Mounting device and mounting method

Abstract

To provide a mounting device and a mounting method capable of realizing high accuracy mounting in which a mounting accuracy becomes 1 μm or less in a face-down mounting for mounting a chip component and a substrate in a manner that both of electrode surfaces face each other.SOLUTION: A mounting device comprises: an attachment tool having transparency and having a tool recognition mart, for holding a chip component; chip position recognition means for acquiring position information on a chip recognition mark and the tool recognition mark at the same time in a state where the chip component is held by the attachment tool; and substrate position recognition means for acquiring the position information on a substrate recognition mark and the tool recognition marl. On the basis of information obtained by the chip position recognition means and the information obtained by the substrate position recognition means, the substrate stage or the attachment tool is moved in a substrate inner surface direction and positioning of the chip component and the substrate is performed. A mounting method is also provided.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a mounting apparatus and a mounting method for mounting chip components on a substrate. In particular, it relates to a mounting apparatus and a mounting method for performing mounting by opposing the electrode surface of a chip component to the electrode surface of a substrate.

Background Art

[0002] As one form of mounting chip components such as semiconductor chips on a substrate such as a wiring board, there is face-down mounting in which the electrode surface of the chip component is opposed to the electrode surface of the substrate for mounting.

[0003] FIG. 17 shows an example of a substrate S for face-down mounting. A chip component is joined to the mounting location SC of the substrate S with the electrode surfaces facing each other. At this time, if the chip component is not accurately placed at the mounting location SC of the substrate S, the electrical connection between the substrate S and the chip component will be incomplete, causing poor quality of the semiconductor device. For this reason, on each mounting location SC of the substrate S, a substrate recognition mark AS, namely a substrate recognition first mark AS1 and a substrate recognition second mark AS2, are provided on the electrode surface side as shown in FIG. 17. On the other hand, the chip component is also provided with a chip recognition mark AC, namely a chip recognition first mark AC1 and a chip recognition second mark AC2. In the state shown in FIG. 18, the relative position of the chip component C with respect to the mounting location SC of the substrate S (in the in-plane direction of the substrate S) can be obtained from the positional relationship between the substrate recognition first mark AS1 and the chip recognition first mark AC1 and the positional relationship between the substrate recognition second mark AS2 and the chip recognition second mark AC2, and the positional accuracy can be improved by correcting this.

[0004] Specifically, in the mounting apparatus shown in FIG. 19, upper and lower two-field cameras 500 are used. The upper field 50U of the upper and lower two-field cameras 500 includes the chip recognition first mark AC1 (or the chip recognition second mark AC2) in the field of view, and the lower field 50D includes the substrate recognition first mark AS1 (or the substrate recognition second mark AS2) in the field of view for imaging (FIG. 20).

[0005] By using this top-bottom dual-field camera to determine and correct the relative position of the chip component C with respect to the mounting location SC on the substrate S (in the plane of the substrate S), mounting with a maximum error of about several micrometers is possible.

Prior Art Documents

Patent Documents

[0006]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0007] The numerical value of the maximum error of several micrometers was sufficient in the case of a face-down mounting called so-called flip-chip mounting when the electrode pitch using solder bumps as the electrodes of the chip component C was 100 μm. However, when the electrode pitch using Cu pillar bumps is more than 50 μm, there is no margin, and in the current situation where higher-density mounting progresses and the electrode pitch becomes narrower, there are also applications where the accuracy is insufficient.

[0008] Therefore, an attempt is made to further improve the accuracy by using the top-bottom dual-field camera. However, in the state shown in Fig. 20, even if the chip component C is aligned with respect to the mounting location SC on the substrate S with an error of less than 1 μm (in the plane of the substrate S), the maximum error at the mounting stage may exceed 1 μm. This is due to, for example, a slight inclination in the descending direction when the chip C descends toward the substrate S from the state of Fig. 20. For this reason, an attempt is made to solve this problem by improving the machining accuracy and rigidity of each part of the mounting apparatus so that the descending direction with respect to the surface holding the substrate S is perpendicular, but this affects the apparatus cost.

[0009] Therefore, it can be expected that the mounting accuracy will also be improved if alignment is performed with the substrate S and the chip component C as close as possible. However, when using the top-bottom dual-field camera, it is difficult to significantly improve the current situation due to the thickness of the camera itself and the relationship of the focal length.

[0010] On the one hand, in the face-up mounting where the electrode surface of the substrate S and the electrode surface of the chip component C face the same direction as shown in FIG. 21, using a mounting apparatus 100 configured as shown in FIG. 22, the positional relationship between the substrate recognition first mark AS1 and the chip recognition first mark AC1 as shown in FIG. 23(a) and the positional relationship between the substrate recognition second mark AS2 and the chip recognition second mark AC2 as shown in FIG. 23(b) can be observed from the same direction. Therefore, it is possible to perform alignment with the substrate S and the chip component C in a state where they are brought as close as possible to each other (see Patent Document 1, etc.).

