Substrate conveying apparatus, substrate processing apparatus and teaching method

Abstract

To provide a substrate conveying apparatus capable of efficiently performing teaching work.SOLUTION: According to the present invention, three movable guides 67 for clamping an outer peripheral surface of a substrate W are provided on a first hand 19 of an indexer block 5. The first hand 19 brings the first hand 19 close to the substrate W, assuming that the substrate W is at its initial setting position, and then brings the movable guide 67 into contact with the substrate W. A position of a center point of substrate W is calculated in accordance with relative positions of each movable guide 67 when each movable guide 67 is in contact with the substrate W, and the position of the center point is stored in a storage unit as a new set position.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a substrate transfer device for transferring substrates such as semiconductor substrates, substrates for flat panel displays (FPD) such as liquid crystal display and organic EL (Electroluminescence) display devices, glass substrates for photomasks, and substrates for optical discs, and a substrate processing device including the same.

Background Art

[0002] A substrate transfer device may be affected by positional errors that occur during assembly. That is, even when the transfer mechanism that holds the substrate is moved to the set position where the substrate should be, the actual substrate may be slightly displaced from this set position. The operation of resetting the set position to the position of the actual substrate to correct the displacement is called teaching work.

[0003] Patent Document 1 describes a technique that can be used for teaching work. That is, Patent Document 1 describes a step of detecting the outer edge of a substrate conveyed by a transfer mechanism and measuring the center position of the substrate using an adjustment value corresponding to a preset path for conveying the substrate. Further, Patent Document 1 describes a step of correcting a target position based on the deviation amount between the center position of the substrate and the standard position of a preset holding portion. Further, Patent Document 1 describes a step of controlling the transfer mechanism so that the standard position of the holding portion becomes the corrected target position.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] The conventional configuration has the following problems. That is, the calculation of the outer edge of the substrate in the conventional configuration is based on a method in which the transfer mechanism transfers the substrate to the sensor and causes the sensor to detect the outer edge of the substrate. Therefore, in order to measure the center position of the substrate, the substrate must be transferred to a certain fixed position in the substrate transfer device. Such an operation must be performed as many times as the number of target positions, and it takes a considerable amount of time for the teaching operation.

[0006] The present invention has been made in view of such circumstances, and an object thereof is to provide a substrate transfer device, a substrate processing device, and a teaching method capable of efficiently performing the teaching operation.

Means for Solving the Problems

[0007] In order to achieve such an object, the present invention has the following configuration. That is, the present invention is a substrate transfer device that transfers a substrate with an operation of receiving a substrate in a horizontal posture at a predetermined setting position and an operation of delivering a substrate in a horizontal posture to a predetermined setting position, a hand for acquiring the substrate, a hand driving mechanism for driving the hand to transfer the substrate, at least three movable guides provided on the hand, for sandwiching the outer peripheral surface of the substrate and holding the substrate separated from the hand in the vertical direction, a forward and backward driving mechanism for driving the movable guide forward and backward with respect to the substrate, a storage unit for storing the setting position, a control unit that controls the hand driving mechanism with reference to the setting position stored in advance in the storage unit, approaches the hand to the substrate at the setting position, and then controls the forward and backward driving mechanism to bring each movable guide into contact with the substrate, a calculation unit that calculates the position of the center point of the substrate based on the positional relationship of each movable guide when each movable guide contacts the substrate, and a setting unit that stores the position of the center point as a new setting position in the storage unit. The control unit is characterized in that when delivering the substrate next, it refers to the new set position stored in the storage unit.

[0008] [Function and Effect] According to the above configuration, three movable guides that sandwich the outer peripheral surface of the substrate are provided on the hand of the substrate transfer device. After the hand approaches the substrate on the premise that the substrate is at a predetermined set position, the hand can recognize the position where the substrate exists by bringing the movable guide into contact with the substrate. Then, if the center point of the substrate is calculated based on the positional relationship of the movable guides, in the next substrate clamping operation by the hand, it can operate on the premise that the substrate is at the calculated center point. Therefore, according to the present invention, since the teaching operation is completed only by the hand clamping the substrate, the teaching operation can be performed efficiently.

[0009] Also, in the above-described substrate transfer device, It is more preferable that the advancing / retreating drive mechanism is configured to be able to advance and retreat in the direction of approaching and separating from the substrate at the set position of the movable guide.

[0010] [Function and Effect] According to the above configuration, the advancing / retreating drive mechanism is configured to be able to advance and retreat in the direction of approaching and separating from the substrate at the set position of the movable guide. With such a configuration, the teaching operation becomes easy.

[0011] Also, in the above-described substrate transfer device, The hand drive mechanism includes a vertical drive mechanism that drives the hand in the vertical direction, It is preferable that the calculation unit actually measures the position of the substrate in the vertical direction by bringing the movable guide into contact with the substrate from the vertical direction.

[0012] [Function and Effect] According to the above configuration, the hand drive mechanism includes a vertical drive mechanism that drives the hand in the vertical direction, and the calculation unit actually measures the position of the substrate in the vertical direction by bringing the movable guide into contact with the substrate from the vertical direction. With such a configuration, the teaching operation becomes easy.

[0013] Also, in the above-described substrate transfer device, the control unit controls the hand drive mechanism and the forward and backward drive mechanism until the difference between the calculated position of the center point of the substrate and the set position already stored in the storage unit becomes equal to or less than a predetermined value, and causes the movable guide to contact the substrate by controlling the hand drive mechanism and the forward and backward drive mechanism, the calculation unit calculates the position of the center point of the substrate each time the movable guide contacts the substrate, the setting unit stores the position of the center point of the substrate calculated each time the movable guide contacts the substrate in the storage unit as a new set position, It is more preferable to repeat each operation.

[0014] [Function and Effect] According to the above-described configuration, a configuration is provided in which redefinition of the set position is repeated. By doing so, redefinition of the set position can be executed more accurately.

[0015] Also, in the above-described substrate transfer device, it is desirable that the control unit individually controls the movable guide by the forward and backward drive mechanism and stops the contacted movable guide when the movable guide contacts the outer peripheral surface of the substrate.

[0016] [Function and Effect] According to the above-described configuration, the control unit is configured to individually control the movable guide by the forward and backward drive mechanism and stop the contacted movable guide when the movable guide contacts the outer peripheral surface of the substrate. With this configuration, when the hand holds the substrate, an external force is not applied to the substrate and the substrate does not shift or move. Therefore, according to the above-described configuration, the teaching operation becomes easy.

[0017] Also, in the above-described transfer device, the hand includes a first blade, a second blade, and a connecting portion that connects the first blade and the second blade. Preferably, each of the three movable guides is provided on each of the first blade, the second blade, and the connecting portion.

[0018] [Function and Effect] According to the above configuration, the hand includes a first blade, a second blade, and a connecting portion, and the three movable guides are provided on each of the first blade, the second blade, and the connecting portion. With this configuration, the substrate can be clamped at three points with different positions, so that the teaching operation can be easily performed after accurately knowing the position of the substrate.

[0019] Also, in the above-described substrate transfer device, The movable guide provided on the first blade is movable forward and backward in the extending direction of the first blade, Preferably, the movable guide provided on the second blade is movable forward and backward in the extending direction of the second blade.

[0020] [Function and Effect] According to the above configuration, the movable guide provided on the first blade is movable forward and backward in the extending direction of the first blade, and the movable guide provided on the second blade is movable forward and backward in the extending direction of the second blade. With this configuration, the stroke of the movable guide can be made sufficiently large, so that the teaching operation becomes easy.

