Underfill material, semiconductor package, and method for manufacturing semiconductor package

Abstract

To provide: an underfill material which has an excellent pot life and has excellent high-temperature adhesiveness to copper when formed into a cured product; a semiconductor package including a cured product of the underfill material; and a method for manufacturing the semiconductor package.SOLUTION: The underfill material contains: an epoxy resin; an aromatic amine curing agent; an inorganic filler; and a compound having a triazine ring and an alkoxysilyl group, or a compound having a triazine ring and a primary amino group and having a melting point of 200°C or lower.SELECTED DRAWING: None

Description

Technical Field

[0001] The present disclosure relates to an underfill material, a semiconductor package, and a method for manufacturing a semiconductor package.

Background Art

[0002] In the field of encapsulating various semiconductor elements used in semiconductor devices such as transistors and ICs (Integrated Circuits), resin encapsulation has become the mainstream in terms of productivity, manufacturing cost, etc. As the resin for encapsulation, epoxy resin is widely used. This is because epoxy resin has excellent balance in various properties such as workability, moldability, electrical properties, moisture resistance, heat resistance, mechanical properties, and adhesiveness to insert parts.

[0003] In recent years, in the field of semiconductor devices, in order to cope with the miniaturization and thinning of packages, semiconductor devices using so-called bare chip mounting, where a bare chip is directly mounted on a wiring board, have become the mainstream. Examples of semiconductor devices using bare chip mounting include COB (Chip on Board), COG (Chip on Glass), TCP (Tape Carrier Package), etc.

[0004] In a flip-chip type semiconductor device in which a semiconductor element is bump-connected to a wiring board, a liquid resin composition is used as an underfill material filled in the gap (gap) between the bump-connected semiconductor element and the substrate. For example, Patent Document 1 describes an underfill material using a polyfunctional epoxy resin and a curing agent containing a phenolic compound and an acid anhydride. The underfill material plays a role of protecting electronic components from temperature and humidity and mechanical external forces.

[0005] In flip-chip type semiconductor devices, solder balls have conventionally been mainly used for connecting semiconductor elements to substrates. On the other hand, with the increase in the number of terminals due to the miniaturization and high integration of semiconductor devices, copper pillars capped with solder at the tips are increasingly being adopted instead of conventional solder balls. Therefore, when connecting a semiconductor device to a mother board or the like using a reflow furnace at a high temperature (for example, 260°C), a defect occurs in which the underfill material peels off from the copper pillars.

[0006] As a method for improving the adhesion of an epoxy resin composition to copper, for example, Patent Documents 2 to 6 describe epoxy resin compositions containing compounds having excellent adhesion to copper.

Prior Art Documents

Patent Documents

[0007]

Patent Document 1

Patent Document 2

Patent Document 3

Patent Document 4

Patent Document 5

Patent Document 6

Summary of the Invention

Problems to be Solved by the Invention

[0008] However, when a compound having excellent adhesion to copper is generally applied to an underfill material, it often reacts with resin components such as epoxy resin and hardener, deteriorating the pot life, that is, the storage stability at room temperature. Furthermore, the adhesive strength between the underfill material and copper at a high temperature (for example, 260°C) has not been verified so far.

[0009] In view of the above circumstances, an object of the present disclosure is to provide an underfill material having excellent pot life and excellent high-temperature adhesiveness to copper when cured, a semiconductor package including a cured product of the underfill material, and a method for manufacturing the same.

Means for Solving the Problems

[0010] Means for solving the above problems include the following embodiments. <1> An underfill material containing an epoxy resin, an aromatic amine curing agent, an inorganic filler, and a compound having a triazine ring and an alkoxysilyl group. <2> The underfill material according to <1>, wherein the compound having a triazine ring and an alkoxysilyl group has a melting point of 200°C or lower. <3> The underfill material according to <1> or <2>, wherein the compound having a triazine ring and an alkoxysilyl group further has a primary amino group. <4> An underfill material containing an epoxy resin, an aromatic amine curing agent, an inorganic filler, and a compound having a triazine ring and a primary amino group and having a melting point of 200°C or lower. <5> A semiconductor package having a substrate, a semiconductor element disposed on the substrate, and a cured product of the underfill material according to any one of <1> to <4> that seals the semiconductor element. <6> A method for manufacturing a semiconductor package, the method including a step of filling a gap between a substrate and a semiconductor element disposed on the substrate with the underfill material according to any one of <1> to <5>, and a step of curing the underfill material.

Advantages of the Invention

[0011] According to the present disclosure, there are provided an underfill material having excellent pot life and excellent high-temperature adhesiveness to copper when cured, a semiconductor package including a cured product of the underfill material, and a method for manufacturing the same.

Embodiments for Carrying Out the Invention

[0012] Hereinafter, embodiments of the present disclosure will be described in detail. However, the embodiments of the present disclosure are not limited to the following embodiments. In the following embodiments, the components (including element steps, etc.) are not essential unless otherwise specified. The same applies to numerical values and their ranges, which do not limit the embodiments of the present disclosure.

[0013] In the present disclosure, the term "step" includes not only a step independent of other steps but also a step that cannot be clearly distinguished from other steps as long as the purpose of the step is achieved. In the numerical range indicated by "~" in the present disclosure, the numerical values described before and after "~" are included as the minimum value and the maximum value, respectively. In the numerical ranges described step by step in the present disclosure, the upper limit value or the lower limit value described in one numerical range may be replaced with the upper limit value or the lower limit value of the numerical range described in other step-by-step descriptions. Also, in the numerical ranges described in the present disclosure, the upper limit value or the lower limit value of the numerical range may be replaced with the value shown in the examples. In the present disclosure, each component may contain a plurality of corresponding substances. When there are a plurality of substances corresponding to each component in the composition, the content rate or content of each component means the total content rate or content of the plurality of substances present in the composition, unless otherwise specified. In the present disclosure, the particles corresponding to each component may contain a plurality of types. When there are a plurality of types of particles corresponding to each component in the composition, the particle diameter of each component means a value for the mixture of the plurality of types of particles present in the composition, unless otherwise specified.

[0014] ≪Underfill Material≫ The underfill material according to the first embodiment of the present disclosure contains an epoxy resin, an aromatic amine curing agent, an inorganic filler, and a compound having a triazine ring and an alkoxysilyl group (hereinafter also referred to as "the first triazine ring-containing compound"). The underfill material according to the second embodiment of the present disclosure contains an epoxy resin, an aromatic amine curing agent, an inorganic filler, and a compound having a triazine ring and a primary amino group and having a melting point of 200°C or lower (hereinafter also referred to as "the second triazine ring-containing compound"). Hereinafter, the underfill material according to the first embodiment and the underfill material according to the second embodiment may be collectively referred to as "the underfill material of the present disclosure" or simply "the underfill material".