[0011] Therefore, in face-down mounting, by providing a chip recognition mark AC on the side opposite to the electrode surface of the chip component C, it is possible to perform alignment with the substrate S and the chip component C in a state where they are brought as close as possible to each other, similar to the face-up mounting shown in FIG. 23.

[0012] However, since the purpose of alignment is to ensure reliable bonding between the electrodes of the chip component C and the substrate S, the chip recognition mark AC needs to be provided with high precision with respect to the electrodes of the chip component C. However, it is extremely difficult to accurately and highly precisely arrange the chip recognition mark AC with respect to the relative position with the electrodes on the opposite surface, and it is not suitable as a means for performing face-down mounting with high precision. Furthermore, it is also necessary to newly provide a process for drawing a recognition mark on the side opposite to the electrode surface, which is not preferable in terms of process cost.

[0013] The present invention has been made in view of the above problems, and provides a mounting apparatus and a mounting method that realize high-precision mounting with a mounting accuracy of 1 μm or less in face-down mounting where electrode surfaces face each other for mounting.

Means for Solving the Problems

[0014] In order to solve the above problems, the invention according to claim 1 is A mounting apparatus for mounting a chip component having a chip recognition mark for alignment and a substrate having a substrate recognition mark for alignment with the surface having the chip recognition mark and the surface having the substrate recognition mark facing each other, An attachment tool that has transparency and has a tool recognition mark, and holds the opposite surface of the surface of the chip component that has the chip recognition mark; a mounting head that holds the attachment tool at its tip; lifting means for lifting and lowering the mounting head in a direction perpendicular to the substrate; a substrate stage that holds the substrate; and chip position recognition means for simultaneously acquiring position information of the chip recognition mark and position information of the tool recognition mark while the chip component is held by the attachment tool. Substrate position recognition means for acquiring position information of the substrate recognition mark and position information of the tool recognition mark, and a control unit connected to the mounting head, the lifting means, the substrate stage, the chip position recognition means, and the substrate position recognition means. At least one of the substrate stage and the attachment tool is movable in the in-plane direction of the substrate. Based on the information obtained by the chip position recognition means and the information obtained by the substrate position recognition means, the control unit moves the substrate stage or the attachment tool in the in-plane direction of the substrate to align the chip component and the substrate. This is a mounting device.

[0015] The invention according to claim 2 is the mounting device according to claim 1, The substrate position recognition means can be moved independently of the mounting head, and it is a mounting device that acquires position information of at least one of the substrate recognition mark and the tool recognition mark through the attachment tool.

[0016] The invention according to claim 3 is the mounting device according to claim 1 or claim 2, The bonding head has tool position moving means for adjusting the position of the attachment tool in the in-plane direction of the chip component. This is a mounting device.

[0017] The invention according to claim 4 is the mounting device according to any one of claims 1 to 3, A mounting apparatus comprising a chip slider for mounting the chip component and a transfer rail for transferring the chip slider as components, and having a chip transfer means for transferring the chip component directly below the attachment tool.

[0018] The invention according to claim 5 is a mounting apparatus according to claim 4, A mounting apparatus in which the chip transfer means has a position adjusting means for adjusting the in-plane position of the chip component mounted on the chip slider.

[0019] The invention according to claim 6 is a mounting apparatus according to any one of claims 1 to 5, A mounting apparatus in which, with the chip component held by the attachment tool and facing the substrate, the substrate position recognition means simultaneously acquires the position information of the tool recognition mark and the substrate recognition mark.

[0020] The invention according to claim 7 is a mounting apparatus according to any one of claims 1 to 5, A mounting apparatus in which the substrate position recognition means acquires the position information of the substrate recognition mark in a state where the chip component is not held.

[0021] The invention according to claim 8 is a mounting apparatus according to claim 7, A mounting apparatus in which the attachment tool is brought close until the distance between the lower surface of the attachment tool and the upper surface of the substrate is substantially equal to the thickness of the chip component, and the position information of the tool recognition mark and the substrate recognition mark is simultaneously acquired.

[0022] The invention according to claim 9 is A mounting method of mounting a chip component having a chip recognition mark for alignment and a substrate having a substrate recognition mark for alignment with the surface having the chip recognition mark facing the surface having the substrate recognition mark, using the mounting apparatus according to any one of claims 1 to 5, a mounting method comprising: a substrate holding process of holding the substrate on a substrate stage; a chip holding process of holding the chip component with an attachment tool having a tool recognition mark; a chip position information acquisition process of acquiring position information of the chip recognition mark and the tool recognition mark while the chip component is held by the attachment tool; a substrate position information acquisition process of acquiring position information of the tool recognition mark and the substrate recognition mark while the chip component is held by the attachment tool and facing the substrate; and an alignment process of adjusting the position of the chip component in the in-plane direction of the substrate based on relative position information of the chip recognition mark and the substrate recognition mark with respect to the tool recognition mark.

