Laminated type electronic component

Abstract

To provide a laminated type electronic component which improves reliability and bending strength.SOLUTION: A laminated type electronic component 100 includes a body 110 including a central part 110a including a dielectric layer 111 and internal electrodes 121 and 122 arranged alternately with the dielectric layer in a first direction, and an outer edge part 110b covering both surfaces in the first direction of the central part and both surfaces in a third direction, and external electrodes 131 and 132 including connection parts C1 and C2 arranged on the third surface or the fourth surface and band parts B1 and B2 extending to a part of the first surface and the second surface from the connection parts, wherein the external electrodes include glass layers 131a and 132a arranged in the band part, basic electrode layers 131b and 132b which are arranged in the connection part and are brought into contact with the internal electrodes, and conductive resin layers 131c and 132c arranged on the basic electrode layers, and a part of the glass layer is arranged on the connection part, and the ends 13a and 13b of the glass layer arranged in the connection part are arranged on the outer edge part.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a multilayer electronic component.

Background Art

[0002] A multilayer ceramic capacitor (MLCC), which is one type of multilayer electronic component, is a chip-type capacitor that is mounted on a printed circuit board of various electronic products such as video devices like liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, and mobile phones, and serves to charge or discharge electricity. Such a multilayer ceramic capacitor is used as a component of various electronic devices due to its advantages of being small in size, having a guaranteed high capacitance, and being easy to mount.

[0003] In recent years, due to the development of electric vehicles and autonomous driving technology, etc., research has continued on multilayer ceramic capacitors that can stably operate even in high-temperature, high-pressure, and high-humidity usage environments. In particular, in multilayer ceramic capacitors for high voltage, withstand voltage and flexural strength characteristics are more important. If it is not possible to prevent the penetration of external moisture and / or plating solution or the generation of cracks due to bending stress, the reliability of the multilayer ceramic capacitor may deteriorate, and there is a risk that not only the multilayer ceramic capacitor but also the printed circuit board on which the multilayer ceramic capacitor is mounted may be damaged due to arc discharge.

[0004] As an example for improving the flexural strength of a multilayer ceramic capacitor, a method of applying a conductive resin layer to the external electrode or increasing the length of the band portion can be considered. However, the longer the length of the band portion, the more vulnerable it becomes to arc discharge, and the conductive resin layer has a weak adhesive force with the main body, and there may be a problem that the resin in the conductive resin layer burns in a high-temperature and high-pressure environment.

Summary of the Invention

Problems to be Solved by the Invention

[0005] One of the various objects of the present invention is to improve the reliability of a multilayer electronic component.

[0006] One of the various objects of the present invention is to improve the bending strength of a multilayer electronic component.

[0007] However, the object of the present invention is not limited to the above description, and can be more easily understood in the process of describing specific embodiments of the present invention.

Means for Solving the Problems

[0008] One embodiment of the present invention includes a first surface and a second surface facing each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in a second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and facing each other in a third direction, a central portion including a dielectric layer and internal electrodes alternately arranged with the dielectric layer in the first direction, and a main body including an outer edge portion covering both surfaces of the central portion in the first direction and both surfaces in the third direction, a connection portion disposed on the third surface or the fourth surface, and an external electrode including a band portion extending from the connection portion to a part of the first surface and the second surface, the external electrode including a glass layer disposed in the band portion, a base electrode layer disposed in the connection portion and contacting the internal electrode, and a conductive resin layer disposed on the base electrode layer, a part of the glass layer is disposed in the connection portion, and an end portion of the glass layer disposed in the connection portion is disposed on the outer edge portion, and provides a multilayer electronic component.

Advantages of the Invention

[0009] One of the various advantages of the present invention is that the reliability of a multilayer electronic component can be improved.

[0010] One of the various advantages of the present invention is that the bending strength of a multilayer electronic component can be improved.

Brief Description of the Drawings

[0011]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Mode for Carrying Out the Invention

[0012] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be deformed into various different forms, and the scope of the present invention is not limited to the embodiments described below. Also, the embodiments of the present invention are provided to more fully explain the present invention to ordinary technicians. Therefore, the shape, size, etc. of the elements in the drawings may be exaggerated for clearer explanation, and the elements indicated by the same reference numerals in the drawings are the same elements.

[0013] In the drawings, parts not relevant to the description are omitted for the sake of clearly explaining the present invention. The sizes and thicknesses of the components shown in the drawings are arbitrarily shown for convenience of explanation, and thus the present invention is not necessarily limited to what is shown. Also, components having the same function within the scope of the same concept are described using the same reference numerals. Further, throughout the specification, when a certain part "includes" a certain component, it means that other components can be further included, rather than excluding other components, unless otherwise stated to the contrary.

[0014] In the drawings, the first direction can be defined as the thickness (T) direction, the second direction as the length (L) direction, and the third direction as the width (W) direction.

[0015] Multilayer electronic component FIG. 1 is a perspective view schematically showing a stacked electronic component according to an embodiment of the present invention, FIG. 2 is a cross-sectional view schematically showing the I-I' cut surface of FIG. 1, FIG. 3 is a cross-sectional view schematically showing the II-II' cut surface of FIG. 1, FIG. 4 is a cross-sectional view schematically showing the III-III' cut surface of FIG. 2, and FIG. 5 is a side view of the stacked electronic component seen from the third surface of FIG. 1.

