Thermal dissipation structure of circuit module, and electronic circuit device, electronic lock system, and wireless communication system using the same

Abstract

To improve thermal dispersion of a circuit module at low cost.SOLUTION: A thermal dissipation structure of the circuit module 1 is used to be mounted in a main substrate 2. The circuit module 1 includes: a module substrate 3; one or more circuit components 41, 42 mounted on the module substrate 3; a base 5 that surrounds a predetermined circuit component 42 mounted on a surface 32 on the main substrate 2 side among the one or more circuit components 41, 42, is formed taller than the circuit component 42, and is interposed between the module substrate 3 and the main substrate 2; and a thermally conductive member 6 interposed between the predetermined circuit component 42 and the main substrate 2 to perform thermal conduction.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure relates to a heat dissipation structure of a circuit module, an electronic circuit device using the same, an electronic lock system, and a wireless communication system.

Background Art

[0002] Patent Document 1 shows an example of an electronic lock system. Patent Document 1 is a wireless communication system that uses an NFC (Near Field Communication) wireless terminal as an electronic key and an NFC transmitter as a lock device. By doing so, Patent Document 1 realizes an electronic lock system that does not require a power source on the wireless terminal side. A circuit module equipped with one or more circuit components is also used in the electronic circuit device that constitutes this wireless terminal.

[0003] In Patent Document 1, since the transmitter side is a door lock device, it cannot be as large as an automatic ticket gate, and a miniaturized circuit module is required. Patent Document 2 is an electronic device that is such a miniaturized circuit module.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

[0005] [Summary] As described above, since the electronic device in Patent Document 2 has achieved miniaturization, heat dissipation has become more severe compared to before miniaturization. By the way, in Patent Document 1, a key switch is provided in the wireless terminal to perform locking and unlocking operations. Therefore, the wireless terminal in Patent Document 1 has more functions compared to, for example, a transportation system IC card which is also an NFC wireless terminal. Therefore, when the wireless terminal in Patent Document 1 attempts to further enhance its functions, it is necessary to increase the power supply, that is, the capacity by NFC wireless power supply.

[0006] Similar to the above-described electronic lock system, in a wireless communication system using a wearable terminal such as an earphone as a wireless terminal, in order to achieve overall miniaturization, it is preferable to use a miniaturized circuit module as in Patent Document 2 on the transmitter side. And regarding this wearable terminal, for example, in the case of an earphone, when the power supply capacity increases, a louder sound can be reproduced for a longer time.

[0007] However, when trying to increase the capacity of wireless power supply, it is necessary to increase the power of heat-generating components such as a transmission amplifier, and a large amount of heat is generated. Therefore, conventionally, although a heat dissipation sheet or the like is used, the cost is high, and there are also cases where heat cannot be dissipated sufficiently.

[0008] An object of the present disclosure is to provide a heat dissipation structure of a circuit module capable of achieving good heat dissipation at low cost, and an electronic circuit device, an electronic lock system, and a wireless communication system using the same.

[0009] In order to solve the above-described problems, the heat dissipation structure of the circuit module of the present disclosure is a heat dissipation structure of a circuit module mounted and used on a main board. The circuit module includes a module board, one or more circuit components mounted on the module board, a pedestal that encloses a predetermined circuit component mounted on the surface on the main board side among the one or more circuit components mounted on the module board, is formed taller than the circuit components, and is interposed between the module board and the main board, and a heat conduction member that is interposed between the predetermined circuit component and the main board to conduct heat.

Brief Description of the Drawings

[0010]

Figure 1

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Figure 8

Figure 9

[0011] [Detailed Description] Next, with reference to the drawings, this embodiment will be described. In the description of the drawings described below, the same or similar parts are denoted by the same or similar reference numerals. However, it should be noted that the drawings are schematic and different from the actual ones. Therefore, specific structures, dimensions, etc. should be appropriately determined with reference to the following description.

[0012] In addition, the embodiments described below exemplify devices and methods for embodying technical ideas, and do not specify the materials, shapes, structures, arrangements, etc. of each component. Various modifications can be made to the embodiments within the scope of the claims.

[0013] (First Embodiment) FIG. 1 is a cross-sectional view of a circuit module 1 according to the first embodiment, and FIG. 2 is an exploded perspective view schematically showing a part of the circuit module 1. This circuit module 1 is mounted on and used with a main (host) substrate 2. This circuit module 1 includes a module substrate 3, one or more (three in FIG. 1) circuit components 41, 42, 43, a pedestal 5 and a heat conduction member 6 to be described later.

