Substrate cleaning device and substrate cleaning method

Abstract

To provide a substrate cleaning device that has a simple structure yet is capable of suppressing uneven cleaning, and a substrate cleaning method using the substrate cleaning device.SOLUTION: A substrate cleaning device includes a rotating unit having a rotatable stage connected on the rotation shaft of a motor and a movable substrate guide provided on the stage, and a cleaning nozzle provided above the rotating unit that ejects cleaning liquid onto a substrate placed on the stage.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The following disclosure relates to a substrate cleaning apparatus and a method for cleaning a substrate.

Background Art

[0002] In the manufacture of substrates such as semiconductor devices and liquid crystal display devices, in order to remove foreign matter generated in each manufacturing process of the substrate, a step of cleaning the substrate is performed by rotating the substrate while discharging a cleaning liquid from a cleaning nozzle onto the substrate. However, such a cleaning method of rotating the substrate has a problem that uneven cleaning in a spiral shape starting from the rotation center of the substrate disposed on the stage occurs due to the centrifugal force applied to the cleaning liquid and the retention of the cleaning liquid, which causes defective products.

[0003] In response to this problem, it has been proposed to reduce uneven cleaning by moving two nozzles respectively using a plurality of cleaning nozzles (for example, Patent Document 1). In the substrate cleaning apparatus of Patent Document 1, nozzles are provided at two locations, the central portion of the substrate and the edge portion of the substrate, and by controlling these, uneven cleaning can be suppressed. Further, the cleaning liquid discharged from each nozzle is made into a mixture with air, and by changing the mixing method with air for each nozzle, damage to the substrate can also be suppressed.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, although the substrate cleaning apparatus as in Patent Document 1 can suppress uneven cleaning, there is a problem that the mechanism becomes complicated because it is necessary to move a plurality of nozzles according to the cleaning time and the cleaning area, or to prepare a plurality of cleaning liquids to be discharged.

[0006] The present invention has been made in view of the above situation, and an object thereof is to provide a substrate cleaning apparatus having a simple structure and capable of suppressing cleaning unevenness, and a method for cleaning a substrate using the substrate cleaning apparatus.

Means for Solving the Problems

[0007] The present disclosure is composed of the following Disclosures 1 to 6. Hereinafter, the present disclosure will be described in detail. [Disclosure 1] A rotating unit having a rotatable stage connected to a rotating shaft of a motor, and a movable substrate guide provided on the stage, and A cleaning nozzle provided above the rotating unit and discharging a cleaning liquid onto a substrate placed on the stage A substrate cleaning apparatus comprising: [Disclosure 2] The substrate cleaning apparatus according to Disclosure 1, wherein the stage includes a center of gravity sensor and a weight movable in a plane direction of the stage. [Disclosure 3] The cleaning nozzle is arranged to cross the stage in a plane direction by bridging a set of rails, The substrate cleaning apparatus according to Disclosure 1 or 2, which is movable along the rails. [Disclosure 4] The cleaning nozzle has a slit-shaped discharge port having a length exceeding a diagonal of a substrate to be cleaned, and the substrate cleaning apparatus according to Disclosure 1 or 2. [Disclosure 5] The substrate cleaning apparatus according to Disclosure 1 or 2, comprising a plurality of the cleaning nozzles. [Disclosure 6] A method for cleaning a substrate using the substrate cleaning apparatus according to any one of Disclosures 1 to 5, A step of installing a substrate at a position on the stage regulated by the substrate guide, A step of performing a substrate rotation cleaning process of discharging the cleaning liquid from the cleaning nozzle onto the substrate while rotating the rotating unit, A substrate cleaning method having an offset step of changing the position of the substrate on the stage by moving the substrate guide.

Effect of the Invention

[0008] According to the present invention, it is possible to provide a substrate cleaning apparatus that can suppress cleaning unevenness while having a simple structure, and a substrate cleaning method using the substrate cleaning apparatus.

Brief Description of the Drawings

[0009]

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Embodiments for Carrying Out the Invention

[0010] Embodiments will be described below, and the present invention will be described in more detail with reference to the drawings. However, the present invention is not limited to these embodiments only. Also, the configurations of each embodiment may be appropriately combined or changed without departing from the gist of the present invention.

