Interface with accessibility

Abstract

To provide an interface with an improved accessibility.SOLUTION: The interface includes: a housing 1230; and a measurement electronic apparatus arranged in the inner side of the housing 1230. The measurement electronic apparatus is fixed to a connector extending into the inside of the housing 1230.SELECTED DRAWING: Figure 20A

Description

Technical Field

[0001] The embodiments described below relate to an instrument having an interface, and more particularly to an interface with improved accessibility.

Background Art

[0002] For example, vibratory instruments such as Coriolis mass flow meters, liquid density meters, gas density meters, liquid viscometers, gas / liquid specific gravity meters, gas / liquid relative density meters, and gas molecular weight meters are generally known and are used to measure the properties of fluids. Generally, a vibratory instrument includes a sensor assembly and instrument electronics. The material within the sensor assembly may be flowing or stationary. The vibratory instrument can be used to measure the mass flow rate, density, or other properties of the material within the sensor assembly. The instrument electronics typically perform calculations to determine the values of the mass flow rate, density, and other properties of the material within the sensor assembly.

[0003] The instrument electronics are usually located within an interface, sometimes called a transmitter, that is communicatively and / or mechanically coupled to the sensor assembly. In addition to including the instrument electronics, the interface can also include a display capable of indicating various data such as the parameters of the vibratory instrument, historical data, communication status, and the like. However, due to the installation of vibratory instruments in industrial environments, access to the interface can be limited, restricted, or obscured. For example, the interface may be located in a position where a pipe hides the display. For similar reasons, performing services or adjustments on the interface can be difficult. Therefore, an interface with improved accessibility is needed.

Summary of the Invention

[0004] An interface with improved accessibility is provided. According to one embodiment, the interface includes a housing and instrumentation electronics disposed inside the housing. The instrumentation electronics are configured to be fixed to a connector that extends into the housing. A method for assembling an interface with improved accessibility is provided. According to one embodiment, the method includes providing a housing, providing instrumentation electronics and disposing them within the housing, providing a connector and extending it into the housing, and fixing the instrumentation electronics to the connector that extends into the housing.

[0005] An interface with improved accessibility is provided. According to one embodiment, the interface includes a housing and instrumentation electronics. The instrumentation electronics include an upper instrumentation electronics, a lower instrumentation electronics, and a barrier plate disposed between the upper instrumentation electronics and the lower instrumentation electronics and coupled to the upper instrumentation electronics and the lower instrumentation electronics. The interface also includes a gasket disposed in contact between the barrier plate and the housing so as to form a watertight seal separating an upper instrumentation electronics portion of the housing from a lower instrumentation electronics portion of the housing.

[0006] A method for assembling an interface with improved accessibility is provided. According to one embodiment, the method includes providing a housing and providing instrumentation electronics. Providing the instrumentation electronics includes providing an upper instrumentation electronics, providing a lower instrumentation electronics, providing a barrier plate and disposing it between the upper instrumentation electronics and the lower instrumentation electronics, and coupling the barrier plate to the upper instrumentation electronics and the lower instrumentation electronics. The method also includes disposing a gasket in contact between the barrier plate and the housing so as to form a watertight seal separating an upper instrumentation electronics portion of the housing from a lower instrumentation electronics portion of the housing, and contacting the barrier plate and the gasket. including placing and contacting the barrier plate and the gasket.

[0007] An interface with improved accessibility is provided. According to one embodiment, the interface comprises a housing having a display opening and a fascia disposed inside the housing adjacent to the display opening. The fascia comprises a substrate and a wireless transceiver. The substrate comprises a front side facing the display opening and a rear side facing an inner portion of the housing. The wireless transceiver is disposed on the rear side of the substrate and configured to communicatively couple to a wireless device through an opening of the substrate.

[0008] A method of forming an interface with improved accessibility is provided. According to one embodiment, the method includes providing a housing having a display opening and providing a fascia and disposing it inside the housing adjacent to the display opening. Providing the fascia includes providing a substrate that comprises a front side facing the display opening and a rear side facing an inner portion of the housing. The method further includes providing a wireless transceiver and disposing it on the rear side of the substrate and configuring the wireless transceiver to communicatively couple to a wireless device through an opening of the substrate.

[0009] A communication system for improving the accessibility of an interface is provided. According to one embodiment, the communication system comprises a wireless device and a fascia disposed inside the housing of the interface. The fascia has a substrate and a wireless transceiver. The substrate has a front side facing the display opening of the housing and a rear side. The wireless transceiver is disposed on the rear side of the substrate and configured to communicatively couple to the wireless device through an opening of the substrate.

[0010] An instrument electronic device is provided for improving the accessibility of an interface. According to one embodiment, the instrument electronic device includes a processor disposed on an electronic device substrate and a component disposed on the electronic device substrate, the component being coupled to a pin of the processor, and the pin of the processor being configured to couple to a component of a display substrate coupled to the electronic device substrate. The component of the display substrate is redundant with respect to the component of the electronic device substrate.

[0011] A method for improving the accessibility of an interface is provided. According to one embodiment, the method includes providing a processor and disposing it on an electronic device substrate, providing a component and disposing it on the electronic device substrate, coupling the component to a pin of the processor, and configuring the pin of the processor to couple to a component of a display substrate coupled to the electronic device substrate. The component of the display substrate is redundant with respect to the component of the electronic device substrate.

[0012] An interface having improved accessibility is provided. According to one embodiment, the interface includes a housing, a fascia disposed inside the housing and proximate to an opening of the housing, and a translation rod pivotally coupled to the fascia, the translation rod being configured to displace the fascia through the opening of the housing.

[0013] A method for improving the accessibility of an interface is provided. According to one embodiment, the method includes providing a housing, providing a fascia and disposing it inside the housing proximate to an opening of the housing, and providing a translation rod and pivotally coupling it to the fascia, the translation rod being configured to displace the fascia through the opening of the housing.

[0014] A method for improving the accessibility of an interface is provided. According to one embodiment, the method includes displacing a fascia through an opening in a housing along a translation axis, the fascia being configured to perform at least one of rotating about the translation axis and pivoting about a pivot axis.

[0015] A method for improving the accessibility of an interface is provided. According to one embodiment, the method includes determining an operating value and adjusting a drive voltage provided to a display based on the determined operating value and a drive voltage - actual contrast relationship. The operating value corresponds to the temperature of an instrument electronics device that provides the drive voltage.

[0016] An instrument electronics device for improving the accessibility of an interface is provided. According to one embodiment, the instrument electronics device includes a processor configured to determine an operating value and a display drive circuit configured to provide a drive voltage to a display and adjust the drive voltage based on the operating value and a drive voltage - actual contrast relationship. The operating value corresponds to the temperature of the instrument electronics device that provides the drive voltage.

[0017] [Aspect] According to one aspect, an interface (402, 502, 602, 1202) with improved accessibility comprises a housing (430, 530, 630, 1230) and an instrument electronics device (420, 520, 620, 1220) disposed inside the housing (430, 530, 630, 1230). The instrument electronics device (420, 520 , 620, 1220) is configured to be fixed to a connector (450, 550, 650, 1250) that extends into the housing (430, 530, 630, 1230).

[0018] Preferably, the housing (530, 1230) is rotatably coupled to a connector (550, 1250) that extends into the housing (530, 1230).

[0019] Preferably, the instrument electronic device (1220) includes an electronic device substrate (1220b) and a shell (1220s) fixed to the electronic device substrate (1220b), and the shell (1220s) is configured to be fixed to a connector (1250) extending into the housing (1230).

[0020] Preferably, the connectors (450, 550 , 650, 1250) extending into the housings (430, 530, 630, 1230) are part of the feedthroughs (415, 515, 615, 1215) extending from one of the sensor assembly and the junction box.

[0021] Preferably, the interfaces (602, 1202) further include receiving disks (617, 1217) rotatably disposed around the connectors (650, 1250), and at least a part of the receiving disks (617, 1217) is disposed between the retaining rings (618, 1218) of the connectors (650, 1250) and the walls (632, 1232) of the housings (630, 1230).

[0022] Preferably, the instrument electronic device (1220) further includes a post (1224p) configured to fit into a groove (1217g) of the receiving disk (1217), and a bolt (1224b) configured to fit into a threaded hole (1217h) of the receiving disk (1217).

[0023] Preferably, the receiving disks (617, 1217) include lobes (617l, 1217l) that join with one of the grooves (618g) and lips (1218b) of the retaining rings (618, 1218) to hold the instrument electronic devices (620, 1220) to the connectors (650, 1250) extending into the housings (630, 1230).

[0024] Preferably, the instrument electronics (1220) includes a lower instrument electronics (1224) configured to be fixed to a connector (1250) extending into the housing (1230), and an upper instrument electronics (1222) configured to be fixed to the housing (1230) and communicatively coupled to the lower instrument electronics (1224).

[0025] According to one embodiment, a method for assembling an interface with improved accessibility includes providing a housing, providing instrument electronics and disposing the instrument electronics within the housing, providing a connector and extending the connector into the housing, and fixing the instrument electronics to the connector extending into the housing.

[0026] Preferably, the method further includes rotatably coupling the housing to the connector extending into the housing.

[0027] Preferably, providing instrument electronics and disposing the instrument electronics inside the housing includes providing an electronics substrate, providing a shell and fixing the shell to the electronics substrate, providing a connector and extending the connector into the housing, and fixing the shell to the connector extending into the housing.

[0028] Preferably, providing a connector and extending the connector into the housing includes providing a feedthrough and extending the feedthrough into the housing from one of a sensor assembly and a junction box.

[0029] Preferably, the method further includes providing a receiving disk and rotatably disposing the receiving disk around the connector, with at least a portion of the receiving disk disposed between a retaining ring of the connector and a wall of the housing.

[0030] ​Preferably, providing the instrument electronic device further includes providing a post, and providing the receiving disk includes providing grooves and screw holes in the receiving disk. The method further includes providing bolts. The post is configured to fit into the groove, and the bolt is configured to fit into the screw hole of the receiving disk.

[0031] Preferably, providing the receiving disk includes providing a lobe that joins with one of the grooves and lips of the retaining ring to hold the instrument electronic device against a connector extending into the housing.

[0032] Preferably, providing the instrument electronic device includes providing a lower instrument electronic device configured to be fixed to a connector extending into the housing, and providing an upper instrument electronic device configured to be fixed to the housing and communicatively coupled to the lower instrument electronic device.

[0033] According to one aspect, an interface (2202) with improved accessibility includes a housing (2230) and an instrument electronic device (2220). The instrument electronic device (2220) includes an upper instrument electronic device (2222), a lower instrument electronic device (2224), and a barrier plate (2223) disposed between and coupled to the upper instrument electronic device (2222) and the lower instrument electronic device (2224). The interface (2202) also includes a gasket (2230o) disposed in contact between the barrier plate (2223) and the housing (2230) to form a watertight seal separating the upper instrument electronic device portion (2230u) of the housing (2230) from the lower instrument electronic device portion (2230l) of the housing (2230).

[0034] Preferably, the barrier plate (2223) has no holes extending through the interior of the barrier plate (2223) to reach the gasket (2230o ).

[0035] Preferably, the gasket (2230o) is arranged between the housing (2230) and the barrier plate (2223). It includes a compressed O-ring.

[0036] Preferably, the gasket (2230o) arranged in contact between the barrier plate (2223) and the housing (2230) includes the gasket (2230o) arranged in contact between the boss (2230s) of the housing (2230) and the barrier plate (2223).

[0037] Preferably, the interface (2202) is arranged close to the gasket (2230o). It further includes a plurality of fasteners (2230b) configured to fix the barrier plate (2223) to the boss (2230s) of the housing (2230).

[0038] Preferably, the plurality of fasteners (2230b) are arranged on at least one of the upper instrument electronics part (2230u) of the housing (2230) and the lower instrument electronics part (2230l) of the housing (2230). (2230u) and at least one of the lower instrument electronics part (2230l) of the housing (2230).

[0039] Preferably, the plurality of fasteners (2230b) are arranged into the boss (2230s) of the housing (2230) through the barrier plate (2223).

[0040] According to one aspect, a method of assembling an interface with improved accessibility includes providing a housing and providing instrument electronics. Providing the instrument electronics includes providing upper instrument electronics, providing lower instrument electronics, providing a barrier plate and arranging it between the upper instrument electronics and the lower instrument electronics, and coupling the barrier plate to the upper instrument electronics and the lower instrument electronics. The method also includes arranging a gasket between the barrier plate and the housing so as to form a watertight seal separating the upper instrument electronics part of the housing from the lower instrument electronics part of the housing, and contacting the barrier plate and the gasket.​​

[0041] Preferably, providing the barrier plate includes forming a barrier plate having no holes reaching the gasket beyond the interior of the barrier plate.

[0042] Preferably, providing the gasket includes providing an O-ring and compressing the O-ring between the housing and the barrier plate.

[0043] Preferably, disposing the gasket between the barrier plate and the housing and contacting the barrier plate and the housing includes disposing the gasket between the barrier plate and a boss of the housing and contacting the barrier plate and the boss of the housing.

[0044] Preferably, the method further includes disposing a plurality of fasteners in proximity to the gasket and using the plurality of fasteners to secure the barrier plate to a boss of the housing.

[0045] Preferably, the method further includes disposing a plurality of fasteners on at least one of an upper instrumentation electronics portion of the housing and a lower instrumentation electronics portion of the housing.

[0046] Preferably, the method further includes disposing a plurality of fasteners through the barrier plate and into a boss of the housing.

[0047] According to one aspect, an interface (2502) having improved accessibility includes a housing (2530) having a display opening (2532) and a fascia (2540) disposed within the housing (2530) in proximity to the display opening (2532). The fascia (2540) includes a substrate (2540b) and a wireless transceiver (2548), and the substrate (2540b ) includes a front side (2540ba) facing the display opening (2532) and a rear side (2540bp) facing the inner part of the housing (2530). The wireless transceiver (2548) is disposed on the rear side (2540bp) of the substrate (2540b) and is configured to be communicatively coupled to the wireless device (2501) through the opening (2540bo) of the substrate (2540b).

[0048] Preferably, the fascia (2540) is a fascia mechanically coupled to the substrate (2540b). It further includes a chassis (2543), and the fascia chassis (2543) includes a slot (2543s) proximate to the wireless transceiver (2548).

[0049] Preferably, the display (2544) is coupled to the front side (2540ba) of the substrate (2540b). There is.

[0050] Preferably, the display (2544) is disposed proximate to the opening (2540bo) of the substrate (2540b). It is arranged.

[0051] Preferably, the display (2544) is disposed opposite to the wireless transceiver (2548) on the substrate (2540b). Preferably, the wireless transceiver (2548) is an antenna (2548a) disposed proximate to the opening (2540bo ) in the substrate (2540b) and the slot (2543s) in the fascia chassis (2543). It includes.

[0052] According to one embodiment, a method of forming an interface having improved accessibility includes providing a housing having a display opening and providing a fascia and disposing the fascia inside the housing in proximity to the display opening. Providing the fascia includes providing a substrate having a front side facing the display opening and a rear side facing an interior portion of the housing. The method further includes providing a wireless transceiver and disposing the wireless transceiver on the rear side of the substrate and configuring the wireless transceiver to communicatively couple to a wireless device through an opening in the substrate.

[0053] Preferably, providing the fascia further includes providing a fascia chassis and mechanically coupling the fascia chassis to the substrate such that a slot in the fascia chassis is in proximity to the wireless transceiver.

[0054] Preferably, the method further includes providing a display and coupling the display to the front side of the substrate.

[0055] Preferably, the method further includes disposing the display in proximity to the opening in the substrate.

[0056] Preferably, the method further includes disposing the display to face the wireless transceiver on the substrate.

[0057] Preferably, providing the wireless transceiver includes providing an antenna and disposing the antenna with respect to the opening in the substrate and the slot in the fascia chassis.

[0058] According to one aspect, a communication system (2500) for improving the accessibility of an interface (2502) includes a wireless device (2501) and a fascia (2540) disposed inside a housing (2530) of the interface (2502). The fascia (2540) has a substrate (2540b) and a wireless transceiver (2548). The substrate (2540b) has a front side (2540ba) facing a display opening (2532) of the housing (2530) and a rear side (2540bp). The wireless transceiver (2548) is disposed on the rear side (2540bp) of the substrate (2540b) and is configured to communicably couple to the wireless device (2501) through an opening (2540bo) of the substrate (2540b).

[0059] Preferably, the fascia (2540) further includes a fascia chassis (2543) mechanically coupled to the substrate (2540b). The fascia chassis (2543) includes a slot (2543s) proximate to the wireless transceiver (2548).

[0060] Preferably, the communication system (2500) further includes a display (2544) coupled to the front side (2540ba) of the substrate (2540b).

[0061] Preferably, the display (2544) is disposed proximate to the opening (2540bo) of the substrate (2540b).

[0062] Preferably, the display (2544) is disposed opposite to the wireless transceiver (2548).

[0063] Preferably, the wireless transceiver (2548) is disposed proximate to the opening (2540bo) in the substrate (2540b) and the slot (2543s) in the fascia chassis (2543). ​​​​​​ It includes a holder (2548a).

[0064] According to one aspect, an instrument electronic device (3220) for improving the accessibility of an interface (3202) includes a processor (3228) disposed on an electronic device substrate (3220b) and an electronic component (3226) disposed on the electronic device substrate (3220b). The component (3226) is coupled to a pin of the processor (3228), and the pin of the processor (3228) is configured to be coupled to a component (3246) of a display substrate (3240b) coupled to the electronic device substrate (3220b ). The component (3246) of the display substrate (3240b) is redundant with respect to the component (3226) of the electronic device substrate (3220b). Preferably, the pin of the processor (3228) is configured to be coupled to the component (3246) of the display substrate (3240b) via a connector (3247) that couples the display substrate (3240b) to the electronic device substrate (3220b).

[0065] Preferably, the component (3226) of the electronic device substrate (3220b) is one of a light-emitting diode (3226l) and a switch (3226s) of the electronic device substrate (3220b), and the component (3246) of the display substrate (3240b) is one of a light-emitting diode (3246l) and a switch (3246s) of the display substrate (3240b).

[0066] Preferably, the pin of the processor (3228) is coupled to a first terminal of the component (3226

[0067] ) of the electronic device substrate (3220b), and a second terminal of the component (3226) is coupled to ground (3220g).

[0068] ​​​​Preferably, the instrument electronic device (3220) further includes a display substrate (3240b), and the pins of the processor (3228) are coupled to components (3246) of the display substrate (3240b). The pins of the processor (3228) are coupled to components (3246) of the display substrate (3240b). Thereof.

[0069] Preferably, the pins of the processor (3228) are coupled to the first terminals of the components (3246) of the display substrate (3240b), and the second terminals of the components (3246) of the display substrate (3240b) are coupled to ground (3220g).

[0070] Preferably, the instrument electronic device (3220) further includes amplifiers (3222a, 3222b) having outputs coupled to components (3226) disposed within the electronic device substrate (3220), and the amplifiers (3222a, 3222b) are inverters configured to invert signals from the processor (3228) to the components (3226).

[0071] According to one embodiment, a method for improving the accessibility of an interface includes providing a processor and disposing it on an electronic device substrate, providing components and disposing them on the electronic device substrate, coupling the components to pins of the processor, and configuring the pins of the processor to be coupled to components of a display substrate coupled to the electronic device substrate. The components of the display substrate are redundant with respect to the components of the electronic device substrate.

[0072] Preferably, configuring the pins of the processor to be coupled to components of the display substrate includes configuring the pins to be coupled to components of the display substrate via a connector that couples the display substrate to the electronic device substrate.

[0073] Preferably, providing components of the electronic device substrate includes providing one of a light emitting diode and a switch of the electronic device substrate, and providing components of the display substrate Providing one of a light emitting diode and a switch of a display substrate is included. Preferably, coupling a component to a pin of a processor includes coupling the pin of the processor to a first terminal of a component of an electronic device substrate and coupling a second terminal of the component to ground.

