Cooler, semiconductor device, and power conversion device

Abstract

To efficiently cool a semiconductor module while the semiconductor module is in operation.SOLUTION: A cooler includes a plurality of multi-hole tubes spaced apart in a first direction and having a flow passage extending in a second direction intersecting the first direction, a first header to which one of each of the plurality of multi-hole tubes is connected, and a second header to which the other of the plurality of multi-hole tubes is connected, and each of the first header and the second header has a fixing portion fixed to an installation target on a wall portion extending in the first direction and the second direction.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present disclosure relates to a cooler, a semiconductor device, and a power conversion device.

Background Art

[0002] A semiconductor module including a power semiconductor or the like generates heat when it operates. Therefore, in an electronic device using the semiconductor module, the semiconductor module is cooled to suppress a temperature rise of the semiconductor module.

[0003] Patent Document 1 discloses a power conversion device including an electronic device including a semiconductor module, a refrigerant flow path through which a refrigerant flows, and a refrigerant pipe portion having a contact surface portion that is alternately laminated with the semiconductor module and through which the refrigerant flows and that can come into contact with a main surface of the semiconductor module to perform heat exchange.

[0004] Patent Document 2 discloses a power conversion device having a cooling water channel capable of accommodating fin portions in a case of the power conversion device, and an insertion port through which the aforementioned power module can be inserted is provided on a side surface of the cooling water channel.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0006] In an electronic device using a semiconductor module, it is required to efficiently cool the semiconductor module while the semiconductor module is operating.

[0007] The present disclosure provides a technique for efficiently cooling a semiconductor module while the semiconductor module is operating.

Means for Solving the Problem

[0008] According to one aspect of the present disclosure, a plurality of multi-hole tubes having flow paths arranged side by side at intervals in a first direction and extending in a second direction intersecting the first direction, a first header to which one of each of the plurality of multi-hole tubes is connected, and a second header to which the other of each of the plurality of multi-hole tubes is connected, and each of the first header and the second header is provided with a cooler having a fixing portion fixed to an object to be installed on a wall portion extending in the first direction and the second direction.

Effect of the Invention

[0009] According to the technology of the present disclosure, the semiconductor module can be efficiently cooled while the semiconductor module is operating.

Brief Description of the Drawings

[0010]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

Figure 14

Figure 15

Figure 16

Figure 17

DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, each embodiment of the present invention will be described with reference to the accompanying drawings. Note that, regarding the description in the specification and drawings according to each embodiment, for components having substantially the same or corresponding functional configurations, the same reference numerals may be given to omit redundant descriptions. Also, for ease of understanding, the scales of each part in the drawings may be different from the actual ones.

[0012] In directions such as parallel, right angle, orthogonal, horizontal, vertical, up and down, left and right, a deviation that does not impair the effects of the embodiment is allowed. The shape of the corner is not limited to a right angle and may be rounded in an arc shape. Parallel, right angle, orthogonal, horizontal, and vertical may include substantially parallel, substantially right angle, substantially orthogonal, substantially horizontal, and substantially vertical.

[0013] <<POWER CONVERSION DEVICE>> The power conversion device according to this embodiment will be described. FIGS. 1 and 2 are perspective views of the power conversion device according to this embodiment. FIG. 2 is a view in which the cover 51 of the power conversion device 5 in FIG. 1 is removed.

[0014] The power conversion device 5 converts, for example, DC power into three-phase AC power of a predetermined frequency. The power conversion device 5 is mounted on, for example, an automobile or the like.

[0015] The power conversion device 5 includes a cover 51 and a case 52. The case 52 includes connectors 53 and 54 for connecting an external power source and load. Note that the combination of the cover 51 and the case 52 may be referred to as a housing 50.

[0016] Inside the cover 51 and the case 52, the power conversion device 5 includes a control board 55, a semiconductor device 1, and a capacitor 56.

[0017] The control board 55 controls the semiconductor device 1 so as to obtain a desired output. The semiconductor device 1 converts DC power into three-phase AC power based on a control signal from the control board 55. The capacitor 56 is a capacitor connected between a converter and an inverter.

