Coil component and IC card having the same

Abstract

To suppress voids from occurring around a coil pattern, in a coil component including a coil pattern and a magnetic body covering the coil pattern.SOLUTION: A coil component 1 includes: a coil pattern CP having a seed part S including a resin and having first and second surfaces S1, S2 positioned on mutually opposite sides, and a body part M made of a metal material and laminated on the second surface S2 of the seed part S; a magnetic body 30 covering the coil pattern CP; and a first resin layer 10 positioned between the coil pattern CP and the magnetic body 30 and including spherical filler particles F1 and a binder resin R1. The coil pattern CP is embedded in the first resin layer 10 such that the first surface S1 of the seed part S is exposed from the first resin layer 10.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present disclosure relates to a coil component and an IC card including the same.

Background Art

[0002] Patent Document 1 discloses a configuration in which wiring constituting a coil pattern is covered with a magnetic layer containing magnetic particles.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, since the magnetic particles described in Patent Document 1 have a flat shape, when the aspect ratio is increased to enhance the magnetic properties, the magnetic layer cannot follow the unevenness on the insulating layer due to the wiring, and as a result, there is a problem that voids are generated around the wiring.

[0005] The present disclosure describes a technique for suppressing voids around a coil pattern in a coil component including a coil pattern and a magnetic body covering the same.

Means for Solving the Problems

[0006] A coil component according to an embodiment of the present disclosure includes a coil pattern including a seed portion containing resin and having first and second surfaces located on opposite sides of each other, and a main body portion made of a metal material laminated on the second surface of the seed portion, a magnetic body covering the coil pattern, and a first resin layer located between the coil pattern and the magnetic body and including spherical filler particles and a binder resin. The coil pattern is embedded in the first resin layer such that the first surface of the seed portion is exposed from the first resin layer.

Effects of the Invention

[0007] According to the present disclosure, a technique for suppressing a gap around a coil pattern in a coil component including a coil pattern and a magnetic body covering the same is provided.

Brief Description of the Drawings

[0008]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Mode for Carrying Out the Invention

[0009] Hereinafter, preferred embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0010] FIG. 1 is a schematic perspective view showing an external appearance of an IC card 2 including a coil component according to an embodiment of the present disclosure.

[0011] As shown in FIG. 1, the IC card 2 according to this embodiment is a plate-like body with the Y direction as the longitudinal direction, the X direction as the short-side direction, and the Z direction as the thickness direction, and has an upper surface 2a and a back surface 2b that constitute the XY plane. An IC module described later is built in the IC card 2, and the terminal electrodes E of the IC module are exposed on the upper surface 2a of the IC card 2.

[0012] FIGS. 2 and 3 are a schematic exploded perspective view and a schematic cross-sectional view, respectively, for explaining the structure of the IC card 2 including the coil component 1 according to this embodiment.

[0013] The IC card 2 shown in FIGS. 2 and 3 has a structure in which a plastic plate 40, a coil component 1, and a metal plate 50 are laminated in this order from the back surface 2b side toward the upper surface 2a side. The coil component 1 according to this embodiment is composed of a coil pattern CP, a first resin layer 10, and a magnetic body 30. The plastic plate 40 and the coil component 1 are adhered via an adhesive layer 71. The metal plate 50 and the coil component 1 are adhered via an adhesive layer 72. Examples of the materials for the adhesive layers 71 and 72 include acrylic double-sided tape, thermosetting resin, and thermoplastic resin.

[0014] The plastic plate 40 is made of a resin material that does not impede magnetic flux. The outer surface of the plastic plate 40 constitutes the back surface 2b of the IC card 2. The metal plate 50 is made of a metal material such as stainless steel or titanium. The outer surface of the metal plate 50 constitutes the upper surface 2a of the IC card 2. A through hole 51 is provided in the metal plate 50, and the IC module 60 is disposed inside the through hole 51. In this way, the IC card 2 is a card in which a metal plate is used for the main body.

[0015] The IC module 60 includes a module substrate 61, an IC chip 62 mounted on or incorporated in the module substrate 61, and a coupling coil 63. The IC chip 62 is protected by being covered with a dome-shaped protective resin 64. Terminal electrodes E shown in FIG. 1 are provided on the surface of the module substrate 61 opposite to the surface on which the IC chip 62 is mounted. The IC module 60 having such a configuration electromagnetically couples with a coupling coil CP1 which is a part of the coil pattern CP. Thereby, communication between an external card reader and the IC chip 62 becomes possible via an antenna coil CP2 which is another part of the coil pattern CP.

