Cleaning method and spinner cleaning device

Abstract

To locally clean or dry an object to be cleaned, such as a wafer while using a spinner cleaning device.SOLUTION: A cleaning method for an object to be cleaned using a spinner cleaning device includes a holding step of holding an object to be cleaned on a holding surface of the spinner cleaning device having a holding table that can rotate around a rotation axis perpendicular to the holding surface, and a first processing step of locally cleaning or drying the object to be cleaned held on the holding table with a first fluid supplied from a first nozzle by combining rotation of the holding table around the rotation axis by a specified rotation angle and relative movement of a first nozzle of the spinner cleaning device with respect to the rotation axis.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a cleaning method for an object to be cleaned using a spinner cleaning device, and to a spinner cleaning device. [Background technology]

[0002] When processing a wafer using a processing device such as a cutting device or a laser processing device, first, a groove is formed on each of a plurality of intended dividing lines arranged in a grid pattern on the surface of the wafer, and then the wafer is cleaned with a spinner cleaning device to remove foreign matter such as particles (dirt, dust, etc.) and processing debris generated when forming the grooves (see, for example, Patent Document 1).

[0003] When cleaning a wafer using a spinner cleaning device, the holding table that holds the wafer by suction is rotated, and the cleaning nozzle that sprays the cleaning liquid is moved back and forth along an arc-shaped trajectory from one point on the outer periphery of the holding table, through the center of the surface of the holding table, to another point on the outer periphery of the holding table.

[0004] However, the above-mentioned grooves are formed in a lattice shape exposed on the surface of the wafer, and have a width of, for example, about 50 μm and a depth of, for example, about 500 μm. Normally, when cleaning a wafer, a cleaning liquid is sprayed onto the wafer from a cleaning nozzle while a holding table holding the wafer is rotated at a relatively high speed (for example, 800 rpm), so that the cleaning fluid is less likely to enter the bottom of the groove and the side surface near the bottom than near the opening of the groove.

[0005] Furthermore, foreign matter may be concentrated in a certain area of ​​the bottom and / or side of the groove in the longitudinal direction of the groove, and when the wafer is cleaned while rotating the holding table at a relatively high speed, it is difficult to sufficiently remove the foreign matter from that area.

[0006] Thus, simply cleaning the entire surface of the wafer cannot adequately clean localized areas such as the bottom and side surfaces of the grooves, and a portion of the groove in its longitudinal direction, nor can it satisfy the requirement to locally dry a portion of the wafer. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] JP 2015-109381 A Summary of the Invention [Problem to be solved by the invention]

[0008] The present invention has been made in view of the above problems, and has as its object to locally clean or dry an object to be cleaned, such as a wafer, while using a spinner cleaning apparatus. [Means for solving the problem]

[0009] According to one aspect of the present invention, there is provided a cleaning method for an object to be cleaned using a spinner cleaning device, the cleaning method comprising: a holding step of holding the object to be cleaned on a holding surface of the spinner cleaning device having a holding table that can rotate around a rotation axis perpendicular to the holding surface; and a first processing step of locally cleaning or drying the object to be cleaned held on the holding table with a first fluid supplied from a first nozzle by combining rotation of the holding table around the rotation axis by a specified rotation angle and relative movement of a first nozzle of the spinner cleaning device with respect to the rotation axis.

[0010] Preferably, in the first processing step, cleaning or drying with the first fluid is performed along a linear area to be cleaned on the object to be cleaned held by the holding table by combining rotation of the holding table by the rotation angle and relative movement of the first nozzle with respect to the rotation axis.

[0011] Preferably, the region to be cleaned corresponds to a linear dividing line existing on the upper surface of the object to be cleaned, and in the first processing step, cleaning or drying with the first fluid is carried out along the dividing line.

[0012] Preferably, the area to be cleaned corresponds to a linear dividing line existing on the upper surface of the object to be cleaned, and in the first processing step, at least one end in the longitudinal direction of the dividing line is washed or dried with the first fluid.

[0013] Preferably, the cleaning method further includes a second processing step, after the holding step and before the first processing step, of spraying a second fluid from a second nozzle of the spinner cleaning device while rotating the holding table holding the object to be cleaned around the rotation axis at a specified rotational speed, and relatively moving the second fluid sprayed from the second nozzle in a path including from the outer periphery of the holding table or the outer periphery of the object to be cleaned held by the holding table to the center of the holding table, thereby cleaning the entire upper surface of the object to be cleaned.

[0014] Preferably, in the first processing step, the object to be cleaned is locally cleaned with the first fluid, and the cleaning method further includes a second processing step of, after the holding step, spraying a second fluid from a second nozzle of the spinner cleaning device while rotating the holding table holding the object to be cleaned around the rotation axis at a specified rotational speed, and relatively moving the second fluid sprayed from the second nozzle in a path including from the outer periphery of the holding table or the outer periphery of the object to be cleaned held by the holding table to the center of the holding table, thereby cleaning the entire upper surface of the object to be cleaned.

[0015] Preferably, in the first processing step, when the object to be cleaned is locally cleaned with the first fluid, the first fluid is pure water, and the cleaning method further includes a local drying step, after the first processing step, of locally drying the area which has been locally cleaned with air, which is a fluid different from the first fluid, by combining rotation of the holding table through the rotation angle and relative movement of the first nozzle with respect to the rotation axis.

[0016] According to another aspect of the present invention, there is provided a spinner cleaning apparatus comprising: a holding table having a holding surface for holding an object to be cleaned; a rotary drive mechanism having a rotation axis arranged perpendicular to the holding surface and fixed to the holding table; a cleaning unit having a first nozzle for spraying a first fluid; a moving mechanism having at least one motor and capable of relatively moving the first fluid sprayed from the first nozzle along a path including from the outer periphery of the holding table or the outer periphery of the object to be cleaned held by the holding table to the center of the holding table; and a controller having a memory and a processor and controlling the operation of the holding table, the rotary drive mechanism, the cleaning unit and the moving mechanism, wherein the controller executes a program stored in the memory to perform a first processing step of locally cleaning or drying the object to be cleaned held by the holding table with the first fluid supplied from the first nozzle by combining rotation of the holding table around the rotation axis by a specified rotation angle and relative movement of the first nozzle with respect to the rotation axis.

[0017] Preferably, the controller combines rotation of the holding table by the rotation angle and relative movement of the first nozzle with respect to the rotation axis to clean or dry the area to be cleaned with the first fluid along a linear area to be cleaned on the object to be cleaned held by the holding table.

[0018] Preferably, the controller specifies the rotation angle based on an orientation of the object held on the holding surface and a relative position of the first nozzle with respect to the holding surface.

[0019] Preferably, the cleaning unit further has a second nozzle different from the first nozzle, and the moving mechanism is capable of relatively moving the second fluid sprayed from the second nozzle, and the controller sprays the second fluid from the second nozzle while rotating the holding table holding the object to be cleaned around the rotation axis at a specified rotational speed, and performs a second processing step in which the entire upper surface of the object to be cleaned is cleaned with the second fluid by relatively moving the second fluid sprayed from the second nozzle in a path including the outer periphery of the holding table or the outer periphery of the object to be cleaned held by the holding table to the center of the holding table.