[0023] The invention according to claim 10 is A mounting method of mounting a chip component having a chip recognition mark for alignment and a substrate having a substrate recognition mark for alignment with the surface having the chip recognition mark facing the surface having the substrate recognition mark, using the mounting apparatus according to any one of claims 1 to 5, comprising: a substrate holding process of holding the substrate on a substrate stage; a substrate position information acquisition process of acquiring position information of the substrate recognition mark; a chip holding process of holding the chip component with the attachment tool; a chip position information acquisition process of acquiring position information of the chip recognition mark and the tool recognition mark while the chip component is held by the attachment tool; and an alignment process of adjusting the position of the chip component in the in-plane direction of the substrate based on relative position information between the tool recognition mark and the chip recognition mark.

[0024] The invention according to claim 11 is the mounting method according to claim 10, The mounting method according to claim 10, a mounting method in which, in the substrate position information acquisition process, the distance between the lower surface of the attachment tool and the upper surface of the substrate is made substantially equal to the thickness of the chip component, and position information of the substrate recognition mark and the tool recognition mark is acquired.

Effect of the Invention

[0025] According to the present invention, alignment can be performed in a state where the chip component and the electrode surface of the substrate are opposed to each other and approaching each other, so that highly accurate face-down mounting becomes possible.

Brief Description of the Drawings

[0026]

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Figure 17

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Figure 20

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Figure 22

Figure 23

Embodiments for Carrying Out the Invention

[0027] Embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a schematic diagram of a mounting device 1 in an embodiment of the present invention.

[0028] The mounting device mounts a chip component on a board such as a wiring board. The mounting device 1 in FIG. 1 is configured to perform face-down mounting in which the electrode surface of the chip component faces the electrode surface of the board.

[0029] The mounting device 1 includes a board stage 2, a lifting means 3, a mounting head 4, a board position recognition means 5, a chip transfer means 6, and a chip position recognition means 7 as components.

[0030] In the mounting device 1 of FIG. 1, the board stage 2 is composed of a stage movement control means 20 and a suction table 23. The suction table 23 adsorbs and holds the board placed on the surface. The suction table 23 can move in the in-plane direction of the board surface while holding the board by the stage movement control means 20.

[0031] The stage movement control means 20 is composed of a Y-direction stage movement control means 22 that can linearly move the adsorption table 23 in the Y direction, and an X-direction stage movement control means 21 that can linearly move the Y-direction stage movement control means 22 in the X direction and is provided on the base 200. The Y-direction movement control means 22 mounts the adsorption table 23 on a movable part arranged on the slide rail, and the movable part is moved and position-controlled by a Y-direction servo 221. Also, the X-direction movement control means 21 mounts the Y-direction movement control means 22 on a movable part arranged on the slide rail, and the movable part is moved and position-controlled by an X-direction servo 211.

[0032] The lifting means 3 is fixed to a gantry frame (not shown), the vertical drive shaft is provided in a direction perpendicular to the adsorption table 23, and the mounting head 4 is connected to the vertical drive shaft. The lifting means 3 has a function of driving the mounting head 4 up and down and applying a pressing force according to the setting. Also, in the mounting device 1, since the lifting means 3 is supported from two directions (by a gantry frame not shown) and is linearly connected to the mounting head 4, it is difficult for a lateral force to be applied to the mounting head 4 during pressing.

[0033] The mounting head 4 holds the chip component C and crimps it in a state parallel to the substrate (held on the suction table 23 of the substrate stage 2). The mounting head 4 comprises a head body 40, a heater unit 41, an attachment tool 42, and a tool position control means 43. The head body 40 is connected to the elevating means 3 via the tool position control means 43, and the heater unit 41 is fixedly arranged on the lower side. The heater unit 41 has a heat generating function and heats the chip component C via the attachment tool 42. Further, the heater unit 41 has a function of adsorbing and holding the attachment tool 42 using a decompression flow path. The attachment tool 42 adsorbs and holds the chip component C and is exchanged according to the shape of the chip component C. The tool position control means 43 finely adjusts the position of the head body 40 in the direction within the vertical plane with respect to the vertical drive shaft of the elevating means 3, and accordingly, the position of the attachment tool 42 and the chip component C held by the attachment tool 42 (in the XY plane of the figure) is adjusted.