[0021] Also, in the above-described substrate transfer device, Preferably, the movable guide provided on the connecting portion is movable forward and backward with respect to the space sandwiched between the first blade and the second blade.

[0022] [Function and Effect] According to the above configuration, the movable guide provided on the connecting portion is movable forward and backward with respect to the space sandwiched between the first blade and the second blade. With this configuration, the substrate supported by the first blade and the second blade can be pressed from an appropriate direction, so that the hand can clamp the substrate more reliably.

[0023] Further, in the above-described substrate transfer device, it is preferable that the movable guide is attached to at least one of the upper and lower surfaces of the hand.

[0024] [Function and Effect] According to the above-described configuration, the movable guide is attached to at least one of the upper and lower surfaces of the hand. With such a configuration, even when the space above or below the substrate is small, the substrate can be securely clamped.

[0025] Further, in the above-described substrate transfer device, a tactile sensor is provided that has a detection surface capable of detecting the forces applied to each of the three orthogonal axes, and is capable of detecting that the movable guide has come into contact with the outer peripheral surface of the substrate. It is preferable that the control unit recognizes that the movable guide has come into contact with the outer peripheral surface of the substrate based on the output of the tactile sensor.

[0026] [Function and Effect] According to the above-described configuration, regardless of the posture when the outer peripheral surface of the substrate comes into contact with the movable guide, the reaction force received by the movable guide from the outer peripheral surface of the substrate can be detected. Therefore, according to the above-described configuration, it is possible to accurately detect that the movable guide has come into contact with the outer peripheral surface of the substrate.

[0027] Further, in the above-described substrate transfer device, It is preferable that the tactile sensor is provided between the hand and the movable guide.

[0028] [Function and Effect] According to the above-described configuration, since the tactile sensor is provided between the hand and the movable guide, the tactile sensor can surely detect the contact of the substrate with the movable guide.

[0029] Further, in the above-described substrate transfer device, The reciprocating drive mechanism includes a motor that reciprocatingly drives the movable guide, a drive circuit that applies a drive current for driving the motor, and an encoder that detects the rotational position of the motor. As a detector for detecting that the movable guide has come into contact with the substrate, at least one of a drive current detection unit that detects the contact based on drive current information of the drive circuit and a position information detection unit that detects the contact based on position information output from the encoder is provided. The control unit preferably determines that the movable guide has come into contact with the substrate based on at least one of the drive current information and the position information.

[0030] [Operation and Effect] According to the above configuration, the control unit determines that the movable guide has come into contact with the substrate based on at least one of the drive current information from the drive current detection unit and the position information from the encoder. Therefore, it is not necessary to provide a sensor for detecting that the movable guide and the outer peripheral surface of the substrate are in contact. Therefore, a substrate transfer device with a simple structure and suppressed manufacturing cost can be provided.

[0031] In addition, a substrate processing apparatus including the above-described substrate transfer device includes a plurality of single-wafer processing units that receive substrates in a horizontal posture one by one on a substrate placement unit and perform predetermined processing. The hand transfers the substrate to the substrate placement unit of each of the single-wafer processing units.

[0032] [Operation and Effect] The present invention is suitable for a substrate processing apparatus including a plurality of single-wafer processing units that receive substrates in a horizontal posture one by one on a substrate placement unit and perform predetermined processing.

[0033] In addition, in the above-described substrate processing apparatus, the storage unit stores the set positions corresponding to the substrate placement unit for each of the single-wafer processing units. The control unit operates individually for a plurality of set positions. The calculation unit operates individually for a plurality of set positions. The setting unit preferably operates individually for a plurality of set positions.

[0034] [Function and Effect] According to the above configuration, a plurality of setting positions are set, and the storage unit, the control unit, and the calculation unit operate individually for the plurality of setting positions. With such a configuration, teaching operations for a plurality of standard positions are facilitated.

[0035] This specification also discloses the following inventions. A teaching method for a substrate transfer device including a hand for holding a substrate, a hand drive mechanism for driving the hand to transfer the substrate, at least three movable guides provided on the hand for sandwiching an outer peripheral surface of the substrate and holding the substrate spaced apart from the hand in the vertical direction, and a forward and backward drive mechanism for driving the movable guides to move forward and backward with respect to the substrate, comprising: A hand movement process of approaching the hand to the substrate assuming that the substrate is at a predetermined setting position, A contact process of bringing each of the movable guides into contact with the substrate, A calculation process of calculating a position of a center point of the substrate based on a positional relationship of each of the movable guides when each of the movable guides contacts the substrate, A teaching process of setting the calculated center position of the substrate as a new setting position, A teaching method for a substrate transfer device comprising the above.

[0036] [Function and Effect] The above teaching method includes a hand movement process of approaching the hand to the substrate assuming that the substrate is at a predetermined setting position, a contact process of bringing each of the movable guides into contact with the substrate, a calculation process of calculating a position of a center point of the substrate based on a positional relationship of each of the movable guides when each of the movable guides contacts the substrate, and a teaching process of setting the calculated center position of the substrate as a new setting position. With such a configuration, the teaching work is facilitated.

Effect of the Invention

[0037] According to the present invention, it is possible to provide a substrate transfer device, a substrate processing device, and a teaching method capable of efficiently performing teaching operations.

Brief Description of the Drawings

[0038]

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Best Mode for Carrying Out the Invention

[0039] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

Embodiment

[0040] FIG. 1 is a plan view showing the overall configuration of a substrate processing apparatus according to an embodiment. The substrate processing apparatus of the embodiment includes a substrate transfer device for transferring a substrate. The substrate transfer device is configured to transfer a substrate by performing an operation of receiving a substrate in a horizontal posture at a predetermined set position. Further, the substrate transfer device is configured to transfer a substrate by performing an operation of delivering a substrate in a horizontal posture to a predetermined set position. The substrate transfer device in the present invention is configured to sandwich the substrate and reset the set position to correct the deviation even when the actual position of the substrate is deviated from the set position.

[0041] <1. Overall Configuration> The substrate processing apparatus 1 includes a loading / unloading block 3, an index block 5, and a processing block 7.

[0042] The substrate processing apparatus 1 processes a substrate W. The substrate processing apparatus 1 performs, for example, a cleaning process on the substrate W. The substrate processing apparatus 1 processes the substrate W in a single-wafer type in the processing block 7. The single-wafer type processes each substrate W one by one in a horizontal posture. The substrate W has, for example, a circular shape in plan view.

[0043] In this specification, for convenience, the direction in which the loading / unloading block 3, the index block 5, and the processing block 7 are arranged is referred to as the "front-rear direction X". The front-rear direction X is horizontal. Among the front-rear direction X, the direction from the processing block 7 toward the loading / unloading block 3 is referred to as "front". The direction opposite to the front is referred to as "rear". The horizontal direction orthogonal to the front-rear direction X is referred to as the "width direction Y". One direction of the "width direction Y" is appropriately referred to as "right". The direction opposite to the right is referred to as "left". The direction perpendicular to the horizontal direction is referred to as the "vertical direction Z". In each figure, front, rear, right, left, up, and down are appropriately shown for reference.