[0074] Preferably, the method further includes providing a display substrate and coupling a pin of a processor to a component of the display substrate.

[0075] Preferably, coupling a pin of a processor to a component of a display substrate includes coupling the pin of the processor to a first terminal of a component of the display substrate and coupling a second terminal of the component of the display substrate to ground.

[0076] Preferably, the method further includes providing an amplifier having an output and coupling the output to a component disposed within an electronic device substrate that is an inverter configured to invert a signal from the processor to the component.

[0077] According to one aspect, an interface (3402) having improved accessibility includes a housing (3430), a fascia (3440) disposed inside the housing (3430) and adjacent to an opening (3430o) of the housing (3430), and a translation rod (3440t) pivotally coupled to the fascia (3440), and the translation rod (3440t) is configured to displace the fascia (3440) through the opening (3430o) of the housing (3430). Preferably, the translation rod (3440t) pivotally coupled to the fascia (3440) rotates about a translation axis (3440at) that is collinear with the longitudinal axis of the translation rod (3440t).

[0078] Preferably, the translation rod (3440t) pivotally coupled to the fascia (3440) is rotating about a translation axis (3440at) that is collinear with the longitudinal axis of the translation rod (3440t). including a fascia (3440) configured as such.

[0079] Preferably, the translation rod (3440t) pivotally coupled to the fascia (3440) rotates about a pivot axis (3440ap) orthogonal to the longitudinal axis of the translation rod (3440t), and includes a fascia (3440) configured as such. including a fascia (3440) configured as such.

[0080] Preferably, the translation rod (3440t) configured to displace the fascia (3440) through the opening (3430o) of the housing (3430) includes a translation rod (3440t) configured to displace the fascia (3440) in a direction collinear with the longitudinal axis of the translation rod (3440t).

[0081] Preferably, the translation rod (3440t) is pivotally coupled to the fascia (3440) at the pivot point (3440p).

[0082] Preferably, the pivot point (3440p) is located at a place where the pivot axis (3440ap) and the translation axis (3440at) coincide. Here, the fascia (3440) pivots about the pivot axis (3440ap) and rotates about the translation axis (3440at).

[0083] According to one aspect, a method for improving the accessibility of an interface includes providing a housing, providing a fascia and disposing it inside the housing in proximity to the opening of the housing, providing a translation rod and pivotally coupling it to the fascia, and the translation rod is configured to displace the fascia through the opening of the housing.

[0084] Preferably, pivotally coupling the translation rod to the fascia includes configuring the fascia to rotate about a translation axis collinear with the longitudinal axis of the translation rod.

[0085] ​​​ Preferably, pivotally coupling the translation rod to the fascia includes configuring the fascia to rotate about a pivot axis orthogonal to the longitudinal axis of the translation rod.

[0086] Preferably, configuring the translation rod to displace the fascia through the opening of the housing includes configuring the translation rod to displace the fascia in a direction along the same straight line as the longitudinal axis of the translation rod.

[0087] Preferably, pivotally coupling the translation rod to the fascia includes pivotally coupling the translation rod to the fascia at a pivot point.

[0088] Preferably, the pivot point is located where the pivot axis and the translation axis coincide, where the fascia pivots about the pivot axis and rotates about the translation axis.

[0089] According to one aspect, a method for improving the accessibility of an interface includes displacing a fascia through an opening of a housing along a translation axis, the fascia being configured to perform at least one of rotating about the translation axis and pivoting about a pivot axis.

[0090] Preferably, the method further includes at least one of rotating the fascia about the translation axis and pivoting the fascia about the pivot axis.

[0091] Preferably, the translation axis and the pivot axis are co-localized at a pivot point, and the fascia is configured to rotate and pivot about the pivot point.

[0092] According to one aspect, a method for improving the accessibility of an interface includes determining an operating value and adjusting a drive voltage provided to a display based on the determined operating value and a drive voltage - actual contrast relationship. The operating value corresponds to the temperature of the instrument electronics that provides the drive voltage.

[0093] Preferably, the method further includes determining a contrast value based on the determined operating value and the drive voltage - actual contrast relationship, and adjusting the drive voltage based on the contrast value.

[0094] Preferably, the method further includes setting a register value in the display driving circuit based on the determined contrast value.

[0095] Preferably, the operating value is the drive voltage provided to the display.

[0096] Preferably, the method further includes determining a contrast value from the relationship between the drive voltage and the contrast value.

[0097] Preferably, the operating value is the temperature of the instrument electronics that provides the drive voltage to the display.

[0098] Preferably, the method further includes determining a contrast value based on the relationship between the temperature of the instrument electronics and the contrast value.

[0099] According to one embodiment, an instrument electronics device (4420) for improving the accessibility of an interface includes a processor (4420p) configured to determine an operating value, and a display (4440) and a display driving circuit (4420d) configured to provide a driving voltage to the display and adjust the driving voltage based on the operating value and the driving voltage - actual contrast relationship. The operating value corresponds to the temperature of the instrument electronics that provides the drive voltage.

[0100] Preferably, the processor (4420p) is further configured to determine a contrast value based on the determined operating value and the drive voltage - actual contrast relationship and adjust the drive voltage based on the contrast value.

[0101] Preferably, the instrument electronic device (4420) is further configured to set a register value in the display drive circuit (4420d) based on the determined contrast value.

[0102] Preferably, the operating value is a drive voltage provided to the display (4440).

[0103] Preferably, the processor (4420p) is further configured to determine the contrast value from the relationship between the drive voltage and the contrast value.

[0104] Preferably, the operating value is the temperature of the instrument electronic device (4420) that provides the drive voltage to the display (4440).

[0105] Preferably, the processor (4420p) is further configured to determine the contrast value based on the relationship between the temperature of the instrument electronic device (4420) and the contrast value.

Brief Description of the Drawings

[0106] It should be understood that the same reference numerals represent the same elements on all the drawings. The drawings are not necessarily to scale.

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[0107] FIGS. 1-47 and the following description show specific examples for teaching those skilled in the art how to create and use the best mode of an embodiment of an interface with improved accessibility. To teach the principles of the present invention, some conventional aspects have been simplified or omitted. Those skilled in the art will understand variations from these examples that fall within the scope of this specification. Those skilled in the art will understand that the features described below can be combined in various ways to form multiple variations of the use of an interface with improved accessibility. As a result, the embodiments described below are not limited to the specific examples described below, but are limited only by the claims and their equivalents.

[0108] FIG. 1 shows a vibrating instrument 5 having an interface 2 with improved accessibility. As shown in FIG. 1, the vibrating instrument 5 includes a sensor assembly 10 mechanically and communicatively coupled to the interface 2 via a feedthrough 15. The sensor assembly 10 can be inserted into the pipeline with flanges 10a, 1 0b to receive and measure the material and return it to the pipeline. The interface 2 has improved accessibility.

[0109] ​For example, the interface 2 can rotate with respect to the sensor assembly 10, making the display of the interface 2 more visible. The interface 2 can also be configured to be more easily serviced, for example, by allowing the display to be removed and rotated without separating it from the interface 2. The improved accessibility also includes an improvement in the way the interface 2 operates. For example, the contrast of the display within the interface 2 can be automatically adjusted to be visible under different environmental conditions. The display can also be automatically detected by the instrumentation electronics within the interface 2, thereby simplifying the configuration. These and other aspects will be described in more detail below. The interface 2 can rotate with respect to the sensor assembly 10, making the display of the interface 2 more visible. The interface 2 can also be configured to be more easily serviced, for example, by allowing the display to be removed and rotated without separating it from the interface 2. The improved accessibility also includes an improvement in the way the interface 2 operates. For example, the contrast of the display within the interface 2 can be automatically adjusted to be visible under different environmental conditions. The display can also be automatically detected by the instrumentation electronics within the interface 2, thereby simplifying the configuration. These and other aspects will be described in more detail below. The interface 2 can rotate with respect to the sensor assembly 10, making the display of the interface 2 more visible. The interface 2 can also be configured to be more easily serviced, for example, by allowing the display to be removed and rotated without separating it from the interface 2. The improved accessibility also includes an improvement in the way the interface 2 operates. For example, the contrast of the display within the interface 2 can be automatically adjusted to be visible under different environmental conditions. The display can also be automatically detected by the instrumentation electronics within the interface 2, thereby simplifying the configuration. These and other aspects will be described in more detail below. The interface 2 can rotate with respect to the sensor assembly 10, making the display of the interface 2 more visible. The interface 2 can also be configured to be more easily serviced, for example, by allowing the display to be removed and rotated without separating it from the interface 2. The improved accessibility also includes an improvement in the way the interface 2 operates. For example, the contrast of the display within the interface 2 can be automatically adjusted to be visible under different environmental conditions. The display can also be automatically detected by the instrumentation electronics within the interface 2, thereby simplifying the configuration. These and other aspects will be described in more detail below. The interface 2 can rotate with respect to the sensor assembly 10, making the display of the interface 2 more visible. The interface 2 can also be configured to be more easily serviced, for example, by allowing the display to be removed and rotated without separating it from the interface 2. The improved accessibility also includes an improvement in the way the interface 2 operates. For example, the contrast of the display within the interface 2 can be automatically adjusted to be visible under different environmental conditions. The display can also be automatically detected by the instrumentation electronics within the interface 2, thereby simplifying the configuration. These and other aspects will be described in more detail below. The interface 2 can rotate with respect to the sensor assembly 10, making the display of the interface 2 more visible. The interface 2 can also be configured to be more easily serviced, for example, by allowing the display to be removed and rotated without separating it from the interface 2. The improved accessibility also includes an improvement in the way the interface 2 operates. For example, the contrast of the display within the interface 2 can be automatically adjusted to be visible under different environmental conditions. The display can also be automatically detected by the instrumentation electronics within the interface 2, thereby simplifying the configuration. These and other aspects will be described in more detail below.

[0110] FIG. 2 shows a vibratory instrument 5 including an interface 2 with improved accessibility, where the housing for the interface 2 and the sensor assembly 10 is not shown for clarity. As shown in FIG. 1, the vibratory instrument 5 includes a sensor assembly 10 and instrumentation electronics 20, and the instrumentation electronics 20 are disposed within the rotatable interface 2 shown in FIG. 1. The sensor assembly 10 responds to the mass flow rate and density of the process material. The instrumentation electronics 20 are connected to the sensor assembly 10 via a lead wire 100 to provide density, mass flow rate, and temperature information, as well as other information, via a port 26.

[0111] The sensor assembly 10 includes a pair of manifolds 150 and 150', flanges 103 and 103' having flange necks 110 and 110', a pair of parallel conduits 130 and 130', a driver 180, a resistive temperature detector (RTD) 190, and a pair of pickup sensors 170l and 170r. The conduits 130 and 130' include two substantially straight inlet legs 131 and 131', and a conduit The sensor assembly 10 includes a pair of manifolds 150 and 150', flanges 103 and 103' having flange necks 110 and 110', a pair of parallel conduits 130 and 130', a driver 180, a resistive temperature detector (RTD) 190, and a pair of pickup sensors 170l and 170r. The conduits 130 and 130' include two substantially straight inlet legs 131 and 131', and a conduit The sensor assembly 10 includes a pair of manifolds 150 and 150', flanges 103 and 103' having flange necks 110 and 110', a pair of parallel conduits 130 and 130', a driver 180, a resistive temperature detector (RTD) 190, and a pair of pickup sensors 170l and 170r. The conduits 130 and 130' include two substantially straight inlet legs 131 and 131', and a conduit The sensor assembly 10 includes a pair of manifolds 150 and 150', flanges 103 and 103' having flange necks 110 and 110', a pair of parallel conduits 130 and 130', a driver 180, a resistive temperature detector (RTD) 190, and a pair of pickup sensors 170l and 170r. The conduits 130 and 130' include two substantially straight inlet legs 131 and 131', and a conduit It has outlet legs 134 and 134' that converge towards each other in the pipe attachment blocks 120 and 120'. The conduits 130 and 130' bend at two symmetric positions along their lengths and are essentially parallel throughout their lengths. Brace bars 140 and 140' function to define axes W and W' about which the respective conduits 130, 130' oscillate. The legs 131, 131' and 134, 134' of the conduits 130 and 130' are fixedly attached to the pipe attachment blocks 120 and 120', and these blocks are fixedly attached to the manifolds 150 and 150'. This provides a continuous closed material path through the sensor assembly 10. They are essentially parallel throughout their lengths. Brace bars 140 and 140' function to define axes W and W' about which the respective conduits 130, 130' oscillate. The legs 131, 131' and 134, 134' of the conduits 130 and 130' are fixedly attached to the pipe attachment blocks 120 and 120', and these blocks are fixedly attached to the manifolds 150 and 150'. This provides a continuous closed material path through the sensor assembly 10.

[0112] When flanges 103 and 103' having holes 102 and 102' are connected to a process line (not shown) that conveys the measured process material via the inlet end 104 and the outlet end 104', the material enters the inlet end 104 of the instrument through the orifice 101 in the flange 103 and is guided to the pipe attachment block 120 having a surface 121 through the manifold 150. In the manifold 150, the material is divided and sent through the conduits 130, 130'. When exiting the conduits 130, 130', the process material recombines into a single stream within the block 120' having a surface 121' and the manifold 150', and is then sent to the outlet end 104' that is connected to the process line (not shown) by the flange 103' having the hole 102'. In the manifold 150, the material is divided and sent through the conduits 130, 130'. When exiting the conduits 130, 130', the process material recombines into a single stream within the block 120' having a surface 121' and the manifold 150', and is then sent to the outlet end 104' that is connected to the process line (not shown) by the flange 103' having the hole 102'. When exiting the conduits 130, 130', the process material recombines into a single stream within the block 120' having a surface 121' and the manifold 150', and is then sent to the outlet end 104' that is connected to the process line (not shown) by the flange 103' having the hole 102'.

[0113] The conduits 130, 130' are selected to have substantially the same mass distribution, moment of inertia, and Young's modulus about the bending axes W-W and W'-W' respectively, and are suitably attached to the conduit mounting blocks 120, 120'. These bending axes pass through the brace bars 140, 140'. As long as the Young's modulus of the conduit varies with temperature and this variation affects the calculation of flow rate and density, the RTD 190 is attached to the conduit 130' to continuously measure the temperature of the conduit 130'. The temperature of the conduit 130', and thus the voltage seen by the RTD 190 for a given current passing through, is determined by the temperature of the material passing through the conduit 130'. The temperature-dependent voltage seen by the RTD 190 is used in a well-known manner by the instrumentation electronics 20 to compensate for any change in the modulus of elasticity of the conduits 130, 130' due to any change in conduit temperature. The RTD 190 is connected to the instrumentation electronics 20 by leads that carry the RTD signal 195. The voltage across the RTD 190 is determined by the temperature of the material passing through the conduit 130'. The temperature-dependent voltage seen by the RTD 190 is used in a well-known manner by the instrumentation electronics 20 to compensate for any change in the modulus of elasticity of the conduits 130, 130' due to any change in conduit temperature. The RTD 190 is connected to the instrumentation electronics 20 by leads that carry the RTD signal 195.

[0114] Both of the conduits 130, 130' are driven by the driver 180 in opposite directions about their respective bending axes W and W' and in a mode called the first out-of-phase bending mode of the flowmeter. The driver 180 can include any one of a number of well-known configurations such as a magnet attached to the conduit 130' and opposing coils to which an alternating current flows to vibrate both conduits 130, 130' and which are attached to the conduit 130. A suitable drive signal 185 is applied by the instrumentation electronics 20 to the driver 180 via the leads. A suitable drive signal 185 is applied by the instrumentation electronics 20 to the driver 180 via the leads.

[0115] The instrumentation electronics 20 receives the RTD signal 195 on the lead wire, as well as the sensor signals 165 seen on the lead wire 100 that carry the left sensor signal 165l and the right sensor signal 165r, respectively. The instrumentation electronics 20 generates a drive signal 185 seen on the lead wire to the driver 180 to vibrate the conduits 130, 130'. The instrumentation electronics 20 processes the left and right sensor signals 165l, 165r and the RTD signal 195 to calculate the mass flow rate and density of the material passing through the sensor assembly 10. This information, along with other information, is applied by the instrumentation electronics 20 as a signal via path 26. A more detailed discussion of the vibratory meter 5 and the instrumentation electronics 20 follows below.

[0116] Figure 3 shows a block diagram of the vibratory meter 5, including a block diagram representation of the instrumentation electronics 20. As shown in Figure 2, the instrumentation electronics 20 is communicatively coupled to the sensor assembly 10. As previously described with reference to Figure 2, the sensor assembly 10 includes left and right pickoff sensors 170l, 170r, a driver 180, and an RTD 190, which are communicatively coupled to the instrumentation electronics 20 via a set of lead wires 100 through communication channel 112.

[0117] The instrumentation electronics 20 provides the drive signal 185 via the lead wire 100. More specifically, the instrumentation electronics 20 provides the drive signal 185 to the driver 180 within the sensor assembly 10. In addition, the sensor signals 165, including the left sensor signal 165l and the right sensor signal 165r, are provided by the sensor assembly 10. More specifically, in the illustrated embodiment, the sensor signals 165 are provided by the left and right pickoff sensors 170l, 170r within the sensor assembly 10. As can be understood, the sensor signals 165 are provided to the instrumentation electronics 20 respectively through the communication channel 112.

[0118] The instrument electronic device 20 includes a processor 210 communicatively coupled to one or more signal processors 220 and one or more memories 230. The processor 210 is also communicatively coupled to a user interface 30. The processor 210 is communicatively coupled to a host via a communication port across port 26 and receives power via power port 250. The proces sor 210 may be a microprocessor, but any suitable processor may be utilized as well. For example, the processor 210 may be composed of sub-processors such as a multi-core processor, a serial communication port, a peripheral interface (e.g., a serial peripheral interface), on-chip memory, I / O ports, etc. In these and other embodiments, the processor 210 is configured to perform operations on received and processed signals such as digitized signals.

[0119] The processor 210 can receive digitized sensor signals from one or more signal processors 220. The processor 210 can also receive signals from any transducer, such as a viscometer or hydrometer, via, for example, a port. That is, the transducer can be communicatively coupled to the processor 210 via port 26. The trans ducer may be fluid-coupled to the sensor assembly 10. One or more transducers may be upstream and / or downstream of the sensor assembly 10. Thus, the processor 210 can be configured to use the digitized sensor signals and / or signals provided by the transducer to determine fluid properties such as mass flow rate, density, viscosity, etc. The processor 210 can also handle conditions such as time delay, properties of the fluid within the sensor assembly 10, etc.

[0120] ​​​​The processor 210 is configured to provide information to the host through the port 26. The processor 210 may also be in communication with one or more memories 230. , may be configured to receive and / or store information in one or more memories 230. For example, the processor 210 may receive calibration coefficients and The calibration factor and / or the sensor assembly zero (e.g., time difference when there is no flow) can be received. Each of the calibration factor and / or the sensor assembly zero can be received by the vibration instrument 5 and / or the or the sensor assembly 10, respectively. The numbers can be used to process the received digitized sensor signals from one or more signal processors 220.

[0121] The one or more signal processors 220 are shown as consisting of an encoder / decoder (CODEC) 222 and an analog-to-digital converter (ADC) 226. The signal processors 220 condition the analog signals and digitize the conditioned analog signals. The CODEC 222 may provide digitalized and / or digitized signals. The CODEC 222 is configured to receive the sensor signals 165 from the left and right pickoff sensors 170l, 170r. The CODEC 222 is also configured to provide a drive signal 185 to the driver 180. In the embodiment, more or fewer signal processors may be utilized.

