Method of manufacturing substrate and light-emitting device, substrate and light-emitting device

Abstract

To provide a method of manufacturing a substrate and a light-emitting device that can effectively reduce burrs, and also to provide a substrate having burrs reduced and a light-emitting device while attaining high heat dissipation.SOLUTION: There is provided a method of manufacturing a substrate that includes: preparing a metallic plate which has a first surface with a first recessed part and a second surface on the opposite side from the first surface; arranging first metallic paste in the first recessed part; sintering the arranged first metallic paste to form a first metallic member; and cutting the metallic plate so as to cut the first metallic member arranged in the first recessed part from the second surface side to the first surface side of the metallic plate.SELECTED DRAWING: Figure 2E

Description

Technical Field

[0001] The present disclosure relates to a method for manufacturing a substrate and a light-emitting device, a substrate, and a light-emitting device.

Background Art

[0002] Conventionally, as a substrate for mounting a semiconductor light-emitting element, a substrate structure has been proposed in which a plurality of metal plates are connected by ceramics and has high mechanical strength and high heat dissipation (for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, when a substrate using a metal plate is cut with a dicing saw, burrs may occur at the cutting location. Therefore, an embodiment according to the present disclosure aims to provide a method for manufacturing a substrate and a light-emitting device that can effectively reduce the generation of burrs. Further, an embodiment according to the present disclosure aims to provide a substrate and a light-emitting device with reduced burrs while realizing high heat dissipation.

Means for Solving the Problems

[0005] The method for manufacturing a substrate disclosed in the embodiment includes preparing a metal plate having a first surface with a first recess and a second surface opposite to the first surface, disposing a first metal paste in the first recess, sintering the disposed first metal paste to form a first metal member, and cutting the metal plate so as to cut the first metal member disposed in the first recess from the second surface side to the first surface side of the metal plate. Further, a method for manufacturing a light-emitting device disclosed in an embodiment includes preparing a metal plate having a first surface with a first recess and a second surface opposite to the first surface, disposing a first metal paste in the first recess, sintering the disposed first metal paste to form a first metal member, forming a third recess on the first surface of the metal plate between two of the first recesses in one direction, disposing an inorganic member in the third recess, polishing or grinding the second surface to expose the inorganic member from the metal plate to prepare a substrate, disposing a light-emitting element on the first electrode and the second electrode each formed of the metal plate on both sides of the inorganic member across the inorganic member on the second surface side of the metal plate in the substrate, and cutting the substrate so as to cut the metal plate and the first metal member from the second surface side toward the first surface side. Furthermore, a substrate disclosed in an embodiment is a substrate including a first electrode and a second electrode made of metal and an insulating member disposed between the first electrode and the second electrode. The first electrode and the second electrode each have a first surface and a second surface opposite to the first surface, and a side surface connecting the first surface and the second surface and constituting a part of the outer periphery of the substrate. The first electrode and the second electrode have a first recess recessed from the side surface side and the first surface side, and a first metal member including a ceramic filler and metal is disposed in the first recess. In addition, a light-emitting device disclosed in an embodiment includes the above-described substrate, a light-emitting element disposed on the second surface side of each of the first electrode and the second electrode across the insulating member, and a covering member disposed on or above the second surface and on or beside the side surface of the light-emitting element.

Advantages of the Invention

[0006] According to an embodiment of the present disclosure, it is possible to provide a method for manufacturing a substrate and a light-emitting device that can effectively reduce the generation of burrs. Further, according to an embodiment of the present disclosure, it is possible to provide a substrate and a light-emitting device with reduced burrs while achieving high heat dissipation.

Brief Description of the Drawings

[0007]

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Embodiments for Carrying Out the Invention

[0008] Hereinafter, embodiments according to the present disclosure will be described with reference to the drawings. However, the embodiments described below are for embodying the technical idea according to the present disclosure, and the invention is not limited to the following unless there are specific descriptions. The content described in one embodiment is also applicable to other embodiments and modifications. The drawings schematically show the embodiments, and for clarity of explanation, the scale, interval, positional relationship, etc. of each member may be exaggerated, or a part of the member may be omitted. The directions shown in each figure indicate the relative positions between the components and are not intended to indicate absolute positions. For convenience of explanation, even when referred to as an end face, it may be a cross section, and vice versa. In principle, the same name and reference numeral indicate the same or homogeneous members, and detailed descriptions will be omitted as appropriate. In the embodiments, "cover" and "arrange" include not only the case of direct contact but also the case of indirectly covering or arranging, for example, via other members. In the present disclosure, a plan view seen from the first surface of the metal plate and the surface side corresponding thereto is referred to as a bottom view, and a plan view seen from the second surface of the metal plate and the surface side corresponding thereto is referred to as a top view.

[0009] 〔Embodiment 1: Manufacturing Method of Substrate〕 As shown in FIG. 1, the method for manufacturing a substrate according to the embodiment includes preparing a metal plate having a first surface and a second surface opposite to the first surface and having a first recess on the first surface (S11), disposing a first metal paste in the first recess (S12), sintering the first metal paste (S13) to form a first metal member, and cutting the metal plate so as to cut the first metal member from the second surface side (S14). By performing such steps, even when the metal plate is cut, burrs do not occur at the cutting location, and during soldering or the like, the solder thickness can be kept constant and the mounting accuracy can be improved. In particular, when a highly heat-dissipative metal plate mainly made of a metal such as copper is used as the metal plate, a substrate having high heat dissipation can be obtained. Therefore, it becomes possible to efficiently manufacture a substrate with burrs suppressed, and high heat dissipation can also be realized.

[0010] S11: Preparation of Metal Plate As shown in FIGS. 2A and 2B, a metal plate 1 is prepared. Examples of the metal plate 1 include those made of at least one metal selected from the group consisting of copper, iron, aluminum, and alloys thereof. Among them, a plate made of copper or mainly composed of copper is preferable. In other words, it is preferable that the metal plate 1 contains 50% or more of copper based on the total weight of the metal constituting the metal plate 1. The metal plate 1 is preferably a flat plate. The planar shape can be appropriately set according to the intended light-emitting device. For example, in a plan view, a rectangular one can be mentioned. The metal plate 1 has a first surface 1A and a second surface 1B on the opposite side thereof. The metal plate 1 has a first recess 1C on the first surface 1A. The first recess 1C may have any shape in a plan view as viewed from the first surface 1A side. For example, various shapes can be mentioned, such as a shape including a straight line and / or a curve, a circular shape, an elliptical shape, a polygon such as a triangle and a quadrangle, and a shape combining these. Also, the end face shape of the first recess 1C may be any shape. For example, in an end face view, it may have the same width from the first surface 1A side toward the second surface 1B, or may be a shape that gradually becomes narrower or wider, or a shape that becomes narrower or wider due to one or more steps. Specifically, various shapes can be mentioned, such as a shape that is wider on the first surface 1A side, a shape that is wider on the second surface 1B side, and a shape that is wider on both the first surface 1A and second surface 1B sides. In FIG. 2B, the first recess 1C has the same width in the end face shape. The width, size, and depth of the first recess 1C can be appropriately set according to the intended form of the light-emitting device. For example, the width (W1 in FIG. 2B) of the first recess 1C may be 0.1 mm or more and 1 mm or less. The depth (d1 in FIG. 2B) of the first recess 1C may be 5% or more and 20% or less of the thickness of the metal plate. Specifically, it may be 0.02 mm or more and 0.2 mm or less. The first recess 1C is preferably, for example, a rectangular groove shape that extends from one end to the other end or from the vicinity of one end to the vicinity of the other end of the metal plate 1 in a first direction (arrow Y direction in FIG. 2A) in a plan view as shown in FIG. 2A. The first recess 1C may vary in width from wide to narrow in the first direction, but preferably has a constant width. Also, the first recess 1C may be arranged to extend from one end to the other end or from the vicinity of one end to the vicinity of the other end of the metal plate 1 in a second direction (arrow X direction in FIG. 2A) orthogonal to the first direction in a plan view. Note that only two first recesses 1C may be provided in the metal plate 1, but preferably two or more are formed. The first recess 1C can be formed by a method known in the art. For example, the first recess 1C can be formed by press working, dry or wet etching, blasting, laser processing in which laser light is irradiated from the first surface 1A side of the metal plate 1, or the like. The metal plate 1 can be prepared by appropriately setting the thickness, the plane for arranging one or more light-emitting elements, the number, width, depth, etc. of the first recess 1C. For example, the thickness of the metal plate 1 may be 100 μm or more and 1500 μm or less. The width of the first recess 1C may be 80 μm or more and 800 μm or less. The depth of the first recess 1C may be 10 μm or more and 200 μm or less. When the first recess 1C extends in the first direction and is formed, the interval between adjacent first recesses 1C can be appropriately set according to the number, size, etc. of the light-emitting elements to be placed. For example, it may be 0.4 mm or more and 3 mm or less, and preferably 1 mm or more and 1.5 mm or less. The same interval may be mentioned when the first recess 1C extends in the second direction.

