Multilayer electronic component

Abstract

To mitigate a problem of reduced moisture resistance reliability of a multilayer electronic component due to moisture penetrating between a plating layer and the main body.SOLUTION: A multilayer electronic component according to the present invention can ensure moisture resistance reliability of a multilayer electronic component by disposing a sealing portion between a plating portion and a main body and adjusting the components or shape of the sealing portion. The multilayer electronic component according to an embodiment of the present invention can include a main body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer, an electrode layer disposed on the main body and connected to the internal electrode, an external electrode including a plating portion disposed on the electrode layer and including two or more plating layers, and a sealing portion disposed between the plating portion and the main body, including Sn, and in direct contact with the main body.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a multilayer electronic component.

Background Art

[0002] A multilayer ceramic capacitor (MLCC), which is one type of multilayer electronic component, is a chip-shaped capacitor mounted on a printed circuit board of various electronic products such as video devices like liquid crystal display (LCD) and plasma display panel (PDP), computers, smartphones, and mobile phones, and serves to charge or discharge electricity.

[0003] Due to the advantages of being small in size while ensuring high capacitance and being easy to mount, multilayer ceramic capacitors can be used as components in various electronic devices. As various electronic devices such as computers and mobile devices are miniaturized and have increased output, the requirements for miniaturization and high capacitance of multilayer ceramic capacitors are increasing.

[0004] While the miniaturization, high capacitance, and high integration of multilayer ceramic capacitors are accelerating, the demand for preventing the reduction of moisture resistance reliability is increasing. In particular, when the external electrode includes a plating layer, the bonding force between the plating layer and the body may be weak due to the difference in components, so the space between the plating layer and the body can be the main path for external moisture to penetrate. Especially when the base electrode layer of the external electrode is a sintered electrode layer, the moisture that penetrates between the plating layer and the body may oxidize the base electrode layer, which may deepen the problem of reduced moisture resistance reliability of the multilayer electronic component.

[0005] Therefore, there is a practical need for a structural improvement that can effectively block the moisture penetration path between the plating layer of the external electrode and the body.

Summary of the Invention

Problems to be Solved by the Invention

[0006] One of the various objects of the present invention is to alleviate the problem that the moisture resistance reliability of the multilayer electronic component is reduced by the moisture penetrating between the plating layer and the main body.

[0007] However, the object of the present invention is not limited to the above-described content, and can be more easily understood in the process of explaining the specific embodiments of the present invention.

Means for Solving the Problems

[0008] A multilayer electronic component according to an embodiment of the present invention includes a main body including a dielectric layer and internal electrodes alternately arranged with the dielectric layer, an electrode layer disposed on the main body and connected to the internal electrodes, and an external electrode disposed on the electrode layer and including a plating portion including two or more plating layers, and a sealing portion disposed between the plating portion and the main body, containing Sn, and directly contacting the main body.

[0009] A multilayer electronic component according to another embodiment of the present invention includes a main body including a dielectric layer and internal electrodes alternately arranged with the dielectric layer, an electrode layer disposed on the main body and connected to the internal electrodes, and an external electrode disposed on the electrode layer and including a plating portion including two or more plating layers, and a sealing portion disposed between an end portion of the electrode layer and an end portion of the plating portion, having a groove portion recessed toward the electrode layer side.

Effects of the Invention

[0010] One of the various effects of the present invention is to form a sealing portion between two or more plating layers and the main body, adjust its shape, and improve the moisture resistance reliability of the multilayer electronic component.

[0011] However, the various and meaningful advantages and effects of the present invention are not limited to the above-described content, and can be more easily understood in the process of explaining the specific embodiments of the present invention.

Brief Description of the Drawings

[0012]

Figure 1

Figure 2

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Figure 8

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Figure 12

Mode for Carrying Out the Invention

[0013] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into several other forms, and the scope of the present invention is not limited to the embodiments described below. Also, the embodiments of the present invention are provided to more fully explain the present invention to ordinary technicians. Therefore, for clearer explanation, elements such as the shape and size in the drawings may be enlarged, reduced (or emphasized or simplified), and elements denoted by the same reference numerals in the drawings are the same elements.

[0014] In addition, for the purpose of clearly explaining the present invention in the drawings, parts not related to the explanation are omitted, and the sizes and thicknesses of the illustrated components are arbitrarily shown for convenience of explanation. Therefore, the present invention is not necessarily limited by the illustration. Also, components with the same functions within the scope of the same concept can be described using the same reference numerals. Furthermore, throughout the specification, when a part "includes" a certain component, it means that other components can be further included, rather than excluding other components, unless otherwise stated to the contrary.

[0015] In the drawings, the first direction can be defined as the stacking direction or the thickness (T) direction, the second direction as the length (L) direction, and the third direction as the width (W) direction.

[0016] FIG. 1 schematically shows a perspective view of a stacked electronic component according to an embodiment of the present invention, FIG. 2 schematically shows a cross-sectional view taken along line I-I' of FIG. 1, FIG. 7 is a cross-sectional view taken along line II-II' of FIG. 1, and FIG. 8 schematically shows a perspective view of a stacked electronic component according to another embodiment of the present invention.

[0017] Hereinafter, with reference to FIGS. 1, 2, 7, and 8, the configurations commonly included in the multilayer electronic component 100 according to one embodiment of the present invention and the multilayer electronic component 100' according to another embodiment of the present invention will be described in detail. As an example of a multilayer electronic component, a multilayer ceramic capacitor (hereinafter referred to as "MLCC") will be described, but the present invention is not limited thereto.

[0018] Hereinafter, each configuration included in the multilayer electronic component 100 according to one embodiment of the present invention will be described.

[0019] The main body 110 can have a dielectric layer 111 and internal electrodes 121 and 122 alternately arranged.

[0020] The dielectric layer 111 and the internal electrodes 121 and 122 can be alternately laminated. In this specification, the direction in which the dielectric layer 111 and the internal electrodes 121 and 122 are laminated can be defined as the first direction.

