Molded component, and method of manufacturing molded component

Abstract

To provide a molded component and a method of manufacturing the molded component that are less likely to cause a contact defect of an electronic component or the like mounted on a circuit substrate even when a design surface has a curved form.SOLUTION: A molded component 100 according to the present disclosure comprises: a base substrate layer 10 made of a synthetic resin having a planar form; a first film layer 30 provided on one surface of the base substrate layer 10 and having a curved area C; and a second film layer 20 provided on the other surface of the base substrate layer 10, and provided as a circuit substrate having a component mounting area E. The component mounting area E that faces the curved area C in the second film layer 20 has a plurality of flat areas 21.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present disclosure relates to a molded part with an integrated circuit board and a method for manufacturing the molded part.

Background Art

[0002] Conventionally, the development of a conductive circuit integrated molded product has been advanced in which a film material as a design surface for creating aesthetic appeal is arranged on one surface of a plate-shaped resin base material, and a film-shaped conductive circuit is arranged on the other surface and integrated (for example, Patent Document 1, etc.).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] By the way, in the conductive circuit integrated molded product as described above, when the design surface has a curved surface shape, since the conductive circuit is also arranged along the curved surface shape, electronic components are mounted in a tilted state with respect to the conductive circuit, which may cause contact failures and the like. Therefore, there is room for improvement in this regard.

[0005] The present disclosure has been made in view of such problems, and an object thereof is to provide a molded part and a method for manufacturing the molded part that are less likely to cause contact failures of electronic components and the like mounted on a circuit board even when the design surface has a curved surface shape.

Means for Solving the Problems

[0006] In order to solve the above problems, the molded part of the present disclosure is [1] a base layer made of synthetic resin having a plate-like shape, and A first film layer having a curved surface region provided on one surface of the base layer, A second film layer provided on the other surface of the base layer and provided as a circuit board having a component mounting region A molded part comprising: The component mounting region of the second film layer facing the curved surface region has a plurality of flat regions.

[0007] Further, the molded part of the present disclosure is [2] In the configuration described in the above [1], it is preferable that the thickness unevenness of the base layer overlapping each of the flat regions of the plurality of flat regions is equal to or less than a predetermined value.

[0008] Further, the molded part of the present disclosure is [3] In the configuration described in the above [1] or [2], it is preferable that each component mounted on the second film layer is arranged so as to fit within any one of the plurality of flat regions.

[0009] Further, the manufacturing method of the molded part of the present disclosure is [4] A method for manufacturing a molded part according to any one of the above [1] to [3], Arranging the first film layer on the cavity surface of a first mold having the shape of the curved surface region, Arranging the second film layer on the cavity surface of a second mold having the shape of the plurality of flat regions, Closing the first mold and the second mold, injecting molten resin into the cavity, and molding the molded part Characterized by including.

Advantages of the Invention

[0010] According to the present disclosure, even when the design surface has a curved surface shape, it is possible to provide a molded part and a method for manufacturing a molded part that are less likely to cause contact failures of electronic components or the like mounted on a circuit board.

Brief Description of the Drawings

[0011]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Mode for Carrying Out the Invention

[0012] Hereinafter, the present disclosure will be more specifically illustrated with reference to the drawings.

[0013] The molded part 100 which is one embodiment of the present disclosure shown in FIG. 1 has a plate-like shape with a substantially oval outer shape, and the upper surface (the surface on the minus side in the Z-axis direction) in FIGS. 1 and 2 constitutes a functional surface F that is recessed toward the lower side (the plus side in the Z-axis direction) of the figure. In the present embodiment, electronic components (not shown) are mounted on the functional surface F. Note that the functional surface F has a shape that is recessed toward the lower side (the plus side in the Z-axis direction) of the figure also along the longitudinal direction of the molded part 100 that is orthogonal to the A-A cross-section.

[0014] FIG. 3 is a conceptual diagram in which the cross-sectional view taken along the A-A cross-section shown in FIG. 2 is enlarged in the thickness direction (Z-axis direction) of the molded part 100 to make it easier to visually recognize the plane area to be described later. Also, in FIG. 3, unlike FIG. 2, it is drawn such that the design surface D which is the outer surface of the final product using the molded part 100 is on the upper side. The molded part 100 according to the present embodiment is assumed to create a sense of beauty when viewed from the design surface D side.

[0015] The molded part 100 according to this embodiment includes a base layer 10 made of a synthetic resin having a plate-like shape, a first film layer 30 provided on one surface (the design surface D side) of the base layer 10 and having a curved surface area C that constitutes the design surface D, and a second film layer 20 provided on the other surface (the functional surface F side) of the base layer 10 and provided as a circuit board having a component mounting area E. And the component mounting area E facing the curved surface area C in the second film layer 20 has a plurality of flat areas 21.

