Capacitor, manufacturing method thereof, and capacitor assembly using the same
The capacitor design with through-holes and layered electrodes addresses the need for higher capacitance by stacking capacitors in parallel or series configurations, enhancing capacitance without increasing thickness and facilitating efficient manufacturing.
Patent Information
- Application Number
- JP2024226430
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-12-22
- Filing Date
- 2024-12-23
- Publication Date
- 2025-07-03
AI Technical Summary
There is a demand for capacitors with higher capacitance to meet the miniaturization and thinning requirements of electronic products, while existing multilayer capacitors fall short in this regard.
A capacitor design involving a body with through-holes, inner and outer electrodes, and dielectric layers, allowing for the stacking and connection of multiple capacitors in parallel or series configurations, enhancing capacitance without increasing thickness.
The proposed design achieves high capacitance by stacking capacitors, enabling increased capacitance without increasing thickness, and allows for efficient manufacturing processes like atomic layer deposition.
Smart Images
Figure 2025100522000001_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to a capacitor, a method for manufacturing the same, and a capacitor assembly using the same.
Background Art
[0002] As electronic components used in electronic devices, there are capacitors, inductors, piezoelectric elements, varistors, or thermistors. Among such ceramic electronic components, multilayer capacitors can be used in various electronic devices because of their advantages of being small in size, having a guaranteed high capacitance, and being easy to mount.
[0003] For example, multilayer capacitors can be mounted on the substrates of various electronic products such as liquid crystal displays (LCDs), plasma display panels (PDPs), video devices such as organic light-emitting diodes (OLEDs), computers, personal mobile terminals, and smartphones, and can be used as chip-type capacitors that play a role in charging or discharging electricity.
[0004] In recent years, due to the trend of miniaturization and thinning of electronic products, the demand for capacitors with higher capacitance than conventional multilayer capacitors has been increasing.
Summary of the Invention
Problems to be Solved by the Invention
[0005] One aspect of the embodiment can provide a capacitor capable of ensuring a high capacitance by stacking two or more capacitors.
[0006] However, the problems to be solved by the embodiments of the present invention are not limited to the above problems, and can be variously extended within the scope of the technical idea included in the present invention.
Means for Solving the Problems
[0007] A capacitor according to an embodiment includes a body having a through-hole penetrating from a first surface to a second surface, an inner surface of the body located in the through-hole, a first inner electrode located on the first surface and the second surface, a dielectric layer located on the first inner electrode, a second inner electrode located on the dielectric layer, a first external electrode located on the first surface and connected to the first inner electrode, and a second external electrode located on the second surface and connected to the second inner electrode.
[0008] Also, the first inner electrode located on the inner surface of the body, the first inner electrode located on the first surface, and the first inner electrode located on the second surface can be connected to each other.
[0009] Also, the dielectric layer is respectively located on the inner surface of the body, the first surface, and the second surface, and the second inner electrode can be respectively located on the inner surface of the body, the first surface, and the second surface.
[0010] Also, the second inner electrodes respectively located on the inner surface of the body, the first surface, and the second surface can be connected to each other.
[0011] Also, the second external electrode can also be located on the first surface, and the first external electrode can also be located on the second surface.
[0012] Also, the second inner electrode can fill the inner space of the body formed by the through-hole.
[0013] Also, the first external electrode includes a sub-electrode portion in contact with the first inner electrode and a main electrode portion in contact with the sub-electrode portion. Based on a plane parallel to the first surface, the cross-sectional area of the main electrode portion may be smaller than the cross-sectional area of the sub-electrode portion.
[0014] Further, the dielectric layer and the second internal electrode can extend from the first surface to at least a part of the outer portion on the sub-electrode portion.
[0015] Further, a protective layer can be located between the second internal electrode located on the outer portion of the sub-electrode portion and the main electrode portion.
[0016] Further, it further includes a protective layer located on the first surface and the second surface and at least partially covering the second internal electrode, and the protective layer can have openings exposing at least a part of the first external electrode and at least a part of the second external electrode.
[0017] Further, the body can include anodizing aluminum oxide (AAO).
[0018] A method for manufacturing a capacitor according to an embodiment includes preparing a body having a through-hole penetrating from a first surface to a second surface, forming a first internal electrode on an inner surface of the body located in the through-hole, the first surface, and the second surface, forming a sub-electrode portion connected to the first internal electrode, forming a dielectric layer on the first internal electrode, forming a second internal electrode on the dielectric layer, disposing a main electrode portion on the sub-electrode portion, forming a first external electrode together with the sub-electrode portion, and forming a second external electrode on the second internal electrode.
[0019] Further, forming the sub-electrode portion can include forming a mask on the first surface of the body, etching the mask to expose a part of the first internal electrode, and applying a conductive material to a position where the mask has been etched.
