Substrate carrier device

Abstract

To provide a substrate carrier device which can precisely detect the front-rear directional position of a substrate in a substrate storage unit.SOLUTION: A substrate carrying device TID has a hand 1, a moving mechanism 31, a lifting mechanism 32, a moving mechanism 33, and a detection unit 2. The moving mechanism 31 moves the hand 1 in the front-rear direction to cause the hand 1 to enter the substrate storage container or withdraw from the substrate storage unit. The lifting mechanism 32 lifts the hand 1 and rises the substrate W from the below by the hand 1. The detection unit 2 includes a light emitting unit 21, a light reception unit, and an operation unit 141. The light emitting unit 21 is provided so that a light emitting surface is located above the upper surface of a protrusion part 31 of the hand 1. The light reception unit is provided so that the light reception surface is located above the upper surface of the protrusion part 31 of the hand 1. An operation unit 141 determines the front-rear directional position of the substrate W on the basis of the amount of light received by the light reception unit and determines a moving adjustment amount to move the substrate W on the basis of the position.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] This application relates to a substrate transfer device.

Background Art

[0002] Conventionally, substrate transfer devices for taking out substrates from cassettes in which substrates are stored have been proposed (for example, Patent Documents 1 to 3). The substrate transfer device includes a hand on which the substrate is placed. The substrate transfer device performs the following operations to take out the substrate from the cassette. That is, first, the substrate transfer device adjusts the height position of the hand at a position facing the cassette. Specifically, the substrate transfer device adjusts the height position of the hand so as to be slightly below the substrate to be carried out. Then, the substrate transfer device moves the hand into the cassette along the front-rear direction. After stopping the hand at a predetermined position directly below the substrate, the substrate transfer device raises the hand. Thereby, the hand can lift the substrate. Next, the substrate transfer device retracts the hand from the cassette. Thereby, the substrate can be taken out from the cassette.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Patent Document 3

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, the placement position of the substrate may shift inside the cassette. Specifically, the placement position of the substrate in the front-rear direction may shift from a specified reference position. When the placement position of the substrate shifts from the reference position, the relative positional relationship between the hand and the substrate also shifts. As a result, the substrate is not placed at an appropriate position relative to the hand. In other words, the hand cannot lift the substrate at an appropriate position, and the substrate cannot be removed appropriately.

[0005] Therefore, an object of the present application is to provide a substrate transport device that can detect the front-rear position of a substrate in a substrate container with high accuracy. [Means for solving the problem]

[0006] A first aspect of the substrate transport device is a substrate transport device that removes a substrate from a substrate container having an internal structure in which a plurality of substrates are stored in a horizontal position and stacked at intervals in the vertical direction, and transports the substrate to a substrate holding section, the substrate transport device comprising a hand, an advance / retract mechanism that moves the hand in a forward / backward direction to move the hand into and out of the substrate container, a lifting mechanism that raises the hand and lifts the substrate from below with the hand, a moving mechanism that moves the hand to a position facing the substrate container, and a mechanism that moves together with the hand and is disposed in a position adjacent to the substrate in a measurement direction that intersects the forward / retract direction when the hand is in an advanced state with the hand advanced into the substrate container, and a detection unit that detects the position of the substrate in the fore-and-aft direction in the entry state, the detection unit including a light-emitting unit and a light-receiving unit arranged facing each other in the measurement direction, and a calculation unit, the hand including a finger and a protrusion provided on the finger and supporting the underside of the substrate, the light-emitting unit is arranged so that its light-emitting surface is located above an upper surface of the protrusion, and the light-receiving unit is arranged so that its light-receiving surface is located above an upper surface of the protrusion, the light-emitting unit irradiates a band-shaped light whose width direction is the fore-and-aft direction toward the light-receiving unit, and the calculation unit determines the fore-and-aft position of the substrate based on the amount of light received by the light-receiving unit, and determines the amount of position adjustment to move the substrate based on the position.

[0007] A second aspect of the substrate transport device is a substrate transport device that removes a substrate from a substrate container having an internal structure in which a plurality of substrates are stored in a horizontal position and stacked at intervals in the vertical direction, and transports the substrate to a substrate holding section, the substrate transport device comprising a hand, an advance / withdraw mechanism that moves the hand in a forward / backward direction to cause the hand to enter and withdraw from the substrate container, a lifting mechanism that raises the hand and lifts the substrate from below with the hand, a moving mechanism that moves integrally with the hand, and in an advanced state in which the advance / withdraw mechanism has advanced the hand into the substrate container, and a detection unit that is provided at a position adjacent to the substrate in a measurement direction that intersects the front-to-rear direction and detects the position of the substrate in the front-to-rear direction in the entry state, the detection unit includes a light-emitting unit and a light-receiving unit that are arranged facing each other in the measurement direction, and a calculation unit, the light-emitting unit irradiates a band-shaped light whose width direction is the front-to-rear direction toward the light-receiving unit, and the calculation unit calculates the ratio between the amount of light received by the light-receiving unit when the light from the light-emitting unit is not blocked by the substrate and the amount of light received by the light-receiving unit in the entry state, and determines the front-to-rear position of the substrate based on the ratio and judges whether the position is within an acceptable range.

[0008] A third aspect of the substrate transport apparatus is the substrate transport apparatus according to the first or second aspect, wherein the light emitting portion is provided at a different height position from the light receiving portion.

[0009] A fourth aspect of the substrate transport device is a substrate transport device according to any one of the first to third aspects, wherein the substrate has a central portion and a peripheral portion that is more outer than the central portion, and the peripheral portion is thicker than the central portion.

[0010] A fifth aspect of the substrate transport apparatus is the substrate transport apparatus according to any one of the first to fourth aspects, wherein the hand is formed with at least two suction ports. Effect of the Invention

[0011] The position of the substrate in the substrate container in the front-rear direction can be detected with high precision.

Brief Description of the Drawings

[0012]

Figure 1

Figure 2

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Figure 11

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Figure 13

Embodiments for Carrying Out the Invention

[0013] Hereinafter, embodiments will be described with reference to the accompanying drawings. Note that the drawings are schematically shown, and for the sake of convenience of explanation, components may be omitted or simplified as appropriate. Also, the sizes and positional relationships of the components shown in the drawings are not necessarily accurately described and may be changed as appropriate.

[0014] In the following description, the same reference numerals are given to the same components in the drawings, and their names and functions are also considered the same. Therefore, detailed descriptions of them may be omitted to avoid duplication.

[0015] <Schematic Configuration of Substrate Processing Apparatus> FIG. 1 is a plan view schematically showing an example of the configuration of a substrate processing apparatus. The substrate processing apparatus in FIG. 1 is an apparatus that forms a resist film or the like on a substrate (e.g., a semiconductor wafer) W and develops the exposed substrate W.

[0016] In the example of FIG. 1, the substrate processing apparatus includes an indexer unit 110, a processing unit 120, an interface unit 130, and a control unit 140. The control unit 140 controls various components of the substrate processing apparatus.

[0017] The control unit 140 is an electronic circuit and may have, for example, a data processing device and a storage medium. The data processing device may be an arithmetic processing device such as a CPU (Central Processor Unit). The storage medium may have a non-temporary storage medium (e.g., ROM (Read Only Memory) or a hard disk) and a temporary storage medium (e.g., RAM (Random Access Memory)). The non-temporary storage medium may store, for example, a program that defines the processes executed by the control unit 140. By the processing device executing this program, the control unit 140 can execute the processes defined in the program. Of course, part or all of the processes executed by the control unit 140 may be executed by hardware.

