Substrate processing apparatus and substrate processing method

Abstract

To provide a substrate processing apparatus capable of determining shape abnormalities of a wafer.SOLUTION: A substrate processing apparatus includes a shape detection module that detects signals according to the surface shape of a substrate and a controller that determines shape abnormalities of the substrate.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus and a substrate processing method.

Background Art

[0002] A substrate processing apparatus for processing a substrate such as a wafer is known. In such a substrate processing apparatus, the wafer is transported to various processing modules and processed in each processing module.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Patent Document 3

Summary of the Invention

Problems to be Solved by the Invention

[0004] The wafer may have shape abnormalities such as chipping or deformation (e.g., warping, distortion) on its surface. When the wafer is processed in each processing module, shape abnormalities may occur on the surface of the wafer.

[0005] When transporting a wafer having such shape abnormalities, the transfer robot may not be able to properly transport the wafer, and there is a risk of a wafer transfer error occurring. When processing a wafer having shape abnormalities in a processing module, there is a risk of the wafer being damaged due to the shape abnormalities of the wafer. When such problems occur, the substrate processing apparatus must be temporarily stopped, and as a result, the throughput of the wafer is significantly reduced.

[0006] Therefore, an object of the present invention is to provide a substrate processing apparatus and a substrate processing method capable of determining an abnormal shape of a wafer.

Means for Solving the Problems

[0007] In one aspect, there is provided a substrate processing apparatus including a processing module that processes a substrate, a transfer robot that transfers the substrate to the processing module, a shape detection module that detects a signal corresponding to the surface shape of the substrate held by the transfer robot, and a control device that determines an abnormal shape of the substrate based on the signal detected by the shape detection module. The shape detection module is connected to the transfer robot and is configured to detect the signal above the transfer robot.

[0008] In one aspect, the shape detection module includes a detection sensor disposed above the substrate held by the transfer robot, and a sensor movement actuator that moves the detection sensor along a movement locus on the surface of the substrate. In one aspect, the transfer robot is configured to rotate the substrate, and the shape detection module includes a fixed sensor disposed above a peripheral portion of the substrate held by the transfer robot, a movable sensor movable in a direction parallel to the substrate held by the transfer robot, and a sensor movement actuator that reciprocates the movable sensor from the peripheral portion to the center of the substrate. In one aspect, the shape detection module is configured to detect the signal when the transfer robot is transferring the substrate.

[0009] In one aspect, when the shape detection module is defined as a first shape detection module and the transfer robot is defined as a first transfer robot, the first transfer robot is configured to transfer the substrate to the polishing module, and the substrate processing apparatus includes a second transfer robot configured to transfer the substrate polished by the polishing module to the cleaning module, and a second shape detection module connected to the second transfer robot and configured to detect a signal corresponding to the surface shape of the substrate held by the second transfer robot.

[0010] In one aspect, the first shape detection module and the second shape detection module are configured to detect the shape of the same surface of the substrate. In one aspect, the substrate processing apparatus includes a fluid injection device disposed in a transfer path of the substrate between the polishing module and the cleaning module, and the fluid injection device includes a fluid injection nozzle configured to spray compressed fluid onto a surface of the substrate that is a detection target of the second shape detection module. In one aspect, the control device obtains shape information of the substrate to be determined for shape abnormality based on the signal obtained from the shape detection module, compares the obtained shape information with a predetermined determination criterion, and determines the shape abnormality. In one aspect, the control device creates a normal distribution from a plurality of values calculated based on a plurality of signals previously obtained from the shape detection module, and determines a range of ±Xσ from the average value of the normal distribution as the determination criterion.

[0011] In one aspect, there is provided a substrate processing method in which a signal corresponding to the surface shape of a substrate held by a transfer robot is detected above the transfer robot by a shape detection module connected to the transfer robot that transfers the substrate to a processing module, and a shape abnormality of the substrate is determined based on the signal detected by the shape detection module.

[0012] In one aspect, the shape detection module includes a detection sensor and a sensor moving actuator for moving the detection sensor, and the detection sensor disposed above the substrate held by the transfer robot is moved along a movement locus on the surface of the substrate by the sensor moving actuator. In one aspect, the shape detection module includes a fixed sensor and a movable sensor, and a sensor moving actuator for reciprocally moving the movable sensor from the peripheral portion of the substrate to the center of the substrate. With the substrate rotated by the transfer robot, the sensor moving actuator reciprocally moves the movable sensor from the peripheral portion to the center. In one aspect, when the transfer robot is transporting the substrate, the shape detection module detects the signal.

[0013] In one aspect, when the shape detection module is defined as a first shape detection module and the transfer robot is defined as a first transfer robot, the first transfer robot transports the substrate to a polishing module, and a second transfer robot transports the substrate polished by the polishing module to a cleaning module. A second shape detection module connected to the second transfer robot detects a signal corresponding to the surface shape of the substrate held by the second transfer robot. In one aspect, the first shape detection module and the second shape detection module detect the shape of the same surface of the substrate. In one aspect, a fluid injection device disposed in the transport path of the substrate between the polishing module and the cleaning module sprays compressed fluid onto the surface of the substrate that is the detection target of the second shape detection module. In one aspect, based on the signal obtained from the shape detection module, shape information of the substrate to be determined for shape abnormality is obtained, and the obtained shape information is compared with a predetermined determination criterion to determine the shape abnormality. In one aspect, a normal distribution is created from a plurality of values calculated based on a plurality of signals acquired in the past from the shape detection module, and a range of ±Xσ from the average value of the normal distribution is determined as the determination criterion.

Advantages of the Invention

[0014] The shape detection module detects a signal corresponding to the shape of the substrate, and the control device determines the shape abnormality of the substrate based on this signal. Therefore, the substrate processing apparatus can improve the throughput of the wafer as a result without temporarily stopping due to problems such as conveyance errors of the substrate.

Brief Description of the Drawings

[0015]

Figure 1

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Embodiments for Carrying Out the Invention

[0016] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings described below, the same or corresponding components are denoted by the same reference numerals, and redundant descriptions are omitted. In the following plurality of embodiments, the configuration of one embodiment not particularly described is the same as that of other embodiments, so the redundant descriptions thereof are omitted.

[0017] FIG. 1 is a plan view showing an embodiment of a substrate processing apparatus. As shown in FIG. 1, the substrate processing apparatus includes a rectangular housing 1. The inside of the housing 1 is partitioned by partition walls 1a and 1b into a load / unload unit 2, a polishing unit 3, and a cleaning unit 4.

