Methods and apparatus for insulating gas lines
The vapor delivery system with a flexible heating element and polyetheretherketone insulation addresses inefficiencies in gas delivery by providing enhanced thermal management and flexibility, improving semiconductor manufacturing processes.
Patent Information
- Application Number
- JP2024224381
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-12-22
- Filing Date
- 2024-12-19
- Publication Date
- 2025-07-03
AI Technical Summary
Conventional gas distribution plates in semiconductor manufacturing struggle with efficient delivery of precursors and reactants due to sequential delivery through shared through-holes, which can lead to inefficiencies and potential thermal challenges.
A vapor delivery system incorporating a heating element surrounded by an insulating layer with voids, formed from polyetheretherketone, and featuring a flexible design with spacers to enhance thermal management and efficiency.
The system provides improved thermal insulation and flexibility, ensuring precise temperature control and efficient delivery of gases to the reaction chamber, enhancing processing efficiency in semiconductor manufacturing.
Smart Images
Figure 2025100482000001_ABST
Abstract
Description
Technical Field
[0001] The present disclosure generally relates to methods and apparatuses for insulating gas lines. More particularly, the present disclosure relates to a gas line having a flexible heater attached thereto and an insulating layer having a void in contact with the flexible heater.
Background Art
[0002] Some reaction chambers used in semiconductor manufacturing utilize a gas distribution plate (also called a showerhead) to deliver various gases, such as precursors and reactants, to a substrate to form a film on the substrate. Conventional gas distribution plates sequentially provide precursors and reactants through a set of shared through-holes within the gas distribution plate. In some cases, it may be advantageous to deliver precursors and reactants into the reaction chamber through separate plenums.
Summary of the Invention
Means for Solving the Problems
[0003] Various embodiments of the present technology may provide a vapor delivery system. The vapor delivery system may include a heating element and an insulating layer surrounding the gas line. The insulating layer may have voids and may be formed from polyetheretherketone.
[0004] According to one aspect, the vapor delivery system includes a gas line having a sidewall including an inner surface and an opposing outer surface, a metal layer surrounding the gas line and having an outer-facing surface, a heating element having a first surface directly attached to the outer-facing surface of the metal layer and an opposing second surface, and an insulating layer adjacent to the heating element, the insulating layer comprising a plurality of voids.
[0005] In one embodiment, the insulating layer comprises a triply periodic minimal surface structure.
[0006] In one embodiment, the triply periodic minimal surface structure is a gyroid structure.
[0007] In one embodiment, the heat insulation layer is in direct contact with the heating element.
[0008] In one embodiment, the heating element is a flexible heating element.
[0009] In one embodiment, the steam delivery system further comprises a plurality of spacers disposed between the second surface of the heating element and the heat insulation layer.
[0010] In one embodiment, the plurality of spacers are formed of silicon and have a thickness in the range of 1 mm to 3 mm.
[0011] In one embodiment, the metal layer comprises aluminum.
[0012] In one embodiment, the heat insulation layer is formed of polyetheretherketone.
[0013] In another aspect, the steam delivery system comprises a gas line having a side wall including an inner surface and an opposing outer surface, a metal layer formed of aluminum surrounding the gas line and having an outward-facing surface, a flexible heating element having a first surface directly attached to the outward-facing surface of the metal layer and an opposing second surface, a heat insulation layer adjacent to the heating element, and a void between the heating element and the heat insulation layer.
[0014] In one embodiment, the steam delivery system further comprises a plurality of spacers disposed between the second surface of the heating element and the heat insulation layer.
[0015] In one embodiment, the plurality of spacers are formed of silicon and have a thickness in the range of 1 mm to 3 mm.
[0016] In one embodiment, the heat insulation layer comprises glass fibers and has a thickness in the range of 5 mm to 8 mm.
[0017] In one embodiment, the heat insulation layer includes a triply periodic minimal surface structure and is formed of polyetheretherketone.
[0018] In yet another aspect, an apparatus configured to surround a gas line includes a metal layer surrounding the gas line, a heating element directly attached to the metal layer, a plurality of spacers disposed on the heating element and having a thickness in the range of 1 mm to 3 mm, a heat insulation layer adjacent to the heating element and in direct contact with the spacers, and a void separating the heating element and the heat insulation layer.
[0019] In one embodiment, the plurality of spacers are formed from silicon.
[0020] In one embodiment, the heat insulation layer includes glass fibers and has a thickness in the range of 5 mm to 8 mm.
