Optimization system

Abstract

To suppress a deterioration of a total facility efficiency.SOLUTION: An optimization device 61 executes a determination processing, and a first optimization processing and a second optimization processing. In the determination processing, it is determined that one of a top surface 3 and a bottom surface 4 having a longer production requirement time is a bottleneck surface to a substrate type in which a mounting operation has to be optimized, and it is determined that the other one is a non-bottleneck surface. In the first optimization processing, the mounting operation of the bottleneck surface is optimized so that a feeder 41 and a suction nozzle 55 of which the production requirement time becomes the shortest are arranged in the bottleneck surface. In the second optimization processing, the mounting operation of the non-bottleneck surface is optimized so that the feeder 41 and the suction nozzle 55 are commonly arranged in a production of the substrate type for producing before and after the production of the substrate type to be optimized within a range where it does not exceed the production requirement time of the bottleneck surface on the non-bottleneck surface.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The technology disclosed in this specification relates to a system for optimizing the component mounting operation when producing a double-sided mounting substrate.

Background Art

[0002] Conventionally, when producing a double-sided mounting substrate, in order to minimize the substrates in production, a line is often constructed in which a top surface production line for mounting components on the top surface of the substrate and a bottom surface production line for mounting components on the bottom surface of the substrate are arranged in series. Usually, in this type of line, the production efficiency is improved by individually optimizing the mounting operation of the mounter for top surface mounting or the mounting operation of the mounter for bottom surface mounting. As a conventional technology for efficiently producing a double-sided mounting substrate, for example, the one disclosed in Patent Document 1 is known.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, depending on the type of substrate to be produced, it often occurs that the balance of the number of mounted components is uneven between the top surface and the bottom surface. For this reason, even if the mounting operation is simply optimized for each side, the production of one side may end earlier, and a situation may occur where the production of the other slower side has to wait. As a result, there is a problem that the OEE (Overall Equipment Effectiveness) becomes low. Therefore, this specification provides a technology for suppressing a decrease in the overall equipment efficiency.

Means for Solving the Problems

[0005] This specification discloses an optimization system equipped with an optimization device. A first mounting operation is performed on a first production line including a first mounter for mounting components on the top surface of a substrate. A second mounting operation is performed on a second production line including a second mounter for mounting components on the bottom surface of the substrate. The optimization device optimizes the first mounting operation and the second mounting operation respectively when producing a double-sided mounting substrate in the production line. The first mounter and the second mounter have a plurality of feeders for supplying components and a plurality of suction nozzles for sucking components from the plurality of feeders. The optimization device is configured to be capable of executing a determination process, a first optimization process, and a second optimization process. In the determination process, for the substrate type for which the mounting operation is to be optimized, the production required time for the top surface and the bottom surface is compared, and the surface with the longer production required time is determined as the bottleneck surface that becomes the bottleneck during substrate production, and the surface with the shorter production required time is determined as the non-bottleneck surface. In the first optimization process, on the bottleneck surface, the mounting operation on the bottleneck surface is optimized so that the arrangement of the feeder and the suction nozzle results in the shortest production required time. In the second optimization process, on the non-bottleneck surface, within a range not exceeding the production required time of the bottleneck surface, the mounting operation on the non-bottleneck surface is optimized so that the feeder and the suction nozzle are commonly arranged in the production of the substrate type to be optimized and the production of the substrate types produced before and after it. According to the above-described configuration, a mounting operation considering the production required time and the changeover property can be realized, so that a decrease in the overall equipment efficiency can be suppressed.

[0006] This specification also discloses an optimization system equipped with another optimization device. A first mounting operation is performed on a first production line including a first mounter for mounting components on the top surface of a substrate. A second mounting operation is performed on a second production line including a second mounter for mounting components on the bottom surface of the substrate. The optimization device optimizes the first mounting operation and the second mounting operation respectively when producing a double-sided mounting substrate in the production line. The first mounter and the second mounter have a plurality of feeders for supplying components and a plurality of suction nozzles for sucking components from the plurality of feeders. When the optimization device optimizes the mounting operation on one side surface of either the top surface or the bottom surface for a substrate type for which the mounting operation is to be optimized, it considers the production time required for the opposite side surface and optimizes the mounting operation so that the feeders and the suction nozzles are commonly arranged in the production of the substrate type and the production of the substrate types produced before and after it. With the above-described configuration, a mounting operation considering the production time required and the changeover property can be realized, so that a decrease in the overall equipment efficiency can be suppressed.

Brief Description of the Drawings

[0007]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Modes for Carrying Out the Invention