[0020] Preferably, the controller performs a second processing step in which the first fluid is sprayed from the first nozzle while rotating the holding table holding the object to be cleaned at a specified rotational speed around the rotation axis, and the first fluid sprayed from the first nozzle is moved relatively along a path including from the outer periphery of the holding table or the outer periphery of the object to be cleaned held by the holding table to the center of the holding table, thereby cleaning the entire upper surface of the object to be cleaned with the first fluid. Effect of the Invention

[0021] In a cleaning method and spinner cleaning apparatus according to one embodiment of the present invention, by combining rotation of the holding table around the rotation axis by a specified rotation angle and relative movement of the first nozzle of the spinner cleaning apparatus with respect to the rotation axis, the object to be cleaned held on the holding table can be locally cleaned or dried with a first fluid supplied from the first nozzle. [Brief description of the drawings]

[0022] [Figure 1] FIG. 2 is a flow diagram of a cleaning method according to the first embodiment. [Diagram 2] FIG. [Diagram 3] FIG. [Figure 4] FIG. 2 is a perspective view of a spinner cleaning device. [Diagram 5]FIG. [Figure 6] FIG. 6(A) is a partially sectional side view showing the full cleaning process, and FIG. 6(B) is a top view showing the full cleaning process. [Figure 7] FIG. 7A is a top view of the spinner table when the nozzle is at point PA, and FIG. 7B is a top view of the spinner table when the nozzle is at point PB. [Figure 8] FIG. 8(A) is a top view of the spinner table when the nozzle is between points PB and PC, and FIG. 8(B) is a top view of the spinner table when the nozzle is at point PC. [Figure 9] FIG. 9A is a top view of the spinner table when the nozzle is between points PC and PD, and FIG. 9B is a top view of the spinner table when the nozzle is at point PD. [Figure 10] FIG. 4 is a flow diagram illustrating a predetermined program executed by a processor. [Figure 11] FIG. 11(A) is a partially sectional side view showing the overall drying process, and FIG. 11(B) is a partially sectional side view showing the local drying process. [Figure 12] FIG. 12(A) is a diagram showing an object to be cleaned in a first modified example, and FIG. 12(B) is a diagram showing a plurality of objects to be cleaned in a second modified example. [Figure 13] FIG. 11 is a flow diagram of a cleaning method according to a second embodiment. [Figure 14] FIG. 14(A) is a flow diagram of a cleaning method in the third embodiment, and FIG. 14(B) is a flow diagram of a cleaning method in the fourth embodiment. [Figure 15] FIG. 15(A) is a flow diagram of a cleaning method in the fifth embodiment, FIG. 15(B) is a flow diagram of a cleaning method in the sixth embodiment, and FIG. 15(C) is a flow diagram of a cleaning method in the seventh embodiment. [Figure 16] FIG. 13 shows a modified example of a cleaning unit having two nozzles. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0023] (First embodiment) An embodiment according to one aspect of the present invention will be described with reference to the accompanying drawings. Fig. 1 is a flow diagram of a method for cleaning an object 23 (see Fig. 3) using a spinner cleaning device 30 (see Fig. 2) in the first embodiment.

[0024] In this embodiment, the steps are performed in the following order: a holding step S10, a full cleaning step (second processing step) S20, a local cleaning step (first processing step) S30, a full drying step S40, and a local drying step S50. First, the cutting device 2 equipped with the spinner cleaning device 30 will be described with reference to FIG.

[0025] 2, the X-axis direction (machining feed direction), the Y-axis direction (indexing feed direction), and the Z-axis direction (up-down direction) are perpendicular to one another. In addition, in FIG. 2, some of the components constituting the cutting device 2 are shown in functional blocks. FIG. 2 is a perspective view of the cutting device 2.

[0026] The cutting device 2 includes a base 4 that supports or houses each of the components. A cassette elevator 6a is provided at one of the four corners of the base 4. The cassette elevator 6a raises and lowers a rectangular parallelepiped cassette 6b along the Z-axis direction.

[0027] Cassette 6b accommodates a plurality of workpieces 11 to be cut, cleaned, dried, etc. Workpieces 11 include, for example, disk-shaped wafers made of a semiconductor material such as silicon. There are no limitations on the material, shape, structure, size, etc., of workpieces 11.

[0028] For example, a substrate or the like formed of other materials such as semiconductors, ceramics, resins, metals, etc. can also be used as the workpiece 11. A plurality of mutually intersecting planned dividing lines 13 (see FIG. 3) are set on the surface 11a of the workpiece 11.

[0029] Devices 15 (see FIG. 3) such as ICs (Integrated Circuits) are formed in each of the multiple regions partitioned by the multiple planned division lines 13. However, there are no limitations on the type, number, shape, structure, size, arrangement, etc. of the devices 15. The devices 15 do not necessarily have to be formed on the workpiece 11.

[0030] A resin dicing tape 17 having a diameter larger than that of the workpiece 11 is attached to the rear surface 11b of the workpiece 11. A metal ring frame 19 is fixed to the outer periphery of the dicing tape 17.

[0031] Each workpiece 11 is accommodated in the cassette 6b in the form of a frame unit 21 supported by a ring frame 19 via a dicing tape 17. Returning to Fig. 2, an opening 4a is provided in the center of the upper surface of the base 4, with its longitudinal portion aligned along the X-axis direction.

[0032] A rectangular table cover 10 is disposed within the opening 4a. On both sides of the table cover 10 in the X-axis direction, bellows-shaped covers 12 that are extendable and contractible along the X-axis direction are provided. A disk-shaped chuck table 14 is fixed onto the table cover 10.

[0033] The chuck table 14 has a disk-shaped frame made of metal. A disk-shaped recess is formed in the frame in a manner that the recess is exposed on the upper surface of the frame, and a disk-shaped porous plate made of porous ceramics is fixed in the recess.

[0034] A suction source (not shown) such as a vacuum pump is provided inside the base 4, and when negative pressure generated by this suction source is transmitted to the porous plate via the frame, the negative pressure is transmitted to the upper surface of the porous plate. The upper surfaces of the frame and the porous plate are substantially flush with each other, forming a holding surface 14a that is disposed substantially parallel to the XY plane.

[0035] A rotation drive mechanism (not shown) such as a motor is provided below the chuck table 14. This rotation drive mechanism allows the chuck table 14 to rotate by any angle around a rotation axis disposed approximately parallel to the Z-axis direction.

[0036] The chuck table 14, the table cover 10, and the rotary drive mechanism are supported by a ball screw type X-axis direction moving mechanism (not shown). When the chuck table 14 and the like are moved along the X-axis direction by the X-axis direction moving mechanism, the cover 12 expands and contracts so as to follow the position of the chuck table 14.

[0037] Gate-shaped supports 4b and 4c are provided above the opening 4a so as to straddle the opening 4a. A first transport unit 16a is provided on the surface of the support 4b, which transports the frame unit 21 while gripping or sucking it between the cassette 6b and the chuck table 14.

[0038] Further, a second transport unit 16b is provided on the surface of the support 4b for transporting the frame unit 21 from the chuck table 14 to the spinner cleaning device 30 under suction in a manner that does not interfere with the first transport unit 16a.

[0039] The frame unit 21 cleaned by the spinner cleaning device 30 is transported by the first transport unit 16a from the spinner cleaning device 30 to the chuck table 14. A pair of cutting unit moving mechanisms (not shown) for moving the cutting unit 18 along the Y-axis and Z-axis directions, respectively, are provided on the surface of the support body 4c.