[0034] The tool position control means 43 comprises an X-direction tool position control means 431, a Y-direction tool position control means 432, and a tool rotation control means 433. In the embodiment shown in FIG. 1, the tool rotation control means 433 adjusts the rotation direction of the head body 40, the Y-direction tool position control means 432 adjusts the Y-direction position of the tool rotation control means 433, and the X-direction tool position control means 431 adjusts the X-direction position of the Y-direction position control means, but it is not limited thereto, and it is sufficient if the X-direction position, Y-direction position, and rotation angle of the attachment tool 42 can be adjusted.

[0035] FIG. 2 shows a mainly a view of the periphery of the head body 40 (front view in FIG. 2(a) and side view in FIG. 2(b)). In the face-down mounting of the present embodiment, chip recognition marks AC (chip recognition first mark AC1 and chip recognition second mark AC2) are provided at diagonal positions of the electrode surface of the chip component C, and substrate recognition marks AS (substrate recognition first mark AS1 and substrate recognition second mark AS2) are provided at reference positions diagonal to the chip component mounting locations on the electrode surface of the substrate S. All of them face the electrode surface of the substrate S of the mounting head 4.

[0036] Also, in the present invention, a tool recognition mark AT is provided on the surface that holds the chip component C of the attachment tool 42, and the tool recognition first mark AT1 and the tool recognition second mark AT2 are arranged so as to correspond to the positions of the chip recognition first mark AC1 and the chip recognition second mark AC2 of the chip component C to be held.

[0037] In the mounting device 1, the substrate recognition mark AS and the tool recognition mark AT are configured to be observable through the mounting head 4. The attachment tool 42 is formed of a transparent member, or a through hole is provided in accordance with the position of the substrate recognition mark AS. Also, for the heater unit 41, it is necessary to use a transparent member or provide an opening so that the tool recognition mark AT can be observed. In the present embodiment, a through hole 41H is provided as shown in FIG. 2. Further, the mounting head 4 requires a space in which the image capturing unit 50 of the substrate position recognition means 5 can move in order to observe the substrate recognition mark AS or / and the tool recognition mark AT. In the present embodiment, a head space 40V is provided as shown in FIG. 2. That is, the head body 40 has a structure configured by side plates connected on the heater 41 and a top plate connecting both side plates.

[0038] The substrate position recognition means 5 acquires the position information of the substrate recognition mark AS or / and the tool recognition mark AT, which is imaged by focusing through the mounting head 4 (through the attachment tool 42 and the heater unit 41). In the present embodiment, the substrate position recognition means 5 includes an image capturing unit 50, an optical path 52, and an imaging means 53 connected to the optical path 52 as components.

[0039] The image capturing unit 50 is disposed above the recognition target from which the imaging means 53 acquires an image, and includes the recognition target within the field of view.

[0040] Further, the substrate position recognition means 5 is configured to be movable in the in-plane direction of the substrate S (and the chip component C) within the head space 40V by a drive mechanism (not shown). Further, it is desirable that the substrate S can also be moved in the vertical direction (Z direction) so that the focal position can be adjusted.

[0041] The mounting head 4 moves in the vertical direction with respect to the substrate S by the lifting means 3, and this operation can be performed independently of the operation of the substrate position recognition means 5. For this reason, even when the mounting head 4 moves in the vertical direction, it is necessary to design the head space 40V to have dimensions such that the substrate position recognition means 5 that has entered the head space 40V does not interfere.

[0042] Note that the movable range of the image capture unit 50 of the substrate position recognition means 5 is not limited to within the head space 40V, and it is also possible to move outside the head space 40V onto the substrate S to acquire the position information of the substrate recognition mark AS.

[0043] The chip transfer means 6 is composed of a transfer rail 60 and a chip slider 61, and the chip slider 61 holds the chip component C supplied from a chip supply unit (not shown) and slides it to directly below the attachment tool 42 for transfer.

[0044] Here, the chip supply unit (not shown) arranges the chip component C at a fixed position on the chip slider 61. If necessary, the chip component C arranged on the chip slider 61 may recognize the arrangement position by a recognition mechanism (not shown). Further, the chip transfer means 6 may have position adjustment means for adjusting the position of the chip component C mounted on the chip slider 61 in the in-plane direction (XY direction). In this way, by controlling the position of the chip slider 61 and the chip component C arranged on the chip slider 61, it is possible to transfer the chip component C within a predetermined range of the attachment tool 42. After the attachment tool 42 holds the chip component C, the chip slider 61 that has released the holding of the chip component C moves to the retracted position.

[0045] The chip position recognition means 7 images the chip recognition mark AC of the chip component C held by the attachment tool 42 and also images the tool recognition mark AT to obtain the position information of the chip recognition mark AC and the tool recognition mark AT.

[0046] As shown in the block diagram of FIG. 3, the mounting apparatus 1 includes a substrate stage 2, a lifting means 3, a mounting head 4, a substrate position recognition means 5, a conveying means 6, and a control unit 10 connected to the chip position recognition means 7.