[0021] There is no particular limitation on the specific shape of the main body 110. As shown in the figure, the main body 110 can have a hexahedral shape or a shape similar thereto. Due to the shrinkage of the ceramic powder contained in the main body 110 during the firing process, the main body 110 does not have a perfect hexahedral shape with straight lines, but can have a substantially hexahedral shape.

[0022] The main body 110 can have a first and a second surface 1 and 2 facing each other in the first direction, a third and a fourth surface 3 and 4 connected to the first and the second surface 1 and 2 and facing each other in the second direction, a third and a fourth surface 3 and 4 connected to the first and the second surface 1 and 2, and a fifth and a sixth surface 5 and 6 facing each other in the third direction.

[0023] On one hand, a margin area where the internal electrodes 121 and 122 are not arranged overlaps on the dielectric layer 111, resulting in a step due to the thickness of the internal electrodes 121 and 122. The corner connecting the first surface and the third to fifth surfaces and / or the corner connecting the second surface and the third to fifth surfaces can have a form that shrinks toward the central side in the first direction of the main body 110 when viewed with reference to the first surface or the second surface. Or, due to the shrinkage behavior during the sintering process of the main body, the corner connecting the first surface 1 and the third to sixth surfaces 3, 4, 5, 6 and / or the corner connecting the second surface 2 and the third to sixth surfaces 3, 4, 5, 6 can have a form that shrinks toward the central side in the first direction of the main body 110 when viewed with reference to the first surface or the second surface. Or, in order to prevent chipping defects, etc., by performing a separate process to round the corners connecting the respective surfaces of the main body 110, the corner connecting the first surface and the third to sixth surfaces and / or the corner connecting the second surface and the third to sixth surfaces can have a round form.

[0024] The plurality of dielectric layers 111 forming the main body 110 are in a fired state, and the boundary between adjacent dielectric layers 111 can be integrated to such an extent that it is difficult to confirm without using a scanning electron microscope (SEM). The number of stacked dielectric layers does not need to be particularly limited and can be determined in consideration of the size of the multilayer electronic component. For example, the main body can be formed by stacking 400 or more dielectric layers.

[0025] The dielectric layer 111 can be formed by manufacturing a ceramic slurry containing ceramic powder, an organic solvent, and a binder, applying and drying the slurry on a carrier film to provide a ceramic green sheet, and then firing the ceramic green sheet. The ceramic powder is not particularly limited as long as sufficient capacitance can be obtained. For example, barium titanate (BaTiO3)-based powder can be used as the ceramic powder. More specifically, as an example, the barium titanate (BaTiO3)-based powder is BaTiO3, (Ba 1-x Ca x)TiO3(0 < x < 1), Ba(Ti 1-y Ca y )O3(0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3(0 < x < 1, 0 < y < 1) and Ba(Ti 1-y Zr y )O3(0 < y < 1) can be one or more of them, and the relative permittivity powder of the CaZrO3 substrate can be (Ca 1-x Sr x )(Zr 1-y Ti y )O3(0 < x < 1, 0 < y < 1).

[0026] Therefore, the dielectric layer 111 can contain one or more of BaTiO3, (Ba 1-x Ca x )TiO3(0 < x < 1), Ba(Ti 1-y Ca y )O3(0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3(0 < x < 1, 0 < y < 1) and Ba(Ti 1-y Zr y )O3(0 < y < 1).

[0027] The average thickness td of the dielectric layer 111 is not particularly limited.

[0028] When aiming for miniaturization and high capacitance of the multilayer electronic component 100, the average thickness td of the dielectric layer 111 can be 0.35 μm or less, and in order to improve the reliability of the multilayer electronic component 100 under high temperature and high pressure, the average thickness td of the dielectric layer 111 can be 3 μm or more.

[0029] The average thickness td of the dielectric layer 111 can be measured by scanning an image of the cross-section (L-T cross-section) of the main body 110 in the third and first directions using a scanning electron microscope (SEM).

[0030] For example, the average thickness td of the dielectric layer 111 is extracted from an image obtained by scanning the cross-section in the length and thickness directions (L-T) of the length cut at the center in the width direction of the main body 110 using a scanning electron microscope (SEM). Among the dielectric layers, for a total of five dielectric layers, two layers above and two layers below, with one layer of the dielectric layer at the point where the center line in the length direction of the main body and the center line in the thickness direction meet as a reference, after determining five points at equal intervals, two points on the left and two points on the right centered around one reference point, with the reference point being the point where the center line in the length direction of the main body and the center line in the thickness direction meet, the thickness at each point is measured to obtain the average value.

[0031] The main body 110 includes a capacitance forming portion Ac that is disposed inside the main body 110 and forms a capacitance including a first internal electrode 121 and a second internal electrode 122 that are arranged with the dielectric layer 111, and cover portions 112 and 113 formed above and below the capacitance forming portion Ac in the first direction.

[0032] The capacitance forming portion Ac is a portion that contributes to the formation of the capacitance of the capacitor, and can be formed by repeatedly laminating a plurality of first and second internal electrodes 121 and 122 with the dielectric layer 111 interposed therebetween, and can mean a region where the first and second internal electrodes 121 and 122 overlap in the first direction. Also, the first internal electrode 121 can be disposed at the uppermost end of the capacitance forming portion Ac in the first direction, and the second internal electrode 122 can be disposed at the lowermost end of the capacitance forming portion Ac in the first direction.

[0033] The internal electrodes 121 and 122 can include the first and second internal electrodes 121 and 122. The first and second internal electrodes 121 and 122 are alternately arranged so as to face each other with the dielectric layer 111 constituting the main body 110 interposed therebetween, and can be exposed on the third and fourth surfaces 3 and 4 of the main body 110, respectively.

[0034] The first internal electrode 121 is spaced apart from the fourth surface 4 and exposed through the third surface 3, and the second internal electrode 122 can be spaced apart from the third surface 3 and exposed through the fourth surface 4. A first external electrode 130 is disposed on the third surface 3 of the main body and connected to the first internal electrode 121, and a second external electrode 140 can be disposed on the fourth surface 4 of the main body and connected to the second internal electrode 122.