[0018] On both sides of the processing unit 120, an indexer unit 110 and an interface unit 130 are provided adjacent to each other. An exposure machine EXP, which is an external device separate from this apparatus, is further provided adjacent to the interface unit 130.

[0019] The indexer unit 110 includes a plurality (four in the figure) of container mounting tables 111 and a conveyance mechanism TID for ID. The plurality of container mounting tables 111 are arranged in a row, and one cassette C is placed on each cassette mounting table 111.

[0020] The substrate container C may be a FOUP (Front Opening Unified Pod) that stores the substrates W in a sealed state, or a SMIF (Standard Mechanical Inter Face) pod, an OC (Open Cassette), or the like. In the substrate container C, a plurality of substrates W in a horizontal posture are stacked in the vertical direction with spaces between them. The horizontal posture referred to here means a state in which the thickness direction of the substrate W is along the vertical direction.

[0021] The conveyance mechanism TID for ID is provided so as to be horizontally movable in the arrangement direction of the substrate containers C on the side of the container mounting table 111 and can stop at a position facing each substrate container C. The conveyance mechanism TID for ID includes a holding arm and performs the transfer of the substrate W between each substrate container C and the processing unit 120. The conveyance mechanism TID for ID takes out the substrate W from the substrate container C and conveys it to the processing unit 120, and stores the substrate W received from the processing unit 120 in the substrate container C.

[0022] The indexer unit 110 is provided with a mapping sensor (not shown) for detecting the presence or absence of a substrate on each stage in the substrate storage container C. For example, the mapping sensor includes a light emitting unit and a light receiving unit. The light emitting unit and the light receiving unit are provided facing each other in the arrangement direction in which a plurality of substrate storage containers C are arranged. The light emitting unit irradiates light toward the light receiving unit, and the light receiving unit receives this light. The light emitting unit and the light receiving unit are integrally provided so as to be movable in the horizontal direction and the vertical direction, and can enter the inside of the substrate storage container C. Specifically, the light emitting unit and the light receiving unit enter a position that sandwiches a part of the substrate W in a plan view inside the substrate storage container C. When the light emitting unit and the light receiving unit are located at the same height position as a certain stage, if the substrate W is placed on that stage, the light from the light emitting unit is blocked by the substrate W, and if the substrate W is not placed on that stage, the light from the light emitting unit is received by the light receiving unit.

[0023] Conversely, when the light receiving unit does not receive light, it indicates that the substrate W is placed on that stage, and when the light receiving unit receives light, it indicates that the substrate W is not placed on that stage. By raising the light emitting unit and the light receiving unit from the lowermost stage to the uppermost stage in the substrate storage container C, the presence or absence of the substrate on each stage in the substrate storage container C can be detected. The detection result of the mapping sensor is output to the control unit 140. The control unit 140 controls the ID transfer mechanism TID according to the detection result of the mapping sensor.

[0024] The processing unit 120 performs processing on the substrate W. In the example of FIG. 1, the processing unit 120 is divided into cells 121 and 122. Cell 121 includes the main transfer mechanism T1, and cell 122 includes the main transfer mechanism T2. A plurality of processing units are provided in each of cells 121 and 122. In the example of FIG. 1, only cells 121 and 122 are shown, but a plurality of cells 121 and 122 may be provided in the vertical direction in the processing unit 120. That is, cells similar to cell 121 may be stacked above cell 121, and cells similar to cell 122 may be stacked above cell 122. In short, the processing unit 120 may have a multi-layer structure. In cell 121 (and the cells on its upper layer), a resist film or the like is formed on the substrate W, and in cell 122 (and the cells on its upper layer), the substrate W is developed.

[0025] Cells 121 and 122 are arranged side by side in the horizontal direction and connected to each other to form a single substrate processing line that connects between the indexer unit 110 and the interface unit 130. The same applies to each layer. These substrate processing lines are provided substantially parallel to each other in the vertical direction. In other words, the processing unit 120 is composed of substrate processing lines having a hierarchical structure.

[0026] The interface unit 130 is disposed between the processing unit 120 and the exposure machine EXP, and relays the substrate W between them.

[0027] Hereinafter, for simplicity of explanation, the description of the cells on the upper layer is omitted, and cells 121 and 122 will be described. In cell 121, a transfer space A1 for transferring the substrate W is formed. The transfer space A1 passes through the center of cell 121 and is formed in a strip shape parallel to the arrangement direction of cells 121 and 122. The processing units of cell 121 include a coating processing unit 123 that applies a processing liquid to the substrate W and a heat treatment unit 124 that performs heat treatment on the substrate W. The coating processing unit 123 is disposed on one side with respect to the transfer space A1, and the heat treatment unit 124 is disposed on the other side.

[0028] A plurality of coating processing units 123 are arranged side by side so as to face the conveyance space A1 respectively. In the present embodiment, the plurality of coating processing units 123 are also arranged side by side in the vertical direction. For example, a total of four coating processing units 123 are arranged in two rows and two tiers. The coating processing unit 123 includes an anti-reflection film coating processing unit that performs a process of forming an anti-reflection film on the substrate W, and a resist film coating processing unit that performs a process of forming a resist film on the substrate W. For example, the two coating processing units 123 in the lower stage form an anti-reflection film on the substrate W, and the two coating processing units 123 in the upper stage form a resist film on the substrate W.

[0029] A plurality of heat treatment units 124 are provided side by side so as to face the conveyance space A1 respectively. In the present embodiment, the plurality of heat treatment units 124 are also arranged side by side in the vertical direction. For example, five heat treatment units 124 can be stacked in the vertical direction so that three heat treatment units 124 can be arranged in the horizontal direction. Each heat treatment unit 124 includes a plate 125 on which the substrate W is placed, etc. The heat treatment unit 124 includes a cooling unit that cools the substrate W, a heating and cooling unit that continuously performs a heat treatment and a cooling treatment, and an adhesion treatment unit that performs a heat treatment in a vapor atmosphere of hexamethyldisilazane (HMDS) in order to improve the adhesion between the substrate W and the film. The heating and cooling unit has two plates 125 and includes a local conveyance mechanism (not shown) that moves the substrate W between the two plates 125. There are a plurality of each type of heat treatment unit, and they are arranged at appropriate positions.

[0030] At the boundary between the indexer unit 110 and the cell 121, a placement section PASS1 is provided, and at the boundary between the cells 121 and 122, a placement section PASS2 is provided. The placement section PASS1 relays the substrate W between the indexer unit 110 and the cell 121, and the placement section PASS2 relays the substrate W between the cells 121 and 122. The placement sections PASS1 and PASS2 include a plurality of support pins that support the substrate W in a horizontal posture. The horizontal posture referred to here is a posture in which the thickness direction of the substrate W is along the vertical direction. The placement section PASS1 can place, for example, two substrates W. The placement section PASS1 has, for example, a two-stage configuration, and one substrate W is placed on each stage. One stage is for placing the substrate W conveyed from the indexer unit 110 to the cell 121, and the other stage is for placing the substrate W conveyed from the cell 121 to the indexer unit 110. The placement section PASS2 also has a two-stage configuration in the same way.

[0031] At approximately the center of the transfer space A1, a main transfer mechanism T1 is provided. The main transfer mechanism T1 performs the transfer of the substrate W with each of the processing unit of the cell 121, the placement section PASS1, and the placement section PASS2. In the example of FIG. 1, the main transfer mechanism T1 includes two holding arms H1 and H2. Therefore, the main transfer mechanism T1 can take out the substrate W from the target part (for example, the processing unit of the cell 121) using one holding arm H1, and at the same time, pass another substrate W to the target part using the other holding arm H2.