[0016] Hereinafter, with reference to FIGS. 1 to 5, a stacked electronic component 100 according to an embodiment of the present invention will be described in detail. Note that, as an example of the stacked electronic component, a multilayer ceramic capacitor will be described, but the present invention is not limited thereto and can also be applied to various stacked electronic components, such as inductors, piezoelectric elements, varistors, thermistors, and the like.

[0017] The size of the stacked electronic component 100 according to an embodiment of the present invention is not particularly limited. The dimension of the stacked electronic component 100 in the first direction may be, for example, 0.25 mm to 4.0 mm, the dimension of the stacked electronic component 100 in the second direction may be, for example, 0.5 mm to 5.5 mm, and the dimension of the stacked electronic component 100 in the third direction may be, for example, 0.25 mm to 4.0 mm.

[0018] The multilayer electronic component 100 can include a main body 110 including a dielectric layer 111 and internal electrodes 121 and 122, and external electrodes 131 and 132. Although the specific shape of the main body 110 is not particularly limited, as shown in the figure, the main body 110 can be formed in a hexahedron shape or a shape similar thereto. Due to the shrinkage of the ceramic powder contained in the main body 110 during the firing process and the polishing of the corner portions, the main body 110 can have a substantially hexahedron shape, although it does not have a hexahedron shape with perfect straight lines.

[0019] The main body 110 can have a first surface 1 and a second surface 2 facing each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and facing each other in a second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1, the second surface 2, the third surface 3, and the fourth surface 4 and facing each other in a third direction.

[0020] The main body 110 can include a central portion 110a including a dielectric layer 111 and internal electrodes 121 and 122 alternately arranged with the dielectric layer 111 in a first direction, and an outer edge portion 110b covering both surfaces of the central portion 110a in the first direction and both surfaces in a third direction. The plurality of dielectric layers 111 forming the central portion 110a are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated to such an extent that they are difficult to confirm without using a scanning electron microscope (SEM).

[0021] The dielectric layer 111 can include, for example, a perovskite-type compound represented by ABO3 as a main component. The perovskite-type compound represented by ABO3 is, for example, BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1) in which Ca (calcium), Zr (zirconium), etc. are partially solid-soluted in BaTiO3, Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1) or Ba(Ti 1-y Zr y)Examples include O3 (0 < y < 1).

[0022] The average thickness td of the dielectric layer 111 is not particularly limited. The average thickness td of the dielectric layer 111 may be, for example, 0.1 μm to 55 μm, 0.1 μm to 20 μm, 0.1 μm to 10 μm, 0.1 μm to 5 μm, 0.1 μm to 2 μm, or 0.1 μm to 0.4 μm.

[0023] The internal electrodes 121 and 122 can include, for example, a first internal electrode 121 and a second internal electrode 122 that are alternately arranged in the first direction with the dielectric layer 111 interposed therebetween. That is, the first internal electrode 121 and the second internal electrode 122, which are a pair of electrodes having different polarities, can be arranged so as to face each other with the dielectric layer 111 interposed therebetween. The first internal electrode 121 and the second internal electrode 122 can be electrically separated from each other by the dielectric layer 111 disposed therebetween.

[0024] The first internal electrode 121 can be separated from the fourth surface 4 and connected to the first external electrode 131 on the third surface 3 side. The second internal electrode 122 can be separated from the third surface 3 and connected to the second external electrode 132 on the fourth surface 4 side.

[0025] The conductive metal included in the internal electrodes 121 and 122 may be one or more of Ni, Cu, Pd, Ag, Au, Pt, Sn, W, Ti, and their alloys, and it is more preferable to include Ni, but the present invention is not limited thereto.

[0026] The average thickness te of the internal electrodes 121 and 122 is not particularly limited. The average thickness te of the internal electrodes 121 and 122 may be, for example, 0.1 μm to 4.0 μm, 0.1 μm to 3.0 μm, 0.1 μm to 1.0 μm, or 0.1 μm to 0.4 μm.

[0027] The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 respectively mean the dimensions of the dielectric layer 111 and the internal electrodes 121 and 122 in the first direction. The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 can be measured by scanning the cross-sections of the main body 110 in the first and second directions with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, the average thickness td of the dielectric layer 111 can be measured by measuring the thicknesses at a plurality of points of one dielectric layer 111, for example, 30 points equally spaced in the second direction, and then taking the average value. Also, the average thickness te of the internal electrodes 121 and 122 can be measured by measuring the thicknesses at a plurality of points of one internal electrode 121 or 122, for example, 30 points equally spaced in the second direction, and then taking the average value. The 30 equally spaced points can be specified at the central portion 110a. On the other hand, when such average value measurements are performed for 10 dielectric layers 111 and 10 internal electrodes 121 and 122 respectively and then the average value is measured, the average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 can be more generalized.

[0028] The outer edge portion 110b can continuously cover both surfaces of the central portion 110a in the first direction and both surfaces of the central portion 110a in the third direction. The outer edge portion 110b can basically play a role in preventing damage to the internal electrodes due to physical or chemical stress. The outer edge portion 110b can have a configuration similar to that of the dielectric layer and can contain a perovskite-type compound represented by ABO3 as a main component.