[0014] The circuit module 1 may, together with its mounted circuit components 41, 42, 43, realize the intended function alone. Alternatively, the circuit module 1 may realize the intended function in appropriate cooperation with the main substrate 2 and other circuit modules (not shown). That is, the configuration for realizing the intended function may be divided and formed on a plurality of substrates, and the configuration in FIG. 1 may be a part of the divided substrates. The configuration for realizing those intended functions is an electronic circuit device.

[0015] In the examples of FIGS. 1 and 2, the module substrate 3 is a double-sided mounting substrate and is made of an insulating material such as glass epoxy resin. Patterns such as die bonding portions 311 and pad portions 312 are appropriately formed on one surface 31 of the module substrate 3, and the circuit component 41 is joined with solder 411 or the like. Patterns such as pad portions 321 are appropriately formed on the other surface 32 of the module substrate 3, and the circuit component 42 is joined with solder 421 or the like. The two surfaces 31 and 32 of the module substrate 3 are appropriately electrically connected by vias 33 or the like.

[0016] The module substrate 3 is electrically connected to the main substrate 2 from the contact pads 322 formed on the other surface 32 through vias (not shown) formed in the pedestal 5 described later or wiring patterns formed on the outer periphery of the pedestal 5. Alternatively, the module substrate 3 may be electrically connected to the main substrate 2 through a flexible printed circuit board connected to at least one of both surfaces 31 and 32.

[0017] Also, in the examples of FIGS. 1 and 2, an NFC antenna, which is a circuit component 43, is mounted on one surface 31 (the side opposite to the main substrate 2) of the module substrate 3. The circuit component 43 includes a pedestal 431 and an antenna body 432. The pedestal 431 is mounted on the module substrate 3 by contact pads 4311, and supports the antenna body 432 on the module substrate 3 so as to straddle or surround the circuit component 41 mounted on one surface 31 of the module substrate 3. The antenna body 432 incorporates an antenna coil 4321 developed on the module substrate 3.

[0018] The pedestal 5 surrounds a predetermined circuit component 42 mounted on the other surface 32 on the main substrate 2 side among the circuit components 41, 42, 43 mounted on the module substrate 3, and is formed taller than this circuit component 42, and is interposed between the module substrate 3 and the main substrate 2. In the present embodiment, the pedestal 5 is made of a glass epoxy resin and functions as an intermediate substrate having vias (not shown), wiring patterns, etc. connected to the contact pads 322. In the present embodiment, the pedestal 5 is formed in a short square tube shape, but may be appropriately notched or columnar for heat dissipation and avoiding interference with other mounted components, as long as the other surface 32 of the module substrate 1 can be held parallel to the surface 21 of the main substrate 2. And in the present embodiment, a heat conductive member 6 capable of performing heat conduction between them is interposed between the circuit component 42 and the main substrate 2. Thus, the heat dissipation structure of the circuit module 1 of the present embodiment is realized.

[0019] Here, in a circuit module 1 formed by mounting a module substrate 3 on a main substrate 2, when there are heat-generating components (circuit component 42 in the case of FIG. 2) among the circuit components 41, 42, and 43 to be mounted (implemented), conventionally, heat dissipation fins, heat dissipation sheets, etc. have been used. However, those heat dissipation fins and heat dissipation sheets require a certain height and area, resulting in an increase in the size of the circuit module and also an increase in cost. Furthermore, in some cases, heat may not be dissipated completely.

[0020] Therefore, in the circuit module 1 of the present embodiment, since the module substrate 3 is formed by mounting one or a plurality of circuit components 41, 42, and 43, the heat dissipation structure to the main substrate 2 is devised by making use of these circuit components. In the present embodiment, with respect to a predetermined circuit component 42 mounted on the surface 32 of the module substrate 3 on the main substrate 2 side, a pedestal 5 in the form of a frame that surrounds the circuit component 42 and is formed taller than the circuit component 42 is interposed (sandwiched) between the main substrate 2. For the circuit component 42, components such as LSI (Large Scale Integration) that are the tallest or have the largest area are suitable. And a heat conduction member 6 for conducting heat is interposed between the circuit component 42 and the main substrate 2. The heat conduction member 6 can be realized by a heat dissipation gel applied between the circuit component 42 and the main substrate 2, a heat transfer sheet sandwiched between the circuit component 42 and the main substrate 2, etc.