[0035] That is, the first internal electrode 121 is not connected to the second external electrode 140 but is connected to the first external electrode 130, and the second internal electrode 122 is not connected to the first external electrode 130 but is connected to the second external electrode 140. Accordingly, the first internal electrode 121 can be formed at a certain distance from the fourth surface 4, and the second internal electrode 122 can be formed at a certain distance from the third surface 3. Also, the first and second internal electrodes 121, 122 can be disposed spaced apart from the fifth and sixth surfaces of the main body 110.

[0036] The conductive metal included in the internal electrodes 121, 122 can be one or more of Ni, Cu, Pd, Ag, Au, Pt, In, Sn, Al, Ti, and alloys thereof, but the present invention is not limited thereto.

[0037] The average thickness te of the internal electrodes 121, 122 is not particularly limited and can vary according to the purpose. In order to miniaturize the multilayer electronic component 100, the average thickness te of the internal electrodes 121, 122 can be 0.35 μm or less, and in order to improve the reliability of the multilayer electronic component 100 under high temperature and high pressure, the average thickness te of the internal electrodes 121, 122 can be 3 μm or more.

[0038] The average thickness te of the internal electrodes 121 and 122 can be measured by measuring the thicknesses at five points, which are equally spaced on the left and right sides of a reference point by two points each with the reference point being at the intersection of the center line in the length direction and the center line in the thickness direction of the main body, among the internal electrode layers extracted from an image scanned using a scanning electron microscope (SEM) of the cross-section in the length and thickness directions (L-T) cut at the central portion in the width direction of the main body 110, and then calculating the average value. The internal electrode layers are a total of five layers, including two layers above and two layers below the internal electrode layer at the point where the center line in the length direction and the center line in the thickness direction of the main body are in contact, with the internal electrode layer at this contact point as the reference layer.

[0039] Cover portions 112 and 113 can be disposed on the upper and lower surfaces of the capacitance forming portion Ac in the first direction.

[0040] The cover portions 112 and 113 can basically serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0041] The cover portions 112 and 113 can contain the same material as the dielectric layer 111. That is, the cover portions 112 and 113 can contain a ceramic material, for example, a barium titanate (BaTiO3)-based ceramic material.

[0042] On the other hand, the thickness of the cover portions 112 and 113 does not need to be particularly limited. For example, the thickness tc1 of the cover portions 112 and 113 can each be 20 μm or less.

[0043] The average thickness tc1 of the cover portions 112 and 113 can represent the size in the first direction and can be the average value of the sizes in the first direction of the cover portions 112 and 113 measured at five equally spaced points above or below the capacitance forming portion Ac.

[0044] Moreover, margin portions 114 and 115 can be disposed on the side surfaces of the capacitance forming portion Ac.

[0045] The margin portions 114 and 115 can include a first margin portion 114 disposed on the fifth surface 5 of the main body 110 and a second margin portion 115 disposed on the sixth surface 6. That is, the margin portions 114 and 115 can be disposed on both end surfaces in the width direction of the ceramic main body 110.

[0046] As shown in FIG. 7, the margin portions 114 and 115 can mean the regions between the boundaries of the main body 110 and both ends of the first and second internal electrodes 121 and 122 in a cross-section obtained by cutting the main body 110 in the width-thickness (W-T) direction.

[0047] The margin portions 114 and 115 can basically serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0048] The margin portions 114 and 115 can be formed by applying a conductive paste to form internal electrodes, except where the margin portions are formed on the ceramic green sheet.

[0049] On the other hand, the widths of the margin portions 114 and 115 do not need to be particularly limited. For example, the average widths of the margin portions 114 and 115 can each be 20 μm or less.

[0050] The average widths of the margin portions 114 and 115 can mean the average sizes in the third direction of the regions where the internal electrodes are separated from the fifth surface and the average sizes in the third direction of the regions where the internal electrodes are separated from the sixth surface, and can be the values obtained by averaging the sizes in the third direction of the margin portions 114 and 115 measured at five equally spaced points on the side surfaces of the capacitance forming portion Ac.

[0051] The external electrodes 130 and 140 can be disposed on the main body 110, and specifically, can be disposed on the third surface 3 and the fourth surface 4 of the main body 110.

[0052] The external electrodes 130 and 140 can be disposed on the third and fourth surfaces 3 and 4 of the main body 110, respectively, and include first and second external electrodes 130 and 140 respectively connected to the first and second internal electrodes 121 and 122.

[0053] On the other hand, it is not necessary to limit the external electrodes 130 and 140 to be disposed only on the third surface 3 and the fourth surface 4 of the main body. Referring to FIGS. 1 and 2, the first external electrode 130 can be extended and disposed from the third surface 3 of the main body 110 to a part on the first, second, fifth, and sixth surfaces 1, 2, 5, and 6, and the second external electrode 140 can be extended and disposed from the fourth surface 4 to a part on the first, second, fifth, and sixth surfaces 1, 2, 5, and 6.

[0054] In this embodiment, the structure in which the multilayer electronic component 100 has two external electrodes 130 and 140 is described, but the number, shape, etc. of the external electrodes 130 and 140 can be changed according to the form of the internal electrodes 121 and 122 and other purposes.

[0055] The external electrodes 130, 140, 130', and 140' can be disposed on the main body 110 and include electrode layers 131, 141, 131', and 141' connected to the internal electrodes 121 and 122.

[0056] Specifically, the first internal electrodes 130' and 140' can be disposed on the main body 110 and include first electrode layers 131 and 131' connected to the first internal electrode 121, and the second internal electrode 140' can be disposed on the main body 110 and include second electrode layers 141 and 141' connected to the second internal electrode 122.

[0057] The first and second electrode layers 131, 141, 131', and 141' are respectively connected to the internal electrodes 121 and 122, and can play a role in ensuring the electrical connectivity between the external electrodes 130, 140 and the internal electrodes 121, 122.