[0021] In one embodiment, the heat insulation layer includes a triply periodic minimal surface structure and is formed from polyetheretherketone.
[0022] In one embodiment, the metal layer includes aluminum.
[0023] In one embodiment, the void is 1 mm to 3 mm.
[0024] A more complete understanding of the present technology may be obtained by referring to the detailed description when considered in connection with the following exemplary drawings. In the following figures, like reference numerals refer to like elements and steps throughout the figures.
Brief Description of the Drawings
[0025]
Figure 1
Figure 2
Figure 3
Figure 4
Modes for Carrying Out the Invention
[0026] The present technology may be described with respect to components of functional blocks and various processing steps. Such functional blocks may be implemented by any number of components configured to perform a specified function and to achieve various results. For example, the present technology may use various gas lines, valves, controllers, pressure controllers, reaction chambers, vessels, and temperature sensors.
[0027] Referring to FIG. 1, an exemplary system 100 may include a reactor 105 configured to perform processing on an object to be processed, such as a substrate 120 (e.g., a wafer). For example, the reactor 105 may be configured to perform heating, deposition, etching, polishing, ion implantation, and / or other processing on the object to be processed. In some embodiments, the reactor 105 may be configured to perform functions such as moving the object to be processed, vacuum sealing, heating, exhausting, and / or other functions so that the object is processed within the reactor. In some embodiments, the reactor 105 may be a reactor in which an atomic layer deposition (ALD) or chemical vapor deposition (CVD) process is performed.
[0028] In various embodiments, the system 100 may further include a substrate mounting unit disposed within the reactor 105. The substrate mounting unit may include a susceptor 115 for supporting the substrate 120 and a heater (not shown) for heating the substrate supported by the susceptor 115. The heater may be embedded within the susceptor 115. The substrate mounting unit may further include a pedestal 135 for supporting the susceptor 115. For loading / unloading the substrate, the substrate mounting unit may be configured to be vertically movable by being connected to a drive unit (not shown).
[0029] In various embodiments, the system 100 may further include a gas distribution system 125 (i.e., a showerhead) for delivering vapor to the reactor 105. In an exemplary embodiment, the gas distribution system 125 is disposed above the susceptor 115.
[0030] In various embodiments, system 100 may further comprise a delivery system 130 configured to deliver gas or vapor from container 110 to reactor 105. For example, delivery system 130 may be coupled to container 110 at a first end and to reactor 105 at a second end. Container 110 may be configured to contain a solid or liquid chemical that is converted to vapor.
[0031] In various embodiments, referring to FIGS. 2-4, delivery system 130 may comprise a gas line 200. Gas line 200 may be configured to facilitate the flow of vapor. Gas line 200 may be formed from a metal such as stainless steel or any other suitable metal and may be of any suitable size. For example, gas line 200 may have a diameter in the range of 0.25 inches to 1 inch. In various embodiments, gas line 200 may comprise any number of connectors and gas line sections coupled by the connectors. Further, delivery system 130 may comprise any number of valves to control the flow and / or pressure of vapor within delivery system 130.
[0032] In various embodiments, delivery system 130 may further comprise a metal layer 205 configured to surround gas line 200. For example, in an exemplary embodiment, metal layer 205 comprises a first section 300 and a second section 305 that are wound around gas line 200 and in direct contact with gas line 200. For example, the first and second sections 300, 305 may comprise notches corresponding to the size and shape of gas line 200 such that the first and second sections 300, 305 fit over gas line 200. Further, the first and second sections 300, 305 may be in direct contact with each other at a seam 310 formed by the edges of the first and second sections 300, 305. Metal layer 205 may be formed from a thermally conductive metal such as aluminum.
[0033] In various embodiments, the delivery system 130 may further include a heating element 210 configured to heat the metal layer 205 and the gas line 200. For example, the heating element 210 may be attached to the outer surface 315 of the metal layer 205. In various embodiments, the heating element 210 may comprise a resistive heating element or any other suitable type of heating element. The heating element may be attached to the metal layer 205 with an adhesive. In some embodiments, the heating element 210 may completely surround the metal layer 205. In other embodiments, the heating element 210 may be attached only to a portion of the outer surface of the metal layer 205. In various embodiments, the heating element 210 may be a flexible heating element. For example, the heating element 210 may be formed from a flexible material such as a thermoplastic material or any other suitable flexible heat-resistant material.
