Electronic component

Abstract

To provide an electronic component.SOLUTION: An electronic component includes: a case having a recess and an opening edge of the recess; a ceramic element which is disposed in the recess and includes a first main surface and a second main surface opposed to each other, a first electrode portion formed on the first main surface, and a second electrode portion formed on the second main surface and in which the first main surface and the second main surface are a pair of surfaces each having the largest area in the ceramic element; a first metal terminal including a first mounting portion disposed on the opening edge and being substantially perpendicular to the first main surface and the second main surface, and a first electrode connection portion connected to the first electrode portion; and a second metal terminal including a second mounting portion disposed on the opening edge and being substantially perpendicular to the first main surface and the second main surface, and a second electrode connection portion connected to the second electrode portion.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to an electronic component used as a capacitor or the like.

Background Art

[0002] Conventionally, capacitors and the like configured by connecting metal terminals to a single-plate dielectric disk have been proposed. Also, electronic components have been proposed in which the periphery of such a dielectric disk is molded with an exterior material to form a form suitable for surface mounting.

[0003] However, conventional surface-mount electronic components have a problem in that the assembly process is complicated because a process of molding with an exterior material is required after fixing a dielectric disk or metal terminals in a cavity for resin molding. Also, since it is necessary to change the molding die as the size of the dielectric disk changes, there is a problem that it is difficult to flexibly respond to changes in the size of the dielectric disk or the like.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In view of such a situation, the present invention provides an electronic component that can flexibly respond to changes in the size of an internal ceramic element and has good productivity.

Means for Solving the Problems

[0006] In order to solve the above problems, the electronic component according to the present invention a case having a concave portion and an opening edge portion of the concave portion, A ceramic element disposed in the recess, having a first main surface and a second main surface facing each other, a first electrode portion formed on the first main surface, and a second electrode portion formed on the second main surface. A first metal terminal disposed at the opening edge, substantially perpendicular to the first main surface and the second main surface, having a first mounting portion, and a first electrode connection portion connected to the first electrode portion. A second metal terminal disposed at the opening edge, substantially perpendicular to the first main surface and the second main surface, having a second mounting portion, and a second electrode connection portion connected to the second electrode portion.

[0007] Since the electronic component according to the present invention houses a ceramic element in a recess in a case, there is no need for a step of disposing a ceramic element or the like in a cavity for resin molding and performing molding with an exterior material, and the productivity is good. Further, since the main surface of the ceramic element is perpendicular to the mounting portion, the mounting area can be effectively narrowed.

[0008] Also, for example, the case may have a first outer surface and a second outer surface that are substantially perpendicular to the first main surface, the second main surface, the first mounting portion, and the second mounting portion and face opposite directions. The distance from the tip of the first mounting portion to the first outer surface may be shorter than the distance from the tip of the first mounting portion to the recess. The distance from the tip of the second mounting portion to the second outer surface may be shorter than the distance from the tip of the second mounting portion to the recess.

[0009] In such an electronic component, since the first mounting portion and the second mounting portion extend from the recess toward the outer surface of the case along the opening edge, the first metal terminal and the second metal terminal are reliably supported by the case, and the mounting posture is stabilized, so that it is possible to effectively prevent the component from falling during mounting.

[0010] Also, for example, the ceramic element may have a first element portion and a second element portion each having the first main surface, the second main surface, the first electrode portion, and the second electrode portion. The first element portion and the second element portion may be arranged in the recess along the length direction of the case in a posture where the first main surface of the first element portion and the first main surface of the second element portion face in opposite directions. The first electrode connection portion may be connected to the first electrode portion of the first element portion. The second electrode connection portion may be connected to the second electrode portion of the second element portion. It may have a third metal terminal that connects the second electrode portion of the first element portion and the first electrode portion of the second element portion. Further, the first element portion and the second element portion may be arranged in the recess such that the first main surface of the first element portion and the second main surface of the second element portion are located on substantially the same plane, and the second main surface of the first element portion and the first main surface of the second element portion are located on substantially the same plane.

[0011] The ceramic element arranged in the recess may be a single ceramic element, or may be a combination of a plurality of plate-like portions such as the first element portion and the second element portion. Such an electronic component has a narrow mounting area and constitutes an electronic component in which two element portions are connected in series.

[0012] Further, for example, the third metal terminal may have a third electrode connection portion that connects the second electrode portion of the first element portion and the first electrode portion of the second element portion, and a third mounting portion that is arranged at the opening edge portion and is substantially perpendicular to the first main surface and the second main surface.

[0013] By changing the connection to the third mounting portion, such an electronic component can change the connection state to the circuits of the two element portions.

[0014] Further, for example, the ceramic element may have a first element portion and a second element portion each having the first main surface, the second main surface, the first electrode portion, and the second electrode portion. The first element portion and the second element portion may be arranged in the recess along the length direction of the case in a posture where the first main surface of the first element portion and the first main surface of the second element portion face the same direction. The first electrode connection portion may be connected to the first electrode portions of both the first element portion and the second element portion. The second electrode connection portion may be connected to the second electrode portions of both the first element portion and the second element portion. Further, the first element portion and the second element portion may be arranged in the recess such that the first main surface of the first element portion and the first main surface of the second element portion are located on substantially the same plane, and the second main surface of the first element portion and the second main surface of the second element portion are located on substantially the same plane.

[0015] Such an electronic component has a narrow mounting area and constitutes an electronic component in which two element portions are connected in parallel.