[0122] As shown, the sensor signal 165 is provided to the CODEC 222 via the signal conditioner 240. The drive signal 185 is provided to the driver 180 via the signal conditioner 240. Although the signal conditioner 240 is shown as a single block, the signal conditioner 240 may be composed of signal conditioning components such as two or more operational amplifiers, filters such as low-pass filters, voltage-current amplifiers, and the like. For example, the sensor signal 165 may be amplified by a first amplifier, and the drive signal 185 may be amplified by a voltage-current amplifier. Amplification can ensure that the magnitude of the sensor signal 165 is close to the full-scale range of the CODEC 222.

[0123] In the illustrated embodiment, one or more memories 230 are composed of a read-only memory (ROM) 232, a random access memory (RAM) 234, and a ferroelectric random access memory (FRAM (registered trademark)) 236. However, in alternative embodiments, one or more memories 230 may be composed of more or fewer memories. Additionally or alternatively , one or more memories 230 may be composed of different types of memories (e.g., volatile, non-volatile, etc.). For example, instead of the FRAM 236, different types of non-volatile memories such as, for example, an erasable programmable read-only memory (EPROM) may be utilized. One or more memories 230 may be a storage device configured to store process data such as drive signals or sensor signals, mass flow rates, or density measurements.

[0124] Mass flow rate measurement

Number

Number

[0125] With respect to density, the resonant frequency at which each conduit 130, 130' vibrates may be a function of the square root of the spring constant of the conduit 130, 130' divided by the total mass of the conduit 130, 130' with the material. The total mass of the conduit 130, 130' with the material may be the mass of the conduit 130, 130' plus the mass of the material in the conduit 130, 130'. The mass of the material in the conduit 130, 130' is directly proportional to the density of the material. Thus, the density of the material may be proportional to the square of the period at which the conduit 130, 130' containing the material vibrates multiplied by the spring constant of the conduit 130, 130'. Thus, the period at which the conduit 130, 130' vibrates may be the square of the period at which the conduit 130, 130' with the material vibrates. By determining and appropriately scaling the result, an accurate measure of the density of the material contained in the conduit 130, 130' can be obtained. The meter electronics 20 determines the sensor signal 165 and And / or the drive signal 185 can be used to determine the period or resonant frequency.

[0126] As mentioned above, the meter electronics 20 is located within the enhanced access interface 2. Also, as mentioned above, the accessibility of the interface 2 can be improved by simply assembling it. Beginning with the instrumentation electronics being fixed to the feed-through connector for purification and / or to enable the interface to rotate relative to the sensor assembly, it can be improved in various ways as described below.

[0127] [Instrumentation electronics attached to the connector] The instrumentation electronics may be connected to a connector that extends into the housing using a cable. However, using a cable can have associated problems. For example, the cable must be long enough to allow sufficient space between the housing and the instrumentation electronics to access the cable. That is, the user installing the cable on the connector must be able to access the cable. The cable can cause electromagnetic compatibility issues. For example, the cable may not have sufficient grounding to the connector and the ground or external body of the housing to prevent electromagnetic noise from interfering with some of the electronic components within the instrumentation electronics or the electronics outside the housing.

[0128] Figures 4 and 5 show block diagrams of vibratory instruments 405, 505 including interfaces 402, 502 with improved accessibility. The block diagrams can represent the vibratory instrument 5 described above, but the block diagrams can represent any suitable vibratory instrument. As shown in Figures 4 and 5, the interfaces 402, 502 are mechanically and / or communicatively coupled to the vibratory instruments 410, 510 via feed-throughs 415, 515. The instrumentation electronics 420, 520 are disposed within housings 430 , 530 and are fixed to connectors 450, 550 that extend into the housings 430, 530 . The instrumentation electronics 420, 520 are composed of upper instrumentation electronics 422, 522 and lower instrumentation electronics 424, 524. The lower instrumentation electronics 424, 524 are fixed to the connectors 450, 550.

[0129] As shown in FIG. 4, the upper instrument electronic device 422 is not fixed to the housing 430, and the lower and the upper instrument electronic devices 422 and 424 are fixed to each other. In addition, the housing 430 is firmly coupled to the connector 450. An exemplary embodiment of the interface 402 shown in FIG. 4 will be described with reference to FIGS. 6 and 7.

[0130] As shown in FIG. 5, the upper and lower instrument electronic devices 522 and 524 are not fixed to each other and are communicably coupled to each other via a cable 527. The upper instrument electronic device 522 shown in FIG. 5 is also fixed to the housing 530. The connector 550 shown in FIG. 5 extending into the housing 530 includes a connector flange 557. The connector flange 557 is shown as abutting against the housing flange 537. The connector flange 557 and the housing flange 537 are both axially compressed with respect to the longitudinal length of the connector 550. The connector flange 557 and the housing flange 537 are both pressed by a coupler 516. More specifically, the coupler 516 clamps around the connector flange 557 and the housing flange 537 so as to press both the housing flange 537 and the connector flange 557 together. The coupler 516 can also prevent lateral displacement and / or bending displacement of the housing flange 537 and the connector flange 557. An exemplary embodiment of the interface 502 will be described with reference to FIGS. 12 to 20 after an embodiment similar to the interface 402 shown in FIG. 4 has been described below. specifically, the coupler 516 clamps around the connector flange 557 and the housing flange 537 so as to press both the housing flange 537 and the connector flange 557 together. The coupler 516 can also prevent lateral displacement and / or bending displacement of the housing flange 537 and the connector flange 557. An exemplary embodiment of the interface 502 will be described with reference to FIGS. 12 to 20 after an embodiment similar to the interface 402 shown in FIG. 4 has been described below. to press both the housing flange 537 and the connector flange 557 together. The coupler 516 can also prevent lateral displacement and / or bending displacement of the housing flange 537 and the connector flange 557. An exemplary embodiment of the interface 502 will be described with reference to FIGS. 12 to 20 after an embodiment similar to the interface 402 shown in FIG. 4 has been described below. position and / or bending displacement of the housing flange 537 and the connector flange 557. An exemplary embodiment of the interface 502 will be described with reference to FIGS. 12 to 20 after an embodiment similar to the interface 402 shown in FIG. 4 has been described below. embodiment is described with reference to FIGS. 12 to 20 after an embodiment similar to the interface 402 shown in FIG. 4 has been described below.

[0131] [Non-rotatable housing] Figures 6 and 7 show partial perspective views of a vibratory instrument 605 including an interface 602 with improved accessibility. As shown in Figures 6 and 7, the interface 602 is mechanically and / or communicatively coupled to a sensor assembly (not shown for clarity) via a feedthrough 615. The feedthrough 615 extends into a housing 630 of the interface 602 and includes a connector 650. In Figure 7, the housing 630 is not shown in order to show how the instrument electronics 620 can be fixed to the connector 650. The interface 602 and the feedthrough 615 are similar to the interface 402 and the feedthrough 415 of Figure 4, respectively, in that the instrument electronics 620 is fixed to the connector 650 without necessarily fixing the instrument electronics 620 to the housing 630. Including a connector 650 that extends into the housing 630 of the interface 602. In Figure 7, the housing 630 is not shown in order to show how the instrument electronics 620 can be fixed to the connector 650. The interface 602 and the feedthrough 615 are similar to the interface 402 and the feedthrough 415 of Figure 4, respectively, in that the instrument electronics 620 is fixed to the connector 650 without necessarily fixing the instrument electronics 620 to the housing 630. The instrument electronics 620 may be similar to the interface 402 and the feedthrough 415 of Figure 4, respectively, in that the instrument electronics 620 is fixed to the connector 650.

[0132] As shown in Figure 6, the housing 630 includes a wall 632 that houses the instrument electronics 620. The housing 630 is coupled to the connector 650 by a coupler 616. The coupler 616 is shown as a clamp with screws, but any suitable coupler may be used. The coupler 616 Is used to hold the housing 630 against the connector 650, and the housing flange (not shown) of the housing 630 and the connector flange 657 (shown in Figure 7) of the connector 650 can be surrounded, included, engaged, or interfaced. Therefore, the coupler 616 Can firmly fix the housing 630 to the connector 650. Looking at Figure 7, the instrument electronics 620 is fixed to the connector 650 using a receiving disk 617. The instrument electronics 620 is coupled to the receiving disk 617 by two bolts 624b that extend through the instrument electronics 620 and into the threaded holder 617h of the receiving disk 617. The bolts 624b Can firmly fix the housing 630 to the connector 650.

[0133] Referring to Figure 7, the instrument electronics 620 is fixed to the connector 650 using a receiving disk 617. The instrument electronics 620 is coupled to the receiving disk 617 by two bolts 624b that extend through the instrument electronics 620 and into the threaded holder 617h of the receiving disk 617. The bolts 624b It can firmly fix the instrument electronic device 620 to the receiving disk 617. The receiving disk 617 surrounds, encloses, and couples the instrument electronic device 620 and the connector 650. In the example shown in FIG. 7, the receiving disk 617 is a clamp that engages with the connector 650, but any suitable receiving disk may be used. The receiving disk 617 can be configured to clamp immovably to the connector 650, thereby holding or firmly fixing the instrument electronic device 620 to the connector 650.

[0134] In particular, the receiving disk 617 may engage with the retaining ring 618 of the connector 650. As shown in FIG. 7, the receiving disk 617 includes lobes 617l that extend radially inwardly or internally towards the receiving disk 617, but any suitable engagement mechanism may be used. The receiving disk 617 is rotatably disposed about the connector 650. A portion of the receiving disk 617 is disposed between the retaining ring 618 and the wall 632 of the housing 630. The retaining ring 618 includes a circumferentially extending groove 618g around the connector 650, but any suitable retaining mechanism may be used. The lobe 617l extends into the groove 618g and joins with the groove. By fixing the instrument electronic device 620 to the connector 650, the internal portion of the housing 630 can be made more accessible, for example, to a user and / or a device servicing the interface 602.

[0135] More specifically, if the instrument electronic device is not configured to be fixed to a connector that extends into the housing of the interface, a cable may be required to communicatively couple the instrument electronic device to the connector. Since the instrument electronic device is disposed within the housing, the cable that couples the instrument electronic device to the connector must have a length sufficient to connect the cable to the connector while the instrument electronic device is at least partially outside the housing. That is, the space between the instrument electronic device and the inner portion of the housing must be sufficient to allow a hand or device to reach the instrument electronic device and to enable connection of the cable to the instrument electronic device.

[0136] As shown in FIGS. 6 and 7 and as described above, the instrument electronic device 620 is fixed to the connector 650 by using two bolts 624b that fix the instrument electronic device 620 to the receiving disk 617. The receiving disk 617 may be clamped at and / or around the connector 650. The receiving disk 617 is disposed inside the housing 630 around the connector 650. The receiving disk 617 may also be disposed around the connector flange 637 of the connector 650 to fix the instrument electronic device 620 to the connector 650 that extends into the housing 630. The housing 630 may also be fixed to the connector 650 by using a coupler 616. As described above, the coupler 616 may be any suitable coupler, such as the example described below with reference to FIGS. 8-11.

[0137] [Alternative Coupler] FIGS. 8 and 9 show an interface 802 with improved accessibility. In FIGS. 8 and 9 As shown, interface 802 is mechanically and / or communicatively coupled to a sensor assembly (not shown for clarity) via feedthrough 815. Interface 802 is mechanically coupled to the sensor assembly by using coupler 816. As shown in FIG. 8, coupler 816 is clamped around connector 850 that extends into housing 830 of interface 802. Coupler 816 is also clamped around a portion of housing 830 is clamped. As shown in FIG. 8, details of the clamped portions of the housing and connector 850 are not shown. As shown in FIG. 9, coupler 816 is removed from connector 850 and housing 830

[0138] The connector 850 shown in FIG. 9 that extends into housing 830 includes a connector flange 857. Connector flange 857 is shown as abutting housing flange 837. Connector flange 857 and housing flange 837 are both compressed axially with respect to the longitudinal length of connector 850 and are both pressed by coupler 816. More specifically, coupler 816 clamps around connector flange 857 and housing flange 837 so as to press connector flange 857 and housing flange 837 together. Coupler 816 can also prevent lateral and bending displacement of housing flange 837 and connector flange 857.

[0139] ​​Figures 10 and 11 show an interface 1002 with improved accessibility. As shown in Figures 10 and 11, the interface 1002 is mechanically and / or communicatively coupled to a sensor assembly (not shown for clarity) via a feed-through 1015. The feed-through 1015 includes a threaded coupler 1016 disposed on a connector 1050. The threaded coupler 1016 may be configured to rotate around the connector 1050. The threaded coupler 1016 has a threaded portion (not shown) configured to threadedly engage a threaded portion 1037 of a housing 1030 of the interface 1002.

[0140] The connector 1050 may be mechanically coupled to the housing 1030 by inserting the connector 1050 until the threaded coupler 1016 contacts the threaded portion 1037. The connector 1050 can be inserted, for example, by lowering the housing 1030 onto the feed-through 1015. The connector 1050 may remain stationary while the threaded coupler 1016 rotates until it meshes with the housing 1030. The connector 1050 may be held stationary so that torque or bending moment does not displace the connector 1050.

[0141] [Rotatable Housing] Figures 12 to 15 show a vibratory instrument 1205 including an interface 1202 with improved accessibility. Figures 12 and 13 are perspective views of the vibratory instrument 1205 including the interface 1202. A connection box 1203 that communicably couples a sensor assembly (not shown for clarity) to the interface 1202 is shown. Figure 13 shows instrument electronics 1220 within the interface 1202. Figure 14 is an exploded perspective view of the instrument electronics 1220, and Figure 15 is a cross-sectional view of the interface 1202. As shown in Figure 14, the instrument electronics 1220 includes an upper instrument electronics 1222 and a lower instrument electronics 1224. The upper instrument electronics 1222 is communicably coupled to the lower instrument electronics 1224 via an intervening cable 1223. The intervening cable 1223 can carry a conditioned signal that does not cause electromagnetic compatibility problems. As described below, the intervening cable 1223 enables the upper instrument electronics 1222 to rotate relative to the lower instrument electronics 1224.

[0142] Referring to Figure 15, the lower instrument electronics 1224 is mechanically coupled to a connector 1250 of a feedthrough 1215 via a lower instrument electronics connector 1224c. More specifically, the lower instrument electronics 1224 is composed of an electronics substrate 1220b fixed to a shell 1220s, and the shell 1220s is fixed to the connector 1250. The ground planes of the shell 1220s, the connector 1250, and / or the electronics substrate 1220b can form a ground path to prevent electromagnetic noise from interfering with electronics outside the shell 1220s, such as the electronics within the upper instrument electronics 1222. As shown, the lower instrument electronics connector 1224c is disposed within the connector 1250 of the feedthrough 1215. A connector O-ring 1250c is disposed between the lower instrument electronics connectors 1224c. As can be understood, the lower instrument electronics 1224 is not fixed to or directly coupled to the housing 1230.

[0143] to the connector 1250 of the feedthrough 1215. As shown, the lower instrument electronics connector 1224c is disposed within the connector 1250 of the feedthrough 1215. A connector O-ring 1250c is disposed between the lower instrument electronics connectors 1224c. As can be understood, the lower instrument electronics 1224 is not fixed to or directly coupled to the housing 1230. is disposed between the lower instrument electronics connectors 1224c. As can be understood, the lower instrument electronics 1224 is not fixed to or directly coupled to the housing 1230. is disposed between the lower instrument electronics connectors 1224c. As can be understood, the lower instrument electronics 1224 is not fixed to or directly coupled to the housing 1230.The coupler 1216 is disposed around and compressed against the housing flange 1237 and the connector flange 1257. The ramps on the housing flange 1237 and the connector flange 1257 allow the coupler 1216 to compress the housing flange 1237 and the connector flange 1257 together, thereby securing and preventing relative rotation and other movement of the housing 1230 and the connector 1250. When the coupler 1216 is loosened, the housing 1230 can rotate relative to the connector 1250. Thus, the housing 1230 can be rotated relative to the connector 1250, and thus the sensor assembly or junction box, by loosening the coupler 1216 and applying a torque to the housing 1230. The manner in which the lower meter electronics 1224 can be mechanically coupled or secured to the connector 1250 is described in more detail below.

[0144] 16-20B show the installation of the lower meter electronics 1224 onto the connector 1250 of the sensor assembly. 12 and 13 are not shown for clarity. As shown in FIGS. 16, 17, and 19, the housing 1230 includes a containment disk 1217. The containment disk 1217 is rotatably disposed about the connector 1250 between the retaining ring 1218 and the wall 1232 of the housing 1230. The containment disk 1217 includes threaded holes 1217h and grooves 1217g configured to receive and mate with the bolts 1224b and posts 1224p of the lower meter electronics 1224, respectively. As shown in FIG. 16, the containment disk 1217 also includes lobes 1217l that extend radially inward or inwardly into the containment disk 1217. The lobes 1217l are threadedly threaded into the grooves 1217. The retaining ring 1218, which is part of the connector 1250, is adjacent to the housing disk 1217. 12. An exemplary process for installing the lower meter electronics 1224 onto the connector 1250 is described below.

[0145] As can be seen by comparing FIGS. 16 and 17, the receiving disk 1217 is rotated 90 degrees. As shown in FIG. 16, between the lips 1218b, there are arranged a groove 1217g and a lobe 1217l. That is, the line connecting the grooves 1217g and the line connecting the centers of the lips 1218b are orthogonal. As shown in FIG. 17, the groove 1217g is arranged close to the lip 1218b. That is, the line connecting the grooves 1217g and the line connecting the centers of the lips 1218b are on the same straight line or parallel. This rotation is performed before the lower instrument electronic device 1224 is attached to the receiving disk 1217. That is, the line connecting the grooves 1217g and the line connecting the centers of the lips 1218b are orthogonal. As shown in FIG. 17, the groove 1217g is arranged close to the lip 1218b. That is, the line connecting the grooves 1217g and the line connecting the centers of the lips 1218b are on the same straight line or parallel. That is, the line connecting the grooves 1217g and the line connecting the centers of the lips 1218b are on the same straight line or parallel. This rotation is performed before the lower instrument electronic device 1224 is attached to the receiving disk 1217.

[0146] After the receiving disk 1217 is rotated to the position shown in FIG. 17, the lower instrument electronic device 1224 is attached to the receiving disk 1217. More specifically, referring to FIGS. 18 and 19, the post 1224p of the lower instrument electronic device 1224 is position - aligned with the groove 1217g of the receiving disk 1217. That is, the lower instrument electronic device 1224 is inverted from the position shown in FIG. 18 and drops into the housing 1230 where the post 1224p is position - aligned with the groove 1217g. The groove 1217g and the post 1224p fit into each other. Similarly, the bolt 1224b of the lower instrument electronic device 1224 is position - aligned with and fits into the screw hole 1217h of the receiving disk 1217.

[0147] Now referring to FIGS. 19A, 19B, 20A, and 20B, details of the lower instrument electronic device 1224 coupled to the receiving disk 1217 and the connector 1250 are shown. In particular, details of the receiving disk 1217 and the connector 1250 are shown in FIGS. 19A and 19B respectively, and FIG. 20A shows how the lower instrument electronic device 1224 is coupled to the receiving disk 1217. FIG. 20A shows how the lower instrument electronic device 1224 is coupled to the receiving disk 1217. In this case, the lower instrument electronic device 1224 is disassembled and separated from the storage disk 1217. In particular, the bolt 1224b is shown as being disassembled from the screw hole 1217h of the storage disk 1217. FIG. 20B shows the relative position between the screw hole 1217h of the storage disk 1217 and the lip 1218b of the retaining ring 1218 after the lower instrument electronic device 1224 is firmly fixed to the connector 1250. shows the relative position between the screw hole 1217h of the storage disk 1217 and the lip 1218b of the retaining ring 1218.