[0018] The load / unload unit 2, the polishing unit 3, and the cleaning unit 4 are each independently assembled and independently evacuated. The substrate processing apparatus includes a control device 5 that controls substrate processing operations. The load / unload unit 2 includes two or more (four in this embodiment) front load units 20 on which wafer cassettes (substrates) storing a large number of wafers are placed.

[0019] The front load unit 20 is disposed adjacent to the housing 1 and is arranged along the width direction (a direction perpendicular to the longitudinal direction) of the substrate processing apparatus. An open cassette, a SMIF (Standard Manufacturing Interface) pod, or a FOUP (Front Opening Unified Pod) can be mounted on the front load unit 20. SMIF and FOUP are sealed containers that can store a wafer cassette inside and maintain an environment independent of the external space by covering it with a partition wall.

[0020] In the load / unload unit 2, a traveling mechanism 21 is laid along the arrangement direction of the front load unit 20, and two transfer robots (loaders) 22 that can move along the arrangement direction of the wafer cassette are installed on the traveling mechanism 21. The transfer robot 22 can access the wafer cassette mounted on the front load unit 20 by moving on the traveling mechanism 21.

[0021] The polishing unit 3 is an area where wafer polishing (planarization) is performed, and includes a first polishing module 3A, a second polishing module 3B, a third polishing module 3C, and a fourth polishing module 3D. The first polishing module 3A, the second polishing module 3B, the third polishing module 3C, and the fourth polishing module 3D are arranged along the longitudinal direction of the substrate processing apparatus as shown in FIG. 1.

[0022] As shown in FIG. 1, the first polishing module 3A includes a polishing table 30A to which a polishing pad 10 having a polishing surface is attached, a top ring 31A for holding the wafer and polishing it while pressing the wafer against the polishing pad 10 on the polishing table 30A, a polishing liquid supply nozzle 32A for supplying a polishing liquid or a dressing liquid (for example, pure water) to the polishing pad 10, a dresser 33A for dressing the polishing surface of the polishing pad 10, and an atomizer 34A for spraying a mixed fluid of a liquid (for example, pure water) and a gas (for example, nitrogen gas) or a liquid (for example, pure water) in a mist form onto the polishing surface.

[0023] Similarly, the second polishing module 3B includes a polishing table 30B to which the polishing pad 10 is attached, a top ring 31B, a polishing liquid supply nozzle 32B, a dresser 33B, and an atomizer 34B. The third polishing module 3C includes a polishing table 30C to which the polishing pad 10 is attached, a top ring 31C, a polishing liquid supply nozzle 32C, a dresser 33C, and an atomizer 34C. The fourth polishing module 3D includes a polishing table 30D to which the polishing pad 10 is attached, a top ring 31D, a polishing liquid supply nozzle 32D, a dresser 33D, and an atomizer 34D.

[0024] A transport mechanism for transporting wafers will be described. As shown in FIG. 1, the substrate processing apparatus includes a first linear transporter 6 disposed adjacent to the first polishing module 3A and the second polishing module 3B. The first linear transporter 6 is a mechanism for transporting wafers between four transport positions (first transport position TP1, second transport position TP2, third transport position TP3, fourth transport position TP4) along the arrangement direction of the polishing modules 3A and 3B.

[0025] The substrate processing apparatus includes a second linear transporter 7 disposed adjacent to the third polishing module 3C and the fourth polishing module 3D. The second linear transporter 7 is a mechanism for transporting wafers between three transport positions (fifth transport position TP5, sixth transport position TP6, seventh transport position TP7) along the arrangement direction of the polishing modules 3C and 3D.

[0026] The wafer is transported to the polishing modules 3A and 3B by the first linear transporter 6. The top ring 31A of the first polishing module 3A moves between the polishing position and the second transport position TP2 by its swinging operation. Therefore, the transfer of the wafer to the top ring 31A is performed at the second transport position TP2.

[0027] Similarly, the top ring 31B of the second polishing module 3B moves between the polishing position and the third transport position TP3, and the transfer of the wafer to the top ring 31B is performed at the third transport position TP3. The top ring 31C of the third polishing module 3C moves between the polishing position and the sixth transport position TP6, and the transfer of the wafer to the top ring 31C is performed at the sixth transport position TP6. The top ring 31D of the fourth polishing module 3D moves between the polishing position and the seventh transport position TP7, and the transfer of the wafer to the top ring 31D is performed at the seventh transport position TP7.

[0028] At the first transfer position TP1, a lifter 11 for receiving a wafer from the transfer robot 22 is arranged. The wafer is passed from the transfer robot 22 to the first linear transporter 6 via the lifter 11.

[0029] The substrate processing apparatus includes a shutter (not shown) provided in the partition wall 1a. The shutter is arranged between the lifter 11 and the transfer robot 22. When transferring the wafer, the shutter is opened and the wafer is passed from the transfer robot 22 to the lifter 11. A swing transporter 12 is arranged between the first linear transporter 6, the second linear transporter 7, and the cleaning unit 4.

[0030] The swing transporter 12 has a hand movable between the fourth transfer position TP4 and the fifth transfer position TP5. The transfer of the wafer from the first linear transporter 6 to the second linear transporter 7 is performed by the swing transporter 12. The wafer is transported to the third polishing module 3C and / or the fourth polishing module 3D by the second linear transporter 7. The wafer polished in the polishing unit 3 is transported to the cleaning unit 4 via the swing transporter 12.

[0031] Fig. 2(a) is a plan view showing the cleaning unit, and Fig. 2(b) is a side view showing the cleaning unit. As shown in Fig. 2(a) and Fig. 2(b), the cleaning unit 4 is partitioned into a first cleaning chamber 190, a first transfer chamber 191, a second cleaning chamber 192, a second transfer chamber 193, and a drying chamber 194. In the first cleaning chamber 190, an upper primary cleaning module 201A and a lower primary cleaning module 201B arranged along the vertical direction are arranged.

[0032] The upper primary cleaning module 201A is disposed above the lower primary cleaning module 201B. Similarly, in the second cleaning chamber 192, an upper secondary cleaning module 202A and a lower secondary cleaning module 202B arranged along the vertical direction are disposed. The upper secondary cleaning module 202A is disposed above the lower secondary cleaning module 202B. The primary and secondary cleaning modules 201A, 201B, 202A, and 202B are cleaning machines that clean the wafer using a cleaning liquid.

[0033] A temporary placement table 203 for the wafer is provided between the upper secondary cleaning module 202A and the lower secondary cleaning module 202B. In the drying chamber 194, an upper drying module 205A and a lower drying module 205B arranged along the vertical direction are disposed. The upper drying module 205A and the lower drying module 205B are isolated from each other.

[0034] Filter fan devices 207, 207 for supplying clean air into the drying modules 205A, 205B are provided above the upper drying module 205A and the lower drying module 205B, respectively.

