Mounting device

Abstract

To provide a mounting tool and a mounting device that can reduce residual air bubbles and substrate damage when mounting electronic components on a substrate.SOLUTION: A mounting tool 31 of the embodiment is the mounting tool 31 that mounts electronic components 2 on a substrate W, and has a holding surface 311 raised so that the electronic components 2 are curved and in contact, a plurality of openings 312 on the holding surface 311, and vent holes 313, which are connected to the openings 312 and hold the electronic components 2 on the holding surface 311 by making the inside pressure negative, and release the electronic components 2 from the holding surface 311 by making the inside pressure positive in turn from a part.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a mounting tool and a mounting apparatus.

Background Art

[0002] When mounting an electronic component, which is a semiconductor element such as a logic, memory, or image sensor, on a substrate, a wafer on which the semiconductor element is formed is diced into individual chips. Then, these chips are picked up one by one, transferred to the substrate, and mounted.

[0003] In such mounting of electronic components, bubbles may remain between the electronic component and the substrate. If there are bubbles between the electronic component and the substrate, it may lead to poor connection and insufficient strength, resulting in a mounting defect. To address this, when mounting an electronic component, in a mounting tool that crimps the substrate, the electronic component is curved and held, a part of the electronic component is brought into contact with the substrate, and then pressed with an elastic body to extrude the gas between the electronic component and the substrate for mounting.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Patent Document 3

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, in a tool that deforms while pressing an elastomer and crushes it, depending on the size of the electronic component, the pressed area may not spread uniformly, and insufficient force may be applied to the outer edge portion, making it impossible to extrude air bubbles. In addition, an excessive pressing force may be applied to the central portion, causing damage to the electronic component.

[0006] The present invention has been made to solve the above problems, and an object thereof is to provide a mounting tool and a mounting apparatus capable of reducing the remaining air bubbles and damage to the substrate when mounting an electronic component on the substrate.

Means for Solving the Problems

[0007] The present invention is a mounting tool for mounting an electronic component on a substrate, comprising a holding surface raised so that the electronic component contacts it in a curved manner, a plurality of openings provided in the holding surface, and a vent hole that communicates with the openings, holds the electronic component on the holding surface by making the internal pressure negative pressure, and detaches the electronic component from the holding surface by sequentially making positive pressure from a part.

[0008] The mounting apparatus of the present invention has the above mounting tool, and a tool moving mechanism that reciprocates the mounting tool between a delivery position and a mounting position and raises and lowers it at the delivery position and the mounting position, a detection unit that detects contact with the mounting tool, and a switching unit that switches the negative pressure and positive pressure with respect to the vent hole of the mounting tool when contact is detected by the detection unit.

Effects of the Invention

[0009] According to the mounting tool and the mounting apparatus of the present invention, it is possible to reduce the remaining air bubbles and damage to the substrate when mounting an electronic component on the substrate.

Brief Description of the Drawings

[0010]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Mode for Carrying Out the Invention

[0011] The mounting device of the embodiment will be described with reference to the drawings. Note that the drawings are schematic diagrams, and the sizes, ratios, etc. of each part include parts that are exaggerated for easy understanding. As shown in FIGS. 1 and 2, the mounting device 1 includes a supply device 10, a pickup device 20, a mounting device 30, and a control device 50, and is a device that transfers the electronic component 2 to the mounting device 30 by the pickup device 20 and mounts it on the substrate W on the substrate stage 60 by the mounting device 30. The electronic component 2 is, for example, a chip-shaped component. In this embodiment, the electronic component 2 is a semiconductor chip obtained by dividing a wafer into individual pieces.

[0012] The supply device 10 is a device that supplies the electronic component 2 to the pickup device 20. The supply device 10 moves the electronic component 2 to be picked up to the supply position P1. The supply position P1 is the position where the pickup device 20 picks up the electronic component 2 to be picked up. The supply device 10 includes a supply stage 12 that supports the sheet 11 to which the electronic component 2 is attached, and a stage moving mechanism 13 that moves the supply stage 12. The stage moving mechanism 13 is, for example, a ball screw mechanism driven by a servo motor.