[0021] Therefore, since the circuit module 1 of the present embodiment dissipates heat through the main substrate 2 which generally has a larger heat capacity than the module substrate 3, the entire circuit module 1 formed by combining them can be miniaturized, and the heat-generating component (42) can also be made to have a higher power.

[0022] As the heat conduction member 6 described above, a heat dissipation gel filled between the top surface 422 of the circuit component 42 and the surface 21 of the main substrate 2 is preferable. The heat dissipation gel is only filled between the circuit component 42 and the main substrate 2, and can appropriately compensate for variations in the interval between them, and can easily and surely obtain high heat conduction performance, which is suitable. Further, as the circuit component 42, the above-described LSI is preferable. The LSI is in a flat package, and as a circuit component mounted on the circuit module 1, it has a relatively large area. Therefore, by facing the LSI to the main substrate 2 and using it for heat dissipation from the heat conduction member 6 to the main substrate 1, heat can be dissipated efficiently.

[0023] Further, the circuit module 1 of the present embodiment exemplifies an NFC module. Therefore, in the circuit module 1 of the present embodiment, in the circuit module having a multi-stage configuration, as described above, on the uppermost (front) surface, the circuit component 43 serving as the NFC antenna (4321) is arranged. And, for example, when the circuit component 41 is an LSI that performs signal processing, control, transmission and reception, etc., and the circuit component 42 is an LSI that includes a power element for power supply and transmission and reception of NFC, when the state of heat conduction of this circuit module is schematically shown, it becomes as shown in FIG. 3. That is, the heat 7 generated in the circuit component 42 spreads inside the circuit component 42 as indicated by the reference numeral 71, and is transmitted to the large-area main substrate 2 as indicated by the reference numeral 72 via the heat conduction member 6, and is dissipated well. Since the purpose is heat dissipation, as shown in FIG. 3, the application area of the heat conduction member 6 is often made wider than the area of the circuit component 42. However, when the application area is narrow, even inside the circuit component 42, the portion contributing to heat conduction is the narrow application portion of the heat conduction member 6.

[0024] Here, the transmission power of NFC reaches, for example, up to about 10W in applications such as the electronic lock device and the wearable terminal described later. In this miniaturized circuit module 1, when such a high-power element is mounted, a large amount of heat 7 is generated. Therefore, the heat dissipation structure of the present embodiment that can dissipate the generated heat 7 to the main substrate 2 via the heat conduction member 6 is effective.

[0025] Then, the circuit module 1 of this embodiment is a multi-stage circuit module, and since the antenna coil 4321 used for NFC wireless power supply and communication is installed on the module substrate 3, a large antenna coil can be formed by utilizing the area of the module substrate 3. As a result, the power supply power can be increased. Also, the antenna coil 4321 can be arranged near the element (42) that creates the transmission radio wave for power supply, and the power supply loss can also be reduced.

[0026] Moreover, in the circuit module 1 of this embodiment, the module substrate 3 is a double-sided mounting substrate. Since it is difficult to directly connect (mount) the double-sided mounting substrate to the main substrate 2, when attempting to dissipate heat, it depends on the above-mentioned heat dissipation fins and heat dissipation sheets, and the heat dissipation problem is prominent. Therefore, the heat dissipation structure of this embodiment is particularly suitable.

[0027] Furthermore, while mounting the double-sided mounting substrate on the main substrate 2, a gantry 5 for enabling the interposition of the heat conduction member 6 between the module substrate 3 and the main substrate 2 is made into a relay substrate that electrically connects at least a part of the patterns between those substrates 3 and 2. By doing so, other configurations such as a flexible substrate can be made unnecessary for the electrical connection between the module substrate 3 and the main substrate 2.

[0028] The above-described circuit module 1 has been described using a high-power NFC module. Here, in the above example, the LSI of the circuit component 42 mounted on the other surface 32 (the main substrate 2 side) of the module substrate 3 is regarded as a heat-generating component. On the other hand, the circuit component 41 mounted on one surface 31 of the module substrate 3 may be configured to include the above-mentioned NFC power supply and power elements for transmission and reception, so that the circuit component 41 may become a heat-generating component.

