Method for manufacturing power converter and power converter

Abstract

To provide a method for manufacturing a power converter and a power converter which realize increase of the reliability, the productivity, and the heat release property.SOLUTION: In a method for manufacturing a power converter, a plurality of power modules and a heat release member for the power modules are thermally connected via a plate-like insulation member. The method includes: a first adhesion step of forming a plurality of first assemblies by attaching the insulation member and the heat release member by a first adhesion layer and assembling the plurality of first assemblies to a cooling flow passage member forming a flow passage wall of a flow passage for flow of a coolant for releasing heat of the power modules; and a second adhesion step of attaching the insulation member and the power modules by a second adhesion layer after the first adhesion step.SELECTED DRAWING: Figure 7

Description

Technical Field

[0001] The present invention relates to a method for manufacturing a power conversion device and a power conversion device.

Background Art

[0002] Power conversion devices that perform power conversion by switching power semiconductor elements are widely used in consumer, in-vehicle, railway, and substation equipment because of their high conversion efficiency. As a configuration example of such a power conversion device, Patent Document 1 below discloses a configuration in which an adhesive layer is provided between a water channel, which is a heat dissipation member, and an insulating member, and between the insulating member and a power module.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the technology described in Patent Document 1, when there are variations in the thickness of each power module, the plate-shaped insulating member provided between the power module and the heat dissipation member may be inclined with respect to the surface of the heat dissipation member, resulting in a problem of peeling due to thermal stress. Further, if the adhesive layer provided between the insulating member and the power module is thickened to eliminate variations during the assembly process, a decrease in reliability due to thermal resistance and a decrease in heat dissipation performance occur.

Means for Solving the Problems

[0005] A method for manufacturing a power conversion device that thermally connects a plurality of power modules and a heat dissipation member corresponding to the plurality of power modules via a plate-shaped insulating member, comprising: forming a plurality of first assemblies by adhering the insulating member and the heat dissipation member with a first adhesive layer; performing a first adhesion step of assembling the plurality of first assemblies to a cooling channel member that forms a channel wall of a channel through which a refrigerant for dissipating heat from the power module flows; and performing a second adhesion step of adhering the insulating member and the power module with a second adhesive layer after the first adhesion step.

Advantages of the Invention

[0006] According to the present invention, it is possible to provide a method for manufacturing a power conversion device and a power conversion device that achieve improved reliability, productivity, and heat dissipation performance.

Brief Description of the Drawings

[0007]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Embodiments for Carrying Out the Invention

[0008] Hereinafter, embodiments of the present invention will be described with reference to the drawings. The following description and drawings are examples for explaining the present invention, and for the sake of clarity of explanation, appropriate omissions and simplifications have been made. The present invention can be implemented in various other forms. Unless otherwise particularly limited, each component may be singular or plural.

[0009] In the drawings, the positions, sizes, shapes, ranges, etc. of the respective components shown may not represent the actual positions, sizes, shapes, ranges, etc. in order to facilitate understanding of the invention. For this reason, the present invention is not necessarily limited to the positions, sizes, shapes, ranges, etc. disclosed in the drawings.

[0010] (Overall Configuration of the Power Conversion Device of the Present Invention) (Figs. 1 to 3) The power conversion device 1 includes a plurality of power modules 101 that are semiconductor devices including semiconductor elements (not shown), and a cooling channel member 107 that forms a channel wall of a cooling channel 107a through which a refrigerant for dissipating heat from the plurality of power modules 101 flows on both sides of the plurality of power modules 101. The configuration of the power conversion device 1 shown in the cross-sectional views of FIGS. 2 and 3 is an example, but the power conversion device 1 includes a total of 24 power modules 101 arranged in 4 columns in the short direction and 6 columns in the long direction.

[0011] The cooling channel member 107 is configured such that only one cooling channel member 107 can correspond to the plurality of power modules 101 on one surface. The cooling channel member 107 is provided with elastic biasing portions 301 corresponding to the plurality of power modules 101 arranged in 4 columns in the short direction in 6 columns in the long direction.

[0012] Between each power module 101 and each elastic biasing portion 301 of the cooling channel member 107, heat dissipation members 105 corresponding to the plurality of power modules 101 are arranged. The heat dissipation members 105 are respectively formed corresponding to the plurality of power modules 101 arranged in 4 columns in the short direction in the cooling channel member 107.