[0013] The sheet 11 to which the electronic component 2 is attached is, here, an adhesive wafer sheet attached to a wafer ring (not shown). The electronic components 2 are arranged in a matrix (array) on the sheet 11. In the present embodiment, the electronic components 2 are arranged in a face-up state with the functional surface exposed upward.

[0014] The supply stage 12 is a stage that horizontally supports the wafer ring to which the sheet 11 is attached. That is, the sheet 11 to which the electronic component 2 is attached is supported via the wafer ring. The supply stage 12 is provided so as to be movable in the horizontal direction by a stage movement mechanism 13. Since the sheet 11 is horizontally supported together with the supply stage 12, the sheet 11 and the electronic components 2 placed on the sheet 11 are also provided so as to be movable in the horizontal direction.

[0015] As shown in FIGS. 1 and 2, in the horizontal direction, the direction in which the supply device 10 and the mounting device 30 are arranged is referred to as the X-axis direction, and the direction orthogonal to the X-axis is referred to as the Y-axis direction. Also, the direction orthogonal to the plane of the sheet 11 is referred to as the Z-axis direction or the vertical direction. The upward direction is the direction on the side where the electronic component 2 is placed with the plane of the sheet 11 as a boundary, and the downward direction is the direction on the side where the electronic component 2 is not placed with the plane of the sheet 11 as a boundary.

[0016] [Pickup device] The pickup device 20 is a relay device that picks up the electronic component 2 from the supply device 10 and delivers the picked-up electronic component 2 to the mounting device 30. This pickup device 20 includes a pickup nozzle 21, a nozzle movement mechanism 22, a direction conversion unit 23, and a push-up pin 24.

[0017] The pickup nozzle 21 is a cylindrical suction nozzle that holds the electronic component 2 and releases the held state to release the electronic component 2. The pickup nozzle 21 has a nozzle hole that opens on the suction surface at its tip. The nozzle hole communicates with a negative pressure generation circuit (not shown) such as a vacuum pump, and the electronic component 2 is suction-held by the nozzle hole by the circuit generating a negative pressure. Also, the electronic component 2 is released from the pickup nozzle 21 by releasing the negative pressure.

[0018] The nozzle movement mechanism 22 is a mechanism that reciprocates the pickup nozzle 21 between the supply position P1 and the delivery position P2 and also raises and lowers it at the supply position P1 and the delivery position P2. Specifically, the nozzle movement mechanism 22 includes a slide mechanism 221 and a lifting mechanism 222. Note that the delivery position P2 is the position where the pickup device 20 delivers the electronic component 2 picked up at the supply position P1 to the mounting tool 31 that functions as a receiving part described later.

[0019] The supply position P1 and the delivery position P2 mainly refer to positions in the XY direction and do not necessarily refer to positions in the Z-axis direction. Also, even when referring to a position (height) in the Z-axis direction, it is assumed that the height has a predetermined width. The predetermined width includes the thickness of the electronic component 2, the distance to push up the electronic component 2, the distance at which the electronic component 2 can be suctioned, etc. when delivering the electronic component 2.

[0020] The slide mechanism 221 reciprocates the pickup nozzle 21 between the supply position P1 and the delivery position P2. Here, the slide mechanism 221 has a rail 221b that extends parallel to the X-axis direction and is fixed to the support frame 221a, and a slider 221c that travels on the rail 221b. The lifting mechanism 222 moves the pickup nozzle 21 in the vertical direction. Specifically, the lifting mechanism 222 can use a ball screw mechanism driven by a servo motor. That is, by driving the servo motor, the pickup nozzle 21 moves up and down along the Z-axis direction.

[0021] The direction changing unit 23 is provided between the pickup nozzle 21 and the nozzle moving mechanism 22. Here, the direction changing unit 23 is an actuator including a driving source such as a motor that changes the direction of the pickup nozzle 21. Changing the direction means rotating it 0° to 180° in the vertical direction. For example, the pickup nozzle 21 with its suction surface facing the supply stage 12 adsorbs and holds the electronic component 2 at the supply position P1. Then, the direction changing unit 23 changes the direction of the pickup nozzle 21 so that the suction surface faces upward. At this time, the rotation angle is 180°.