[0016] Further, for example, at least a part of the opening edge portion of the case may be visible from below.

[0017] Such an electronic component has at least a part of the opening of the recess exposed, has a simple structure, and has good productivity.

[0018] Further, for example, the case may be substantially hexagonal columnar in which none of the outer surfaces are parallel to the first main surface and the second main surface.

[0019] Such an electronic component can improve the sense of stability during mounting while maintaining a narrow mounting area.

[0020] Further, for example, the electronic component according to the present invention includes a groove portion formed on a third outer surface of the case, and a protrusion portion formed on a fourth outer surface of the case and corresponding to the shape of the groove portion.

[0021] Such electronic components can improve the mounting efficiency because, by connecting a plurality of electronic components, they can be transported at once using a mounting machine when being transported and mounted on, for example, a mounting substrate.

[0022] Further, for example, the first metal terminal may have a first folded-back portion that extends upward along the outer surface of the case from the tip of the first mounting portion. The second metal terminal may have a second folded-back portion that extends upward along the outer surface of the case from the tip of the second mounting portion.

[0023] Electronic components having such metal terminals are likely to form solder fillets during mounting and have good mountability.

Brief Description of the Drawings

[0024]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Embodiments for Carrying out the Invention

[0025] Hereinafter, the present invention will be described based on the embodiments shown in the drawings.

[0026] First Embodiment Figure 1 is a schematic perspective view of an electronic component 10 according to a first embodiment of the present invention from the bottom side. As shown in Figure 1, the electronic component 10 has a case 20 and a ceramic element 30 disposed in a recess 21 of the case 20. Also, as can be understood from Figure 4 showing the internal state of the electronic component 10, the electronic component 10 has a first metal terminal 40 and a second metal terminal 50 that are respectively connected to the ceramic element 30 disposed in the recess 21. Note that Figure 4 is a conceptual diagram showing a state in which the case 20 of the electronic component 10 is seen through. In Figure 4, the case 20 is shown by a virtual line (two-dot chain line).

[0027] Figure 2 is a perspective view of the electronic component 10 seen from the side. As shown in Figures 1 and 2, the electronic component 10 has a substantially rectangular flat plate shape or a rectangular parallelepiped shape in which two of the three lengths are substantially equal and the other length is shorter than the other two lengths. However, the electronic component 10 is not limited to this, and may have a polygonal flat plate shape other than a rectangle, or a polygonal columnar shape other than a rectangular parallelepiped (see Figure 6). As can be understood from a comparison between Figure 2 and Figure 4, in the electronic component 10, the side where the opening 21a of the recess 21 formed in the case 20 is formed becomes the mounting surface side that faces a substrate or the like to be mounted when the electronic component 10 is mounted.

[0028] As shown in FIG. 1, the case 20 has a recess 21 and an opening edge 22 surrounding the opening 21a of the recess 21. As shown in FIG. 2, the opening 21a of the recess 21 is formed in one of the four narrow surfaces, rather than the two large surfaces, among the surfaces of the case 20. Thereby, the mounting area of the electronic component 10 can be reduced.

[0029] FIG. 3 is a bottom view of the electronic component 10 as viewed from the mounting surface side. The case 20 houses a ceramic element 30 or the like inside the recess 21. The opening 21a of the recess 21 has a rectangular shape smaller than the outer shape of the case 20. Further, as shown in FIG. 4, the recess 21 forms a substantially rectangular parallelepiped space inside the case 20. Above the electronic component 10 in the direction opposite to the opening 21a of the recess 21, an upper bottom 23 of the case 20 is formed.

[0030] As shown in FIG. 3, the opening edge 22 is composed of a frame-shaped plane surrounding the opening 21a. The opening edge 22 is substantially perpendicular to the first main surface 31a and the second main surface 31b of the ceramic element 30 described later. Note that the shape of the opening edge 22 may be different from the opening edge 22 shown in FIG. 3 according to the shape of the opening 21a, the outer peripheral shape of the case 20, etc. (see FIG. 7, etc.).

[0031] As shown in FIG. 3, the first mounting portion 42 of the first metal terminal 40 and the second mounting portion 52 of the second metal terminal 50 are arranged on the opening edge 22.

[0032] As shown in FIGS. 3 and 4, the ceramic element 30 is disposed in the recess 21 of the case 20. As shown in FIG. 3, the ceramic element 30 has a first main surface 31a and a second main surface 31b that face each other, and has a substantially disk-shaped outer shape. However, the ceramic element 30 may have a shape other than a disk shape, such as an elliptical disk shape or a rectangular flat plate shape. Note that the first main surface 31a and the second main surface 31b are a pair of surfaces having the largest area in the ceramic element 30. Further, as shown in FIG. 3, in the description of the ceramic element 30, one of the two main surfaces is defined as the first main surface 31a and the other as the second main surface 31b, but the first main surface 31a and the second main surface 31b may be interchanged with respect to the state shown in the drawing.

[0033] As shown in FIG. 3 which is a bottom view of the electronic component 10, the ceramic element 30 has a first electrode portion 33 formed on the first main surface 31a, a second electrode portion 34 formed on the second main surface 31b, and a dielectric portion 35 sandwiched between the first electrode portion 33 and the second electrode portion 34. The material of the dielectric portion 35 is not particularly limited, and is, for example, composed of a dielectric material such as calcium titanate, strontium titanate, barium titanate, or a mixture thereof. Note that the ceramic element 30 is not limited to only a capacitor or the like in which the dielectric portion 35 is sandwiched between the first electrode portion 33 and the second electrode portion 34. For example, the ceramic element may be a varistor or a thermistor in which a semiconductor ceramic is sandwiched between the first electrode portion and the second electrode portion.

