Substrate processing system

Abstract

To provide a substrate processing system capable of suppressing an increase in the burden on a worker who manages an external control apparatus.SOLUTION: A substrate processing system 1000 includes a first processing apparatus 20, a second processing apparatus 50, and an integrated control apparatus 10. The first processing apparatus 20 performs a first process on a substrate W based on a job. The second processing apparatus 50 performs a second process on the substrate W based on a job. The integrated control apparatus 10 generates a first virtual job and a second virtual job based on an integrated job creation command received from an external control apparatus HC. The first processing apparatus 20 performs at least a part of the first process on the substrate W based on the first virtual job. The second processing apparatus 50 performs at least a part of the second process on the substrate W after being processed by the first processing apparatus 20 based on the second virtual job.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a substrate processing system.

Background Art

[0002] A substrate processing apparatus that performs batch processing and single-wafer processing on a substrate using a single apparatus has been proposed (see, for example, Patent Document 1). Patent Document 1 discloses a configuration in which a loading / unloading unit, a single-wafer processing unit, a batch processing unit, and an interface unit are provided in one apparatus. In the substrate processing apparatus disclosed in Patent Document 1, the loading / unloading unit loads and unloads a cassette containing a plurality of substrates into and out of the apparatus. The batch processing unit collectively processes a lot including a plurality of substrates. The single-wafer processing unit processes each substrate of the lot one by one. The interface unit transfers substrates between the batch processing unit and the single-wafer processing unit. Specifically, the batch processing unit performs a chemical solution treatment for collectively processing a plurality of substrates constituting a lot using chemical solutions such as dilute hydrofluoric acid, phosphoric acid aqueous solution, and SC1 (a mixed solution containing ammonia, hydrogen peroxide solution, and water), and a rinsing treatment for collectively rinsing a plurality of substrates constituting a lot using a rinsing solution. The single-wafer processing unit supplies a drying liquid (for example, isopropyl alcohol) one by one to each substrate after the rinsing treatment by the batch processing unit to form a liquid film of the drying liquid on each substrate, and then dries each substrate one by one using a supercritical fluid.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in the substrate processing apparatus disclosed in Patent Document 1, the single-wafer processing unit only performs a process (drying process) of drying the substrate using a supercritical fluid after forming a liquid film of a drying liquid on the substrate. Therefore, the single-wafer processing unit cannot perform a process (chemical solution process) using chemical solutions such as dilute hydrofluoric acid, phosphoric acid aqueous solution, and SC1.

[0005] On the other hand, in addition to a series of substrate processes that combine a chemical solution process and a rinse process by a batch processing apparatus and a drying process by a single-wafer processing apparatus using a batch processing apparatus and a single-wafer processing apparatus, it is conceivable to construct a substrate processing system that can selectively execute a series of substrate processes only by the batch processing apparatus and a series of substrate processes only by the single-wafer processing apparatus.

[0006] However, when a series of substrate processes are executed by a plurality of processing apparatuses, the host computer needs to instruct each of the plurality of processing apparatuses to create a job (control job) so that a series of substrate processes (for example, a substrate process that continuously performs a chemical solution process, a rinse process, and a drying process) are executed. Therefore, it is necessary to introduce a new system (software) to the existing host computer, which increases the burden on the operator who manages the host computer. Also, if it is possible to control a plurality of processing apparatuses by a single creation instruction of a job (control job), the burden on the operator who manages the host computer can be reduced, but causing a plurality of processing apparatuses to execute substrate processes by a single job (control job) does not conform to the SEMI standard.

[0007] The present invention has been made in view of the above problems, and an object thereof is to provide a substrate processing system capable of suppressing an increase in the burden on an operator who manages an external control device.

Means for Solving the Problems

[0008] According to one aspect of the present invention, a substrate processing system includes a first processing device, a second processing device, and an integrated control device. The first processing device executes a first process on a substrate based on a job. The second processing device executes a second process on the substrate based on the job. The integrated control device controls the first processing device and the second processing device based on an instruction received from an external control device. The job commands the processing from loading the substrate from a substrate storage container into the processing device, executing the process on the substrate inside the processing device, to unloading the substrate from the processing device into the substrate storage container or another substrate storage container different from the substrate storage container. The integrated control device generates a first virtual job and a second virtual job based on a creation instruction of an integrated job received from the external control device. The first processing device executes at least a part of the first process on the substrate based on the first virtual job. The second processing device executes at least a part of the second process on the substrate after being processed by the first processing device based on the second virtual job.

[0009] In an embodiment, the above substrate processing system further includes a first connection part. The first connection part connects the first processing device and the second processing device. The first connection part has a substrate transfer mechanism. The substrate transfer mechanism transfers the substrate after being processed by the first processing device to the second processing device.

[0010] In an embodiment, the above substrate processing system further includes a substrate standby part. In the substrate standby part, the substrate after at least a part of the first process is executed waits. The substrate transfer mechanism transfers the substrate waiting in the substrate standby part to the second processing device. The integrated control device generates the second virtual job in response to the substrate waiting in the substrate standby part.

[0011] In one embodiment, the second processing device has a storage unit. The storage unit stores identification information of the virtual container placement unit. The integrated control device generates information indicating that a virtual substrate storage container is placed on the virtual container placement unit in response to the substrate waiting in the substrate standby unit.

[0012] In one embodiment, the first processing device has a first housing having a first opening. The second processing device has a second housing having a second opening. The first connecting portion further has a first connecting housing. One end of the first connecting housing is connected to the first housing. The other end of the first connecting housing is connected to the second housing. The substrate transfer mechanism takes out the substrate after being processed by the first processing device from the first opening of the first housing, transfers it inside the first connecting housing, and transfers it into the second housing through the second opening.

[0013] In one embodiment, the above substrate processing system further includes a second connecting portion. The second connecting portion connects the first processing device and the second processing device. The first processing device has a first housing and a first container placement unit. A substrate storage container is placed on the first container placement unit. The second processing device has a second housing and a second container placement unit. The substrate storage container is placed on the second container placement unit. The first container placement unit is provided outside the first housing. The second container placement unit is provided outside the second housing. The second connecting portion has a container transfer mechanism. The container transfer mechanism transfers the substrate storage container placed on the first container placement unit to the second container placement unit.

[0014] In one embodiment, the second connecting portion further has a second connecting housing. The second connecting housing covers the first container placement unit and the second container placement unit. The container transfer mechanism transfers the substrate storage container inside the second connecting housing.

[0015] In one embodiment, the first processing device has a first storage unit. The first storage unit stores a first recipe that defines the first process. The second processing device has a second storage unit. The second storage unit stores a second recipe that defines the second process. The integrated control device edits an integrated recipe that integrates the first recipe and the second recipe, and stores integrated recipe information. When the integrated control device receives a creation instruction for the integrated job from the external control device, it generates the first virtual job and the second virtual job with reference to the integrated recipe information. The first virtual job includes identification information of the first recipe integrated into the integrated recipe. The second virtual job includes identification information of the second recipe integrated into the integrated recipe.

[0016] In one embodiment, the first processing device executes a part of the first process. When editing the integrated recipe, the integrated control device edits the first recipe so that a part of the first process is executed based on an instruction from the external control device.

[0017] In one embodiment, the second processing device executes a part of the second process. When editing the integrated recipe, the integrated control device edits the second recipe so that a part of the second process is executed based on an instruction from the external control device.

[0018] In one embodiment, the first storage unit stores a plurality of different first recipes. When editing the integrated recipe, the integrated control device integrates the first recipe into the integrated recipe on a per-substrate basis. When two or more first recipes are integrated into the integrated recipe, the integrated control device generates two or more first virtual jobs.

[0019] In one embodiment, the second storage unit stores a plurality of different second recipes. When editing the integrated recipe, the integrated control device integrates the second recipe into the integrated recipe on a per-substrate basis. When two or more second recipes are integrated into the integrated recipe, the integrated control device generates two or more second virtual jobs.

[0020] In one embodiment, the first processing device notifies the integrated control device of an event that has occurred in the first processing device together with the identification information of the first virtual job. The second processing device notifies the integrated control device of an event that has occurred in the second processing device together with the identification information of the second virtual job. The integrated control device notifies the external control device of the event that has occurred in the first processing device together with the identification information of the integrated job. The integrated control device notifies the external control device of the event that has occurred in the second processing device together with the identification information of the integrated job.

[0021] In one embodiment, the events that occur in the first processing device include a completion event indicating the completion of the processing based on the first virtual job. When the event notified from the first processing device is the completion event of the first virtual job, the integrated control device determines not to notify the external control device of the completion event.

[0022] In one embodiment, the integrated control device generates the second virtual job a plurality of times. The events that occur in the second processing device include a plurality of completion events indicating the completion of the processing based on each of the plurality of second virtual jobs. The plurality of completion events include a final completion event that is the last completion event notified from the second processing device. When the completion event notified from the second processing device is not the final completion event, the integrated control device determines not to notify the external control device of the completion event. When the completion event notified from the second processing device is the final completion event, the integrated control device notifies the external control device of the completion event together with the identification information of the integrated job.

[0023] In one embodiment, the first processing device includes a first control device that controls the execution of the first processing. The second processing device includes a second control device that controls the execution of the second processing. One of the first control device and the second control device also serves as the integrated control device.

[0024] In one embodiment, the first processing device includes a batch-type substrate processing device capable of processing a plurality of substrates collectively. The second processing device includes a single-wafer substrate processing device that processes substrates one by one.

[0025] In one embodiment, the integrated control device generates the first virtual job and controls the batch-type substrate processing device. The batch-type substrate processing device executes a part of the first processing on the plurality of substrates based on the first virtual job. After the completion of the processing of the plurality of substrates by the batch-type substrate processing device, the integrated control device generates the second virtual job and controls the single-wafer substrate processing device. The single-wafer substrate processing device executes a part of the second processing on each of a part of the plurality of substrates in units of one substrate based on the second virtual job. After the completion of the processing of a part of the plurality of substrates by the single-wafer substrate processing device, the integrated control device regenerates the second virtual job and controls the single-wafer substrate processing device. The single-wafer substrate processing device executes a part of the second processing on each of the remaining substrates of the plurality of substrates in units of one substrate based on the second virtual job.

[0026] According to another aspect of the present invention, a substrate processing system includes a first processing device, a plurality of second processing devices, an integrated control device, and a container transfer mechanism. The first processing device executes a first process on a substrate based on a job. Each of the plurality of second processing devices executes a second process on a substrate based on a job. The integrated control device controls the first processing device and the plurality of second processing devices based on an instruction received from an external control device. The container transfer mechanism is movable independently of the first processing device and the plurality of second processing devices. The job instructs a process from loading a substrate from a substrate storage container into the interior of a processing device, executing a process on the substrate inside the processing device, and then unloading the substrate from the interior of the processing device to the substrate storage container or another substrate storage container different from the substrate storage container. The integrated control device generates a first virtual job and a second virtual job based on a creation instruction of an integrated job received from the external control device. The first processing device executes at least a part of the first process on the substrate based on the first virtual job. Among the plurality of second processing devices, one second processing device selected by the integrated control device executes at least a part of the second process on the substrate after being processed by the first processing device based on the second virtual job. The first processing device has a first container placement portion on which a substrate storage container is placed. Each of the plurality of second processing devices has a second container placement portion on which the substrate storage container is placed. The container transfer mechanism transfers the substrate storage container containing the substrate after being processed by the first processing device from the first container placement portion to the second container placement portion of the one second processing device among the plurality of second processing devices.

[0027] In one embodiment, the integrated control device stores processing wait information indicating the number of substrates waiting for processing in each of the plurality of second processing devices and maintenance information of each of the plurality of second processing devices. The integrated control device selects the one second processing device from the plurality of second processing devices based on the processing wait information and the maintenance information of each second processing device.

[0028] In one embodiment, the plurality of second processing devices include a first type of second processing device group and a second type of second processing device group different from the first type. The second type of second processing device group is arranged in a region separated from the region where the first type of second processing device group is arranged. The integrated control device selects one of the second processing device groups of the first type and the second type of second processing device groups based on the creation instruction of the integrated job, and selects the one second processing device from the one second processing device group.

[0029] In one embodiment, the first processing device includes a batch-type substrate processing device capable of processing a plurality of substrates at once. Each of the plurality of second processing devices includes a single-wafer type substrate processing device that processes substrates one by one.

Advantages of the Invention

[0030] According to the substrate processing system of the present invention, an increase in the burden on the operator who manages the external control device can be suppressed.

Brief Description of the Drawings

[0031]

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Embodiments for Carrying Out the Invention

[0032] Hereinafter, embodiments of the substrate processing system according to the present invention will be described with reference to the drawings (FIGS. 1 to 21). However, the present invention is not limited to the following embodiments, and can be implemented in various aspects without departing from the gist thereof. Note that descriptions of overlapping portions may be omitted as appropriate. Also, in the drawings, the same or corresponding parts are denoted by the same reference numerals and the description will not be repeated.

[0033] In the “substrate” in the embodiments of the present invention, various substrates such as semiconductor wafers, glass substrates for photomasks, glass substrates for liquid crystal displays, glass substrates for plasma displays, substrates for FED (Field Emission Display), substrates for optical disks, substrates for magnetic disks, and substrates for magneto-optical disks can be applied. Hereinafter, embodiments of the present invention will be described mainly by taking a substrate processing system used for processing a disk-shaped semiconductor wafer as an example, but the present invention can be similarly applied to the processing of various substrates exemplified above. Also, various shapes of substrates can be applied.

[0034] [Embodiment 1] FIG. 1 is a block diagram showing the configuration of a substrate processing system 1000 according to the present embodiment. The substrate processing system 1000 of the present embodiment processes a substrate W. Specifically, the substrate processing system 1000 of the present embodiment executes substrate processing on the substrate W. The substrate processing includes, for example, chemical solution processing, rinsing processing, and drying processing. By the chemical solution processing, the substrate W is processed with a chemical solution. The chemical solution processing is, for example, etching processing or cleaning processing. The rinsing processing indicates a process of washing away the chemical solution from the substrate W. The drying processing indicates a process of drying the substrate W.

[0035] As shown in FIG. 1, the substrate processing system 1000 of the present embodiment includes an integrated control device 10, a first processing device 20, and a second processing device 50. The substrate processing system 1000 is controlled by a host computer HC. The host computer HC is an example of an "external control device".

[0036] The first processing device 20 executes a first process on the substrate W based on one job. Here, the job indicates a command to the processing device. Specifically, the job is a control job. That is, the job commands the execution of processing from loading the substrate W from the substrate storage container CA into the inside of the processing device, executing the processing on the substrate W inside the processing device, to unloading the substrate W from the inside of the processing device to the same or different substrate storage container CA.

[0037] Specifically, the first processing device 20 is configured to load the substrate W from the substrate storage container CA into the inside of the first processing device 20 based on one job, execute the processing (first processing) on the substrate W inside the first processing device 20, and then unload the substrate W from the inside of the first processing device 20 to the same or different substrate storage container CA. The first processing device 20 may be an existing processing device, a device obtained by modifying an existing processing device, or a new processing device.

[0038] In this embodiment, the first processing device 20 is a batch processing device. For example, the first processing device 20 may be a batch-type cleaning device or a batch-type etching device. The cleaning device and the etching device are substrate processing devices. The batch processing device executes batch processing for collectively processing a plurality of substrates W. Specifically, the batch processing device collectively processes the substrates W that constitute a lot. A lot is composed of one or more substrates W. The number of substrates W that constitute a lot is, for example, 1 or more and 25 or less. One substrate storage container CA stores one lot of substrates W. The batch processing device is configured to carry out the substrates W that constitute one lot from the substrate storage container CA and to be able to execute, for example, chemical solution processing, rinse processing, and drying processing on the substrates W that constitute one lot.

[0039] Hereinafter, the first processing device 20 may be described as the "batch processing device 20". In this embodiment, the batch processing device 20 collectively processes two lots. Specifically, the batch processing device 20 combines two lots to form one lot. Hereinafter, one lot formed by combining two lots may be described as a "set of lots".

[0040] Note that the substrate storage container CA stores a plurality of substrates W in a stacked state. Specifically, the plurality of substrates W are stacked in the vertical direction with a space therebetween in a horizontal posture within the substrate storage container CA. Here, the horizontal posture indicates a state in which the thickness direction of the substrate W is along the vertical direction. The substrate storage container CA may be, for example, a FOUP (Front Opening Unified Pod), a SMIF (Standard Mechanical Inter Face) pod, or an OC (Open Cassette).

[0041] The second processing device 50 executes a second process on the substrate W based on one job. Specifically, the second processing device 50 loads the substrate W from the substrate storage container CA into the second processing device 50 based on one job, executes a process (second process) on the substrate W inside the second processing device 50, and then unloads the substrate W from the inside of the second processing device 50 to the same or a different substrate storage container CA. The second processing device 50 may be an existing processing device, a device obtained by modifying an existing processing device, or a new processing device, similar to the first processing device 20.

[0042] In the present embodiment, the second processing device 50 is a single-wafer processing device. For example, the second processing device 50 may be a single-wafer cleaning device or a single-wafer etching device. The single-wafer processing device executes a single-wafer process for processing the substrate W one by one. Specifically, the single-wafer processing device unloads the substrates W one by one from the substrate storage container CA and processes the substrates W one by one. The single-wafer processing device is configured to be able to execute, for example, a chemical solution process, a rinse process, and a drying process on one substrate W. Hereinafter, the second processing device 50 may be referred to as the "single-wafer processing device 50".

[0043] The integrated control device 10 controls the first processing device 20 and the second processing device 50 based on an instruction received from the host computer HC. More specifically, the integrated control device 10 generates a first virtual job and a second virtual job based on a creation instruction for an integrated job received from the host computer HC. Then, the integrated control device 10 causes the first processing device 20 to execute the first virtual job and causes the second processing device 50 to execute the second virtual job. The integrated control device 10 may be, for example, a general-purpose computer system or a dedicated computer system. Here, the creation instruction for the integrated job indicates a creation instruction for a control job. Also, the first virtual job is a control job. Similarly, the second virtual job is a control job.

[0044] The first processing device 20 executes at least a part of the first processing on the substrate W based on the first virtual job. The second processing device 50 executes at least a part of the second processing on the substrate W after being processed by the first processing device 20 based on the second virtual job.