[0022] The pushing pin 24 is provided below the sheet 11 of the supply device 10. The pushing pin 24 is a needle-like member with a pointed tip. The pushing pin 24 is provided inside the backup body 241 so that its longitudinal direction is parallel to the Z-axis direction.

[0023] The backup body 241 has a driving mechanism for advancing or retracting the pushing pin 24 from or into its interior. This advancing or retracting is performed in the vertical direction. This driving mechanism is a mechanism driven by, for example, an air cylinder or a cam mechanism.

[0024] [Mounting device] The mounting device 30 is a device that transports the electronic component 2 received from the pickup device 20 to the mounting position P3 and mounts it on the substrate W. The mounting position P3 is the position where the electronic component 2 is mounted on the substrate W. The mounting device 30 has a mounting tool 31 and a tool moving mechanism 32.

[0025] The mounting tool 31 has a function as a receiving part for receiving the electronic component 2 from the pickup nozzle 21 at the delivery position P2, and is also a member for mounting the electronic component 2 on the substrate W at the mounting position P3. The mounting tool 31 holds the electronic component 2 and releases the holding state after mounting to release the electronic component 2.

[0026] Specifically, as shown in FIGS. 3(A) and 3(B), the mounting tool 31 is a block in a substantially rectangular parallelepiped shape, and has a holding surface 311, an opening 312, and a ventilation hole 313. The holding surface 311 is the bottom surface of the mounting tool 31, and is a surface that bulges so that the electronic component 2 contacts it in a curved manner. Curving means bending without forming an angle, and as shown in FIG. 3(B), it also includes a mode that can be called so-called buckling, in which a curved surface is formed between flat surfaces and bends. The holding surface 311 of the present embodiment is in a mountain shape. The mountain shape here refers to a shape in which two flat surfaces with different angles are gently continuous at a peak portion including the highest vertex in the center. That is, the holding surface 311 has a rectangular planar shape, the centers of both side surfaces in the long side direction are peak portions, and the ridge line connecting the peak portions of both side surfaces is in the short side direction. Note that it is preferable that the mounting tool 31 is formed of a hard material so that the holding surface 311 does not elastically deform under the pressure during mounting of the electronic component 2. The holding surface 311 may have a rectangular or square planar shape according to the electronic component 2 to be mounted. As described above, FIGS. 3 and other drawings are schematic diagrams, and the degree of bulge of the holding surface 311, the ratio to other parts, etc. are exaggerated for easy understanding.

[0027] As shown in FIG. 3(C), a plurality of openings 312 are provided in the holding surface 311. The plurality of openings 312 are arranged in a plurality of rows. The direction of each row is, here, the direction parallel to the short side when the holding surface 311 is rectangular. However, it is not limited to this direction. In the present embodiment, the openings 312 are provided in two rows, row [2] and row [3], on both short side sides of the holding surface 311, sandwiching row [1] provided at the peak portion.

[0028] The vent hole 313 has one end communicating with the opening 312, and the pressure inside the hole is made negative to hold the electronic component 2 on the holding surface 311, and made positive to release the electronic component 2. The other end of each vent hole 313 communicates with a pneumatic circuit (not shown) that generates a negative pressure and a positive pressure by switching. In this embodiment, the vent holes 313 in each column are connected to pipes and valves respectively so that the negative pressure and the positive pressure can be switched for each column. Such a valve functions as a switching unit that switches the negative pressure and the positive pressure for the vent hole 313.

[0029] The tool moving mechanism 32 reciprocates the mounting tool 31 between the delivery position P2 and the mounting position P3, and raises and lowers it at the delivery position P2 and the mounting position P3. The tool moving mechanism 32 includes a slide mechanism 321 and a lifting mechanism 322.