[0034] The materials of the first electrode portion 33 and the second electrode portion 34 are also not particularly limited, and usually copper, copper alloy, nickel, nickel alloy, etc. are used, but silver, an alloy of silver and palladium, etc. can also be used. The thicknesses of the first electrode portion 33 and the second electrode portion 23 are not particularly limited, but are usually about 10 to 50 μm. Note that at least one metal film selected from Ni, Cu, Sn, etc. may be formed on the surfaces of the first and second electrode portions 33 and 34.

[0035] As shown in Fig. 4, the ceramic element 30 is disposed in the recess 21 such that the first main surface 31a and the second main surface 31 face in a direction perpendicular to the opening 21a. Therefore, the depth W2, which is the distance from the opening 21a of the case 20 to the upper bottom 23 of the recess 21, is larger than the diameter W1 of the ceramic element 30. Thereby, the entire ceramic element 30 can be accommodated in the recess 21 without a part of the ceramic element 30 being exposed from the opening 21a of the recess 21. Also, in the electronic component 10, the recess 21 may be filled with a molding resin, and in such a case, the entire ceramic element 30 can be covered with the molding resin.

[0036] As shown in Fig. 4, the case 20 does not have a lid portion that closes the opening 21a. Therefore, as shown in Fig. 3, in the electronic component 10, at least a part of the opening edge portion 22 of the case 20, that is, the remaining portion excluding the portions where the first mounting portion 42 and the second mounting portion 52 are disposed in the opening edge portion 22, is visible from below. Thus, since the case 20 has a simple shape without a lid attached, the electronic component 10 has good productivity.

[0037] Fig. 5 is a schematic perspective view showing the first metal terminal 40 and the second metal terminal 50 in the electronic component 10. As shown in Figs. 3 to 5, the electronic component 10 has a pair of metal terminals 40 and 50. The first metal terminal 40 and the second metal terminal 50 are spaced apart from each other and electrically insulated in the electronic component 10. The first metal terminal 40 and the second metal terminal 50 are formed, for example, by machining a conductive metal plate material, but the forming method of the metal terminals 40 and 50 is not particularly limited.

[0038] As shown in FIGS. 3 to 5, the first metal terminal 40 has a first mounting portion 42 disposed at the opening edge portion 22, a first electrode connection portion 44 connected to the first electrode portion 33 of the ceramic element 30, a first terminal arm portion 46 connecting the first mounting portion 42 and the first electrode connection portion 44, and a first folding portion 47 extending upward from the tip 42a of the first mounting portion 42. As shown in FIG. 4, the first electrode connection portion 44 and the first terminal arm portion 46 are housed in the recess 21 of the case 20, similar to the ceramic element 30.

[0039] As shown in FIGS. 3 and 4, the first electrode connection portion 44 extends substantially parallel to the first main surface 31a of the ceramic element 30 and is connected to the first electrode portion 33 formed on the first main surface 31a via solder, a conductive adhesive, or the like. On the other hand, the first mounting portion 42 is disposed on one side of the opening edge portion 22 (the first outer surface 24 side of the case 20).

[0040] As shown in FIGS. 4 and 5, the first terminal arm portion 46 of the first metal terminal 40 connects the first electrode connection portion 44 in the recess 21 and the first mounting portion 42 outside the recess 21. Also, as shown in FIGS. 3 and 4, the first mounting portion 42 is substantially perpendicular to the first main surface 31a and the second main surface 31b of the ceramic element 30.

[0041] As shown in FIGS. 3 and 4, the case 20 has a first outer surface 24 and a second outer surface 25 that are perpendicular to the first main surface 31a and the second main surface 31b of the ceramic element 30, and the first mounting portion 42 and the second mounting portion 52 of the metal terminals 40 and 50. That is, the first outer surface 24 and the second outer surface 25 are a pair of opposing outer surfaces among the four outer surfaces of the case 20, and have a smaller area than the other outer surfaces excluding the first outer surface 24 and the second outer surface 25. Among the outer surfaces of the case 20, the surface perpendicular to the opening edge portion 22 is the outer surface.

[0042] As shown in FIG. 3, the tip 42a of the first mounting portion 42 is the end portion on the side opposite to the side connected to the first terminal arm portion 46 in the first mounting portion 42 and is connected to the first folding portion 47. The distance D1 from the tip 42a of the first mounting portion 42 to the first outer surface 24 is the tip 42 of the first mounting portion 42 is shorter than the distance D2 from a to the recess 21. Such a first mounting portion 42 can secure a certain area along the opening edge portion 22, and exhibits good mountability. and can exhibit good mountability.

[0043] As shown in FIG. 4, the first folded-back portion 47 of the first metal terminal 40 extends upward along the first outer surface 24 of the case 20 from the tip 42a of the mounting portion 42. By having the first folded-back portion 47, the first metal terminal 40 facilitates the formation of a solder fillet during mounting, and the electronic component 10 having such a first folded-back portion 47 exhibits good mountability. Also, as shown in FIG. 4, by having the first terminal arm portion 46, the first mounting portion 42, and the first folded-back portion 47, the tip of the first metal terminal 40 becomes J-shaped. Therefore, in the electronic component 10, a part of the case 20 is sandwiched between the first terminal arm portion 46 and the first folded-back portion 47, so that the first metal terminal 40 can be more strongly engaged with the case 20.