[0018] Tubes 112 and 113 of the cooler 30 of the semiconductor device 1 project outside the cover 51 and the case 52. By allowing refrigerant to flow into one of the tubes 112 and 113 and flow out of the other, the refrigerant flows through the cooler 30. When the refrigerant flows through the cooler 30, the semiconductor package 20 is cooled.

[0019] <<First Embodiment>> ≪Semiconductor Device 1≫ FIG. 3 is a perspective view of the semiconductor device 1 according to the first embodiment. FIG. 4 is an exploded perspective view of the semiconductor device 1 according to the first embodiment. The semiconductor device 1 is, for example, a power converter that converts DC to AC and supplies power by using two semiconductor packages 20 for each phase of a three-phase motor. The semiconductor device 1 is used, for example, in a power conversion device that drives a motor.

[0020] Note that, for convenience of explanation, an XYZ orthogonal coordinate system may be set in the drawings. For the coordinate axes perpendicular to the drawing plane of the drawings, a cross mark in the circle of the coordinate axis indicates that the direction into the paper is positive, and a black dot in the circle indicates that the direction toward the front side with respect to the paper is positive. However, the coordinate system is defined for explanation purposes and does not limit the posture of the semiconductor device 1 or the like.

[0021] In the present disclosure, unless otherwise specified, the X-axis is the extending direction of each of the first multi-hole tube 30b1, the second multi-hole tube 30b2, and the third multi-hole tube 30b3 of the cooler 30. Further, the Y-axis is the direction in which the first multi-hole tube 30b1, the second multi-hole tube 30b2, and the third multi-hole tube 30b3 of the cooler 30 are adjacent to each other. Note that the Y-axis direction may be referred to as the vertical direction. The Z-axis is the direction perpendicular to the X-axis and the Y-axis.

[0022] The semiconductor device 1 includes a plurality of semiconductor packages 20 and a cooler 30.

[0023] The semiconductor device 1 of the present embodiment includes six semiconductor packages 20. Specifically, the semiconductor device 1 includes a semiconductor package 21, a semiconductor package 22, a semiconductor package 23, a semiconductor package 24, a semiconductor package 25, and a semiconductor package 26. In the following description, when it is not necessary to distinguish each of the semiconductor package 21, the semiconductor package 22, the semiconductor package 23, the semiconductor package 24, the semiconductor package 25, and the semiconductor package 26, they may be collectively referred to as the semiconductor package 20.

[0024] The semiconductor package 20 is arranged and held in three horizontal rows and two vertical tiers between the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 of the cooler 30, which will be described later. Refrigerant (hot refrigerant), for example, cooling water, is introduced into the cooler 30 from the refrigerant inlet 30ap1. Further, the refrigerant introduced into the cooler 30 is led out from the refrigerant outlet 30ap2. The semiconductor package 20 is cooled by exchanging heat with the cooling water flowing through the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3.

[0025] Between the first multi-hole pipe 30b1 and the second multi-hole pipe 30b2, semiconductor packages 21, 22, and 23 are provided in order from the side of the first header 30a. Further, between the second multi-hole pipe 30b2 and the third multi-hole pipe 30b3, semiconductor packages 24, 25, and 26 are provided in order from the side of the first header 30a.

[0026] Details of the semiconductor package 20 of the semiconductor device 1 and the cooler 30 will be described.

[0027] <Semiconductor Package 20> FIG. 5 is a top view of the semiconductor package 20 of the semiconductor device 1 according to the first embodiment. FIG. 6 is a bottom view of the semiconductor package 20 of the semiconductor device 1 according to the first embodiment.

[0028] The semiconductor package 20 is, for example, a so-called 2in1 semiconductor package in which two semiconductor elements constituting the upper and lower arms of one phase are packaged. Further, the semiconductor package 20 is a so-called double-sided cooling type semiconductor package. Inside the semiconductor package 20, semiconductor elements such as power transistors such as IGBT (Insulated Gate Bipolar Transistor) and FET (Field-Effect Transistor) are incorporated.

[0029] As for the built-in semiconductor element, it may be a power MOSFET (Metal Oxide Semiconductor Field Effect Transistor), a FWD (Free Wheeling Diode), or the like. Further, the semiconductor element to be mounted may be an RB-IGBT (Reverse Blocking-Insulated Gate Bipolar Transistor) in which the aforementioned IGBT and FWD are integrated on one chip. Still further, the semiconductor element to be mounted may be an RC-IGBT (Reverse Conducting-Insulated Gate Bipolar Transistor) in which the aforementioned IGBT and FWD are integrated on one chip.

