Lid material and packaging material

Abstract

To provide a lid material with an opening detection function that can be stably thermo-compression bonded, and a packaging material equipped with the same.SOLUTION: A lid material 30 for sealing a storage section 21 of a storage container 20, includes: a base layer 35; a circuit pattern 32 provided on the base layer 35 and having a wiring path that is broken when the storage section is opened; a resin layer 37 for covering the circuit pattern 32 from a side opposite to the base layer; and a thermal adhesive layer 31 for bonding to the storage container 20. The wiring path is provided with a terminal portion to be connected to an external device 40 for detecting breakage, and the resin layer 37 is divided into a first region 37A1 that covers the terminal portion and a second region 37A2 that covers a portion other than the terminal portion, and a thickness T2 of the second region 37A2 of the resin layer 37 is larger than a thickness T1 of the first region.SELECTED DRAWING: Figure 7

Description

Technical Field

[0001] The present technology relates to a lid material and a packaging material.

Background Art

[0002] Conventionally, in a packaging material (for example, a press-through package (PTP)) having a storage section for storing tablets or the like, a technique for detecting the opening of the storage section is known, and an example thereof is disclosed in Patent Document 1. The packaging material described in Patent Document 1 includes a storage sheet (an example of a storage container) having a plurality of storage sections and an opening detection sheet on which a circuit pattern is formed. When the contents are taken out from the storage section, the circuit pattern of the opening detection sheet is broken. By detecting this breakage with an external opening detector, the opening of the storage section is detected.

[0003] The circuit pattern of the opening detection sheet is divided into a region covered with a resin layer and a non-covered region. The non-covered region serves as a connection portion that conducts with the terminal portion of the opening detector.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] The opening detection sheet may be used by being attached to the lid material of the storage sheet as a post-attachment, but it would be convenient if the opening detection sheet could be thermally adhered to the storage sheet as a lid material in advance. If the opening detection sheet is used as a lid material, the existing PTP can be provided with an opening detection function without increasing the number of manufacturing steps.

[0006] However, there is a concern that the connection part of the circuit pattern of the unsealing detection sheet described in Patent Document 1 may be damaged during thermocompression bonding. For example, the thermocompression bonding between the lid material and the storage sheet in the PTP manufacturing process is performed by applying a pressure of about 0.2 MPa to 0.4 MPa in a temperature range of about 200°C to 300°C. The connection part of the circuit pattern described in Patent Document 1 is not covered by a resin layer, and there is a concern that it may peel off from the base material under such high temperature and high pressure.

[0007] This technology has been completed based on the above actual situation, and an object thereof is to realize a lid material with an unsealing detection function that can be stably thermocompression-bonded, and a packaging material including the same.

Means for Solving the Problems

[0008] The lid material related to the technology described in the present specification is a lid material for sealing the storage part of a storage container, and includes a base material layer, a circuit pattern provided on the base material layer and having a wiring path that is broken when the storage part is unsealed, a resin layer that covers the circuit pattern from the side opposite to the base material layer, and a thermal adhesive layer with the storage container. The wiring path is provided with a terminal part connected to an external device for detecting the breakage. The resin layer is divided into a first region that covers the terminal part and a second region that covers the part other than the terminal part, and the thickness of the second region of the resin layer is larger than the thickness of the first region.

[0009] Further, in the lid material having the above configuration, the resin layer may include a first resin layer provided across the first region and the second region, and a second resin layer provided on the second region of the first resin layer but not provided on the first region.

[0010] Further, in the lid material having the above configuration, the dry weight per unit area in the second region of the resin layer may be 3.0 g / m 2 or more and 5.0 g / m 2 or less.

[0011] Further, in the lid material having the above configuration, the dry weight per unit area in the first region of the resin layer is 0.6 g / m 2 or more and 2.5 g / m 2 or less.

[0012] Further, in the lid material having the above configuration, the terminal portion may be configured to be electrically conductive by contacting a tapered contact provided in the external device.