[0044] As shown in FIGS. 3 to 5, the second metal terminal 50 has a second mounting portion 52 disposed at the opening edge portion 22, a second electrode connection portion 54 connected to the second electrode portion 34 of the ceramic element 30, a second terminal arm portion 56 connecting the second mounting portion 52 and the second electrode connection portion 54, and a second folded-back portion 57 extending upward from the tip 52a of the second mounting portion 52. The second electrode connection portion 54 is housed in the recess 21 of the case 20 in the same manner as the first electrode connection portion 44. The second metal terminal 50 has substantially the same shape as the first metal terminal 40 and is disposed substantially symmetrically with respect to the first metal terminal 40. However, the second metal terminal 50 is not limited to only those having the same shape as the first metal terminal 40.

[0045] As shown in FIGS. 3 and 4, the second electrode connection portion 54 extends substantially parallel to the second main surface 31b of the ceramic element 30 and is connected to the second electrode portion 34 formed on the second main surface 31b via solder, a conductive adhesive, or the like. On the other hand, the second mounting portion 52 is disposed on the other side of the opening edge portion 22 (the second outer surface 25 side of the case 20).

[0046] As shown in FIGS. 4 and 5, the second terminal arm portion 56 of the second metal terminal 50 connects the second electrode connection portion 54 within the recess 21 and the second mounting portion 52 outside the recess 21. Also, as shown in FIGS. 3 and 4, the second mounting portion 52 is substantially perpendicular to the first main surface 31a and the second main surface 31b of the ceramic element 30.

[0047] As shown in FIG. 3, the tip 52a of the second mounting portion 52 is an end portion on the side opposite to the side connected to the second terminal arm portion 56 in the second mounting portion 52, and is connected to the second folding portion 57. The distance D3 from the tip 52a of the second mounting portion 52 to the second outer surface 25 is shorter than the distance D4 from the tip 52 a of the second mounting portion 52 to the recess 21. Such a second mounting portion 52 can secure a certain area or more along the opening edge portion 22, and exhibits good mountability. along the opening edge portion 22, and can ensure an area of a certain size or more, and exhibits good mountability.

[0048] As shown in FIG. 4, the second folding portion 57 of the second metal terminal 50 extends upward along the second outer surface 25 of the case 20 from the tip 52a of the second mounting portion 52. The second metal terminal 50 having the second folding portion 57 exhibits the same effect as the first metal terminal 40 having the first folding portion 47.

[0049] The materials of the first metal terminal 40 and the second metal terminal 50 shown in FIG. 5 and the like are not particularly limited as long as they are metal materials having conductivity. For example, iron, nickel, copper, silver, etc. or alloys containing these can be used. Also, a metal film such as Ni, Sn, Cu, etc. may be formed on the surfaces of the first metal terminal 40 and the second metal terminal 50.

[0050] The recess 21 of the case 20 shown in FIGS. 3 and 4 may be filled with a molding resin that fills the gap between the inner wall of the recess 21 (including the bottom surface 21c) and the ceramic element 30 and the metal terminals 40 and 50. Thereby, the strength and insulation of the electronic component 10 can be improved. However, the recess 21 may not be filled with resin, and as shown in FIG. 3, a gap may be formed between the inner wall of the recess 21 and the ceramic element 30 and the metal terminals 40 and 50.

[0051] The case 20 can be manufactured, for example, by injection molding with resin. However, the material of the case 20 is not limited to only resin.

[0052] The electronic component 10 shown in FIGS. 1 to 5 can be manufactured, for example, by the following steps. First, a ceramic element 30, a first metal terminal 40, and a second metal terminal 50 are prepared, and the first metal terminal 40 and the second metal terminal 50 are connected to the ceramic element 30. The connection between the ceramic element 30 and the first metal terminal 40 and the second metal terminal 50 can be performed using solder, a conductive adhesive, or the like.

[0053] Next, the intermediate product in which the first metal terminal 40, the second metal terminal 50, and the ceramic element 30 are integrated is placed in the recess 21 of the case 20. After that, if necessary, a mold resin is injected into the recess 21 to obtain the electronic component 10 shown in FIG. 1. In this way, since the electronic component 10 shown in FIGS. 1 to 5 accommodates the ceramic element 30 in the recess 21 in the case 20, there is no need for a process of arranging the ceramic element 30 or the like in the cavity for resin molding and performing molding with an exterior material, and the productivity is good.

[0054] Since the electronic component 10 can accommodate the ceramic element 30 and the like in the case 20, it can flexibly respond to changes in the size of the ceramic element 30 as long as it fits within the case 20. Also, since the first mounting portion 42 and the second mounting portion 52 are perpendicular to the first main surface 31a and the second main surface 31b of the ceramic element 30, the electronic component 10 can reduce the mounting area and is suitable for surface mounting.

[0055] Second Embodiment FIG. 6 is a schematic perspective view of an electronic component 210 according to the second embodiment of the present invention, and FIG. 7 is a bottom view of the electronic component 210. As shown in FIGS. 6 and 7, the outer shape of the case 220 of the electronic component 210 is different from that of the case 20 of the electronic component 10 shown in FIGS. 1 and 2, but in other respects, it is the same as the electronic component 10. In the description of the electronic component 210, only the differences from the electronic component 10 will be described, and the description of the common points with the electronic component 10 will be omitted.