[0040] The pair of cutting unit moving mechanisms share a pair of Y-axis guide rails (not shown) arranged substantially parallel to the Y-axis direction. A pair of Y-axis moving plates 26a are slidably attached to the pair of Y-axis guide rails.

[0041] A nut portion (not shown) is provided on the back surface of each of the Y-axis direction moving plates 26a. A screw shaft (not shown) arranged along the Y-axis direction is rotatably coupled to one nut portion via a plurality of balls (not shown).

[0042] A stepping motor (not shown) is connected to one end of the screw shaft. When the screw shaft is rotated by the stepping motor, the Y-axis direction moving plate 26a moves along the Y-axis direction.

[0043] A Z-axis guide rail (not shown) arranged substantially parallel to the Z-axis direction is fixed to the surface of each Y-axis moving plate 26a. A Z-axis moving plate 26b is slidably attached to the Z-axis guide rail.

[0044] A nut portion (not shown) is provided on the back surface of the Z-axis direction moving plate 26b, and a screw shaft (not shown) arranged approximately parallel to the Z-axis direction is rotatably connected to this nut portion via a plurality of balls (not shown).

[0045] A stepping motor 26c is connected to the upper end of the screw shaft. When the stepping motor 26c rotates the screw shaft, the Z-axis direction moving plate 26b moves along the Z-axis direction. The above-mentioned cutting unit 18 is fixed to the lower end of the Z-axis direction moving plate 26b.

[0046] The cutting unit 18 has a rectangular parallelepiped spindle housing with its longitudinal portion aligned along the Y-axis direction. A part of a cylindrical spindle with its longitudinal portion aligned along the Y-axis direction is accommodated inside the spindle housing. The spindle is rotatably supported by the spindle housing using an air bearing or the like.

[0047] A stator (not shown) is arranged inside the spindle housing so as to surround the side of the spindle, and the spindle functions as a rotor. A cutting blade with an annular cutting edge is attached to the tip of the spindle protruding outside the spindle housing in the Y-axis direction.

[0048] A blade cover is attached to the tip of the spindle housing. The blade cover has a pair of L-shaped cooler nozzle units arranged to sandwich the front and back sides of the cutting blade, and a shower nozzle unit arranged to face the outer circumferential side surface of the cutting blade.

[0049] When cutting the workpiece 11, the orientation of the chuck table 14 is adjusted so that the planned division line 13 is approximately parallel to the X-axis direction, and the lower end of the cutting blade rotating at high speed is positioned radially outside the holding surface 14a at a predetermined height position between the surface 11a and the holding surface 14a, and the position of the cutting blade in the Y-axis direction is adjusted.

[0050] After adjusting the relative positions of the cutting blade and the workpiece 11, the chuck table 14 is moved in the X-axis direction to form one cutting groove 13a on one planned division line 13 as shown in Fig. 3. During the rotation of the cutting blade, cutting water such as pure water is continuously supplied to the cutting blade from the cooler nozzle and the shower nozzle.

[0051] Next, after the cutting unit 18 is moved in the Y-axis direction by a predetermined indexing feed amount, one cutting groove 13a is similarly formed on another one of the planned division lines 13. In this manner, after one cutting groove 13a is formed on each of all the planned division lines 13 along one direction, the chuck table 14 is rotated approximately 90 degrees.

[0052] Similarly, one cutting groove 13a is formed on each of all the division lines 13 along the other direction perpendicular to the one direction. In this embodiment, the workpiece 11 on which the cutting grooves 13a are formed is the object to be cleaned 23 that is the object to be cleaned. Fig. 3 is a perspective view of the object to be cleaned 23.

[0053] The cut groove 13a shown in FIG. 3 is a groove having a depth that reaches from the front surface 11a to the back surface 11b (a so-called full-cut groove), but the cut groove 13a may also be a groove having a depth that does not reach from the front surface 11a to the back surface 11b (a so-called half-cut groove).

[0054] Returning to Fig. 2, the cutting device 2 will be further described. In addition to the cutting unit 18, a microscope camera unit 28 is fixed to the lower end of the Z-axis direction moving plate 26b. The microscope camera unit 28 includes a lens, a solid-state imaging element, etc., and captures an image of a subject using, for example, visible light.

[0055] The image obtained by capturing an image of the workpiece 11 held on the holding surface 14a with the microscope camera unit 28 is used to adjust the orientation of the chuck table 14, adjust the relative position between the cutting blade and the workpiece 11, check the kerf, etc.

[0056] In the Y-axis direction, a circular opening 4d is provided on the opposite side of the cassette elevator 6a with the opening 4a in between. A spinner cleaning device 30 for cleaning the object 23 is provided in the opening 4d.

[0057] Fig. 4 is a perspective view of the spinner cleaning device 30. Some of the components are shown as functional blocks in Fig. 4. The spinner cleaning device 30 has a spinner table (holding table) 32 in a disk shape.

[0058] The spinner table 32 has a disk-shaped frame body made of metal and a disk-shaped porous plate made of porous ceramics, similar to the above-mentioned chuck table 14. A porous plate having approximately the same diameter as the recessed portion is fixed to a recessed portion exposed on the upper surface of the frame body.

[0059] The negative pressure generated by the suction source is transmitted to the upper surface of the porous plate. The upper surfaces of the frame and the porous plate are substantially flush with each other, forming a holding surface 32a that is substantially parallel to the XY plane. A plurality of pendulum-type clamps 32b (four in the example shown in FIG. 4) are provided on the outer periphery of the holding surface 32a.

[0060] When the spinner table 32 rotates at a predetermined speed or faster, the tips of the claws constituting the clamps 32b are pressed toward the holding surfaces 32a by centrifugal force, whereby the ring frame 19 is clamped between the holding surfaces 32a and the clamps 32b.

[0061] A rotation shaft 34 is provided at the bottom of the spinner table 32, in the center in the radial direction of the spinner table 32. The rotation shaft 34 is disposed so that its longitudinal portion is substantially parallel to the Z-axis direction. In other words, the rotation shaft 34 is disposed so as to be perpendicular to the holding surface 32a.

[0062] The center of the rotation shaft in the XY plane substantially coincides with the center 32c of the holding surface 32a. The rotation shaft is fixed to the spinner table 32, and is rotated by a motor (servo motor) .

[0063] The motor 36 is electrically connected to a controller 62 (described later) via a driver circuit 38. The controller 62 sends a pulse signal, defined by high and low voltage, to the driver circuit 38, thereby controlling the rotation of the motor 36 (i.e., the rotating shaft 34).

[0064] Specifically, the number of rotations per unit time (i.e., rpm (hereinafter referred to as rotational speed)) of motor 36 is adjusted according to the number of pulse signals per unit time, and the rotation angle (i.e., angle: degree) in the XY plane is adjusted according to the number of input pulse signals.

[0065] In addition, the motor 36 has a built-in rotary encoder (not shown) that can detect the rotation speed and rotation angle of the rotating shaft 34. The rotating shaft 34, the motor 36, the driver circuit 38, the rotary encoder, etc. constitute a rotary drive mechanism 40 for rotating the spinner table 32.

