Electronic component inspection device and tray collection device

Abstract

To solve the issue that there is a room for improvement in the terms of work efficiency since operators are required to collect trays arranged on the back surface side of an electronic component inspection device.SOLUTION: The present invention relates to an electronic component inspection device (1) in which storage trays (T1 to T3) for storing electronic components having been inspected are arranged on an electronic component storage region (CR) located on a back surface side of the electronic component inspection device (1). The electronic component inspection device (1) has a tray collection lane (41) and a tray transfer mechanism (50). The tray collection lane (41) transfers the storage trays (T1 to T3) to the front side of the electronic component inspection device (1). The tray transfer mechanism (50) transfers the storage trays (T1 to T3) arranged in the electronic component collection region (CR) onto the tray collection lane (41) by holding the storage trays.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to an electronic component inspection apparatus and a tray recovery apparatus that recover a storage tray containing inspected electronic components from an electronic component recovery area provided on the back side of the electronic component inspection apparatus.

Background Art

[0002] In an electronic component inspection apparatus, after inspecting the electrical characteristics of electronic components, the inspected electronic components are stored in a tray. Here, an area for recovering a tray containing inspected electronic components is provided on the front surface of the electronic component inspection apparatus. Also, inside the electronic component inspection apparatus, a tray for storing inspected electronic components is arranged in an area located on the back side of the electronic component inspection apparatus.

[0003] When recovering the tray arranged on the back side of the electronic component inspection apparatus, an operator can recover the tray by opening an access door provided on the side surface of the electronic component inspection apparatus.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] When recovering the tray arranged on the back side of the electronic component inspection apparatus, as described above, an operator has to recover the tray, and there is room for improvement in terms of work efficiency.

Means for Solving the Problems

[0006] The first invention of the present application is an electronic component inspection apparatus in which a storage tray for accommodating inspected electronic components is arranged in an electronic component recovery area provided on the back side of the electronic component inspection apparatus. The electronic component inspection apparatus has a tray recovery lane and a tray transport mechanism. The tray recovery lane transports the storage tray to the front side of the electronic component inspection apparatus. The tray transport mechanism holds the storage tray arranged in the electronic component recovery area and transports it onto the tray recovery lane.

[0007] The tray transport mechanism can be constituted by a hand, a first guide rail, and a second guide rail. The hand holds the storage tray. The first guide rail extends from the electronic component recovery area to the tray recovery lane. The second guide rail moves along the first guide rail and moves the hand in the vertical direction.

[0008] The electronic component inspection apparatus can be provided with a tray supply lane for supplying an empty tray to the electronic component recovery area. Here, the tray transport mechanism can transport the empty tray supplied by the tray supply lane to the electronic component recovery area. The tray recovery lane can be provided in number corresponding to the number of storage trays arranged in the electronic component recovery area.

[0009] The electronic component inspection apparatus can be provided with a tray recovery mechanism for recovering the storage tray. Here, the tray recovery mechanism can be constituted by a guide rail, a mounting table, and a support member. The guide rail can be arranged along the tray recovery lane. The mounting table is located above the tray recovery lane and receives the storage tray from the tray transport mechanism. The support member moves along the guide rail and supports the mounting table.

[0010] A plurality of storage trays can be placed on the mounting table. On the front side of the electronic component inspection apparatus with respect to the electronic component recovery area, an existing tray recovery lane for recovering the tray in which the electronic components are accommodated is provided. Here, the tray recovery lane can be arranged side by side with the existing tray recovery lane.

[0011] The second invention of the present application is a tray recovery device that is attached to an electronic component inspection device for inspecting electronic components and recovers a storage tray containing inspected electronic components from an electronic component recovery area provided on the back side of the electronic component inspection device. The tray recovery device has a tray recovery lane and a tray transport mechanism. The tray recovery lane transports the storage tray to the front side of the electronic component inspection device. The tray transport mechanism holds the storage tray arranged in the electronic component recovery area and transports it onto the tray recovery lane.