[0013] Further, in the lid material having the above configuration, the thermal adhesive layer may be capable of sealing the accommodating portion by thermocompression bonding at a heating temperature of 220°C to 240°C.

[0014] The packaging material related to the technology described in the present specification includes the lid material having the above configuration and an accommodating container having an accommodating portion sealed by the lid material, and the content in the accommodating portion can be taken out by breaking the lid material.

[0015] Further, in the packaging material having the above configuration, the wiring path may have a shape that folds back through an overlapping portion that overlaps the accommodating portion in a plan view and then passes through the overlapping portion again.

Advantages of the Invention

[0016] According to the present technology, it is possible to realize a lid material with an opening detection function that can be stably thermocompression bonded and a packaging material including the same.

Brief Description of the Drawings

[0017]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Mode for Carrying Out the Invention

[0018] <Embodiment 1> Embodiment 1 will be described with reference to FIGS. 1 to 8. In this embodiment, an unsealing detection sheet (an example of a lid material with an unsealing detection function) 30 and a PTP (press-through package, an example of a packaging material) 10 to which the unsealing detection sheet 30 is thermally adhered will be exemplified. Note that in some of the drawings, the X-axis, Y-axis, and Z-axis are shown, and the directions of the respective axes are drawn so as to be common directions in each figure.

[0019] As shown in FIG. 1, the PTP 10 can be attached to an unsealing detector 40, which is an external device, to detect the unsealed state. The method for detecting the unsealed state of the unsealing detector 40 and the method for outputting the unsealing detection result are not limited. Hereinafter, an example of the unsealing detector 40 will be described with reference to FIGS. 1 and 2. The unsealing detector 40 includes at least a plurality (12 in this embodiment) of contacts 41B, a communication module 42, and a housing 50. The housing 50 houses each part and also serves as an attachment part that detachably sandwiches and holds the PTP 10.

[0020] The housing 50 of the unsealing detector 40 is made of a resin material and includes a first housing 51 and a second housing 52. The first housing 51 occupies most of the housing 50 and has a depression in the upper front side. The second housing 52 is a lid that covers the depression in the upper front side of the first housing 51. The second housing 52 is displaced toward the first housing 51 when pressed in the vertical direction (Z-axis direction). As a result, the PTP 10 is sandwiched and held between the first housing 51 and the second housing 52. In this way, the PTP 10 is attached to the unsealing detector 40.

[0021] The contact 41B of the unsealing detector 40 protrudes from the surface of the first housing 51 where the PTP10 is sandwiched, and has a tapered tip. At least the protruding end of the contact 41B has conductivity. When the PTP10 is attached to the unsealing detector 40 (Fig. 1), the contact 41B comes into contact with and conducts with each of the terminal portions 32Z1, 32A1 - 32J1 of the circuit pattern 32 of the PTP10 described below.

[0022] The communication module 42 of the unsealing detector 40 includes a control unit (detection unit) and a communication unit. The control unit passes a current through the contact 41B and detects the voltage generated in the circuit pattern 32 of the PTP10. Then, the control unit 44 compares the detected voltage value with a predetermined threshold value. If it is below the threshold value, it determines that the circuit pattern 32 is not broken and is in the unopened state. If it is greater than the threshold value, it determines that the circuit pattern 32 is broken and is in the opened state. The communication unit transmits and outputs the determined unsealing detection information to a management server or an information processing terminal.

[0023] Next, the PTP10 will be described in detail. As shown in Fig. 3, the PTP10 includes a sheet-like container 20 including a storage portion 21 for storing contents M such as tablets, and an unsealing detection sheet 30 thermocompression-bonded to the sheet-like container 20. The unsealing detection sheet 30 is thermally adhered to the sheet-like container 20 by a heat roll HR provided in a content filling machine, for example, as shown in Fig. 4. When the unsealing detection sheet 30 is thermally adhered to the sheet-like container 20, it covers the opening 21A of the storage portion 21 and seals the storage portion 21. The planar shape and planar size of the unsealing detection sheet 30 are formed to be able to cover the entire main surface of the sheet-like container 20, and in this embodiment, it is substantially the same as the sheet-like container 20.