[0044] <2. Loading / Unloading Block> The loading / unloading block 3 includes a loading section 9 and an unloading section 11. The loading section 9 and the unloading section 11 are arranged in the width direction Y. A plurality of substrates W (for example, 25 substrates) are stacked and stored horizontally at regular intervals within a single carrier C. The carrier C storing the unprocessed substrates W is placed on the loading section 9. The loading section 9 includes, for example, two mounting tables 13 on which the carrier C is placed. The carrier C has a plurality of grooves (not shown) formed therein for accommodating the substrates W one by one with the surfaces of the substrates W spaced apart from each other. The carrier C accommodates the substrates W, for example, with the surface of the substrate W facing upward. Examples of the carrier C include a FOUP (Front Opening Unify Pod). The FOUP is a sealed container. The carrier C may be an open container, regardless of the type.

[0045] The unloading section 11 is arranged on the opposite side of the loading section 9 across the central portion in the width direction Y in the substrate processing apparatus 1. The unloading section 11 is arranged to the left Y of the loading section 9. The unloading section 11 stores the processed substrates W in the carrier C and unloads the entire carrier C. The unloading section 11 that functions in this way includes, like the loading section 9, for example, two mounting tables 13 for placing the carrier C. The loading section 9 and the unloading section 11 are also called load ports.

[0046] <3. Indexer Block> The indexer block 5 is arranged adjacent to the rear X of the loading / unloading block 3 in the substrate processing apparatus 1. The indexer block 5 includes an indexer robot IR and a delivery section 15.

[0047] The indexer robot IR is configured to be rotatable around the vertical direction Z. The indexer robot IR is configured to be movable in the width direction Y. The indexer robot IR includes a first hand 19 and a second hand 21. In FIG. 1, only one hand is shown for the sake of illustration. The first hand 19 and the second hand 21 hold the substrate W in a horizontal posture. The first hand 19 and the second hand 21 sandwich the outer peripheral surface of the substrate W and hold the substrate W while separating it from the upper surfaces of the first hand 19 and the second hand 21. The first hand 19 and the second hand 21 are configured to be able to acquire and sandwich the substrate W.

[0048] The indexer robot IR includes a hand drive mechanism 57. The hand drive mechanism 57 drives the first hand 19 in the front-rear direction X. The hand drive mechanism 57 drives the first hand 19 to advance and retreat in the horizontal direction. The hand drive mechanism 57 drives the first hand 19 to advance and retreat with respect to the delivery destination. Specifically, the delivery destination in the indexer robot IR drives the first hand 19 to advance and retreat with respect to the carrier C and the path portion 25. Note that the hand drive mechanism 57 in the center robot CR drives the first hand 33 and the second hand 35 to advance and retreat not only in the front-rear direction X but also in the width direction Y. The hand drive mechanism 57 is configured to drive the first hand 19 to advance and retreat in the horizontal plane in order to deliver the substrate W. Further, the hand drive mechanism 19 can also move the first hand 33 and the second hand 35 up and down in the vertical direction.

[0049] The first hand 19 and the second hand 21 each hold one substrate W. The first hand 19 and the second hand 21 are independently configured to be able to advance and retreat in the front-rear direction X. The indexer robot IR moves in the width direction Y and rotates around the vertical direction Z, and advances and retreats the first hand 19 and the second hand 21 to deliver the substrate W to and from each carrier C. Similarly, the indexer robot IR delivers the substrate W to and from the path portion 25.

[0050] The path portion 25 is disposed at the boundary with the processing block 7 among the index blocks 5. The path portion 25 is disposed, for example, at the central portion in the width direction Y. The path portion 25 is used to transfer the substrate W between the index block 5 and the processing block 7. The path portion 25 is used, for example, to convey the substrate W from the processing block 7 to the index block 5.

[0051] <4. Processing Block> The processing block 7 performs various processes on the substrate W, for example. Examples of the process include a cleaning process. The cleaning process is, for example, a process liquid cleaning process performed by supplying only the cleaning liquid, or a brush cleaning process using a brush in addition to the process liquid.

[0052] As shown in FIG. 1, the processing block 7 is divided into, for example, a first row R1, a second row R2, and a third row R3 in the width direction Y. Specifically, the first row R1 is disposed on the left side Y. The second row R2 is disposed at the central portion in the width direction Y. In other words, the second row R2 is disposed on the right side Y of the first row R1. The third row R3 is disposed on the right side Y of the second row R2.

[0053] In the first row R1, the single-wafer processing chambers 31 are arranged. Specifically, in the first row R1, a stacked body SSR is provided in which four single-wafer processing chambers 31 are stacked in the vertical direction. The single-wafer processing chamber 31 has a substrate placement portion for placing a substrate in a horizontal posture. Specifically, the substrate placement portion is constituted by, for example, a vacuum chuck 300 that vacuum-adsorbs the lower surface of the substrate. As shown in FIG. 2, the single-wafer processing chamber 31 receives the substrate W in a horizontal posture by the vacuum chuck 300 and performs a predetermined process. Examples of the predetermined process include a substrate cleaning process. The single-wafer processing chamber 31 corresponds to the single-wafer processing portion of the present invention. The single-wafer processing chamber 31 receives the substrates W in a horizontal posture stored in the carrier C one by one by the vacuum chuck 300 and executes a predetermined process.

[0054] The second column R2 of processing block 7 is provided with a center robot CR. The center robot CR is configured to be rotatable around the vertical direction Z. The center robot CR is configured to be movable up and down in the vertical direction Z. The center robot CR includes, for example, a first hand 33 and a second hand 35. The first hand 33 and the second hand 35 each hold one substrate W. The first hand 33 and the second hand 35 are independently configured to be movable back and forth in the front-rear direction X and the width direction Y.

[0055] The first hand 33 and the second hand 35 hold the substrate W in a horizontal posture. The first hand 33 and the second hand 35 sandwich the outer peripheral surface of the substrate W and hold the substrate W separated from the upper surfaces of the first hand 33 and the second hand 35.

[0056] The third column R3 is provided with a stack in which four single-wafer processing chambers 31 are stacked in the same manner as the first column R1. The center robot CR in the second column R2 can access the single-wafer processing chambers 31 mounted on the first column R1 and the third column R3.

[0057] <5. Details of the Hand> Here, with reference to FIGS. 3 to 7, the first hand 19 in the indexer robot IR will be described as an example. Note that the configuration of the first hand 19 is the same as that of the second hand 21, and the first hand 33 and the second hand 35 in the center robot CR.

[0058] As shown in FIG. 3, the first hand 19 includes a connecting portion 59, a first blade 61, and a second blade 62. The connecting portion 59 is located at the base end of the first hand 19. The first blade 61 and the second blade 62 are located at the tip end of the first hand 19. The first hand 19 enters the transfer destination from the tip end side and exits from the base end side of the first hand 19. The connecting portion 59 includes an attachment base end 63 and a blade attachment portion 65. The attachment base end 63 is attached to the hand drive mechanism 57. The first blade 61 and the second blade 62 are attached to the blade attachment portion 65. The blade attachment portion 65 is provided at two locations spaced apart in the width direction Y. When the first hand 19 advances to the position where the substrate W is transferred, the portions of the blade attachment portions 65 to which the first blade 61 and the second blade 62 are attached are located outside the outer circumferential surface of the substrate W in a plan view. In other words, the length of the first blade 61 and the second blade 62 in the front-rear direction X is longer than the diameter of the substrate W.