[0013] The power module 101 is molded by encapsulating each component such as semiconductor elements and conductor plates (not shown) with an encapsulating resin, and the surface of the heat dissipation member 105 is brought into contact with the surface of the conductor plate exposed from the encapsulating resin for cooling.

[0014] The heat dissipation member 105 has pin-shaped heat dissipation fins 105a on the side of the cooling channel 107a. The elastic biasing portion 301 is in contact with the heat dissipation fins 105a. The space formed by the elastic biasing portion 301 and the heat dissipation member 105 is the cooling channel 107a, which is a channel for the refrigerant flowing in from a channel inlet and outlet (not shown), and the heat dissipation fins 105a are arranged in the cooling channel 107a.

[0015] Since the power conversion device 1 is cooled on both sides, the refrigerant flows from the cooling channel 107a formed on one surface, through piping components (not shown), to the cooling channel 107a formed on the opposite surface. Note that, as the refrigerant flowing through the cooling channel 107a, water, an antifreeze liquid in which ethylene glycol is mixed into water, or the like is used.

[0016] The cooling channel member 107 is fastened using screws 111 at the four corners in the planar direction of the region where a plurality of elastic biasing portions 301 are provided. Thereby, it is possible to secure the pressing force for pressing each elastic biasing portion 301 corresponding to each power module 101, and also to improve the adhesion reliability of the elastic biasing portion 301 with respect to the heat dissipation member 105.

[0017] A plate-shaped insulating member 103 is arranged between the power module 101 and the heat dissipation member 105. The insulating member 103 thermally connects the power module 101 and the heat dissipation member 105. The insulating member 103 and the heat dissipation member 105 are adhered to each other by a first adhesive layer 104. The insulating member 103 and the power module 101 are adhered to each other by a second adhesive layer 102. Both end portions of the insulating member 103 in the short side direction of the power conversion device 1 are covered by the first adhesive layer 104 by pressing and fixing in a manufacturing process described later.

[0018] By doing so, the insulating member 103 is protected by the first adhesive layer 104, and it is possible to prevent the insulating member 103 from cracking or being damaged during the manufacturing process and the reliability test under thermal stress. Note that the first adhesive layer 104 and the second adhesive layer 102 are thermally conductive adhesive layers. For example, they are made of resin such as silicone or epoxy adhesive layer added with zinc oxide or alumina powder filler, or metal bonding materials such as solder and brazing material. Further, the insulating member 103 is, for example, an alumina plate, an alumina zirconia plate, or a silicon nitride plate, and has a thermal conductivity of 0.5 [W / mK] or more.

[0019] (Manufacturing method of power conversion device) (Figs. 4 and 5) The first bonding step according to the manufacturing method of the power conversion device 1 of the present invention will be described. The first bonding step is a step of bonding the insulating member 103 to the heat dissipation member 105 using the first adhesive layer 104 to form the first assembly 110, and assembling the assembly 110 to each elastic biasing portion 301 of the cooling channel member 107.

[0020] As shown in Fig. 4(a), the heat dissipation member 105 has a positioning portion 109 for installing the positioning pins 201. The positioning portion 109 is a recess formed in accordance with the diameter of the positioning pins 201 temporarily connected to the heat dissipation member 105 in order to define an arrangement area for arranging the insulating member 103 on the heat dissipation member 105. First, the positioning pins 201 are installed in the positioning portion 109. Note that the positioning pins 201 may be made of metal or resin.

[0021] Next, as shown in Fig. 4(b), the first adhesive layer 104 is applied onto the protruding portion 105c, which is a protruding shape and is the position where the insulating member 103 is installed on the heat dissipation member 105. Then, the insulating member 103 having a width that fits within the range between the positioning pins 201 installed on the heat dissipation member 105 is mounted onto the protruding portion 105c between the positioning pins 201. Note that at least three positioning pins 201 are sufficient on the heat dissipation member 105, but from the viewpoint of stability during installation, it is desirable to have four or more.

[0022] Next, as shown in FIG. 4(c), pressure is applied from above the insulating member 103 using a pressing machine 202 or the like so that the insulating member 103 is covered with the first adhesive layer 104 and the first adhesive layer 104 has a specified thickness. In order to prevent cracks from occurring in the insulating member 103 due to excessive pressure and causing damage, an upper limit is set for the amount of pressure. For example, the range of the amount of pressure is from 0.1 MPa to 2 MPa. Also, instead of specifying the amount of pressure by only one level, it may be specified by two or more levels so that the pressure is applied in two or more stages.