[0056] As shown in FIGS. 6 and 7, the case 220 is a substantially hexagonal prism shape in which none of the outer surfaces 224, 225, 226a, 226b, 228a, 228b are parallel to the first main surface 31a and the second main surface 31b of the ceramic element 30. However, as shown in FIG. 7, the case 220 is the same as the case 20 shown in FIG. 3 in terms of the internal shape of the case 220, such as the shape of the recess 21.

[0057] As shown in FIGS. 6 and 7, the case 220 has six outer surfaces perpendicular to the opening edge 222 surrounding the opening 21a of the recess 21. The six outer surfaces of the case 220 are composed of a first outer surface 224, a second outer surface 225, a third outer surface 226b, a fourth outer surface 228a, a fifth outer surface 226a, and a sixth outer surface 228b.

[0058] As shown in FIG. 7, the first outer surface 224 and the second outer surface 225 are a pair of opposing outer surfaces, which are the same as the first outer surface 24 and the second outer surface 25 shown in FIG. 3. As shown in FIG. 7, the fifth outer surface 226a is connected to the first outer surface 224 forming an included angle greater than 90 degrees, and the third outer surface 226b is connected to the second outer surface 225 forming an included angle greater than 90 degrees. The fifth outer surface 226a and the third outer surface 226b have substantially the same area and are connected to each other at the central portion of the electronic component 210 forming an included angle greater than 90 degrees.

[0059] As shown in FIGS. 6 and 7, the fourth outer surface 228a and the sixth outer surface 228b are symmetric with respect to the fifth outer surface 226a and the third outer surface 226b, respectively. That is, the fourth outer surface 228a forms an included angle greater than 90 degrees and is connected to the first outer surface 224, and the sixth outer surface 228b forms an included angle greater than 90 degrees and is connected to the second outer surface 225. The fourth outer surface 228a and the sixth outer surface 228b have substantially the same area and are connected to each other at the central portion of the electronic component 210, forming an included angle greater than 90 degrees.

[0060] As shown in FIGS. 6 and 7, the first and second outer surfaces 224 and 225 are substantially perpendicular to the first main surface 31a and the second main surface 31b, while the fourth to sixth outer surfaces are disposed obliquely with respect to the first main surface 31a and the second main surface 31b. As shown in FIG. 7, in the electronic component 210, the width of the opening edge 222 in the direction perpendicular to the first main surface 31a and the second main surface 31b is narrower on both sides closer to the first and second outer surfaces 224 and 225 and wider at the central portion. Such an electronic component 210 can prevent falling in the mounted posture while keeping the mounting area small.

[0061] In addition, regarding the common points between the electronic component 210 according to the second embodiment and the electronic component 10 according to the first embodiment, the same effects as those of the electronic component 10 are achieved.

[0062] Third Embodiment FIG. 8 is a schematic perspective view of an electronic component 310 according to a third embodiment of the present invention. In FIG. 8, similar to the electronic component 10 shown in FIG. 3, the inside of the case 320 of the electronic component 310 is shown in a perspective view, and the case 320 is shown by a virtual line.

[0063] As shown in FIG. 8, in the electronic component 310, the ceramic element 330 has two short plate-shaped dielectric elements, i.e., the first element portion 330a and the second element portion 370a, and the shape of the second metal terminal 350 and the fact that it has the third metal terminal 380 are different from those of the electronic component 210 shown in FIGS. 6 and 7. However, regarding the case 320 of the electronic component 310, it is the same as the case 220 of the electronic component 210 according to the second embodiment, except that the dimension in the length direction, which is the distance between the first outer surface 324 and the second outer surface 325, is about twice as large. In the description of the electronic component 310, only the differences from the electronic component 210 will be described, and the description of the common points with the electronic component 210 will be omitted.

[0064] As shown in FIG. 8, the ceramic element 330 of the electronic component 310 has two element portions, i.e., the first element portion 330a and the second element portion 370a. The first element portion 330a and the second element portion 370a are arranged in the recess 321 of the case 320. The case 320 has a first outer surface 324, a second outer surface 325, a fifth outer surface 326a, a third outer surface 326b, a fourth outer surface 328a, and a sixth outer surface 328b, and has a substantially hexagonal prism-shaped outer shape, similar to the case 220 shown in FIGS. 6 and 7. Also, the case 320 surrounds the periphery of the opening 321a of the recess 321 and has an opening edge portion 322 facing the mounting surface side (lower side), similar to the case 220 shown in FIG. 7.

[0065] The first element portion 330a and the second element portion 370a arranged in the recess 321 of the case 320 have a first main surface 331a, 371a and a second main surface 331b, 371b, and are the same as the ceramic element 30 of the electronic components 10 and 210 in the first and second embodiments. That is, the first element portion 330a and the second element portion 370a have a first electrode portion formed on the first main surfaces 331a, 371a, a second electrode portion formed on the second main surfaces 331b, 371b, and a dielectric portion sandwiched between the first electrode portion and the second electrode portion, similar to the first electrode portion 33, the second electrode portion 34, and the dielectric portion 35 in FIG. 3.

[0066] As shown in FIG. 8, the first element portion 330a and the second element portion 370a are arranged in the recess 321 of the case 320 such that the first main surface 331a of the first element portion 330a and the second main surface 371b of the second element portion 370a are located on substantially the same plane. Further, the first element portion 330a and the second element portion 370a are arranged in the recess 321 of the case 320 such that the second main surface 331b of the first element portion 330a and the first main surface 371a of the second element portion 370a are located on substantially the same plane.