[0045] In this embodiment, the first virtual job causes the batch processing device 20 to execute chemical solution processing and rinse processing. The second virtual job causes the single-wafer processing device 50 to execute drying processing. Accordingly, the batch processing device 20 executes chemical solution processing and rinse processing among chemical solution processing, rinse processing, and drying processing on a set of lots based on the first virtual job. The single-wafer processing device 50 executes drying processing among chemical solution processing, rinse processing, and drying processing on each substrate W after batch processing included in a set of lots based on the second virtual job.

[0046] As described above, according to Embodiment 1, the host computer HC only needs to instruct the integrated control device 10 to create one job. Therefore, the host computer HC does not need to instruct each of the first processing device 20 and the second processing device 50 to create a job. Thus, since it is not necessary to introduce a new system (software) to an existing host computer, an increase in the burden on an operator who manages the host computer HC can be suppressed. Further, according to Embodiment 1, the integrated control device 10 generates the first virtual job and the second virtual job based on an instruction from the host computer HC, so that the first processing device 20 and the second processing device 50 cooperate to perform a series of substrate processing (substrate processing that continuously performs chemical solution processing, rinse processing, and drying processing). Therefore, since the first processing device 20 and the second processing device 50 are not caused to perform substrate processing by one job, it complies with the SEMI standard.

[0047] Subsequently, with reference to FIG. 1, the substrate processing system 1000 of the present embodiment will be further described. As shown in FIG. 1, the substrate processing system 1000 of the present embodiment further includes a first connection part 80. The first connection part 80 connects the first processing device 20 and the second processing device 50.

[0048] As will be described later with reference to FIG. 3, the first connection portion 80 includes a substrate transfer mechanism 82 that transfers the substrate W after being processed by the first processing apparatus 20 to the second processing apparatus 50. In the present embodiment, the substrate transfer mechanism 82 of the first connection portion 80 transfers the substrate W after the chemical solution treatment and the rinse treatment are performed in the batch processing apparatus 20 to the single wafer processing apparatus 50 one by one.

[0049] Subsequently, with reference to FIG. 1, the configurations of the host computer HC, the integrated control device 10, the first processing device 20, and the second processing device 50 will be described.

[0050] As shown in FIG. 1, the host computer HC instructs the integrated control device 10 to create an integrated job. The host computer HC may be, for example, a general-purpose computer system or a dedicated computer system. The host computer HC may be, for example, an MES (Manufacturing Execution System). Specifically, the host computer HC includes an input unit HC1, a display unit HC2, a storage unit HC3, a communication unit HC4, and a control unit HC5.

[0051] The input unit HC1 includes a user interface device operated by an operator. The input unit HC1 inputs a signal corresponding to the operator's operation to the control unit HC5. The input unit HC1 includes, for example, a keyboard and a mouse. The input unit HC1 may include a touch sensor superimposed on the display surface of the display unit HC2. By superimposing a touch sensor on the display surface of the display unit HC2, a graphical user interface may be configured. The operator can edit a recipe by operating the input unit HC1, for example, as will be described later with reference to FIG. 5.

[0052] The display unit HC2 is controlled by the control unit HC5 to display various screens. For example, the display unit HC2 is controlled by the control unit HC5 to display a first recipe editing screen G1, which will be described later with reference to FIG. 5. The display unit HC2 includes, for example, a display device such as a liquid crystal display device or an organic EL (electroluminescence) display device.

[0053] The storage unit HC3 has a main storage device. The main storage device includes, for example, a semiconductor memory. The storage unit HC3 may further have an auxiliary storage device. The auxiliary storage device includes, for example, at least one of a semiconductor memory and a hard disk drive. The storage unit HC3 may include a removable medium. The storage unit HC3 stores various computer programs and various data.

[0054] The communication unit HC4 is connected to a network and executes communication with the integrated control device 10. The network includes, for example, a LAN (Local Area Network) laid in a factory where the first processing device 20 and the second processing device 50 are installed. The communication unit HC4 includes a communication machine. The communication machine is, for example, a network interface controller.

[0055] When an existing host computer is used as the host computer HC, an existing communication interface may be used for the communication interface between the host computer HC and the integrated control device 10.

[0056] The communication unit HC4 is controlled by the control unit HC5 to transmit a signal instructing the creation of an integrated job to the integrated control device 10. Further, the communication unit HC4 receives a notification indicating that an event has occurred from the integrated control device 10. The notification includes a notification of an event that has occurred in the substrate processing system 1000. For example, when an event occurs in which the substrate storage container CA docks to the substrate processing system 1000, the communication unit HC4 receives from the integrated control device 10 a notification indicating that the substrate storage container CA has docked to the substrate processing system 1000.

[0057] The control unit HC5 includes a processor. The control unit HC5 includes, for example, a CPU (Central Processing Unit) as the processor. The control unit HC5 may include a GPU (Graphics Processing Unit) as the processor. Alternatively, the control unit HC5 may include a general-purpose arithmetic unit or a dedicated arithmetic unit. For example, the control unit HC5 may include an FPGA (Field-Programmable Gate Array), or an ASIC (Application Specific Integrated Circuit) as the general-purpose arithmetic unit or the dedicated arithmetic unit.

[0058] The control unit HC5 executes a computer program stored in the storage unit HC3 to control the display unit HC2, the storage unit HC3, and the communication unit HC4. When executing the computer program, the control unit HC5 may refer to the data stored in the storage unit HC3. For example, when the notification received from the integrated control device 10 indicates the occurrence of an event that the substrate storage container CA docks to the substrate processing system 1000, the control unit HC5 causes the communication unit HC4 to transmit a creation command for an integrated job.

[0059] Subsequently, the integrated control device 10 will be described. As shown in FIG. 1, the integrated control device 10 includes a communication unit 11, a storage unit 12, and a control unit 13.

[0060] The communication unit 11 is connected to a network and executes communication with the communication unit HC4 of the host computer HC. The communication unit 11 includes a communication device. The communication unit 11 is controlled by the control unit 13 to notify the host computer HC of the occurrence of an event. Further, the communication unit 11 receives a creation command for an integrated job from the host computer HC.

[0061] The communication unit 11 further executes communication between the first processing device 20 and the second processing device 50. The communication unit 11 is controlled by the control unit 13 to transmit the first virtual job to the first processing device 20 and the second virtual job to the second processing device 50. Also, the communication unit 11 is notified of the events that occur in the first processing device 20 and the events that occur in the second processing device 50.

[0062] For example, when an event occurs in which the substrate storage container CA docks to the first processing device 20, the first processing device 20 notifies the integrated control device 10 of the occurrence of the event. Also, when the processing based on the first virtual job is completed, the first processing device 20 notifies the integrated control device 10 of the occurrence of the event. Similarly, when an event occurs in which the substrate storage container CA docks to the second processing device 50, the second processing device 50 notifies the integrated control device 10 of the occurrence of the event. Also, when the processing based on the second virtual job is completed, the second processing device 50 notifies the integrated control device 10 of the occurrence of the event.

[0063] The storage unit 12 has a main storage device. The storage unit 12 may further have an auxiliary storage device. The storage unit 12 may include a removable medium. The storage unit 12 stores various computer programs and various data. For example, the data includes integrated recipe information HR, which will be described later with reference to FIGS. 5 and 6.

[0064] The control unit 13 includes a processor. The control unit 13 includes, for example, a CPU as the processor. The control unit 13 may include a GPU as the processor. The control unit 13 may include a general-purpose arithmetic device or a dedicated arithmetic device. The control unit 13 executes the computer program stored in the storage unit 12 to control the communication unit 11 and the storage unit 12. When executing the computer program, the control unit 13 may refer to the data stored in the storage unit 12.

[0065] For example, when the communication unit 11 receives a creation instruction for an integrated job from the host computer HC, the control unit 13 generates a first virtual job and a second virtual job by referring to the integrated recipe information HR. Then, the control unit 13 controls the communication unit 11 to cause the communication unit 11 to transmit the first virtual job to the first processing device 20. Similarly, the control unit 13 controls the communication unit 11 to cause the communication unit 11 to transmit the second virtual job to the second processing device 50.

[0066] In addition, when an event occurs in which the substrate storage container CA docks to the first processing device 20, the control unit 13 causes the communication unit 11 to notify the host computer HC that an event has occurred in which the substrate storage container CA has docked to the substrate processing system 1000.

[0067] Subsequently, the first processing device 20 will be described. As shown in FIG. 1, the first processing device 20 includes a first control device 21 and a main body unit 30. The main body unit 30 executes a first process on the substrate W. In the present embodiment, the first processing device 20 is a batch processing device, and the main body unit 30 executes batch processing on the substrate W. The first control device 21 controls the main body unit 30. Specifically, the first control device 21 includes a first communication unit 22, a first storage unit 23, and a first control unit 24.

[0068] The first communication unit 22 is connected to a network and communicates with the communication unit 11 of the integrated control device 10. The first communication unit 22 includes a communication device. The first communication unit 22 is controlled by the first control unit 24 to notify the integrated control device 10 of the occurrence of an event. In addition, the first communication unit 22 receives the first virtual job from the integrated control device 10.

[0069] The first storage unit 23 has a main storage device. The first storage unit 23 may further have an auxiliary storage device. The first storage unit 23 may include a removable medium. The first storage unit 23 stores various computer programs and various data. For example, the data includes a first recipe RP1. The first recipe RP1 defines a first process that the main body 30 of the first processing device 20 executes on the substrate W. Specifically, the first recipe RP1 defines a procedure (process sequence) of substrate processing and set values of various parameters (process parameters).

[0070] The first control unit 24 includes a processor. As the processor, the first control unit 24 includes, for example, a CPU. As the processor, the first control unit 24 may include an MCU (Micro Controller Unit), an MPU (Micro Processing Unit), or a GPU. The first control unit 24 may include a general-purpose arithmetic device or a dedicated arithmetic device. The first control unit 24 executes a computer program stored in the first storage unit 23 to control the first communication unit 22, the first storage unit 23, and the main body 30. When executing the computer program, the first control unit 24 may refer to the data stored in the first storage unit 23.

[0071] Specifically, each time an event occurs in the first processing device 20, the first control unit 24 causes the first communication unit 22 to notify the integrated control device 10 of the occurrence of the event. For example, each time the state of the main body 30 changes, the first control unit 24 causes the first communication unit 22 to notify the integrated control device 10 of the occurrence of the event.

[0072] In addition, when the first control unit 24 receives a first virtual job from the integrated control device 10, it controls the main body 30 based on the first recipe RP1 to cause the main body 30 to process the substrate W. Specifically, the first storage unit 23 stores at least one first recipe RP1. The first virtual job includes information specifying (designating) one of the first recipes RP1 stored in the first storage unit 23. The first control unit 24 controls the main body 30 by referring to the first recipe RP1 specified (designated) by the first virtual job.

[0073] In this embodiment, the main body 30 performs chemical solution treatment and rinsing treatment on the substrate W based on the first virtual job. The first recipe RP1 specified (designated) by the first virtual job defines the procedure of the chemical solution treatment, the procedure of the rinsing treatment, and the set values of various parameters.

[0074] Next, the second processing apparatus 50 will be described. As shown in FIG. 1, the second processing apparatus 50 includes a second control device 51 and a main body 60. The main body 60 performs a second process on the substrate W. In this embodiment, the second processing apparatus 50 is a single-wafer processing apparatus, and the main body 60 performs single-wafer processing on the substrate W. The second control device 51 controls the main body 60. Specifically, the second control device 51 includes a second communication unit 52, a second storage unit 53, and a second control unit 54.

[0075] The second communication unit 52 is connected to the network and communicates with the communication unit 11 of the integrated control device 10. The second communication unit 52 includes a communication machine. The second communication unit 52 is controlled by the second control unit 54 to notify the integrated control device 10 of the occurrence of an event. Further, the second communication unit 52 receives a second virtual job from the integrated control device 10.

[0076] The second storage unit 53 has a main storage device. The second storage unit 53 may further have an auxiliary storage device. The second storage unit 53 may include a removable medium. The second storage unit 53 stores various computer programs and various data. For example, the data includes a second recipe RP2. The second recipe RP2 defines the second process that the main body 60 of the second processing apparatus 50 performs on the substrate W. Specifically, the second recipe RP2 defines the procedure (process sequence) of the substrate process and the set values of various parameters (process parameters).

[0077] The second control unit 54 includes a processor. The second control unit 54 includes, for example, a CPU as the processor. The second control unit 54 may include an MCU, an MPU, or a GPU as the processor. The second control unit 54 may include a general-purpose arithmetic unit or a dedicated arithmetic unit. The second control unit 54 executes a computer program stored in the second storage unit 53 to control the second communication unit 52, the second storage unit 53, and the main body unit 60. When executing the computer program, the second control unit 54 may refer to the data stored in the second storage unit 53.

[0078] Specifically, each time an event occurs in the second processing device 50, the second control unit 54 causes the second communication unit 52 to notify the integrated control device 10 of the occurrence of the event. For example, each time the state of the main body unit 60 changes, the second control unit 54 causes the second communication unit 52 to notify the integrated control device 10 of the occurrence of the event.

[0079] In addition, when the second control unit 54 receives a second virtual job from the integrated control device 10, it controls the main body unit 60 based on the second recipe RP2 to cause the main body unit 60 to process the substrate W. Specifically, the second storage unit 53 stores at least one second recipe RP2. The second virtual job includes information specifying (designating) one of the second recipes RP2 stored in the second storage unit 53. The second control unit 54 controls the main body unit 60 by referring to the second recipe RP2 specified (designated) by the second virtual job.

[0080] In this embodiment, the main body unit 60 performs a drying process on the substrate W based on the second virtual job. The second recipe RP2 specified (designated) by the second virtual job defines the procedure of the drying process and the set values of various parameters.

[0081] Next, with reference to FIGS. 1 and 2, the processing executed by the control unit 13 of the integrated control device 10 will be described. FIG. 2 is a flowchart showing the flow of processing executed by the control unit 13 of the integrated control device 10 included in the substrate processing system 1000 of the present embodiment. The processing shown in FIG. 2 starts when the integrated control device 10 receives a creation command for an integrated job from the host computer HC.

[0082] As shown in FIG. 2, the integrated control device 10 generates a first virtual job and a second virtual job based on the creation command for the integrated job received from the host computer HC. Specifically, when the integrated control device 10 receives a creation command for an integrated job from the host computer HC, it refers to the integrated recipe information HR and generates a first virtual job and a second virtual job.

[0083] Specifically, when starting the processing shown in FIG. 2, the control unit 13 (integrated control device 10) refers to the integrated recipe information HR to generate a first virtual job, and causes the communication unit 11 to transmit the first virtual job to the first control device 21 of the first processing device 20 (step S1). As a result, the first processing device 20 executes processing on the substrate W based on the first virtual job. In the present embodiment, the first processing device 20 is a batch processing device, and chemical solution processing and rinse processing are collectively executed for a set of lots.

[0084] After the chemical solution processing and rinse processing for a set of lots are completed, the control unit 13 (integrated control device 10) refers to the integrated recipe information HR to generate a second virtual job, and causes the communication unit 11 to transmit the second virtual job to the second control device 51 of the second processing device 50 (step S2). As a result, the second processing device 50 executes processing on the substrate W based on the second virtual job. In the present embodiment, the second processing device 50 is a single-wafer processing device, and processes the substrate W one by one. Specifically, the second processing device 50 executes drying processing.

[0085] The second virtual job commands the execution of processing on the substrate W that constitutes one lot. Therefore, after the drying process for one of the pair of lots (two lots) is completed, the control unit 13 (integrated control device 10) refers to the integrated recipe information HR to regenerate the second virtual job, and causes the communication unit 11 to resend the second virtual job to the second control device 51 of the second processing device 50 (step S3). As a result, the process shown in FIG. 2 ends. Note that the second processing device 50 executes a drying process on the other lot of the pair of lots (two lots) based on the second virtual job.

[0086] Subsequently, referring to FIG. 3, the substrate processing system 1000 of the present embodiment will be described. FIG. 3 is a plan view schematically showing the configuration of the substrate processing system 1000 of the present embodiment. Specifically, FIG. 3 shows the configuration of the main body 30 of the batch processing device 20, the main body 60 of the single-wafer processing device 50, the first connection part 80, and the second connection part 90.

[0087] In the following description, for ease of understanding, the X direction, Y direction, and Z direction may be defined and described. The X direction and Y direction are directions parallel to the horizontal plane, and the Z direction is a direction parallel to the vertical plane. The X direction and the Y direction are orthogonal to each other. In the present embodiment, the side where a plurality of first container placement parts CP1 are located in the batch processing device 20 is the +X side, and the opposite side is the -X side. Similarly, in the single-wafer processing device 50, the side where a plurality of second container placement parts CP2 are located is the +X side, and the opposite side is the -X side. Also, the side where the single-wafer processing device 50 is located with respect to the batch processing device 20 is the -Y side, and the side where the batch processing device 20 is located with respect to the single-wafer processing device 50 is the +Y side. Therefore, the batch processing device 20 and the single-wafer processing device 50 face each other in the Y direction.

[0088] As shown in FIG. 3, the main body 30 of the batch processing device 20 includes a first housing 31, a plurality of first container placement parts CP1, a container storage part ACB, a first lot transfer mechanism HTR, a first posture conversion mechanism CTC, a second lot transfer mechanism WTR, and first batch processing units BPU1 to seventh batch processing units BPU7.

[0089] The plurality of first container placement parts CP1 are provided outside the first housing 31. A substrate storage container CA is placed on each of the plurality of first container placement parts CP1. In the present embodiment, the batch processing apparatus 20 includes two first container placement parts CP1. The two first container placement parts CP1 are arranged in the Y direction. The two first container placement parts CP1 are located on the +X side with respect to the container storage part ACB.

[0090] The first container placement part CP1 is, for example, a load port. Hereinafter, one of the two first container placement parts CP1 may be described as the "first load port LP1", and the other may be described as the "second load port LP2". The second load port LP2 is located on the -Y side with respect to the first load port LP1. The first load port LP1 is located on the +Y side with respect to the second load port LP2.

[0091] The container storage part ACB is provided inside the first housing 31. The container storage part ACB stores the substrate storage container CA. Specifically, the container storage part ACB includes a first container transfer mechanism 32, a first container shelf 33a, and a plurality of second container shelves 33b.