[0011] (Embodiment 1) The substrate cleaning apparatus according to Embodiment 1 includes a rotating part having a rotatable stage connected to the rotation axis of a motor and a movable substrate guide provided on the stage, and a cleaning nozzle provided above the rotating part for discharging a cleaning liquid onto the substrate placed on the stage. Here, a side view showing an example of the rotating part of the substrate cleaning apparatus according to Embodiment 1 is shown in FIG. 1, and a top view showing an example of the substrate cleaning apparatus according to Embodiment 1 is shown in FIG. 2. As shown in FIG. 1, the substrate cleaning apparatus of the present embodiment has a rotating part in which a suction chuck 4, a stage 1, and a movable substrate guide 2 are connected on a motor 6 and a rotation axis (for example, a metal shaft) 5 of the motor 6. Further, the suction chuck 4 and the stage 1 are connected so that the center of gravity is located on the center line of the rotation axis 5. Furthermore, as shown in FIG. 2, the substrate cleaning apparatus of the present embodiment includes a cleaning nozzle 3 above the rotating part. By placing the substrate 7 on the substrate guide 2 and rotating the rotating part while discharging the cleaning liquid from the cleaning nozzle 3 onto the substrate 7, the cleaning liquid spreads over the entire substrate 7 due to the centrifugal force of rotation, and the substrate 7 is cleaned. In this specification, "above" and "upper surface" refer to the direction or surface on the stage side in the direction of the rotation axis of the above-mentioned rotating part. Also, "side surface" refers to a plane parallel to the rotation axis of the above-mentioned rotating part.

[0012] The above-mentioned motor, rotating shaft, stage, and adsorption chuck can be the same as those used in a conventional spin-type substrate cleaning apparatus.

[0013] The above-mentioned substrate guide can move on the stage and change the position of the substrate placed on the substrate guide on the stage. In a conventional substrate cleaning apparatus, when cleaning the substrate, spiral cleaning unevenness occurred on the substrate, which was the cause of defective products. In the substrate cleaning apparatus of the present embodiment, as shown in FIG. 2, first, cleaning is performed at position A, and then or during the cleaning, the substrate guide 2 is moved to position B, and cleaning is also performed at position B. As a result, spiral cleaning unevenness 8 occurs at different positions on the substrate 7, so the cleaning degree is leveled over the entire substrate 7, and cleaning unevenness can be suppressed. Also, in a conventional substrate cleaning apparatus, a complex mechanism and control such as moving a plurality of cleaning nozzles during cleaning and changing the position of the cleaning nozzle and the discharge amount of the cleaning liquid according to the progress of cleaning were required. On the other hand, in the substrate cleaning apparatus of the present embodiment, since it is only necessary to move the substrate guide 2 by a certain amount, cleaning unevenness can be suppressed with a simple mechanism and control.

[0014] Here, FIG. 3 shows an image diagram representing the distribution of remaining contaminants after cleaning a substrate using a conventional substrate cleaning apparatus by computer simulation, and FIG. 4 shows an image diagram representing the distribution of foreign matter after cleaning a substrate using the substrate cleaning apparatus of the present embodiment by computer simulation. In FIGS. 3 and 4, foreign matter (the object to be removed by cleaning) is represented by dots. As shown in FIG. 3, in the conventional substrate cleaning apparatus, swirling cleaning unevenness occurs due to the centrifugal force applied to the cleaning liquid and the retention of the cleaning liquid, etc., and the foreign matter that could not be cleaned remains in a solid state. On the other hand, as shown in FIG. 4, in the substrate cleaning apparatus of the present embodiment, by moving the position of the substrate, swirling cleaning unevenness occurs at different positions of the substrate, so the distribution of foreign matter is leveled and the cleaning unevenness is reduced.

[0015] Examples of the moving mechanism of the substrate guide include, for example, the moving mechanisms shown in FIGS. 5 to 9. FIG. 5 is a top view of the stage in the moving mechanism shown in FIGS. 6 to 9, FIGS. 6 and 7 are a top view and a side view respectively showing an example of the moving mechanism of the substrate guide, and FIGS. 8 and 9 are a top view and a side view respectively showing a further example of the moving mechanism of the substrate guide. For clarity, in FIG. 7, two of the four substrate guides and one set of the moving mechanism are omitted, and in FIG. 9, two of the four substrate guides are omitted. The moving mechanism of the substrate guide in FIGS. 5 to 7 is composed of a substrate guide 2, a moving plate 21, a mandrel 22, and a moving mechanism 23. The substrate guide 2 is fixed to the moving plate 21 through a hole 1a provided in the stage 1, and moves inside the hole 1a provided in the stage 1. The moving plate 21 is disposed below the stage 1, and an opening is provided so as not to interfere with the rotating shaft 5 during rotation and movement. The moving mechanism 23 is fixed to the lower part of the moving plate 21 and has a threaded groove cut therein. One end of the mandrel 22 is connected to the peripheral edge of the stage 1 and is movable only in the rotating direction. Further, a screw 22a corresponding to the threaded groove of the moving mechanism 23 is cut in the mandrel 22, and the moving mechanism 23 is connected thereto.

