches the second region 1002, the support member 407 is not fixed to the first substrate 401 in the second region 1002 where the water-repellent treatment is applied. Therefore, even when the support member 407 is heated and tries to deform, the stress generated by this deformation hardly acts on the thin plate portion 602.

[0094] Therefore, according to the liquid ejection head of this modification example, even when the adhesive 903 protrudes into the second region 1002, the resistance to deformation of the support member can be improved.

[0095] Further, in the second region 1002, as long as the support member 407 can be made not substantially fixed to the first substrate 401, the groove portion 1100 may not be provided on the first substrate 401, and the water-repellent treatment may not be performed on the first substrate 401 either. For example, the groove portion 1100 may be provided on the adhesion surface of the support member 407 with the first substrate 401, and the water-repellent treatment may be performed.

[0096] Also, as a means for suppressing the overflow of the adhesive or partially reducing the adhesive strength, as long as the same effect can be obtained, not limited to the groove portion and the water-repellent treatment portion, another configuration may be provided. For example, a plurality of groove portions may be provided along the direction in which the adhesive overflows.

[0097] Also, in this modification, the groove portion extending in the X direction is arranged, but a plurality of recesses for allowing the excess adhesive to flow into a plurality of locations in the first region may be provided. After performing the water-repellent treatment only on the second region, the adhesive may be applied to both the first region and the second region. That is, in the region where the first substrate 401 is laminated on the support member 407, a first region where the support member 407 and the first substrate 401 are relatively firmly fixed and a second region where they are not firmly fixed are provided. Thereby, it is possible to provide a liquid ejection head that improves the resistance to deformation more than before while ensuring the sealing performance of the adhesion portion.

[0098] [Other Embodiments] In the above embodiments, the description has been made assuming a case where the support member is deformed by the heat when curing the thermosetting adhesive. As another example of the case where the support member is deformed, an example is given in which when the ink is heated to adjust the temperature of the ink during use of the liquid ejection head, the support member is deformed by the heat. Thus, even when there is a risk that the support member may be deformed while adjusting the temperature of the ink, in the second region, as long as the support member is not fixed to the first substrate, the stress when the support member is deformed can be released in the second region.

[0099] In the liquid ejection head in the above-described embodiment, liquid was ejected by driving a piezo element. In addition to this, the technology of the present disclosure can also be applied to a liquid ejection head that employs a thermal method in which liquid is ejected by bubbles generated by a heater element, or various other liquid ejection methods.

[0100] In the above-described embodiment, a liquid such as ink was circulated between a tank and a liquid ejection head. In addition to this, for example, even in a form in which two tanks are provided on the upstream side and the downstream side of the liquid ejection head and ink is caused to flow from one tank to the other tank without circulating the ink, thereby flowing the ink in the pressure chamber, the technology of the present disclosure can be applied.

[0101] In the above-described embodiment, a so-called page-wide type liquid ejection head was used, but the technology of the present disclosure can also be applied to a liquid ejection head that performs recording while scanning. That is, the technology of the present disclosure can also be applied to a so-called serial type liquid ejection head.

[0102] In the above-described embodiment, cut paper was used as the recording medium. In addition to cut paper, for example, various materials and forms of recording media such as roll paper, cloth, the label surface of an optical disc, a plastic sheet, an OHP sheet, and an envelope can be used.

[0103] In the above-described embodiment, ink was used as the liquid, but the liquid that can be used in the technology of the present disclosure is not limited to ink. In addition to ink, various recording liquids including a processing liquid used for the purpose of improving the fixing property of ink on a recording medium, reducing gloss unevenness, and improving scratch resistance can be used as the liquid.

[0104] The present disclosure includes the following configurations.

[0105] [Configuration 1] A first substrate having a first surface provided with a discharge port for discharging a liquid, A support member bonded to the first surface of the first substrate and provided with an opening surrounding a region where the discharge port is provided in the first substrate. A second substrate bonded to a second surface opposite to the first surface of the first substrate. Comprising: A region where the support member and the first substrate are bonded includes a first region where the adhesion between the support member and the first substrate is relatively strong, and a second region where the adhesion between the support member and the first substrate is relatively weak. A liquid discharge head, characterized in that.

[0106] [Configuration 2] In a state where the first surface is viewed along the direction in which the support member, the first substrate, and the second substrate are laminated, the first region includes an overlapping region where the projection region of the second substrate and the projection region of the support member overlap, and the second region includes a region where the second substrate is not projected and the support member is projected. The liquid discharge head according to Configuration 1.