[0016] FIG. 4 is a partial cross-sectional view of the coil component 1.

[0017] As shown in FIG. 4, the coil pattern CP is embedded in the first resin layer 10 such that a part thereof is exposed from the surface 10A of the first resin layer 10. The coil pattern CP includes a seed portion S containing resin and a main body portion M made of a metal material laminated on the second surface S2 of the seed portion S. The first surface S1 of the seed portion S is exposed from the first resin layer 10. The first surface S1 and the second surface S2 are located on opposite sides of each other. The coil pattern CP is formed on the surface of a base material (not shown), but the base material may be peeled off thereafter. In this case, the base material is not included in the coil component 1. Thereby, the thickness of the coil component 1 in the Z direction is reduced. The Z direction is the coil axis direction of the coil pattern CP and also the thickness direction of the coil pattern CP. Alternatively, the base material may be left as it is without being peeled off. In this case, the first surface S1 of the seed portion S is constituted by the base material used for forming the coil pattern CP.

[0018] The coil pattern CP is embedded in the first resin layer 10 such that the first surface S1 of the seed portion S is exposed from the surface 10A of the first resin layer 10. The metal material constituting the main body portion M of the coil pattern CP may be Cu. The seed portion S may contain a material that functions as a catalyst when plating the main body portion M. The thickness of the main body portion M may be greater than the thickness of the seed portion S. According to this, it is possible to reduce the resistance value of the coil pattern CP.

[0019] The entire main body portion M may be embedded in the first resin layer 10 without being exposed from the first resin layer 10. Alternatively, a part of the main body portion M, for example, the portion covering the side surface of the seed portion S, may be exposed from the first resin layer 10. In the example shown in FIG. 4, the seed portion S is also embedded in the first resin layer 10, and the surface 10A of the first resin layer 10 and the first surface S1 of the seed portion S form the same plane.

[0020] The first resin layer 10 is positioned between the coil pattern CP and the magnetic body 30 so as to be sandwiched from the Z direction. The first resin layer 10 includes spherical filler particles F1 and a binder resin R1. The thickness T of the first resin layer 10 in the Z direction 10 is, for example, 30 to 50 μm. The surface 10B of the first resin layer 10 in contact with the magnetic body 30 is substantially flat. Therefore, at the location where the coil pattern CP exists, the thickness of the first resin layer 10 becomes thinner. The thickness T of the first resin layer between the coil pattern CP and the magnetic body 30 10' is the value obtained by subtracting the thickness T 10 of the coil pattern CP from the thickness T CP of the first resin layer 10. The thickness T CP of the coil pattern CP is, for example, 10 to 30 μm.

[0021] The filler particles F1 are spherical. By using the spherical filler particles F1, while increasing the strength of the first resin layer 10, it becomes difficult for voids to occur around the coil pattern CP. As the material of the filler particles F1, a non-magnetic inorganic material such as alumina may be used, or a magnetic material such as ferrite or an Fe-based alloy magnetic material may be used. Examples of the Fe-based alloy magnetic material include permalloy, sendust, Fe-Si-Cr, Fe-Si, carbonyl iron, an Fe-based alloy amorphous powder containing at least Fe-Si-B, or an Fe-based alloy nanocrystalline powder containing at least Fe-B-P-Cu. If a magnetic material is used as the material of the filler particles F1, the inductance of the coil pattern CP can be increased. The average particle diameter (D 50 ) of the filler particles F1 is, for example, 2 to 10 μm. Note that the average particle diameter is the value of D50 in the laser diffraction particle size distribution measurement.

[0022] As the material of the binder resin R1, acrylic resin, polyester resin, polyethylene resin, polyvinyl chloride resin, polyvinyl butyral resin, polyurethane resin, polyester urethane resin, cellulose resin, ABS (acrylonitrile-butadiene-styrene) resin, nitrile-butadiene rubber, styrene-butadiene rubber, epoxy resin, phenol resin, amide resin, polyester-based elastomer, polyamide-based elastomer, etc. can be mentioned. The elongation rate obtained by the tensile test of the resin used as the binder resin R1 may be greater than 400%.