[0066] For example, when a pulse signal specifying a rotation speed is input from the controller 62, the driver circuit 38 supplies power to the motor 36 so as to realize this rotation speed. At this time, the actual rotation speed of the rotating shaft 34 obtained by using a rotary encoder is fed back to the driver circuit 38.

[0067] The driver circuit 38 adjusts the power to the motor 36 so that the fed back actual rotation speed is equal to the commanded rotation speed if it differs from the commanded rotation speed, thus achieving the rotation speed commanded by the controller 62.

[0068] Furthermore, for example, when a rotation angle is specified by the controller 62, the driver circuit 38 supplies power to the motor 36 so as to realize this rotation angle. At this time, the actual rotation angle of the rotating shaft 34 obtained using a rotary encoder is fed back to the driver circuit 38.

[0069] If the feedback actual rotation angle differs from the specified rotation angle, the driver circuit 38 adjusts the power to the motor 36 so that the actual rotation angle becomes equal to the specified rotation angle. In this way, the rotation angle specified by the controller 62 is realized.

[0070] The motor 36 is housed in a cylindrical housing. A plurality of air cylinders 42 (three in the example shown in FIG. 4) are provided around the housing. Each air cylinder 42 moves the spinner table 32 up and down by synchronously adjusting the amount of protrusion of the piston rod.

[0071] For example, when the object 23 is carried in or out of the spinner table 32, the spinner table 32 is positioned relatively high. In contrast, when the object 23 is washed or dried, the spinner table 32 is positioned relatively low.

[0072] A cylindrical outer cover 44 is provided on the radial outside of the spinner table 32. The outer periphery of an annular bottom plate portion 44a is fixed to the inner periphery of the outer cover 44. The bottom of a cylindrical inner wall portion 44b is fixed to the inner periphery of the bottom plate portion 44a.

[0073] The outer cover 44, the bottom plate 44a and the inner wall 44b function as an annular water receiving portion, in which used liquid is temporarily stored. A drain outlet 44d is formed in a part of the bottom plate 44a. A drain hose 44e is connected to the drain outlet 44d, and the used liquid stored in the water receiving portion is discharged from the drain hose 44e.

[0074] In the XY plane view, a relatively thin rotating shaft 46 is provided between the spinner table 32 and the outer cover 44. The longitudinal portion of the rotating shaft 46 is disposed substantially parallel to the Z-axis direction, and a motor 48a that rotates the rotating shaft 46 within a predetermined angle range is connected to the bottom of the rotating shaft 46.

[0075] The rotation of the rotating shaft 46 is not a simple rotation in one direction, but an oscillation in which rotation in one direction and rotation in the opposite direction are alternated. The motor 48a constitutes an oscillation mechanism (movement mechanism) 48.

[0076] The base end of an arm 50 is fixed to the upper end of the rotating shaft 46 so as to be perpendicular to the rotating shaft 46. In addition, nozzles (first nozzle, second nozzle) 52 are fixed to the tip of the arm 50 so that the nozzles face directly downward.

[0077] The nozzle 52 and the arm 50 constitute a cleaning unit 54. Although the nozzle 52 in this embodiment has an ejection port facing directly downward, the orientation of the ejection port may be slightly tilted with respect to the Z-axis direction.

[0078] The swing mechanism 48 swings the rotary shaft 46, whereby the nozzle 52 moves back and forth along an arc-shaped path of a predetermined length passing through the center of the holding surface 32a within the XY plane, for example. At this time, the nozzle 52 sprays fluids (first fluid, second fluid) such as liquid, gas, or gas-liquid mixed fluid.

[0079] A liquid supply device 56 for supplying liquid and an air supply device 58 for supplying air are connected to the nozzle 52. Note that, although one set of the liquid supply device 56 and the air supply device 58 is usually provided per factory or per building, one set may be provided for one spinner cleaning device 30.

[0080] The liquid supply device 56 includes a storage tank (not shown) for storing liquid such as pure water, an acidic cleaning solution, an alkaline cleaning solution, etc., and a pump (not shown) for sending the liquid from the storage tank to the nozzle 52. The air supply device 58 includes a compressor (not shown) for taking in and compressing air, a tank (not shown) for storing the compressed air, a filter for removing dust, etc.

[0081] The fluid sprayed from the nozzle 52 is, for example, (1) pure water, (2) air, (3) a gas-liquid mixture fluid in which pure water and air are mixed (including pure water containing microbubbles, nanobubbles, etc.), (4) an acidic cleaning liquid (for example, a mixture of sulfuric acid, hydrochloric acid, or hydrofluoric acid and hydrogen peroxide solution), or (5) an alkaline cleaning liquid (for example, a mixture of an ammonium hydroxide solution and hydrogen peroxide solution).

[0082] Whether the nozzle 52 sprays liquid or gas is controlled by a first solenoid valve (not shown) provided between the nozzle 52 and the liquid supply device 56, and a second solenoid valve (not shown) provided between the nozzle 52 and the air supply device 58.

[0083] In addition, in the nozzle 52, the flow path for the liquid and the flow path for the gas intersect near the nozzle outlet of the nozzle 52, and when the nozzle 52 injects a gas-liquid mixed fluid, the first solenoid valve and the second solenoid valve are both opened, and the liquid and gas are mixed near the opening of the nozzle 52.

[0084] A microscope camera unit 60 is provided above the spinner table 32. The microscope camera unit 60 is used to designate an area to be cleaned or dried in a local cleaning step S30 and a local drying step S50, which will be described later.

[0085] The microscope camera unit 60 is movable along the Z-axis direction and at least one of the X- and Y-axis directions by an actuator (not shown) controlled by a controller 62.

[0086] 2 again. An exterior panel (not shown) is provided above the base 4, and the upper and side surfaces of the supports 4b, 4c, etc. are covered with the exterior panel. A touch panel (not shown) is provided on one surface of the exterior panel.

[0087] The touch panel functions as a display device that displays images obtained by the microscope camera units 28 and 60, a GUI (Graphical User Interface), processing conditions, etc., and also functions as an input device for the operator to input instructions.

[0088] The operations of the above-mentioned cassette elevator 6a, chuck table 14, X-axis direction moving mechanism, first transport unit 16a, second transport unit 16b, a pair of cutting unit moving mechanisms, a pair of cutting units 18, microscope camera unit 28, spinner cleaning device 30 (i.e., spinner table 32, driver circuit 38, cleaning unit 54, rocking mechanism 48, microscope camera unit 60, etc.), liquid supply device 56, air supply device 58, touch panel, etc. are controlled by a controller 62.

[0089] The controller 62 is configured by a computer having a processor (processing device) 62a, such as a CPU (Central Processing Unit), and a memory (storage device) 62b. The memory 62b includes a main storage device such as a DRAM (Dynamic Random Access Memory), and an auxiliary storage device such as a flash memory, a hard disk drive, or a solid state drive.

[0090] The auxiliary storage device stores software including a predetermined program. The functions of the controller 62 are realized by operating the processor 62a and other components in accordance with this software.

[0091] Next, with reference to Fig. 5 to Fig. 11(B), a method for cleaning the object 23 using the spinner cleaning device 30 will be described according to the flow diagram of Fig. 1. After the cutting process, the frame unit 21 including the object 23 is transported from the chuck table 14 to the spinner table 32 by the second transport unit 16b.

