Interposer package, mounting method, and burn-in test device

Abstract

To reduce cracks and the like caused by temperature changes without changing conditions such as the mounting area of a test device on a substrate.SOLUTION: An interposer package according to an embodiment is mounted between a burn-in board and a test device package, and includes: a first substrate having the same or substantially the same expansion coefficient as the burn-in board; a second substrate having the same or substantially the same expansion coefficient as the test device package; a first sheet contact inserted between the first substrate and the second substrate; and a case that seals the first substrate, the second substrate, and the first sheet contact. The first sheet contact is sandwiched between the first substrate and the second substrate to electrically connect the burn-in board and the test device package, and the electrical connection is maintained by sealing the first substrate, the second substrate, and the first sheet contact through application of a predetermined pressure with the case.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] Embodiments of the present invention relate to an interposer package, a mounting method, and a burn-in test apparatus.

Background Art

[0002] For semiconductor integrated circuits such as semiconductor memory devices (hereinafter also referred to as devices under test (DUT)), stress tests for suppressing the occurrence of initial defects and reliability tests for confirming the reliability of products are performed. Examples of stress tests include burn-in tests, and examples of reliability tests include environmental tests and long-term life tests. In a burn-in test, for example, a burn-in board (BI board) on which a DUT is placed is used. The burn-in test is performed with the burn-in board housed in a test furnace (chamber) in a burn-in test apparatus. In addition to the DUT, for example, a test device for inspecting the DUT may be placed on the burn-in board. The test device may be placed directly on the burn-in board or may be placed on the burn-in board via a relay board or the like.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Patent Document 3

Summary of the Invention

Problems to be Solved by the Invention

[0004] One embodiment of the present invention provides an interposer package, a mounting method, and a burn-in test apparatus that can reduce cracks and the like due to temperature changes without changing various conditions such as the mounting area of a test device on a substrate.

Means for Solving the Problems

[0005] The interposer package according to the embodiment is an interposer package mounted between a burn-in board and a test device package mounted on the burn-in board, and includes a first substrate having the same or substantially the same expansion rate as that of the burn-in board, a second substrate having the same or substantially the same expansion rate as that of the test device package, a first sheet contact inserted between the first substrate and the second substrate, and a case for sealing the first substrate, the second substrate, and the first sheet contact. By sandwiching the first sheet contact between the first substrate and the second substrate, an electrical connection is established between the burn-in board and the test device package, and the electrical connection is maintained by applying a predetermined pressure with the case to seal the first substrate, the second substrate, and the first sheet contact.

Brief Description of the Drawings

[0006]

Figure 1

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Figure 2B

Figure 3

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Figure 5B

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Figure 6B

Figure 7A

Figure 7B

Figure 8A

Figure 8B

Figure 9A

Figure 9B

Figure 10A

Figure 10B

Figure 11

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Figure 13

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Mode for Carrying Out the Invention

[0007] Next, embodiments will be described with reference to the drawings. In the description of the specification or drawings described below, the same reference numerals are given to the same components and the description thereof is omitted. The drawings are schematic. Also, the embodiments shown below illustrate devices and methods for embodying the technical idea. Various changes can be made to the embodiments within the scope of the claims.

[0008] (Burn-in Test Device in the Embodiment) FIG. 1 schematically shows a schematic configuration example of a burn-in test apparatus according to an embodiment. The burn-in test apparatus according to the embodiment includes a BGA (Ball Grid Array) package (test device package) 400 (400_1, …, 400_n), a burn-in board 100, an interposer package 300 (see FIGS. 3 and 4), a test furnace 800, and a burn-in device 200. The BGA package 400 (400_1, …, 400_n) houses n test devices 410 (410_1, …, 410_n) that execute tests on a device under test (DUT (not shown)). The DUT and the BGA package 400 (400_1, …, 400_n) are placed on the burn-in board 100. The interposer package 300 is mounted between the burn-in board 100 and the BGA package 400 (400_1, …, 400_n). The test furnace 800 houses the burn-in board 100, the DUT, the interposer package 300, and the BGA package 400 (400_1, …, 400_n). The burn-in device 200 executes an accelerated test of temperature-voltage stress or the like on the DUT while performing, for example, a function test or the like.

[0009] During the test of the DUT, as shown in FIG. 1, the burn-in board 100 is housed in the test furnace 800, and the test is performed while changing the temperature. When the test of the DUT is completed, the burn-in board 100 is taken out of the test furnace 800.

[0010] The DUT is mounted on socket terminals 135 (135_1, …, 135_n) in burn-in sockets 130 (130_1, …, 130_n) mounted on the burn-in board 100. In the example of FIG. 1, one test device 410 is mounted for one DUT, but the present invention is not limited to this, and two or more test devices 410 may be mounted for one DUT, or one test device 410 may be mounted for two or more DUTs.

