Optical sensor

Abstract

To reduce the cost of an optical sensor.SOLUTION: An optical sensor 10 includes: a lead 20 including a first terminal 21, second terminal 22, and an intermediate terminal 25 located between the first terminal 21 and the second terminal 22 in an X-direction; a light-emitting element 30 mounted on the first terminal 21; a light-receiving element 40 mounted on the second terminal 22; a light-shielding member 70, provided on the intermediate terminal 25, which is made of a resin; a translucent sealing member 60 which seals at least the light-emitting element 30, the light-receiving element 40, and the light-shielding member 70; and a groove 80, located above the intermediate terminal 25, which penetrates the sealing member 60 so as to reach the light-shielding member 70.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present disclosure relates to an optical sensor.

Background Art

[0002] Patent Document 1 discloses an optical sensor including a substrate, a light-emitting element and an integrated circuit disposed on the substrate, and a light-transmissive coating member that seals the light-emitting element and the integrated circuit. The integrated circuit includes one or more light-receiving elements. The substrate is made of an insulating material such as glass epoxy resin.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

[0004] [Summary] Cost reduction of optical sensors is desired.

[0005] An optical sensor according to one aspect of the present disclosure includes a lead including a first terminal, a second terminal disposed at a distance from the first terminal in a first direction, and an intermediate terminal disposed between the first terminal and the second terminal in the first direction, a light-emitting element mounted on the first terminal, a light-receiving element mounted on the second terminal, a light-shielding member provided on the intermediate terminal and made of resin, a light-transmissive sealing member that seals at least the light-emitting element, the light-receiving element, and the light-shielding member, and a groove disposed above the intermediate terminal and reaching the light-shielding member through the sealing member.

Brief Description of the Drawings

[0006]

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[0007] [Detailed Description] Hereinafter, some embodiments of the optical sensor in the present disclosure will be described with reference to the accompanying drawings. Note that, for the sake of simplicity and clarity of the description, the components shown in the drawings are not necessarily drawn to a certain scale. Also, for ease of understanding, the hatching lines may be omitted in the cross-sectional views. The accompanying drawings are merely illustrative of the embodiments of the present disclosure and should not be regarded as limiting the present disclosure.

[0008] The following detailed description includes apparatuses, systems, and methods that embody exemplary embodiments of the present disclosure. This detailed description is for illustrative purposes only and is not intended to limit the embodiments of the present disclosure or the application and use of such embodiments.

[0009] As used herein, the expression "at least one" means "one or more" of the desired options. As an example, as used herein, the expression "at least one" means "only one option" or "both of the two options" if the number of options is two. As another example, as used herein, the expression "at least one" means "only one option" or "any combination of two or more options" if the number of options is three or more.

[0010] As used herein, "the dimension of A (depth, width, length, height) is equal to the dimension of B (depth, width, length, height)" or "the dimension of A (depth, width, length, height) and the dimension of B (depth, width, length, height) are equal to each other" includes a relationship in which the difference between the dimension of A (depth, width, length, height) and the dimension of B (depth, width, length, height) is within 10% of the dimension of A (depth, width, length, height), for example.

[0011] <Embodiment> [Configuration of Optical Sensor] With reference to FIGS. 1 to 6, the configuration of an optical sensor 10 according to an embodiment will be described. FIG. 1 schematically shows a perspective structure of the optical sensor 10 according to an embodiment. FIG. 2 schematically shows a plan structure of the optical sensor 10 of FIG. 1. FIG. 3 schematically shows a back surface structure of the optical sensor 10 of FIG. 1. FIG. 4 schematically shows a side surface structure of the optical sensor 10 of FIG. 1. FIG. 5 schematically shows a cross-sectional structure obtained by cutting the optical sensor 10 along line F5-F5 of FIG. 2. FIG. 6 shows an enlarged view of a groove 80 and its periphery, which will be described later, in the cross-sectional structure of FIG. 5. In FIG. 4, for easy understanding of the drawing, first to third wires W1 to W3, which will be described later, are omitted.

[0012] As shown in FIGS. 1 and 2, the optical sensor 10 is formed in a rectangular flat plate shape with the Z direction as the thickness direction. Here, two directions orthogonal to each other among the directions orthogonal to the Z direction are defined as the "X direction" and the "Y direction". In this embodiment, the optical sensor 10 is formed in a rectangular shape in which the X direction is the long side and the Y direction is the short side when viewed from the Z direction. Hereinafter, "when viewed from the Z direction" may be referred to as "plan view". The plan view means viewing the optical sensor 10 or the components of the optical sensor 10 from the Z direction.

