Component crimping device and component crimping method

Abstract

To provide a component crimping device capable of simplifying a device construction.SOLUTION: A component crimping device 100 comprises: a first under-receiving part 46L; a second under-receiving part 46R; a crimping tool 44; a first cleaning tool 71L that is for cleaning the first under-receiving part 46L; a second cleaning tool 71R that is for cleaning the second under-receiving part 46R; a coupling member 74 that couples the first cleaning tool 71L and the second cleaning tool 71R; and a tool movement mechanism 75 that moves the coupling member 74 to slit the first cleaning tool 71L and the second cleaning tool 71R to the first under-receiving part 46L and the second under-receiving part 46R, and is moved along a distribution direction of the first under-receiving part 46L and the second under-receiving part 46R.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present disclosure relates to a component crimping device for crimping components onto a substrate and the like.

Background Art

[0002] Conventionally, there has been provided a component crimping device for crimping electronic components (hereinafter simply referred to as "components") onto a panel such as a liquid crystal panel (see Patent Documents 1 and 2). This component crimping device crimps a component onto an end portion of a liquid crystal panel via an anisotropic conductive film (ACF) which is an anisotropic conductive member. That is, an ACF is adhered as an adhesive member to the end portion of the liquid crystal panel. The component crimping device mounts a component on the portion of the liquid crystal panel to which the ACF is adhered and crimps it onto the liquid crystal panel.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, the component crimping devices of Patent Documents 1 and 2 above have a problem that the device configuration may become complicated.

[0005] Therefore, the present disclosure provides a component crimping device and the like capable of simplifying the device configuration.

Means for Solving the Problems

[0006] A component crimping device according to one aspect of the present disclosure includes a first lower receiving portion that supports a first substrate from below, a second lower receiving portion that supports a second substrate from below, at least one crimping tool that crimps a component onto the first substrate and the second substrate supported by the first lower receiving portion and the second lower receiving portion, a first cleaning tool for cleaning the first lower receiving portion, a second cleaning tool for cleaning the second lower receiving portion, a connecting member that connects the first cleaning tool and the second cleaning tool, and a tool moving mechanism that moves the first cleaning tool and the second cleaning tool along the arrangement direction of the first lower receiving portion and the second lower receiving portion while rubbing the first lower receiving portion and the second lower receiving portion.

[0007] These general or specific aspects may be implemented in a system, method, integrated circuit, computer program, or a recording medium such as a computer-readable CD-ROM, or may be implemented in any combination of a system, method, integrated circuit, computer program, and recording medium. The recording medium may also be a non-transitory recording medium.

Advantages of the Invention

[0008] The component crimping device of the present disclosure can simplify the configuration.

[0009] Furthermore, additional advantages and effects in one aspect of the present disclosure will be clarified from the specification and drawings. Such advantages and / or effects are provided by some embodiments and the configurations described in the specification and drawings, but not necessarily all configurations are required.

Brief Description of the Drawings

[0010]

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Embodiments for Carrying Out the Invention

[0011] (Knowledge on which the present disclosure is based) The inventor has found that the following problems occur with respect to the component crimping devices of Patent Documents 1 and 2 described in the "Background Art" section.

[0012] For crimping components to a panel such as a liquid crystal panel or an organic EL (electro-luminescence) panel, like the component crimping device of Patent Document 1 above, a backup unit and a bonder are used. The backup unit, also called a backup stage or a lower receiving part, supports the end of the panel from below. The bonder, also called a crimping tool, crimps a component to the end of the panel supported by the backup stage via an ACF.

[0013] Here, particles of each member may adhere as foreign matter to the backup stage. Examples of foreign matter include glass fragments of a liquid crystal panel or fragments of an ACF. The adhesion of such foreign matter greatly affects the quality of the product produced by crimping the component to the panel.

[0014] Therefore, the component crimping device of Patent Document 1 includes a cleaning brush and moves the brush along the longitudinal direction of the backup stage. Thereby, foreign matter adhering to the backup stage is removed. Further, the component crimping device includes a suction unit that sucks foreign matter discharged by the brush.

[0015] The component crimping device (specifically, an electronic component crimping device) of Patent Document 2 includes a rotary brush and cleans the backup stage with the rotary brush. Thereby, foreign matter adhering to the backup stage is scraped off. Further, the component crimping device includes a suction unit that sucks foreign matter scraped off by the rotary brush.

[0016] Here, the component crimping device may include two backup stages. In such a case, in the component crimping devices of Patent Document 1 and Patent Document 2, it is necessary to provide two mechanisms for moving the brush with respect to each backup stage. As a result, the number of components of the component crimping device increases, and the device configuration may become complicated. Therefore, there is a possibility that the cost of the component crimping device increases. Further, it is necessary to secure sufficient space for arranging these mechanisms in the component crimping device, which makes it difficult to save space.

[0017] In order to solve such problems, a component crimping device according to a first aspect of the present disclosure includes a first lower receiving portion that supports a first substrate from below, a second lower receiving portion that supports a second substrate from below, at least one crimping tool that crimps a component to the first substrate and the second substrate supported by the first lower receiving portion and the second lower receiving portion, a first cleaning tool for cleaning the first lower receiving portion, a second cleaning tool for cleaning the second lower receiving portion, a connecting member that connects the first cleaning tool and the second cleaning tool, and a tool moving mechanism that moves the first cleaning tool and the second cleaning tool along the arrangement direction of the first lower receiving portion and the second lower receiving portion while rubbing the first lower receiving portion and the second lower receiving portion by moving the connecting member.

[0018] As a result, when the tool moving mechanism moves the connecting member, the first cleaning tool and the second cleaning tool move in the arrangement direction of the first lower receiving portion and the second lower receiving portion while rubbing against the first lower receiving portion and the second lower receiving portion. As a result, the first cleaning tool and the second cleaning tool can be interlocked. Therefore, it is not necessary to provide two tool moving mechanisms for individually moving the first cleaning tool for the first lower receiving portion and the second cleaning tool for the second lower receiving portion in the component crimping device. Therefore, the number of components of the component crimping device can be reduced, and the device configuration can be simplified. Furthermore, an increase in the cost of the component crimping device can be suppressed, and space saving of the component crimping device can be easily achieved.

[0019] In addition, in the component crimping device according to the second aspect, the tool moving mechanism may move the first cleaning tool and the second cleaning tool in the same direction in the arrangement direction. Note that the component crimping device according to the second aspect may be subordinate to the first aspect.

[0020] As a result, since the first cleaning tool and the second cleaning tool move in the same direction, the space between the first lower receiving portion and the second lower receiving portion can be narrowed. For example, when the first cleaning tool and the second cleaning tool move in opposite directions, it is necessary to secure a wide space where these cleaning tools gather between the first lower receiving portion and the second lower receiving portion. However, in the second aspect, since the first cleaning tool and the second cleaning tool do not gather, it is not necessary to secure such a wide space. Therefore, the degree of freedom in the layout of the first lower receiving portion and the second lower receiving portion can be increased.

[0021] In addition, in the component crimping device according to the third aspect, the tool moving mechanism may move the first cleaning tool and the second cleaning tool in the same direction in the arrangement direction by sliding the connecting member. Note that the component crimping device according to the third aspect may be subordinate to the second aspect. Note that the connecting member may be a shaft, a cylinder, or the like.

[0022] As a result, the tool moving mechanism can move the first cleaning tool and the second cleaning tool with a simple operation. Therefore, there is a possibility that the configuration of the tool moving mechanism can be simplified.

[0023] Further, in the component crimping device according to the fourth aspect, the connecting member is a belt, the first cleaning tool and the second cleaning tool are fastened to the belt so as to be arranged along the arrangement direction, and the tool moving mechanism may move the first cleaning tool and the second cleaning tool in the same direction in the arrangement direction by sliding the belt in the arrangement direction. Note that the component crimping device according to the fourth aspect may be subordinate to the second aspect or the third aspect.

[0024] As a result, the first cleaning tool and the second cleaning tool can be appropriately moved in the same direction, and effective cleaning of the first lower receiving portion and the second lower receiving portion can be performed.

[0025] Further, in the component crimping device according to the fifth aspect, the component crimping device further includes a first foreign matter removing portion for removing foreign matter adhering to the first cleaning tool and a second foreign matter removing portion for removing foreign matter adhering to the second cleaning tool, the first foreign matter removing portion is disposed on one side of the two directions in the arrangement direction rather than the first lower receiving portion, and the second foreign matter removing portion may be disposed on the one side rather than the second lower receiving portion. Note that the component crimping device according to the fifth aspect may be subordinate to any one of the second aspect to the fourth aspect.

[0026] As a result, the foreign matter adhering to the first cleaning tool and the second cleaning tool moving to one side in the above-described arrangement direction can be appropriately removed by the first foreign matter removing portion and the second foreign matter removing portion.

[0027] Further, in the component crimping device according to the sixth aspect, the tool moving mechanism may move the first cleaning tool and the second cleaning tool in opposite directions in the arrangement direction. Note that the component crimping device according to the sixth aspect may be subordinate to the first aspect.

[0028] As a result, the first cleaning tool and the second cleaning tool may gather, and thus, at the timing when they gather, processes such as foreign matter removal for the first cleaning tool and the second cleaning tool can be effectively performed.

[0029] Further, in the component crimping device according to the seventh aspect, the connecting member is an annular belt, the first cleaning tool is fastened to a first portion of the belt that moves in a first direction in the arrangement direction by the circulation of the belt, the second cleaning tool is fastened to a second portion of the belt that moves in a second direction in the arrangement direction by the circulation of the belt, the second direction is opposite to the first direction, and the tool moving mechanism may move the first cleaning tool and the second cleaning tool in opposite directions in the arrangement direction by circulating the belt. Note that the component crimping device according to the seventh aspect may be subordinate to the sixth aspect.

[0030] As a result, the first cleaning tool and the second cleaning tool can be easily and appropriately moved in opposite directions, and effective cleaning of the first lower receiving portion and the second lower receiving portion can be performed.

[0031] Further, the component crimping device according to the eighth aspect further includes a foreign matter removing portion for removing foreign matter adhering to the first cleaning tool and the second cleaning tool, and the foreign matter removing portion may be disposed between the first lower receiving portion and the second lower receiving portion. Note that the component crimping device according to the eighth aspect may be subordinate to the sixth aspect or the seventh aspect.