[0148] As described above with reference to FIGS. 18 and 19, when the bolt 1224b is fitted into the screw hole 1217h, the screw hole 1217h approaches the lip 1218b. After the bolt 1224b is fitted into the screw hole 1217h from the disassembled position shown in FIG. 20A, the bolt engages the lobe 1217l of the storage disk 1217 with the lip 1218b so as to hold the lower instrument electronic device 1224 against the connector 1250. is tightened. Thereby, the lower instrument electronic device 1224 is fixed to the connector 1250. The bolt 1224b, the storage disk 1217, and the connector 1250 are part of the above-described grounding path for reducing electromagnetic noise. FIG. 21 shows a method 2100 for assembling an interface having improved accessibility. As shown in FIG. 21, the method 2100 includes providing a housing in step 2110. The housing can be any suitable housing, such as the above-described housings 630, 1230, etc. In step 2120, the method 2100 provides an instrument electronic device and places it within the housing. The instrument electronic device can be the above-described instrument electronic devices 620, 1220, but can be any

[0149] suitable instrument electronic device. suitable instrument electronic device. Suitable instrumentation electronics may be utilized. Method 2100, in step 2130, provides a connector and extends it into the housing. The connector may be extended into the housing, for example, by assembling a sensor assembly including the extended connector and lowering the housing onto the sensor assembly, although any suitable method may be utilized. In step 2140, method 2100 secures the instrumentation electronics to the connector that extends into the housing. Steps 2110 - 2140 may be performed in any suitable order. For example, the connector may be extended into the housing before the instrumentation electronics are placed within the housing. The instrumentation electronics may be secured to the connector by any suitable means such as screws, bolts, rotating cams or lips, clamps, retaining rings, snap rings, cotter pins, etc. The instrumentation electronics may be fixedly secured, rotatably secured, pivotably secured, etc.

[0150] Method 2100 may include additional steps such as rotatably coupling the housing to the connector that extends into the housing. For example, referring to FIG. 15 above, housing 1230 may rotate with respect to connector 1250 that extends into housing 1230. Coupler 1216 may be tightened to housing flange 1237 of housing 1230 and connector flange 1257 of connector 1250, thereby preventing housing 1230 from rotating.

[0151] In step 2120, providing the instrument electronic device can include providing an upper instrument electronic device and a lower instrument electronic device. The upper instrument electronic device and the lower instrument electronic device may be the above-described upper instrument electronic device 1222 and lower instrument electronic device 1224, respectively, but any suitable upper and lower instrument electronic devices may be used. The upper instrument electronic device and the lower instrument electronic device may be fixed to each other or may not be fixed. For example, the upper instrument electronic device and the lower instrument electronic device may be fixed to each other using a barrier plate described below. The upper instrument electronic device and the lower instrument electronic device may be fixed to each other, for example, by using a potting material combined with standoffs, but any suitable means may be used. Additionally or alternatively, the upper instrument electronic device and the lower instrument electronic device may not be mechanically coupled to each other in the sense that their relative movement is restricted. For example, the upper instrument electronic device and the lower instrument electronic device may be communicatively coupled to each other using a cable such as a communication cable. Thus, the step of providing the instrument electronic device may include providing a lower instrument electronic device configured to be fixed to a connector extending into the housing, and providing an upper instrument electronic device configured to be fixed to the housing and communicatively coupled to the lower instrument electronic device. Providing the instrument electronic device can also include providing a shielded instrument electronic device such as the above-described lower instrument electronic device 1224 that prevents the propagation of electromagnetic noise from the instrument electronic device.

[0152] As described above, in step 2130, a connector can be provided and extended into the housing, for example, by lowering the housing onto a sensor assembly, junction box, or other device from which the connector extends. However, alternative means may be utilized. For example, the housing may be coupled to a sensor assembly, junction box, or other device, and the connector may then be coupled to the sensor assembly, junction box, or other device through the housing. Additionally or alternatively, the connector may be extended into the housing through the sensor assembly, junction box, or other device. For example, the sensor assembly can have an upper portion fixed to the housing, and the sensor assembly is extended into the housing through the upper portion. Thereafter, the lower portion of the sensor assembly can be fixed to the upper portion of the sensor assembly. The connector extending into the housing may be part of a feed-through extending from a sensor assembly, junction box, etc. That is, the connector may be part of a more complex assembly between a sensor assembly, junction box, etc. and the housing. For example, the feed-through extending into the housing may be the feed-through 1215 described above with reference to FIG. 15. Thus, the feed-through may be composed of a portion that allows the housing to rotate relative to a sensor assembly, junction box, etc.

[0153] As described above with reference to step 2140, the instrumentation electronics may be fixed to the connector by using any suitable means such as screws, bolts, rotating cams or lips, clamps, retaining rings, snap rings, cotter pins, etc. The instrumentation electronics may be firmly fixed, rotatably fixed, pivotably fixed, etc. For example, the connector may be similar to the connectors 850, 1050, 1250 described above with reference to FIGS. 8, 10, and 15.

[0154] Accordingly, providing a connector can include providing a receiving disk and rotatably disposing it around the connector. At least a portion of the receiving disk may be disposed between the retaining ring of the connector and the wall of the housing. Additionally or alternatively, providing an instrumentation electronics device can further include providing a post, and providing a receiving disk can include providing grooves and threaded holes within the receiving disk. Step 2140 can further include providing bolts. The post may be configured to fit into the groove, and the bolt may be configured to fit into the threaded hole of the receiving disk. The lobes on the receiving disk can engage with the grooves and / or lips of the retaining ring to hold the instrumentation electronics device against the connector extending into the housing.

[0155] The instrumentation electronics devices 420, 520, 620, 1220 and the feedthroughs 415, 515, 615, 1215 provide improved accessibility to the interfaces 402, 502, 602, 1202. The instrumentation electronics devices 420, 520, 620, 1220 do not necessarily have to be connected to the housings 430, 530, 630, 1230, and may be directly connected to the feedthroughs 415, 515, 615, 1215. If the instrumentation electronics devices 520, 1220 are not connected to the housings 530, 1230, the housings 530, 1230 can be enabled to rotate with respect to a sensor assembly, junction box, etc., thereby allowing easier access to the interfaces 402, 502, 602, 1202. Additionally, by connecting the instrumentation electronics devices 420, 520, 620, 1220 to the feedthroughs 415, 515, 615, 1215, an electrically grounded enclosure can be formed to prevent the propagation of electromagnetic noise . The instrumentation electronics device 420 , 620 can be connected to the housings 430, 630, and if the instrumentation electronics devices 420, 620 are the By being connected towards the feed-throughs 415, 615, easier assembly of the interfaces 402, 602 can be enabled. For example, cables between the instrumentation electronics 420, 620 and the feed-throughs 415, 615 may not be used.

[0156] [Removable Instrumentation Electronics with a Water Barrier] The interface can have a single or double-compartment housing for the instrumentation electronics. In a single-compartment housing, the instrumentation electronics, terminals, and wiring are located inside the same compartment. Conventionally, this requires protecting the instrumentation electronics from water by housing the entire instrumentation electronics within a potting compound to prevent damage to the instrumentation electronics in case water enters the housing. This potting of the electronics to protect it from water can add a significant cost to the interface due to the potting material, the electronics shell, and the additional manufacturing steps required for filling and curing the potting material.

[0157] An alternative to the single-compartment housing that reduces the risk of water to the instrumentation electronics is to utilize a double-compartment housing. In a double-compartment housing, the terminals and wiring are placed inside one compartment, while the instrumentation electronics and circuitry are in a separate compartment sealed by a potted housing wall or partition. This type of design allows the instrumentation electronics to be sealed from water ingress in the terminal compartment. However, double-compartment housings are conventionally heavier and more costly to manufacture than single-compartment housings. The instrumentation electronics are also not accessible due to the potted housing wall.

[0158] Figures 22 and 23 show an interface 2202 with improved accessibility. As shown in Figures 22 and 23, the interface 2202 includes an instrument electronic device 2220 having a gasket 2230o disposed between a barrier plate 2223 and a housing 2230. More specifically, the gasket 2230o is disposed between the barrier plate 2223 and a boss 2230s of the housing 2230. As shown in Figures 22 and 23 the gasket 2230o is an O-ring, although any suitable gasket may be used. The barrier plate 2223 is disposed between and coupled to an upper instrument electronic device 2222 and a lower instrument electronic device 2224. The upper instrument electronic device 2222 is disposed within an upper instrument electronic device portion 2230u of the housing 2230, and the lower instrument electronic device 2224 is disposed within a lower instrument electronic device part 2230l of the housing 2230. The barrier plate 2223 is fixed to the housing 2230 using a plurality of fasteners 2230b. As shown, the plurality of fasteners 2230b are screws, although any suitable fasteners may be used.

[0159] The housing 2230 may include any suitable material such as aluminum, stainless steel, polymer, etc. The housing 2230 may be composed of a single integral structure such as a cast, forged, or milled structure. The housing 2230 has an opening through which the instrument electronic device 2220 can be inserted into and removed from the housing 2230. The barrier plate 2223 can be made to not include vias or holes through which water can flow. This can be achieved by using blind vias and embedded vias and providing a seal around the holes that pass through the barrier plate 2223. Thus, the barrier plate 2223 can be made to not include holes that pass through the barrier plate 2223 inside the gasket 2230o. The barrier Since the plate 2223 does not include holes that cross the barrier plate 2223 inside the gasket 2230o, water cannot pass through the barrier plate 2223. Thereby, it is possible to prevent water from entering the lower instrument electronics portion 2230l.

[0160] The barrier plate 2223 can correspond to the bosses 2230s on the housing 2230 where the gasket 2230o is disposed and have overlapping peripheries. The bosses 2230s may extend circumferentially around the inner surface of the housing 2230. The bosses 2230s can define the boundary between the upper instrument electronics portion 2230u and the lower instrument electronics portion 2230l of the housing 2230. When the instrument electronics 2220 is inserted, a plurality of fasteners 2230b can compress the barrier plate 2223 against the housing 2230, more particularly the bosses 2230s and the gasket 2230o, thereby forming a watertight compartment under the upper instrument electronics 2222. The upper instrument electronics 2222 may be composed of wiring components such as cables, terminals, etc., and may not include electronic components, but any suitable configuration that is not subject to water exposure problems may be utilized. For example, sealed electronics for the environment may be utilized. The lower instrument electronics 2224 may similarly be composed of electronic equipment components and cables, terminals, etc. The lower instrument electronics 2224 can be communicatively and / or mechanically coupled to a sensor assembly, junction box, etc. As shown in FIGS. 22 and 23, the wiring terminals of the upper instrument electronics 2222 can be disposed on this barrier plate 2223, and additional electronic circuit boards of the electronic equipment substrate stack can be suspended under the barrier plate 2223, allowing additional circuit board space without the need for potting of a portion of the instrument electronics 2220. For example, the lower instrument electronics 2224 may not need to be potted. As can be understood, the instrument electronics 2220 includes a plurality of fasteners 2230b

[0161] The upper instrument electronics 2222 may be composed of wiring components such as cables, terminals, etc., and may not include electronic components, but any suitable configuration that is not subject to water exposure problems may be utilized. For example, sealed electronics for the environment may be utilized. The lower instrument electronics 2224 may similarly be composed of electronic equipment components and cables, terminals, etc. The lower instrument electronics 2224 can be communicatively and / or mechanically coupled to a sensor assembly, junction box, etc.

[0162] As shown in FIGS. 22 and 23, the wiring terminals of the upper instrument electronics 2222 can be disposed on this barrier plate 2223, and additional electronic circuit boards of the electronic equipment substrate stack can be suspended under the barrier plate 2223, allowing additional circuit board space without the need for potting of a portion of the instrument electronics 2220. For example, the lower instrument electronics 2224 may not need to be potted. As can be understood, the instrument electronics 2220 includes a plurality of fasteners 2230b It can be removed by removal.

[0163] As shown in FIGS. 22 and 23, a plurality of fasteners 2230b are disposed outside the gasket 2230o or within the upper instrument electronics portion 2230u of the housing 2230. However, the plurality of fasteners 2230b may be disposed at any suitable location. For example, the plurality of fasteners 2230b may be disposed inside the gasket 2230o or within the lower instrument electronics portion 2230l of the housing 2230. Additionally or alternatively, the plurality of fasteners 2230b can include fasteners located both inside and outside the gasket 2230o. For example, the fasteners located inside the gasket 2230o may include a gasket coupled to the fastener to provide a watertight seal.

[0164] The plurality of fasteners 2230b are shown as being disposed through the barrier plate 2223, but any suitable configuration may be utilized. For example, a claim such as a ring clamp disposed around the barrier plate 2223 may be utilized, and the clamp compresses the barrier plate 2223 against the boss 2230s of the housing 2230. The plurality of fasteners 2230b may be disposed within or opposite the ring clamp. Additionally or alternatively, the plurality of fasteners 2230b may be disposed around the edge of the barrier plate 2223. For example, the plurality of fasteners 2230b may abut against the edge of the barrier plate 2223, and the heads of the plurality of fasteners 2230b may compress the edge of the barrier plate 2223 against the boss 2230s.

[0165] The gasket 2230o may include a compressible material such as rubber, polymer, soft metal, etc. The gasket 2230o is shown as having a circular cross-section, but any shape such as rectangular An appropriate cross-section may be utilized and may vary, such as an increase or decrease in diameter. The gasket 2230o can form a watertight seal that prevents water from flowing into the lower instrument electronics portion 2230l of the housing 2230. Thus, the gasket 2230o can define the boundary between the upper instrument electronics portion 2230u and the lower instrument electronics portion 2230l of the housing 2230

[0166] FIG. 24 shows a method 2400 for assembling an interface with improved accessibility. As shown in FIG. 24, the method 2400, in step 2410, provides a housing. The housing may be the housing 2230 described above, although any suitable housing may be utilized. The method 2400, in step 2420, provides instrument electronics. For example, the method 2400 can provide upper instrument electronics and provide lower instrument electronics. In step 2430, the method 2400 can provide a barrier plate and dispose it between the upper instrument electronics and the lower instrument electronics. The method 2400 can also couple the barrier plate to the upper instrument electronics and the lower instrument electronics. In step 2440, the method 2400 disposes a gasket between the barrier plate and the housing so as to form a watertight seal that separates the upper instrument electronics portion of the housing from the lower instrument electronics portion of the housing and can contact the barrier plate and the gasket.

[0167] The step of providing a barrier plate may include forming a barrier plate without holes therethrough. For example, blind vias may be utilized within the barrier plate. Providing a gasket may include providing an O-ring, and the method 2400 can compress the O-ring between the housing and the barrier plate. The step of disposing the gasket between the barrier plate and the housing and contacting the barrier plate and the housing may include disposing the gasket between the barrier plate and the shelf of the housing and contacting the barrier plate and the shelf of the housing.

[0168] ​​ Method 2400 can also place a plurality of fasteners in proximity to the gasket and use the plurality of fasteners to secure the barrier plate to the shelf of the housing. The method can also place the plurality of fasteners on at least one of the upper instrument electronics portion of the housing and the lower instrument electronics portion of the housing. Method 2400 can also place the plurality of fasteners through the barrier plate and into the shelf of the housing.

[0169] Instrument electronics 2220 and method 2400 can provide improved accessibility to interface 2202. For example, instrument electronics 2220 can include non-potted portions, thereby allowing for higher access to components on instrument electronics 2220. Additionally, instrument electronics 2220 can be installed within housing 2230 without necessarily using potting material to seal instrument electronics 2220 to housing 2230. That is, gasket 2230o can provide a water seal between instrument electronics 2220 and housing 2230. Thus, instrument electronics 2220 can be made removable from housing 2230. between. from.

[0170] [Wireless Communication with Interface] The accessibility of an interface can be improved by, for example, using a wireless communication protocol to enhance the interface's ability to communicate with other devices. However, an interface is typically not designed to include wireless capabilities. For example, the housing of an interface can be designed to meet safety standards that require a thick metal housing formed from a single integral part. Wireless signals can be adversely affected by metal surfaces. Additionally, the components inside the housing can be arranged to meet safety and user interface requirements as well. For example, a display substrate can necessarily be coplanar with the plane formed by an opening in the housing to ensure that the display can be readable by a user. Such a substrate can interfere with wireless signals between the interface and other devices.

[0171] FIG. 25 shows a communication system 2500 that includes an interface 2502 having improved accessibility. In particular, the communication system 2500 includes a wireless device 2501 configured to wirelessly communicate with the interface 2502 via a fascia 2540. The fascia 2540 can be considered part of the instrumentation electronics within the interface 2502. The fascia 2540 is disposed proximate to a display opening 2532 within a housing 2530. Interfaces other than the interface 2502 shown in FIG. 25 lack the line of sight (LOS) necessary to incorporate any Wi-Fi (Wireless Fidelity), or other communication standard There may be very limited or almost no openings for it. For example, metal housings such as aluminum or stainless steel can be a problem for radio frequency (RF) signals. Other interfaces typically include a limited number of plastic parts such as sub-bezels, display covers, terminal covers, display glass covers, etc., which, when combined, can have a significant adverse effect on the RF signal range from the interface. This can, when combined with an interface having an external RF transmission opening, make WiFi communication difficult. To address these problems, the fascia 2540 provides openings in the circuit board and slots in the fascia positioned to reduce the adverse effects of other components within the interface 2502.

[0172] Figures 26 to 28 show various views of the fascia 2540 for the interface 2502 with improved accessibility. As shown in Figure 26, the fascia 2540 includes a faceplate 2542 through which the display 2544 is visible. The fascia 2540 also includes buttons 2546 disposed below the display 2544. The buttons 2546 are configured to detect finger presses on the fascia 2540. As shown in Figure 27, the faceplate 2542 is removed to expose the fascia chassis 2543 of the buttons 2546 shown in Figure 27, as well as the emitter 2546e and the sensor 2546s. A wire less transceiver 2548 having an antenna 2548a is also shown. The antenna 2548a is disposed proximate to a slot 2543s within the fascia chassis 2543. Figure 28 is a cross-sectional view of the fascia 2540 from Figure 26 and shows that, as shown in Figure 26, the fascia 2540 includes the faceplate 2542, the fascia chassis 2543, the display 2544, the buttons 2546 including the emitter 2546e and the sensor 2546s, the wireless transceiver 2548, and the antenna 2548a of the wireless transceiver 2548. Also, the base The plate 2540b, and a display cable 2544c that communicably couples the display 2544 and the substrate 2540b are also shown.

[0173] As described above, the interface 2502 can include a housing 2530 having a display opening 2532. The housing 2530 may be composed of a metal such as steel or aluminum formed from a single integral part to meet safety or other criteria so as to be resistant to explosion, water, or other intrusion. If the housing 2530 is composed of a conductive material wireless signals propagating near the housing 2530 may be adversely affected.

[0174] The display opening 2532 is shown as having a circular shape, but any suitable shape may be utilized. For example, a rectangular, elliptical, or hexagonal shape may be utilized. Additionally, although the display opening 2532 is shown as being planar, a non-planar opening may be utilized. The display opening 2532 can include a bezel including a transparent material that is a dielectric so as not to adversely affect wireless signals propagating through the display opening 2532.

[0175] The fascia 2540 may be disposed inside the housing 2530 and proximate to the display opening 2532. As described above, the fascia 2540 can include a substrate 2540b and a wireless transceiver 2548. The substrate 2540b may include a front side 2540ba facing the display opening 2532 and a rear side 2540bp facing an inner portion of the housing 2530. The wireless transceiver 2548 may be disposed on the rear side 2540bp of the substrate 2540b as shown. The wire less transceiver 2548 may be configured to communicably couple to the wireless device 2501 through an opening 2540bo of the substrate 2540b.