[0035] In the first transfer chamber 191, a first transfer robot 209 capable of moving up and down is disposed, and in the second transfer chamber 193, a second transfer robot 210 capable of moving up and down is disposed. The first transfer robot 209 and the second transfer robot 210 are respectively movably supported by support shafts 211, 212 extending in the vertical direction.

[0036] The first transfer robot 209 and the second transfer robot 210 are movable up and down along the support shafts 211, 212. The first transfer robot 209 is disposed at a position accessible to the temporary placement table 180 as shown by the dotted line in Fig. 2(a). When the first transfer robot 209 accesses the temporary placement table 180, a shutter 610 (to be described in detail later) provided in the partition wall 1b is opened.

[0037] The first transfer robot 209 operates to transfer the wafer W among the temporary placement table 180, the upper primary cleaning module 201A, the lower primary cleaning module 201B, the temporary placement table 203, the upper secondary cleaning module 202A, and the lower secondary cleaning module 202B.

[0038] The second transfer robot 210 operates to transfer the wafer W among the upper secondary cleaning module 202A, the lower secondary cleaning module 202B, the temporary placement table 203, the upper drying module 205A, and the lower drying module 205B.

[0039] The transfer robot 22 shown in FIG. 1 takes out the wafer W from the upper drying module 205A or the lower drying module 205B and returns the wafer W to the wafer cassette. When the transfer robot 22 accesses the drying modules 205A and 205B, a shutter (not shown) provided in the partition wall 1a is opened. In this way, the wafer W is transferred through the load / unload section 2, the polishing section 3, and the cleaning section 4 in this order.

[0040] The wafer W may have shape abnormalities such as chipping or deformation (e.g., warping, distortion) on its surface. In this case, when transferring the wafer W having shape abnormalities from the front load section 20 to the polishing section 3, the transfer robot 22 may not be able to transfer the wafer W appropriately, and there is a risk of a transfer error of the wafer W.

[0041] By processing the wafer W in each processing module (in this embodiment, the polishing modules 3A to 3D of the polishing section 3, the cleaning modules 201A, 201B, 202A, 202B of the cleaning section 4, etc.), there is a risk of shape abnormalities occurring on the surface of the wafer W. Even in this case, the first transfer robot 209 may not be able to transfer the wafer W appropriately, and there is a risk of a transfer error of the wafer W. Such a transfer error of the wafer W causes a decrease in the throughput of the wafer W.

[0042] Therefore, the substrate processing apparatus includes a shape detection module for determining the shape abnormality of the wafer W held by the transfer robot. Hereinafter, the configuration of the shape detection module will be described with reference to the drawings.

[0043] FIG. 3 is a perspective view showing an embodiment of the shape detection module. In the embodiment shown in FIG. 3, the shape detection module 400 is connected to the transfer robot 22. The shape detection module 400 is configured to detect a signal corresponding to the shape (surface shape) of the wafer W held by the robot hand 420 of the transfer robot 22. The control device 5 is configured to determine the presence or absence of a shape abnormality of the wafer W based on the signal detected by the shape detection module 400.

[0044] As shown in FIG. 3, the control device 5 includes a storage device 5a in which a program is stored, and an arithmetic device 5b that executes arithmetic operations according to instructions included in the program. The storage device 5a includes a main storage device such as a RAM, and an auxiliary storage device such as a hard disk drive (HDD) and a solid state drive (SSD). Examples of the arithmetic device 5b include a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit).

[0045] As shown in FIG. 3, the shape detection module 400 connected to the transfer robot 22 is configured to detect a signal corresponding to the shape of the wafer W above the robot hand 420 of the transfer robot 22. The shape detection module 400 includes a detection sensor 401 disposed above the wafer W on the robot hand 420, and a sensor moving actuator 402 that moves the detection sensor 401.

[0046] The wafer W has a first surface W1 and a second surface W2 disposed on the opposite side of the first surface W1. The first surface W1 is, for example, the surface to be polished of the wafer W. In this case, the second surface W2 is the back surface of the wafer W.

[0047] In this embodiment, the detection sensor 401 faces the first surface W1. However, in one embodiment, the detection sensor 401 may face the second surface W2. Hereinafter, in this specification, the first surface W1 and the second surface W2 may be referred to as the surface without particular limitation.

[0048] In this embodiment, the detection sensor 401 is an optical sensor (for example, a laser displacement meter) that guides light to the surface of the wafer W and detects the reflected light from the wafer W. In this case, the detection sensor 401 detects a signal corresponding to the distance between the detection sensor 401 and the surface of the wafer W.

[0049] The control device 5 is electrically connected to the shape detection module 400. Therefore, the control device 5 connected to the detection sensor 401 is configured to acquire the signal detected by the detection sensor 401 and determine the presence or absence of a shape abnormality of the wafer W based on the acquired signal.

[0050] The sensor movement actuator 402 is configured to move the detection sensor 401 in a direction parallel to the surface of the wafer W held by the robot hand 420. Here, the direction parallel to the surface of the wafer W is the X-axis direction and the Y-axis direction that are orthogonal to each other. The direction perpendicular to the surface of the wafer W is the Z-axis direction.

[0051] The sensor movement actuator 402 includes a first translation actuator 410 and a second translation actuator 411 that move the detection sensor 401 in a direction parallel to the surface of the wafer W.

[0052] In this embodiment, the first translation actuator 410 is configured to move the detection sensor 401 in the X-axis direction. The second translation actuator 411 is configured to move the detection sensor 401 in the Y-axis direction.

[0053] Hereinafter, in this specification, the first translation actuator 410 may be referred to as the X-axis actuator 410, and the second translation actuator 411 may be referred to as the Y-axis actuator 411.

[0054] In this embodiment, each of the X-axis actuator 410 and the Y-axis actuator 411 has a linear guide structure. More specifically, the X-axis actuator 410 includes a moving body 410a movable in the X-axis direction and a guide rail 410b that guides the movement of the moving body 410a in the X-axis direction.

[0055] The detection sensor 401 is attached to the moving body 410a. Therefore, when the moving body 410a moves in the X-axis direction along the guide rail 410b, the detection sensor 401 attached to the moving body 410a moves in the X-axis direction together with the moving body 410a.

[0056] The Y-axis actuator 411 has the same configuration as the X-axis actuator 410. More specifically, the Y-axis actuator 411 includes a moving body 411a movable in the Y-axis direction and a guide rail 411b that guides the movement of the moving body 411a in the Y-axis direction.