[0024] The sheet-like container 20 includes a plurality of accommodating portions 21 that protrude on the side opposite to the unsealing detection sheet 30. The accommodating portion 21 has an internal space for accommodating the content M inside, and the boundary portion with the unsealing detection sheet 30 is an opening 21A. The accommodating portion 21 is formed in a shape following the shape of the content M when viewed in plan. As the sheet-like container 20, a known material for a PTP sheet-like container is appropriately used. The sheet-like container 20 is, for example, a resin container in which a resin sheet material having a thickness of about 60 μm to 400 μm is bulged.

[0025] In the present embodiment, each accommodating portion 21 is circular when viewed in plan, and a total of 10 accommodating portions 21 are formed, with 5 in each in the longitudinal direction (Y-axis direction) at a predetermined interval and 2 in each in the short-side direction (X-axis direction) at a predetermined interval. Further, the five accommodating portions 21 arranged in the longitudinal direction are formed closer to one short side 20A of the sheet-like container 20. As a result, a wider margin area 20S is formed between the other short side 20B of the sheet-like container 20 and the accommodating portion 21 than between the one short side 20A and the accommodating portion 21. The margin area 20S is an area where the first region 37A1 of the resin layer 37 of the unsealing detection sheet 30 described later overlaps when viewed in plan.

[0026] The unsealing detection sheet 30 is a press-through-capable sheet-like composite material. Except for the portion covering the opening 21A of the accommodating portion 21, the unsealing detection sheet 30 is thermally adhered to the sheet-like container 20. As shown in FIG. 6, the unsealing detection sheet 30 is an aluminum laminate in which a thermal adhesive layer 31, a base material layer 35 (aluminum foil 33 and insulating layer 34), a circuit pattern 32, and a resin layer (overcoat layer, protective layer) 37 are laminated in order from the lower side (sheet-like container 20 side).

[0027] The heat - adhesive layer 31 is thermally adhered to the sheet - like container 20 to cover the accommodating portion 21. The sealing property of the accommodating portion 21 is appropriately designed according to the use of the PTP10. It does not necessarily need to be airtight to the extent that no gas leaks, and it suffices to be airtight to the extent that at least no solid leaks. Known heat - adhesives for PTP can be used for the heat - adhesive layer 31. For example, the heat - adhesive layer 31 is composed of a heat - adhesive such as a polyester - based adhesive, a polypropylene - based adhesive, a vinyl chloride - based adhesive, a vinyl chloride - vinyl acetate copolymer - based adhesive (vinyl chloride - vinyl acetate - based adhesive), etc.

[0028] The temperature at which the heat - adhesive layer 31 is thermocompression - bonded, that is, the heating temperature by the heat roll HR, is appropriately selected according to the type of the PTP10. Generally, it is in the range from 220°C to 260°C or in the range from 200°C to 300°C. In this embodiment, as will be described later, since the second region 37A2 of the resin layer 37 is formed as a thick film, the heat - adhesive layer 31 is preferably made of a low - melting - point material so that it can be surely heat - adhered in a short time as in the conventional case even when heated by the heat roll HR through the thick - film resin layer 37. For example, the heat - adhesive layer 31 is a heat - adhesive such as a polyester - based adhesive, a polypropylene - based adhesive, a vinyl chloride - based adhesive, a vinyl chloride - vinyl acetate copolymer - based adhesive (vinyl chloride - vinyl acetate - based adhesive), etc.

[0029] The base material layer 35 includes an aluminum foil 33 and an insulating layer 34. By using the aluminum foil 33 for the base material layer 35, the moisture - proof property can be particularly enhanced compared with resin or paper. The insulating layer 34 is interposed between the aluminum foil 33 and the circuit pattern 32 to ensure insulation between the two. Incidentally, on the main surface of the aluminum foil 33 on the side of the insulating layer 34, for example, white ink may be solidly coated over the entire surface to make it easier to read barcodes or QR codes printed as required.