[0008] (Aspect 1) In the optimization system disclosed in this specification, in the production line, a plurality of execution conditions may be set when producing double-sided mounting substrates of a plurality of substrate types. The optimization device may optimize the first mounting operation and the second mounting operation respectively by repeating trials while changing the plurality of execution conditions. The plurality of execution conditions may include the arrangement of feeders and the arrangement of suction nozzles. The determination process, the first optimization process, and the second optimization process may be executed for each of the plurality of substrate types. According to such a configuration, since the determination process, the first optimization process, and the second optimization process are executed for each of the plurality of substrate types, a decrease in overall equipment efficiency can be preferably suppressed. (Aspect 2) In the optimization system disclosed in this specification, the first production line and the second production line may be connected in a series arrangement. According to such a configuration, the transfer of substrates between the first production line and the second production line can be efficiently performed. (Aspect 3) In the optimization system disclosed in this specification, in the second optimization process, when there are no restrictions on the component dispensing from the feeder, the mounting operation may be optimized so that both the feeder and the suction nozzle are commonly arranged, while when there are restrictions on the component dispensing from the feeder, the mounting operation may be optimized so that only the suction nozzle is commonly arranged. (Aspect 4) In another optimization system disclosed in this specification, in the production line, a plurality of execution conditions may be set when producing double-sided mounting substrates of a plurality of substrate types. The optimization device may optimize the first mounting operation and the second mounting operation respectively by repeating trials while changing the plurality of execution conditions. The plurality of execution conditions may include the arrangement of feeders and the arrangement of suction nozzles. The determination process, the first optimization process, and the second optimization process may be executed for each of the plurality of substrate types. (Aspect 5) In another optimization system disclosed in this specification, the first production line and the second production line may be connected in a series arrangement. (Aspect 6) In another optimization system disclosed in this specification, the optimization process compares the difference in production time between the top surface and the bottom surface for each substrate type, identifies the substrate type with the largest difference in production time from the comparison results, raises the priority of the common arrangement of feeders and suction nozzles in the production of the substrate type with the largest difference in production time and the production of the substrate types produced before and after it, and lowers the priority of the common arrangement of feeders and suction nozzles in the production of other substrate types and the production of the substrate types produced before and after it, thereby optimizing the mounting operation. (Aspect 7) In another optimization system disclosed in this specification, the optimization process classifies substrate types according to the magnitude of the difference in production time from the comparison results of the difference in production time between the top surface and the bottom surface for each substrate type, relatively raises the priority of the common arrangement of feeders and suction nozzles in the production of the substrate types with a large difference in production time and the production of the substrate types produced before and after it, and relatively lowers the priority of the common arrangement of feeders and suction nozzles in the production of the substrate types with a small difference in production time and the production of the substrate types produced before and after it, thereby optimizing the mounting operation.

[0009] (Example 1) Hereinafter, an optimization system 6 according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a schematic diagram showing a substrate production facility 11 equipped with the optimization system 6 of this embodiment. As shown in FIG. 1, the substrate production facility 11 of this embodiment is a facility for producing a double-sided mounting substrate, and has a production line composed of a first production line 31 for producing the top surface 3 side of the substrate 1 and a second production line 21 for producing the bottom surface 4 side of the substrate 1. Here, the start end of the first production line 31 is connected to the end of the second production line 21. That is, the first production line 31 and the second production line 21 are connected in a series arrangement.

[0010] The second production line 21 is a line for performing the operation of mounting the component 2 on the bottom surface 4 of the substrate 1. The second production line 21 includes a substrate loader 22, a printer 23, an SPI 24, a second mounter 25, a reflow device 26, an AOI 27, and a front-back inverter 28 in this order from the upstream side in the substrate conveyance direction.

[0011] The substrate loader 22 is disposed at the starting end of the second production line 21, and loads the substrate 1 before production onto the second production line 21 with the bottom surface 4 facing upward. The printer 23 forms a solder pattern by printing solder paste on the bottom surface 4 of the substrate 1 unloaded one by one from the substrate loader 22. The SPI 24 images the bottom surface 4 of the substrate 1 with the solder pattern formed thereon unloaded from the printer 23, and visually inspects the quality of the printing state of the solder paste.

[0012] The second mounter 25 performs a predetermined second mounting operation on the bottom surface 4 of the substrate 1 with the solder pattern inspected unloaded from the SPI 24, and mounts the component 2. A plurality of terminals such as lands and pads are formed on the bottom surface 4 of the substrate 1, and lead components, chip components, etc. are mounted on the lands and the like. The reflow device 26 performs reflow processing on the substrate 1 with the component 2 mounted on the bottom surface 4. That is, the reflow device 26 heats the loaded substrate 1 to melt the solder, and solders the component 2 to the bottom surface 4 of the substrate 1. The AOI 27 images the bottom surface 4 of the substrate 1 unloaded from the reflow device 26, and visually inspects the quality of the mounting state of the component 2. The front-back inverter 28 inverts the substrate 1 unloaded from the AOI 27, arranges the bottom surface 4 with the component 2 mounted downward, and arranges the top surface 3 without the component 2 mounted upward.

[0013] The first production line 31 is a line for performing the operation of mounting the component 2 on the top surface 3 of the substrate 1. The first production line 31 includes a printer 32, an SPI 33, a first mounter 34, a reflow device 35, an AOI 36, and a substrate unloader 37 in this order from the upstream side in the substrate conveyance direction.

[0014] The printer 32 forms a solder pattern by printing solder paste on the top surface 3 of the substrate 1 inverted and unloaded by the front-back inverter 28. The SPI 33 images the top surface 3 of the substrate 1 with the solder pattern formed thereon unloaded from the printer 32, and visually inspects the quality of the printing state of the solder paste.