[0107] [Configuration 3] The linear expansion coefficient of the first substrate is smaller than the linear expansion coefficient of the support member. The liquid discharge head according to Configuration 1 or 2.

[0108] [Configuration 4] The linear expansion coefficient of the first substrate is 5 times or less of the linear expansion coefficient of the support member. The liquid discharge head according to Configuration 3.

[0109] [Configuration 5] The first substrate contains silicon. The support member contains any one or more of titanium, nickel alloy, stainless steel, tungsten, molybdenum, and ceramics. The liquid discharge head according to Configuration 4.

[0110] [Configuration 6] In a state where the first surface is viewed along the direction in which the support member, the first substrate, and the second substrate are laminated, the projection area of the second substrate with respect to the first substrate is smaller than the projection area of the first substrate. The liquid ejection head according to any one of Configurations 1 to 5.

[0111] [Configuration 7] An adhesive is applied to the first region. An adhesive is not applied to the second region. The liquid ejection head according to any one of Configurations 1 to 6.

[0112] [Configuration 8] The adhesive is a thermosetting adhesive. The liquid ejection head according to Configuration 7.

[0113] [Configuration 9] A groove portion is provided at the boundary between the first region and the second region. The liquid ejection head according to Configuration 7 or 8.

[0114] [Configuration 10] A water-repellent treatment is applied to part or all of the second region. The liquid ejection head according to any one of Configurations 1 to 9.

[0115] [Configuration 11] The thickness of part or all of the first substrate is 0.3 mm or less. The liquid ejection head according to any one of Configurations 1 to 10.

[0116] [Configuration 12] The second substrate is provided with an individual flow path for supplying liquid to each of the ejection ports and an energy generating element for generating energy for ejecting liquid from the ejection ports. The liquid ejection head according to any one of Configurations 1 to 11.

[0117] [Configuration 13] The liquid ejection head according to any one of Configurations 1 to 12, and a mounting portion for mounting the liquid ejection head, and a liquid ejection apparatus characterized by the above.

Claims

1. A first substrate having a first surface provided with a discharge port for discharging a liquid, a support member bonded to the first surface of the first substrate and provided with an opening surrounding a region where the discharge port is provided in the first substrate, a second substrate bonded to a second surface opposite to the first surface of the first substrate, comprising: a region where the support member and the first substrate are bonded includes a first region where the adhesive force between the support member and the first substrate is relatively strong, and a second region where the adhesive force between the support member and the first substrate is relatively weak, a liquid discharge head characterized by the above.

2. In a state where the first surface is viewed along the direction in which the support member, the first substrate, and the second substrate are laminated, the first region includes an overlapping region where the projection region of the second substrate and the projection region of the support member overlap, and the second region includes a region where the second substrate is not projected and the support member is projected, The liquid discharge head according to claim 1.

3. The linear expansion coefficient of the first substrate is smaller than the linear expansion coefficient of the support member, The liquid discharge head according to claim 1.

4. The linear expansion coefficient of the first substrate is 5 times or less of the linear expansion coefficient of the support member, The liquid discharge head according to claim 3.

5. The first substrate contains silicon, The support member contains any one or more of titanium, nickel alloy, stainless steel, tungsten, molybdenum, and ceramics, The liquid discharge head according to claim 4.

6. In a state where the first surface is viewed along the direction in which the support member, the first substrate, and the second substrate are laminated, the projection region of the second substrate with respect to the first substrate is smaller than the projection region of the first substrate, The liquid discharge head according to claim 1.

7. An adhesive is applied to the first region, An adhesive is not applied to the second region, The liquid discharge head according to claim 1.

8. The adhesive is a thermosetting adhesive, The liquid discharge head according to claim 7.

9. A groove is provided at the boundary between the first region and the second region, The liquid discharge head according to claim 7.

10. A water repellent treatment is applied to part or all of the second region, The liquid discharge head according to claim 1.

11. The thickness of part or all of the first substrate is 0.3 mm or less, The liquid discharge head according to claim 1.

12. The second substrate is provided with individual channels for supplying liquid to each of the discharge ports, and energy generating elements for generating energy for discharging liquid from the discharge ports. The liquid discharge head according to claim 1.

13. The liquid discharge head according to claim 1, and a mounting portion for mounting the liquid discharge head. A liquid discharge device characterized by the above.

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