[0012] In the tray recovery device which is the second invention of the present application, the tray transport mechanism can be constituted by a hand, a first guide rail, and a second guide rail. The hand holds the storage tray. The first guide rail extends from the electronic component recovery area to the tray recovery lane. The second guide rail moves along the first guide rail and moves the hand in the vertical direction.

[0013] The tray recovery device can be provided with a tray supply lane for supplying an empty tray to the electronic component recovery area. Here, the tray transport mechanism can transport the empty tray supplied by the tray supply lane to the electronic component recovery area. The tray recovery lane can be provided in the number corresponding to the number of storage trays arranged in the electronic component recovery area.

[0014] The tray recovery device can be provided with a tray recovery mechanism for recovering the storage tray. Here, the tray recovery mechanism can be constituted by a guide rail, a mounting table, and a support member. The guide rail can be arranged along the tray recovery lane. The mounting table is located above the tray recovery lane and receives the storage tray from the tray transport mechanism. The support member moves along the guide rail and supports the mounting table.

[0015] A plurality of storage trays can be placed on the mounting table. On the front side of the electronic component inspection device with respect to the electronic component recovery area, there is provided an existing tray recovery lane for recovering the tray containing the electronic components. Here, the tray recovery lane can be arranged side by side with the existing tray recovery lane. [Effect of the Invention]

[0016] According to the present invention, by using the tray recovery lane and the tray transport mechanism, the storage tray arranged on the back side of the electronic component inspection device can be automatically recovered. [Brief Description of the Drawings]

[0017]

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Embodiments for Carrying Out the Invention

[0018] (First Embodiment) The configuration of the electronic component inspection apparatus according to the first embodiment will be described with reference to FIG. 1. In FIG. 1, the X-axis and the Y-axis are perpendicular to each other, and the direction perpendicular to the X-axis and the Y-axis is defined as the Z-axis. Examples of the electronic components inspected by the electronic component inspection apparatus 1 include IC (Integrated Circuit) devices such as LSI (Large Scale Integration), CMOS (Complementary Metal Oxide Semiconductor), CCD (Charge Coupled Device), module ICs in which a plurality of modules are packaged, crystal devices, pressure sensors, inertial sensors, acceleration sensors, gyro sensors, and fingerprint sensors.

[0019] (Configuration of the electronic component inspection apparatus 1) The electronic component inspection apparatus 1 includes an inspection unit 1A and a tray recovery and supply unit 1B. In the present embodiment, the inspection unit 1A and the tray recovery and supply unit 1B are integrally configured, but they can also be separated into a device constituting the inspection unit 1A (electronic component inspection apparatus) and a device constituting the tray recovery and supply unit 1B (tray recovery and supply apparatus). In this case, an electronic component inspection system can be configured by the device constituting the inspection unit 1A (electronic component inspection apparatus) and the device connected to the device constituting the inspection unit 1A (electronic component inspection apparatus) and constituting the tray recovery and supply unit 1B (tray recovery and supply apparatus).

[0020] (Configuration of the inspection unit 1A) Hereinafter, the configuration of the inspection unit 1A will be described.

[0021] On the first tray conveyance lane 11, on the front side of the electronic component inspection apparatus 1, a tray T containing a plurality of uninspected electronic components is arranged. This tray T is conveyed to the electronic component supply area DR by the first tray conveyance lane 11, and each electronic component contained in the tray T is conveyed to the first shuttle 13 by the electronic component conveyance mechanism 12. The first shuttle 13 conveys the electronic components from the electronic component supply area DR to the inspection area IR.

[0022] After all the electronic components are transported from the tray T to the first shuttle 13, the emptied tray T is transported from the first tray transport lane 11 to the second tray transport lane 15 by the tray transport mechanism 14. The second tray transport lane 15 transports the empty tray T to the front side of the electronic component inspection device 1. The third tray transport lane 16 is arranged side by side with the second tray transport lane 15 and transports the empty tray T to the electronic component supply area DR. Note that the third tray transport lane 16 can also be omitted.