[0092] 5 is a diagram showing a holding step S10 in which the frame unit 21 transported to the spinner table 32 is suction-held on the holding surface 32a. In the holding step S10, the object to be cleaned 23 is suction-held on the holding surface 32a via the dicing tape 17.

[0093] After the holding step S10, a full cleaning step S20 is performed in which the entire surface (upper surface) 11a of the object to be cleaned 23 is cleaned by spin cleaning. Fig. 6(A) is a partially sectional side view showing the full cleaning step S20, and Fig. 6(B) is a top view showing the full cleaning step S20.

[0094] In the entire cleaning process S20, the spinner table 32 is rotated around the rotation axis 34 at a specified rotational speed using the motor 36 while spraying pure water (second fluid) 52a from the nozzle 52. At the same time, the pure water 52a sprayed from the nozzle 52 is moved relatively along an arc-shaped path 52c including the outer peripheral edge 32d to the center 32c of the spinner table 32 using the swinging mechanism 48, thereby cleaning the entire surface 11a of the object to be cleaned 23.

[0095] An example of the cleaning conditions in the overall cleaning step S20 is shown below. Pure water flow rate: 1L / min to 2L / min Nozzle movement speed: 20mm / s Spinner table rotation speed: 100 rpm to 1000 rpm (e.g. 800 rpm) Cleaning time: 30s to 90s (e.g., 60s)

[0096] After the overall cleaning step S20, a local cleaning step S30 is performed. That is, in this embodiment, the overall cleaning step S20 is performed before the local cleaning step S30, and the local cleaning step S30 is performed after the overall cleaning step S20. In the local cleaning step S30 of this embodiment, the object 23 is locally cleaned with pure water (first fluid) 52a supplied from a nozzle 52.

[0097] 7(A) to 9(B) are top views showing the local cleaning step S30. Note that the arrangement patterns of the devices 15 shown in Fig. 7(A) to 9(B) are different from the arrangement pattern of the devices 15 shown in Fig. 3, but the arrangement patterns are merely examples, and any pattern does not affect the essence of the local cleaning step S30.

[0098] In the local cleaning process S30, a portion of the object 23 to be cleaned is cleaned rather than the entirety by combining rotation of the spinner table 32 around the rotation axis 34 by a specified rotation angle and relative rotational movement of the nozzle 52 with respect to the rotation axis 34.

[0099] Specifically, by spraying pure water 52a from the nozzle 52 while moving the nozzle 52 and the object to be cleaned 23 relative to each other, the object to be cleaned 23 is cleaned with the pure water 52a along the cutting groove 13a (i.e., the planned division line 13), which is a linear area to be cleaned when viewed in the XY plane.

[0100] As described above, since the cutting grooves 13a are formed on each of the planned division lines 13, in the local cleaning step S30, a point P located at one end of one of the cutting grooves 13a in the longitudinal direction is A From the other end, point P D Until it is cleaned.

[0101] Before the start of the local cleaning step S30, the controller 62 grasps the orientation 25 of the object 23 on the holding surface 32a. Specifically, the controller 62 grasps the orientation 25 of the object 23 when it is transferred to the spinner table 32 by the second transfer unit 16b (i.e., initially at the start of the local cleaning step S30), as well as the rotation angle of the spinner table 32.

[0102] The direction 25 of the object to be cleaned 23 is, for example, a direction proceeding from the innermost position of the notch (i.e., the position closest to the center of the object to be cleaned 23 corresponding to the radial center of the workpiece 11) toward the center of the object to be cleaned 23.

[0103] In addition, the controller 62 is aware of the initial position of the nozzle 52 and the amount of movement of the nozzle 52 by the swinging mechanism 48, and therefore always knows the position of the nozzle 52 within the XY plane whose origin is the center 32c of the holding surface 32a.

[0104] In the local cleaning step S30, first, the operator designates the cut groove 13a to be cleaned while the image obtained by the microscope camera unit 60 is displayed on the touch panel. The operator may designate one cut groove 13a, or may select multiple cut grooves 13a or all cut grooves 13a. The use of the microscope camera unit 60 has the advantage that the operator can visually confirm the area to be locally cleaned.

[0105] 7(A) to 9(B), a case where one cutting groove 13a indicated by a broken line is cleaned will be described. In this example, the nozzle 52 is rotated counterclockwise or clockwise at a predetermined speed, and the moving nozzle 52 is moved to a point P A From point P D The rotation angle of the spinner table 32 is adjusted clockwise so that the spinner table 32 moves linearly to the position indicated by the arrows.

[0106] An example of the cleaning conditions in the local cleaning step S30 is shown below. Pure water flow rate: 1L / min to 2L / min Nozzle movement speed: 15mm / s -Spinner table rotation angle: Adjusted appropriately according to the nozzle position

[0107] However, the above-mentioned operations of the nozzle 52 and the spinner table 32 are merely an example, and the moving speed of the nozzle 52 does not have to be constant, and the direction of movement of the nozzle 52 may be not only one direction but also the opposite direction. Also, the direction of rotation of the spinner table 32 is not particularly limited.

[0108] First, the controller 62 determines a point P located on the outer periphery of the object 23 on the division line 13 based on the initial orientation 25 of the object 23 in the XY plane and the initial position of the nozzle 52 relative to the holding surface 32a in the XY plane. A The rotation angle of the spinner table 32 is designated so that the nozzle 52 is positioned at the position indicated by arrow A1 in FIG.

[0109] FIG. 7A shows that the nozzle 52 is at point P A 7(A) to 9(B), the spinner table 32 is omitted and the object 23 on the holding surface 32a is shown. O coincides with the radial center position of the object 23 to be cleaned.

[0110] 7(A) to 9(B), the nozzle 52 is simplified and indicated by a circle, and the rotation path of the nozzle 52 and the division lines 13 and cutting grooves 13a corresponding to the landing points of the pure water 52a are indicated by dashed lines. Although the cutting grooves 13a are formed on each of the division lines 13, the cutting grooves 13a are omitted from the drawings in consideration of the ease of viewing the drawings.

[0111] point P A After the start of cleaning at the position P O The spinner table 32 is rotated counterclockwise relative to the rotation axis 34, and the spinner table 32 is rotated clockwise around the rotation axis 34 by a specified rotation angle, for example, between 0 degrees and 10 degrees, per unit time.

[0112] The rotation angle of the spinner table 32 is specified for each relatively short unit time (for example, 100 ms or 50 ms) so that the pure water 52a enters the cut groove 13a as accurately as possible. The rotation angle of the spinner table 32 may be specified at different angles or the same angle for each unit time.

[0113] FIG. 7B shows that the nozzle 52 is at point P B 1 is a top view of the spinner table 32 when it is at point P. B is the point P A and point P D Point P, which is the midpoint of C And point P A 7B is indicated by a solid line, and for comparison, the orientation 25 of the object 23 to be cleaned in FIG.

[0114] As shown in FIG. 7B, the nozzle 52 is at point P B After reaching position P, the nozzle 52 is continued to be moved to position P O The spinner table 32 is rotated counterclockwise relative to the rotation axis 34, and the spinner table 32 is rotated clockwise around the rotation axis 34 by a specified rotation angle, for example, between 0 degrees and 30 degrees, per unit time.

[0115] FIG. 8A shows that the nozzle 52 is at point P B and point P C 8(A) is shown by a solid line, and for comparison, the orientation 25 of the object 23 to be cleaned in FIG.