[0058] The first electrode layers 131, 131' and the second electrode layers 141, 141' can contain a conductive metal. As the conductive metal, a material with excellent electrical conductivity can be used, but it is not particularly limited. For example, the conductive metal can be one or more of nickel (Ni), copper (Cu), and their alloys.

[0059] On the other hand, when the internal electrodes 121, 122 contain Ni and the first and second electrode layers 131, 141, 131', 141' contain Cu, a Ni-Cu alloy can be formed between the internal electrodes 121, 122 and the first and second electrode layers 131, 141, 131', 141', thereby improving the electrical connectivity between the internal electrodes 121, 122 and the external electrodes 130, 140, 130', 140'.

[0060] In one embodiment, to give a more specific example of the first and second electrode layers 131, 141, 131', 141', the electrode layer can be a fired electrode containing a conductive metal and glass, or a resin-based electrode containing a conductive metal and a resin.

[0061] Also, the first and second electrode layers 131, 141, 131', 141' can be in a form where a fired electrode and a resin-based electrode are sequentially formed on the main body. Further, the electrode layer can be formed by a method of transferring a sheet containing a conductive metal onto the main body, or can be formed by a method of transferring a sheet containing a conductive metal onto a fired electrode.

[0062] The size of the multilayer electronic components 100, 100' does not need to be particularly limited. For example, the length of the multilayer electronic component 100 can be 0.85 mm or more and 1.15 mm or less, the thickness of the multilayer electronic component 100 can be 0.35 mm or more and 0.65 mm or less, and the width of the multilayer electronic component 100 can be 0.35 mm or more and 0.65 mm or less.

[0063] Here, the length of the multilayer electronic component 100 means the maximum size in the second direction of the multilayer electronic component 100, the thickness of the multilayer electronic component 100 means the maximum size in the first direction of the multilayer electronic component 100, and the width of the multilayer electronic component 100 can mean the maximum size in the third direction of the multilayer electronic component 100.

[0064] FIG. 2 schematically shows a cross-sectional view taken along line I-I' of FIG. 1, FIG. 3 schematically shows an enlarged view of region A in FIG. 2, FIG. 4 schematically shows an enlarged view corresponding to region A in FIG. 2 in a multilayer electronic component according to an embodiment, FIG. 5 schematically shows an enlarged view corresponding to region A in FIG. 2 in a multilayer electronic component according to an embodiment, and FIG. 6 schematically shows a method for forming a sealing portion according to an embodiment.

[0065] Hereinafter, with reference to FIGS. 2 to 6, the configuration of the multilayer electronic component 100 according to an embodiment of the present invention will be described in detail.

[0066] The external electrodes 130 and 140 of the multilayer electronic component 100 according to an embodiment of the present invention are disposed on the electrode layers 131 and 141 and can include a plating portion including two or more plating layers 132, 133, 134, 142, 143, and 144. The type of each of the two or more plating layers is not particularly limited, and each of the two or more plating layers can be a plating layer containing one or more of nickel (Ni), tin (Sn), palladium (Pd), and alloys thereof.

[0067] Specifically, the plating portion can include a first plating portion including two or more plating layers 132, 133, and 134 disposed on the first electrode layer 131 and a second plating portion including two or more plating layers 142, 143, and 144 disposed on the second electrode layer 141.

[0068] In the drawings of the present invention, the two or more plating layers are represented as being composed of three layers, but the plating portion of the present invention is not limited to being composed of three plating layers.

[0069] In one embodiment, the plating portion may include Cu plating layers 132 and 142 disposed on the electrode layers 131 and 141, Ni plating layers 133 and 143 disposed on the Cu plating layers, and Sn plating layers 134 and 144 disposed on the Ni plating layers.

[0070] The Cu plating layers 132 and 142 can play a role in relaxing the stress between the plating portion and the electrode layers 131 and 141. The Ni plating layers 133 and 143 can play a role in improving the hermeticity and mechanical strength of the external electrodes 130 and 140. The Sn plating layers 134 and 144 can play a role in improving the mountability of the stacked electronic component 100.

[0071] Therefore, according to one embodiment, when the plating portion includes the Cu plating layers 132 and 142 disposed on the electrode layers 131 and 141, the Ni plating layers 133 and 143 disposed on the Cu plating layers, and the Sn plating layers 134 and 144 disposed on the Ni plating layers, the mechanical strength, moisture resistance reliability, and mountability of the stacked electronic component 100 can be improved.

[0072] Referring to FIGS. 2 and 3, the stacked electronic component 100 according to an embodiment of the present invention may include sealing portions 151 and 152 that are disposed between the plating portions 132, 133, 134 and the main body 110, contain Sn, and are in direct contact with the main body 110.

[0073] The adhesion between the plating portions 132, 133, 134 and the main body 110 may be weakened due to the difference in their components, and thus a gap may be formed between the end of the plating portion and the main body 110. Such a gap may become a main penetration path for moisture and plating solution from the outside, and may cause a decrease in the moisture resistance reliability of the stacked electronic component 110.

[0074] Therefore, the stacked electronic component 100 according to an embodiment of the present invention includes sealing portions 151 and 152 that contain Sn and are in direct contact with the main body 110 between the plating portions 132, 133, 134, 142, 143, and 144. By closing the gaps between the ends of the plating portions 132, 133, 134, 142, 143, and 144 and the main body 110, the moisture resistance reliability of the stacked electronic component 100 can be improved. In particular, the plating portions of the stacked electronic component 100 according to an embodiment of the present invention include two or more plating layers. Since the sealing portions 151 and 152 that contain Sn are arranged between such plating portions 132, 133, 134, 142, 143, and 144 and the main body, the moisture resistance reliability of the stacked electronic component 100 can be further improved.

[0075] Referring to FIG. 3, the ends of the electrode layers 131 and 141 can be in contact with the surface of the main body 110. When the electrode layers 131 and 141 extend and are arranged on at least a part of one of the first surface, the second surface, the fifth surface, and the sixth surface 1, 2, 5, and 6 of the main body 110, the ends of the electrode layers 131 and 141 can be in contact with at least a part of one of the first surface, the second surface, the fifth surface, and the sixth surface 1, 2, 5, and 6 of the main body 110.

