Fluid supply system, substrate processing method, and recording medium

Abstract

To provide a fluid supply system, a substrate processing method, and a recording medium that suppresses backflow of processing fluid.SOLUTION: In a substrate processing apparatus 10 having a processing portion 11, a fluid supply portion 12, an exhaust portion 13, and a control portion 14, a fluid supply system that supplies a fluid into a processing container 111 in which a substrate W is processed is configured with a fluid supply portion that supplies a processing fluid and a control portion that controls the fluid supply portion, and the control portion controls the fluid supply portion to supply the processing fluid into the processing container from at least one of a first supply flow path L11 and a second supply flow path L12 having a flow rate adjustment mechanism during the entire period in which the processing fluid is supplied into the processing container to process the substrate.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure relates to a fluid supply system, a substrate processing method, and a recording medium.

Background Art

[0002] Techniques for drying a substrate using a supercritical fluid are known. Patent Document 1 discloses a configuration for switching the temperature of the supercritical fluid supplied to the substrate.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The present disclosure provides a technique capable of suppressing backflow of a processing fluid.

Means for Solving the Problems

[0005] A fluid supply system according to one aspect of the present disclosure is a fluid supply system that supplies fluid into a processing container where a substrate is processed inside. The fluid supply system includes a fluid supply unit that supplies a processing fluid, and a control unit that controls the fluid supply unit. The fluid supply unit includes a first supply flow path that supplies the processing fluid into the processing container, a second supply flow path that supplies the processing fluid into the processing container, a first heating mechanism provided in the first supply flow path that heats the processing fluid to a first temperature, a second heating mechanism provided in the second supply flow path that heats the processing fluid to a second temperature, and a flow rate adjustment mechanism provided downstream of at least one of the first heating mechanism in the first supply flow path and the second heating mechanism in the second supply flow path to adjust the flow rate of the processing fluid. The control unit controls the fluid supply unit to supply the processing fluid into the processing container from at least one of the first supply flow path and the second supply flow path having the flow rate adjustment mechanism during the entire period of supplying the processing fluid into the processing container to process the substrate.

Advantages of the Invention

[0006] According to the present disclosure, backflow of the processing fluid can be suppressed.

Brief Description of the Drawings

[0007]

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DETAILED DESCRIPTION OF THE INVENTION

[0008] Hereinafter, non-limiting exemplary embodiments of the present disclosure will be described with reference to the accompanying drawings. In all the accompanying drawings, the same or corresponding members or components are denoted by the same or corresponding reference numerals, and redundant descriptions are omitted.

[0009] 〔First Embodiment〕 Referring to FIG. 1, the substrate processing apparatus 10 according to the first embodiment will be described. FIG. 1 is a diagram showing the substrate processing apparatus 10 according to the first embodiment.

[0010] The substrate processing apparatus 10 includes a processing unit 11, a fluid supply unit 12, a discharge unit 13, and a control unit 14. The fluid supply unit 12 and the control unit 14 constitute a fluid supply system.

[0011] The processing unit 11 includes a processing container 111 and a holding unit 112. The processing container 111 is a container having a processing space inside that can accommodate a substrate W with a diameter of, for example, 300 mm. The substrate W is, for example, a semiconductor wafer. The holding unit 112 is provided inside the processing container 111. The holding unit 112 holds the substrate W horizontally. The holding unit 112 is, for example, integrally formed with the processing container 111. The holding unit 112 may be configured separately from the processing container 111. The processing unit 11 may have a temperature sensor that detects the temperature inside the processing container 111. The processing unit 11 may have a pressure sensor that detects the pressure inside the processing container 111.

[0012] The fluid supply unit 12 includes a fluid supply source S11, a first supply flow path L11, a second supply flow path L12, a first bypass flow path L13, and a second bypass flow path L14.

[0013] The fluid supply source S11 is a supply source of the processing fluid. The processing fluid may be, for example, liquid carbon dioxide (CO2).

[0014] The upstream of the first supply flow path L11 is connected to the fluid supply source S11, and the downstream is connected to the processing container 111. A heating mechanism HE11 and an on-off valve V11 are provided in the first supply flow path L11 in order from the upstream. A line heater may be provided downstream of the heating mechanism HE11 in the first supply flow path L11. Various positions of the first supply flow path L11 may be further provided with on-off valves, orifices, filters, temperature sensors, pressure sensors, etc.

[0015] The heating mechanism HE11 heats the processing fluid supplied from the fluid supply source S11 to the first temperature and supplies the fluid at the first temperature downstream. The first temperature is, for example, 60°C. The heating mechanism HE11 is an example of a first heating mechanism.

[0016] The on-off valve V11 is a valve that switches the on and off of the flow of the processing fluid. In the open state, the on-off valve V11 allows the processing fluid to flow to the downstream processing vessel 111, and in the closed state, it does not allow the processing fluid to flow to the downstream processing vessel 111. The on-off valve V11 is an example of a first on-off valve.

[0017] The second supply flow path L12 is provided in parallel with the first supply flow path L11. The second supply flow path L12 branches from the first supply flow path L11 upstream of the heating mechanism HE11. The downstream of the second supply flow path L12 is connected to the processing vessel 111. The first supply flow path L11 and the second supply flow path L12 supply the processing fluid to different positions in the processing vessel 111 without merging midway. The heating mechanism HE12 and the on-off valve V12 are provided in the second supply flow path L12 in order from upstream. A line heater may be provided downstream of the heating mechanism HE12 in the second supply flow path L12. Various positions in the second supply flow path L12 may be further provided with on-off valves, orifices, filters, temperature sensors, pressure sensors, etc.

[0018] The heating mechanism HE12 heats the processing fluid supplied from the fluid supply source S11 to the second temperature and supplies the fluid at the second temperature downstream. The second temperature is a temperature higher than the first temperature. The second temperature is, for example, 120°C. The heating mechanism HE12 is an example of a second heating mechanism.

[0019] The on-off valve V12 is a valve that switches the on and off of the flow of the processing fluid. In the open state, the on-off valve V12 allows the processing fluid to flow to the downstream processing vessel 111, and in the closed state, it does not allow the processing fluid to flow to the downstream processing vessel 111. The on-off valve V12 is an example of a second on-off valve.

[0020] The first bypass flow path L13 bypasses by connecting the upstream side and the downstream side of the on-off valve V11 in the first supply flow path L11. The upstream of the first bypass flow path L13 is connected to the first supply flow path L11 between the heating mechanism HE11 and the on-off valve V11, and the downstream is connected to the first supply flow path L11 between the on-off valve V11 and the processing container 111. An on-off valve V13 and an orifice OR13 are provided in the first bypass flow path L13 in order from the upstream. A line heater may be provided in the first bypass flow path L13.

[0021] The on-off valve V13 is a valve that switches the on and off of the flow of the processing fluid. In the open state, the on-off valve V13 allows the processing fluid to flow to the downstream orifice OR13, and in the closed state, it does not allow the processing fluid to flow to the downstream orifice OR13.

[0022] The orifice OR13 has a function of reducing the flow velocity of the processing fluid and adjusting the pressure. The orifice OR13 allows the processing fluid with adjusted pressure to flow to the downstream processing container 111. The orifice OR13 is an example of a first throttle.

[0023] The first bypass flow path L13, the on-off valve V13, and the orifice OR13 constitute a flow rate adjustment mechanism for adjusting the flow rate of the processing fluid downstream of the heating mechanism HE11 in the first supply flow path L11.

[0024] The second bypass flow path L14 bypasses by connecting the upstream side and the downstream side of the on-off valve V12 in the second supply flow path L12. The upstream of the second bypass flow path L14 is connected to the second supply flow path L12 between the heating mechanism HE12 and the on-off valve V12, and the downstream is connected to the second supply flow path L12 between the on-off valve V12 and the processing container 111. An on-off valve V14 and an orifice OR14 are provided in the second bypass flow path L14 in order from the upstream. A line heater may be provided in the second bypass flow path L14.

[0025] The on-off valve V14 is a valve that switches the on and off of the flow of the processing fluid. In the open state, the on-off valve V14 allows the processing fluid to flow to the downstream orifice OR14, and in the closed state, it does not allow the processing fluid to flow to the downstream orifice OR14.

[0026] The orifice OR14 has a function of reducing the flow velocity of the processing fluid and adjusting the pressure. The orifice OR14 allows the processing fluid with adjusted pressure to flow to the downstream processing vessel 111. The orifice OR14 is an example of a second throttle.

[0027] The second bypass flow path L14, the on-off valve V14, and the orifice OR14 constitute a flow rate adjustment mechanism for adjusting the flow rate of the processing fluid downstream of the heating mechanism HE12 in the second supply flow path L12.

[0028] The discharge section 13 has a discharge flow path L19. The discharge flow path L19 is connected to the processing vessel 111. A pressure sensor P19, an on-off valve V19, and a back pressure valve BV19 are provided in the discharge flow path L19 in this order from the upstream. A line heater may be provided in the discharge flow path L19. On-off valves, temperature sensors, and pressure sensors may be further provided at various positions in the discharge flow path L19.

[0029] The pressure sensor P19 detects the pressure of the fluid flowing through the discharge flow path L19 immediately after the processing vessel 111. Thereby, the pressure inside the processing vessel 111 can be detected.

[0030] The on-off valve V19 is a valve that switches the on and off of the flow of the processing fluid. In the open state, the on-off valve V19 allows the processing fluid to flow to the downstream back pressure valve BV19, and in the closed state, it does not allow the processing fluid to flow to the downstream back pressure valve BV19.

[0031] When the primary side pressure of the discharge flow path L19 exceeds the set pressure, the back pressure valve BV19 adjusts the valve opening degree and allows the processing fluid to flow to the secondary side, thereby maintaining the primary side pressure at the set pressure. For example, the set pressure of the back pressure valve BV19 is adjusted by the control unit 14.