[0015] The underfill material of the present disclosure is excellent in pot life and has excellent high-temperature adhesiveness to copper when cured. In the present disclosure, the high-temperature adhesiveness refers to the adhesiveness at 260°C. The detailed reason why the underfill material of the present disclosure is excellent in pot life and high-temperature adhesiveness to copper when cured is not necessarily clear, but is presumed as follows. The underfill material according to the first embodiment contains a compound having a triazine ring and an alkoxysilyl group (the first triazine ring-containing compound). It is considered that the nitrogen atom in the triazine ring contributes to the high-temperature adhesiveness to copper. Further, due to the presence of the alkoxysilyl group, the first triazine ring-containing compound has excellent compatibility with the epoxy resin and is well dispersed in the underfill material. Therefore, it is considered that the high-temperature adhesiveness is good throughout the underfill material. Furthermore, when the first triazine ring-containing compound is used and an aromatic amine compound is used as the curing agent, the reactivity of the first triazine ring-containing compound and the aromatic amine compound with respect to the epoxy group is not too high, so the progress of gelation is relatively slow, and it is considered that an excellent pot life can be obtained. The underfill material according to the second embodiment contains a compound having a triazine ring and a primary amino group and having a melting point of 200°C or lower (second triazine ring-containing compound). The nitrogen atom and the primary amino group in the triazine ring are considered to contribute to the high-temperature adhesiveness with copper. Further, since the melting point of the compound is 200°C or lower, it has excellent dispersibility in the epoxy resin during kneading (for example, about 25°C to 80°C), during filling into the gap between the element and the substrate (for example, about 100°C to 120°C), and during curing of the underfill material (for example, about 80°C to 200°C), and it is considered that the underfill material has good high-temperature adhesiveness throughout. Furthermore, when the second triazine ring-containing compound is used and an aromatic amine compound is used as the curing agent, the reactivity of the second triazine ring-containing compound and the aromatic amine compound with respect to the epoxy resin is not too high, so the progress of gelation is relatively slow, and it is considered that an excellent pot life can be obtained.

[0016] The underfill material is preferably liquid at 25°C. In the present disclosure, "liquid" means a substance that exhibits fluidity and viscosity and has a viscosity, which is a measure of viscosity, in the range of 0.0001 Pa·s to 100 Pa·s. Further, "liquid state" means the state of being liquid.

[0017] In the present disclosure, the viscosity is defined as the measured value when an EHD type rotational viscometer (for example, VISCONIC EHD type (trade name) manufactured by Tokyo Keiki Co., Ltd.) is rotated at 10 revolutions per minute (10 rpm) for 1 minute at 25°C. The above measured value is obtained using an EHD type rotational viscometer equipped with a cone rotor having a cone angle of 3° and a cone radius of 14 mm for a liquid maintained at 25 ± 1°C.

[0018] The viscosity of the underfill material is not particularly limited. In particular, from the viewpoint of high fluidity, the viscosity of the underfill material at 25°C is preferably 0.1 Pa·s to 100.0 Pa·s, more preferably 0.1 Pa·s to 50.0 Pa·s, and even more preferably 0.1 Pa·s to 30.0 Pa·s.

[0019] In addition, as an index of the ease of filling the underfill material between narrow gaps of several tens of μm to several hundreds of μm near 100°C to 120°C, the viscosity of the underfill material at 110°C is preferably 0.20 Pa·s or less, and more preferably 0.15 Pa·s or less. The viscosity of the underfill material at 110°C is measured by a rheometer (for example, AR2000 manufactured by TA Instruments, cone radius 20 mm, shear rate 32.5 / sec).

[0020] The pot life of the underfill material measured by the following method after standing at 25°C for 24 hours is preferably 100% or less, more preferably 90% or less, still more preferably 80% or less, and particularly preferably 60% or less. The lower limit of the pot life is not particularly limited, and the lower the value, the more preferable. After the underfill material is left standing at 25°C for 24 hours, the viscosity at 25°C is measured using an E-type viscometer (for example, VISCONIC EHD type (trade name) manufactured by Tokyo Keiki Co., Ltd.) (cone angle 3°, rotation speed 10 revolutions per minute (rpm)) (viscosity after standing). However, for samples that cannot be measured at a rotation speed of 10 revolutions per minute (rpm) due to high viscosity, the measurement is performed at 2.5 revolutions per minute (rpm). The pot life (%) is calculated as the viscosity increase rate after standing for 24 hours by the following formula. Pot life (%) = {(viscosity after standing - initial viscosity) / initial viscosity} × 100

[0021] The high-temperature adhesion of the underfill material to copper (Cu) measured by the following method is preferably 0.70 kgf or more, more preferably 0.80 kgf or more, and still more preferably 0.90 kgf or more. The higher the high-temperature adhesion, the more preferable.

[0022] The adhesive force to copper can be measured, for example, as follows. A test piece in which an underfill material is formed into a diameter of 3 mm and a height of 3 mm is prepared on the surface of a copper plate, and a shear stress is applied under the condition of a head speed of 50 μm / sec using a bond tester (for example, DS100 type manufactured by DAGE), and the strength at which the molded product peels off from the copper plate is measured. Specifically, it can be measured by the method described in the examples.

[0023] <Epoxy resin> The type of epoxy resin is not particularly limited. The epoxy resin preferably has two or more epoxy groups in one molecule.

[0024] The epoxy resin may be solid or liquid at room temperature, or a solid epoxy resin and a liquid epoxy resin may be used in combination. From the viewpoint of reducing the viscosity of the underfill material, it is preferable to use a liquid epoxy resin at room temperature. From the viewpoint of fluidity during molding, the content of the solid epoxy resin is preferably 20% by mass or less based on the total amount of the epoxy resin.