[0092] The first container transfer mechanism 32 is configured to be able to transfer the substrate storage container CA between the second load port LP2, the first container shelf 33a, and the plurality of second container shelves 33b. The operation of the first container transfer mechanism 32 is controlled by the first control device 21.

[0093] Specifically, the first container transfer mechanism 32 can transfer the substrate storage container CA placed on the second load port LP2 to the first container shelf 33a and place the substrate storage container CA on the first container shelf 33a. Further, the first container transfer mechanism 32 can transfer the substrate storage container CA from the first container shelf 33a to any one of the plurality of second container shelves 33b and place the substrate storage container CA on the second container shelf 33b. Also, the first container transfer mechanism 32 can transfer the substrate storage container CA from the second container shelf 33b to the second load port LP2 and place the substrate storage container CA on the second load port LP2. Moreover, the first container transfer mechanism 32 can transfer the substrate storage container CA from the second container shelf 33b to the first container shelf 33a and place the substrate storage container CA on the first container shelf 33a. Furthermore, the first container transfer mechanism 32 can transfer the substrate storage container CA from the first container shelf 33a to the second load port LP2 and place the substrate storage container CA on the second load port LP2.

[0094] The first lot transfer mechanism HTR and the first posture conversion mechanism CTC are provided in the first housing 31. The first lot transfer mechanism HTR is configured to access the substrate storage container CA placed on the first container shelf 33a, collectively carry out the substrates W constituting one lot from the substrate storage container CA, and transfer the substrates W constituting one lot to the first posture conversion mechanism CTC. Also, the first lot transfer mechanism HTR and the first posture conversion mechanism CTC are configured to be able to transfer one lot of substrates W between the first lot transfer mechanism HTR and the first posture conversion mechanism CTC. The operation of the first lot transfer mechanism HTR is controlled by the first control device 21.

[0095] The first posture conversion mechanism CTC is configured to combine two lots of substrates W to form a set of lots. Further, the first posture conversion mechanism CTC is configured to convert the posture of a set of lots and convert the postures of the respective substrates W constituting the set of lots between a horizontal posture and a vertical posture. That is, the first posture conversion mechanism CTC is configured to convert the posture of a set of lots between a horizontal posture and a vertical posture. The operation of the first posture conversion mechanism CTC is controlled by the first control device 21.

[0096] Specifically, in response to the first container transfer mechanism 32 transferring the first substrate storage container CA1 from the second load port LP2 to the first container shelf 33a, the first lot transfer mechanism HTR collectively transfers the substrates W of the first lot stored in the first substrate storage container CA1 to the first posture conversion mechanism CTC.

[0097] The first container transfer mechanism 32 transfers the emptied first substrate storage container CA1 from the first container shelf 33a to any one of a plurality of second container shelves 33b, and then transfers the second substrate storage container CA2 newly placed on the second load port LP2 to the first container shelf 33a. Then, the first lot transfer mechanism HTR collectively transfers the substrates W of the second lot stored in the second substrate storage container CA2 placed on the first container shelf 33a to the first posture conversion mechanism CTC. The first posture conversion mechanism CTC combines the two lots sequentially transferred by the first lot transfer mechanism HTR to form a set of lots.

[0098] The second lot transfer mechanism WTR and the first batch processing units BPU1 to seventh batch processing units BPU7 are provided in the first housing 31. The first batch processing units BPU1 to seventh batch processing units BPU7 are arranged in the X direction. In the present embodiment, among the first batch processing units BPU1 to seventh batch processing units BPU7, the seventh batch processing unit BPU7 is located on the most +X side.

[0099] The second lot transfer mechanism WTR and the first attitude conversion mechanism CTC are configured to enable the transfer of a set of lots between the second lot transfer mechanism WTR and the first attitude conversion mechanism CTC. Further, the second lot transfer mechanism WTR is configured to enable the transfer of a set of lots between the first batch processing units BPU1 to BPU7. Furthermore, the second lot transfer mechanism WTR is configured to enable the transfer of a set of lots between the substrate standby unit 40 described later. Specifically, the second lot transfer mechanism WTR has a pair of chucks 34 configured to be able to grip each substrate W in a vertical attitude constituting a set of lots. The operation of the second lot transfer mechanism WTR is controlled by the first control device 21.

[0100] The first batch processing units BPU1 to BPU4 are each configured to be able to perform chemical solution treatment on each substrate W in a vertical attitude constituting a set of lots all at once (batch chemical solution treatment). Therefore, the batch processing apparatus 20 can execute chemical solution treatment in parallel on a maximum of four sets of lots (eight lots). After the second lot transfer mechanism WTR grips a set of lots supported by the first attitude conversion mechanism CTC with the pair of chucks 34, it transfers the lots to any one of the first batch processing units BPU1 to BPU4.

[0101] Specifically, the first batch processing units BPU1 to BPU4 each have a first chemical solution tank CHB1 to CHB4 and a first lifter LF1 to LF4.

[0102] The first chemical solution tank CHB1 stores a chemical solution. The chemical solution is, for example, an etching solution. The etching solution may be an acidic chemical solution such as an aqueous phosphoric acid solution. The first lifter LF1 is configured to be able to move up and down between an upper position and a lower position. The upper position is a position above the liquid level of the chemical solution stored in the first chemical solution tank CHB1, and the lower position is a position below the liquid level of the chemical solution stored in the first chemical solution tank CHB1. The operation of the first lifter LF1 is controlled by the first control device 21.

[0103] When the first lifter LF1 is in the upper position, a set of lots is transferred between the first lifter LF1 and the second lot transfer mechanism WTR. Specifically, the first lifter LF1 has a support member 35. The support member 35 supports each substrate W in a vertical posture. When the first lifter LF1 is in the upper position, the second lot transfer mechanism WTR places a set of lots on the support member 35 of the first lifter LF1. Further, when the first lifter LF1 is in the upper position, the second lot transfer mechanism WTR grips each substrate W in a vertical posture supported by the support member 35 of the first lifter LF1 with a pair of chucks 34.

[0104] With the support member 35 supporting each substrate W in a vertical posture, as the first lifter LF1 moves from the upper position to the lower position, each substrate W in a vertical posture is immersed in the chemical solution stored in the first chemical solution tank CHB1. By holding each substrate W in the chemical solution, each substrate W is processed by the chemical solution. After the chemical solution treatment is completed, the first lifter LF1 moves from the lower position to the upper position.

[0105] Since the configurations of the second batch processing unit BPU2 to the fourth batch processing unit BPU4 are the same as the configuration of the first batch processing unit BPU1, their descriptions are omitted.

[0106] The fifth batch processing unit BPU5 and the sixth batch processing unit BPU6 are each configured to be able to perform a rinsing process on each substrate W in a vertical posture constituting a set of lots (batch rinsing process) all at once. Therefore, the batch processing apparatus 20 can execute the rinsing process in parallel for a maximum of two sets of lots (four lots). The second lot transfer mechanism WTR transfers a set of lots after the chemical solution treatment to one of the fifth batch processing unit BPU5 and the sixth batch processing unit BPU6.

[0107] Specifically, the fifth batch processing unit BPU5 has a first rinse tank ONB1 and a fifth lifter LF5. The sixth batch processing unit BPU6 has a second rinse tank ONB2 and a sixth lifter LF6.

[0108] Rinse liquid is stored in the first rinse tank ONB1 and the second rinse tank ONB2 respectively. The rinse liquid may be deionized water (DIW). When a set of lots after chemical solution treatment is immersed in the rinse liquid, the chemical solution adhering to each substrate W in a vertical posture constituting the set of lots is washed away. Since the configurations of the fifth batch processing unit BPU5 and the sixth batch processing unit BPU6 are substantially the same as those of the first batch processing unit BPU1 to the fourth batch processing unit BPU4, their detailed descriptions are omitted.

[0109] The seventh batch processing unit BPU7 performs a batch drying process for collectively drying each substrate W in a vertical posture constituting a set of lots. The seventh batch processing unit BPU7 is used when performing chemical solution treatment, rinse treatment, and drying treatment in the batch processing apparatus 20. The operation of the seventh batch processing unit BPU7 is controlled by the first control device 21.

[0110] Specifically, the seventh batch processing unit BPU7 has a drying chamber LPD, an inert gas supply nozzle, and an organic solvent supply nozzle. The second lot transfer mechanism WTR accommodates a set of lots after rinse treatment in the drying chamber LPD. The inert gas supply nozzle supplies inert gas into the drying chamber LPD. The organic solvent supply nozzle supplies vapor of an organic solvent into the drying chamber LPD. Note that the inert gas is, for example, nitrogen. The organic solvent is, for example, IPA (isopropyl alcohol).

[0111] After a set of lots is accommodated in the drying chamber LPD, the seventh batch processing unit BPU7 first supplies an inert gas into the drying chamber LPD to replace the atmosphere in the drying chamber LPD with the inert gas. Then, the seventh batch processing unit BPU7 decompresses the inside of the drying chamber LPD. And the seventh batch processing unit BPU7 supplies the vapor of the organic solvent into the drying chamber LPD while the inside of the drying chamber LPD is decompressed. The organic solvent is discharged out of the drying chamber LPD together with the moisture adhering to the substrate W. As a result, each substrate W accommodated in the drying chamber LPD is dried.

[0112] Note that the first lot and the second lot constituting a set of lots may each be returned to the first substrate storage container CA1 and the second substrate storage container CA2 after the drying process is performed.

[0113] Specifically, the second lot transfer mechanism WTR transfers a set of lots after the drying process to the first posture conversion mechanism CTC. The first posture conversion mechanism CTC converts the posture of each substrate W from the vertical posture to the horizontal posture. On the other hand, the first container transfer mechanism 32 moves the empty first substrate storage container CA1 from the second container shelf 33b to the first container shelf 33a.

[0114] The first lot transfer mechanism HTR transfers one of the two lots (the first lot) constituting a set of lots from the first posture conversion mechanism CTC to the empty first substrate storage container CA1 placed on the first container shelf 33a and loads it into the first substrate storage container CA1. As a result, the first lot is accommodated in the first substrate storage container CA1. The first container transfer mechanism 32 transfers the first substrate storage container CA1 accommodating the first lot after the drying process to the second load port LP2, and then moves the empty second substrate storage container CA2 from the second container shelf 33b to the first container shelf 33a. The first substrate storage container CA1 placed on the second load port LP2 is transferred from the second load port LP2 to the first load port LP1 by the second container transfer mechanism 92 described later.

[0115] The second lot after the drying process is carried into the empty second substrate storage container CA2 in the same manner as the first lot. Then, the second substrate storage container CA2 that houses the second lot after the drying process is transported to the second load port LP2 by the first container transport mechanism 32, in the same manner as the first substrate storage container CA1.

[0116] On the other hand, when the batch drying process is not performed in the batch processing apparatus 20, the second lot transport mechanism WTR transports a set of lots after the rinsing process to the first connection part 80. Specifically, the second lot transport mechanism WTR transports a set of lots after the rinsing process to a substrate standby part 40, which will be described later. The set of lots after the rinsing process waits in the substrate standby part 40. Note that the set of lots after the rinsing process is an example of "substrates after executing at least a part of the first process".

[0117] Next, the first connection part 80 will be described. As shown in FIG. 3, the first connection part 80 includes a substrate standby part 40. The substrate standby part 40 is provided inside the first housing 31 of the batch processing apparatus 20. In the present embodiment, the substrate standby part 40 is provided on the +X side of the seventh batch processing unit BPU7.

[0118] When substrate processing is executed by the batch processing apparatus 20 and the single-wafer processing apparatus 50, the substrate standby part 40 waits for a set of lots after the rinsing process. Specifically, the substrate standby part 40 includes a seventh lifter LF7, a standby tank 42, a chuck mechanism TFC, and an attitude conversion part 43.

[0119] For example, deionized water is stored in the standby tank 42. Similar to the first lifter LF1, the seventh lifter LF7 is configured to be movable up and down between an upper position and a lower position. The operation of the seventh lifter LF7 is controlled by the control part 13 (see FIG. 1) of the integrated control device 10. Note that the integrated control device 10 may be disposed, for example, below a plurality of second container placement parts CP2, which will be described later.

[0120] Specifically, when the second lot transfer mechanism WTR places a set of lots on the support member 35 of the seventh lifter LF7 positioned at the upper position, the integrated control device 10 is notified from the first control device 21 (first control unit 24) that a completion event of the first virtual job has occurred. The completion event indicates that the processing based on the job has been completed. The control unit 13 of the integrated control device 10 starts controlling the first connecting portion 80 in response to the occurrence of the completion event of the first virtual job.

[0121] Specifically, when a completion event of the first virtual job occurs, the seventh lifter LF7 moves from the upper position to the lower position. As a result, a set of lots (each substrate W in a vertical posture) is immersed in the deionized water stored in the standby tank 42. Since the configuration of the seventh lifter LF7 is the same as that of the first lifter LF1, a detailed description thereof is omitted.

[0122] The chuck mechanism TFC is configured to transfer one lot between the seventh lifter LF7 and the posture conversion unit 43. Specifically, the chuck mechanism TFC has a pair of chucks 41 configured to be able to grip one of the two lots constituting a set of lots. The operation of the chuck mechanism TFC is controlled by the control unit 13 of the integrated control device 10.

[0123] When a set of lots is immersed in the liquid in the standby tank 42, the chuck mechanism TFC grips one of the two lots constituting the set of lots supported by the seventh lifter LF7 and transports it to the posture conversion unit 43. Specifically, the chuck mechanism TFC grips one of the two lots with the pair of chucks 41, moves the one lot above the liquid level of the standby tank 42, and then transports it to the posture conversion unit 43. After each substrate W constituting one lot is transported from the posture conversion unit 43 to the single-wafer processing apparatus 50 by the substrate transfer mechanism 82 described later, the chuck mechanism TFC grips the other lot immersed in the liquid in the standby tank 42 and transports it to the posture conversion unit 43.

[0124] The posture conversion unit 43 includes a second posture conversion mechanism and an immersion tank. The second posture conversion mechanism is configured to be able to transfer each substrate W in a vertical posture that constitutes one lot to and from the chuck mechanism TFC. Further, the second posture conversion mechanism is configured to convert the posture of each substrate W that constitutes one lot from a vertical posture to a horizontal posture. The operation of the second posture conversion mechanism is controlled by the control unit 13 of the integrated control device 10.

[0125] For example, deionized water is stored in the immersion tank. The second posture conversion mechanism is configured to be movable in the vertical direction. When the second posture conversion mechanism moves downward, the substrates W of one lot are immersed in the deionized water in the immersion tank. Further, the second posture conversion mechanism adjusts the vertical position of each substrate W after the posture conversion so that the uppermost substrate W among the substrates W of one lot is positioned above the liquid level of the immersion tank. Note that the second posture conversion mechanism may convert the posture of one lot in the liquid in the immersion tank or may convert the posture of one lot above the liquid level of the immersion tank.

[0126] Next, the single - sheet processing apparatus 50 will be described. As shown in FIG. 3, the main body portion 60 of the single - sheet processing apparatus 50 includes a second housing 61, a plurality of second container placement portions CP2, an indexer robot IR, a center robot CR, and a plurality of towers TW. Further, the first connection portion 80 has a transfer portion 62.

[0127] The plurality of second container placement portions CP2 are provided outside the second housing 61. Specifically, the plurality of second container placement portions CP2 are located on the +X side of the second housing 61. A substrate storage container CA is placed on each of the plurality of second container placement portions CP2. The plurality of second container placement portions CP2 are arranged in the Y direction.

[0128] In the present embodiment, the single - sheet processing apparatus 50 includes four second container placement portions CP2. The second container placement portion CP2 is, for example, a load port. Hereinafter, the second container placement portion CP2 may be referred to as the "third load port LP3".

[0129] The indexer robot IR, the center robot CR, and the plurality of towers TW are located within the second housing 61. The indexer robot IR transports the substrate W between the third load port LP3 and the center robot CR. Note that a mounting table (pass) for temporarily placing the substrate W may be provided between the indexer robot IR and the center robot CR, and the substrate W may be indirectly transferred between the indexer robot IR and the center robot CR via the mounting table. The operation of the indexer robot IR is controlled by the second control device 51.

[0130] The plurality of towers TW are arranged so as to surround the center robot CR in a plan view. In the present embodiment, the single-wafer processing apparatus 50 includes four towers TW (the first tower TW1 to the fourth tower TW4).

[0131] Each tower TW includes a plurality of single-wafer processing units 63 stacked vertically. In the present embodiment, the first tower TW1, the second tower TW2, and the fourth tower TW4 include three single-wafer processing units 63. The third tower TW3 includes two single-wafer processing units 63 and one chamber 63a. Specifically, single-wafer processing units 63 are provided at the uppermost stage and the lowermost stage of the third tower TW3. The chamber 63a is provided in the middle stage of the third tower TW3. FIG. 3 shows the configuration of the middle stage of each tower TW.

[0132] The center robot CR transports the substrate W between the indexer robot IR and the single-wafer processing unit 63. Also, the center robot CR transports the substrate W between the chamber 63a and the single-wafer processing unit 63. The operation of the center robot CR is controlled by the second control device 51.

[0133] Each of the single-wafer processing units 63 is configured to be able to perform chemical solution treatment, rinse treatment, and drying treatment on one substrate W. The delivery unit 62 of the first connection part 80 is provided in the chamber 63a. Specifically, the chamber 63a has a substantially box shape and houses the delivery unit 62.

[0134] The delivery unit 62 is configured to hold the substrates W one by one. For example, the delivery unit 62 may be a clamping chuck or a vacuum chuck. The operation of the delivery unit 62 is controlled by the control unit 13 (see FIG. 1) of the integrated control device 10.

[0135] Subsequently, referring to FIG. 3, the batch processing device 20, the single wafer processing device 50, and the first connection unit 80 will be further described. As shown in FIG. 3, the first housing 31 of the batch processing device 20 has a first opening 31a. The second housing 61 of the single wafer processing device 50 has a second opening 61a. The first connection unit 80 further includes a first connection housing 81 and a substrate transfer mechanism 82.

[0136] The first connection housing 81 is cylindrical. The first connection housing 81 extends in the Y direction. One end of the first connection housing 81 is connected to the first housing 31. The other end of the first connection housing 81 is connected to the second housing 61. One end and the other end of the first connection housing 81 are open, and the inner space of the first connection housing 81 communicates with the first opening 31a of the first housing 31 and the second opening 61a of the second housing 61.