[0030] The semiconductor package 20 includes a case 20d made of a resin having a substantially rectangular parallelepiped shape, for example, an epoxy resin or the like. The case 20d has an upper surface 20dA and a lower surface 20dB on the side opposite to the upper surface 20dA.

[0031] The semiconductor package 20 has current terminals 20a1, 20a2, and 20a3 and control terminals 20b1, 20b2, 20b3, and 20b4 on the side surface of the case 20d. The current terminals 20a1, 20a2, and 20a3 and the control terminals 20b1, 20b2, 20b3, and 20b4 protrude from the side surface of the case 20d of the semiconductor package 20.

[0032] The current terminals 20a1, 20a2, and 20a3 are terminals for passing current to a load, for example. The current terminals 20a1, 20a2, and 20a3 are formed of a conductive material. The control terminals 20b1, 20b2, 20b3, and 20b4 are terminals for controlling the current flowing through the load. The control terminals 20b1, 20b2, 20b3, and 20b4 are formed of a conductive material.

[0033] Further, the semiconductor package 20 has a heat sink 20c1 and a heat sink 20c2. For example, a power transistor incorporated in the semiconductor package 20 is a heat generating element and thus needs to be cooled. The heat sink 20c1 and the heat sink 20c2 are provided to dissipate heat from the heat generating element. The heat sink 20c1 and the heat sink 20c2 are formed of a material with high thermal conductivity, for example, a metal such as copper. The heat sink 20c1 and the heat sink 20c2 are thermally connected to the heat generating element. The heat sink 20c1 is provided on the upper surface 20dA of the case 20d. The heat sink 20c2 is provided on the lower surface 20dB of the case 20d.

[0034] <Cooler 30> FIG. 7 is a perspective view of the cooler 30 of the semiconductor device 1 according to the first embodiment. FIG. 8 is an exploded perspective view of the cooler 30 of the semiconductor device 1 according to the first embodiment.

[0035] The cooler 30 cools the semiconductor package 20. A refrigerant flows through the inside of the cooler 30. The cooler 30 cools the semiconductor package 20 by exchanging heat between the refrigerant (for example, cooling water) flowing through the first multi-hole tube 30b1, the second multi-hole tube 30b2, and the third multi-hole tube 30b3 and the semiconductor package 20. Note that the refrigerant is not limited to water and may be a liquid containing antifreeze.

[0036] The cooler 30 includes a first header 30a, a first multi-hole tube 30b1, a second multi-hole tube 30b2, and a third multi-hole tube 30b3, and a second header 30c. The second header 30c is provided at a distance from the first header 30a in the X-axis direction. The first multi-hole tube 30b1, the second multi-hole tube 30b2, and the third multi-hole tube 30b3 are provided at a predetermined interval in the Y-axis direction, that is, in a direction intersecting the X-axis direction, specifically, an interval capable of holding the semiconductor package 20.

[0037] Note that the X-axis direction is an example of the second direction.

[0038] The first header 30a is connected to one end of each of the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3. Specifically, the first header 30a is connected to the -X side end of each of the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3. The second header 30c is connected to the other end of each of the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3. Specifically, the second header 30c is connected to the +X side end of each of the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3.

[0039] [First header 30a] First, the first header 30a will be described. Fig. 9 is a perspective view of the first header 30a of the cooler 30 of the semiconductor device 1 of the first embodiment. The first header 30a introduces the refrigerant into the inside of the cooler 30 and discharges it to the outside of the cooler 30. The first header 30a is a hollow rectangular parallelepiped formed by the wall portion 30aA, the wall portion 30aB, the wall portion 30aC, the wall portion 30aD, the wall portion 30aE, and the wall portion 30aF.

[0040] A part of the wall 30aE, which is the wall on the +X side of the first header 30a, is released. Specifically, the first header 30a has an opening 30ah1, an opening 30ah2, and an opening 30ah3 in the wall 30aE. One ends of the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 are inserted into the openings 30ah1, 30ah2, and 30ah3 of the first header 30a, respectively, and fixed thereto. The first header 30a and the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 are fixed to each other by brazing, for example, to ensure watertightness.