[0030] The slide mechanism 321 reciprocates the mounting tool 31 between the delivery position P2 and the mounting position P3. Here, the slide mechanism 321 extends parallel to the X-axis direction and has two rails 321b fixed to the support frame 321a and a slider 321c that travels on the rails 321b. Although not shown, the slide mechanism 321 has a slide mechanism that slides the mounting tool 31 in the Y-axis direction. This slide mechanism can also be constituted by a rail in the Y-axis direction and a slider that travels on the rail.

[0031] The lifting mechanism 322 moves the mounting tool 31 in the vertical direction by driving an arm to which the mounting tool 31 is detachably provided. Specifically, the lifting mechanism 322 can use a ball screw mechanism driven by a servo motor. That is, by driving the servo motor, the mounting tool 31 moves up and down along the Z-axis direction. Further, the lifting mechanism 322 is provided with a detection unit 322a that detects contact with the mounting tool 31. As the detection unit 322a, a load sensor such as a strain gauge or a piezo element can be used.

[0032] The substrate stage 60 is a stage that supports the substrate W for mounting the electronic component 2. The substrate stage 60 is provided in the stage moving mechanism 61. The stage moving mechanism 61 is a moving mechanism that slides the substrate stage 60 on the XY plane and aligns it with the mounting position P3 of the electronic component 2 on the substrate W. The stage moving mechanism 61 is, for example, a ball screw mechanism driven by a servo motor.

[0033] The control device 50 controls the startup, stop, speed, operation timing, etc. of the supply device 10, the pickup device 20, the mounting device 30, and the substrate stage 60. That is, the control device 50 is the control device of the mounting device 1. The control device 50 can be realized by, for example, a dedicated electronic circuit or a computer operating according to a predetermined program. An input device for an operator to input instructions and information necessary for control and an output device for checking the state of the device are connected to the control device 50. As the input device, a switch, a touch panel, a keyboard, a mouse, etc. can be used. As the output device, a display unit such as a liquid crystal or an organic EL can be used.

[0034] FIG. 4 is a functional block diagram of the control device 50. The control device 50 includes a supply device control unit 51, a push-up pin control unit 52, a pickup nozzle control unit 53, a mounting tool control unit 54, a substrate stage control unit 56, and a storage unit 57.

[0035] The supply device control unit 51 controls the movement of the supply stage 12. That is, it controls the movement of the electronic component 2 to be picked up placed on the sheet 11. The push-up pin control unit 52 controls the movement of the push-up pin 24.

[0036] The pickup nozzle control unit 53 controls the movement of the pickup nozzle 21, that is, the operations of the nozzle moving mechanism 22 and the direction changing unit 23. Further, the pickup nozzle control unit 53 controls the negative pressure generation circuit communicated with the nozzle hole 21b and controls the holding and releasing of the electronic component 2.

[0037] The mounting tool control unit 54 controls the movement of the mounting tool 31, that is, the operation of the tool movement mechanism 32. Further, the mounting tool control unit 54 controls a pneumatic circuit communicating with the vent hole 313 of the mounting tool 31, switches the negative pressure and positive pressure of the openings 312 in each column, and controls the holding and releasing of the electronic component 2. Further, the mounting tool control unit 54 controls the switching between the negative pressure and positive pressure of the vent hole 313 in response to the contact detection by the detection unit 322a. The substrate stage control unit 56 controls the movement of the substrate stage 60, that is, the operation of the stage movement mechanism 61.

[0038] The storage unit 57 is a recording medium such as an HDD or an SSD. In the storage unit 57, data and programs necessary for the operation of the mounting apparatus 1 are stored in advance, and data necessary for the operation of the mounting apparatus 1 is stored. This necessary data is, for example, the position coordinates of the supply position P1, the transfer position P2, and the mounting position P3, and the position coordinates of each movement mechanism. Each of the above-described movement mechanisms performs movement control of each component based on these coordinates. Further, the storage unit 57 stores the timing for switching any of the columns of the vent holes 313 of the mounting tool 31 from negative pressure to positive pressure.

[0039] [Operation] The operation of the mounting apparatus 1 as described above will be described. First, the pickup apparatus 20 picks up the electronic component 2 from the supply apparatus 10 and delivers the electronic component 2 to the mounting apparatus 30. That is, the pickup apparatus 20 moves the pickup nozzle 21 to the supply position P1 where the push-up pin 24 is located, and opposes the nozzle hole 21b of the pickup nozzle 21 to the push-up pin 24.