[0032] As a result, since the cleaning tool and the second cleaning tool that move in opposite directions to each other gather between the first lower receiving portion and the second lower receiving portion, foreign matter removal for these cleaning tools can be effectively performed. In addition, it is not necessary to separately arrange the foreign matter removal portion for the first cleaning tool and the foreign matter removal portion for the second cleaning tool, and they can be integrally configured. As a result, the apparatus configuration can be further simplified and further space saving can be achieved.

[0033] Hereinafter, embodiments will be specifically described with reference to the drawings.

[0034] Note that each of the embodiments described below shows general or specific examples. The numerical values, shapes, materials, components, arrangement positions and connection forms of the components, steps, order of steps, etc. shown in the following embodiments are merely examples and are not intended to limit the present disclosure. In addition, among the components in the following embodiments, components not described in the independent claims indicating the most general concept are described as optional components. Each drawing is a schematic diagram and is not necessarily drawn precisely. Also, in each drawing, the same constituent members are denoted by the same reference numerals.

[0035] (Embodiment) [Schematic Configuration of Component Mounting Line] FIG. 1 is a diagram showing a schematic configuration of a component mounting line in the present embodiment.

[0036] The component mounting line 1 in the present embodiment is a system for producing a product such as a liquid crystal display by mounting a component 5 on a substrate 3 such as a liquid crystal panel. Note that the component 5 is an electronic component such as a drive circuit, for example. Specifically, as shown in FIG. 1, the component mounting line 1 includes a substrate loading unit 10, an adhering unit 20, a temporary crimping unit 30, a main crimping unit 40, and a substrate unloading unit 50. The substrate loading unit 10, the adhering unit 20, the temporary crimping unit 30, the main crimping unit 40, and the substrate unloading unit 50 are connected in this order.

[0037] The substrate loading unit 10 receives the rectangular substrate 3 carried in by an operator or another device on the upstream side. Then, the substrate 3 is carried out to the downstream adhering unit 20.

[0038] The adhering unit 20 receives the substrate 3 carried out from the substrate loading unit 10, and adheres an adhesive member to each of a plurality of electrode portions 4 on the periphery of the substrate 3. Then, the substrate 3 with the adhesive member adhered thereto is carried out to the temporary crimping unit 30. Each of the plurality of electrode portions 4 is constituted by, for example, a plurality of electrodes.

[0039] The temporary crimping unit 30 receives the substrate 3 carried out from the adhering unit 20, mounts the component 5 on the portion of the substrate 3 where the adhesive member is adhered, and performs temporary crimping. Then, the substrate 3 with the component 5 temporarily crimped thereon is carried out to the main crimping unit 40.

[0040] The main crimping unit 40 receives the substrate 3 carried out from the temporary crimping unit 30, and performs main crimping (also referred to as thermal crimping) on the component 5 temporarily crimped on the substrate 3. Then, the substrate 3 on which the main crimping has been performed is carried out to the substrate unloading unit 50.

[0041] The substrate unloading unit 50 receives the substrate 3 carried out from the main crimping unit 40. The substrate 3 received by the substrate unloading unit 50 is carried out downstream.

[0042] In this way, the component mounting line 1 executes a component mounting operation of mounting the component 5 on each of a plurality of electrode portions 4 provided on the periphery of the loaded substrate 3, and unloads the substrate 3 on which the component 5 is mounted from the substrate unloading unit 50.

[0043] [Detailed Configuration of Component Mounting Line] FIG. 2 is a plan view of the component mounting line 1 in the present embodiment. Specifically, FIG. 2 shows the configuration of the component mounting line 1 as viewed from above. In the present embodiment, the conveyance direction of the substrate is referred to as the X-axis direction, the vertical direction is referred to as the Z-axis direction, and the direction perpendicular to the X-axis direction and the Z-axis direction, that is, the depth direction, is referred to as the Y-axis direction. Also, the negative side and the positive side in the X-axis direction correspond to the upstream side and the downstream side in the conveyance direction of the substrate, respectively, the negative side and the positive side in the Z-axis direction correspond to the lower side and the upper side in the vertical direction, respectively, and the negative side and the positive side in the Y-axis direction correspond to the front side and the back side in the depth direction, or the front side and the rear side, respectively.

[0044] The substrate loading unit 10 includes a base 1a for placing the loaded substrate 3. A stage 11 on which the substrate 3 is placed is provided on the base 1a of the substrate loading unit 10. The stage 11 moves up and down in the Z-axis direction with respect to the base 1a. Further, a plurality of suction holes 11a are provided on the upper surface of the stage 11. Such a stage 11 vacuum-sucks and holds the substrate 3 carried in by an operator or another device on the upstream side and placed on the stage 11 from the suction holes 11a by a suction device such as a pump (not shown).

[0045] The sticking unit 20 has a function of performing a sticking operation (in other words, a sticking process) of sticking an ACF, which is an adhesive member, to the electrode portion 4 of the substrate 3. The sticking unit 20 includes a substrate moving mechanism 21 and a sticking mechanism 22.

[0046] The substrate moving mechanism 21 is a mechanism for moving the substrate 3. The substrate moving mechanism 21 includes, for example, an X-axis table movable in the X-axis direction, a Y-axis table movable in the Y-axis direction, a Z-axis table movable in the Z-axis direction, and a stage 23. On the base 1b, an X-axis table, a Y-axis table, a Z-axis table, and a stage 23 are provided in this order from below in a stacked manner in the substrate moving mechanism 21.

[0047] The Y-axis table is provided extending in the Y-axis direction and can freely move on the X-axis table in the X-axis direction. The Z-axis table can freely move on the Y-axis table in the Y-axis direction, raises and lowers the stage 23 provided on the upper part in the Z-axis direction, and rotates around the Z-axis.

[0048] Also, a plurality of suction holes 23a are provided on the upper surface of the stage 23, and the stage 23 vacuum-sucks and holds the substrate 3 placed on its upper surface. In this way, the substrate moving mechanism 21 sucks and holds the substrate 3 and moves it in the horizontal plane (specifically, in the X-axis direction and the Y-axis direction), raises and lowers it in the vertical direction (specifically, in the Z-axis direction), and rotates it around the Z-axis.

[0049] The bonding mechanism 22 includes, for example, two bonding heads arranged in the X-axis direction above the base 1b. Each bonding head includes a supply unit for supplying ACF and a bonding tool for bonding the ACF to the substrate 3. Each of the two bonding heads bonds the ACF at positions corresponding to a plurality of electrode portions 4 on the substrate 3. Also, a bonding support base is provided at a position below each of the two bonding heads.

[0050] The temporary bonding unit 30 executes a temporary bonding process of mounting the component 5 on the region where the ACF of the substrate 3 is bonded (i.e., the bonding target site) and performing temporary bonding. The temporary bonding unit 30 includes a substrate moving mechanism 31, a component mounting mechanism 32, a component supply unit 33, and a component transfer unit 35.

[0051] The substrate moving mechanism 31 has the same structure as the substrate moving mechanism 21 of the adhering part 20. Specifically, the substrate moving mechanism 31 has a stage 37 for holding the substrate 3. A plurality of suction holes 37a are provided on the upper surface of the stage 37. The substrate moving mechanism 31 vacuum-sucks and holds the substrate 3 placed on the stage 37 by the plurality of suction holes 37a. Further, the substrate moving mechanism 31 has a function of moving the stage 37 that sucks and holds the substrate 3 in the horizontal plane, raising and lowering it in the vertical direction, and rotating it around the Z axis. The substrate moving mechanism 31 positions the area where the ACF of the substrate 3 held by suction is adhered above the lower receiving part 36, which is the backup stage of the component mounting mechanism 32, by moving and rotating the stage 37. In the example of FIG. 2, one stage 37 is shown, but the substrate moving mechanism 31 in the present embodiment may include two stages 37.

[0052] The component supply unit 33 is provided so as to project from the rear part of the base 1b to the back side (i.e., the positive side in the Y-axis direction) of the component mounting mechanism 32. For example, the component supply unit 33 includes a supply reel 33a around which a strip-shaped component storage body such as a TCP (Tape carrier package) is wound, a punching part 33b, a movable stage 33c, and a rail 33d. Such a component supply unit 33 sequentially supplies the components 5 from the strip-shaped component storage body by the movement of these components.

[0053] The component transfer unit 35 moves the component 5 supplied from the component supply unit 33 to the side of the crimping tool 34 included in the component mounting mechanism 32.

[0054] The component mounting mechanism 32 is provided on the base 1b and includes a crimping tool 34 and a lower receiving part 36.

[0055] The lower receiving part 36 is a long-shaped member that supports the crimping target part, which is a predetermined part on the substrate 3 held by the stage 37, from below. Note that this crimping target part is the part on the substrate 3 where the ACF is adhered.

[0056] The crimping tool 34 holds the component 5 and crimps the component 5 onto the crimping target site supported by the lower receiving portion 36. Specifically, the crimping tool 34 moves up and down in the Z-axis direction and adsorbs (i.e., picks up) the component 5 transferred by the component transfer portion 35 from above. Then, the crimping tool 34 mounts the adsorbed component 5 on the ACF and presses the entire substrate 3 against the lower receiving portion 36, thereby temporarily crimping the component 5 onto the substrate 3. Note that the temporary crimping portion 30 may include a mechanism for rotating the direction of the substrate 3 held by the substrate moving mechanism 31 by 90 degrees. In the example of FIG. 2, one crimping tool 34 is shown, but the component mounting mechanism 32 in the present embodiment may include two or more crimping tools 34.

[0057] This crimping portion 40 performs a main crimping process (i.e., a thermocompression bonding process) of thermocompression bonding (i.e., main crimping) the component 5 temporarily crimped onto the substrate 3 by the temporary crimping portion 30 to the substrate 3. By doing so, the electrode portion 4 formed on the substrate 3 and the component 5 are electrically connected via the ACF. Such a main crimping portion 40 includes a substrate moving mechanism 41, a crimping mechanism 42, and a cleaning mechanism 70.

[0058] The substrate moving mechanism 41 has the same structure as the substrate moving mechanism 21 of the sticking portion 20. Specifically, the substrate moving mechanism 41 has a stage 49. In the example of FIG. 2, one stage 49 is shown, but the substrate moving mechanism 41 in the present embodiment may include two stages 49. A plurality of suction holes 49a are provided on the upper surface of the stage 49. The substrate moving mechanism 41 vacuum-suction holds the substrate 3 placed on the stage 49 by the plurality of suction holes 49a. Further, the substrate moving mechanism 41 has a function of moving the stage 49 that suction-holds the substrate 3 in the horizontal plane, raising and lowering it in the vertical direction, and rotating it around the Z-axis. The substrate moving mechanism 41 positions the region where the component 5 of the substrate 3 held by suction is temporarily crimped above the lower receiving portion 46 of the crimping mechanism 42 by the movement and rotation of the stage 49.