[0059] The first hand 19 includes a first blade 61 and a second blade 62. The first blade 61 and the second blade 62 extend in the front-rear direction X. The first blade 61 and the second blade 62 are spaced apart from each other in the width direction Y. The distance by which the first blade 61 and the second blade 62 are spaced apart from each other does not exceed the diameter of the substrate W. In other words, the width direction Y of the first blade 61 and the second blade 62 falls within the diameter of the substrate W. The base ends of the first blade 61 and the second blade 62 are attached to the blade attachment portion 65. The tip ends of the first blade 61 and the second blade 62, which are opposite to the base ends, are in an open state. The first hand 19 is U-shaped in plan view by the connecting portion 59 and the first blade 61 and the second blade 62.

[0060] Thus, the first hand 19 includes the first blade 61, the second blade 62, and the connecting portion 59 that connects the first blade 61 and the second blade 62 together.

[0061] The first hand 19 is provided with three movable guides 67. The three movable guides 67 are attached to the upper surface of the first hand 19. The first blade 61 and the second blade 62 are provided with one movable guide 67 on the tip side. A structure in which the movable guide 67 is attached to the upper surfaces of the first blade 61 and the second blade 62 like this first hand 19 is called a "down-taking hand". The first hand 19 having the structure of the down-taking hand holds the substrate W by scooping it up from below to above.

[0062] Thus, three movable guides 67 are provided on each of the first blade 61, the second blade 62, and the connecting portion 59. At least three movable guides 67 are provided on the first hand 19, and the outer peripheral surface of the substrate W is sandwiched to hold the substrate W spaced apart from the first hand 19 in the vertical direction. Therefore, the substrate W sandwiched by the movable guides 67 is configured to contact only the movable guides 67, and a gap is located between the first hand 19 and the substrate W. Hereinafter, the configuration of the first hand 19 provided with the movable guides 67 will be described.

[0063] Note that FIG. 4 is a side view of the first hand 19 of the present embodiment.

[0064] As shown in FIG. 5, the movable guides 67 of the first blade 61 and the second blade 62 are attached to the guide holes 69. The guide holes 69 are long in the front-rear direction X. A moving piece 71 is disposed at the bottom of the guide hole 69. The moving piece 71 is movable only in the front-rear direction X at the bottom of the guide hole 69. A tactile sensor 73 is attached to the moving piece 71. The tactile sensor 73 is attached to the upper surface of the moving piece 71.

[0065] The tactile sensor 73 has a detection surface 75 capable of detecting forces applied to each of three mutually orthogonal axes. Thereby, the tactile sensor 73 can detect that the movable guide 67 has come into contact with the outer peripheral surface of the substrate W. The control unit 100 recognizes that the movable guide 67 has come into contact with the outer peripheral surface of the substrate based on the output of the tactile sensor 73.

[0066] The tactile sensor 73 is attached to the moving piece 71 in a posture where the detection surface 75 faces upward. A movable guide 67 is attached to the detection surface 75. Therefore, the tactile sensor 73 is provided between the moving piece 71, which is a component of the hand body, and the movable guide 67. The bottom of the movable guide 67 is attached to the detection surface 75. The tactile sensor 73 can detect the force applied to the movable guide 67 in three axial directions respectively. The tactile sensor 73 detects the forces applied in the front-rear direction X, the width direction Y, and the vertical direction Z. The tactile sensor 73 outputs an electrical signal corresponding to each force detected in the three axial directions.

[0067] In the first blade 61 and the second blade 62, a lateral hole 77 is formed in the front-rear direction X from the guide hole 69. The lateral hole 77 penetrates through to the connecting portion 59. A servo motor 79 is provided at a location in the connecting portion 59 corresponding to the end of the lateral hole 77. The servo motor 79 is provided with an encoder 81. The encoder 81 detects the rotational position (rotation angle) of the rotating shaft of the servo motor 79 and outputs it as position information in an electrical signal. A ball screw 83 is inserted into the lateral hole 77. One end side of the ball screw 83 is connected to the rotating shaft of the servo motor 79. The moving piece 71 is screwed to the other end side of the ball screw 83. When the servo motor 79 is rotationally driven, the ball screw 83 is rotated, and the moving piece 71 moves in the front-rear direction X along the guide hole 69. As a result, the movable guide 67 moves in the front-rear direction X. The servo motor 79 corresponds to the forward and backward driving mechanism of the present invention. The servo motor 79 is configured to be able to drive the movable guide 67 to move forward and backward in the direction approaching and separating from the substrate W at the set position.

[0068] As shown in FIG. 6, the connecting portion 59 is provided with a pusher 87. The pusher 87 is provided with one movable guide 67. The pusher 87 has the same configuration as that for driving the movable guide 67 of the first blade 61 and the second blade 62, excluding the pusher arm 89 and the guide hole 91.

[0069] That is, the pusher 87 includes a tactile sensor 73, a lateral hole 77, a ball screw 83, a servo motor 79, an encoder 81, and a pusher arm 89. One end side of the lateral hole 77 penetrates the side surface on the first blade 61 side. A guide hole 91 is formed on the first blade 61 side of the lateral hole 77. The guide hole 91 has a larger dimension in the vertical direction Z than the lateral hole 77. A part of the pusher arm 89 is inserted into the guide hole 91 so as to be movable in the front-rear direction X. The other end side of the lateral hole 77 is blocked inside the connecting portion 59. A servo motor 79 is disposed on the other end side of the lateral hole 77. The servo motor 79 includes an encoder 81. One end side of the ball screw 83 is connected to the rotating shaft of the servo motor 79. The pusher arm 89 is screwed to the other end side of the ball screw 83. The pusher arm 89 includes the tactile sensor 73 on the side opposite to the servo motor 79 in the front-rear direction X. A movable guide 67 is attached to the detection surface 75 of the tactile sensor 73.

[0070] Each of the above-described movable guides 67 is configured to be movable by a predetermined distance in the front-rear direction X. Each of the above-described movable guides 67 is movable, for example, by a distance of about 5 mm in the front-rear direction X. The movable range of this movable guide 67 is related to the initial set position P1 described later. This point will be described later.

[0071] The movable guide 67 provided on the first blade 61 is retractable in the extending direction of the first blade 61. Similarly, the movable guide 67 provided on the second blade 62 is retractable in the extending direction of the second blade 62. The movable guide 67 provided on the connecting portion 59 is retractable with respect to the space sandwiched between the first blade 61 and the second blade 62.

[0072] The clamping control unit 97 independently operates the movement of each of the three movable guides 67. The clamping control unit 97 is operated by the control unit 100. The clamping control unit 97 operates each servo motor 79 based on an instruction from the control unit 100 to independently move the three movable guides 67. At that time, the clamping control unit 97 operates the servo motor 79 according to the position information from the encoder 81. The clamping control unit 97 operates the drive current to the servo motor 79. The clamping control unit 97 can detect the drive current supplied to the servo motor 79.

[0073] The clamping control unit 97 individually controls the movable guide 67 by the servo motor 79, and when the movable guide 67 abuts on the outer peripheral surface of the substrate W, stops the abutting movable guide 67.

[0074] The first hand 19 has three movable guides 67 on its upper surface. The first hand 19 holds the substrate W in a state where the lower surface of the substrate W is spaced upward from the upper surfaces of the first blade 61 and the second blade 62. Specifically, the outer peripheral surface of the substrate W is clamped by the three movable guides 67, and the lower surface of the substrate W is held in a state of being floated from the upper surfaces of the first blade 61 and the second blade 62. The first hand 19 holds the substrate W in a state of abutting only on the outer peripheral surface of the substrate W. The first hand 19 moves the three movable guides 67 toward the outer peripheral surface of the substrate W, thereby clamping the outer peripheral surface of the substrate W with the three movable guides 67 and holding the substrate W in a state of being spaced from the upper surfaces of the first blade 61 and the second blade 62.