[0030] The circuit pattern 32 is provided on the main surface 34A of the insulating layer 34 on the side opposite to the aluminum foil 33. The circuit pattern 32 is a plurality of wiring patterns formed by printing a conductive ink or the like on the insulating layer 34. The circuit pattern 32 is formed, for example, by supplying a conductive ink to the surface of the insulating layer 34 in a predetermined pattern shape and then curing it. The conductive ink is a conductive composition in which conductive particles are dispersed in a vehicle containing a binder, and various particles composed of materials showing good conductivity such as gold, silver, copper, platinum, aluminum, and their alloys, and carbon black are used. As a method for supplying the conductive ink, for example, various printing methods such as supply by a dispenser, gravure printing method, and inkjet printing method can be used. As a curing method for the conductive composition, a drying curing method, a heat curing method, etc. are used according to the type of conductive ink used.

[0031] As shown in FIG. 5, the circuit pattern 32 according to the present embodiment includes the same number of wiring paths as the number of the accommodating portions 21, more specifically, ten wiring paths 32A, 32B, 32C, 32D, 32E, 32F, 32G, 32H, 32I, 32J (hereinafter referred to as 32A - 32J). Each of the wiring paths 32A - 32J is provided for each accommodating portion 21 so as to have a different path for each accommodating portion 21.

[0032] Both ends of each of the wiring paths 32A - 32J are provided on one short side 10A side of the PTP10. Terminal portions that come into contact with and are connected to the contacts 41B of the unsealing detector 40 are provided at both ends of each of the wiring paths 32A - 32J. More specifically, a first terminal portion 32Z1 is provided on one end side of each of the wiring paths 32A - 32J, and second terminal portions 32A1, 32B1, 32C1, 32D1, 32E1, 32F1, 32G1, 32H1, 32I1, 32J1 (hereinafter referred to as 32A1 - 32J1) are provided on the other end side.

[0033] The first terminal portion 32Z1 is provided at the same position for all the wiring paths 32A - 32J and is a terminal common to all the wiring paths 32A - 32J. The first terminal portion 32Z1 is connected to one of the contacts 41B, and a predetermined reference potential (specifically, the GND potential) is supplied from the contact 41B. The second terminal portions 32A1 - 32J1 are provided at different positions for each of the wiring paths 32A - 32J. Each of the second terminal portions 32A1 - 32J1 is connected to one of the contacts 41B, and a predetermined potential is supplied from the contact 41B. When a predetermined potential difference (voltage is applied) occurs between the first terminal portion 32Z1 and the second terminal portions 32A1 - 32J1, current flows through each of the wiring paths 32A - 32J.

[0034] Each of the wiring paths 32A - 32J is formed to connect between the first terminal portion 32Z1 and the second terminal portions 32A1 - 32J1. The length of the wiring paths 32A - 32J is formed larger for the wiring paths 32A - 32J provided in the housing portion 21 where the distance from the terminal portions 32Z1, 32A1 - 32J1 is large. Also, each of the wiring paths 32A - 32J has an overlapping portion 32A2 - 32J2 that overlaps with the housing portion 21 in a planar view. When the housing portion 21 is opened, the overlapping portions 32A2 - 32J2 of the wiring paths 32A - 32J are broken.

[0035] Also, as shown by an example in the wiring paths 32A, 32J of FIG. 5, the wiring paths 32A - 32J may be formed to be folded back in a substantially U - shape through the overlapping portions 32A2, 32J2 and then pass through the overlapping portions 32A2, 32J2 again. In this way, it will be more surely broken when the housing portion 21 is opened.