[0067] That is, the first element portion 330a and the second element portion 370a are arranged side by side in the recess 321 along the length direction of the case 320 in a posture where the first main surface 331a of the first element portion 330a and the first main surface 371a of the second element portion 370a face in opposite directions.

[0068] As shown in FIG. 8, the first metal terminal 40 has the same shape as the first metal terminal 40 shown in FIGS. 4 and 7. The first electrode connection portion 44 of the first metal terminal 40 in the electronic component 310 is connected to the first electrode portion formed on the first main surface 331a of the first element portion 330a.

[0069] On the other hand, the second metal terminal 350 shown in FIG. 8 is line-symmetric with respect to the center line of the electronic component 310 with respect to the first metal terminal 40, unlike the second metal terminal 50 shown in FIGS. 4 and 7. The second metal terminal 350 has a second mounting portion 352 arranged at the opening edge portion 322, a second electrode connection portion 354 connected to the second electrode portion of the second element portion 370a, a second terminal arm portion 356 connecting the second mounting portion 352 and the second electrode connection portion 354, and a second folding portion 357 extending upward from the tip of the second mounting portion 352. However, the second metal terminal 350 is the same as the second metal terminal 50 shown in FIGS. 4 and 7 except that the connection positions of the second electrode connection portion 354 and the second terminal arm portion 356 are different.

[0070] As shown in FIG. 8, the electronic component 310 has a third metal terminal 380 that connects a second electrode portion formed on the second main surface 331b of the first element portion 330a and a first electrode portion formed on the first main surface 371a of the second element portion 370a. The third metal terminal 380 includes a third electrode connection portion 384 that connects the second electrode portion of the first element portion 330a and the first electrode portion of the second element portion 370a, a third mounting portion 382 disposed at the opening edge portion 322, and a third terminal arm portion 386 that connects the third electrode connection portion 384 and the third mounting portion 382.

[0071] The third electrode connection portion 384 and the third terminal arm portion 386 of the third metal terminal 380 are disposed within the recess 321, and the third mounting portion 382 is exposed outside the recess 321. Similar to the second mounting portion 352, the third mounting portion 382 is substantially perpendicular to the first main surfaces 331a and 371a and the second main surfaces 331b and 371b.

[0072] The electronic component 310 shown in FIG. 8 has a narrow mounting area and can constitute an electronic component in which the first element portion 330a and the second element portion 370a are connected in series. Further, since the third metal terminal 380 has the third mounting portion 382, the electronic component 310 can change the connection state to the circuits of the first element portion 330a and the second element portion 370a, and a configuration different from the configuration in which the first element portion 330a and the second element portion 370a are connected in series is also possible.

[0073] In addition, with regard to the common points between the electronic component 310 according to the third embodiment and the electronic component 210 according to the second embodiment, the electronic component 310 has the same effects as the electronic component 210.

[0074] Fourth Embodiment FIG. 9 is a schematic perspective view of an electronic component 410 according to a fourth embodiment of the present invention. In FIG. 9, similar to the electronic component 310 shown in FIG. 8, the inside of the case 320 of the electronic component 410 is shown in a perspective view, and the case 320 is shown by a virtual line.

[0075] As shown in FIG. 9, in the electronic component 410, the ceramic element 430 has two short plate-shaped dielectric elements, the first element part 430a and the second element part 470a, and the shapes of the first metal terminal 440 and the second metal terminal 450 are different from those of the electronic component 210 shown in FIGS. 6 and 7. However, the case 320 of the electronic component 410 is the same as the case 320 of the electronic component 310. In the description of the electronic component 410, only the differences from the electronic component 210 or the electronic component 410 will be described, and the description of the common points with the electronic component 210 and the electronic component 410 will be omitted.

[0076] As shown in FIG. 9, the ceramic element 430 of the electronic component 410 has two element parts, the first element part 430a and the second element part 470a. The first element part 430a and the second element part 470a are arranged in the recess 321 of the case 320.

[0077] The first element part 430a and the second element part 470a arranged in the recess 321 of the case 320 have first main surfaces 431a, 471a, second main surfaces 431b, 471b, which are the same as the ceramic element 30 of the electronic components 10, 210 in the first and second embodiments. That is, the first element part 430a and the second element part 470a have a first electrode part formed on the first main surfaces 431a, 471a, a second electrode part formed on the second main surfaces 431b, 471b, and a dielectric part sandwiched between the first electrode part and the second electrode part, similar to the first electrode part 33, the second electrode part 34, and the dielectric part 35 in FIG. 3.

[0078] As shown in FIG. 9, the first element part 430a and the second element part 470a are arranged in the recess 321 of the case 320 such that the first main surface 431a of the first element part 430a and the first main surface 471a of the second element part 470a are located on substantially the same plane. Also, the first element part 430a and the second element part 470a are arranged in the recess 321 of the case 320 such that the second main surface 431b of the first element part 430a and the second main surface 371b of the second element part 470a are located on substantially the same plane.

[0079] That is, the first element portion 330a and the second element portion 370a are arranged side by side in the recess 321 along the length direction with the first main surfaces 331a and 371a facing the same direction.

[0080] As shown in FIG. 9, the first metal terminal 440 has a different shape of the first electrode connection portion 444 from the first metal terminal 40 shown in FIGS. 4 and 7, but the first mounting portion 42, the first terminal arm portion 46, and the first folding portion 47 are the same as those of the first metal terminal 40. As shown in FIG. 9, the first electrode connection portion 444 extends in the length direction of the electronic component 410. The first electrode connection portion 444 is connected to the first electrode portions formed on the first main surfaces 431a and 471a of both the first element portion 430a and the second element portion 470a.