[0015] The first mounting machine 34 performs a predetermined first mounting operation on the top surface 3 of the substrate 1 that has been subjected to solder pattern inspection and unloaded from the SPI 33, and mounts the component 2. The reflow device 35 performs a reflow process on the substrate 1 with the component 2 mounted on the top surface 3. That is, the reflow device 35 heats the loaded substrate 1 to melt the solder, and solders the component 2 to the top surface 3 of the substrate 1. The AOI 36 images the top surface 3 of the substrate 1 unloaded from the reflow device 35, and visually inspects the quality of the mounting state of the component 2. The substrate unloader 37 is disposed at the end of the first production line 31, and unloads the substrate with the component 2 mounted on both the top surface 3 and the bottom surface 4, that is, the finished product of the double-sided mounting substrate.

[0016] FIG. 2 is a schematic plan view showing the first mounting machine 34 that constitutes the substrate production equipment, and the first mounting machine 34 will be described based on this. Since the mechanical configuration of the second mounting machine 25 is basically the same as that of the first mounting machine 34, the description thereof will be omitted.

[0017] As shown in FIG. 2, the first mounting machine 34 includes a plurality of feeders 41, an XY robot 42, a substrate transfer lane 43, a head unit 44, a parts camera 45, a nozzle station 46, a control device 51, and the like.

[0018] Each feeder 41 houses a plurality of components 2. The feeder 41 is detachably attached to the feeder holding portion 52, and supplies the component 2 to the head unit 44. The feeder 41 of the present embodiment is a tape-type feeder that houses a plurality of components 2 on a tape.

[0019] The XY robot 42 moves the head unit 44 between above the feeder 41 and above the substrate 1 by moving the head unit 44 in the X and Y directions. The XY robot 42 is composed of a guide rail for guiding the head unit 44, a moving mechanism for moving the head unit 44 along the guide rail, a motor for driving the moving mechanism, and the like. The XY robot 42 is housed inside the housing and is disposed above the substrate 1. The head unit 44 is moved by the XY robot 42 in the space from above the feeder 41 to above the substrate 1.

[0020] The substrate transfer lane 43 is a device that performs operations such as loading the substrate 1 into the working position inside the machine, positioning the substrate 1 before performing the first mounting operation at the working position, and unloading the substrate 1 after component mounting from the working position. The substrate transfer lane 43 of this embodiment can be configured, for example, by a pair of belt conveyors, a support device (not shown) that is attached to the belt conveyor and supports the substrate 1 from below, and a drive device (not shown) that drives the belt conveyor.

[0021] The head unit 44 is a movable unit that mounts the component 2 onto the substrate 1. The head unit 44 includes a component mounting head 53 and a mark camera 54. The component mounting head 53 is attached to the lower surface side of the head unit 44 and includes a plurality of suction nozzles 55. Each suction nozzle 55 is detachably supported by the component mounting head 53. Each suction nozzle 55 is moved up and down in the vertical direction (Z direction) by an actuator (not shown) housed in the component mounting head 53 and is configured to be able to suck the component 2.

[0022] To attach component 2 to substrate 1 by head unit 44, first, move the suction nozzle 55 downward until the suction surface of the suction nozzle 55 contacts component 2 accommodated in the feeder 41. Next, suck component 2 with the suction nozzle 55 and move the suction nozzle 55 upward. When the process of sucking component 2 by the suction nozzle 55 is completed, drive the XY robot 42 to position the head unit 44 with respect to substrate 1. Then, by lowering the suction nozzle 55 toward substrate 1, component 2 is attached to substrate 1.

[0023] The nozzle station 46 is provided at a position below the moving path of the head unit 44 between the plurality of feeders 41 and the substrate transfer lane 43. The nozzle station 46 has nozzle holders 56 at a plurality of locations on its upper surface. The nozzle station 46 detachably holds the suction nozzles 55 in the respective nozzle holders 56. When automatically exchanging the suction nozzle 55 during the production of substrate 1, the head unit 44 moves the component mounting head 53 above the nozzle station 46. Then, place the used suction nozzle 55 on the empty nozzle holder 56 and hold the suction nozzle 55 to be used on the component mounting head 53.

[0024] The mark camera 54 is mounted near the component mounting head 53 of the head unit 44 and is configured to be movable together with the component mounting head 53. The mark camera 54 moves above the substrate 1 carried into the working position by the substrate transfer lane 43 and images a mark (not shown) attached to the substrate 1. The mark camera 34 is configured using an imaging device such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor).

[0025] The component camera 45 is provided between the plurality of feeders 41 and the substrate transfer lane 43, at a position below the movement path of the head unit 44. The component camera 45 images the component 2 adsorbed by the head unit 44 from below. The component camera 45 is also configured using an image sensor such as a CCD or a CMOS, for example.

[0026] The control device 51 is incorporated in the machine base of the first mounter 34. The control device 51 is composed of a computer configured by a CPU, a memory, etc., and includes a display unit for displaying information to the operator and an input unit for performing input settings by the operator. The control device 51 is communicably connected to the host computer 14 for production management that manages substrate production via the network 5 (see FIG. 1). Further, the control device 51 is communicably connected to the feeder 41, the XY robot 42, the substrate transfer lane 43, the head unit 44, the component camera 45, etc. via a bus. The control device 51 controls the operations of each part (the feeder 41, the XY robot 42, the substrate transfer lane 43, the head unit 44, the component camera 45, etc.) based on the production program stored in the host computer 14. By this control, the control device 51 executes processes such as mounting a plurality of components 2 on the substrate 1.