[0176] Also as described above, the fascia 2540 can include a fascia chassis 2543 mechanically coupled to the substrate 2540b. The fascia chassis 2543 includes slots 2543s that can be proximate to the wireless transceiver 2548. The fascia chassis 2543 may be composed of a conductive material such as aluminum, steel, etc., but any suitable material may be utilized. The fascia chassis 2543 can provide a rigid support structure for the substrate 2540b. The substrate 2540b may be mechanically and / or electrically coupled to the fascia chassis 2543 via ground. For example, the substrate 2540b can have a ground plane that is substantially continuous on the rear side 2540bp of the substrate 2540b. Thus, the opening 2540bo can enable wireless signals to propagate through the substrate 2540b. The opening 2540bo is shown as a through hole that extends beyond the substrate 2540b. That is, the opening 2540bo extends beyond both the dielectric material and, for example, a substantially continuous ground plane at the rear side 2540p of the substrate 2540b. Alternative substrates may not include through holes. For example, the openings of alternative substrates may be formed only in the ground plane and / or other conductive layers of the substrate. For example, the openings of alternative substrates may be defined by the absence of a ground plane on the rear side of the alternative substrate. Thus, the openings of alternative substrates may be electrical openings in that the substrate can be mechanically solid at the openings but electrically transmissive to electromagnetic propagation or wireless signals. The display 2544 may be coupled to the front side 2540ba of the substrate 2540b. In particular, the display

[0177]

[0178] The display 2544 is mechanically and electrically coupled to the front side 2540ba of the substrate 2540b from the opposite side of the wireless transceiver 2548 with respect to the substrate 2540b. As can also be seen from FIG. 28, the display 2544 is recessed within the fascia chassis 2543. That is, the front surface of the display 2544 is recessed from the front surface of the fascia chassis 2543.

[0179] The wireless transceiver 2548 may be any suitable wireless transceiver capable of receiving and transmitting wireless signals. The wireless transceiver 2548 may be a WiFi wireless transceiver, but any suitable protocol such as Bluetooth, Zigbee, etc. may be utilized. The wireless transceiver 2548 may be configured to communicate with one or more devices 2501. Although a single wireless transceiver 2548 is shown, multiple wireless transceivers may be utilized. For example, a WiFi wireless transceiver and a Bluetooth transceiver may be utilized. In such a configuration, the wireless transceiver may be disposed on the rear side of the substrate 2540b or may not be disposed thereat.

[0180] The antenna 2548a may be an on-board chip ceramic antenna having suitable performance in the constrained environment as described above, but any suitable antenna may be utilized. For example, an antenna built into the substrate 2540b may be utilized. The antenna 2548a can be configured for one or more communication protocols such as the WiFi, Bluetooth, and / or Zigbee protocols described above. The antenna 2548a is one of the wireless transceiver 2548 It may also be a part, or may be coupled to the wireless transceiver 2548 using, for example, a coaxial cable. For example, the wireless transceiver 2548 can be displaced further away from the opening 2540bo of the substrate 2540b, and the coaxial cable can be routed along the rear side of the substrate 2540b between the wireless transceiver 2548 and the antenna 2548a.

[0181] As shown in FIG. 28, when the fascia 2540 is disposed and positioned within the housing 2530, the front side 2540ba of the substrate 2540b can be close to the display opening 2532 within the housing 2530. Also, as shown in FIGS. 26-28, the display 2544 is disposed proximate to the opening 2540bo of the substrate 2540b. The display 2544 is also disposed opposite the wireless transceiver 2548 on the substrate 2540b. Also, as shown in FIGS. 26-28, the wireless transceiver 2548 includes an antenna 2548a disposed proximate to the opening 2548a within the substrate 2540b and the slot 2543s within the fascia chassis 2543.

[0182] Accordingly, the display 2544 may not be in the transmission path of the wireless signal indicated by the curve in FIG. 28. Accordingly, although some displays may be interfered with by wireless signals, the display 2544 shown in FIGS. 26-28 can be assumed not to be interfered with because the display 2544 is not in the path of the wireless signal. More specifically, the opening 2540bo of the substrate 2548b and the slot 2543s of the fascia chassis 2543 can form a signal path for the wireless signal.

[0183] Also, by disposing the antenna 2548a proximate to the slot 2543s, the wireless signal can propagate in LOS between the wireless device 2501 and the wireless transceiver 2548. . More specifically, the wireless signal may be transmitted between the antenna 2548a through the opening 2540bo of the substrate 2540b and the slot 2543s of the fascia chassis 2543 and through the display opening 2532 of the housing 2530. The substantially central arrangement of the antenna 2548a with respect to the inner surface formed by the housing 2530 and the circular plane formed by the display opening 2532 of the housing 2530 can minimize the adverse effects of the housing 2530 on the wireless signal. And through the slot 2543s of the fascia chassis 2543 and through the display opening 2532 of the housing 2530, it may be transmitted between the antenna 2548a. As can be understood, since the antenna 2548a on the wireless transceiver 2548 is located behind the display 2544, the wireless signal may be blocked without the slot 2543s. In addition, the antenna 2548a is disposed close to the opening of the emitter 2546e. The opening enables the infrared (IR) light emitted from the emitter 2546e to be reflected by the user's finger to the sensor 2546s, thereby detecting the pressing of the finger. The opening of the emitter 2546e may also enable the wireless signal to propagate through the fascia chassis 2543. However, the emitter 2546e should not be sensitive to the wireless signal, and the opening for the emitter 2546e may not be utilized by the wireless signal emitted by the antenna 2548a. For example, an alternative opening may be specific to the antenna 2548a or another reused opening such as a switch opening, as shown in FIGS. 26 to 28. The adverse effects on the wireless signal can be minimized.

[0184] As can be understood, since the antenna 2548a on the wireless transceiver 2548 is located behind the display 2544, the wireless signal may be blocked without the slot 2543s. In addition, the antenna 2548a is disposed close to the opening of the emitter 2546e. The opening enables the infrared (IR) light emitted from the emitter 2546e to be reflected by the user's finger to the sensor 2546s, thereby detecting the pressing of the finger. The opening of the emitter 2546e may also enable the wireless signal to propagate through the fascia chassis 2543. However, the emitter 2546e should not be sensitive to the wireless signal, and the opening for the emitter 2546e may not be utilized by the wireless signal emitted by the antenna 2548a. For example, an alternative opening may be specific to the antenna 2548a or another reused opening such as a switch opening, as shown in FIGS. 26 to 28. In addition, the antenna 2548a is disposed close to the opening of the emitter 2546e. The opening enables the infrared (IR) light emitted from the emitter 2546e to be reflected by the user's finger to the sensor 2546s, thereby detecting the pressing of the finger. The opening of the emitter 2546e may also enable the wireless signal to propagate through the fascia chassis 2543. However, the emitter 2546e should not be sensitive to the wireless signal, and the opening for the emitter 2546e may not be utilized by the wireless signal emitted by the antenna 2548a. For example, an alternative opening may be specific to the antenna 2548a or another reused opening such as a switch opening, as shown in FIGS. 26 to 28. In addition, the antenna 2548a is disposed close to the opening of the emitter 2546e. The opening enables the infrared (IR) light emitted from the emitter 2546e to be reflected by the user's finger to the sensor 2546s, thereby detecting the pressing of the finger. The opening of the emitter 2546e may also enable the wireless signal to propagate through the fascia chassis 2543. However, the emitter 2546e should not be sensitive to the wireless signal, and the opening for the emitter 2546e may not be utilized by the wireless signal emitted by the antenna 2548a. For example, an alternative opening may be specific to the antenna 2548a or another reused opening such as a switch opening, as shown in FIGS. 26 to 28. For example, an alternative opening may be specific to the antenna 2548a or another reused opening such as a switch opening, as shown in FIGS. 26 to 28. Or it may be specific to another reused opening such as a switch opening.

[0185] FIG. 29 shows a method 2900 for forming an interface with improved accessibility. As shown in FIG. 29, As such, method 2900 provides, at step 2910, a housing having a display opening. The housing may be the housing 2530 described above, although any suitable housing may be utilized. At step 2920, method 2900 provides a fascia that can be disposed inside the housing in proximity to the display opening. Providing the fascia may include providing a substrate and a wireless transceiver, the substrate having a front side facing the display opening and a rear side facing an interior portion of the housing. Method 2900 also provides, at step 2930, a wireless transceiver that can be disposed on the rear side of the substrate. Disposing the wireless transceiver on the rear side of the substrate can include fixing the wireless transceiver to the substrate. At step 2940, method 2900 can be configured to communicatively couple the wireless transceiver to a wireless device via an opening in the substrate.

[0186] Providing the fascia can further include providing a fascia chassis and mechanically coupling the fascia chassis to the substrate such that slots within the fascia chassis are in proximity to the wireless transceiver. Method 2900 also provides a display that can be coupled to the front side of the substrate. Coupling the display to the front side of the substrate may include fixing the display to the front side of the substrate. The method can also dispose the display in proximity to the opening in the substrate. For example, the display can be such that it does not extend or otherwise interfere with wireless signals propagating through the opening in the substrate. The wireless signals can propagate through the opening in the substrate due to the display facing the wireless transceiver on the substrate. For example, method 2900 for providing a wireless transceiver can include providing an antenna and disposing the antenna with respect to the opening in the substrate and the slots in the fascia chassis.

[0187] Communication system 2500, interface 2502, and method 2900 can provide improved accessibility to interface 2502. Facia 2540 may be disposed proximate to display opening 2532 within housing 2530 and may include slots 2543s that permit wireless signals between the device and interface 2502. Substrate 2540b within facia 2540 can include opening 2540bo to enable wireless signals to be transmitted and received by antenna 2548a of wireless transceiver 2548. Accordingly, interface 2502 and device 2501 can communicate wirelessly. through

[0188] [Automatic Detection of Display] The interfaces described above can include a display. Some interfaces do not have a display. These interfaces may be referred to as blind interfaces and may require configuration of the interface during assembly. For example, the display may be part of a substrate housed within a facia that may not be included in the blind interface, similar to facia 2540 described above. Accordingly, a blind interface can necessarily include some components that are included in the facia. For example, the facia can include light emitting diodes (LEDs), switches, etc. with which the user interacts. Accordingly, the instrumentation electronics within the blind interface can include a similar set of components. This can cause configuration issues, such as, for example, the blind interface activating the LEDs in both the instrumentation electronics and the facia. ate There is a possibility of causing configuration problems such as activating the LEDs in both the instrumentation electronics and the facia.

[0189] Figures 30 and 31 show a display interface 3002 and a blind interface 3102 configured to improve accessibility. As shown in Figure 30, the display interface 3002 includes a display fascia 3040. As shown in Figure 31, the blind interface 3102 includes a blind fascia 3140. The display fascia 3040 and the blind fascia 3140 both include faceplates 3042, 3142. Both the display interface 3002 and the blind interface 3102 can include status light-emitting diodes (LEDs) 3046l, 3126l and switch sets 3046s, 3126s. However, the display fascia 3040 also includes a display 3044 and a switch 3045 for controlling the display 3044, while the blind fascia 3140 does not. The display fascia 3040 can include a display substrate similar to the substrate 2540b described above with reference to Figure 31. However, the blind fascia 3140 may not include a display substrate. As a result, the electronic device substrate in both the display fascia 3040 and the blind fascia 3140 in the instrumentation electronics can include components and features that are redundant with respect to the display substrate in the display fascia 3040. For example, as shown in Figures 30 and 31, the LEDs 3046l and the switch set 3046s in the display fascia 3040 can be within the display substrate, while the LEDs 3126l and the switch set 3126s in the blind fascia 3140 can be within the electronic device substrate of the instrumentation electronics.

[0190] The display fascia 3040 can include a display substrate similar to the substrate 2540b described above with reference to Figure 31. However, the blind fascia 3140 may not include a display substrate. As a result, the electronic device substrate in both the display fascia 3040 and the blind fascia 3140 in the instrumentation electronics can include components and features that are redundant with respect to the display substrate in the display fascia 3040. For example, as shown in Figures 30 and 31, the LEDs 3046l and the switch set 3046s in the display fascia 3040 can be within the display substrate, while the LEDs 3126l and the switch set 3126s in the blind fascia 3140 can be within the electronic device substrate of the instrumentation electronics. and the switch set 3126s can be within the electronic device substrate of the instrumentation electronics.

[0191] Therefore, the electronic device substrate and the display substrate can include duplicate circuits for supporting redundant components. For example, the LEDs 3046l and the switch 3046s of the display substrate A set of general-purpose input / output (GPIO) pins within a substrate stack for support, and a separate set of GPIO pins for supporting the LED 3126l and switch set 3126s of an electronic device substrate can exist. To avoid this, there are two different versions of the electronic device substrate as well. One version, which is intended to support the display substrate, does not include the LED 3126l and switch set 3126s, but this is prohibitively costly.

[0192] Figure 32 shows a circuit diagram of interface 3202 including a display substrate 3240b and an instrument electronic device 3220 configured to improve access to the interface by detecting the display substrate 3240b or supporting the interface 3202 or blind facia 3140 by supporting the display substrate 3240b. As shown in Figure 32, the circuit diagram is that of the electronic device substrate 3220b and a part of the circuit within the electronic device substrate 3220b is shown for clarity. The display substrate 3240b and the electronic device substrate 3220b include components 3246, 3226. The components 3226, 3246 are composed of LED sets 3226l, 3246l and switch sets 3226s, 3246s.

[0193] The component 3246 of the display substrate 3240b is coupled to the display connector 3247 More specifically, the LEDs 3246l are coupled to pins 2 and 4 of the display connector 3247, which are designated as PF3 pin and PF2 pin respectively. The switch 3246s is coupled to pin 12 of the display connector 3247, which is designated as PF1 pin. As can be seen, the display connector 3247 also includes a PF0 pin coupled to the ground 3240g of the display substrate 3240b. The LEDs 3246l are also connected to the ground 3240g of the display substrate 3240b as well.

[0194] The display connector 3247 is electrically coupled to the processor 3228 of the electronic device substrate 3220b. Therefore, the pins on the display connector 3247 correspond to the pins of the processor 3228. More specifically, the PF0, PF1, PF2, and PF3 pins of the display connector 3247 respectively correspond to the PF0, PF1, PF2, and PF3 pins of the processor 3228. As a result, when the display substrate 3240b is coupled to the electronic device substrate 3220b, the PF0, PF1, PF2, and PF3 pins of the display connector 3247 are respectively coupled to the PF0, PF1, PF2, and PF3 pins of the processor 3228.

[0195] The electronic device substrate 3220b has a component 3226 that is also coupled to the processor 3228. More specifically, the switch 3226s is coupled to the pin labeled PF1 of the processor 3228, and the LED 3226l is respectively coupled to the pins labeled PF1 and PF2 of the processor 3228. As shown in FIG. 32, the processor 3228 is coupled to the LED 3226l via a first amplifier 3222a and a second amplifier 3222b. The electronic device substrate 3220b is configured to detect and support the display substrate 3240b while supporting the LED sets 3246l, 3226l and the switch sets 3246s, 3226s using the same pins.

[0196] Specifically, referring to FIG. 32, a total of 12 pins are assigned. Among the 12 pins, 8 pins are used to control a standard display such as a liquid crystal display (LCD). Another 4 pins labeled PF0 to PF3 are compatible for use with the display substrate 3240b or without a display substrate. The PF0 pin detects the presence or absence of the display substrate 3240b. When the display substrate 3240b is present, the PF0 pin is latched to ground 3240g. When the display substrate 3240b is absent, the PF0 pin is not latched to ground 3240g. The PF1 pin can be used for either switch 3226s or 3246s. The PF2 and PF3 pins are used to control the LED sets 3246l and 3226l. When the display substrate 3240b is present, the PF2 and PF3 pins are at the active high level. When the display substrate 3240b is absent, the PF2 and PF3 pins are at the active low level. That is, when the display substrate 3240b is connected to the electronic device substrate 3220b, the PF2 and PF3 pins are at the active high level. Thus, a voltage is applied to the LED 3246l on the display substrate 3240b to turn on the LED 3246l. The amplifiers 3222a and 3222b are inverters. Therefore, the high-level voltage is inverted to a low-level voltage (i.e., 0), thereby turning off the LED 3226l on the electronic device substrate 3220b. Conversely, when the display substrate 3240b is not connected to the electronic device substrate 3220b, the PF2 and PF3 pins are at the active low level. Thus, the low-level voltage on the PF2 and PF3 pins is inverted by the amplifiers 3222a and 3222b to turn on the LED 3226l on the electronic device substrate 3220b. That is, when the display substrate 3240b is connected to the electronic device substrate 3220b, the PF2 and PF3 pins are at the active high level, and thus, the LED 3246l on the display substrate 3240b is turned on by applying a voltage. The amplifiers 3222a and 3222b are inverters, and thus, the high-level voltage is inverted to a low-level voltage (i.e., 0), thereby turning off the LED 3226l on the electronic device substrate 3220b. Conversely, when the display substrate 3240b is not connected to the electronic device substrate 3220b, the PF2 and PF3 pins are at the active low level, and thus, the low-level voltage on the PF2 and PF3 pins is inverted by the amplifiers 3222a and 3222b to turn on the LED 3226l on the electronic device substrate 3220b. That is, when the display substrate 3240b is connected to the electronic device substrate 3220b, the PF2 and PF3 pins are at the active high level, and thus, the LED 3246l on the display substrate 3240b is turned on by applying a voltage. The amplifiers 3222a and 3222b are inverters, and thus, the high-level voltage is inverted to a low-level voltage (i.e., 0), thereby turning off the LED 3226l on the electronic device substrate 3220b. Conversely, when the display substrate 3240b is not connected to the electronic device substrate 3220b, the PF2 and PF3 pins are at the active low level, and thus, the low-level voltage on the PF2 and PF3 pins is inverted by the amplifiers 3222a and 3222b to turn on the LED 3226l on the electronic device substrate 3220b. That is, when the display substrate 3240b is connected to the electronic device substrate 3220b, the PF2 and PF3 pins are at the active high level, and thus, the LED 3246l on the display substrate 3240b is turned on by applying a voltage. The amplifiers 3222a and 3222b are inverters, and thus, the high-level voltage is inverted to a low-level voltage (i.e., 0), thereby turning off the LED 3226l on the electronic device substrate 3220b. Conversely, when the display substrate 3240b is not connected to the electronic device substrate 3220b, the PF2 and PF3 pins are at the active low level, and thus, the low-level voltage on the PF2 and PF3 pins is inverted by the amplifiers 3222a and 3222b to turn on the LED 3226l on the electronic device substrate 3220b.

[0197] That is, when the display substrate 3240b is connected to the electronic device substrate 3220b, the PF2 and PF3 pins are at the active high level, and thus, the LED 3246l on the display substrate 3240b is turned on by applying a voltage. The amplifiers 3222a and 3222b are inverters, and thus, the high-level voltage is inverted to a low-level voltage (i.e., 0), thereby turning off the LED 3226l on the electronic device substrate 3220b. Conversely, when the display substrate 3240b is not connected to the electronic device substrate 3220b, the PF2 and PF3 pins are at the active low level, and thus, the low-level voltage on the PF2 and PF3 pins is inverted by the amplifiers 3222a and 3222b to turn on the LED 3226l on the electronic device substrate 3220b. That is, when the display substrate 3240b is connected to the electronic device substrate 3220b, the PF2 and PF3 pins are at the active high level, and thus, the LED 3246l on the display substrate 3240b is turned on by applying a voltage. The amplifiers 3222a and 3222b are inverters, and thus, the high-level voltage is inverted to a low-level voltage (i.e., 0), thereby turning off the LED 3226l on the electronic device substrate 3220b. Conversely, when the display substrate 3240b is not connected to the electronic device substrate 3220b, the PF2 and PF3 pins are at the active low level, and thus, the low-level voltage on the PF2 and PF3 pins is inverted by the amplifiers 3222a and 3222b to turn on the LED 3226l on the electronic device substrate 3220b. That is, when the display substrate 3240b is connected to the electronic device substrate 3220b, the PF2 and PF3 pins are at the active high level, and thus, the LED 3246l on the display substrate 3240b is turned on by applying a voltage. The amplifiers 3222a and 3222b are inverters, and thus, the high-level voltage is inverted to a low-level voltage (i.e., 0), thereby turning off the LED 3226l on the electronic device substrate 3220b. Conversely, when the display substrate 3240b is not connected to the electronic device substrate 3220b, the PF2 and PF3 pins are at the active low level, and thus, the low-level voltage on the PF2 and PF3 pins is inverted by the amplifiers 3222a and 3222b to turn on the LED 3226l on the electronic device substrate 3220b. That is, when the display substrate 3240b is connected to the electronic device substrate 3220b, the PF2 and PF3 pins are at the active high level, and thus, the LED 3246l on the display substrate 3240b is turned on by applying a voltage. The amplifiers 3222a and 3222b are inverters, and thus, the high-level voltage is inverted to a low-level voltage (i.e., 0), thereby turning off the LED 3226l on the electronic device substrate 3220b. Conversely, when the display substrate 3240b is not connected to the electronic device substrate 3220b, the PF2 and PF3 pins are at the active low level, and thus, the low-level voltage on the PF2 and PF3 pins is inverted by the amplifiers 3222a and 3222b to turn on the LED 3226l on the electronic device substrate 3220b.