[0011] The burn-in terminal 105 is a terminal for connecting a burn-in device 200 capable of supplying power to the burn-in board 100 and controlling the SoC to the burn-in board 100.

[0012] The test devices 410 (410_1, …, 410_n) are devices capable of performing electrical inspections such as measuring, for example, the electrical characteristics of the DUTs connected thereto. The burn-in device 200 can supply power to the burn-in board 100 and control the test devices 410 mounted on the burn-in board 100.

[0013] As the test device package used in the burn-in test apparatus according to the embodiment, in addition to the BGA package 400 as shown in FIG. 1, for example, a PGA (Pin Grid Array) package, an LGA (Land Grid Array) package, or the like can also be applied.

[0014] Here, the test items of the DUT include a conduction test, a DC test, a functional test, an AC test, a SCAN test (structural test), a power-related test, and the like. When the DUT is a NAND flash memory, as the cell test of the NAND memory, pass / fail tests such as SLC (binary), MLC (quad), TLC (octal), QLC (hexadecimal), etc., a test allowing a certain error as an error bit test, a fail bit count test exceeding the ECC correction ability required for the cell test, a tPROG criteria test for OK / NG determination of the tPROG criteria, and the like are included.

[0015] As shown in FIG. 1, the burn-in apparatus 200 includes a power supply unit 210, a control unit 220, a drive unit 230, and a measurement unit 240. The control unit 220 controls each unit within the burn-in apparatus 200, that is, the power supply unit 210, the drive unit 230, the measurement unit 240, etc., and also performs control on the burn-in board 100 side via the burn-in terminal 105. The power supply unit 210 supplies power to the DUT inserted into the socket terminals 135 (135_1,..., 135_n) on the burn-in board 100 and the test devices 410 (410_1,..., 410_n) on the burn-in board 100 during the burn-in test. The drive unit 230 drives the test devices 410 on the burn-in board 100 during the burn-in test. The measurement unit 240 compares the input voltage with the threshold of the high level / low level for the DUT during the burn-in test.

[0016] Incidentally, as a shipping test for semiconductor integrated circuits such as semiconductor memory devices, a burn-in test is widely implemented in which a test is performed while applying stress to the DUT at high or low temperatures. In the burn-in board 100 used in the burn-in test, in order to reduce the test cost, it is required to increase the number of sockets (burn-in sockets 130) that can be mounted on the burn-in board 100 and simultaneously increase the number of DUTs that can be measured. In recent years, in order to perform tests that require signal quality such as interface tests within the burn-in apparatus, it has also been incorporated to mount the test devices 410 at positions closer to the DUT (that is, on the burn-in sockets 130) on the burn-in board 100. Therefore, the arrangement density of the DUTs and their test devices 410 on the burn-in board 100 has been increasing.

[0017] In particular, if there is a difference in the coefficient of thermal expansion (hereinafter also simply referred to as the expansion coefficient) between the BGA package 400 and the burn-in board 100, stress may be applied to the BGA package 400 and the burn-in board 100 due to temperature changes during the burn-in test.

[0018] FIG. 2A shows an example in which a BGA package 400 containing a test device 410 is directly placed on a burn-in board 100. FIG. 2B shows an example in which the BGA package 400 and the burn-in board 100 shown in FIG. 2A are affected by temperature changes. As shown in FIG. 2B, when stress is applied to the BGA package 400 and the burn-in board 100 due to temperature changes during the burn-in test, breakage such as cracks may occur in the BGA 401 bonded to the electrode pads 101 on the burn-in board 100.

[0019] In particular, when the BGA 401 and the electrode pads 101 are joined by soldering, the BGA 401 and the electrode pads 101 are alloyed. Therefore, such breakage often occurs near the joint between the electrode pads 101 and the BGA 401 (near the arrow indicated by CR in FIG. 2B), but it may also occur in other locations. In addition, as the operation years increase, such breakage is likely to occur due to stress migration or the like. When the BGA 401 (or the electrode pads 101) breaks, problems such as the electrical connection between the BGA package 400 and the burn-in board 100 being severed and the burn-in test not being correctly executed occur.

[0020] To avoid breakage of the BGA 401 due to such temperature cycle stress, a sheet contact that connects the BGA 401 and the burn-in board 100 without fusing them is effective. The sheet contact arranges conductors of extremely small sizes on an insulator sheet to form thin paths on the front and back of the sheet. By joining the lower ends of the conductors (electrodes) of the sheet contact to the respective electrode pads 101 of the burn-in board 100, placing each BGA 401 of the BGA package 400 on the upper ends of the conductors (electrodes) of the sheet contact, and pressing and contacting them in the vertical direction, the BGA package 400 and the burn-in board 100 are electrically connected.

[0021] However, in order to maintain a stable and continuous electrical connection, it is necessary to continuously apply a certain pressing force from the upper surface of the BGA package 400 to the burn-in board 100 using a socket for mounting the BGA package 400 or the like. Also, the use of such a socket is essential to ensure the positional accuracy of the sheet contacts.