[0011] S12: Arrangement of the first metal paste in the first recess As shown in FIG. 2C, the first metal paste 11a is arranged in the first recess 1C of the metal plate 1. The first metal paste 11a includes, for example, those containing a first metal powder, an active metal powder, an organic solvent, a ceramic filler, etc. By using the first metal paste 11a containing such components, conductivity can be imparted to the first metal paste 11a. In addition, appropriate fluidity can be given, and it can be freely filled in the first recess 1C of any shape, and can be applied and arranged in any shape and thickness. Furthermore, the adhesion between the first metal member 11 and the metal plate 1 can be improved. Examples of the first metal powder include one or more of Ag, Al, Zn, Sn, Cu, and Ag-Cu alloy / eutectic powder. In addition to this, one or more of Cu, Cr, and Ni may be included. When the first metal paste contains a metal powder, the content may be 1 part by weight or more and 20 parts by weight or less with respect to 100 parts by weight of the first metal paste. Examples of the active metal powder include one or more of TiH2, CeH2, ZrH2, and MgH2. The content of the active metal powder contained in the first metal paste is 1 part by weight or more and 20 parts by weight or less, preferably 1 part by weight or more and 5 parts by weight or less, based on 100 parts by weight of the first metal paste. By containing the active metal powder within such a range, it is possible to minimize reactants such as the above-described nitrides, oxides, or carbides after sintering in a subsequent process and to reduce the generation of hydrogen. Examples of the organic solvent include terpineol and butyl carbitol. When the first metal paste contains an organic solvent, the content thereof is 5% by mass or more and 15% by mass or less based on 100 parts by weight of the first metal paste. The ceramic filler can be dispersed in the metal paste to reduce the generation of cracks and suppress volume fluctuations due to sintering. The ceramic filler before sintering is, for example, a plurality of granular members, and examples include crystalline or non-crystalline ones. Examples of the ceramic filler include nitride ceramic fillers such as aluminum nitride and silicon nitride, oxide ceramic fillers such as aluminum oxide, silicon oxide, zirconium oxide, and yttrium oxide, and carbide ceramic fillers such as silicon carbide. Among them, nitride ceramic fillers are preferred. When the first metal paste contains an inorganic filler, the content thereof is 1 part by weight or more and 20 parts by weight or less based on 100 parts by weight of the first metal paste. By containing a ceramic filler, particularly a nitride ceramic filler, in the first metal paste, it is possible to suppress volume shrinkage of the first metal paste inside the first recess 1C. As will be described later, the first metal paste becomes the first metal member 11 after sintering. However, after sintering under the sintering conditions described later, it is preferable to configure the first metal member 11 to have a smaller ductility than the metal plate 1, for example, at room temperature (20°C to 25°C). Therefore, specifically, when Cu is used as the metal plate, it is preferable to contain an AlN filler in the first metal paste in a content of 10 wt% or more and 30 wt% or less.

[0012] The placement of the first metal paste 11a into the first recess 1C can utilize methods known in the art, such as screen printing, inkjet printing, injection with a nozzle, filling with a squeegee, etc. At this time, the first metal paste 11a may be arranged not only within the first recess 1C but also so as to cover the upper part of the first recess 1C. For example, after masking the first surface 1A of the metal plate 1 with an opening excluding the first recess 1C, the first metal paste 11a may be arranged in the opening of the mask so as to protrude from the first surface 1A as well as inside the first recess 1C. The first metal paste 11a can be arranged at least within the first recess 1C by applying it from the first surface 1A side, for example, by screen printing. Further, by applying the first metal paste 11a one or more times, it can be arranged so as to cover the upper part of the first recess 1C. By such an arrangement of the first metal paste 11a, even when the volume of the first metal paste 11a shrinks after drying and / or sintering, it is possible to prevent a depression into the first recess 1C.

[0013] S13: Drying and sintering of the first metal paste The first metal paste 11a arranged within the first recess 1C is dried. The drying of the first metal paste 11a may be any of known methods, such as natural drying, drying using a drying furnace, etc., or drying using the sintering furnace used in the next process. The drying temperature can be set, for example, at about 20°C or more and 200°C or less, and the drying time can be set from several minutes to several hours. The drying may be performed either under reduced pressure or at normal pressure. Due to the drying of the first metal paste 11a, the volume may shrink due to volatile components contained in the first metal paste 11a, such as organic solvents, etc. However, as described above, when the first metal paste 11a is arranged so as to cover the upper part of the first recess 1C, the shrinkage during drying can be alleviated. After drying the first metal paste 11a, the first metal paste 11a is sintered. The sintering of the first metal paste 11a can be performed using a sintering furnace such as an electric furnace together with the metal plate 1. The sintering temperature at this time may be 700°C or higher and 1100°C or lower. The sintering temperature is preferably 750°C or higher and 900°C or lower, and more preferably 780°C or higher and 850°C or lower. Also, the sintering atmosphere in the sintering furnace is preferably a vacuum atmosphere of 10 -5 Pa or less or an Ar atmosphere of 99.9% or more. The sintering time may be, for example, 15 minutes or more and 60 minutes or less. By such sintering, as shown in FIG. 2D, the first metal paste 11a disposed in the first recess 1C of the metal plate 1 can be made into the first metal member 11. The first metal member 11 obtained by sintering is preferably less ductile than the metal plate at, for example, normal temperature (20°C to 25°C). Thereby, the rigidity of the metal plate itself can be strengthened, and the generation of burrs can be effectively suppressed during cutting described later. Note that, due to such sintering, a depression may occur above the first recess 1C. In order to remove the depression, optionally, after drying, after sintering, or both after drying and after sintering, at least a part of the surface of the first metal paste 11a including the depression or the first metal member 11 including the depression may be removed. The removal of a part of the first metal paste 11a or the first metal member 11 here means, for example, removing the surface in the first recess 1C of the dried or sintered first metal paste 11a or the first metal member 11 so as to be substantially flush with the first surface 1A. The removal of the first metal paste 11a or the first metal member 11 may be performed using any method known in the art, such as polishing, grinding, etc. Also, when removing the first metal paste 11a or the first metal member 11, the first surface 1A of the metal plate 1 may also be polished, ground, etc. together with these. By such removal, it is preferable that the first metal paste 11a or the first metal member 11 and the first surface 1A of the metal plate 1 are substantially flush. Here, the substantial flush allows unevenness of 5% or less of the total thickness of the first metal paste 11a or the first metal member 11. Alternatively, finally, it is preferable that the arithmetic mean roughness Ra of the surface of the first metal member 11 that is flush with the first surface 1A of the metal plate 1 is 0.01 μm or more and 1.5 μm or less, more preferably 1.0 μm or less, further preferably 0.5 μm or less, and even more preferably 0.1 μm or less. The arithmetic mean roughness Ra here is a value measured by ISO 25178 surface texture (surface roughness measurement) shown in international standards using a stylus-type measuring instrument using a stylus or a non-contact-type measuring instrument using a laser (conforming to JIS B 0601).