[0032] In the cell 122, a transfer space A2 for transferring the substrate W is formed. The transfer space A2 is formed so as to be an extension of the transfer space A1.

[0033] The processing unit of cell 122 includes a coating processing unit 127 that applies a processing liquid to a substrate, a heat treatment unit 126 that performs a heat treatment on the substrate W, and an edge exposure unit (not shown) that exposes the peripheral portion of the substrate W. The coating processing unit 127 is disposed on one side with respect to the transfer space A2, and the heat treatment unit 126 and the edge exposure unit are disposed on the other side. Here, it is preferable that the coating processing unit 127 is disposed on the same side as the coating processing unit 123. Further, it is preferable that the heat treatment unit 126 and the edge exposure unit are arranged in the same order as the heat treatment unit 124.

[0034] In the present embodiment, a plurality of coating processing units 127 are arranged side by side in the vertical direction. For example, a total of six coating processing units 127 are arranged in three rows and two stages. The coating processing unit 127 includes a development processing unit that develops the substrate W and a coating processing unit for a resist cover film that performs a process of forming a resist cover film on the substrate W. For example, the three coating processing units 127 in the lower stage form a resist cover film on the substrate W, and the three coating processing units 127 in the upper stage develop the substrate W.

[0035] The heat treatment units 126 are arranged in a plurality in the lateral direction along the transfer space A2 and are stacked in a plurality in the vertical direction. The heat treatment unit 126 includes a heating unit that heats the substrate W and a cooling unit that cools the substrate W.

[0036] The edge exposure unit is single and is provided at a predetermined position. The edge exposure unit includes a rotation holding unit (not shown) that rotatably holds the substrate W and a light irradiation unit (not shown) that exposes the periphery of the substrate W held by the rotation holding unit.

[0037] A mounting and buffer unit P-BF is provided at the boundary between the cell 122 and the interface unit 130. The substrate W transferred from the cell 122 to the interface unit 130 is placed on the mounting and buffer unit P-BF.

[0038] The main transfer mechanism T2 is provided substantially at the center of the transfer space A2 in plan view. The main transfer mechanism T2 is configured in the same manner as the main transfer mechanism T1. Then, the main transfer mechanism T2 delivers the substrate W to and receives it from each of the placement section PASS2, the coating processing unit 127, the heat treatment unit 126, the edge exposure unit, and the placement and buffer section P-BF.

[0039] The interface section 130 includes a cleaning processing block 131 and a loading / unloading block 132. At the boundary between the cleaning processing block 131 and the loading / unloading block 132, a placement section PASS3 is provided. An example of the configuration of the placement section PASS3 is the same as that of the placement sections PASS1 and PASS2. Above or below the placement section PASS3, a placement and cooling unit (not shown) is provided. The placement and cooling unit cools the substrate W to a temperature suitable for exposure.

[0040] In the loading / unloading block 132, a transfer mechanism TIF for IF is provided. The transfer mechanism TIF for IF transfers the substrate W from the placement and cooling unit to the loading section LPa of the exposure machine EXP, and transfers the substrate W from the unloading section LPb of the exposure machine EXP to the placement section PASS3.

[0041] The cleaning processing block 131 includes two cleaning processing units 133a and 133b, and two transfer mechanisms T3a and T3b. The two cleaning processing units 133a and 133b are arranged so as to sandwich a set of the transfer mechanisms T3a and T3b. The cleaning processing unit 133a cleans and dries the substrate W before exposure. A plurality of cleaning processing units 133a may be stacked in multiple stages. The transfer mechanism T3a transfers the substrate W from the placement and buffer section P-BF to the cleaning processing unit 133a, and transfers the cleaned substrate W from the cleaning processing unit 133a to the placement and cooling unit.

[0042] The cleaning processing unit 133b cleans and dries the substrate W after exposure. A plurality of cleaning processing units 133b may be stacked in multiple stages. The transfer mechanism T3b transfers the substrate W from the placement unit PASS3 to the cleaning and drying processing unit 133b, and transfers the cleaned substrate W from the cleaning and drying processing unit 133b to the placement and buffer unit P-BF.

[0043] In such a substrate processing system, the substrate W is processed as follows. That is, the substrate W taken out from the substrate container C is cooled by the cooling unit of the cell 121. The cooled substrate W is subjected to a coating process by the anti-reflection film coating processing unit of the cell 121. Thereby, an anti-reflection film is formed on the surface of the substrate W. The substrate W on which the anti-reflection film is formed is heated by the heating and cooling unit and then cooled. The cooled substrate W is subjected to a coating process by the resist film coating processing unit. Thereby, a resist film is formed on the surface of the substrate W. The substrate W on which the resist film is formed is heated again by the heating and cooling unit and then cooled. The substrate W on which the resist film is formed is subjected to a coating process by the resist cover film coating processing unit of the cell 122. Thereby, a resist cover film is formed on the surface of the substrate W. The substrate W on which the resist cover film is formed is heated by the heating and cooling unit of the cell 122 and then cooled.

[0044] The peripheral portion of the cooled substrate W is exposed by the edge exposure unit of the cell 122. The substrate W whose peripheral portion has been exposed is subjected to a cleaning and drying process in the cleaning processing unit 133a. The cleaned substrate W is cooled by the placement and cooling unit. The cooled substrate W is exposed by an external exposure machine EXP. The exposed substrate W is subjected to a cleaning and drying process in the cleaning and drying processing unit 133b. The cleaned substrate W is subjected to a post-exposure bake process by the heating and cooling unit of the cell 122. The baked substrate W is cooled by the cooling unit of the cell 122. The cooled substrate W is subjected to a development process in the development processing unit. The substrate W subjected to the development process is heated by the heating and cooling unit and then cooled. The cooled substrate W is transferred to the substrate container C of the indexer unit 110. In the above manner, the substrate processing apparatus processes the substrate W.

[0045] <Substrate container> FIG. 2 is a front view schematically showing an example of the configuration of the substrate container C, and FIG. 3 is a side view showing an example of the configuration of the substrate container C. The substrate container C has, for example, a box shape that opens in a substantially horizontal one direction (the front side of the paper surface in FIG. 2). The substrate container C is placed on the container mounting table 111 so that its opening 51 faces the ID transfer mechanism TID side (see also FIG. 1). Projection support portions 52 for supporting the lower surface of the substrate W are provided protruding on the inner surfaces of both side walls 53 of the substrate container C that face each other. The projection support portions 52 protrude inward from the inner surfaces of the respective side walls 53. The upper surface of the projection support portion 52 is substantially horizontal. The projection support portions 52 formed on both side walls 53 support the end portions of the substrate W in the left-right direction. Note that the left-right direction is the direction in which both side walls 53 of the substrate container C face each other.

[0046] A plurality of projection support portions 52 are provided at intervals in the vertical direction, and a plurality of substrates W are respectively supported by the left and right projection support portions 52. The plurality of substrates W are stored in the substrate container C in a state of being stacked at intervals in the vertical direction.

[0047] In the example of FIG. 3, the configuration when the substrate container C is a FOUP is shown, and the substrate container C also includes a lid 54. The lid 54 opens and closes the opening 51. The indexer unit 110 is provided with a drive member for opening and closing the lid 54. When the substrate container C is placed on the container mounting table 111, the drive member opens the lid 54. Thereby, the substrate container C opens to the ID transfer mechanism TID side.