[0022] However, in order to mount the BGA package 400 using sheet contacts and a socket, screw holes for fixing the socket, a pressing mechanism (e.g., a latch for pressing), etc. are required. Therefore, the mounting area of the BGA package 400 increases, the number of BGA packages 400 and DUTs that can be mounted on the burn-in board 100 decreases, leading to a reduction in the number of simultaneous measurements.

[0023] (Interposer Package According to Embodiment) FIG. 3 schematically shows a schematic configuration example of an interposer package 300 according to an embodiment. FIG. 4 schematically shows a connection example when the interposer package 300 shown in FIG. 3 is arranged between the burn-in board 100 and the BGA package 400.

[0024] As shown in FIGS. 3 and 4, the interposer package 300 is an intermediate substrate mounted between the burn-in board 100 and a BGA package (test device package) 400 mounted on the burn-in board. The interposer package 300 according to the embodiment can be used in the burn-in test apparatus shown in FIG. 1.

[0025] The interposer package 300 includes a first substrate 310 having the same or substantially the same expansion rate as that of the burn-in board 100, a second substrate 330 having the same or substantially the same expansion rate as that of the BGA package 400, a first sheet contact 320 inserted between the first substrate 310 and the second substrate 330, and a rigid case 380 that seals the first substrate 310, the second substrate 330, and the first sheet contact 320. In the interposer package 300, the first sheet contact 320 is sandwiched between the first substrate 310 and the second substrate 330 to electrically connect between the burn-in board 100 and the BGA package 400, and the first substrate 310, the second substrate 330, and the first sheet contact 320 are sealed by applying a predetermined pressure with the case 380 to maintain the electrical connection between the burn-in board 100 and the BGA package 400.

[0026] As shown in FIGS. 3 and 4, through VIA electrodes 306 are arranged inside the first substrate 310. The through VIA electrodes 306 are connected to an electrode pad 303 formed on the surface of the first substrate 310 on the side of the first sheet contact 320 and a BGA 304 formed on the surface of the first substrate 310 on the side of the burn-in board 100. Further, through VIA electrodes 305 are arranged inside the second substrate 330. The through VIA electrodes 305 are connected to an electrode pad 307 formed on the surface of the second substrate 330 on the side of the first sheet contact 320, a plug pin 301 and an electrode pad 302 formed on the surface of the first substrate 310 on the side of the BGA package 400.

[0027] Through VIA electrodes 306 and 305 that penetrate the front and back surfaces of the substrate are respectively formed on the first substrate 310 and the second substrate 330, and an insulating substrate or the like that insulates each electrode can be used. For the first substrate 310, for example, FR-4 (Flame Retardant Type 4), an epoxy resin, a glass fiber, a laminate of copper foil, etc. can be used. For the second substrate 330, for example, a material obtained by adding a molding resin to a thin piece of a pelletized silicon wafer can be used.

[0028] The first sheet contact 320 has a number of electrodes 309 (see FIGS. 10A and 10B) made of conductors of extremely small sizes disposed inside an insulating sheet. The electrodes 309 are connected to the electrode pads 303 and the electrode pads 307. The electrodes 309 are connected so as to be in contact with the electrode pads 303 and the electrode pads 307 without being fused to the electrode pads 303 and the electrode pads 307 with solder or the like. The electrodes 309 are electrically connected to the through VIA electrodes 306 and the through VIA electrodes 305 via the electrode pads 303 and the electrode pads 307, respectively.

[0029] Then, as shown in FIG. 4, the BGA 304 of the first substrate 310 of the interposer package 300 is respectively disposed on the electrode pads 101 of the burn-in board 100 and soldered thereto, whereby the interposer package 300 is mounted on the burn-in board 100. Further, the BGA 401 of the BGA package 400 is disposed on the plug pins 301 of the interposer package 300 and soldered to the electrode pads 302, whereby the BGA package 400 is mounted on the interposer package 300. Thereby, the BGA 401 of the BGA package 400 and the electrode pads 101 of the burn-in board 100 are electrically connected via the interposer package 300.

[0030] The interposer package 300 includes at least three layers, namely, a first substrate 310, a first sheet contact 320, and a second substrate 330. The first substrate 310 has the same expansion rate or substantially the same expansion rate as that of the burn-in board 100. Also, the second substrate 330 has the same or substantially the same expansion rate as that of the BGA package 400.

[0031] In this way, the first sheet contact 320 within the interposer package 300 electrically connects the first substrate 310 and the second substrate 330 without fusing them. By using a material with the same or substantially the same expansion rate as the burn-in board 100 for the first substrate 310, even when the burn-in board 100 expands or contracts due to temperature changes, the strain between the burn-in board 100 and the first substrate 310 can be avoided. Also, by using a material with the same or substantially the same expansion rate as the BGA package 400 for the second substrate 330, even when the BGA package 400 expands or contracts due to temperature changes, the strain between the BGA package 400 and the second substrate 330 can be avoided.