[0047] Substantially, the control unit 10 has a CPU and a storage device as main components, and an interface is interposed between the control unit 10 and each device as necessary. Further, by incorporating a program, the control unit 10 can perform calculations using the acquired data and perform an output according to the calculation result. Furthermore, it is desirable that the control unit 10 also has a function of recording the acquired data and the calculation result and using them as new data for calculation.

[0048] The control unit 10 is connected to the substrate stage 2, controls the operations of the X-direction stage movement control means 21 and the Y-direction stage movement control means 22, and controls the in-plane movement of the suction table 23. Also, the control unit 10 controls the suction table 23 to control the suction and holding and release of the substrate S.

[0049] The control unit 10 is connected to the lifting means 3, controls the vertical (Z-direction) position of the mounting head 4, and has a function of controlling the pressing force when pressing the chip component C against the substrate S.

[0050] The control unit 10 is connected to the mounting head 4 and has a function of controlling, by the tool position control means 43, the suction and holding and release of the chip component C by the attachment tool 42, the heating temperature of the heater unit 41, and the position of the head body 40 (and the heater unit 41 and the attachment tool 42) in the XY plane.

[0051] The control unit 10 is connected to the substrate position recognition means 5, and has a function of controlling the driving in the horizontal (in the XY plane) direction and the vertical (Z direction), and controlling the imaging means 53 to acquire image data. Further, the control unit 10 has an image processing function, and has a function of calculating the position of the substrate recognition mark AS and / or the tool recognition mark AT from the image acquired by the imaging means 53.

[0052] The control unit 10 is connected to the chip transfer means 6, and has a function of controlling the position of the chip slider 61 that moves along the transfer rail 60.

[0053] The control unit 10 is connected to the chip position recognition means 7, and has a function of controlling the driving in the horizontal (in the XY plane) direction of the chip position recognition means 7 and controlling an imaging means (not shown) to acquire image data. Further, the image processing function of the control unit 10 has a function of calculating the position of the chip recognition mark AC and / or the tool recognition mark AT.

[0054] Hereinafter, the process of aligning and mounting the chip component on the mounting location SC of the substrate S by the mounting apparatus 1 will be described with reference to FIGS. 4 to 7. Prior to this, the substrate S has passed through the substrate holding process and is held on the substrate stage 2 of the mounting apparatus 1. Here, it is desirable that the arrangement information of the substrate S with respect to the suction table 23 of the substrate stage 2 is acquired by an image recognition means or the like and stored in the control unit 10.

[0055] Also, the chip component C has gone through a chip holding process of being transported by the chip transfer means 6 and held by the attachment tool 42. Here, the chip component C is transferred from a chip supply unit (not shown) to the chip slider 61, and a predetermined position accuracy is ensured when being transferred from the chip slider 61 to the attachment tool 42, and is held by the attachment tool 42 with a predetermined position accuracy.

[0056] Therefore, in the chip position information acquisition process shown in FIG. 4, the chip position recognition means 7 can observe the chip recognition mark AC and the tool recognition mark AT at a high magnification within the same visual field. That is, in the state shown in FIG. 4(a), as shown in FIG. 5(a), the first chip recognition mark AC1 and the first tool recognition mark AT1 can be imaged within the same visual field, and the relative position information between the first chip recognition mark AC1 and the first tool recognition mark AT1 can be obtained. Similarly, in the state of FIG. 4(b), an image as shown in FIG. 5(b) can be obtained, and the relative position information between the second chip recognition mark AC2 and the second tool recognition mark AT2 can be obtained. From the position information of the chip recognition mark AC and the tool recognition mark AT obtained at these two locations, and using the position information of the first tool recognition mark AT1 and the second tool recognition mark AT2, the position information of the first chip recognition mark AC1 and the second chip recognition mark AC2 of the held chip component C can be calculated.

[0057] In the mounting apparatus 1 of FIG. 1, the chip position recognition means 7 is fixed to the suction table 23. Therefore, the suction table 23 is moved by the stage movement control means 20 so that the chip position recognition means 7 is disposed under the attachment tool 42.

[0058] After the chip position information acquisition process, the suction table 23 is moved by the stage movement control means 20 so that the chip mounting location SC is disposed directly below the attachment tool 42. Thereafter, the lifting means 3 is driven to lower the mounting head 4, and the chip component C is brought as close as possible without contacting the substrate S (FIG. 6).

[0059] From this state, in the process of acquiring the substrate position information shown in FIG. 6, the substrate position recognition means 5 observes the substrate recognition mark AS from above the attachment tool 42. Since the attachment tool 42 is transparent, the tool recognition mark AT can also be observed. Further, as described above, since the arrangement information of the substrate S on the suction table 23 is obtained, the mounting location SC of the substrate S is arranged directly below the attachment tool 42, and the substrate position recognition means 5 can observe the substrate recognition mark AS and the tool recognition mark AT at a high magnification within the same visual field. That is, in the state shown in FIG. 6(a), as shown in FIG. 7(a), the tool recognition first mark AT1 and the substrate recognition first mark AS1 can be imaged within the same visual field. Similarly, in the state of FIG. 6(b), as shown in FIG. 7(b), the tool recognition second mark AT2 and the substrate recognition second mark AS2 can be imaged within the same visual field.