[0048] <Substrate> The substrate W is, for example, a semiconductor wafer and has a substantially disc shape. FIG. 4 is a perspective view schematically showing an example of the configuration of the substrate W. In the present embodiment, as an example, the substrate W has a central portion 91 and a peripheral portion 92 on the outer peripheral side of the central portion 91. The upper surface of the substrate W has a concave shape that is concave at its central portion 91. Conversely, the substrate W has a shape in which its peripheral portion 92 protrudes upward with respect to the central portion 91. The central portion 91 has a substantially circular shape in plan view. The peripheral portion 92 has a substantially annular shape surrounding the central portion 91, and the periphery of the central portion 91 is connected to the inner surface of the peripheral portion 92. The lower surface of the substrate W is substantially flat. Therefore, the peripheral portion 92 of the substrate W is thicker than the central portion 91.

[0049] The diameter of the substrate W is, for example, about 300 mm, and the width (radial width) of the peripheral portion 92 is, for example, about 2 mm to 3 mm. The thickness of the peripheral portion 92 of the substrate W is, for example, about 800 μm, and the thickness of the central portion 91 of the substrate W is, for example, about 45 μm to 60 μm.

[0050] <Substrate transfer mechanism for ID> FIG. 5 is a side view schematically showing an example of the configuration of the transfer mechanism TID for ID, and FIG. 6 is a top view schematically showing an example of the configuration of the transfer mechanism TID for ID. Hereinafter, the transfer mechanism TID for ID is also referred to as a substrate transfer device TID. The substrate transfer device TID includes a hand 1 which is an example of a holding arm 13, a sensor (detection unit) 2, and a hand moving mechanism 3.

[0051] The hand 1 is a member for placing the substrate W. In the examples of FIGS. 5 and 6, the hand 1 includes a pair of fingers 11 and a connecting member 12. Each finger 11 has an elongated shape and is arranged substantially parallel to each other in plan view (that is, when viewed along the vertical direction). The upper surface of the finger 11 is substantially horizontal.

[0052] The connecting member 12 is a member that connects the proximal ends of the fingers 11. In the examples of FIGS. 5 and 6, the connecting member 12 has an elongated plate-like shape and is arranged such that its thickness direction is along the vertical direction. The connecting member 12 is integrally formed of, for example, the same material as the fingers 11. The tips of both fingers 11 are separated from each other. Such a hand 1 has a U-shaped in plan view.

[0053] In the examples of FIGS. 5 and 6, two protrusions 13 are provided on the upper surface of each finger 11. The protrusions 13 project upward from the upper surface of the fingers 11. Each protrusion 13 has, for example, a substantially circular shape in plan view. The total of four protrusions 13 provided on the pair of fingers 11 are respectively provided at the vertices of a virtual quadrilateral in plan view. The upper surface of the protrusion 13 is substantially horizontal. The substrate W is placed on the upper surface of the protrusion 13. More specifically, the upper surface of each protrusion 13 abuts against the lower surface of the peripheral edge portion 92 of the substrate W to support the substrate W.

[0054] In the example of FIG. 6, a suction port 13a is formed on the upper surface of each protrusion 13. At least one suction port 13a is formed in each protrusion 13. In the example of FIG. 6, since four protrusions 13 are provided, at least four suction ports 13a are formed in the hand 1. This suction port 13a is connected to an external suction mechanism (not shown) via a suction path provided inside the hand 1. By the suction mechanism making the air pressure in the suction port 13a negative pressure, the hand 1 can adsorb the substrate W from below. Thereby, the hand 1 can hold the substrate W.

[0055] In the example of FIG. 6, the suction port 13a is located directly below the peripheral edge portion 92 of the substrate W. Therefore, the hand 1 can apply a suction force to the thick peripheral edge portion 92. According to this, the hand 1 can stably hold the substrate W.

[0056] The hand moving mechanism 3 moves the hand 1 at least in the front-rear direction D1 and the vertical direction. Here, the hand moving mechanism 3 further moves the hand 1 in the circumferential direction about a predetermined rotation axis Q1. As a specific example, the hand moving mechanism 3 includes a forward and backward mechanism 31, a lifting mechanism 32, and a rotating mechanism 33. The forward and backward mechanism 31 is controlled by the control unit 140 to move the hand 1 along the front-rear direction D1. The forward and backward mechanism 31 may have, for example, a plurality of articulated arms, or may have a ball screw structure. The forward and backward mechanism 31 is coupled to, for example, the connecting member 12 of the hand 1.

[0057] The lifting mechanism 32 is controlled by the control unit 140 to move the hand 1 along the vertical direction. That is, the lifting mechanism 32 raises and lowers the hand 1. The lifting mechanism 32 has, for example, a ball screw structure. In the example of FIG. 5, the lifting mechanism 32 raises and lowers the hand 1 by raising and lowering the forward and backward mechanism 31.

[0058] The rotating mechanism 33 is controlled by the control unit 140 to rotate the hand 1 around the rotation axis Q1 extending in the vertical direction. As a result, the hand 1 moves along the circumferential direction about the rotation axis Q1. The rotating mechanism 33 has, for example, a motor. In the example of FIG. 5, the rotating mechanism 33 rotates the forward and backward mechanism 31, the lifting mechanism 32, and the hand 1 integrally. By rotating the hand 1 by the rotating mechanism 33, the orientation of the hand 1 can be changed. Referring also to FIG. 1, the rotating mechanism 33 moves the hand 1 between a state where the hand 1 (holding arm 113) faces the substrate container C and a state where the hand 1 faces the placement portion PASS1.

[0059] Since the forward and backward mechanism 31 is rotated by the rotating mechanism 33, the front-rear direction D1 in which the forward and backward mechanism 31 moves the hand 1 becomes the radial direction about the rotation axis Q1. The hand 1 is arranged such that the longitudinal direction of its fingers 11 is along the front-rear direction D1.

[0060] Here, the operation of the substrate transfer device TID when taking out the substrate W from the substrate container C will be outlined. First, the rotation mechanism 33 rotates the empty hand 1 to face the hand 1 towards the substrate container C. Here, the empty hand 1 refers to the hand 1 on which the substrate W is not placed. Next, the lifting mechanism 32 adjusts the height position of the hand 1. Specifically, taking the lower surface of the substrate W to be taken out (the position connecting the upper surfaces of the left and right protrusion support portions 52) as the reference height position, the lifting mechanism 32 adjusts the height position of the hand 1 so that the hand 1 is located slightly below the reference height position. In FIG. 2, an example of the height position of the finger 11 is shown by a virtual line. Next, the reciprocating mechanism 31 moves the hand 1 forward to move the hand 1 to a predetermined stop position directly below the substrate W.

[0061] In the example of FIG. 6, the substrate W placed at the specified reference position in the substrate container C is shown. That is, in FIG. 6, the substrate W and the hand 1 in the state where the hand 1 has entered the substrate container C are shown. In the example of FIG. 6, the hand 1 stopped at the predetermined stop position is shown. As illustrated in FIG. 6, when the substrate W is placed at the specified reference position, the four protrusion portions 13 of the hand 1 face the lower surface of the peripheral portion 92 of the substrate W in the state where the hand 1 has stopped at the stop position.

[0062] Next, the lifting mechanism 32 raises the hand 1. Due to this raising of the hand 1, the protrusion portions 13 of the hand 1 come into contact with and adsorb to the lower surface of the peripheral portion 92 of the substrate W, so that the hand 1 holds the substrate. Thereafter, the lifting mechanism 32 further raises the hand 1 slightly to lift the substrate W from the protrusion support portion 52. When the hand 1 lifts the substrate W, the lifting mechanism 32 stops the raising. Next, the reciprocating mechanism 31 moves the hand 1 backward to retract the hand 1 on which the substrate W is placed from the substrate container C. As described above, the substrate transfer device TID can take out the substrate W from the substrate container C.

