Method for manufacturing electronic device, and lead frame

Abstract

To provide an electronic device that can be reduced in size and thickness, a method for manufacturing the same, and a lead frame.SOLUTION: An electronic device 1 has a ceramic package 3 including a quartz oscillator therein, an IC chip 5 connected to a lower face of the ceramic packages with bumps, and lead parts 20a, 20b connected to lower sides of the four corners of the lower face of the ceramic package, which are molded with resin 8. The lead parts are arranged on the same plane to be located individually at the vertices of the rectangle without being connected to each other during formation of the electronic device with respect to one ceramic package. The lead parts each include a plate-like first mounting terminal part, a plate-like internal connection terminal part provided continuously on an end of the first mounting terminal part, a first extension part provided continuously with the internal connection terminal part and extending outward orthogonal to one side face of the internal connection terminal part, and a second extension part provided continuously with the internal connection terminal part and extending outward orthogonal to the first extension part.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to an electronic device, a method for manufacturing the same, and a lead frame.

Background Art

[0002] Conventionally, in mobile phones, GNSS modules, IoT devices, etc., electronic devices in which a crystal oscillator and a circuit (IC) are incorporated in one package are mounted. Such an electronic device has a crystal oscillator and an IC chip or the like mounted in a ceramic package (ceramic PKG), connected by bonding wires or the like, and sealed with resin to be integrated (see, for example, Patent Document 1).

[0003] FIG. 1 is an explanatory diagram schematically showing the structure of a conventional state in which a crystal oscillator and a circuit (IC) are incorporated in one package. As shown in FIG. 1, the crystal oscillator and the circuit are fixed in a ceramic package with an adhesive, connected to the wiring in the ceramic package by bonding wires or the like, and become one electronic device.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, the above-described conventional electronic device has a problem that there is a limit in achieving both miniaturization and thinning as one package.

[0006] For example, when mounting a crystal oscillator and an IC chip of size 1210, there was a problem that it was difficult to process the ceramic package to secure a space for mounting the crystal oscillator and the IC chip inside the ceramic package. Also, there was a problem that it was difficult to miniaturize the IC chip.

Means for Solving the Problems

[0007] The present invention has been made in view of the above problems, and an object thereof is to provide an electronic device capable of miniaturization and thinning, a manufacturing method thereof, and a lead frame.

[0008] A first aspect of the present invention provides an electronic device in which a ceramic package having a crystal oscillator inside, an IC chip connected by bumps to the lower surface of the ceramic package, and lead portions connected to the lower sides of the four corners of the lower surface of the ceramic package are molded with resin.

[0009] According to such an aspect, in the height direction, the height of the IC chip is accommodated within the lead frame, enabling miniaturization and thinning.

[0010] A second aspect of the present invention has four lead portions that are arranged on the same plane so as to be independent of each other and located at the respective vertices of a rectangle without being connected to each other when forming an electronic device for one ceramic package, each of the lead portions having a flat first mounting terminal portion, a flat internal connection terminal portion continuously provided on an end portion of the first mounting terminal portion, a first extension portion continuously provided on the internal connection terminal portion and extending outward perpendicular to one side surface of the internal connection terminal portion, a second extension portion continuously provided on the internal connection terminal portion and extending outward perpendicular to the first extension portion, and being provided with a large number of the lead portions are arranged and connected to each other by an outer frame portion. Provided is a lead frame characterized in that the first extended portion and the second extended portion are connected to the outer frame portion.

[0011] According to such an aspect, the size in the planar direction including the connection portion with the ceramic package to be mounted can be made to fit within the size of the ceramic package, enabling miniaturization and thinning of the electronic device.

[0012] In a first aspect of the present invention, further, the lead portion is preferably the lead portion of the lead frame according to the second aspect of the present invention. The size in the planar direction including the connection portion with the lead portion fits within the size of the ceramic package, enabling further miniaturization and thinning. Also, the central lower part is hollow, and it is difficult for air bubbles to accumulate inside the device during molding, so an explosion due to air bubbles can be prevented.