[0029] FIG. 4 is a cross-sectional view schematically showing the state of heat conduction of the circuit module 1a of another example in the first embodiment. In FIG. 4, parts corresponding to those in FIG. 3 are denoted by the same reference numerals or the same reference numerals with the suffix a attached thereto. On one surface 31a of the module substrate 3a, a circuit component 41a, which is a heat-generating component, is mounted. On the other surface 32a of the module substrate 3a, another circuit component 44 is also mounted. In this regard, the module substrate 3a is a double-sided mounting substrate similar to the above. Therefore, also in this embodiment, the pedestal 5 serving as the relay substrate described above is used, and instead of the circuit component 42 that was an LSI, a dummy circuit component 42a having good thermal conductivity such as an aluminum plate is mounted between the module substrate 3a and the main substrate 2. The gap between the circuit component 42a and the main substrate 2 is filled with a heat-conducting member 6 made of a heat-radiating gel or the like.

[0030] Then, the heat 7a generated in the circuit component 41a propagates through the module substrate 3a as indicated by the reference numeral 70a and reaches the circuit component 42a. The reached heat spreads inside the circuit component 42a as indicated by the reference numeral 71a in the same manner as described above, and is transmitted to the main substrate 2 having a large area as indicated by the reference numeral 72a through the heat-conducting member 6, and is radiated well. Thus, even if the heat-generating components (42, 41a) are mounted on any of the surfaces 31, 31a, 32, 32a of the module substrates 3, 3a, they can be transmitted to the main substrate 2 through the heat-conducting member 6 from the circuit components 42, 42a and radiated well.

[0031] (Second Embodiment) FIG. 5 is a cross-sectional view of the circuit module 1b according to the second embodiment, and FIG. 6 is an exploded perspective view of the circuit module 1b. This circuit module 1b is also mounted on the main (host) substrate 2 and used. This circuit module 1b includes a module substrate 3b, one or more (five in FIG. 4) circuit components 451, 452, 461, 462, 463, a lid 8, and the aforementioned heat conduction member 6. The module substrate 3b is a semiconductor substrate, for example, created by etching the center of a silicon substrate. The module substrate 3b includes a plate-like portion 3b1 and a peripheral wall portion 3b2 that hangs down from the outer peripheral edge of the plate-like portion 3b1. The circuit components 451 and 452 are mounted on one surface 31b of the plate-like portion 3b1, and the circuit components 461, 462, and 463 are mounted on the other surface 32b.

[0032] And at least one of the circuit components 451, 452, and 462 is a heat-generating component. In the example of FIG. 5, the large-area circuit component 462 is the heat-generating component, and the heat conduction member 6 is filled between this circuit component 462 and the main substrate 2 to dissipate heat.

[0033] Also, in this embodiment, the surface of the module substrate 3b, which is a semiconductor substrate, on the main (host) substrate 2 side is drilled for mounting the circuit components 461, 462, and 463 to form an internal space 464, and the peripheral wall portion 3b2 that forms the internal space 464 is configured to correspond to the gantry 5. Therefore, from the module substrate 3b to the main (host) substrate 2, in addition to heat dissipation from the predetermined circuit component 462 through the heat conduction member 6, heat can also be dissipated from the peripheral wall portion 3b2 of the semiconductor substrate (3b) serving as the gantry. Heat dissipation by the heat conduction member 6 may also be performed for the other circuit components 461 and 463.

[0034] The circuit components 451 and 452 mounted on one surface 31b of the module substrate 3b are sealed by a lid 8. The lid 8 is created, for example, by etching the center of a silicon substrate, similar to the module substrate 3b. The lid 8 includes a plate-like portion 81 and a peripheral wall portion 82 that hangs down from the outer peripheral edge of the plate-like portion 81. The peripheral wall portion 82 is joined to the outer peripheral edge of one surface 31b of the plate-like portion 3b1 of the module substrate 3b, and the internal space 453 is sealed. Heat dissipation may also be performed between the plate-like portion 81 and the circuit components 451 and 452 by the heat conductive member 6.