[0081] Also, the second metal terminal 450 has a different shape of the second electrode connection portion 454 from the second metal terminal 50 shown in FIGS. 4 and 7, but the second mounting portion 52, the second terminal arm portion 56, and the second folding portion 57 are the same as those of the second metal terminal 50. As shown in FIG. 9, the second electrode connection portion 454 extends in the length direction of the electronic component 510 in the same manner as the first electrode connection portion 444. The second electrode connection portion 454 is connected to the second electrode portions formed on the second main surfaces 431b and 471b of both the first element portion 430a and the second element portion 470a.

[0082] As shown in FIG. 9, in the electronic component 410, the first electrode connection portion 444 connects the first electrode portions of the first element portion 430a and the second element portion 470a, and the second electrode connection portion 454 connects the second electrode portions of the first element portion 430a and the second element portion 470a. By having such first and second electrode connection portions 444 and 454, the electronic component 410 has a narrow mounting area and constitutes an electronic component in which the dielectric portions of the two element portions are connected in parallel.

[0083] In addition, the electronic component 410 according to the fourth embodiment has the same effects as the electronic component 210 in terms of the common points with the electronic component 210 according to the second embodiment.

[0084] Fifth Embodiment FIG. 10 is a schematic perspective view of an electronic component 510 according to a fifth embodiment of the present invention, and FIG. 11 is a bottom view of the electronic component 510. FIG. 12 is a conceptual diagram showing an example of a connected state of a plurality of electronic components 510.

[0085] As shown in FIGS. 10 and 11, the electronic component 510 is different from the electronic component 210 shown in FIGS. 6 and 7 in that protrusions 526aa and 528aa are formed on the fifth outer surface 526a and the fourth outer surface 528a of the case 520, and groove portions 526ba and 528ba are formed on the third outer surface 526b and the sixth outer surface 528b of the case 520. However, the electronic component 510 is the same as the electronic component 210 shown in FIGS. 6 and 7 except that the protrusions 526aa, 528aa and the groove portions 526ba, 528ba are formed on the case 520. In the description of the electronic component 510, only the differences from the electronic component 210 according to the second embodiment will be described, and the description of the common points with the electronic component 10 will be omitted.

[0086] As shown in FIGS. 10 and 11, the case 520 has a substantially hexagonal prism outer shape similar to the case 220 shown in FIG. 6. However, among the outer surfaces, groove portions 526ba, 528ba or protrusions 526aa, 528aa are formed on the third to sixth outer surfaces 526b, 528a, 526a, 528b excluding the first outer surface 524 and the second outer surface 525 on which the first and second folded portions 47, 57 of the first and second metal terminals 40, 50 are disposed.

[0087] As shown in FIG. 11, a groove portion 526ba extending in the height direction is formed on the third outer surface 526b of the case 520. The groove portion 526ba is formed at intervals and is composed of two grooves parallel to each other. The two grooves constituting the groove portion 526ba continue to the opening edge portion 522.

[0088] As shown in FIGS. 10 and 11, a protrusion 528aa extending in the height direction is formed on the fourth outer surface 528a of the case 520. The protrusion 528aa corresponds to the shape of the groove 526ba formed on the third outer surface 526b and is composed of two protrusions parallel to each other. The two protrusions constituting the protrusion 528aa continue to the opening edge 522.

[0089] FIG. 12 is a conceptual diagram showing a state in which a plurality of electronic components 510 are connected. As shown in FIG. 12, the protrusion 528aa formed on the fourth outer surface 528a can be engaged with the groove 526ba formed on the third outer surface 526b that is parallel to the fourth outer surface 528a in another electronic component 510 having the same shape. As shown in FIG. 12, by engaging the protrusion 528aa with the groove 526ba, a plurality of electronic components 510 can be connected to each other.

[0090] A protrusion 526aa similar to the protrusion 528aa on the fourth outer surface 528a is formed on the fifth outer surface 526a of the case 520. Further, a groove 528ba similar to the groove 526ba on the third outer surface 526b is formed on the sixth outer surface 528b of the case 520. The protrusion 526aa can be engaged with the groove 528ba formed on the sixth outer surface 528b that is parallel to the fifth outer surface 526a in another electronic component 510 having the same shape. Therefore, a plurality of electronic components 510 can also be connected by engaging the protrusion 526aa with the groove 528ba.

[0091] The electronic components 510 shown in FIGS. 10 to 12 can connect a plurality of electronic components 510 and transport them at once using a mounting machine to, for example, a mounting substrate. Therefore, the mounting efficiency can be improved.

[0092] In addition, regarding the common points between the electronic component 410 according to the fourth embodiment and the electronic component 210 according to the second embodiment, the same effects as those of the electronic component 210 are achieved.

[0093] The electronic component according to the present invention has been described above with reference to embodiments. However, the present invention is not limited to the above-described embodiments only, and it goes without saying that many other embodiments and variations are included in the present invention. For example, a plurality of ceramic elements may be stacked and housed in the recess of the case, or three or more ceramic elements may be arranged side by side in the length direction of the case.

[0094] Further, projections and grooves similar to the projection 528aa and the groove 526ba of the electronic component 510 may be formed on the outer surface of the substantially quadrangular prism-shaped electronic component 10.