[0023] Here, the thickness T of the first resin layer between the coil pattern CP and the magnetic body 30 10' can be set thinner as the average particle diameter (D 50 ) of the filler particles F1 is smaller. According to this, while ensuring the filling rate of the filler particles F1 in the first resin layer 10, it becomes possible to disperse the filler particles F1 more uniformly. For example, when the average particle diameter (D 50 ) of the filler particles F1 is less than 5 μm, the thickness T of the first resin layer between the coil pattern CP and the magnetic body 30 10' is set to the thickness T of the coil pattern CPCP Even if it is set thinner, while ensuring the filling rate of the filler particles F1 in the first resin layer 10, the filler particles F1 can be uniformly dispersed. Therefore, the thickness of the entire coil component 1 can be made thinner, and the distance between the coil pattern CP and the magnetic body 30 can be shortened. On the other hand, when the average particle diameter (D 50 ) of the filler particles F1 is 5 μm or more, the thickness T 10' of the first resin layer between the coil pattern CP and the magnetic body 30 is set to be thicker than the thickness T CP of the coil pattern CP. In this way, while ensuring the filling rate of the filler particles F1 in the first resin layer 10, the filler particles F1 can be uniformly dispersed.

[0024] The magnetic body 30 is used to prevent the application of magnetic flux to the metal plate 50 by covering the antenna coil CP2 which is a part of the coil pattern CP. The magnetic body 30 is not provided at the position overlapping with the coupling coil CP1, that is, at the position overlapping with the through hole 51 of the metal plate 50. The thickness T 30 of the magnetic body 30 in the Z direction is, for example, 50 μm. The thickness T 30 of the magnetic body 30 may be thicker than the thickness T 10 of the first resin layer. According to this, the inductance of the coil pattern CP can be increased.

[0025] The magnetic body 30 may be a magnetic resin layer containing flat magnetic powder F3 and a binder resin R3. The flat magnetic powder F3 may be made of a metallic magnetic material such as Sendust, Permalloy, Fe-Si-Cr alloy magnetic body, Fe-Si-Al-Cr alloy magnetic body, or Fe-Al-Cr alloy magnetic body. The thickness direction of the flat magnetic powder F3 is the Z direction, and the longitudinal direction is the XY plane direction orthogonal to the Z direction. The flat magnetic powder F3 is oriented such that the longitudinal direction is substantially parallel to the XY plane direction. Thereby, the magnetic permeability in the XY plane direction of the magnetic body 30 is increased. However, it is not necessary for the longitudinal directions of all the flat magnetic powder F3 to be exactly parallel to the XY plane direction, and the longitudinal directions of some of the flat magnetic powder F3 may have an inclination with respect to the XY plane direction. The size of the flat magnetic powder F3 in the XY plane direction may be larger than the thickness T 30 in the Z direction of the magnetic body 30. According to this, the magnetic permeability in the XY plane direction of the magnetic body 30 is further increased.

[0026] Examples of the material for the binder resin R3 include acrylic resins, polyester resins, polyethylene resins, polyvinyl chloride resins, polyvinyl butyral resins, polyurethane resins, polyester urethane resins, cellulose resins, ABS (acrylonitrile-butadiene-styrene) resins, nitrile-butadiene rubbers, styrene-butadiene rubbers, epoxy resins, phenol resins, amide resins, polyester-based elastomers, polyamide-based elastomers, and the like. The binder resin R3 may be the same resin material as the binder resin R1 contained in the first resin layer 10, or may be a different resin material. The elongation rate determined by the tensile test of the resin used as the binder resin R3 may be greater than 400%. When the binder resin R1 contained in the first resin layer 10 and the binder resin R3 contained in the magnetic body 30 are made of the same resin material, the adhesion between the first resin layer 10 and the magnetic body 30 is enhanced. A curing agent may be added to the binder resin R3. If a curing agent is added to the binder resin R3, the heat resistance and moisture resistance of the magnetic body 30 are enhanced. When the magnetic body 30 is a magnetic resin layer containing the flat magnetic powder F3 and the binder resin R3, the ratio of the flat magnetic powder F3 to the binder resin R3 (=F3 / R3) may be about 4 to 8. According to this, it becomes possible to increase the magnetic permeability of the magnetic body 30. On the other hand, for the first resin layer 10, the ratio of the filler particles F1 to the binder resin R1 (=F1 / R1) may be smaller than the value of F3 / R3. According to this, it becomes possible to enhance the adhesion of the first resin layer 10 to the coil pattern CP and the magnetic body 30.

[0027] As described above, in the coil component 1 according to the present embodiment, since the first resin layer 10 is provided between the coil pattern CP and the magnetic body 30, even when the aspect ratio of the flat magnetic powder F3 contained in the magnetic body 30 is large, voids are less likely to occur around the coil pattern CP. Therefore, it is possible to prevent peeling of the coil pattern CP and the like. Moreover, since the first resin layer 10 contains spherical filler particles F1, it is possible to increase the strength of the first resin layer 10 while preventing the generation of voids.