[0041] The first header 30a has a refrigerant inlet 30ap1 and a refrigerant outlet 30ap2 in the wall portion 30aF. The refrigerant inlet 30ap1 introduces a refrigerant from an external cooling device. The refrigerant outlet 30ap2 discharges the refrigerant to the external cooling device. The first header 30a has a partition wall therein, which will be described later. The partition wall is a wall that separates the refrigerant introduced into the first header 30a from the refrigerant discharged from the first header 30a. The partition wall will be described in detail later.

[0042] The first header 30a includes a fixing portion 30af that is fixed to the object to be installed, specifically, the case 52 of the power conversion device 5, on the wall portion 30aD. Further, the first header 30a includes a fixing portion 30ag that is fixed to the object to be installed, specifically, the case 52 of the power conversion device 5, on the wall portion 30aB.

[0043] The fixing portion 30af and the fixing portion 30ag will be described. Since the fixing portion 30ag has the same shape as the fixing portion 30af, the fixing portion 30af will be described.

[0044] The fixing portion 30af has a first plate portion 30af1 that is parallel to the side surface of the wall portion 30aD and is fixed to the wall portion 30aD, and a second plate portion 30af2 that is connected to the first plate portion 30af1 and is fixed to the object to be installed. The second plate portion 30af2 has a through hole 30afh through which a screw passes when the fixing portion 30af is attached to the object to be installed with a screw.

[0045] [First multi-hole tube 30b1, second multi-hole tube 30b2, third multi-hole tube 30b3] Next, the first multi-hole tube 30b1, the second multi-hole tube 30b2, and the third multi-hole tube 30b3 will be described. FIG. 10 is a side view of the first multi-hole tube 30b1, the second multi-hole tube 30b2, and the third multi-hole tube 30b3 of the cooler 30 of the semiconductor device 1 according to the first embodiment. The first multi-hole tube 30b1, the second multi-hole tube 30b2, and the third multi-hole tube 30b3 are tubes with open ends in the longitudinal direction through which a refrigerant flows. Further, the first multi-hole tube 30b1, the second multi-hole tube 30b2, and the third multi-hole tube 30b3 cool the semiconductor package 20 by exchanging heat with the refrigerant flowing through the inside of the multi-hole tube.

[0046] The cross-section of the first multi-hole tube 30b1, the second multi-hole tube 30b2, and the third multi-hole tube 30b3 in the short direction has a substantially rectangular outer shape. The first multi-hole tube 30b1, the second multi-hole tube 30b2, and the third multi-hole tube 30b3 are so-called microchannels having flow paths 30bc divided inside.

[0047] Each flow path 30bc of the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 is a rectangular microchannel that is long in the Y-axis direction (vertical direction). Note that the flow path 30bc may be divided into two or more stages in the Y-axis direction.

[0048] Note that the Y-axis direction (vertical direction) is an example of the first direction.

[0049] The first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 have a cooling surface 30bA and a cooling surface 30bB. When the semiconductor package 20 is cooled by the cooler 30, the semiconductor package 20 to be cooled is provided in contact with the cooling surface 30bA or the cooling surface 30bB. Specifically, the cooling surface 30bA or the cooling surface 30bB and the heat dissipation plate 20c1 or the heat dissipation plate 20c2 of the semiconductor package 20 are thermally joined by a joining member such as soldering or thermal conduction grease, which will be described later.

[0050] Each flow path 30bc of the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 has a uniform cross-sectional area with respect to the extending direction of each of the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3. The extending direction of each flow path 30bc of the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 coincides with the flow direction of the refrigerant in the X-axis direction. Note that, in the present disclosure, the cross-sectional area of the flow path 30bc is the cross-sectional area of a plane perpendicular to the extending direction of each flow path 30bc, that is, the flow direction of the refrigerant.

[0051] In at least one multi-hole pipe among the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3, the refrigerant flows from the first header 30a toward the second header 30c, and in the remaining multi-hole pipes, the refrigerant flows from the second header 30c toward the first header 30a. Note that, in the following description, a multi-hole pipe in which the refrigerant flows from the first header 30a toward the second header 30c may be referred to as an upstream multi-hole pipe, and a multi-hole pipe in which the refrigerant flows from the second header 30c toward the first header 30a may be referred to as a downstream multi-hole pipe.