[0025] The type of the epoxy resin is not particularly limited. Specific examples of the epoxy resin include novolak type epoxy resins such as phenol novolak type epoxy resin and cresol novolak type epoxy resin; bisphenol type epoxy resins such as bisphenol A type epoxy resin and bisphenol F type epoxy resin; glycidylamine type epoxy resins such as N,N-diglycidylaniline, N,N-diglycidyltoluidine, diaminodiphenylmethane type glycidylamine, and aminophenol type glycidylamine; phenol aralkyl type epoxy resins having at least one selected from the group consisting of a phenylene skeleton and a biphenylene skeleton; aralkyl type epoxy resins such as naphthol aralkyl type epoxy resins having at least one selected from the group consisting of a phenylene skeleton and a biphenylene skeleton; hydroquinone type epoxy resin; biphenyl type epoxy resin; stilbene type epoxy resin; triphenolmethane type epoxy resin; triphenolpropane type epoxy resin; alkyl-modified triphenolmethane type epoxy resin; triazine nucleus-containing epoxy resin; dicyclopentadiene-modified phenol type epoxy resin; naphthol type epoxy resin; naphthalene type epoxy resin; alicyclic epoxy resins such as vinylcyclohexene dioxide, dicyclopentadiene dioxide, and alicyclic diepoxy-adipate; bifunctional aliphatic epoxy compounds having two epoxy groups in the molecule such as alkylene glycol diglycidyl ether, poly(alkylene glycol) diglycidyl ether, and alkenylene glycol diglycidyl ether. The epoxy resin may be used alone or in combination of two or more.

[0026] When using two or more epoxy resins, the two or more epoxy resins may be premixed and then mixed with other components, or may be mixed with other components without premixing.

[0027] The epoxy equivalent of the epoxy resin is not particularly limited. The epoxy equivalent of the epoxy resin may be 60 g / eq or more, may be 70 g / eq or more, or may be 90 g / eq or more. The epoxy equivalent of the epoxy resin may be 500 g / eq or less, may be 300 g / eq or less, or may be 200 g / eq or less. From the viewpoint of the balance of various properties such as moldability, reflow resistance, and electrical reliability, it is preferably 60 g / eq to 500 g / eq, more preferably 70 g / eq to 300 g / eq, and even more preferably 90 g / eq to 200 g / eq. The epoxy equivalent of the epoxy resin is a value measured by a method according to JIS K 7236:2009.

[0028] The content rate of the epoxy resin with respect to the total mass of the underfill material is not particularly limited. The content rate of the epoxy resin with respect to the total mass of the underfill material may be 0.5% by mass or more, or may be 2% by mass or more. The content rate of the epoxy resin with respect to the total mass of the underfill material may be 50% by mass or less, may be 40% by mass or less, or may be 30% by mass or less. From the viewpoints of viscosity, glass transition temperature, heat resistance, etc., the content rate of the epoxy resin is preferably 0.5% by mass to 50% by mass, more preferably 2% by mass to 40% by mass, and even more preferably 5% by mass to 30% by mass with respect to the total mass of the underfill material.

[0029] In one aspect, from the viewpoints of injectability and reduction of the thermal expansion coefficient when formed into a cured product, the underfill material preferably contains at least one selected from the group consisting of bisphenol type epoxy resins, glycidylamine type epoxy resins, and naphthalene type epoxy resins. Further, it is more preferable that the underfill material contains all of bisphenol type epoxy resins, glycidylamine type epoxy resins, and naphthalene type epoxy resins.

[0030] The type of bisphenol-type epoxy resin is not particularly limited, and examples include bisphenol A-type epoxy resin, bisphenol F-type epoxy resin, bisphenol AD-type epoxy resin, etc. The bisphenol-type epoxy resin may be used alone or in combination of two or more. From the viewpoint of using the underfill material in a liquid state, the bisphenol-type epoxy resin is preferably liquid at room temperature (25°C). From the viewpoint of reducing viscosity, the bisphenol-type epoxy resin is preferably bisphenol F-type epoxy resin.

[0031] When the underfill material contains a bisphenol-type epoxy resin, the content of the bisphenol-type epoxy resin is not particularly limited and can be selected according to the desired properties of the underfill material. For example, the content rate of bisphenol F-type epoxy resin may be 20% by mass or more, 30% by mass or more, or 40% by mass or more based on the total mass of the epoxy resin. The content rate of bisphenol F-type epoxy resin may be less than 90% by mass, 80% by mass or less, or 70% by mass or less based on the total mass of the epoxy resin. The content rate of bisphenol F-type epoxy resin may be 20% by mass or more and less than 90% by mass, 30% by mass to 80% by mass, or 40% by mass to 70% by mass based on the total mass of the epoxy resin.

[0032] The type of glycidylamine type epoxy resin is not particularly limited. The glycidylamine type epoxy resin preferably has two or more functional groups, and from the viewpoint of improving heat resistance after curing, a glycidylamine type epoxy resin having three or more functional groups (that is, having three or more epoxy groups in one molecule) is preferred. Examples of the bifunctional glycidylamine type epoxy resin include N,N-diglycidylaniline and N,N-diglycidyl-o-toluidine. Examples of the glycidylamine type epoxy resin having three or more functional groups include triglycidyl-p-aminophenol and 4,4'-methylenebis[N,N-bis(oxiranylmethyl)aniline]. The glycidylamine type epoxy resin may be used alone or in combination of two or more. Among them, triglycidyl-p-aminophenol is preferred from the viewpoint of viscosity at room temperature (25°C).

[0033] From the viewpoint of reducing the viscosity of the underfill material, the molecular weight of the glycidylamine type epoxy resin is preferably 300 or less.

[0034] When the underfill material contains a glycidylamine type epoxy resin, the content of the glycidylamine type epoxy resin is not particularly limited. For example, the content rate of the glycidylamine type epoxy resin may be 10% by mass or more, 20% by mass or more, or 25% by mass or more based on the total mass of the epoxy resin. The content rate of the glycidylamine type epoxy resin may be 60% by mass or less, 50% by mass or less, or 40% by mass or less based on the total mass of the epoxy resin. The content rate of the glycidylamine type epoxy resin may be 10% by mass to 60% by mass, 20% by mass to 50% by mass, or 25% by mass to 40% by mass based on the total mass of the epoxy resin.

[0035] The type of naphthalene type epoxy resin is not particularly limited. From the viewpoint of reducing the thermal expansion coefficient, 1,6-bis(glycidyloxy)naphthalene is preferred.

[0036] When the underfill material contains a naphthalene-type epoxy resin, the content of the naphthalene-type epoxy resin is not particularly limited. For example, the content rate of the naphthalene-type epoxy resin may be 10% by mass or more, or 15% by mass or more, based on the total mass of the epoxy resin. The content rate of the naphthalene-type epoxy resin may be 30% by mass or less, or 25% by mass or less, based on the total mass of the epoxy resin. The content rate of the naphthalene-type epoxy resin may be 10% by mass to 30% by mass, or 15% by mass to 25% by mass, based on the total mass of the epoxy resin.

