Reuse determination device, reuse determination system, and reuse determination method for semiconductor integrated circuit

Abstract

To provide a reuse determination device, a reuse determination system, and a reuse determination method for easily determining the reusability of a semiconductor integrated circuit.SOLUTION: A method includes mapping the normal and faulty states of a semiconductor integrated circuit onto a graph using monitor statistical calculation data, calculating a reuse boundary that separates an area on the graph into a normal data group area and a faulty data group area, and determining the reusability of the semiconductor integrated circuit on the basis of the reuse boundary.SELECTED DRAWING: Figure 7

Description

Technical Field

[0001] The present invention relates to a reuse determination device, a reuse determination system, and a reuse determination method for semiconductor integrated circuits.

Background Art

[0002] As the movement to reduce the environmental impact increases, there is a demand for technology to reuse semiconductor integrated circuits used inside electronic devices without discarding them. As such a technology, there is a technology for estimating the deterioration of a semiconductor integrated circuit during use. According to this technology, it is possible to detect deterioration and efficiently replace the semiconductor integrated circuit.

[0003] For example, in Patent Document 1, means for determining the maximum operating frequency is incorporated into a target semiconductor integrated circuit, and the amount of deterioration is calculated based on the maximum operating frequency by monitoring at an arbitrary timing during use.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, in the technology of Patent Document 1, it is necessary to provide a monitor circuit for calculating the maximum operating frequency in the target semiconductor integrated circuit. For this reason, it is not general-purpose and cannot diagnose the deterioration of semiconductor integrated circuits on the market.

[0006] In addition, in accordance with the fact that the degradation of a semiconductor integrated circuit can occur due to the overlapping of factors such as HCI (Hot Carrier Injection), BTI (Bias Temperature Instability), and TDDB (Time Dependent Dielectric Breakdown), there is also recoverable degradation.

[0007] From this, simply calculating the amount of degradation makes it difficult to determine whether the target semiconductor integrated circuit can be reused, and inspections equivalent to those in the shipping inspection are required during the reuse determination. The need for such inspections can lead to increased man-hours and costs, which can become an obstacle to improving the reusability of semiconductor integrated circuits.

[0008] An object of the present invention is to easily determine the reusability of a semiconductor integrated circuit.

Means for Solving the Problems

[0009] A reuse determination device for a semiconductor integrated circuit according to an aspect of the present invention is a reuse determination device having a reuse determination unit for determining the reusability of a semiconductor integrated circuit, wherein the reuse determination unit determines the state of the semiconductor integrated circuit using monitor data of the semiconductor integrated circuit by a processor. When the state of the semiconductor integrated circuit is determined to be a failure, the semiconductor integrated circuit is recycled or discarded. When the state of the semiconductor integrated circuit is determined to be normal, a statistical value of the monitor data is calculated to obtain monitor statistic calculation data. Using the monitor statistic calculation data, the normal state and the failure state of the semiconductor integrated circuit are mapped on a graph, and a reuse boundary that separates the region on the graph into a normal data group region indicating the normal state and a failure data group region indicating the failure state is calculated. The reusability of the semiconductor integrated circuit is determined based on the reuse boundary.

Effects of the Invention

[0010] According to an aspect of the present invention, the reusability of a semiconductor integrated circuit can be easily determined.

Brief Description of the Drawings

[0011]

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Mode for Carrying Out the Invention

[0012] Hereinafter, embodiments will be described with reference to the drawings. In all the drawings for explaining the embodiments, the same members are generally denoted by the same reference numerals, and repeated explanations thereof will be omitted as appropriate.

[0013] In addition, in the following embodiments, it goes without saying that the constituent elements (including element steps, etc.) are not necessarily essential, except in cases where it is particularly specified or considered clearly essential in principle.

[0014] Also, when it is said "consisting of A", "comprising A", "having A", or "including A", it goes without saying that other elements are not excluded, except in cases where it is particularly specified that only that element is involved.

[0015] Similarly, in the following embodiments, when referring to the shape, positional relationship, etc. of constituent elements, etc., it includes those that are substantially approximated or similar to the shape, etc., except in cases where it is particularly specified or considered clearly not so in principle.

Embodiment

[0016] FIG. 1 is a schematic diagram showing an example of the system configuration of a reuse determination system. The reuse determination system is a system for determining the reusability of a semiconductor integrated circuit, and includes a computer 1 and electronic devices 3a to 3n.