[0063] As described above, when the substrate W is placed at the reference position in the substrate container C, the protrusion 13 of the hand 1 abuts against the peripheral edge 92 of the substrate W. Therefore, the hand 1 can stably hold the substrate W. On the other hand, if the placement position of the substrate W deviates significantly in the front-rear direction D1 from the reference position, the relative positional relationship between the substrate W and the hand 1 also deviates. For example, the protrusion 13 comes off from the peripheral edge 92 of the substrate W, and the hand 1 cannot properly hold the substrate W.

[0064] Therefore, the substrate transfer device TID is provided with a sensor 2 for detecting the position of the substrate W in the front-rear direction D1. This sensor 2 is provided so as to be movable integrally with the hand 1. In the examples of FIGS. 5 and 6, the sensor 2 is provided on the finger 11. This sensor 2 is adjacent to the substrate W stored in the substrate container C in the state where the hand 1 enters the inside of the substrate container C. More specifically, in the state where the hand 1 stops at the above-described stop position, the sensor 2 faces the end portion of the substrate W in the front-rear direction D1 in a plan view in the measurement direction D2. The measurement direction D2 is a direction that intersects the front-rear direction D1, for example, a direction perpendicular to the front-rear direction D1. In other words, the arrangement position of the sensor 2 with respect to the finger 11 is determined so that the sensor 2 faces the end portion of the substrate W in the measurement direction D2 in the above-described state. In the example of FIG. 6, the sensor 2 is provided on the proximal end side (rear side) of the finger 11 and faces the rear end portion of the substrate W in the measurement direction D2 in a plan view.

[0065] The sensor 2 detects the position of the substrate W in the front-rear direction D1 in the state where the hand 1 enters the inside of the substrate container C. That is, the sensor 2 measures the position of the substrate W in the front-rear direction D1 from the measurement direction D2 that intersects the front-rear direction D1. In the measurement direction D2 that intersects the front-rear direction D1, it is easy to measure the position of the substrate W in the front-rear direction D1, so the sensor 2 can measure the position of the substrate W in the front-rear direction D1 with high measurement accuracy.

[0066] In the examples of FIGS. 5 and 6, the sensor 2 includes a light emitting unit 21 and a light receiving unit 22. The light emitting unit 21 and the light receiving unit 22 are arranged to face each other in the measurement direction D2. More specifically, the light emitting unit 21 and the light receiving unit 22 are provided at positions that sandwich the rear end of the substrate W in the measurement direction D2 in the entry state. That is, the light emitting unit 21 is provided on the side opposite to the light receiving unit 22 with respect to the said end of the substrate W. In the example of FIG. 6, the light emitting unit 21 is provided on one of the pair of fingers 11, and the light receiving unit 22 is provided on the other of the pair of fingers 11.

[0067] The light emitting unit 21 irradiates a strip-shaped light (that is, electromagnetic wave) having the front-rear direction D1 as the width direction toward the light receiving unit 22. The light emitting unit 21 has a light source such as a laser light source or a lamp light source, for example. Although the wavelength of the light irradiated by the light emitting unit 21 is not particularly limited, infrared rays can be adopted, for example.

[0068] The light receiving unit 22 receives the light irradiated from the light emitting unit 21 and outputs an electrical signal (hereinafter referred to as a detection signal) indicating the amount of received light to the control unit 140. The light receiving unit 22 is also called a photodetector.

[0069] In a state where the empty hand 1 is located outside the substrate container C, the light irradiated from the light emitting unit 21 is directly received by the light receiving unit 22. Here, even in a state where the advancing / retreating mechanism 31 has advanced the hand 1 into the substrate container C and stopped it at a predetermined stop position, before the hand 1 rises, it is assumed that the light from the light emitting unit 21 is directly received by the light receiving unit 22. FIG. 7 is a diagram schematically showing an example of the positional relationship between the substrate W and the sensor 2. FIG. 7 schematically shows an example of the A-A cross section of FIG. 6. In FIG. 7, the sensor 2 when the hand 1 has stopped at the stop position is shown by a virtual line. In this state, the light emitting unit 21 and the light receiving unit 22 are located below the substrate W, and the light irradiated from the light emitting unit 21 is received by the light receiving unit 22 without being blocked by the substrate W.

[0070] When the elevating mechanism 32 raises the hand 1, the light emitting unit 21 and the light receiving unit 22 also rise together with the hand 1. Therefore, as illustrated in FIG. 7, part of the light from the light emitting unit 21 is blocked by the rear end of the substrate W. FIG. 8 is a plan view showing a schematic example of a state where part of the light from the light emitting unit 21 is blocked by the substrate W. FIG. 8 shows an example of such a state when the substrate W is located at the reference position. As can be understood from FIG. 8, among the strip-shaped light from the light emitting unit 21, the front part is irradiated onto the rear end of the substrate W and blocked by the substrate W, while the rear part of the strip-shaped light is not blocked by the substrate W and directly proceeds to the light receiving unit 22. Therefore, the rear part of the strip-shaped light is received by the light receiving unit 22.

[0071] FIG. 9 is a plan view showing an example of such a state when the substrate W is placed in the substrate container C with a shift backward from the reference position. In FIG. 9, the substrate W placed at the reference position is shown by a virtual line. As can be understood from a comparison between FIGS. 8 and 9, the amount of light received by the light receiving unit 22 changes according to the position of the substrate W in the front-rear direction D1. Specifically, the more the substrate W shifts backward, the greater the amount of light blocked by the substrate W, and the smaller the amount of light received by the light receiving unit 22.

[0072] Therefore, the arithmetic unit 141 (see FIG. 5) of the control unit 140 obtains the position of the substrate W in the front-rear direction D1 based on the amount of light received by the light receiving unit 22. For example, the correspondence relationship between the position of the substrate W in the front-rear direction D1 and the amount of light received by the light receiving unit 22 is preset through simulation or experiment. The correspondence relationship information indicating this correspondence relationship is stored in the storage medium of the control unit 140 as, for example, a look-up table or a function.

[0073] The light receiving unit 22 outputs a detection signal indicating the detected amount of received light to the control unit 140. The arithmetic unit 141 obtains the position of the substrate W in the front-rear direction D1 based on the amount of light received indicated by the detection signal and the correspondence relationship information stored in the storage medium. It can be said that this arithmetic unit 141 constitutes the sensor 2 together with the light emitting unit 21 and the light receiving unit 22.

[0074] In the above example, although the arithmetic unit 141 is included in the control unit 140, the arithmetic unit 141 may be provided separately from the control unit 140. The arithmetic unit 141 is an electronic circuit and may have, for example, the same configuration as the control unit 140.

[0075] Based on the position of the substrate W obtained by the arithmetic unit 141, the control unit 140 obtains the adjustment amount of the position of the hand 1 in the front-rear direction D1. Specifically, the control unit 140 obtains the adjustment amount of the position of the hand 1 so that the four protrusions 13 are in contact with the lower surface of the peripheral edge portion 92 of the substrate W. The control unit 140 causes the advancing / retreating mechanism 31 to adjust the position of the hand 1 by the adjustment amount. As a result, even if the substrate W is placed in the substrate container C with a shift in the front-rear direction D1 from the specified reference position, the position of the hand 1 in the front-rear direction D1 is adjusted according to the positional shift of the substrate W. Therefore, the hand 1 can appropriately lift the substrate W.