[0023] Next, in FIG. 4(d), the pressing machine 202 is separated from the insulating member 103 and the positioning pin 201 is removed from the positioning portion 109. When being pressed by the pressing machine 202, since the positioning pin 201 was provided on the heat dissipation member 105, even if the positioning pin 201 is removed after pressing, the first adhesive layer 104 that has been pressed and deformed in the positioning portion 109 does not flow in. In this way, a plurality of first assemblies 110 in which the insulating member 103 and the heat dissipation member 105 are adhered to each other by the first adhesive layer 104 are formed.

[0024] The flow path plane 105b of the heat dissipation member 105 is formed to have substantially the same area as the heat dissipation surface of the power module 101. By doing so, the bending stress applied to the insulating member 103 is relaxed, and the reliability is improved by suppressing cracks in the insulating member 103.

[0025] Note that the angle formed by the least-squares plane of the flow path plane 105b of the heat dissipation member 105 and the least-squares plane of the surface of the insulating member 103 is desirably 10 degrees or less. Thereby, it is possible to suppress the displacement of the plane of the insulating member 103 with respect to the flow path plane 105b of the heat dissipation member 105. Also, when the main component of the first adhesive layer 104 is a thermosetting resin, heat treatment necessary in a constant temperature bath or the like may be performed for resin curing.

[0026] FIG. 5(a) shows the cooling channel member 107 in a state where the first assembly 110 formed in FIG. 4(d) is not mounted. In the cooling channel member 107, a plurality of elastic biasing portions 301 are located at positions where the first assembly 110 is to be mounted.

[0027] In FIG. 5(b), when mounting the first assembly 110 on the cooling channel member 107, a plurality of seal members 106 for connecting the cooling channel 107 and the plurality of assemblies 110 are applied. The seal member 106 is an adhesive, a rubber elastic material, a brazing material, etc., and is a deformable material when the first assembly 110 is mounted on the cooling channel member 107 and pressurized.

[0028] In FIG. 5(c), a plurality of first assemblies 110 are mounted on the openings 107b of the respective elastic biasing portions 301, and each first assembly 110 is brought into close contact with the seal member 106, and the first assembly 110 is pressurized toward the cooling channel member 107. Thereby, the first assemblies 110 arranged in six rows in the longitudinal direction of the cooling channel member 107 are assembled to the cooling channel member 107 and fixed by curing the seal material 106. Thus, the first bonding step is completed.

[0029] After completing the above-described first bonding step and before starting the second bonding step, an inspection step is performed according to the procedure of FIG. 7 described later. Thereby, the bonding state of the first bonding layer 104 is inspected, and it is determined whether the power module 101 scheduled to be mounted in the second bonding step can be properly mounted on the first assembly 110 assembled to the cooling channel member 107. By doing so, the reliability and heat dissipation performance of the power conversion device 1 are improved. After the inspection step is completed, the process proceeds to the second bonding step.

[0030] (FIG. 6) The second bonding step will be described. First, FIG. 6(a) shows a state where the first assembly 110 is pressurized and assembled to the cooling channel member 107 in FIG. 5(c). This state is referred to as the second assembly 110a. In FIG. 6(b), in the second assembly 110a, the second bonding layer 102 is applied to the insulating member 103 of the first assembly 110 by a coating machine (not shown).

[0031] When applying the second adhesive layer 102, the first adhesive layer 104 is thermally cured to sufficiently adhere to the insulating member 103 and the heat dissipation member 105, thereby suppressing the displacement of the insulating member 103 during the application operation of the second adhesive layer 102, and contributing to the stable manufacturing of the power conversion device 1.

[0032] In FIG. 6(c), a plurality of power modules 101 mounted on the printed circuit board 108 are mounted and adhered to the positions where the second adhesive layer 102 is applied on each insulating member 103. From above the power module 101, by pressing the power module 101 with a press machine (not shown), the second adhesive layer 102 spreads in the planar direction, bringing the power module 101 into close contact with the insulating member 103, and thermally connecting the power module 101 and the heat dissipation member 105 via the insulating member. Thus, the second bonding step is completed.

[0033] Note that the power module 101 is arranged on the printed circuit board 108 with the lower surface of the power module 101 aligned with a predetermined reference plane in the stacking direction. Thereby, the lower surface of the power module 101 can be set to a unified height, and a plurality of power modules 101 can be stably arranged.