[0057] The X-axis actuator 410 (and the detection sensor 401) is attached to the moving body 411a. Therefore, when the moving body 411a moves in the Y-axis direction along the guide rail 411b, the X-axis actuator 410 attached to the moving body 411a moves in the Y-axis direction together with the moving body 411a. The detection sensor 401 attached to the moving body 410a of the X-axis actuator 410 moves in the Y-axis direction together with the moving body 411a.

[0058] The shape detection module 400 includes a sensor moving actuator 402 and a connecting member 430 that connects the conveying robot 22. The connecting member 430 extends in the Z-axis direction and is connected to the Y-axis actuator 411 (more specifically, the guide rail 411b). The sensor moving actuator 402 connected to the connecting member 430 disposes the detection sensor 401 above the surface of the wafer W.

[0059] As shown in FIG. 3, the sensor moving actuator 402 includes a vertical moving actuator 412 that moves the detection sensor 401 in the Z-axis direction. Hereinafter, in this specification, the vertical moving actuator 412 may be referred to as a Z-axis actuator (elevating actuator) 412.

[0060] Although the detailed structure of the Z-axis actuator 412 will not be described, examples of the Z-axis actuator 412 include an air cylinder and a ball screw mechanism (a combination of a servo motor and a ball screw).

[0061] In the present embodiment, the Z-axis actuator 412 is movably supported in the Y-axis direction via a moving body 411a on a guide rail 411b of the Y-axis actuator 411. The X-axis actuator 410 and the detection sensor 401 are attached to the Z-axis actuator 412. Therefore, when the Z-axis actuator 412 operates, the detection sensor 401 moves in a direction approaching or separating from the surface of the wafer W together with the X-axis actuator 410.

[0062] In this way, the control device 5 can move the detection sensor 401 in the X-axis direction, Y-axis direction, and Z-axis direction by operating the sensor moving actuator 402 (that is, the parallel moving actuators 410 and 411 and the vertical moving actuator 412).

[0063] When the transfer robot 22 accesses the wafer W in the wafer cassette and / or when the transfer robot 22 accesses the lifter 11, the detection sensor 401 may come into contact with the wafer W. Therefore, the control device 5 operates the Z-axis actuator 412 to move the detection sensor 401 to a predetermined retracted position when the transfer robot 22 transfers the wafer W. The retracted position is a position where the detection sensor 401 is separated from the robot hand 420 in the Z-axis direction. With such a configuration, the transfer robot 22 can prevent the detection sensor 401 from contacting the wafer W when transferring the wafer W.

[0064] FIG. 4 is a diagram showing the movement locus of the detection sensor. As shown in FIG. 4, the sensor movement actuator 402 is configured to move the detection sensor 401 along a spiral movement locus (i.e., a detection locus) on the surface of the wafer W (the first surface W1 in FIG. 4). In other words, the control device 5 moves the detection sensor 401 along the spiral movement locus by operating the X-axis actuator 410 and the Y-axis actuator 411. Data corresponding to the movement locus of the detection sensor 401 is stored in the storage device 5a.

[0065] The detection sensor 401 moves spirally from the peripheral portion PP of the wafer W toward the center CP of the wafer W along a predetermined movement locus, and continuously detects a signal corresponding to the distance between the detection sensor 401 and the surface of the wafer W. In this way, by moving the detection sensor 401 in a direction parallel to the surface of the wafer W, the detection sensor 401 detects a signal corresponding to the shape of the entire surface of the wafer W.

[0066] In one embodiment, the sensor movement actuator 402 may move the detection sensor 401 spirally from the center CP toward the peripheral portion PP. In one embodiment, as long as the detection sensor 401 can detect a signal corresponding to the shape of the entire surface of the wafer W, the sensor movement actuator 402 does not necessarily have to move the detection sensor 401 spirally.

[0067] After the detection sensor 401 detects a signal corresponding to the shape of the wafer W, the signal is output to the control device 5. The control device 5 receives the signal detected by the detection sensor 401, and based on the signal, acquires (measures) the shape information of the wafer W that is the object of determination of the shape abnormality of the wafer W. Then, the control device 5 compares the acquired shape information with a predetermined determination criterion to determine whether there is a shape abnormality in the wafer W.

[0068] FIG. 5 is a diagram showing a flow for determining the shape abnormality of a wafer by a control device. As shown in step S101 of FIG. 5, first, the control device 5 causes the transfer robot 22 to access the wafer W in the front load unit 20 and holds the wafer W on the robot hand 420. At this time, the control device 5 operates the Z-axis actuator 412 to raise the detection sensor 401 to a predetermined retracted position so that the detection sensor 401 does not contact the wafer W.

[0069] Thereafter, the control device 5 operates the Z-axis actuator 412 to lower the detection sensor 401 to a predetermined detection position. The detection position is a position where the detection sensor 401 is close to the wafer W on the robot hand 420.

[0070] After the control device 5 moves the detection sensor 401 to the detection position, the control device 5 operates the X-axis actuator 410 and the Y-axis actuator 411 to move the detection sensor 401 along a predetermined movement locus. The detection sensor 401 moving along the movement locus detects a signal corresponding to the shape of the wafer W. After the detection sensor 401 detects a signal, the control device 5 operates the Z-axis actuator 412 to move the detection sensor 401 to the predetermined retracted position again.

[0071] In one embodiment, the control device 5 may cause the detection sensor 401 to perform a signal detection operation when the transfer robot 22 is transporting the wafer W from a predetermined receiving position (in this embodiment, the front load unit 20) to a predetermined delivery position (in this embodiment, the lifter 11).

[0072] With such a configuration, the control device 5 can improve the throughput of the wafer W. If the shape detection module 400 is arranged at a location different from the transfer robot 22, the control device 5 has to specially transport the transfer robot 22 holding the wafer W to the location where the shape detection module 400 is arranged, which results in a waste of time.

[0073] In this embodiment, the shape detection module 400 is connected to the transfer robot 22. Therefore, when the transfer robot 22 is transferring the wafer W, the detection sensor 401 can detect a signal corresponding to the shape of the wafer W. Thus, in this embodiment, since the substrate processing apparatus can perform the transfer operation and the signal detection operation of the wafer W simultaneously, the throughput of the wafer W can be improved.

[0074] After step S101 in FIG. 5, the control device 5 acquires the shape information of the wafer W based on the signal detected by the detection sensor 401 (see step S102), and determines whether there is a shape abnormality in the wafer W (see step S103).

[0075] As an example of the shape abnormality of the wafer W, chipping of the peripheral portion PP of the wafer W or deformation of the surface of the wafer W can be cited. For example, the control device 5 can determine whether there is chipping in the peripheral portion PP of the wafer W based on the detection signal at the peripheral portion PP of the wafer W.