[0040] On the other hand, the supply apparatus 10 moves the supply stage 12 and positions the electronic component 2 to be picked up at the supply position P1. After that, the pickup nozzle 21 is lowered so that the suction surface abuts on the electronic component 2 at the supply position P1 to suck the electronic component 2. Next, while raising the pickup nozzle 21 while holding the electronic component 2, the electronic component 2 is pushed up by the push-up pin 24, and the electronic component 2 is picked up while being peeled off from the sheet 11.

[0041] The pickup device 20 reverses the pickup nozzle 21 by the direction changing unit 23. That is, the direction of the pickup nozzle 21 is rotated 180° in the vertical direction, and the suction surface of the pickup nozzle 21 is directed upward. Note that the reversing operation may be performed at any point between the supply position P1 and the transfer position P2.

[0042] The pickup device 20 moves the picked-up electronic component 2 to the transfer position P2 by the nozzle moving mechanism 22. The mounting tool 31 of the mounting device 30 moves to the transfer position P2 by the tool moving mechanism 32 and waits, and the nozzle hole 21b of the pickup nozzle 21 and the holding surface 311 of the mounting tool 31 face each other via the electronic component 2.

[0043] Then, the mounting tool 31 is lowered toward the pickup nozzle 21 located at the transfer position P2, a negative pressure is applied to the vent hole 313 of the mounting tool 31 to hold the electronic component 2, and then the negative pressure of the pickup nozzle 21 is released, so that the electronic component 2 is transferred from the pickup nozzle 21 to the mounting tool 31. As a result, the electronic component 2 is curved and adsorbed and held so as to follow the bulge of the holding surface 311.

[0044] After that, the mounting tool 31 moves to the mounting position P3 and mounts the electronic component 2 on the substrate W. This mounting operation will be described with reference to the flowchart of FIG. 5 and the operation explanatory diagram of FIG. 6. First, the mounting tool 31 moves to the mounting position P3, and as shown in FIG. 6(A), the electronic component 2 held by the mounting tool 31 faces the substrate W (step S01). Then, the mounting tool 31 descends to bring the electronic component 2 closer to the substrate W (step S02).

[0045] When the detection unit 322a of the mounting tool 31 detects the contact between the electronic component 2 and the substrate W (YES in step S03), the mounting tool 31 stops descending (step S04). Then, the negative pressure is sequentially stopped from a part of the ventilation holes 313 and the positive pressure is applied to detach the electronic component 2 and mount it on the substrate W. That is, the positive pressure is switched in the order of column [1], column [2], and column [3] shown in FIG. 3, and blowing is performed from the opening 312 (steps S05 to S07).

[0046] At this time, as shown in FIGS. 6(B), (C), and (D), among the plurality of columns of the ventilation holes 313, the portion of the electronic component 2 corresponding to the most protruding peak portion of the holding surface 311 first contacts the substrate W, and the negative pressure (white arrow in the figure) is sequentially switched to the positive pressure (black arrow in the figure) from the column of this peak portion to the adjacent column. As a result, the curved electronic component 2 gradually detaches from the peak portion toward the outside and follows the flat surface of the substrate W, so that the air bubbles are excluded to the outside while being mounted on the substrate W. After the mounting, as shown in FIG. 6(E), the mounting tool 31 rises and retracts from the substrate W leaving the electronic component 2 (step S08).

[0047] [Effect] (1) This embodiment is a mounting tool 31 for mounting the electronic component 2 on the substrate W, which includes a holding surface 311 that protrudes so that the electronic component 2 contacts it in a curved manner, a plurality of openings 312 provided in the holding surface 311, and a ventilation hole 313 that communicates with the opening 312, holds the electronic component 2 on the holding surface 311 by negative pressure, and detaches the electronic component 2 from the holding surface 311 by sequentially changing to positive pressure from a part.