[0076] Since it is necessary to adjust the position of the hand 1 before the hand 1 comes into contact with the lower surface of the substrate W, it is necessary to detect the position of the substrate W before the hand 1 comes into contact with the lower surface of the substrate W. That is, before the hand 1 comes into contact with the lower surface of the substrate W, a part of the light from the light emitting unit 21 needs to be blocked by the substrate W. Therefore, the light emitting unit 21 and the light receiving unit 22 are provided such that their respective light emitting surfaces and light receiving surfaces are located at least above the upper surface of the protrusion 13 of the hand 1 (that is, the placement surface on which the substrate W is placed).

[0077] <Unloading operation of the substrate transfer device> FIG. 10 is a flowchart showing an example of the unloading operation of the substrate transfer device TID with respect to the substrate container C. Initially, no substrate W is placed on the hand 1, and the hand 1 is located outside the substrate container C. First, the rotation mechanism 33 rotates the empty hand 1 to face the hand 1 toward the substrate container C (step S1). Next, the lifting mechanism 32 adjusts the height position of the hand 1 (step S2). Specifically, the lifting mechanism 32 moves the hand 1 to a height position slightly below the lower surface of the substrate W to be taken out.

[0078] Next, the sensor 2 measures the total light reception amount P1 (step S3). The total light reception amount P1 is the light reception amount of the light received by the light receiving unit 22 in a state where the light from the light emitting unit 21 of the sensor 2 is not blocked by the substrate W. As a specific operation, first, the control unit 140 instructs the light emitting unit 21 to irradiate, and the light emitting unit 21 irradiates light in response to the instruction. The light receiving unit 22 receives the light and outputs a detection signal indicating the light reception amount to the control unit 140. At this time, the light irradiated from the light emitting unit 21 is directly received by the light receiving unit 22. The control unit 140 stores this light reception amount as the total light reception amount P1 in the storage medium.

[0079] Next, the advancing / retreating mechanism 31 moves the hand 1 forward and stops it at a predetermined stop position (step S4). At this predetermined stop position, the hand 1 enters the inside of the substrate container C, and in a plan view, the light emitting unit 21 and the light receiving unit 22 are located on opposite sides with respect to the rear end of the substrate W (see FIGS. 8 and 9). Here, it is assumed that the light from the light emitting unit 21 is not yet blocked by the substrate W before the hand 1 rises (see the virtual line in FIG. 7). In this case, the detection of the total light reception amount P1 (step S3) may be performed in a state where the hand 1 has stopped at the stop position. That is, step S3 may be executed after step S4.

[0080] Next, the elevating mechanism 32 raises the hand 1 (step S5). Since the sensor 2 moves integrally with the hand 1, the sensor 2 also rises. Next, the arithmetic unit 141 calculates a ratio R1 (= P2 / P1) between the light reception amount P2 received by the light receiving unit 22 and the total light reception amount P1 based on the detection signal input from the light receiving unit 22 (step S6). When the light from the light emitting unit 21 is not blocked by the substrate W, the ratio R1 is ideally 1.0. Due to the rise of the sensor 2, a part of the light from the light emitting unit 21 is blocked by the substrate W (see FIGS. 8 and 9), and the light reception amount P2 of the light received by the light receiving unit 22 decreases significantly. At this time, the light reception amount P2 changes to be equal to or greater than a preset first predetermined value. In other words, the ratio R1 also decreases to be equal to or greater than a preset second predetermined value.

[0081] The calculation unit 141 determines whether the ratio R1 is less than a predetermined ratio reference value less than 1.0 (step S7). This ratio reference value is set in advance and stored in the storage medium of the control unit 140. The ratio reference value is a value less than 1.0 and is larger than the light reception amount of the light reception unit 22 in the state where the substrate W is located at the most forward position in the substrate container C. The ratio reference value is a value obtained by subtracting a second predetermined value from 1.0.

[0082] During the period when the light from the light emitting unit 21 is not yet blocked by the substrate W, the ratio R1 is ideally 1.0. Therefore, the calculation unit 141 repeatedly executes a set of steps S6 and S7. When the sensor 2 rises and the light from the light emitting unit 21 is blocked by the substrate W, the ratio R1 becomes less than the ratio reference value. When the ratio R1 becomes less than the ratio reference value, the calculation unit 141 obtains the position of the substrate W in the front-rear direction D1 based on the ratio R1 (step S8). For example, the correspondence relationship between the ratio R1 and the position of the substrate W in the front-rear direction D1 is set in advance by simulation or experiment. The correspondence relationship information indicating this correspondence relationship is stored in the storage medium as, for example, a look-up table or a function. The calculation unit 141 obtains the position of the substrate W in the front-rear direction D1 based on the obtained ratio R1 and the correspondence relationship information stored in the storage medium.

[0083] Next, the control unit 140 determines whether the obtained position of the substrate W is within the allowable range (step S9). The allowable range indicates the allowable range of the position of the substrate W in the front-rear direction D1. Within this allowable range, the elevator mechanism 32 can lift the substrate W at an appropriate position by raising the hand 1.

[0084] If the position of the substrate W is outside the allowable range, the control unit 140 calculates the adjustment amount of the hand 1 based on the comparison between the position of the substrate W and the reference position of the substrate W, and adjusts the position of the hand 1 in the front-rear direction D1 of the advancing / retreating mechanism 31 based on the adjustment amount (step S10). Specifically, the control unit 140 calculates the difference between the obtained position of the substrate W and the reference position of the substrate W as the adjustment amount. The reference position of the substrate W is stored in the storage medium of the control unit 140, for example.

[0085] When adjusting the position of the hand 1 in the front-rear direction D1, the lifting mechanism 32 may once interrupt the upward movement of the hand 1. Then, after the position of the hand 1 is adjusted by the advancing / retreating mechanism 31, the lifting mechanism 32 raises the hand 1 again.

[0086] On the other hand, when the position of the substrate W obtained by the arithmetic unit 141 is within the allowable range, without executing step S10, the lifting mechanism 32 continues to raise the hand 1.

[0087] When the hand 1 lifts the substrate W, the lifting mechanism 32 stops the upward movement of the hand 1. Next, the advancing / retreating mechanism 31 moves the hand 1 backward to retract the hand 1 from inside the substrate container C (step S11).

[0088] As described above, according to the substrate transfer device TID, during the unloading operation of the substrate W, the sensor 2 detects the position of the substrate W in the front-rear direction D1. Then, the substrate transfer device TID moves the hand 1 to an appropriate position with respect to the substrate W according to the detected position, and then raises the hand 1. Therefore, even if a positional deviation in the front-rear direction D1 of the substrate W occurs inside the substrate container C, the substrate transfer device TID can appropriately unload the substrate W.

[0089] Moreover, in the above example, the position of the substrate W in the front-rear direction D1 can be detected by the simple light emitting unit 21 and light receiving unit 22.

[0090] By the way, in the above example, the substrate W has a thin central portion 91 and a thick peripheral portion 92, and the area to be supported (peripheral portion 92) is narrow. Therefore, the allowable amount of positional deviation in the front-rear direction D1 between the substrate W and the hand 1 is small. Therefore, the substrate transfer device TID that can detect the position of the substrate W and adjust the position of the hand 1 is particularly beneficial for the substrate W having the central portion 91 and the peripheral portion 92.