[0032] The control unit 14 is, for example, a computer and includes an arithmetic unit 141 and a storage unit 142. The storage unit 142 stores programs for controlling various processes executed in the substrate processing apparatus 10. The arithmetic unit 141 controls the operation of the substrate processing apparatus 10 by reading and executing the programs stored in the storage unit 142. The programs may have been recorded on a computer-readable recording medium and installed from that recording medium into the storage unit 142 of the control unit 14. Examples of computer-readable recording media include hard disks (HD), flexible disks (FD), compact disks (CD), magneto-optical disks (MO), memory cards, and the like.

[0033] The control unit 14 receives measurement signals from various sensors and transmits control signals to various functional elements. The control signals include, for example, opening / closing signals for the on-off valves V11, V12, V13, V14, V19 and a set pressure signal for the back pressure valve BV19.

[0034] With reference to FIGS. 2 to 4, a substrate processing method executed using the substrate processing apparatus 10 will be described. The substrate processing method shown below is automatically executed under the control of the control unit 14 based on the processing recipe and control program stored in the storage unit 142.

[0035] FIG. 2 is a flowchart showing the substrate processing method according to the first embodiment. FIG. 3 is a diagram showing the pressure change in the processing container 111 in the substrate processing method according to the first embodiment. In FIG. 3, the horizontal axis represents the processing time, and the vertical axis represents the pressure in the processing container 111 detected by the pressure sensor P19. FIG. 4 is a diagram showing the flow of the processing fluid in the first embodiment. FIG. 4(a) shows the flow of the processing fluid in the pressure increasing step ST12, FIG. 4(b) shows the flow of the processing fluid in the circulation step ST13, and FIG. 4(c) shows the flow of the processing fluid in the pressure decreasing step ST14.

[0036] As shown in FIG. 2, the substrate processing method according to the first embodiment includes a preparation step ST11, a pressure increasing step ST12, a circulation step ST13, and a pressure reducing step ST14.

[0037] In the preparation step ST11, the substrate W is carried into the processing container 111. The substrate W is subjected to a cleaning process and is placed on the holding portion 112 in a state where the concave portions of the surface pattern are filled with isopropyl alcohol (IPA).

[0038] The pressure increasing step ST12 is performed after the preparation step ST11. In the pressure increasing step ST12, as shown in FIG. 4(a), the on-off valves V11, V13, and V14 are in an open state, and the on-off valves V12 and V19 are in a closed state.

[0039] In the pressure increasing step ST12, since the on-off valves V11 and V13 are in an open state, the processing fluid heated to the first temperature by the heating mechanism HE11 passes through the on-off valves V11 and V13 and is supplied into the processing container 111 at a large flow rate. In the pressure increasing step ST12, since the on-off valve V12 is in a closed state and the on-off valve V14 is in an open state, the processing fluid heated to the second temperature by the heating mechanism HE12 passes through the orifice OR14, and its flow velocity decreases and is supplied into the processing container 111 at a small flow rate. As a result, a processing fluid having a temperature closer to the first temperature than the second temperature is supplied into the processing container 111.

[0040] In the pressure increasing step ST12, since the on-off valve V14 is in an open state, the processing fluid whose flow velocity has decreased due to the orifice OR14 is supplied into the processing container 111 throughout the entire period of the pressure increasing step ST12. Thereby, the backflow of the processing fluid from the inside of the processing container 111 toward the upstream of the second supply passage L12 is prevented. For this reason, the retention of the IPA residue between the on-off valves V12 and V14 and the processing container 111, in other words, on the secondary side of the on-off valves V12 and V14 can be suppressed. As a result, when the on-off valve V12 is opened and the processing fluid is supplied into the processing container 111 from the second supply passage L12 at a large flow rate, the inflow of the IPA residue into the processing container 111 together with the processing fluid can be suppressed.

[0041] In the pressure increasing step ST12, since the on-off valve V19 is in the closed state, the processing fluid does not flow out from the processing container 111. Therefore, as shown in FIG. 3, the pressure in the processing container 111 gradually increases. In the pressure increasing step ST12, the pressure of the processing fluid supplied into the processing container 111 is lower than the critical pressure. Therefore, the processing fluid is supplied into the processing container 111 in a gaseous (gas) state. Then, as the filling of the processing fluid into the processing container 111 progresses, the pressure in the processing container 111 increases. When the pressure in the processing container 111 exceeds the critical pressure, the processing fluid existing in the processing container 111 becomes a supercritical state. In the pressure increasing step ST12, when the pressure in the processing container 111 reaches a processing pressure higher than the critical pressure, the pressure increasing step ST12 ends and the flow process ST13 is entered.

[0042] The flow process ST13 is performed after the pressure increasing step ST12. In the flow process ST13, as shown in FIG. 4(b), the on-off valves V12, V13, V14, and V19 are in the open state, and the on-off valve V11 is in the closed state.

[0043] In the flow process ST13, since the on-off valves V12 and V14 are in the open state, the processing fluid heated to the second temperature by the heating mechanism HE12 passes through the on-off valves V12 and V14 and is supplied into the processing container 111 at a large flow rate. In the flow process ST13, since the on-off valve V11 is in the closed state and the on-off valve V13 is in the open state, the processing fluid heated to the first temperature by the heating mechanism HE11 passes through the orifice OR13, the flow rate decreases, and it is supplied into the processing container 111 at a small flow rate. Thereby, the processing fluid having a temperature closer to the second temperature than the first temperature is supplied into the processing container 111.

[0044] In the flow process ST13, since the on-off valve V13 is in the open state, the processing fluid whose flow rate has been reduced by the orifice OR13 is supplied into the processing container 111 over the entire period of the flow process ST13. Thereby, the backflow of the processing fluid from inside the processing container 111 toward the upstream of the first supply channel L11 is prevented. For this reason, it is possible to suppress the retention of the residue of IPA between the on-off valves V11, V13 and the processing container 111, in other words, on the secondary side of the on-off valves V11, V13. As a result, when the on-off valve V11 is in the open state and a large flow rate of the processing fluid is supplied from the first supply channel L11 into the processing container 111, it is possible to suppress the residue of IPA from flowing into the processing container 111 together with the processing fluid.

[0045] In the flow process ST13, since the on-off valve V19 is in the open state, the processing fluid supplied into the processing container 111 is discharged from inside the processing container 111 via the discharge channel L19. In the flow process ST13, the supply of the processing fluid into the processing container 111 and the discharge of the processing fluid from inside the processing container 111 are performed simultaneously. For this reason, as shown in FIG. 3, the pressure inside the processing container 111 is maintained substantially constant. By performing the flow process ST13, the replacement from IPA to the processing fluid is promoted inside the concave portions of the pattern of the substrate W. When the replacement from IPA to the processing fluid inside the concave portions of the pattern is completed, the flow process ST13 is terminated and the process proceeds to the depressurization process ST14.

[0046] The depressurization process ST14 is performed after the flow process ST13. In the depressurization process ST14, as shown in FIG. 4(c), the on-off valve V19 is in the open state and the on-off valves V11, V12, V13, V14 are in the closed state. Thereby, the processing fluid is discharged from inside the processing container 111 without the processing fluid being supplied into the processing container 111. For this reason, as shown in FIG. 3, the pressure inside the processing container 111 gradually decreases. When the pressure inside the processing container 111 becomes lower than the critical pressure of the processing fluid by the depressurization process ST14, the supercritical state processing fluid vaporizes and detaches from inside the concave portions of the pattern. Thereby, the drying process for one substrate W is completed.

[0047] As described above, according to the first embodiment, throughout the entire period of the boosting step ST12, a large flow rate of the processing fluid is supplied from the first supply channel L11 into the processing container 111, and a small flow rate of the processing fluid is supplied from the second supply channel L12 into the processing container 111. In this case, in the boosting step ST12, the backflow of the processing fluid from inside the processing container 111 toward the upstream of the second supply channel L12 is prevented.

[0048] According to the first embodiment, throughout the entire period of the circulation step ST13, a large flow rate of the processing fluid is supplied from the second supply channel L12 into the processing container 111, and a small flow rate of the processing fluid is supplied from the first supply channel L11 into the processing container 111. In this case, in the circulation step ST13, the backflow of the processing fluid from inside the processing container 111 toward the upstream of the first supply channel L11 is prevented.

[0049] In the first embodiment, the case where the on-off valve V13 is in the open state in the boosting step ST12 has been described, but the on-off valve V13 may be in the closed state. In the first embodiment, the case where the on-off valve V14 is in the open state in the circulation step ST13 has been described, but the on-off valve V14 may be in the closed state.

[0050] (First Modified Example) Referring to FIG. 5, the substrate processing apparatus 10A according to the first modified example of the first embodiment will be described. FIG. 5 is a diagram showing the substrate processing apparatus 10A according to the first modified example of the first embodiment.

[0051] The substrate processing apparatus 10A is different from the substrate processing apparatus 10 in that the first supply channel L11 and the second supply channel L12 merge before being connected to the processing container 111 and supply the processing fluid to the same position inside the processing container 111. Regarding other configurations, they are the same as those of the substrate processing apparatus 10. Hereinafter, the description will focus on the configurations different from those of the substrate processing apparatus 10.

[0052] The first supply channel L11 and the second supply channel L12 are provided in parallel. The second supply channel L12 branches from the first supply channel L11 upstream of the heating mechanism HE11 and merges with the first supply channel L11 downstream of the on-off valve V11. The first supply channel L11 and the second supply channel L12 merge immediately before being connected to the processing container 111 and supply the processing fluid to the same position within the processing container 111.

[0053] The substrate processing method executed using the substrate processing apparatus 10A may be the same as the substrate processing method executed using the substrate processing apparatus 10.

[0054] According to the first modification of the first embodiment, throughout the entire period of the pressure boosting step ST12, a large flow rate of the processing fluid is supplied from the first supply channel L11 into the processing container 111, and a small flow rate of the processing fluid is supplied from the second supply channel L12 into the processing container 111. In this case, during the pressure boosting step ST12, backflow of the processing fluid from the confluence of the first supply channel L11 and the second supply channel L12 toward the upstream of the second supply channel L12 is prevented.