[0017] The computer 1 is a computer for determining reusability, and presents the determination result of reusability to the user through a GUI (Graphical User Interface) or the like. The electronic devices 3a to 3n are devices intended for industrial equipment, IT equipment, medical equipment, etc., devices and edge devices, and are devices equipped with a semiconductor integrated circuit to be the subject of reusability determination. The computer 1 and the electronic devices 3a to 3n are interconnected via a network (communication line) 2 such as the Internet or a LAN (Local Area Network).

[0018] FIG. 2 is a schematic diagram showing an example of the hardware configuration of the reuse determination system according to Embodiment 1.

[0019] The electronic devices 3a to 3n are systems having monitor modules 30a to 30n and semiconductor integrated circuits 31a to 31n.

[0020] The monitor modules 30a to 30n are modules including sensors for measuring the voltage and temperature of the semiconductor integrated circuits 31a to 31n, processors such as a CPU (Central Processing Unit) for controlling the sensors, etc. Note that monitor circuits such as a voltmeter and a thermometer may notify the computer 1 using the internal functions of the semiconductor integrated circuits 31a to 31n. The monitor modules 30a to 30n have a configuration common to the semiconductor integrated circuits 31a to 31n.

[0021] The semiconductor integrated circuits 31a to 31n are processors such as a CPU (Central Processing Unit) and an FPGA (Field Programable Gate Array) for realizing the functions of the electronic devices 3a to 3n, and are components to be determined for reusability.

[0022] The computer 1 performs data generation, transmission, reception, and various other processes. The processor 10 reads a processing program stored in the memory resource 13, and the processor 10 executes a process according to the processing program.

[0023] Note that the computer 1 is a computer such as a personal computer, a tablet terminal (computer), a smartphone, a server computer, a blade server, and a cloud server, and may be a system including at least one or more of these computers. That is, the computer 1 also includes a system including, for example, a cloud server and a display computer (e.g., a tablet terminal or a smartphone). Also, a controller that controls or manages some device including the processor 10 and the memory resource 13 is also an example of the computer 1.

[0024] Specifically, as shown in FIG. 2, the computer 1 has one or more processors 10, one or more UI (User Interface) devices 11, one or more NI (Network Interface) devices 12, and one or more memory resources 13. Note that the computer 1 may include components other than these. Also, the processor 10, UI device 11, NI device 12, and memory resource 13 are interconnected via a bus 14.

[0025] The processor 10 is an arithmetic unit that reads the reuse determination program 15 stored in the memory resource 13 and executes each process of the reuse determination method. Note that examples of the processor 10 include a microprocessor, CPU, GPU (Graphics Processing Unit), FPGA (Field Programmable Gate Array), quantum processor, or other semiconductor devices capable of performing calculations.

[0026] The UI device 11 is an input device for inputting instructions from a user (which may be an operator) to the computer 1 and an output device for outputting information and the like generated by the computer 1. Examples of the input device include a pointing device such as a keyboard, touch panel, mouse, and a voice input device such as a microphone.

[0027] Also, examples of the output device include a display, printer, and voice synthesizer. Note that unless otherwise specifically mentioned below, it is assumed that the input and output of information between the computer 1 and the user are performed via the UI device 11. Note that the UI device 11 may be only an input device or only an output device.

[0028] The NI device 12 is a communication device that performs information communication with external devices. The NI device 12 performs information communication with external devices such as electronic devices 3a to 3n via the network 2. Note that unless otherwise specifically mentioned below, it is assumed that the information communication between the computer 1 (or the processor 10) and the external device is performed via the NI device 12.

[0029] The memory resource 13 is, for example, a non-volatile memory and / or a volatile memory. Examples of the volatile memory are RAM (Random Access Memory) and ROM (Read Only Memory). Examples of the non-volatile memory may be rewritable storage media such as flash memory, hard disk, or SSD (Solid State Drive), and may also be USB (Universal Serial Bus) memory, memory card, and hard disk, etc.

[0030] Also, RAMs such as MRAM (Magnetoresistive RAM), PRAM (Phase change RAM), and ReRAM (Resistive RAM) may be regarded as non-volatile memories. Note that the processor 10 may perform a service of distributing the reuse determination program 14 stored in the memory resource 13 to other computers.