[0037] <Aromatic amine curing agent> The type of the aromatic amine curing agent is not particularly limited, and it is preferably an aromatic amine compound having at least two of at least one selected from the group consisting of a primary amino group and a secondary amino group in one molecule, more preferably an aromatic amine compound having 2 to 4 of at least one selected from the group consisting of a primary amino group and a secondary amino group in one molecule, and even more preferably an aromatic amine compound having 2 of at least one selected from the group consisting of a primary amino group and a secondary amino group in one molecule. The aromatic amine curing agent is preferably liquid at 25°C.

[0038] Examples of the aromatic amine curing agent include diethyltoluenediamine such as 3,5-diethyltoluene-2,4-diamine and 3,5-diethyltoluene-2,6-diamine; triethyldiaminobenzene such as 1,3,5-triethyl-2,6-diaminobenzene; and diaminodiphenylmethane such as 3,3'-diethyl-4,4'-diaminodiphenylmethane and 3,5,3',5'-tetramethyl-4,4'-diaminodiphenylmethane. The aromatic amine curing agent may be used alone or in combination of two or more.

[0039] Among them, from the viewpoint of storage stability, at least one selected from the group consisting of diaminodiphenylmethane and diethyltoluenediamine is preferable, and it is more preferable to use them in combination.

[0040] The active hydrogen equivalent of the aromatic amine curing agent is not particularly limited. The active hydrogen equivalent of the aromatic amine curing agent may be 20 g / eq or more, may be 30 g / eq or more, or may be 40 g / eq or more. The active hydrogen equivalent of the aromatic amine curing agent may be 200 g / eq or less, may be 100 g / eq or less, or may be 80 g / eq or less. From the viewpoint of achieving both low thermal stress and a high glass transition temperature (Tg) of the cured product, it is preferably 20 g / eq to 200 g / eq, more preferably 30 g / eq to 100 g / eq, and even more preferably 40 g / eq to 80 g / eq.

[0041] In addition to the aromatic amine curing agent, the underfill material may contain other curing agents. Examples of curing agents other than the aromatic amine curing agent include aliphatic amine curing agents, phenolic curing agents, acid anhydride curing agents, imidazole compounds, imidazoline compounds, polymercaptan curing agents, polyaminoamide curing agents, isocyanate curing agents, blocked isocyanate curing agents, and the like.

[0042] The content rate of the aromatic amine curing agent with respect to the total mass of the curing agent is not particularly limited. From the viewpoint of making the pot life and the high-temperature adhesiveness to copper when formed into a cured product particularly good, it is preferably 50% by mass or more, more preferably 70% by mass or more, and even more preferably 80% by mass or more. Among them, the total content rate of at least one selected from the group consisting of diaminodiphenylmethane and diethyltoluenediamine is preferably 50% by mass or more, more preferably 70% by mass or more, and even more preferably 80% by mass or more with respect to the total mass of the curing agent.

[0043] The equivalent ratio of the epoxy resin and the curing agent (including aromatic amine curing agents), that is, the ratio of the number of functional groups (active hydrogen in the case of amine curing agents) in the curing agent to the number of epoxy groups in the epoxy resin (number of functional groups in the curing agent / number of epoxy groups in the epoxy resin) is not particularly limited. From the perspective of minimizing unreacted components, it is preferably set in the range of 0.5 to 2.0, more preferably in the range of 0.6 to 1.3. From the perspectives of moldability and reflow resistance, it is even more preferably set in the range of 0.8 to 1.2.

[0044] From the perspective of making the underfill material liquid at room temperature (25°C), it is preferable to select a curing agent such that the entire curing agent is liquid at room temperature. That is, when using only one type of curing agent, it is preferable that the curing agent is liquid at room temperature. When using a combination of two or more types of curing agents, all of the two or more types of curing agents may be liquid at room temperature, or some may be solid curing agents at room temperature, and a combination may be used such that the mixture of two or more types of curing agents becomes liquid at room temperature. When using a solid curing agent at room temperature as the curing agent, its content is preferably 20% by mass or less based on the total mass of the curing agent from the perspective of fluidity.

[0045] <Inorganic filler> The type of inorganic filler is not particularly limited, and examples include inorganic materials such as silica, glass, alumina, calcium carbonate, zirconium silicate, calcium silicate, silicon nitride, aluminum nitride, boron nitride, beryllia, zirconia, zircon, forsterite, steatite, spinel, mullite, titania, talc, clay, mica, etc. An inorganic filler having a flame retardant effect may be used. Examples of inorganic fillers having a flame retardant effect include composite metal hydroxides such as aluminum hydroxide, magnesium hydroxide, and composite hydroxide of magnesium and zinc, and zinc borate. The inorganic filler may be used alone or in combination of two or more. Among them, silica is preferable from the perspective of reducing the thermal expansion coefficient, and alumina is preferable from the perspective of improving the thermal conductivity.

[0046] The content of the inorganic filler is not particularly limited. The content rate of the inorganic filler may be 30% by mass or more, 40% by mass or more, or 50% by mass or more with respect to the total mass of the underfill material. The content rate of the inorganic filler may be 90% by mass or less, 80% by mass or less, or 75% by mass or less with respect to the total mass of the underfill material. From the viewpoint of achieving both good fluidity and the desired effects by the inorganic filler, the content rate of the inorganic filler is preferably 30% to 90% by mass, more preferably 40% to 80% by mass, and even more preferably 50% to 75% by mass with respect to the total mass of the underfill material.

[0047] When the inorganic filler is in a particulate form, its average particle diameter is not particularly limited. For example, the volume average particle diameter of the inorganic filler may be 0.2 μm or more, or 0.5 μm or more. The volume average particle diameter of the inorganic filler may be 20 μm or less, or 15 μm or less. The volume average particle diameter of the inorganic filler is preferably 0.2 μm to 20 μm, and more preferably 0.5 μm to 15 μm. When the volume average particle diameter is 0.2 μm or more, the increase in the viscosity of the underfill material tends to be more suppressed. When the volume average particle diameter is 20 μm or less, the filling property into narrow gaps tends to be more improved. The volume average particle diameter of the inorganic filler can be measured as the particle diameter (D50) at which the cumulative volume from the small-diameter side becomes 50% in the volume-based particle size distribution obtained by a laser scattering diffraction method particle size distribution measuring device.

[0048] <Triazine ring-containing compound> -First triazine ring-containing compound- The first triazine ring-containing compound has a triazine ring and an alkoxysilyl group. The position of nitrogen in the triazine ring is not particularly limited. That is, the triazine serving as the skeleton may be any of 1,2,3-triazine, 1,2,4-triazine, and 1,3,5-triazine.