[0013] The optical sensor 10 mainly includes leads 20, a light-emitting element 30, a light-receiving element 40, a protection diode 50, and a sealing member 60. The sealing member 60 seals the leads 20, the light-emitting element 30, the light-receiving element 40, and the protection diode 50. In this embodiment, the optical sensor 10 is a reflective photosensor configured such that the light-receiving element 40 receives the reflected light reflected by a detection object from the light-emitting element 30 toward the detection object (not shown). Note that the reflective photosensor is also called a photo-reflector.

[0014] The sealing member 60 is made of a light-transmissive resin material. Also, the sealing member 60 is made of a resin material having electrical insulation properties. Examples of such resin materials include transparent or translucent epoxy resins, silicone resins, acrylic resins, and the like. In this embodiment, the sealing member 60 is made of a transparent epoxy resin. The sealing member 60 is formed in a rectangular flat plate shape with the Z direction as the thickness direction so as to form the outer surface of the optical sensor 10. The sealing member 60 includes a sealing upper surface 61 and a sealing lower surface 62 opposite to the sealing upper surface 61. The sealing member 60 also includes first to fourth sealing side surfaces 63 to 66 as four sealing side surfaces connecting the sealing upper surface 61 and the sealing lower surface 62. In the following description, the direction from the sealing lower surface 62 toward the sealing upper surface 61 is defined as "upward", and the direction from the sealing upper surface 61 toward the sealing lower surface 62 is defined as "downward".

[0015] Both the sealing upper surface 61 and the sealing lower surface 62 are formed by, for example, a plane orthogonal to the Z direction. In this embodiment, the sealing upper surface 61 is an emission surface through which the light emitted from the light-emitting element 30 is emitted toward the outside of the optical sensor 10, and is also a light-receiving surface through which the light-receiving element 40 receives the light from the outside of the optical sensor 10. The sealing lower surface 62 is a mounting surface on which the optical sensor 10 is mounted on a mounting substrate (not shown).

[0016] The first sealing side surface 63 and the second sealing side surface 64 constitute both end surfaces of the sealing member 60 in the X direction. The third sealing side surface 65 and the fourth sealing side surface 66 constitute both end surfaces of the sealing member 60 in the Y direction.

[0017] The lead 20 is formed in a flat plate shape with the Z direction being the thickness direction. Therefore, the Z direction is an example of the "thickness direction of the lead 20". The lead 20 is composed of a conductive material. Examples of the conductive material include metal materials such as copper (Cu) and aluminum (Al). The lead 20 is formed by etching a flat conductive plate (metal plate) made of a conductive material. The lead 20 includes first to fourth terminals 21 to 24 that are arranged separately from each other.

[0018] The first terminal 21 and the second terminal 22 are arranged separately in the X direction. The third terminal 23 is arranged separately from the first terminal 21 in the Y direction. The fourth terminal 24 is arranged separately from the second terminal 22 in the Y direction. Here, the X direction is an example of the "first direction", and the Y direction is an example of the "second direction".

[0019] As shown in FIGS. 2 and 3, the first terminal 21 is arranged at a corner portion closer to the first sealing side surface 63 and the third sealing side surface 65 among the four corner portions of the sealing member 60 in a plan view. The first terminal 21 includes a portion exposed from both the first sealing side surface 63 and the third sealing side surface 65.

[0020] The first terminal 21 includes a first upper portion 21A including a first terminal upper surface 21S and a first lower portion 21B including a first terminal lower surface 21R. The first lower portion 21B is recessed from the first upper portion 21A in the X direction and the Y direction. The first terminal upper surface 21S faces the same side as the sealing upper surface 61 (see FIG. 1), and the first terminal lower surface 21R faces the same side as the sealing lower surface 62. The first terminal lower surface 21R is exposed from the sealing lower surface 62. The first terminal lower surface 21R is arranged separately from both the first sealing side surface 63 and the third sealing side surface 65. Therefore, the first lower portion 21B is not exposed from both the first sealing side surface 63 and the third sealing side surface 65.

[0021] The second terminal 22 is disposed at a corner portion near the second sealing side surface 64 and the third sealing side surface 65 among the four corner portions of the sealing member 60 in a plan view. The second terminal 22 includes a portion exposed from both the second sealing side surface 64 and the third sealing side surface 65.