[0023] In the electronic component supply area DR, a soak plate 17 for adjusting the temperature of the electronic components during inspection standby and a rotary stage 18 for rotating the electronic components are arranged. A plurality of electronic components can be placed on the soak plate 17, and the temperature of the electronic components is adjusted to a temperature suitable for inspection by heating or cooling the electronic components. In this embodiment, two soak plates 17 are provided, but the present invention is not limited thereto. Electronic components can be transported from the soak plate 17 to the first shuttle 13 or from the rotary stage 18 to the first shuttle 13.

[0024] After the first shuttle 13 transports the electronic components from the electronic component supply area DR to the inspection area IR, a test hand (not shown) transports the electronic components from the first shuttle 13 to the test socket 19. After the electronic components are taken out from the first shuttle 13, the first shuttle 13 returns from the inspection area IR to the electronic component supply area DR. The first shuttle 13 can heat or cool the electronic components placed on the first shuttle 13. The electronic components whose temperature has been adjusted by the soak plate 17 can be transported to the inspection area IR while maintaining the temperature adjustment state by the first shuttle 13.

[0025] The test socket 19 disposed in the inspection area IR has a plurality of probe pins that are electrically connected to the terminals of the electronic component, and inspects the electrical characteristics of the electronic component. Here, the test socket 19 can heat or cool the electronic component and can adjust the temperature of the electronic component to a temperature suitable for inspection. The above-described test hand presses the electronic component against the test socket 19. Further, the test hand can heat or cool the electronic component and can maintain the temperature adjustment state of the electronic component.

[0026] In the electronic component recovery area CR, a plurality of electronic components that have completed inspection are recovered. When the inspection at the test socket 19 is completed, a test hand (not shown) conveys the electronic component from the test socket 19 to the second shuttle 20. The second shuttle 20 conveys the electronic component from the inspection area IR to the electronic component recovery area CR. Note that a rotation stage 21 for rotating the electronic component can be provided in the electronic component recovery area CR.

[0027] In the electronic component recovery area CR, trays T1 to T3 for accommodating the inspected electronic components are arranged, and the electronic component recovery mechanism 22 conveys the electronic components from the shuttle 20 or the rotation stage 21 to each of the trays T1 to T3. In the present embodiment, three trays T1 to T3 are arranged, and the trays T1 to T3 that are the accommodation destinations of the electronic components can be determined according to the inspection results of the electronic components.

[0028] In the electronic component recovery area CR, three tray recovery lanes (existing tray recovery lanes) 23 are arranged, and empty trays T can be placed on the tray recovery lanes 23. The electronic component recovery mechanism 22 conveys the electronic components from the shuttle 20 or the rotary stage 21 to the tray T on the tray recovery lane 23. When the inspected electronic components are stored in the tray T, more specifically, when the tray T is full of inspected electronic components, the tray recovery lane 23 conveys the tray T to the front of the electronic component inspection device 1. In the present embodiment, three tray recovery lanes 23 are provided, and according to the inspection results of the electronic components, among the trays T arranged on the three tray recovery lanes 23, the tray T that is the storage destination of the electronic components can be determined.

[0029] (Configuration of the Tray Recovery Supply Unit 1B) Hereinafter, the configuration of the tray recovery supply unit 1B will be described.

[0030] In the tray recovery supply unit 1B, three tray recovery lanes 41 and one tray supply lane 42 are arranged. The tray recovery lanes 41 and the tray supply lane 42 are arranged side by side in the X direction. Also, the tray recovery lanes 41 are arranged side by side with the tray recovery lanes 23.

[0031] The tray recovery lanes 41 are provided in the same number as the number of trays T1 to T3 arranged in the electronic component recovery area CR of the inspection unit 1A. In the present embodiment, since three trays T1 to T3 are arranged in the electronic component recovery area CR, three tray recovery lanes 41 are provided. Note that the total number of trays arranged in the electronic component recovery area CR is not limited to three. The tray supply lane 42 is used to supply an empty tray Te to the electronic component recovery area CR.