[0076] When chipping has occurred in the peripheral portion PP of the wafer W, even if the detection sensor 401 guides light to the entire circumference of the peripheral portion PP, it does not detect the reflected light at the chipped portion. In other words, the detection sensor 401 detects different signals over the entire circumference of the peripheral portion PP. Therefore, the control device 5 can determine the chipping in the peripheral portion PP of the wafer W based on the signal detected by the detection sensor 401.

[0077] When deformation has occurred in the wafer W, the detection sensor 401 moving along the movement locus detects signals of different magnitudes in the region between the peripheral portion PP and the center CP. Therefore, the control device 5 can determine the deformation of the wafer W based on the signal detected by the detection sensor 401.

[0078] The storage device 5a stores data indicating the determination criteria that are the comparison targets with the shape information of the wafer W. The control device 5 compares the acquired shape information of the wafer W with the predetermined determination criteria to determine the shape abnormality of the wafer W.

[0079] For example, as shape information of the wafer W, the control device 5 determines whether a value calculated based on a signal detected by the detection sensor 401 exceeds a threshold value as a determination criterion. This calculated value is a numerical value (displacement amount) indicating the difference in the distance between the detection sensor 401 and the surface of the wafer W in the region between the peripheral portion PP and the center CP.

[0080] In one embodiment, before processing the wafer W to be processed, the control device 5 calculates a plurality of displacement amounts (numerical values) based on a plurality of signals acquired in the past from the detection sensor 401. The control device 5 may create a normal distribution from the calculated plurality of values and determine a range of ±Xσ (standard deviation) from the average value of the normal distribution as a determination criterion. Here, "X" indicates a predetermined coefficient. For example, the control device 5 may determine a range of ±3σ (standard deviation) from the average value of the normal distribution as a determination criterion (i.e., an allowable range).

[0081] The control device 5 compares the shape information of the wafer W with a predetermined determination criterion. When it is determined that no abnormality has occurred in the shape of the wafer W (see "NO" in step S103), the control device 5 transports the wafer W to the polishing unit 3 by the transfer robot 22 (see step S104).

[0082] On the other hand, when the control device 5 determines that an abnormality has occurred in the shape of the wafer W (see "YES" in step S103), the control device 5 returns the wafer W to the front load unit 20 by the transfer robot 22 (step S105). Since the plurality of wafers W in the front load unit 20 are tagged, the transfer robot 22 will not receive the wafer W having a shape abnormality again.

[0083] According to the present embodiment, by connecting the shape detection module 400 to the transfer robot 22, the control device 5 can determine the shape abnormality of the wafer W immediately after transferring the wafer W to the load / unload unit 2 of the substrate processing apparatus. Therefore, the substrate processing apparatus can minimize the risk of transferring the wafer W having a shape abnormality to the processing module.

[0084] When the control device 5 determines the shape abnormality of the wafer W, the control device 5 may store data regarding the shape abnormality in the storage device 5a as information for determining the determination criteria. By accumulating such data, the control device 5 can more accurately determine the determination criteria based on the accumulated data.

[0085] The wafer W transferred to the polishing unit 3 by the transfer robot 22 is polished by any one of the polishing modules 3A to 3D of the polishing unit 3 (see FIG. 1), and then transferred to the cleaning unit 4 by the first transfer robot 209. When the wafer W is polished, a shape abnormality may occur in the wafer W.

[0086] Therefore, the substrate processing apparatus includes a shape detection module for determining the shape abnormality of the wafer W held by the first transfer robot 209. Hereinafter, in this specification, the first transfer robot 209 may be simply referred to as the transfer robot 209.

[0087] FIG. 6 is a perspective view showing a shape detection module connected to a transfer robot. FIG. 7 is a plan view of FIG. 6. In the embodiment shown in FIGS. 6 and 7, the substrate processing apparatus includes a shape detection module 500 connected to the transfer robot 209.

[0088] The shape detection module 500 includes a fixed sensor 501A disposed above the peripheral portion PP of the wafer W held by the robot hand 520 of the transfer robot 209, a movable sensor 501B movable in a direction (X-axis direction or Y-axis direction) parallel to the wafer W held by the transfer robot 209, and a sensor movement actuator 502 that reciprocates the movable sensor 501B from the peripheral portion PP to the center CP.

[0089] The fixed sensor 501A and the movable sensor 501B are arranged adjacent to each other at positions above the surface of the wafer W. In the present embodiment, the fixed sensor 501A and the movable sensor 501B have the same structure. For example, each of the fixed sensor 501A and the movable sensor 501B is an optical sensor (e.g., a laser displacement meter) that guides light to the surface of the wafer W and detects the reflected light from the wafer W.

[0090] In the embodiment shown in FIG. 7, the fixed sensor 501A and the movable sensor 501B are arranged close to each other in the vicinity of the peripheral portion PP. In one embodiment, the movable sensor 501B may be arranged at a distance from the fixed sensor 501A. In this case, the movable sensor 501B is configured to be movable to the outermost periphery (including the peripheral portion PP) of the wafer W without contacting the fixed sensor 501A.

[0091] The sensor movement actuator 502 includes a translational actuator 510 that moves the movable sensor 501B in a direction parallel to the surface of the wafer W, and a vertical movement actuator (i.e., a Z-axis actuator) 512 that moves the fixed sensor 501A and the movable sensor 501B in the Z-axis direction together with the translational actuator 510.

[0092] In this embodiment, the horizontal movement actuator 510 has a linear guide structure and is configured to move the movable sensor 501B in the X-axis direction. Therefore, hereinafter, in this specification, the horizontal movement actuator 510 may be referred to as the X-axis actuator 510. In one embodiment, the horizontal movement actuator 510 may be configured to move the movable sensor 501B in the Y-axis direction.

[0093] The Z-axis actuator 512 has the same structure as the Z-axis actuator 412. Examples of the Z-axis actuator 512 include an air cylinder and a ball screw mechanism (a combination of a servo motor and a ball screw).

[0094] The X-axis actuator 510 includes a moving body 510a movable in the X-axis direction (i.e., a direction parallel to the surface of the wafer W) and a guide rail 510b that guides the movement of the moving body 510a in the X-axis direction.

[0095] The movable sensor 501B is attached to the moving body 510a. Therefore, when the moving body 510a moves in the X-axis direction along the guide rail 510b, the movable sensor 501B attached to the moving body 510a moves in the X-axis direction together with the moving body 510a.

[0096] The shape detection module 500 includes a connecting member 530 that connects the sensor movement actuator 502 and the transfer robot 209. The connecting member 530 extends in the Z-axis direction, similar to the connecting member 430, and is connected to the Z-axis actuator 512. The sensor movement actuator 502 connected to the connecting member 530 can arrange the fixed sensor 501A and the movable sensor 501B above the surface of the wafer W.