[0022] The second terminal 22 includes a second upper portion 22A including a second terminal upper surface 22S and a second lower portion 22B including a second terminal lower surface 22R. The second lower portion 22B is recessed from the second upper portion 22A in the X direction and the Y direction. The second terminal upper surface 22S faces the same side as the sealing upper surface 61, and the second terminal lower surface 22R faces the same side as the sealing lower surface 62. The second terminal lower surface 22R is exposed from the sealing lower surface 62. The second terminal lower surface 22R is disposed at a distance from both the second sealing side surface 64 and the third sealing side surface 65. Therefore, the second lower portion 22B is not exposed from both the second sealing side surface 64 and the third sealing side surface 65. The area of the second terminal upper surface 22S is larger than the area of the first terminal upper surface 21S. In one example, the area of the second terminal lower surface 22R is equal to the area of the first terminal lower surface 21R.

[0023] The third terminal 23 is disposed at a corner portion near the first sealing side surface 63 and the fourth sealing side surface 66 among the four corner portions of the sealing member 60 in a plan view. The third terminal 23 includes a portion exposed from both the first sealing side surface 63 and the fourth sealing side surface 66.

[0024] The third terminal 23 includes a third upper portion 23A including a third terminal upper surface 23S and a third lower portion 23B including a third terminal lower surface 23R. The third lower portion 23B is recessed from the third upper portion 23A in the X direction and the Y direction. The third terminal upper surface 23S faces the same side as the sealing upper surface 61, and the third terminal lower surface 23R faces the same side as the sealing lower surface 62. The third terminal lower surface 23R is exposed from the sealing lower surface 62. The third terminal lower surface 23R is disposed at a distance from both the first sealing side surface 63 and the fourth sealing side surface 66. Therefore, the third lower portion 23B is not exposed from both the first sealing side surface 63 and the fourth sealing side surface 66. The area of the third terminal upper surface 23S is smaller than the area of the first terminal upper surface 21S. The area of the third terminal lower surface 23R is smaller than the area of the first terminal lower surface 21R.

[0025] The fourth terminal 24 is disposed at a corner portion near the second sealing side surface 64 and the fourth sealing side surface 66 among the four corner portions of the sealing member 60 in a plan view. The fourth terminal 24 includes portions exposed from both the second sealing side surface 64 and the fourth sealing side surface 66.

[0026] The fourth terminal 24 includes a fourth upper portion 24A including a fourth terminal upper surface 24S and a fourth lower portion 24B including a fourth terminal lower surface 24R. The fourth lower portion 24B is recessed from the fourth upper portion 24A in the X direction and the Y direction. The fourth terminal upper surface 24S faces the same side as the sealing upper surface 61, and the fourth terminal lower surface 24R faces the same side as the sealing lower surface 62. The fourth terminal lower surface 24R is exposed from the sealing lower surface 62. The fourth terminal lower surface 24R is disposed at a distance from both the second sealing side surface 64 and the fourth sealing side surface 66. For this reason, the fourth lower portion 24B is not exposed from both the second sealing side surface 64 and the fourth sealing side surface 66. The area of the fourth terminal upper surface 24S is smaller than the area of the third terminal upper surface 23S. In one example, the area of the fourth terminal lower surface 24R is equal to the area of the third terminal lower surface 23R.

[0027] Note that the relationship of the areas of the first to fourth terminal upper surfaces 21S to 24S of the first to fourth terminals 21 to 24 can be arbitrarily changed. Also, the relationship of the areas of the first to fourth terminal lower surfaces 21R to 24R can be arbitrarily changed. Further, in FIG. 3, dots are attached to the first to fourth terminal lower surfaces 21R to 24R exposed from the sealing lower surface 62 for easy understanding of the drawing.