[0032] The tray transport mechanism 50 holds each of the trays T1 to T3 arranged in the electronic component recovery area CR and transports them to each tray recovery lane 41. Here, each tray recovery lane 41 is associated with each of the trays T1 to T3 arranged in the electronic component recovery area CR, and the tray recovery lane 41, which is the transport destination of the trays T1 to T3, is changed according to the trays T1 to T3. The specific configuration of the tray transport mechanism 50 will be described later.

[0033] An empty tray Te can be placed at the first end of the tray supply lane 42 (the end on the front side of the electronic component inspection device 1), and this tray Te is transported by the tray supply lane 42 to the second end of the tray supply lane 42 (the end on the back side of the electronic component inspection device 1). The tray transport mechanism 50 holds the tray Te transported to the second end of the tray supply lane 42, and in the electronic component recovery area CR, collects the trays T1 to T3 and transports the tray Te to the emptied position.

[0034] (Configuration of the tray transport mechanism 50) Next, the configuration of the tray transport mechanism 50 will be described with reference to FIG. 2.

[0035] The tray transport mechanism 50 includes a first guide rail 51 extending in the X direction, a second guide rail 52 extending in the Z direction, and a hand 53 for holding the tray T. As shown in FIG. 1, a part of the first guide rail 51 extends to the electronic component recovery area CR of the inspection unit 1A.

[0036] The second guide rail 52 is connected to the first guide rail 51 and moves in the X direction along the first guide rail 51 by driving the first guide rail 51. The hand 53 is connected to the second guide rail 52 and moves in the Z direction along the second guide rail 52 by driving the second guide rail 52. The structure for holding the tray T by the hand 53 can be determined as appropriate. For example, a pair of claw portions for holding both ends of the tray T can be provided on the hand 53, and the tray T can be held by rotating the pair of claw portions.

[0037] (Operation of Tray Recovery and Supply Unit 1B) In the tray recovery and supply unit 1B, as shown in FIG. 3, the driving of the tray transport mechanism 50, the tray recovery lane 41, and the tray supply lane 42 is controlled by the controller 100. The operation of the tray recovery and supply unit 1B will be described using the flowcharts shown in FIGS. 4 and 5.

[0038] The process shown in FIG. 4 is a process of recovering the trays T1 to T3 arranged in the electronic component recovery area CR, and the process shown in FIG. 5 is a process of transporting the empty tray Te to the electronic component recovery area CR. By performing the process shown in FIG. 5 after the process shown in FIG. 4, in the electronic component recovery area CR, each of the trays T1 to T3 containing electronic components can be replaced with the empty tray Te. The processes shown in FIGS. 4 and 5 are performed by the controller 100 shown in FIG. 3.

[0039] The process shown in FIG. 4 is started when it is necessary to replace the trays T1 to T3 arranged in the electronic component recovery area CR. For example, when the trays T1 to T3 arranged in the electronic component recovery area CR are full of electronic components, the process shown in FIG. 4 can be started. Here, whether the trays T1 to T3 are in a full state can be determined by counting the number of electronic components transported by the electronic component recovery mechanism 22 constituting the inspection unit 1A to each tray T. Also, when starting the process shown in FIG. 4, the tray transport mechanism 50 is in a standby state. When the tray transport mechanism 50 is in a standby state, for example, the hand 53 can be stopped at a position corresponding to the tray supply lane 42.

[0040] In step S101, the controller 100 drives the first guide rail 51 to move the second guide rail 52 along the first guide rail 51. Specifically, the second guide rail 52 is moved from the standby position (for example, the position corresponding to the tray supply lane 42) to the position corresponding to the trays T1 to T3 to be exchanged arranged in the electronic component recovery area CR.

[0041] In step S102, the controller 100 drives the second guide rail 52 to move the hand 53 downward along the second guide rail 52, and then the hand 53 holds the trays T1 to T3 to be exchanged.