[0075] The first hand 19 has three movable guides 67 on its upper surface, but may be configured as shown in FIG. 7. FIG. 7 is a side view of the pick-up hand according to the embodiment.

[0076] <6. Update Operation of Set Position> The first hand 19 is configured to convey the substrate W between the carrier C and the path portion 25. The path portion 25 is always in the same position. Therefore, the first hand 19 only needs to convey the substrate W acquired from the carrier C to a predetermined position where the path portion 25 is located. The predetermined position needs to be precisely determined. Thus, the substrate processing apparatus 1 of the present embodiment includes means for storing the predetermined position.

[0077] In addition, the substrate processing apparatus 1 of the present embodiment includes means for finely adjusting the predetermined position. Although the position of the path portion 25 is uniquely determined in the design of the substrate processing apparatus 1, due to a positional deviation that occurs during the assembly of the apparatus, the actual position of the path portion 25 is slightly deviated from the designed position. The substrate processing apparatus 1 of the present embodiment has a function to eliminate this positional deviation. That is the update operation of the set position.

[0078] FIG. 8 illustrates a configuration related to the update operation of the set value. The storage unit 101 stores the initial set position P1. The control unit 100 controls the hand drive mechanism 57 with reference to the set position stored in advance in the storage unit 101, and approaches the acquisition hand 11a to the substrate W at the set position. Further, the control unit 100 is configured to control the servo motor 79 to bring each movable guide 67 into contact with the substrate W. The calculation unit 22 is configured to calculate the position of the center point of the substrate W based on the positional relationship of each movable guide 67 when each movable guide 67 comes into contact with the substrate W. The specific configuration of the calculation unit 22 will be described later. The setting unit 23 stores the calculated position of the center point in the storage unit 101 as a new set value. The specific configuration of the setting unit 23 will be described later. In addition, the control unit 100 is also configured to control the movement of the first hand 19 with reference to the new set position P2 stored in the storage unit 101 when the substrate W is delivered next.

[0079] The calculation unit 22 receives the detection results of the tactile sensors 73 attached to each movable guide 67 so as to recognize the positional relationship of the movable guides 67. Based on the detection results of the three tactile sensors 73, the calculation unit 22 can recognize at which position the movable guide 67 contacts the substrate W. Then, the calculation unit 22 can calculate the center point of the substrate W based on the position of the movable guide 67.

[0080] As an example, the operation of updating the set value for the path unit 25 will be described. The update operation is performed by tentatively clamping the substrate W placed in advance on the path unit 25 with the first hand 19.

[0081] FIG. 9 illustrates the first hand 19 before clamping the substrate W placed on the path unit 25. The control unit 100 controls the servo motor 79 to move the movable guide 67 to the initial position. The initial position of the movable guide 67 located on the first blade 61 is the tip of the first blade 61. Therefore, in the initial state, the movable guide 67 is located at the end on the tip side of the first blade 61 within the movable range. The initial position of the movable guide 67 located on the second blade 62 is the tip of the second blade 62. Therefore, in the initial state, the movable guide 67 is located at the end on the tip side of the second blade 62 within the movable range.

[0082] The initial position of the movable guide 67 located at the connecting portion 59 is the position closest to the connecting portion 59. Therefore, in the initial position, the movable guide 67 is at the position closest to the connecting portion 59 within the movable range.

[0083] By separating the movable guides 67 from each other as much as possible in this way, the internal space defined by the three movable guides 67 becomes the widest. By doing so, no matter how the substrate W in the path unit 25 is displaced with respect to the first hand 19, the first hand 19 can surely clamp the substrate W using the three movable guides 67.

[0084] FIG. 10 shows a state in which the first hand 19 is moved to the pass portion 25 to hold the substrate W placed on the pass portion 25 with the first hand 19. At this time, the three movable guides 67 have not yet moved from the state shown in FIG. 9. The control unit 100 moves the first hand 19 to the pass portion 25 on the assumption that the center of the substrate W placed on the pass portion 25 is at the initial set position P1 determined by the structure of the first hand 19. Even in this case, the center point of the substrate W placed on the pass portion 25 does not coincide with the initial set position P1. This is because an unexpected misalignment occurs when the pass portion 25 is assembled to the substrate processing apparatus 1.

[0085] In FIG. 10, the misalignment between the initial set position P1 and the center point of the substrate W is represented by the center line E that crosses the diameter of the substrate W. If the initial set position P1 and the center point of the substrate W were to coincide, the initial set position P1 should be located on the center line. However, since the center point of the substrate W is shifted from the initial set position P1, the initial set position P1 is not on the center line.

[0086] FIG. 11 shows a state when an operation of approaching the movable guides 67 to each other is performed to hold the substrate W placed on the pass portion 25 with the first hand 19. When each of the movable guides 67 is moved, first, the movable guide 67 of the second blade 62 comes into contact with the outer peripheral surface of the substrate W, and the tactile sensor 73 detects this contact. The detection result is sent to the control unit 100 via the calculation unit 22. The control unit 100 controls the servo motor 79 at this point to stop the movable guide 67 that has come into contact with the substrate W. By operating in this manner, the control unit 100 ensures that the substrate W placed on the pass portion 25 does not receive unnecessary pressing from the movable guide 67 of the second blade 62. Therefore, the substrate W does not shift due to being pushed by the movable guide 67 in the pass portion 25.

[0087] FIG. 12 shows a state when the movable guides 67 are further brought closer to sandwich the substrate W placed on the path portion 25 with the first hand 19. When each of the movable guides 67 is moved, the movable guide 67 of the connecting portion 59 comes into contact with the outer peripheral surface of the substrate W, and the tactile sensor 73 detects this contact. The detection result is sent to the control unit 100 via the calculation unit 22. The control unit 100 controls the servo motor 79 at this point to stop the movable guide 67 that has contacted the substrate W.

[0088] FIG. 13 shows a state when the movable guides 67 are further brought closer to sandwich the substrate W placed on the path portion 25 with the first hand 19. When the movable guide 67 of the first blade 61 is moved, the movable guide 67 of the first blade 61 comes into contact with the outer peripheral surface of the substrate W, and the tactile sensor 73 detects this contact. The detection result is sent to the control unit 100 via the calculation unit 22. The control unit 100 controls the servo motor 79 at this point to stop the movable guide 67 that has contacted the substrate W.

[0089] The operation after the movable guide 67 stops will be described. An origin position is set in the encoder 81, and the amount of movement of the movable guide 67 from the origin position can be measured. Since the origin position is set based on the base member 31, it moves as the acquisition hand 11a moves. That is, the origin position of the encoder 81 is a relative position set based on the movable base member 31. The absolute position of the origin position can be obtained by various position sensors attached to the indexer robot IR. The substrate processing apparatus 1 is provided with an origin as an absolute position, and the position of the indexer robot IR with respect to the origin is known. Therefore, the absolute position of the movable guide 67 can be known based on the origin position of the encoder 81, the amount of movement measured by the encoder 81, and the output of the indexer robot IR main body indicating the positional relationship between the origin position and the origin.