[0034] After the completion of the second bonding step, in FIG. 6(d), the second adhesive layer 102 is applied on the power module 101. In FIG. 6(e), the same product as the second assembly 110a created in FIG. 6(a) is mounted so that the insulating member 103 and the second adhesive layer 102 of the second assembly 110a are adhered.

[0035] Then, the cooling channel members 107 on both sides in the stacking direction are tightened and fixed with bolts and nuts (not shown). As a result, the adhesive surfaces of the first adhesive layer 104 and the second adhesive layer 102 spread due to the pressure and can cover the insulating member 103, thus contributing to the protection of suppressing cracks in the insulating member 103. Through the above steps, the power conversion device 1 is manufactured.

[0036] Note that, in order to absorb the tolerance due to the thickness variation of the plurality of power modules 101, when the thickness of a certain power module 101 is relatively smaller than that of other power modules 101, it is necessary to increase the thickness of the second adhesive layer 102. This makes it difficult for compressive stress to be applied, which may cause a decrease in reliability and heat dissipation due to thermal stress.

[0037] To avoid this, when the first adhesive layer 104 and the second adhesive layer 102 are both made of resin, the second adhesive layer 102 is made to have a higher content of metal fillers and a lower resin content than the first adhesive layer 104. By separating the materials in this way, the thermal conductivity of the second adhesive layer 102 can be made higher than that of the first adhesive layer 104, and good heat conduction can be maintained between the power module 101, the insulating member 103, and the heat dissipation member 105. Also, thereby, the shear strength of the first adhesive layer 104 becomes higher than that of the second adhesive layer 102, but it is desirable for the second adhesive layer 102 to have a higher thermal conductivity even if the shear strength is small, and the fixing property between the insulating member 103 and the heat dissipation member 105 in the first assembly 110 can be enhanced.

[0038] (Inspection process) (Fig. 7) The procedure for the inspection process carried out between the first bonding process and the second bonding process will be described. First, after the completion of the first bonding process, in step S701, the void ratio of the first adhesive layer 104 is measured. For measuring the void ratio of the first adhesive layer 104, for example, X-ray transmission measurement or ultrasonic flaw detection measurement may be used.

[0039] In step S702, it is determined whether the measured void ratio of the first adhesive layer 104 is lower than a first specified value. If the void ratio of the first adhesive layer 104 is equal to or higher than the first specified value (NO), it is determined that the product is defective with deteriorated reliability in step S709, and the flow of the inspection process is terminated. If the void ratio of the first adhesive layer 104 is lower than the first specified value (YES), it is determined that the product is good, and the process proceeds to step S703. Note that the specified value in step 702 is, for example, a void ratio of 5%.

[0040] In step S703, a first thickness T1, which is the thickness of the first adhesive layer 104 in the first assembly 110, is obtained. Subsequently, in step S704, it is determined whether the first thickness T1 is lower than a second specified value. If the first thickness T1 is greater than or equal to the second specified value (NO), it is determined that the product is defective with deteriorated reliability in step S703, and the flow of the inspection process is terminated. If the first thickness T1 is lower than the second specified value (YES), the process proceeds to step S705.

[0041] In step S705, a second thickness T2, which is the maximum thickness among the thicknesses of the plurality of power modules 101 to be installed on the heat dissipation member 105, is obtained. In step S706, it is determined whether the sum value T1 + T2 of the first thickness T1 and the second thickness T2 is lower than a third specified value. If the sum value T1 + T2 is lower than the third specified value (YES), the process proceeds to step S707. If the sum value T1 + T2 is greater than or equal to the third specified value (NO), the process proceeds to step S708.

[0042] Note that, for measuring the thicknesses of the first adhesive layer 104 and the power module 101, for example, a laser beam, a micrometer, an interference fringe measuring device, etc. may be used.

[0043] In step S707, mounting the power module 101 onto the second assembly 110a is permitted, and the second bonding process in FIG. 6 is performed. On the other hand, in step S708, mounting the power module 101 onto the second assembly 110a is prohibited.

[0044] By performing the inspection process in this way, it can be confirmed that the thickness of the first adhesive layer 104 is approximately uniform by the pressing process, and the plane of the insulating member 103 and the flow path plane 105b of the heat dissipation member 105 are approximately parallel, and thus the process can proceed to the second bonding process. Also, the first adhesive layer 104 becomes smaller than before, improving heat dissipation performance. Furthermore, compressive stress is more likely to be applied to the first adhesive layer 104 and the second adhesive layer 102 for each power module 101. As a result, not only can the second adhesive layer 102 absorb the thickness tolerance (variation), but also the reliability is improved and the productivity can be enhanced.