[0042] In step S103, the controller 100 drives the tray transport mechanism 50 to transport the trays T1 to T3 held by the hand 53 to the tray recovery lane 41. Specifically, the controller 100 drives the second guide rail 52 to move the hand 53 upward along the second guide rail 52 while holding the trays T1 to T3 to be exchanged. Next, the controller 100 drives the first guide rail 51 to move the second guide rail 52 from the electronic component recovery area CR to the tray recovery and supply unit 1B along the first guide rail 51.

[0043] After the second guide rail 52 moves to the tray recovery lane 41 corresponding to the trays T1 to T3 to be exchanged, the controller 100 drives the second guide rail 52 to move the hand 53 downward along the second guide rail 52. When the hand 53 releases the holding of the trays T1 to T3, the trays T1 to T3 are placed on the tray recovery lane 41.

[0044] In step S104, the controller 100 drives the tray recovery lane 41 to transport the trays T1 to T3 from the back side to the front side of the electronic component inspection device 1. Thereby, the trays T1 to T3 to be exchanged can be taken out from the front of the electronic component inspection device 1.

[0045] Next, the process shown in FIG. 5 starts when the process shown in FIG. 4 ends and an empty tray Te is placed on the tray supply lane 42. Specifically, when the controller 100 finishes the process shown in FIG. 4 and detects that the tray Te is placed on the tray supply lane 42, the controller 100 starts the process shown in FIG. 5. Whether the tray Te is placed on the tray supply lane 42 or not can be determined using various sensors (for example, an optical sensor).

[0046] In step S201, the controller 100 conveys the tray Te from the front side to the back side of the electronic component inspection apparatus 1 by driving the tray supply lane 42.

[0047] In step S202, the controller 100 holds the tray Te placed on the tray supply lane 42 by driving the tray transfer mechanism 50. Specifically, the controller 100 moves the second guide rail 52 to a position corresponding to the tray supply lane 42 by driving the first guide rail 51. Next, the controller 100 moves the hand 53 downward along the second guide rail 52 by driving the second guide rail 52, and then holds the tray Te by the hand 53.

[0048] In step S203, the controller 100 conveys the tray Te held by the hand 53 to the electronic component recovery area CR by driving the tray transfer mechanism 50. Specifically, the controller 100 moves the hand 53 upward along the second guide rail 52 while holding the tray Te by driving the second guide rail 52. Next, the controller 100 moves the second guide rail 52 from the tray recovery supply unit 1B to the electronic component recovery area CR along the first guide rail 51 by driving the first guide rail 51.

[0049] After the second guide rail 52 has moved to the target position where the tray Te is to be placed in the electronic component collection area CR (the position where the trays T1 to T3 collected by the process shown in FIG. 4 were placed), the controller 100 drives the second guide rail 52 to move the hand 53 downward along the second guide rail 52. When the hand 53 releases the holding of the tray Te, the tray Te is placed at the target position in the electronic component collection area CR.

[0050] According to the present embodiment, the tray collection and supply unit 1B can automatically collect the trays T1 to T3 placed in the electronic component collection area CR. Further, the tray collection and supply unit 1B can supply an empty tray Te to the position where the collected trays T1 to T3 were placed.

[0051] (Second Embodiment) The configuration of the electronic component inspection apparatus 1 according to the present embodiment will be described with reference to FIG. 6. In the present embodiment, the same components as those described in the first embodiment are denoted by the same reference numerals, and detailed descriptions thereof are omitted. In the present embodiment, the configuration of the inspection unit 1A is the same as that in the first embodiment. The configuration of the tray collection and supply unit 1C in the present embodiment is different from the configuration of the tray collection and supply unit 1B in the first embodiment. Hereinafter, the differences from the first embodiment will be mainly described.

[0052] (Configuration of Tray Collection and Supply Unit 1C) The tray collection and supply unit 1C is provided with the tray transport mechanism 50 and the tray collection mechanism 60 described in the first embodiment. In the present embodiment, one tray collection lane 41 and one tray supply lane 42 are arranged in the tray collection and supply unit 1C.