[0052] [Second header 30c] The second header 30c introduces the refrigerant introduced from at least one of the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 into the remaining multi-hole pipes of the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3. In other words, the second header 30c introduces the refrigerant introduced from the upstream multi-hole pipe into the downstream multi-hole pipe.

[0053] The second header 30c has a cavity with one side open. Specifically, the second header 30c has an opening 30ch1, an opening 30ch2, and an opening 30ch3 on the -X side surface. The other ends of the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 are inserted and fixed to the open side of the second header 30c. Specifically, the other end of the first multi-hole pipe 30b1 is inserted and fixed into the opening 30ch1. The other end of the second multi-hole pipe 30b2 is inserted and fixed into the opening 30ch2. The other end of the third multi-hole pipe 30b3 is inserted and fixed into the opening 30ch3. The second header 30c and the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 are fixed, for example, by brazing to ensure watertightness.

[0054] The second header 30c is provided with a fixing portion 30cf on the wall portion 30cD for being fixed to the object to be installed, specifically, the case 52 of the power conversion device 5. Further, the second header 30c is provided with a fixing portion 30cg on the wall portion 30cB for being fixed to the object to be installed, specifically, the case 52 of the power conversion device 5.

[0055] The fixing portion 30af and the fixing portion 30cg have the same shape as the fixing portion 30af.

[0056] <Partition wall of the first header 30a> Here, the partition wall provided in the first header 30a will be described. First, the conditions for determining the position of the partition wall provided in the first header 30a will be described.

[0057] The refrigerant introduced from an external cooling device into the cooler 30 absorbs heat from the semiconductor package 20 and is then led out from the cooler 30. Therefore, the refrigerant flowing through the cooler 30 has the lowest temperature immediately after being introduced, and gradually absorbs heat and its temperature rises. That is, the temperature of the refrigerant in the downstream multi-hole tube is higher than that of the refrigerant in the upstream multi-hole tube.

[0058] Next, the position of the partition provided in the first header 30a will be described. In the semiconductor device 1 of the first embodiment, the partition 30aw of the first header 30a is formed such that the first multi-hole tube 30b1 and the second multi-hole tube 30b2 serve as the upstream multi-hole tubes, and the third multi-hole tube 30b3 serves as the downstream multi-hole tube.

[0059] FIGS. 11 and 12 are cross-sectional views of the semiconductor device 1 of the first embodiment. Specifically, FIG. 11 is a cross-sectional view obtained by cutting the semiconductor device 1 at a plane perpendicular to the X-axis direction at the first header 30a portion. Specifically, FIG. 12 is a cross-sectional view obtained by cutting the semiconductor device 1 at a plane perpendicular to the Z-axis direction at the central portion in the Z direction. Note that, regarding the semiconductor package 20, the internal details are omitted and it is shown as a uniform cross-section.

[0060] In the semiconductor device 1 of the first embodiment, the partition 30aw is provided such that the first multi-hole tube 30b1 and the second multi-hole tube 30b2 serve as the upstream multi-hole tubes, and the third multi-hole tube 30b3 serves as the downstream multi-hole tube. The partition 30aw extends in the X-axis direction from the wall portion 30aF to the wall portion 30aE of the first header 30a.

[0061] The first multi-hole tube 30b1 and the second multi-hole tube 30b2 communicate with the space SPin surrounded by a part of the wall portion 30aA, the wall portion 30aB, a part of the wall portion 30aC, the partition 30aw, the wall portion 30aE, and the wall portion 30aF. The refrigerant from the refrigerant inlet 30ap1 is introduced into the space SPin. The refrigerant introduced into the space SPin is led out from the first multi-hole tube 30b1 and the second multi-hole tube 30b2 that communicate with the space SPin.

[0062] On the other hand, the third multi-hole pipe 30b3 communicates with a space SPout surrounded by a part of the wall portion 30aA, the partition wall 30aw, a part of the wall portion 30aC, the wall portion 30aD, the wall portion 30aE, and the wall portion 30aF. Refrigerant is introduced from the third multi-hole pipe 30b3 that communicates with the space SPout. The refrigerant introduced into the space SPout is led out from the refrigerant outlet 30ap2.