[0016] In this embodiment, as the material of the base layer 10, synthetic resin materials such as polycarbonate (PC), polypropylene (PP), acrylonitrile-butadiene-styrene (ABS), polystyrene (PS), and polymethyl methacrylate (PMMA) can be mainly used. However, it is not limited to this mode, and other synthetic resin materials other than the above may be used for the material of the base layer 10. In particular, when using synthetic resin materials with a large shrinkage rate such as PP and ABS as the base layer 10, the possibility of sink marks and warping due to thick parts increases, so it is considered that the merit of adopting the structure of the present disclosure is great. Also, polyethylene terephthalate (PET) is used for the substrate materials of the first film layer 30 and the second film layer 20. However, it is not limited to this mode, and other synthetic resin materials other than PET may be used. Note that the second film layer 20 includes a conductive layer in addition to the PET substrate. Also, a connector or the like for inputting and outputting signals may be mounted on the second film layer 20 that functions as a circuit board.

[0017] It is preferable to select the substrate materials of the first film layer 30 and the second film layer 20 in consideration of the hardness, glossiness, etc. required for the design surface D, the heat resistance temperature during component mounting required for the functional surface F, etc.

[0018] In this embodiment, all regions of the design surface D, which is the upper surface in FIG. 3, are curved surface regions C formed by curved surfaces. However, it is not limited to this, and only a part of the region of the design surface D may be a curved surface region C formed by a curved surface and the other regions of the design surface D may be flat surfaces.

[0019] Further, in the present embodiment, as shown in FIGS. 1 and 3, a region excluding the outer edge portion 21r on the functional surface F is composed of a plurality of planar regions 21. The plurality of planar regions 21 are formed by planes and are configured to include substantially rectangular planar regions 21a, 21b, 21c, 21d, 21e, 21a2, 21b2, 21c2, 21d2, 21e2 arranged in a lattice pattern as shown in FIG. 1. In the present embodiment, the plurality of planar regions 21 have a plurality of planes with different inclinations from each other. In the present embodiment, since no electronic components or the like are mounted on the outer edge portion 21r on the functional surface F, the outer edge portion 21r of the functional surface F is a curved surface having the same curvature as the opposing design surface D. However, the present invention is not limited to this aspect, and the outer edge portion 21r of the functional surface F may also be configured as a part of the plurality of planar regions 21.

[0020] In the present embodiment, as shown in FIG. 3, a virtual substrate layer having a thickness t with a curved surface shape on the design surface D side is also assumed on the functional surface F side (the lower surface of the substrate layer is shown by a broken line in FIG. 3), and the X-axis direction ends of the respective planar regions are arranged so as to be located on the lower surface of the virtual substrate layer having the thickness t. With such a configuration, for example, the actual thickness of the substrate layer 10 overlapping the planar region 21c arranged at the central position in the X-axis direction in FIG. 3 (the distance from the lower surface of the first film layer 30 in FIG. 3 to the upper surface of the planar region 21c) is t + Δt at the central position in the X-axis direction of the planar region 21c and becomes t at the X-axis direction end of the planar region 21c. That is, the thickness unevenness in the X-axis direction of the planar region 21c is Δt. Further, the substrate layer 10 overlapping the planar region 21c also has thickness unevenness in the Y-axis direction. The reference thickness t of the substrate layer 10 described above can be set, for example, to 2.5 [mm], and the thickness unevenness Δt can be set, for example, to a predetermined value: +0.5 [mm] or less. Making the thickness unevenness Δt here to a predetermined value: +0.5 [mm] or less means that the thickness may increase up to +0.5 mm with respect to the reference thickness t, but the thickness does not decrease from the reference thickness t.

[0021] In this embodiment, the thickness unevenness Δt of the base layer 10 is set to be equal to or less than a predetermined value in both the X-axis direction and the Y-axis direction. More specifically, as will be described later, when the thickness unevenness Δt exceeds the predetermined value in either the X-axis direction or the Y-axis direction, the number of divisions of the plurality of planar regions 21 in that direction is increased, and each planar region is defined so that the thickness unevenness Δt of the base layer 10 in that direction becomes equal to or less than the predetermined value.