[0055] According to the first modification of the first embodiment, throughout the entire period of the circulation step ST13, a large flow rate of the processing fluid is supplied from the second supply channel L12 into the processing container 111, and a small flow rate of the processing fluid is supplied from the first supply channel L11 into the processing container 111. In this case, during the circulation step ST13, backflow of the processing fluid from the confluence of the first supply channel L11 and the second supply channel L12 toward the upstream of the first supply channel L11 is prevented.

[0056] (Second Modification) Referring to FIG. 6, the substrate processing apparatus 10B according to the second modification of the first embodiment will be described. FIG. 6 is a diagram showing the substrate processing apparatus 10B according to the second modification of the first embodiment.

[0057] The substrate processing apparatus 10B is different from the substrate processing apparatus 10 in a configuration where the first bypass channel L13, the on-off valve V13, and the orifice OR13 are not provided. For other configurations, they are the same as those of the substrate processing apparatus 10.

[0058] Referring to FIG. 7, a substrate processing method executed using the substrate processing apparatus 10B will be described. The substrate processing method shown below is automatically executed under the control of the control unit 14 based on the processing recipe and control program stored in the storage unit 142. FIG. 7 is a diagram showing the flow of the processing fluid in the second modification of the first embodiment. FIG. 7(a) shows the flow of the processing fluid in the pressure increasing step ST12, FIG. 7(b) shows the flow of the processing fluid in the circulation step ST13, and FIG. 7(c) shows the flow of the processing fluid in the pressure reducing step ST14.

[0059] The substrate processing method according to the second modification of the first embodiment includes a preparation step ST11, a pressure increasing step ST12, a circulation step ST13, and a pressure reducing step ST14.

[0060] The preparation step ST11 is the same as the substrate processing method according to the first embodiment.

[0061] The pressure increasing step ST12 is performed after the preparation step ST11. In the pressure increasing step ST12, as shown in FIG. 7(a), the on-off valves V11 and V14 are opened, and the on-off valves V12 and V19 are closed.

[0062] In the pressure increasing step ST12, since the on-off valve V11 is open, the processing fluid heated to the first temperature by the heating mechanism HE11 passes through the on-off valve V11 and is supplied into the processing container 111 at a large flow rate. In the pressure increasing step ST12, since the on-off valve V12 is closed and the on-off valve V14 is open, the processing fluid heated to the second temperature by the heating mechanism HE12 passes through the orifice OR14, and its flow rate decreases and is supplied into the processing container 111 at a small flow rate. As a result, the processing fluid having a temperature closer to the first temperature than the second temperature is supplied into the processing container 111.

[0063] In the pressure boosting step ST12, since the on-off valve V14 is in the open state, the processing fluid whose flow rate has decreased due to the orifice OR14 is supplied into the processing container 111 over the entire period of the pressure boosting step ST12. Thereby, backflow of the processing fluid from inside the processing container 111 toward the upstream of the second supply flow path L12 is prevented. For this reason, it is possible to suppress the retention of the residue of IPA between the on-off valves V12, V14 and the processing container 111, in other words, on the secondary side of the on-off valves V12, V14. As a result, when the on-off valve V12 is in the open state and a large flow rate of the processing fluid is supplied from the second supply flow path L12 into the processing container 111, it is possible to suppress the residue of IPA from flowing into the processing container 111 together with the processing fluid.

[0064] In the pressure boosting step ST12, since the on-off valve V19 is in the closed state, the processing fluid does not flow out from the processing container 111. For this reason, as shown in FIG. 3, the pressure inside the processing container 111 gradually increases. In the pressure boosting step ST12, the pressure of the processing fluid supplied into the processing container 111 is lower than the critical pressure. For this reason, the processing fluid is supplied into the processing container 111 in a gaseous (gas) state. Thereafter, as the filling of the processing fluid into the processing container 111 progresses, the pressure inside the processing container 111 increases, and when the pressure inside the processing container 111 exceeds the critical pressure, the processing fluid existing inside the processing container 111 becomes a supercritical state. In the pressure boosting step ST12, when the pressure inside the processing container 111 reaches a processing pressure higher than the critical pressure, the pressure boosting step ST12 is terminated and the process proceeds to the flow-through step ST13.

[0065] The flow-through step ST13 is performed after the pressure boosting step ST12. In the flow-through step ST13, as shown in FIG. 7(b), the on-off valves V12, V14, V19 are in the open state and the on-off valve V11 is in the closed state.

[0066] In the flow process ST13, since the on-off valves V12 and V14 are in the open state, the processing fluid heated to the second temperature by the heating mechanism HE12 passes through the on-off valves V12 and V14 and is supplied into the processing container 111 at a large flow rate. In the flow process ST13, since the on-off valve V11 is in the closed state, the processing fluid heated to the first temperature by the heating mechanism HE12 is not supplied into the processing container 111. As a result, the processing fluid at the second temperature is supplied into the processing container 111.

[0067] In the flow process ST13, since the on-off valve V19 is in the open state, the processing fluid supplied into the processing container 111 is discharged from the processing container 111 via the discharge flow path L19. In the flow process ST13, the supply of the processing fluid into the processing container 111 and the discharge of the processing fluid from the processing container 111 are performed simultaneously. For this reason, as shown in FIG. 3, the pressure inside the processing container 111 is maintained substantially constant. By performing the flow process ST13, the replacement of IPA with the processing fluid is promoted in the concave portions of the pattern of the substrate W. When the replacement of IPA with the processing fluid in the concave portions of the pattern is completed, the flow process ST13 is terminated and the pressure reduction process ST14 is entered.

[0068] The pressure reduction process ST14 is performed after the flow process ST13. In the pressure reduction process ST14, as shown in FIG. 7(c), the on-off valve V19 is set to the open state and the on-off valves V11, V12, and V14 are set to the closed state. The pressure reduction process ST14 is the same as the substrate processing method according to the first embodiment.

[0069] As described above, according to the second modification of the first embodiment, during the entire period of the pressure increase process ST12, a large flow rate of the processing fluid is supplied from the first supply flow path L11 into the processing container 111, and a small flow rate of the processing fluid is supplied from the second supply flow path L12 into the processing container 111. In this case, in the pressure increase process ST12, the backflow of the processing fluid from the inside of the processing container 111 toward the upstream of the second supply flow path L12 is prevented.

[0070] In the second modification of the first embodiment, the case where the on-off valve V14 is in the open state in the flow process ST13 has been described, but the on-off valve V14 may be in the closed state.

[0071] In the second modification of the first embodiment, the case where the first supply channel L11 and the second supply channel L12 supply the processing fluid to different positions in the processing container 111 without merging midway has been described, but the present invention is not limited to this. For example, similar to the substrate processing apparatus 10A according to the first modification of the first embodiment, the first supply channel L11 and the second supply channel L12 may merge before being connected to the processing container 111 and supply the processing fluid to the same position in the processing container 111.

[0072] (Third Modification) Referring to FIG. 8, the substrate processing apparatus 10C according to the third modification of the first embodiment will be described. FIG. 8 is a diagram showing the substrate processing apparatus 10C according to the third modification of the first embodiment.

[0073] The substrate processing apparatus 10C is different from the substrate processing apparatus 10 in that the second bypass channel L14, the on-off valve V14, and the orifice OR14 are not provided. Other configurations are the same as those of the substrate processing apparatus 10.

[0074] Referring to FIG. 9, the substrate processing method executed using the substrate processing apparatus 10C will be described. The substrate processing method shown below is automatically executed under the control of the control unit 14 based on the processing recipe and the control program stored in the storage unit 142. FIG. 9 is a diagram showing the flow of the processing fluid in the third modification of the first embodiment. FIG. 9(a) shows the flow of the processing fluid in the pressure increasing step ST12, FIG. 9(b) shows the flow of the processing fluid in the circulation step ST13, and FIG. 9(c) shows the flow of the processing fluid in the pressure reducing step ST14.

[0075] The substrate processing method according to the third modification of the first embodiment includes a preparation step ST11, a pressure increasing step ST12, a circulation step ST13, and a pressure reducing step ST14.

[0076] The preparation step ST11 is the same as the substrate processing method according to the first embodiment.

[0077] The pressure increasing step ST12 is performed after the preparation step ST11. In the pressure increasing step ST12, as shown in Fig. 9(a), the on-off valves V11 and V13 are opened, and the on-off valves V12 and V19 are closed.

[0078] In the pressure increasing step ST12, since the on-off valves V11 and V13 are open, the processing fluid heated to the first temperature by the heating mechanism HE11 passes through the on-off valves V11 and V13 and is supplied into the processing vessel 111 in a large flow rate. In the pressure increasing step ST12, since the on-off valve V12 is closed, the processing fluid heated to the second temperature by the heating mechanism HE12 is not supplied into the processing vessel 111. As a result, the processing fluid at the first temperature is supplied into the processing vessel 111.

[0079] In the pressure increasing step ST12, since the on-off valve V19 is closed, the processing fluid does not flow out from the processing vessel 111. Therefore, as shown in Fig. 3, the pressure in the processing vessel 111 gradually increases. In the pressure increasing step ST12, the pressure of the processing fluid supplied into the processing vessel 111 is lower than the critical pressure. Therefore, the processing fluid is supplied into the processing vessel 111 in a gaseous state. Then, as the filling of the processing fluid into the processing vessel 111 progresses, the pressure in the processing vessel 111 increases. When the pressure in the processing vessel 111 exceeds the critical pressure, the processing fluid existing in the processing vessel 111 becomes a supercritical state. In the pressure increasing step ST12, when the pressure in the processing vessel 111 reaches a processing pressure higher than the critical pressure, the pressure increasing step ST12 ends and the flow step ST13 is entered.

[0080] The flow step ST13 is performed after the pressure increasing step ST12. In the flow step ST13, as shown in Fig. 9(b), the on-off valves V12, V13, and V19 are opened, and the on-off valve V11 is closed.