[0028] As shown in FIGS. 4 and 5, the height ZA of the first terminal 21, the height ZB of the second terminal 22, the height ZC of the third terminal 23, and the height ZD of the fourth terminal 24 are equal to each other. Here, the height ZA of the first terminal 21 can be defined as the distance in the Z direction between the upper surface 21S of the first terminal and the lower surface 21R of the first terminal. The height ZB of the second terminal 22 can be defined as the distance in the Z direction between the upper surface 22S of the second terminal and the lower surface 22R of the second terminal. The height ZC of the third terminal 23 can be defined as the distance in the Z direction between the upper surface 23S of the third terminal and the lower surface 23R of the third terminal. The height ZD of the fourth terminal 24 can be defined as the distance in the Z direction between the upper surface 24S of the fourth terminal and the lower surface 24R of the fourth terminal. Therefore, it can be said that the distances in the Z direction between the upper surface 21S and the lower surface 21R of the first terminal, between the upper surface 22S and the lower surface 22R of the second terminal, between the upper surface 23S and the lower surface 23R of the third terminal, and between the upper surface 24S and the lower surface 24R of the fourth terminal are equal to each other. Further, since the lower surfaces 21R to 24R of the first to fourth terminals 21 to 24 of the first to fourth terminals are exposed from the sealing lower surface 62, it can be said that the upper surface 21S of the first terminal 21, the upper surface 22S of the second terminal 22, the upper surface 23S of the third terminal 23, and the upper surface 24S of the fourth terminal 24 are arranged at the same position in the Z direction.

[0029] The light emitting element 30 is mounted on the first terminal 21. More specifically, as shown in FIG. 5, the light emitting element 30 is joined to the upper surface 21S of the first terminal 21 by a conductive joining material SD1. As the conductive joining material SD1, a silver (Ag) paste or a solder paste may be used. Here, the conductive joining material SD1 is an example of the "first joining material".

[0030] The light emitting element 30 includes a light emitting upper surface 31 and a light emitting lower surface 32 opposite to the light emitting upper surface 31. The light emitting upper surface 31 faces the same side as the sealing upper surface 61, and the light emitting lower surface 32 faces the same side as the sealing lower surface 62. The conductive joining material SD1 is in contact with the light emitting lower surface 32. That is, the conductive joining material SD1 is interposed between the light emitting element 30 and the first terminal 21.

[0031] As shown in FIG. 2, the light-emitting element 30 is disposed closer to the first sealing side surface 63 than the center in the X direction of the upper surface 21S of the first terminal on the upper surface 21S of the first terminal. The light-emitting element 30 is formed in a rectangular shape having a long side and a short side in plan view. The light-emitting element 30 is arranged such that the long side is along the Y direction and the short side is along the X direction.

[0032] The light-emitting element 30 is configured to emit light upward from the light-emitting upper surface 31. That is, it can be said that the light-emitting upper surface 31 constitutes a "light-emitting surface". In one example, the light-emitting element 30 is a semiconductor laser element. In one example, the light-emitting element 30 is a surface-emitting laser element. In one example, the light-emitting element 30 is a vertical cavity surface emitting laser (VCSEL).

[0033] The light-emitting element 30 includes a plurality of light-emitting regions 33 and an upper surface electrode 34 formed on the light-emitting upper surface 31. In plan view, the light-emitting element 30 is arranged such that the plurality of light-emitting regions 33 and the upper surface electrode 34 are arranged in the Y direction. That is, the light-emitting element 30 is configured such that the plurality of light-emitting regions 33 and the upper surface electrode 34 are arranged in the long side direction thereof. In one example, the upper surface electrode 34 is disposed closer to the third terminal 23 than the plurality of light-emitting regions 33. In one example, the upper surface electrode 34 constitutes an anode. Note that the number of the light-emitting regions 33 can be arbitrarily changed.

[0034] The upper surface electrode 34 is electrically connected to the third terminal 23 via a first wire W1 which is an example of a first connection member. The first wire W1 is joined to the upper surface electrode 34 and the upper surface 23S of the third terminal 23 of the third terminal. The first wire W1 is made of a conductive material such as Cu, Al, Ag, or gold (Au). Thus, it can be said that the optical sensor 10 includes a first connection member (first wire W1) that electrically connects the light-emitting element 30 and the third terminal 23.

[0035] As shown in FIG. 5, the light-emitting element 30 includes a bottom electrode 35 formed on the light-emitting bottom surface 32. In one example, the bottom electrode 35 is formed over the entire surface of the light-emitting bottom surface 32. In one example, the bottom electrode 35 constitutes a cathode. The bottom electrode 35 is electrically connected to the first terminal 21 via a conductive bonding material SD1.

[0036] The protection diode 50 is mounted on the first terminal 21. More specifically, the protection diode 50 is bonded to the upper surface 21S of the first terminal by a conductive bonding material SD3. As the conductive bonding material SD3, an Ag paste or a solder paste may be used. The protection diode 50 is an example of a protection element that protects the light-emitting element 30. In one example, the protection diode 50 is a Zener diode. Here, the conductive bonding material SD3 is an example of the "third bonding material".