[0027] As shown in FIG. 1, the substrate production facility 11 of this embodiment includes an optimization system 6 that optimizes the operation when producing a double-sided mounting substrate. The optimization system 6 includes an optimization device 61. The optimization device 61 is connected to the network 5 and optimizes the first mounting operation performed by the first mounter 34 belonging to the first production line 31 and the second mounting operation performed by the second mounter 25 belonging to the second production line 21, respectively. That is, the optimization device 61 executes a process of optimizing the production program (production job) to be executed by the first mounter 34 and the second mounter 25.

[0028] FIG. 3 is a block diagram for explaining the configuration of the optimization device 61. The optimization device 61 of the present embodiment includes an optimization processing computer 71, an information input unit 72, a display device 73, a storage device 74, a job database 75, a data library 76, etc., which are communicably connected to the optimization processing computer 71. The information input unit 72 is a device for an operator to input and set information necessary for the optimization process, and includes, for example, a keyboard, a mouse, a touch panel, etc. The display device 73 displays the progress of the optimization process of the production program and component data, etc. to the operator. The storage device 74 stores the production program optimization processing program, component data, etc. The optimization processing computer 71 executes a production program optimization processing program (to be described later) before the start of production, thereby executing a process of optimizing the production programs of the first mounter 34 and the second mounter 25, and transmits the optimized production program to the first mounter 34 and the second mounter 25 via the network 5. In this specification, the above production program optimization processing program may be referred to as an optimizer.

[0029] The job database 75 holds data necessary for producing the substrate 1 of a number of substrate types. The job database 75 includes component data, substrate data, equipment data, recipe data, etc.

[0030] The component data includes information on all component types of the component 2 mounted on the substrate 1. The component data includes, in addition to the shape information such as the outer dimensions of each component type of the component 2 and the arrangement of connection terminals, information on the standard handling conditions when handled by the first mounter 34 and the second mounter 25. The standard handling conditions include, for example, information specifying the nozzle diameter of the suction nozzle 55 that sucks the component 2 and the maximum speed for each operation direction of the component mounting head 53 that supports the suction nozzle 55.

[0031] The substrate data includes information such as the outer shape of the substrate 1 to be produced, the arrangement of circuit patterns, the coordinates of the mounting positions of components 2, and the coordinates of the positions of various markers. The equipment data includes information regarding the performance of the first mounter 34 and the second mounter 25, and information regarding the dimensional specifications of the suction nozzles 55 used interchangeably, etc.

[0032] The recipe data is data that describes how to produce a substrate 1 of a certain substrate type using a certain first mounter 34 or second mounter 25. The recipe data is optimized by an optimizer, and corrections are made based on the optimization results, thereby completing the final version. The recipe data includes information on the mounting order of a plurality of components 2, information on the arrangement order of component types (i.e., the arrangement order of a plurality of feeders 41), etc. Initial component data is created prior to the optimization process within the recipe data. Initial handling conditions regarding the handling conditions of components are defined in the initial component data. The initial handling conditions are later replaced with the final handling conditions. Thereby, the final component data is created.

[0033] The data library 76 consists of a group of data that is referred to when the optimizer performs the optimization process. The data library 76 includes performance data that accumulates various production data such as production conditions and production status when the substrate 1 was produced in the past, and edited data obtained by editing various production data. As one example of the performance data, there is performance component data that accumulates the handling conditions of components with usage records, etc. As one example of the edited data, there is history component data obtained by editing the usage history of components, etc.

[0034] The optimizer is software that performs trials (simulations) of the optimization process and is executed by being installed in the optimization processing computer 71. The optimizer is executed each time the substrate type of the substrate 1 and the type of the mounter are specified and recipe data is created, and performs a trial of the optimization process. In the production line, a plurality of execution conditions are set when producing double-sided mounting substrates of a plurality of substrate types. Specifically, in the first production line 31 including the first mounter 34, in the production of double-sided mounting substrates of a plurality of substrate types, a plurality of execution conditions for the first mounting operation performed when mounting the component 2 on the top surface 3 of the substrate 1 are set. In the second production line 21 including the second mounter 25, in the production of double-sided mounting substrates of a plurality of substrate types, a plurality of execution conditions for the second mounting operation performed when mounting the component 2 on the bottom surface 4 of the substrate 1 are set. Then, when the optimizer sets a plurality of execution conditions (a plurality of option parameters) when performing the first mounting operation in the first production line 31 and the second mounting operation in the second production line 21, the optimizer repeats the trial while changing the plurality of execution conditions, thereby optimizing the first mounting operation and the second mounting operation respectively. Here, the plurality of option parameters include, for example, the arrangement order of the plurality of suction nozzles 55, the nozzle diameter of the suction nozzle 55, the information on the mounting order of the plurality of components, the arrangement order of the plurality of feeders 41, and the like.

[0035] As shown in FIG. 3, the optimization processing computer 71 that constitutes the optimization device 61 of the present embodiment functionally includes a determination processing unit 77, a first optimization processing unit 78, and a second optimization processing unit 79. In other words, the optimization processing computer 71 installed with the optimizer can execute a predetermined determination processing step, a first optimization processing step, a second optimization processing step, and the like.