[0081] In the flow process ST13, since the on-off valve V12 is in the open state, the processing fluid heated to the second temperature by the heating mechanism HE12 passes through the on-off valve V12 and is supplied into the processing vessel 111 at a large flow rate. In the flow process ST13, since the on-off valve V11 is in the closed state and the on-off valve V13 is in the open state, the processing fluid heated to the first temperature by the heating mechanism HE11 passes through the orifice OR13, its flow velocity decreases, and it is supplied into the processing vessel 111 at a small flow rate. As a result, a processing fluid having a temperature closer to the second temperature than the first temperature is supplied into the processing vessel 111.

[0082] In the flow process ST13, since the on-off valve V13 is in the open state, the processing fluid whose flow velocity has decreased due to the orifice OR13 is supplied into the processing vessel 111 over the entire period of the flow process ST13. Thereby, the backflow of the processing fluid from inside the processing vessel 111 toward the upstream of the first supply channel L11 is prevented. For this reason, the retention of the residue of IPA can be suppressed between the on-off valves V11, V13 and the processing vessel 111, in other words, on the secondary side of the on-off valves V11, V13. As a result, when the on-off valve V11 is opened and the processing fluid is supplied into the processing vessel 111 from the first supply channel L11 at a large flow rate, the inflow of the residue of IPA into the processing vessel 111 together with the processing fluid can be suppressed.

[0083] In the flow process ST13, since the on-off valve V19 is in the open state, the processing fluid supplied into the processing vessel 111 is discharged from inside the processing vessel 111 via the discharge channel L19. In the flow process ST13, the supply of the processing fluid into the processing vessel 111 and the discharge of the processing fluid from inside the processing vessel 111 are performed simultaneously. For this reason, as shown in FIG. 3, the pressure inside the processing vessel 111 is maintained substantially constant. By performing the flow process ST13, the replacement from IPA to the processing fluid is promoted in the concave portions of the pattern of the substrate W. When the replacement from IPA to the processing fluid in the concave portions of the pattern is completed, the flow process ST13 is terminated and the process proceeds to the depressurization process ST14.

[0084] The depressurization step ST14 is performed after the circulation step ST13. In the depressurization step ST14, as shown in FIG. 9(c), the on-off valve V19 is opened and the on-off valves V11, V12, and V13 are closed. The depressurization step ST14 is the same as the substrate processing method according to the first embodiment.

[0085] As described above, according to the third modification of the first embodiment, throughout the entire circulation step ST13, a large flow rate of the processing fluid is supplied from the second supply channel L12 into the processing vessel 111, and a small flow rate of the processing fluid is supplied from the first supply channel L11 into the processing vessel 111. In this case, in the circulation step ST13, the backflow of the processing fluid from the inside of the processing vessel 111 toward the upstream of the first supply channel L11 is prevented.

[0086] In the circulation step ST13, since the pressure inside the processing vessel 111 increases and the processing fluid is in a supercritical state, the processing fluid is more likely to diffuse and the backflow of the processing fluid is more likely to occur compared to the pressure increasing step ST12. Therefore, throughout the entire circulation step ST13, supplying a large flow rate of the processing fluid from the second supply channel L12 into the processing vessel 111 and supplying a small flow rate of the processing fluid from the first supply channel L11 into the processing vessel 111 is particularly effective from the viewpoint of preventing the backflow of the processing fluid.

[0087] In the third modification of the first embodiment, the case where the on-off valve V13 is opened in the pressure increasing step ST12 has been described, but the on-off valve V13 may be closed.

[0088] In the third modification of the first embodiment, the case where the first supply channel L11 and the second supply channel L12 supply the processing fluid to different positions inside the processing vessel 111 without merging on the way has been described, but it is not limited to this. For example, similar to the substrate processing apparatus 10A according to the first modification of the first embodiment, the first supply channel L11 and the second supply channel L12 may merge before being connected to the processing vessel 111 and supply the processing fluid to the same position inside the processing vessel 111.

[0089] 〔Second Embodiment〕 Referring to FIG. 10, the substrate processing apparatus 20 according to the second embodiment will be described. FIG. 10 is a diagram showing the substrate processing apparatus 20 according to the second embodiment.

[0090] The substrate processing apparatus 20 includes a processing unit 21, a fluid supply unit 22, a discharge unit 23, and a control unit 24. The fluid supply unit 22 and the control unit 24 constitute a fluid supply system.

[0091] The processing unit 21 may be the same as the processing unit 11. The processing unit 21 includes a processing container 211 and a holding unit 212.

[0092] The fluid supply unit 22 includes a fluid supply source S21, a first supply flow path L21, a second supply flow path L22, a first connection flow path L23, and a second connection flow path L24.

[0093] The fluid supply source S21 may be the same as the fluid supply source S11.

[0094] The first supply flow path L21 may be the same as the first supply flow path L11. A heating mechanism HE21 and an on-off valve V21 are provided in the first supply flow path L21 in this order from the upstream. A line heater may be provided downstream of the heating mechanism HE21 in the first supply flow path L21. Various positions of the first supply flow path L21 may be further provided with an on-off valve, an orifice, a filter, a temperature sensor, a pressure sensor, and the like. The heating mechanism HE21 may be the same as the heating mechanism HE11. The on-off valve V21 may be the same as the on-off valve V11.

[0095] The second supply flow path L22 may be the same as the second supply flow path L12. A heating mechanism HE22 and an on-off valve V22 are provided in the second supply flow path L22 in this order from the upstream. A line heater may be provided downstream of the heating mechanism HE22 in the second supply flow path L22. Various positions of the second supply flow path L22 may be further provided with an on-off valve, an orifice, a filter, a temperature sensor, a pressure sensor, and the like. The heating mechanism HE22 may be the same as the heating mechanism HE12. The on-off valve V22 may be the same as the on-off valve V12.

[0096] An orifice may be provided immediately before the processing container 211 in the first supply flow path L21 and immediately before the processing container 211 in the second supply flow path L22. In this case, on the downstream side of the on-off valves V21, V22, and V23, it is possible to suppress the circulation of the processing fluid via the first supply flow path L21, the second supply flow path L22, the first connection flow path L23, the second connection flow path L24, and the processing container 211.

[0097] The first connection flow path L23 connects the upstream side of the on-off valve V21 in the first supply flow path L21 and the downstream side of the on-off valve V22 in the second supply flow path L22. The upstream of the first connection flow path L23 is connected to the first supply flow path L21 between the heating mechanism HE21 and the on-off valve V21, and the downstream is connected to the second supply flow path L22 between the on-off valve V22 and the processing container 211. An orifice OR23 and an on-off valve V23 are provided in the first connection flow path L23 in order from the upstream. A line heater may be provided in the first connection flow path L23.

[0098] The orifice OR23 has a function of reducing the flow velocity of the processing fluid and adjusting the pressure. The orifice OR23 allows the processing fluid with adjusted pressure to flow through to the downstream processing container 211. The orifice OR23 is an example of a third throttle.

[0099] The on-off valve V23 is a valve that switches the on and off of the flow of the processing fluid. In the open state, the on-off valve V23 allows the processing fluid to flow to the downstream processing container 211, and in the closed state, it does not allow the processing fluid to flow to the downstream processing container 211.

[0100] The first connection flow path L23, the orifice OR23, and the on-off valve V23 constitute a flow rate adjustment mechanism for adjusting the flow rate of the processing fluid downstream of the heating mechanism HE21 in the first supply flow path L21.

[0101] The second connection flow path L24 connects the upstream side of the on-off valve V22 in the second supply flow path L22 and the downstream side of the on-off valve V21 in the first supply flow path L21. The upstream of the second connection flow path L24 is connected to the second supply flow path L22 between the heating mechanism HE22 and the on-off valve V22, and the downstream is connected to the first supply flow path L21 between the on-off valve V21 and the processing container 211. The second connection flow path L24 merges with the first connection flow path L23 on the way and then branches again. An orifice OR24 and an on-off valve V23 are provided in the second connection flow path L24 in order from the upstream. The orifice OR24 is provided on the upstream side of the confluence of the second connection flow path L24 and the first connection flow path L23. The on-off valve V23 is provided at the portion where the first connection flow path L23 and the second connection flow path L24 merge. Therefore, the number of on-off valves can be reduced by one compared to the substrate processing apparatus 10 according to the first embodiment. A line heater may be provided in the second connection flow path L24.

[0102] The orifice OR24 has a function of reducing the flow velocity of the processing fluid and adjusting the pressure. The orifice OR24 allows the processing fluid with adjusted pressure to flow through to the downstream processing container 211. The orifice OR24 is an example of a fourth throttle.

[0103] The second connection flow path L24, the orifice OR24, and the on-off valve V23 constitute a flow rate adjustment mechanism for adjusting the flow rate of the processing fluid downstream of the heating mechanism HE22 in the second supply flow path L22.

[0104] The discharge unit 23 may be the same as the discharge unit 13. The discharge unit 23 has a discharge flow path L29. The discharge flow path L29 is connected to the processing container 211. A pressure sensor P29, an on-off valve V29, and a back pressure valve BV29 are provided in the discharge flow path L29 in order from the upstream. The pressure sensor P29, the on-off valve V29, and the back pressure valve BV29 may be the same as the pressure sensor P19, the on-off valve V19, and the back pressure valve BV19, respectively.

[0105] The control unit 24 may be the same as the control unit 14. The control unit 24 receives measurement signals from various sensors and transmits control signals to various functional elements. The control signals include, for example, the opening / closing signals of the on-off valves V21, V22, V23, V29 and the set pressure signal of the back pressure valve BV29.

[0106] Referring to FIG. 11, a substrate processing method executed using the substrate processing apparatus 20 will be described. The substrate processing method shown below is automatically executed under the control of the control unit 24 based on the processing recipe and control program stored in the storage unit 242.