[0037] The protection diode 50 includes a diode upper surface 51 and a diode lower surface 52 opposite to the diode upper surface 51. The diode upper surface 51 faces the same side as the sealing upper surface 61, and the diode lower surface 52 faces the same side as the sealing lower surface 62. In one example, the height of the protection diode 50 is lower than the height of the light-emitting element 30. In other words, the diode upper surface 51 of the protection diode 50 is disposed closer to the upper surface 21S of the first terminal than the light-emitting upper surface 31 of the light-emitting element 30 in the Z direction.

[0038] As shown in FIG. 2, an upper electrode 53 is formed on the diode upper surface 51. In one example, the upper electrode 53 constitutes a cathode. The upper electrode 53 is electrically connected to the third terminal 23 via a third wire W3 which is an example of a third connection member. The third wire W3 is made of a conductive material such as Cu, Al, Ag, or Au. In one example, the third wire W3 is made of the same material as the first wire W1. Thus, it can be said that the optical sensor 10 includes a third connection member (third wire W3) that electrically connects the protection diode 50 and the third terminal 23.

[0039] As shown in FIG. 5, a bottom electrode 54 is formed on the bottom surface 52 of the diode. In one example, the bottom electrode 54 is formed over the entire bottom surface 52 of the diode. In one example, the bottom electrode 54 constitutes an anode. The bottom electrode 54 is electrically connected to the first terminal 21 via a conductive bonding material SD3. That is, the anode of the protection diode 50 is electrically connected to the cathode of the light-emitting element 30, and the cathode of the protection diode 50 is electrically connected to the anode of the light-emitting element 30. Note that depending on the types of the light-emitting element 30 and the protection diode 50, the protection diode 50 may be connected in parallel with the light-emitting element 30. In this case, the top electrode 53 of the protection diode 50 may constitute an anode, and the bottom electrode 54 may constitute a cathode. Further, a bipolar protection diode 50 may be used. Note that, for example, a bidirectional TVS (Transient Voltage Suppressors) diode may be used as the protection diode 50.

[0040] The light-receiving element 40 is mounted on the second terminal 22. More specifically, the light-receiving element 40 is bonded to the top surface 22S of the second terminal by a conductive bonding material SD2. As the conductive bonding material SD3, an Ag paste or a solder paste may be used. Here, the conductive bonding material SD2 is an example of the “second bonding material”.

[0041] As shown in FIG. 2, the light-receiving element 40 is disposed at the center of the top surface 22S of the second terminal in plan view. The light-receiving element 40 is formed in a rectangular shape having a long side and a short side in plan view. The light-receiving element 40 is disposed such that the long side extends along the X direction and the short side extends along the Y direction. Note that the arrangement position of the light-receiving element 40 on the top surface 22S of the second terminal can be arbitrarily changed. Also, the shape of the light-receiving element 40 in plan view can be arbitrarily changed. In one example, the shape of the light-receiving element 40 in plan view may be a square.

[0042] As shown in FIG. 5, the light-receiving element 40 includes a light-receiving upper surface 41 and a light-receiving lower surface 42 on the side opposite to the light-receiving upper surface 41. The light-receiving upper surface 41 faces the same side as the sealing upper surface 61, and the light-receiving lower surface 42 faces the same side as the sealing lower surface 62. In one example, the height of the light-receiving element 40 is lower than the height of the light-emitting element 30. In other words, the light-receiving upper surface 41 of the light-receiving element 40 is disposed below the light-emitting upper surface 31 of the light-emitting element 30 in the Z direction. Note that the height of the light-receiving element 40 can be arbitrarily changed. In one example, the light-receiving upper surface 41 of the light-receiving element 40 may be disposed at the same position as the light-emitting upper surface 31 of the light-emitting element 30 in the Z direction. In another example, the light-receiving upper surface 41 may be disposed above the light-emitting upper surface 31.

[0043] The light-receiving element 40 is configured to receive light at the light-receiving upper surface 41. That is to say, it can be said that the light-receiving upper surface 41 constitutes a "light-receiving surface". In one example, the light-receiving element 40 is a photodiode. Note that the light-receiving element 40 may be a phototransistor instead of a photodiode.