[0016] The substrate guides in FIGS. 5 to 7 move the moving mechanism 23 in the extending direction of the mandrel 22 in the manner of a feed screw by rotating the mandrel 22. As a result, since the moving plate 21 fixed to the moving mechanism 23 and the substrate guide 2 fixed to the moving plate 21 also move, the substrate guide 2 can move on the stage. In FIG. 6, two sets of the mandrel 22 and the moving mechanism 23 are used, but even one set may be sufficient as long as the moving plate 21 can be moved. Further, the rotation of the mandrel 22 may be electrically performed using a motor or the like.

[0017] The moving mechanism of the substrate guides in FIGS. 5, 8, and 9 is composed of a substrate guide 2, a moving plate 21 having two or more protrusions 21a at the lower part, an intermediate plate 24 having the same number of protrusions 24a as the protrusions 21a at the upper part, a push-up pin 25, and a spring 26. The substrate guide 2 is fixed to the moving plate 21 through a hole 1a provided in the stage 1 and moves inside the hole 1a provided in the stage 1. The moving plate 21 is disposed below the stage 1, the intermediate plate 24 is disposed below the moving plate 21, the lower surface of the protrusion 21a and the upper surface of the protrusion 24a are each inclined at the same angle, and they face and contact each other so that their inclination directions coincide. The push-up pin 25 is disposed below the intermediate plate 24 and can move the intermediate plate 24 up and down. The spring 26 is fixed to the peripheral edge of the lower part of the stage 1 and is disposed at a position where it contacts the protrusion 21a.

[0018] In the substrate guides of FIGS. 5, 8, and 9, when the intermediate plate 24 is lifted by the push-up pin 25, the moving plate 21 moves via the protrusion 21a so as to lower the inclination of the protrusion 24a of the intermediate plate 24. When the intermediate plate 24 is lowered, the moving plate 21 moves via the repulsive force of the spring 26 fixed to the stage 1 so as to raise the inclination of the protrusion 24a of the intermediate plate 24. Due to such movement, the moving plate 21 moves in the planar direction, so that the substrate guide 2 fixed to the moving plate 21 can move on the stage. Note that the protrusion 21a of the moving plate 21 and the protrusion 24a of the intermediate plate 24 are preferably arranged evenly on the moving plate 21 and the intermediate plate 24 from the viewpoint of suppressing unevenness in the rotation part's center of gravity and ensuring smooth movement of the substrate guide 2.

[0019] The movement amount of the above substrate guide is appropriately determined in consideration of the position of the cleaning nozzle, the discharge amount and discharge speed of the cleaning liquid, the rotation speed of the rotation part, etc., so as to further suppress cleaning unevenness. As an example of the movement amount of the above substrate guide, for example, when the substrate size is 730 mm × 920 mm, the maximum movement amount can be set to about 360 mm.

[0020] The position of the above cleaning nozzle, the arrangement (number) of the cleaning nozzles, the size and shape of the discharge port of the cleaning nozzle, and the discharge amount of the cleaning liquid are not particularly limited, and can be set to the same conditions as those of a conventional spin-type substrate cleaning apparatus. Also, the discharge angle of the cleaning liquid can be set to the same conditions as those of a conventional spin-type substrate cleaning apparatus, but it is preferably within ±5° from the viewpoint of further suppressing cleaning unevenness. The above cleaning nozzle may have a movable discharge port that reciprocates within a certain discharge angle range. Note that in this specification, the discharge angle of the cleaning liquid refers to the angle formed by the discharged cleaning liquid and the perpendicular line dropped from the discharge port of the above cleaning nozzle to the above stage.

[0021] Examples of the cleaning liquid discharged from the cleaning nozzle include cleaning liquids conventionally used for substrate cleaning such as pure water, acids, alkalis, and ozone water. Further, the cleaning liquid may be a mixture of a cleaning liquid used for the substrate cleaning and a gas such as air or nitrogen gas. The flow rate of the cleaning liquid can also be set under the same conditions as those in conventional substrate cleaning according to the type of the substrate. As an example, when the cleaning liquid is pure water, it is 7 to 10 L / min, and when the cleaning liquid is ozone water, it is 1 to 2 L / min.