[0032] Here, the "material with the same or substantially the same expansion rate as the burn-in board 100" refers to a material with the same or substantially the same expansion rate as the burn-in board 100 such that even when the burn-in board 100 and the first substrate 310 expand or contract due to temperature changes, no solder cracks or the like occur between the burn-in board 100 and the first substrate 310. In other words, it refers to a material with the same or substantially the same expansion rate as the burn-in board 100 such that even when the burn-in board 100 and the first substrate 310 expand or contract due to temperature changes, the electrical connection or the like between the burn-in board 100 and the first substrate 310 is not severed.

[0033] Also, the "material with the same or substantially the same expansion rate as the BGA package 400" refers to a material with the same or substantially the same expansion rate as the BGA package 400 such that even when the BGA package 400 and the second substrate 330 expand or contract due to temperature changes, no solder cracks or the like occur between the BGA package 400 and the second substrate 330. In other words, it refers to a material with the same or substantially the same expansion rate as the burn-in board 100 such that even when the BGA package 400 and the second substrate 330 expand or contract due to temperature changes, the electrical connection or the like between the BGA package 400 and the second substrate 330 is not severed.

[0034] The thickness of the rigid case 380 is formed to be smaller than the sum of the thicknesses of the first substrate 310, the second substrate 330, and the first sheet contact 320. Therefore, when the first substrate 310, the second substrate 330, and the first sheet contact 320 are housed in the case 380, a predetermined pressure is applied to the first sheet contact 320 from the first substrate 310 and also to the first sheet contact 320 from the second substrate 330. Thereby, the electrical connection between the burn-in board 100 and the BGA package 400 can be maintained.

[0035] By mounting the first substrate 310 on the burn-in board 100, the position of the interposer package 300 can be fixed. Also, by mounting the BGA package 400 on the second substrate 330, the position of the BGA package 400 can be fixed.

[0036] Furthermore, the mounting size of the rigid case 380 (the size in the direction orthogonal to the thickness direction) is set to a size that can accommodate the maximum expansion sizes of the first substrate 310 and the second substrate 330. Thereby, it can be contained in a size that does not inhibit the expansion and contraction of the first substrate 310 and the second substrate 330 due to the influence of temperature changes.

[0037] FIG. 5A schematically shows an example of a connection portion when mounting the BGA package 400 on the interposer package 300 from the side. FIG. 5B shows the connection portion on the interposer package 300 side shown in FIG. 5A from the top. Also, FIG. 6A schematically shows an example of the connection portion after mounting the BGA package shown in FIG. 5A on the interposer package from the side.

[0038] At the connection part between the BGA package 400 and the interposer package 300, as shown in FIG. 5A, it is mounted on the electrode pad 302 of the second substrate 330 by the solder ball 401 on the BGA package 400 side. Also, as shown in FIG. 5B, insertion holes 381 are formed in the hard case 380 of the interposer package 300 at the portions directly above the respective electrode pads 302, and the electrode pads 302 of the second substrate 330 are visible (exposed) from the insertion holes 381. As shown in FIG. 6A, the individual solder balls of the BGA 401 are inserted into the portions of the insertion holes 381 and soldered to the electrode pads 302 for mounting.

[0039] In addition, as described above, in this embodiment, in addition to the BGA package 400, a PGA package, an LGA package, etc. can also be applied. FIG. 6B shows an example of the connection part after mounting the LGA package 450 on the interposer package 300. When mounting the LGA package 450, since the amount of solder on the LGA package 450 side is small, pins 451 are set up on the electrode pads 302 of the second substrate 330 of the interposer package 300 to make it a PGA, and the electrodes are extended outside the hard case 380 to enable mounting.

[0040] FIG. 7A shows an example of the connection part when mounting the interposer package 300 on the burn-in board 100 from the side, and FIG. 7B shows an example of the connection part after mounting from the side.

[0041] When mounting the interposer package 300 on the burn-in board 100, the solder balls of the BGA 304 arranged on the first substrate 310 are arranged on the electrode pads 101 on the burn-in board and soldered for mounting. BGA holes are also formed in the surface of the hard case 380 of the interposer package 300 on the burn-in board 100 side, and the solder balls of the BGA 304 are exposed from the BGA holes.