[0014] S14: Cutting of the metal plate As shown in FIG. 2E, the metal plate 1 with the first metal member 11 disposed in the first recess 1C is cut from the second surface 1B side toward the first surface 1A side, that is, in the direction of arrow Z, so as to cut the first metal member 11 disposed in the first recess 1C. The cutting may be performed using any method known in the art, such as a disk-shaped rotary blade, an ultrasonic cutter, laser light irradiation, etc. Note that, as will be described later, as long as the cutting is performed after sintering the first metal member 11, it may be performed after performing other processes.

[0015] The substrate obtained by such a manufacturing method has a flat surface on which burrs do not occur on the surface of the first metal member 11 on the first surface 1A of the substrate. Therefore, when mounting such a substrate on a circuit board or the like using solder or the like, it is possible to prevent the thickening of the solder thickness due to burrs, make the solder thickness constant, and improve the mounting accuracy.

[0016] Also, in the method for manufacturing a substrate according to this embodiment, as shown in FIG. 1, after forming the first metal member by drying and sintering the first metal paste (S13) and before cutting the metal plate (S14), further, on the first surface of the metal plate, a third recess is formed between two first recesses 1C in one direction (S13-1), an inorganic member is disposed in the third recess (S13-2), and the second surface of the substrate is polished or ground to expose the inorganic member from the metal plate (S13-3) may be included. In this case, these steps (S13-1) to (S13-3) are preferably performed before the step of (S14).

[0017] S13-1: Formation of the third recess As shown in FIGS. 3A and 3B, a third recess 1E is formed on the first surface 1A of the metal plate 1 on which the first metal member 11 shown in FIG. 2D is formed. The third recess 1E is preferably formed between two first recesses 1C in one direction (arrow Y direction in FIG. 3A). The third recess 1E may have any shape in a plan view as viewed from the first surface 1A side. For example, various shapes can be mentioned, such as a straight line, a curve, a circle, an ellipse, a polygon such as a triangle and a quadrilateral, and a shape formed by combining these. Among them, the third recess 1E is preferably, for example, as shown in FIG. 3A, a groove shape of a quadrilateral extending from one end to the other end or from the vicinity of one end to the vicinity of the other end of the metal plate 1 in the first direction (for example, the Y-axis direction) in a plan view. The third recess 1E may vary in width from wide to narrow in the first direction, but preferably has a constant width. Also, the end face shape of the third recess 1E may be any shape. For example, in an end face view, it may have the same width from the first surface 1A side toward the second surface 1B, or may be a shape that gradually becomes narrower or wider, or a shape that becomes narrower or wider due to one or more steps, and various shapes can be mentioned. In FIG. 3B, the third recess 1E has the same width in the end face shape. The width, size, and depth of the third recess 1E can be appropriately set according to the intended form of the light-emitting device. For example, the width (W3 in FIG. 3B) of the third recess 1E may be 0.05 mm or more and 2 mm or less. The depth (d3 in FIG. 3B) of the third recess 1E may be deeper than the first recess 1C. The depth of the third recess 1E may be 15% or more and 90% or less of the thickness of the metal plate, and for example, may be 0.02 mm or more and 0.3 mm or less. Specifically, the width of the third recess 1E may be 80 μm or more and 800 μm or less, preferably 100 μm or more and 500 μm or less. The depth of the third recess 1E may be 10 μm or more and 200 μm or less, preferably 20 μm or more and 100 μm or less. When the third recess 1E is formed by extending in the first direction, the distance (D in FIG. 3B) from the first recess 1C can be appropriately set according to the number, size, etc. of the light-emitting elements to be mounted. For example, it may be 0.005 mm or more and 0.1 mm or less, and preferably 0.01 mm or more and 0.05 mm or less. As described above, in the metal plate 1, when three or more first recesses 1C are formed as shown in FIG. 3A, preferably two or more third recesses 1E are formed. The third recess 1E can be formed by the same method as the first recess 1C.

[0018] S13-2: Arrangement of Inorganic Member in the Third Recess As shown in FIG. 3C, an inorganic member 13 is arranged in the third recess 1E. The inorganic member 13 can be formed of ceramics having a specific shape. It is preferable to use a third inorganic paste 13a to embed and fix the inorganic member 13 in the third recess 1E without a gap. The inorganic member 13 preferably contains at least one of nitride-based ceramics such as silicon nitride, aluminum nitride, and boron nitride, oxide-based ceramics such as magnesium oxide and aluminum oxide, beryllium oxide, silicon carbide, mullite, borosilicate glass, etc. Among them, the inorganic member 13 is preferably nitride-based ceramics such as silicon nitride, aluminum nitride, and boron nitride. The inorganic member 13 preferably has a shape having through holes and / or unevenness, etc. that can fit the third recess 1E of the metal plate 1 into a flat substrate, for example. The planar shape can be appropriately set according to the intended light-emitting device. For example, in a plan view, a rectangular one can be mentioned. The surface of the inorganic member 13 facing the bottom surface of the third recess 1E may be flat, but preferably has convex portions. The size and height of the convex portions can be arbitrarily set. Thereby, the exposure of the inorganic member 13 described later can be easily performed. The third inorganic paste 13a can be appropriately selected and composed from among the components exemplified as the first metal paste. Among them, those containing silver-copper eutectic powder, TiH2, AlN, resin (such as silicone resin), and organic solvent (such as butyl carbitol) are preferable. Also, after arranging the inorganic member 13 and the third inorganic paste 13a in the third recess 1E, as shown in FIG. 3D, it is preferable to dry and sinter the third inorganic paste 13a in the same manner as the first metal paste 11a. This drying and sintering can be performed in the same manner as the first metal paste 11a. The third inorganic paste 13a becomes a third inorganic member 13b by sintering, and the inorganic member 13 can be fixed in the third recess 1E. The third inorganic member 13b preferably becomes a conductor, although it also depends on the composition constituting the above-described third inorganic paste 13a.

[0019] S13-3: Exposure of Inorganic Member As shown in FIG. 3E, the second surface 1B of the metal plate 1 to which the inorganic member 13 is fixed in the third recess 1E by sintering is polished or ground to expose the inorganic member 13 from the metal plate 1. Here, when the inorganic member 13 has a convex portion, the obtained metal plate 1 can be a substrate in which, in a top view, the surface of the convex portion is exposed from the metal plate 1 and both sides of the convex portion are sandwiched by the third inorganic member 13b. Thereafter, as shown in FIG. 3F, the metal plate 1 is cut (S14). The cutting here is performed in the same manner as above, that is, the metal plate 1 in which the first metal member 11 is disposed in the first recess 1C is cut from the second surface 1B side toward the first surface 1A side so as to cut the first metal member 11 disposed in the first recess 1C. In this cutting, by disposing the first metal member 11 on the end side of the cutting, generation of burrs during cutting can be effectively prevented by the metal and the ceramic filler contained in the first metal member 11. Further, since the inorganic member 13 can be reinforced by the third inorganic member 13b, the strength as a substrate can be improved.

[0020] 〔Embodiment 2: Manufacturing Method of Substrate〕 As shown in FIG. 4, the manufacturing method of the substrate according to this embodiment includes, when preparing (S11) a metal plate having a first recess 1C on a first surface 1A, further preparing a metal plate 1X having a second recess 1D on a second surface 1B. Also, when disposing the first metal paste 11a in the first recess 1C, the second metal paste 12a is disposed in the second recess 1D (S12a), and when sintering the first metal paste 11a, the second metal paste 12a is sintered (S13a) to form the second metal member 12. Thereafter, when cutting (S14) the metal plate 1 so as to cut the first metal member 11 from the second surface 1B side, the metal plate 1X is cut so as to cut the second metal member 12 disposed in the second recess 1D together with the first metal member 11. The manufacturing method of the substrate according to this embodiment may also include the above-described steps (S13-1) to (S13-3). By performing such a process, even when the metal plate is cut, burrs do not occur at the cutting location, and during solder mounting or the like, the solder thickness can be maintained constant, and the mounting accuracy can be improved. In particular, when a highly heat-dissipating metal plate mainly made of a metal such as copper is used as the metal plate, a substrate having high heat dissipation can be obtained. Therefore, it is possible to efficiently manufacture a substrate with burrs suppressed, and high heat dissipation can also be realized.