[0107] FIG. 11 is a diagram showing the flow of the processing fluid in the second embodiment. FIG. 11(a) shows the flow of the processing fluid in the pressure increasing step ST12, FIG. 11(b) shows the flow of the processing fluid in the circulation step ST13, and FIG. 11(c) shows the flow of the processing fluid in the pressure reducing step ST14.

[0108] The substrate processing method according to the second embodiment includes a preparation step ST11, a pressure increasing step ST12, a circulation step ST13, and a pressure reducing step ST14.

[0109] The preparation step ST11 is the same as the substrate processing method according to the first embodiment.

[0110] The pressure increasing step ST12 is performed after the preparation step ST11. In the pressure increasing step ST12, as shown in FIG. 11(a), the on-off valves V21, V23 are opened and the on-off valves V22, V29 are closed.

[0111] In the pressure increasing step ST12, since the on-off valves V21 and V23 are in the open state, the processing fluid heated to the first temperature by the heating mechanism HE21 passes through the on-off valves V21 and V23 and is supplied into the processing container 211 at a large flow rate. In the pressure increasing step ST12, since the on-off valve V22 is in the closed state and the on-off valve V23 is in the open state, the processing fluid heated to the second temperature by the heating mechanism HE22 passes through the orifice OR24, resulting in a decrease in flow velocity and being supplied into the processing container 211 at a small flow rate. As a result, a processing fluid having a temperature closer to the first temperature than the second temperature is supplied into the processing container 211.

[0112] In the pressure increasing step ST12, since the on-off valve V23 is in the open state, the processing fluid with a reduced flow velocity due to the orifice OR24 is supplied into the processing container 211 throughout the entire period of the pressure increasing step ST12. Thereby, the backflow of the processing fluid from inside the processing container 211 toward the upstream of the second supply passage L22 is prevented. For this reason, it is possible to suppress the retention of the IPA residue between the on-off valves V22 and V23 and the processing container 211, in other words, on the secondary side of the on-off valves V22 and V23. As a result, when the on-off valve V22 is opened and the processing fluid is supplied into the processing container 211 from the second supply passage L22 at a large flow rate, it is possible to suppress the inflow of the IPA residue into the processing container 211 together with the processing fluid.

[0113] In the pressure increasing step ST12, since the on-off valve V29 is in the closed state, the processing fluid does not flow out from the processing container 211. For this reason, as shown in FIG. 3, the pressure inside the processing container 211 gradually increases. In the pressure increasing step ST12, the pressure of the processing fluid supplied into the processing container 211 is lower than the critical pressure. For this reason, the processing fluid is supplied into the processing container 211 in a gaseous (gas) state. Thereafter, as the filling of the processing fluid into the processing container 211 progresses, the pressure inside the processing container 211 increases. When the pressure inside the processing container 211 exceeds the critical pressure, the processing fluid existing inside the processing container 211 becomes a supercritical state. In the pressure increasing step ST12, when the pressure inside the processing container 211 reaches a processing pressure higher than the critical pressure, the pressure increasing step ST12 is terminated and the flow-through step ST13 is entered.

[0114] The circulation process ST13 is performed after the pressure boosting process ST12. In the circulation process ST13, as shown in Fig. 11(b), the on-off valves V22, V23, and V29 are in the open state, and the on-off valve V21 is in the closed state.

[0115] In the circulation process ST13, since the on-off valves V22 and V23 are in the open state, the processing fluid heated to the second temperature by the heating mechanism HE22 passes through the on-off valves V22 and V23 and is supplied into the processing container 211 in a large flow rate. In the circulation process ST13, since the on-off valve V21 is in the closed state and the on-off valve V23 is in the open state, the processing fluid heated to the first temperature by the heating mechanism HE21 passes through the orifice OR23, the flow rate decreases, and it is supplied into the processing container 211 in a small flow rate. Thereby, a processing fluid having a temperature closer to the second temperature than the first temperature is supplied into the processing container 211.

[0116] In the circulation process ST13, since the on-off valve V23 is in the open state, the processing fluid whose flow rate has decreased due to the orifice OR23 is supplied into the processing container 211 over the entire period of the circulation process ST13. Thereby, the backflow of the processing fluid from the inside of the processing container 211 toward the upstream of the first supply passage L21 is prevented. For this reason, the retention of the IPA residue between the on-off valves V21 and V23 and the processing container 211, in other words, on the secondary side of the on-off valves V21 and V23 can be suppressed. As a result, when the on-off valve V21 is opened and the processing fluid is supplied into the processing container 211 from the first supply passage L21 in a large flow rate, it is possible to suppress the IPA residue from flowing into the processing container 211 together with the processing fluid.

[0117] In the circulation step ST13, since the on-off valve V29 is in the open state, the processing fluid supplied into the processing vessel 211 is discharged from the processing vessel 211 via the discharge flow path L29. In the circulation step ST13, the supply of the processing fluid into the processing vessel 211 and the discharge of the processing fluid from the processing vessel 211 are performed simultaneously. For this reason, as shown in FIG. 3, the pressure inside the processing vessel 211 is maintained substantially constant. By performing the circulation step ST13, the replacement of IPA with the processing fluid is promoted in the concave portions of the pattern of the substrate W. When the replacement of IPA with the processing fluid in the concave portions of the pattern is completed, the circulation step ST13 is terminated and the process proceeds to the depressurization step ST14.

[0118] The depressurization step ST14 is performed after the circulation step ST13. In the depressurization step ST14, as shown in FIG. 11(c), the on-off valve V29 is set to the open state and the on-off valves V21, V22, and V23 are set to the closed state. The depressurization step ST14 is the same as the substrate processing method according to the first embodiment.

[0119] As described above, according to the second embodiment, throughout the entire period of the pressure increase step ST12, a large flow rate of the processing fluid is supplied from the first supply flow path L21 into the processing vessel 211, and a small flow rate of the processing fluid is supplied from the second supply flow path L22 into the processing vessel 211. In this case, in the pressure increase step ST12, the backflow of the processing fluid from the inside of the processing vessel 211 toward the upstream of the second supply flow path L22 is prevented.

[0120] According to the second embodiment, throughout the entire period of the circulation step ST13, a large flow rate of the processing fluid is supplied from the second supply flow path L22 into the processing vessel 211, and a small flow rate of the processing fluid is supplied from the first supply flow path L21 into the processing vessel 211. In this case, in the circulation step ST13, the backflow of the processing fluid from the inside of the processing vessel 211 toward the upstream of the first supply flow path L21 is prevented.

[0121] (First Modification Example) With reference to FIG. 12, the substrate processing apparatus 20A according to the first modification example of the second embodiment will be described. FIG. 12 is a diagram showing the substrate processing apparatus 20A according to the first modification example of the second embodiment.

[0122] The substrate processing apparatus 20A is different from the substrate processing apparatus 20 in that the first supply channel L21 and the second supply channel L22 merge before being connected to the processing container 211 and supply the processing fluid to the same position in the processing container 211. For other configurations, they are the same as those of the substrate processing apparatus 20. Hereinafter, the description will focus on the configuration different from that of the substrate processing apparatus 20.

[0123] The first supply channel L21 and the second supply channel L22 are provided in parallel. The second supply channel L22 branches from the first supply channel L21 upstream of the heating mechanism HE21 and merges with the first supply channel L21 downstream of the on-off valve V21. The first supply channel L21 and the second supply channel L22 merge immediately before being connected to the processing container 211 and supply the processing fluid to the same position in the processing container 211.

[0124] The substrate processing method executed using the substrate processing apparatus 20A may be the same as the substrate processing method executed using the substrate processing apparatus 20.

[0125] According to the first modification of the second embodiment, during the entire period of the pressure increasing step ST12, a large flow rate of the processing fluid is supplied from the first supply channel L21 into the processing container 211, and a small flow rate of the processing fluid is supplied from the second supply channel L22 into the processing container 211. In this case, during the pressure increasing step ST12, backflow of the processing fluid from the confluence of the first supply channel L21 and the second supply channel L22 toward the upstream of the second supply channel L22 is prevented.

[0126] According to the first modification of the second embodiment, during the entire period of the circulation step ST13, a large flow rate of the processing fluid is supplied from the second supply channel L22 into the processing container 211, and a small flow rate of the processing fluid is supplied from the first supply channel L21 into the processing container 211. In this case, during the circulation step ST13, backflow of the processing fluid from the confluence of the first supply channel L21 and the second supply channel L22 toward the upstream of the first supply channel L21 is prevented.

[0127] 〔Third Embodiment〕 Referring to FIG. 13, the substrate processing apparatus 30 according to the third embodiment will be described. FIG. 13 is a diagram showing the substrate processing apparatus 30 according to the third embodiment.

[0128] The substrate processing apparatus 30 is different from the substrate processing apparatus 20 in a configuration where the first connection flow path L33 and the second connection flow path L34 do not merge. Hereinafter, the description will focus on the configuration different from that of the substrate processing apparatus 20.

[0129] The substrate processing apparatus 30 includes a processing unit 31, a fluid supply unit 32, a discharge unit 33, and a control unit 34. The fluid supply unit 32 and the control unit 34 constitute a fluid supply system.

[0130] The processing unit 31 may be the same as the processing unit 11. The processing unit 31 includes a processing container 311 and a holding unit 312.

[0131] The fluid supply unit 32 includes a fluid supply source S31, a first supply flow path L31, a second supply flow path L32, a first connection flow path L33, and a second connection flow path L34.

[0132] The fluid supply source S31 may be the same as the fluid supply source S11.

[0133] The first supply flow path L31 may be the same as the first supply flow path L11. A heating mechanism HE31 and an on-off valve V31 are provided in the first supply flow path L31 in order from the upstream. A line heater may be provided downstream of the heating mechanism HE31 in the first supply flow path L31. Various positions of the first supply flow path L31 may be further provided with an on-off valve, an orifice, a filter, a temperature sensor, a pressure sensor, and the like. The heating mechanism HE31 may be the same as the heating mechanism HE11. The on-off valve V31 may be the same as the on-off valve V11.