[0116] In this example, the nozzle 52 is at point P B and point P C When the nozzle 52 reaches a predetermined position between the positions, it reaches a limit point where the remaining cut groove 13a cannot be cleaned if the moving direction of the nozzle 52 is kept counterclockwise.

[0117] Then, the nozzle 52 is at point P B and point P C After reaching a predetermined position between the positions P and P, the nozzle 52 changes its rotation direction and moves the nozzle 52 to the position P. O The spinner table 32 is rotated clockwise around the rotation axis 34 by a specified rotation angle, for example, between 0 degrees and 90 degrees, per unit time.

[0118] FIG. 8B shows that the nozzle 52 is at point P C 8(B) is shown by a solid line, and for comparison, the orientation 25 of the object 23 in FIG 8(A) is shown by a dashed line.

[0119] FIG. 9A shows that the nozzle 52 is at point P C and point P D 9(A) is shown by a solid line, and for comparison, the orientation 25 of the object 23 to be cleaned in FIG 8(B) is shown by a dashed line.

[0120] FIG. 9B shows that the nozzle 52 is at point P D 9(B) is shown by a solid line, and for comparison, the orientation 25 of the object 23 in FIG 9(A) is shown by a dashed line.

[0121] In this embodiment, since only one cut groove 13a can be locally cleaned, the amount and number of foreign matter such as processing waste remaining on the bottom and side of the cut groove 13a can be reduced compared to the case where only the whole cleaning step S20 is performed. That is, high cleaning quality for the cut groove 13a can be achieved.

[0122] Such relative movement of the nozzle 52 and the spinner table 32 is realized by executing a predetermined program stored in the auxiliary storage device (memory 62b). Figure 10 is a flow diagram illustrating the predetermined program executed by the processor 62a.

[0123] The time Δt in S2 in FIG. 10 is the above-mentioned relatively short unit time (for example, 100 ms or 50 ms). In addition, the threshold value of the deviation between the planned division line 13 and the nozzle 52 in the XY plane in S3 is set to a predetermined value (for example, 50 μm or 100 μm). Furthermore, the limit point in S4 is the point P B and point P C It is a designated position between.

[0124] 7(A) to 9(B), the case where one cut groove 13a is cleaned is described, but it is of course possible to clean a plurality of cut grooves 13a in the same manner. Note that at the cutting start position of the workpiece 11, a relatively large amount of foreign matter tends to remain in the cut groove 13a.

[0125] Therefore, in the local cleaning step S30, at least one end portion in the longitudinal direction of the intended division line 13 (i.e., point P of the cut groove 13a) A Or point P D For example, the nozzle 52 and the spinner table 32 may be kept stationary for a predetermined time, and the area around the point P A Pure water 52a is sprayed to the

[0126] This results in point P A From point P DCompared with the case where the cutting start position is uniformly washed with the pure water 52a at a predetermined flow rate, a high washing quality can be achieved at the cutting start position even for the same washing time. Of course, among the multiple cutting grooves 13a, one end of the cutting groove 13a, which is the cutting start position, may be similarly focused on washing.

[0127] In the local cleaning step S30, one end of the cut groove 13a is intensively cleaned, and then the point P A From point P D The nozzle 52 may be moved to the position where the nozzle 52 reaches ...

[0128] In the above explanation, the orientation of the object 23 to be cleaned is adjusted using the microscope camera unit 60. However, the orientation of the object 23 to be cleaned may be adjusted in advance on the chuck table 14, and then the spinner table 32 and the nozzle 52 may be moved in the spinner cleaning device 30 so that the landing point of the water moves approximately parallel to the intended division line 13 in a specified direction.

[0129] In this case, during a part of the time during the local cleaning step S30, the landing point does not necessarily move only directly above the cut groove 13a, but may move so as to cross the device 15. After the local cleaning step S30 is completed, the process proceeds to the full drying step S40. Fig. 11(A) is a partial cross-sectional side view showing the full drying step S40.

[0130] In the overall drying process S40, the spinner table 32 is rotated around the rotation axis 34 at a specified rotational speed while air 52b is sprayed from the nozzle 52, and the air 52b sprayed from the nozzle 52 is moved relatively along an arc-shaped path 52c including the outer peripheral edge 32d to the center 32c of the spinner table 32.

[0131] This dries the entire surface 11a of the object to be cleaned 23. An example of drying conditions in the entire surface drying step S40 is shown below. Air flow rate: 200mL / min to 300mL / min Air supply pressure: 0.3MPa Nozzle movement speed: 20mm / s Spinner table speed: 1500rpm to 3000rpm (e.g. 2000 rpm) Cleaning time: 30s to 90s (e.g., 60s)

[0132] After the overall drying step S40, a local drying step S50 is performed. Fig. 11(B) is a partial cross-sectional side view showing the local drying step S50. In the local drying step S50, at least the cut groove 13a that has been subjected to the local cleaning step S30 (i.e., the area that has been subjected to the local cleaning step S30) is locally dried with air 52b, which is a fluid different from the pure water used in the local cleaning step S30.

[0133] In the local drying process S50, similar to the local cleaning process S30, the nozzle 52 is moved along the linear cutting groove 13a by combining rotation of the spinner table 32 by a specified rotation angle and relative movement of the nozzle 52 with respect to the rotation axis 34 of the spinner table 32.

[0134] More specifically, the air 52b supplied from the nozzle 52 locally dries the cut groove 13a (that is, the intended dividing line 13) along the cut groove 13a.

[0135] In addition, in the local drying process S50, after the droplets remaining at the bottom of the cutting groove 13a, etc. are blown up onto the surface 11a, the components contained in the droplets (e.g., silicon cutting chips (i.e., swarf)) may dry and adhere to the surface 11a.

[0136] Therefore, the droplets may be removed by performing the total drying step again after the local drying step S50. In other embodiments described later, a total drying step may be added after the local drying step S50.

[0137] By performing the full drying step again after the local drying step S50, the adhesion of powder particles and the like described above can be suppressed, and therefore higher cleaning quality can be achieved on the surface 11a compared to the case where the full drying step is not performed again.

[0138] In this embodiment, the rotation direction of the nozzle 52 is changed from counterclockwise to clockwise, but the rotation direction of the spinner table 32 is fixed counterclockwise. However, the rotation direction of the nozzle 52 may be fixed in one direction, and the rotation direction of the spinner table 32 may be appropriately switched between counterclockwise and clockwise.

[0139] (First Modification) Next, a modification of the first embodiment will be described with reference to Fig. 12(A) and Fig. 12(B). Fig. 12(A) is a diagram showing the object 23 to be cleaned in the first modification. The diameter of the object 23 to be cleaned in the first modification is larger than the diameter of the holding surface 32a.

[0140] Therefore, the outer periphery of the object 23 protrudes from the holding surface 32a. In this case, the nozzle 52 moves relative to the rotation axis 34 of the spinner table 32 along a path 52c that includes an arc shown by a solid line from the outer periphery of the object 23 held by the holding surface 32a to the center 32c of the holding surface 32a, and an arc shown by a dashed line.

[0141] 12B is a diagram showing multiple objects 23a, 23b, and 23c to be cleaned in a second modified example. In the second modified example, the diameter of each of the multiple objects 23 to be cleaned is smaller than the holding surface 32a, and the multiple objects 23a, 23b, and 23c to be cleaned are sucked and held by the holding surface 32a.