[0031] The memory resource 13 stores a reuse determination program 15, monitor data 16, rated data 17, monitor statistical value data 18, classification data 19, and reuse boundary data 20.

[0032] The reuse determination program 15 is a program for the computer 1 to execute a reuse determination method and functions as a reuse determination unit.

[0033] The monitor data 16 is information obtained from the monitor modules 30a to 30n of the electronic devices 3a to 3n via the NI device 12, and stores voltages, temperatures, operating statuses (normal or faulty), etc. related to the internal semiconductor integrated circuits 31a to 31n of the respective electronic devices 3a to 3n.

[0034] The rated data 17 is rated information obtained from datasheets of semiconductor integrated circuits 31a to 31n to be determined for reuse, and is stored in the memory resource 13 in advance by the user. Information such as the maximum voltage, minimum and maximum junction temperatures, and ESD (Electro-static discharge) will mainly be stored.

[0035] The monitor statistical calculation data 18 is information on statistical values such as the maximum value, average value, and standard deviation in an arbitrary period calculated from the monitor data 16, and is stored in the memory resource 13 in advance by the user.

[0036] The classification data 19 is a plurality of graphs in which the operating status (two values of normal or failure) is plotted on a graph with the statistical values of the monitor data 16 as the axis.

[0037] The reuse boundary data 20 is information that separates the normal data group and the failure data group in each graph and sets the separated plane as the reuse boundary. By calculating the reuse boundary, it becomes possible to determine whether reuse is possible from the statistical information of the monitor data 16.

[0038] Figure 3 is an example of the configuration of the electronic device 3.

[0039] In order to monitor the power supply voltage, temperature, and ESD mainly described in the datasheet as device rated values, an example is shown in which a power supply voltage sensor 300, a temperature sensor 301, and an ESD sensor 302 are mounted. The analog information of each sensor is acquired as a digital value by the AD converter 305 and transferred as monitor data 16 to the computer 1 via the CPU 306 and the data transfer circuit 307.

[0040] At this time, the CPU 306 includes a decimation process for data transfer at an arbitrary time timing (such as daily), and a process of storing pre-transfer data in the non-volatile memory 304 and transferring the data at an arbitrary timing. A failure detection circuit 303 for detecting that the semiconductor integrated circuit 31 has failed is also included. In this embodiment, although voltage, temperature, and ESD are monitored as examples, atmospheric pressure and humidity may be included, or the internal monitor of the semiconductor integrated circuit 31 may be used.

[0041] FIGS. 4A and 4B are an example of the monitor data 16.

[0042] The monitor data 16 stores the serial number, operating state, devices applied so far, total operating time, and monitored data for each semiconductor integrated circuit 31. The monitored data of the power supply voltage, temperature, and ESD record the average value, upper limit value, lower limit value, etc. on a daily basis or the like.

[0043] The total operating time is information indicating the cumulative operating time of the semiconductor integrated circuit 31. For example, the cumulative time when the power supply voltage is supplied to the semiconductor integrated circuit 31 is the operating time. The cumulative time is monitored by the CPU 306 or the like.

[0044] FIGS. 5A and 5B are an example of the rated data 17.

[0045] The rated values are extracted and input from the data sheet or the like of the semiconductor integrated circuit 31 to be the object of reuse determination.

[0046] FIGS. 6A and 6B are an example of the classification data 19 and the reuse boundary data 20. The statistical values of the monitor data 16 (here, the maximum value average of the power supply voltage, the maximum temperature, the total number of ESDs, the average temperature over the entire period) are calculated based on the monitor statistic calculation data 18. The states of the semiconductor integrated circuits 31 are plotted as axes, and a plane (a curve in the figure because it is a two-dimensional graph) for separating the normal data group and the failure data group is calculated by gathering the plotted data points.

[0047] This plane is the reuse boundary, and at the next monitoring timing, it can be determined whether it can be reused based on whether it is within the area of the normal data group. Even if it is normal, if it is plotted in the area of the failure data group, it is likely to fail in a short period, so it is determined that reuse is not possible.

[0048] Next, the processing performed by the computer 1 will be described. FIG. 7 is a flowchart showing an example of the processing performed by the computer 1 when determining the reuse of an individual semiconductor integrated circuit 31. Here, the dotted line in FIG. 7 indicates the location where data is input and output.