[0035] (Third Embodiment) FIG. 7 is a cross-sectional view of a circuit module 1c according to the third embodiment. This circuit module 1c is also mounted on and used with the main (host) substrate 2. This circuit module 1c includes a module substrate 3c, a sub-substrate 9 on the main (host) substrate 2 side, one or more (five in FIG. 5) circuit components 451, 452, 471, 472, 473, pedestals 5, 51, a lid 83, and the aforementioned heat conductive member 6. The module substrate 3c and the sub-substrate 9 are, for example, the aforementioned polyimide substrates. The module substrate 3c and the sub-substrate 9 are both single-sided mounting substrates. The circuit components 451 and 452 are mounted on one surface 31c of the module substrate 3c. The circuit components 471, 472, and 473 are mounted on one surface 91 of the sub-substrate 9, and the other surface 92 is joined to the main (host) substrate 2.

[0036] The pedestal 5 is provided on the outer peripheral portion of the sub-board 9, and the module board 3c is mounted and supported thereon. Then, heat from the heat-generating components, such as the circuit component 452, is transmitted to the other surface 32c of the module board 3c through the via 33 from the module board 3c. Thereafter, the heat is transmitted from the heat-conducting member 6, as indicated by reference numeral 74, to one surface 91 of the module board 9 through the tall circuit component 473 determined in advance. In the module board 9, the heat is transmitted from the via 93 to the other surface 92 through the pad 94, and finally radiated to the main board 2. The circuit components 451 and 452 on one surface 31c of the module board 3c are surrounded by a pedestal 51 similar to the pedestal 5 and sealed by a plate-shaped lid 83 mounted on the pedestal 51.

[0037] Thus, instead of the double-sided mounting module board 3b and the lid 8 made of an etched silicon substrate in the circuit module 1b, this circuit module 1c can use the normal single-sided mounting module board 3c and the sub-board 9 by using the pedestals 5 and 51.

[0038] (Fourth Embodiment) FIGS. 8 and 9 are perspective views showing an example of a wireless communication system according to the fourth embodiment. These wireless communication systems can use the above-described NFC circuit modules 1, 1a, 1b, 1c (hereinafter, described by representing with the circuit module 1). FIG. 8 shows an example applied to the electronic lock system 10 of Patent Document 1. The electronic lock system 10 includes a lock device 101 attached to a door or a door frame, and an electronic key 102 held by a user. The electronic key 102 is an NFC wireless terminal. Wireless power supply is performed from the lock device 101 to the electronic key 102 in a state where the electronic key 102 is fitted into a recess 1011 formed in the front surface of the lock device 101. By this wireless power supply, the internal circuit of the electronic key 102 is energized, and the operation of the key 1021 becomes possible along with the identification of the identification number, and signal transmission and reception such as locking and unlocking become possible. In this way, an NFC wireless terminal in the form of a card or the like can be used as the electronic key 101, and an electronic lock system 10 that does not require a power supply on the wireless terminal side can be realized.

[0039] FIG. 9 shows an example in which the NFC wireless terminal is a wearable terminal. In FIG. 9, although the receiving-side wearable terminal is not shown, it is a wireless earphone. FIG. 9 shows an example of an earphone case 11 equipped with the above-described circuit module 1 as a transmission (power supply) device. The earphone case 11 includes a main body 111 and a lid 112 that can be opened and closed with respect to the main body 111. Accommodation holes 1111 and 1112 for accommodating a pair of earphones are formed in the main body 111. The circuit module 1 is appropriately arranged around the accommodation holes 1111 and 1112.

[0040] By configuring in this way, the wearable terminal can be realized as an NFC wireless terminal, and the wearable terminal can be made non-chargeable. Further, by using the circuit module 1 of the present disclosure having a large power supply capacity, the volume of the earphone which is a wireless terminal can be increased or it can be operated for a long time.

[0041] The technical idea that can be grasped from the present disclosure is described in the following supplementary notes. Note that, not with the intention of limiting, for the purpose of assisting understanding, the reference numerals of the corresponding components in the embodiment are attached to the components described in the supplementary notes. The reference numerals are shown as examples for assisting understanding, and the components described in each supplementary note should not be limited to the components indicated by the reference numerals.

[0042] <Supplementary Note 1> The heat dissipation structure of the circuit module described in Supplementary Note 1 is the heat dissipation structure of the circuit modules 1, 1a, and 1b mounted on the main board 2 and used. The circuit modules 1, 1a, and 1b include module boards 3, 3a, and 3b, one or more circuit components 41, 41a, 42, 42a, 44, 451, 452, 461, 462, and 463 mounted on the module boards 3, 3a, and 3b, and among the one or more circuit components 41, 41a, 42, 42a, 44, 451, 452, 461, 462, and 463 mounted on the module boards 3, 3a, and 3b, a predetermined circuit component 42, 42a, or 462 mounted on the surfaces 32, 32a, or 32b on the main board 2 side is surrounded, and a pedestal 5, (3b2) formed taller than the circuit component 42, 42a, or 462 and interposed between the module boards 3, 3a, and 3b and the main board 2, and a heat conduction member 6 interposed between the predetermined circuit component 42, 42a, or 462 and the main board 2 to conduct heat.