[0022] Examples of the substrate to be cleaned in this embodiment include substrates of display devices such as liquid crystal display devices and organic EL display devices, and substrates of semiconductor devices.

[0023] The rotational speed of the rotating unit can be set under the same conditions as those used in a conventional spin-type substrate cleaning apparatus. As an example, it is 15 rpm to 150 rpm.

[0024] (Embodiment 2) The substrate cleaning apparatus according to Embodiment 2 includes a center-of-gravity sensor on the stage and a weight movable in the plane direction of the stage. Here, Fig. 10 shows a top view illustrating an example of the substrate cleaning apparatus according to Embodiment 2, Fig. 11 shows a schematic diagram illustrating an example of the stage of the substrate cleaning apparatus according to Embodiment 2, and Fig. 12 shows a schematic diagram for explaining a method of controlling the center of gravity position of the substrate cleaning apparatus according to Embodiment 2. As shown in Figs. 10 and 11, in the substrate cleaning apparatus of the present embodiment, a center of gravity sensor 9 is provided around the stage 1 of Embodiment 1, and a weight 11 that moves in the plane direction of the rotating part (the central direction of the rotation axis in Fig. 11) is provided inside the stage 1 or on the lower surface side of the stage. By having such a structure, the position of the center of gravity on the stage 1 can be moved by adjusting the position of each weight 11 while measuring the position of the center of gravity on the stage 1 with the center of gravity sensor 9. As a result, as shown in Fig. 12, by moving the substrate guide 2, the center of gravity 10 on the displaced stage 1 can be moved to the center of the rotation axis, and unnecessary vibrations during rotation can be suppressed. Further, since the center of gravity on the stage can be moved, substrates of different sizes can be cleaned without changing the stage. In this specification, the "plane direction" refers to a direction perpendicular to the rotation axis of the above-mentioned stage and the above-mentioned rotating part.

[0025] The number of the above-mentioned center of gravity sensors only needs to be able to specify the position of the center of gravity on the stage. However, from the viewpoints of the measurement accuracy of the center of gravity, cost, and weight balance, it is preferable to provide 3 or more and 12 or less at equal intervals on the outer periphery of the stage.

[0026] The number of the above-mentioned weights only needs to be able to move the position of the center of gravity on the stage to the center of the rotation axis in the same manner as the above-mentioned center of gravity sensor. However, from the relationship of the accuracy of the movement of the center of gravity, cost, and weight balance, it is preferable to provide 3 or more and 12 or less at equal intervals along the outer periphery inside the stage or on the lower surface.

[0027] As a method of controlling the center of gravity position using the above-mentioned center of gravity sensor and weight, for example, the method shown in the flowchart of Fig. 13 can be mentioned. In the method for controlling the center-of-gravity position shown in FIG. 13, first, after performing a first cleaning step (S1) of cleaning the substrate under the same cleaning conditions as the conventional spin-type substrate cleaning apparatus at the initial position (for example, position A in FIG. 2), the substrate guide is moved to a predetermined position (for example, position B in FIG. 2) to change the position of the substrate (S2). Next, the center-of-gravity position on the stage is specified by the center-of-gravity sensor (S3), and the amount of deviation from the center of the rotation axis is calculated (S4). Subsequently, the weight is moved so that the center of gravity moves by the calculated amount of deviation (S5), and it is determined whether the center of gravity on the stage after the weight movement coincides with the center of the rotation axis (S6). If the center of gravity on the stage does not coincide with the center of the rotation axis, the steps of S3 to S6 are repeated until they coincide. Then, after the center of gravity on the stage coincides with the center of the rotation axis, a second cleaning step of cleaning the substrate under the same conditions as the first cleaning step is performed (S7).