[0021] S11: Preparation of metal plate As shown in FIG. 5A, a metal plate 1X is prepared. This metal plate 1X has a second recess 1D on the second surface 1B in addition to the first recess 1C on the first surface 1A. The second recess 1D is preferably disposed at a position overlapping the first recess 1C in the thickness direction of the metal plate 1X. The second recess 1D may have any shape in plan view and end view as seen from the second surface 1B side, and can be selected from the shapes exemplified as the shape of the first recess 1C. In FIG. 5A, the width of the second recess 1D (W2 in FIG. 5A) may be 0.1 mm or more and 1 mm or less. Among them, the width W2 of the second recess 1D is preferably equal to the width W1 of the first recess 1C. The depth of the second recess 1D (d2 in FIG. 5A) can be equal to or deeper than that of the first recess 1C. Specifically, it may be 0.02 mm or more and 0.3 mm or less. Similar to the first recess 1C, the second recess 1D is preferably in the shape of a rectangular groove extending from one end to the other end or from the vicinity of one end to the vicinity of the other end of the metal plate 1X in plan view. Preferably, two or more second recesses 1D are formed in the metal plate 1X. The second recess 1D can be formed by the same method as the first recess 1C.

[0022] S12a: Disposal of the second metal paste in the second recess When disposing the first metal paste 11a in the first recess 1C of the metal plate 1X, as shown in FIG. 5B, the second metal paste 12a is disposed in the second recess 1D. The second metal paste 12a may be the same as that exemplified by the first metal paste 11a. The second metal paste 12a may have a composition different from that of the first metal paste 11a, but preferably has the same composition. This can simplify the manufacturing process.

[0023] S13a: Drying and sintering of the second metal paste When drying and sintering the first metal paste 11a disposed in the first recess 1C, as shown in FIG. 5C, the second metal paste 12a disposed in the second recess 1D is also dried and sintered. The drying and sintering of the second metal paste 12a can be performed under the same conditions as those described for the drying and sintering of the first metal paste 11a. The drying and sintering of the second metal paste 12a may be performed separately from the drying and sintering of the first metal paste 11a, but it is preferable to perform the drying and sintering simultaneously.

[0024] S14: Cutting of the metal plate When cutting the metal plate 1X in which the first metal member 11 is disposed in the first recess 1C, as shown in FIG. 5D, the second metal member 12 in the second recess 1D is similarly cut.

[0025] The substrate obtained by such a manufacturing method has a flat surface without burrs on its surface due to the first metal member 11 on the first surface 1A of the substrate. Therefore, when mounting such a substrate on a circuit board or the like using solder or the like, it is possible to prevent the thickening of the solder film due to burrs and make the thickness of the solder constant, thereby improving the mounting accuracy.

[0026] Further, in the method for manufacturing a substrate according to the embodiment, as shown in FIG. 4, after forming the first metal member by drying and sintering the first metal paste (S13), and before cutting the metal plate (S14), further, on the first surface of the metal plate, a third recess is formed between two first recesses in one direction (S13-1), an inorganic member is disposed in the third recess (S13-2), and the second surface of the substrate is polished or ground to expose the inorganic member from the metal plate (S13-3) may be included.

[0027] Formation of the third recess (S13-1) and arrangement of the inorganic member in the third recess (S13-2) The formation of the third recess 1E and the arrangement of the inorganic member 13 in the third recess 1E can be performed in the same manner as in FIGS. 3B to 3D, as shown in FIGS. 6A and 6B.

[0028] S13-3: Exposure of the inorganic member As shown in FIG. 6C, the second surface 1B of the metal plate 1 in which the inorganic member 13 is fixed to the third recess 1E by sintering is polished or ground to expose the inorganic member 13 from the metal plate 1X. At this time, the second metal member in the second recess on the second surface 1B side is also polished or ground at the same time. Thereby, the second surface 1B of the metal plate 1 can be made substantially flush with the inorganic member 13, the third inorganic member 13b, and the second metal member. Thereafter, as shown in FIG. 6D, the metal plate 1X is cut (S14). The cutting here is the same as above, and the metal plate 1 in which the first metal member 11 is disposed in the first recess 1C is cut from the second surface 1B side toward the first surface 1A side so as to cut the second metal member 12 in the second recess 1D and the first metal member 11 disposed in the first recess 1C. In this cutting, by disposing the first metal member 11 on the end side of the cutting, the generation of burrs during cutting can be effectively prevented by the metal and the ceramic filler contained in the first metal member 11. Further, since the inorganic member 13 can be reinforced by the third inorganic member 13b, the strength as a substrate can be improved.

[0029] 〔Embodiment 3: Substrate〕 As shown in FIGS. 7A and 7B, the substrate 10 of this embodiment includes a first electrode 111 and a second electrode 112 made of metal, and an insulating member 113 disposed between the first electrode 111 and the second electrode 112. The first electrode 111 and the second electrode 112 each have a first surface 10A and a second surface 10B opposite to the first surface 10A, and a side surface 10G that connects the first surface 10A and the second surface 10B and constitutes a part of the outer periphery of the substrate 10. Further, the first electrode 111 and the second electrode 112 have a first recess 1C that is recessed from the side surface 10G side and the first surface 10A side, and a first metal member 11 containing a ceramic filler and a metal is disposed in the first recess 1C. The shape of the substrate 10 may be any shape in a plan view (bottom view) as viewed from the first surface 10A side. For example, various shapes can be mentioned, such as a circle, an ellipse, a polygon such as a triangle and a quadrilateral, and a shape combining these. Among them, a rectangular shape is preferable. The first electrode 111 and the second electrode 112 preferably contain at least one metal selected from the group consisting of copper, iron, aluminum, and alloys thereof. In a bottom view, the first surface 10A of each of the first electrode 111 and the second electrode 112 is preferably substantially rectangular. A plating may be disposed on the first surface 10A of each of the first electrode 111 and the second electrode 112. The first recesses 1C of the first electrode 111 and the second electrode 112 may be arranged in any of an I shape, an L shape, or a U shape, for example, as shown in FIG. 7A, across two or three opposing side surfaces 10G of the substrate 10 in a bottom view. Among them, the first recess 1C is preferably arranged in a U shape in a bottom view. The first metal member 11 disposed in the first concave portion 1C preferably has conductivity. For example, those containing metal, ceramic fillers, etc. are preferable. As the metal, for example, it preferably contains at least one metal selected from the group consisting of gold, silver, copper, platinum, Al, Zn, Sn, Cu, Cr, Ni, and these alloys / eutectics such as Ag-Cu alloy / eutectic, and more preferably contains at least one metal selected from gold, silver, copper, platinum, and these alloys. The metal may be in any form such as granular or filler-like. The ceramic filler is preferably at least one selected from the group consisting of silicon nitride, aluminum nitride, silicon oxide, aluminum oxide, and zirconium oxide. For the first metal member, the metal is preferably contained in an amount of 50% by weight or more and 98% by weight or less. By containing such a metal, when this substrate is used as the substrate of a light-emitting device, the bonding with solder or the like can be enhanced. The metal may be contained in various forms such as particulate or filler-like. Also, when containing a ceramic filler, it is preferably contained in an amount of 2% by weight or more and 50% by weight or less with respect to the first metal member. The median diameter of the ceramic filler is, for example, 1 μm or more and 50 μm or less, preferably 1 μm or more and 40 μm or less, or 5 μm or more and 50 μm or less, and more preferably 5 μm or more and 30 μm or less. As described above, when plating is disposed on the first surface 10A of the first electrode 111 and the second electrode 112, it is preferable that plating is also disposed on the first surface 10A of the first metal member 11. The first metal member 11 preferably has a ductility of 50% or less with respect to the ductility of the metal used for the first electrode 111. As the insulating member 113, those containing at least one of nitride-based ceramics such as silicon nitride, aluminum nitride, and boron nitride, oxide-based ceramics such as magnesium oxide and aluminum oxide, beryllium oxide, silicon carbide, mullite, soda-lime glass, borosilicate glass, quartz glass, and lead glass are preferable. Among them, the insulating member 113 is preferably nitride-based ceramics such as silicon nitride, aluminum nitride, and boron nitride. The insulating member 113 is preferably rectangular in a bottom view. Also, in an end face view, it is preferable that the insulating member 113 has a convex portion on the second surface 10B side of the first electrode 111. The insulating member 113 is preferably extended in one direction of the substrate 10 (refer to the arrow Y direction in FIG. 7DA) and arranged from one end to the other end of the substrate 10. Note that the insulating member 113 is preferably fixed in the recess. In this case, it can be fixed by the third inorganic member 113b. Examples of the third inorganic member 113b are the same as those of the above-described third inorganic member 13b.