[0013] A third aspect of the present invention is a lead frame manufacturing process in which a large number of four lead portions, which are arranged on the same plane so as to be located at the respective vertices of a rectangle independently without being connected to each other when forming an electronic device for one ceramic package, are arranged and connected to each other by an outer frame portion, etched on a metal plate, and plated; an IC chip hanging process in which an IC chip is connected by bumps to the upper surface of a ceramic package provided with a crystal oscillator inside and then inverted; a protruding electrode forming process in which bumps are placed on the upper surfaces of the four lead portions and an adhesive is applied; a ceramic package bonding process in which the ceramic package is bonded to the upper surfaces of the lead portions with the bumps and the adhesive; a molding process in which resin is injected, heated, and solidified so that the upper surface of the ceramic package is exposed; a cutting process in which the resin-molded electronic device is separated by cutting the connection between the lead portion and the outer frame portion for each ceramic package; provided is a method for manufacturing an electronic device, characterized by including the above.

[0014] According to such an aspect, miniaturization and thinning of the electronic device are enabled, re-imprinting on the ceramic package becomes unnecessary, the manufacturing process can be reduced, and explosion due to air bubbles can be prevented.

Advantages of the Invention

[0015] According to the present invention, miniaturization and thinning are enabled.

Brief Description of the Drawings

[0016]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Embodiments for Carrying Out the Invention

[0017] (Configuration) FIG. 2 is a schematic diagram showing a package structure of an electronic device using the lead frame of Example 1 of the present invention. The electronic device 1 of Example 1 of the present invention includes a ceramic package 3 having a crystal oscillator 4 therein, an IC chip 5 connected by bumps 7 near the center of the lower surface of the ceramic package 3, and leads 20a, 20b, 20c, 20d connected by bumps 7 and an adhesive 6 to the lower sides of the four corners of the lower surface of the ceramic package 3, which is an electronic device molded with a resin 8. Different from the electronic device of a conventional ceramic package, a lead frame is incorporated and there is no bonding wire. Further, there is no die pad.

[0018] In this embodiment, the adhesive 6 is a silver paste, the bump 7 is a gold bump, and the lead frame 9 is a copper plate plated with palladium, but the respective materials are not limited to these.

[0019] Four leads 20 forming a set of leads are arranged on the same plane so as not to be connected to each other and to be located at the respective vertices of a rectangle independently, and each has an internal connection terminal portion 21 for electrically connecting to a corner of the lower surface of the ceramic package 3, a first mounting terminal portion 22 provided below the internal connection terminal portion 21, a columnar first extension portion 23 extending in the longitudinal direction of the internal connection terminal portion 21 on the side where the ceramic package 3 is not placed, and a columnar second extension portion 24 extending in the short side direction of the internal connection terminal portion 21 on the side where the ceramic package 3 is not placed. An end face of the first extension portion 23 is exposed on one side surface of the electronic device 1, and an end face of the second extension portion 24 is exposed on the other side surface of the resin 8.

[0020] A set of lead portions is composed of four lead portions 20a, 20b, 20c, and 20d, and such a set of lead portions does not have a die pad on which an IC chip is placed and adhered. The lead portions 20a, 20b, 20c, and 20d are each independent and not physically connected. The IC chip 5 is surrounded by the respective internal connection terminal portions 21a, 21b, 21c, and 21d of the lead portions 20a, 20b, 20c, and 20d in a state of being separated from the IC chip 5 at both corner sides in the longitudinal direction of the IC chip 5. The IC chip 5 is also separated from and not connected to the upper surface of the first mounting terminal portion 22.

[0021] In other words, each lead portion 20 includes a flat plate-shaped first mounting terminal portion 22 that can be electrically connected to the outside on the lower surface, a flat plate-shaped internal connection terminal portion 21 that is continuously provided on the end of the first mounting terminal portion 22 and is electrically connected to one of the four corners on the lower surface of the ceramic package 3 on the upper surface, a first extending portion 23 that is continuously provided on the internal connection terminal portion 21 and extends outward perpendicular to one side surface of the internal connection terminal portion 21, and a second extending portion 24 that is continuously provided on the internal connection terminal portion 21 and extends outward perpendicular to the first extending portion 23.

[0022] More specifically, the lead portion 20 has a two-story structure where the first floor portion is a flat pentagonal prism and the second floor portion is a flat rectangular parallelepiped with two columnar protrusions. The first floor portion is the first mounting terminal portion 22, the second floor portion is the internal connection terminal portion 21, and the protruding portions on the second floor are the first extending portion 23 that becomes the second mounting terminal portion and the second extending portion 24 that becomes the third mounting terminal portion. The first mounting terminal portion 22 spreads in the direction that becomes under the ceramic package 3 when the ceramic package 3 is placed on the internal connection terminal portion 21, and one corner in the central direction of the ceramic package 3 is diagonally notched.