[0049] The first triazine ring-containing compound has a structure in which at least one of the hydrogen atoms bonded to the three carbon atoms on the triazine (C3H3N3) is substituted with a monovalent group having an alkoxysilyl group. The substitution position of the monovalent group may be any of the three carbon atoms. The number of substituted monovalent groups may be any of 1 to 3, preferably 1 or 2, and more preferably 1.

[0050] In the first triazine ring-containing compound, when the number of substituted monovalent groups having an alkoxysilyl group is 1 or 2, a substituent other than the monovalent group having an alkoxysilyl group may be bonded or may not be bonded to the carbon atom on the triazine ring to which the monovalent group having an alkoxysilyl group is not bonded.

[0051] The monovalent group having an alkoxysilyl group may be the alkoxysilyl group itself or a monovalent group formed by bonding a linking group to the silicon atom of the alkoxysilyl group. When the monovalent group having an alkoxysilyl group is a monovalent group formed by bonding a linking group to the silicon atom of the alkoxysilyl group, the linking group may be, for example, a hydrocarbon group or a hydrocarbon group having a heteroatom such as a nitrogen atom or an oxygen atom. The length of the linking group, that is, the number of atoms (excluding hydrogen atoms, branched chains or substituents) on the atomic chain existing between the silicon atom of the alkoxysilyl group and the carbon atom on the triazine ring may be, for example, 2 to 13 or 3 to 11.

[0052] The alkoxysilyl group has a structure represented by -Si(OR)3. Here, each R independently represents a hydrogen atom or an alkyl group, and at least one of the three Rs is an alkyl group. Among the three Rs, it is preferable that two or more are alkyl groups, and it is more preferable that all three are alkyl groups. As the alkyl group represented by R, each independently, an alkyl group having 1 to 4 carbon atoms is preferable, an ethyl group or a methyl group is more preferable, and an ethyl group is even more preferable.

[0053] Substituents other than the monovalent group having an alkoxysilyl group, which may be bonded to the triazine ring, are not particularly limited, and examples thereof include a halogen atom, an amino group, a hydroxy group, an arylamino group, and an alkylamino group. Among them, an amino group is preferable, a primary amino group or a secondary amino group is more preferable, and a primary amino group is even more preferable. The number of substituents other than the monovalent group having an alkoxysilyl group is not particularly limited, and the total of the number of the monovalent groups having an alkoxysilyl group and the number of substituents other than the monovalent group having an alkoxysilyl group is preferably 3.

[0054] Preferable examples of the first triazine ring-containing compound include compounds represented by the following general formula (I).

[0055]

Chemical formula

[0056] In formula (I), X represents a monovalent group having an alkoxysilyl group. Details of the monovalent group having an alkoxysilyl group in X are the same as those in the above-described embodiments.

[0057] The molecular weight of the triazine ring-containing compound is not particularly limited, and may be, for example, 100 to 800, 200 to 700, or 300 to 600.

[0058] The melting point of the first triazine ring-containing compound is not particularly limited, and from the viewpoints of high-temperature adhesiveness and pot life, it is preferably 200°C or lower, more preferably 175°C or lower, and even more preferably 150°C or lower. From the viewpoints of handleability and dispersibility, the melting point of the first triazine ring-containing compound is preferably 0°C or higher, more preferably 10°C or higher, and even more preferably 25°C or higher. From the above viewpoints, the melting point of the first triazine ring-containing compound is preferably 0°C to 200°C, more preferably 10°C to 175°C, and even more preferably 25°C to 150°C.

[0059] From the perspective of achieving good compatibility between high-temperature adhesion to copper and excellent pot life, the content of the first triazine ring-containing compound relative to the total mass of the underfill material is preferably 0.05% by mass or more, more preferably 0.10% by mass or more, and even more preferably 0.20% by mass or more. Also, from the perspective of suppressing the increase in the viscosity of the underfill material itself, the content of the first triazine ring-containing compound relative to the total mass of the underfill material is preferably 3.0% by mass or less, more preferably 2.0% by mass or less, and even more preferably 1.5% by mass or less. From the above perspectives, the content of the first triazine ring-containing compound relative to the total mass of the underfill material is preferably 0.05% by mass to 3.0% by mass, more preferably 0.10% by mass to 2.0% by mass, and even more preferably 0.20% by mass to 1.5% by mass.

[0060] -Second triazine ring-containing compound- The second triazine ring-containing compound has a triazine ring and a primary amino group, and a melting point of 200°C or lower.

[0061] From the perspectives of high-temperature adhesiveness and pot life, the melting point of the second triazine ring-containing compound is preferably 175°C or lower, more preferably 150°C or lower. From the perspectives of handleability and dispersibility, the melting point of the second triazine ring-containing compound is preferably 0°C or higher, more preferably 10°C or higher, and even more preferably 25°C or higher. From the above perspectives, the melting point of the second triazine ring-containing compound is preferably 0°C to 200°C, more preferably 10°C to 175°C, and even more preferably 25°C to 150°C. The melting point of the triazine ring-containing compound can be measured by a melting point measuring instrument or the like.

[0062] The position of the nitrogen in the triazine ring is not particularly limited. That is, the triazine serving as the backbone may be any of 1,2,3-triazine, 1,2,4-triazine, and 1,3,5-triazine.

[0063] The second triazine ring-containing compound has a structure in which at least one of the hydrogen atoms bonded to the three carbon atoms on the triazine (C3H3N3) is substituted with a monovalent group having a primary amino group. The substitution position of the monovalent group may be any of the three carbon atoms. The number of substituted monovalent groups may be any of 1 to 3.

[0064] When the number of substituted monovalent groups having a primary amino group in the second triazine ring-containing compound is 1 or 2, a substituent other than the monovalent group having a primary amino group may be bonded or may not be bonded to the carbon atom on the triazine ring to which the monovalent group having a primary amino group is not bonded.

[0065] The monovalent group having a primary amino group may be the primary amino group itself or a monovalent group formed by bonding a linking group to the nitrogen atom of the primary amino group. When the monovalent group having a primary amino group is a monovalent group formed by bonding a linking group to the nitrogen atom of the primary amino group, the linking group may be, for example, a hydrocarbon group or a hydrocarbon group having a heteroatom such as a nitrogen atom or an oxygen atom. The length of the linking group, that is, the number of atoms (excluding hydrogen atoms, branched chains, or substituents) on the atomic chain existing between the nitrogen atom of the primary amino group and the carbon atom on the triazine ring may be, for example, 1 to 10 or 1 to 5. It is preferable that the monovalent group having a primary amino group is the primary amino group itself.