[0030] Also, as shown in FIG. 7C, the substrate 10X may have, for example, a second recess 1D recessed from the side surface 10G side and the second surface 10B side at at least a corner portion on the second surface 10B side of the first electrode 111 and the second electrode 112, and the second metal member 12 may be arranged in the recess. The second metal member 12 is different from the metal constituting the first electrode 111 and the second electrode 112, and examples thereof are the same as those exemplified as the first metal member 11. Among them, the second metal member 12 preferably contains a metal, a ceramic filler, or the like. The second metal member 12 may have the same composition as the first metal member or a different composition. The second recess 1D may be arranged in an I shape, an L shape, or a U shape across two or three side surfaces 10G of the substrate 10X, which are the outer periphery of the substrate, in a plan view (top view) seen from the second surface 1B side. Among them, the second recess 1D is preferably arranged in a U shape in a top view. In this case, the second metal member is preferably arranged at a position overlapping the first metal member in the thickness direction of the substrate.

[0031] The substrate 10X in Fig. 7C represents a substrate for mounting one light-emitting element. However, as shown in Fig. 7D, in order to mount a plurality of light-emitting elements, for example, an integrated substrate 10Z in which a plurality of substrates 10X (A in Fig. 7D) are arranged may be used. In this case, in the above-described cutting step, cutting may be performed along the second metal member 12 in the X and Y directions in Fig. 7D. Here, the integrated substrate 10Z for mounting light-emitting elements of the same size is represented, but it may also be an integrated substrate for arranging light-emitting elements 16 of different sizes in alignment according to their sizes. Also, the substrate 10 in Fig. 7A may similarly be an integrated substrate for mounting a plurality of light-emitting elements.

[0032] Such a substrate can be manufactured, for example, by the above-described method of manufacturing a substrate, in which the first metal member 11 disposed at the end on the first surface 10A side of the first electrode 111 and the second electrode 112 is cut by cutting from the second surface 10B side. That is, in this substrate, as described above, the metal plate 1 functions as the first electrode and the second electrode on both sides of the substrate, and the inorganic member 13 functions as an insulating member disposed between the first electrode and the second electrode. Also, the side corresponding to the first surface 1A of the metal plate 1 becomes the first surface of the substrate, which is the first surface of the first electrode and the second electrode, and at the end of the substrate, the first metal member 11 is disposed. At the second surface of the first electrode and the second electrode, at the end of the substrate, the second metal member 12 is disposed. In such a substrate, the surface of the first metal member 11 on the first surface 10A is a flat surface without burrs. Therefore, when this substrate is mounted on a circuit board or the like using solder, it is possible to prevent the thickening of the solder film due to burrs, make the thickness of the solder constant, and improve the mounting accuracy.

[0033] 〔Embodiment 4: Method of Manufacturing a Light-Emitting Device〕 The method of manufacturing a light-emitting device according to this embodiment includes preparing a metal plate (S11) as shown in Figs. 1 and 8, preparing a substrate by exposing an inorganic member (S13-3), disposing a light-emitting element on the second surface side of the metal plate in the substrate (S21), and cutting the metal plate in the substrate (S14). In the method for manufacturing a light-emitting device according to this embodiment, before arranging the light-emitting element on the substrate, plating and bumps may be arranged (S20a) on the second surface side of the substrate such as a metal plate, or after arranging the light-emitting element and before cutting the metal plate, a covering member for covering the side surface or the like of the light-emitting element may be arranged on the substrate (S21a). In such a method for manufacturing a light-emitting device, since the metal plate arranged by the first metal member is used as the substrate on which the light-emitting element is placed, even if such a substrate is cut and the metal plate is cut to obtain individual light-emitting devices, it is possible to effectively prevent burrs from occurring at the cutting locations. As a result, when performing soldering or the like on the obtained light-emitting device to the mounting substrate, the solder thickness can be maintained constant, the mounting accuracy can be improved, and a highly reliable light-emitting device can be efficiently manufactured.

[0034] S20: Preparation of Substrate First, prepare the substrate 10 manufactured by the above-described method for manufacturing a substrate. As shown in FIG. 3E, the substrate 10 is prepared by polishing or grinding the second surface 1B of the metal plate 1 in which the inorganic member 13 is arranged in the third recess by sintering, so that the inorganic member 13 is exposed from the metal plate 1. Here, in the method for manufacturing a substrate, the metal plates 1 arranged on both sides of the inorganic member 13 are referred to as the first electrode 111 and the second electrode 112 in the substrate 10 as shown in FIG. 9A, the inorganic member 13 is referred to as the insulating member 113, and the sintered third inorganic member 13b is referred to as the third inorganic member 113b. Also, the first surface 1A and the second surface 1B of the metal plate 1 are referred to as the first surface 10A and the second surface 10B of the substrate 10, respectively. In the substrate 10, since the insulating member 113 has convex portions, in a plan view (top view) seen from the second surface 10B side of the substrate 10, the surfaces of the convex portions are exposed from the first electrode 111 and the second electrode 112, and the convex portions have a form sandwiched by the third inorganic members 113b from both sides.

[0035] S20a: Plating As shown in FIG. 9B, plating 14 may be disposed on the second surface 10B side of the first electrode 111 and the second electrode 112 and on the second surface 10B side of the third inorganic member 113b. Plating 14 may utilize any method known in the art. For example, either a dry plating method or a wet plating method may be used, and either electrolytic plating, electroless plating, or the like may be used. Among these, it is preferable to utilize electroless plating. Examples of the plating include gold, platinum, titanium, and the like. The thickness of the plating can be set as appropriate, and for example, it may be 0.1 μm or more and 5 μm or less. Note that plating 14 may also be disposed on the first surface 10A side of the first electrode 111 and the second electrode 112 and on the first surface 10A side of the third inorganic member 113b. In this case, it is preferable to also dispose plating 14 on the surface of the second metal member 12 on the second surface 10B side. The plating 14 on the second surface 10B side may be different from the plating 14 on the first surface 10A side, but it is preferably the same. Thereby, since plating on the first surface side and the second surface side can be performed simultaneously, the manufacturing process can be simplified.

[0036] Also, as shown in FIG. 9C, bumps 15 may be formed on a part of the plating 14 on the second surface 10B side. The shape, size, number, etc. of the bumps 15 can be appropriately set according to the shape, arrangement, etc. of the electrodes of the light-emitting element. The size of the bumps 15 can be appropriately adjusted according to the size of the semiconductor laminate, the required light emission output of the light-emitting element, etc. For example, the diameter may be on the order of several tens of μm to several hundreds of μm. In FIG. 9C, it shows that bumps 15 are formed on the plating 14, but bumps may also be disposed on the electrode side of the light-emitting element described later. The bumps 15 can be formed by, for example, Au, Ag, Cu, Al, Sn, Pt, Zn, Ni, or an alloy thereof, by a method known in the art such as electrolytic plating, electroless plating, vapor deposition, sputtering, or the like.