[0028] In addition, compared with the case where an adhesive sheet or the like is used instead of the first resin layer 10, it is possible to reduce the thickness of the entire coil component 1. In the present embodiment, since the base material used for forming the coil pattern CP is removed, the thickness of the entire coil component 1 becomes thinner. Further, since the seed portion S is exposed from the surface 10A of the first resin layer 10 without exposing all or most of the main body portion M of the coil pattern CP, it is possible to protect the main body portion M of the coil pattern CP.

[0029] FIG. 5 is a partial cross-sectional view of a coil component 1A according to a first modification.

[0030] The coil component 1A according to the first modification shown in FIG. 5 is different from the coil component 1 shown in FIG. 4 in that the magnetic body 30 is made of a ferrite sintered body. Since the other basic configuration is the same as that of the coil component 1 shown in FIG. 4, the same reference numerals are assigned to the same elements, and redundant descriptions are omitted.

[0031] As illustrated by the coil component 1A according to the first modification, the magnetic body 30 may be a ferrite sintered body. According to this, it is possible to further increase the inductance of the coil pattern CP. The ferrite sintered body may be an aggregate of individual pieces P divided into a plurality by cracks extending in the Z direction. According to this, it is possible to prevent breakage of the magnetic body 30 made of a ferrite sintered body. The extending direction of the cracks does not necessarily have to be strictly in the Z direction, and may include cracks having an inclination with respect to the Z direction or cracks extending in the XY plane direction. Further, the binder resin R1 constituting the first resin layer 10 may penetrate into the gaps (cracks) between the individual pieces P of the ferrite sintered body. According to this, since the individual pieces P are fixed by the binder resin R1, it is possible to increase the strength of the magnetic body 30. Note that the penetration of the binder resin R1 into the gaps between the individual pieces P of the ferrite sintered body may be only in some of the plurality of gaps, or may be only in the region on the first resin layer 10 side of the gap.

[0032] FIG. 6 is a partial cross-sectional view of the coil component 1B according to the second modification.

[0033] The coil component 1B according to the second modification shown in FIG. 6 is different from the coil component 1 shown in FIG. 4 in that the first resin layer 10 includes a first region 11 and a second region 12. Since the other basic configurations are the same as those of the coil component 1 shown in FIG. 4, the same elements are denoted by the same reference numerals, and redundant descriptions are omitted.

[0034] The first region 11 is located on the side of the magnetic body 30. The second region 12 is a region for embedding the coil pattern CP and constitutes the surface 10A. A part of the coil pattern CP may be embedded in the first region 11. The first region 11 and the second region 12 may be made of the same material or different materials. Thus, by configuring the first resin layer 10 from two regions, the adhesion to the coil pattern CP and the magnetic body 30 is enhanced. The first region 11 and the second region 12 may be configured by dividing the single-layer first resin layer 10 into two regions, or may be configured by making the first resin layer 10 a two-layer structure. The first resin layer 10 having a two-layer structure can be formed by applying a first layer (first region 11) on the surface of the magnetic body 30 and then applying a second layer (second region 12) on the surface of the first layer (first region 11).

[0035] Alternatively, a second layer (second region 12) may be applied to the surface of a base material (not shown) used for forming the coil pattern CP, and a first layer (first region 11) in which the magnetic body 30 is formed may be laminated on the surface of the second layer (second region 12). In this case, if an uncured curing agent is added to the binder resin R3 contained in the magnetic body 30, the curing agent may penetrate into the underlying first layer (first region 11). As a result, the characteristics of the first layer (first region 11) change, but since the curing agent does not reach the second layer (second region 12), the embedding characteristics of the coil pattern CP do not deteriorate. Further, since the concentration of the curing agent contained in the first layer (first region 11) is lower than the concentration of the curing agent contained in the magnetic resin layer, which is the magnetic body 30, the characteristics required for the first layer (first region 11) are not significantly impaired. Rather, the heat resistance and moisture resistance of the first resin layer 10 are improved, and the adhesion between the first resin layer 10 and the magnetic body 30 is enhanced.

[0036] FIG. 7 is a partial cross-sectional view of the coil component 1C according to the third modification.