[0198] As can be understood, the effects of active-high logic and low-level logic on LEDs 3226l and 3246l depend on the cathodes of the LEDs being connected to grounds 3220g and 3240g. Similarly, switches 3246s on display substrate 3240b and switches 3226s on electronic device substrate 3220b are both connected to grounds 3240g and 3220g. Therefore, when display substrate 3240b is connected to electronic device substrate 3220b, by switching switch 3246s on display substrate 3240b, pin PF1 can be latched to ground 3240g. When display substrate 3240b is not connected to electronic device substrate 3220b, by switching switch 3226s within electronic device substrate 3220b, pin PF1 can be latched to ground 3220g. Thus, pin PF1 may be latched to ground by either switch 3226s within electronic device substrate 3220b or switch 3246s within display substrate 3240b. The effects of active-high logic and low-level logic on LEDs 3226l and 3246l depend on the cathodes of the LEDs being connected to grounds 3220g and 3240g. Similarly, switches 3246s on display substrate 3240b and switches 3226s on electronic device substrate 3220b are both connected to grounds 3240g and 3220g. Therefore, when display substrate 3240b is connected to electronic device substrate 3220b, by switching switch 3246s on display substrate 3240b, pin PF1 can be latched to ground 3240g. When display substrate 3240b is not connected to electronic device substrate 3220b, by switching switch 3226s within electronic device substrate 3220b, pin PF1 can be latched to ground 3220g. Thus, pin PF1 may be latched to ground by either switch 3226s within electronic device substrate 3220b or switch 3246s within display substrate 3240b. As can be understood, the effects of active-high logic and low-level logic on LEDs 3226l and 3246l depend on the cathodes of the LEDs being connected to grounds 3220g and 3240g. Similarly, switches 3246s on display substrate 3240b and switches 3226s on electronic device substrate 3220b are both connected to grounds 3240g and 3220g. Therefore, when display substrate 3240b is connected to electronic device substrate 3220b, by switching switch 3246s on display substrate 3240b, pin PF1 can be latched to ground 3240g. When display substrate 3240b is not connected to electronic device substrate 3220b, by switching switch 3226s within electronic device substrate 3220b, pin PF1 can be latched to ground 3220g. Thus, pin PF1 may be latched to ground by either switch 3226s within electronic device substrate 3220b or switch 3246s within display substrate 3240b. As can be understood, the effects of active-high logic and low-level logic on LEDs 3226l and 3246l depend on the cathodes of the LEDs being connected to grounds 3220g and 3240g. Similarly, switches 3246s on display substrate 3240b and switches 3226s on electronic device substrate 3220b are both connected to grounds 3240g and 3220g. Therefore, when display substrate 3240b is connected to electronic device substrate 3220b, by switching switch 3246s on display substrate 3240b, pin PF1 can be latched to ground 3240g. When display substrate 3240b is not connected to electronic device substrate 3220b, by switching switch 3226s within electronic device substrate 3220b, pin PF1 can be latched to ground 3220g. Thus, pin PF1 may be latched to ground by either switch 3226s within electronic device substrate 3220b or switch 3246s within display substrate 3240b. As can be understood, the effects of active-high logic and low-level logic on LEDs 3226l and 3246l depend on the cathodes of the LEDs being connected to grounds 3220g and 3240g. Similarly, switches 3246s on display substrate 3240b and switches 3226s on electronic device substrate 3220b are both connected to grounds 3240g and 3220g. Therefore, when display substrate 3240b is connected to electronic device substrate 3220b, by switching switch 3246s on display substrate 3240b, pin PF1 can be latched to ground 3240g. When display substrate 3240b is not connected to electronic device substrate 3220b, by switching switch 3226s within electronic device substrate 3220b, pin PF1 can be latched to ground 3220g. Thus, pin PF1 may be latched to ground by either switch 3226s within electronic device substrate 3220b or switch 3246s within display substrate 3240b. As can be understood, the effects of active-high logic and low-level logic on LEDs 3226l and 3246l depend on the cathodes of the LEDs being connected to grounds 3220g and 3240g. Similarly, switches 3246s on display substrate 3240b and switches 3226s on electronic device substrate 3220b are both connected to grounds 3240g and 3220g. Therefore, when display substrate 3240b is connected to electronic device substrate 3220b, by switching switch 3246s on display substrate 3240b, pin PF1 can be latched to ground 3240g. When display substrate 3240b is not connected to electronic device substrate 3220b, by switching switch 3226s within electronic device substrate 3220b, pin PF1 can be latched to ground 3220g. Thus, pin PF1 may be latched to ground by either switch 3226s within electronic device substrate 3220b or switch 3246s within display substrate 3240b. As can be understood, the effects of active-high logic and low-level logic on LEDs 3226l and 3246l depend on the cathodes of the LEDs being connected to grounds 3220g and 3240g. Similarly, switches 3246s on display substrate 3240b and switches 3226s on electronic device substrate 3220b are both connected to grounds 3240g and 3220g. Therefore, when display substrate 3240b is connected to electronic device substrate 3220b, by switching switch 3246s on display substrate 3240b, pin PF1 can be latched to ground 3240g. When display substrate 3240b is not connected to electronic device substrate 3220b, by switching switch 3226s within electronic device substrate 3220b, pin PF1 can be latched to ground 3220g. Thus, pin PF1 may be latched to ground by either switch 3226s within electronic device substrate 3220b or switch 3246s within display substrate 3240b. As can be understood, the effects of active-high logic and low-level logic on LEDs 3226l and 3246l depend on the cathodes of the LEDs being connected to grounds 3220g and 3240g. Similarly, switches 3246s on display substrate 3240b and switches 3226s on electronic device substrate 3220b are both connected to grounds 3240g and 3220g. Therefore, when display substrate 3240b is connected to electronic device substrate 3220b, by switching switch 3246s on display substrate 3240b, pin PF1 can be latched to ground 3240g. When display substrate 3240b is not connected to electronic device substrate 3220b, by switching switch 3226s within electronic device substrate 3220b, pin PF1 can be latched to ground 3220g. Thus, pin PF1 may be latched to ground by either switch 3226s within electronic device substrate 3220b or switch 3246s within display substrate 3240b.

[0199] Figure 33 shows a method 3300 for improving the accessibility of an interface. As shown in Figure 33, method 3300 provides, in step 3310, a processor and disposes it on an electronic device substrate. The processor and the electronic device substrate may be, for example, processor 3228 and electronic device substrate 3220b described above, but any suitable electronic device substrate and processor may be used. Okay. In step 3320, method 3300 provides a component and places it on the electronic device substrate. The component may be, for example, the LED 3226l or the switch 3226s on the electronic device substrate 3220b described above. In step 3330 of method 3300, the component is coupled to a pin on the processor. For example, as described above, the switch 3226s is coupled to the PF0 pin of the processor 3228, and the LED 3226l is coupled to the PF2 and PF3 pins of the processor 3228. In step 3340, method 3300 configures the pins of the processor to couple to components on a display substrate coupled to the electronic device substrate. For example, as described above, the display connector 3247 connects the components 3226 on the electronic device substrate 3220b and the components 3246 on the display substrate 3240b in parallel with the grounds 3220g, 3240g.

[0200] Accordingly, configuring the pins of the processor to couple to components of the display substrate may include configuring the pins to couple to components of the display substrate via a connector that couples the display substrate to the electronic device substrate. However, any suitable means such as an active switch controlled by the processor may be utilized. Providing a component may include providing one of a light emitting diode and a switch. However, other components may be utilized.

[0201] Method 3300 may also provide a plurality of components, couple each of the plurality of components to a respective one of a plurality of pins of the processor, and configure the plurality of pins of the processor to couple to respective ones of a plurality of components of the display substrate. For example, method 3300 may also provide and place other components in addition to the LED 3226l shown in FIG. 32. The plurality of components of the display substrate may be redundant with respect to the plurality of components of the electronic device substrate, similar to the above-described LEDs 3226l, 3246l and switches 3226s, 3246s. board.

[0202] Coupling a component to a pin of a processor may include coupling the pin of the processor to a first terminal of a component on an electronic device substrate and coupling a second terminal of the component to ground. For example, referring to FIG. 32, the first terminals 1, 3 of the LED 3226l on the electronic device substrate 3220b are coupled to the PF2, PF3 pins of the processor 3228, and the second terminal 2 of the LED 3226l is coupled to ground 3220g. The first pin 1 of the switch 3226s is coupled to the PF1 pin of the processor 3228. Similarly, on the display substrate 3240b, the first terminals 1, 3 of the LED 3246l on the electronic device substrate 3220b are coupled to the PF2, PF3 pins of the processor 3228, and the second terminal 2 of the LED 3246l is coupled to ground 3240g. The first terminal 4 of the switch 3246s is coupled to the PF1 pin of the processor 3228.

[0203] Method 3300 may also provide a display substrate and couple a pin of a processor to a component on the display substrate. Coupling a pin of a processor to a component on a display substrate may include coupling the pin of the processor to a first terminal of a component on the display substrate and coupling a second terminal of the component on the display substrate to ground. For example, the display substrate 3240b is coupled to the electronic device substrate 3220b via the display connector 3247, thereby connecting the respective first terminals 1, 3 of the LED 3246l to the PF2, PF3 pins of the processor 3228 and connecting the first terminal 4 of the switch 3246s to the PF1 pin of the processor 3228.

[0204] Instrument electronic device 3220 and method 3300 provide an interface 3202 with improved accessibility. For example, instrument electronic device 3220 includes a processor 3220p that can detect when a display substrate 3240b is connected to the instrument electronic device 3220. By detecting the display substrate 3240b, the processor can configure its pins to have appropriate logic levels so that the same pins can be used, thereby using fewer GPIO pins. In addition, the same instrument electronic device can be used regardless of whether a display is utilized. This can reduce the material cost of the interface. However, when the fascia is used when there is a possibility that the fascia is misaligned or misinserted into the interface, access to the instrument electronic device can be difficult.

[0205] [Swingable fascia] The interface can have a fascia such as the above-described fascia 2540 that can limit a user's access to the instrument electronic device disposed behind the fascia. In addition, when the fascia is removed from the interface, components such as the fascia and the display on the fascia may be damaged or misaligned . In addition, removal of the fascia, if not performed correctly, can cause damage to the interface, housing, and / or instrument electronic device.

[0206] Figures 34 to 38 show an interface 3402 with improved accessibility. As shown in Figure 34, the interface 3402 includes a fascia 3440 configured to rotate about a translation axis 3440at and then rotate about a pivot axis 3440ap to the position of the pivoted fascia 3440'. The translation axis 3440at and the pivot axis 3440ap are orthogonal and coincide at the pivot point 3440p. The translation rod 3440t is position-aligned with the translation axis 3440at. As will be described in more detail below, the translation rod 3440t is displaced along the translation axis 3440at. A pin 3440i connects the translation rod 3440t to the fascia 3440 and couples the fascia 3440 to the instrumentation electronics 3420 rotatably and pivotably. The instrumentation electronics 3420 may be a substrate stack, an electronics substrate, etc. The instrumentation electronics 3420 and the fascia 3440 can be arranged within a housing 3430 as shown in Figure 35. Figure 35 also shows a rod post 3430p that can be an integral part of the housing 3430 or fixed thereto. The translation rod 3440t is arranged within the rod post 3430p and configured to translate within the rod post as shown in Figure 36. Thus, the fascia 3440 may be configured to be displaced through an opening 3430o of the housing 3430

[0207] The fascia 3440 can include any suitable material and can include any suitable components. For example, the fascia 3440 may be similar to the fascia 2540 described above with reference to Figures 26 to 28. That is, the fascia 3440 can include a display, electronic components, connectors, switches, etc. Alternatively, the fascia 3440 may be a plastic cover such as a transparent plastic cover that can be placed on top of the instrumentation electronics, for example.

[0208] The translation rod 3440t, the pin 3440i, and the rod post 3430p are made of, for example, metal​​​ Although it can be, any suitable material such as a thermosetting polymer may be utilized. The translation rod 3440t is shown as having a cylindrical shape, but any suitable shape may be utilized. The translation rod 3440t includes a bore into which the pin 3440i is installed. The bore of the translation rod 3440t may be positionally aligned with the bore of the fascia 3440 when the pin 3440i is installed in the bore and couples the translation rod 3440t to the fascia 3440.

[0209] The translation rod 3440t may also be installed into the rod post 3430p and is shown as including a smooth portion and a threaded portion that can be used to hold the translation rod 3440t within the rod post 3430p. Thereby, as shown in FIGS. 35 and 36, the translation rod 3440t is constrained by the rod post 3430p. The rod post 3430p allows the translation rod 3440t to displace or translate along the translation axis 3440at and rotate about it. The rod post 3430p can be made to display a predetermined distance sufficient for the translation rod 3440t to allow the fascia 3440 to displace externally away from the housing 3430.

[0210] As described above, the translation rod 3440t translates along the translation axis 3440at to allow the fascia 3440 to displace away from the instrument electronics 3420. Thus, if the fascia 3440 includes electronic components, cables can be used to communicatively couple the electronic components of the fascia 3440 to the instrument electronics 3420. The pin 3440i can allow the fascia 3440 to pivot away from the instrument electronics 3420 to allow access to, for example, cables and the instrument electronics 3420 without the need to separate the fascia 3440 from the interface 3402.

[0211] ​As shown in FIGS. 37 and 38, the translation rod 3440t is displaced so as to dispose the fascia 3440 outside the housing 3430. In FIG. 37, the fascia 3440 is not swiveled. In FIG. 38, the fascia 3440 is swiveled but not rotated. As described above, the translation rod 3440t can also rotate so as to enable relatively easy access to both sides of the fascia 3440. For example, the user can swivel the fascia 3440 from the position shown in FIG. 38 to enable the user to access the rear side of the substrate in the fascia 3440. Alternatively, the user can rotate the fascia 3440 from the position shown in FIG. 37 to enable the user to access the front side of the fascia 3440 while also accessing the instrument electronics 3420 disposed in the housing 3430. For example, the user may desire to switch the switches of the fascia 3440 and the instrument electronics 3420, for example, for troubleshooting purposes. As shown in FIGS. 37 and 38, the translation rod 3440t is displaced so as to dispose the fascia 3440 outside the housing 3430. In FIG. 37, the fascia 3440 is not swiveled. In FIG. 38, the fascia 3440 is swiveled but not rotated. As described above, the translation rod 3440t can also rotate so as to enable relatively easy access to both sides of the fascia 3440. For example, the user can swivel the fascia 3440 from the position shown in FIG. 38 to enable the user to access the rear side of the substrate in the fascia 3440. Alternatively, the user can rotate the fascia 3440 from the position shown in FIG. 37 to enable the user to access the front side of the fascia 3440 while also accessing the instrument electronics 3420 disposed in the housing 3430. For example, the user may desire to switch the switches of the fascia 3440 and the instrument electronics 3420, for example, for troubleshooting purposes. As shown in FIGS. 37 and 38, the translation rod 3440t is displaced so as to dispose the fascia 3440 outside the housing 3430. In FIG. 37, the fascia 3440 is not swiveled. In FIG. 38, the fascia 3440 is swiveled but not rotated. As described above, the translation rod 3440t can also rotate so as to enable relatively easy access to both sides of the fascia 3440. For example, the user can swivel the fascia 3440 from the position shown in FIG. 38 to enable the user to access the rear side of the substrate in the fascia 3440. Alternatively, the user can rotate the fascia 3440 from the position shown in FIG. 37 to enable the user to access the front side of the fascia 3440 while also accessing the instrument electronics 3420 disposed in the housing 3430. For example, the user may desire to switch the switches of the fascia 3440 and the instrument electronics 3420, for example, for troubleshooting purposes.

[0212] FIG. 39 shows a method 3900 of forming an interface with improved accessibility. In step 3910, the method 3900 provides a housing having an opening. The housing may be the housing 3430 described above, but any suitable housing may be used. In step 3920, the method 3900 provides a fascia that can be disposed inside the housing in proximity to the opening of the housing. The fascia may be the fascia 3440 described above, but any suitable fascia may be used. In step 3930, the method provides a translation rod that can be pivotally coupled to the fascia, and the translation rod is configured to displace the fascia through the opening of the housing. The translation rod may be the translation rod 3440t described above, but any suitable translation rod may be used. The translation rod may be pivotally coupled to the fascia using, for example, pins, flexible couplers, U-joints, etc., but any suitable means may be used. FIG. 39 shows a method 3900 of forming an interface with improved accessibility. In step 3910, the method 3900 provides a housing having an opening. The housing may be the housing 3430 described above, but any suitable housing may be used. In step 3920, the method 3900 provides a fascia that can be disposed inside the housing in proximity to the opening of the housing. The fascia may be the fascia 3440 described above, but any suitable fascia may be used. In step 3930, the method provides a translation rod that can be pivotally coupled to the fascia, and the translation rod is configured to displace the fascia through the opening of the housing. The translation rod may be the translation rod 3440t described above, but any suitable translation rod may be used. The translation rod may be pivotally coupled to the fascia using, for example, pins, flexible couplers, U-joints, etc., but any suitable means may be used. FIG. 39 shows a method 3900 of forming an interface with improved accessibility. In step 3910, the method 3900 provides a housing having an opening. The housing may be the housing 3430 described above, but any suitable housing may be used. In step 3920, the method 3900 provides a fascia that can be disposed inside the housing in proximity to the opening of the housing. The fascia may be the fascia 3440 described above, but any suitable fascia may be used. In step 3930, the method provides a translation rod that can be pivotally coupled to the fascia, and the translation rod is configured to displace the fascia through the opening of the housing. The translation rod may be the translation rod 3440t described above, but any suitable translation rod may be used. The translation rod may be pivotally coupled to the fascia using, for example, pins, flexible couplers, U-joints, etc., but any suitable means may be used.

[0213] Coupling the translation rod to the fascia so as to be rotatable may include configuring the fascia to rotate about a translation axis that is collinear with the longitudinal axis of the translation rod. For example, the translation rod can have a longitudinal axis that extends orthogonally to the plane formed by the rotation of the fascia. The plane may also be orthogonal to the translation direction of the fascia along the translation axis. Coupling the translation rod to the fascia so as to be rotatable may also include configuring the fascia to rotate about a rotation axis that is orthogonal to the longitudinal axis of the translation rod.

[0214] Configuring the translation rod to displace the fascia through the opening of the housing may include configuring the translation rod to displace the fascia in a direction collinear with the longitudinal axis of the translation rod. For example, the translation rod can extend the fascia through the opening of the housing in a direction orthogonal to the plane formed by the opening in the housing. Coupling the translation rod to the fascia so as to be rotatable may include rotatably coupling the translation rod to the fascia at the pivot point. The pivot point may be located where the rotation axis and the translation axis coincide, where the fascia rotates about the rotation axis and rotates about the translation axis.