[0029] The outer edge portion 110b can include a first cover portion 112 and a second cover portion 113 respectively disposed on both surfaces of the central portion 110a in the first direction, and can include a first margin portion 114 and a second margin portion 115 respectively disposed on both surfaces of the central portion 110a in the third direction. The boundary surface between the central portion 110a and the first cover portion 112 can correspond to the upper surface of the internal electrode disposed at the uppermost part with reference to the first direction, the boundary surface between the central portion 110a and the second cover portion 113 can correspond to the lower surface of the internal electrode disposed at the lowermost part with reference to the first direction, and the boundary surfaces between the central portion 110a and the margin portions 114, 115 can correspond to both side surfaces of the internal electrode in the third direction.

[0030] The average thickness of the cover portions 112, 113 is not particularly limited. The average thickness of the cover portions 112, 113 may be, for example, 400 μm or less, 150 μm or less, 100 μm or less, 30 μm or less, or 20 μm or less. The average thickness of the cover portions 112, 113 may be, for example, 10 μm or more. Here, the average thickness of the cover portions 112, 113 means the average thickness of each of the first cover portion 112 and the second cover portion 113. The average thickness of the cover portions 112, 113 can mean the average dimension of the cover portions 112, 113 in the first direction, and may be a value obtained by averaging the dimensions in the first direction measured at five points equally spaced in the second direction in the cross section in the first direction and the second direction cut at the center of the main body 110 in the third direction.

[0031] The average thicknesses of the margin portions 114 and 115 are not particularly limited. The average thicknesses of the margin portions 114 and 115 may be, for example, 150 μm or less, 100 μm or less, 20 μm or less, or 15 μm or less. The average thicknesses of the margin portions 114 and 115 may be, for example, 5 μm or more. Here, the average thicknesses of the margin portions 114 and 115 mean the respective average thicknesses of the first margin portion 114 and the second margin portion 115. The average thicknesses of the margin portions 114 and 115 can mean the average dimensions of the margin portions 114 and 115 in the third direction, and may be a value obtained by averaging the dimensions in the third direction measured at five points equally spaced in the first direction in the cross section in the first and third directions cut at the center in the second direction of the main body 110.

[0032] Hereinafter, an example of a method for forming the main body 110 will be described. First, ceramic powder for forming the dielectric layer 111 is prepared. The ceramic powder may be, for example, BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1) in which Ca (calcium), Zr (zirconium), etc. are partially solid-solved in BaTiO3, Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), or Ba(Ti 1-y Zr y )O3 (0 < y < 1). The BaTiO3 powder can be synthesized, for example, by reacting a titanium raw material such as titanium dioxide and a barium raw material such as barium carbonate. Examples of the synthesis method of the ceramic powder include a solid-phase method, a sol-gel method, a hydrothermal synthesis method, etc., but the present invention is not limited thereto. Next, the prepared ceramic powder is dried and pulverized, and then an organic solvent such as ethanol and a binder such as polyvinyl butyral are mixed to produce a ceramic slurry, and then a ceramic green sheet is provided by applying and drying the ceramic slurry on a carrier film.

[0033] Next, an internal electrode conductive paste containing a metal powder, a binder, an organic solvent, etc. is printed on the ceramic green sheet with a predetermined thickness using a screen printing method, a gravure printing method, or the like to form an internal electrode pattern.

[0034] Thereafter, the ceramic green sheet on which the internal electrode pattern is printed is peeled off from the carrier film, and then the ceramic green sheet on which the internal electrode pattern is printed is laminated and pressure-bonded by a predetermined number of layers to form a ceramic laminate. On the upper and lower parts of the ceramic laminate, ceramic green sheets on which no internal electrode pattern is formed can be laminated by a predetermined number of layers in order to form the cover parts 112 and 113 after firing. Thereafter, the ceramic laminate is cut into a predetermined chip size, and the cut chip can be fired at a temperature of, for example, 1000 °C or higher and 1400 °C or lower to form the main body 110.

[0035] On the other hand, the margin parts 114 and 115 may be formed by applying and firing an internal electrode conductive paste except for the region where the margin part is formed on the ceramic green sheet. Alternatively, in order to suppress the step difference caused by the internal electrodes 121 and 122, the ceramic laminate is cut so that the internal electrode pattern is exposed from both surfaces in the third direction of the cut chip, and then the margin part forming sheet is attached onto both surfaces in the third direction of the cut chip and fired to form the margin parts 114 and 115.

[0036] The external electrodes 131 and 132 can include connection portions C1 and C2 disposed on the third surface 3 or the fourth surface 4, and band portions B1 and B2 extending from the connection portions C1 and C2 to a part of the first surface 1 and the second surface 2. The first external electrode 131 can include a first connection portion C1 disposed on the third surface 3 and a first band portion B1 extending from the first connection portion C1 to a part of the first surface 1 and the second surface 2. The second external electrode 132 can include a second connection portion C2 disposed on the fourth surface 4 and a second band portion B2 extending from the second connection portion C2 to a part of the first surface 1 and the second surface 2. The band portions B1 and B2 can also extend from the connection portions C1 and C2 to a part of the fifth surface 5 and the sixth surface 6.

[0037] The first connection portion C1 can mean a region disposed outside a virtual plane E3 parallel to the third surface within the first external electrode 131, and the first band portion B1 can mean a region disposed inside the virtual plane E3 parallel to the third surface within the first external electrode 131. That is, the boundary between the first connection portion C1 and the first band portion B1 can be located on the virtual plane E3 parallel to the third surface.