[0037] The coil component 1C according to the third modification shown in FIG. 7 is different from the coil component 1B shown in FIG. 6 in that it further includes a second resin layer 20 located on the surface opposite to the first resin layer 10 of the magnetic body 30. Since the other basic configurations are the same as those of the coil component 1B shown in FIG. 6, the same reference numerals are assigned to the same elements, and redundant descriptions are omitted.

[0038] The second resin layer 20 may be made of the same material as the first resin layer 10. That is, the second resin layer 20 may contain the same spherical filler particles as the filler particles F1 contained in the first resin layer 10 and the same binder resin as the binder resin R1 contained in the first resin layer 10. Regarding the second resin layer 20, since it is not necessary to embed the coil pattern CP, the ratio of the filler particles to the binder resin can be increased compared to the first resin layer 10, and according to this, the strength of the second resin layer 20 can be increased.

[0039] In this way, if the magnetic body 30 is sandwiched between the first resin layer 10 and the second resin layer 20, it becomes possible to protect the magnetic body 30 from both sides. Further, the magnetic body 30 can be attached to other members by the second resin layer 20. For example, the second resin layer 20 can be used as an adhesive layer instead of the adhesive layer 72 in FIG. 3.

[0040] FIG. 8 is a partial cross-sectional view of the coil component 1D according to the fourth modification.

[0041] The coil component 1D according to the fourth modification shown in FIG. 8 is different from the coil component 1 shown in FIG. 4 in that the thickness of the magnetic body 30 in the portion not overlapping the coil pattern CP is larger than the thickness of the magnetic body 30 in the portion overlapping the coil pattern CP. Since the other basic configuration is the same as that of the coil component 1 shown in FIG. 4, the same elements are denoted by the same reference numerals, and redundant descriptions are omitted.

[0042] In this way, if the thickness of the magnetic body 30 in the portion not overlapping the coil pattern CP is increased, it becomes possible to obtain higher magnetic characteristics. In the example shown in FIG. 8, the Z-direction position of the boundary (10B) between the first resin layer 10 and the magnetic body 30 in the portion not overlapping the coil pattern CP is included within the height range of the coil pattern CP. According to this, it becomes possible to obtain even higher magnetic characteristics.

[0043] As described above, the preferred embodiments of the present disclosure have been described. However, the present disclosure is not limited to the above-described embodiments, and various modifications can be made without departing from the gist of the present disclosure, and it goes without saying that those are also included in the scope of the present disclosure.

[0044] For example, the second resin layer 20 shown in FIG. 7 may be added to the coil component 1 shown in FIG. 4 or the coil component 1A shown in FIG. 5.

[0045] The technology according to the present disclosure includes, but is not limited to, the following configuration examples.

[0046] According to one embodiment of the present disclosure, a coil component includes a seed portion containing a resin and having first and second surfaces located on opposite sides of each other, and a coil pattern including a main body portion laminated on the second surface of the seed portion and made of a metal material, a magnetic body covering the coil pattern, and a first resin layer located between the coil pattern and the magnetic body and containing spherical filler particles and a binder resin. The coil pattern is embedded in the first resin layer such that the first surface of the seed portion is exposed from the first resin layer. According to this, since the coil pattern and the first resin layer are in close contact with each other, voids are less likely to occur around the coil pattern.

[0047] In the above coil component, the thickness of the main body portion may be greater than the thickness of the seed portion. According to this, it is possible to reduce the resistance value of the coil pattern.

[0048] In the above coil component, the average particle diameter of the filler particles is less than 5 μm, and the thickness of the first resin layer between the coil pattern and the magnetic body may be less than the thickness of the coil pattern. According to this, it is possible to make the overall thickness of the coil component thinner.

[0049] In the above coil component, the average particle diameter of the filler particles is 5 μm or more, and the thickness of the first resin layer between the coil pattern and the magnetic body may be greater than the thickness of the coil pattern. According to this, it is possible to uniformly disperse the filler particles while ensuring the filling rate of the filler particles.

[0050] The above coil component may further include a second resin layer located on the surface of the magnetic body opposite to the first resin layer. According to this, it is possible to protect the magnetic body from both sides.

[0051] In the above coil component, the second resin layer may contain filler particles and a binder resin. According to this, it is possible to increase the strength of the second resin layer. Also, it is possible to adhere the magnetic body to other members with the second resin layer.

[0052] In the above coil component, the magnetic material is a ferrite sintered body, and the ferrite sintered body may be an aggregate of a plurality of divided pieces. According to this, it is possible to increase the magnetic permeability of the magnetic material and suppress changes in magnetic characteristics.