[0063] <Regarding deformation due to heat> The influence when the semiconductor package 20 of the semiconductor device 1 according to the first embodiment generates heat will be described. FIGS. 13 and 14 are diagrams for explaining the influence when the semiconductor package 20 of the semiconductor device 1 according to the first embodiment generates heat.

[0064] FIG. 13 is a side view of the semiconductor device 1 when assembling the semiconductor device 1. When assembling the semiconductor device 1, the temperature of the semiconductor device 1 is normal temperature, for example, 25°C. When assembling the semiconductor device 1, the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 are substantially parallel.

[0065] As described above, the first header 30a is fixed by the fixing portion 30af provided on the wall portion 30aD and the fixing portion 30ag provided on the wall portion 30aB. Note that the wall portion 30aD and the wall portion 30aB extend in the Y direction, which is the first direction in which the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 are arranged side by side. Further, the wall portion 30aD and the wall portion 30aB extend in the X direction, which is the second direction in which the flow paths of the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 extend. That is, the wall portion 30aD and the wall portion 30aB extend in the first direction and the second direction.

[0066] When the semiconductor device 1 operates, the semiconductor package 20 generates heat. When the semiconductor package 20 generates heat, the first multi-hole tube 30b1, the second multi-hole tube 30b2, and the third multi-hole tube 30b3 are heated by the semiconductor package 20. When the first multi-hole tube 30b1, the second multi-hole tube 30b2, and the third multi-hole tube 30b3 are heated from the state where the first header 30a and the second header 30c are fixed at room temperature, the first multi-hole tube 30b1, the second multi-hole tube 30b2, and the third multi-hole tube 30b3 each thermally expand.

[0067] For example, when each of the first multi-hole tube 30b1, the second multi-hole tube 30b2, and the third multi-hole tube 30b3 is not fixed at both ends, it thermally expands in proportion to the length L [m] of the multi-hole tube, the linear expansion coefficient α [1 / K] of the coolant tube material, and the temperature difference ΔT [K]. That is, the thermal deformation amount (in the length direction) δ of the first multi-hole tube 30b1, the second multi-hole tube 30b2, and the third multi-hole tube 30b3 is α×L×ΔT. For example, when the multi-hole tube is made of an aluminum material, since the linear expansion coefficient of the aluminum material is 23.8×10 -6 [1 / K], when the length of the multi-hole tube is 0.15 [m], a thermal expansion of 0.2 [mm] occurs.

[0068] In the semiconductor device 1, when the multi-hole tube expands due to thermal expansion, a load is applied to the semiconductor package 20. Therefore, a mechanism that can achieve both sealing and absorption of the expansion is required to absorb the expansion or fix both ends so that the tube does not expand. Since it is necessary to prevent leakage when the thermal coolant is a liquid such as water, a mechanism that can achieve both sealing and expansion absorption is required. On the other hand, when both ends are fixed, the multi-hole tube becomes difficult to expand in the longitudinal direction, but a force is applied to the first header 30a and the second header 30c.

[0069] The cooler 30 of the semiconductor device 1 according to the present embodiment is fixed to the object to be installed on the side surfaces of the first header 30a and the second header 30c. When the first header 30a and the second header 30c are fixed on their respective side surfaces, as shown in FIG. 14, the central portions of the first header 30a and the second header 30c in the Y-axis direction each expand, and the first multi-hole tube 30b1 and the third multi-hole tube 30b3 curve in the direction of arrow A.

[0070] FIG. 15 is a diagram showing the result of simulating the deformation of the cooler 30 when the semiconductor package 20 generates heat in the semiconductor device 1 according to the first embodiment.

[0071] When the first multi-hole tube 30b1 and the third multi-hole tube 30b3 are deformed in the direction of arrow A, they are deformed in the direction in which the distance between the multi-hole tubes becomes smaller. Therefore, the gap between the multi-hole tube and the semiconductor package 20 can be reduced.

[0072] Here, for comparison, the influence when the semiconductor package 20 generates heat in the case where the first header 30a and the second header 30c are fixed to the bottom surface, for example, the wall portion 30aC, will be described.