[0049] First, the processor 10 performs monitoring on each electronic device 3 at an arbitrary timing (step S1). It may be the timing when the semiconductor integrated circuit 31 fails. As a result, data is accumulated in the monitor data 16.

[0050] Next, the processor 10 compares the acquired monitor data 16 with the rated data 17 to determine whether it is operating outside the specifications (step S2). If it is operating outside the specifications (NO), even if it is operating normally, the deterioration of the semiconductor integrated circuit 31 may be accelerating. Therefore, for the semiconductor integrated circuit 31 corresponding to step S3, recycling or disposal is advanced. If it is operating within the rated range (YES), it proceeds to step S4 to perform a state determination.

[0051] Subsequently, the state is discriminated (step S5). If it is determined to be a failure (NO), it proceeds to step S6, and recycling or disposal is advanced. If it is determined to be normal (YES), it proceeds to step S7. At this time, normal or failure information is stored in the monitor data 16 as the operating status.

[0052] In step S7, it is determined whether the reuse boundary has been calculated. The calculation flow of the reuse boundary will be described in another flowchart. If the calculation has not been performed (NO), it proceeds to step S8, and the corresponding semiconductor integrated circuit 31 is ensured for continuous use or as inventory. The continuous use here assumes the case where the electronic device 3 is continuously used at the monitoring timing.

[0053] When determining whether reuse is possible, in a situation where the reuse boundary has not been calculated, it is not possible to determine whether reuse is possible, so it is also conceivable to return it to inventory. If the reuse boundary has been calculated (YES), proceed to step S9.

[0054] In step S9, perform state mapping of the corresponding semiconductor integrated circuit 31 on the graph of the classification data 19 and determine whether it is within the normal data group area. If it is outside the normal data group area, proceed to recycling or disposal (step S10). If it is within the normal data group area, it is determined that continuous use or reuse is possible (step S11).

[0055] So far, it has been explained that the individual semiconductor integrated circuits 31 can easily determine whether reuse is possible by using the reuse boundary data 20. Next, a method for generating the reuse boundary data will be explained.

[0056] FIG. 8 is an example of a method for generating the reuse boundary data 20. Here, the dotted line in FIG. 8 indicates the location where data is input and output.

[0057] First, the processor 10 performs monitoring (step S12).

[0058] Next, refer to the monitor data 16 and determine whether a failure count of an arbitrary number (here N) has been accumulated (step S13). If the failure count is less than N (NO), return to step S12. If it is N or more (YES), proceed to step S14. The reason for collecting a certain number of failure counts here is that in the operation of the electronic device 3, the absolute number of failure counts is probabilistically likely to be small, and a certain amount of data is required for calculating the reuse boundary.

[0059] Subsequently, in step S14, based on the monitor data 16 and the monitor statistic calculation data 18, a statistical value of the monitor data 16 is calculated. The statistical value here is, for example, the maximum power supply voltage in the entire total operation time, etc. By calculating a unique value as the statistical value, the state of each semiconductor integrated circuit 31 can be mapped on a graph (step S15). This mapped graph becomes the classification data 19.

[0060] Subsequently, from the classification data 19, a reuse boundary plane for dividing the normal group and the failure group is calculated (step S16). The calculation of the plane can be performed by using machine learning. For example, an algorithm such as SVM (Support Vector Machine). The calculated reuse boundary plane is stored as reuse boundary data 20. So far, the process of calculating the reuse boundary by the processor 10 has been shown. Thus, the basic process performed by the computer 1 is completed.

[0061] According to the first embodiment, by calculating the reuse boundary, it becomes possible to instantaneously determine whether each semiconductor integrated circuit 31 can be continuously used or reused at an arbitrary monitoring timing.

Embodiment

[0062] FIG. 9 is a diagram showing a configuration example of the computer 1 according to the second embodiment.

[0063] In the second embodiment, the content of the reuse determination program 15 in the memory resource 13 is different from that of the first embodiment, and further, reuse area data 21 is added. Since the other configurations are the same as the configuration example of the computer 1 according to the first embodiment (see FIG. 2), detailed description thereof is omitted.

[0064] FIG. 10 is an example of the reuse area data 21.

[0065] The reuse area data 21 is information that divides areas according to the distance from the reuse boundary. When the monitored voltage and temperature are regarded as stress on the semiconductor integrated circuit 31, it can be said that the closer to the reuse boundary, the greater the stress. Therefore, by dividing the areas, the reliability can be divided from the amount of stress so far related to the target semiconductor integrated circuit 31. Depending on which area it belongs to during reuse determination, the reuse destination can be selected.