[0038] The second connection portion C2 can mean a region disposed outside a virtual plane E4 parallel to the fourth surface within the second external electrode 132, and the second band portion B2 can mean a region disposed inside the virtual plane E4 parallel to the fourth surface within the second external electrode 132. That is, the boundary between the second connection portion C2 and the second band portion B2 can be located on the virtual plane E4 parallel to the fourth surface.

[0039] The external electrodes 131 and 132 can include glass layers 131a and 132a disposed on the band portions B1 and B2, base electrode layers 131b and 132b disposed on the connection portions C1 and C2 and contacting the internal electrodes 121 and 122, and conductive resin layers 131c and 132c disposed on the base electrode layers 131b and 132b.

[0040] The first external electrode 131 can include a first glass layer 131a disposed in the first band portion B1, a first base electrode layer 131b disposed in the first connection portion C1 and contacting the first internal electrode 121, a first conductive resin layer 131c disposed on the first base electrode layer 131b, and a first plating layer 131d disposed on the first conductive resin layer 131c.

[0041] The second external electrode 132 can include a second glass layer 132a disposed in the second band portion B2, a second base electrode layer 132b disposed in the second connection portion C2 and contacting the second internal electrode 122, a second conductive resin layer 132c disposed on the second base electrode layer 132b, and a second plating layer 132d disposed on the second conductive resin layer 132c.

[0042] The glass layers 131a and 132a are basically disposed in the band portions B1 and B2, and can improve the bending strength of the multilayer electronic component 100. Also, they can play a role in improving the bonding strength between the main body 110 and the external electrodes 131 and 132. In particular, since the bonding strength between the main body 110 and the glass is stronger than the bonding strength between the main body 110 and the resin, the glass layers 131a and 132a can effectively prevent moisture and plating solution from the outside from penetrating into the inside of the main body 110 through the ends of the band portions B1 and B2, and can improve the reliability of the multilayer electronic component 100. Furthermore, since the glass is superior to the resin in heat resistance and pressure resistance, by including the glass layers 131a and 132a in the external electrodes 131 and 132, the stability of the multilayer electronic component 100 in high-temperature and high-pressure environments can be improved.

[0043] According to an embodiment of the present invention, a part of the glass layers 131a and 132a is disposed at the connection portions C1 and C2, and the end portions 13a and 13b of the glass layers disposed at the connection portions C1 and C2 can be disposed on the outer edge portion 110b. For example, a part of the first glass layer 131a is disposed at the first connection portion C1, and the end portion 13a of the first glass layer disposed at the first connection portion C1 can be disposed on the outer edge portion 110b. A part of the second glass layer 132a is disposed at the second connection portion C2, and the end portion 13b of the second glass layer disposed at the second connection portion C2 can be disposed on the outer edge portion 110b. For example, the first glass layer 131a is disposed on the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6 and extends onto a part of the third surface 3, but can be made not to contact the first internal electrode 121. The second glass layer 132a is disposed on the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6 and extends onto a part of the fourth surface 4, but can be made not to contact the second internal electrode 122. For example, the first glass layer 131a is disposed at the first connection portion C1 and the first band portion B1, but can be disposed outside the central portion 110a with reference to the first direction and the third direction. The second glass layer 132a is disposed at the second connection portion C2 and the second band portion B2, but can be disposed outside the central portion 110a with reference to the first direction and the third direction. The first glass layer 131a and the second glass layer 132a can be disposed spaced apart from each other.

[0044] By arranging a part of the glass layers 131a and 132a at the connection parts C1 and C2, it is possible to effectively seal the corner part of the main body 110 which is vulnerable to the penetration of moisture and plating solution from the outside, and thereby effectively improve the reliability of the laminated electronic component 100. However, if the glass layers 131a and 132a directly contact the internal electrodes 121 and 122, the connectivity between the internal electrodes 121 and 122 and the external electrodes 131 and 132 may deteriorate, and the capacitance of the laminated electronic component 100 may decrease. Therefore, the end parts 13a and 13b of the glass layers arranged at the connection parts C1 and C2 are preferably arranged on the outer edge part 110b. In one embodiment, the glass layers 131a and 132a can contact at least a part of the first surface 1 and the second surface 2 for improving the bonding force and reliability between the main body 110 and the external electrodes 131 and 132. More preferably, the glass layers 131a and 132a contact at least a part of the first surface 1, the second surface 2, the fifth surface 5 and the sixth surface 6. The glass layers 131a and 132a can contact a part of the third surface 3 or the fourth surface 4. The first glass layer 131a can contact a part of the third surface 3, and the second glass layer 132a can contact a part of the fourth surface 4.

[0045] In one embodiment, the end parts of the glass layers 131a and 132a arranged at the band parts B1 and B2 can be exposed from the conductive resin layers 131c and 132c. That is, the end part of the first glass layer 131a arranged at the first band part B1 can be exposed from the first conductive resin layer 131c, and the end part of the second glass layer 132a arranged at the second band part B2 can be exposed from the second conductive resin layer 132c. Thereby, the effect of preventing the penetration of moisture and plating solution from the outside of the present invention becomes more remarkable. Also, while increasing the length of the band parts B1 and B2 to improve the bending strength of the laminated electronic component 100, by maintaining the insulation between the first external electrode 131 and the second external electrode 132, it is possible to prevent the occurrence of arc discharge.