[0090] As shown in FIG. 13, when considering a triangle connecting the three movable guides 67, there is only one determined circle when any of the vertices of this triangle is the outer peripheral surface of the substrate W. Therefore, the absolute position of the center point of the substrate W can be calculated based on this triangle. The calculation unit 22 determines the positions of the three movable guides 67 from the output of the encoder 81 attached to the servo motor 79, and calculates the absolute position of the center point of the substrate W. Note that the calculation unit 22 can also refer to the substrate diameter when calculating the center point of the substrate W. Thus, the set position of the present invention is the absolute position starting from the origin defined in the substrate processing apparatus 1.

[0091] The data indicating the position of the center point calculated by the calculation unit 22 is sent to the setting unit 23. The setting unit 23 stores the position of this center point in the storage unit 101 as a new set position P2.

[0092] FIG. 14 illustrates a case where the substrate W placed on the pass portion 25 is to be clamped using the first hand 19 based on the new set position P2. As can be seen by comparing FIG. 14 and FIG. 9, in the case of FIG. 15, it is not necessary to separate the movable guides 67 from each other as much as possible. This is because the center point of the substrate W placed on the pass portion 25 has been found to be at the new set position P2. Also in the case of FIG. 14, although it is necessary to separate the movable guides 67 from each other more than when clamping the substrate W, the separation distance can be smaller than that in the case of FIG. 9.

[0093] FIG. 15 shows the state when the first hand 19 is moved to the pass portion 25 to clamp the substrate W placed on the pass portion 25 with the first hand 19. At this time, the three movable guides 67 have not yet moved from the state of FIG. 14. The control unit 100 moves the first hand 19 to the pass portion 25 assuming that the center of the substrate W placed on the pass portion 25 is at the newly measured set position P2. By doing so, the center point of the substrate W placed on the pass portion 25 coincides with the new set position P2.

[0094] FIG. 16 shows a state when the movable guides 67 are moved closer to each other to hold the substrate W placed on the path portion 25 with the first hand 19. When each of the movable guides 67 is moved, each of the movable guides 67 comes into contact with the outer peripheral surface of the substrate W simultaneously. In this way, the substrate W is securely held by the first hand 19.

[0095] <7. Range of movement of the movable guide> Each movable guide 67 can move forward and backward individually, but the range of its movement is set based on the initial set position P1, so this point will be explained. That is, as shown in FIG. 17, each movable guide 67 is configured to be located in the middle of the range of movement when the substrate W exists at the initial set position P1. That is, each movable guide 67 can move 5 mm in the tip direction of the first blade 61 and the second blade 62 from the position when the substrate W at the initial set position P1 is held. With such a configuration, when holding the substrate W in the path portion 25, even if the substrate W is displaced in the tip direction of the first blade 61 and the second blade 62 with respect to the initial set position P1, the first hand 19 can securely hold the substrate W.

[0096] And each movable guide 67 can move 5 mm in the direction toward the connecting portion 59 from the position when the substrate W at the initial set position P1 is held. With such a configuration, when holding the substrate W in the path portion 25, even if the substrate W is displaced in the direction toward the connecting portion 59 with respect to the initial set position P1, the first hand 19 can securely hold the substrate W.

[0097] That is, the servo motor 79 is configured to be able to drive the movable guide 67 at the position where the substrate W at the initial set position P1 is held to move forward and backward in the direction of approaching and separating from the substrate W.

[0098] <8. Other configurations> As shown in FIG. 1, the index block 5 includes a control unit 100 related to the control of the index robot IR. The control unit 100 is composed of, for example, a CPU (Central Processing Unit). The specific configuration of the control unit 100 is not limited. For example, the control related to the first hand 19 and the control related to the second hand 35 may be configured by a single processor, or may be configured by individual processors.

[0099] Examples of the control related to the control unit 100 include the forward and backward movements of the first hand 19, the forward and backward movements of the second hand 35, the rotational movement of the first hand 19, the rotational movement of the second hand 21, the lifting movement of the first hand 19, the lifting movement of the second hand 35, and the control related to the control unit 100.

[0100] The storage unit 101 stores programs related to control and parameters such as the initial set position P1 and the new set position P2. The storage unit may be composed of a single device, or may be composed of individual devices corresponding to each control. The index block 5 of the present invention has no particular limitation on the configuration of the device that realizes the storage unit.

[0101] <9. Flow of Instructions> Hereinafter, a method of teaching the position of the substrate W in the path portion 25 to the first hand 19 will be described with reference to the flowchart shown in FIG. 18. The teaching method of this embodiment includes a first hand 19 that holds the substrate W, a hand drive mechanism 57 that drives the first hand 19 to move forward and backward in a horizontal plane to a storage for delivering the substrate W, and is provided on the first hand 19. Three movable guides 67 that sandwich the outer peripheral surface of the substrate W and hold the substrate W spaced apart from the first hand 19 in the vertical direction, and a servo motor 79 that moves the movable guide 67 forward and backward with respect to the substrate W. This corresponds to the teaching method of the index block 5.

[0102] Step S1: Assume that the substrate W is at the initial set position P1, which is the assumed position in the design, and bring the first hand 19 close to the substrate W.

[0103] Step S2: Each movable guide 67 is operated to bring the movable guide 67 into contact with the substrate.

[0104] Step S3: The calculation unit 22 calculates the position of the center point of the substrate W based on the positional relationship of the movable guide 67.

[0105] Step S4: The calculation unit 22 sets the calculated center position as the teaching position and stores it in the storage unit 101.

[0106] In this way, the teaching in this embodiment is executed.

[0107] <10. Effects of the present invention> According to the above configuration, three movable guides 67 that sandwich the outer peripheral surface of the substrate W are provided on the first hand 19 of the index block 5. After the first hand 19 approaches the substrate W assuming that the substrate W is at a predetermined set position, the movable guide 67 is brought into contact with the substrate W, so that the position where the substrate W exists can be recognized. Then, if the center point of the substrate W is calculated based on the positional relationship of the movable guide 67, in the next clamping operation of the substrate W by the first hand 19, the substrate W can operate assuming that it is at the calculated center point. Therefore, according to this embodiment, the teaching work is completed only by the first hand 19 clamping the substrate W, so that the teaching work can be efficiently performed.

[0108] According to the above configuration, the servo motor 79 is configured to be able to drive forward and backward in the direction of approaching and separating from the substrate W for the movable guide 67 that is at the position of clamping the substrate W at the initial set position P1. With such a configuration, the teaching work becomes easy.

[0109] According to the above configuration, the control unit 100 individually controls the movable guides 67 by the servo motor 79, and when the movable guide 67 contacts the outer peripheral surface of the substrate W, the contacting movable guide 67 is stopped. With such a configuration, when the first hand 19 clamps the substrate W, an external force is not applied to the substrate W and the substrate W does not shift or move. Therefore, according to the above configuration, the teaching operation becomes easy.

[0110] According to the above configuration, the first hand 19 includes a first blade 61, a second blade 62, and a connecting portion 59, and the three movable guides 67 are provided on each of the first blade 61, the second blade 62, and the connecting portion 59. With such a configuration, the substrate W can be clamped at three points with different positions, so that the teaching operation can be easily performed after accurately knowing the position of the substrate W.

[0111] According to the above configuration, the movable guide 67 provided on the first blade 61 can move forward and backward in the extending direction of the first blade 61. Also, the movable guide 67 provided on the second blade 62 can move forward and backward in the extending direction of the second blade 62. With such a configuration, the stroke of the movable guide 67 can be made sufficiently large, so that the teaching operation becomes easy.