[0045] According to the embodiments of the present invention described above, the following operational effects are achieved.

[0046] (1) A method for manufacturing a power conversion device 1 that thermally connects a plurality of power modules 101 and heat dissipation members 105 corresponding to the plurality of power modules 101 via a plate-shaped insulating member 103, comprising forming a plurality of first assemblies 110 by adhering the insulating member 103 and the heat dissipation member 105 with a first adhesive layer 104, and performing a first bonding step of assembling the plurality of first assemblies 110 to a cooling channel member 107 that forms a channel wall of a channel through which a refrigerant for dissipating heat from the power module 101 flows. After the first bonding step, a second bonding step of bonding the insulating member 103 and the power module 101 with a second adhesive layer 102 is performed. By adopting a manufacturing method that separates the first bonding step and the second bonding step in this way, a power conversion device 1 with improved reliability, productivity, and heat dissipation performance can be provided.

[0047] (2) After the first bonding step and before starting the second bonding step, an inspection step of inspecting the bonding state of the first adhesive layer 104 is performed. By doing so, a power conversion device 1 with improved reliability, productivity, and heat dissipation performance can be provided.

[0048] (3) In the inspection step, it is determined whether the void ratio of the first adhesive layer 104 is lower than a first specified value. If the void ratio is lower than the first specified value, it is determined whether a first thickness T1, which is the thickness of the first adhesive layer 104, is lower than a second specified value. If the first thickness T1 is lower than the second specified value, it is determined whether the sum of the first thickness T1 and a second thickness T2, which is the maximum thickness of the plurality of power modules 101, is lower than a third specified value. If the sum value is lower than the third specified value, the second bonding step is performed. By doing so, a power conversion device 1 with improved reliability, productivity, and heat dissipation performance can be provided.

[0049] (4) The main components of the first adhesive layer 104 and the second adhesive layer 102 are resins. By doing so, it contributes to improving reliability and heat dissipation performance.

[0050] (5) In the first bonding step, pressure is applied so that the insulating member 103 is covered with the first bonding layer 104. By doing so, the occurrence of cracks in the insulating member 103 can be suppressed.

[0051] (6) In the first bonding step, a positioning portion 109 is provided on the heat radiating member in order to define an arrangement region where the insulating member 103 is arranged on the heat radiating member 105. By doing so, the insulating member 103 can be appropriately arranged on the heat radiating member 105.

[0052] (7) In the first bonding step, the angle formed by the least-squares plane on the surface of the heat radiating member 105 on the flow path side and the least-squares plane on the surface of the insulating member 103 is set to 10 degrees or less. By doing so, the displacement of the plane of the insulating member 103 with respect to the flow path plane 105b of the heat radiating member 105 can be suppressed.

[0053] (8) The shear force of the first bonding layer 104 is made higher than the shear force of the second bonding layer 102. By doing so, the fixing property between the insulating member 103 and the heat radiating member 105 in the first assembly 110 can be enhanced.

[0054] (9) The thermal conductivity of the second bonding layer 102 is made higher than the thermal conductivity of the first bonding layer 104. By doing so, good heat conduction among the power module 101, the insulating member 103, and the heat radiating member 105 can be maintained.

[0055] (10) Heat radiating fins 105a are provided on the heat radiating member 105 on the flow path side, an elastically biasing portion 301 is provided on the surface of the cooling flow path member 107 that contacts the heat radiating fins 105a, in the first bonding step, the first assembly 110 is assembled to the cooling flow path member 107 using a sealing member 106, and after the second bonding step, pressure is applied to the heat radiating member 105 with respect to the power module 101. By doing so, the cooling flow path 107a can be formed, contributing to the improvement of heat dissipation.

[0056] (11) The power conversion device 1 includes a plurality of power modules 101, a cooling channel member 107 that forms the channel wall of a cooling channel 107a through which a refrigerant for dissipating heat from the plurality of power modules 101 flows, a heat dissipation member 105 disposed between the plurality of power modules 101 and the cooling channel member 107 and provided corresponding to each power module 101, and a plate-shaped insulating member 103 disposed between the power module 101 and the heat dissipation member 105 and thermally connecting the power module 101 and the heat dissipation member 105. The insulating member 103 and the heat dissipation member 105 are adhered to each other by a first adhesive layer 104 to form a first assembly 110, and the insulating member 103 and the power module 101 are adhered to each other by a second adhesive layer 102. The first assembly 110 is assembled to the cooling channel member 107. By adopting the manufacturing method of the power conversion device 1 of the present invention for such a power conversion device 1, a power conversion device 1 can be provided that realizes improved reliability, improved productivity, and improved heat dissipation performance.