[0028] (Embodiment 3) FIG. 14 is a top view showing an example of the substrate cleaning apparatus according to Embodiment 3, and FIG. 15 is a side view showing an example of the substrate cleaning apparatus according to Embodiment 3. As shown in FIGS. 14 and 15, the substrate cleaning apparatus according to Embodiment 3, in addition to the rotating part of Embodiment 1, bridges a pair of rails 12 arranged so that the cleaning nozzles 3 sandwich the rotating part and are arranged to cross over the rotating part in the planar direction. Further, the cleaning nozzles 3 are movable along the rails 12 and discharge the cleaning liquid in a shower shape. While moving the substrate 7 as in Embodiment 1 to perform cleaning, the cleaning nozzles 3 discharge the cleaning liquid in a shower shape, that is, the cleaning liquid is discharged linearly or in a planar shape from the discharge ports of the plurality of cleaning nozzles 3 while moving, so that the cleaning unevenness can be suppressed more than in the case of only moving the position of the substrate 7. Note that since the substrate cleaning apparatus of the present embodiment can equalize the cleaning unevenness to a certain level or more by moving the substrate 7, it is not necessary to precisely control the moving speed of the cleaning nozzles 3 and the discharge amount of the cleaning liquid according to the progress of cleaning, and it is possible to effectively suppress the cleaning unevenness by simply moving the cleaning nozzles at a constant speed. Also, the rails 12 may be fixed to the lower part of the substrate cleaning apparatus as shown in FIGS. 14 and 15, or may be fixed to the upper part of the substrate cleaning apparatus like an overhead crane.

[0029] In the substrate cleaning apparatus according to Embodiment 3, the height of the cleaning nozzle, that is, the height of the discharge port of the cleaning nozzle, can be set under the same conditions as those of the cleaning nozzle of the conventional substrate cleaning apparatus. Further, the range of the discharge port of the cleaning nozzle only needs to be able to discharge the cleaning liquid in a shower shape over the entire substrate. As an example, when the substrate size is 730 mm × 920 mm, it is preferable that the discharge port of the cleaning nozzle is arranged so that the cleaning liquid hits the entire substrate in a range of 920 mm or more of the cleaning nozzle.

[0030] In the substrate cleaning apparatus according to Embodiment 3, the discharge angle of the cleaning liquid is preferably within ±5° from the viewpoint of further suppressing cleaning unevenness. Note that, in the substrate cleaning apparatus according to Embodiment 3, each discharge port for discharging the cleaning liquid in a shower shape of the cleaning nozzle may have the same discharge angle, or may have different discharge angles depending on the discharge port. Further, the discharge port may be movable and reciprocate within a range of a certain discharge angle.

[0031] (Embodiment 4) FIG. 16 is a top view showing an example of the substrate cleaning apparatus according to Embodiment 4. As shown in FIG. 16, in the substrate cleaning apparatus according to Embodiment 4, in addition to the rotating part of Embodiment 1, a cleaning nozzle 3 is provided in the plane direction of the stage 1, and the discharge port of the cleaning nozzle 3 has a length exceeding the diagonal line of the substrate to be cleaned. Further, the discharge port of the cleaning nozzle 3 has a slit shape as shown by the broken line, and is configured to be able to discharge the cleaning liquid over the entire substrate. By using such a cleaning nozzle, the cleaning liquid can be discharged over the entire substrate without moving the cleaning nozzle, and cleaning unevenness can be suppressed. Note that the shape of the discharge port may be a single slit having a length exceeding the diagonal line of the substrate as shown in FIG. 16, or may be a shape in which a single slit is divided into several sections.

[0032] In the substrate cleaning apparatus according to Embodiment 4, the height of the cleaning nozzle, that is, the height of the discharge port of the cleaning nozzle, can be set under the same conditions as those of Embodiment 3 described above.

[0033] In the substrate cleaning apparatus according to Embodiment 4, the length of the discharge port (slit length) of the cleaning nozzle only needs to exceed the length of the diagonal line of the substrate. Further, from the viewpoint of preventing the cleaning liquid from running out, the width of the slit is preferably 0.05 mm or more and preferably 1.5 mm or less.

[0034] In the substrate cleaning apparatus according to Embodiment 4, the discharge angle of the cleaning liquid is preferably within ±5° from the viewpoint of further suppressing cleaning unevenness. When the slit is divided into a plurality of sections, each slit may have a different discharge angle. Further, the cleaning nozzle or the slit may move and reciprocate within a range of a constant discharge angle.

[0035] (Embodiment 5) FIG. 17 is a top view showing an example of a substrate cleaning apparatus according to Embodiment 5. As shown in FIG. 17, the substrate cleaning apparatus according to Embodiment 5 has a plurality of cleaning nozzles 3 in addition to the rotating unit of Embodiment 1. By using a plurality of cleaning nozzles 3, cleaning unevenness is equalized, so that cleaning unevenness can be further suppressed. Further, in the substrate cleaning apparatus according to Embodiment 5, since the position of the substrate 7 moves in the rotating unit, it is not necessary to move the cleaning nozzle 3, and precise and complex control of the cleaning nozzle is not required.