[0053] FIG. 7 shows a perspective view of the tray recovery mechanism 60. The tray recovery mechanism 60 includes a guide rail 61 extending in the Y direction, a mounting table 62 on which the tray T is placed, and a support member 63 that supports the mounting table 62. As shown in FIG. 6, the guide rail 61 is arranged along the tray recovery lane 41 and the tray supply lane 42, and is arranged at a position adjacent to the tray supply lane 42.

[0054] The base end portion of the support member 63 is connected to the guide rail 61, and the support member 63 is movable in the Y direction along the guide rail 61. The mounting table 62 is fixed to the tip end portion of the support member 63, and the mounting table 62 moves together with the support member 63. The mounting table 62 is located above the tray recovery lane 41 and the tray supply lane 42, and two trays T can be arranged side by side on the mounting table 62.

[0055] (Operation of the Tray Recovery and Supply Unit 1C) In the tray recovery and supply unit 1C, as shown in FIG. 8, the driving of the tray transfer mechanism 50, the tray recovery lane 41, the tray supply lane 42, and the tray recovery mechanism 60 is controlled by the controller 100. Also in this embodiment, the processes shown in FIGS. 4 and 5 are performed.

[0056] Here, in the process of step S103 shown in FIG. 4, the trays T1 to T3 to be exchanged are being conveyed to the tray recovery lane 41, but in this embodiment, the trays T1 to T3 to be exchanged are conveyed to the tray recovery lane 41 or the mounting table 62 of the tray recovery mechanism 60. Also, in the process of step S104 shown in FIG. 4, by driving the tray recovery lane 41, the trays T1 to T3 to be exchanged are conveyed from the back side to the front side of the electronic component inspection apparatus 1, but in this embodiment, by driving the tray recovery lane 41 or the tray recovery mechanism 60, the trays T1 to T3 to be exchanged are conveyed from the back side to the front side of the electronic component inspection apparatus 1.

[0057] In this embodiment, by using the tray recovery lane 41 and the mounting table 62, the three trays T1 to T3 arranged in the electronic component recovery area CR can be recovered. Here, for the three trays T1 to T3, those to be recovered by the tray recovery lane 41 and those to be recovered by the mounting table 62 can be assigned in advance. For example, it can be determined in advance that the tray T1 is recovered by the tray recovery lane 41, and the trays T2 and T3 are recovered by the mounting table 62.

[0058] Next, the operations of the tray transfer mechanism 50 and the tray recovery mechanism 60 will be specifically described with reference to FIGS. 9 to 25. Hereinafter, the operation of recovering the tray T1 and replacing it with the empty tray Te and the operation of recovering the tray T2 and replacing it with the empty tray Te will be described.

[0059] First, the operation of recovering the tray T1 and replacing it with the empty tray Te will be described with reference to FIGS. 9 to 17.

[0060] In FIG. 9, in the tray transfer mechanism 50, the hand 53 is moved above the tray T1 by moving the second guide rail 52 along the first guide rail 51. Next, as shown in FIG. 10, the hand 53 is moved downward along the second guide rail 52, and the tray T1 is held by the hand 53.

[0061] Next, with the hand 53 holding the tray T1, after moving the hand 53 upward along the second guide rail 52, the second guide rail 52 is moved along the first guide rail 51, and as shown in FIG. 11, the hand 53 is stopped above the tray recovery lane 41. Here, the mounting table 62 has retracted to the front side of the electronic component inspection device 1 so as not to interfere with the hand 53. Then, as shown in FIG. 12, after moving the hand 53 downward along the second guide rail 52, the holding of the tray T1 by the hand 53 is released, and as shown in FIG. 13, when the hand 53 releases the holding of the tray T1, the tray T1 is placed on the tray recovery lane 41.