[0097] When the Z-axis actuator 512 operates, the fixed sensor 501A and the movable sensor 501B move in a direction approaching or separating from the surface of the wafer W together with the X-axis actuator 510.

[0098] The control device 5 is electrically connected to the shape detection module 500. Therefore, the control device 5 can move the fixed sensor 501A and the movable sensor 501B in the Z-axis direction by operating the Z-axis actuator 512, and can move the movable sensor 501B in the X-axis direction by operating the X-axis actuator 510.

[0099] FIG. 8 is a diagram showing the detection locus of the movable sensor. In the present embodiment, the transfer robot 209 is configured to rotate the wafer W held by the robot hand 520. Therefore, when the transfer robot 209 rotates the wafer W and the X-axis actuator 510 linearly moves the movable sensor 501B from the peripheral portion PP to the center CP of the wafer W, the movable sensor 501B detects a signal corresponding to the shape of the wafer W along the spiral detection locus.

[0100] The fixed sensor 501A is disposed above the peripheral portion PP of the wafer W. Therefore, when the transfer robot 209 rotates the wafer W, the fixed sensor 501A detects a signal corresponding to the shape of the peripheral portion PP without moving.

[0101] In this way, the control device 5 acquires the shape information of the wafer W to be determined for shape abnormality based on the signals detected by the fixed sensor 501A and the movable sensor 501B, compares the acquired shape information with a predetermined determination criterion, and determines the shape abnormality of the wafer W.

[0102] FIG. 9 is a diagram showing a flow for determining the shape abnormality of the wafer by the control device. First, the polished wafer W is placed on the temporary stage 180. The first transfer robot 209 accesses the wafer W on the temporary stage 180 and transfers the wafer W to the cleaning unit 4 (see step S201).

[0103] The surface of the polished wafer W may be wetted by the liquid used during the polishing process of the wafer W. In this embodiment, each of the fixed sensor 501A and the movable sensor 501B is an optical sensor. Therefore, if the surface of the wafer W is wet, each of the fixed sensor 501A and the movable sensor 501B may not be able to accurately detect a signal corresponding to the shape of the wafer W. Thus, the substrate processing apparatus includes a fluid injection device that removes the liquid adhering to the surface of the wafer W conveyed to the cleaning unit 4. Hereinafter, the configuration of the fluid injection device will be described with reference to the drawings.

[0104] FIG. 10 is a perspective view showing an embodiment of the fluid injection device. As shown in FIG. 10, the substrate processing apparatus includes a fluid injection device 600 disposed in the conveyance path of the wafer W between the polishing unit 3 and the cleaning unit 4.

[0105] The fluid injection device 600 includes a fluid injection nozzle 601 that blows compressed fluid onto the surface of the wafer W (more specifically, the surface to be detected by the shape detection module 500), and a fluid supply line 602 connected to the fluid injection nozzle 601.

[0106] The fluid supply line 602 is connected to a compressed fluid supply source (not shown), and the compressed fluid supplied from the compressed fluid supply source is introduced into the fluid injection nozzle 601 through the fluid supply line 602. Examples of the compressed fluid include compressed air and compressed gas (for example, an inert gas such as nitrogen gas).

[0107] In one embodiment, the fluid injection device 600 may include a filter 606 disposed upstream of the fluid injection nozzle 601 in the flow direction of the compressed fluid. In the embodiment shown in FIG. 10, the filter 606 is attached to the fluid supply line 602. The filter 606 is configured to remove foreign matter contained in the compressed fluid flowing through the fluid supply line 602. With such a configuration, clean compressed fluid can be blown onto the surface of the wafer W through the fluid injection nozzle 601.

[0108] As shown in FIG. 10, the fluid injection nozzle 601 is disposed above the transfer port 605 formed in the partition wall 1b. The fluid injection nozzle 601 has a cylindrical shape and extends along the longitudinal direction of the transfer port 605.

[0109] FIGS. 11(a) and 11(b) are diagrams showing injection ports formed in the fluid injection nozzle. In the embodiment shown in FIG. 11(a), the fluid injection nozzle 601 has a plurality of injection ports 603 arranged along its longitudinal direction. The plurality of injection ports 603 are arranged to face the surface of the wafer W (the first surface W1 in FIG. 11(a)). Therefore, the compressed fluid introduced into the fluid injection nozzle 601 is sprayed onto the surface of the wafer W through the plurality of injection ports 603.

[0110] The fluid injection nozzle 601 has a length longer than the diameter of the wafer W. The length of the plurality of injection ports 603 extending in the longitudinal direction of the fluid injection nozzle 601 (that is, the distance between the injection port 603 on one end side and the injection port 603 on the other end side) is longer than the diameter of the wafer W. Therefore, the compressed fluid supplied from the plurality of injection ports 603 is sprayed onto the entire surface of the wafer W.

[0111] As shown in FIG. 11(b), the fluid injection nozzle 601 may have a single slit-shaped injection port 604 extending along its longitudinal direction. Even with such a configuration, the injection port 604 is arranged to face the surface of the wafer W. Even in this case, the length of the injection port 604 is longer than the diameter of the wafer W. Therefore, the compressed fluid supplied from the injection port 604 is sprayed onto the entire surface of the wafer W.

[0112] FIGS. 12(a) to 12(c) are diagrams showing the wafer transferred from the polishing section to the cleaning section. As shown in FIG. 12(a), before the wafer W is transferred to the cleaning section 4, the transfer port 605 is closed by the shutter 610.

[0113] As shown in FIG. 12(b), when the wafer W is transported from the polishing unit 3 to the cleaning unit 4, the shutter 610 is opened, and the wafer W is transported from the polishing unit 3 to the cleaning unit 4 through the transport port 605. At this time, the fluid injection device 600 sprays the compressed fluid onto the surface of the wafer W through the injection port 603 (or injection port 604) of the fluid injection nozzle 601. By spraying the compressed fluid, the fluid injection device 600 completely removes the liquid adhering to the surface of the wafer W.

[0114] Thereafter, as shown in FIG. 12(c), after the wafer W passes through the transport port 605, the shutter 610 is closed, and the fluid injection device 600 stops supplying the compressed fluid from the fluid injection nozzle 601. Thus, through the series of steps shown in FIGS. 12(a) to 12(c), the wafer W polished in the polishing unit 3 is transported to the cleaning unit 4 with the liquid adhering to its surface removed.

[0115] Also in this embodiment, when the transfer robot 209 accesses the wafer W on the temporary placement table 180, the control device 5 operates the Z-axis actuator 512 to move the fixed sensor 501A and the movable sensor 501B to a predetermined retracted position so that the fixed sensor 501A and the movable sensor 501B do not contact the wafer W.