[0036] When the PTP10 is attached to the unsealing detector 40 (FIG. 1), the terminal portions 32Z1, 32A1 - 32J1 are electrically connected to the contact 41B of the unsealing detector 40. When the PTP10 is sandwiched between the first housing 51 and the second housing 52 of the unsealing detector 40, the contact 41B is pressed toward the opposing terminal portions 32Z1, 32A1 - 32J1. The contact 41B has a tapered tip as described above, and when pressed, it is configured to be electrically connected to the terminal portions 32Z1, 32A1 - 32J1.

[0037] The resin layer 37 is formed over the entire surface as the outermost layer of the unsealing detection sheet 30, covering and protecting the other layers of the unsealing detection sheet 30. The resin layer 37 is printed and applied over the entire main surface 34A of the insulating layer 34, covering all parts of the circuit pattern 32. The material of the resin layer 37 is not particularly limited as long as it is a resin material. For example, it is made of an epoxy resin material and is formed by printing and application (MOP, Mat Over Print). The resin layer 37 protects the unsealing detection sheet 30 from heating and pressure by the heat roll HR during manufacturing, and also protects the unsealing detection sheet 30 from damage caused by external forces during transportation. Therefore, the resin layer 37 preferably has heat resistance and pressure resistance against heating by the heat roll HR, and adhesion strength (adhesiveness) such that it is not easily peeled off by external forces.

[0038] As shown in FIGS. 5 to 7, the inside of the sheet surface of the resin layer 37 is divided into a first region 37A1 that covers the terminal portions 32Z1, 32A1 - 32J1 of the circuit pattern 32, and a second region 37A2 that covers most of the portions other than the terminal portions 32Z1, 32A1 - 32J1. The first region 37A1 is a region on the side of one short side 10A of the PTP10 (see FIG. 5), and is a region that overlaps the margin region 20S of the sheet-like container 20 when viewed in plan.

[0039] The resin layer 37 has a laminated structure of a first resin layer 38 and a second resin layer 39 in the layer thickness direction. The first resin layer 38 is applied over the first region 37A1 and the second region 37A2. The second resin layer 39 is applied over the second region 37A2 of the first resin layer 38, but is not applied over the first region 37A1. As a result, the thickness T2 of the second region 37A2 of the resin layer 37 becomes larger than the thickness T1 of the first region, as shown in FIG. 7.

[0040] By doing so, within the sheet surface of the unsealing detection sheet 30, the portions to be attached to the unsealing detector 40, that is, the terminal portions 32Z1, 32A1 - 32J1 of the circuit pattern 32, are protected by the first region 37A1 of the resin layer 37 while enabling conduction with the unsealing detector 40. More specifically, by sufficiently reducing the thickness T1 of the first region 37A1 of the resin layer 37, the terminal portions 32Z1, 32A1 - 32J1 can be made conductive with the contact 41B of the unsealing detector 40 through the first region 37A1 of the thin film. In the present embodiment, the contact 41B has a tapered tip, and due to the pressing, the contact 41B can easily conduct with the terminal portions 32Z1, 32A1 - 32J1 through the first region 37A1 of the resin layer 37. Depending on the thickness T1 of the first region 37A1 of the resin layer 37, the contact 41B penetrates the first region 37A1 of the resin layer 37 and contacts the terminal portions 32Z1, 32A1 - 32J1. By doing so, the contact 41B of the unsealing detector 40 and the terminal portions 32Z1, 32A1 - 32J1 of the unsealing detection sheet 30 can surely conduct. On the other hand, most of the sheet surface of the unsealing detection sheet 30 is covered by the second region 37A2 of the resin layer 37 having a large film thickness T2, so that the insulating property is ensured. As a result, an unsealing detection sheet 30 that can be stably thermocompression-bonded to the sheet-like container 20 can be realized, and the PTP10 can be manufactured using a conventional container filling machine.