[0112] According to the above configuration, the movable guide 67 provided on the connecting portion 59 can move forward and backward with respect to the space sandwiched between the first blade 61 and the second blade 62. With such a configuration, the substrate W supported by the first blade 61 and the second blade 62 can be pressed from an appropriate direction, so that the first hand 19 can more reliably clamp the substrate W.

[0113] According to the above configuration, regardless of the posture when the outer peripheral surface of the substrate W contacts the movable guide 67, the reaction force received by the movable guide 67 from the outer peripheral surface of the substrate W can be detected. Therefore, according to the above configuration, it can be accurately detected that the movable guide 67 has contacted the outer peripheral surface of the substrate W.

[0114] According to the above configuration, since the tactile sensor 73 is provided between the first hand 19 and the movable guide 67, the tactile sensor 73 can surely detect the contact of the substrate W with the movable guide 67.

[0115] This embodiment is suitable for a substrate processing apparatus including a single wafer processing chamber 31 that receives the substrates W in a horizontal posture one by one and performs predetermined processing.

[0116] The above teaching method includes a first hand 19 moving process of approaching the substrate W with the first hand 19 assuming that the substrate W is at a predetermined set position, a contacting process of bringing each movable guide 67 into contact with the substrate W, a calculating process of calculating the position of the center point of the substrate W based on the positional relationship of each movable guide 67 when each movable guide 67 contacts the substrate W, and a teaching process of setting the calculated center position of the substrate W as a new set position. With this configuration, the teaching operation becomes easy.

[0117] <11. Modification Example> The present invention is not limited to the above-described embodiment and can be modified as follows.

[0118] <Modification Example 1> In the above-described embodiment, the teaching is performed in the XY directions, but the present invention is not limited to this configuration. After step S4, release the substrate W from the first hand 19, move the first hand 19 in the vertical direction to separate it from the substrate W, and then bring the movable guide 67 into contact with the substrate W from the vertical direction, thereby grasping the position of the substrate W in the vertical direction, and based on this, the teaching in the vertical direction may be performed.

[0119] When bringing the movable guide 67 into contact with the substrate W, it is desirable that the movable guide 67 be displaced to the position closest to each other in the first hand 19. With such a configuration, the movable guide 67 can be surely brought into contact with the substrate W. Further, when bringing the movable guide 67 into contact with the substrate W, it is desirable to operate the first hand 19 on the assumption that the substrate W is located at the set position P2. With such a configuration, the movable guide 67 can be surely brought into contact with the substrate W. The contact of the substrate W is detected by the tactile sensor 73.

[0120] As shown in FIG. 19, in the above-described configuration, the hand drive mechanism 57 includes a vertical drive mechanism 56 that drives the first hand 19 in the vertical direction. Then, the calculation unit 22 actually measures the position of the substrate W in the vertical direction by bringing the movable guide 67 into contact with the substrate W from the vertical direction. With such a configuration, the teaching operation becomes easy.

[0121] <Modification Example 2> In addition to the configuration of the embodiment, a configuration may be adopted in which the redefinition of the set position is repeated. That is, according to this modification example, the control unit 100 controls the hand drive mechanism 57 and the servo motor 79 to bring the movable guide 67 into contact with the substrate W until the difference between the calculated position of the center point of the substrate W and the set position P2, which is the previously calculated position of the center point of the substrate W already stored in the storage unit 101, becomes equal to or less than a predetermined value. Then, the calculation unit 22 calculates the position of the center point of the substrate W each time the movable guide 67 comes into contact with the substrate W, and the setting unit 23 stores the calculated position of the center point of the substrate W as a new set position in the storage unit 101 each time the movable guide 67 comes into contact with the substrate W. In this way, the redefinition of the set position can be executed more accurately. Such a configuration is effective when the shape of the movable guide 67 is not cylindrical, as shown in FIG. 20.

[0122] <Modification Example 3> In the above-described embodiment, the first hand 19 is a so-called under-taking hand having the movable guide 67 on the upper surface of the hand. However, the first hand 19 can also be configured as an over-taking hand by attaching the movable guide 67 to the lower surface of the hand.

[0123] According to the above configuration, the movable guide 67 is attached to the lower surface of the first hand 19. With such a configuration, even when the space below the substrate W is small, the substrate W can be reliably clamped.

[0124] Thus, the present invention assumes a configuration in which the movable guide 67 is attached to at least one of the upper and lower surfaces of the first hand 19.

[0125] <Modification 4> The present invention can also be implemented in the first hand 19 that does not have the tactile sensor 73. Hereinafter, the configuration of this modification will be specifically described. The gripping operation of the substrate W by the first hand 19 is performed via the clamping control unit 97.

[0126] The clamping control unit 97 is connected to the servo motor 79 and the encoder 81. The clamping control unit 97 operates the servo motor 79 based on an instruction from the control unit 100 to move the three movable guides 67. At that time, the clamping control unit 97 operates the servo motor 79 according to the position information from the encoder 81. The clamping control unit 97 can detect the drive current supplied to the servo motor 79 as drive current information. The clamping control unit 97 determines that the movable guide 67 has come into contact with the outer peripheral surface of the substrate W based on either one or both of the position information and the drive current information. The clamping control unit 97 corresponds to the drive circuit and the drive current detection unit of the present invention. Therefore, it can also be said that the clamping control unit 97 and the encoder 81 are detectors for detecting that the movable guide 67 has come into contact with the substrate W.

[0127] That is, when the movable guide 67 abuts against the outer peripheral surface of the substrate W, the movement of the movable guide 67 is temporarily hindered. Therefore, the displacement of the position information from the encoder 81 temporarily stops. Further, even when the movable guide 67 abuts against the outer peripheral edge of the substrate, in order to further move the movable guide 67 toward the outer peripheral surface of the substrate W, it is necessary to increase the torque of the servo motor 79. Therefore, the drive current to the servo motor 79 increases and the drive current information is displaced. Accordingly, by monitoring either one or both of the position information and the drive current information, it is possible to accurately determine that the movable guide 67 has abutted against the outer peripheral surface of the substrate W. After the movable guide 67 abuts against the outer peripheral surface of the substrate W, the clamping control unit 97 adjusts the biasing force of the movable guide 67 against the outer peripheral surface of the substrate W according to the shape information from the storage unit 101 to grip the substrate W.

[0128] According to the above configuration, the control unit 100 determines that the movable guide 67 has abutted against the outer peripheral surface of the substrate W based on at least one of the drive current information from the clamping control unit 97 and the position information from the encoder 81. Therefore, it is not necessary to provide a sensor for detecting that the movable guide 67 and the outer peripheral surface of the substrate W are in contact. Therefore, the index block 5 with a simple structure and a suppressed manufacturing cost can be provided.

[0129] <Modification 5> The present invention can also be applied to a center robot CR that transports the substrate W to each vacuum chuck 300 of a plurality of single-wafer processing chambers 31. The storage unit 101 of this modification stores, for each single-wafer processing chamber 31, an initial set position P1 corresponding to each of the vacuum chucks 300 included in the plurality of single-wafer processing chambers 31. The control unit 100, the calculation unit 22, and the setting unit 23 operate individually for a plurality of initial set positions P1.