[0116] Thereafter, the control device 5 operates the Z-axis actuator 512 to move the fixed sensor 501A and the movable sensor 501B to a predetermined detection position close to the wafer W on the robot hand 520. The fixed sensor 501A and the movable sensor 501B that have moved to the detection position detect signals according to the shape of the wafer W while the wafer W is rotated by the transfer robot 209.

[0117] More specifically, with the transfer robot 209 rotating the wafer W, the control device 5 operates the X-axis actuator 510 to move the movable sensor 501B from the peripheral edge PP of the wafer W toward the center CP of the wafer W. The movable sensor 501B detects signals along a spiral detection locus by its linear movement.

[0118] The fixed sensor 501A detects a signal corresponding to the shape of the peripheral portion PP of the wafer W due to the rotation of the wafer W. After the fixed sensor 501A and the movable sensor 501B detect the signal, the control device 5 operates the Z-axis actuator 512 to move the fixed sensor 501A and the movable sensor 501B again to a predetermined retracted position.

[0119] In one embodiment, the control device 5 may cause the fixed sensor 501A and the movable sensor 501B to perform a signal detection operation when the transfer robot 209 is transferring the wafer W from a predetermined receiving position (in this embodiment, the temporary placement table 180) to a predetermined delivery position (in this embodiment, the cleaning modules 201A, 201B, 202A, 202B, etc.).

[0120] Also in this embodiment, the shape detection module 500 is connected to the transfer robot 209. Therefore, the transfer operation and the signal detection operation of the wafer W can be performed simultaneously, and the throughput of the wafer W can be improved.

[0121] As shown in step S202 of FIG. 9, the control device 5 acquires the shape information of the wafer W based on the signals detected by the fixed sensor 501A and the movable sensor 501B, and determines whether there is an abnormality in the shape of the wafer W (see step S203). Since the flow for determining the shape abnormality of the wafer W is the same as the flow described with reference to the above-described embodiment, a specific description thereof is omitted.

[0122] The control device 5 compares the shape information of the wafer W with a predetermined determination criterion. If it is determined that there is no abnormality in the shape of the wafer W (see "NO" in step S203), the transfer robot 209 transfers the wafer W to any one of the cleaning modules 201A, 201B, 202A, 202B (see step S204).

[0123] On the other hand, when the control device 5 determines that an abnormality has occurred in the shape of the wafer W (see "YES" in step S203), the control device 5 causes the transfer robot 209 to transfer the wafer W to the temporary stage 203.

[0124] FIG. 13 is a diagram showing a recovery window accessible to the temporary stage. As shown in FIG. 13, the substrate processing apparatus has a recovery window 700 formed in the outer wall 1c of the housing 1. The recovery window 700 is disposed to face the temporary stage 203, and an operator can access the temporary stage 203 through the recovery window 700.

[0125] As described above, the control device 5 transfers the wafer W having a shape abnormality to the temporary stage 203. Therefore, the operator can recover the wafer W on the temporary stage 203 through the recovery window 700 (see step S205). The control device 5 may issue an alarm to notify the operator of the abnormality when it determines the shape abnormality of the wafer W.

[0126] As described with reference to the above-described embodiment, the substrate processing apparatus includes a shape detection module 400 connected to the transfer robot 22 and a shape detection module 500 connected to the transfer robot 209. In one embodiment, the substrate processing apparatus may include a new shape detection module (not shown) connected to the transfer robot 210. The new shape detection module has the same configuration as the shape detection module 500 (or the shape detection module 400). With such a configuration, the control device 5 can determine the shape abnormality of the wafer W that has been subjected to the cleaning process in the cleaning unit 4.

[0127] In one embodiment, the shape detection modules 400 and 500 may be configured to detect the shape of the same surface of the wafer W (that is, the first surface W1 or the second surface W2). With such a configuration, the reliability of the determination of the shape abnormality can be improved.

[0128] Assuming that the first surface W1 is deformed upward (or downward), the second surface W2 is deformed downward (or upward). In this case, when the shape detection modules 400 and 500 detect the shapes of different surfaces of the wafer W, the control device 5 must calculate the displacement amounts of the wafer W deformed in different directions. In this case, there is a possibility that the control device 5 cannot accurately determine the shape abnormality of the wafer W.

[0129] Therefore, by detecting the shape of the same surface of the wafer W by the shape detection modules 400 and 500, the control device 5 can calculate the displacement amount of the wafer W deformed in the same direction. As a result, the control device 5 can accurately determine the shape abnormality of the wafer W.

[0130] In the above-described embodiment, the transfer robot 22 does not have a configuration for rotating the wafer W. Therefore, the shape detection module 400 is configured to detect the shape abnormality of the entire surface of the non-rotating wafer W by the detection sensor 401.

[0131] On the other hand, the transfer robot 209 has a configuration for rotating the wafer W. Therefore, the shape detection module 500 has a configuration for detecting the shape abnormality of the entire surface of the rotating wafer W by the fixed sensor 501A and the movable sensor 501B.

[0132] However, as long as any of the shape detection modules 400 and 500 has a mechanism for determining the shape abnormality of the wafer W, the specific mechanism is not particularly limited. For example, the transfer robots 22 and 209 may have the same configuration, and the shape detection modules 400 and 500 may have the same configuration.

[0133] In the above-described embodiment, the shape detection module 400 includes the detection sensor 401 as an optical sensor, and the shape detection module 500 includes the fixed sensor 501A and the movable sensor 501B as optical sensors.

[0134] In one embodiment, the shape detection module 400 may include an image sensor as the detection sensor 401 instead of an optical sensor. Similarly, the shape detection module 500 may include an image sensor as the fixed sensor 501A and the movable sensor 501B instead of an optical sensor.

[0135] In this case, the control device 5 acquires a signal (image signal) detected by the image sensor, and creates image data as shape information of the wafer W from the acquired image signal. The storage device 5a stores reference image data to be compared with the image data. Examples of the reference image data include image data of a contour including the peripheral portion PP of the wafer W and image data indicating the shading of the shadow over the entire wafer W. The control device 5 compares the image data with the reference image data to determine whether there is a shape abnormality in the wafer W.

[0136] In the above-described embodiment, the fixed sensor 501A and the movable sensor 501B are the same sensor, but the fixed sensor 501A and the movable sensor 501B may be different sensors. For example, the contour of the wafer W including the peripheral portion PP may be detected by the fixed sensor 501A as an image sensor, and the surface shape of the wafer W inside the peripheral portion PP may be detected by the movable sensor 501B as an optical sensor.