[0022] As described above, in this embodiment, in both the X-axis direction and the Y-axis direction, the thickness unevenness Δt of the base layer 10 overlapping with each planar region is configured to be equal to or less than a predetermined value. With such a configuration, when forming the base layer 10, the shrinkage difference caused by the difference in the solidification (cooling) rate of the molten resin between the thick region and the thin region can be suppressed, and the occurrence of warping of the molded part 100 due to the shrinkage difference can be suppressed. In addition, it is possible to suppress the occurrence of welds due to the difference in the solidification (cooling) rate of the molten resin between the thick region and the thin region, and to suppress the deterioration of the appearance of the molded part 100. Furthermore, the variation in density due to the variation in the flow of the molten resin during filling into the mold between the thick region and the thin region can be suppressed, and the occurrence of sink marks in the thick portion can be suppressed.

[0023] Next, a procedure for dividing the plurality of planar regions 21 of the functional surface F so that the thickness unevenness Δt of the base layer 10 becomes equal to or less than a predetermined value will be described with reference to FIG. 4 and the like.

[0024] First, the designer of the molded part 100 determines the shape of the design surface D including the curved surface region C (step S101 in FIG. 4). The design surface D usually forms the outer shape of the final product in which the molded part 100 is used. In this embodiment, it is described assuming that the entire design surface D is the curved surface region C, but only a part of the design surface D may be the curved surface region C. A curved surface is a surface other than a plane among surfaces, and is a surface having a non-zero curvature in at least one of the X-axis direction and the Y-axis direction. The curved surface may be any curved surface such as the surface of a sphere, or the side surface of a cylinder or a cone, or a combination thereof.

[0025] Next, the designer of the molded part 100 arranges the component mounting area E on the functional surface F (step S102 in FIG. 4). The component mounting area E is an area where components such as electronic components are mounted, and is determined based on the circuit layout of the circuit board and the like. In the present embodiment, the area excluding the outer edge portion 21r on the functional surface F is defined as the component mounting area E. In the present embodiment, the continuous area excluding the outer edge portion 21r is used as the component mounting area E, but the present invention is not limited to this aspect. For example, a plurality of non-continuous areas within the functional surface F may be used as the component mounting area E.

[0026] The components mounted in the component mounting area E on the functional surface F are, for example, active elements such as transistors, ICs, diodes, and operational amplifiers, as well as passive elements such as resistors, coils, and capacitors, and auxiliary components such as relays, switches, connectors, other circuit boards, and wirings.

[0027] Next, the designer of the molded part 100 arranges a plurality of flat areas 21 in the component mounting area E facing the curved surface area C (overlapping the curved surface area C in the surface direction) (step S103 in FIG. 4). In the present embodiment, since all the areas of the design surface D are used as the curved surface area C, the arrangement of the plurality of flat areas 21 is to be arranged in all the areas of the component mounting area E.

[0028] In the present embodiment, the plurality of flat areas 21 include all the areas inside the frame-shaped outer edge portion 21r including the substantially rectangular flat areas 21a, 21b, 21c, 21d, 21e, 21a2, 21b2, 21c2, 21d2, and 21e2 labeled in FIG. 1. The plurality of flat areas 21 can include those having a substantially rectangular shape, a substantially triangular shape, or a polygonal shape, as well as flat areas at least partially surrounded by curves.

[0029] It is preferable that each component mounted in the component mounting area E on the functional surface F is arranged so as to fit within a single planar area. The state where the component fits within a single planar area as referred to here means that the component does not protrude outside the planar area when viewed from a direction orthogonal to the plane. This can make it difficult for contact failures to occur in electronic components or the like mounted on the circuit board of the functional surface F. However, this mode is not limited thereto, and depending on the specifications of components or the like, and / or considering the inclination angle between adjacent planar areas, etc., it may be arranged across two or more planar areas.

[0030] Next, it is determined whether or not the thickness unevenness Δt of the base layer 10 overlapping each planar area of the plurality of planar areas 21 is equal to or less than a predetermined amount (step S104 in FIG. 4). The determination of the thickness unevenness Δt of the base layer 10 is performed for all planar areas constituting the plurality of planar areas inside the outer edge portion 21r. The thickness unevenness Δt of the base layer 10 overlapping each planar area is acquired from, for example, 3D CAD data or the like, and planar areas where the thickness unevenness Δt exceeds the predetermined amount are listed. The thickness unevenness Δt acquires the thickness unevenness Δt in the X-axis direction and the Y-axis direction for each base layer 10 overlapping each planar area.

[0031] When the thickness unevenness Δt in the X-axis direction and the Y-axis direction is equal to or less than the predetermined amount for all planar areas (Yes in step S104), the procedure of dividing the component mounting area E of the functional surface F facing the curved surface area C into each planar area of the plurality of planar areas 21 is terminated.