[0091] <Height position of the light emitting unit and the light receiving unit> In the example of FIG. 7, the light emitting unit 21 is provided at a height position different from that of the light receiving unit 22. In the example of FIG. 7, although the light emitting unit 21 is provided at a position higher than the light receiving unit 22, it may be provided at the same height position.

[0092] <Flexure of the substrate> Both left and right ends of the substrate W are supported by the protrusion support portion 52 inside the substrate container C. Therefore, the substrate W bends due to its own weight with both ends as fulcrums. FIG. 11 is a diagram schematically showing an example of the shape of the substrate W stored in the substrate container C. In the example of FIG. 11, the substrate W bends such that its central portion is positioned downward with respect to both ends. That is, the substrate W bends into a shape convex downward. In the substrate container C, since only both ends of the substrate W are supported, in the cross section (FIG. 11) viewed from the front-rear direction D1, the substrate W bends, but in the cross section viewed from the left-right direction, the substrate W hardly bends.

[0093] In FIG. 11, the sensor 2 is also shown. In the present embodiment, before the hand 1 and the sensor 2 are lifted, the light from the light emitting unit 21 is not blocked by the substrate W. That is, the light from the light emitting unit 21 travels below the substrate W and is incident on the light receiving unit 22 as it is. Then, due to the lifting of the hand 1 and the sensor 2, the light from the light emitting unit 21 starts to be blocked by the substrate W. The height position of the light emitting unit 21 when the light starts to be blocked by the substrate W is lower as the amount of flexure of the substrate W is larger. That is, the height position of the hand 1 when the light reception amount changes greatly is lower as the amount of flexure of the substrate W is larger. In other words, the height position of the hand 1 when the ratio R1 changes from 1.0 to a value less than the reference ratio value is lower as the amount of flexure of the substrate W is larger. The relationship between the height position of the hand 1 and the amount of flexure of the substrate W can be preset by, for example, simulation or experiment. Therefore, the correspondence information indicating the relationship between the height position and the amount of flexure is stored in advance in the storage medium of the control unit 140.

[0094] When the hand 1 and the sensor 2 are lifted, the calculation unit 141 monitors the height position of the hand 1 when the received light amount P2 changes significantly, and obtains the amount of deflection of the substrate W based on the difference (distance) between the height position and the reference height position. FIG. 12 is a flowchart showing an example of this operation of the substrate transfer device TID. In FIG. 12, compared with the flowchart of FIG. 10, step S12 is further executed. In the example of FIG. 12, step S12 is executed when it is determined in step S7 that the ratio R1 is less than the ratio reference value. In step S12, the calculation unit 141 obtains the amount of deflection of the substrate W based on the height position of the hand 1. The height position of the hand 1 is obtained based on, for example, the elapsed time from the start of the ascent of the hand 1 and the sensor 2 and the ascent speed. Alternatively, a sensor for detecting the height position of the hand 1 may be provided. For example, when the elevator mechanism 32 has a motor, the sensor may be a so-called encoder that detects the rotational position of the motor. The calculation unit 141 obtains the amount of deflection of the substrate W based on the obtained height position and the correspondence information stored in the storage medium.

[0095] Thereafter, in steps S8 to S11, the substrate W is taken out by the substrate transfer device TID.

[0096] As described above, according to the substrate transfer device TID, when taking out the substrate container C, the amount of deflection of the substrate W can be detected. Therefore, there is no need to separately provide a dedicated detection unit for detecting the amount of deflection, and the amount of deflection of the substrate W can be detected at low cost.

[0097] <Delivery to the substrate holding part> In the example of FIG. 6, the hand 1 has a U shape in plan view and supports the peripheral portion 92 of the substrate W. Therefore, the vicinity of the center of the substrate W does not face the hand 1, and the substrate W can be deflected by its own weight even when placed on the hand 1. Although the amount of deflection of the substrate W on the hand 1 may differ from the amount of deflection of the substrate W in the substrate container C, it is considered that the larger the amount of deflection of the substrate W in the substrate container C, the larger the amount of deflection of the substrate W on the hand 1. That is, when the amount of deflection of the substrate W in the substrate container C is large, the substrate W is relatively easily deflected, so it deflects more on the hand 1.

[0098] The correspondence relationship between the amount of deflection of the substrate W in the substrate container C and the amount of deflection of the substrate W on the hand 1 can also be preset by experiments or simulations. The correspondence relationship information indicating the correspondence relationship is also stored in the storage medium of the control unit 140 as, for example, a look-up table or a function. Therefore, the arithmetic unit 141 can also obtain the amount of deflection of the substrate W on the hand 1 based on the amount of deflection of the substrate W in the substrate container C. In short, the arithmetic unit 141 can obtain the amount of deflection of the substrate W on the hand 1 based on the height position of the hand 1 when the received light amount changes significantly.

[0099] When the substrate transfer device TID transfers the substrate W to the placement unit PASS1, the hand 1 is lowered to place the substrate W on the substrate holding unit of the placement unit PASS1. The substrate holding unit has, for example, a plurality of support pins, and the support pins support the lower surface of the substrate W. For example, the support pins support at least the lower surface of the central portion 91 of the substrate W. At the time of this transfer, the larger the amount of deflection of the substrate W, the higher the position at which the lower surface of the substrate W contacts the substrate holding unit (support pins).

[0100] When placing the substrate W on the substrate holding unit, it is desirable to lower the descent speed in order to reduce the impact. On the other hand, for improving throughput, a higher descent speed is desirable. Therefore, it is desirable to increase the descent speed until the substrate W contacts the substrate holding unit and then set the descent speed at the moment when the substrate W contacts the substrate holding unit to be low.

[0101] Therefore, the control unit 140 determines the lowering speed when transferring the substrate W to the placement unit PASS1 based on the amount of deflection of the substrate W on the hand 1. FIG. 13 is a flowchart showing an example of the operation of the substrate transfer device TID. In the example of FIG. 13, an example of the operation of transferring the substrate W to the placement unit PASS1 is shown. The substrate W is placed on the hand 1. First, the rotation mechanism 33 rotates the hand 1 to face the hand 1 to the placement unit PASS1 (step S21). Next, the lifting mechanism 32 moves the height position of the hand 1 to a preset height position (step S22). Next, the advancing / retreating mechanism 31 moves the hand 1 forward and stops it at a position above the substrate holding part of the placement unit PASS1 (step S23). This position is preset, for example.

[0102] Next, the lifting mechanism 32 starts to lower the hand 1 (step S24). As a result, the lowering speed of the hand 1 increases to the target value. Next, the control unit 140 sets a height reference value based on the amount of deflection of the substrate W on the hand 1 (step S25). This height reference value is set higher as the amount of deflection of the substrate W is larger. The correspondence between the height reference value and the amount of deflection of the substrate W is preset by, for example, experiments or simulations. The correspondence information indicating this correspondence is stored in the storage medium of the control unit 140 as, for example, a look-up table or a function. The control unit 140 sets the height reference value based on the amount of deflection of the substrate W and the correspondence information stored in the storage medium.

[0103] Next, the control unit 140 determines whether the current height position of the hand 1 is lower than the height reference value (step S26). Note that the setting of the height reference value only needs to be performed before this determination process, and may be performed before the lowering of the hand 1 (step S24).

[0104] The control unit 140 calculates the height position of the hand 1 based on, for example, the elapsed time from the start of lowering of the hand 1 and the lowering speed. The control unit 140 compares this height position with the height reference value, and when the height position is still equal to or higher than the height reference value, step S26 is executed again.