[0137] The above-described embodiments are described for the purpose of enabling a person having ordinary skill in the art to which the present invention pertains to practice the present invention. Various modifications of the above embodiments can be naturally made by those skilled in the art, and the technical idea of the present invention can also be applied to other embodiments. Therefore, the present invention is not limited to the described embodiments, but is to be construed in the broadest scope in accordance with the technical idea defined by the claims.

Explanation of Reference Numerals

[0138] 1 Housing 1a, 1b Partition wall 1c Outer wall 2 Load / Unload section 3 Grinding section Grinding modules 3A to 3D 4 Cleaning section 5 Control device 5a Memory device 5b Arithmetic unit 6 First linear transporter 7 Second linear transporter 10 Grinding pad 11 Lifter 12 Swing transporter 20 Front load section 21 Travel mechanism 22 Transfer robot Grinding tables 30A to 30D Top rings 31A to 31D Grinding fluid supply nozzles 32A to 32D Dressers 33A to 33D 180 Temporary placement stand 190 First cleaning chamber 191 First transfer chamber 192 Second cleaning chamber 193 Second transfer chamber 194 Drying chamber Upper primary cleaning module 201A Lower primary cleaning module 201B Upper secondary cleaning module 202A Lower secondary cleaning module 202B 203 Temporary placement stand Upper drying module 205A Lower drying module 205B 207 Filter fan device First transfer robot 209 Second transfer robot 210 Support shafts 211, 212 400 Shape detection module 401 Detection sensor 402 Sensor movement actuator 410 First linear actuator 410a Moving body 410b Guide rail 411 Second Parallel Movement Actuator 411a Moving Body 411b Guide Rail 412 Vertical Movement Actuator 420 Robot Hand 430 Connecting Member 500 Shape Detection Module 501A Fixed Sensor 501B Movable Sensor 502 Sensor Movement Actuator 510 Parallel Movement Actuator 510a Moving Body 510b Guide Rail 512 Vertical Movement Actuator 520 Robot Hand 530 Connecting Member 600 Fluid Injection Device 601 Fluid Injection Nozzle 602 Fluid Supply Line 603, 604 Injection Ports 605 Conveyor Port 606 Filter 610 Shutter TP1 - TP7 Conveyor Positions W1 First Surface W2 Second Surface CP Center PP Peripheral Portion

Claims

1. A substrate processing apparatus, comprising: a processing module for processing a substrate; a transfer robot for transferring the substrate to the processing module; a shape detection module for detecting a signal corresponding to the surface shape of the substrate held by the transfer robot; a control device for determining a shape abnormality of the substrate based on the signal detected by the shape detection module. The shape detection module is connected to the transfer robot and is configured to detect the signal above the transfer robot.

2. The shape detection module includes: a detection sensor disposed above the substrate held by the transfer robot; a sensor moving actuator for moving the detection sensor along a movement locus on the surface of the substrate.

3. The transfer robot is configured to rotate the substrate. The shape detection module includes: a fixed sensor disposed above a peripheral portion of the substrate held by the transfer robot; a movable sensor movable in a direction parallel to the substrate held by the transfer robot; a sensor moving actuator for reciprocally moving the movable sensor from the peripheral portion to the center of the substrate.

4. The shape detection module is configured to detect the signal when the transfer robot is transferring the substrate.

5. When the shape detection module is defined as a first shape detection module and the transfer robot is defined as a first transfer robot, the first transfer robot is configured to transfer the substrate to a polishing module. The substrate processing apparatus further includes: a second transfer robot for transferring the substrate polished by the polishing module to a cleaning module; a second shape detection module connected to the second transfer robot and configured to detect a signal corresponding to the surface shape of the substrate held by the second transfer robot.

6. The first shape detection module and the second shape detection module are configured to detect the shape of the same surface of the substrate.

7. The substrate processing apparatus includes a fluid injection device disposed in a conveyance path of the substrate between the polishing module and the cleaning module. The substrate processing apparatus according to claim 5, wherein the fluid injection device includes a fluid injection nozzle that sprays compressed fluid onto a surface of the substrate to be detected by the second shape detection module.

8. The control device acquires shape information of the substrate to be determined for shape abnormality based on the signal acquired from the shape detection module, and determines the shape abnormality by comparing the acquired shape information with a predetermined determination criterion. The substrate processing apparatus according to claim 1.

9. The control device creates a normal distribution from a plurality of values calculated based on a plurality of signals acquired in the past from the shape detection module, and determines a range of ±Xσ from the average value of the normal distribution as the determination criterion. The substrate processing apparatus according to claim 8.

10. A substrate processing method, comprising: detecting, above the transfer robot, a signal corresponding to a surface shape of the substrate held by the transfer robot by a shape detection module connected to the transfer robot that transfers the substrate to a processing module; determining a shape abnormality of the substrate based on the signal detected by the shape detection module. The substrate processing method.

11. The shape detection module includes a detection sensor and a sensor movement actuator that moves the detection sensor, and moves the detection sensor disposed above the substrate held by the transfer robot along a movement locus on the surface of the substrate by the sensor movement actuator. The substrate processing method according to claim 10.

12. The shape detection module includes a fixed sensor and a movable sensor, and a sensor movement actuator that reciprocates the movable sensor from a peripheral portion of the substrate to the center of the substrate, and reciprocates the movable sensor from the peripheral portion to the center by the sensor movement actuator while the substrate is rotated by the transfer robot. The substrate processing method according to claim 10.

13. The substrate processing method according to claim 10, wherein the signal is detected by the shape detection module while the substrate is being conveyed by the transfer robot.

14. When the shape detection module is defined as a first shape detection module and the transfer robot is defined as a first transfer robot, The substrate is transported to the polishing module by the first transfer robot, The substrate polished by the polishing module is transported to the cleaning module by the second transfer robot, The substrate processing method according to claim 10, wherein a signal corresponding to the surface shape of the substrate held by the second transfer robot is detected by a second shape detection module connected to the second transfer robot.

15. The substrate processing method according to claim 14, wherein the first shape detection module and the second shape detection module detect the shape of the same surface of the substrate.

16. The substrate processing method according to claim 14, wherein compressed fluid is sprayed onto the surface of the substrate that is the detection target of the second shape detection module by a fluid injection device arranged in the transport path of the substrate between the polishing module and the cleaning module.

17. Based on the signal obtained from the shape detection module, shape information of the substrate to be determined for shape abnormality is obtained, The obtained shape information is compared with a predetermined determination criterion to determine the shape abnormality. The substrate processing method according to claim 10.

18. A normal distribution is created from a plurality of values calculated based on a plurality of signals previously obtained from the shape detection module, The substrate processing method according to claim 17, wherein a range of ±Xσ from the average value of the normal distribution is determined as the determination criterion.

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