[0066] For example, since the area A in FIG. 10 is an area close to the reuse boundary, even if it has been operating normally, the amount of stress so far is large, and there is a possibility that deterioration is accelerating, and the reliability during reuse is low.

[0067] On the other hand, the area C is the area farthest from the reuse boundary, and it can be said that the reliability is high. As a reuse destination for individuals with low reliability, for example, products for prototype purposes can be considered. Conversely, individuals with high reliability can be considered for reuse in products again.

[0068] FIG. 11 is a flowchart showing an example of the processing performed by the computer 1 when determining the reuse of individual semiconductor integrated circuits 32 in other embodiments. Here, the dotted line in FIG. 11 indicates the location where data is input and output.

[0069] Steps S20 to S25 are the same as steps S1 to S6 in FIG. 7 in the first embodiment, so the description thereof is omitted.

[0070] In step S26, it is determined whether the reuse area data 21 has been calculated. If it has not been calculated, it is continuously used or returned to inventory (step S27). If it has been calculated, the process proceeds to step S28.

[0071] In step S28, it is determined whether an individual is plotted within the reuse area C. If it is within the reuse area C, it is continuously used or sent to the reuse destination X that requires high reliability (step S29). If it is outside the reuse area C, the process proceeds to step S30.

[0072] In step S30, it is determined whether an individual is plotted within the reuse area B. If it is within the reuse area B, it is sent to the reuse destination Y that requires continuous use or reuse with medium reliability (step S29). If it is outside the reuse area B, the process proceeds to step S32.

[0073] In step S32, it is determined whether an individual is plotted within the reuse area A. If it is within the reuse area A, it is sent to the reuse destination Z that requires continuous use or reuse with low reliability (step S29). If it is outside the reuse area A, the process proceeds to step S34. If it does not belong to any area (step S34), since it will belong to the area of the failure data group, that individual will be recycled or discarded.

[0074] Here, examples of the reuse destination X include, for example, automobiles (ECUs). Also, examples of the reuse destination Y include, for example, inspection devices (signal processing systems). Examples of the reuse destination Z include, for example, those for prototypes such as inspection devices. Here, an example with three areas has been described, but it may be more or less than that.

[0075] So far, it has been explained that an individual semiconductor integrated circuit 31 can easily determine the reusability and the reuse destination by using the reuse area data 21. Next, a method for generating the reuse area data 21 will be described.

[0076] FIG. 12 is an example of a method for generating the reuse area data 21. Here, the dotted line in FIG. 12 indicates the location where data is input and output.

[0077] From step S35 to step S39, since it is the same processing as steps S12 to S16 in FIG. 8 in the first embodiment, the description thereof will be omitted.

[0078] Calculate the reuse area from the reuse boundary calculated in step S40. The reuse area is defined, for example, as an area reduced to be similar when considering the area from the reuse boundary line to the minimum value of each axis as shown in FIG. 10. For example, as shown in FIG. 10, while maintaining the similarity of the figure composed of the reuse boundary and the axes of the graph, the area reduced from the reuse boundary 20 in the direction of the area C21 (the direction of the arrow in FIG. 10) is calculated as the reuse area. Thus, the basic processing performed by the computer 1 is completed.

[0079] According to the above-described second embodiment, by calculating the reuse area, it becomes possible to instantaneously determine whether each semiconductor integrated circuit 31 can be continuously used or reused and the reuse destination at any monitoring timing.

[0080] The present invention is not limited to the above-described embodiments, and includes various modifications. For example, each of the above-described embodiments has been described in detail for easy understanding of the present invention, and the present invention is not necessarily limited to those having all the components described.

[0081] Also, a part of the configuration of one embodiment can be replaced with the configuration of another embodiment, and the configuration of another embodiment can be added to the configuration of one embodiment. Also, for a part of the configuration of each embodiment, addition, deletion, or replacement with other configurations is possible.

[0082] Also, each of the above-described configurations, functions, processing units, processing means, etc. may be realized in hardware by designing a part or all of them, for example, by an integrated circuit. Also, each of the above-described configurations, functions, etc. may be realized in software by a processor interpreting and executing a program for realizing each function.