[0020] Further, forming the dielectric layer can include covering a portion of the sub-electrode portion exposed between the through-holes with a dielectric.
[0021] Also, forming the dielectric layer includes covering the sub - electrode portion on the first surface with a dielectric, and forming the second internal electrode can include covering the dielectric on the sub - electrode portion with a conductive material.
[0022] Also, forming the main - electrode portion can include removing at least a part of the dielectric layer and the second internal electrode formed on the sub - electrode portion, and depositing a conductive material on the portion of the sub - electrode portion from which the dielectric layer and the second internal electrode have been removed.
[0023] Also, forming the second internal electrode can include filling the internal space of the body formed along the through - hole with a conductive material.
[0024] A capacitor combination according to an embodiment includes a body having a through - hole penetrating from a first surface to a second surface, an inner surface of the body located in the through - hole, the first surface, and a first internal electrode located on the first surface, a dielectric layer located on the first internal electrode, a second internal electrode located on the dielectric layer, a first external electrode located on the first surface and connected to the first internal electrode, and a second external electrode located on the second surface and connected to the second internal electrode. In a first capacitor and a second capacitor each including these, the first external electrode of the first capacitor and the second external electrode of the second capacitor are connected.
[0025] Also, the second external electrode is also located on the first surface, and the first external electrode is also located on the second surface. The first external electrode on the first surface of the first capacitor and the second external electrode on the second surface of the second capacitor can be bonded, and the second external electrode on the first surface of the first capacitor and the first external electrode on the second surface of the second capacitor can be bonded.
[0026] Also, the second external electrode is located on the first surface, and the first external electrode is located on the second surface. The first external electrode on the first surface of the first capacitor and the first external electrode on the second surface of the second capacitor can be connected, and the second external electrode on the first surface of the first capacitor and the second external electrode on the second surface of the second capacitor can be connected.
Advantages of the Invention
[0027] According to at least one of the embodiments, a plurality of capacitors can be stacked to provide a high capacitance.
Brief Description of the Drawings
[0028]
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Best Mode for Carrying Out the Invention
[0029] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those having ordinary knowledge in the technical field to which the present invention pertains can easily implement it. In order to clearly explain the present invention in the drawings, parts that are unnecessary for the explanation are omitted, and the same reference numerals are given to the same or similar components throughout the specification. Also, in the accompanying drawings, some components are exaggerated, omitted, or schematically illustrated, and the size of each component does not fully reflect the actual size.
[0030] The accompanying drawings are merely provided to facilitate understanding of the embodiments disclosed in this specification, and the technical idea disclosed in this specification is not limited by the accompanying drawings, and should be understood to include all modifications, equivalents, and alternatives included in the idea and technical scope of the present invention.
[0031] Terms including ordinal numbers such as first, second, etc. can be used to describe various components, but the components are not limited by the terms. The terms are used only for the purpose of distinguishing one component from another.
[0032] Also, when a part such as a layer, film, region, or plate is "on" or "above" another part, this includes both the case where it is directly above the other part and the case where there are additional parts in between. Conversely, when a part is "directly above" another part, it means there are no other parts in between. Also, being "on" or "above" a reference part means being located above or below the reference part, and does not necessarily mean being located "on" or "above" in the direction opposite to gravity.
[0033] Throughout the specification, terms such as "comprising" or "having" are to be construed as specifying the presence of the features, numbers, steps, actions, components, parts, or combinations thereof set forth therein, and are not to be construed as precluding the presence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof. Thus, when a part "comprises" a certain component, this means that, unless otherwise stated to the contrary, it can further include other components rather than excluding other components.
[0034] Throughout the specification, when referring to "in a plane", it means when viewing the target part from above, and when referring to "in a cross-section", it means when viewing the cross-section obtained by vertically cutting the target part from the side.
[0035] Throughout the specification, when referring to "connected", this does not only mean that two or more components are directly connected, but can also mean that two or more components are indirectly connected by other components, not only physically connected but also electrically connected, or can mean being integrated although referred to by different names depending on their positions and functions.
[0036] Figure 1 is a perspective view showing a body according to an embodiment, and Figure 2 is a cross-sectional view showing a capacitor to which the body of Figure 1 is coupled.
[0037] Referring to FIGS. 1 and 2, the capacitor 10 according to this embodiment can include a body 100, a capacitor portion 200, a first external electrode 300, a second external electrode 400, and a protective layer 500.