[0042] FIG. 8A shows an example of the thickness of the stacked structure that constitutes the interposer package 300 according to the embodiment. FIG. 8B shows an example of the thickness of the stacked structure (i.e., the size in the thickness direction of the case) after the stacked structure shown in FIG. 8A is housed in the case 380. The thickness W2 of the rigid case 380 is formed to be smaller than the total thickness W1 of the first substrate 310, the second substrate 330, and the first sheet contact 320. Therefore, when the first substrate 310, the second substrate 330, and the first sheet contact 320 are housed in the case 380, a predetermined pressure is applied to the first sheet contact 320 from the first substrate 310 and to the first sheet contact 320 from the second substrate 330. Here, the predetermined pressure refers to, for example, the degree of pressure applied by a holding mechanism such as a holding latch that is required when the BGA package 400 is mounted using a sheet contact and a socket without using the case 380. Therefore, it is desirable that the case 380 be made of a rigid material that can withstand the stress against the predetermined pressure.

[0043] Thereby, the electrical connection between the burn-in board 100 and the BGA package 400 can be maintained. Further, by using such a rigid case 380, fixing screw holes, a holding mechanism, etc. become unnecessary. Therefore, it is possible to suppress an increase in the mounting area of the BGA package 400, increase the number of BGA packages 400 and DUTs that can be mounted on the burn-in board 100, and increase the number of simultaneous measurements.

[0044] FIG. 9A shows an example of a gap portion (S2) provided in a case 380 of an interposer package 300 according to an embodiment, and FIG. 9B schematically shows a state in which a first substrate 310 and a second substrate 330 expand due to a temperature change in the interposer package shown in FIG. 9A. The mounting size of the case 380 (the size in a direction orthogonal to the thickness direction) is set to a size that can accommodate the maximum expansion sizes of the first substrate 310 and the second substrate 330. In other words, the mounting size of the case 380 is formed to be larger by the difference between the normal size of the first substrate 310 and the second substrate 330 before expansion and the maximum size of the first substrate 310 and the second substrate 330 after expansion. Thereby, it can be housed in a size that does not inhibit the expansion and contraction of the first substrate 310 and the second substrate 330 due to the influence of temperature change.

[0045] As an example of the length of the gap portion S2, for example, assuming that the size of the case 380 is 15 mm square and the first substrate 310 is formed of FR-4, it is a dozen or so μm, for example, about 12 μm.

[0046] In addition, the first substrate 310 and the second substrate 330 also expand and contract in the vertical direction toward the paper surface of FIG. 9. However, since there is nothing in contact along the vertical direction, it is not necessary to consider the expansion and contraction in the vertical direction.

[0047] FIG. 10A schematically shows the electrical connection relationship in the stacked structure constituting the interposer package 300 according to the embodiment. FIG. 10B schematically shows a state in which the substrate expands due to a temperature change in the stacked structure example shown in FIG. 10A. The first sheet contact 320 has a large number of electrodes 309 made of conductors of extremely small sizes penetrating therethrough (for example, at the intersections of insulator fibers) inside an insulator sheet, creating local conductors on the front and back of the sheet. The electrodes 309 are connected in contact with the electrode pads 303 and the electrode pads 307 without being fused to the electrode pads 303 and the electrode pads 307 with solder or the like. That is, electrical connection is established by pressing vertically without requiring fine alignment.

[0048] The insulating sheet can be composed of insulating materials such as PTFE (polytetrafluoroethylene), polyimide, and liquid crystal polymers including aramid. The electrode 309 can use, for example, a conductive foil such as gold or a conductive pin.

[0049] The electrode 309 is electrically connected to the through VIA electrode 306 and the through VIA electrode 305 via the electrode pad 303 and the electrode pad 307, respectively. By inserting and connecting such an interposer package 300 between the burn-in board 100 and the BGA package 400, the BGA 401 of the BGA package 400 and the electrode pad 101 of the burn-in board 100 are electrically connected via the interposer package 300.

[0050] As shown in FIGS. 10A and 10B, the electrode 309 in the first sheet contact 320 is extremely small in size compared to the electrode pad 303 and the electrode pad 307. Therefore, the ratio of the number of the electrode pad 303: the electrode 309: the electrode pad 307 when one electrode pad 303 and one electrode pad 307 are electrically connected is 1:m:1 (m is an integer of 2 or more). In the examples of FIGS. 10A and 10B, m = 3. Therefore, as shown in FIG. 10B, even if the first substrate 310 thermally expands in the right direction toward the paper surface of FIG. 10B, the influence of the displacement due to thermal expansion can be absorbed, and the electrical connection between the burn-in board 100 and the BGA package 400 can be maintained.

[0051] In addition, since the alignment between the first substrate 310 and the second substrate 330 and the first sheet contact 320 can be relatively rough, the expansion rate of the first sheet contact 320 due to the influence of temperature change does not particularly need to be considered.

[0052] FIG. 11 shows the influence of stress due to temperature change in a state where the interposer package 300 according to the embodiment is mounted between the BGA package 400 and the burn-in board 100. ΔL2 in FIG. 11 indicates the amount of expansion on the burn-in board 100 side, and ΔL1 indicates the amount of expansion on the BGA package 400 side. It exemplifies that even in a state where the burn-in board 100 and the interposer package 300 are soldered and melt-joined, and the BGA package 400 and the interposer package 300 are soldered and melt-joined, the stress due to temperature change can be reduced.