[0036] The determination processing unit 77 compares the production required time (cycle time) when mounting the component 2 on the top surface 3 on the first production line 31 with the cycle time when mounting the component 2 on the bottom surface 4 on the second production line 25 for the substrate type that optimizes the mounting operation. Then, the determination processing unit 77 determines the surface with the longer cycle time as the bottleneck surface that becomes a bottleneck during substrate production, and determines the surface with the shorter cycle time as the non-bottleneck surface. Note that the determination processing by the determination processing unit 77 is executed for each of a plurality of substrate types.

[0037] The first optimization processing unit 78 executes a first optimization process for optimizing the mounting operation on the bottleneck surface so that the feeder 41 and the suction nozzle 55 are arranged such that the cycle time is the shortest on the bottleneck surface. The final production output depends on the cycle time of the bottleneck surface. Therefore, on the bottleneck surface, it is desirable to optimize (speed up) separately and individually from the non-bottleneck surface, and neither the feeder 41 nor the suction nozzle 55 is arranged in a common manner. That is, the feeder 41 and the suction nozzle 55 are arranged in a so-called individual arrangement (fastest arrangement). Note that the first optimization process by the first optimization processing unit 78 is executed for each of a plurality of substrate types.

[0038] In the non-bottleneck surface, the second optimization processing unit 79 optimizes the mounting operation of the non-bottleneck surface so that the feeders 41 and the suction nozzles 55 are commonly arranged in the production of the substrate type to be optimized and the production of the substrate types produced before and after it, within a range not exceeding the cycle time of the bottleneck surface. Since the final production output does not depend on the cycle time of the non-bottleneck surface, the cycle time of the non-bottleneck surface does not need to be made very short. Therefore, in the non-bottleneck surface, optimization processing is performed to balance with other jobs performed before and after in a multi-job manner. That is, by commonly arranging the feeders 41 and the suction nozzles 55 in the production of the substrate type to be optimized and the production of the substrate types produced before and after it, the setup change time when switching production is reduced. Note that the second optimization processing by the second optimization processing unit 79 is executed for each of a plurality of substrate types.

[0039] Also, when there are no restrictions on the component dispensing from the feeder 41, the second optimization processing unit 79 optimizes the mounting operation so that both the feeder 41 and the suction nozzle 55 are commonly arranged. On the other hand, when there are restrictions on the component dispensing from the feeder 41, the second optimization processing unit 79 optimizes the mounting operation so that only the suction nozzle 55 is commonly arranged.

[0040] FIG. 4 is Table 1 comparing the cycle times of the top surface 3 and the bottom surface 4 when performing conventional optimization processing for a plurality of substrate types, and the cycle times of the top surface 3 and the bottom surface 4 when performing the optimization processing of this embodiment for a plurality of substrate types. In this table, six production job names of "JOB_a", "JOB_b", "JOB_c", "JOB_d", "JOB_e", and "JOB_f" are listed as the production job names of a plurality of substrate types.

[0041] For example, when performing the conventional optimization process for "JOB_a", the cycle time of the bottom surface 4 becomes 20 seconds, and the cycle time of the top surface 3 becomes 27 seconds. Therefore, the top surface 3 with a long cycle time becomes the bottleneck surface, and the bottom surface 4 with a short cycle time becomes the non-bottleneck surface. At this time, the second production line 21 has a waiting time for the subsequent process of 7 seconds. Also, when performing the conventional optimization process for "JOB_b", the cycle time of the bottom surface 4 becomes 22 seconds, and the cycle time of the top surface 3 becomes 19 seconds. Therefore, the bottom surface 4 with a long cycle time becomes the bottleneck surface, and the top surface 3 with a short cycle time becomes the non-bottleneck surface. At this time, the first production line 31 has a waiting time for the previous process of 3 seconds.

[0042] On the other hand, when performing the optimization process of this embodiment for "JOB_a", the cycle time of the bottom surface 4 increases by 5 seconds from 20 seconds to 25 seconds, and the cycle time of the top surface 3 becomes 27 seconds. At this time, the second production line 21 has a waiting time for the subsequent process of 2 seconds. Also, when performing the optimization process of this embodiment for "JOB_b", the cycle time of the bottom surface 4 becomes 22 seconds, and the cycle time of the top surface 3 increases by 2 seconds from 19 seconds to 21 seconds. At this time, the first production line 31 has a waiting time for the previous process of 1 second.

[0043] As shown in Table 1, those in which the bottom surface 4 becomes the non-bottleneck surface are three, namely "JOB_a", "JOB_c", and "JOB_e". Therefore, when the optimization process of this embodiment is performed, a balance is achieved among these three production jobs and the production jobs before and after them, and the mounting operation is optimized so that the feeders 41 and the suction nozzles 55 are arranged in a common manner. Also, those in which the top surface 3 becomes the non-bottleneck surface are three, namely "JOB_b", "JOB_d", and "JOB_f". Therefore, when the optimization process of this embodiment is performed, a balance is achieved among these three production jobs and the production jobs before and after them, and the mounting operation is optimized so that the feeders 41 and the suction nozzles 55 are arranged in a common manner.