[0053] In the above coil component, the binder resin of the first resin layer may penetrate into at least a part of the gaps between the pieces of the ferrite sintered body. According to this, since the pieces are adhered by the binder resin, it is possible to increase the strength of the magnetic material.

[0054] In the above coil component, the magnetic material may be a magnetic resin layer containing flat magnetic powder and a binder resin. According to this, not only is it easy to process the coil component, but it is also possible to give flexibility to the entire coil component.

[0055] In the above coil component, the first resin layer may include a first region located on the magnetic material side and a second region for embedding the coil pattern. According to this, the adhesion of the first resin layer to the coil pattern and the magnetic material is enhanced.

[0056] In the above coil component, the magnetic resin layer contains a curing agent, and the first region may contain the same curing agent as the curing agent contained in the magnetic resin layer. According to this, it is possible to increase the heat resistance and moisture resistance of the first resin layer.

[0057] In the above coil component, the concentration of the curing agent contained in the first region may be lower than the concentration of the curing agent contained in the magnetic resin layer. According to this, it is possible to ensure the embedding characteristics of the first resin layer.

[0058] In the above coil component, the ratio of the flat magnetic powder contained in the magnetic resin layer to the binder resin contained in the magnetic resin layer may be larger than the ratio of the filler particles contained in the first resin layer to the binder resin contained in the first resin layer. According to this, it becomes possible to obtain a high inductance while ensuring the coil pattern embedding characteristics.

[0059] An IC card according to an embodiment of the present disclosure includes the above coil component. According to this, it becomes possible to provide a thin IC card.

Explanation of Signs

[0060] 1, 1A, 1B, 1C, 1D Coil component 2 IC card 2a Upper surface of the IC card 2b Back surface of the IC card 10 First resin layer 10A, 10B Surfaces of the first resin layer 20 Second resin layer 30 Magnetic body 40 Plastic plate 50 Metal plate 51 Through hole 60 IC module 61 Module substrate 62 IC chip 63 Coupling coil 64 Protective resin 71, 72 Adhesive layer CP Coil pattern CP1 Coupling coil CP2 Antenna coil E Terminal electrode F1 Filler particles F3 Flat magnetic powder M Body part P Individual piece R1, R3 Binder resin S Seed part S1, S2 Surfaces of the seed part

Claims

1. A coil component comprising a seed portion containing a resin and having first and second surfaces located on opposite sides of each other, and a main body portion laminated on the second surface of the seed portion and made of a metal material, a magnetic body covering the coil pattern, and a first resin layer located between the coil pattern and the magnetic body and containing spherical filler particles and a binder resin. The coil pattern is embedded in the first resin layer such that the first surface of the seed portion is exposed from the first resin layer. Coil component.

2. The thickness of the main body portion is thicker than the thickness of the seed portion. The coil component according to claim 1.

3. The average particle diameter of the filler particles is less than 5 μm. The thickness of the first resin layer between the coil pattern and the magnetic body is thinner than the thickness of the coil pattern. The coil component according to claim 1.

4. The average particle diameter of the filler particles is 5 μm or more. The thickness of the first resin layer between the coil pattern and the magnetic body is thicker than the thickness of the coil pattern. The coil component according to claim 1.

5. Further comprising a second resin layer located on the surface of the magnetic body opposite to the first resin layer. The coil component according to claim 1.

6. The second resin layer contains filler particles and a binder resin. The coil component according to claim 5.

7. The magnetic body is a ferrite sintered body. The ferrite sintered body is an aggregate of a plurality of divided pieces. The coil component according to claim 1.

8. The binder resin of the first resin layer has penetrated into at least a part of the gaps between the pieces of the ferrite sintered body. The coil component according to claim 7.

9. The magnetic body is a magnetic resin layer containing flat magnetic powder and a binder resin. The coil component according to claim 1.

10. The first resin layer includes a first region located on the magnetic body side and a second region for embedding the coil pattern. The coil component according to claim 9.

11. The magnetic resin layer contains a curing agent. The first region contains the same curing agent as the curing agent contained in the magnetic resin layer. The coil component according to claim 10.

12. The concentration of the curing agent contained in the first region is lower than the concentration of the curing agent contained in the magnetic resin layer. The coil component according to claim 11.

13. The ratio of the flat magnetic powder contained in the magnetic resin layer to the binder resin contained in the magnetic resin layer is greater than the ratio of the filler particles contained in the first resin layer to the binder resin contained in the first resin layer. The coil component according to claim 1.

14. An IC card including the coil component according to any one of claims 1 to 13.

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