[0038] First, in order to clearly explain this embodiment, directions are defined. The DRH axis, DRL axis, and DRW axis shown in the drawings respectively indicate axes showing the thickness direction, length direction, and width direction of the capacitor 10. The thickness direction (DRH axis direction) can be a direction perpendicular to the upper surface or the lower surface of the body 100. For example, the thickness direction (DRH axis direction) can be a direction parallel to the direction in which the through-hole 110 formed in the body 100 extends. The length direction (DRL axis direction) is a direction parallel to the upper surface or the lower surface of the body 100 and can be a direction intersecting (or orthogonal) to the thickness direction (DRH axis direction). For example, the length direction (DRL axis direction) can be a direction in which the first external electrode 300 and the second external electrode 400 face each other. The width direction (DRW axis direction) is a direction parallel to the upper surface or the lower surface of the body 100 and can be a direction intersecting (or orthogonal) to the thickness direction (DRH axis direction) and the length direction (DRL axis direction) simultaneously.
[0039] The body 100 may be in a hexahedral shape, but its shape is not limited thereto. The body 100 has a first surface 100a and a second surface 100b located in opposite directions. The first surface 100a and the second surface 100b can face each other in the thickness direction (DRH axis direction). Also, the first surface 100a and the second surface 100b can be formed side by side in the length direction (DRL axis direction) and / or the width direction (DRW axis direction). In FIG. 1, the first surface 100a is shown as being located on the upper side and the second surface 100b is shown as being located on the lower side. Accordingly, in this embodiment, for convenience of explanation, the first surface 100a is regarded as the upper surface, the second surface 100b is regarded as the lower surface, and the direction in which the first surface 100a and the second surface 100b face each other is regarded as the vertical direction. However, the positions of the first surface 100a and the second surface 100b are not limited thereto.
[0040] The body 100 is provided with an insulating material. A plurality of thru holes 110 penetrating from the first surface 100a to the second surface 100b are formed in the body 100. The thru hole 110 can be a columnar space connecting the first surface 100a and the second surface 100b. For example, the body 100 can be manufactured with porous anodizing aluminum oxide (AAO), and the thru hole 110 can be formed by fine pores formed in the anodizing aluminum oxide. The aspect-ratio of the thru hole 110 may be 2000 to 3000, and the interval between the thru holes 110 may be about several tens to several hundreds of nanometers. However, the aspect-ratio of the thru hole 110 and the interval between the thru holes 110 are not limited thereto. For example, the size, interval, and depth of the thru hole 110 can be adjusted by changing conditions such as anodizing voltage, type and concentration of electrolyte, and temperature.
[0041] The capacitor unit 200 includes a first internal electrode 210, a dielectric layer 220, and a second internal electrode 230.
[0042] The first internal electrode 210 can be disposed on the inner surface of the body 100 located in the through-hole 110. That is, the first internal electrode 210 can be in contact with the surface of the through-hole 110 formed inside the body 100. Further, the first internal electrode 210 can be located in the section between the through-holes 110 adjacent to each other on the first surface 100a of the body 100, and can be located in the section between the through-holes 110 adjacent to each other on the second surface 100b of the body 100. Therefore, the regions of the first internal electrode 210 located on the mutually adjacent through-holes 110 can be connected to each other by the regions located on the first surface 100a and the second surface 100b of the body 100. Also, the regions of the first internal electrode 210 located on the first surface 100a and the second surface 100b of the body 100 can be connected to each other by the region located on the inner surface of the body 100 along the through-hole 110. That is, the second internal electrodes 230 located on the through-hole 110, the second internal electrodes 230 located on the first surface 100a, and the second internal electrodes 230 located on the second surface 100b can be connected to each other. The first internal electrode 210 may be made of a metallic material.
[0043] The dielectric layer 220 is located on the first internal electrode 210. That is, the dielectric layer 220 is located on the first internal electrode 210 formed inside the body 100 along the through-hole 110 and can be in contact with the surface of the first internal electrode 210. Also, the dielectric layer 220 can be located on the first internal electrode 210 formed on the first surface 100a and the second surface 100b. That is, the dielectric layer 220 can be in contact with the surfaces of the first internal electrodes 210 on the first surface 100a and the second surface 100b.
[0044] The dielectric layer 220 can be formed of ZAZ which is a ZrO2 - Al2O3 - ZrO2 composite layer. Also, the dielectric layer 220 can be formed of any one of metal oxides such as Al2O3, ZrO2, HfO2, etc. Further, the dielectric layer 220 can be formed of a combination of metal oxides such as Al2O3, ZrO2, HfO2, etc.