[0134] The second supply flow path L32 may be the same as the second supply flow path L12. In the second supply flow path L32, a heating mechanism HE32 and an on-off valve V32 are provided in order from upstream. A line heater may be provided downstream of the heating mechanism HE32 in the second supply flow path L32. Various positions of the second supply flow path L32 may be further provided with an on-off valve, an orifice, a filter, a temperature sensor, a pressure sensor, and the like. The heating mechanism HE32 may be the same as the heating mechanism HE12. The on-off valve V32 may be the same as the on-off valve V12.

[0135] The first connection flow path L33 connects the upstream side of the on-off valve V31 in the first supply flow path L31 and the downstream side of the on-off valve V32 in the second supply flow path L32. The upstream of the first connection flow path L33 is connected to the first supply flow path L31 between the heating mechanism HE31 and the on-off valve V31, and the downstream is connected to the second supply flow path L32 between the on-off valve V32 and the processing container 311. In the first connection flow path L33, an on-off valve V33 and an orifice OR33 are provided in order from upstream. A line heater may be provided in the first connection flow path L33.

[0136] The on-off valve V33 is a valve that switches the on and off of the flow of the processing fluid. In the open state, the on-off valve V33 allows the processing fluid to flow to the downstream orifice OR33, and in the closed state, it does not allow the processing fluid to flow to the downstream orifice OR33.

[0137] The orifice OR33 has a function of reducing the flow velocity of the processing fluid and adjusting the pressure. The orifice OR33 allows the processing fluid with adjusted pressure to flow through to the downstream processing container 311. The orifice OR33 is an example of a third throttle.

[0138] The first connection flow path L33, the on-off valve V33, and the orifice OR33 constitute a flow rate adjustment mechanism for adjusting the flow rate of the processing fluid downstream of the heating mechanism HE31 in the first supply flow path L31.

[0139] The second connection flow path L34 connects the upstream side of the on-off valve V32 in the second supply flow path L32 and the downstream side of the on-off valve V31 in the first supply flow path L31. The upstream of the second connection flow path L34 is connected to the second supply flow path L32 between the heating mechanism HE32 and the on-off valve V32, and the downstream is connected to the first supply flow path L31 between the on-off valve V31 and the processing container 311. The second connection flow path L34 does not merge with the first connection flow path L33. An on-off valve V34 and an orifice OR34 are provided in the second connection flow path L34 in order from the upstream. A line heater may be provided in the second connection flow path L34.

[0140] The on-off valve V34 is a valve that switches the on and off of the flow of the processing fluid. In the open state, the on-off valve V34 allows the processing fluid to flow to the downstream orifice OR34, and in the closed state, it does not allow the processing fluid to flow to the downstream orifice OR34.

[0141] The orifice OR34 has a function of reducing the flow velocity of the processing fluid and adjusting the pressure. The orifice OR34 allows the processing fluid with adjusted pressure to flow through to the downstream processing container 311. The orifice OR34 is an example of a fourth throttle.

[0142] The second connection flow path L34, the on-off valve V34, and the orifice OR34 constitute a flow rate adjustment mechanism for adjusting the flow rate of the processing fluid downstream of the heating mechanism HE32 in the second supply flow path L32.

[0143] The discharge part 33 may be the same as the discharge part 13. The discharge part 33 has a discharge flow path L39. The discharge flow path L39 is connected to the processing container 311. A pressure sensor P39, an on-off valve V39, and a back pressure valve BV39 are provided in the discharge flow path L39 in order from the upstream. A line heater may be provided in the discharge flow path L39. The pressure sensor P39, the on-off valve V39, and the back pressure valve BV39 may be the same as the pressure sensor P19, the on-off valve V19, and the back pressure valve BV19, respectively.

[0144] The control unit 34 may be the same as the control unit 14. The control unit 34 receives measurement signals from various sensors and transmits control signals to various functional elements. The control signals include, for example, the opening / closing signals of the on-off valves V31, V32, V33, V34, V39 and the set pressure signal of the back pressure valve BV39.

[0145] Referring to FIG. 14, a substrate processing method executed using the substrate processing apparatus 30 will be described. The substrate processing method shown below is automatically executed under the control of the control unit 34 based on the processing recipe and control program stored in the storage unit 342.

[0146] FIG. 14 is a diagram showing the flow of the processing fluid in the third embodiment. FIG. 14(a) shows the flow of the processing fluid in the pressure increasing step ST12, FIG. 14(b) shows the flow of the processing fluid in the circulation step ST13, and FIG. 14(c) shows the flow of the processing fluid in the pressure decreasing step ST14.

[0147] The substrate processing method according to the third embodiment includes a preparation step ST11, a pressure increasing step ST12, a circulation step ST13, and a pressure decreasing step ST14.

[0148] The preparation step ST11 is the same as the substrate processing method according to the first embodiment.

[0149] The pressure increasing step ST12 is performed after the preparation step ST11. In the pressure increasing step ST12, as shown in FIG. 14(a), the on-off valves V31, V34 are opened and the on-off valves V32, V33, V39 are closed.

[0150] In the pressure increasing step ST12, since the on-off valve V31 is in the open state, the processing fluid heated to the first temperature by the heating mechanism HE31 passes through the on-off valve V31 and is supplied into the processing container 311 at a large flow rate. In the pressure increasing step ST12, since the on-off valve V32 is in the closed state and the on-off valve V34 is in the open state, the processing fluid heated to the second temperature by the heating mechanism HE32 passes through the orifice OR34, resulting in a decrease in flow velocity and being supplied into the processing container 311 at a small flow rate. Thereby, a processing fluid having a temperature closer to the first temperature than the second temperature is supplied into the processing container 311.

[0151] In the pressure increasing step ST12, since the on-off valve V34 is in the open state, the processing fluid with a reduced flow velocity due to the orifice OR34 is supplied into the processing container 311 throughout the entire period of the pressure increasing step ST12. Thereby, backflow of the processing fluid from inside the processing container 311 toward the upstream of the second supply flow path L32 is prevented. For this reason, it is possible to suppress the retention of the IPA residue between the on-off valve V34 and the processing container 311, in other words, on the secondary side of the on-off valve V34.

[0152] In the pressure increasing step ST12, since the on-off valve V39 is in the closed state, the processing fluid does not flow out from the processing container 311. For this reason, as shown in FIG. 3, the pressure inside the processing container 311 gradually rises. In the pressure increasing step ST12, the pressure of the processing fluid supplied into the processing container 311 is lower than the critical pressure. For this reason, the processing fluid is supplied into the processing container 311 in a gaseous (gas) state. Thereafter, as the filling of the processing fluid into the processing container 311 progresses, the pressure inside the processing container 311 increases. When the pressure inside the processing container 311 exceeds the critical pressure, the processing fluid existing inside the processing container 311 becomes a supercritical state. In the pressure increasing step ST12, when the pressure inside the processing container 311 reaches a processing pressure higher than the critical pressure, the pressure increasing step ST12 ends and the process proceeds to the flow-through step ST13.

[0153] The flow-through step ST13 is performed after the pressure increasing step ST12. In the flow-through step ST13, as shown in FIG. 14(b), the on-off valves V32, V33, and V39 are set to the open state, and the on-off valves V31 and V34 are set to the closed state.

[0154] In the flow process ST13, since the on-off valve V32 is in the open state, the processing fluid heated to the second temperature by the heating mechanism HE32 passes through the on-off valve V32 and is supplied into the processing vessel 311 at a large flow rate. In the flow process ST13, since the on-off valve V31 is in the closed state and the on-off valve V33 is in the open state, the processing fluid heated to the first temperature by the heating mechanism HE31 passes through the orifice OR33, whereby the flow velocity decreases and it is supplied into the processing vessel 311 at a small flow rate. Thereby, a processing fluid having a temperature closer to the second temperature than the first temperature is supplied into the processing vessel 311.

[0155] In the flow process ST13, since the on-off valve V33 is in the open state, the processing fluid whose flow velocity has decreased due to the orifice OR33 is supplied into the processing vessel 311 over the entire period of the flow process ST13. Thereby, backflow of the processing fluid from inside the processing vessel 311 toward the upstream of the first supply flow path L31 is prevented. For this reason, it is possible to suppress the retention of the residue of IPA between the on-off valve V33 and the processing vessel 311, in other words, on the secondary side of the on-off valve V33.

[0156] In the flow process ST13, since the on-off valve V39 is in the open state, the processing fluid supplied into the processing vessel 311 is discharged from inside the processing vessel 311 via the discharge flow path L39. In the flow process ST13, the supply of the processing fluid into the processing vessel 311 and the discharge of the processing fluid from inside the processing vessel 311 are performed simultaneously. For this reason, as shown in FIG. 3, the pressure inside the processing vessel 311 is maintained substantially constant. By performing the flow process ST13, replacement from IPA to the processing fluid is promoted in the concave portions of the pattern of the substrate W. When the replacement from IPA to the processing fluid is completed in the concave portions of the pattern, the flow process ST13 is terminated and the process proceeds to the depressurization process ST14.

[0157] The depressurization process ST14 is performed after the flow process ST13. In the depressurization process ST14, as shown in FIG. 14(c), the on-off valve V39 is set to the open state and the on-off valves V31, V32, V33, and V34 are set to the closed state. The depressurization process ST14 is the same as the substrate processing method according to the first embodiment.

[0158] As described above, according to the third embodiment, throughout the entire period of the boosting step ST12, a large flow rate of the processing fluid is supplied from the first supply channel L31 into the processing container 311, and a small flow rate of the processing fluid is supplied from the second supply channel L32 into the processing container 311. In this case, in the boosting step ST12, backflow of the processing fluid from inside the processing container 311 toward the upstream of the second supply channel L32 is prevented.