[0137] Specifically, the first opening 31a of the first housing 31 is provided at a position that communicates the inner space of the substrate standby unit 40 and the inner space of the first connection housing 81. The second opening 61a of the second housing 61 is provided at a position that communicates the inner space of the chamber 63a and the inner space of the first connection housing 81.

[0138] The substrate transfer mechanism 82 transfers the substrates W one by one to the single wafer processing device 50 after being processed by the batch processing device 20. Specifically, the substrate transfer mechanism 82 accesses the substrate standby unit 40 through the first opening 31a of the first housing 31 and transfers the substrates W waiting in the substrate standby unit 40 to the single wafer processing device 50 one by one. The substrate transfer mechanism 82 is, for example, a transfer robot. The operation of the substrate transfer mechanism 82 is controlled by the control unit 13 of the integrated control device 10.

[0139] Specifically, the substrate transfer mechanism 82 transfers the substrate W positioned above the liquid surface of the immersion tank provided in the posture conversion unit 43 to the single wafer processing apparatus 50. Therefore, the substrate transfer mechanism 82 transfers the substrate W in a wet state. Thus, it is difficult for the substrate W to dry during the transfer by the substrate transfer mechanism 82. As a result, for example, even when a fine pattern is formed on the substrate W, the pattern is less likely to collapse during the transfer of the substrate W by the substrate transfer mechanism 82.

[0140] The second posture conversion mechanism adjusts the vertical position of each substrate W after posture conversion held by the second posture conversion mechanism so that the next uppermost substrate W is positioned above the liquid surface of the immersion tank in response to the uppermost substrate W being transferred by the substrate transfer mechanism 82.

[0141] The substrate transfer mechanism 82 unloads the substrate W after being processed by the batch processing apparatus 20 from the first opening 31a of the first housing 31, transfers it inside the first connecting housing 81, and loads it into the second housing 61 through the second opening 61a of the second housing 61. Specifically, the substrate transfer mechanism 82 loads the substrate W into the chamber 63a through the second opening 61a. Then, the substrate transfer mechanism 82 delivers the substrate W to the delivery unit 62. The delivery unit 62 holds the substrate W delivered from the substrate transfer mechanism 82.

[0142] When the control unit 13 of the integrated control device 10 causes the delivery unit 62 to hold the substrate W, it notifies the single wafer processing apparatus 50 that the delivery unit 62 is holding the substrate W. When the single wafer processing apparatus 50 receives this notification, the center robot CR accesses the chamber 63a, unloads the substrate W from the chamber 63a, and loads it into any one of the single wafer processing units 63.

[0143] As described above, according to Embodiment 1, the first connecting portion 80 is provided in the substrate processing system 1000. As a result, a dedicated transfer path for transferring the substrate W is formed between the first processing apparatus 20 and the second processing apparatus 50. Therefore, for example, it is not necessary to return the wet substrate W to the substrate storage container CA and transfer the substrate storage container CA that stores the wet substrate W from the first container placement portion CP1 of the first processing apparatus 20 to the second container placement portion CP2 of the second processing apparatus 50.

[0144] Subsequently, with reference to FIG. 3, the substrate processing system 1000 of the present embodiment will be further described. As shown in FIG. 3, the substrate processing system 1000 further includes a second connecting portion 90. The second connecting portion 90 connects the batch processing apparatus 20 and the single wafer processing apparatus 50. The second connecting portion 90 includes a second connecting housing 91 and a second container transfer mechanism 92.

[0145] The second connecting housing 91 is cylindrical. The second connecting housing 91 extends in the Y direction. The second connecting housing 91 covers the first container placement portion CP1 of the first processing apparatus 20 and the second container placement portion CP2 of the second processing apparatus 50. The second container transfer mechanism 92 is configured to transfer the substrate storage container CA. For example, the second container transfer mechanism 92 transfers the substrate storage container CA placed on the first container placement portion CP1 of the first processing apparatus 20 to the second container placement portion CP2 of the second processing apparatus 50. Specifically, the second container transfer mechanism 92 transfers the substrate storage container CA inside the second connecting housing 91. The operation of the second container transfer mechanism 92 is controlled by the control unit 13 (see FIG. 1) of the integrated control device 10.

[0146] In this embodiment, the second connection housing 91 covers the second load port LP2 of the first processing device 20 and the plurality of third load ports LP3 of the second processing device 50. Therefore, the second load port LP2 and the plurality of third load ports LP3 are located inside the second connection housing 91, and the first load port LP1 of the first processing device 20 is located outside the second connection housing 91. The substrate storage container CA is placed on the first load port LP1 by an OHT (Overhead Hoist Transport). A factory internal transport system such as an OHT transports the substrate storage container CA within the clean room where the first processing device 20 and the second processing device 50 are installed.

[0147] The end of the second connection housing 91 on the +Y side (the first load port LP1 side) is located between the first load port LP1 and the second load port LP2. The end of the second connection housing 91 on the +Y side is open. Hereinafter, the end of the second connection housing 91 on the +Y side may be referred to as "one end of the second connection housing 91". Also, the end of the second connection housing 91 on the side opposite to the one end (-Y side) may be referred to as "the other end of the second connection housing 91".

[0148] The second container transport mechanism 92 transports the substrate storage container CA placed on the first load port LP1 from outside the second connection housing 91 to inside through one end (+Y side end) of the second connection housing 91 and places it on the second load port LP2. Also, the second container transport mechanism 92 transports the empty substrate storage container CA placed on the second load port LP2 by the first container transport mechanism 32 to any one of the four third load ports LP3 and places it on the third load port LP3.

[0149] The ceiling wall of the second connection housing 91 has an opening (not shown). For example, the opening formed in the ceiling wall of the second connection housing 91 may be located near the other end (-Y side end) of the second connection housing 91. Note that the other end (-Y side end) of the second connection housing 91 is located further on the -Y side than the third load port LP3 located most on the -Y side among the four third load ports LP3.

[0150] The second container transfer mechanism 92 is configured to be able to move up and down. The second container transfer mechanism 92 raises the substrate storage container CA that houses the substrate W after the drying process is performed by the single-wafer processing apparatus 50 toward the opening formed in the ceiling wall of the second connection housing 91.

[0151] The opening formed in the ceiling wall of the second connection housing 91 may be formed so that, for example, the OHT can access it. In this case, the OHT receives the substrate storage container CA from the second container transfer mechanism 92 through the opening formed in the ceiling wall of the second connection housing 91, and carries out the substrate storage container CA to the outside of the second connection housing 91. Alternatively, the second container transfer mechanism 92 may raise the substrate storage container CA above the ceiling wall of the second connection housing 91 through the opening formed in the ceiling wall of the second connection housing 91.

[0152] As described above, according to the first embodiment, the second connection portion 90 is provided in the substrate processing system 1000. As a result, a dedicated transfer path for transferring the substrate storage container CA is formed between the first processing apparatus 20 and the second processing apparatus 50. Therefore, it is not necessary to transfer the substrate storage container CA between the first processing apparatus 20 and the second processing apparatus 50 using an in-factory transfer system such as an OHT.

[0153] Subsequently, referring to FIG. 4, the single-wafer processing unit 63 will be described. FIG. 4 is a side sectional view schematically showing the inside of the single-wafer processing unit 63. As shown in FIG. 4, the single-wafer processing unit 63 includes a chamber 63b, a spin chuck 64, a nozzle 65, a nozzle moving portion 66, and a cup 67. The single-wafer processing apparatus 50 further includes a liquid supply pipe 71 and an on-off valve 72.

[0154] The substrate W is carried into the chamber 63b and processed in the chamber 63b. The chamber 63b has a substantially box shape. The chamber 63b houses the spin chuck 64, the nozzle 65, the nozzle moving portion 66, the cup 67, and a part of the liquid supply pipe 71.

[0155] The spin chuck 64 holds the substrate W horizontally. The spin chuck 64 rotates the substrate W about a first rotation axis AX1 extending in the vertical direction. Specifically, the spin chuck 64 includes a spin base 641, a plurality of chuck members 642, a motor body 643, and a shaft 644.

[0156] The spin base 641 is disc-shaped and supports the plurality of chuck members 642 in a horizontal posture. The plurality of chuck members 642 are arranged at the peripheral edge of the spin base 641. The plurality of chuck members 642 sandwich the peripheral edge of the substrate W. The substrate W is held in a horizontal posture by the plurality of chuck members 642. The operation of the plurality of chuck members 642 is controlled by the second control device 51. The plurality of chuck members 642 are arranged such that the center of the substrate W faces the center of the spin base 641.

[0157] The shaft 644 is coupled to the center of the spin base 641. The shaft 644 extends vertically downward from the center of the spin base 641 along the first rotation axis AX1. The motor body 643 rotates the shaft 644 about the first rotation axis AX1. As a result, the spin base 641 rotates, and the substrate W held by the plurality of chuck members 642 rotates about the first rotation axis AX1. The operation of the motor body 643 is controlled by the second control device 51. The motor body 643 is, for example, an electric motor.

[0158] The nozzle moving unit 66 moves the nozzle 65 in the vertical and horizontal directions. Specifically, the nozzle moving unit 66 includes an arm 661, a base 662, and a nozzle moving mechanism 663.

[0159] The base 662 extends in the vertical direction. The arm 661 is coupled to the base 662. The arm 661 extends horizontally from the base 662. The arm 661 supports the nozzle 65. For example, the nozzle 65 is fixed to the tip of the arm 661.

[0160] The nozzle moving mechanism 663 moves the arm 661 in the vertical and horizontal directions. As a result, the nozzle 65 moves in the vertical and horizontal directions. The nozzle moving mechanism 663 is controlled by the second control device 51.

[0161] Specifically, the nozzle moving mechanism 663 includes a rotation mechanism and a lifting mechanism. The rotation mechanism rotates the base 662 in both forward and reverse directions about a second rotation axis AX2 extending in the vertical direction. As a result, the nozzle 65 moves along the horizontal plane. The lifting mechanism raises and lowers the base 662 in the vertical direction. As a result, the nozzle 65 moves in the vertical direction. The actuator of the rotation mechanism may include, for example, a servo motor such as a stepping motor and a speed reducer. The actuator of the lifting mechanism may include, for example, a ball screw and an electric motor capable of rotating in both forward and reverse directions.

[0162] The nozzle moving unit 66 moves the nozzle 65 between the processing position and the retracted position. The processing position is a position facing the center of the substrate W. The retracted position is a position outside the cup 67 in a plan view.

[0163] The nozzle 65 discharges the processing liquid toward the upper surface of the substrate W held by the spin chuck 64 from the processing position. More specifically, the nozzle 65 discharges the processing liquid toward the center of the rotating substrate W. As a result, a liquid film of the processing liquid is formed on the upper surface of the substrate W. In the present embodiment, the nozzle 65 discharges IPA. IPA is an example of an organic solvent.

[0164] Here, the drying process by the single-wafer processing unit 63 will be described. As described with reference to FIG. 3, the substrate W after being subjected to the chemical liquid treatment and the rinse treatment by the batch processing apparatus 20 may be transported to the single-wafer processing apparatus 50. In this case, the center robot CR transports the substrate W from the delivery unit 62 to one of the plurality of single-wafer processing units 63. The spin chuck 64 holds and rotates the substrate W carried into the chamber 63b. Then, IPA is supplied from the nozzle 65 toward the rotating substrate W. As a result, the rinse liquid adhering to the substrate W is washed away, and a liquid film of IPA is formed on the upper surface of the substrate W. When a predetermined time has elapsed since the start of the discharge of IPA, the spin chuck 64 increases the rotation speed of the substrate W. As a result, IPA scatters from the upper surface of the substrate W, and the substrate W dries up.

[0165] Next, the liquid supply pipe 71, the on-off valve 72, and the cup 67 will be described. The liquid supply pipe 71 supplies the processing liquid to the nozzle 65. The liquid supply pipe 71 is a tubular member through which the processing liquid flows. By supplying the processing liquid to the nozzle 65 through the liquid supply pipe 71, the processing liquid is discharged from the nozzle 65. In the present embodiment, the liquid supply pipe 71 supplies IPA to the nozzle 65.

[0166] The on-off valve 72 is provided in the liquid supply pipe 71. The on-off valve 72 is switchable between an open state and a closed state. The second control device 51 controls the opening and closing operation of the on-off valve 72. Specifically, when supplying the processing liquid (IPA) from the nozzle 65 to the substrate W, the second control device 51 sets the on-off valve 72 to the open state. As a result, the processing liquid (IPA) flows through the liquid supply pipe 71 toward the nozzle 65, and the processing liquid (IPA) is discharged from the nozzle 65 toward the substrate W. When stopping the discharge of the processing liquid (IPA) by the nozzle 65, the second control device 51 sets the on-off valve 72 to the closed state. As a result, the flow of the processing liquid (IPA) through the liquid supply pipe 71 stops, and the discharge of the processing liquid (IPA) by the nozzle 65 stops.

[0167] The cup 67 is disposed outside the spin chuck 64. The cup 67 has a substantially cylindrical shape. In other words, the cup 67 surrounds the spin chuck 64. The cup 67 receives the processing liquid discharged from the substrate W and prevents the processing liquid from scattering inside the chamber 63b.

[0168] Note that the single wafer processing unit 63 may have at least one nozzle in addition to the nozzle 65. For example, the single wafer processing unit 63 may have a chemical liquid nozzle and a rinse liquid nozzle in addition to the nozzle 65. The chemical liquid nozzle discharges the chemical liquid toward the upper surface of the substrate W when performing chemical liquid processing in the single wafer processing unit 63. The rinse liquid nozzle discharges the rinse liquid toward the upper surface of the substrate W when performing a rinse process in the single wafer processing unit 63.

[0169] Subsequently, referring to FIGS. 1 and 5, the first recipe editing screen G1 will be described. FIG. 5 is a diagram showing an example of the first recipe editing screen G1. The first recipe editing screen G1 is a screen for editing (creating) an integrated recipe. The integrated recipe indicates a recipe obtained by integrating the first recipe RP1 and the second recipe RP2. The user of the substrate processing system 1000 edits (creates) the integrated recipe via the first recipe editing screen G1 before processing the substrate W using the substrate processing system 1000.

[0170] The first recipe editing screen G1 is displayed on the display unit HC2 of the host computer HC by the integrated control device 10. As shown in FIG. 5, the first recipe editing screen G1 displays a recipe name column 101, a first recipe list column 102, and a second recipe list column 103.

[0171] The recipe name column 101 is an input column for setting the name of the integrated recipe. The operator of the host computer HC can operate the input unit HC1 to input arbitrary characters, symbols, or numbers into the recipe name column 101 to set the name of the integrated recipe.

[0172] The first recipe list column 102 displays a list of the names of the first recipes RP1 stored in the first storage unit 23 of the first processing device 20. For example, when a plurality of first recipes RP1 are stored in the first storage unit 23, the first recipe list column 102 displays the names of the plurality of first recipes RP1 in a list format. An operator of the host computer HC can operate the input unit HC1 to specify (select) a first recipe RP1 to be integrated into the integrated recipe from among the first recipes RP1 displayed in the first recipe list column 102.

[0173] In addition, when an operator of the host computer HC operates the input unit HC1 to specify (select) one of the names of the first recipes RP1 displayed in the first recipe list column 102, a first individual recipe editing screen (not shown) is displayed on the display unit HC2.

[0174] The first individual recipe editing screen is a screen for editing the first recipe RP1 specified (selected) by the operator. When the batch processing device 20 is an existing device, the existing first recipe RP1 stored in the first storage unit 23 defines the procedures for chemical solution processing, rinsing processing, and drying processing, and the set values of various parameters related to those processes. For example, when creating an integrated recipe, the operator edits the first recipe RP1 via the first individual recipe editing screen so that the chemical solution processing and rinsing processing are executed by the batch processing device 20 among the chemical solution processing, rinsing processing, and drying processing.

[0175] Similar to the first recipe list column 102, the second recipe list column 103 displays a list of the names of the second recipes RP2 stored in the second storage unit 53 of the second processing device 50. An operator of the host computer HC can operate the input unit HC1 to specify (select) a second recipe RP2 to be integrated into the integrated recipe from among the second recipes RP2 displayed in the second recipe list column 103.

[0176] In addition, when an operator of the host computer HC operates the input unit HC1 to specify (select) one of the names of the second recipes RP2 displayed in the second recipe list column 103, a second individual recipe editing screen (not shown) is displayed on the display unit HC2 in the same manner as when the first recipe RP1 is specified (selected).

[0177] The second individual recipe editing screen is a screen for editing the second recipe RP2 specified (selected) by the operator, similar to the first individual recipe editing screen. For example, when creating an integrated recipe, the operator edits the second recipe RP2 via the second individual recipe editing screen so that only the drying process among the chemical solution treatment, rinsing treatment, and drying treatment is executed by the single-sheet processing apparatus 50.

[0178] Subsequently, with reference to FIGS. 1, 5, and 6, the integrated recipe editing process executed by the control unit 13 of the integrated control device 10 will be described. FIG. 6 is a flowchart showing the flow of the integrated recipe editing process executed by the control unit 13 of the integrated control device 10 included in the substrate processing system 1000 of the present embodiment. As shown in FIG. 6, the integrated recipe editing process includes steps S11 to S19. The integrated recipe editing process is started, for example, in response to an operator operating the input unit HC1 of the host computer HC to instruct the editing of the integrated recipe.

[0179] When starting the integrated recipe editing process, the control unit 13 acquires the first recipe RP1 from the first processing device 20 via the communication unit 11 (step S11). Specifically, the control unit 13 instructs the first control unit 24 of the first processing device 20 to transmit the first recipe RP1. The first control unit 24 reads out the first recipe RP1 (recipe file) from the first storage unit 23 in accordance with the instruction from the integrated control device 10. The first control unit 24 transmits the first recipe RP1 (recipe file) read out from the first storage unit 23 to the integrated control device 10 via the first communication unit 22. As a result, the communication unit 11 of the integrated control device 10 receives the first recipe RP1 (recipe file) from the first processing device 20, and the control unit 13 acquires the first recipe RP1 (recipe file) via the communication unit 11. The control unit 13 stores the first recipe RP1 (recipe file) transmitted from the first processing device 20 in the storage unit 12.