[0045] The second internal electrode 230 is located on the dielectric layer 220. That is, the second internal electrode 230 can be located on the dielectric layer 220 formed inside the body 100 along the through-hole 110. That is, the second internal electrode 230 can contact the surface of the dielectric layer 220 formed inside the body 100. Also, the second internal electrode 230 can be located on the dielectric layer 220 formed on the first surface 100a and the second surface 100b of the body 100. That is, the second internal electrode 230 can contact the surface of the dielectric layer 220 formed on the first surface 100a and the second surface 100b. Therefore, the second internal electrode 230 can face the first internal electrode 210 with the dielectric layer 220 interposed therebetween at the through-hole 110, the first surface 100a, and the second surface 100b. That is, a dielectric layer 220 is interposed between the first internal electrode 210 and the second internal electrode 230, and the first internal electrode 210 and the second internal electrode 230 can be insulated by the dielectric layer 220. The second internal electrode 230 can be formed to fill the inner space of the body 100 formed along the through-hole 110. That is, the inner space of the body 100 formed along the through-hole 110 is partially filled by the first internal electrode 210 and the dielectric layer 220, and the remaining inner space not filled by the first internal electrode 210 and the dielectric layer 220 is filled by the second internal electrode 230. The second internal electrode 230 can be located in the section between the through-holes 110 adjacent to each other on the first surface 100a of the body 100, and can be located in the section between the through-holes 110 adjacent to each other on the second surface 100b of the body 100. Therefore, the regions of the second internal electrode 230 located on the adjacent through-holes 110 can be connected to each other by the regions located on the first surface 100a and the second surface 100b of the body 100. Also, the regions of the second internal electrode 230 located on the first surface 100a and the second surface 100b of the body 100 can be connected to each other by the region located on the through-hole 110. That is, the second internal electrode 230 located on the through-hole 110, the second internal electrode 230 located on the first surface 100a, and the second internal electrode 230 located on the second surface 100b can be connected to each other. The second internal electrode 230 may be made of a metallic material.
[0046] The first external electrode 300 is connected to the first internal electrode 210. The first external electrode 300 is arranged to contact the first internal electrode 210 located on the first surface 100a of the body 100 and can be connected to the first internal electrode 210. Also, the first external electrode 300 is arranged to contact the first internal electrode 210 located on the second surface 100b of the body 100 and can be connected to the first internal electrode 210. The first external electrode 300 can be arranged to overlap at least one through-hole 110. That is, a part of the first external electrode 300 can overlap the through-hole 110.
[0047] The first external electrode 300 can include a sub-electrode portion 310 and a main electrode portion 320.
[0048] The sub-electrode portion 310 is connected to the first internal electrode 210. The sub-electrode portion 310 can be positioned to contact the first internal electrode 210 on the first internal electrode 210 where at least a part of the region is located on the first surface 100a of the body 100. Also, the sub-electrode portion 310 can be positioned on the first internal electrode 210 where at least a part of the region is located on the second surface 100b of the body 100. The sub-electrode portion 310 can be positioned to contact the first internal electrode 210 on the first internal electrode 210 where at least a part of the region is located on the second surface 100b of the body 100. The dielectric layer 220 can contact the side surface of the sub-electrode portion 310, and the second internal electrode 230 can be located on the dielectric layer 220 on the side surface of the sub-electrode portion 310. The dielectric layer 220 and the second internal electrode 230 located on the side surface of the sub-electrode portion 310 can be connected to the dielectric layer 220 and the second internal electrode 230 located on the first surface 100a or the second surface 100b respectively.
[0049] The main electrode portion 320 is connected to the sub-electrode portion 310. The main electrode portion 320 is located on the sub-electrode portion 310 and can contact the sub-electrode portion 310. The main electrode portion 320 can face the body 100 with the sub-electrode portion 310 interposed therebetween.
[0050] On the sub - electrode portion 310, a dielectric layer 220 and a second internal electrode 230 can be formed at the edge portion. Therefore, the main - electrode portion 320 can have a smaller area in the planar direction (DRL - DRW direction) than the sub - electrode portion 310. That is, based on the plane parallel to the first surface 100a, the cross - sectional area of the main - electrode portion 320 can be smaller than the cross - sectional area of the sub - electrode portion 310. In other words, when viewed from above, the main - electrode portion 320 is included within the sub - electrode portion 310. On the sub - electrode portion 310, the dielectric layer 220 and the second internal electrode 230 can be arranged so as to be separated from the main - electrode portion 320. On the sub - electrode portion 310, a protective layer 500 is interposed between the dielectric layer 220 and the main - electrode portion 320, and between the second internal electrode 230 and the main - electrode portion 320. The second internal electrode 230 and the main - electrode portion 320 on the sub - electrode portion 310 can be insulated by the interposed protective layer 500. The dielectric layer 220 and the second internal electrode 230 located at the edge portion on the sub - electrode portion 310 can be connected to the dielectric layer 220 and the second internal electrode 230 on the side surface of the sub - electrode portion 310, respectively.