[0034] In various embodiments, the delivery system 130 may further include a plurality of spacers 230 configured to form voids 225. The plurality of spacers 230 may be attached to the heating element 210 or otherwise disposed on the heating element 210. In some cases, the plurality of spacers 230 may be integrated with the heating element 210. For example, the plurality of spacers 230 may be formed or attached to the surface of the heating element 210 on the side opposite the side attached or adhered to the metal layer 205. The plurality of spacers 230 may be formed from silicon and may have a thickness in the range of 1 mm to 3 mm.
[0035] In various embodiments, the delivery system 130 may further include a thermal insulation layer 215 adjacent to the heating element 210. In some embodiments, the thermal insulation layer 215 may be disposed on the plurality of spacers 230. In this case, the void 225 is formed between the heating element 210 and the thermal insulation layer 215. In other embodiments without the plurality of spacers 230, the thermal insulation layer 215 may be in direct contact with the heating element 210. In various embodiments, the thermal insulation layer 215 may surround the heating element 210 and the metal layer 205 and provide a thermal barrier for the heating element 210 and the metal layer 205. In some embodiments, the thermal insulation layer 215 may include a glass fiber material.
[0036] In other embodiments, the thermal insulation layer 215 may include a thermoplastic material such as polyetheretherketone (PEEK).
[0037] In various embodiments, the thermal insulation layer 215 may include a plurality of air pockets. For example, the thermal insulation layer 215 may include a 3D lattice structure 400 that includes a first plenum 600 and a second plenum 605. The 3D lattice structure may be a triply periodic minimal surface structure, such as a gyroid structure or any other structure having two or more distinct plenums.
[0038] The continuous inner wall 705 separates the first plenum 600 from the second plenum 605. In other words, the first plenum 600 is separated from the second plenum 605 by the continuous inner wall 705. The thermal insulation layer 215 may further include an outer surface wall (not shown) that surrounds or otherwise bounds the first and second plenums 600, 605.
[0039] In various embodiments, the first plenum 600 may include a first plurality of interconnected channels 601 that form a first volume. The first plurality of channels 601 may be branched (i.e., non-linear), for example, two or more channels 601 may be connected at a first node. Similarly, the second plenum 605 may include a second plurality of interconnected channels 606 that form a second volume. The second plurality of channels 606 may be branched, for example, two or more channels 606 may be connected at a second node.
[0040] In various embodiments, the first plurality of channels 600 are intertwined with the second plurality of channels 606.
[0041] In various embodiments, the thermal insulation layer 215 may be formed from a thermoplastic material by additive manufacturing (i.e., 3D printing) or any other suitable method.
[0042] In various embodiments, referring to FIGS. 1 and 2, system 100 may further include a delivery system 130, and in particular, a temperature sensor 220 such as a thermocouple configured to measure the temperature of the gas line 200. For example, the temperature sensor 220 may be directly attached to the outer surface of the gas line 200 or the metal layer 205. In other cases, the temperature sensor 220 may be embedded within the metal layer 205. The temperature sensor 220 may generate a signal corresponding to the temperature of the gas line 200.
[0043] In various embodiments, system 100 may also include a controller (not shown) configured to control a valve (not shown) disposed within the delivery system 130. The controller may operate the valve to facilitate the flow of vapor from the container 110 to the reactor 105 according to a desired pulse pattern. In various embodiments, the controller may control the temperature of the heating element 210 according to the measured temperature of the gas line 200. For example, the controller may receive a signal from the temperature sensor and then increase or decrease the temperature of the heating element 210 according to the desired temperature of the gas line 200.
[0044] In the foregoing description, the technology has been described with reference to specific exemplary embodiments. The specific implementations shown and described are examples of the technology and its best mode, and are not intended to limit the scope of the technology in any way. Indeed, for the sake of brevity, conventional manufacturing, connection, preparation, and other functional aspects of the methods and systems may not be described in detail. Further, the connection lines shown in the various figures are intended to represent exemplary functional relationships and / or steps between the various elements. Many alternative or additional functional relationships or physical connections may exist in the actual system.
[0045] This technology is described with reference to specific exemplary embodiments. However, various modifications and changes may be made without departing from the scope of the technology. The description and drawings are to be regarded in an illustrative rather than a restrictive sense, and all such modifications are intended to be included within the scope of the technology. Accordingly, the scope of the technology should be determined not by the specific examples described above only, but by the general embodiments described and their legal equivalents. For example, the steps recited in any method or process embodiment may be executed in any order, and are not limited to the explicit order presented in a particular example, unless explicitly specified otherwise in another way. Further, the components and / or elements recited in any apparatus embodiment may be assembled in various permutations or otherwise operably configured to produce substantially the same result as the technology, and thus are not limited to the specific configuration recited in a particular example.