[0215] Figure 40 shows a method 4000 for improving the accessibility of an interface. As shown in Figure 40, the method 4000 provides, in step 4010, a housing having an opening. The housing may be the housing 3430 described above, but any suitable housing may be used. The method 4000 displaces, in step 4020, a fascia through the opening in the housing along a translation axis. The fascia may be configured to perform at least one of rotating about the translation axis and pivoting about a pivot axis. The method 4000 may further include at least one of rotating the fascia about the translation axis and pivoting the fascia about the pivot axis. The translation axis and the pivot axis may be co-localized at a pivot point, and the fascia may be configured to rotate and pivot about the pivot point.

[0216] The interface 3402 and the method 3900 improve the accessibility of the interface 3402. In particular, the interface 3402 includes a translatable fascia 3440 that enables the fascia 3440 to be displaced through an opening 3430o in the housing 3430. The fas cia 3440 can also rotate and pivot about the translation axis at a translation axis and a pivot axis 3440ap that can be defined by a translation rod 3440t and a pin 3440i, respectively. Thus, the instrument electronics 3420 may be accessible by a user, and further, may be accessible without the user damaging the housing 3430, the instrument electronics 3420, or the fascia 3440. In addition, since the fascia 3440 remains attached to the housing, the user will not misplace the fascia 3440.

[0217] [Automatic display contrast adjustment] As described above, an interface for a vibratory instrument such as the interface 2502 described above can include a display. The display can have a contrast that allows the display to be read by a user in a nominal state. For example, the display can have a contrast setting in the range of 0 to 100%, and a contrast of 50% is suitable for reading the display at room temperature in normal light. However, when the interface is connected to a vibratory instrument that measures a material at a non-nominal temperature, such as the vibratory instrument 5 described above, for various reasons, the interface is not in the nominal state may occur. The contrast can be set to 50%, but the actual contrast of the display can vary significantly, for example, due to temperature changes within the interface. More specifically, the temperature change of the instrument electronics within the interface changes the actual contrast of the display, which can thereby cause perceptions such as a defective vibratory instrument or an unreadable display.

[0218] Figures 41 to 43 show graphs indicating how parameters within the display of an interface with improved accessibility can be adjusted to ensure that the contrast of the display remains readable. More specifically, Figure 41 shows the relationship between the temperature and contrast of a display indicating that the contrast decreases as the temperature increases, and Figures 42 and 43 show the relationship between the drive voltage and contrast that can be used to compensate for the relationship between the temperature and contrast of the display, as will be described in more detail below.

[0219] Figure 41 shows a graph 4100 indicating the relationship between the temperature and contrast of a display. As shown in Figure 41, graph 4100 includes a temperature axis 4110 in the range of 0 to 100 degrees Celsius, although any suitable temperature range, or other parameters such as environmental parameters, may be used. Graph 4100 also includes a contrast axis 4120 which is a percentage value without units in the range of 0 to 120% of the full contrast. Graph 4100 includes a temperature-contrast plot 4130 that correlates the temperature and contrast of the display.

[0220] The temperature axis 4110 may be a measured value of the ambient temperature within the interface that houses the display. For example, the temperature axis 4110 can represent measured values of a fascia such as fascia 2540 described above with reference to Figures 26 to 28. The temperature may be measured at any suitable location by any suitable means. For example, a thermocouple may be within the display substrate to which the display is attached. Additionally or alternatively, the temperature may be measured by indirect means such as an infrared detector directed at the fascia chassis that houses the display.

[0221] The contrast axis 4120 is a measured value of the contrast of a display such as the above-described display 2544. The contrast of the display may be defined as the ratio of the luminance of the brightest color (e.g., white) and the luminance of the darkest color (e.g., black). The display may be powered by an electrical signal having a voltage and / or current. The contrast can correspond to the voltage and / or current. For example, the display is driven by a drive voltage V0 that corresponds to and correlates with the contrast value of the display. The drive voltage V0 may have a positive correlation with the contrast value of the display. That is, the higher the voltage, the larger the contrast value.

[0222] The temperature-contrast plot 4130 shows the relationship between the temperature values on the temperature axis 4110 and the contrast axis 4120. Although the relationship is linear, any suitable relationship may be utilized. As shown by the temperature-contrast plot 4130, the contrast value is also correlated with the temperature value. As can be understood, when the contrast is not suitable for reading, it may be difficult to read the display. Hereinafter, it will be explained that the change in contrast is due to the drive voltage decreasing as the temperature increases.

[0223] FIG. 42 shows a graph 4200 showing the relationship between the drive voltage and the contrast of the display. The graph 4200 includes an electron volume axis 4210 in the range of 0 to about 63 and a drive voltage axis 4220 in the range of 0 to 14 volts. However, in alternative embodiments, any suitable parameters and / or values may be utilized. The graph 4200 also includes an electron volume-drive voltage plot 4230 that correlates the drive voltage values with the display contrast values.

[0224] The electron volume axis 4210 is a register value that sets the drive voltage for controlling the contrast of the display. That is, the electron volume value on the electron volume axis 4210 is a setting in the substrate that drives the display. The setting is performed by setting the register value in the register. The drive voltage value is correlated with the electron volume value. The correlation between the drive voltage value and the electron volume value may be determined at a nominal temperature of 25 degrees Celsius. The determined correlation is expressed as an electron volume-drive voltage plot 4230. Electron volume values from 36 to 63 correspond to contrast display values from 0 to 100 when the nominal temperature is 25 degrees Celsius.

[0225] The electronic volume-driving voltage plot 4230 shows that as the electronic volume increases from 10%, the driving voltage V0 increases accordingly. Note that this relationship is approximately linear from 10%. This linearity can be utilized by compensating the driving voltage for temperature changes. Table 1 below shows the experiments conducted to determine the appropriate relationship between the temperature and the driving voltage to maintain the visual contrast of the display at approximately 50%. to determine the appropriate relationship between the temperature and the driving voltage to maintain the visual contrast of the display at approximately 50%.

[0226]

Table 1

[0227] The voltage values shown in bold and indicated by "(50)" indicate that the observed contrast on the display was approximately 50%, or as close as possible, even when the contrast setting values could be different. For example, at 85 degrees Celsius, the contrast setting was 100, and an observed contrast of 50 or as close as possible to 50 was achieved.

[0228] The driving voltage can be compensated by using the following equation that relates the substrate temperature BT and the contrast setting value CS.

Equation

[0229]

Table 2

[0230] As can be seen, the contrast setting can be varied based on the substrate temperature to ensure that the observation contrast setting is maintained at an optimal observation contrast, which may be approximately 50%. However, alternative methods for compensating the drive voltage for temperature may be utilized. For example, the drive voltage may be compensated by other means that do not necessarily require a temperature measurement, as described below.

[0231] FIG. 43 shows a graph 4300 illustrating the relationship between drive voltage and contrast of a display. The graph 4300 has a drive voltage axis 4310 ranging from 10 to 11.8 volts and a contrast axis 4312 ranging from 0 to 120%. Graph 4300 also includes a drive voltage-contrast plot 4330 correlating drive voltage values ​​with display contrast targets. Drive voltage-contrast plot 4330 is based on Table 3 below. As described below, the drive voltage-contrast Also shown is an analytical drive voltage-contrast plot 4330 that can be derived from the empirical data of the contrast plot 4340.

[0232] [Table 3]

[0233] The drive voltage can be related to the actual contrast by using an electronic volume-drive voltage relationship, such as electronic volume-drive voltage plot 4230 described above with reference to FIG. 42, which is shown in the following relationship:

number

[0234] The above formula [3] can be used when 10 < EV < 63. From this specification, it can be determined that the change in drive voltage ΔV0 can be related to the change in electron volume ΔEV by the following formula. The change in drive voltage ΔV0 can be related to the change in electron volume ΔEV by the following formula. ΔV0 = 0.058 * ΔEV Formula [4] In the formula, ΔV0 is the change in drive voltage, ΔEV is the change in electron volume.

[0235] As described above with reference to FIG. 42, since the electron volume has a linear relationship with the contrast, to determine the relationship between the electron volume and the contrast C, the ratio of the electron volume EV (i.e., 63 to 36) to the full scale corresponding to the contrast C (i.e., 100 to 0) can be used to represent the electron volume EV. From this relationship, the change in electron volume ΔEV can be related to the change in contrast ΔC by the following relationship.

Number

[0236] From the above two formulas [4] and [5], the change in drive voltage ΔV0 can be related to the change in contrast ΔC by the following relationship. The change in drive voltage ΔV0 can be related to the change in contrast ΔC by the following relationship. ΔV0 = 0.058 * 0.27 * ΔC Formula [6] To maintain the drive voltage ΔV0 at a stable value, the following relationship can be utilized. ΔC = -63.8 * ΔV0 Formula [7]

[0237] As shown in Table 3 above, the actual drive voltage V0 and contrast test data can be used. It is possible. From the contrast-driving voltage V0 data, the following relationship can be derived. C = -63.607 * V0 + 756.01 Equation [8] In the formula, C is the contrast setting in percentage. Therefore, the driving voltage can be related to the contrast setting of the display in order to maintain the observed contrast at, for example, 50%.

[0238] As can be understood from Table 3, Equation [8], the analysis driving voltage-contrast plot 4340, and the driving voltage-contrast plot 4330 relate the operating value, which is the measured temperature as shown in the figure, to the actual contrast value. That is, Equation [8], the analysis driving voltage-contrast plot 4340, and the driving voltage-contrast plot 4330 are the driving voltage-actual contrast value relationships. It is.

[0239] As shown in Table 3, all the actual contrast values are 50%. Therefore, Equation [8], the analysis driving voltage-contrast plot 4340, and the driving voltage-contrast plot 4330 are the driving voltage-actual contrast value relationships normalized to the 50% actual contrast value. However, other values may be used. For example, without being limited to these, as an example, additional tables can be provided that relate the operating values to the actual contrast values of 30, 40, 60, and 70 percent, respectively.

[0240] As can also be seen from Table 3, the driving voltage-actual contrast value relationship can include the contrast value-driving voltage relationship. More specifically, as shown in Table 3, the contrast values in the "contrast target" column (which may also be called the contrast setting value) can be set based on the operating value so as to maintain the actual contrast value at 50%. Therefore, by adjusting the driving voltage provided to the display based on the determined operating value and the driving voltage-actual contrast relationship, an actual contrast value of 50% can be achieved. The operating value shown in FIG. 3 is temperature. However, the operating value may be the drive voltage provided to the display. For example, as shown in Table 1, the drive voltage provided to the display can be correlated with the temperature in advance by associating the contrast value of the display driving circuit with the drive voltage at various temperatures. Therefore, by measuring the drive voltage provided to the display and comparing it with Table 1, the contrast value or contrast setting value for achieving the desired actual contrast value can be determined. It may be the drive voltage. For example, as shown in Table 1, the drive voltage provided to the display can be correlated with the temperature in advance by associating the contrast value of the display driving circuit with the drive voltage at various temperatures. Therefore, by measuring the drive voltage provided to the display and comparing it with Table 1, the contrast value or contrast setting value for achieving the desired actual contrast value can be determined. More specifically, the drive voltage can be measured, and the contrast value or contrast setting value of the display driver can be determined (e.g., 50%). If the measured drive voltage is 10.2V, a temperature of 85 degrees can be inferred, but this inference may not be necessary. Instead, using Table 1, it can be determined that a 50% actual contrast value can be obtained using a 100% contrast setting value. Alternatively, Equation [8], which is the drive voltage - actual contrast relationship that associates the drive voltage with the contrast value at a 50% actual contrast value, can be used. The contrast value can be correlated with the register value in advance as described above with reference to FIG. 42. The 0% contrast setting value corresponds to an EV value of 36, and the 100% contrast setting value corresponds to an EV value of 63, and the relationship is linear: It can be determined that a 50% actual contrast value can be obtained using a 100% contrast setting value. Alternatively, Equation [8], which is the drive voltage - actual contrast relationship that associates the drive voltage with the contrast value at a 50% actual contrast value, can be used. The contrast value can be correlated with the register value in advance as described above with reference to FIG. 42. The 0% contrast setting value corresponds to an EV value of 36, and the 100% contrast setting value corresponds to an EV value of 63, and the relationship is linear:

[0241] More specifically, the drive voltage can be measured, and the contrast value or contrast setting value of the display driver can be determined (e.g., 50%). If the measured drive voltage is 10.2V, a temperature of 85 degrees can be inferred, but this inference may not be necessary. Instead, using Table 1, it can be determined that a 50% actual contrast value can be obtained using a 100% contrast setting value. Alternatively, Equation [8], which is the drive voltage - actual contrast relationship that associates the drive voltage with the contrast value at a 50% actual contrast value, can be used. The contrast value can be correlated with the register value in advance as described above with reference to FIG. 42. The 0% contrast setting value corresponds to an EV value of 36, and the 100% contrast setting value corresponds to an EV value of 63, and the relationship is linear: The contrast value can be correlated with the register value in advance as described above with reference to FIG. 42. The 0% contrast setting value corresponds to an EV value of 36, and the 100% contrast setting value corresponds to an EV value of 63, and the relationship is linear:

Equation

[0242] FIGS. 44 to 46 show an instrument electronic device 4420 for improving the accessibility of the interface. As shown in FIG. 44, the instrument electronic device 4420 includes a display 4440, a processor 4420p, and a display driving circuit 4420d coupled to the processor 4420p. The display driving circuit 4420d is configured to provide a drive voltage 4420dv to the display 4440. The display driving circuit 4420d is configured to provide a drive voltage 4420dv to the display 4440. The The sampling circuit 4420s communicably coupled to the display driving circuit 4420d is configured to sample the driving voltage 4420dv and provide a driving voltage value 4420ds to the processor 4420p. The display driving circuit 4420d may be configured to determine the driving voltage 4420dv from register values such as the above-described electronic volume value. The electronic volume value may be set by the processor 4420p. The temperature sensor 4420t is optionally coupled to the processor 4420p.

[0243] The instrument electronic device 4420 may be the same as or similar to the above-described instrument electronic device 20, but any suitable instrument electronic device may be used. For example, the instrument electronic device 4420 may be the above-described instrument electronic device 20 having an additional temperature sensor 4420t disposed proximate to the display driving circuit 4420d.

[0244] The temperature sensor 4420t may be a thermocouple, a resistance temperature detector, an infrared detector, or the like. The temperature sensor 4420t may be configured to detect the temperature of the instrument electronic device 4420. The temperature sensor 4420t can provide a signal such as an analog signal to the processor 4420p. The temperature sensor 4420t can detect any suitable portion of the instrument electronic device 4420 where temperature variations may cause the driving voltage to vary up to 4420dv. For example, the temperature sensor 4420t may be configured to detect the temperature of the display driving circuit 4420d.

[0245] The display driving circuit 4420d may be configured to provide the driving voltage 4420dv to the display. The amplitude of the driving voltage 4420dv may be determined by the display driving circuit 4420d based on register values within the registers of the display driving circuit 4420d. The register values may be set by the processor 4420p. The processor 4420p may set the register value based on the drive voltage value 4420ds provided to the processor 4420p by the sampling circuit 4420s.

[0246] The sampling circuit 4420s measures the drive voltage 4420dv and samples a signal representative of the drive voltage 4420dv. For example, the arithmetic processor 4420p may be configured to provide the arithmetic processor 4420p with the arithmetic processor 4420p. As described, the sampling circuit 4420s may be a voltage divider circuit that adjusts the drive voltage provided to the processor 4420p. More specifically, the sampling circuit 4420s may proportionally reduce the drive voltage 4420dv to a scale suitable for the processor 4420p. In addition, the sampling circuit 4420s may digitize the sampled and adjusted drive voltage 4420dv, The digitized signal can be provided to a processor 4420p as a drive voltage value 4420ds.

[0247] The display 4440 may be a liquid crystal display (LCD), a light emitting diode (LED) display, etc. Any suitable display whose contrast can be affected by environmental conditions such as temperature may be utilized. For example, the brightness of an LED may be adversely affected by environmental conditions. This can potentially result in a negative effect on the contrast of the LED. As shown, the display 4440 may be an LCD having pixels that may be black or white, depending on the drive voltage 4420dv.

[0248] Figure 47 shows a method 4700 for improving the accessibility of an interface. As shown in Figure 47, method 4700 determines an operating value in step 4710. The operating value can correspond to the temperature of an instrument electronic device, such as the aforementioned instrument electronic device 4420, that provides a drive voltage to the display. In step 4720, method 4700 adjusts the drive voltage provided to the display based on the determined operating value.

[0249] Method 4700 can further include determining a contrast value based on the determined operating value. For example, the contrast value can be determined within a range of 0 to 100 percent that compensates the drive voltage for the temperature of the instrument electronic device. For example, a nominal value of 50% contrast may be readable at 25 degrees Celsius, but a 100% contrast value may be required to ensure that the display is readable at 85 degrees Celsius.

[0250] Method 4700 can also set a register value in the display drive circuit based on the determined contrast value. The determined contrast value may be associated with a register setting value. For example, the register value may be an electronic volume value that correlates with the contrast value. Referring to the foregoing description as an example, a 100% contrast value can correlate with an electronic volume value of 63. Therefore, if it is determined that a 100% contrast value corresponds to the operating value, an electronic volume value of 63 can be set in the display drive circuit. The operating value may be the drive voltage provided to the display. For example, as described above, the drive voltage can increase or decrease in proportion to the temperature of the instrument electronic device, particularly the display drive circuit. Therefore, the drive voltage corresponds to the temperature of the instrument electronic device. The contrast value may be determined from the drive voltage. For example, the contrast value can be determined using the aforementioned drive voltage-contrast plot 4330. For example, if the drive voltage is 10.2 volts

[0251] ​When it is [a certain condition], the contrast value may be 100%.

[0252] Additionally or alternatively, the contrast value may be determined based on the relationship between the temperature of the instrument electronics and the contrast value. For example, as described above, when the substrate temperature BT is between 20 degrees Celsius and 85 degrees Celsius, the contrast value can be determined from CS = 0.83 * BT + 29.35, where the contrast setting value CS is the contrast value.

[0253] The above-described instrument electronics 4420 and method 4700 can improve the accessibility of interfaces such as interface 2. The accessibility of the interface can be improved by compensating the contrast of the display 4440 with respect to the temperature of the instrument electronics 4420. In particular, the instrument electronics 4420 can compensate the drive voltage 4420dv of the display 4440. The drive voltage 4420dv can be compensated based on the measured temperature of the instrument electronics 4420, the display drive circuit 4420d, etc. Additionally or alternatively, the drive voltage 4420dv may be compensated based on the drive voltage 4420dv. This latter method can make it possible to compensate the drive voltage 4420dv without using a temperature sensor. Due to the contrast being compensated, the actual contrast of the display 4440 can be consistent, thereby improving the perceived quality and accessibility of the interface.

[0254] The detailed description of the above embodiments is not an exhaustive description of all embodiments that the inventors believe to be within the scope of the present disclosure. In fact, those skilled in the art will recognize that the specific elements of the above embodiments may be variously combined or eliminated to create additional embodiments, and such additional embodiments will fall within the scope and teachings of the present disclosure. Also, it will be apparent to those skilled in the art that the above embodiments may be combined in whole or in part to create additional embodiments within the scope and teachings of the present disclosure.

[0255] Accordingly, specific embodiments are described herein for purposes of illustration, but as will be understood by those skilled in the art, various equivalent modifications are possible within the scope of this specification. The teachings provided herein can be applied to other interfaces not only to the embodiments described above and shown in the accompanying drawings, but also to improve the accessibility of the interface. Accordingly, the scope of the above embodiments should be determined from the appended claims.