[0051] The second external electrode 400 is connected to the second internal electrode 230. The second external electrode 400 can be located on the second internal electrode 230 located on the first surface 100a of the body 100. The second external electrode 400 can be in contact with at least a part of the second internal electrodes 230 located on the first surface 100a of the body 100. Also, the second external electrode 400 can be located on the second internal electrode 230 located on the second surface 100b of the body 100. The second external electrode 400 can be in contact with at least a part of the second internal electrodes 230 located on the second surface 100b of the body 100. The second external electrode 400 can have a portion overlapping with the through - hole 110. That is, the second external electrode 400 can be arranged so as to overlap at least one through - hole 110 in the thickness direction (DRH direction).
[0052] The protective layer 500 can be located on the capacitor portion 200 of the first surface 100a and the second surface 100b of the body 100. The protective layer 500 can include an insulating material such as a solder resist. The protective layer 500 can cover the second internal electrode 230. The protective layer 500 can have an opening (OP) that exposes at least a part of the first external electrode 300 and at least a part of the second external electrode 400. Also, the protective layer 500 can cover at least a part of the surface of the sub - electrode portion 310. A part of the protective layer 500 can be located on the side surface of the main electrode portion 320. Further, a part of the protective layer 500 can be located at the end of the second external electrode 400 and the end of the dielectric layer 220 and can be in contact with the end of the second external electrode 400 and the end of the dielectric layer 220. The protective layer 500 located between the end of the second external electrode 400 and the side surface of the main electrode portion 320 can electrically insulate the first internal electrode 210 and the second external electrode 400.
[0053] In the above, it has been described that the first external electrode 300 and the first internal electrode 210 are connected, and the second external electrode 400 and the second internal electrode 230 are connected. However, the connection relationship and configuration of the first and second external electrodes 400 and the first and second internal electrodes are not limited by these terms. That is, the second external electrode 400 can include the sub - electrode portion 310 connected to the first internal electrode 210 and the main electrode portion 320 located on the sub - electrode portion 310, and the first external electrode 300 can be connected to the second internal electrode.
[0054] FIG. 3 is a cross - sectional view showing the connection of the capacitor 10 shown in FIG. 2, and FIG. 4 is a cross - sectional view showing another example of capacitor connection.
[0055] Referring to FIG. 3, for the capacitor 10 according to this embodiment, two or more capacitors 10 can be connected in parallel. To connect the capacitors 10 in parallel, the first external electrode 300a of the first capacitor 10a can be connected to the second external electrode 400b of the second capacitor 10b, and the second external electrode 400a of the first capacitor 10a can be connected to the first external electrode 300b of the second capacitor 10b. By stacking and joining the first capacitor 10a and the second capacitor 10b as described above, two or more capacitors can be connected in parallel. That is, the first external electrode 300a located on the first surface 100a of the first capacitor 10a and the second external electrode 400b located on the second surface 100b of the second capacitor 10b are coupled, and the second external electrode 400a located on the first surface 100a of the first capacitor 10a and the first external electrode 300b located on the second surface 100b of the second capacitor 10b can be coupled. By the said coupling, the first capacitor 10a and the second capacitor 10b can be connected in parallel.
[0056] Referring to FIG. 4, for the capacitor 10 according to this embodiment, two or more capacitors 10 can be connected in parallel in a manner different from that shown in FIG. 3. To connect the capacitors 10 in parallel, the first external electrode 300a of the first capacitor 10a can be connected to the first external electrode 300c of the third capacitor 10c, and the second external electrode 400a of the first capacitor 10a can be connected to the second external electrode 400c of the third capacitor 10c. By stacking and joining the first capacitor 10a and the third capacitor 10c as described above, two or more capacitors can be connected in parallel. That is, the first external electrode 300a located on the first surface 100a of the first capacitor 10a and the first external electrode 300c located on the second surface 100b of the third capacitor 10c are coupled, and the second external electrode 400a located on the first surface 100a of the first capacitor 10a and the second external electrode 400c located on the second surface 100b of the third capacitor 10c can be coupled. By the said coupling, the first capacitor 10a and the third capacitor 10c can be connected in parallel.
[0057] In FIGS. 3 and 4, an example of connecting two capacitors 10 in parallel is shown. However, it is also possible to connect three or more capacitors 10 in parallel in the same manner. It is also possible to connect them in parallel by using a combination of the connection methods shown in FIGS. 3 and 4.
[0058] As described above, by connecting two or more capacitors 10 in parallel, the capacitance can be increased without increasing the thickness of the capacitor 10. Also, even if the aspect ratio of the capacitor 10 is lowered, the capacitance can be increased. Therefore, by manufacturing the low aspect ratio capacitor 10, atomic layer deposition in the manufacturing process can be effectively performed. Also, when connecting in the manner shown in FIG. 3 or FIG. 4, since both are parallel connections, they can be easily connected in parallel without distinguishing between the first external electrode and the second external electrode.