[0180] When the control unit 13 acquires the first recipe RP1, it generates (creates) a list of the first recipe RP1 and stores the list data of the first recipe RP1 in the storage unit 12 (step S12).

[0181] Similar to step S11, the control unit 13 acquires the second recipe RP2 from the second processing device 50 via the communication unit 11 (step S13). The control unit 13 stores the second recipe RP2 transmitted from the second processing device 50 in the storage unit 12.

[0182] When the control unit 13 acquires the second recipe RP2, it generates (creates) a list of the second recipe RP2 and stores the list data of the second recipe RP2 in the storage unit 12 (step S14).

[0183] When the control unit 13 generates (creates) the list of the first recipe RP1 and the list of the second recipe RP2, it causes the display unit HC2 of the host computer HC to display the first recipe editing screen G1 (see FIG. 5) (step S15). When displaying the first recipe editing screen G1, the control unit 13 refers to the list data of the first recipe RP1 and displays a list of the first recipe RP1 in the first recipe list column 102. Similarly, the control unit 13 refers to the list data of the second recipe RP2 and displays a list of the second recipe RP2 in the second recipe list column 103.

[0184] After displaying the first recipe editing screen G1, as described with reference to FIG. 5, the control unit 13 accepts the editing operation of the integrated recipe via the first recipe editing screen G1 by the operator (step S16). As a result, the control unit 13 edits the integrated recipe that integrates the first recipe RP1 and the second recipe RP2 specified (selected) by the operator, and stores the integrated recipe information HR (see FIG. 1) in the storage unit 12 (step S17).

[0185] Specifically, as described with reference to FIG. 5, when causing the first processing device 20 to execute a part of the first processing, the control unit 13 edits the first recipe RP1 so that a part of the first processing is executed based on an instruction from the host computer HC when editing the integrated recipe. Therefore, the edited first recipe RP1 is integrated into the integrated recipe. In the present embodiment, the first processing executed by the first processing device 20 includes a chemical solution processing, a rinsing processing, and a drying processing. When editing the integrated recipe, the control unit 13 edits the first recipe RP1 so that the chemical solution processing and the rinsing processing among the chemical solution processing, the rinsing processing, and the drying processing are executed in accordance with the operation of the input unit HC1 by the operator.

[0186] Similarly, when causing the second processing device 50 to execute a part of the second processing, at the time of editing the integrated recipe, the control unit 13 edits the second recipe RP2 based on an instruction from the host computer HC so that a part of the second processing is executed. Therefore, the edited second recipe RP2 is integrated into the integrated recipe. In the present embodiment, the second processing executed by the second processing device 50 includes a chemical solution processing, a rinsing processing, and a drying processing. The control unit 13 edits the second recipe RP2 so that only the drying processing among the chemical solution processing, the rinsing processing, and the drying processing is executed in response to an operation of the input unit HC1 by the operator at the time of editing the integrated recipe.

[0187] The integrated recipe information HR includes identification information of the integrated recipe and identification information of each of the first recipe RP1 and the second recipe RP2 integrated into the integrated recipe. For example, the integrated recipe information HR includes information indicating a name set for the integrated recipe and information indicating names set for each of the first recipe RP1 and the second recipe RP2 integrated into the integrated recipe.

[0188] When the control unit 13 stores the integrated recipe information HR in the storage unit 12, the control unit 13 transmits the first recipe RP1 integrated into the integrated recipe to the first processing device 20 (step S18). When the first control unit 24 of the first processing device 20 receives the first recipe RP1 from the integrated control device 10 via the first communication unit 22, the first control unit 24 changes (overwrites) the first recipe RP1 stored in the first storage unit 23 with the first recipe RP1 transmitted from the integrated control device 10. Therefore, the first recipe RP1 stored in the first storage unit 23 is changed to the edited first recipe RP1.

[0189] Similarly, the control unit 13 transmits the second recipe RP2 integrated into the integrated recipe to the second processing device 50 (step S19). As a result, the second recipe RP2 stored in the second storage unit 53 of the second processing device 50 is changed (overwritten) with the second recipe RP2 transmitted from the integrated control device 10.

[0190] When the control unit 13 transmits the first recipe RP1 and the second recipe RP2, it ends the integrated recipe editing process shown in FIG. 6.

[0191] Subsequently, referring to FIGS. 1, 3, 7, and 8, the process executed by the control unit 13 of the integrated control device 10 when controlling the second container transport mechanism 92 and the process executed by the first control unit 24 of the batch processing device 20 when controlling the first container transport mechanism 32 will be described.

[0192] FIG. 7 is a flowchart showing the flow of the process executed by the control unit 13 of the integrated control device 10 included in the substrate processing system 1000 of the present embodiment. The process shown in FIG. 7 is started, for example, in response to the integrated control device 10 (communication unit 11) receiving a creation command for an integrated job from the host computer HC. FIG. 8 is a flowchart showing the flow of the process executed by the first control unit 24 of the batch processing device 20 included in the substrate processing system 1000 of the present embodiment. The process shown in FIG. 8 is started in response to the batch processing device 20 receiving the first virtual job.

[0193] As shown in FIG. 7, when the control unit 13 of the integrated control device 10 receives a creation command for an integrated job from the host computer HC via the communication unit 11, it controls the second container transport mechanism 92 to transport the first substrate storage container CA1 placed on the first load port LP1 to the second load port LP2 and place the first substrate storage container CA1 on the second load port LP2 (step S21). Note that the first substrate storage container CA1 is placed on the first load port LP1 by the OHT. Further, when the first substrate storage container CA1 is transported from the first load port LP1 to the second load port LP2, the second substrate storage container CA2 is placed on the first load port LP1 by the OHT.

[0194] When the control unit 13 receives a creation instruction for an integrated job from the host computer HC via the communication unit 11, it generates a first virtual job by referring to the integrated recipe information HR (step S22). Then, the control unit 13 transmits the first virtual job to the batch processing device 20. The first virtual job includes the identification information of the first recipe RP1 integrated in the integrated recipe. The first control unit 24 of the batch processing device 20 controls the operations of each part of the batch processing device 20 by referring to the first recipe RP1 specified by the first virtual job.

[0195] Specifically, the creation instruction for the integrated job includes the identification information of the integrated recipe. The identification information of the integrated recipe indicates, for example, the name set for the integrated recipe. The control unit 13 generates the first virtual job by referring to the identification information of the integrated recipe included in the integrated recipe information HR and the identification information of the first recipe RP1. The identification information of the first recipe RP1 indicates, for example, the name set for the first recipe RP1.

[0196] As shown in FIG. 8, when the first control unit 24 of the batch processing device 20 receives the first virtual job via the first communication unit 22, it controls the first container transfer mechanism 32 to transfer the first substrate storage container CA1 placed on the second load port LP2 to the first container shelf 33a and place the first substrate storage container CA1 on the first container shelf 33a (step S31). Then, the first control unit 24 controls the first lot transfer mechanism HTR to transfer the first lot accommodated in the first substrate storage container CA1 placed on the first container shelf 33a to the first attitude conversion mechanism CTC.

[0197] When the first lot is unloaded from the first substrate storage container CA1, the first control unit 24 controls the first container transfer mechanism 32 to transfer the empty first substrate storage container CA1 placed on the first container shelf 33a to one of the plurality of second container shelves 33b and place the empty first substrate storage container CA1 on one of the second container shelves 33b (step S32).

[0198] As shown in FIG. 7, when the first substrate storage container CA1 is conveyed from the second load port LP2 to the first container shelf 33a, the control unit 13 of the integrated control device 10 controls the second container conveyance mechanism 92 to convey the second substrate storage container CA2 placed on the first load port LP1 to the second load port LP2 and place the second substrate storage container CA2 on the second load port LP2 (step S23).

[0199] As shown in FIG. 8, when the second substrate storage container CA2 is placed on the second load port LP2, the first control unit 24 of the batch processing device 20 controls the first container conveyance mechanism 32 to convey the second substrate storage container CA2 placed on the second load port LP2 to the first container shelf 33a and place the second substrate storage container CA2 on the first container shelf 33a (step S33). Then, the first control unit 24 controls the first lot conveyance mechanism HTR to convey the second lot accommodated in the second substrate storage container CA2 placed on the first container shelf 33a to the first posture conversion mechanism CTC.

[0200] When the second lot is unloaded from the second substrate storage container CA2, the first control unit 24 controls the first container conveyance mechanism 32 to convey the empty second substrate storage container CA2 placed on the first container shelf 33a to one of the plurality of second container shelves 33b and place the empty second substrate storage container CA2 on one of the second container shelves 33b (step S34).

[0201] After placing the empty second substrate storage container CA2 on one of the second container shelves 33b, the first control unit 24 controls the first container conveyance mechanism 32 to convey the empty first substrate storage container CA1 from the second container shelf 33b to the second load port LP2 and place the empty first substrate storage container CA1 on the second load port LP2 (step S35).

[0202] As shown in FIG. 7, when an empty first substrate storage container CA1 is placed on the second load port LP2, the control unit 13 of the integrated control device 10 controls the second container transfer mechanism 92 to transfer the empty first substrate storage container CA1 from the second load port LP2 to one of the plurality of third load ports LP3 and place the empty first substrate storage container CA1 on one of the third load ports LP3 (step S24).

[0203] As shown in FIG. 8, when an empty first substrate storage container CA1 is transferred from the second load port LP2, the first control unit 24 of the batch processing device 20 controls the first container transfer mechanism 32 to transfer an empty second substrate storage container CA2 from the second container shelf 33b to the second load port LP2 and place the empty second substrate storage container CA2 on the second load port LP2 (step S36). As a result, the process shown in FIG. 8 ends.

[0204] As shown in FIG. 7, when an empty second substrate storage container CA2 is placed on the second load port LP2, the control unit 13 of the integrated control device 10 controls the second container transfer mechanism 92 to transfer the empty second substrate storage container CA2 from the second load port LP2 to another one of the plurality of third load ports LP3 and place the empty second substrate storage container CA2 on another one of the third load ports LP3 (step S25).

[0205] The first lot after being dried by the second processing device 50 is returned to the first substrate storage container CA1 placed on the third load port LP3. As shown in FIG. 7, when the first lot is returned to the first substrate storage container CA1 placed on the third load port LP3, the control unit 13 of the integrated control device 10 controls the second container transfer mechanism 92 to transfer the first substrate storage container CA1 to the delivery position where the substrate storage container CA is delivered between the second container transfer mechanism 92 and the OHT. As a result, the first substrate storage container CA1 is delivered from the second container transfer mechanism 92 to the OHT (step S26).

[0206] Similarly, the second lot after being dried by the second processing device 50 is returned to the second substrate storage container CA2 placed on the third load port LP3. When the second lot is returned to the second substrate storage container CA2 placed on the third load port LP3, the control unit 13 controls the second container transfer mechanism 92 to transfer the second substrate storage container CA2 to the transfer position where the substrate storage container CA is transferred between the second container transfer mechanism 92 and the OHT. As a result, the second substrate storage container CA2 is transferred from the second container transfer mechanism 92 to the OHT (step S27). When the second substrate storage container CA2 is transferred from the second container transfer mechanism 92 to the OHT, the process shown in FIG. 7 ends.

[0207] Note that each of the processes of step S24 and step S25 shown in FIG. 7 and step S35 and step S36 shown in FIG. 8 may be executed before the substrate W is carried into the substrate storage container CA by the indexer robot IR of the single-wafer processing device 50. For example, the first substrate storage container CA1 may be transferred to the third load port LP3 in accordance with the timing when the first substrate W of the first lot is transferred from the batch processing device 20 to the single-wafer processing device 50. Similarly, the second substrate storage container CA2 may be transferred to the third load port LP3 in accordance with the timing when the first substrate W of the second lot is transferred from the batch processing device 20 to the single-wafer processing device 50.

[0208] Subsequently, referring to FIGS. 1, 3, and 9, the process executed by the first control unit 24 of the batch processing device 20 based on the first virtual job will be described. FIG. 9 is a flowchart showing the flow of the process executed by the first control unit 24 of the batch processing device 20 based on the first virtual job. Specifically, FIG. 9 shows the flow of the process in which the first control unit 24 of the batch processing device 20 controls the first lot transfer mechanism HTR, the first posture conversion mechanism CTC, the second lot transfer mechanism WTR, and the first batch processing units BPU1 to the sixth batch processing units BPU6 based on the first virtual job. The process shown in FIG. 9 starts in response to the first container transfer mechanism 32 placing the first substrate storage container CA1 on the first container shelf 33a.

[0209] As shown in FIG. 9, when the first substrate storage container CA1 is placed on the first container shelf 33a (step S31 in FIG. 8), the first control unit 24 controls the first lot transfer mechanism HTR to transfer the first lot stored in the first substrate storage container CA1 placed on the first container shelf 33a to the first attitude conversion mechanism CTC (step S41).

[0210] After the first control unit 24 transfers the first lot to the first attitude conversion mechanism CTC, when the second substrate storage container CA2 is placed on the first container shelf 33a (step S33 in FIG. 8), the first control unit 24 controls the first lot transfer mechanism HTR to transfer the second lot stored in the second substrate storage container CA2 placed on the first container shelf 33a to the first attitude conversion mechanism CTC (step S42).

[0211] The first control unit 24 controls the first attitude conversion mechanism CTC to create a set of lots (step S43).

[0212] When a set of lots is created, the first control unit 24 controls the first attitude conversion mechanism CTC to convert the attitude of each substrate W constituting the set of lots from the horizontal attitude to the vertical attitude (step S44). As a result, the attitude of the set of lots is converted from the horizontal attitude to the vertical attitude.

[0213] After converting the attitude of the set of lots, the first control unit 24 controls the second lot transfer mechanism WTR to transfer the set of lots to any one of the first batch processing units BPU1 to the fourth batch processing units BPU4. As a result, in any one of the first batch processing units BPU1 to the fourth batch processing units BPU4, chemical solution treatment for the set of lots is executed (step S45).

[0214] Specifically, the first control unit 24 controls the second lot transfer mechanism WTR to place a set of lots on the support member 35 of any one of the first to fourth lifters LF1 to LF4. Then, the lifter that supports the set of lots is controlled to lower from the upper position to the lower position. As a result, the set of lots is immersed in the chemical solution in the corresponding chemical solution tank, and chemical solution treatment for the set of lots is executed.

[0215] When a predetermined time has elapsed since the start of the chemical solution treatment, the first control unit 24 controls the second lot transfer mechanism WTR to transfer a set of lots from one of the first to fourth batch processing units BPU1 to BPU4 to one of the fifth batch processing unit BPU5 and the sixth batch processing unit BPU6. As a result, a rinsing process for the set of lots is executed in one of the fifth batch processing unit BPU5 and the sixth batch processing unit BPU6 (step S46).

[0216] Specifically, when a predetermined time has elapsed since the start of the chemical solution treatment, the first control unit 24 controls the lifter that supports the set of lots to raise from the lower position to the upper position. Then, the second lot transfer mechanism WTR is controlled to grip the set of lots supported by the lifter.

[0217] After causing the second lot transfer mechanism WTR to grip the set of lots, the first control unit 24 controls the second lot transfer mechanism WTR to transfer the set of lots. Then, the first control unit 24 controls the second lot transfer mechanism WTR to place the set of lots on the support member 35 of one of the fifth lifter LF5 and the sixth lifter LF6. Then, the lifter that supports the set of lots is controlled to lower from the upper position to the lower position. As a result, the set of lots is immersed in the rinsing solution in the corresponding rinsing tank, and rinsing treatment for the set of lots is executed.

[0218] When a predetermined time has elapsed since the start of the rinse process, the first control unit 24 controls the second lot transfer mechanism WTR to transfer a set of lots from one of the fifth batch processing units BPU5 and the sixth batch processing units BPU6 to the substrate standby unit 40 (step S47). As a result, the process shown in FIG. 9 ends.

[0219] Specifically, when a predetermined time has elapsed since the start of the rinse process, the first control unit 24 controls a lifter that supports a set of lots to raise it from the lower position to the upper position. Then, the second lot transfer mechanism WTR is controlled to grip a set of lots supported by the lifter.

[0220] After the first control unit 24 causes the second lot transfer mechanism WTR to grip a set of lots, the first control unit 24 controls the second lot transfer mechanism WTR to transfer the set of lots. Then, the first control unit 24 controls the second lot transfer mechanism WTR to place the set of lots on the support member 35 of the seventh lifter LF7.

[0221] When a set of lots is supported by the seventh lifter LF7, the first control unit 24 notifies the integrated control device 10 via the first communication unit 22 that the completion event of the first virtual job has occurred, as described with reference to FIG. 3.

[0222] Subsequently, with reference to FIGS. 1, 3, 10, and 11, the process executed by the control unit 13 of the integrated control device 10 will be described. FIGS. 10 and 11 are flowcharts showing the flow of the process executed by the control unit 13 of the integrated control device 10 included in the substrate processing system 1000 of the present embodiment. Specifically, FIGS. 10 and 11 show the flow of the process in which the control unit 13 of the integrated control device 10 controls the chuck mechanism TFC and the posture conversion unit 43. The process shown in FIGS. 10 and 11 starts in response to the notification of the completion event of the first virtual job from the batch processing device 20 to the integrated control device 10. That is, the process shown in FIGS. 10 and 11 starts in response to a set of lots being supported by the seventh lifter LF7.

[0223] When the processes shown in FIGS. 10 and 11 start, the control unit 13 controls the chuck mechanism TFC to convey the first lot among a set of lots to the posture conversion unit 43 (step S51). Specifically, the control unit 13 first controls the seventh lifter LF7 to lower it from the upper position to the lower position. As a result, a set of lots is immersed in the liquid in the standby tank 42. Then, the control unit 13 controls the chuck mechanism TFC to cause the pair of chucks 41 to grip the first lot. And the first control unit 24 controls the chuck mechanism TFC to move the first lot above the liquid level of the standby tank 42 and then convey it to the posture conversion unit 43.

[0224] When the control unit 13 conveys the first lot to the posture conversion unit 43, it controls the second posture conversion mechanism of the posture conversion unit 43 to convert the posture of each substrate W constituting the first lot from the vertical posture to the horizontal posture (step S52). That is, the control unit 13 controls the second posture conversion mechanism to convert the posture of the first lot from the vertical posture to the horizontal posture.