[0043] <Supplementary Note 2> The heat dissipation structure of the circuit module described in Supplementary Note 2 is the heat dissipation structure of the circuit modules 1, 1a, 1b, and 1c formed by mounting one or more circuit components 41, 41a, 42, 42a, 44, 451, 452, 461, 462, 463, 471, 472, and 473. The circuit modules 1, 1a, 1b, and 1c include the main board 2(9), one or more stages of module boards 3, 3a, 3b, and 3c mounted on the main board 2(9), and a pedestal 5 or 3b2 that is interposed between the module boards 3, 3a, 3b, and 3c and the main board 2(9) and is formed taller than the circuit components 42, 42a, 462, and 473 to surround the predetermined circuit components 42, 42a, 462, and 473 mounted on the mutually facing surfaces on one of the main board 2(9) and the module boards 3, 3a, 3b, and 3c, and a heat conduction member 6 interposed between the predetermined circuit components 42, 42a, 462, and 473 and the other of the main board 2(9) and the module boards 3, 3a, 3b, and 3c to conduct heat.

[0044] <Supplementary Note 3> The heat dissipation structure of the circuit module described in Supplementary Note 3 is such that, in the heat dissipation structure of the circuit module described in Supplementary Note 1 or 2, the module substrates 3, 3a, and 3b are double-sided mounting substrates.

[0045] <Supplementary Note 4> The heat dissipation structure of the circuit module described in Supplementary Note 4 is such that, in the heat dissipation structure of the circuit module described in Supplementary Note 1 or 2, the module substrate 3b is a semiconductor substrate, and the pedestal is composed of the peripheral wall portion 3b2 of the internal space 464 formed by drilling the surface of the semiconductor substrate on the main substrate 2 side for mounting the circuit components 461, 462, and 463.

[0046] <Supplementary Note 5> The heat dissipation structure of the circuit module described in Supplementary Note 5 is such that, in the heat dissipation structure of the circuit module described in Supplementary Note 2, the module substrate 3c is a single-sided mounting substrate, a sub-substrate 9 is mounted on the main substrate 2, the predetermined circuit component 473 is mounted on the sub-substrate 9, and the sub-substrate 9 is provided with vias 93 that contact the predetermined circuit component 473 and pads 94 that are connected to the vias 93 and contact the main substrate 2.

[0047] <Supplementary Note 6> The heat dissipation structure of the circuit module described in Supplementary Note 6 is such that, in the heat dissipation structure of the circuit module described in any one of Supplementary Notes 1 to 5, the pedestal 5 is an intermediate substrate that electrically connects at least a part of the pattern between the module substrates 3, 3a, 3c and the main substrate 2.

[0048] <Supplementary Note 7> The heat dissipation structure of the circuit module described in Supplementary Note 7 is such that, in the heat dissipation structure of the circuit module described in any one of Supplementary Notes 1 to 4 and 6, the predetermined circuit components 42 and 462 are LSIs.

[0049] <Supplementary Note 8> In the heat dissipation structure of the circuit module described in Supplementary Note 8, in the heat dissipation structure of the circuit module described in any one of Supplementary Notes 1 to 4 and 6, the heat conduction member 6 is a heat dissipation gel filled between the predetermined circuit components 42, 42a, 462 and the main substrate 2.

[0050] <Appendix 9> The electronic circuit device described in Appendix 9 includes circuit modules 1, 1a, 1b, 1c having the heat dissipation structure described in any one of Appendices 1 to 8, and a main board 2.

[0051] <Appendix 10> The electronic circuit device described in Appendix 10 is a wireless communication device in the electronic circuit device described in Appendix 9.

[0052] <Appendix 11> The electronic circuit device described in Appendix 11 is an NFC wireless communication device in the electronic circuit device described in Appendix 10, and the predetermined circuit components 42, 462 are elements for wireless power supply in NFC.