[0059] The crimping mechanism 42 is provided on the base 1b and includes two crimping tools 44 and a lower receiving portion 46. The heated crimping tool 44 presses the component 5 of the substrate 3 toward the lower receiving portion 46 side. As a result, the component 5 is firmly crimped, and the electrode portion 4 formed on the substrate 3 and the component 5 are electrically connected via the ACF. In the example of FIG. 2, two crimping tools 44 are shown, but the crimping mechanism 42 in the present embodiment may include one crimping tool 44. Further, in the present embodiment, the lower receiving portion 46 included in the crimping mechanism 42 is composed of a first lower receiving portion and a second lower receiving portion, as will be described later.

[0060] The cleaning mechanism 70 cleans the lower receiving portion 46 included in the crimping mechanism 42.

[0061] The substrate unloading unit 50 has a function of vacuum-sucking and holding the substrate 3 conveyed from the main crimping unit 40 on the stage 51. The substrate 3 held in the substrate unloading unit 50 is unloaded to another device on the downstream side or taken out from the stage 51 by an operator.

[0062] The stage 51 moves up and down in the Z-axis direction with respect to the base 1c. Further, a plurality of suction holes 51a are provided on the upper surface of the stage 51, and the stage 51 vacuum-sucks and holds the substrate 3 transferred from the main crimping unit 40 on its upper surface.

[0063] The conveying unit 60 is a device that conveys the substrate 3. Specifically, the conveying unit 60 has a function of delivering (transferring) the substrate 3 carried into the substrate loading unit 10 to the sticking unit 20, the temporary crimping unit 30, the main crimping unit 40, and the substrate unloading unit 50 in this order. The conveying unit 60 is arranged in the front region (i.e., the negative side in the Y-axis direction) of the sticking unit 20, the temporary crimping unit 30, and the main crimping unit 40.

[0064] The conveying unit 60 includes a substrate conveying mechanism 62A, a substrate conveying mechanism 62B, a substrate conveying mechanism 62C, and a substrate conveying mechanism 62D, which are arranged in order from the upstream side on a moving base 61 extending in the X-axis direction across the base 1a, the base 1b, and the base 1c.

[0065] The substrate transfer mechanisms 62A to 62D each include a base 63 and one or more arm units 64. In the present embodiment, the case where the substrate transfer mechanisms 62A to 62D each include two arm units 64 is illustrated.

[0066] The base 63 is provided on the moving base 61 and is movable freely in the X-axis direction. On the base 63, two arm units 64 are provided side by side in the X-axis direction. The arm unit 64 vacuum-sucks the substrate 3 from above.

[0067] Each of the substrate transfer mechanisms 62A to 62D moves to a substrate transfer position where it vacuum-sucks the substrate 3 held by the stages 11, 23, 37, 49, 51 from above, and receives or transfers the substrate 3 from / to the elevating stages 11, 23, 37, 49, 51. For example, the substrate transfer mechanism 62A receives the substrate 3 placed on the stage 11 of the substrate loading section 10 and transfers it to the stage 23 of the sticking section 20. Also, for example, the substrate transfer mechanism 62B receives the substrate 3 from the stage 23 of the sticking section 20 and transfers it to the stage 37 of the temporary pressure bonding section 30. Also, for example, the substrate transfer mechanism 62C receives the substrate 3 from the stage 37 of the temporary pressure bonding section 30 and transfers it to the stage 49 of the main pressure bonding section 40. Also, for example, the substrate transfer mechanism 62D receives the substrate 3 from the stage 49 of the main pressure bonding section 40 and transfers it to the stage 51 of the substrate unloading section 50.

[0068] FIG. 3 is a diagram showing a computer provided in the component mounting line 1 and each component controlled by the computer.

[0069] As shown in FIG. 3, the component mounting line 1 includes a computer 2. This computer 2 is communicably connected to, for example, the sticking section 20, the temporary pressure bonding section 30, the main pressure bonding section 40, and the transfer section 60 by, for example, control lines, and controls each of these sections. The computer 2 includes a control section 2a and a storage section 2b.

[0070] The storage unit 2b stores various data necessary for component mounting operations such as the size of the substrate 3, the types of components 5 mounted on the substrate 3, the mounting positions, the mounting directions, and the timing of transferring the substrate 3, as well as control programs executed by the control unit 2a. The storage unit 2b is realized by a ROM (Read Only Memory) or a RAM (Random Access Memory) or the like.

[0071] The control unit 2a controls the substrate moving mechanism 21 of the sticking unit 20, the substrate moving mechanism 31 of the temporary crimping unit 30, the substrate moving mechanism 41 of the main crimping unit 40, and the conveying unit 60 to execute a substrate transfer operation for transferring the substrate 3 between each part to the next process. The transfer of the substrate 3 from the upstream side to the downstream side in the substrate transfer operation is performed synchronously between each part.

[0072] For example, by controlling the sticking unit 20, the control unit 2a changes the orientation and position of the substrate 3 held by the substrate moving mechanism 21, changes the interval between a plurality of sticking heads by the head moving motor, and causes the sticking unit 20 to execute a sticking operation of sticking ACF to the substrate 3 by the sticking mechanism 22.

[0073] Also, for example, by controlling the temporary crimping unit 30, the control unit 2a changes the orientation and position of the substrate 3 held by the substrate moving mechanism 31 and causes the component mounting mechanism 32 to perform temporary crimping of the component 5 onto the substrate 3. Further, the control unit 2a moves the component 5 temporarily crimped onto the substrate 3 to the side of the component mounting mechanism 32 by controlling the component supply unit 33 and the component transfer unit 35.

[0074] Also, for example, by controlling the main crimping unit 40, the control unit 2a changes the orientation and position of the substrate 3 held by the substrate moving mechanism 41 and causes the crimping mechanism 42 to perform main crimping on the component 5 temporarily crimped onto the substrate 3. Furthermore, the control unit 2a controls the cleaning mechanism 70 to cause the cleaning mechanism 70 to clean the receiving portion 46 of the crimping mechanism 42.

[0075] Such a control unit 2a is realized by, for example, a control program stored in a storage unit 2b for controlling each part and each mechanism of the component mounting line 1 and a processor such as a CPU (Central Processing Unit) that executes the control program.

[0076] [Configuration of Component Crimping Device] FIG. 4 is a block diagram showing the functional configuration of the component crimping device 100 in the present embodiment.

[0077] The component crimping device 100 is composed of, for example, a main crimping unit 40 in the component mounting line 1 and a control unit 2a of the computer 2.

[0078] Specifically, the component crimping device 100 includes a control unit 2a, a crimping tool 44, a lower receiving part 46, a substrate moving mechanism 41, and a cleaning mechanism 70. Here, the lower receiving part 46 in the present embodiment is composed of a first lower receiving part 46L and a second lower receiving part 46R that are arranged apart from each other.

[0079] The control unit 2a controls the crimping tool 44, the substrate moving mechanism 41, and the cleaning mechanism 70.

[0080] The cleaning mechanism 70 includes a first cleaning tool 71L, a second cleaning tool 71R, a connecting member 74, a tool moving mechanism 75, and a foreign matter removing unit 73. Each of the first cleaning tool 71L and the second cleaning tool 71R is, for example, a brush. The connecting member 74 is a member that connects the first cleaning tool 71L and the second cleaning tool 71R. The tool moving mechanism 75 is a mechanism that moves the first cleaning tool 71L and the second cleaning tool 71R by moving the connecting member 74. The foreign matter removing unit 73 removes foreign matter adhering to the first cleaning tool 71L and the second cleaning tool 71R. For example, the foreign matter removing unit 73 removes the foreign matter by suction. The tool moving mechanism 75 and the foreign matter removing unit 73 move the first cleaning tool 71L and the second cleaning tool 71R according to the control by the control unit 2a to clean the first lower receiving portion 46L and the second lower receiving portion 46R, and remove the foreign matter adhering to the first cleaning tool 71L and the second cleaning tool 71R by the cleaning. For example, the control unit 2a causes the cleaning mechanism 70 to perform cleaning periodically. Specifically, each time the substrate 3 is carried into the main crimping portion 40, the control unit 2a causes the cleaning mechanism 70 to clean the lower receiving portion 46 before the substrate 3 is supported by the lower receiving portion 46. Alternatively, the control unit 2a may cause the cleaning mechanism 70 to perform the cleaning each time the main crimping of the component 5 on N (N is an integer of 2 or more) substrates 3 is completed. Thereby, for example, it is possible to save the labor of manually cleaning the lower receiving portion 46 by stopping the operation of the component crimping device 100 intentionally. That is, cleaning can be performed during production, and continuous operation of the component crimping device 100 can be enabled.

[0081] [Cleaning mechanism] FIG. 5 is a diagram showing an example of a series of processing operations of the cleaning process of the lower receiving portion 46 and the main crimping process of the component 5.

[0082] In the present embodiment, the first lower receiving portion 46L and the second lower receiving portion 46R are each formed in a long shape, their longitudinal directions are along the X-axis direction, and they are arranged so as to be arranged in the X-axis direction.

[0083] As shown in FIG. 5(a), for example, the control unit 2a controls the substrate transfer mechanism 41 to adsorb and hold the substrate 3 on each of the two stages 49. The substrate transfer mechanism 41 may move and rotate the two stages 49 individually, or may move and rotate them simultaneously in the same manner.

[0084] Then, in the cleaning process, as shown in FIG. 5(a), for example, the control unit 2a controls the tool transfer mechanism 75 to move the first cleaning tool 71L along the longitudinal direction of the first lower receiving portion 46L while rubbing the first cleaning tool 71L against the support surface 46a of the first lower receiving portion 46L. Further, the control unit 2a controls the tool transfer mechanism 75 to move the second cleaning tool 71R along the longitudinal direction of the second lower receiving portion 46R while rubbing the second cleaning tool 71R against the support surface 46a of the second lower receiving portion 46R. Thereby, the cleaning of the support surface 46a of the first lower receiving portion 46L and the cleaning of the support surface 46a of the second lower receiving portion 46R are performed. Such cleaning of the first lower receiving portion 46L and the second lower receiving portion 46R is performed simultaneously, for example.