Explanation of Reference Numerals

[0095] 10, 210, 310, 410, 510... Electronic components 20, 220, 320, 520... Cases 21, 321... Recesses 21a, 321a... Openings 22, 222, 322, 522... Opening edges 24, 224, 324, 524... First outer surfaces 25, 225, 325, 525... Second outer surfaces 226a, 326a, 526a... Fifth outer surfaces 226b, 326b, 526b... Third outer surfaces 228a, 328a, 528a... Fourth outer surfaces 228b, 328b, 528b... Sixth outer surfaces 30, 330, 430... Ceramic elements 330a, 430a... First element parts 370a, 470a... Second element parts 31a, 331a, 371a, 431a, 471a... First main surfaces 33... First electrode parts 31b, 331b, 371b, 431b, 471b... Second main surfaces 34... Second electrode parts 35... Dielectric parts W1... Diameter W2... Depth 40, 440... First metal terminals 42... First mounting parts Tips of 42a, 52a... First electrode connection parts 44, 244, 444... First folding part 47... First terminal arm part 46... Second metal terminals 50, 350, 450... Second mounting parts 52, 352... Second electrode connection parts 54, 354, 454... Second terminal arm parts 56, 356... Second folding parts 57, 357... Third metal terminal 380... Third mounting part 382... Third electrode connection part 384... Third terminal arm part 386... Protrusions 526aa, 528aa... Grooves 526ba, 528ba...

Claims

1. A case having a recess and an opening edge of the recess; a ceramic element disposed in the recess, the ceramic element having a first main surface and a second main surface opposing each other, a first electrode portion formed on the first main surface and a second electrode portion formed on the second main surface, the first main surface and the second main surface being a pair of surfaces having the largest areas in the ceramic element; a first metal terminal including a first mounting portion disposed on the opening edge portion and substantially perpendicular to the first main surface and the second main surface, and a first electrode connection portion connected to the first electrode portion; an electronic component having a second metal terminal including a second mounting portion disposed on the opening edge portion and substantially perpendicular to the first main surface and the second main surface, and a second electrode connection portion connected to the second electrode portion.

2. the case has a first outer side surface and a second outer side surface which are substantially perpendicular to the first main surface, the second main surface, the first mounting portion, and the second mounting portion and face in opposite directions; a distance from a tip of the first mounting portion to the first outer surface is shorter than a distance from a tip of the first mounting portion to the recess; The electronic component according to claim 1 , wherein a distance from a tip of the second mounting portion to the second outer surface is shorter than a distance from the tip of the second mounting portion to the recess.

3. the ceramic element includes a first element portion and a second element portion each having the first main surface, the second main surface, the first electrode portion, and the second electrode portion, the first element portion and the second element portion are arranged in the recessed portion side by side along a longitudinal direction of the case with the first main surface of the first element portion and the first main surface of the second element portion facing in opposite directions, the first electrode connection portion is connected to the first electrode portion of the first element portion, the second electrode connection portion is connected to the second electrode portion of the second element portion, 3 . The electronic component according to claim 1 , further comprising a third metal terminal that connects the second electrode portion of the first element portion and the first electrode portion of the second element portion.

4. The electronic component according to claim 3, wherein the first element portion and the second element portion are arranged in the recess such that the first main surface of the first element portion and the second main surface of the second element portion are located on approximately the same plane, and the second main surface of the first element portion and the first main surface of the second element portion are located on approximately the same plane.

5. 5. The electronic component according to claim 3, wherein the third metal terminal has a third electrode connection portion that connects the second electrode portion of the first element portion and the first electrode portion of the second element portion, and a third mounting portion that is arranged on the opening edge portion and is approximately perpendicular to the first main surface and the second main surface.

6. the ceramic element includes a first element portion and a second element portion each having the first main surface, the second main surface, the first electrode portion, and the second electrode portion, the first element portion and the second element portion are arranged in the recessed portion side by side along a longitudinal direction of the case with the first main surface of the first element portion and the first main surface of the second element portion facing in the same direction, the first electrode connection portion is connected to the first electrode portions of both the first element portion and the second element portion, 3 . The electronic component according to claim 1 , wherein the second electrode connection portion is connected to the second electrode portions of both the first element portion and the second element portion.

7. The electronic component according to claim 6, wherein the first element portion and the second element portion are arranged in the recess such that the first main surface of the first element portion and the first main surface of the second element portion are positioned on approximately the same plane, and the second main surface of the first element portion and the second main surface of the second element portion are positioned on approximately the same plane.

8. 8. The electronic component according to claim 1, wherein at least a portion of the edge of the opening in the case is visible from below.

9. 9. The electronic component according to claim 1, wherein the case is substantially hexagonal prism-shaped, all of the outer surfaces of which are non-parallel to the first main surface and the second main surface.

10. a groove formed on a third outer surface of the case; The electronic component according to claim 1 , further comprising: a protrusion formed on a fourth outer surface of the case, the protrusion corresponding to a shape of the groove.

11. the first metal terminal has a first folded portion extending upward from a tip of the first mounting portion along an outer side surface of the case, The electronic component according to claim 1 , wherein the second metal terminal has a second folded portion that extends upward from a tip of the second mounting portion along an outer side surface of the case.

12. An electronic component described in any one of claims 1 to 11, wherein the ceramic element is a single-plate ceramic element.

13. An electronic component described in any one of claims 1 to 12, wherein the ceramic element has an approximately disk-shaped outer shape.

14. An electronic component described in any one of claims 1 to 13, wherein the case is approximately hexagonal prism-shaped, all of whose outer surfaces are non-parallel to the first principal surface and the second principal surface.

Images