[0044] As described above, in the optimization system 6 of this embodiment, the optimization device 61 optimizes the first mounting operation and the second mounting operation when producing a double-sided mounting substrate on the production line. At this time, by the determination process, for the substrate type for which the mounting operation is to be optimized, the production required times of the top surface 3 and the bottom surface 4 are compared, and the one with the longer production required time is determined as the bottleneck surface, and the one with the shorter production required time is determined as the non-bottleneck surface. Then, on the bottleneck surface, the mounting operation of the bottleneck surface is optimized so that the feeder 41 and the suction nozzle 55 are arranged such that the production required time is the shortest. On the other hand, on the non-bottleneck surface, within a range not exceeding the production required time of the bottleneck surface, the mounting operation of the non-bottleneck surface is optimized so that the feeder 41 and the suction nozzle 55 are commonly arranged in the production of the substrate type to be optimized and the production of the substrate types produced before and after it.

[0045] Therefore, in the optimization system 6 of this embodiment, on the bottleneck surface, it is optimized alone so that the production required time is the shortest, while on the non-bottleneck surface, it is optimized in such a way that it is commonly arranged with other production jobs. Therefore, on the non-bottleneck surface, the production required time becomes longer compared to the case of performing optimization alone, but the time waiting for the production on the bottleneck surface to end can be reduced. In addition, since the non-bottleneck surfaces are commonly arranged, a production job with improved changeoverability can be realized, and the changeover time can be shortened. That is, according to this embodiment, a mounting operation considering the production required time and the changeoverability can be realized, so that the decrease in the overall equipment efficiency can be effectively suppressed.

[0046] (Embodiment 2) Next, the optimization system 6 of Embodiment 2 will be described. Here, the description will focus on the configuration that is different from that of Embodiment 1.

[0047] The optimization computer 71 for optimization processing that constitutes the optimization device 61 of this embodiment executes optimization processing by a method different from that of the first embodiment. When the optimization device 61 of this embodiment optimizes the mounting operation of one of the top surface 3 and the bottom surface 4 for the substrate type to optimize the mounting operation, it considers the cycle time of the opposite surface. Then, the optimization device 61 can execute an optimization process for optimizing the mounting operation so that the feeders 41 and the suction nozzles 55 are commonly arranged in the production of the substrate type and the production of the substrate types produced before and after it.

[0048] Specifically, the optimization device 61 compares the difference in cycle time between the top surface 3 and the bottom surface 4 for each substrate type. Based on the result, the optimization device 61 identifies the substrate type with the largest difference in cycle time. Next, the optimization device 61 raises the priority of the common arrangement of the feeders 41 and the suction nozzles 55 in the production of the substrate type with the largest difference in cycle time and the production of the substrate types produced before and after it. On the other hand, the optimization device 61 lowers the priority of the common arrangement of the feeders 41 and the suction nozzles 55 in the production of the other substrate types and the production of the substrate types produced before and after it. Then, the optimization device 61 optimizes the mounting operation based on such a difference in priority.

[0049] FIG. 5 is Table 2 comparing the cycle times of the top surface 3 and the bottom surface 4 when performing conventional normal optimization processing for a plurality of substrate types, the cycle times of the top surface 3 and the bottom surface 4 when performing optimization processing using a conventional multi-line balancer for a plurality of substrate types, and the cycle times of the top surface 3 and the bottom surface 4 when performing the optimization processing of this embodiment for a plurality of substrate types. In this table, six production job names of a plurality of substrate types are listed as "JOB_a", "JOB_b", "JOB_c", "JOB_d", "JOB_e", and "JOB_f". Note that in the optimization processing using a conventional multi-line balancer, the cycle time when producing other substrate types on the same surface is considered, but the cycle time of the surface produced simultaneously on the opposite surface is not considered. On the other hand, the optimization processing using the multi-line balancer of this embodiment is characterized in that not only the cycle time when producing other substrate types on the same surface is considered, but also the cycle time of the surface produced simultaneously on the opposite surface is considered.

[0050] Here, the processing performed by the optimization device 61 will be described. First, the optimization device 61 compares the difference in cycle times between the top surface 3 and the bottom surface 4 when performing the conventional normal optimization process for each substrate type. For example, in "JOB_a", the cycle time of the bottom surface 4 is 20 seconds, and the cycle time of the top surface 3 is 27 seconds, so the difference is calculated to be 7 seconds. Similarly, in "JOB_b", the difference is 3 seconds, in "JOB_c", the difference is 4 seconds, in "JOB_d", the difference is 5 seconds, in "JOB_e", the difference is 5 seconds, and in "JOB_f", the difference is 14 seconds, respectively. Based on this result, the optimization device 61 identifies that the substrate type with the largest difference in cycle time is the "f substrate" corresponding to "JOB_f". Next, the optimization device 61 raises the priority of the common arrangement of the feeder 41 and the suction nozzle 55 in the production of the "f substrate" with the largest difference in cycle time and the production of the substrate types produced before and after it. On the other hand, the optimization device 61 lowers the priority of the common arrangement of the feeder 41 and the suction nozzle 55 in the production of substrate types other than the "f substrate" and the production of the substrate types produced before and after it. Then, the optimization device 61 optimizes the mounting operation based on such a difference in priority. That is, based on the common arrangement of the feeder 41 and the suction nozzle 55 that is optimal for the production job "JOB_f" when producing the "f substrate", the common arrangement of the feeder 41 and the suction nozzle 55 for other production jobs is created.