[0053] (Modification Example 1 of Interposer Package) FIG. 12 shows a schematic configuration example of a test board using the interposer package 300B according to Modification Example 1 of the embodiment. As shown in FIG. 12, in the interposer package 300B of Modification Example 1, a through electrode 392 is provided to directly connect one BGA 401 and one BGA 304 in the central portion. The side surface of the through electrode 392 is covered with an insulating resin layer 391. The first substrate 310, the second substrate 330, and the first sheet contact 320 are divided and stored in two cases 380_1 and case 380_2.

[0054] Note that the arrangement and joining method of the burn-in board 100 and the BGA package 400 and the interposer package 300B in Modification Example 1 are the same as those of the interposer package 300 in the embodiment.

[0055] By configuring in this way, even when the temperature change is large or the difference in the expansion rate between the first substrate 310 and the second substrate 330 is large, the displacement between the burn-in board 100 and the BGA package 400 can be suppressed.

[0056] Note that the number and arrangement positions of the through electrodes 392 are not limited to the example in FIG. 12, and two or more through electrodes 392 may be arranged, or they may be arranged at positions other than the central portion.

[0057] (Second Modification Example of Interposer Package) FIG. 13 shows a schematic configuration example of a test substrate using an interposer package 300C according to a second modification example of the embodiment. As shown in FIG. 13, in the interposer package 300C of the second modification example, two substrates, namely a third substrate 340 and a fourth substrate 350, are inserted between the first substrate 310 and the second substrate 330. The third substrate 340 is inserted between the first substrate 310 and the first sheet contact 320. The fourth substrate 350 is inserted between the second substrate 330 and the first sheet contact 320. Further, a second sheet contact 320_2 is inserted between the first substrate 310 and the third substrate 340. Furthermore, a third sheet contact 320_3 is inserted between the second substrate 330 and the fourth substrate 350.

[0058] Note that, as the second sheet contact 320_2 and the third sheet contact 320_3, those having the same material, structure, and size (thickness) as the first sheet contact 320 can be used.

[0059] FIG. 13 shows a case where the expansion rate of the burn-in board 100 is larger than the expansion rate of the BGA package 400. Similar to the case of the interposer package 300 of the embodiment, the first substrate 310 has the same expansion rate or substantially the same expansion rate as the expansion rate of the burn-in board 100, and the second substrate 330 has the same or substantially the same expansion rate as the expansion rate of the BGA package 400. In contrast, the third substrate 340 has an expansion rate smaller than the expansion rate of the burn-in board 100 (the expansion rate of the first substrate 310) and larger than the expansion rate of the fourth substrate 350. Also, the fourth substrate 350 has an expansion rate smaller than the expansion rate of the second substrate 330 and larger than the expansion rate of the BGA package 400 (the expansion rate of the second substrate 330).

[0060] Therefore, the expansion rates of the burn-in board 100, the first substrate 310, the third substrate 340, the fourth substrate 350, the second substrate 330, and the BGA package 400 satisfy the relationship: burn-in board 100 ≈ first substrate 310 > third substrate 340 > fourth substrate 350 > second substrate 330 ≈ BGA package 400.

[0061] Thus, by inserting the third substrate 340 and the fourth substrate 350 between the first substrate 310 and the second substrate 330, even when the difference in expansion rates between the burn-in board 100 and the BGA package 400 is large, the strain caused by temperature changes can be absorbed, and the electrical connection between the burn-in board 100 and the BGA package 400 can be maintained.

[0062] Note that the relationship of the expansion rates of each substrate is not limited to this. For example, when the expansion rate of the burn-in board 100 is smaller than that of the BGA package 400, the expansion rates of the burn-in board 100, the first substrate 310, the third substrate 340, the fourth substrate 350, the second substrate 330, and the BGA package 400 satisfy the relationship: burn-in board 100 ≈ first substrate 310 < third substrate 340 < fourth substrate 350 < second substrate 330 ≈ BGA package 400.

[0063] Also, the number of substrates inserted between the first substrate 310 and the second substrate 330 is not limited to two, and three or more substrates may be used. However, a sheet contact is inserted between the substrates.

[0064] Furthermore, a structure combining the interposer package 300B of Modification 1 and the interposer package 300C of Modification 2 can also be adopted.

[0065] (Mounting method according to the embodiment) FIG. 14 is a flowchart schematically showing an example of a mounting method of a test substrate using the interposer package 300 according to the embodiment.

[0066] Furthermore, the processing operations of the implementation method according to the embodiment described below can also be described in a computer program as instructions for causing a computer to execute them. The computer program is stored, for example, in a non-transitory computer-readable medium and is used in a burn-in test apparatus according to the embodiment, a DUT insertion / removal apparatus (not shown), and the like.