[0046] The glass layers 131a and 132a can include the first glass. The glass layers 131a and 132a can include one or more of Ba, Ca, Zn, Al, B, Si, and Fe. In one embodiment, the glass layers 131a and 132a can include Fe. Since the Fe component is excellent in corrosion resistance and acid resistance, when the glass layers 131a and 132a include Fe, the effect of preventing the penetration of moisture and plating solution from the outside of the present invention becomes more remarkable.

[0047] The thickness of the glass layers 131a and 132a does not need to be particularly limited. However, the thickness of the glass layers 131a and 132a measured at the band portions B1 and B2 may be 0.2 μm or more and 4 μm or less. The thickness of the glass layers 131a and 132a can be measured from an image obtained by scanning cross-sections in the first direction and the second direction cut at the center in the third direction of the main body 110 with a scanning electron microscope (SEM).

[0048] The method for forming the glass layers 131a and 132a does not need to be particularly limited. For example, the main body 110 can be dipped into a glass paste containing glass frit, binder, etc., and then the glass paste applied on a part of the central portion 110a and the outer edge portion 110b is removed and then heat-treated to form the glass layers 131a and 132a. Alternatively, the glass layers 131a and 132a may be formed by a sputtering method or the like.

[0049] The base electrode layers 131b and 132b can basically serve to electrically connect the internal electrodes 121 and 122 to the external electrodes 131 and 132 by directly contacting the internal electrodes 121 and 122. The base electrode layers 131b and 132b may be disposed at the connection portions C1 and C2 and contact the internal electrodes 121 and 122. However, a part of the base electrode layers 131b and 132b may be disposed at the band portions B1 and B2, and in the band portions B1 and B2, the base electrode layers 131b and 132b can be disposed between the glass layers 131a and 132a and the conductive resin layers 131c and 132c. That is, in the first band portion B1, the first base electrode layer 131b can be disposed between the first glass layer 131a and the first conductive resin layer 131c, and in the second band portion B2, the second base electrode layer 132b can be disposed between the second glass layer 132a and the second conductive resin layer 132c.

[0050] The base electrode layers 131b and 132b can contain a metal and a second glass. In one embodiment, the first glass contained in the glass layers 131a and 132a may have a different composition from the second glass. For example, the first glass may contain Fe, and the second glass may not contain Fe. Although Fe is excellent in corrosion resistance and acid resistance, when it reacts with Ni in the internal electrodes 121 and 122 to form a Ni-Fe compound, the connectivity between the internal electrodes 121 and 122 and the external electrodes 131 and 132 may decrease, and as a result, the capacitance of the multilayer electronic component 100 may deteriorate. Therefore, it is preferable that the second glass in direct contact with the internal electrodes 121 and 122 does not contain Fe. Alternatively, in one embodiment, both the first glass and the second glass may contain Fe, and the content of Fe (at%) in the total content of the elements constituting the first glass may be more than the content of Fe (at%) in the total content of the elements constituting the second glass. The components of the first glass and the second glass may be calculated from an image scanned using SEM-EDS. Specifically, the multilayer electronic component can be polished to the central position in the third direction to expose the cross sections in the first direction and the second direction, and then the content of Fe (at%) in the total content of the elements constituting the first glass and the second glass can be measured using SEM-EDS.

[0051] The metals contained in the base electrode layers 131b and 132b can include Cu, Ni, Pd, Pt, Au, Ag, Pb, and / or alloys containing them, but the present invention is not limited thereto.

[0052] The thickness of the base electrode layers 131b and 132b does not need to be particularly limited. However, the maximum thickness of the base electrode layers 131b and 132b measured at the central portions of the connection portions C1 and C2 may be 10 μm or more and 100 μm or less. The maximum thickness of the base electrode layers 131b and 132b can be measured from an image obtained by scanning cross-sections in the first and second directions cut at the center in the third direction of the main body 110 with a scanning electron microscope (SEM).

[0053] The base electrode layers 131b and 132b can be formed, for example, by dipping the main body 110 on which the glass layers 131a and 132a are formed into a conductive paste containing metal powder, glass frit, binder, organic solvent, etc., and then firing. The firing for forming the base electrode layers 131b and 132b can be performed at a temperature of 500°C or higher and 900°C or lower, but the present invention is not limited thereto.

[0054] The conductive resin layers 131c and 132c can be disposed at the connection portions C1 and C2 and the band portions B1 and B2. The conductive resin layers 131c and 132c can contain metal and resin. The conductive resin layers 131c and 132c can basically play a role in improving the bending strength of the multilayer electronic component 100.

[0055] The metals contained in the conductive resin layers 131c and 132c can include one or more of spherical particles and flaky particles. Here, the spherical particles can include forms that are not completely spherical, for example, forms in which the ratio of the length of the major axis to the length of the minor axis (major axis / minor axis) is 1.45 or less. The flaky particles mean powders having a flat and long form and are not particularly limited, but for example, the ratio of the length of the major axis to the length of the minor axis (major axis / minor axis) may be 1.95 or more.

[0056] The metals contained in the conductive resin layers 131c and 132c can include, for example, Cu, Ni, Pd, Pt, Au, Ag, Pb, Sn, and / or alloys containing them. The resins contained in the conductive resin layers 131c and 132c can include, for example, one or more of epoxy resins, acrylic resins, and ethyl cellulose. In one embodiment, the conductive resin layers 131c and 132c can further include intermetallic compounds including one or more of Ag3Sn, Ni3Sn4, Cu6Sn5, and Cu3Sn.