[0051] For example, when performing the conventional normal optimization process for "JOB_a", the cycle time of the bottom surface 4 becomes 20 seconds, and the cycle time of the top surface 3 becomes 27 seconds. When performing the optimization process using the conventional multi-line balancer for "JOB_a", the cycle time of the bottom surface 4 increases by 3 seconds from 20 seconds to 23 seconds, and the cycle time of the top surface 3 increases by 3 seconds from 27 seconds to 30 seconds, and the second production line 21 has a 7-second waiting time for the subsequent process. In contrast, when performing the optimization process using the multi-line balancer of this embodiment for "JOB_a", the cycle time of the bottom surface 4 increases by 8 seconds from 20 seconds to 28 seconds, and the cycle time of the top surface 3 increases by 2 seconds from 27 seconds to 29 seconds, and the second production line 21 has a 1-second waiting time for the subsequent process. That is, the waiting time for the subsequent process is reduced by 6 seconds compared to the optimization process using the conventional multi-line balancer, and the difference in the cycle times of the top surface 3 and the bottom surface 4 becomes smaller.

[0052] Also, when performing the conventional optimization process for "JOB_b", the cycle time of the bottom surface 4 becomes 22 seconds, and the cycle time of the top surface 3 becomes 19 seconds. When performing the optimization process using the conventional multi-line balancer for "JOB_b", the cycle time of the bottom surface 4 increases by 3 seconds from 22 seconds to 25 seconds, and the cycle time of the top surface 3 increases by 3 seconds from 19 seconds to 22 seconds, and the first production line 31 has a 3-second waiting time for the previous process. In contrast, when performing the optimization process using the multi-line balancer of this embodiment for "JOB_b", the cycle time of the bottom surface 4 increases by 1 second from 22 seconds to 23 seconds, and the cycle time of the top surface 3 increases by 4 seconds from 19 seconds to 23 seconds. At this time, the first production line 31 and the second production line 21 have a 0-second waiting time for the process. That is, no waiting for the process occurs.

[0053] Furthermore, when performing the conventional optimization process for "JOB_f", the cycle time of the bottom surface 4 When the optimization process by the balancer is performed for "JOB_f", the cycle time of the bottom surface 4 increases from 37 seconds by 8 seconds to 45 seconds, the cycle time of the top surface 3 increases from 23 seconds by 5 seconds to 28 seconds, and the first production line 31 waits for the previous process for 17 seconds. On the other hand, when the optimization process by the multi-line balancer of the present embodiment is performed for "JOB_f", the cycle time of the bottom surface 4 remains 37 seconds without changing from 37 seconds, and the cycle time of the top surface 3 increases from 23 seconds by 5 seconds to 28 seconds. At this time, the second production line 21 waits for the process for 9 seconds. Therefore, the effect of reducing the difference in the cycle times of the top surface 3 and the bottom surface 4 becomes the most remarkable.

[0054] As described above, in the optimization system 6 of the present embodiment, when optimizing the mounting operation for one of the top surface 3 and the bottom surface 4 for the substrate type to optimize the mounting operation, considering the production time required for the opposite surface, the mounting operation is optimized so that the feeders 41 and the suction nozzles 55 are commonly arranged in the production of the substrate type and the production of the substrate types produced before and after it. Incidentally, in the first embodiment, since the optimization process by the multi-line balancer is performed only on the non-bottleneck surface side, the changeover property on the non-bottleneck surface side can be improved, but the changeover property on the bottleneck surface side cannot be improved. In that regard, according to the configuration of the present embodiment described above, not only the cycle time when producing other substrate types on the same surface is considered, but also the cycle time of the surface produced simultaneously on the opposite surface is considered, and the optimization process by the multi-line balancer is performed. Therefore, the optimization process by the multi-line balancer is performed on both the non-bottleneck surface and the bottleneck surface sides, and the changeover property on both surface sides can be improved. It should be noted that in the present embodiment, it cannot be denied that the productivity slightly decreases due to the slightly longer production time required for the bottleneck surface side. However, as a result, the changeover time is shortened by that amount, and the decrease in the overall equipment efficiency can be preferably suppressed, and ultimately the total production time can be shortened.

[0055] Although the embodiments have been described above, the specific embodiments are not limited to the above embodiments. In the above-described Embodiment 2, the priority of the common arrangement of the feeder 41 and the suction nozzle 55 in the production of the substrate type with the largest cycle time difference and the production of the substrate types produced before and after it was increased, and the priority of the common arrangement of the feeder 41 and the suction nozzle 55 in the production of the other substrate types and the production of the substrate types produced before and after it was decreased to optimize the mounting operation. However, the present invention is not limited to this configuration. For example, in other embodiments, the priority of the common arrangement of the feeder 41 and the suction nozzle 55 in the production of the substrate type with a large cycle time difference and the production of the substrate types produced before and after it may be relatively increased, and the priority of the common arrangement of the feeder 41 and the suction nozzle 55 in the production of the substrate type with a small difference in the production required time and the production of the substrate types produced before and after it may be relatively decreased to optimize the mounting operation.

[0056] In the above embodiment, the first production line 31 and the second production line 21 were connected in a series arrangement. However, the present invention is not limited to this configuration. For example, in other embodiments, although the first production line 31 and the second production line 21 are arranged in series, a space may be provided between the two, and they may not be directly connected. Alternatively, the first production line 31 and the second production line 21 may be arranged in parallel.