[0032] On the other hand, when the thickness unevenness Δt of the base layer 10 overlapping the planar area in at least one of the X-axis direction and the Y-axis direction exceeds the predetermined amount in any planar area (No in step S104), the number of divisions of the planar area in the direction where the thickness unevenness Δt exceeds the predetermined amount is increased (step S105 in FIG. 4). For example, in FIG. 3, since the curvature of the curved surface is larger at the left end portion in the X-axis direction compared to the planar area 21c at the central position in the X-axis direction, it is divided into two planar areas 21a and 21b. Thus, by increasing the number of divisions of the planar area in the direction where the thickness unevenness Δt exceeds the predetermined amount, the thickness unevenness Δt in that direction can be made smaller compared to before the change in the number of divisions.

[0033] In step S105, after increasing the number of divisions of the planar region in the direction in which the thickness unevenness Δt exceeds a predetermined amount, the components mounted on the component mounting region E are rearranged so as to fit within one planar region (step S106 in FIG. 4). As described above, although this step S106 is not an essential procedure, by rearranging the components so as to fit within one planar region, it is possible to make it difficult for contact failures to occur in electronic components and the like mounted on the circuit board of the functional surface F.

[0034] After executing step S106, return to step S104 again, and determine whether the thickness unevenness Δt of the base layer 10 overlapping each planar region of the plurality of planar regions 21 is equal to or less than a predetermined amount (step S104 in FIG. 4). Thereafter, steps S104 to S106 are repeated until the thickness unevenness Δt of the base layer 10 overlapping each planar region of the plurality of planar regions 21 becomes equal to or less than a predetermined amount.

[0035] The manufacturing of the molded component 100 is formed by insert molding by arranging the first film layer 30 and the second film layer 20 in the cavity formed by the first mold and the second mold. When manufacturing the molded component 100, first, the first film layer 30 is arranged on the cavity surface of the first mold having the shape of the curved surface region C (step S201 in FIG. 5). Also, the second film layer 20 provided as a circuit board is arranged on the cavity surface of the second mold having the shape of the plurality of planar regions 21 (step S202 in FIG. 5). At this time, the first film layer 30 and the second film layer 20 are respectively adsorbed to the cavity surfaces of the first mold and the second mold through the suction holes provided in the first mold and the second mold. Note that the order of performing step S201 and step S202 is not limited, and step S202 may be performed first.

[0036] Next, the first mold and the second mold are closed, and a molten resin of PC is injected into the cavity to perform insert molding (step S203 in FIG. 5). Due to the injection pressure during this insert molding, the shape of the cavity surface having the shape of the curved surface region C of the first mold is transferred to the first film layer 30, so that a molded part 100 with the first film layer 30 having the curved surface region C as the design surface D is formed. Similarly, since the shape of the cavity surface having the shape of the plurality of planar regions 21 of the second mold is transferred to the second film layer 20, a molded part 100 with the second film layer 20 having the plurality of planar regions 21 as the functional surface F is formed.

[0037] Next, components constituting the circuit are mounted on the component mounting region E of the functional surface F by means such as soldering (step S204 in FIG. 5).

[0038] As described above, this embodiment is a molded part 100 including a base layer 10 made of a synthetic resin having a plate-like shape, a first film layer 30 having a curved surface region C provided on one surface of the base layer 10, and a second film layer 20 provided on the other surface of the base layer 10 and provided as a circuit board having a component mounting region E. The component mounting region E facing the curved surface region C in the second film layer 20 is configured to have a plurality of planar regions 21. By adopting such a configuration, even when the design surface D has the curved surface region C, since the component mounting region E facing the curved surface region C has a plurality of planar regions 21, electronic components and the like mounted on the circuit board are also arranged on each of the planar regions of the plurality of planar regions 21. Therefore, the electronic components and the like are not mounted on the surface of the circuit board in a tilted state. Accordingly, it is possible to suppress the occurrence of problems such as contact failure.

[0039] In addition, in the present embodiment, the thickness unevenness of the base layer 10 overlapping each of the plurality of planar regions 21 is configured to be equal to or less than a predetermined value. By adopting such a configuration, when the base layer 10 is molded, the shrinkage difference caused by the difference in the solidification (cooling) rate of the molten resin between the thick region and the thin region is suppressed, and the occurrence of warping of the molded part 100 due to the shrinkage difference can be suppressed. Further, it is possible to suppress the occurrence of welding due to the difference in the solidification (cooling) rate of the molten resin between the thick region and the thin region, and to suppress the deterioration of the appearance of the molded part 100. Furthermore, the variation in density due to the variation in the flow of the molten resin during filling into the mold between the thick region and the thin region can be suppressed, and the occurrence of sink marks in the thick portion can be suppressed.