Claims

1. An interface (402, 502, 602, 1202) with improved accessibility, The surface (402, 502, 602, 1202) Housing (430, 530, 630, 1230) and Meter electronics (420, 520) disposed inside the housing (430, 530, 630, 1230) , 620, 1220), wherein the meter electronics (420, 520, 620, 1220) is configured to secure to a connector (450, 550, 650, 1250) extending into the housing (430, 530, 630, 1230).

2. The interface (502) of claim 1, wherein the housing (530, 1230) is rotatably coupled to the connector (550, 1250) that extends into the housing (530, 1230). 、1202）。

3. The meter electronics (1220) An electronic device board (1220b); a shell (1220s) secured to the electronics board (1220b), the shell (1220s) adapted to be secured to the connector (1250) extending into the housing (1230). The interface (1202) of claim 1,

4. 2. The interface of claim 1, wherein the connector extending into the housing is part of a feedthrough extending from one of a sensor assembly and a junction box.

5. a receiving disk (617, 1217) rotatably disposed about said connector (650, 1250), at least a portion of said receiving disk (617, 1217) being in contact with a retaining ring (618, 1218) of said connector (650, 1250) and a wall (632, 1232) of said housing (630, 1230) The interface (602, 1202) of claim 1 is disposed between

6. The meter electronics (1220) is adapted to mate with a groove (1217g) in the receiving disc (1217).

6. The interface (402, 502, 602, 1202) of claim 5, further comprising a post (1224p) configured to engage with a threaded hole (1217h) of the containment disk (1217).

7. The interface (602, 1202) of claim 5, wherein the containment disk (617, 1217) includes a lobe (617l, 1217l) that interfaces with one of the groove (618g) and lip (1218b) of the retaining ring (618, 1218) to retain the meter electronics (620, 1220) in the connector (650, 1250) extending into the housing (630, 1230).

8. The meter electronics (1220) a lower meter electronics (1224) configured to secure to the connector (1250) extending into the housing (1230); and upper meter electronics (1222) configured to be secured to the housing (1230) and configured to communicatively couple to the lower meter electronics (1224). The interface described (1202).

9. 1. A method for assembling an interface with increased accessibility, comprising: Providing housing; providing meter electronics and disposing within the housing; providing a connector extending into the housing; and securing the meter electronics to the connector extending into the housing.

10. The method of claim 9 , further comprising rotatably coupling the housing to the connector extending into the housing.

11. Providing the meter electronics and disposing inside the housing includes: Providing an electronic device substrate; providing a shell and securing it to the electronic device substrate; providing a connector extending into the housing; and securing the shell to the connector extending into the housing.

12. 10. The method of claim 9, wherein providing the connector and extending into the housing includes providing a feedthrough and extending into the housing from one of a sensor assembly and a junction box.

13. 10. The method of claim 9, further comprising providing a containment disk and rotatably disposing it around the connector, at least a portion of the containment disk being disposed between a retaining ring of the connector and a wall of the housing.

14. 14. The method of claim 13, wherein providing the meter electronics further comprises providing a post, and providing the receiving disk comprises providing a groove and a threaded hole in the receiving disk, and the method further comprises providing a bolt, the post configured to mate with the groove and the bolt configured to mate with the threaded hole in the receiving disk.

15. 14. The method of claim 13, wherein providing the containment disk includes providing a lobe that mates with one of a groove and a lip of the retaining ring to retain the meter electronics against the connector extending into the housing.

16. 10. The method of claim 9, wherein providing the meter electronics includes providing lower meter electronics configured to secure to the connector extending into the housing, and providing upper meter electronics configured to secure to the housing and configured to communicatively couple to the lower meter electronics.

17. An interface (2202) with improved accessibility, said interface (2502) comprising: Housing (2230) and and a meter electronics (2220), the meter electronics (2220) comprising: An upper instrument electronic device (2222); A lower instrument electronics unit (2224); a barrier plate (2223) disposed between the upper meter electronics (2222) and the lower meter electronics (2224) and coupled to the upper meter electronics (2222) and the lower meter electronics (2224); An upper meter electronics portion (2230u) of the housing (2230) and the housing (2230). said barrier so as to form a watertight seal separating the lower meter electronics portion (2230l) of said a gasket (2230o) disposed in contact between the plate (2223) and the housing (2230); An interface (2202).

18. The barrier plate (2223) includes the gasket (2230) extending beyond the interior of the barrier plate (2223).

20. The interface (2202) of claim 17, wherein there are no holes leading to the interface (2202).

19. The gasket (2230o) is disposed between the housing (2230) and the barrier plate (2223).

20. The interface of claim 17, comprising a compressed O-ring.

20. The interface according to claim 17, wherein the gasket (2230o) disposed in contact between the barrier plate (2223) and the housing (2230) includes the gasket (2230o) disposed in contact between a boss (2230s) of the housing (2230) and the barrier plate (2223). Face (2202).

21. A barrier plate (2223) is disposed adjacent to the gasket (2230o) and is attached to the housing (2230). The interface (2202) of claim 20, further comprising a plurality of fasteners (2230b) configured to fasten to bosses (2230s) of the support (2230).

22. The plurality of fasteners (2230b) are disposed within the upper meter electronics portion of the housing (2230). The interface (2202) of claim 21, disposed on at least one of the lower meter electronics portion (2230u) and the lower meter electronics portion (2230l) of the housing (2230).

23. The plurality of fasteners (2230b) are inserted into the housing (2230) through the barrier plate (2223). The interface (2202) of claim 21, wherein the boss (2230s) is disposed within the boss (2230s).

24. 1. A method for assembling an interface with improved accessibility, comprising: Providing housing; To provide an instrument electronic device, providing upper gauge electronics; providing lower gauge electronics; providing a barrier plate and disposing it between the upper meter electronics and the lower meter electronics; providing meter electronics, the meter electronics including coupling the barrier plate to the upper meter electronics and the lower meter electronics; and disposing a gasket between the barrier plate and the housing and contacting the barrier plate and the gasket to form a watertight seal separating an upper meter electronics portion of the housing and a lower meter electronics portion of the housing.

25. 25. The method of claim 24, wherein providing the barrier plate includes forming the barrier plate without holes beyond an interior of the barrier plate to the gasket.

26. Providing the gasket includes providing an O-ring and connecting the housing and the and compressing the O-ring between a barrier plate.

27. 25. The method of claim 24, wherein disposing the gasket between the barrier plate and the housing and contacting the barrier plate and the housing comprises disposing the gasket between the barrier plate and a boss of the housing and contacting the gasket with the boss of the barrier plate and the housing.

28. 28. The method of claim 27, further comprising disposing a plurality of fasteners adjacent to the gasket and securing the barrier plate to the bosses of the housing using the plurality of fasteners.

29. 30. The method of claim 28, further comprising disposing the plurality of fasteners in at least one of the upper meter electronics portion of the housing and the lower meter electronics portion of the housing.

30. 30. The method of claim 28, further comprising disposing the plurality of fasteners through the barrier plate and into the bosses of the housing.

31. An interface (2502) having improved accessibility, said interface (2502) comprising: a housing (2530) having a display opening (2532); a fascia (2540) disposed within the housing (2530) proximate the display opening (2532), the fascia (2540) including a substrate (2540b) and a wire a transceiver (2548), the substrate (2540b) having a front side (2540ba) facing the display opening (2532) and a rear side (2540bp) facing an interior portion of the housing (2530); The wireless transceiver (2548) is attached to the rear side (2540bp) of the substrate (2540b). a wireless device (2501) disposed through an opening (2540bo) in the substrate (2540b); an interface (2502) configured to communicatively couple to the

32. The fascia (2540) is a fascia member mechanically coupled to the substrate (2540b).

32. The interface of claim 31, further comprising a fascia chassis (2543), the fascia chassis (2543) including a slot (2543s) adjacent the wireless transceiver (2548). S (2502).

33. a display (2544) coupled to the front side (2540ba) of the substrate (2540b) The interface (2502) of claim 31 comprising:

34. The display (2544) is adjacent to the opening (2540bo) of the substrate (2540b). The interface (2502) of claim 33,

35. 34. The interface (2502) of claim 33, wherein the display (2544) is positioned opposite the wireless transceiver (2548) on the substrate (2540b).

36. The wireless transceiver (2548) is connected to the opening (2540b) in the substrate (2540b). ) and disposed adjacent to said slot (2543s) in said fascia chassis (2543).

32. The interface (2502) of claim 31, comprising an antenna (2548a) attached thereto.

37. 1. A method for creating an interface having improved accessibility, comprising: providing a housing having a display opening; providing a fascia and positioning it within the housing proximate to the display opening, the providing the fascia including providing a substrate, the substrate having a front side facing the display opening and a rear side facing an interior portion of the housing; providing a wireless transceiver and disposing it on the rear side of the substrate; and configuring the wireless transceiver to communicatively couple to a wireless device through an opening in the substrate.

38. Providing the fascia includes providing a fascia chassis and mounting the fascia such that a slot in the fascia chassis is adjacent to the wireless transceiver.

38. The method of claim 37, further comprising: mechanically coupling a shear chassis to the substrate.

39. 38. The method of claim 37, further comprising providing a display and bonding it to the front side of the substrate.

40. 40. The method of claim 39, further comprising disposing the display proximate to the opening in the substrate.

41. 40. The method of claim 39, further comprising disposing the display on the substrate opposite the wireless transceiver.

42. 38. The method of claim 37, wherein providing the wireless transceiver includes providing an antenna and positioning the antenna relative to the opening in the substrate and the slot in the fascia chassis.

43. A communication system (2500) for improving accessibility of an interface (2502), the communication system (2500) comprising: Wireless device (2501) and and a fascia (2540) disposed within the housing (2530) of the interface (2502), the fascia (2540) including a substrate (2540b) and a wireless (2548) and The substrate (2540b) faces the display opening (2532) of the housing (2530). The front side (2540ba) and the rear side (2540bp) are The wireless transceiver (2548) is attached to the rear side (2540bp) of the substrate (2540b). and a wireless device is disposed through the opening (2540bo) of the substrate (2540b). A communication system (2500) configured to be communicatively coupled to the communication system (2501).

44. The fascia (2540) is a fascia member mechanically coupled to the substrate (2540b).

44. The communications system (2500) of claim 43, further comprising a fascia chassis (2543), the fascia chassis (2543) including a slot (2543s) adjacent the wireless transceiver (2548).

45. a display (2544) coupled to the front side (2540ba) of the substrate (2540b) The communication system (2500) of claim 43 comprising:

46. The display (2544) is adjacent to the opening (2540bo) of the substrate (2540b).

46. ​​The communication system (2500) of claim 45,

47. 46. ​​The communication system (2500) of claim 45, wherein the display (2544) is positioned opposite the wireless transceiver (2548).

48. The wireless transceiver (2548) is connected to the opening (2540b) in the substrate (2540b). ) and disposed adjacent to said slot (2543s) in said fascia chassis (2543).

44. The communication system (2500) of claim 43, comprising an antenna (2548a).

49. 1. A meter electronics (3220) for improving accessibility of an interface (3202), the meter electronics (3220) comprising: a processor (3228) disposed on the electronics board (3220b); a component (3226) disposed on said electronic device board (3220b), (3226) is coupled to pins of the processor (3228), the pins of the processor (3228) being configured to couple to components (3246) of a display board (3240b) coupled to the electronics board (3220b); The meter electronics (3220), wherein the components (3246) of the display board (3240b) are redundant to the components (3226) of the electronics board (3220b).

50. The pins of the processor (3228) connect the display board (3240b) to the electronics 50. The meter electronics (3220) of claim 49, configured to couple to the component (3246) of the display substrate (3240b) via a connector (3247) that couples to a display substrate (3220b).

51. The meter electronics (3220) of claim 49, wherein the component (3226) of the electronics board (3220b) is one of a light emitting diode (3226l) and a switch (3226s) of the electronics board (3220b), and the component (3246) of the display board (3240b) is one of a light emitting diode (3246l) and a switch (3246s) of the display board (3240b).

52. 50. The meter electronics (3220) of claim 49, wherein the pin of the processor (3228) is coupled to a first terminal of the component (3226) of the electronics board (3220b) and a second terminal of the component (3226) is coupled to ground (3220g).

53. The display board (3240b) further includes a display board (3240b), and the pins of the processor (3228) are 50. The method of claim 49, further comprising: coupling the display substrate to the component. On-board instrument electronics (3220).

54. The pins of the processor (3228) are connected to the components of the display board (3240b).

54. The meter electronics (3220) of claim 53, wherein a first terminal of a component (3246) of the display substrate (3240b) is coupled to ground (3220g) and a second terminal of the component (3246) of the display substrate (3240b) is coupled to ground (3220g).

55. 50. The meter electronics (3220) of claim 49, further comprising an amplifier (3222a, 3222b) having an output coupled to the component (3226) disposed within the electronics board (3220), the amplifier (3222a, 3222b) being an inverter configured to invert a signal from the processor (3228) to the component (3226).

56. 1. A method for improving accessibility of an interface, comprising: Providing a processor and disposing it on an electronics substrate; Providing a component and disposing it on the electronics substrate; coupling said components to pins of said processor; and configuring the pins of the processor to be coupled to components of a display board coupled to the electronics board; The method, wherein the components of the display substrate are redundant to the components of the electronics substrate.

57. 57. The method of claim 56, wherein configuring the pins of the processor to couple to the components of the display substrate comprises configuring the pins to couple to the components of the display substrate via a connector that couples the display substrate to the electronics substrate.

58. Providing the component of the electronic device board includes: providing one of a gate and a switch on the display substrate; 57. The method of claim 56, wherein providing an element includes providing one of a light emitting diode and a switch on the display substrate.

59. 57. The method of claim 56, wherein coupling the component to the pin of the processor comprises coupling the pin of the processor to a first terminal of the component on the electronics board and coupling a second terminal of the component to ground.

60. 57. The method of claim 56, further comprising providing the display substrate; and coupling the pins of the processor to the components of the display substrate.

61. Coupling the pins of the processor to the components of the display substrate includes coupling the pins of the processor to first terminals of the components of the display substrate. and coupling a second terminal of the component of the display substrate to ground. The method of claim 60, comprising:

62. 57. The method of claim 56, further comprising providing an amplifier having an output and coupling the output to the component disposed within the electronics board, the amplifier being an inverter configured to invert a signal from the processor to the component.

63. An interface (3402) having improved accessibility, said interface (3402) comprising: Housing (3430) and Within the housing (3430), adjacent to the opening (3430o) of the housing (3430), The fascia (3440) is arranged in a a translation rod (3440t) pivotally coupled to the fascia (3440); A translation rod (3440t) is configured to displace the fascia (3440) through the opening (3430o) in the housing (3430), an interface (3402).

64. The translation rod (3440t) pivotally coupled to the fascia (3440) Rotates about a translation axis (3440at) that is collinear with the longitudinal axis of the forward rod (3440t).

64. The interface (3402) of claim 63, comprising the fascia (3440) configured to:

65. The translation rod (3440t) pivotally coupled to the fascia (3440) The forward rod (3440t) is configured to rotate about a pivot axis (3440ap) perpendicular to the longitudinal axis of the forward rod (3440t).

64. The interface (3402) of claim 63, comprising the fascia (3440) formed thereon.

66. The fascia (3440) is changed through the opening (3430o) of the housing (3430).

64. The interface (3402) of claim 63, wherein the translating rod (3440t) configured to position the fascia (3440) comprises the translating rod (3440t) configured to displace the fascia (3440) in a direction collinear with a longitudinal axis of the translating rod (3440t).

67. 64. The interface (3402) of claim 63, wherein the translation rod (3440t) is pivotally coupled to the fascia (3440) at a pivot point (3440p).

68. The pivot point (3440p) is located where the pivot axis (3440ap) and the translation axis (3440at) coincide.

68. The interface (3402) of claim 67, wherein the fascia (3440) pivots about the pivot axis (3440ap) and rotates about the translation axis (3440at).

69. 1. A method for improving accessibility of an interface, the interface comprising: Providing housing; providing a fascia and positioning the fascia within the housing adjacent an opening in the housing; providing a translating rod and pivotally coupling it to the fascia, the translating rod configured to displace the fascia through the opening in the housing.

70. 70. The method of claim 69, wherein pivotally coupling the translation rod to the fascia includes configuring the fascia to rotate about a translation axis collinear with a longitudinal axis of the translation rod.

71. 70. The method of claim 69, wherein pivotally coupling the translating rod to the fascia includes configuring the fascia to rotate about a pivot axis perpendicular to a longitudinal axis of the translating rod.

72. 70. The method of claim 69, wherein configuring the translating rod to displace the fascia through the opening in the housing includes configuring the translating rod to displace the fascia in a direction collinear with a longitudinal axis of the translating rod.

73. 70. The method of claim 69, wherein pivotally coupling the translating rod to the fascia includes pivotally coupling the translating rod to the fascia at a pivot point.

74. 74. The method of claim 73, wherein the pivot point is located at a location where a pivot axis and a translation axis coincide, where the fascia pivots about the pivot axis and rotates about the translation axis.

75. 1. A method for improving accessibility of an interface, comprising:

1. A method comprising: displacing a fascia through an opening in a housing along a translation axis, the fascia configured to at least one of rotate about the translation axis and pivot about a pivot axis.

76. 76. The method of claim 75, further comprising at least one of rotating the fascia about the translation axis and pivoting the fascia about the pivot axis.

77. 77. The method of claim 76, wherein the translation axis and the pivot axis are colocalized at a pivot point, and the fascia is configured to rotate and pivot about the pivot point.

78. 1. A method for improving accessibility of an interface, comprising: Determining an operating value; adjusting a drive voltage provided to the display based on the determined operating value and a drive voltage-actual contrast relationship; The method of claim 1, wherein the operating value corresponds to a temperature of meter electronics that provides the drive voltage.

79. 80. The method of claim 78, further comprising determining a contrast value based on the determined operating value and the drive voltage-actual contrast relationship, and adjusting the drive voltage based on the contrast value.

80. setting a register value in a display driver circuit based on the determined contrast value; 80. The method of claim 79, further comprising:

81. 79. The method of claim 78, wherein the operating value is the drive voltage provided to the display.

82. 82. The method of claim 81, further comprising determining the contrast value from a relationship between the driving voltage and the contrast value.

83. 79. The method of claim 78, wherein the operating value is the temperature of the meter electronics that provides the drive voltage to the display.

84. 84. The method of claim 83, further comprising determining the contrast value based on a relationship between the temperature of the meter electronics and the contrast value.

85. A meter electronics (4420) for improving the accessibility of an interface, said meter electronics (4420) comprising: a processor (4420p) configured to determine an operating value; a display driver circuit (4420d) configured to provide a drive voltage to a display (4440) and adjust the drive voltage based on the operating value and a drive voltage vs. actual contrast relationship; The operating value corresponds to a temperature of meter electronics that provides the drive voltage (4420).

86. The processor (4420p) calculates the determined operating value and the drive voltage-actual control value.

86. The meter electronics (4420) of claim 85, further configured to determine a contrast value based on a test relationship and adjust the drive voltage based on the contrast value.

87. The processor (4420p) controls the display based on the determined contrast value.

87. The method of claim 86, further configured to set a register value in a ray driving circuit (4420d). On-board instrument electronics (4420).

88. 86. The meter electronics (4420) of claim 85, wherein the operating value is the drive voltage provided to the display (4440).

89. The processor (4420p) determines a relation between the driving voltage and the contrast value. The meter electronics (4420) of claim 88, further configured to determine the contrast value.

90. 86. The meter electronics (4420) of claim 85, wherein the operating value is the temperature of the meter electronics (4420) that provides the drive voltage to the display (4440).

91. The processor (4420p) detects the temperature and the contrast of the meter electronics (4420).

91. The meter electronics (4420) of claim 90, further configured to determine the contrast value based on a relationship between a contrast value and a time value.

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