[0059] Hereinafter, with reference to FIGS. 1 and 2 and FIGS. 5 to 14, a method for manufacturing the capacitor 10 according to an embodiment will be described.
[0060] FIGS. 5 to 14 are cross-sectional views showing a method for manufacturing a capacitor according to an embodiment.
[0061] Referring to FIG. 5, a body 100 having a plurality of through-holes 110 is prepared. The prepared body 100 may be in a state where a plurality of through-holes 110 are formed. The body 100 can be formed of anodic aluminum oxide (AAO). The plurality of through-holes 110 may be fine pores formed in the body 100 by an anodization method.
[0062] Referring to FIG. 6, a first internal electrode 210 is formed of a metallic material on the body 100. The first internal electrode 210 is formed on the inner surface of the body 100 located in the through-hole 110. Also, the first internal electrode 210 is formed on the first surface 100a and the second surface 100b of the body 100. The first internal electrode 210 formed on the inner surface of the body 100 along the through-hole 110, the first internal electrode 210 formed on the first surface 100a of the body 100, and the first internal electrode 210 formed on the second surface 100b can be connected to each other. The first internal electrode 210 can be formed by the Atomic Layer Deposition (ALD) method. For example, the first internal electrode 210 can be formed of a metallic material such as titanium nitride (TiN). The first internal electrode 210 is formed with a thickness of 2.9 nm to 3.1 nm, but is not limited thereto.
[0063] Referring to FIGS. 7 to 9, a sub-electrode portion 310 is formed on the first surface 100a and / or the second surface 100b of the body 100. To form the sub-electrode portion 310, first, a mask (MK) is formed on the first surface 100a and / or the second surface 100b of the body 100. To form the mask (MK), a photoresist is applied on the first surface 100a and / or the second surface 100b of the body 100 and then a part thereof is etched. When the photoresist is etched, the first internal electrode 210 located on the first surface 100a and / or the second surface 100b of the body 100 is exposed. The position where the photoresist is etched can include the region where the through-hole 110 is located. The sub-electrode portion 310 is formed at the portion where the photoresist is etched. The sub-electrode portion 310 can be formed by applying a conductive material such as Cu, Sn, Au. After the sub-electrode portion 310 is formed, the remaining photoresist is removed.
[0064] Referring to FIG. 10, a dielectric is applied to form a dielectric layer 220. The dielectric can cover the first internal electrode 210 on the first surface 100a and the second surface 100b of the body 100, and can cover the first internal electrode 210 formed on the inner surface of the body 100 along the through-hole 110. Further, the dielectric can cover the sub-electrode portion 310 that contacts the first internal electrode 210 on the first surface 100a and the second surface 100b of the body 100. Also, the dielectric can cover the sub-electrode portion 310 (EH in FIG. 8) exposed between the through-holes 110. Thereby, the dielectric layer 220 can cover the first internal electrode 210 and the sub-electrode portion 310 on the first surface 100a, the second surface 100b, and the through-hole 110 of the body 100. For example, the dielectric can be deposited by Atomic Layer Deposition (ALD).
[0065] Referring to FIG. 11, a second internal electrode 230 is formed on the dielectric layer 220. The second internal electrode 230 can cover the dielectric layer 220 on the first surface 100a and the second surface 100b of the body 100. The second internal electrode 230 can cover the dielectric layer 220 formed on the inner surface of the body 100 along the through-hole 110. The second internal electrode 230 can fill the inner space of the body 100 formed by the through-hole 110. As a result, since there is no empty space inside the body 100 with the second internal electrode 230, it is possible to prevent the generation of voids inside the through-hole 110. The first surface 100a, the second surface 100b of the body 100, and the second internal electrode 230 on the through-hole 110 can be formed to be connected to each other. Since a dielectric layer 220 is formed on the portion of the first external electrode 300 that overlaps the through-hole 110, the second internal electrode 230 formed in the through-hole 110 and the first internal electrode 210 can be insulated. Also, although the second internal electrode 230 can cover the first external electrode 300 located on the first surface 100a and the second surface 100b of the body 100, since the dielectric layer 220 already formed on the first external electrode 300 is interposed between the second internal electrode 230, it does not contact the first external electrode 300. Therefore, the second internal electrode 230 and the first external electrode 300 can be insulated. The second internal electrode 230 can be formed of a conductive material such as titanium nitride (TiN). For example, the second internal electrode 230 can be formed by atomic layer deposition (ALD). After atomic layer deposition is performed to form the second internal electrode 230, an additional process of filling the inside of the through-hole 110 can be performed. The additional process can be performed using a conductive material, and the second internal electrode 230 can be formed together with the region where the additional process is performed by atomic layer deposition. However, the method of forming the second internal electrode 230 is not limited to this.