[0085] Next, in this crimping process, the control unit 2a controls the substrate transfer mechanism 41 to move the two stages 49 in the positive Y-axis direction, as shown in FIG. 5(b) for example. Then, the control unit 2a places the peripheral edge of the substrate 3 held on one of the two stages 49 on the support surface 46a of the first lower receiving portion 46L. As a result, the peripheral edge of the substrate 3 on the positive Y-axis side is supported from below by the support surface 46a of the first lower receiving portion 46L. Further, the control unit 2a places the peripheral edge of the substrate 3 held on the other of the two stages 49 on the support surface 46a of the second lower receiving portion 46R. As a result, the peripheral edge of the substrate 3 on the positive Y-axis side is supported from below by the support surface 46a of the second lower receiving portion 46R. As a result, the portions where the components 5 of the two substrates 3 are temporarily crimped are supported from below by the support surface 46a of the first lower receiving portion 46L or the second lower receiving portion 46R. Also, the control unit 2a controls the two crimping tools 44 to position each of the two crimping tools 44 above the component 5. For example, the control unit 2a positions one of the two crimping tools 44 above the component 5 temporarily crimped to the substrate 3 supported by the first lower receiving portion 46L, and positions the other above the component 5 temporarily crimped to the substrate 3 supported by the second lower receiving portion 46R.

[0086] Next, as shown in FIG. 5(c) for example, the control unit 2a lowers the two heated crimping tools 44 to press the two components 5 against the two substrates 3. As a result, the two components 5 are permanently crimped.

[0087] FIG. 6 is a diagram showing another example of a series of processing operations of the cleaning process of the lower receiving portion 46 and the permanent crimping process of the component 5.

[0088] The substrate transfer mechanism 41 in the present embodiment may include one stage 49, and the peripheral edge of the substrate 3 adsorbed and held on the stage 49 may be placed on the first lower receiving portion 46L and the second lower receiving portion 46R. Also, the component crimping device 100 may include one crimping tool 44 instead of two crimping tools 44.

[0089] For example, as shown in Fig. 6(a), the control unit 2a controls the substrate moving mechanism 41 to cause the stage 49 to adsorb and hold the substrate 3. Then, in the cleaning process, the control unit 2a controls the tool moving mechanism 75 to move the first cleaning tool 71L along the longitudinal direction of the first lower receiving portion 46L while rubbing the first cleaning tool 71L against the support surface 46a of the first lower receiving portion 46L. Further, the control unit 2a controls the tool moving mechanism 75 to move the second cleaning tool 71R along the longitudinal direction of the second lower receiving portion 46R while rubbing the second cleaning tool 71R against the support surface 46a of the second lower receiving portion 46R. Thereby, the cleaning of the first lower receiving portion 46L and the cleaning of the second lower receiving portion 46R are performed. Such cleaning of the first lower receiving portion 46L and the second lower receiving portion 46R are performed simultaneously, for example.

[0090] Next, in the main crimping process, as shown in Fig. 6(b), the control unit 2a controls the substrate moving mechanism 41 to move the stage 49 of the substrate moving mechanism 41 in the positive Y-axis direction. Then, the control unit 2a places the peripheral portion on the positive Y-axis side of the substrate 3 held by the stage 49 on the support surface 46a of the first lower receiving portion 46L and the support surface 46a of the second lower receiving portion 46R. Thereby, the peripheral portion on the positive Y-axis side of the substrate 3 is supported from below by the respective support surfaces 46a of the first lower receiving portion 46L and the second lower receiving portion 46R. Specifically, the portion where the two components 5 of the substrate 3 are temporarily crimped is supported from below by the support surfaces 46a of the first lower receiving portion 46L and the second lower receiving portion 46R. Further, the control unit 2a controls the crimping tool 44 to place the crimping tool 44 above one of the two components 5.

[0091] Next, as shown in Fig. 6(c), the control unit 2a lowers the heated crimping tool 44 to press the component 5 against the substrate 3. Thereby, the component 5 is main-crimped. The control unit 2a causes the crimping tool 44 to perform the same process on the other component 5.

[0092] FIG. 7 is a diagram showing an example of the shapes of the first cleaning tool 71L and the second cleaning tool 71R in the present embodiment. Note that FIG. 7 shows the states of the first cleaning tool 71L and the second cleaning tool 71R as viewed from the front side. Also, the first cleaning tool 71L and the second cleaning tool 71R may hereinafter be simply collectively referred to as the cleaning tool.

[0093] The first cleaning tool 71L and the second cleaning tool 71R in the present embodiment may have, for example, the same shape. These cleaning tools may have a shape that is, for example, cylindrical as shown in FIG. 7(a), and in which a plurality of bristles extend radially from the center in the XZ plane. Alternatively, the cleaning tool may have the shape shown in FIG. 7(b). In the shape shown in FIG. 7(b), the cleaning tool has a plurality of bristles extending downward in the Z-axis direction and does not have bristles extending upward in the Z-axis direction and bristles extending in the X-axis direction. Also, the cleaning tool may have the shape shown in FIG. 7(c). The shape shown in FIG. 7(c) is a shape that is composed of the lower half in the Z-axis direction of the cleaning tool having the shape shown in FIG. 7(a). When, in the XZ plane, the positive direction in the X-axis direction is defined as 0°, and an angle increasing clockwise from the positive direction is defined, the cleaning tool has a plurality of bristles extending in directions within the range of 0° to 180° from the center.

[0094] These cleaning tools move along the X-axis direction so that the tips of the bristles of the cleaning tools rub against the support surface 46a.

[0095] Note that the first cleaning tool 71L and the second cleaning tool 71R may have different shapes from each other.

[0096] As described above, the component crimping device 100 in the present embodiment includes a first lower receiving portion 46L that supports the first substrate from below, a second lower receiving portion 46R that supports the second substrate from below, at least one crimping tool 44 that crimps the component 5 to the first substrate and the second substrate supported by the first lower receiving portion 46L and the second lower receiving portion 46R, a first cleaning tool 71L for cleaning the first lower receiving portion 46L, and a second cleaning tool 71R for cleaning the second lower receiving portion 46R. The first substrate may be the substrate 3 supported by the first lower receiving portion 46L as shown in FIG. 5, and the second substrate may also be the substrate 3 supported by the second lower receiving portion 46R as shown in FIG. 5. Further, as shown in FIG. 6, the first substrate and the second substrate may be the same substrate 3.

[0097] [Configuration Example 1 of Cleaning Mechanism] FIG. 8 is a diagram showing the schematic configuration and cleaning operation of the cleaning mechanism 70 in Configuration Example 1 of the present embodiment. Note that FIG. 8(a) shows the state of the cleaning mechanism 70 viewed from the negative side in the Y-axis direction, FIG. 8(b) shows the state of the cleaning mechanism 70 viewed from the positive side in the Z-axis direction, and FIG. 8(c) shows the state of the cleaning mechanism 70 viewed from the positive side in the X-axis direction.

[0098] The cleaning mechanism 70 in Configuration Example 1 alternately performs a cleaning operation and a retracting operation. The cleaning operation is an operation performed in the cleaning process. Specifically, the cleaning operation is an operation of moving the first cleaning tool 71L along the longitudinal direction of the first lower receiving portion 46L while rubbing it against the support surface 46a of the first lower receiving portion 46L, and moving the second cleaning tool 71R along the longitudinal direction of the second lower receiving portion 46R while rubbing it against the support surface 46a of the second lower receiving portion 46R. The retracting operation is an operation of retracting the cleaning tool to a retracting position that is below the support surface 46a of the lower receiving portion 46 and where foreign matter is removed by the foreign matter removing portion 73.

[0099] Specifically, such a cleaning mechanism 70 includes a first cleaning tool 71L, a second cleaning tool 71R, a drive shaft 74a, and a tool moving mechanism 75.

[0100] The drive shaft 74a is an example of a connecting member 74 that connects the first cleaning tool 71L and the second cleaning tool 71R. Such a drive shaft 74a is a shaft member along the X-axis direction, and is disposed, for example, on the positive side in the Y-axis direction with respect to the first lower receiving portion 46L and the second lower receiving portion 46R. Note that the drive shaft 74a may be a shaft, a cylinder, or the like.

[0101] The tool moving mechanism 75 includes a horizontal moving portion 75a, a first vertical moving portion 75L, and a second vertical moving portion 75R. The horizontal moving portion 75a includes an actuator such as a motor, and moves the drive shaft 74a in the positive and negative directions of the X-axis direction according to the control by the control unit 2a. In other words, the horizontal moving portion 75a slides the drive shaft 74a in the X-axis direction.

[0102] The first vertical moving portion 75L is a column that is extendable and retractable along the Z-axis direction for supporting the first cleaning tool 71L. The second vertical moving portion 75R is a column that is extendable and retractable along the Z-axis direction for supporting the second cleaning tool 71R. The base ends of the first vertical moving portion 75L and the second vertical moving portion 75R are fixed to the drive shaft 74a in a state of being spaced apart from each other in the X-axis direction. The first cleaning tool 71L is fixed to the tip side of the first vertical moving portion 75L via a fixing shaft 76, and the second cleaning tool 71R is fixed to the tip side of the second vertical moving portion 75R via a fixing shaft 76. In addition, the first vertical moving portion 75L and the second vertical moving portion 75R in the present embodiment include an actuator such as a motor, and expand and contract in the Z-axis direction according to the control by the control unit 2a. Thereby, the first cleaning tool 71L and the second cleaning tool 71R move up and down.

[0103] In Configuration Example 1, the cleaning operation is performed by the movement of the drive shaft 74a by the horizontal movement unit 75a. That is, by the movement of the drive shaft 74a in the X-axis direction, the first vertical movement unit 75L and the second vertical movement unit 75R also move together with the drive shaft 74a. As a result, the first cleaning tool 71L supported by the fixed shaft 76 via the first vertical movement unit 75L and the second cleaning tool 71R supported by the fixed shaft 76 via the second vertical movement unit 75R move in the positive and negative sides in the X-axis direction. That is, the first cleaning tool 71L moves along the X-axis direction while rubbing against the support surface 46a of the first lower receiving part 46L, and the second cleaning tool 71R moves along the X-axis direction while rubbing against the support surface 46a of the second lower receiving part 46R. At this time, the first cleaning tool 71L and the second cleaning tool 71R move in the same direction in the X-axis direction.

[0104] Also, in Configuration Example 1, the foreign matter removing unit 73 consists of a first foreign matter removing unit 73L and a second foreign matter removing unit 73R. The first foreign matter removing unit 73L is arranged on the negative side in the X-axis direction of the first lower receiving part 46L. The second foreign matter removing unit 73R is arranged on the negative side in the X-axis direction of the second lower receiving part 46R. That is, the second foreign matter removing unit 73R is arranged between the first lower receiving part 46L and the second lower receiving part 46R.