[0060] Note that the chip recognition first mark AC1 is marked in FIG. 7(a) and the chip recognition second mark AC2 is marked in FIG. 7(b). However, if the substrate position recognition means 5 is an imaging means in the visible light range, neither of them can be observed. However, from the relative positional relationship between the chip recognition mark AC and the tool recognition mark AT obtained in the chip position information acquisition process, the position information of the chip recognition first mark AC1 within the visual field shown in FIG. 7(a) and the chip recognition second mark AC2 within the visual field shown in FIG. 7(b) can be obtained.

[0061] Therefore, the positional relationship between the chip recognition first mark AC1 and the substrate recognition first mark AS1 and the positional relationship between the chip recognition second mark AC2 and the substrate recognition second mark AS2 are known. In the alignment process, the control unit 10 controls the tool position control means 43 or / and the stage movement control means 20 to perform alignment so as to correct the positional deviation of the chip component C with respect to the mounting location SC of the substrate S.

[0062] After that, the lifting means 3 is driven to lower the mounting head 4 to bring the chip component C into close contact with the substrate S. As the mounting process, the chip component C is pressed with a predetermined pressure, and the heater unit 40 is heated to bond the electrodes of the substrate C and the chip component C. Here, since the lowering distance from the alignment process to the mounting process is very small, mounting can be performed while maintaining the accuracy aligned in the alignment process.

[0063] By the way, in the mounting apparatus 1 shown in FIG. 1, the chip position recognition means 7 is provided on the suction table 23, but the arrangement location of the chip position recognition means 7 is not limited to this. For example, in the modification 1 shown in FIG. 8, the chip position recognition means 7 is provided so as to be slidable along the transfer rail 60 of the chip transfer means 6 and can be arranged under the attachment tool 42 as shown in FIG. 9. Further, as in the modification 2 shown in FIG. 10, it is also possible to adopt a configuration in which the chip position recognition means 7 is combined with the substrate position recognition means 5. In this configuration, by providing the substrate position recognition means 5 on a driving means that also moves in the vertical direction, the chip position recognition means 7 can observe the chip component C held by the attachment tool 42.

[0064] Modification 3 in FIG. 11 shows an example in which a plurality of mounting heads 4 (4A and 4B) are provided for one substrate stage 23.

[0065] By the way, recently, as shown in FIG. 12, a form in which the mounting location SC is arranged on the substrate S with a slight gap has emerged. In such a form, unlike the style in which the substrate recognition mark AS shown in FIG. 17 is outside the mounting location SC, the substrate recognition mark AS may be provided inside the mounting location SC as shown in FIG. 12.

[0066] Therefore, even when the present invention is applied to the form in which the mounting location SC is arranged on the substrate S with a slight gap, as shown in FIG. 13, in the substrate position information acquisition process, the substrate recognition mark AS cannot be observed because it is hidden by the shadow of the chip component.

[0067] Therefore, FIG. 14 shows an example of using the substrate recognition mark AS at adjacent mounting locations. That is, in FIG. 14(a), in the mounting area located on the diagonal line, the first substrate recognition mark AS1 of the mounting area at the upper right of the figure is used as the second substrate recognition mark Aso2, and the second substrate recognition mark AS2 of the mounting area at the lower left of the figure is used as the first substrate recognition mark Aso1 (for alignment), and it is possible to observe outside the chip component Ca. However, if the chip component Cb is arranged at the mounting location, as shown in FIG. 14(b), one of the substrate recognition marks AS on the diagonal of the chip component Ca cannot be observed due to the chip component Cb. For this reason, it is difficult to sequentially align and mount the chip component C at the mounting location SC of the substrate S as shown in FIG. 12 using the present invention.

[0068] However, it is possible to address this problem by devising the arrangement of the substrate recognition mark AS provided at the mounting location SC of the substrate S. That is, as shown in FIG. 15, by providing the substrate recognition mark AS at the upper left of the figure at each mounting location SC, although it is not on the perfect diagonal line with respect to the chip recognition mark AC of the chip component Ca for alignment, it is possible to perform alignment using the substrate recognition marks AS of the right adjacent mounting location and the lower adjacent mounting location. An example of this is shown in FIG. 15(a). From this state, by repeating the process of moving to the right and, after reaching the right end, moving to the left end of the lower row, it is possible to align and mount the chip component C at each mounting location of the substrate S using the present invention.