[0066] Referring to FIG. 12, on the first surface 100a and the second surface 100b of the body 100, a part of the second internal electrode 230 and the dielectric layer 220 that overlap with the first internal electrode 210 are etched. That is, a part of the dielectric layer 220 and the second internal electrode 230 formed on the first internal electrode 210 are removed. By this etching, at least a part of the portion of the first internal electrode 210 on the first surface 100a of the body 100 that faces the first surface 100a of the body 100 is exposed. Also, by this etching, at least a part of the portion of the first internal electrode 210 on the second surface 100b of the body 100 that faces the second surface 100b of the body 100 is exposed.
[0067] Referring to FIG. 13, a protective layer 500 is formed on the first surface 100a and the second surface 100b of the body 100. The protective layer 500 can be formed so as to cover the second internal electrode 230 formed on the first surface 100a and the second surface 100b of the body 100. Also, the protective layer 500 can be formed so as to cover the first internal electrode 210 exposed by the etching of the second internal electrode 230 and the dielectric layer 220. The protective layer 500 can be formed of an insulating material such as a solder resist.
[0068] Referring to FIG. 14, the protective layer 500 is etched to form an opening (OP). The opening (OP) can be formed so as to overlap a part of the through-hole 110. Due to the opening (OP) of the protective layer 500, a part of the second internal electrode 230 on the first surface 100a and the second surface 100b can be exposed. Also, due to the opening (OP) of the protective layer 500, a part of the sub-electrode portion 310 can be exposed. The opening (OP) can be formed by a lithography process.
[0069] Referring back to FIG. 2, the main electrode portion 320 is formed on the portion where the protective layer 500 is etched and the sub-electrode portion 310 is exposed. That is, the main electrode portion 320 can be formed by depositing a conductive material on the portion where the dielectric layer 220 and the second internal electrode 230 are removed on the sub-electrode portion 310.
[0070] Both the sub-electrode portion 310 and the main electrode portion 320 constitute the first external electrode 300. Also, the second external electrode 400 is formed on the portion where the protective layer 500 is etched and the second internal electrode 230 is exposed. The main electrode portion 320 and the second external electrode 400 can be formed of a conductive material such as Cu, Sn, Au, etc.
[0071] FIG. 15 is a cross-sectional view schematically showing a capacitor 20 according to another embodiment. The capacitor 20 according to this embodiment is similar to the embodiment described with reference to FIGS. 1 and 2. Specific descriptions of the same components are omitted.
[0072] Referring to FIG. 15, in the capacitor 20 according to this embodiment, the second external electrode 700 is disposed on the first surface 100a of the body 100, and the first external electrode is disposed on the second surface 100b of the body 100. That is, the first external electrode 600 can be located only on the second surface 100b of the body 100, and the second external electrode 700 can be located only on the first surface 100a of the body 100. The first external electrode 600 can be widely formed on the second surface 100b of the body 100. Thereby, the first external electrode 600 can be connected to the second external electrodes 700 of a number of different capacitors. Also, the second external electrode 700 can be widely formed on the first surface 100a of the body 100. Thereby, the second external electrode 700 can be connected to the first external electrodes 600 of a number of different capacitors.
[0073] FIG. 16 is a cross-sectional view schematically showing a connection of the capacitors shown in FIG. 15.
[0074] Referring to FIG. 16, the capacitors according to this embodiment can have two or more capacitors connected in series. To connect the capacitors in series, the second external electrode 700a of the first capacitor 20a can be connected to the first external electrode 600b of the second capacitor 20b. By stacking and joining the first capacitor 20a and the second capacitor 20b as described above, two or more capacitors can be connected in series. Also, by connecting still another capacitor to the first capacitor 20a and / or the second capacitor 20b, three or more capacitors can be connected in series. Connecting a large number of capacitors in series can enhance the withstand voltage.
[0075] As described above, the preferred embodiments of the present invention have been described. However, the present invention is not limited thereto, and various modifications can be made and implemented within the scope of the claims, the detailed description of the invention, and the accompanying drawings, and it is natural that this also belongs to the scope of the present invention.
Explanation of Reference Numerals
[0076] 10: Capacitor 100: Body 110: Through-hole 210: First internal electrode 220: Dielectric layer 230: Second internal electrode 300: First external electrode 310: Sub-electrode portion 320: Main electrode portion 400: Second external electrode 500: Protective layer
Claims
1. A body having a through-hole penetrating from a first surface to a second surface, a first internal electrode located on the inner surface of the body positioned in the through-hole, the first surface, and the second surface, a dielectric layer located on the first internal electrode, a second internal electrode located on the dielectric layer, a first external electrode located on the first surface and connected to the first internal electrode, and a capacitor including a second external electrode located on the second surface and connected to the second internal electrode.