[0048] Further, the mounting apparatus 1 of this embodiment has a mounting tool 31, a tool moving mechanism 32 that reciprocates the mounting tool 31 between a delivery position and a mounting position and raises and lowers it at the delivery position and the mounting position, a detection unit 322a that detects the contact pressure on the mounting tool 31, and a switching unit that switches the negative pressure and the positive pressure on the ventilation hole 313 of the mounting tool 31 when the detection unit 322a detects the contact.

[0049] Therefore, from the state where the electronic component 2 is curved and held on the holding surface 311 by negative pressure, by sequentially setting the ventilation holes to positive pressure, while the electronic component 2 becomes flat following the substrate W, it is mounted while bubbles are discharged. Thereby, it is possible to suppress the remaining of bubbles between the electronic component 2 and the substrate W, and reduce mounting defects. Since it is mounted using the restoration of the curvature of the electronic component 2 itself, the pressing force acts uniformly without being biased, and it is possible to uniformly extrude the bubbles and also reduce the breakage of the electronic component 2.

[0050] (2) The plurality of openings 312 are formed arranged in a plurality of rows. For this reason, by sequentially switching the negative pressure to positive pressure for each row, it is possible to prevent an excessive force from being applied to a part of the electronic component 2 and to mount it after returning the curvature to flatness.

[0051] (3) Among the plurality of ventilation holes 313, the ventilation holes 313 adjacent to the ventilation hole 313 closest to the most protruding peak portion of the holding surface 311 are sequentially set to positive pressure. For this reason, it is possible to discharge the bubbles by gradually bringing the substrate W into contact with the outer edge starting from the portion where the electronic component 2 first contacts the substrate W. By making each row parallel to the short side direction, it is possible to cause curvature in the long side direction in which the rectangular electronic component 2 is likely to be deformed.

[0052] (3) The holding surface 311 is in a corrugated shape. Therefore, with the central peak portion in between, as the substrate W gradually becomes flat toward the outer edges on both sides, the distance for the electronic component 2 to come into contact with the substrate W while the curvature returns to flat from the center of the electronic component 2 can be made short, so there is also little risk of entraining air bubbles. Further, by forming a corrugated shape on the long side of the holding surface 311 and setting the ridge line connecting the peak portions in the short side direction, curvature is generated in the long side direction of the electronic component 2, so the electronic component 2 is likely to follow the holding surface 311. Note that the ridge line connecting the peak portions can also be provided on any side of the holding surface 311. For example, when a ridge line is provided on one of the short sides at one end, by sequentially applying a positive pressure from one end toward the other end, the electronic component 2 comes into contact with the substrate W from one end toward the other end. Even in this case, the effect of reducing damage to the electronic component 2 while eliminating air bubbles can be obtained. The risk of damage is further reduced because the electronic component 2 does not bend. For example, when the rows of openings 312 are provided as shown in FIG. 3(C), the pressure is switched from negative pressure to positive pressure in order from the row [3] on one end side, to the row [2], the row [1], the row [2] on the other end side, and the row [3].

[0053] [Modification Example] The following modification examples are also applicable to the present embodiment. (1) The holding surface 311 may be a curved surface. For example, as shown in FIG. 7, the holding surface 311 may have a shape that bulges like a part of the side surface of a cylinder. Here, a part of the side surface of a cylinder as referred to herein also includes cases where the cross section is a part of a cylindrical body having a circular, elliptical, rounded rectangular, or track-shaped cross section. Thereby, the curvature of the electronic component 2 becomes gentle, and the influence on the electronic component 2 can be suppressed. In the above aspect, the opening 312 is provided in the ridge line portion connecting the peak portions. However, the opening 312 does not necessarily have to be provided on the ridge line and may be provided in the vicinity thereof. Among the air holes 313 of each opening 312, by sequentially changing from negative pressure to positive pressure starting from the place close to the ridge line, the same effect as above can be obtained. Also, even in the case of such a curved surface, the ridge line portion can be provided on any side of the holding surface 311.