[0041] Such an application amount of the resin layer 37 is such that the dry weight per unit area in the first region 37A1 of the resin layer 37 is 0.6 g / m 2 or more and 2.5 g / m 2 or less, which is preferable. When the dry weight is less than 0.6 g / m 2 , the thickness T1 of the first region 37A1 of the resin layer 37 becomes small, and the terminal portions 32Z1, 32A1 - 32J1 cannot be protected from the heating by the heat roll HR, and the heat resistance and pressure resistance cannot be ensured. Also, when the dry weight is greater than 2.5 g / m 2 , the thickness T1 of the first region 37A1 of the resin layer 37 becomes excessively large, and the terminal portions 32Z1, 32A1 - 32J1 cannot conduct with the contact 41B of the unsealing detector 40.

[0042] Further, the coating amount of the resin layer 37 is such that the dry weight per unit area in the second region 37A2 of the resin layer 37 is 3.0 g / m 2 or more and 5.0 g / m 2 or less. When the dry weight is less than 3.0 g / m 2 , the thickness T2 of the second region 37A2 of the resin layer 37 becomes small, and the insulation of the circuit pattern 32 covered by the second region 37A2 of the resin layer 37 cannot be ensured. Further, when the dry weight is greater than 5.0 g / m 2 , the thickness T2 of the second region 37A2 of the resin layer 37 becomes large, and although the insulation is improved, the amount of resin used increases due to being made thicker than necessary, and it is necessary to increase the number of coating times, resulting in an increase in manufacturing cost.

[0043] <Evaluation Experiment 1> In order to evaluate the performance of PTP10 described above, Evaluation Experiment 1 was conducted. In Evaluation Experiment 1, for the evaluation samples of PTP10 (Examples 1 to 6), the sealing performance of the housing portion 21 and the conductivity of the circuit pattern 32 were evaluated. The evaluation experiment results are shown in the table of FIG. 8.

[0044] <Conditions> · Thermal adhesive layer 31: Type 1 (rigid vinyl chloride-based thermal adhesive sheet) or Type 2 (rigid vinyl chloride-based thermal adhesive sheet, melting point higher than that of Type 1) · Resin layer 37: Epoxy-based resin material · Aluminum foil 33: Full-surface coating of white ink on the main surface on the insulating layer 34 side is present in Examples 1 and 2 and absent in Examples 3 to 6 · Thermal pressure bonding conditions to the sheet-like container 20: Each temperature of 180°C, 200°C, 220°C, 240°C, 260°C, and the pressure is constant at 0.3 MPa

[0045] <Evaluation Method> In the sealing test (leak test), the evaluation sample was evacuated to 0.07 MPa for 1 minute, and the presence or absence of air leakage was evaluated. The sealing test was a two-stage evaluation of A or C, where A (good) was defined as no air leakage and C (not acceptable) was defined as the presence of air leakage. In the conductivity test (device operation confirmation), conduction was confirmed by attaching to the unsealing detector 40. The conductivity test was a two-stage evaluation of A or C, where A (good) was defined as the conduction state being confirmed and C (not acceptable) was defined as the conduction state not being confirmed.

[0046] <Evaluation Results> As shown in FIG. 8, for Sealing performance, in Examples 1 to 4 using the type 1 heat adhesive sheet for heat adhesion 31, good results (A evaluation) were obtained when the unsealing detection sheet 30 was adhered to the sheet-like container 20 by thermocompression bonding at a heating temperature of 220° C. or higher. On the other hand, the sealing performance was insufficient in the case of thermocompression bonding at a heating temperature of 200° C. or lower (C evaluation). Also, in Examples 5 and 6 using the type 2 heat adhesive sheet for heat adhesion 31, good results (A evaluation) were obtained in the case of thermocompression bonding at a heating temperature of 260° C., but the sealing performance was insufficient in the case of thermocompression bonding at a heating temperature of 240° C. or lower (C evaluation). It was confirmed that it was easier to lower the temperature during thermocompression bonding when using the type 1 heat adhesive sheet with a lower melting point.