[0105] The first foreign matter removing unit 73L removes foreign matter attached to the first cleaning tool 71L, for example, by suction. The second foreign matter removing unit 73R removes foreign matter attached to the second cleaning tool 71R, for example, by suction. For example, the first foreign matter removing unit 73L and the second foreign matter removing unit 73R each have the same configuration as each other. Also, as shown in FIG. 8(a), the first foreign matter removing unit 73L and the second foreign matter removing unit 73R are arranged below the respective support surfaces 46a of the first lower receiving part 46L and the second lower receiving part 46R. Further, suction holes h are formed in the upper surfaces, which are the positive sides in the Z-axis direction of the first foreign matter removing unit 73L and the second foreign matter removing unit 73R, respectively. Each of the first foreign matter removing unit 73L and the second foreign matter removing unit 73R is connected to, for example, a suction pump, and the suction pump sucks air around the opening of the suction hole h from the suction hole h.

[0106] FIG. 9 is a diagram showing the retraction operation of the cleaning mechanism 70 in Configuration Example 1. Note that FIG. 9 shows the state of the cleaning mechanism 70 as viewed from the negative side in the Y-axis direction.

[0107] In the retraction operation, the first cleaning tool 71L and the second cleaning tool 71R are respectively disposed above the first foreign matter removal unit 73L and the second foreign matter removal unit 73R, and each of the first vertical movement unit 75L and the second vertical movement unit 75R becomes shorter in the Z-axis direction. As a result, as shown in FIG. 9, each of the first cleaning tool 71L and the second cleaning tool 71R retracts to the retraction position corresponding to the cleaning tool. That is, the first cleaning tool 71L descends and is disposed near the opening of the suction hole h of the first foreign matter removal unit 73L. Similarly, the second cleaning tool 71R descends and is disposed near the opening of the suction hole h of the second foreign matter removal unit 73R. At this time, the first cleaning tool 71L and the second cleaning tool 71R are below the respective support surfaces 46a of the first lower receiving portion 46L and the second lower receiving portion 46R. Therefore, when the substrate 3 is placed on these support surfaces 46a, it is possible to suppress the first cleaning tool 71L and the second cleaning tool 71R from interfering with the substrate 3. That is, when the first cleaning tool 71L and the second cleaning tool 71R are retracted to the retraction position, the component 5 can be pressure-bonded to the substrate 3.

[0108] When the first cleaning tool 71L is disposed at the retraction position, the first foreign matter removal unit 73L removes foreign matter from the first cleaning tool 71L by sucking the foreign matter attached to the first cleaning tool 71L. Similarly, when the second cleaning tool 71R is disposed at the retraction position, the second foreign matter removal unit 73R removes foreign matter from the second cleaning tool 71R by sucking the foreign matter attached to the second cleaning tool 71R.

[0109] FIG. 10 is a diagram showing an example of the external configuration of the first foreign matter removal unit 73L. Note that FIG. 10(a) shows the state of the first foreign matter removal unit 73L as viewed from above, and FIG. 10(b) shows a cross section of the first foreign matter removal unit 73L in the XZ plane.

[0110] On the upper surface of the first foreign object removal unit 73L, a concave portion j having a substantially rectangular opening is formed, and the above-described suction hole h is formed at the center of the bottom surface of the concave portion j. Further, the opening on the positive side in the Z-axis direction of the suction hole h is formed wider toward the positive side. For example, the first cleaning tool 71L is disposed by the tool moving mechanism 75 at a retracted position which is a position near the opening of the suction hole h. That is, the first cleaning tool 71L retracts to its retracted position. At this time, the bristles of the first cleaning tool 71L at the retracted position may be in contact with the first foreign object removal unit 73L or may be separated from the first foreign object removal unit 73L. Then, when the first cleaning tool 71L is retracted to its retracted position, the first foreign object removal unit 73L removes the foreign objects adhering to the first cleaning tool 71L by suction.

[0111] The second foreign object removal unit 73R also has the same external configuration as the first foreign object removal unit 73L. Then, when the second cleaning tool 71R is retracted to a retracted position near the opening of the suction hole h of the second foreign object removal unit 73R, the second foreign object removal unit 73R removes the foreign objects adhering to the second cleaning tool 71R by suction.

[0112] As described above, the component crimping device 100 in the first configuration example includes a first lower receiving portion 46L, a second lower receiving portion 46R, a crimping tool 44, a first cleaning tool 71L, and a second cleaning tool 71R. Further, the component crimping device 100 includes a drive shaft 74a and a tool moving mechanism 75. Here, the drive shaft 74a is an example of a connecting member 74 that connects the first cleaning tool 71L and the second cleaning tool 71R. The tool moving mechanism 75 moves the connecting member 74 to move the first cleaning tool 71L and the second cleaning tool 71R along the arrangement direction of the first lower receiving portion 46L and the second lower receiving portion 46R while rubbing them against the first lower receiving portion 46L and the second lower receiving portion 46R. Note that the arrangement direction is the X-axis direction in the above example.

[0113] As a result, when the tool moving mechanism 75 moves the drive shaft 74a, the first cleaning tool 71L and the second cleaning tool 71R move in the arrangement direction of the first lower receiving portion 46L and the second lower receiving portion 46R while rubbing against the first lower receiving portion 46L and the second lower receiving portion 46R. As a result, the first cleaning tool 71L and the second cleaning tool 71R can be interlocked. Therefore, it is not necessary to provide the component crimping device 100 with two tool moving mechanisms for individually moving the first cleaning tool 71L for the first lower receiving portion 46L and the second cleaning tool 71R for the second lower receiving portion 46R. Therefore, the number of components of the component crimping device 100 can be reduced, and the device configuration can be simplified. Furthermore, an increase in the cost of the component crimping device 100 can be suppressed, and space saving of the component crimping device 100 can be easily achieved.

[0114] Also, the tool moving mechanism 75 in Configuration Example 1 moves the first cleaning tool 71L and the second cleaning tool 71R in the same direction in the above-described arrangement direction. That is, both the first cleaning tool 71L and the second cleaning tool 71R move to the positive side in the X-axis direction or move to the negative side in the X-axis direction.

[0115] As a result, since the first cleaning tool 71L and the second cleaning tool 71R move in the same direction, the space between the first lower receiving portion 46L and the second lower receiving portion 46R can be narrowed. For example, when the first cleaning tool 71L and the second cleaning tool 71R move in opposite directions, it is necessary to secure a wide space where these cleaning tools gather between the first lower receiving portion 46L and the second lower receiving portion 46R. However, in Configuration Example 1, since the first cleaning tool 71L and the second cleaning tool 71R do not gather, it is not necessary to secure such a wide space. Therefore, the degree of freedom in the layout of the first lower receiving portion 46L and the second lower receiving portion 46R can be increased.

[0116] Also, the tool moving mechanism 75 in Configuration Example 1 moves the first cleaning tool 71L and the second cleaning tool 71R in the same direction in the above-described arrangement direction by sliding the drive shaft 74a.

[0117] As a result, the tool moving mechanism 75 can move the first cleaning tool 71L and the second cleaning tool 71R with a simple operation. Therefore, there is a possibility that the configuration of the tool moving mechanism 75 can be simplified.

[0118] In addition, the component crimping device 100 in Configuration Example 1 includes a first foreign matter removing unit 73L for removing foreign matter adhering to the first cleaning tool 71L and a second foreign matter removing unit 73R for removing foreign matter adhering to the second cleaning tool 71R. The first foreign matter removing unit 73L is disposed on one side of the two directions in the above-described arrangement direction with respect to the first lower receiving portion 46L, and the second foreign matter removing unit 73R is disposed on that one side with respect to the second lower receiving portion 46R. For example, the first foreign matter removing unit 73L is disposed on the negative side in the X-axis direction with respect to the first lower receiving portion 46L, and the second foreign matter removing unit 73R is disposed on the negative side in the X-axis direction with respect to the second lower receiving portion 46R.

[0119] As a result, foreign matter adhering to the first cleaning tool 71L and the second cleaning tool 71R moving to one side (for example, the negative side in the X-axis direction) in the above-described arrangement direction can be appropriately removed by the first foreign matter removing unit 73L and the second foreign matter removing unit 73R. Note that the first foreign matter removing unit 73L may be disposed on the positive side in the X-axis direction with respect to the first lower receiving portion 46L, and the second foreign matter removing unit 73R may be disposed on the positive side in the X-axis direction with respect to the second lower receiving portion 46R.

[0120] [Configuration Example 2 of Cleaning Mechanism 70] FIG. 11 is a diagram showing a schematic configuration and a cleaning operation of the cleaning mechanism 70 in Configuration Example 2 of the present embodiment. Note that FIG. 11(a) shows a state of the cleaning mechanism 70 viewed from the negative side in the Y-axis direction, FIG. 11(b) shows a state of the cleaning mechanism 70 viewed from the positive side in the Z-axis direction, and FIG. 11(c) shows a state of the cleaning mechanism 70 viewed from the positive side in the X-axis direction.

[0121] Similar to Configuration Example 1, the cleaning mechanism 70 in Configuration Example 2 alternately performs a cleaning operation and a retraction operation. Also, the cleaning mechanism 70 in Configuration Example 2 includes a first cleaning tool 71L, a second cleaning tool 71R, a belt 74b, two fastening parts 77, and a tool moving mechanism 75.

[0122] The belt 74b is an annular belt and is an example of a connecting member 74 that connects the first cleaning tool 71L and the second cleaning tool 71R. Such a belt 74b is disposed, for example, on the positive side in the Y-axis direction from the first lower receiving part 46L and the second lower receiving part 46R.

[0123] The tool moving mechanism 75 includes two pulleys 75b, a first vertical moving part 75L, and a second vertical moving part 75R. The first vertical moving part 75L and the second vertical moving part 75R in Configuration Example 2 have the same configuration and function as those in Configuration Example 1. The two pulleys 75b are hung on the inner peripheral side of the belt 74b and are arranged to pull the belt 74b in the X-axis direction. Thereby, the belt 74b has two belt conveyance parts 74bu and 74bd along the X-axis direction, and the two belt conveyance parts 74bu and 74bd are arranged in the Z-axis direction. Also, the belt conveyance parts 74bu and 74bd are longer than the distance from the negative-side end in the X-axis direction of the first lower receiving part 46L to the positive-side end in the X-axis direction of the second lower receiving part 46R. One of the two pulleys 75b, the driving pulley 75b, is rotated by an actuator such as a motor to circulate the belt 74b.