[0076] In one embodiment, the sealing portions 151 and 152 can be in contact with the ends of the electrode layers 131 and 141. Thereby, it is possible to prevent the electrode layers 131 and 141 from being damaged by the infiltrated external moisture or plating solution.

[0077] Referring to FIG. 3, the sealing portion 151 can be arranged so as not to come off from the end of the plating layer 134 arranged on the outermost side among the plating portions. At this time, the plating layer 134 arranged on the outermost side can be in contact with one side surface of the sealing portion 151.

[0078] In one embodiment, the sealing portions 151 and 152 can be arranged so as not to come off from the ends of the outermost plating layer among the plating portions. Thereby, while ensuring the moisture resistance reliability of the stacked electronic component 100, the proportion occupied by the external electrodes 130 and 140 in the entire component can be reduced.

[0079] Also, referring to FIG. 3, the plating portion according to one embodiment can completely cover the sealing portion 151. Thereby, the adhesion strength of the external electrode can be improved.

[0080] Referring to FIG. 4, the sealing portion 151 can also be arranged between the end of the electrode layer 131 and the end of the outermost plating layer 134 among the plating portions and the second surface 2 of the main body 110.

[0081] That is, the sealing portions 151 and 152 according to one embodiment can be arranged between the outermost plating layers 134 and 144 among the plating portions and the main body 110. Thereby, by forming the sealing portions 151 and 152 between the ends of the entire plating layers 132, 133, 134, 142, 143, and 144 and the main body, the effect of improving the adhesion strength of the external electrode can be further improved.

[0082] Referring to FIG. 5, the sealing portion 151 can be arranged to extend so as to come off from the end of the outermost plating layer 134 among the plating portions. In this case, the effect of blocking or extending the penetration path of moisture from the outside can be further improved.

[0083] That is, the sealing portions 151 and 152 according to one embodiment can be arranged to come off from the ends of the outermost plating layers 134 and 144 among the plating portions. Thereby, the moisture resistance reliability of the stacked electronic component 100 can be further improved.

[0084] Referring to FIGS. 4 and 5, the first sealing portion 151 can be divided into a first region 151a, a second region 151b, and a third region 151c according to the region in which it is disposed among the regions between the plating layers 132, 133, 134 of two or more layers and the second surface 2 of the main body 110, and the same may be true for the second sealing portion 152.

[0085] Specifically, the first region 151a can mean the region of the sealing portion disposed between the first plating layer 132 and the main body 110, the second region 151b can mean the region of the sealing portion disposed between the second plating layer 133 and the main body 110, and the third region 151c can mean the region of the sealing portion disposed between the third plating layer 134 and the main body 110.

[0086] In FIGS. 4 and 5, the case where the first region 151a, the second region 151b, and the third region 151c are arranged continuously with each other is shown, but the present invention is not limited thereto, and at least two or more of the first region 151a, the second region 151b, and the third region 151c can be arranged spaced apart from each other in the second direction.

[0087] On the other hand, referring to FIG. 3, the average thickness of the sealing portion 151 is denoted by tp. In FIG. 3, the average thickness tp is shown based on the first sealing portion 151, but the average thickness of the second sealing portion 152 can also be denoted by tp.

[0088] There is no particular need to particularly limit the lower limit value of the average thickness tp of the sealing portions 151 and 152. For example, when the average thickness tp of the sealing portions 151 and 152 is 1 μm or more, the moisture resistance reliability of the stacked electronic component 100 can be sufficiently improved. On the other hand, there is no particular need to particularly limit the upper limit value of the average thickness tp of the sealing portions 151 and 152. For example, the average thickness tp of the sealing portions 151 and 152 can be 8 μm or less.

[0089] On one hand, the ends of the electrode layers 131 and 141 can mean the boundary lines between the electrode layers 131 and 141 and the surface of the main body 110 where no electrode layer is formed, and the end of the plating layer can mean the end surface of the plating layer when looking at the surface of the main body.

[0090] The method for forming the sealing parts 151 and 152 is not particularly limited. For example, the sealing parts 151 and 152 can be Sn plating layers. Referring to FIG. 6, as a specific example of the method for forming the sealing parts 151 and 152, an electrode layer 131 is formed on the main body, immersed in a solution in which Sn is dissolved, and then the region except for the region where the first region 151a is formed is removed with an alkaline solution or an acidic solution to form the first plating layer 132. After being immersed in the solution in which Sn is dissolved again, the region except for the region where the second region 151b is formed is removed with an alkaline solution or an acidic solution, and then a method for forming the second plating layer 133, the third region 151c, and the third plating layer 134 in the same manner can be mentioned. At this time, the formation region of the sealing part 151 can vary according to the thickness of each plating layer forming the plated part and the shapes of the regions 151a, 151b, and 151c.

[0091] FIG. 8 schematically shows a perspective view of a stacked electronic component according to another embodiment of the present invention, FIG. 9 schematically shows a cross-sectional view taken along line III-III' of FIG. 1, FIG. 10 schematically shows an enlarged view of region A' in FIG. 9, FIG. 11 schematically shows an enlarged view corresponding to region A in FIG. 9 in a stacked electronic component according to an embodiment, and FIG. 12 schematically shows a method for forming a sealing part according to an embodiment.

[0092] Hereinafter, with reference to FIGS. 8 to 12, a stacked electronic component 100' according to another embodiment of the present invention will be described in detail, but the content overlapping with the stacked electronic component 100 according to an embodiment of the present invention will be omitted.

[0093] In FIGS. 10 to 12, another embodiment of the present invention is described with reference to the first external electrode 130' and the first sealing portion 161, but the same can be similarly applied to the second external electrode 140' and the second sealing portion.