[0037] S21: Arrangement of Light-Emitting Elements As shown in FIG. 9D, on the second surface 10B side of the substrate 10, across the insulating member 113, directly on the third inorganic members 113b, the first electrode 111, and the second electrode 112 on both sides thereof, or indirectly through the plating 14 and / or the bumps 15 if they are disposed, the light-emitting element 16 is disposed. (Light-emitting element 16) The light-emitting element 16 has, for example, an element substrate, a semiconductor laminate, and a pair of electrodes. The light-emitting element 16 may have a light-transmissive member 17 on the light extraction surface side thereof. In the present embodiment, the light-transmissive member 17 is disposed on the upper surface side that becomes the light extraction surface of the element substrate, the semiconductor laminate is provided on the lower surface side of the element substrate, and a pair of electrodes are provided on the semiconductor laminate side. As the semiconductor laminate, an arbitrary composition can be used according to the emission wavelength to be obtained. For example, a nitride semiconductor (In X Al Y Ga 1-X-Y N, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1), GaP, or GaAlAs, AlInGaP, etc. that can emit red light can be used. The size, shape, etc. of the light-emitting element 16 can be appropriately set according to the purpose of use. As the element substrate, for example, a sapphire substrate, a silicon substrate, a GaN substrate, etc. are used. The thickness of the element substrate is, for example, 20 μm or more and 2 mm or less. It is preferable that the element substrate and the light-transmissive member are joined directly or via a joining member. The light-transmissive member 17 can be formed of, for example, an inorganic material such as a light-transmissive resin material, glass, aluminum oxide, or a phosphor. The light-transmissive member may have a constant thickness throughout, or may be thin or thick in part. The thickness of the light-transmissive member is, for example, 50 μm or more and 300 μm or less. The light-transmissive member 17 can use an organic material such as an epoxy resin, a silicone resin, a modified epoxy resin, a modified silicone resin, a polyester resin, a polyimide resin, a modified polyimide resin, a polyphthalamide (PPA), a polycarbonate resin, a polyphenylene sulfide (PPS), a liquid crystal polymer (LCP), an ABS resin, a phenol resin, an acrylic resin, a polybutylene terephthalate (PBT) resin, etc. The light-transmissive member 17 may contain a phosphor, a light diffusing material, etc. in an inorganic material, an organic material, etc. For example, by containing a phosphor that absorbs blue light from the light-emitting element 16 and emits yellow light, white light can be emitted. Further, the light-transmissive member 17 may contain a plurality of types of phosphors. For example, it may contain a phosphor that absorbs blue light from the semiconductor laminate and emits green light and a phosphor that emits red light. Thereby, white light can be emitted from the light-emitting device.

[0038] Examples of the phosphor include yttrium aluminum garnet-based phosphors (for example, Y3(Al,Ga)5O 12 :Ce), lutetium aluminum garnet-based phosphors (for example, Lu3(Al,Ga)5O 12 :Ce), terbium aluminum garnet-based phosphors (for example, Tb3(Al,Ga)5O 12 :Ce), β-sialon phosphors (for example, (Si,Al)3(O,N)4:Eu), α-sialon phosphors (for example, Mz(Si,Al) 12 (O,N) 16(However, 0 < z ≤ 2, and M is Li, Mg, Ca, Y, and lanthanide elements excluding La and Ce), nitride-based phosphors such as CASN-based phosphors (e.g., CaAlSiN3:Eu), SCASN-based phosphors (e.g., (Sr,Ca)AlSiN3:Eu), etc., fluoride-based phosphors such as KSF-based phosphors (e.g., K2SiF6:Mn), KSAF-based phosphors (e.g., K2(Si,Al)F6:Mn), MGF-based phosphors (e.g., 3.5MgO·0.5MgF2·GeO2:Mn), quantum dot phosphors such as perovskite and chalcopyrite can be used. The phosphor may be in the form of particles, or a sintered body of the phosphor obtained by sintering phosphor particles, or a fixed product of phosphor particles. Since the sintered body and the fixed product of the phosphor do not contain an organic material by themselves, their heat resistance, light resistance, etc. can be improved. Examples of the light diffusing material include known fillers used in the art, such as silicon oxide, titanium oxide, zirconium oxide, magnesium oxide, aluminum nitride, silicon nitride, aerosil, glass, glass fiber, or wollastonite.

[0039] S21a: Arrangement of the coating member As shown in FIG. 9E, the coating member 18 may be arranged on the substrate 10 on which the light emitting element 16 is arranged. The coating member 18 preferably covers the second surface 1B of the substrate 10 and directly or indirectly covers the side surface of the light emitting element 16. Further, it is more preferable to arrange it so as to cover the periphery of the plating 14 and / or the bump 15 between the substrate 10 and the light emitting element 16. In other words, the coating member 18 is arranged on or above the second surface 1B and on the side surface or side of the light emitting element 16. The coating member 18 may be arranged to cover the side surface of the light transmissive member 17 so as to expose the upper surface of the light transmissive member 17 which is the light extraction surface of the light emitting element 16. The coating member 18 is preferably arranged such that its surface is in the same plane as the surface of the light transmissive member 17. In order to effectively utilize the light from the light-emitting element 16, the covering member 18 preferably has a high reflectance. The reflectance of the covering member 18 is preferably, for example, 90% or more, more preferably 95% or more, at the wavelength of the light emitted by the light-emitting element 16. The covering member 18 can be formed of a resin containing a light diffusing material. As the resin used for the covering member, for example, thermoplastic resins such as acrylic resin, polycarbonate resin, cyclic polyolefin resin, polyethylene terephthalate resin, polyethylene naphthalate resin or polyester resin, or thermosetting resins such as epoxy resin or silicone resin can be used. As the light diffusing material, for example, known materials such as titanium oxide, silicon oxide, aluminum oxide, zinc oxide or glass can be used. Further, it may contain fillers for adjusting color tone, wavelength conversion, viscosity, and the like.

[0040] S14: Cutting of the metal plate As shown in FIG. 9F, the substrate 10 is cut (S14). When the covering member 18 is arranged in the previous step, the covering member 18 is also cut together with the metal plate. The cutting is performed in the direction of the arrow Z in FIG. 9F, that is, from the second surface 10B side to the first surface 10A side of the substrate 10, so as to cut the first electrode 111 and the second electrode 112 made of a metal plate and the first metal member 11 arranged on the first surface 10A side of these electrodes.

[0041] The light-emitting device obtained by such a manufacturing method can have a flat surface without burrs and unevenness on the surface of the first metal member 11 on the first surface 10A of the substrate 10. Therefore, when the light-emitting device thus obtained is soldered and mounted, the bonding strength can be stably ensured, and the reliability of the light-emitting device can be improved. In FIGS. 9A to 9F, a light-emitting device having one light-emitting element mounted thereon is manufactured as one unit serving as a control unit for brightness and lighting and extinguishing. However, an assembly substrate on which a plurality of light-emitting elements can be mounted, shown in FIG. 7D, may also be used.

[0042] 〔Embodiment 5: Manufacturing method of a light-emitting device〕 The method for manufacturing a light-emitting device according to this embodiment includes preparing a metal plate (S11) as shown in FIG. 4, and preparing a substrate by exposing an inorganic member (S13-3), arranging a light-emitting element on the second surface side of the metal plate on the substrate (S21), and cutting the metal plate on the substrate (S14). In the method for manufacturing a light-emitting device according to this embodiment, further, before arranging the light-emitting element on the substrate, plating and bumps may be arranged on the second surface side of the metal plate or the like on the substrate (S20a), or after arranging the light-emitting element and before cutting the metal plate, a covering member for covering the side surface or the like of the light-emitting element may be arranged on the substrate (S21a). In such a method for manufacturing a light-emitting device, as described above, since the metal plate on which the first metal member is arranged is used as the substrate on which the light-emitting element is placed, even if such a substrate is cut and the metal plate is cut to obtain individual light-emitting devices, it is possible to effectively prevent burrs from occurring at the cutting location. As a result, when performing solder mounting or the like on the obtained light-emitting device with respect to the mounting substrate, the solder thickness can be maintained constant, the mounting accuracy can be improved, and a highly reliable light-emitting device can be efficiently manufactured.