[0036] The number of the cleaning nozzles may be two or more, but preferably three or more. Further, there is no particular limitation on the upper limit of the number of nozzles, but from the viewpoint of the balance between cost and suppression of cleaning unevenness, when the substrate size is 730 mm × 920 mm, it is preferably 12 or less.

[0037] The arrangement of each cleaning nozzle (arrangement of the discharge port) is appropriately determined so as to reduce cleaning unevenness, but from the viewpoint of further suppressing cleaning unevenness, it is preferably arranged linearly and the cleaning liquid discharged at the initial position of the rotating unit (position before the start of cleaning) bisects the diagonal line of the substrate.

[0038] In the substrate cleaning apparatus according to Embodiment 5, the positions of the respective cleaning nozzles, the sizes and shapes of the discharge ports of the cleaning nozzles, the discharge amount and discharge angle of the cleaning liquid can be set to the same conditions as in Embodiment 1 above.

[0039] As a specific example of the method for cleaning a substrate using the substrate cleaning apparatus of the present embodiment, a step of installing a substrate at a position on the stage regulated by the substrate guide; a step of performing a substrate rotation cleaning process of discharging the cleaning liquid from the cleaning nozzle onto the substrate while rotating the rotating part; and an offset step of changing the position of the substrate on the stage by moving the substrate guide. A method for cleaning a substrate having the above steps can be mentioned. The above method for cleaning a substrate is also one of the present embodiments.

[0040] Regarding the type and discharge amount of the cleaning liquid in the step of performing the substrate rotation cleaning process, the shape and discharge angle of the discharge port of the cleaning nozzle, and the rotation speed of the rotating part, the conditions described in Embodiments 1 to 5 above can be used. Also, for the cleaning time in the step of performing the substrate rotation cleaning process, conditions similar to those of a conventional spin-type substrate cleaning apparatus can be used.

[0041] Regarding the moving amount of the substrate guide in the above offset step, the conditions described in Embodiment 1 above can be used. Also, the above offset step may be performed between the first cleaning step and the second cleaning step by dividing the step of performing the substrate rotation cleaning process into two steps, the first cleaning step and the second cleaning step, or may be performed during the step of performing the substrate rotation cleaning process. When performing the first cleaning step and the second cleaning step, from the viewpoints of suppressing cleaning efficiency and damage to the substrate, the total cleaning time of the first cleaning step and the second cleaning step is preferably about the same as the cleaning time when the step of performing the substrate rotation cleaning process is performed once.

Explanation of Reference Numerals

[0042] 1: Stage 1a: Hole 2: Substrate guide 3: Cleaning nozzle 4: Suction chuck 5: Rotation axis 6: Motor 7: Substrate 8: Cleaning unevenness 9: Center of gravity sensor 10: Center of gravity on the stage 11: Weight 12: Rail 21: Moving plate 21a: Protrusion 22: Mandrel 22a: Screw 23: Moving mechanism 24: Intermediate plate 24a: Protrusion 25: Pushing pin 26: Spring

Claims

1. A rotating part having a rotatable stage connected to a rotating shaft of a motor and a movable substrate guide provided on the stage, and A cleaning nozzle provided above the rotating part and discharging a cleaning liquid onto a substrate placed on the stage A substrate cleaning apparatus comprising.

2. The substrate cleaning apparatus according to claim 1, wherein the stage includes a center of gravity sensor and a weight movable in a plane direction of the stage.

3. The cleaning nozzle is arranged to cross the stage in a plane direction by bridging a set of rails, The substrate cleaning apparatus according to claim 1 or 2, which is movable along the rails.

4. The substrate cleaning apparatus according to claim 1 or 2, wherein the cleaning nozzle has a slit-shaped discharge port having a length exceeding a diagonal of the substrate to be cleaned.

5. The substrate cleaning apparatus according to claim 1 or 2, comprising a plurality of the cleaning nozzles.

6. A method for cleaning a substrate using the substrate cleaning apparatus according to claim 1 or 2, comprising: A step of installing a substrate at a position on the stage regulated by the substrate guide; A step of performing a substrate rotation cleaning process of discharging the cleaning liquid from the cleaning nozzle onto the substrate while rotating the rotating part; and An offset step of changing the position of the substrate on the stage by moving the substrate guide.

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