[0142] Even in this case, the nozzle 52 moves relative to the rotation axis 34 of the spinner table 32 along a path 52c that includes an arc shown by a solid line from the outer peripheral edge of the object to be cleaned 23 closest to the outer peripheral edge 32d of the spinner table 32 to the center 32c of the holding surface 32a, and an arc shown by a dashed line.

[0143] (Second embodiment) Next, a second embodiment will be described with reference to Fig. 13. Fig. 13 is a flow diagram of a cleaning method in the second embodiment. The second embodiment differs from the first embodiment in that a full-body drying step S55 is performed after a full-body cleaning step (second processing step) S20, a local cleaning step (first processing step) S30, and a local drying step S50.

[0144] Also in the second embodiment, in the local cleaning step S30, the object 23 can be locally cleaned with the pure water 52a supplied from the nozzle 52. Furthermore, by performing the full drying step S55 after the local drying step S50, higher cleaning quality can be achieved on the surface 11a.

[0145] (Third embodiment) Next, a third embodiment will be described with reference to Fig. 14(A). Fig. 14(A) is a flow diagram of a cleaning method in the third embodiment. In the third embodiment, after the holding step S10, a local cleaning step (first processing step) S30 is performed first, and then a total cleaning step (second processing step) S35 is performed.

[0146] After the overall cleaning step S35, the overall drying step S40 and the local drying step S50 are performed in the same manner as in the first embodiment. In the third embodiment, the object 23 can be locally cleaned with the pure water 52a supplied from the nozzle 52.

[0147] (Fourth embodiment) Next, a fourth embodiment will be described with reference to Fig. 14(B). Fig. 14(B) is a flow diagram of a cleaning method in the fourth embodiment. In the fourth embodiment, similarly to the first embodiment, after the holding step S10, a total cleaning step (second processing step) S20 using pure water (second fluid) 52a is performed.

[0148] However, in the fourth embodiment, the local cleaning step S30 is not performed, and after the full drying step S40, a local drying step (first processing step) S50 using air (first fluid) 52b is performed. In the local drying step S50, the object 23 is locally dried by air 52b supplied from a nozzle 52.

[0149] Therefore, the amount of chips remaining in the cut groove 13a can be reduced compared to the case where the process is completed only with the full cleaning step S20 and the full drying step S40 after the holding step S10.

[0150] (Fifth embodiment) Next, a fifth embodiment will be described with reference to Fig. 15(A). Fig. 15(A) is a flow diagram of a cleaning method in the fifth embodiment. In the fifth embodiment, after a holding step S10, a local cleaning step (first processing step) S30 using pure water (first fluid) 52a and a total drying step S40 are sequentially performed.

[0151] (Sixth embodiment) Next, a sixth embodiment will be described with reference to Fig. 15(B). Fig. 15(B) is a flow diagram of a cleaning method in the sixth embodiment. The sixth embodiment differs from the fifth embodiment in that a local drying step S50 is further performed after the overall drying step S40.

[0152] (Seventh embodiment) Next, a seventh embodiment will be described with reference to Fig. 15(C). Fig. 15(C) is a flow diagram of a cleaning method in the seventh embodiment. In the seventh embodiment, after the holding step S10, only a local drying step (first processing step) using air (first fluid) 52b is performed.

[0153] In the fifth to seventh embodiments, the whole-body cleaning step S20 is not performed, but the object 23 to be cleaned can be locally cleaned and / or dried.

[0154] In the above embodiment, the spinner cleaning device 30 has one nozzle 52, and the nozzle 52 selectively ejects the pure water 52a or the air 52b.

[0155] However, the spinner cleaning device 30 may include both the nozzle (first nozzle) 52 and a different nozzle (second nozzle) 64. FIG. 16 is a diagram showing a modified example of the cleaning unit 54 having two nozzles 52, 64.

[0156] The nozzle 64 is fixed to the tip of the arm 66 with the nozzle opening facing directly downward. As in the first embodiment, the nozzle openings of the nozzles 52 and 64 may be slightly tilted with respect to the Z-axis direction.

[0157] A rotation shaft 68 is fixed to the base end of the arm 66 in a manner perpendicular to the arm 66. The nozzle 52 and the arm 50, and the nozzle 64 and the arm 66 constitute a cleaning unit 54.

[0158] A motor 48b that rotates (i.e., swings) the rotating shaft 68 within a predetermined angular range is connected to the rotating shaft 68. The structure of the motor 48b is substantially the same as that of the motor 48a. In the example shown in FIG. 16, the motors 48a and 48b constitute the swing mechanism 48.

[0159] In the example shown in FIG. 16, the nozzle 52 sprays pure water (first fluid) 52a in the local cleaning process S30, and the nozzle 64 sprays air (second fluid) 52b in the local drying process S50, but the nozzle 52 may spray a liquid or a gas-liquid mixture fluid other than the pure water 52a.

[0160] When the local cleaning step S30 is performed, the nozzle 52 that sprays the pure water 52a moves in a revolving manner above the holding surface 32a, and the nozzle 64 waits in a stationary state outside the holding surface 32a in the radial direction of the holding surface 32a.

[0161] Furthermore, when the local drying step S50 is performed, the nozzle 64 that sprays the air 52b moves in a circulating manner above the holding surface 32a. That is, the air 52b sprayed from the nozzle 64 moves relative to the rotation shaft 34 of the spinner table 32. During this time, the nozzle 52 waits in a stationary state outside the holding surface 32a in the radial direction of the holding surface 32a.

[0162] Although not shown in FIG. 16, alternatively, the nozzle 64 may spray pure water (first fluid) 52a, liquid or gas-liquid mixture fluid, and the nozzle 52 may spray air (second fluid) 52b.

[0163] In addition, the structures, methods, and the like according to the above-described embodiments can be modified as appropriate without departing from the scope of the present invention. The spinner cleaning device 30 may not be a part of the cutting device 2, but may be a cleaning device that is separate and independent from the cutting device 2.

[0164] Furthermore, instead of the swinging mechanism 48 swinging the nozzles 52, 64, the nozzles 52, 64 may be moved linearly in the XY plane by first and second ball screw type moving mechanisms (not shown). Even in this way, the fluid ejected from the nozzles 52, 64 can be moved back and forth linearly in the XY plane.

[0165] The first moving mechanism is configured to move the nozzles 52, 64 linearly along a predetermined direction (e.g., the X-axis direction) in the XY plane, and the second moving mechanism is configured to move the nozzles 52, 64 linearly along another direction (e.g., the Y-axis direction) perpendicular to the predetermined direction in the XY plane.

[0166] Therefore, the moving mechanism can move the fluid sprayed from the nozzles 52, 64 in a linear path including from the outer peripheral edge 32d to the center 32c of the spinner table 32, or in a linear path including from the outer peripheral edge of the object to be cleaned 23 held by suction on the holding surface 32a to the center 32c of the holding surface 32a.

[0167] In addition, since the controller 62 constantly keeps track of the orientation 25 of the object 23 to be cleaned brought into the spinner cleaning device 30, the rotation angle of the spinner table 32, the initial position of the nozzle 52, and the amount of movement of the nozzle 52 by the swinging mechanism 48, the installation of the microscope camera unit 60 may be omitted.