[0047] Regarding Conductivity, for all of Examples 1 to 6, good results (A evaluation) were obtained in the case of thermocompression bonding at a heating temperature of 220° C. or higher. On the other hand, in the case of thermocompression bonding at a heating temperature of 200° C. or lower, since the results of the previously conducted sealing test were inferior (C evaluation), the conductivity test was not performed (indicated as "-" in the table of FIG. 8).

[0048] <Other Embodiments> The present invention is not limited to the embodiments described by the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention.

[0049] (1) The shape of the circuit pattern 32 of the unsealing detection sheet 30 is an example and can be changed as appropriate. For example, the wiring paths 132A - 132J may be formed like the unsealing detection sheet 130 of the PTP100 shown in FIG. 9. Each of the wiring paths 132A - 132J may be folded back in a substantially U shape through each overlapping portion 132A2 - 132J2 and then pass through each overlapping portion 132A2 - 132J2 again. In this way, all the wiring paths 132A - 132J will be more surely broken when the accommodating portion 21 is unsealed.

[0050] (2) The configuration of the base material layer 35 of the unsealing detection sheet 30 can be changed as appropriate according to the purpose. For example, the aluminum foil 33 in the base material layer 35 is not limited to a single layer, and a configuration in which two aluminum foils are adhered by a resin intermediate layer may be adopted.

[0051] (3) The size, shape, number, interval, etc. of the sheet - shaped container 20 shown in the figure are examples and can be changed as appropriate.

Explanation of Reference Numerals

[0052] 10: PTP (packaging material), 20: sheet - shaped container (accommodating container), 21: accommodating portion, 21A: opening, 30, 130: unsealing detection sheet (lid material), 31: thermally - adhesive layer, 32: circuit pattern, 32A, 32B, 32C, 32D, 32E, 32F, 32G, 32H, 32I, 32J: wiring paths, 32A1, 32B1, 32C1, 32D1, 32E1, 32F1, 32G1, 32H1, 32I1, 32J1: second terminal portions, 32Z1: first terminal portion, 33: aluminum foil, 34: insulating layer, 35: base material layer, 37: resin layer, 37A1: first region, 37A2: second region, 38: first resin layer, 39: second resin layer, 40: unsealing detector (external device), 41B: contact, M: accommodated object

Claims

1. A lid material for sealing a storage portion of a storage container, including a base material layer, a circuit pattern provided on the base material layer and having a wiring path that is broken when the storage portion is opened, a resin layer that covers the circuit pattern from the side opposite to the base material layer, and a thermal adhesive layer with the storage container, wherein a terminal portion connected to an external device for detecting the breakage is provided in the wiring path, the resin layer is divided into a first region covering the terminal portion and a second region covering portions other than the terminal portion, and the thickness of the second region of the resin layer is greater than the thickness of the first region.

2. The lid material according to claim 1, wherein the resin layer has a first resin layer provided across the first region and the second region, and a second resin layer provided on the second region of the first resin layer but not provided on the first region.

3. The dry weight per unit area in the second region of the resin layer is 3.0 g / m 2 or more and 5.0 g / m 2 or less. The lid material according to claim 1 or claim 2.

4. The dry weight per unit area in the first region of the resin layer is 0.6 g / m 2 or more and 2.5 g / m 2 or less. The lid material according to claim 1 or claim 2.

5. The lid material according to claim 1 or claim 2, wherein the terminal portion is configured to be conductive by contacting a tapered contact provided in the external device.

6. The lid material according to claim 1 or claim 2, wherein the thermal adhesive layer can seal the storage portion by thermocompression bonding at a heating temperature of 220°C to 240°C.

7. The lid material according to claim 1 or claim 2, and A storage container having a storage portion sealed by the lid material, The contents in the storage portion are a packaging material that can be taken out by breaking through the lid material.

8. The wiring path has a shape that folds back through an overlapping portion that overlaps the storage portion in a planar view and passes through the overlapping portion again. The packaging material according to claim 7.

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