[0124] Each of the two fastening parts 77 is fastened to the belt 74b and moves in the X-axis direction as the belt 74b circulates. Specifically, the two fastening parts 77 are attached to the upper belt conveying part 74bu among the above-mentioned two belt conveying parts 74bu and 74bd included in the belt 74b, in a state of being spaced apart from each other in the X-axis direction. The proximal ends of the first vertical moving part 75L and the second vertical moving part 75R are respectively fixed to the two fastening parts 77. Also, similar to Configuration Example 1, the first cleaning tool 71L is fixed to the distal end side of the first vertical moving part 75L via the fixing shaft 76, and the second cleaning tool 71R is fixed to the distal end side of the second vertical moving part 75R via the fixing shaft 76.

[0125] Therefore, when the driving pulley 75b rotates according to the control by the control unit 2a, the belt 74b circulates, and the first cleaning tool 71L and the second cleaning tool 71R move in the positive and negative sides in the X-axis direction. That is, the first cleaning tool 71L moves along the X-axis direction while rubbing against the support surface 46a of the first lower receiving part 46L, and the second cleaning tool 71R moves along the X-axis direction while rubbing against the support surface 46a of the second lower receiving part 46R. Also in Configuration Example 2, similar to Configuration Example 1, the first cleaning tool 71L and the second cleaning tool 71R move in the same direction.

[0126] Also in Configuration Example 2, similar to Configuration Example 1, the foreign matter removing part 73 is composed of a first foreign matter removing part 73L and a second foreign matter removing part 73R.

[0127] FIG. 12 is a diagram showing the retracting operation of the cleaning mechanism 70 in Configuration Example 2. Note that FIG. 12 shows the state of the cleaning mechanism 70 viewed from the negative side in the Y-axis direction.

[0128] In the retraction operation of Configuration Example 2, similar to Configuration Example 1, the first cleaning tool 71L and the second cleaning tool 71R are respectively arranged above the first foreign object removal unit 73L and the second foreign object removal unit 73R, and each of the first vertical movement unit 75L and the second vertical movement unit 75R becomes shorter in the Z-axis direction. As a result, as shown in FIG. 12, each of the first cleaning tool 71L and the second cleaning tool 71R retracts to the retraction position corresponding to the cleaning tool. That is, the first cleaning tool 71L descends and is arranged near the opening of the suction hole h of the first foreign object removal unit 73L, and similarly, the second cleaning tool 71R descends and is arranged near the opening of the suction hole h of the second foreign object removal unit 73R. At this time, the first cleaning tool 71L and the second cleaning tool 71R are below the respective support surfaces 46a of the first lower receiving part 46L and the second lower receiving part 46R. Therefore, when the substrate 3 is placed on these support surfaces 46a, it is possible to prevent the first cleaning tool 71L and the second cleaning tool 71R from interfering with the substrate 3. That is, when the first cleaning tool 71L and the second cleaning tool 71R are retracted to the retraction position, the component 5 can be pressure-bonded to the substrate 3.

[0129] When the first cleaning tool 71L is arranged at the retraction position, the first foreign object removal unit 73L removes foreign objects from the first cleaning tool 71L by sucking the foreign objects attached to the first cleaning tool 71L. Similarly, when the second cleaning tool 71R is arranged at the retraction position, the second foreign object removal unit 73R removes foreign objects from the second cleaning tool 71R by sucking the foreign objects attached to the second cleaning tool 71R.

[0130] Thus, in the component crimping device 100 in Configuration Example 2, the connecting member 74 is configured as a belt 74b, and the first cleaning tool 71L and the second cleaning tool 71R are fastened to the belt 74b so as to be arranged along the above-described arrangement direction. Further, the tool moving mechanism 75 moves the first cleaning tool 71L and the second cleaning tool 71R in the same direction in the above-described arrangement direction by sliding the belt 74b in the above-described arrangement direction. For example, two pulleys 75b included in the tool moving mechanism 75 rotate to circulate the belt 74b, thereby sliding the upper belt conveyance portion 74bu of the belt 74b. As a result, both the first cleaning tool 71L and the second cleaning tool 71R move to the positive side in the X-axis direction or move to the negative side in the X-axis direction.

[0131] Thereby, the first cleaning tool 71L and the second cleaning tool 71R can be appropriately moved in the same direction, and effective cleaning of the first lower receiving portion 46L and the second lower receiving portion 46R can be performed.

[0132] [Configuration Example 3 of Cleaning Mechanism 70] FIG. 13 is a diagram showing the schematic configuration and cleaning operation of the cleaning mechanism 70 in Configuration Example 3 in the present embodiment. Note that FIG. 13(a) shows a state of viewing the cleaning mechanism 70 from the negative side in the Y-axis direction, FIG. 13(b) shows a state of viewing the cleaning mechanism 70 from the positive side in the Z-axis direction, and FIG. 13(c) shows a state of viewing the cleaning mechanism 70 from the positive side in the X-axis direction.

[0133] The cleaning mechanism 70 in Configuration Example 3 is more space-saving than Configuration Example 2. Hereinafter, only the differences from Configuration Example 2 in Configuration Example 3 will be described in detail, and the description of the same parts will be omitted.

[0134] In Configuration Example 3, the cleaning mechanism 70 has one fastening portion 77 without having two fastening portions 77 as in Configuration Example 2. And the first vertical movement portion 75L is fixed to the one fastening portion 77 together with the second vertical movement portion 75R. For example, the proximal end of the first vertical movement portion 75L is fixed to the second vertical movement portion 75R via the connection portion 74c. As a result, the first vertical movement portion 75L is fixed to the fastening portion 77 via the connection portion 74c and the second vertical movement portion 75R. In such Configuration Example 3, it can be said that the cleaning mechanism 70 includes the connection portion 74c as a connecting member 74 that connects the first cleaning tool 71L and the second cleaning tool 71R.

[0135] In Configuration Example 3, when the drive pulley 75b rotates according to the control by the control unit 2a, the belt 74b circulates. As a result, since the fastening portion 77 and the connection portion 74c move along the positive and negative sides in the X-axis direction, the first cleaning tool 71L and the second cleaning tool 71R also move along the positive and negative sides in the X-axis direction.

[0136] In such Configuration Example 3, the distance between the two pulleys 75b, that is, the lengths of the two belt conveyance portions 74bu, 74bd included in the belt 74b, can be made shorter than in Configuration Example 2. In Configuration Example 2, the belt conveyance portions 74bu, 74bd are longer than the distance from the negative end in the X-axis direction of the first lower receiving portion 46L to the positive end in the X-axis direction of the second lower receiving portion 46R. However, in Configuration Example 3, the belt conveyance portions 74bu, 74bd only need to be longer than the length in the X-axis direction of the first lower receiving portion 46L or the second lower receiving portion 46R, and can be made shorter than the above-mentioned distance. As a result, in Configuration Example 3, space can be saved compared to Configuration Example 2.

[0137] FIG. 14 is a diagram showing the retraction operation of the cleaning mechanism 70 in Configuration Example 3. Note that FIG. 14 shows a state of viewing the cleaning mechanism 70 from the negative side in the Y-axis direction.

[0138] In the retraction operation of Configuration Example 3, similar to Configuration Example 2, the first cleaning tool 71L and the second cleaning tool 71R are respectively arranged above the first foreign object removal unit 73L and the second foreign object removal unit 73R, and each of the first vertical movement unit 75L and the second vertical movement unit 75R becomes shorter in the Z-axis direction. As a result, as shown in FIG. 14, each of the first cleaning tool 71L and the second cleaning tool 71R retracts to the retraction position corresponding to the cleaning tool. That is, the first cleaning tool 71L descends and is arranged near the opening of the suction hole h of the first foreign object removal unit 73L. Similarly, the second cleaning tool 71R descends and is arranged near the opening of the suction hole h of the second foreign object removal unit 73R.

[0139] In the above example, each of the first vertical movement unit 75L and the second vertical movement unit 75R becomes shorter in the Z-axis direction, but only the second vertical movement unit 75R may become shorter in the Z-axis direction. In this case, the connection part 74c connected to the second vertical movement unit 75R descends, and the first vertical movement unit 75L fixed to the connection part 74c also descends. Even in such a case, each of the first cleaning tool 71L and the second cleaning tool 71R can retract to the retraction position corresponding to the cleaning tool.

[0140] [Configuration Example 4 of the cleaning mechanism 70] FIG. 15 is a diagram showing the schematic configuration and cleaning operation of the cleaning mechanism 70 in Configuration Example 4 of the present embodiment. Note that FIG. 15(a) shows the state of the cleaning mechanism 70 viewed from the negative side in the Y-axis direction, FIG. 15(b) shows the state of the cleaning mechanism 70 viewed from the positive side in the Z-axis direction, and FIG. 15(c) shows the state of the cleaning mechanism 70 viewed from the positive side in the X-axis direction.

[0141] In the cleaning mechanism 70 in Configuration Example 4, the first cleaning tool 71L and the second cleaning tool 71R are moved in opposite directions to each other without moving them in the same direction as in Configuration Example 2. Hereinafter, only the differences from Configuration Example 2 in Configuration Example 4 will be described in detail, and the description of the same parts will be omitted.

[0142] In the cleaning mechanism 70 in Configuration Example 4, the fastening portion 77 fixed to the base end of the first vertical movement portion 75L is attached to the lower belt conveyance portion 74bd among the two belt conveyance portions 74bu and 74bd included in the belt 74b. When the belt 74b circulates, the upper belt conveyance portion 74bu and the lower belt conveyance portion 74bd move in opposite directions in the X-axis direction. Therefore, the first vertical movement portion 75L attached to the lower belt conveyance portion 74bd via the fastening portion 77 and the second vertical movement portion 75R attached to the upper belt conveyance portion 74bu via the fastening portion 77 move in opposite directions in the X-axis direction. As a result, both the first cleaning tool 71L and the second cleaning tool 71R move in opposite directions in the X-axis direction. That is, the first cleaning tool 71L and the second cleaning tool 71R move along the X-axis direction so as to approach each other while rubbing against the support surface 46a of the first lower receiving portion 46L and the support surface 46a of the second lower receiving portion 46R, respectively. Alternatively, the first cleaning tool 71L and the second cleaning tool 71R move along the X-axis direction so as to move away from each other while rubbing against the support surface 46a of the first lower receiving portion 46L and the support surface 46a of the second lower receiving portion 46R, respectively.