[0023] In this embodiment, the height of the lead frame 2 is 0.2 mm, which is the combined height of the first mounting terminal portion 22 corresponding to the first layer part with a height of 0.1 mm and the internal connection terminal portion 21 corresponding to the second layer part with a height of 0.1 mm. The height of the bump 7 and the adhesive 6 between the lower surface of the ceramic package 3 and the upper surface of the lead frame 2 is about 20 - 40 μm, and the height from the lower surface of the lead frame 2 to the upper surface of the ceramic package 3, that is, the height of the resin-molded electronic device 1 is about 0.5 mm. In this embodiment, since the thickness of the IC chip 5 is about 1.0 mm, there is a gap between the lower surface of the IC chip 5 connected so as to hang down from the lower surface of the ceramic package 3 and the upper surface of the first mounting terminal portion 22, and there is also a gap between the inner side surface of the internal connection terminal portion 21 and the side surface of the IC chip 5. The resin molded between them will be filled, and the IC chip 5 is not in contact with either the first mounting terminal portion 22 or the internal connection terminal portion 21. Therefore, air bubbles do not remain inside the electronic device, and an explosion caused by the air bubbles can be prevented.

[0024] In this embodiment, the ceramic package 3 with a crystal oscillator incorporated therein has a size of 1210, that is, about 1.2 mm × 1.0 mm, and a thickness of about 0.3 mm. The corresponding IC chip has dimensions of about 0.8 × 0.6 mm, making it difficult to fit inside the ceramic package. However, according to this embodiment, by laminating the ceramic package and the IC chip on the lead frame and joining the wirings, an electronic device with a size not much different from that of the ceramic package can be realized. Also, by accommodating the IC chip between the lead frames, it has become possible to make it thinner.

[0025] Figure 3 is an external perspective view of the electronic device according to Embodiment 1 of the present invention. The lower surface of the first mounting terminal portion 22 is exposed on the lower surface of the resin-molded electronic device 1, and when the electronic device 1 is mounted on a substrate, it can be electrically connected to the terminals on the substrate at four locations. Further, on the long-side side surface of the electronic device 1, second extending portions are exposed at the end faces at two locations each, and on the short-side side surface, first extending portions are exposed at the end faces at two locations each. Among the first mounting terminals 22, a cutout portion 221 is formed by diagonally cutting one corner in the central direction of the ceramic package 3. A lid 10 made of metal is placed on the ceramic package 3.

[0026] Figure 4 is a partial cross-sectional explanatory view for explaining the internal structure of the electronic device according to Embodiment 1 of the present invention. As shown in Figure 4, an IC chip 5 is accommodated between lead portions 20 with a lid 10 placed thereon under a ceramic package 3, enabling a small and thin electronic device to be realized. The ceramic package 3 and the lead portions 20 are joined by bumps 7 and an adhesive 6 which is a silver paste, and are molded with a resin 8. Further, the electronic device 1 of the present embodiment was able to exhibit the same characteristics as the conventional ones in terms of operation confirmation, electrical characteristics, and reliability.

[0027] (Manufacturing method) Figure 5 is an external view of the lead frame according to Embodiment 1 of the present invention. It shows a state where the lead frame 9 is etched on a sheet, and a part is enlarged and shown below. From Figure 6 onwards, only the enlarged part is taken out and shown. Figure 6 is an explanatory diagram of the manufacturing procedure of an electronic device showing a state where bumps are placed on the lead portions of the lead frame according to Embodiment 1 of the present invention.

[0028] The lead portions 20a, 20b, 20c, and 20d each constitute one corner of an electronic device. The lead portion 20 is a component of the lead frame 9 formed by connecting a set of four lead portions 20 with an outer frame portion 25 that arranges a number of sets of lead portions and connects them to each other. Each individual lead portion 20 is independently formed when the electronic devices 1 are cut out one by one after being molded with resin.

[0029] (Lead Frame Manufacturing Process) For one ceramic package, a large number of four lead portions 20 that are arranged on the same plane so as to be located at the respective vertices of a rectangle without being connected to each other during the formation of the electronic device are arrayed, and a lead frame 9 that is connected by an outer frame portion 25 to each other is etched and formed on a metal plate and then plated.