[0130] According to the above configuration, a plurality of initial set positions P1 are set, and the storage unit 101, the control unit 100, and the calculation unit 22 operate individually for the plurality of initial set positions P1. With this configuration, the teaching operation for the plurality of initial set positions P1 becomes easy.

[0131] <Modification Example 6> In this embodiment, three movable guides 67 were provided, but the present invention is not limited to this configuration. The number of movable guides can also be three or more.

[0132] <Modification Example 7> The first hand 19 having the movable guide 67 in the present invention is at least necessary for teaching work, and when actually transporting the substrate W, it is also possible to replace the first hand 19 in the indexer robot IR with a general-purpose hand provided with a pusher 87 and a fixed guide 88 as shown in FIG. 21.

[0133] <Modification Example 8> The present invention is not limited to the indexer block 5, and can be generally applied to a substrate transfer device including a robot for transferring a substrate W in a horizontal posture.

Explanation of Reference Numerals

[0134] 1 Substrate processing apparatus 3 Loading / Unloading block 5 Indexer block 7 Processing block 9 Loading section 11 Unloading section 13 Mounting table 19 First hand 21 Second hand 22 Calculation unit 23 Setting unit 25 Path section 31 Single-wafer processing chamber 33 First hand 35 Second hand 56 Vertical drive mechanism 57 Hand drive mechanism 59 Connecting section 61 First blade 62 Second blade 65 Blade mounting section 63 Mounting base end portion 67 Movable guide 69 Guide hole 71 Moving piece 73 Tactile sensor 75 Detection surface 77 Horizontal hole 79 Servo motor 81 Encoder 87 Pusher 83 Ball screw 88 Fixed guide 89 Pusher arm 91 Guide hole 97 Clamping control unit 100 Control unit 101 Memory unit C Carrier CR Center robot IR Indexer robot P1 Set position P2 Set position W Substrate

Claims

1. In a substrate transfer device that transfers a substrate with operations of receiving a substrate in a horizontal posture at a predetermined set position and passing the substrate in a horizontal posture to the predetermined set position, a hand for acquiring the substrate; a hand driving mechanism for driving the hand to transfer the substrate; at least three movable guides provided on the hand, which sandwich the outer peripheral surface of the substrate and hold the substrate spaced apart from the hand in the vertical direction; a forward and backward driving mechanism for driving the movable guide to move forward and backward with respect to the substrate; a storage unit for storing the set position; a control unit that controls the hand driving mechanism with reference to the set position stored in advance in the storage unit, approaches the hand to the substrate at the set position, and then controls the forward and backward driving mechanism to bring each movable guide into contact with the substrate; a calculation unit that calculates the position of the center point of the substrate based on the positional relationship of each movable guide when each movable guide contacts the substrate; and a setting unit that stores the position of the center point as a new set position in the storage unit, wherein the control unit refers to the new set position stored in the storage unit when transferring the substrate next. A substrate transfer device characterized by the above.

2. In the substrate transfer device according to Claim 1, the forward and backward driving mechanism is configured to be able to drive the movable guide forward and backward in a direction approaching and separating from the substrate at the set position. A substrate transfer mechanism characterized by the above.

3. In the substrate transfer device according to Claim 1, the hand driving mechanism includes a vertical driving mechanism for driving the hand in the vertical direction, and the calculation unit actually measures the position of the substrate in the vertical direction by bringing the movable guide into contact with the substrate from the vertical direction. A substrate transfer device characterized by the above.

4. In the substrate transfer device according to Claim 1, the control unit controls the hand driving mechanism and the forward and backward driving mechanism to bring the movable guide into contact with the substrate until the difference between the calculated position of the center point of the substrate and the set position already stored in the storage unit becomes equal to or less than a predetermined value, the calculation unit calculates the position of the center point of the substrate each time the movable guide contacts the substrate, the setting unit stores the position of the center point of the substrate calculated each time the movable guide contacts the substrate as a new set position in the storage unit, and repeats each operation. A substrate transfer device characterized by the above.

5. In the substrate transfer device according to Claim 1, ​ The control unit individually controls the movable guides by the forward and backward drive mechanism, and when the movable guide contacts the outer peripheral surface of the substrate, the contacted movable guide is stopped. A substrate transfer device characterized by the above.

6. In the substrate transfer device according to claim 1, The hand A first blade, A second blade, And a connecting portion connecting the first blade and the second blade, The three movable guides are provided on each of the first blade, the second blade, and the connecting portion. A substrate transfer device characterized by the above.

7. In the substrate transfer device according to claim 6, The movable guide provided on the first blade is movable forward and backward in the extending direction of the first blade, The movable guide provided on the second blade is movable forward and backward in the extending direction of the second blade. A substrate transfer device characterized by the above.

8. In the substrate transfer device according to claim 6, The movable guide provided on the connecting portion is movable forward and backward with respect to the space sandwiched between the first blade and the second blade. A substrate transfer device characterized by the above.

9. In the substrate transfer device according to claim 1, The movable guide is attached to at least one of the upper surface and the lower surface of the hand. A substrate transfer device characterized by the above.

10. In the substrate transfer device according to claim 1, It is provided with a detection surface capable of detecting the force applied to each of the three orthogonal axes, and is provided with a tactile sensor capable of detecting that the movable guide has contacted the outer peripheral surface of the substrate. The control unit recognizes that the movable guide has contacted the outer peripheral surface of the substrate based on the output of the tactile sensor. A substrate transfer device characterized by the above.

11. In the substrate transfer device according to claim 10, The tactile sensor is provided between the hand and the movable guide. A substrate transfer device characterized by the above.

12. In the substrate transfer device according to claim 1, The forward and backward drive mechanism includes a motor that drives the movable guide forward and backward, a drive circuit that applies a drive current for driving the motor, and an encoder that detects the rotational position of the motor. As a detector for detecting that the movable guide has contacted the substrate, it includes at least one of a drive current detection unit that detects the contact based on the drive current information of the drive circuit and a position information detection unit that detects the contact based on the position information output from the encoder. The control unit determines that the movable guide has come into contact with the substrate based on at least one of the drive current information and the position information. A substrate transfer device characterized by the above.

13. A substrate processing apparatus comprising the substrate transfer device according to claim 1, comprising a plurality of single-wafer processing units that receive substrates in a horizontal posture one by one on a substrate placement unit and perform predetermined processing, wherein the hand transfers the substrate to the substrate placement unit of each single-wafer processing unit. A substrate processing apparatus characterized by the above.

14. In the substrate processing apparatus according to claim 13, the storage unit stores the set positions corresponding to the substrate placement units for each single-wafer processing unit, the control unit operates individually for a plurality of set positions, the calculation unit operates individually for a plurality of set positions, the setting unit operates individually for a plurality of set positions. A substrate processing apparatus characterized by the above.

15. A teaching method for a substrate transfer device including a hand for holding a substrate, a hand drive mechanism for driving the hand to transfer the substrate, at least three movable guides provided on the hand for sandwiching the outer peripheral surface of the substrate and holding the substrate spaced apart from the hand in the vertical direction, and a forward and backward drive mechanism for driving the movable guides forward and backward with respect to the substrate, the method comprising: a hand movement process of approaching the hand to the substrate assuming that the substrate is at a predetermined set position, a contact process of bringing each movable guide into contact with the substrate, a calculation process of calculating the position of the center point of the substrate based on the positional relationship of each movable guide when each movable guide comes into contact with the substrate, a teaching process of setting the calculated center position of the substrate as a new set position. A teaching method for a substrate transfer device comprising the above.

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