[0225] Furthermore, after the control unit 13 converts the posture of the first lot from the vertical posture to the horizontal posture, it controls the second posture conversion mechanism so that the uppermost substrate W among the substrates W of the first lot is positioned above the liquid level of the immersion tank, and adjusts the vertical position of each substrate W of the first lot. As a result, the first lot is in a standby state in the substrate standby unit 40. In response to the first lot waiting in the substrate standby unit 40, the control unit 13 of the integrated control device 10 generates a second virtual job. Thus, according to the first embodiment, when the second virtual job (control job) is generated, each substrate W of the first lot is in a standby state in the substrate standby unit 40. Therefore, the single-wafer processing apparatus 50 can execute the second virtual job (control job) to process each substrate W of the first lot one by one.

[0226] Specifically, in response to the first lot waiting in the substrate standby unit 40, the control unit 13 generates information indicating that a virtual substrate storage container is placed on the virtual load port (step S53). Hereinafter, the information indicating that a virtual substrate storage container is placed on the virtual load port may be referred to as "virtual placement information". After generating the virtual placement information, the control unit 13 transmits the virtual placement information and the identification information of the virtual load port to the sheet processing apparatus 50 via the communication unit 11. The virtual load port is an example of a "virtual container placement unit".

[0227] When the control unit 13 transmits the virtual placement information to the second processing apparatus 50, it generates a second virtual job by referring to the integrated recipe information HR (step S54). Then, the control unit 13 transmits the second virtual job to the sheet processing apparatus 50. The second virtual job includes the identification information of the second recipe RP2 integrated into the integrated recipe. Specifically, the control unit 13 generates a second virtual job by referring to the identification information of the second recipe RP2 included in the integrated recipe information HR. The identification information of the second recipe RP2 indicates, for example, the name set in the second recipe RP2.

[0228] The second control unit 54 of the sheet processing apparatus 50 controls the operations of each part of the sheet processing apparatus 50 by referring to the second recipe RP2 specified by the second virtual job. Specifically, the second storage unit 53 of the sheet processing apparatus 50 stores the identification information of the virtual load port together with the identification information of the third load port LP3. When the second control unit 54 receives the virtual placement information and the identification information of the virtual load port transmitted from the integrated control apparatus 10 via the second communication unit 52, it becomes in a state where the second virtual job can be executed, similar to the case where a substrate storage container CA is placed on any one of the third load ports LP3. Therefore, even if the substrate W is directly transported from the batch processing apparatus 20 to the sheet processing apparatus 50, the sheet processing apparatus 50 can process the substrate W transported from the batch processing apparatus 20 based on the second recipe RP2.

[0229] When the control unit 13 transmits the second virtual job to the sheet-fed processing apparatus 50, it controls the substrate transfer mechanism 82 to transfer the substrates W of the first lot one by one from the substrate standby unit 40 to the delivery unit 62 (step S55). Specifically, the substrate transfer mechanism 82 grips the uppermost substrate W of the first lot located above the liquid level of the immersion tank and transfers it to the delivery unit 62. When the substrate W is transferred to the delivery unit 62 by the substrate transfer mechanism 82, the control unit 13 controls the delivery unit 62 to hold the substrate W. Each time the substrate transfer mechanism 82 transfers the substrate W, the control unit 13 controls the second posture conversion mechanism to adjust the vertical positions of the substrates W of the first lot so that the uppermost substrate W of the first lot is located above the liquid level of the immersion tank.

[0230] Each time the substrate transfer mechanism 82 transfers the substrate W, the control unit 13 determines whether the transfer of the substrates W of the first lot is completed (step S56). Until the transfer of the substrates W of the first lot is completed (No in step S56), the control unit 13 causes the substrate transfer mechanism 82 to transfer the substrate W.

[0231] When the control unit 13 determines that the transfer of the substrates W of the first lot is completed (Yes in step S56), as shown in FIG. 11, it controls the chuck mechanism TFC to transfer the second lot of one set of lots to the posture conversion unit 43 (step S57). Since the processes in steps S57 to S62 are substantially the same as the processes in steps S51 to S56, their descriptions are omitted. The processes shown in FIGS. 10 and 11 end when the control unit 13 determines that the transfer of the substrates W of the second lot is completed (Yes in step S62).

[0232] Subsequently, with reference to FIGS. 1, 3, 4, and 12, the processing executed by the second control unit 54 of the sheet-fed processing apparatus 50 based on the second virtual job will be described. FIG. 12 is a flowchart showing the flow of processing executed by the second control unit 54 of the sheet-fed processing apparatus 50 based on the second virtual job. Specifically, FIG. 12 shows the flow of processing when the sheet-fed processing apparatus 50 executes a drying process on a single substrate W included in the first lot.

[0233] The process shown in FIG. 12 starts in response to the transfer unit 62 holding the substrate W. Specifically, the control unit 13 of the integrated control device 10 notifies the sheet processing device 50 that the process in the chamber 63a has been completed in response to the transfer unit 62 holding the substrate W. When the second control unit 54 of the sheet processing device 50 receives a notification indicating that the process in the chamber 63a has been completed via the second communication unit 52, it starts the process shown in FIG. 12.

[0234] When starting the process shown in FIG. 12, the second control unit 54 controls the center robot CR to transfer the substrate W (the substrate W after the lens process) from the transfer unit 62 to any one of the plurality of sheet processing units 63 (step S71). Then, the second control unit 54 causes the sheet processing unit 63 to perform a drying process (step S72).

[0235] Specifically, the second control unit 54 controls the spin chuck 64 to hold the substrate W carried into the chamber 63b by the center robot CR. Then, the second control unit 54 controls the spin chuck 64 to rotate the substrate W. When the rotation speed of the substrate W reaches a predetermined rotation speed, the second control unit 54 opens the on-off valve 72. As a result, IPA is discharged from the nozzle 65 toward the rotating substrate W, and a liquid film of IPA is formed on the upper surface of the substrate W.

[0236] When a predetermined time has elapsed since the discharge of IPA started, the second control unit 54 closes the on-off valve 72. As a result, the discharge of IPA by the nozzle 65 stops. When the second control unit 54 stops the discharge of IPA, it controls the spin chuck 64 to increase the rotation speed of the substrate W. As a result, IPA scatters from the substrate W, and the substrate W dries. When a predetermined time has elapsed since the second control unit 54 increased the rotation speed of the substrate W, it controls the spin chuck 64 to stop the rotation of the substrate W. As a result, the drying process ends.

[0237] When the drying process is completed, the second control unit 54 controls the center robot CR and the indexer robot IR to transfer the substrate W from the single-sheet processing unit 63 to the indexer robot IR (step S73).

[0238] When the substrate W is transferred from the center robot CR to the indexer robot IR, the second control unit 54 controls the indexer robot IR to carry the substrate W into the first substrate storage container CA1 placed on one of the plurality of third load ports LP3 (step S74). As a result, the substrate W after the drying process is stored in the first substrate storage container CA1, and the process shown in FIG. 12 is completed.

[0239] Subsequently, with reference to FIGS. 1, 13, and 14, a process for notifying that an event has occurred will be described. FIG. 13 is a flowchart showing the flow of notification processing executed by the first control unit 24 of the first processing device 20 when an event occurs in the first processing device 20 operating based on the first virtual job. FIG. 14 is a flowchart showing the flow of notification processing executed by the control unit 13 of the integrated control device 10 when an event occurs in the first processing device 20 operating based on the first virtual job.

[0240] As shown in FIG. 13, when an event occurs while the first control unit 24 of the first processing device 20 controls each part of the first processing device 20 based on the first virtual job, the first control unit 24 of the first processing device 20 notifies the integrated control device 10 of the event that has occurred in the first processing device 20 together with the identification information of the first virtual job via the first communication unit 22 (step S81). As a result, the process shown in FIG. 13 is completed.

[0241] As shown in FIG. 14, when notified of the occurrence of an event from the first processing device 20, the control unit 13 of the integrated control device 10 determines whether to notify the host computer HC of the event that has occurred in the first processing device 20 (step S91).

[0242] When it is determined by the control unit 13 not to notify the host computer HC of the occurrence of an event (No in step S91), the process shown in FIG. 14 ends. For example, the events occurring in the first processing device 20 include completion events indicating the completion of processing based on the first virtual job. When the event notified from the first processing device 20 is a completion event of the first virtual job, the control unit 13 determines not to notify the host computer HC of the completion event.

[0243] On the other hand, when the control unit 13 determines to notify the host computer HC of the occurrence of an event (Yes in step S91), it converts the identification information of the first virtual job into the identification information of the integrated job (step S92), and notifies the host computer HC of the event that occurred in the first processing device 20 together with the identification information of the integrated job (step S93). As a result, the process shown in FIG. 14 ends.

[0244] Note that the notification process executed when an event occurs in the second processing device 50 operating based on the second virtual job is substantially the same as the process described with reference to FIGS. 13 and 14 except for the process of notifying the completion event, so the description thereof is omitted.

[0245] Subsequently, with reference to FIGS. 1, 15, and 16, the process of notifying the host computer HC that a completion event has occurred will be described. FIG. 15 is a flowchart showing the flow of the notification process executed by the second control unit 54 of the second processing device 50 when a completion event occurs in the second processing device 50 operating based on the second virtual job. FIG. 16 is a flowchart showing the flow of the notification process executed by the control unit 13 of the integrated control device 10 when a completion event occurs in the second processing device 50 operating based on the second virtual job.

[0246] As shown in FIG. 15, when a completion event occurs while the second control unit 54 of the second processing device 50 controls each part of the second processing device 50 based on the second virtual job, the second communication unit 52 is used to notify the integrated control device 10 of the completion event that has occurred in the second processing device 50 together with the identification information of the second virtual job (step S81a). As a result, the process shown in FIG. 15 ends.

[0247] Specifically, as described with reference to FIG. 2 and the like, the integrated control device 10 generates the second virtual job a plurality of times. Therefore, the events that occur in the second processing device 50 include a plurality of completion events indicating the completion of processing based on each of the plurality of second virtual jobs. And among the plurality of completion events, there is a final completion event which is the completion event last notified from the second processing device 50. In the present embodiment, the integrated control device 10 generates the second virtual job twice. Therefore, the completion event notified to the integrated control device 10 for the second time from the second processing device 50 corresponds to the final completion event.

[0248] As shown in FIG. 16, when the control unit 13 of the integrated control device 10 is notified of the occurrence of a completion event from the second processing device 50 to the communication unit 11, it determines whether the completion event is the final completion event (step S91a).

[0249] When the control unit 13 determines that the completion event notified from the second processing device 50 is not the final completion event (No in step S91a), it decides not to notify the host computer HC of the completion event (step S94a), and ends the process shown in FIG. 16.

[0250] On the other hand, when the control unit 13 determines that the completion event notified from the second processing device 50 is the final completion event (Yes in step S91a), it converts the identification information of the second virtual job into the identification information of the integrated job (step S92a), and notifies the host computer HC of the completion event together with the identification information of the integrated job (step S93a). As a result, the process shown in FIG. 16 ends.

[0251] As described above with reference to FIGS. 1 to 16, according to Embodiment 1, the host computer HC may instruct the integrated control device 10 to create one job. Therefore, the host computer HC does not need to instruct each of the first processing device 20 and the second processing device 50 to create a job. Thus, since there is no need to introduce a new system (software) to an existing host computer, an increase in the burden on the operator who manages the host computer HC can be suppressed. Further, the integrated control device 10 generates the first virtual job and the second virtual job based on an instruction from the host computer HC, whereby the first processing device 20 and the second processing device 50 cooperate to execute a series of substrate processes. Therefore, since the first processing device 20 and the second processing device 50 are not caused to execute substrate processes by one job, it complies with the SEMI standard.

[0252] Furthermore, according to Embodiment 1, the batch processing device 20 can be used to perform chemical solution processing and rinsing processing on a plurality of substrates W at once. Therefore, productivity can be improved. Also, the consumption amount of the chemical solution can be reduced.

[0253] Also, according to Embodiment 1, the substrate W can be dried using the drying process of the single-wafer processing device 50. Since the drying process of the single-wafer processing device 50 is less likely to cause the pattern to collapse compared to the drying process of the batch processing device 20, the pattern is less likely to collapse during the drying process compared to the case of using the drying process of the batch processing device 20.

[0254] Also, according to Embodiment 1, an existing recipe file can be edited and used. Therefore, the burden on the operator can be reduced compared to the case of newly creating a recipe file.

[0255] Subsequently, with reference to FIGS. 1, 3, 17, and 18, a modified example of the substrate processing system 1000 of the present embodiment will be described. FIG. 17 is a diagram showing an example of the second recipe editing screen G2. In the example shown in FIG. 17, the first recipe list column 102 shown in FIG. 5 is omitted for easy understanding.

[0256] As shown in FIG. 17, the second recipe editing screen G2 displays two recipe setting columns 104 and 105 instead of the second recipe list column 103 shown in FIG. 5. The recipe setting column 104 is an input column for setting a recipe (second recipe RP2) for each of the substrates W constituting the first lot. The recipe setting column 105 is an input column for setting a recipe (second recipe RP2) for each of the substrates W constituting the second lot. The operator can operate the input unit HC1 while the second recipe editing screen G2 is being displayed to set different second recipes RP2 for each substrate W. The control unit 13 of the integrated control device 10 integrates the second recipe RP2 into the integrated recipe on a per-substrate basis in response to the operator setting the second recipe RP2 for each substrate W via the second recipe editing screen G2 during the editing of the integrated recipe.

[0257] In the example shown in FIG. 17, Recipe A is set for the first substrate W (slot number 1) of the first lot, Recipe D is set for the second to 24th substrates W (slot numbers 2 to 24) of the first lot, and Recipe B is set for the 25th substrate W (slot number 25) of the first lot. Also, in the example shown in FIG. 17, Recipe D is set for the first to 9th substrates W (slot numbers 1 to 9) of the second lot, Recipe C is set for the 10th substrate W (slot number 10) of the second lot, and Recipe D is set for the 11th to 25th substrates W (slot numbers 11 to 25) of the second lot.

[0258] Note that Recipes A to D represent different second recipes RP2. Recipes A to D may be existing recipe files stored in the second storage unit 53 of the sheet-fed processing apparatus 50, or may be recipe files newly created by the operator.

[0259] The newly created recipe file is stored in the second storage unit 53 of the sheet processing apparatus 50 when editing the integrated recipe. When using an existing recipe file, as described with reference to FIG. 5, the operator edits the existing recipes A to D via the second individual recipe editing screen. As described with reference to FIG. 6, the existing recipes A to D stored in the second storage unit 53 are changed to the recipes A to D edited via the second individual recipe editing screen.

[0260] Subsequently, with reference to FIGS. 1, 17, and 18, the processing executed by the control unit 13 of the integrated control device 10 will be described. FIG. 18 is a flowchart showing the flow of processing executed by the control unit 13 of the integrated control device 10 included in a modification example of the substrate processing system 1000 of the present embodiment. The processing shown in FIG. 18 starts when the integrated control device 10 receives a creation command for an integrated job from the host computer HC.

[0261] When the control unit 13 starts the processing in FIG. 18, it generates a first virtual job by referring to the integrated recipe information HR and causes the communication unit 11 to transmit the first virtual job to the first processing device 20, similar to step S1 shown in FIG. 2 (step S101). As a result, the first processing device 20 executes chemical solution processing and rinse processing on a set of lots in a batch.

[0262] After the chemical solution processing and rinse processing for a set of lots are completed, the control unit 13 generates a second virtual job by referring to the integrated recipe information HR and causes the communication unit 11 to transmit the second virtual job to the second processing device 50 (steps S102 to S107). Specifically, when two or more second recipes RP2 are integrated into the integrated recipe, the control unit 13 generates two or more second virtual jobs.

[0263] For example, when the second recipe RP2 is set as shown in FIG. 17, when the control unit 13 conveys the first substrate W of the first lot by the substrate conveyance mechanism 82, it generates a second virtual job indicating the identification information of recipe A and transmits it to the second processing device 50 (step S102).

[0264] When the control unit 13 conveys the second substrate W of the first lot by the substrate transfer mechanism 82, it generates a second virtual job indicating the identification information of the recipe D and transmits it to the second processing device 50 (step S103).

[0265] When the control unit 13 conveys the 25th substrate W of the first lot by the substrate transfer mechanism 82, it generates a second virtual job indicating the identification information of the recipe B and transmits it to the second processing device 50 (step S104).

[0266] In addition, each time the control unit 13 conveys each substrate W from the second to the 24th of the first lot by the substrate transfer mechanism 82, it may transmit a second virtual job indicating the identification information of the recipe D to the second processing device 50.

[0267] When the control unit 13 conveys the first substrate W of the second lot by the substrate transfer mechanism 82, it generates a second virtual job indicating the identification information of the recipe D and transmits it to the second processing device 50 (step S105). As described with reference to FIG. 2, the control unit 13 transmits a second virtual job when the lot is switched. Therefore, even when the recipe set for the 25th substrate W of the first lot and the recipe set for the first substrate W of the second lot are the same recipe, the control unit 13 transmits a second virtual job when conveying the first substrate W of the second lot by the substrate transfer mechanism 82.

[0268] When the control unit 13 conveys the 10th substrate W of the second lot by the substrate transfer mechanism 82, it generates a second virtual job indicating the identification information of the recipe C and transmits it to the second processing device 50 (step S106).

[0269] In addition, each time the control unit 13 conveys each substrate W from the first to the 9th of the second lot by the substrate transfer mechanism 82, it may transmit a second virtual job indicating the identification information of the recipe D to the second processing device 50.

[0270] When the control unit 13 conveys the 11th substrate W of the second lot by the substrate conveyance mechanism 82, it generates a second virtual job indicating the identification information of the recipe D and transmits it to the second processing device 50 (step S107). As a result, the process shown in FIG. 18 ends.

[0271] Note that each time the control unit 13 conveys each substrate W from the 11th to the 25th of the second lot by the substrate conveyance mechanism 82, it may transmit a second virtual job indicating the identification information of the recipe D to the second processing device 50.

[0272] As described above with reference to FIGS. 1, 3, 17, and 18, according to the first embodiment, the recipe can be changed for each substrate. Therefore, the processes executed in the single-wafer processing device 50 can be changed for each substrate W. In the example described with reference to FIGS. 1, 3, 17, and 18, the recipe of the second processing device 50 is set for each substrate W. However, when the first processing device 20 is a single-wafer processing device, the recipe of the first processing device 20 may be set for each substrate W.