[0030] Specifically, for the lead frame 9, first, a predetermined wiring pattern is formed on a metal plate by etching or the like, and then plating is performed. The plating is preferably a conductive material (such as Au, Ag, Pd). In this embodiment, a copper alloy plate is used as the metal plate, and palladium plating is performed as the plating.

[0031] Among the large number of lead portions included in one lead frame 9, the four lead portions 20 surrounded by one outer frame will constitute the terminal portions of one electronic device. Before being cut out as an electronic device, the four lead portions 20 are connected to each other, but after being cut out, the connected portions are separated, so they become independent lead portions (terminal portions). The internal connection terminal portion 21, the first mounting terminal portion 22, the first extension portion 23, and the second extension portion 24 of each lead portion 20 are formed during etching.

[0032] In the lead frame 9, adjacent lead portions 20 are connected to the outer frame portion 25 with their first extension portions or second extension portions integrated with each other. The adjacent lead portions 20b, 20a´, 20d´´´, 20C´´ that will constitute a corner of separate electronic devices are connected in a grid pattern by the outer frame portion 25, the first extension portion 23, and the second extension portion 24. When cut out as an electronic device, the four lead portions 20 will be in a state of being independent without being connected to each other. In FIG. 6, except for the lead portions that are components of four adjacent electronic devices and the outer frame portion 25 surrounding them, they are omitted, but they are formed continuously side by side in four directions on one sheet.

[0033] The lead frame 9 is a member formed by etching a metal plate, and has four lead portions 20 which are arranged on the same plane so as to be located at the respective vertices of a rectangle independently without being connected to each other during the formation of an electronic device for one ceramic package. Each of the lead portions 20 includes a flat first mounting terminal portion 22, a flat internal connection terminal portion 21 continuously provided on the end of the first mounting terminal portion 21, a first extending portion 23 continuously provided on the internal connection terminal portion 21 and extending outward orthogonally to one side surface of the internal connection terminal portion 21, and a second extending portion 24 continuously provided on the internal connection terminal portion 21 and extending outward orthogonally to the first extending portion 23. The lead frame 9 has a large number of lead portions 20 arranged and connected to each other by an outer frame portion 25, and the first extending portion 23 and the second extending portion 24 are connected to the outer frame portion 25. Therefore, before being cut out as an electronic device, the lead portions 20 are physically connected to each other.

[0034] The first mounting terminal portion 22 serves as an external electrode terminal for connecting the wiring of the substrate to which the lower surface side is connected to the lower part of the electronic device. The first mounting terminal portion 22 has a portion where the internal connection terminal portion 21 is placed above it and a portion where nothing is placed above it, and this is formed by half-etching in which the degree of etching is adjusted in the height direction during etching. There is no first mounting terminal portion 22 below the second mounting terminal portion 23 and the third mounting terminal portion 24, and this is formed by over-etching in which the degree of etching is adjusted in the width direction during etching, but the etching method may be other methods. The internal connection terminal portion 21 and the first mounting terminal portion 22 are flat and island-shaped. The first extending portion 23 and the second extending portion 24 are formed to protrude columnarly in two directions orthogonal to each other from the internal connection terminal portion 21, and their upper surfaces are on the same plane as the upper surface of the internal connection terminal portion.

[0035] When the ceramic package 3 is set in the IC chip hanging step described later, four independent lead portions 20 which are not connected to each other after the formation of the electronic device are arranged under one ceramic package 3, and before the formation of the electronic device, the lead frame 9 is arranged such that all the lead portions 20 on the same sheet are electrically connected.

[0036] Specifically, in the lead frame 9 shown in FIG. 6, (1) a first extended portion 23b extending in the longitudinal direction of the internal connection terminal portion 21b on the side where the ceramic package 3a is not placed is connected to the internal connection terminal portion 21c'' of the lead portion 20c'' connected under the ceramic package 3c on the side opposite to the internal connection terminal portion 21c in the vertical column direction with the ceramic package 3a, and is integrally connected to a columnar first extended portion 23c'' extending in the longitudinal direction of the internal connection terminal portion 21c'' on the side where the ceramic package 3c is not placed; (2) a columnar second extended portion 24b extending in the short side direction of the internal connection terminal portion 21b on the side where the ceramic package 3a is not placed is connected to the internal connection terminal portion 21a' of the lead portion 20a' connected under the ceramic package 3b on the side opposite to the internal connection terminal portion 21a in the parallel direction with the ceramic package 3a, and is integrally connected to a columnar second extended portion 24a' extending in the short side direction of the internal connection terminal portion 21a' on the side where the ceramic package 3b is not placed. Further, (3) at positions diagonal to the lead portion 20b, the lead portion 20c'' and the lead portion 20a', lead portions 20d''' connected under the ceramic package 3d are similarly connected. That is, the lead portion 20b, the lead portion 20c'', the lead portion 20d''', and the lead portion 20a' are connected in a grid shape by the columnar first extended portions and the columnar second extended portions. Further, an outer frame 25 is orthogonally connected to their connection portions, forming a cross shape, and the outer frame 25 further extends outward to connect the first extended portions and the second extended portions of adjacent lead portions 20, forming a frame body integrally. This frame body spreads out in all four directions on the sheet.