[0066] Substituents other than the monovalent group having a primary amino group, which may be bonded to the triazine ring, are not particularly limited, and examples thereof include a halogen atom, an amino group, a hydroxy group, an arylamino group, an alkylamino group, a monovalent group having an alkoxysilyl group, etc. From the viewpoint of pot life, a monovalent group having an alkoxysilyl group is preferred. Details of the monovalent group having an alkoxysilyl group are the same as those of the monovalent group having an alkoxysilyl group described in the first triazine ring-containing compound. The number of substituents other than the monovalent group having a primary amino group is not particularly limited, and it is preferable that the total of the number of the monovalent groups having a primary amino group and the number of substituents other than the monovalent group having a primary amino group is 3.

[0067] Preferable examples of the second triazine ring-containing compound include the compounds represented by the general formula (I) described above.

[0068] From the viewpoint of achieving good balance between high-temperature adhesive strength to copper and excellent pot life, the content of the second triazine ring-containing compound with respect to the total mass of the underfill material is preferably 0.05% by mass or more, more preferably 0.10% by mass or more, and even more preferably 0.20% by mass or more. Also, from the viewpoint of suppressing the increase in viscosity of the underfill material itself, the content of the second triazine ring-containing compound with respect to the total mass of the underfill material is preferably 3.0% by mass or less, more preferably 2.0% by mass or less, and even more preferably 1.5% by mass or less. From the above viewpoints, the content of the second triazine ring-containing compound with respect to the total mass of the underfill material is preferably 0.05% by mass to 3.0% by mass, more preferably 0.10% by mass to 2.0% by mass, and even more preferably 0.20% by mass to 1.5% by mass.

[0069] <Various Additives> In addition to the above components, the underfill material may contain various additives such as a curing accelerator, a stress reliever, a coupling agent, an ion trap agent, a bleed inhibitor, a colorant, etc. The underfill material may contain various additives well-known in the art as necessary in addition to the additives exemplified below.

[0070] (Curing accelerator) The underfill material may contain a curing accelerator. The type of the curing accelerator is not particularly limited and can be selected according to the types of the epoxy resin and the curing agent, the desired properties of the underfill material, etc. Specifically, cycloamidine compounds such as 1,8-diazabicyclo[5.4.0]undecene-7, 1,5-diazabicyclo[4.3.0]nonene, 5,6-dibutylamino-1,8-diazabicyclo[5.4.0]undecene-7; compounds having intramolecular polarization formed by adding quinone compounds such as maleic anhydride, 1,4-benzoquinone, 2,5-toluquinone, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone, 2,6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl-1,4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, phenyl-1,4-benzoquinone, etc., compounds having a π bond such as diazophenylmethane and phenol resin to the cycloamidine compound; tertiary amine compounds such as benzyldimethylamine, triethanolamine, dimethylaminoethanol, tris(dimethylaminomethyl)phenol; derivatives of the tertiary amine compound; imidazole compounds such as 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole; derivatives of the imidazole compound; organic phosphine compounds such as tributylphosphine, methyldiphenylphosphine, triphenylphosphine, tris(4-methylphenyl)phosphine, diphenylphosphine, phenylphosphine; phosphorus compounds having intramolecular polarization formed by adding quinone compounds such as maleic anhydride, the above quinone compounds, diazophenylmethane, phenol resin, etc., compounds having a π bond to the organic phosphine compound; tetraphenylborate salts such as tetraphenylphosphonium tetraphenylborate, triphenylphosphonium tetraphenylborate, 2-ethyl-4-methylimidazolium tetraphenylborate, N-methylmorpholinium tetraphenylborate; derivatives of the tetraphenylborate salt; tetraphenylborane complexes such as triphenylphosphine-triphenylborane complex, morpholine-triphenylborane complex, etc. are mentioned.The hardening accelerator may be used alone or in combination of two or more kinds.

[0071] When the underfill material contains a hardening accelerator, the content of the hardening accelerator is not particularly limited, and it is preferably 0.1 part by mass to 15 parts by mass, more preferably 0.5 part by mass to 10 parts by mass, and still more preferably 0.8 part by mass to 5 parts by mass with respect to 100 parts by mass of the epoxy resin.

[0072] (Stress reliever) The underfill material may contain a stress reliever. The type of the stress reliever is not particularly limited, and examples thereof include particles such as a thermoplastic elastomer, NR (natural rubber), NBR (acrylonitrile-butadiene rubber), acrylic rubber, urethane rubber, and silicone rubber. The stress reliever may be used alone or in combination of two or more kinds.

[0073] When the underfill material contains a stress reliever, the content of the stress reliever is not particularly limited, and it is preferably 0.1 part by mass to 30 parts by mass, more preferably 1 part by mass to 15 parts by mass with respect to 100 parts by mass of the epoxy resin.

[0074] (Coupling agent) The underfill material may contain a coupling agent. The type of the coupling agent is not particularly limited, and examples thereof include silane compounds such as epoxy silane, mercapto silane, amino silane, alkyl silane, ureido silane, and vinyl silane; titanium compounds; aluminum chelate compounds; and aluminum / zirconium compounds. The coupling agent may be used alone or in combination of two or more kinds.

[0075] When the underfill material contains a coupling agent, the content of the coupling agent is not particularly limited, and it is preferably 0.01 part by mass to 5 parts by mass, more preferably 0.02 part by mass to 2.5 parts by mass with respect to 100 parts by mass of the epoxy resin.

[0076] (Ion trap agent) The underfill material may contain an ion trapping agent. The type of the ion trapping agent is not particularly limited, and examples thereof include compounds represented by the following general formula (VI-1) or the following general formula (VI-2).

[0077] Mg 1-a Al a (OH)2(CO3) a / 2 ·uH2O (VI-1) (In general formula (VI-1), a satisfies 0 < a ≤ 0.5, and u is a positive number.) BiO b (OH) c (NO3) d (VI-2) (In general formula (VI-2), b satisfies 0.9 ≤ b ≤ 1.1, c satisfies 0.6 ≤ c ≤ 0.8, and d satisfies 0.2 ≤ d ≤ 0.4.)

[0078] The ion trapping agent is commercially available. As the compound represented by the general formula (VI-1), for example, "DHT-4A" (trade name, manufactured by Kyowa Chemical Industry Co., Ltd.) is commercially available. Further, as the compound represented by the general formula (VI-2), for example, "IXE500" (trade name, manufactured by Toagosei Co., Ltd.) is commercially available.