[0062] Next, by driving the tray recovery lane 41, as shown in FIG. 14, the tray T1 moves from the back to the front of the electronic component inspection apparatus 1. Also, by driving the tray supply lane 42, an empty tray Te is conveyed from the front to the back of the electronic component inspection apparatus 1. When the tray Te reaches the back of the electronic component inspection apparatus 1, as shown in FIG. 15, the hand 53 moves downward along the second guide rail 52 to hold the tray Te.

[0063] While the hand 53 holds the tray Te, after moving upward along the second guide rail 52, the second guide rail 52 moves along the first guide rail 51, and as shown in FIG. 16, the hand 53 stops above the area where the tray T1 was placed. Then, the hand 53 moves downward along the second guide rail 52 and releases the holding of the tray Te, and as shown in FIG. 17, the tray Te is placed in the electronic component recovery area CR. This tray Te is used as the tray T1.

[0064] Next, the operation of recovering the tray T2 and replacing it with an empty tray Te will be described with reference to FIGS. 18 to 25.

[0065] As shown in FIG. 18, after the second guide rail 52 moves along the first guide rail 51 to the position corresponding to the tray T2 placed in the electronic component recovery area CR, the hand 53 moves downward along the second guide rail 52, and the hand 53 holds the tray T2. Then, as shown in FIG. 19, while the hand 53 holds the tray T2, it moves upward along the second guide rail 52.

[0066] Next, when the second guide rail 52 moves along the first guide rail 51 in the direction of the tray collection lane 41, as shown in FIG. 20, the hand 53 holding the tray T2 stops above the mounting table 62. Here, the mounting table 62 of the tray collection mechanism 60 is waiting at the receiving position for receiving the tray T2. As shown in FIG. 21, when the hand 53 releases the holding of the tray T2, the tray T2 is placed on the mounting table 62. On the other hand, while the tray T2 is being placed on the mounting table 62, by driving the tray supply lane 42, the empty tray Te is moved from the front to the back of the electronic component inspection apparatus 1.

[0067] Next, when the support member 63 moves along the guide rail 61, the mounting table 62 is moved from the back to the front of the electronic component inspection apparatus 1. As shown in FIG. 22, when the mounting table 62 moves to the front of the electronic component inspection apparatus 1, the mounting table 62 is positioned above the tray T1 collected in the tray collection lane 41 and the empty tray Te arranged in the tray supply lane 42. Also, when the second guide rail 52 moves along the first guide rail 51, the hand 53 stops above the tray Te conveyed by the tray supply lane 42.

[0068] Next, when the hand 53 moves downward along the second guide rail 52, as shown in FIG. 23, the hand 53 holds the tray Te on the tray supply lane 42. Then, as shown in FIG. 24, while the hand 53 holds the tray Te, the hand 53 moves upward along the second guide rail 52. After the hand 53 moves upward, when the second guide rail 52 moves along the first guide rail 51, the hand 53 stops above the area where the tray T2 is arranged in the electronic component collection area CR. Then, as shown in FIG. 25, when the hand 53 moves downward along the second guide rail 52 and releases the holding of the tray Te, the tray Te can be arranged in the area where the tray T2 was arranged. Thereby, the tray T2 containing the electronic components can be replaced with the empty tray Te, and the tray Te is used as the tray T2.

[0069] According to this embodiment, similar to the first embodiment, it is possible to collect the trays T1 to T3 in which the electronic components are accommodated while distinguishing them. Here, by using the mounting table 62, it is not necessary to arrange the three tray collection lanes 41 corresponding to each of the trays T1 to T3 horizontally side by side, and the electronic component inspection apparatus 1 can be miniaturized in the X direction.

[0070] (Modification of the second embodiment) In this embodiment, one mounting table 62 is provided in the tray collection mechanism 60, but it is not limited thereto. For example, as in the tray collection mechanism 60 shown in FIG. 26, two mounting tables 62 can be provided for the support member 63. Thereby, the trays T1 to T3 in which the electronic components are accommodated can be distributed to the tray collection lane 41 and the two mounting tables 62.