[0083] Information such as programs, determination tables, and files that implement each function can be placed in a memory, a storage device such as an HDD or SSD, or a recording medium such as an IC (Integrated Circuit) card, an SD (Secure Digital) card, or a DVD (Digital Versatile Disc). Also, the control lines and information lines show those considered necessary for explanation, and not all control lines and information lines are necessarily shown on the product. In reality, it may be considered that almost all components are interconnected.

[0084] The computer 1 may be realized by the user (operator) performing some or all of the functions and processes realized by the reuse determination program 15.

[0085] Note that in the case where the computer 1 does not have the UI device 11 and instead entrusts part of the output process to the user and the input process from the user to a processor system outside the system, such as a smartphone or a tablet terminal (referred to as an external processor system), the computer 1 (or the processor 10, the reuse determination program 15) may perform the following in order to execute the processes and other parts of the program as described above.

[0086] Instead of the output to the user using the UI device 11 described above, data necessary for the output to the user is transmitted to the external processor system via the NI device 12.

[0087] Examples of such data include the data to be output itself and data for generating the output data in another processor system, but may also be a program or web data in which the process of performing user output in the external processor system is described.

[0088] Instead of receiving input or operations from the user using the UI device 11 described above, data indicating user input or operations is received from an external processor system via the NI device 12. From another perspective, the meaning of data output to the user may include causing (enabling) another entity other than the computer 1 to perform the data output, in addition to the computer 1 itself performing it.

[0089] Also, the meaning of receiving input or operations from the user may include the computer 1 indirectly performing the reception, in addition to directly outputting and receiving to / from the user using the UI device 11 of the computer 1.

[0090] According to the above embodiment, the remaining life of electronic components can be easily predicted. For example, the reusability of semiconductor integrated circuits can be easily predicted.

Explanation of Signs

[0091] 1 Computer 2 Network 3 Electronic Device 10 Processor 11 UI Device 12 NI Device 13 Memory Resource 14 Bus 15 Reuse Judgment Program (Reuse Judgment Unit) 16 Monitor Data 17 Rated Data 18 Monitor Statistical Calculation Data 19 Classification Data 20 Reuse Boundary Data 21 Reuse Region Data 30 Monitor Module 31 Semiconductor Integrated Circuit 300 Power Supply Voltage Sensor 301 Temperature Sensor 302 ESD Sensor 303 Fault Detection Circuit 304 Non-Volatile Memory 305 AD Converter 306 CPU 307 Data Transfer Circuit

Claims

1. A reuse determination device having a reuse determination unit for determining the reusability of a semiconductor integrated circuit, wherein the reuse determination unit, by a processor, determines the state of the semiconductor integrated circuit using the monitor data of the semiconductor integrated circuit, when the state of the semiconductor integrated circuit is determined to be a failure, the semiconductor integrated circuit is recycled or discarded, when the state of the semiconductor integrated circuit is determined to be normal, a statistical value of the monitor data is calculated to obtain monitor statistic calculation data, maps the normal state and the failure state of the semiconductor integrated circuit on a graph using the monitor statistic calculation data, calculates a reuse boundary that separates the area on the graph into a normal data group area indicating the normal state and a failure data group area indicating the failure state, and determines the reusability of the semiconductor integrated circuit based on the reuse boundary. A reuse determination device for a semiconductor integrated circuit, characterized in that.

2. The reuse determination unit, by a processor, determines whether the monitor statistic calculation data exists in the normal data group area or the failure data group area, when it is determined that the monitor statistic calculation data exists in the failure data group area, the semiconductor integrated circuit is recycled or discarded, when it is determined that the monitor statistic calculation data exists in the normal data group area, the semiconductor integrated circuit is continuously used or reused. The reuse determination device according to claim 1, characterized in that.

3. The reuse determination unit, by a processor, calculates the reuse boundary that separates the area on the graph into the normal data group area and the failure data group area using machine learning. The reuse determination device according to claim 1, characterized in that.

4. The reuse determination unit, by a processor, divides the normal data group area into a plurality of reuse areas, and determines the reuse destination of the semiconductor integrated circuit according to the divided reuse areas. The reuse determination device according to claim 1, characterized in that.

5. The reuse determination unit, by a processor, divides the normal data group area into a plurality of the reuse areas corresponding to the reliability obtained from the stress amount related to the semiconductor integrated circuit, and determines the reuse destination of the semiconductor integrated circuit based on the reliability. The reuse determination device according to claim 4, characterized in that.