[0094] A multilayer electronic component 100' according to another embodiment of the present invention includes a main body 110 including a dielectric layer 111 and internal electrodes 121 and 122 alternately arranged with the dielectric layer, electrode layers 131' and 141' arranged on the main body and connected to the internal electrodes, external electrodes 130' and 140' including a plating portion arranged on the electrode layers and including two or more plating layers 132', 133', 134', 142', 143', 144', and sealing portions 161 and 162 arranged between an end portion EP1 of the electrode layer and an end portion EP2 of the plating portion and having a groove portion R2 recessed toward the electrode layer side.

[0095] The external electrodes 130' and 140' of the multilayer electronic component 100' according to another embodiment of the present invention can include a plating portion arranged on the electrode layers 131' and 141' and including two or more plating layers. The type of each of the two or more plating layers is not particularly limited, and each of the two or more plating layers can be a plating layer including one or more of nickel (Ni), tin (Sn), palladium (Pd), and alloys thereof.

[0096] Specifically, the plating portion can include a first plating portion including two or more plating layers 132', 133', 134' arranged on the first electrode layer 131', and a second plating portion including two or more plating layers 142', 143', 144' arranged on the second electrode layer 141'.

[0097] In the drawings of the present invention, the two or more plating layers are shown as being composed of three layers, but the plating portion of the present invention is not limited to being composed of three plating layers.

[0098] In one embodiment, the plating portion may include Cu plating layers 132' and 142 disposed on the electrode layers 131' and 141', Ni plating layers 133' and 143 disposed on the Cu plating layers, and Sn plating layers 134' and 144 disposed on the Ni plating layers.

[0099] The Cu plating layers 132' and 142 can serve to relieve the stress between the plating portion and the electrode layers 131' and 141. The Ni plating layers 133' and 143 can serve to improve the hermeticity and mechanical strength of the external electrodes 130' and 140. The Sn plating layers 134' and 144 can serve to improve the mountability of the stacked electronic component 100.

[0100] Therefore, according to one embodiment, when the plating portion includes the Cu plating layers 132' and 142 disposed on the electrode layers 131' and 141', the Ni plating layers 133' and 143 disposed on the Cu plating layers, and the Sn plating layers 134' and 144 disposed on the Ni plating layers, the mechanical strength, moisture resistance reliability, and mountability of the stacked electronic component 100' can be improved.

[0101] Referring to FIGS. 9 and 10, the electrode layers 131', 141' and the plating portions can each form end portions EP1, EP2. On the other hand, the end portion EP1 of the electrode layers 131', 141' and the end portion EP2 of the plating portions 132', 133', 134', and the end portion EP2 of the plating portions 132', 133', 134' and the main body 110 may have a weak adhesive force due to the difference in their components, and the end of the plating portion may not be in contact with the main body 110 or the electrode layers 131', 141, so that the electrode layers 131', 141' and the plating portions can each form end portions EP1, EP2. On the other hand, since the end portion EP1 of the electrode layers 131', 141' is a portion vulnerable to the penetration of moisture from the outside, when the electrode layers 131', 141' and the plating portions each form end portions EP1, EP2, it may be difficult to ensure the moisture resistance reliability of the multilayer electronic component 100'. Accordingly, the multilayer electronic component 100' according to still another embodiment of the present invention includes a sealing portion having a groove portion R2 recessed toward the electrode layers 131', 141' and disposed between the end portion EP1 of the electrode layers 131', 141' and the end portion EP2 of the plating portion, thereby improving the moisture resistance reliability of the multilayer electronic component 100'.

[0102] On the other hand, the sealing portions 161, 162 of the multilayer electronic component 100' according to still another embodiment of the present invention can have groove portions recessed toward the electrode layers 131', 141'. The meaning that the sealing portions 161, 162 have groove portions recessed toward the electrode layers 131', 141' can mean that the sealing portions 161, 162 have groove portions recessed in the direction toward the electrode layers 131', 141' among the second directions. Thereby, while ensuring the moisture resistance reliability of the multilayer electronic component 100', the specific gravity occupied by the external electrodes 130', 140' and the sealing portions 161, 162 in the whole component can be minimized.

[0103] In one embodiment, the sealing portions 161, 162 can be arranged so as not to deviate from the end of the outermost plating layer among the plating portions 132', 133', 134'. Thereby, while ensuring the moisture resistance reliability of the multilayer electronic component 100', the specific gravity occupied by the external electrodes 130, 140 in the whole component can be reduced.

[0104] In one embodiment, the end EP1 of the electrode layers 131' and 141' can mean a region where the electrode layers 131' and 141' are separated from the plating portion, and the end EP2 of the plating portion can mean a region where the plating portion is separated from the electrode layers 131' and 141'. As described above, the end EP1 of the electrode layers 131' and 141' can be a portion vulnerable to the penetration of moisture from the outside. Therefore, in one embodiment, the sealing portions 161 and 162 can cover the end EP1 of the electrode layer to further improve the moisture resistance reliability of the stacked electronic component 100'.

[0105] Referring to FIG. 10, a groove portion R1 recessed in the second direction from the end E of the electrode layer 131' can be disposed between the electrode layer 131' and the plating portions 132', 133', and 134'.

[0106] The groove portion R1 can be formed because the plating portions 132', 133', and 134' are not formed at the end EP1 of the electrode layer 131' due to the difference in components when the electrode layer 131' is a sintered electrode containing glass.

[0107] When the groove portion R1 is formed, the end EP1 of the electrode layer 131' may be exposed to the outside, and thus the electrode layer 131' may be damaged by moisture from the outside. In particular, since the groove portion R1 is formed adjacent to the interface where the end EP1 of the electrode layer 131' and the end EP2 of the plating portion are in contact, if moisture from the outside penetrates into the groove portion R1, the bonding force between the electrode layer 131' and the plating portion may be reduced.

[0108] Therefore, by disposing the sealing portions 161 and 162 of the stacked electronic component 100' according to another embodiment of the present invention so as to fill the groove portion R1, damage to the electrode layers 131' and 141' caused by moisture from the outside and a decrease in the bonding force between the electrode layers 131' and 141' and the plating portion can be prevented.

[0109] On the other hand, in order to further improve the moisture resistance reliability of the stacked electronic component 100', the sealing portions 161 and 162 can be formed to have a sufficient thickness at portions vulnerable to moisture penetration.