[0057] The thickness of the conductive resin layers 131c and 132c does not need to be particularly limited. However, the maximum thickness of the conductive resin layers 131c and 132c measured at the central portions of the connection portions C1 and C2 may be 10 μm or more and 100 μm or less. The maximum thickness of the conductive resin layers 131c and 132c can be measured from an image obtained by scanning cross-sections in the first and second directions cut at the center in the third direction of the main body 110 with a scanning electron microscope (SEM).

[0058] The conductive resin layers 131c and 132c can be formed, for example, by dipping the main body 110 on which the base electrode layers 131b and 132b are formed into a conductive resin composition containing metal powder, resin, binder, organic solvent, etc., and then performing a curing heat treatment at a temperature of 200°C to 300°C.

[0059] The plating layers 131d and 132d can improve the mounting characteristics. The types of the plating layers 131d and 132d are not particularly limited, and they may be plating layers including Ni, Sn, Pd, and / or alloys containing them, and may be formed of multiple layers. The plating layers 131d and 132d may be, for example, Ni plating layers or Sn plating layers, or may be in a form in which a Ni plating layer and a Sn plating layer are sequentially formed. Also, the plating layers 131d and 132d may include multiple Ni plating layers and / or multiple Sn plating layers. The plating layers 131d and 132d can be formed using an electrolytic plating method and / or an electroless plating method, etc.

[0060] In the drawings, a structure in which the multilayer electronic component 100 has two external electrodes 131 and 132 is described, but the present invention is not limited thereto, and the number, shape, etc. of the external electrodes 131 and 132 may be changed according to the form of the internal electrodes 121 and 122 and other purposes.

[0061] FIGS. 6 to 8 are cross-sectional views schematically showing a multilayer electronic component according to another embodiment of the present invention, and are diagrams corresponding to FIG. 2. Hereinafter, with reference to FIGS. 6 to 8, a multilayer electronic component 200 according to another embodiment of the present invention will be described. The same / similar reference numerals are used for the same / similar configurations as those of the multilayer electronic component 100 described in FIGS. 6 to 8, and redundant descriptions are omitted.

[0062] Referring to FIG. 6, a multilayer electronic component 200 according to an embodiment of the present invention includes a first external electrode 231 including a first glass layer 231a disposed in the first band portion B1, a first base electrode layer 231b disposed in the first connection portion C1 and contacting the first internal electrode 121, a first conductive resin layer 231c disposed on the first base electrode layer 231b, and a first plating layer 231d disposed on the first conductive resin layer 231c, and a second external electrode 232 including a second glass layer 232a disposed in the second band portion B2, a second base electrode layer 232b disposed in the second connection portion C2 and contacting the second internal electrode 122, a second conductive resin layer 232c disposed on the second base electrode layer 232b, and a second plating layer 232d disposed on the second conductive resin layer 232c.

[0063] According to an embodiment of the present invention, in the connection portions C1 and C2, the glass layers 231a and 232a can be disposed between the base electrode layers 231b and 232b and the conductive resin layers 231c and 232c. That is, in the first connection portion C1, the first glass layer 231a can be disposed between the first base electrode layer 231b and the first conductive resin layer 231c, and in the second connection portion C2, the second glass layer 232a can be disposed between the second base electrode layer 232b and the second conductive resin layer 232c.

[0064] A part of the base electrode layers 231b and 232b is disposed in the band portions B1 and B2. In the band portions B1 and B2, the base electrode layers 231b and 232b can be disposed between the main body 110 and the glass layers 231a and 232a. That is, a part of the first base electrode layer 231b is disposed in the first band portion B1, and in the first band portion B1, the first base electrode layer 231b can be disposed between the main body 110 and the first glass layer 231a. A part of the second base electrode layer 232b is disposed in the second band portion B2, and in the second band portion B2, the second base electrode layer 232b can be disposed between the main body 110 and the second glass layer 232a.

[0065] In one embodiment of the present invention, by disposing a part of the glass layers 231a and 232a in the connection portions C1 and C2, the corner portions of the main body 110 that are vulnerable to the penetration of moisture and plating solution from the outside can be effectively sealed, thereby effectively improving the reliability of the laminated electronic component 200. Further, the end portions 23a and 23b of the glass layers disposed in the connection portions C1 and C2 are disposed on the outer edge portion 110b, thereby ensuring that the bonding area between the base electrode layers 231b and 232b and the conductive resin layers 231c and 232c is equal to or greater than a predetermined level, and preventing the capacitance of the laminated electronic component 200 from decreasing.

[0066] The form of the conductive resin layers 231c and 232c does not need to be particularly limited, but the conductive resin layers 231c and 232c can cover the base electrode layers 231b and 232b in the connection portions C1 and C2.

[0067] On the other hand, the base electrode layers 231b and 232b can be formed by dipping the main body 110 in a conductive paste and then baking. The glass layers 231a and 232a can be formed by dipping the main body 110 on which the base electrode layers 231b and 232b are formed in a glass paste, then removing the glass paste applied on a part of the central portion 110a and the outer edge portion 110b, and then performing heat treatment, or can be formed by a sputtering method.