[0079] In addition, examples of the ion trapping agent other than the above include hydrated oxides of elements selected from magnesium, aluminum, titanium, zirconium, antimony, etc. The ion trapping agent may be used alone or in combination of two or more.

[0080] When the underfill material contains an ion-trapping agent, the content of the ion-trapping agent is not particularly limited. From the viewpoint of achieving sufficient moisture resistance reliability, it is preferably 1 part by mass or more, more preferably 2 parts by mass or more, based on 100 parts by mass of the epoxy resin. From the viewpoint of fully exerting the effects of other components, the content of the ion-trapping agent is preferably 15 parts by mass or less, more preferably 10 parts by mass or less, and even more preferably 5 parts by mass or less, based on 100 parts by mass of the epoxy resin. From the above viewpoints, the content of the ion-trapping agent is preferably 1 to 15 parts by mass, more preferably 1 to 10 parts by mass, and even more preferably 2 to 5 parts by mass, based on 100 parts by mass of the epoxy resin.

[0081] Also, the average particle diameter of the ion-trapping agent is preferably 0.1 μm to 3.0 μm, and the maximum particle diameter is preferably 10 μm or less. The average particle diameter of the ion-trapping agent can be measured in the same manner as in the case of the inorganic filler.

[0082] (Bleed inhibitor) The underfill material may contain a bleed inhibitor. The type of the bleed inhibitor is not particularly limited, and examples thereof include nonionic surfactants and silicone-modified epoxy resins. The bleed inhibitor may be used alone or in combination of two or more.

[0083] The content of the bleed inhibitor is not particularly limited, and is preferably 0.1 to 5 parts by mass, more preferably 0.2 to 2 parts by mass, and even more preferably 0.3 to 1 part by mass, based on 100 parts by mass of the epoxy resin.

[0084] (Colorant) The underfill material may contain a colorant. The type of the colorant is not particularly limited, and examples thereof include carbon black, organic dyes, organic pigments, titanium oxide, red lead, and red iron oxide. The colorant may be used alone or in combination of two or more.

[0085] When the underfill material contains a colorant, the content of the colorant is not particularly limited, and is preferably 0.001 to 1 part by mass, more preferably 0.02 to 0.5 part by mass, based on the total amount of the underfill material.

[0086] 〔Method for preparing underfill material〕 The underfill material can be obtained, for example, by stirring, melting, mixing, dispersing, etc. the respective components all at once or separately, with heat treatment applied as necessary. The apparatus for mixing, stirring, dispersing, etc. of these components is not particularly limited, and examples include a kneader equipped with a stirring device, a heating device, etc., a three-roll mill, a ball mill, a planetary mixer, a bead mill, etc. The underfill material can be obtained by mixing and kneading the respective components using these apparatuses and defoaming as necessary.

[0087] 〔Use of underfill material〕 The underfill material can be used in various mounting technologies. In particular, the underfill material of the present disclosure can be suitably used as an underfill material for flip-chip type mounting technology, that is, for filling the gap between a semiconductor element and a substrate joined by bumps or the like. Further, the underfill material of the present disclosure can be suitably used as an underfill material for flip-chip type mounting technology using copper pillars.

[0088] The types of the semiconductor element and the substrate are not particularly limited, and can be appropriately selected from those generally used in the field of semiconductor packages. The method for filling the gap between the semiconductor element and the substrate using the underfill material is not particularly limited.

[0089] ≪Semiconductor package≫ The semiconductor package of the present disclosure has a substrate, a semiconductor element disposed on the substrate, and a cured product of the underfill material of the present disclosure that seals the semiconductor element.

[0090] In a semiconductor package, the types of the semiconductor element and the substrate are not particularly limited and can be appropriately selected from those generally used in the field of semiconductor packages. From the viewpoint that the underfill material of the present disclosure is particularly useful, the semiconductor package is preferably a flip-chip mounting type semiconductor package, and more preferably a flip-chip mounting type semiconductor package using copper pillars as bumps for connecting the semiconductor element and the substrate.

[0091] ≪Method for manufacturing semiconductor package≫ The method for manufacturing a semiconductor package of the present disclosure includes a step of filling a gap between a substrate and a semiconductor element disposed on the substrate with the underfill material of the present disclosure, and a step of curing the underfill material.

[0092] Details of the semiconductor package are as described above. The method of filling the gap between the semiconductor element and the substrate using the underfill material and the method of curing the underfill material after filling are not particularly limited. For example, after connecting the semiconductor element and the substrate, the underfill material is applied to the gap between the semiconductor element and the substrate by utilizing capillary action, and then the curing reaction of the underfill material is performed in a post-insertion method. In addition, there is a pre-application method in which the underfill material is first applied to at least one surface of the semiconductor element and the substrate, and when the semiconductor element is connected to the substrate by thermocompression bonding, the connection between the semiconductor element and the substrate and the curing reaction of the underfill material are performed together. Examples of the method of applying the underfill material include a casting method, a dispensing method, a printing method, and the like.

[0093] The curing conditions of the underfill material are not particularly limited. For example, it is preferably heated at 80°C to 200°C for 1 minute to 150 minutes.

Example

[0094] Hereinafter, the above-described embodiments will be specifically described by way of examples, but the scope of the embodiments of the present disclosure is not limited to these examples.

[0095] 〔Preparation of underfill material〕 The components shown in Table 1 and Table 2 were mixed in the compounding amounts shown in the same tables to prepare an underfill material. The details of each component are as follows. In Table 1 and Table 2, blank spaces indicate that no component is compounded.

[0096] Epoxy resin 1... Liquid bisphenol F type epoxy resin, epoxy equivalent: 160 g / eq, trade name "Epotoate YDF-8170C", Nippon Steel Chemical & Material Co., Ltd. Epoxy resin 2... Triglycidyl-p-aminophenol, epoxy equivalent: 95 g / eq, trade name "jER 630", Mitsubishi Chemical Corporation Epoxy resin 3... 1,6-bis(glycidyloxy)naphthalene, epoxy equivalent: 143 g / eq, trade name "Epiclon HP-4023D", DIC Corporation

[0097] Hardener 1... Diethyltoluenediamine, trade name "jER Cure W", active hydrogen equivalent: 45 g / eq, Mitsubishi Chemical Corporation Hardener 2... 3,3'-diethyl-4,4'-diaminodiphenylmethane, trade name "Kayhard A-A", active hydrogen equivalent: 63 g / eq, Nippon Kayaku Co., Ltd. Hardener 3... 3,4-dimethyl-6-(2-methyl-1-propenyl)-4-cyclohexene-1,2-dicarboxylic anhydride, trade name "YH-306", anhydrous acid equivalent: 234 g / eq, Mitsubishi Chemical Corporation Hardener 4... 2-allylphenol·formaldehyde polycondensate, trade name "MEH-8000H", active hydrogen equivalent: 140 g / eq, Meiwafosis Co., Ltd.