[0105] When the height position of the hand 1 is less than the height reference value, the lifting mechanism 32 reduces the descending speed (step S27). Thereby, when the amount of deflection of the substrate W is large, the lifting mechanism 32 can start reducing the descending speed from a higher position. Therefore, the substrate W can be transferred to the substrate holding portion of the placement unit PASS1 in a state where the descending speed is sufficiently reduced.

[0106] Also, until the height position of the hand 1 reaches the height reference value, the hand 1 can be lowered at a high descending speed. Therefore, the substrate W can be transferred to the substrate holding portion of the placement unit PASS1 with high throughput.

[0107] When the substrate W is placed on the substrate holding portion (support pin), the lifting mechanism 32 stops the descent of the empty hand 1, and the reciprocating mechanism 31 retracts the hand 1 from the placement unit PASS1 (step S28).

[0108] As described above, when the amount of deflection is large, the descending speed of the hand 1 can be reduced from a higher height position, and when the amount of deflection is small, the descending speed of the hand 1 can be reduced from a lower height position. Thereby, while sufficiently reducing the descending speed until the substrate W abuts against the substrate placement portion, the hand 1 can be lowered at a high descending speed up to that height position. Therefore, the substrate transfer device TID can transfer the substrate W to the substrate holding portion of the placement unit PASS1 with high throughput while reducing the descending speed at the moment when the substrate W is placed on the substrate holding portion.

[0109] Although the embodiments have been described above, this substrate transfer device can be variously modified other than those described above as long as it does not depart from the gist thereof. In the scope of this disclosure, the embodiments can be freely combined, or any component of each embodiment can be deformed, or any component in each embodiment can be omitted.

[0110] For example, in the above specific example, the sensor 2 is provided on the base end side (rear end side) of the finger 11 of the hand 1. However, the sensor 2 may be provided on the tip side (front side) of the finger 11 of the hand 1. In short, the sensor 2 may be provided at a position facing the front end of the substrate W in the measurement direction D2 in the entry state where the hand 1 enters the substrate container C.

[0111] Also, in the above specific example, the sensor 2 is provided on the finger 11 of the hand 1. However, it is not necessarily limited to this. For example, when other members are connected to the finger 11 and the connecting member 12, the sensor 2 may be connected to the other member.

[0112] Also, in the above example, in order to obtain the amount of deflection of the substrate W, the hand 1 was raised from a height position where the light from the light emitting unit 21 is not blocked by the substrate W. However, when it is not necessary to obtain the amount of deflection of the substrate W, it is not necessarily limited to this. For example, the hand 1 may be made to enter the substrate container C at a height position where the light from the light emitting unit 21 is blocked by the substrate W. In this case, in a state where the hand 1 is stopped at the stop position in the substrate container C, the sensor 2 can detect the position of the substrate W in the front-rear direction D1.

[0113] In the above specific example, when the substrate transfer device TID places the substrate W on the placement unit PASS1, the lowering speed of the hand 1 is adjusted according to the amount of deflection of the substrate W. However, the adjustment of this lowering speed is not necessarily limited to the placement on the placement unit PASS1. For example, in each processing unit of the processing unit 120, a substrate holding unit for holding the substrate W is provided. The substrate holding unit may include, for example, a plate-shaped substrate placement unit formed with a suction port for sucking the lower surface of the substrate W, and a lift pin for raising and lowering the substrate W. The substrate placement unit abuts on the lower surface of the substrate W at least near the center of the substrate W. In a state where the lift pin is raised, the lift pin supports the substrate W above the substrate placement unit. When the substrate W is carried in, in a state where the lift pin is raised, the main transfer mechanism T1 or the main transfer mechanism T2 places the substrate W on the lift pin. The lift pin descends while supporting the substrate W and is placed on the substrate placement unit. In this case, the lift pin may adjust the lowering speed according to the amount of deflection of the substrate W. The correspondence relationship between the amount of deflection of the substrate W on the lift pin and the amount of deflection of the substrate W on the hand 1 can also be preset by simulation or experiment, etc. The greater the amount of deflection of the substrate W, the lower the lowering speed starts from a higher position. Thereby, the substrate W can be delivered to the substrate placement unit at a high throughput, and the lowering speed at the time of delivering the substrate W to the substrate placement unit can be reduced.

Description of Reference Numerals

[0114] C Substrate container 1 Hand 2 Detection unit (sensor) 21 Light emitting unit 22 Light receiving unit 31 Forward and backward mechanism 32 Lifting mechanism 33 Moving mechanism (rotating mechanism) 13a Suction port 140 Control unit 141 Arithmetic unit

Claims

1. A substrate transport device that removes a substrate from a substrate container having an internal structure in which a plurality of substrates are stored in a horizontal position and stacked at intervals in a vertical direction, and transports the substrate to a substrate holding section, Hand and a forward / backward mechanism for moving the hand in a forward / backward direction to move the hand into and out of the substrate container; a lifting mechanism that lifts the hand and lifts the substrate from below with the hand; a moving mechanism that moves the hand to a position facing the substrate container; a detection unit that moves together with the hand, is provided at a position adjacent to the substrate in a measurement direction intersecting a front-rear direction when the advancing / retracting mechanism has advanced the hand into the substrate container, and detects the position of the substrate in the front-rear direction when the advancing / retracting mechanism has advanced the hand into the substrate container; Equipped with The detection unit is a light emitting unit and a light receiving unit arranged to face each other in a measurement direction; Calculation section and Including, The hand is Finger and a protrusion provided on the finger and supporting a lower surface of the substrate; Including, the light emitting portion is provided such that a light emitting surface is located above an upper surface of the protrusion, the light receiving portion is provided such that a light receiving surface is located above an upper surface of the protrusion, The light emitting unit irradiates a strip of light having a width direction in the front-rear direction toward the light receiving unit, The calculation unit determines a front-to-rear position of the substrate based on an amount of light received by the light receiving unit, and determines a position adjustment amount for moving the substrate based on the position.

2. A substrate transport device that removes a substrate from a substrate container having an internal structure in which a plurality of substrates are stored in a horizontal position and stacked at intervals in a vertical direction, and transports the substrate to a substrate holding section, Hand and a forward / backward mechanism for moving the hand in a forward / backward direction to move the hand into and out of the substrate container; a lifting mechanism that lifts the hand and lifts the substrate from below with the hand; a moving mechanism that moves the hand to a position facing the substrate container; a detection unit that moves together with the hand, is provided at a position adjacent to the substrate in a measurement direction intersecting a front-rear direction when the advancing / retracting mechanism has advanced the hand into the substrate container, and detects the position of the substrate in the front-rear direction when the advancing / retracting mechanism has advanced the hand into the substrate container; Equipped with The detection unit is a light emitting unit and a light receiving unit arranged to face each other in a measurement direction; Calculation section and Including, The light emitting unit irradiates a strip of light having a width direction in the front-rear direction toward the light receiving unit, The calculation unit calculates a ratio between the amount of light received by the light receiving unit when the light from the light emitting unit is not blocked by the substrate and the amount of light received by the light receiving unit in the entering state, determines the front-to-rear position of the substrate based on the ratio, and determines whether the position is within an acceptable range.

3. 3. The substrate transport device according to claim 1, The substrate transport device, wherein the light emitting unit is provided at a different height from the light receiving unit.

4. A substrate transport device according to any one of claims 1 to 3, The substrate has a central portion and a peripheral portion that is outer than the central portion, and the peripheral portion is thicker than the central portion.

5. 5. The substrate transport device according to claim 1, The substrate transport device, wherein the hand is formed with at least two suction ports.

Images