[0054] (2) When the mounting tool 31 receives the electronic component 2 from the pickup nozzle 21, some of the vent holes 313 on the holding surface 311 may be sequentially set to negative pressure in the adjacent vent holes 313. That is, when the mounting tool 31 receives the electronic component 2, if the electronic component 2 tries to bend along the holding surface 311 but part of it floats or shifts, problems such as the position recognition of the electronic component 2 becoming impossible may occur. Also, if an attempt is made to mount the electronic component 2 with floating or shifting remaining, when moving away from the ridge line along the outer edge, a timing deviation may occur and there is a possibility of entrapping air bubbles.

[0055] For example, among the plurality of vent holes 313, it is preferable to sequentially set the adjacent vent holes 313 to negative pressure starting from the vent hole 313 closest to the most prominent peak portion of the holding surface 311. More specifically, as shown in FIG. 8(A), when the holding surface 311 of the mounting tool 31 approaches the electronic component 2 and the detection unit 322a detects contact, as shown in FIGS. 8(B) to (D), starting from the column [1] of the opening 312, the columns [2] and [3] (see FIG. 3(B)) are sequentially set to negative pressure. Thereby, while gradually bending the electronic component 2 along the holding surface 311, the mounting tool 31 can receive the electronic component 2 from the pickup nozzle 21, so floating and shifting are suppressed and the problem of impossible position recognition can be prevented. Also, since floating and shifting are reduced, when mounting the electronic component 2, it is difficult for a deviation in the detachment timing to occur, and the possibility of entrapping air bubbles can be reduced.

[0056] [Other Embodiments] The present invention is not limited to the above-described embodiments, but also includes other embodiments shown below. Further, the present invention also includes forms in which all or any combination of the above-described embodiments and the following other embodiments are combined. Furthermore, within the scope not departing from the scope of the invention, various omissions, replacements, and changes can be made, and such modifications are also included in the present invention.

Explanation of Reference Numerals

[0057] 1 Mounting device 2 Electronic component 10 Supply device 11 Sheet 12 Supply stage 13 Stage moving mechanism 20 Pickup device 21 Pickup nozzle 21b Nozzle hole 22 Nozzle moving mechanism 23 Direction changing part 24 Pushing pin 30 Mounting device 31 Mounting tool 32 Tool moving mechanism 50 Control device 51 Supply device control unit 52 Pushing pin control unit 53 Pickup nozzle control unit 54 Mounting tool control unit 56 Substrate stage control unit 57 Memory unit 60 Substrate stage 61 Stage moving mechanism 221 Slide mechanism 221a Support frame 221b Rail 221c Slider 222 Lifting mechanism 241 Backup body 311 Holding surface 312 Opening 313 Vent hole 321 Slide mechanism 321a Support frame 321b Rail 321c Slider 322 Lifting mechanism 322a Detection unit

Claims

1. A mounting tool for mounting electronic components on a substrate, comprising: a holding surface that is raised so that the electronic component is curved and comes into contact with the holding surface; A plurality of openings provided on the holding surface; an air vent that communicates with the opening and holds the electronic component on the holding surface by making the internal pressure negative and sequentially makes a portion of the electronic component positive, thereby removing the electronic component from the holding surface; An implementation tool comprising:

2. 2. The method according to claim 1, wherein the plurality of openings are arranged in a plurality of rows. Implementation tools.

3. 3. The mounting tool according to claim 1, wherein the holding surface is angled.

4. 3. The mounting tool according to claim 1, wherein the holding surface is a curved surface.

5. A mounting tool according to any one of claims 1 to 4, a tool moving mechanism for moving the mounting tool back and forth between a transfer position and a mounting position and for raising and lowering the mounting tool at the transfer position and the mounting position; A detection unit that detects contact with the mounting tool; a switching unit that switches between negative pressure and positive pressure applied to the vent hole of the mounting tool when the detection unit detects contact; A mounting device comprising:

6. 6. The mounting device according to claim 5, wherein the positive pressure is applied to the adjacent vent holes in sequence starting from the vent hole closest to the most elevated ridge portion of the holding surface.

7. 6. The mounting device according to claim 5, wherein the negative pressure is sequentially applied to adjacent vent holes, starting from the vent hole closest to the most elevated ridge portion of the holding surface.

Images