[0073] FIG. 17 is a diagram for explaining the influence when the semiconductor package generates heat in the semiconductor device of the comparative example. In the semiconductor device of the comparative example, when the multi-hole tube thermally expands, the first header and the second header are pushed and expanded in the direction of arrow B. Therefore, the multi-hole tube bends in an arc shape in the direction of arrow C. Therefore, the multi-hole tube and the semiconductor package are separated. Since the multi-hole tube and the semiconductor package are separated, the thermal resistance between the multi-hole tube and the semiconductor package increases, and the efficiency of cooling the semiconductor package decreases.

[0074] As shown in FIG. 14, in the semiconductor device 1 according to the first embodiment, the central portions of the first header 30a and the second header 30c in the Y-axis direction are widened, and the first multi-hole tube 30b1 and the third multi-hole tube 30b3 are curved in the direction of arrow A. Therefore, the gap between the multi-hole tube and the semiconductor package 20 can be reduced, and an increase in the thermal resistance between the multi-hole tube and the semiconductor package 20 can be prevented. By preventing an increase in the thermal resistance between the multi-hole tube and the semiconductor package 20, the efficiency of cooling the semiconductor package 20 can be maintained even when the semiconductor package 20 is operating.

[0075] <<Second Embodiment>> ≪Semiconductor Device 101≫ FIG. 16 is a perspective view of a semiconductor device 101 which is an example of a semiconductor device according to the second embodiment.

[0076] The semiconductor device 101 includes a plurality of semiconductor packages 20 and a cooler 130. The cooler 130 includes a first header 130a, a plurality of multi-hole tubes 130b, and a second header 130c.

[0077] The first header 130a includes a fixing portion 130af and a fixing portion 130ag. The second header 130c includes a fixing portion 130cf and a fixing portion 130cg. The fixing portion 130af and the fixing portion 130ag are attached to the object to be installed in the -X direction in the X-axis direction. Further, the fixing portion 130cf and the fixing portion 130cg are attached to the object to be installed in the +X direction in the X-axis direction.

[0078] It should be considered that the embodiments disclosed this time are illustrative in all respects and not restrictive. The above embodiments may be omitted, replaced, or changed in various forms without departing from the scope and gist of the appended claims.

Description of Reference Numerals

[0079] 1, 101 Semiconductor device 5 Power conversion device 20, 21, 22, 23, 24, 25, 26 Semiconductor package 30, 130 Cooler 30a, 130a First header 30aB Wall portion 30aD Wall portion 30af, 130af Fixing portion 30af1 First plate portion 30af2 Second plate portion 30ag, 130ag Fixing portion 30b1 First multi-hole tube 30b2 Second multi-hole tube 30b3 Third multi-hole tube 30bc Flow path 30c, 130c Second header 30cf, 30cg, 130cf, 130cg Fixing portion 50 Housing 51 Cover 52 cases SPin space SPout space

Claims

1. A plurality of multi-hole tubes provided side by side at intervals in a first direction and having flow paths extending in a second direction intersecting the first direction; A first header to which one side of each of the plurality of multi-hole tubes is connected; A second header to which the other side of each of the plurality of multi-hole tubes is connected; Comprising: Each of the first header and the second header has a fixing portion fixed to an object to be installed on a wall portion extending in the first direction and the second direction. Cooler.

2. A plurality of multi-hole tubes provided side by side at intervals in a first direction and having flow paths extending in a second direction intersecting the first direction; A first header having a cavity inside, a refrigerant inlet through which refrigerant is introduced from the outside, and a refrigerant outlet through which the refrigerant is led out to the outside, and to which one side of each of the plurality of multi-hole tubes is connected; A second header to which the other side of each of the plurality of multi-hole tubes is connected; Comprising: Each of the first header and the second header has a fixing portion fixed to an object to be installed on a wall portion extending in the first direction and the second direction. Cooler.

3. The fixing portion includes a first plate portion fixed to the wall portion and a second plate portion connected to the first plate portion and fixed to the object to be installed. The cooler according to any one of Claim 1 or Claim 2.

4. The second plate portion is fixed to the object to be installed in the first direction. The cooler according to Claim 3.

5. The cooler according to any one of Claims 1 to 4; A semiconductor package between adjacent multi-hole tubes; Semiconductor device.

6. Comprising the semiconductor device according to Claim 5; Power conversion device.

Images