[0068] Referring to FIG. 7, a stacked electronic component 300 according to an embodiment of the present invention includes a first external electrode 331 including a first glass layer 331a disposed in the first band portion B1, a first base electrode layer 331b disposed in the first connection portion C1 and contacting the first internal electrode 121, and a first conductive resin layer 331c disposed on the first base electrode layer 331b, and a second external electrode 332 including a second glass layer 332a disposed in the second band portion B2, a second base electrode layer 332b disposed in the second connection portion C2 and contacting the second internal electrode 122, and a second conductive resin layer 332c disposed on the second base electrode layer 332b.

[0069] In the connection portions C1 and C2, the glass layers 331a and 332a can be disposed between the base electrode layers 331b and 332b and the conductive resin layers 331c and 332c. Also, a part of the base electrode layers 331b and 332b can be disposed in the band portions B1 and B2, and in the band portions B1 and B2, the base electrode layers 331b and 332b can be disposed between the main body 110 and the glass layers 331a and 332a.

[0070] The base electrode layers 331b and 332b can have regions not covered by the conductive resin layers 331c and 332c in the connection portions C1 and C2. That is, the first base electrode layer 331b can have a region not covered by the first conductive resin layer 331c in the first connection portion C1, and the second base electrode layer 332b can have a region not covered by the second conductive resin layer 332c in the second connection portion C2. The ends of the conductive resin layers 331c and 332c disposed in the connection portions C1 and C2 can be disposed on the central portion 110a or on the outer edge portion 110b.

[0071] The external electrodes 331 and 332 can include plating layers 331d and 332d that are disposed on the base electrode layers 331b and 332b at the connection portions C1 and C2 and on the conductive resin layers 331c and 332c at the band portions B1 and B2. That is, the first external electrode 331 includes a first plating layer 331d that is disposed on the first base electrode layer 331b at the first connection portion C1 and on the first conductive resin layer 331c at the first band portion B1, and the second external electrode 332 includes a second plating layer 332d that is disposed on the second base electrode layer 332b at the second connection portion C2 and on the second conductive resin layer 332c at the second band portion B2.

[0072] In one embodiment of the present invention, by disposing a part of the glass layers 331a and 332a at the connection portions C1 and C2, it is possible to effectively seal the corner portions of the main body 110 that are vulnerable to the penetration of moisture and plating solution from the outside, thereby effectively improving the reliability of the multilayer electronic component 300. Further, the end portions 33a and 33b of the glass layers disposed at the connection portions C1 and C2 are disposed on the outer edge portion 110b, thereby ensuring that the bonding area between the base electrode layers 331b and 332b and the plating layers 331d and 332d is at a predetermined level or higher, and improving the capacitance and ESR characteristics of the multilayer electronic component 300.

[0073] On the other hand, the conductive resin layers 331c and 332c can be formed by dipping the main body 110 on which the base electrode layers 331b and 332b are formed into a conductive resin composition, and then removing a part of the conductive resin composition applied to the central portions of the connection portions C1 and C2 and then performing a curing heat treatment.

[0074] Referring to FIG. 8, a stacked electronic component 400 according to an embodiment of the present invention includes a first external electrode 431 including a first glass layer 431a disposed in the first band portion B1, a first base electrode layer 431b disposed in the first connection portion C1 and contacting the first internal electrode 121, a first conductive resin layer 431c disposed on the first base electrode layer 431b, and a first plating layer 431d disposed on the first conductive resin layer 431c, and a second external electrode 432 including a second glass layer 432a disposed in the second band portion B2, a second base electrode layer 432b disposed in the second connection portion C2 and contacting the second internal electrode 122, a second conductive resin layer 432c disposed on the second base electrode layer 432b, and a second plating layer 432d disposed on the second conductive resin layer 432c.

[0075] The first glass layer 431a and the second glass layer 432a can be connected to each other on the first surface and the second surface to cover the first surface and the second surface. By the first glass layer 431a and the second glass layer 432a completely covering the first surface and the second surface, the effect of improving the moisture resistance reliability of the present invention becomes more remarkable.

[0076] In an embodiment of the present invention, since a part of the glass layers 431a and 432a is disposed in the connection portions C1 and C2, the corner portions of the main body 110, which are vulnerable to the penetration of moisture and plating solution from the outside, can be effectively sealed, thereby effectively improving the reliability of the stacked electronic component 400. However, if the glass layers 431a and 432a directly contact the internal electrodes 121 and 122, the connectivity between the internal electrodes 121 and 122 and the external electrodes 431 and 432 may deteriorate, and the capacitance of the stacked electronic component 400 may decrease. Therefore, the end portions 43a and 43b of the glass layers disposed in the connection portions C1 and C2 are preferably disposed on the outer edge portion 110b.

[0077] On the other hand, the glass layers 431a and 432a can be formed by applying a glass paste on the first and second surfaces of the main body 110 and then performing heat treatment, or by using a sputtering method. The base electrode layers 431b and 432b can be formed by dipping the main body 110 on which the glass layers 431a and 432a are formed into a conductive paste and then baking it.

[0078] The present invention is not limited by the above-described embodiments and the accompanying drawings, but is limited by the appended claims. Therefore, various substitutions, modifications, and changes can be made by those having ordinary knowledge in the technical field without departing from the technical idea of the present invention described in the claims, and these also belong to the scope of the present invention.

[0079] Note that the expression "one embodiment" does not mean the same embodiment, but is provided to emphasize and explain different unique features. However, the above-described one embodiment does not exclude being realized in combination with the features of another one embodiment. For example, matters described in a specific one embodiment can be understood as explanations related to another one embodiment as long as there is no explanation in the other one embodiment that is contrary to or inconsistent with those matters.