[0273] [Second Embodiment] Subsequently, a second embodiment of the present invention will be described with reference to FIG. 19. However, matters different from the first embodiment will be described, and descriptions of matters the same as those in the first embodiment will be omitted. The second embodiment is different from the first embodiment in that the first control device 21 of the first processing device 20 also serves as the integrated control device 10 described with reference to FIGS. 1 to 18.

[0274] FIG. 19 is a block diagram showing the configuration of the substrate processing system 1000 of the present embodiment. As shown in FIG. 19, the substrate processing system 1000 of the present embodiment includes a first processing device 20 and a second processing device 50.

[0275] The first processing device 20 executes a first process on the substrate W based on one job, as in the first embodiment. The second processing device 50 executes a second process on the substrate W based on one job, as in the first embodiment.

[0276] In this embodiment, the first communication unit 22 of the first processing device 20 communicates between the communication unit HC4 of the host computer HC and the second communication unit 52 of the second processing device 50. As already described, in this embodiment, the first control device 21 of the first processing device 20 also serves as the integrated control device 10. Therefore, the first control unit 24 of the first control device 21 generates a first virtual job and a second virtual job based on the integrated job creation instruction received from the host computer HC. The first control unit 24 executes the first virtual job. Further, the first control unit 24 transmits the second virtual job to the second processing device 50 via the first communication unit 22 to cause the second processing device 50 to execute the second virtual job.

[0277] As described above, Embodiment 2 of the present invention has been described with reference to FIG. 19. According to Embodiment 2, similar to Embodiment 1, the host computer HC only needs to instruct the integrated control device 10 to create one job. Therefore, similar to Embodiment 1, an increase in the burden on the operator who manages the host computer HC can be suppressed.

[0278] In Embodiment 2, the first control device 21 of the first processing device 20 also serves as the integrated control device 10, but the second control device 51 of the second processing device 50 may also serve as the integrated control device 10.

[0279] [Embodiment 3] FIG. 20 is a block diagram showing the configuration of the substrate processing system 1000a according to Embodiment 3. As shown in FIG. 20, in the substrate processing system 1000a, the first connection portion 80 and the second connection portion 90 are omitted from the substrate processing system 1000 shown in FIGS. 1 and 3, and the substrate standby portion 40 is omitted from the first processing device 20. Further, the substrate processing system 1000a further includes another second processing device 50 and a local transfer mechanism 93 in addition to each configuration of the substrate processing system 1000. Other configurations of the substrate processing system 1000a are substantially the same as those of the substrate processing system 1000 shown in FIGS. 1 and 3.

[0280] In the substrate processing system 1000a, another second processing device 50 is arranged adjacent to the (-Y) side of the second processing device 50. These two second processing devices 50 are the same type of processing devices having substantially the same structure, and each is configured to be able to perform a second process on the substrate W based on one job. In the present embodiment, the two second processing devices 50 are single-wafer processing devices, and the first processing device 20 is a batch processing device as described above. Note that, in the substrate processing system 1000a, three or more second processing devices 50 may be provided. That is, the substrate processing system 1000a includes a plurality of second processing devices 50.

[0281] The local transfer mechanism 93 is a mechanism for transferring the substrate storage container CA between the first processing device 20 and the plurality of second processing devices 50. The local transfer mechanism 93 is a transfer mechanism different from the above-described in-factory transfer system TS in the clean room where the first processing device 20 and the plurality of second processing devices 50 are installed. The local transfer mechanism 93 is an OHT or an AGV (Automated Guided Vehicle) or the like that operates independently of the in-factory transfer system TS. The AGV is a transfer mechanism that travels on the floor of the clean room.

[0282] The local transfer mechanism 93 is configured to be able to transfer the substrate storage container CA to and from the above-described in-factory transfer system TS. The local transfer mechanism 93 transfers the substrate storage container CA only between the first processing device 20 and the plurality of second processing devices 50, and does not transfer the substrate storage container CA between the substrate processing system 1000a and other substrate processing devices or container storage warehouses (that is, carrier stockers for temporarily storing the substrate storage container CA) in the clean room other than the substrate processing system 1000a.

[0283] In this embodiment, the local transfer mechanism 93 is an OHT. The local transfer mechanism 93 is disposed, for example, in the vicinity of the (+X)-side portions of the first processing apparatus 20 and the plurality of second processing apparatuses 50. The local transfer mechanism 93 is disposed above (i.e., on the (+Z)-side) the first container mounting portion CP1 of the first processing apparatus 20 and the second container mounting portion CP2 of each second processing apparatus 50. The local transfer mechanism 93 includes a movable unit 931 that holds and transfers the substrate storage container CA. The movable unit 931 is movable independently of the first processing apparatus 20 and the second processing apparatus 50.

[0284] In the substrate processing system 1000a, the integrated control device 10 controls the first processing apparatus 20 and the plurality of second processing apparatuses 50 based on commands received from the host computer HC. Specifically, the integrated control device 10 generates a first virtual job and a second virtual job based on a creation command for an integrated job received from the host computer HC.

[0285] The integrated control device 10 transmits the first virtual job to the first processing apparatus 20 from the communication unit 11 and causes the first processing apparatus 20 to execute the first virtual job. In this embodiment, the first virtual job causes the first processing apparatus 20 (i.e., the batch processing apparatus 20) to perform chemical solution processing and rinse processing. While the chemical solution processing and rinse processing of the substrate W are being performed in the first processing apparatus 20, the two empty substrate storage containers CA in which the substrate W was stored are placed on the first container shelf 33a and / or the second container shelf 33b.

[0286] A plurality of substrates W (i.e., the above-described first lot and second lot) for which the processing in the first processing device 20 has been completed are accommodated in two substrate accommodation containers CA on the first container shelf 33a and / or the second container shelf 33b, and are placed on the first container placement unit CP1. The substrate accommodation container CA that accommodates the substrate W processed by the first processing device 20 may be the substrate accommodation container CA in which the substrate W was accommodated before being processed by the first processing device 20, or may be another substrate accommodation container CA different from the substrate accommodation container CA. When the substrate accommodation container CA containing the substrate W is placed on the first container placement unit CP1, one of the plurality of second processing devices 50 is selected by the integrated control device 10.

[0287] The selection of the one second processing device 50 is performed as follows, for example. First, a transmission request for processing waiting information is sent from the integrated control device 10 to each of the plurality of second processing devices 50, and the processing waiting information is sent from each second processing device 50 to the integrated control device 10. The processing waiting information is information indicating the number of substrates W (i.e., processing waiting substrates W) waiting for processing in the second processing device 50. The processing waiting substrate W means a substrate W that has been carried into the second processing device 50 and for which the processing by the second processing device 50 has not yet been performed. The processing waiting information of each second processing device 50 transmitted from each second processing device 50 is stored in the storage unit 12 of the integrated control device 10.

[0288] Subsequently, the integrated control device 10 compares the processing waiting information of the plurality of second processing devices 50, and based on the comparison result, determines one second processing device 50 into which the substrate accommodation container CA carried out from the first processing device 20 by the local transfer mechanism 93 is to be carried. Specifically, for example, one second processing device 50 having the smallest number of processing waiting substrates W among the plurality of second processing devices 50 is selected by the integrated control device 10.

[0289] Then, when the local transfer mechanism 93 is controlled by the control unit 13 of the integrated control device 10, the substrate storage container CA placed on the first container placement unit CP1 is held by the local transfer mechanism 93 and transported to the second container placement unit CP2 of one selected second processing device 50 and placed on the second container placement unit CP2. As a result, the substrate W after being processed by the first processing device 20 is carried into the one second processing device 50. The local transfer mechanism 93 directly carries the substrate storage container CA unloaded from the first processing device 20 into the one second processing device 50 without passing through the above-described container storage warehouse or the like.

[0290] When the substrate storage container CA is placed on the second container placement unit CP2 of the one second processing device 50, the integrated control device 10 transmits a second virtual job from the communication unit 11 to the one second processing device 50 to cause the one second processing device 50 to execute the second virtual job. In the present embodiment, the second virtual job causes the one second processing device 50 (i.e., the single-wafer processing device 50) to perform a drying process.

[0291] Thus, in the substrate processing system 1000a, the substrate storage container CA can be easily transported by the local transfer mechanism 93 to one second processing device 50 appropriately selected from a plurality of second processing devices 50. Further, when the substrate storage container CA is transported from the first processing device 20 to the one second processing device 50, it does not pass through a container storage warehouse or the like, so the time required for the transport from the container storage warehouse or the like to the one second processing device 50 does not increase due to delays caused by the transport of other substrate storage containers CA or the like. Therefore, the time from the end of the processing of the substrate W by the first processing device 20 to the start of the processing of the substrate W by the one second processing device 50 can be shortened.

[0292] In the substrate processing system 1000a, the method for selecting one of the second processing apparatuses 50 described above is not necessarily limited to the above example. For example, a request to transmit maintenance information and the above-described processing wait information is made from the integrated control apparatus 10 to each of the plurality of second processing apparatuses 50, and the maintenance information and the processing wait information are transmitted from each second processing apparatus 50 to the integrated control apparatus 10. The maintenance information is information indicating the scheduled start time and the scheduled end time of the maintenance to be performed next (i.e., the maintenance scheduled to be performed in the nearest future) in the second processing apparatus 50. The maintenance information and the processing wait information of each second processing apparatus 50 transmitted from each second processing apparatus 50 are stored in the storage unit 12 of the integrated control apparatus 10.

[0293] Then, the integrated control apparatus 10 compares the processing wait information and the maintenance information of the plurality of second processing apparatuses 50, and based on the comparison result, determines one of the second processing apparatuses 50 into which the substrate storage container CA carried out from the first processing apparatus 20 by the local transfer mechanism 93 is to be carried. Specifically, for example, among the plurality of second processing apparatuses 50, one of the second processing apparatuses 50 that can process the substrates W in the substrate storage container CA scheduled to be carried in the fastest manner is selected in consideration of the number of processing wait substrates W and the maintenance schedule.

[0294] For example, even if a second processing apparatus 50 has the smallest number of processing wait substrates W among the plurality of second processing apparatuses 50, if maintenance is scheduled to be performed before the processing of the substrates W in the substrate storage container CA scheduled to be carried in starts, and considering the maintenance, the processing of the substrates W in the substrate storage container CA will be delayed, the second processing apparatus 50 is not selected as the above-described one second processing apparatus 50. Then, among the second processing apparatuses 50 whose maintenance is scheduled to be performed some time later, the second processing apparatus 50 having the smallest number of processing wait substrates W is selected as the above-described one second processing apparatus 50.

[0295] As described above, the substrate processing system 1000a includes a first processing apparatus 20, a plurality of second processing apparatuses 50, an integrated control apparatus 10, and a local transfer mechanism 93. The first processing apparatus 20 executes a first process on the substrate W based on a job. The plurality of second processing apparatuses 50 each execute a second process on the substrate W based on a job. The integrated control apparatus 10 controls the first processing apparatus 20 and the plurality of second processing apparatuses 50 based on an instruction received from an external control apparatus (i.e., host computer HC). The local transfer mechanism 93 is movable independently of the first processing apparatus 20 and the plurality of second processing apparatuses 50.

[0296] A job instructs to carry the substrate W from the substrate storage container CA into the processing apparatus, execute a process on the substrate W inside the processing apparatus, and then carry the substrate W out from inside the processing apparatus to the substrate storage container CA or another substrate storage container CA different from the substrate storage container CA. The integrated control apparatus 10 generates a first virtual job and a second virtual job based on a creation instruction of an integrated job received from the host computer HC. The first processing apparatus 20 executes at least a part of the first process on the substrate W (in the above example, chemical solution treatment and rinse treatment) based on the first virtual job. Among the plurality of second processing apparatuses 50, one second processing apparatus 50 selected by the integrated control apparatus 10 executes at least a part of the second process (in the above example, drying treatment) on the substrate W after being processed by the first processing apparatus 20 based on the second virtual job.

[0297] The first processing apparatus 20 has a first container placement portion CP1 on which the substrate storage container CA is placed. Each of the plurality of second processing apparatuses 50 has a second container placement portion CP2 on which the substrate storage container CA is placed. The local transfer mechanism 93 transfers the substrate storage container CA containing the substrate W after being processed by the first processing apparatus 20 from the first container placement portion CP1 to the second container placement portion CP2 of the one second processing apparatus 50 among the plurality of second processing apparatuses 50.

[0298] As a result, as described above, the substrate storage container CA can be easily transported to one of the second processing devices 50 appropriately selected from the plurality of second processing devices 50. Further, as described above, the time from the end of the processing of the substrate W by the first processing device 20 to the start of the processing of the substrate W by the one second processing device 50 can be shortened.

[0299] As described above, it is preferable that the first processing device 20 includes a batch-type substrate processing device capable of processing a plurality of substrates W at once, and the plurality of second processing devices 50 include single-wafer-type substrate processing devices that process substrates one by one. Thereby, a hybrid process in which single-wafer processing is performed after batch processing is performed on each substrate W can be suitably implemented.

[0300] In the above example, the integrated control device 10 stores processing-waiting information indicating the number of substrates W waiting for processing in each of the plurality of second processing devices 50 and maintenance information for each of the plurality of second processing devices 50. The integrated control device 10 preferably selects one of the second processing devices 50 from the plurality of second processing devices 50 based on the processing-waiting information and the maintenance information of each second processing device 50. Thereby, the one second processing device 50 can be selected in consideration of the maintenance timing of each second processing device 50. As a result, it is possible to select one of the second processing devices 50 that can process the substrate W in the substrate storage container CA scheduled to be carried in the fastest manner.

[0301] [Embodiment 4] FIG. 21 is a block diagram showing the configuration of a substrate processing system 1000b according to Embodiment 4. As shown in FIG. 21, the substrate processing system 1000b further includes a plurality of second processing devices 50b in addition to each configuration of the substrate processing system 1000a shown in FIG. 20. Other configurations of the substrate processing system 1000b are substantially the same as those of the substrate processing system 1000a shown in FIG. 20.

[0302] The plurality of second processing devices 50b are each a single-sheet processing device of a type different from the above-described second processing device 50. Between the second processing device 50b and the second processing device 50, for example, the structure of the device, the type of processing liquid used, the type of process that can be executed, etc. are different. For example, in the second processing device 50b, the substrate W is dried by a drying method of a type different from that of the second processing device 50. In the following description, the plurality of second processing devices 50 are also referred to as "the first type of second processing device group 500", and the plurality of second processing devices 50b are also referred to as "the second type of second processing device group 500b". Further, the second processing device 50 and the second processing device 50b are collectively also simply referred to as the "second processing device".

[0303] The plurality of second processing devices 50b included in the second type of second processing device group 500b are processing devices of the same type having substantially the same structure, and each is configured to be able to execute a second process on the substrate W based on one job. In the present embodiment, the second type of second processing device group 500b includes two second processing devices 50b. The number of second processing devices 50b included in the second type of second processing device group 500b may be three or more.

[0304] The second type of second processing device group 500b is arranged in a region separated from the region where the first type of second processing device group 500 is arranged. In the example shown in FIG. 21, with respect to the direction along the conveyance path of the substrate storage container CA by the local conveyance mechanism 93, the second type of second processing device group 500b is located on the side opposite to the first type of second processing device group 500 with the first processing device 20 interposed therebetween. The local conveyance mechanism 93 can also convey the substrate storage container CA between the first processing device 20 and the plurality of second processing device groups 500b. The local conveyance mechanism 93 is also arranged above (i.e., on the (+Z) side) the second container placement portion CP2 of each second processing device 50b. The movable part 931 of the local conveyance mechanism 93 can move independently of the second processing device 50b as well.

[0305] In the substrate processing system 1000b, the integrated control device 10 controls the first processing device 20, the plurality of second processing devices 50, and the plurality of second processing devices 50b based on the instructions received from the host computer HC. Specifically, the integrated control device 10 generates a first virtual job and a second virtual job based on the integrated job creation instruction received from the host computer HC.

[0306] The integrated control device 10 transmits the first virtual job from the communication unit 11 to the first processing device 20 to cause the first processing device 20 to execute the first virtual job. In the present embodiment, the first virtual job causes the first processing device 20 (i.e., the batch processing device 20) to perform chemical solution processing and rinse processing. While the chemical solution processing and rinse processing of the substrate W are being performed in the first processing device 20, the two empty substrate storage containers CA in which the substrate W was accommodated are placed on the first container shelf 33a and / or the second container shelf 33b.

[0307] The plurality of substrates W (i.e., the above-described first lot and second lot) for which the processing in the first processing device 20 has been completed are accommodated in the two substrate storage containers CA on the first container shelf 33a and / or the second container shelf 33b and placed on the first container placement portion CP1. The substrate storage container CA in which the processed substrate W by the first processing device 20 is accommodated may be the substrate storage container CA in which the substrate W was accommodated before being processed by the first processing device 20, or may be another substrate storage container CA different from the substrate storage container CA.

[0308] When the substrate storage container CA in which the substrate W is accommodated is placed on the first container placement portion CP1, one of the second processing device groups of the first type of second processing device group 500 and the second type of second processing device group 500b is selected by the integrated control device 10. The selection of the one second processing device group is performed based on, for example, the content of the drying process instructed by the second virtual job, the size of the pattern on the substrate W stored in advance in the storage unit 12, and the like.

[0309] When the selection of the above-mentioned one second processing device group (in this embodiment, the first type of second processing device group 500 or the second type of second processing device group 500b) on one side is completed, the local transfer mechanism 93 is controlled by the control unit 13 of the integrated control device 10. The movable part 931 of the local transfer mechanism 93 holds the substrate storage container CA placed on the first container placement part CP1, and starts to move toward the area where the selected one second processing device group is arranged.

[0310] In the integrated control device 10, in parallel with the above-mentioned movement of the movable part 931, one second processing device (that is, the second processing device 50 or the second processing device 50b) among the plurality of second processing devices included in the selected one second processing device group is selected. The selection of the one second processing device is performed in substantially the same manner as the selection of the one second processing device 50 in the substrate processing system 1000a described above. Then, the substrate storage container CA is transported by the local transfer mechanism 93 to the second container placement part CP2 of the selected one second processing device and placed on the second container placement part CP2. Thereby, the substrate W after being processed by the first processing device 20 is carried into the one second processing device. The local transfer mechanism 93 directly carries the substrate storage container CA carried out from the first processing device 20 into the one second processing device (that is, the second processing device 50 or the second processing device 50b) without passing through the above-mentioned container storage warehouse or the like.