[0053] <Appendix 12> In the electronic circuit device described in Appendix 12, on the side of the module board 3 opposite to the main board 2, an antenna coil 4321 for NFC is provided via another pedestal (431).

[0054] <Appendix 13> The electronic lock system 10 described in Appendix 13 mounts the electronic circuit device described in Appendix 11 on the lock device 101 and uses the NFC wireless terminal as the electronic key 102.

[0055] <Appendix 14> The wireless communication system described in Appendix 14 mounts the electronic circuit device described in Appendix 11 on the transmitter, and the NFC wireless terminal is a wearable terminal.

Explanation of Reference Numerals

[0056] 1, 1a, 1b, 1c Circuit modules 2 Main board 21 Surface 3, 3a, 3b, 3c Module boards 31, 31a, 31b, 31c, 91 One surface 311 Die bonding part 312 Pad part The surfaces of 32, 32a, 32b, 32c, 92 and the other party 3b1 Plate-shaped part 3b2 Peripheral wall part 33, 93 Via 41, 41a, 44, 451, 452, 461, 463, 471, 472 Circuit components 411 Solder 42, 42a, 462, 473 Predetermined circuit components 431 Stand 432 Antenna body 4321 Antenna coil 5, 51 Stand 6 Heat conduction member 8, 83 Cover 81 Plate-shaped part 82 Peripheral wall part 9 Substrate 94 Pad 10 Electronic lock system 101 Locking device 1011 Recess 102 Electronic key 1021 Key 11 Earphone case 111 Body 112 Cover 1111, 1112 Accommodation holes

Claims

1. In a heat dissipation structure of a circuit module mounted and used on a main board, the circuit module includes a module board, one or more circuit components mounted on the module board, a pedestal that surrounds a predetermined circuit component mounted on a surface of the one or more circuit components mounted on the module board and facing the main board side, is formed higher than the predetermined circuit component, and is interposed between the module board and the main board, and a heat conduction member that is interposed between the predetermined circuit component and the main board and conducts heat, the heat dissipation structure of the circuit module.

2. In a heat dissipation structure of a circuit module formed by mounting one or more circuit components, a main board, one or more stages of module boards mounted on the main board, a pedestal that is interposed between the module board and the main board and surrounds a predetermined circuit component mounted on a mutually facing surface on one of the main board and the module board, is formed higher than the predetermined circuit component, and a heat conduction member that is interposed between the predetermined circuit component, the main board, and the other of the module board and conducts heat, the heat dissipation structure of the circuit module.

3. The heat dissipation structure of the circuit module according to claim 1 or 2, wherein the module board is a double-sided mounting board.

4. The module board is a semiconductor board, and the pedestal is formed of a peripheral wall portion of an internal space drilled for mounting the circuit component on a surface of the semiconductor board facing the main board side, the heat dissipation structure of the circuit module according to claim 1 or 2.

5. The module board is a single-sided mounting board, a sub-board is mounted on the main board, the predetermined circuit component is mounted on the sub-board, and the sub-board is provided with a via that contacts the predetermined circuit component and a pad that is connected to the via and contacts the main board, the heat dissipation structure of the circuit module according to claim 1 or 2.

6. The heat dissipation structure of the circuit module according to claim 1 or 2, wherein the pedestal is a relay board that electrically connects at least a part of a pattern between the module board and the main board.

7. The heat dissipation structure of the circuit module according to claim 1 or 2, wherein the predetermined circuit component is an LSI.

8. The heat conduction member is a heat dissipation gel filled between the predetermined circuit component and the main board, and is the heat dissipation structure of the circuit module according to claim 1 or 2.

9. An electronic circuit device comprising a circuit module having the heat dissipation structure according to claim 1 and the main board according to claim 1.

10. The electronic circuit device according to claim 9, which is a wireless communication device.

11. The electronic circuit device according to claim 10, which is an NFC wireless communication device, and the predetermined circuit component is an element for wireless power supply in the NFC.

12. On the side of the module board opposite to the main board, an antenna coil in the NFC is provided via another pedestal, and is the electronic circuit device according to claim 11.

13. An electronic lock system in which the electronic circuit device according to claim 11 is mounted on a lock device, and the NFC wireless terminal is used as an electronic key.

14. A wireless communication system in which the electronic circuit device according to claim 11 is mounted on a transmitter, and the NFC wireless terminal is a wearable terminal.

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