[0110] Referring to FIG. 10, the minimum size in the second direction from the point I where the electrode layer 131', the plating portion, and the sealing portion 161 are in contact simultaneously to the surface of the sealing portion 161 is indicated by lp.

[0111] Since the point where the electrode layer 131' and the plating portion are in contact is the point where the electrode layer 131' and the plating portion start to separate from each other, it is vulnerable to moisture penetration from the outside and can be a main path for moisture penetration from the outside. In order to prevent moisture from penetrating at the point where the electrode layer 131' and the plating portion are in contact, as shown in FIG. 10, it is preferable to form the sealing portion 161 to be sufficiently thick in the second direction. Therefore, in one embodiment, by adjusting the minimum size lp in the second direction from the point I where the electrode layers 131' and 141', the plating portion, and the sealing portions 161 and 162 are in contact simultaneously to the surfaces of the sealing portions 161 and 162 to 10 nm or more, the phenomenon of moisture penetrating at the point where the electrode layers 131' and 141' and the plating portion are in contact can be sufficiently prevented.

[0112] Referring to FIG. 10, the sealing portion 161 can be extended and disposed on a part of the second surface 2 which is the surface of the main body adjacent to the end E of the electrode layer 131' from the end EP of the electrode layer 131'. That is, the sealing portion 161 according to one embodiment can be extended and disposed on a part of the surface of the main body adjacent to the end E of the electrode layers 131' and 141' from the ends EP of the electrode layers 131' and 141'. Thereby, the bonding force between the electrode layers 131' and 141' and the main body 110 can be improved.

[0113] Referring to FIG. 10, the groove portion R2 recessed on the electrode layer 131' side of the sealing portion 161 is shown as extending beyond the end E of the electrode layer 131', but the present invention is not limited thereto.

[0114] Referring to FIG. 11, the groove portion R2 recessed on the electrode layer 131' side of the sealing portion 161 can be arranged so as not to exceed the end E of the electrode layer 131'. In this case, since the sealing portion 161 can sufficiently cover the vulnerable electrode layer 131' and the plating portion to moisture penetration from the outside, the moisture resistance reliability of the multilayer electronic component 100' can be further improved. That is, in one embodiment, the groove portions R2 recessed on the electrode layer 131', 141' sides of the sealing portions 161, 162 are arranged so as not to exceed the ends E of the electrode layers 131', 141', thereby further improving the moisture resistance reliability of the multilayer electronic component 100'.

[0115] In one embodiment, among the plating portions, the second plating layers 133', 143' and the third plating layers 134', 144' can be arranged not on the sealing portions 161, 162 respectively. When forming the electrode layers 131', 141' and the first plating layers 132', 142 and then forming the second or third plating layers 133', 134', 143', 144' after forming the sealing portions 161, 162, depending on the components of the sealing portions 161, 162, the second plating layers 133', 143' and the third plating layers 134', 144' can be arranged not on the sealing portions 161, 162 respectively. Specifically, when the sealing portions 161, 162 contain an insulating material and the second plating layers 133', 143' and the third plating layers 134', 144' are electrolytic plating, each of the second plating layers 133', 143' and the third plating layers 134', 144' can be arranged not on the sealing portions 161, 162 due to the difference in components.

[0116] In one embodiment, the sealing portions 161, 162 can contain fluorocarbon. Fluorocarbon is excellent in chemical resistance and can be formed densely, so it can effectively prevent moisture penetration from the outside. On the other hand, as long as the dense and uniform sealing portions 161, 162 can be formed, the type of fluorocarbon is not particularly limited.

[0117] For example, the sealing parts 161 and 162 can include one or more of CF2-, CF3-, and CF-series fluorocarbons as fluorocarbons.

[0118] The sealing parts 161 and 162 including one or more of CF2-, CF3-, and CF-series fluorocarbons can be formed by an atmospheric pressure plasma coating method.

[0119] Referring to FIG. 12, the sealing part 161 according to one embodiment can be formed by an atmospheric pressure plasma coating method after the electrode layer 131' and the first plating layer 132' are formed. After that, the second plating layer 133' or the third plating layer 134' can be formed. When the sealing part 161 contains fluorocarbon, the second plating layer 133' or the third plating layer 134' cannot be disposed on the sealing part 161 due to the insulating property of the sealing part 161.

[0120] As described above, the embodiments of the present invention have been described in detail. However, the present invention is not limited by the above-described embodiments and the accompanying drawings, but is limited by the appended claims. Therefore, within the scope not departing from the technical idea of the present invention described in the claims, various forms of substitution, modification, and change are possible by those having ordinary knowledge in the technical field, and it can be said that these also belong to the scope of the present invention.

[0121] In addition, the expression "one embodiment" used in the present disclosure does not mean the same embodiment, but is provided to emphasize and explain each different unique feature. However, the above-presented one embodiment does not exclude being implemented in combination with the features of another one embodiment. For example, even if a matter described in a specific one embodiment is not described in another one embodiment, it can be understood as an explanation related to another one embodiment as long as there is no explanation contrary to or conflicting with that matter in another one embodiment.

[0122] The terms used in this disclosure are merely used to describe an embodiment and are not intended to limit this disclosure. At this time, singular expressions include plural expressions unless the context clearly indicates otherwise.

Description of Reference Numerals

[0123] 100, 100' Multilayer electronic component 110 Body 111 Dielectric layer 112, 113 Cover part 114, 115 Margin part 121, 122 Internal electrode 130, 130', 140, 140' External electrode 131, 131', 141, 141' Electrode layer 132, 132', 142, 142' First plating layer 133, 133', 143, 143' Second plating layer 134, 134', 144, 144' Third plating layer 151, 152, 161, 162 Sealing part

Claims

1. a body including dielectric layers and internal electrodes interleaved with the dielectric layers; an electrode layer disposed on the body and connected to the internal electrode; and an external electrode disposed on the electrode layer, the external electrode including a plating portion including two or more plating layers; a sealing portion disposed between the plating portion and the body, the sealing portion containing Sn and in direct contact with the body.