[0057] Although the specific examples of the present invention have been described in detail above, these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and changes of the specific examples illustrated above. The technical elements described in this specification or the drawings exhibit technical utility alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. In addition, the technology illustrated in this specification or the drawings can achieve a plurality of objectives simultaneously, and achieving one of these objectives itself has technical utility.

Description of Reference Numerals

[0058] 1: Substrate 2: Component 3: Top surface 4: Bottom surface 6: Optimization system 21: Second production line 25: Second mounting machine 31: First production line 34: First mounting machine 41: Feeder 55: Suction nozzle 61: Optimization device

Claims

1. In a production line that performs a first mounting operation on a first production line including a first mounting machine for mounting components on the top surface of a substrate, and a second mounting operation on a second production line including a second mounting machine for mounting the components on the bottom surface of the substrate, when producing a double-sided mounting substrate, a system provided with an optimization device for optimizing the first mounting operation and the second mounting operation respectively, The first mounting machine and the second mounting machine have a plurality of feeders for supplying the components and a plurality of suction nozzles for sucking the components from the plurality of feeders, The optimization device, For the substrate type for which the mounting operation is to be optimized, compares the production required times for the top surface and the bottom surface, determines the bottleneck surface that becomes the bottleneck during substrate production as the one with the longer production required time, and determines the non-bottleneck surface as the one with the shorter production required time, a determination process, On the bottleneck surface, a first optimization process for optimizing the mounting operation on the bottleneck surface so that the feeder and the suction nozzle are arranged such that the production required time is the shortest, On the non-bottleneck surface, within a range not exceeding the production required time of the bottleneck surface, the mounting operation on the non-bottleneck surface is optimized so that the feeder and the suction nozzle are commonly arranged in the production of the substrate type to be optimized and the production of the substrate types produced before and after it, a second optimization process, An optimization system configured to be capable of executing.

2. In the production line, a plurality of execution conditions are set when producing double-sided mounting substrates of a plurality of substrate types, The optimization device optimizes the first mounting operation and the second mounting operation respectively by repeating trials while changing the plurality of execution conditions, The plurality of execution conditions include the arrangement of the feeders and the arrangement of the suction nozzles, The determination process, the first optimization process, and the second optimization process are executed for each of the plurality of substrate types. The optimization system according to claim 1.

3. The first production line and the second production line are connected in a series arrangement. The optimization system according to claim 1 or 2.

4. The second optimization process, When there is no restriction on the component payout from the feeder, while optimizing the mounting operation so that both the feeder and the suction nozzle are commonly arranged, When there are restrictions on the dispensing of components from the feeder, optimize the mounting operation so that only the suction nozzles are commonly arranged. The optimization system according to claim 1 or 2.

5. In a production line that performs a first mounting operation on a first production line including a first mounting machine that mounts components on the top surface of a substrate and a second mounting operation on a second production line including a second mounting machine that mounts the components on the bottom surface of the substrate, when producing a double-sided mounting substrate, a system provided with an optimization device that optimizes the first mounting operation and the second mounting operation respectively, The first mounting machine and the second mounting machine have a plurality of feeders that supply the components and a plurality of suction nozzles that suck the components from the plurality of feeders. When optimizing the mounting operation of one side surface of the top surface and the bottom surface for a substrate type for which the optimization device optimizes the mounting operation, the optimization system is configured to be able to execute an optimization process that optimizes the mounting operation so that the feeder and the suction nozzle are commonly arranged in the production of the substrate type and the production of the substrate types produced before and after it, taking into account the production required time of the opposite side surface.

6. In the production line, a plurality of execution conditions are set when producing double-sided mounting substrates of a plurality of substrate types. The optimization device optimizes the first mounting operation and the second mounting operation respectively by repeating trials while changing the plurality of execution conditions. The plurality of execution conditions include the arrangement of the feeder and the arrangement of the suction nozzle. The determination process, the first optimization process, and the second optimization process are executed for each of the plurality of substrate types. The optimization system according to claim 5.

7. The first production line and the second production line are connected in a serially arranged state. The optimization system according to claim 6.

8. The optimization process is From the result of comparing the difference in the production required time between the top surface and the bottom surface for each substrate type, identify the substrate type with the largest difference in the production required time. Increase the priority of the common arrangement of the feeder and the suction nozzle in the production of the substrate type with the largest difference in the production time required and in the production of the substrate types produced before and after it, and lower the priority of the common arrangement of the feeder and the suction nozzle in the production of other substrate types and in the production of the substrate types produced before and after it, so as to optimize the mounting operation. The optimization system according to claim 6 or 7.

9. The optimization process is From the results of comparing the differences in the production time required for the top surface and the bottom surface for each substrate type, classify the substrate types according to the magnitude of the difference in the production time required. Relatively increase the priority of the common arrangement of the feeder and the suction nozzle in the production of the substrate type with a large difference in the production time required and in the production of the substrate types produced before and after it, and relatively lower the priority of the common arrangement of the feeder and the suction nozzle in the production of the substrate type with a small difference in the production time required and in the production of the substrate types produced before and after it, so as to optimize the mounting operation. The optimization system according to claim 6 or 7.

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