[0069] Also, by changing the order of the chip position information acquisition process and the substrate position information acquisition process, it is possible to perform alignment using the substrate recognition mark AS within the mounting location SC shown in FIG. 12 without using the substrate recognition marks AS of adjacent mounting areas.

[0070] That is, when the chip component C is not held as shown in FIG. 16, in the process of acquiring the substrate position information, the relative position information of the tool recognition mark AT and the substrate recognition mark AS is acquired by the substrate position recognition means 5 and utilized. Specifically, as shown in FIG. 16, the attachment tool 42 is brought close to the substrate S, and using the substrate position recognition means 5, the positional relationship between the first tool recognition mark AT1 and the first substrate recognition mark AS1 (FIG. 16(a)) and the positional relationship between the second tool recognition mark AT2 and the second substrate recognition mark AS2 (FIG. 16(b)) are acquired, and the relative position information is stored.

[0071] After that, after raising the attachment tool 42 and holding the chip component C (chip holding process), the positional relationship between the first chip recognition mark AC1 and the first tool recognition mark AT1 and the relative position information between the second chip recognition mark AC2 and the second tool recognition mark AT2 are acquired using the chip position recognition means 7 (chip position information acquisition process).

[0072] Based on the respective position information obtained in the above procedure, in a state where the chip component C held by the attachment tool 42 approaches the substrate S, the tool position control means 43 calculates the adjustment amount by which the attachment tool 42 should be moved to align the chip component C with the mounting location SC of the substrate S, and performs position adjustment by the tool position control means 43 (alignment process).

[0073] After that, the lifting means 3 is driven to lower the mounting head 4 to bring the chip component C into close contact with the substrate S. In the mounting process, the chip component C is pressed with a predetermined pressure, and the heater unit 40 is heated to bond the electrodes of the substrate S and the chip component C (mounting process).

[0074] Incidentally, in the implementation process, the distance between the upper surface of the substrate S and the lower surface of the attachment tool 42 corresponds to the thickness of the chip component C. Therefore, in the substrate position information acquisition process shown in FIG. 16, high-precision implementation becomes possible if the distance G between the lower surface of the attachment tool 42 and the upper surface of the substrate S is made equal to the thickness of the chip component C. For example, even if there is a slight inclination in the driving direction of the lifting means 3, the positional deviation in the implementation process can be suppressed by making the distance G in the substrate position information acquisition process equal to the thickness of the chip component C. Note that even if an attempt is made to make the distance G between the lower surface of the attachment tool 42 and the upper surface of the substrate S in the substrate position information acquisition process exactly the same as the thickness of the chip component C, there are thickness variations in the substrate S and the chip component C, etc., so it is sufficient to be approximately equal to the thickness of the chip component C. Here, "approximately equal" means allowing an error within plus or minus 30% with respect to the designed thickness of the chip component C.

[0075] In the example described above, after the attachment tool 42 holds the chip component C, the chip position recognition means 7 determines the positional relationship between the chip recognition mark AC and the substrate recognition mark AS, and the alignment process is performed. However, alignment may be performed at the stage when the attachment tool 42 holds the chip component C. Specifically, when delivering the chip component C mounted on the chip slider 61 of the chip transfer means 6 to the attachment tool 42, the chip position recognition means 7 acquires the position information of the chip recognition mark AC and the tool recognition mark AT, and performs alignment (so that the chip recognition mark AC has a predetermined positional relationship with respect to the substrate recognition mark AS), and then the attachment tool 42 holds the chip component C. At that time, if the tool position control means 43 is not driven and only the chip slider 61 side is adjusted in position so that the attachment tool 42 holds the chip component C, the chip component C can be mounted on the mounting location SC with high precision simply by lowering the mounting head 4 by the lifting means 3. That is, it is also possible to perform the alignment process prior to the chip holding process.

[0076] Incidentally, in the above description, in the process of acquiring the substrate position information, the substrate position recognition means 5 acquires the position information of the tool recognition mark AT and the substrate recognition mark AS. However, it is also possible to perform alignment without acquiring the position information of the tool recognition mark AT. That is, the position of the tool recognition mark AT can also be adjusted so that the position of the chip recognition mark AC matches the position information of the substrate recognition mark AS obtained by the substrate position recognition means 5 and stored by the control unit 10.