[0037] In this embodiment, since the IC chip is sandwiched between four terminals, that is, four lead portions by etching, miniaturization and thinning are enabled. The shape of the terminals exposed to the outside is a pentagon with an oblique notch instead of a square, making it easier for the resin to enter the center of the lower part of the electronic device, so voids can be suppressed.

[0038] (IC Chip Hanging Process) An IC chip 5 is ultrasonically bonded via bumps 7 having a height of about 20 μm to 30 μm to a ceramic package 3a having a crystal oscillator 4 inside. The bonding is performed in a flip-chip process, that is, a process of placing the IC chip 5 on the ceramic package 3 for connection and then inverting it, so that the IC chip is integrated in a state of being suspended below the ceramic package.

[0039] (Protrusion electrode formation process) As shown in FIG. 6, the bumps 7 are placed on the upper surface of the internal connection terminal portion 21 of the lead frame after the lead frame manufacturing process. Then, the adhesive 6 is applied thereon. FIG. 7 is an explanatory diagram of the manufacturing procedure of an electronic device showing a state where the adhesive is placed on the lead portion shown in FIG. 6. As shown in FIG. 7, the bumps 7 are hidden by the adhesive 6 of silver (Ag) paste applied thereon. However, as shown in FIG. 2, the bumps 7, which are protruding electrodes, connect the lead portion 20 and the ceramic package 3 while maintaining a certain height. The dotted line shown in FIG. 7 indicates a unit of a set of lead portions that will be joined to the upper surface of the ceramic package 3a to form one electronic device. The dotted line portion becomes a part of the cutting line for cutting out the electronic device 1, which is a rectangular resin-sealed body, after resin molding.

[0040] Such a process is a protrusion electrode formation process in which bumps 7 are placed on the upper surfaces of a set of lead portions surrounded by an outer frame 25, that is, four lead portions 20a, 20b, 20c, and 20d that are arranged on the same plane so as to be located at the respective vertices of a rectangle and are independent of each other without being connected to each other during the formation of the electronic device for one ceramic package, and the adhesive 6 is applied.

[0041] (Ceramic package bonding process) On the upper surfaces of lead portions 20a, 20b, 20c, and 20d, specifically, on the upper surfaces of internal connection terminal portions 21a, 21b, 21c, and 21d, a ceramic package 3a in which a crystal oscillator 4 is mounted in advance with an IC chip 5a suspended and connected is placed, and joined with bumps 7 on the upper surface of the internal connection terminal portion by an adhesive 6. FIG. 8 is an explanatory diagram of a manufacturing procedure of an electronic device showing a state in which a ceramic package is placed on the lead frame shown in FIG. 7. FIG. 9 is an overall external view of the lead frame shown in FIG. 8. Ceramic packages 3 are arranged and joined on the lead frame 9.

[0042] (Molding process) Furthermore, a resin 8 which is a resin for sealing (molding material) is vacuum printed and injected by potting so that the upper surface of the ceramic package is exposed, cured (heated), and solidified into a rectangular body. FIG. 10 is a diagram showing the entire lead frame in a state of being resin molded and a partially enlarged state. The ceramic package 3 and the lead portion 20 are included inside, and the lower surface of the resin 8 is sealed so that the lower surface of the first mounting terminal portion is exposed. A lid 10 which is a metal lid is placed on the ceramic package 3 mounted and joined on the lead frame 9. In this embodiment, about 1,000 ceramic packages can be mounted on one sheet. Molding is performed so as to form one resin body on one sheet.