[0098] Curing accelerator 1... Triphenylphosphine Curing accelerator 2... 2-phenyl-4-methyl-5-hydroxymethylimidazole Ion trap agent... Compound represented by general formula (VI-2), trade name: "IXE500", Toagosei Co., Ltd. Colorant... Carbon black, trade name "MA-100", Mitsubishi Chemical Corporation Inorganic filler... Spherical silica with a surface treated with an epoxy silane coupling agent, trade name "SE2200-SEJ", volume average particle diameter 0.6 μm, Admatechs Co., Ltd.

[0099] As test compounds, the following compounds available as commercial products were used.

[0100] Compound 1... Triazine derivative (trade name: VD-5, Shikoku Chemicals Corporation, the following compound, R is a divalent linking group)

[0101]

Chem.

[0102] Compound 2... Melamine (the following compound)

[0103]

Chem.

[0104] Compound 3... 6-Phenyl-1,3,5-triazine-2,4-diamine (the following compound)

[0105]

Chem.

[0106] Compound 4... 3-Amino-1,2,4-triazole (the following compound)

[0107]

Chem.

[0108] Compound 5... 5-Amino-1H-tetrazole (the following compound)

[0109]

Chem.

[0110] Compound 6…1,2,3-Benzotriazole (trade name: BT-120, Johoku Chemical Industry Co., Ltd., the following compound)

[0111]

Chemical formula

[0112] Compound 7…1-[N,N-Bis(2-ethylhexyl)aminomethyl]benzotriazole (trade name: BT-LX, Johoku Chemical Industry Co., Ltd., the following compound)

[0113]

Chemical formula

[0114]

Table 1

[0115]

Table 2

[0116] In Table 1 and Table 2, the compounding amount of the curing agent is shown as a mass ratio when the total mass of the curing agent is 100. The compounding amounts of the colorant, inorganic filler, and test compound are shown as the content rate (mass%) with respect to the total mass of the underfill material. The compounding amounts of the curing accelerator and ion trap agent are shown as the mass parts of each component with respect to 100 total mass parts of the epoxy resin. In the above underfill material, the ratio of the number of active hydrogens in the curing agent to the number of epoxy groups in the epoxy resin (number of active hydrogens in the curing agent / number of epoxy groups in the epoxy resin) is 1.0.

[0117] 〔Evaluation of viscosity〕 The viscosity (Pa·s) of the underfill material at 25°C was measured using an E-type viscometer (manufactured by Tokyo Keiki Co., Ltd., VISCONIC EHD type (trade name)) (cone angle 3°, rotation speed: 10 revolutions per minute (rpm)).

[0118] 〔Evaluation of Pot Life〕 After leaving the underfill material at 25°C for 24 hours, the viscosity at 25°C was measured using an E-type viscometer (manufactured by Tokyo Keiki Co., Ltd., VISCONIC EHD type (trade name)) (cone angle 3°, rotation speed 10 revolutions per minute (rpm)) (viscosity after standing). However, for samples with high viscosity that could not be measured at 10 revolutions per minute (rpm), the measurement was performed at 2.5 revolutions per minute (rpm). The pot life (%) was calculated as the viscosity increase rate after standing for 24 hours according to the following formula. Pot life (%) = {(viscosity after standing - initial viscosity) / initial viscosity} × 100

[0119] 〔Evaluation of Adhesive Strength at 25°C or 260°C〕 · Adhesive Strength to Copper (Cu) Test pieces were prepared by forming the underfill material on the surface of a copper plate into a shape with a diameter of 3 mm and a height of 3 mm. Using a bond tester DS100 type (manufactured by DAGE), shear stress was applied under the conditions of a head speed of 50 μm / sec and 25°C or 260°C, and the strength at which the molded product peeled off from the copper plate was measured.

[0120] The evaluation results are shown in Tables 3 and 4. In Tables 3 and 4, "-" indicates non-applicability. "Measurement impossible" in the evaluation of pot life indicates that thickening was significant and measurement could not be performed.

[0121]

Table 3

[0122]

Table 4

[0123] As shown in Tables 3 and 4, the underfill materials of Examples 1 to 6 containing Test Compound 1 were excellent in pot life and adhesive strength to copper at 260°C. On the one hand, the underfill material of Comparative Example 1 that does not contain Test Compound 1 had a slightly higher adhesion to copper at 25°C, but its adhesion to copper at 260°C was poor. Among the underfill materials of Comparative Examples 2 to 7 containing various test compounds, some had a significantly inferior pot life, and some had poor adhesion to copper at 260°C. Further, the underfill materials of Comparative Examples 8 or 9 that contain Test Compound 1 but substitute the curing agent with Curing Agent 3 or 4 also had an inferior pot life and adhesion to copper at 260°C.

[0124] The disclosure of Japanese Patent Application No. 2020-009238 is incorporated herein by reference in its entirety. All documents, patent applications, and technical standards described in this specification are incorporated herein by reference to the same extent as if each individual document, patent application, and technical standard was specifically and individually indicated to be incorporated by reference.

Claims

1. An epoxy resin, an aromatic amine curing agent, an inorganic filler, a compound having a triazine ring and an alkoxysilyl group, and an underfill material containing the same.

2. The underfill material according to Claim 1, wherein the compound having a triazine ring and an alkoxysilyl group has a melting point of 200°C or lower.

3. The underfill material according to Claim 1 or Claim 2, wherein the compound having a triazine ring and an alkoxysilyl group further has a primary amino group.

4. An epoxy resin, an aromatic amine curing agent, an inorganic filler, a compound having a triazine ring and a primary amino group and having a melting point of 200°C or lower, and an underfill material containing the same.

5. A semiconductor package comprising a substrate, a semiconductor element disposed on the substrate, and a cured product of the underfill material according to any one of Claims 1 to 4 that seals the semiconductor element.

6. A method for manufacturing a semiconductor package, the method comprising a step of filling a gap between a substrate and a semiconductor element disposed on the substrate with the underfill material according to any one of Claims 1 to 5, and a step of curing the underfill material.

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