[0311] When the substrate storage container CA is placed on the second container placement part CP2 of the one second processing device, the integrated control device 10 transmits a second virtual job from the communication unit 11 to the one second processing device and causes the one second processing device to execute the second virtual job. In this embodiment, the second virtual job causes the one second processing device (that is, the single-wafer processing device) to perform a drying process.

[0312] As described above, the substrate processing system 1000b includes a first processing apparatus 20, a plurality of second processing apparatuses (i.e., a second processing apparatus 50 and a second processing apparatus 50b), an integrated control apparatus 10, and a local transfer mechanism 93. The first processing apparatus 20 executes a first process on a substrate W based on a job. The plurality of second processing apparatuses each execute a second process on the substrate W based on a job. The plurality of second processing apparatuses include a first type of second processing apparatus group 500 and a second type of second processing apparatus group 500b different from the first type. The second type of second processing apparatus group 500b is arranged in a region separated from the region where the first type of second processing apparatus group 500 is arranged. The integrated control apparatus 10 controls the first processing apparatus 20 and the plurality of second processing apparatuses based on an instruction received from an external control apparatus (i.e., a host computer HC). The local transfer mechanism 93 is movable independently of the first processing apparatus 20 and the plurality of second processing apparatuses.

[0313] A job commands a process of loading the substrate W from a substrate storage container CA into the inside of a processing apparatus, executing a process on the substrate W inside the processing apparatus, and then unloading the substrate W from the inside of the processing apparatus to the substrate storage container CA or another substrate storage container CA different from the substrate storage container CA. The integrated control apparatus 10 generates a first virtual job and a second virtual job based on a creation instruction of an integrated job received from the host computer HC. The first processing apparatus 20 executes at least a part of the first process (in the above example, chemical solution treatment and rinse treatment) on the substrate W based on the first virtual job.

[0314] Based on the creation instruction of the integrated job, the integrated control device 10 selects one of the second processing device groups of the first type 500 and the second processing device group of the second type 500b, and selects one second processing device (that is, the second processing device 50 or the second processing device 50b) from the selected one of the second processing device groups. Among the plurality of second processing devices, the one second processing device selected by the integrated control device 10 performs at least a part of the second processing (drying processing in the above example) on the substrate W after being processed by the first processing device 20 based on the second virtual job.

[0315] The first processing device 20 has a first container placement portion CP1 on which the substrate storage container CA is placed. Each of the plurality of second processing devices has a second container placement portion CP2 on which the substrate storage container CA is placed. The local transfer mechanism 93 transfers the substrate storage container CA containing the substrate W after being processed by the first processing device 20 from the first container placement portion CP1 to the second container placement portion CP2 of the above one second processing device (that is, the second processing device 50 or the second processing device 50b) among the plurality of second processing devices.

[0316] Thereby, the substrate storage container CA can be easily transferred to one second processing device appropriately selected from the plurality of second processing devices (that is, the second processing device group of the first type 500 and the second processing device group of the second type 500b). Also, similar to the substrate processing system 1000a substantially, the time from the end of the processing of the substrate W by the first processing device 20 to the start of the processing of the substrate W by the one second processing device can be shortened.

[0317] As described above, in the substrate processing system 1000b, the substrate storage container CA containing the substrate W processed by the first processing apparatus 20 is conveyed from the first processing apparatus 20 to one of the second processing apparatus groups (that is, the first type of second processing apparatus group 500 or the second type of second processing apparatus group 500b) selected by the integrated control apparatus 10. Then, preferably in parallel with the conveyance, one of the second processing apparatuses (that is, the second processing apparatus 50 or the second processing apparatus 50b) in the one second processing apparatus group is selected by the integrated control apparatus 10 as the second processing apparatus that executes the second virtual job. Thereby, the time from the completion of the processing of the substrate W by the first processing apparatus 20 to the start of the processing of the substrate W by the one second processing apparatus can be further shortened.

[0318] As described above, the first processing apparatus 20 preferably includes a batch type substrate processing apparatus capable of processing a plurality of substrates W at once, and each of the plurality of second processing apparatuses preferably includes a single wafer type substrate processing apparatus that processes substrates one by one. Thereby, a hybrid process in which single wafer processing is performed after batch processing is performed on each substrate W can be suitably implemented.

[0319] The embodiments of the present invention have been described above with reference to the drawings (FIGS. 1 to 21). However, the present invention is not limited to the above-described embodiments, and can be implemented in various aspects without departing from the gist thereof. Further, the plurality of components disclosed in the above embodiments can be modified as appropriate. For example, a component among all the components shown in one embodiment may be added to the components of another embodiment, or some of the components among all the components shown in one embodiment may be deleted from the embodiment.

[0320] The drawings schematically show each component mainly for facilitating the understanding of the invention, and the thickness, length, number, interval, etc. of each illustrated component may be different from the actual ones for convenience in drawing preparation. Also, the configuration of each component shown in the above embodiments is an example and is not particularly limited, and it goes without saying that various changes can be made without substantially departing from the effects of the present invention.

[0321] For example, in the embodiment described with reference to FIGS. 1 to 21, a configuration in which the substrate W is processed using the first processing device 20 and the second processing devices 50 and 50b has been described. However, the integrated control device 10 may cause only the first processing device 20 to process the substrate W, or may cause only the second processing device 50 or the second processing device 50b to process the substrate W. In this case, one of the first recipe RP1 and the second recipe RP2 is integrated into the integrated job.

[0322] Also, in the embodiment described with reference to FIGS. 1 to 21, it was a combination of a batch-type cleaning device or etching device and a single-wafer-type cleaning device or etching device. However, the combination of the first processing device 20 and the second processing devices 50 and 50b is not limited to this. For example, the combination of the first processing device 20 and the second processing devices 50 and 50b may be a combination of a scrubber cleaning device and a batch cleaning device, or may be a combination of a film thickness inspection device and a cleaning device, or may be a combination of a warp measurement device and a lamp annealing device, or may be a combination of a cleaning device and a particle count device.

[0323] Also, in the embodiment described with reference to FIGS. 1 to 21, some of the first processes that the first processing device 20 can execute were used, but all of the processes that the first processing device 20 can execute may be used. The same applies to the second processing devices 50 and 50b. For example, when the first processing device 20 is a film thickness inspection device, all of the processes that the first processing device 20 can execute are used.

[0324] Also, in the embodiment described with reference to FIGS. 1 to 21, it was a combination of a batch-type processing device and a single-wafer-type processing device. However, a combination of batch-type processing devices or a combination of single-wafer-type processing devices may also be used.

[0325] In the embodiments described with reference to FIGS. 1 to 21, batch processing and single-sheet processing are combined, but a combination of batch processing and batch processing or a combination of single-sheet processing and single-sheet processing may also be used. For example, a plurality of processing apparatuses capable of executing the same processing may be combined.

[0326] In the embodiments described with reference to FIGS. 1 to 19, the substrate processing system 1000 includes the first connection portion 80 and the second connection portion 90, but the substrate processing system 1000 may include only one of the first connection portion 80 and the second connection portion 90.

[0327] In the embodiments described with reference to FIGS. 1 to 19, a combination of two processing apparatuses is used, but as in the embodiments described with reference to FIGS. 20 and 21, a combination of three or more processing apparatuses may be used.

[0328] In the embodiments described with reference to FIGS. 1 to 19, after the second posture conversion mechanism converts the posture of one lot from the vertical posture to the horizontal posture, virtual placement information (information indicating that a virtual substrate storage container is placed on a virtual load port) is generated in response to adjusting the vertical position of one lot so that the uppermost substrate W of one lot is located above the liquid surface of the immersion tank. However, virtual placement information may be generated in response to the second posture conversion mechanism converting the posture of one lot from the vertical posture to the horizontal posture.

[0329] In the embodiments described with reference to FIGS. 1 to 19, the first connection portion 80 has the substrate standby portion 40, but the first processing apparatus 20 may have the substrate standby portion 40.

[0330] In the embodiments described with reference to FIG. 21, two second processing apparatus groups are provided, but three or more second processing apparatus groups may be provided.

Industrial Applicability

[0331] The present invention is useful for an apparatus, a system, and a method for processing a substrate.

Explanation of Signs

[0332] 10: Integrated control device 20: First processing device, batch processing device 21: First control device 23: First memory unit 31: First housing 31a: First opening 40: Substrate standby unit 50, 50b: Second processing device, sheet-fed processing device 51: Second control device 53: Second memory unit 61: Second housing 61a: Second opening 80: First connection part 81: First connection housing 82: Substrate transfer mechanism 90: Second connection part 91: Second connection housing 92: Second container transfer mechanism 93: Local transfer mechanism 1000, 1000a, 1000b: Substrate processing system A~D: Recipe CA: Substrate storage container CA1: First substrate storage container CA2: Second substrate storage container CP1: First container placement part CP2: Second container placement part G1: First recipe editing screen G2: Second recipe editing screen HC: Host computer HR: Integrated recipe information LP1: First load port LP2: Second load port LP3: Third load port RP1: First recipe RP2: Second recipe W: Substrate

Claims

1. a first processing device that performs a first processing on a substrate based on a job; a second processing device that performs a second processing on the substrate based on the job; an integrated control device that controls the first processing device and the second processing device based on a command received from an external control device; Equipped with the job instructs a process of loading a substrate from a substrate accommodation container into a processing apparatus, performing a process on the substrate in the processing apparatus, and then unloading the substrate from the processing apparatus into the substrate accommodation container or another substrate accommodation container different from the substrate accommodation container; The integrated control device includes: generating a first virtual job and a second virtual job based on an integrated job creation command received from the external control device; the first processing device performs at least a part of the first processing on a substrate based on the first virtual job; The second processing apparatus performs at least a part of the second processing on the substrate after the substrate has been processed by the first processing apparatus, based on the second virtual job.

2. a first connection unit that connects the first processing device and the second processing device, The substrate processing system according to claim 1 , wherein the first connection portion has a substrate transport mechanism that transports the substrate after being processed by the first processing apparatus to the second processing apparatus.

3. a substrate waiting section on which the substrate waits after at least a part of the first process has been performed, the substrate transport mechanism transports the substrate waiting in the substrate standby section to the second processing device; The substrate processing system according to claim 2 , wherein the integrated control device generates the second virtual job in response to the substrate being placed on standby in the substrate standby section.

4. The second processing device has a storage unit that stores identification information of the virtual container placement unit, The substrate processing system according to claim 3 , wherein the integrated control device generates information indicating that a virtual substrate container has been placed on the virtual container placement section in response to the substrate being placed on standby in the substrate standby section.

5. the first processing device has a first housing having a first opening; the second processing device has a second housing having a second opening; The first connecting portion further includes a first connecting housing, one end of the first connecting housing is connected to the first housing, the other end of the first connecting housing is connected to the second housing, 5. The substrate processing system according to claim 2, wherein the substrate transport mechanism transports the substrate after being processed by the first processing device out of the first opening of the first housing, transports the substrate inside the first connecting housing, and transports the substrate into the second housing through the second opening.

6. a second connection unit that connects the first processing device and the second processing device, the first processing apparatus has a first housing and a first container mounting part on which a substrate accommodation container is mounted, the second processing apparatus includes a second housing and a second container mounting portion on which the substrate accommodation container is mounted, The first container mounting portion is provided outside the first housing, The second container mounting portion is provided outside the second housing, The substrate processing system according to claim 1 , wherein the second connection unit has a container transport mechanism that transports the substrate container placed on the first container mounting unit to the second container mounting unit.

7. The second connecting portion further includes a second connecting housing that covers the first container mounting portion and the second container mounting portion, The substrate processing system according to claim 6 , wherein the container transport mechanism transports the substrate accommodation container inside the second connection housing.

8. the first processing device has a first storage unit that stores a first recipe that defines the first process; the second processing device has a second storage unit that stores a second recipe that defines the second process; the integrated control device edits an integrated recipe that integrates the first recipe and the second recipe, and stores integrated recipe information; when receiving a creation command for the integrated job from the external control device, the integrated control device generates the first virtual job and the second virtual job by referring to the integrated recipe information; the first virtual job includes an identification of the first recipe that is integrated into the integrated recipe; The substrate processing system of claim 1 , wherein the second virtual job includes identification information of the second recipe integrated into the integrated recipe.

9. The first processing device executes a part of the first process, 9. The substrate processing system according to claim 8, wherein the integrated control device, when editing the integrated recipe, edits the first recipe so that a portion of the first process is executed based on an instruction from the external control device.

10. The second processing device executes a part of the second process, 9. The substrate processing system of claim 8, wherein the integrated control device, when editing the integrated recipe, edits the second recipe so that a portion of the second process is executed based on an instruction from the external control device.

11. The first storage unit stores a plurality of the first recipes that are different from each other, the integrated control device integrates the first recipe into the integrated recipe on a substrate-by-substrate basis when editing the integrated recipe; The substrate processing system of claim 8 , wherein the integrated control device generates two or more of the first virtual jobs when two or more of the first recipes are integrated into the integrated recipe.

12. The second storage unit stores a plurality of the second recipes that are different from each other, the integrated control device integrates the second recipe into the integrated recipe on a substrate-by-substrate basis when editing the integrated recipe; The substrate processing system of claim 8 , wherein the integrated control device generates two or more of the second virtual jobs when two or more of the second recipes are integrated into the integrated recipe.

13. the first processing device notifies the integrated control device of an event that has occurred in the first processing device together with identification information of the first virtual job; the second processing device notifies the integrated control device of an event that has occurred in the second processing device together with identification information of the second virtual job; The integrated control device includes: notifying the external control device of an event occurring in the first processing device together with identification information of the integrated job; 5. The substrate processing system according to claim 1, further comprising: a notification of an event occurring in said second processing apparatus to said external control apparatus together with identification information of said integrated job.

14. the event occurring in the first processing device includes a completion event indicating completion of processing based on the first virtual job; The substrate processing system according to claim 13 , wherein the integrated control device determines not to notify the external control device of a completion event when the event notified from the first processing device is a completion event of the first virtual job.

15. The integrated control device generates the second virtual job a plurality of times; the events occurring in the second processing device include a plurality of completion events indicating completion of processing based on each of the plurality of second virtual jobs; the plurality of completion events include a final completion event that is a completion event notified last from the second processing device; The integrated control device includes: If the completion event notified from the second processing device is not the final completion event, determining not to notify the external control device of the completion event; The substrate processing system according to claim 13 , wherein when the completion event notified from the second processing apparatus is the final completion event, the completion event is notified to the external control apparatus together with identification information of the integrated job.

16. the first processing device has a first control device that controls execution of the first process; the second processing device has a second control device that controls execution of the second process; The substrate processing system according to claim 1 , wherein one of the first controller and the second controller also serves as the integrated controller.

17. the first processing apparatus includes a batch-type substrate processing apparatus capable of processing a plurality of substrates at once; The substrate processing system according to claim 1 , wherein the second processing apparatus includes a single-wafer type substrate processing apparatus that processes substrates one by one.

18. the integrated control device generates the first virtual job to control the batch-type substrate processing device; the batch-type substrate processing apparatus performs a part of the first processing on the plurality of substrates based on the first virtual job; the integrated control device generates the second virtual job and controls the single-wafer type substrate processing apparatus after the batch-type substrate processing apparatus has completed processing the plurality of substrates; the single-wafer substrate processing apparatus performs a part of the second process on each of the plurality of substrates on a substrate-by-substrate basis based on the second virtual job; the integrated control device generates the second virtual job again to control the single-wafer type substrate processing apparatus after the single-wafer type substrate processing apparatus has completed processing of some of the plurality of substrates; The substrate processing system according to claim 17 , wherein the single-wafer substrate processing apparatus performs a part of the second process on each of the remaining substrates of the plurality of substrates on a substrate-by-substrate basis based on the second virtual job.

19. a first processing device that performs a first processing on a substrate based on a job; a plurality of second processing devices each performing a second processing on a substrate based on a job; an integrated control device that controls the first processing device and the plurality of second processing devices based on a command received from an external control device; a local transport mechanism movable independently of the first processing device and the plurality of second processing devices; Equipped with the job instructs a process of loading a substrate from a substrate accommodation container into a processing apparatus, performing a process on the substrate in the processing apparatus, and then unloading the substrate from the processing apparatus into the substrate accommodation container or another substrate accommodation container different from the substrate accommodation container; The integrated control device includes: generating a first virtual job and a second virtual job based on an integrated job creation command received from the external control device; the first processing device performs at least a part of the first processing on a substrate based on the first virtual job; one second processing apparatus selected by the integrated control apparatus from among the plurality of second processing apparatuses performs at least a part of the second processing on the substrate after being processed by the first processing apparatus, based on the second virtual job; the first processing apparatus has a first container mounting part on which a substrate accommodation container is mounted, Each of the second processing devices has a second container mounting part on which the substrate accommodation container is mounted, A substrate processing system, wherein the local transport mechanism transports the substrate storage container containing the substrate after it has been processed by the first processing device from the first container mounting portion to the second container mounting portion of one of the plurality of second processing devices.

20. The substrate processing system of claim 19, wherein the integrated control device stores waiting-for-processing information indicating the number of substrates waiting to be processed in each of the plurality of second processing devices and maintenance information for each of the plurality of second processing devices, and selects the one second processing device from the plurality of second processing devices based on the waiting-for-processing information and the maintenance information for each second processing device.

21. The plurality of second processing devices include a second processing device group of a first type; a second processing device group of a second type different from the first type; Including, the second type of second processing device group is disposed in an area spaced apart from an area in which the first type of second processing device group is disposed, The substrate processing system of claim 19, wherein the integrated control device selects one of the first type second processing device groups and the second type second processing device groups based on the integrated job creation command, and selects the one second processing device from the one second processing device group.

22. the first processing apparatus includes a batch-type substrate processing apparatus capable of processing a plurality of substrates at once; 22. The substrate processing system according to claim 19, wherein each of the second processing apparatuses includes a single-wafer type substrate processing apparatus that processes substrates one by one.

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