[0046] Benefits, other advantages, and solutions to problems have been described above with respect to specific embodiments. However, any element that may result in or make more prominent any benefit, advantage, solution to a problem, or any particular benefit, advantage, or solution is not to be construed as a critical, required, or essential feature or component.
[0047] The terms "comprises," "comprising," or any variation thereof are intended to reference non-limiting inclusion, such that a process, method, article, composition, or apparatus that comprises a list of elements includes not only those elements that are recited, but also other elements not expressly recited or inherent to such process, method, article, composition, or apparatus. In addition to those not specifically recited, other combinations and / or modifications of the structures, arrangements, uses, proportions, elements, materials, or components described above that are used in the practice of this technology may be varied or otherwise specifically adapted without departing from their general principles to particular environments, manufacturing specifications, design parameters, or other operational requirements.
[0048] This technology has been described above with reference to exemplary embodiments. However, modifications and alterations may be made to the exemplary embodiments without departing from the scope of this technology. These and other modifications or alterations are intended to be included within the scope of this technology as expressed in the following claims.
Claims
1. A gas line having a side wall including an inner surface and an opposing outer surface, a metal layer surrounding the gas line and having an outer-facing surface, a heating element having a first surface directly attached to the outer-facing surface of the metal layer and an opposing second surface, a heat insulation layer adjacent to the heating element, A steam delivery system comprising: The heat insulation layer includes a plurality of voids. Steam delivery system.
2. The steam delivery system according to claim 1, wherein the heat insulation layer has a triply periodic minimal surface structure.
3. The steam delivery system according to claim 1, wherein the triply periodic minimal surface structure is a gyroid structure.
4. The steam delivery system according to claim 1, wherein the heat insulation layer is in direct contact with the heating element.
5. The steam delivery system according to claim 1, wherein the heating element is a flexible heating element.
6. The steam delivery system according to claim 1, further comprising a plurality of spacers disposed between the second surface of the heating element and the heat insulation layer.
7. The steam delivery system according to claim 6, wherein the plurality of spacers are formed of silicon and have a thickness in the range of 1 mm to 3 mm.
8. The steam delivery system according to claim 1, wherein the metal layer comprises aluminum.
9. The steam delivery system according to claim 1, wherein the heat insulation layer is formed of polyetheretherketone.
10. A gas line having a side wall including an inner surface and an opposing outer surface, a metal layer surrounding the gas line and formed of aluminum having an outer-facing surface, a flexible heating element having a first surface directly attached to the outer-facing surface of the metal layer and an opposing second surface, a heat insulation layer adjacent to the heating element, a void between the heating element and the heat insulation layer, A steam delivery system comprising:
11. The steam delivery system according to claim 10, further comprising a plurality of spacers disposed between the second surface of the heating element and the heat insulation layer.
12. The steam delivery system according to claim 10, wherein the plurality of spacers are formed of silicon and have a thickness in the range of 1 mm to 3 mm.
13. The steam delivery system according to claim 10, wherein the heat insulation layer comprises glass fibers and has a thickness in the range of 5 mm to 8 mm.
14. The steam delivery system according to claim 10, wherein the heat insulation layer has a triply periodic minimal surface structure and is formed of polyetheretherketone.
15. An apparatus configured to surround a gas line, comprising: a metal layer surrounding the gas line; a heating element directly attached to the metal layer; a plurality of spacers disposed on the heating element, the spacers having a thickness in the range of 1 mm to 3 mm; a heat insulation layer adjacent to the heating element and in direct contact with the spacers; and a void separating the heating element and the heat insulation layer.
16. The apparatus according to claim 15, wherein the plurality of spacers are formed of silicon.
17. The apparatus according to claim 15, wherein the heat insulation layer comprises glass fibers and has a thickness in the range of 5 mm to 8 mm.
18. The apparatus according to claim 15, wherein the heat insulation layer has a triply periodic minimal surface structure and is formed of polyether ether ketone.
19. The apparatus according to claim 15, wherein the metal layer comprises aluminum.
20. The apparatus according to claim 15, wherein the void is 1 mm to 3 mm.