[0057] Note that the present invention is not limited to the above-described embodiments, and various modifications and combinations with other configurations can be made without departing from the gist thereof. Also, the present invention is not limited to those having all the configurations described in the above embodiments, and those in which a part of the configuration is deleted are also included.

Explanation of Reference Numerals

[0058] 1 Power conversion device 101 Power module 102 Second adhesive layer 103 Insulating member 104 First adhesive layer 105 Heat dissipation member 105a Heat dissipation fin 105b Channel plane 105c Protrusion 106 Sealing member 107 Cooling channel member 107a Cooling channel 107b Opening 108 Printed circuit board 109 Positioning portion 110 First set of three-dimensional objects 110a Second set of three-dimensional objects 111 Screw 201 Positioning pin 202 Press machine 301 Elastic biasing part

Claims

1. A method for manufacturing a power conversion device that thermally connects a plurality of power modules and a heat dissipation member corresponding to the plurality of power modules via a plate-shaped insulating member, comprising: forming a plurality of first assemblies by adhering the insulating member and the heat dissipation member with a first adhesive layer, and performing a first adhesion step of assembling the plurality of first assemblies to a cooling channel member that forms a channel wall of a channel through which a refrigerant for dissipating heat from the power module flows; after the first adhesion step, performing a second adhesion step of adhering the insulating member and the power module with a second adhesive layer A method for manufacturing a power conversion device.

2. After the first adhesion step and before starting the second adhesion step, performing an inspection step of inspecting the adhesion state of the first adhesive layer The method for manufacturing a power conversion device according to Claim 1.

3. In the inspection step, determining whether the void ratio of the first adhesive layer is lower than a first specified value; when the void ratio is lower than the first specified value, determining whether a first thickness, which is the thickness of the first adhesive layer, is lower than a second specified value; when the first thickness is lower than the second specified value, determining whether the sum of the first thickness and a second thickness, which is the maximum thickness of the plurality of power modules, is lower than a third specified value; when the sum value is lower than the third specified value, performing the second adhesion step The method for manufacturing a power conversion device according to Claim 2.

4. The main components of the first adhesive layer and the second adhesive layer are resin The method for manufacturing a power conversion device according to Claim 1.

5. In the first adhesion step, applying pressure so that the insulating member is covered with the first adhesive layer The method for manufacturing a power conversion device according to Claim 1.

6. In the first adhesion step, providing a positioning portion on the heat dissipation member to define an arrangement region for arranging the insulating member on the heat dissipation member The method for manufacturing a power conversion device according to Claim 1.

7. In the first adhesion step, making the angle formed by the least-squares plane on the channel side surface of the heat dissipation member and the least-squares plane on the surface of the insulating member 10 degrees or less The method for manufacturing a power conversion device according to Claim 1.

8. Making the shear force of the first adhesive layer higher than the shear force of the second adhesive layer The method for manufacturing a power conversion device according to Claim 1.

9. Making the thermal conductivity of the second adhesive layer higher than the thermal conductivity of the first adhesive layer The method for manufacturing a power conversion device according to Claim 1.

10. In the heat radiating member, heat radiating fins are provided on the flow path side, In the cooling flow path member, an elastically biasing portion is provided on the surface that contacts the heat radiating fins, In the first bonding step, the assembly is assembled to the cooling flow path member using a sealing member, After the second bonding step, the heat radiating member is pressurized against the power module A method for manufacturing a power conversion device.

11. A plurality of power modules, A cooling flow path member that forms a flow path wall of a cooling flow path through which a refrigerant for radiating heat from the plurality of power modules flows, A heat radiating member that is disposed between the plurality of power modules and the cooling flow path member and is provided corresponding to each of the power modules, A plate-shaped insulating member that is disposed between the power module and the heat radiating member and thermally connects the power module and the heat radiating member, The insulating member and the heat radiating member are adhered to each other by a first adhesive layer to form a first assembly, The insulating member and the power module are adhered to each other by a second adhesive layer, The first assembly is assembled to the cooling flow path member Power conversion device.

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