[0143] Further, in Configuration Example 4, the foreign matter removal portion 73 having two suction holes h is disposed between the first lower receiving portion 46L and the second lower receiving portion 46R.

[0144] FIG. 16 is a diagram showing the retraction operation of the cleaning mechanism 70 in Configuration Example 4. Note that FIG. 16 shows a state of viewing the cleaning mechanism 70 from the negative side in the Y-axis direction.

[0145] In the retraction operation of Configuration Example 4, the first cleaning tool 71L and the second cleaning tool 71R are both arranged above the foreign object removal unit 73, and each of the first vertical movement unit 75L and the second vertical movement unit 75R becomes shorter in the Z-axis direction. That is, the first cleaning tool 71L and the second cleaning tool 71R gather between the first lower receiving portion 46L and the second lower receiving portion 46R and descend. As a result, as shown in FIG. 16, each of the first cleaning tool 71L and the second cleaning tool 71R retracts to the retraction position corresponding to the cleaning tool. That is, the first cleaning tool 71L descends and is arranged near the opening of one of the two suction holes h of the foreign object removal unit 73. Similarly, the second cleaning tool 71R descends and is arranged near the opening of the other of the two suction holes h of the foreign object removal unit 73. At this time, the first cleaning tool 71L and the second cleaning tool 71R are below the respective support surfaces 46a of the first lower receiving portion 46L and the second lower receiving portion 46R. Therefore, when the substrate 3 is placed on these support surfaces 46a, it is possible to prevent the first cleaning tool 71L and the second cleaning tool 71R from interfering with the substrate 3. That is, when the first cleaning tool 71L and the second cleaning tool 71R are retracted to the retraction position, the component 5 can be pressure-bonded to the substrate 3.

[0146] When the first cleaning tool 71L is arranged near the opening of one of the two suction holes h of the foreign object removal unit 73 and the second cleaning tool 71R is arranged near the opening of the other, the foreign object removal unit 73 sucks the foreign objects attached to the first cleaning tool 71L and the second cleaning tool 71R. Thereby, the foreign object removal unit 73 removes the foreign objects from the first cleaning tool 71L and the second cleaning tool 71R.

[0147] FIG. 17 is a diagram showing an example of the external configuration of the foreign object removal unit 73 in Configuration Example 4. Note that FIG. 17(a) shows the state of the foreign object removal unit 73 viewed from above, and FIG. 17(b) shows a cross section of the foreign object removal unit 73 in the XZ plane.

[0148] On the upper surface of the foreign matter removal unit 73, a recess j having a substantially rectangular opening is formed, and the above-described two suction holes h are formed at the center of the bottom surface of the recess j. For example, the two suction holes h are arranged in the X-axis direction. Also, the openings of these suction holes h on the positive side in the Z-axis direction are formed wider toward the positive side. For example, the first cleaning tool 71L is arranged by the tool moving mechanism 75 at a retracted position which is a position near the opening of the suction hole h on the negative side in the X-axis direction. The second cleaning tool 71R is arranged by the tool moving mechanism 75 at a retracted position which is a position near the opening of the suction hole h on the positive side in the X-axis direction. That is, the first cleaning tool 71L and the second cleaning tool 71R retract to their corresponding retracted positions. At this time, the bristles of the first cleaning tool 71L and the second cleaning tool 71R in their respective retracted positions may be in contact with the foreign matter removal unit 73, or may be separated from the foreign matter removal unit 73. Such a foreign matter removal unit 73 is connected to, for example, a suction pump, and the suction pump sucks air around the openings of the two suction holes h from each of the two suction holes h.

[0149] When the first cleaning tool 71L and the second cleaning tool 71R are each retracted to their respective retracted positions, the foreign matter removal unit 73 removes the foreign matter adhering to the first cleaning tool 71L and the second cleaning tool 71R by suction.

[0150] Thus, the tool moving mechanism 75 in Configuration Example 4 moves the first cleaning tool 71L and the second cleaning tool 71R in opposite directions in the above-described arrangement direction. For example, the first cleaning tool 71L and the second cleaning tool 71R move in a direction approaching each other along the X-axis direction. Alternatively, the first cleaning tool 71L and the second cleaning tool 71R move in a direction away from each other along the X-axis direction.

[0151] As a result, since the first cleaning tool 71L and the second cleaning tool 71R may gather, at the timing when they gather, processing such as foreign matter removal for the first cleaning tool 71L and the second cleaning tool 71R can be effectively performed.

[0152] In Configuration Example 4, the connecting member 74 is configured as an annular belt 74b. The first cleaning tool 71L is fastened to the first part of the belt 74b that moves in the first direction in the above-described arrangement direction by the circulation of the belt 74b, and the second cleaning tool 71R is fastened to the second part of the belt 74b that moves in the second direction in the above-described arrangement direction by the circulation of the belt 74b. Here, the second direction is opposite to the first direction. Also, the first part is, for example, the upper belt conveyance part 74bu, and the second part is, for example, the lower belt conveyance part 74bd. The tool movement mechanism 75 circulates the belt 74b to move the first cleaning tool 71L and the second cleaning tool 71R in opposite directions in the above-described arrangement direction.

[0153] Thereby, the first cleaning tool 71L and the second cleaning tool 71R can be easily and appropriately moved in opposite directions, and effective cleaning of the first lower receiving part 46L and the second lower receiving part 46R can be performed.

[0154] Also, the component crimping device 100 in Configuration Example 4 includes a foreign matter removal part 73 for removing foreign matter adhering to the first cleaning tool 71L and the second cleaning tool 71R. The foreign matter removal part 73 is disposed between the first lower receiving part 46L and the second lower receiving part 46R.

[0155] As a result, between the first lower receiving part 46L and the second lower receiving part 46R, the first cleaning tool 71L and the second cleaning tool 71R that move in opposite directions gather, so that foreign matter removal for these cleaning tools can be effectively performed. Also, there is no need to separately arrange a foreign matter removal part for the first cleaning tool and a foreign matter removal part for the second cleaning tool, and they can be integrally configured. As a result, the device configuration can be further simplified and more space can be saved.

[0156] [Configuration Example 5 of the Cleaning Mechanism 70] FIG. 18 is a diagram showing the schematic configuration and cleaning operation of the cleaning mechanism 70 in Configuration Example 5 of the present embodiment. Note that FIG. 18(a) shows a state of viewing the cleaning mechanism 70 from the negative side in the Y-axis direction, FIG. 18(b) shows a state of viewing the cleaning mechanism 70 from the positive side in the Z-axis direction, and FIG. 18(c) shows a state of viewing the cleaning mechanism 70 from the positive side in the X-axis direction.

[0157] The cleaning mechanism 70 in Configuration Example 5 is more space-saving than that in Configuration Example 4. Hereinafter, only the differences between Configuration Example 5 and Configuration Example 4 will be described, and the description of the same parts will be omitted.

[0158] The first vertical movement part 75L in Configuration Example 5 includes a vertical part a along the Z-axis direction and a horizontal part b along the X-axis direction. As a result, the tip of the first vertical movement part 75L is arranged on the negative side in the X-axis direction with respect to the base end of the first vertical movement part 75L. As a result, it can be said that the first vertical movement part 75L in Configuration Example 5 extends on the negative side in the X-axis direction compared to the first vertical movement part 75L in Configuration Example 4.

[0159] Therefore, in Configuration Example 5, the interval between the two pulleys 75b, that is, the lengths of the two belt conveyance parts 74bu and 74bd included in the belt 74b, can be made shorter than those in Configuration Example 4. In Configuration Example 4, the belt conveyance parts 74bu and 74bd are longer than the distance from the end on the negative side in the X-axis direction of the first lower receiving part 46L to the end on the positive side in the X-axis direction of the second lower receiving part 46R. On the other hand, in Configuration Example 5, since the first vertical movement part 75L extends on the negative side in the X-axis direction, many parts in the movable range of the fastening part 77 corresponding to the first cleaning tool 71L can be overlapped with the movable range of the fastening part 77 corresponding to the second cleaning tool 71R. As a result, the belt conveyance parts 74bu and 74bd only need to be longer than the length in the X-axis direction of the first lower receiving part 46L or the second lower receiving part 46R, and can be made shorter than the above-mentioned distance. As a result, in Configuration Example 5, space can be saved compared to Configuration Example 4.

[0160] FIG. 19 is a diagram showing the retraction operation of the cleaning mechanism 70 in Configuration Example 5. Note that FIG. 19 shows a state of viewing the cleaning mechanism 70 from the negative side in the Y-axis direction.

[0161] In the retraction operation of Configuration Example 5, similar to Configuration Example 4, the first cleaning tool 71L and the second cleaning tool 71R are both arranged above the foreign matter removal unit 73, and each of the first vertical movement unit 75L and the second vertical movement unit 75R becomes shorter in the Z-axis direction. At this time, the first vertical movement unit 75L and the second vertical movement unit 75R are arranged so as to overlap when viewed from the negative side in the Y-axis direction. As a result, as shown in FIG. 19, each of the first cleaning tool 71L and the second cleaning tool 71R retracts to the retraction position corresponding to the cleaning tool. That is, the first cleaning tool 71L descends and is arranged near the opening of one of the two suction holes h of the foreign matter removal unit 73. Similarly, the second cleaning tool 71R descends and is arranged near the opening of the other of the two suction holes h of the foreign matter removal unit 73.

[0162] Similar to Configuration Example 4, when the first cleaning tool 71L is arranged near the opening of one of the two suction holes h and the second cleaning tool 71R is arranged near the opening of the other, the foreign matter removal unit 73 sucks the foreign matter adhering to the first cleaning tool 71L and the second cleaning tool 71R. Thereby, the foreign matter removal unit 73 removes foreign matter from the first cleaning tool 71L and the second cleaning tool 71R.

[0163] FIG. 20 is a flowchart showing the processing operation of the component crimping device 100 in the present embodiment.

[0164] First, the cleaning mechanism 70 moves the first cleaning tool 71L and the second cleaning tool 71R from the retraction position in response to the control by the control unit 2a, and the first cleaning tool 71L and the second cleaning tool 71R clean the respective support surfaces 46a of the first lower receiving portion 46L and the second lower receiving portion 46R (step S1). That is, the cleaning mechanism 70 performs a cleaning operation. In this cleaning operation, the first cleaning tool 71L moves along the longitudinal direction of the first lower receiving portion 46L while rubbing against the support surface 46a of the first lower receiving portion 46L, and the second cleaning tool 71R moves along the longitudinal direction of the second lower receiving portion 46R while rubbing against the support surface 46a of the second lower receiving portion 46R.