[0040] In addition, in the present embodiment, each component mounted on the second film layer 20 is configured to be arranged so as to fit within any one of the plurality of planar regions 21. By adopting such a configuration, it is possible to more reliably suppress the mounting of electronic components or the like on the circuit board in an inclined state.

[0041] In addition, the present embodiment is a method for manufacturing a molded part 100, including arranging a first film layer 30 on the cavity surface of a first mold having the shape of the curved surface region C, arranging a second film layer 20 on the cavity surface of a second mold having the shape of the plurality of planar regions 21, closing the first mold and the second mold, and injecting molten resin into the cavity to mold the molded part 100. By adopting such a configuration, even when the design surface D has the curved surface region C, since the component mounting region E facing the curved surface region C has the plurality of planar regions 21, the electronic components or the like mounted on the circuit board are also arranged along each of the plurality of planar regions 21. Therefore, the electronic components or the like are not mounted on the circuit board in an inclined state. Accordingly, the occurrence of problems such as contact failure can be suppressed.

[0042] Although the present disclosure has been described based on the drawings and examples, it should be noted that those skilled in the art can easily make various modifications and alterations based on the present disclosure. Therefore, it should be noted that these modifications and alterations are included in the scope of the present invention. For example, the functions included in each component can be rearranged so as not to be logically contradictory, and a plurality of components can be combined into one or divided. It should be understood that these are also included in the scope of the present invention.

[0043] For example, in the present embodiment, the region excluding the outer edge portion 21r on the functional surface F is taken as a plurality of planar regions 21, but it is not limited to this aspect, and all regions of the functional surface F including the outer edge portion 21r may be configured as planar regions.

[0044] Further, in the present embodiment, an example in which the design surface D has a curved surface region C that is a convex surface has been shown and described, but it is not limited to this aspect. The design surface D may be configured to include a curved surface region C that is a concave surface. In that case, the base layer 10 overlapping each of the plurality of planar regions 21 facing the curved surface region C is thicker by a thickness unevenness Δt than the reference thickness t at the end position rather than the central position in the surface direction of each planar region. Also in that case, the thickness unevenness Δt can be reduced by increasing the number of divisions of the planar region in the direction along the surface.

[0045] Further, in the present embodiment, the case where the reference thickness t of the base layer 10 is set to 2.5 [mm] and the thickness unevenness Δt is set to a predetermined value: +0.5 [mm] or less has been described, but it is not limited to this aspect. The reference thickness t of the base layer 10 can be any value less than 2.5 [mm] or exceeding 2.5 [mm]. Also, regarding the predetermined value that allows the thickness unevenness Δt, the thickness unevenness Δt may be suppressed to be small as a value less than +0.5 [mm], or a large thickness unevenness Δt may be allowed by setting the predetermined value that allows the thickness unevenness Δt to a value exceeding +0.5 [mm]. Further, the thickness management may be performed so as to allow the case where the thickness becomes thinner than the reference thickness t by setting the predetermined value that allows the thickness unevenness Δt with respect to the reference thickness t to, for example, -0.5 [mm] or more and +0.5 [mm] or less.

[0046] Even if warping or the like occurs in the molded part 100 due to environmental temperature, humidity, etc., and each of the plurality of planar regions 21 deviates slightly from the plane, they shall be treated as planar regions.

Explanation of Reference Numerals

[0047] 10 Substrate layer 20 Second film layer 21 Plurality of planar regions 21a, 21b, 21c, 21d, 21e Planar regions 21a2, 21b2, 21c2, 21d2, 21e2 Planar regions 21r Outer edge 30 First film layer 100 Molded part C Curved surface region D Design surface E Component mounting region F Functional surface

Claims

1. A base layer made of synthetic resin having a plate-like shape, a first film layer provided on one surface of the base layer and having a curved surface region, a second film layer provided on the other surface of the base layer and provided as a circuit board having a component mounting region A molded part comprising: The component mounting region of the second film layer facing the curved surface region has a plurality of flat regions.

2. The molded part according to claim 1, wherein the thickness unevenness of the base layer overlapping each of the plurality of flat regions is set to be equal to or less than a predetermined value.

3. The molded part according to claim 1 or 2, wherein each component mounted on the second film layer is arranged so as to fit within any one of the plurality of flat regions.

4. A method for manufacturing the molded part according to claim 1 or 2, placing the first film layer on the cavity surface of a first mold having the shape of the curved surface region, placing the second film layer on the cavity surface of a second mold having the shape of the plurality of flat regions, closing the first mold and the second mold, and injecting molten resin into the cavity to mold the molded part A method for manufacturing a molded part, including:

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