[0071] In the tray collection mechanism 60 shown in FIG. 26, when placing the trays T1 to T3 on the lower mounting table 62, the hand 53 holding the trays T1 to T3 is stopped at a corresponding position between the upper mounting table 62 and the lower mounting table 62. Then, by moving the support member 63, the hand 53 holding the trays T1 to T3 can be inserted between the upper mounting table 62 and the lower mounting table 62, and the trays T1 to T3 can be placed on the lower mounting table 62.

[0072] Note that one tray T can be placed on the mounting table 62, or a plurality of trays T can be placed side by side in the X direction. Also, three or more mounting tables 62 can be arranged in the Z direction.

Explanation of reference numerals

[0073] 1 Electronic component inspection apparatus 1A Inspection unit 1B, 1C Tray collection and supply unit 11 First tray conveyance lane 12 Electronic component conveyance mechanism 13 First shuttle 14 Tray conveyance mechanism 15 Second tray conveyance lane 16 Third Tray Conveyor Lane 17 Sock Plate 18 Rotating Stage 19 Test Socket 20 Shuttle 21 Rotating Stage 22 Electronic Component Recovery Mechanism 23 Tray Recovery Lane 41 Tray Recovery Lane 42 Tray Supply Lane 50 Tray Conveyor Mechanism 51 First Guide Rail 52 Second Guide Rail 53 Hand 60 Tray Recovery Mechanism 61 Guide Rail 62 Mounting Table 63 Support Member 100 Controller CR Electronic Component Recovery Area DR Electronic Component Supply Area IR Inspection Area T, T1, T2, T3, Te Trays

Claims

1. An electronic component inspection apparatus, wherein a storage tray for storing inspected electronic components is disposed in an electronic component collection area provided on the back side of the electronic component inspection apparatus, a tray collection lane for transporting the storage tray to the front side of the electronic component inspection apparatus; a tray transport mechanism for holding the storage tray disposed in the electronic component collection area and transporting it onto the tray collection lane; The electronic component inspection apparatus, characterized by comprising the above.

2. The tray transport mechanism includes: a hand for holding the storage tray; a first guide rail extending from the electronic component collection area to the tray collection lane; a second guide rail that moves along the first guide rail and moves the hand in the vertical direction; The electronic component inspection apparatus according to claim 1, characterized by comprising the above.

3. It has a tray supply lane for supplying an empty tray to the electronic component collection area, The electronic component inspection apparatus according to claim 1, wherein the tray transport mechanism transports the empty tray supplied by the tray supply lane to the electronic component collection area.

4. The electronic component inspection apparatus according to claim 1, wherein the number of the tray collection lanes is provided corresponding to the number of the storage trays disposed in the electronic component collection area.

5. It has a tray collection mechanism for collecting the storage tray, The tray collection mechanism includes: a guide rail disposed along the tray collection lane; a mounting table located above the tray collection lane and receiving the storage tray from the tray transport mechanism; a support member that moves along the guide rail and supports the mounting table; The electronic component inspection apparatus according to claim 1, characterized by comprising the above.

6. The electronic component inspection apparatus according to claim 5, wherein the mounting table can mount a plurality of the storage trays.

7. On the front side of the electronic component inspection apparatus with respect to the electronic component collection area, an existing tray collection lane for collecting a tray in which the electronic components are stored is provided, The electronic component inspection apparatus according to claim 1, wherein the tray collection lane is disposed side by side with the existing tray collection lane.

8. A tray collection device attached to an electronic component inspection apparatus for inspecting electronic components, the tray collection device collecting a storage tray in which inspected electronic components are stored from an electronic component collection area provided on the back side of the electronic component inspection apparatus. A tray recovery lane for transporting the storage tray to the front side of the electronic component inspection apparatus; A tray transport mechanism that holds the storage tray disposed in the electronic component recovery area and transports it onto the tray recovery lane; A tray recovery device characterized by comprising the above.

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