Explanation of Signs

[0077] 1 Mounting device 2 Substrate stage 3 Lifting means 4 Mounting head 5 Substrate position recognition means 6 Chip transfer means 7 Chip position recognition means 10 Control unit 20 Stage movement control means 21 X-direction stage movement control means 22 Y-direction stage movement control means 23 Suction table 40 Head body 41 Heater section 42 Attachment tool 43 Tool position control means 50 Image capture section 52 Optical path 53 Imaging means 60 Transfer rail 61 Chip slider AC, AC1, AC2 Chip recognition marks AS, AS1, AS2 Substrate recognition marks AT, AT1, AT2 Tool recognition marks C Chip component S Substrate SC (Chip component) mounting location

Claims

1. 1. A mounting apparatus for mounting a chip component having a chip recognition mark for alignment and a substrate having a substrate recognition mark for alignment, with a surface having the chip recognition mark facing a surface having the substrate recognition mark, comprising: an attachment tool having transparency and a tool recognition mark, the attachment tool holding a surface of the chip component opposite to a surface having the chip recognition mark; a mounting head that holds the attachment tool at a tip thereof; a lifting means for lifting the mounting head in a direction perpendicular to the substrate; a substrate stage for holding the substrate; a chip position recognition means for simultaneously acquiring position information of the chip recognition mark and position information of the tool recognition mark while the chip component is held by the attachment tool; a substrate position recognition unit that can be moved independently of the mounting head and that acquires position information of the substrate recognition mark and position information of the tool recognition mark; a control unit connected to the mounting head, the lifting means, the substrate stage, the chip position recognition means, and the substrate position recognition means, At least one of the substrate stage and the attachment tool is movable in a direction within a surface of the substrate, A mounting apparatus in which the control unit moves the substrate stage or the attachment tool in an in-plane direction of the substrate based on information obtained by the chip position recognition means and information obtained by the substrate position recognition means, thereby aligning the chip component with the substrate.

2. The mounting device according to claim 1 , the substrate position recognition means recognizes all of the substrate recognition marks and the tool recognition marks in the alignment of one of the chip components by the substrate position recognition means; A mounting apparatus in which at least one of the board recognition mark and the tool recognition mark is recognized by the board position recognition means through the attachment tool.

3. The mounting device according to claim 1 or 2, The mounting head has a tool position moving means for adjusting the position of the attachment tool in the in-plane direction of the chip component.

4. The mounting device according to any one of claims 1 to 3, a mounting device including a chip slider for mounting the chip component and a transport rail for transporting the chip slider as components, the mounting device being provided with chip transport means for transporting the chip component immediately below the attachment tool;

5. The mounting device according to claim 4, The mounting apparatus wherein the chip transport means has position adjustment means for adjusting the in-plane position of the chip component mounted on the chip slider.

6. The mounting device according to any one of claims 1 to 5, A mounting apparatus in which, in a state in which the chip component is held by the attachment tool and faces the substrate, the substrate position recognition means simultaneously acquires position information of the tool recognition mark and the substrate recognition mark.

7. The mounting device according to any one of claims 1 to 5, The mounting apparatus, in a state where the chip component is not being held, wherein the board position recognition means acquires position information of the board recognition mark.

8. The mounting device according to claim 7, A mounting apparatus that brings the attachment tool closer to the upper surface of the substrate until the distance between the lower surface of the attachment tool and the upper surface of the substrate becomes approximately equal to the thickness of the chip component, and simultaneously acquires position information of the tool recognition mark and the substrate recognition mark.

9. Using the mounting device according to any one of claims 1 to 5, A mounting method for mounting a chip component having a chip recognition mark for alignment and a substrate having a substrate recognition mark for alignment, with a surface having the chip recognition mark facing a surface having the substrate recognition mark, comprising the steps of: a substrate holding step of holding the substrate on a substrate stage; a chip holding step of holding the chip component with an attachment tool having a tool recognition mark; a chip position information acquiring step of acquiring position information of the chip recognition mark and the tool recognition mark while the chip component is held by the attachment tool; a substrate position information acquiring step of acquiring position information of the tool recognition mark and the substrate recognition mark while the chip component is held by the attachment tool and faces the substrate; A mounting method comprising an alignment process for adjusting the position of the chip component in an in-plane direction of the substrate based on relative position information of the chip recognition mark and the substrate recognition mark with respect to the tool recognition mark.

10. Using the mounting device according to any one of claims 1 to 5, A mounting method for mounting a chip component having a chip recognition mark for alignment and a substrate having a substrate recognition mark for alignment, with a surface having the chip recognition mark facing a surface having the substrate recognition mark, comprising the steps of: a substrate holding step of holding the substrate on a substrate stage; a substrate position information acquiring step of acquiring position information of the substrate recognition mark; a chip holding step of holding the chip component with the attachment tool; a chip position information acquiring step of acquiring position information of the chip recognition mark and the tool recognition mark while the chip component is held by the attachment tool; A mounting method comprising an alignment process for adjusting the position of the chip component in an in-plane direction of the substrate based on relative position information between the tool recognition mark and the chip recognition mark.

11. The mounting method according to claim 10, In the board position information acquisition step, the distance between the lower surface of the attachment tool and the upper surface of the board is set to be approximately equal to the thickness of the chip component, and position information of the board recognition mark and the tool recognition mark is acquired.

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