[0168] When the microscope camera unit 60 is not mounted on the spinner cleaning device 30, the controller 62 controls the operations of the nozzles 52, 64 and the spinner table 32 based on information such as the diameter of the object 23 to be cleaned and the pitch of the cut grooves 13a.

[0169] Incidentally, the above-mentioned object 23 to be cleaned has been subjected to cutting processing, but the object 23 to be cleaned may also be subjected to laser processing in which a groove is formed in the workpiece 11 along the intended dividing line 13 by using a pulsed laser beam having a wavelength that is absorbed by the workpiece 11. [Explanation of symbols]

[0170] 2: Cutting device, 4: Base, 4a, 4d: Opening, 4b, 4c: Support 6a: Cassette elevator, 6b: Cassette 10: table cover, 12: cover 11: Workpiece, 11a: Front surface, 11b: Back surface 13: planned division line, 13a: cutting groove, 15: device 14: chuck table, 14a: holding surface 16a: first transport unit, 16b: second transport unit 17: dicing tape, 19: ring frame, 21: frame unit 18: Cutting unit 23, 23a, 23b, 23c: Object to be cleaned, 25: Direction 26a: Y-axis direction moving plate, 26b: Z-axis direction moving plate 26c: Stepping motor, 28: Microscope camera unit 30: Spinner cleaning device 32: spinner table (holding table), 32a: holding surface, 32b: clamp 32c: center, 32d: outer edge 34: Rotating shaft, 36: Motor, 38: Driver circuit, 40: Rotating drive mechanism 42: Air cylinder 44: outer cover, 44a: bottom plate, 44b: inner wall 44d: Drain outlet, 44e: Drain hose 46, 68: Rotating shaft, 48: Swing mechanism (moving mechanism), 48a, 48b: Motor 50,66: Arm, 52,64: Nozzle 52a: pure water, 52b: air, 52c: path 54: Cleaning unit 56: Liquid supply device, 58: Air supply device 60: Microscope camera unit 62: controller, 62a: processor, 62b: memory S10: Holding process, S20, S35: Overall cleaning process, S30: Localized cleaning process S40, S55: Overall drying process, S50: Localized drying process P A ,P B ,P C ,P D ,P O :point

Claims

1. A method for cleaning an object using a spinner cleaning device, comprising the steps of: a holding step of holding the object to be cleaned on a holding surface of the spinner cleaning device having a holding table rotatable around a rotation axis perpendicular to the holding surface; a first processing step of locally cleaning or drying the object held by the holding table with a first fluid supplied from the first nozzle by combining rotation of the holding table around the rotation axis through a specified rotation angle and relative movement of a first nozzle of the spinner cleaning device with respect to the rotation axis; A cleaning method comprising:

2. The cleaning method according to claim 1, characterized in that in the first processing step, cleaning or drying with the first fluid is performed along a linear region to be cleaned on the object to be cleaned held by the holding table by combining rotation of the holding table by the rotation angle and relative movement of the first nozzle with respect to the rotation axis.

3. the cleaning area corresponds to a linear dividing line present on the top surface of the object to be cleaned, 3. The cleaning method according to claim 2, wherein in the first treatment step, cleaning with the first fluid or drying is performed along the intended division line.

4. the cleaning area corresponds to a linear dividing line present on the top surface of the object to be cleaned, 3. The cleaning method according to claim 2, wherein in the first treatment step, at least one end portion in the longitudinal direction of the planned division line is washed with the first fluid or dried.

5. 2. The cleaning method according to claim 1, further comprising a second processing step, after the holding step and before the first processing step, of spraying a second fluid from a second nozzle of the spinner cleaning device while rotating the holding table holding the object to be cleaned about the rotation axis at a specified rotational speed, and relatively moving the second fluid sprayed from the second nozzle in a path including from the outer periphery of the holding table or the outer periphery of the object to be cleaned held by the holding table to the center of the holding table, thereby cleaning the entire upper surface of the object to be cleaned.

6. In the first processing step, the object to be cleaned is locally cleaned with the first fluid; 2. The cleaning method according to claim 1, further comprising a second processing step of, after the holding step, spraying a second fluid from a second nozzle of the spinner cleaning device while rotating the holding table holding the object to be cleaned about the rotation axis at a specified rotational speed, and relatively moving the second fluid sprayed from the second nozzle along a path including from the outer periphery of the holding table or the outer periphery of the object to be cleaned held by the holding table to the center of the holding table, thereby cleaning the entire upper surface of the object to be cleaned.

7. In the first processing step, when the object to be cleaned is locally cleaned with the first fluid, the first fluid is pure water; 7. The cleaning method according to claim 5, further comprising a local drying step of, after the first processing step, locally drying the area that has been locally cleaned with air, which is a fluid different from the first fluid, by combining rotation of the holding table through the rotation angle and relative movement of the first nozzle with respect to the rotation axis.

8. A spinner cleaning device, comprising: A holding table having a holding surface for holding an object to be cleaned; a rotation drive mechanism having a rotation axis that is disposed perpendicular to the holding surface and fixed to the holding table; a cleaning unit having a first nozzle for spraying a first fluid; a moving mechanism having at least one motor and capable of relatively moving the first fluid sprayed from the first nozzle along a path including from an outer periphery of the holding table or an outer periphery of the object to be cleaned held by the holding table to a center of the holding table; a controller having a memory and a processor for controlling operations of the holding table, the rotation drive mechanism, the cleaning unit and the moving mechanism; Equipped with The controller executes a program stored in the memory to perform a first processing step of locally cleaning or drying the object to be cleaned held by the holding table with the first fluid supplied from the first nozzle by combining rotation of the holding table around the rotation axis by a specified rotation angle and relative movement of the first nozzle with respect to the rotation axis.

9. The spinner cleaning device according to claim 8, characterized in that the controller cleans or dries the area to be cleaned with the first fluid along a linear area to be cleaned in the object to be cleaned held by the holding table by combining rotation of the holding table by the rotation angle and relative movement of the first nozzle with respect to the rotation axis.

10. 9. The spinner cleaning device according to claim 8, wherein the controller specifies the rotation angle based on a direction of the object held on the holding surface and a relative position of the first nozzle with respect to the holding surface.

11. the cleaning unit further includes a second nozzle different from the first nozzle; the movement mechanism is capable of relatively moving the second fluid ejected from the second nozzle, 11. The spinner cleaning device according to claim 8, wherein the controller performs a second processing step of spraying the second fluid from the second nozzle while rotating the holding table holding the object to be cleaned around the rotation axis at a specified rotational speed, and relatively moving the second fluid sprayed from the second nozzle along a path including from the outer periphery of the holding table or the outer periphery of the object to be cleaned held by the holding table to the center of the holding table, thereby cleaning the entire upper surface of the object to be cleaned with the second fluid.

12. 11. The spinner cleaning device according to claim 8, wherein the controller performs a second processing step of spraying the first fluid from the first nozzle while rotating the holding table holding the object to be cleaned around the rotation axis at a specified rotational speed, and relatively moving the first fluid sprayed from the first nozzle along a path including from the outer periphery of the holding table or the outer periphery of the object to be cleaned held by the holding table to the center of the holding table, thereby cleaning the entire upper surface of the object to be cleaned with the first fluid.

Images