[0067] In step S100, the implementation method of the test substrate using the interposer package 300 is started.

[0068] In step S110, the BGAs 304 of the first substrate 310 are respectively placed (positioned) on the electrode pads 101 on the burn-in board 100, and in step S120, the BGAs 304 are soldered to the electrode pads 101 for fusion bonding.

[0069] In step S130, the BGAs 401 of the BGA package 400 are respectively placed (positioned) on the plug pins 301 of the interposer package 300, and in step S140, the BGAs 401 are soldered to the plug pins 301 for fusion bonding.

[0070] Thus, a test substrate using the interposer package 300 according to the embodiment is formed.

[0071] Subsequently, when a burn-in test is to be performed (YES in step S150), the process proceeds to step S160. When the burn-in test is not to be performed (NO in step S150), the process ends (step S180).

[0072] If YES in step S150, in step S160, the DUTs are mounted on the respective burn-in sockets 130 on the burn-in board 100, and in step S170, the burn-in test is performed. When the burn-in test in step S170 is completed, the process ends (step S180).

[0073] Also, in FIG. 14, an example in which the processes of step S130 and step S140 are performed after the processes of step S110 and step S120 is shown, but the present invention is not limited to this. The processes of step S130 and step S140 may be performed first, and then the processes of step S110 and step S120 may be performed, or the processes of step S110 and step S120 and the processes of step S130 and step S140 may be performed in parallel.

[0074] In addition, the implementation method shown in FIG. 14 can be similarly applied to the interposer package 300B of Modification 1 and the interposer package 300C of Modification 2.

[0075] (Operation and Effect in Embodiment) According to the present embodiment, the following operation and effect are achieved.

[0076] (1) By inserting and electrically connecting an interposer package 300 (or interposer package 300_2 or interposer package 300_3) between the burn-in board 100 and the BGA package 400, it is possible to suppress distortion of the substrate (burn-in board 100) and the BGA package 400 and the occurrence of solder cracks due to changes in the test temperature. That is, the stress due to the thermal expansion of the burn-in board 100 is not transmitted to the BGA package 400 side, and the stress due to the thermal expansion of the BGA package 400 side is also not transmitted to the burn-in board 100 side. Therefore, it is possible to provide a stable electrical connection without breaking the BGA even when the temperature changes.

[0077] (2) In the interposer package 300, by sandwiching the first sheet contact 320 between the first substrate 310 and the second substrate 330, the burn-in board 100 and the BGA package 400 can be electrically connected. Electrical connection can be achieved only by contacting without soldering. Further, by sealing the first substrate 310, the second substrate 330, and the first sheet contact 320 while applying a predetermined pressure (the pressure required for stable conduction of the sheet contact) with a rigid case 380, the electrical connection between the burn-in board 100 and the BGA package 400 can be maintained.

[0078] (3) Also, without using sockets or screws, the positions of the interposer package 300 and the BGA package 400 with respect to the burn-in board 100 can be fixed. Therefore, component placement with the same area and shape as when directly mounting the BGA package 400 during substrate design can be selected, and the substrate size of the burn-in board 100 can be reduced. That is, stable contact is possible with the same mounting area as the size of the BGA package 400 without affecting the wiring limitations or the number of socket mounts on the burn-in board 100. Also, it can be similarly applied to existing burn-in boards. Also, for LGA packages with a small ball diameter of BGA, soldering bonding can be achieved by using plug pins or the like.

[0079] Although some embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the gist of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are included in the invention described in the claims and its equivalent scope.

Description of Reference Numerals

[0080] 100…Burn-in board 101…Electrode pad 105…Burn-in terminal 130…Burn-in socket 135…Socket terminal 200…Burn-in device 210…Power supply unit 220…Control unit 230…Drive unit 240…Measurement unit 300, 300_2, 300_3, 300B, 300C…Interposer package 301…Plug pin 302, 303, 304, 307…Electrode pad 305, 306…Through VIA electrode 309…Electrode 310…First substrate 320…First sheet contact 320_2…Second sheet contact 320_3…Third sheet contact 330…Second substrate 340…Third substrate 350…Fourth substrate 380, 380_1, 380_2…Case 381…Insertion hole 391…Resin layer 392…Through electrode 400…BGA package 401…BGA (Solder ball) 410…Test device 450…LGA package 451…Pin 800…Test furnace

Claims

1. An interposer package implemented between a burn-in board and a test device package implemented on the burn-in board, comprising: a first substrate having the same or substantially the same expansion rate as that of the burn-in board; a second substrate having the same or substantially the same expansion rate as that of the test device package; a first sheet contact inserted between the first substrate and the second substrate; a case for sealing the first substrate, the second substrate, and the first sheet contact; wherein: the first sheet contact is sandwiched between the first substrate and the second substrate to electrically connect between the burn-in board and the test device package; the first substrate, the second substrate, and the first sheet contact are sealed by applying a predetermined pressure with the case to maintain the electrical connection.