2. The multilayer electronic component according to claim 1 , wherein the sealing portion contacts an edge of the electrode layer.

3. The multilayer electronic component according to claim 1 , wherein the sealing portion is disposed so as not to come off an end of an outermost plating layer of the plating portion.

4. The multilayer electronic component according to claim 1 , wherein the plating portion completely covers the electrode layer and the sealing portion.

5. The multilayer electronic component according to claim 1 , wherein the sealing portion is disposed so as to be offset from an end of an outermost plating layer of the plating portion.

6. The internal electrodes include Ni, the electrode layer comprises Cu and glass; 2. The multilayer electronic component according to claim 1, wherein the plating portion includes a Cu plating layer disposed on the electrode layer, a Ni plating layer disposed on the Cu plating layer, and a Sn plating layer disposed on the Ni plating layer.

7. 2. The multilayer electronic component according to claim 1, wherein the sealing portion is a Sn-plated layer.

8. 2. The multilayer electronic component according to claim 1, wherein the sealing portion has an average thickness of 1 μm or more and 8 μm or less.

9. a body including dielectric layers and internal electrodes interleaved with the dielectric layers; an electrode layer disposed on the body and connected to the internal electrode; and an external electrode disposed on the electrode layer, the external electrode including a plating portion including two or more plating layers; a sealing portion disposed between an end of the electrode layer and an end of the plating portion, the sealing portion having a groove portion recessed toward the electrode layer.

10. an end of the electrode layer is a region where the electrode layer is separated from the plating portion, and an end of the plating portion is a region where the plating portion is separated from the electrode layer, The multilayer electronic component according to claim 9 , wherein the sealing portion covers an end portion of the electrode layer.

11. The multilayer electronic component according to claim 10 , wherein the sealing portion is disposed so as to extend from an end of the electrode layer onto a part of a surface of the body adjacent to the electrode layer.

12. When a direction in which the dielectric layers and the internal electrodes are alternately arranged is defined as a first direction, and a direction perpendicular to the first direction is defined as a second direction, a groove portion recessed in the second direction from an end of the electrode layer is disposed between the electrode layer and the plating portion; The multilayer electronic component according to claim 9 , wherein the sealing portion is disposed so as to fill the groove portion.

13. When a direction in which the dielectric layers and the internal electrodes are alternately arranged is defined as a first direction, and a direction perpendicular to the first direction is defined as a second direction, The multilayer electronic component according to claim 9 , wherein a minimum dimension in the second direction from a point where the electrode layer, the plating portion, and the sealing portion are in contact with each other to a surface of the sealing portion is 10 nm or more.

14. The multilayer electronic component according to claim 9 , wherein the sealing portion comprises fluorocarbon.

15. 10. The multilayer electronic component according to claim 9, wherein the sealing portion includes at least one of CF2-, CF3-, and CF-series fluorocarbons.

16. the plating unit includes a first plating layer disposed on the electrode layer, a second plating layer disposed on the first plating layer, and a third plating layer disposed on the second plating layer; The multilayer electronic component according to claim 9 , wherein the second plating layer and the third plating layer are not disposed on the sealing portion.

17. The multilayer electronic component according to claim 9 , wherein the groove of the sealing portion is disposed so as not to extend beyond an edge of the electrode layer.

18. The internal electrodes include Ni, the electrode layer comprises Cu and glass; 10. The multilayer electronic component according to claim 9, wherein the plating portion includes a Cu plating layer disposed on the electrode layer, a Ni plating layer disposed on the Cu plating layer, and a Sn plating layer disposed on the Ni plating layer.

19. a body including dielectric layers and internal electrodes interleaved with the dielectric layers; an electrode layer disposed on the body and connected to the internal electrode; and an external electrode disposed on the electrode layer, the external electrode including a plating portion including two or more plating layers; a sealing portion disposed between an end of the plating portion and the body; A multilayer electronic component, wherein the sealing portion is positioned so as not to come off the end of the plating layer that is arranged on the outermost side of the plating portion.

20. an end of the electrode layer is a region where the electrode layer is separated from the plating portion, and an end of the plating portion is a region where the plating portion is separated from the electrode layer, The multilayer electronic component according to claim 19 , wherein the sealing portion covers an end portion of the electrode layer.

21. 21. The laminated electronic component according to claim 20, wherein the sealing portion is disposed so as to extend from an end of the electrode layer onto a portion of a surface of the body adjacent to the electrode layer.

22. When a direction in which the dielectric layers and the internal electrodes are alternately arranged is defined as a first direction, and a direction perpendicular to the first direction is defined as a second direction, a groove portion recessed in the second direction from an end of the electrode layer is disposed between the electrode layer and the plating portion; The multilayer electronic component according to claim 19 , wherein the sealing portion is disposed so as to fill the groove portion.

23. When a direction in which the dielectric layers and the internal electrodes are alternately arranged is defined as a first direction, and a direction perpendicular to the first direction is defined as a second direction, 20. The multilayer electronic component according to claim 19, wherein a minimum dimension in the second direction from a point where the electrode layer, the plating portion, and the sealing portion are in contact with each other to a surface of the sealing portion is 10 nm or more.

24. 20. The laminated electronic component according to claim 19, wherein the sealing portion comprises fluorocarbon.

25. 20. The multilayer electronic component according to claim 19, wherein the sealing portion includes at least one of CF2-, CF3-, and CF-series fluorocarbons.

26. the plating unit includes a first plating layer disposed on the electrode layer, a second plating layer disposed on the first plating layer, and a third plating layer disposed on the second plating layer; The multilayer electronic component according to claim 19 , wherein the second plating layer and the third plating layer are not disposed on the sealing portion.

27. The internal electrodes include Ni, the electrode layer comprises Cu and glass; 20. The multilayer electronic component according to claim 19, wherein the plating portion includes a Cu plating layer disposed on the electrode layer, a Ni plating layer disposed on the Cu plating layer, and a Sn plating layer disposed on the Ni plating layer.

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