[0043] In this embodiment, a one-component epoxy resin having a high viscosity is used as the resin for sealing. Since the viscosity is high, it is difficult for air bubbles to enter during injection, so an explosion due to air bubbles can be prevented. Also, unlike photo-curing, it is inexpensive and highly reliable.

[0044] (Cutting process) Next, using a target mark provided in advance, the resin 8 including the lead frame 9 is cut for each molded ceramic package with a dicing blade to separate an electronic device 1 which is a rectangular resin-sealed body.

[0045] FIG. 11 is a diagram showing a cutting method for cutting out the electronic device shown in FIG. 3. The dotted line indicates the cutting line. By cutting, the end faces of the two second extended portions are exposed on one side surface and the opposite side surface of the electronic device 1 formed in the resin sealing body as shown in FIG. 3, and the end faces of the two first extended portions are exposed on both side surfaces in a direction perpendicular to the one side surface.

[0046] The lead portions supporting the four corners of the ceramic package 3 are independent of each other.

[0047] (Effect) In this embodiment, since the structure is such that the ceramic package is combined by the lead portions of the lead frame, miniaturization and thinning can be achieved. Also, air bubbles are less likely to be present, and explosion due to air bubbles can be prevented.

[0048] Also, since the top surface (upper surface) of the ceramic package is exposed, re-imprinting is not required for information about the ceramic package. Therefore, according to this embodiment, the manufacturing process can be reduced.

[0049] In this embodiment, instead of mounting the chip on the upper surface of the lead portion, the ceramic package is mounted and connected. The IC chip is connected so as to be suspended from the lower surface of the ceramic package, and has a structure covered by the external terminals at the four corners. Therefore, in the conventional method, it was difficult to miniaturize the IC chip, but by using the lead frame without miniaturization, an electronic device having substantially the same size as the built-in ceramic package can be produced.

[0050] The electronic device 1 of this embodiment is an electronic component of a ceramic package in which a crystal oscillator and a circuit (IC) are incorporated in one package, but it may also be a plastic package generally called a QFN.

[0051] The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the invention.

Explanation of Reference Numerals

[0052] 1 Electronic device 20 Lead part 21 Internal connection terminal part 22 First mounting terminal part 221 Notch 23 First extension part 24 Second extension part 25 Outer frame part 3 Ceramic package 4 Crystal oscillator 5 IC chip 6 Adhesive 7 Bump 8 Resin 9 Lead frame 10 Lid

Claims

1. An electronic device, characterized in that a ceramic package having a crystal oscillator therein, an IC chip connected by bumps to the lower surface of the ceramic package, and lead portions connected to the lower sides of the four corners of the lower surface of the ceramic package are molded with resin.

2. For one ceramic package, it has four lead portions that are arranged on the same plane so as to be located at the respective vertices of a rectangle independently without being connected to each other during the formation of the electronic device, each of the lead portions has a flat first mounting terminal portion, a flat internal connection terminal portion continuously provided on the end of the first mounting terminal portion, a first extending portion continuously provided on the internal connection terminal portion and extending outward orthogonally to one side surface of the internal connection terminal portion, a second extending portion continuously provided on the internal connection terminal portion and extending outward orthogonally to the first extending portion, and is provided with a large number of the lead portions are arranged and connected to each other by an outer frame portion, and the first extending portion and the second extending portion are connected to the outer frame portion, which is a lead frame.

3. The electronic device according to claim 1, characterized in that the lead portion is the lead portion of the lead frame according to claim 2.

4. A lead frame manufacturing process of forming a lead frame by etching and plating a metal plate, in which four lead portions that are arranged on the same plane so as to be located at the respective vertices of a rectangle independently without being connected to each other during the formation of the electronic device for one ceramic package are arranged in a large number and connected to each other by an outer frame portion; an IC chip suspension process of connecting an IC chip to the upper surface of a ceramic package having a crystal oscillator therein with bumps and then inverting it; a protruding electrode forming process of placing bumps on the upper surfaces of the four lead portions and applying an adhesive; a ceramic package bonding process of bonding the ceramic package to the upper surfaces of the lead portions with the bumps and the adhesive; a molding process of injecting resin so that the upper surface of the ceramic package is exposed, heating it, and solidifying it; a cutting process of separating the resin-molded electronic device by cutting the connection between the lead portion and the outer frame portion for each ceramic package; A method for manufacturing an electronic device, characterized by including the above.

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