[0165] Next, the cleaning mechanism 70 moves the first cleaning tool 71L and the second cleaning tool 71R to their respective retracted positions (step S2). That is, the cleaning mechanism 70 performs a retraction operation. In this retraction operation, the first cleaning tool 71L retracts to a retracted position below the support surface 46a of the first lower receiving portion 46L, and the second cleaning tool 71R retracts to a retracted position below the support surface 46a of the second lower receiving portion 46R.

[0166] When the first cleaning tool 71L and the second cleaning tool 71R retract to their respective retracted positions, the foreign matter removal unit 73 starts suction. Thereby, the foreign matter removal unit 73 removes the foreign matter adhering to the first cleaning tool 71L and the second cleaning tool 71R (step S3).

[0167] Also, when the first cleaning tool 71L and the second cleaning tool 71R retract to their respective retracted positions and the foreign matter on the first cleaning tool 71L and the second cleaning tool 71R is removed by the foreign matter removal unit 73, the above-described main crimping process is executed. That is, the control unit 2a of the component crimping device 100 moves the stage 49 to support the portion of the component 5 held on the stage 49 of the substrate 3 that has been temporarily crimped from below by the lower receiving portion 46 (step S4). Then, the crimping tool 44 crimps the component 5 to the substrate 3 in a heated state (step S5). When the crimping of the component 5 is completed, the control unit 2a of the component crimping device 100 moves the stage 49 again to release the support of the substrate 3 by the lower receiving portion 46 (step S6). That is, the substrate 3 separates from the lower receiving portion 46.

[0168] Then, the control unit 2a of the component crimping device 100 determines whether there is another substrate 3 to which the component 5 is to be crimped (step S7). Here, when the control unit 2a determines that there is another substrate 3 (Yes in step S7), the processing from step S1 is repeatedly executed. On the other hand, when the control unit 2a determines that there is no other substrate 3 (No in step S7), all the processing operations are terminated.

[0169] As described above, the component crimping device 100 in the present embodiment can simplify the device configuration. Further, although the component crimping device according to one or more aspects has been described based on the above embodiment, the present disclosure is not limited to this embodiment. As long as the gist of the present disclosure is not deviated from, various modifications conceived by those skilled in the art applied to the above embodiment may also be included within the scope of the present disclosure.

[0170] For example, in Configuration Examples 2 and 3 in the above embodiment, the first cleaning tool 71L and the second cleaning tool 71R are attached to the upper belt conveyance portion 74bu. However, the first cleaning tool 71L and the second cleaning tool 71R may be attached to the lower belt conveyance portion 74bd.

[0171] Further, in Configuration Examples 4 and 5 in the above embodiment, the foreign matter removal portion 73 is integrated, but may have a configuration including a first foreign matter removal portion 73L and a second foreign matter removal portion 73R adjacent to each other.

[0172] Further, in Configuration Examples 4 and 5 in the above embodiment, the first cleaning tool 71L is attached to the lower belt conveyance portion 74bd, and the second cleaning tool 71R is attached to the upper belt conveyance portion 74bu. However, conversely, the first cleaning tool 71L may be attached to the upper belt conveyance portion 74bu, and the second cleaning tool 71R may be attached to the lower belt conveyance portion 74bd.

[0173] Further, in the above embodiment, the substrate 3 is a liquid crystal panel, and the component 5 is temporarily crimped and finally crimped to the liquid crystal panel, but the substrate 3 may be a substrate other than the liquid crystal panel.

[0174] Further, in the above embodiment, the moving directions of the first cleaning tool 71L and the second cleaning tool 71R are in the X-axis direction, but may be in other directions. That is, the moving directions of the first cleaning tool 71L and the second cleaning tool 71R may be in any direction as long as it is the arrangement direction of the first lower receiving portion 46L and the second lower receiving portion 46R.

[0175] In the above embodiment, the first cleaning tool 71L and the second cleaning tool 71R are brushes, but they may also be cloths. Further, the first cleaning tool 71L and the second cleaning tool 71R may be rotary brushes. That is, in the above embodiment, the first cleaning tool 71L and the second cleaning tool 71R clean the receiving portion 46 by moving along the X-axis direction, but they may also move while rotating. For example, the first cleaning tool 71L and the second cleaning tool 71R rotate about a central axis (for example, a fixed shaft 76) along the Y-axis direction as the rotation axis.

[0176] In the above embodiment, the portion to be pressure-bonded is the portion where the ACF is adhered, but it may also be a portion where the ACF is not adhered.

[0177] In the above embodiment, the cleaning mechanism 70 is provided in the main pressure-bonding portion 40, but it may also be provided in the temporary pressure-bonding portion 30 or the adhering portion 20.

[0178] The bristles held by the first cleaning tool 71L and the second cleaning tool 71R in the above embodiment may be resin molded products, fibers, or wires.

[0179] In the above embodiment, all or part of the components of the computer 2 may be configured by dedicated hardware, or may be realized by executing a software program suitable for each component. Each component may be realized by a program execution unit such as a CPU (Central Processing Unit) or a processor reading and executing a software program recorded on a recording medium such as an HDD (Hard Disk Drive) or a semiconductor memory. For example, the program execution unit causes the main pressure-bonding portion 40 to execute each step shown in FIG. 20.

[0180] In addition, the components of the computer 2 may be composed of one or more electronic circuits. Each of the one or more electronic circuits may be a general-purpose circuit or a dedicated circuit. The one or more electronic circuits may include, for example, semiconductor devices, ICs (Integrated Circuits), or LSIs (Large Scale Integrations). The IC or LSI may be integrated on one chip or on a plurality of chips. Here, although it is called an IC or LSI, the name may change depending on the degree of integration, and it may be called a system LSI, a VLSI (Very Large Scale Integration), or a ULSI (Ultra Large Scale Integration). Also, an FPGA (Field Programmable Gate Array) programmed after the manufacture of the LSI can be used for the same purpose.

Industrial Applicability

[0181] The present disclosure can be applied to a component crimping device included in, for example, a component mounting line for producing liquid crystal displays.

Explanation of Signs

[0182] 1 Component mounting line 1a, 1b, 1c Base 2 Computer 2a Control unit 2b Storage unit 3 Substrate 4 Electrode part 5 Component 10 Substrate loading unit 11, 23, 37, 49, 51 Stage 20 Adhesive part 21, 31, 41 Substrate moving mechanism 22 Adhesive mechanism 30 Temporary crimping part 32 Component mounting mechanism 33 Component supply unit 34, 44 Crimping tool 35 Component transfer unit 36, 46 Lower receiving part 46L First lower receiving part 46R Second lower receiving part 40 Main crimping part 42 Crimping mechanism 50 Substrate discharging part 70 Cleaning mechanism 71L First cleaning tool 71R Second cleaning tool 74 Connecting member 74a Drive shaft 74b Belt 74bd, 74bu Belt conveying part 74c Connection part 73 Foreign object removing part 73L First foreign object removing part 73R Second foreign object removing part 75 Tool moving mechanism 75a Horizontal moving part 75b Pulley 75L First vertical moving part 75R Second vertical moving part 76 Fixed shaft 77 Fastening part 100 Component crimping device h Suction hole j Recess

Claims

1. a first lower receiving portion that supports the first substrate from below, a second lower receiving portion that supports the second substrate from below, at least one crimping tool that crimps components to the first substrate and the second substrate supported by the first lower receiving portion and the second lower receiving portion, a first cleaning tool for cleaning the first lower receiving portion, a second cleaning tool for cleaning the second lower receiving portion, a connecting member that connects the first cleaning tool and the second cleaning tool, a tool moving mechanism that moves the first cleaning tool and the second cleaning tool along the arrangement direction of the first lower receiving portion and the second lower receiving portion while rubbing the first lower receiving portion and the second lower receiving portion by moving the connecting member, A component crimping device comprising:

2. The tool moving mechanism moves the first cleaning tool and the second cleaning tool in the same direction along the arrangement direction, The component crimping device according to claim 1.

3. The tool moving mechanism moves the first cleaning tool and the second cleaning tool in the same direction along the arrangement direction by sliding the connecting member, The component crimping device according to claim 2.

4. The connecting member is a belt, The first cleaning tool and the second cleaning tool are fastened to the belt so as to be arranged along the arrangement direction, The tool moving mechanism, moves the first cleaning tool and the second cleaning tool in the same direction along the arrangement direction by sliding the belt in the arrangement direction, The component crimping device according to claim 2.

5. The component crimping device further comprises A first foreign matter removal unit for removing foreign matter adhering to the first cleaning tool; A second foreign matter removal unit for removing foreign matter adhering to the second cleaning tool; The first foreign matter removal unit is disposed on one side of the two directions in the arrangement direction, rather than the first lower receiving portion; The second foreign matter removal unit is disposed on the one side rather than the second lower receiving portion; The component crimping device according to any one of claims 2 to 4.

6. The tool moving mechanism moves the first cleaning tool and the second cleaning tool in opposite directions in the arrangement direction; The component crimping device according to claim 1.

7. The connecting member is an annular belt, The first cleaning tool is fastened to a first portion of the belt that moves in a first direction in the arrangement direction by the circulation of the belt, The second cleaning tool is fastened to a second portion of the belt that moves in a second direction in the arrangement direction by the circulation of the belt, The second direction is opposite to the first direction, The tool moving mechanism, By circulating the belt, the first cleaning tool and the second cleaning tool are moved in opposite directions in the arrangement direction; The component crimping device according to claim 6.

8. The component crimping device further includes, A foreign matter removal unit for removing foreign matter adhering to the first cleaning tool and the second cleaning tool; The foreign matter removal unit is disposed between the first lower receiving portion and the second lower receiving portion; The component crimping device according to claim 6 or 7.

9. A crimping step of crimping components to a first substrate and a second substrate supported by a first lower receiving portion and a second lower receiving portion; A cleaning step of cleaning the first lower receiving portion and the second lower receiving portion, In the cleaning step, By moving a connecting member that connects a first cleaning tool for cleaning the first lower receiving portion and a second cleaning tool for cleaning the second lower receiving portion, the first cleaning tool and the second cleaning tool are rubbed against the first lower receiving portion and the second lower receiving portion while moving them along the arrangement direction of the first lower receiving portion and the second lower receiving portion. A component crimping method.

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