[0043] S20: Preparation of substrate As shown in FIGS. 6C and 10A, the substrate 10X is obtained by polishing or grinding the second surface 1B of the metal plate 1 in which the inorganic member 13 is arranged in the third recess by sintering, so that the inorganic member 13 and the second metal member 12 are exposed from the metal plate 1. Otherwise, it is a substrate obtained in substantially the same manner as the substrate 10.

[0044] S20a: Plating As shown in FIG. 10B, on the substrate 10X, plating 14 may be arranged on the second surface 10B side of the first electrode 111 and the second electrode 112, the second surface 10B side of the third inorganic member 113b, and the second metal member 12. Also, plating 14 may be arranged on the first surface 10A side of the first electrode 111 and the second electrode 112 and the first surface 10A side of the third inorganic member 113b. Further, as shown in FIG. 10C, bumps 15 may be formed on a part of the plating 14 on the second surface 10B side. Otherwise, it can be carried out in the same manner as the plating in the manufacturing method of the light-emitting device described above.

[0045] S21: Arrangement of light-emitting elements As shown in FIG. 10D, on the second surface 10B side of the substrate 10, across the insulating member 113, directly on the third inorganic members 113b, the first electrode 111, and the second electrode 112 on both sides thereof, or indirectly through the plating 14 and / or the bumps 15 if they are arranged, the light-emitting elements 16 are arranged. Otherwise, it can be carried out in the same manner as the arrangement of the light-emitting device in the manufacturing method of the light-emitting device described above.

[0046] S21a: Arrangement of covering members As shown in FIG. 10E, a covering member 18 may be arranged on the substrate 10X on which the light-emitting elements 16 are arranged. This step can be carried out in the same manner as the arrangement of the covering member in the manufacturing method of the light-emitting device described above.

[0047] S14: Cutting of metal plate As shown in FIG. 10F, the substrate 10 is cut (S14). The cutting is performed in the direction of arrow Z in FIG. 10F, that is, from the second surface 10B side of the substrate 10 toward the first surface 10A side, so as to cut the second metal member 12, the first electrode 111, and the second electrode 112, and the first metal member 11 arranged on the first surface 10A side of these electrodes. The light-emitting device obtained by such a manufacturing method can have a flat surface without burrs and unevenness on the surface of the first metal member 11 on the first surface 10A of the substrate 10X. Therefore, when the light-emitting device thus obtained is soldered, the bonding strength can be stably ensured, and the reliability of the light-emitting device can be improved.

[0048] 〔Embodiment 6: Light-emitting device〕 As shown in FIG. 11A, the light-emitting device 20 according to this embodiment includes a substrate 10X, a light-emitting element 16 disposed on the second surface 10B side of each of the first electrode 111 and the second electrode 112 across an insulating member 113, and a covering member 18. A second metal member 12 is disposed on the second surface 10B at the corner or outer periphery of the first electrode 111 and the second electrode 112, and a first metal member 11 is disposed on the first surface 10A. The light-emitting element 16 has a translucent member 17 on the light extraction surface side. The light-emitting element 16 is indirectly disposed on the first electrode 111 and the second electrode 112 of the substrate 10X via plating 14 and bumps 15. The covering member 18 covers between the substrate 10X and the light-emitting element 16, the side surface of the light-emitting element 16, and the side surface of the translucent member 17, including the periphery of the plating 14 and the bumps 15 on the substrate 10X. The first surface side of the substrate 10X is disposed on the wiring 41 disposed on the mounting substrate 40 via solder 19 and plating 14. Note that the light-emitting device 20 may use one light-emitting element 16 as a unit for controlling brightness and lighting and extinguishing, or may use a unit including a plurality of light-emitting elements 16 as a unit. In this case, the lighting and extinguishing of all the light-emitting elements may be controlled collectively, or the lighting and extinguishing may be controlled for each light-emitting element 16. In such a light-emitting device, since the surface of the first metal member 11 on the first surface 10A of the substrate 10X is flat without burrs and unevenness, when the light-emitting device is soldered, the bonding strength can be stably ensured, and the reliability of the light-emitting device can be improved.

[0049] 〔Embodiment 7: Light-Emitting Device〕 As shown in FIG. 11B, the light-emitting device 30 according to this embodiment includes a substrate 10Y, a light-emitting element 16 disposed on the second surface 10B side of each of the first electrode 111 and the second electrode 112 across an insulating member 113, and a covering member 18. At the corners or outer peripheral portions of the first electrode 111 and the second electrode 112, a second metal member 12 is disposed on the second surface 10B, and a first metal member 11 is disposed on the first surface 10A. Further, on the first surface 10A side of the first electrode 111 and the second electrode 112, the first metal member 11 is connected and disposed so as to contact the third inorganic member 113b. Other than that, it has the same configuration as the above-described light-emitting device 20 and has the same effects.

[0050] This application includes the following inventions. [Item 1] Preparing a metal plate having a first surface with a first recess and a second surface opposite to the first surface; Disposing a first metal paste in the first recess; Sintering the disposed first metal paste to form a first metal member; A method for manufacturing a substrate, including cutting the metal plate so as to cut the first metal member disposed in the first recess from the second surface side to the first surface side of the metal plate. [Item 2] In the disposing of the first metal paste, the first metal paste includes a first metal powder, an active metal powder, an organic solvent, and a ceramic filler. The method for manufacturing a substrate according to Item 1. [Item 3] In the cutting of the metal plate, the first metal member has less ductility than the metal plate. The method for manufacturing a substrate according to any of the above-described items. [Item 4] Before cutting the metal plate, polishing or grinding the first surface of the metal plate and the first metal member. The method for manufacturing a substrate according to any of the above-described items. [Item 5] In the preparing of the metal plate, the metal plate has a second recess on the second surface. In the disposing of the first metal paste, disposing a second metal paste in the second recess. In the forming of the first metal member, sintering the second metal paste to form a second metal member. In cutting the metal plate, including cutting the metal plate so as to cut the second metal member disposed in the second recess together with the first metal member, the method for manufacturing a substrate according to any one of the above-described items. [Item 6] After forming the first metal member, forming a third recess on the first surface of the metal plate between two of the first recesses in one direction; Disposing an inorganic member in the third recess; The method for manufacturing a substrate according to any one of the above-described items, including polishing or grinding the second surface of the substrate to expose the inorganic member from the metal plate. [Item 7] Preparing a metal plate having a first surface with a first recess and a second surface opposite to the first surface; Disposing a first metal paste in the first recess; Sintering the disposed first metal paste to form a first metal member; Forming a third recess on the first surface of the metal plate between two of the first recesses in one direction; Disposing an inorganic member in the third recess; Polishing or grinding the second surface to expose the inorganic member from the metal plate to prepare a substrate; Disposing a light-emitting element on a first electrode and a second electrode formed of the metal plate on both sides of the inorganic member across the inorganic member on the second surface side of the metal plate in the substrate; and Cutting the substrate so as to cut the metal plate and the first metal member from the second surface side toward the first surface side, the method for manufacturing a light-emitting device. [Item 8] After disposing the light-emitting element and before cutting the metal plate, Disposing a covering member on or above the second surface and on or beside a side surface of the light-emitting element; The manufacturing method of the light-emitting device according to claim 7, including cutting the coating member from the coating member side toward the metal plate when cutting the metal plate and the first metal member. [Claim 9] A substrate including a first electrode and a second electrode made of metal, and an insulating member disposed between the first electrode and the second electrode, wherein the first electrode and the second electrode each have a first surface, a second surface opposite to the first surface, and a side surface connecting the first surface and the second surface and constituting a part of the outer periphery of the substrate, and the first electrode and the second electrode have a first recess recessed from the side surface side and the first surface side, and a first metal member including a ceramic filler and a metal is disposed in the first recess. [Claim 10] The substrate according to claim 9, wherein the first metal member has conductivity. [Claim 11] The substrate according to any of the above claims, wherein the metal contained in the first metal member is 50% by weight or more and 98% by weight or less. [Claim 12] The substrate according to any of the above claims, wherein the ductility of the first metal member is 50% or less with respect to the ductility of the metal used for the first electrode. [Claim 13] The substrate according to any of the above claims, wherein the first metal member contains 2% by weight or more and 50% by weight or less of a ceramic filler. [Claim 14] The substrate according to any of the above claims, wherein the median diameter of the ceramic filler is 1 μm or more and 50 μm or less. [Claim 15] The substrate according to any of the above claims, wherein the ceramic filler is at least one selected from the group consisting of silicon nitride, aluminum nitride, silicon oxide, aluminum oxide, and zirconium oxide. [Claim 16] The substrate according to any of the above claims, wherein the first metal member contains at least one metal selected from the group consisting of gold, silver, copper, platinum, and alloys thereof. [Claim 17] The first electrode and the second electrode are the substrate according to any one of the above items including at least one metal selected from the group consisting of copper, iron, aluminum, and alloys thereof. [Item 18] The first metal member is the substrate according to any one of the above items further including a metal filler. [Item 19] The substrate according to any one of the above items, wherein plating is disposed on each of the first surfaces of the first electrode and the second electrode and one surface of the first metal member. [Item 20] The substrate according to any one of the above items, wherein each of the first surfaces of the first electrode and the second electrode is substantially rectangular in a bottom view. [Item 21] The substrate according to any one of the above items, wherein a second metal member including a ceramic filler and a metal is disposed at each corner portion on the second surface side of the outer periphery of the first electrode and the second electrode. [Item 22] The substrate according to any one of the above items, wherein the first metal member and the second metal member are disposed at positions overlapping in the thickness direction of the substrate. [Item 23] The substrate according to any one of the above items, and A light-emitting element disposed on each of the second surface sides of the first electrode and the second electrode across the insulating member, and A light-emitting device including a covering member disposed on or above the second surface and on or beside the side surface of the light-emitting element. [Item 24] The light-emitting device according to Item 23, wherein plating is provided on each of the second surfaces of the first electrode and the second electrode.