6. The reuse determination unit, by a processor, The reuse determination device according to claim 4, wherein a region obtained by reducing a figure formed by the reuse boundary and the axis of the graph while maintaining a similar relationship is calculated as the reuse region.

7. The reuse determination unit is configured by a processor to determine whether the rated value of the semiconductor integrated circuit is exceeded using the monitor data, and when it is determined that the rated value is exceeded, recycle or discard the semiconductor integrated circuit. The reuse determination device according to claim 1.

8. The reuse determination unit is configured by a processor to calculate, as the statistical value of the monitor data, a maximum value, a minimum value, or a standard deviation of the monitor data over a predetermined period. The reuse determination device according to claim 1.

9. A reuse determination system in which a reuse determination device having a reuse determination unit for determining the reusability of a semiconductor integrated circuit and a plurality of electronic devices are connected via a communication line, wherein each of the electronic devices has the semiconductor integrated circuit and a monitor module for acquiring monitor data of the semiconductor integrated circuit, and the reuse determination device acquires the monitor data from the monitor module of the electronic device via the communication line, and the reuse determination unit is configured by a processor to determine the state of the semiconductor integrated circuit using the monitor data, and when it is determined that the state of the semiconductor integrated circuit is a failure, recycle or discard the semiconductor integrated circuit, and when it is determined that the state of the semiconductor integrated circuit is normal, calculate a statistical value of the monitor data to obtain monitor statistical calculation data, map the normal state and the failure state of the semiconductor integrated circuit on a graph using the monitor statistical calculation data, calculate a reuse boundary that separates a region on the graph into a normal data group region indicating the normal state and a failure data group region indicating the failure state, and determine the reusability of the semiconductor integrated circuit based on the reuse boundary. A semiconductor integrated circuit reuse determination system.

10. Each of the electronic devices has the monitor module common to each of the semiconductor integrated circuits, and the monitor module includes a power supply voltage sensor, a temperature sensor, and an ESD sensor for monitoring a power supply voltage, a temperature, and an ESD, which are rated values of the semiconductor integrated circuit, and a failure detection circuit for detecting that the semiconductor integrated circuit has failed. The reuse determination system according to claim 9, characterized by having

11. The reuse determination unit, by means of a processor, determines whether the monitored statistical calculation data exists in the normal data group area or the failure data group area, if it is determined that the monitored statistical calculation data exists in the failure data group area, the semiconductor integrated circuit is recycled or discarded, if it is determined that the monitored statistical calculation data exists in the normal data group area, the semiconductor integrated circuit is continuously used or reused. The reuse determination system according to claim 9, characterized by this.

12. The reuse determination unit, by means of a processor, divides the normal data group area into a plurality of reuse areas, and determines the reuse destination of the semiconductor integrated circuit according to the divided reuse areas. The reuse determination system according to claim 9, characterized by this.

13. The reuse determination unit, by means of a processor, divides the normal data group area into a plurality of the reuse areas corresponding to the reliability obtained from the stress amount related to the semiconductor integrated circuit, and determines the reuse destination of the semiconductor integrated circuit based on the reliability. The reuse determination system according to claim 12, characterized by this.

14. The reuse determination unit, by means of a processor, determines whether the rated value of the semiconductor integrated circuit is exceeded using the monitored data, if it is determined that the rated value is exceeded, the semiconductor integrated circuit is recycled or discarded. The reuse determination system according to claim 10, characterized by this.

15. A reuse determination method for determining the reusability of a semiconductor integrated circuit by means of a processor, comprising: a step of determining the state of the semiconductor integrated circuit using the monitored data of the semiconductor integrated circuit; a step of recycling or discarding the semiconductor integrated circuit if the state of the semiconductor integrated circuit is determined to be a failure; a step of calculating a statistical value of the monitored data to obtain monitored statistical calculation data if the state of the semiconductor integrated circuit is determined to be normal; a step of mapping the normal state and the failure state of the semiconductor integrated circuit on a graph using the monitored statistical calculation data; a step of calculating a reuse boundary that separates the area on the graph into a normal data group area indicating the normal state and a failure data group area indicating the failure state A step of determining the reusability of the semiconductor integrated circuit based on the reuse boundary; A method for determining the reusability of a semiconductor integrated circuit, characterized by comprising the above.

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