[0080] In addition, expressions such as first and second are used to distinguish one component from another component, and do not limit the order and / or importance of the components. In some cases, within the scope not departing from the scope of rights, the first component can be named the second component, and similarly, the second component can be named the first component.

Explanation of Reference Numerals

[0081] 100, 200, 300, 400 Multilayer Electronic Components 110 Main Body 110a Central Portion 110b Outer Edge Portion 111 Dielectric Layer 112 and 113 Cover parts 121 and 122 Internal electrodes 114 and 115 Margin parts 131, 132, 231, 232, 331, 332, 431, 432 External electrodes 131a, 132a, 231a, 232a, 331a, 332a, 431a, 432a Glass layers 131b, 132b, 231b, 232b, 331b, 332b, 431b, 432b Base electrode layers 131c, 132c, 231c, 232c, 331c, 332c, 431c, 432c Conductive resin layers 131d, 132d, 231d, 232d, 331d, 332d, 431d, 432d Plating layers

Claims

1. a main body including a first surface and a second surface facing a first direction, a third surface and a fourth surface connected to the first surface and the second surface facing a second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface facing a third direction, the main body including a central portion including a dielectric layer and internal electrodes alternately disposed with the dielectric layer in the first direction, and an outer edge portion covering both sides of the central portion in the first direction and both sides in the third direction; an external electrode including a connection portion disposed on the third surface or the fourth surface, and a band portion extending from the connection portion onto a portion of the first surface and a portion of the second surface, the external electrode includes a glass layer disposed on the band portion, a base electrode layer disposed on the connection portion and in contact with the internal electrode, and a conductive resin layer disposed on the base electrode layer, A laminated electronic component, wherein a portion of the glass layer is disposed in the connection portion, and an end portion of the glass layer disposed in the connection portion is disposed on the outer edge portion.

2. The multilayer electronic component according to claim 1 , wherein the glass layer contacts at least a portion of the first surface and the second surface.

3. 2. The multilayer electronic component according to claim 1, wherein an end portion of said glass layer disposed on said band portion is exposed from said conductive resin layer.

4. the glass layer contacts a portion of the third surface or the fourth surface; 2. The multilayer electronic component according to claim 1, wherein a portion of the base electrode layer is disposed in the band portion, and in the band portion, the base electrode layer is disposed between the glass layer and the conductive resin layer.

5. In the connection portion, the glass layer is disposed between the basic electrode layer and the conductive resin layer, The multilayer electronic component according to claim 1 , wherein a portion of the base electrode layer is disposed in the band portion, and in the band portion, the base electrode layer is disposed between the main body and the glass layer.

6. The multilayer electronic component according to claim 5 , wherein the conductive resin layer covers the base electrode layer in the connection portion.

7. 6. The multilayer electronic component according to claim 5, wherein the base electrode layer has an area in the connection portion that is not covered by the conductive resin layer.

8. 8. The multilayer electronic component according to claim 7, wherein the external electrodes further include a plating layer disposed on the base electrode layer in the connection portion and on the conductive resin layer in the band portion.

9. the external electrode includes a first external electrode including a first connection portion disposed on the third surface and a first band portion extending from the first connection portion to the first surface and a portion of the second surface, and a second external electrode including a second connection portion disposed on the fourth surface and a second band portion extending from the second connection portion to the first surface and a portion of the second surface, the first external electrode includes a first glass layer disposed on the first band portion, a first base electrode layer disposed on the first connection portion, and a first conductive resin layer disposed on the first base electrode layer, the second external electrode includes a second glass layer disposed on the second band portion, a second base electrode layer disposed on the second connection portion, and a second conductive resin layer disposed on the second base electrode layer, The multilayer electronic component according to claim 1 , wherein the first glass layer and the second glass layer are spaced apart from each other.

10. the external electrode includes a first external electrode including a first connection portion disposed on the third surface and a first band portion extending from the first connection portion to the first surface and a portion of the second surface, and a second external electrode including a second connection portion disposed on the fourth surface and a second band portion extending from the second connection portion to the first surface and a portion of the second surface, the first external electrode includes a first glass layer disposed on the first band portion, a first base electrode layer disposed on the first connection portion, and a first conductive resin layer disposed on the first base electrode layer, the second external electrode includes a second glass layer disposed on the second band portion, a second base electrode layer disposed on the second connection portion, and a second conductive resin layer disposed on the second base electrode layer, The multilayer electronic component according to claim 1 , wherein the first glass layer and the second glass layer are connected to each other on the first surface and the second surface to cover the first surface and the second surface.

11. The glass layer includes a first glass, the base electrode layer comprises a metal and a second glass; The multilayer electronic component according to claim 1 , wherein the first glass has a different composition from the second glass.

12. 2. The laminated electronic component of claim 1, wherein the glass layers contain one or more of Ba, Ca, Zn, Al, B, Si, and Fe.

13. The multilayer electronic component according to claim 1 , wherein the glass layer contains Fe.

14. The first glass contains Fe, The multilayer electronic component according to claim 11 , wherein the second glass does not contain Fe.

15. The first glass and the second glass each contain Fe, 12. The multilayer electronic component according to claim 11, wherein a content (at %) of Fe in a total content of elements constituting the first glass is higher than a content (at %) of Fe in a total content of elements constituting the second glass.

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