[0159] According to the third embodiment, throughout the entire period of the circulation step ST13, a large flow rate of the processing fluid is supplied from the second supply channel L32 into the processing container 311, and a small flow rate of the processing fluid is supplied from the first supply channel L31 into the processing container 311. In this case, in the circulation step ST13, backflow of the processing fluid from inside the processing container 311 toward the upstream of the first supply channel L31 is prevented.

[0160] (First Modification Example) Referring to FIG. 15, a substrate processing apparatus 30A according to a first modification example of the third embodiment will be described. FIG. 15 is a diagram showing the substrate processing apparatus 30A according to the first modification example of the third embodiment.

[0161] The substrate processing apparatus 30A is different from the substrate processing apparatus 30 in that the first supply channel L31 and the second supply channel L32 merge before being connected to the processing container 311 and supply the processing fluid to the same position inside the processing container 311. Other configurations are the same as those of the substrate processing apparatus 30. Hereinafter, the description will focus on the configurations different from those of the substrate processing apparatus 30.

[0162] The first supply channel L31 and the second supply channel L32 are provided in parallel. The second supply channel L32 branches from the first supply channel L31 upstream of the heating mechanism HE31 and merges with the first supply channel L31 downstream of the on-off valve V31. The first supply channel L31 and the second supply channel L32 merge immediately before being connected to the processing container 311 and supply the processing fluid to the same position inside the processing container 311.

[0163] The substrate processing method executed using the substrate processing apparatus 30A may be the same as the substrate processing method executed using the substrate processing apparatus 30.

[0164] According to the first modification of the third embodiment, throughout the entire period of the pressure increasing step ST12, a large flow rate of the processing fluid is supplied from the first supply flow path L31 into the processing container 311, and a small flow rate of the processing fluid is supplied from the second supply flow path L32 into the processing container 311. In this case, in the pressure increasing step ST12, the backflow of the processing fluid from the confluence of the first supply flow path L31 and the second supply flow path L32 toward the upstream of the second supply flow path L32 is prevented.

[0165] According to the first modification of the third embodiment, throughout the entire period of the circulation step ST13, a large flow rate of the processing fluid is supplied from the second supply flow path L32 into the processing container 311, and a small flow rate of the processing fluid is supplied from the first supply flow path L31 into the processing container 311. In this case, in the circulation step ST13, the backflow of the processing fluid from the confluence of the first supply flow path L31 and the second supply flow path L32 toward the upstream of the first supply flow path L31 is prevented.

[0166] (Second Modification) Referring to FIG. 16, the substrate processing apparatus 30B according to the second modification of the third embodiment will be described. FIG. 6 is a diagram showing the substrate processing apparatus 30B according to the second modification of the third embodiment.

[0167] The substrate processing apparatus 30B is different from the substrate processing apparatus 30 in that the first connection flow path L33, the on-off valve V33, and the orifice OR33 are not provided. For other configurations, they are the same as those of the substrate processing apparatus 30.

[0168] Referring to FIG. 17, the substrate processing method executed using the substrate processing apparatus 30B will be described. The substrate processing method shown below is automatically executed under the control of the control unit 34 based on the processing recipe and the control program stored in the storage unit 342. FIG. 17 is a diagram showing the flow of the processing fluid in the second modification of the third embodiment. FIG. 17(a) shows the flow of the processing fluid in the pressure increasing step ST12, FIG. 17(b) shows the flow of the processing fluid in the circulation step ST13, and FIG. 17(c) shows the flow of the processing fluid in the pressure reducing step ST14.

[0169] The substrate processing method according to the second modification of the third embodiment includes a preparation step ST11, a pressure increasing step ST12, a circulation step ST13, and a pressure reducing step ST14.

[0170] The preparation step ST11 is the same as the substrate processing method according to the first embodiment.

[0171] The pressure increasing step ST12 is performed after the preparation step ST11. In the pressure increasing step ST12, as shown in Fig. 17(a), the on-off valves V31 and V34 are opened, and the on-off valves V32 and V39 are closed.

[0172] In the pressure increasing step ST12, since the on-off valve V31 is open, the processing fluid heated to the first temperature by the heating mechanism HE31 passes through the on-off valve V31 and is supplied into the processing container 311 at a large flow rate. In the pressure increasing step ST12, since the on-off valve V32 is closed and the on-off valve V34 is open, the processing fluid heated to the second temperature by the heating mechanism HE32 passes through the orifice OR34, the flow rate decreases, and it is supplied into the processing container 311 at a small flow rate. As a result, the processing fluid having a temperature closer to the first temperature than the second temperature is supplied into the processing container 311.

[0173] In the pressure increasing step ST12, since the on-off valve V34 is open, the processing fluid whose flow rate has decreased due to the orifice OR34 is supplied into the processing container 311 throughout the entire period of the pressure increasing step ST12. As a result, the backflow of the processing fluid from the inside of the processing container 311 toward the upstream of the second supply channel L32 is prevented. Therefore, it is possible to suppress the retention of the IPA residue between the on-off valve V34 and the processing container 311, in other words, on the secondary side of the on-off valve V34.

[0174] In the pressure increasing step ST12, since the on-off valve V39 is in the closed state, the processing fluid does not flow out from the processing container 311. Therefore, as shown in FIG. 3, the pressure in the processing container 311 gradually increases. In the pressure increasing step ST12, the pressure of the processing fluid supplied into the processing container 311 is lower than the critical pressure. Therefore, the processing fluid is supplied into the processing container 311 in the state of gas. Then, as the filling of the processing fluid into the processing container 311 progresses, the pressure in the processing container 311 increases. When the pressure in the processing container 311 exceeds the critical pressure, the processing fluid existing in the processing container 311 becomes a supercritical state. In the pressure increasing step ST12, when the pressure in the processing container 311 reaches the processing pressure higher than the critical pressure, the pressure increasing step ST12 is terminated and the flow-through step ST13 is entered.

[0175] The flow-through step ST13 is performed after the pressure increasing step ST12. In the flow-through step ST13, as shown in FIG. 17(b), the on-off valves V32 and V39 are opened and the on-off valves V31 and V34 are closed.

[0176] In the flow-through step ST13, since the on-off valve V32 is open, the processing fluid heated to the second temperature by the heating mechanism HE32 is supplied into the processing container 311 through the on-off valve V32 in a large flow rate. In the flow-through step ST13, since the on-off valve V31 is closed, the processing fluid heated to the first temperature by the heating mechanism HE31 is not supplied into the processing container 311. Thereby, the processing fluid at the second temperature is supplied into the processing container 311.

[0177] In the flow-through step ST13, since the on-off valve V39 is open, the processing fluid supplied into the processing container 311 is discharged from the processing container 311 via the discharge flow path L39. In the flow-through step ST13, the supply of the processing fluid into the processing container 311 and the discharge of the processing fluid from the processing container 311 are performed simultaneously. Therefore, as shown in FIG. 3, the pressure in the processing container 311 is maintained substantially constant. By performing the flow-through step ST13, the replacement from IPA to the processing fluid in the concave portion of the pattern of the substrate W is promoted. When the replacement from IPA to the processing fluid in the concave portion of the pattern is completed, the flow-through step ST13 is terminated and the pressure reducing step ST14 is entered.

[0178] The depressurization step ST14 is performed after the flow process ST13. In the depressurization step ST14, as shown in FIG. 17(c), the on-off valve V39 is opened and the on-off valves V31, V32, and V34 are closed. The depressurization step ST14 is the same as the substrate processing method according to the first embodiment.

[0179] As described above, according to the second modification of the third embodiment, during the entire period of the pressure increase step ST12, a large flow rate of the processing fluid is supplied from the first supply flow path L31 into the processing container 311, and a small flow rate of the processing fluid is supplied from the second supply flow path L32 into the processing container 311. In this case, in the pressure increase step ST12, the backflow of the processing fluid from the inside of the processing container 311 toward the upstream of the second supply flow path L32 is prevented.

[0180] In the second modification of the third embodiment, the case where the first supply flow path L31 and the second supply flow path L32 are configured to supply the processing fluid to different positions in the processing container 311 without merging on the way has been described, but it is not limited thereto. For example, similar to the substrate processing apparatus 30A according to the first modification of the third embodiment, the first supply flow path L31 and the second supply flow path L32 may merge before being connected to the processing container 311 and be configured to supply the processing fluid to the same position in the processing container 311.

[0181] (Third modification) Referring to FIG. 18, the substrate processing apparatus 30C according to the third modification of the third embodiment will be described. FIG. 18 is a diagram showing the substrate processing apparatus 30C according to the third modification of the third embodiment.

[0182] The substrate processing apparatus 30C is different from the substrate processing apparatus 30 in that the second connection flow path L34, the on-off valve V34, and the orifice OR34 are not provided. For other configurations, they are the same as those of the substrate processing apparatus 30.

[0183] Referring to FIG. 19, a substrate processing method executed using the substrate processing apparatus 30C will be described. The substrate processing method shown below is automatically executed under the control of the control unit 34 based on the processing recipe and control program stored in the storage unit 342. FIG. 19 is a diagram showing the flow of the processing fluid in the third modification of the third embodiment. FIG. 19(a) shows the flow of the processing fluid in the pressure increasing step ST12, FIG. 19(b) shows the flow of the processing fluid in the circulation step ST13, and FIG. 19(c) shows the flow of the processing fluid in the pressure decreasing step ST14.

[0184] The substrate processing method according to the third modification of the third embodiment includes a preparation step ST11, a pressure increasing step ST12, a circulation step ST13, and a pressure decreasing step ST14.

[0185] The preparation step ST11 is the same as the substrate processing method according to the first embodiment.

[0186] The pressure increasing step ST12 is performed after the preparation step ST11. In the pressure increasing step ST12, as shown in FIG. 19(a), the on-off valve V31 is opened, and the on-off valves V32, V33, and V39 are closed.

[0187] In the pressure increasing step ST12, since the on-off valve V31 is open, the processing fluid heated to the first temperature by the heating mechanism HE31 passes through the on-off valve V31 and is supplied into the processing container 311 at a large flow rate. In the pressure increasing step ST12, since the on-off valve V32 is closed, the processing fluid heated to the second temperature by the heating mechanism HE32 is not supplied into the processing container 311. As a result, the processing fluid at the first temperature is supplied into the processing container 311.