Industrial Applicability

[0051] The manufacturing method of a substrate and a light-emitting device according to an embodiment of the present disclosure, the substrate and the light-emitting device can be used in a light distribution variable type headlamp light source, a backlight light source of a liquid crystal display, various lighting fixtures, a large display, various display devices such as advertisements and destination guides, a digital video camera, a facsimile machine, a copying machine, an image reading device in a scanner, a projector device, and the like.

Explanation of Reference Numerals

[0052] 1, 1X Metal plate 1A First surface 1B Second surface 1C First recess 1D Second recess 1E Third recess 10, 10X, 10Y Substrate 10A First surface 10B Second surface 10G Side surface 10Z Assembly substrate 11 First metal member 11a First metal paste 12 Second metal member 12a Second metal paste 13 Inorganic member 13a Third inorganic paste 13b Third inorganic member 14 Plating 15 Bump 16 Light-emitting element 17 Translucent member 18 Coating member 19 Solder 20 Light-emitting device 30 Light-emitting device 40 Mounting substrate 41 Wiring 111 First electrode 112 Second electrode 113 Insulating member 113b Third inorganic member

Claims

1. Preparing a metal plate having a first surface with a first recess and a second surface opposite to the first surface; Disposing a first metal paste in the first recess; Sintering the disposed first metal paste to form a first metal member; Cutting the metal plate so as to cut the first metal member disposed in the first recess from the second surface side of the metal plate toward the first surface side. A method for manufacturing a substrate comprising:

2. The method for manufacturing a substrate according to claim 1, wherein, when disposing the first metal paste, the first metal paste contains a first metal powder, an active metal powder, an organic solvent, and a ceramic filler.

3. The method for manufacturing a substrate according to claim 1, wherein, when cutting the metal plate, the first metal member has less ductility than the metal plate.

4. The method for manufacturing a substrate according to claim 1, further comprising polishing or grinding the first surface of the metal plate and the first metal member before cutting the metal plate.

5. When preparing the metal plate, the metal plate has a second recess on the second surface; When disposing the first metal paste, disposing a second metal paste in the second recess; When forming the first metal member, sintering the second metal paste to form a second metal member; When cutting the metal plate, cutting the metal plate so as to cut the second metal member disposed in the second recess together with the first metal member. The method for manufacturing a substrate according to claim 1.

6. After forming the first metal member, forming a third recess on the first surface of the metal plate between two of the first recesses in one direction; Disposing an inorganic member in the third recess; Polishing or grinding the second surface of the substrate to expose the inorganic member from the metal plate. The method for manufacturing a substrate according to claim 1.

7. Preparing a metal plate having a first surface with a first recess and a second surface opposite to the first surface; Disposing a first metal paste in the first recess; Sintering the disposed first metal paste to form a first metal member; Forming a third recess on the first surface of the metal plate between two of the first recesses in one direction; Disposing an inorganic member in the third recess; Polishing or grinding the second surface to expose the inorganic member from the metal plate to prepare a substrate; Placing a light-emitting element on a first electrode and a second electrode composed of the metal plate on both sides of the inorganic member across the inorganic member on the second surface side of the metal plate in the substrate; and A method of manufacturing a light-emitting device, including cutting the substrate so as to cut the metal plate and the first metal member from the second surface side toward the first surface side.

8. After arranging the light-emitting element and before cutting the metal plate, Placing a covering member on or above the second surface and on or beside the side surface of the light-emitting element; and The method of manufacturing a light-emitting device according to claim 7, including cutting the covering member from the covering member side toward the metal plate when cutting the metal plate and the first metal member.

9. A substrate including a first electrode and a second electrode made of metal, and An insulating member disposed between the first electrode and the second electrode, wherein The first electrode and the second electrode each have a first surface and a second surface opposite to the first surface, and a side surface connecting the first surface and the second surface and constituting a part of the outer periphery of the substrate, The first electrode and the second electrode have a first recess recessed from the side surface side and the first surface side, and a first metal member including a ceramic filler and a metal is disposed in the first recess.

10. The substrate according to claim 9, wherein the first metal member has conductivity.

11. The substrate according to claim 9, wherein the metal contained in the first metal member is 50% by weight or more and 98% by weight or less.

12. The substrate according to claim 9, wherein the ductility of the first metal member is 50% or less with respect to the ductility of the metal used for the first electrode.

13. The substrate according to claim 9, wherein the first metal member contains a ceramic filler in an amount of 2% by weight or more and 50% by weight or less.

14. The substrate according to claim 13, wherein the median diameter of the ceramic filler is 1 μm or more and 50 μm or less.

15. The substrate according to claim 13, wherein the ceramic filler is at least one selected from the group consisting of silicon nitride, aluminum nitride, silicon oxide, aluminum oxide, and zirconium oxide.

16. The substrate according to claim 9, wherein the first metal member contains at least one metal selected from the group consisting of gold, silver, copper, platinum, and alloys thereof.

17. The substrate according to claim 9, wherein the first electrode and the second electrode contain at least one metal selected from the group consisting of copper, iron, aluminum, and alloys thereof.

18. The substrate according to claim 9, wherein the first metal member further contains a metal filler.

19. The substrate according to claim 9, wherein plating is disposed on each of the first surfaces of the first electrode and the second electrode and one surface of the first metal member.

20. The substrate according to claim 9, wherein in a bottom view, each of the first surfaces of the first electrode and the second electrode is substantially rectangular.

21. The substrate according to claim 9, wherein at each corner portion on the second surface side of the outer periphery of the first electrode and the second electrode, a second metal member containing a ceramic filler and a metal is disposed.

22. The substrate according to claim 21, wherein the first metal member and the second metal member are disposed at positions overlapping in the thickness direction of the substrate.

23. The substrate according to any one of claims 9 to 22, a light-emitting element disposed on each of the second surface sides of the first electrode and the second electrode across the insulating member, and a covering member disposed on the second surface or above the second surface and on the side surface or side of the light-emitting element.

24. The light-emitting device according to claim 23, wherein plating is provided on each of the second surfaces of the first electrode and the second electrode.

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