2. a third substrate disposed between the first substrate and the first sheet contact; a fourth substrate disposed between the second substrate and the first sheet contact; a second sheet contact disposed between the first substrate and the third substrate; a third sheet contact disposed between the second substrate and the fourth substrate; wherein: when the expansion rate of the burn-in board is greater than the expansion rate of the test device package, the expansion rate of the third substrate is smaller than the expansion rate of the first substrate and greater than the expansion rate of the fourth substrate, and the expansion rate of the fourth substrate is greater than the expansion rate of the second substrate and smaller than the expansion rate of the third substrate; when the expansion rate of the test device package is greater than the expansion rate of the burn-in board, the expansion rate of the fourth substrate is smaller than the expansion rate of the second substrate and greater than the expansion rate of the third substrate, and the expansion rate of the third substrate is greater than the expansion rate of the first substrate and smaller than the expansion rate of the fourth substrate; The interposer package according to Claim 1.

3. The interposer package according to Claim 1, further comprising at least one through electrode installed through the first substrate, the second substrate, and the first sheet contact, with one end fused to the burn-in board and the other end fused to the test device package.

4. The test device package is a BGA package, The first substrate is mounted on the burn-in board by BGAs arranged on the first substrate, and the interposer package according to any one of claims 1 to 3.

5. The test device package is an LGA package, The first substrate is mounted on the burn-in board by plug pins arranged on the first substrate, and the interposer package according to any one of claims 1 to 3.

6. The BGA package is mounted on plug pins arranged on the second substrate, and the interposer package according to claim 4.

7. The BGA package is mounted on pads arranged on the second substrate, and the interposer package according to claim 4.

8. Mount an interposer package according to any one of claims 1 to 3 on the burn-in board, A mounting method of mounting the test device package on the interposer package.

9. The test device package is a BGA package, When mounting the interposer package on the burn-in board, The first substrate is mounted on the burn-in board by BGAs arranged on the first substrate, and the mounting method according to claim 8.

10. The test device package is an LGA package, When mounting the interposer package on the burn-in board, The first substrate is mounted on the burn-in board by plug pins arranged on the first substrate, and the mounting method according to claim 8.

11. When mounting the BGA package on the interposer package, The BGA package is mounted on plug pins arranged on the second substrate, and the mounting method according to claim 9.

12. When mounting the BGA package on the interposer package, The BGA package is mounted on pads arranged on the second substrate, and the mounting method according to claim 9.

13. A test device package containing a test device for testing a device under test, A burn-in board on which the device under test and the test device package are placed, The interposer package according to claim 1, implemented between the burn-in board and the test device package, and A test furnace that houses the burn-in board, the device under test, the interposer package, and the test device package, and A test apparatus that performs an acceleration test of temperature voltage stress while performing a function test on the device under test A burn-in test apparatus comprising:

14. A third substrate disposed between the first substrate and the first sheet contact, A fourth substrate disposed between the second substrate and the first sheet contact, A second sheet contact disposed between the first substrate and the third substrate, A third sheet contact disposed between the second substrate and the fourth substrate Further comprising: When the expansion rate of the burn-in board is greater than the expansion rate of the test device package, the expansion rate of the third substrate is smaller than the expansion rate of the first substrate and greater than the expansion rate of the fourth substrate, and the expansion rate of the fourth substrate is greater than the expansion rate of the second substrate and smaller than the expansion rate of the third substrate. When the expansion rate of the test device package is greater than the expansion rate of the burn-in board, the expansion rate of the fourth substrate is smaller than the expansion rate of the second substrate and greater than the expansion rate of the third substrate, and the expansion rate of the third substrate is greater than the expansion rate of the first substrate and smaller than the expansion rate of the fourth substrate. The burn-in test apparatus according to claim 13.

15. In the interposer package, The burn-in test apparatus according to claim 13, further comprising at least one through electrode that penetrates the first substrate, the second substrate, and the first sheet contact, with one end fused to the burn-in board and the other end fused to the test device package.

16. The test device package is a BGA package, In the interposer package, The burn-in test apparatus according to any one of claims 13 to 15, wherein the first substrate is mounted on the burn-in board by BGAs disposed on the first substrate.

17. The test device package is an LGA package, In the interposer package, The burn-in test apparatus according to any one of claims 13 to 15, wherein the first substrate is mounted on the burn-in board by plug pins disposed on the first substrate.

18. In the interposer package, The burn-in test apparatus according to claim 16, wherein the BGA package is mounted on plug pins disposed on the second substrate.

19. In the interposer package, The burn-in test apparatus according to claim 16, wherein the BGA package is mounted on pads disposed on the second substrate.

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