[0188] In the pressure increasing step ST12, since the on-off valve V39 is in the closed state, the processing fluid does not flow out from the processing container 311. Therefore, as shown in FIG. 3, the pressure in the processing container 311 gradually increases. In the pressure increasing step ST12, the pressure of the processing fluid supplied into the processing container 311 is lower than the critical pressure. Therefore, the processing fluid is supplied into the processing container 311 in a gaseous (gas) state. Then, as the filling of the processing fluid into the processing container 311 progresses, the pressure in the processing container 311 increases. When the pressure in the processing container 311 exceeds the critical pressure, the processing fluid existing in the processing container 311 becomes a supercritical state. In the pressure increasing step ST12, when the pressure in the processing container 311 reaches a processing pressure higher than the critical pressure, the pressure increasing step ST12 ends and the flow-through step ST13 is entered.

[0189] The flow-through step ST13 is performed after the pressure increasing step ST12. In the flow-through step ST13, as shown in FIG. 19(b), the on-off valves V32, V33, and V39 are in the open state, and the on-off valve V31 is in the closed state.

[0190] In the flow-through step ST13, since the on-off valve V32 is in the open state, the processing fluid heated to the second temperature by the heating mechanism HE32 passes through the on-off valve V32 and is supplied into the processing container 311 in a large flow rate. In the flow-through step ST13, since the on-off valve V31 is in the closed state and the on-off valve V33 is in the open state, the processing fluid heated to the first temperature by the heating mechanism HE31 passes through the orifice OR33, the flow rate decreases, and it is supplied into the processing container 311 in a small flow rate. Thereby, the processing fluid having a temperature closer to the second temperature than the first temperature is supplied into the processing container 311.

[0191] In the flow-through step ST13, since the on-off valve V33 is in the open state, the processing fluid whose flow rate has decreased due to the orifice OR33 is supplied into the processing container 311 over the entire period of the flow-through step ST13. Thereby, the backflow of the processing fluid from the processing container 311 toward the upstream of the first supply flow path L31 is prevented. Therefore, the retention of the IPA residue between the on-off valve V33 and the processing container 311, in other words, on the secondary side of the on-off valve V33 can be suppressed.

[0192] In the circulation step ST13, since the on-off valve V39 is in the open state, the processing fluid supplied into the processing vessel 311 is discharged from the inside of the processing vessel 311 via the discharge flow path L39. In the circulation step ST13, the supply of the processing fluid into the processing vessel 311 and the discharge of the processing fluid from the inside of the processing vessel 311 are performed simultaneously. For this reason, as shown in FIG. 3, the pressure inside the processing vessel 311 is maintained substantially constant. By performing the circulation step ST13, the replacement of IPA with the processing fluid is promoted in the concave portions of the pattern of the substrate W. When the replacement of IPA with the processing fluid in the concave portions of the pattern is completed, the circulation step ST13 is terminated and the process proceeds to the depressurization step ST14.

[0193] The depressurization step ST14 is performed after the circulation step ST13. In the depressurization step ST14, as shown in FIG. 19(c), the on-off valve V39 is opened and the on-off valves V31, V32, and V33 are closed. The depressurization step ST14 is the same as the substrate processing method according to the first embodiment.

[0194] As described above, according to the third modification of the third embodiment, throughout the entire period of the circulation step ST13, a large flow rate of the processing fluid is supplied from the second supply flow path L32 into the processing vessel 311, and a small flow rate of the processing fluid is supplied from the first supply flow path L31 into the processing vessel 311. In this case, in the circulation step ST13, the backflow of the processing fluid from inside the processing vessel 311 toward the upstream of the first supply flow path L31 is prevented.

[0195] In the circulation step ST13, since the pressure inside the processing vessel 311 has risen and the processing fluid is in a supercritical state, the processing fluid is more likely to diffuse and the backflow of the processing fluid is more likely to occur than in the pressurization step ST12. For this reason, throughout the entire period of the circulation step ST13, supplying a large flow rate of the processing fluid from the second supply flow path L32 into the processing vessel 311 and supplying a small flow rate of the processing fluid from the first supply flow path L31 into the processing vessel 311 is particularly effective from the viewpoint of preventing the backflow of the processing fluid.

[0196] In the third modification of the third embodiment, the case where the first supply channel L31 and the second supply channel L32 supply the processing fluid to different positions in the processing container 311 without merging midway was described, but the present invention is not limited to this. For example, similar to the substrate processing apparatus 30A according to the first modification of the third embodiment, the first supply channel L31 and the second supply channel L32 may merge before being connected to the processing container 311 and supply the processing fluid to the same position in the processing container 311.

[0197] The embodiments disclosed this time should be considered as illustrative in all respects and not restrictive. The above embodiments may be omitted, replaced, or changed in various forms without departing from the scope and spirit of the appended claims.

Explanation of Reference Numerals

[0198] 12, 22, 32 Fluid supply unit 14, 24, 34 Control unit 111, 211, 311 Processing container L11, L21, L31 First supply channel L12, L22, L32 Second supply channel L13 First bypass channel L14 Second bypass channel L23, L33 First connection channel L24, L34 Second connection channel OR13, OR14, OR23, OR24, OR33, OR34 Orifice HE11, HE21, HE31 Heating mechanism HE12, HE22, HE32 Heating mechanism

Claims

1. A fluid supply system for supplying fluid into a processing container where a substrate is processed inside, comprising: a fluid supply unit for supplying a processing fluid; a control unit for controlling the fluid supply unit; The fluid supply unit includes: a first supply channel for supplying the processing fluid into the processing container; a second supply channel for supplying the processing fluid into the processing container; a first heating mechanism provided in the first supply channel for heating the processing fluid to a first temperature; a second heating mechanism provided in the second supply channel for heating the processing fluid to a second temperature; a flow rate adjustment mechanism provided downstream of at least one of the first heating mechanism in the first supply channel and the second heating mechanism in the second supply channel for adjusting the flow rate of the processing fluid; The control unit controls the fluid supply unit to supply the processing fluid into the processing container from at least one of the first supply channel and the second supply channel having the flow rate adjustment mechanism during the entire period of supplying the processing fluid into the processing container to process the substrate. Fluid supply system.

2. The fluid supply unit further includes: a first on-off valve provided in the first supply channel; a second on-off valve provided in the second supply channel; The fluid supply system according to claim 1.

3. The flow rate adjustment mechanism includes: a first bypass channel connecting and bypassing the upstream side and the downstream side of the first on-off valve in the first supply channel; a first throttle provided in the first bypass channel; The fluid supply system according to claim 2.

4. The flow rate adjustment mechanism includes: a second bypass channel connecting and bypassing the upstream side and the downstream side of the second on-off valve in the second supply channel; a second throttle provided in the second bypass channel; The fluid supply system according to claim 3.

5. The flow rate adjustment mechanism includes: a first connection channel connecting the upstream side of the first on-off valve in the first supply channel and the downstream side of the second on-off valve in the second supply channel; a third throttle provided in the first connection channel; The fluid supply system according to claim 2.

6. The flow rate adjustment mechanism includes: a second connection channel connecting the upstream side of the second on-off valve in the second supply channel and the downstream side of the first on-off valve in the first supply channel; a fourth throttle provided in the second connection channel; The fluid supply system according to claim 5.

7. ​ ​ ​ ​ ​ ​ ​ The second connection flow path merges with the first connection flow path on the way and then branches again. The fluid supply system according to claim 6.

8. The second connection flow path does not merge with the first connection flow path. The fluid supply system according to claim 6.

9. The flow rate adjustment mechanism is provided in the second supply flow path. The control unit divides the period of supplying the processing fluid into the processing container to process the substrate into a first period and a second period. In the first period, the processing fluid is supplied into the processing container from the first supply flow path and the second supply flow path. In the second period, the fluid supply unit is controlled so that the processing fluid is supplied into the processing container only from the second supply flow path. The fluid supply system according to any one of claims 1 to 8.

10. The flow rate adjustment mechanism is provided in the first supply flow path. The control unit divides the period of supplying the processing fluid into the processing container to process the substrate into a first period and a second period. In the first period, the processing fluid is supplied into the processing container only from the first supply flow path. In the second period, the fluid supply unit is controlled so that the processing fluid is supplied into the processing container from the first supply flow path and the second supply flow path. The fluid supply system according to any one of claims 1 to 8.

11. The second temperature is higher than the first temperature. The fluid supply system according to any one of claims 1 to 8.

12. The first supply flow path and the second supply flow path supply the processing fluid to different positions in the processing container. The fluid supply system according to any one of claims 1 to 8.

13. The first supply flow path and the second supply flow path merge before being connected to the processing container and supply the processing fluid to the same position in the processing container. The fluid supply system according to any one of claims 1 to 8.

14. A substrate processing method using a fluid supply system for supplying fluid into a processing container in which a substrate is processed inside, The fluid supply system is A fluid supply unit for supplying a processing fluid, Comprising The fluid supply unit is A first supply flow path for supplying the processing fluid into the processing container, A second supply flow path for supplying the processing fluid into the processing container, A first heating mechanism provided in the first supply flow path for heating the processing fluid to a first temperature, A second heating mechanism provided in the second supply flow path for heating the processing fluid to a second temperature, A flow rate adjusting mechanism provided at least on one of the downstream side of the first heating mechanism in the first supply flow path and the downstream side of the second heating mechanism in the second supply flow path, for adjusting the flow rate of the processing fluid; having During the entire period of supplying the processing fluid into the processing vessel to process the substrate, supplying the processing fluid into the processing vessel from at least one of the first supply flow path and the second supply flow path having the flow rate adjusting mechanism; Substrate processing method.

15. A computer-readable recording medium having recorded thereon a program for causing a computer to execute the substrate processing method according to claim 14.

Images