2. The first internal electrode located on the inner surface of the body, the first internal electrode located on the first surface, and the first internal electrode located on the second surface are connected to each other. The capacitor according to Claim 1.
3. The dielectric layer is respectively located on the inner surface of the body, the first surface, and the second surface, The second internal electrode is respectively located on the inner surface of the body, the first surface, and the second surface. The capacitor according to Claim 1.
4. The second internal electrodes respectively located on the inner surface of the body, the first surface, and the second surface are connected to each other. The capacitor according to Claim 3.
5. The second external electrode is also located on the first surface, and The first external electrode is also located on the second surface. The capacitor according to Claim 1.
6. The second internal electrode fills the inner space of the body formed by the through-hole. The capacitor according to Claim 1.
7. The first external electrode includes a sub-electrode portion in contact with the first internal electrode and a main electrode portion in contact with the sub-electrode portion, Based on a plane parallel to the first surface, the cross-sectional area of the main electrode portion is smaller than the cross-sectional area of the sub-electrode portion. The capacitor according to Claim 1.
8. The dielectric layer and the second internal electrode extend from the first surface to at least a part of the outer portion on the sub-electrode portion. The capacitor according to Claim 7.
9. A protective layer is located between the second internal electrode located on the outer portion of the sub-electrode portion and the main electrode portion. The capacitor according to Claim 8.
10. Further includes a protective layer located on the first surface and the second surface and at least partially covering the second internal electrode, The protective layer has an opening exposing at least a part of the first external electrode and at least a part of the second external electrode. The capacitor according to Claim 1.
11. The capacitor according to claim 1, wherein the body contains anodizing aluminum oxide (AAO).
12. Prepare a body having a through-hole penetrating from a first surface to a second surface, and form a first internal electrode on an inner surface of the body located in the through-hole, the first surface, and the second surface. Form a sub-electrode portion connected to the first internal electrode. Form a dielectric layer on the first internal electrode. Form a second internal electrode on the dielectric layer. Dispose a main electrode portion on the sub-electrode portion, and form a first external electrode together with the sub-electrode portion. A method for manufacturing a capacitor, comprising forming a second external electrode on the second internal electrode.
13. Forming the sub-electrode portion includes: Forming a mask on a first surface of the body. Etching the mask to expose a part of the first internal electrode. The method for manufacturing a capacitor according to claim 12, comprising applying a conductive material to a position where the mask has been etched.
14. Forming the dielectric layer includes: Covering a portion of the sub-electrode portion exposed between the through-holes with a dielectric. The method for manufacturing a capacitor according to claim 12.
15. Forming the dielectric layer includes covering the sub-electrode portion on the first surface with a dielectric, and Forming the second internal electrode includes covering the dielectric on the sub-electrode portion with a conductive material. The method for manufacturing a capacitor according to claim 12.
16. Forming the main electrode portion includes: Removing at least a part of the dielectric layer and the second internal electrode formed on the sub-electrode portion. The method for manufacturing a capacitor according to claim 15, comprising depositing a conductive material on a portion of the sub-electrode portion where the dielectric layer and the second internal electrode have been removed.
17. Forming the second internal electrode includes filling an internal space of the body formed along the through-hole with a conductive material. The method for manufacturing a capacitor according to claim 12.
18. A body having a through-hole penetrating from a first surface to a second surface. A first internal electrode located on an inner surface of the body located in the through-hole, the first surface, and the second surface. A dielectric layer located on the first internal electrode. A second internal electrode located on the dielectric layer. A first external electrode located on the first surface and connected to the first internal electrode, and In the first capacitor and the second capacitor, each including a second external electrode located on the second surface and connected to the second internal electrode, A capacitor combination in which the first external electrode of the first capacitor is connected to the second external electrode of the second capacitor.
19. The second external electrode is also located on the first surface, and the first external electrode is also located on the second surface, The first external electrode on the first surface of the first capacitor is coupled to the second external electrode on the second surface of the second capacitor, and The capacitor combination according to claim 18, wherein the second external electrode on the first surface of the first capacitor is coupled to the first external electrode on the second surface of the second capacitor.
20. The second external electrode is also located on the first surface, and the first external electrode is also located on the second surface, The first external electrode on the first surface of the first capacitor is coupled to the first external electrode on the second surface of the second capacitor, and The capacitor combination according to claim 18, wherein the second external electrode on the first surface of the first capacitor is coupled to the second external electrode on the second surface of the second capacitor.