[0044] As shown in FIG. 2, the light-receiving element 40 includes a light-receiving region 43 and an upper surface electrode 44 formed on the light-receiving upper surface 41. The light-receiving region 43 is formed in a rectangular shape having a long side and a short side in a plan view. The long side direction of the light-receiving region 43 is the same as the long side direction of the light-receiving element 40, and the short side direction of the light-receiving region 43 is the same as the short side direction of the light-receiving element 40. In one example, the upper surface electrode 44 is disposed at a position overlapping the light-receiving region 43 in a plan view. The upper surface electrode 44 is disposed at a position overlapping, in a plan view, with an end portion of the light-receiving region 43 on the side opposite to the light-emitting element 30 in the X direction. In one example, the upper surface electrode 44 constitutes an anode.

[0045] The upper electrode 44 is electrically connected to the fourth terminal 24 via a second wire W2 which is an example of a second connection member. The second wire W2 is joined to the upper electrode 44 and the upper surface 24S of the fourth terminal 24 of the fourth terminal 24. The second wire W2 is composed of a conductive material such as Cu, Al, Ag, Au, or the like. Thus, it can be said that the optical sensor 10 includes a second connection member (second wire W2) that electrically connects the light receiving element 40 and the fourth terminal 24.

[0046] As shown in FIG. 5, the light receiving element 40 includes a lower electrode 45 formed on the lower light receiving surface 42. In one example, the lower electrode 45 is formed over the entire surface of the lower light receiving surface 42. In one example, the lower electrode 45 constitutes a cathode. The lower electrode 45 is electrically connected to the second terminal 22 via a conductive bonding material SD2.

[0047] (Intermediate terminal, light shielding member, and groove) As shown in FIG. 2, lead 20 includes intermediate terminal 25. Intermediate terminal 25 is disposed at a position spaced apart from the four corner portions of the sealing member 60 in a plan view. Intermediate terminal 25 is disposed between the first terminal 21 and the second terminal 22 in the X direction. Intermediate terminal 25 is disposed spaced apart from both the first terminal 21 and the second terminal 22. It can also be said that intermediate terminal 25 is disposed between the third terminal 23 and the fourth terminal 24 in the X direction. Intermediate terminal 25 is disposed spaced apart from both the third terminal 23 and the fourth terminal 24. It can also be said that intermediate terminal 25 is disposed between the light-emitting element 30 and the light-receiving element 40 in the X direction. In one example, it can also be said that intermediate terminal 25 is disposed between the protection diode 50 and the light-receiving element 40 in the X direction. The sealing member 60 is filled between the intermediate terminal 25 and the first terminal 21. The sealing member 60 is filled between the intermediate terminal 25 and the second terminal 22. Thus, the intermediate terminal 25 is insulated from the first terminal 21 and the second terminal 22. Also, the sealing member 60 is filled between the intermediate terminal 25 and the third terminal 23. The sealing member 60 is filled between the intermediate terminal 25 and the fourth terminal 24. Thus, the intermediate terminal 25 is also insulated from the third terminal 23 and the fourth terminal 24. In one example, the intermediate terminal 25 is in an electrically floating state.

[0048] Intermediate terminal 25 extends in the Y direction so as to cross the entire opposing region RA of the light-emitting element 30 and the light-receiving element 40 in a plan view. Here, the opposing region RA is a region where the light-emitting element 30 and the light-receiving element 40 face each other in the X direction in this embodiment. In the example shown in FIG. 2, since the dimension YA in the Y direction of the light-emitting element 30 is shorter than the dimension YB in the Y direction of the light-receiving element 40, the opposing region RA is a range where the entire Y direction of the light-emitting element 30 faces the light-receiving element 40 in a plan view. In FIG. 2, the opposing region RA is indicated by a two-dot chain line.

[0049] In this embodiment, the intermediate terminal 25 extends in the Y direction from the third sealing side surface 65 to the fourth sealing side surface 66. In other words, the Y-direction dimension YR of the intermediate terminal 25 is equal to the Y-direction dimension YD of the sealing member 60. For this reason, as shown in FIGS. 2 and 4, the intermediate terminal 25 includes portions exposed from both the third sealing side surface 65 and the fourth sealing side surface 66. In FIG. 4, for convenience, portions of the components of the optical sensor 10 that are not exposed from the fourth sealing side surface 66 are shown by dashed lines.

[0050] As shown in FIGS. 2 and 3, the intermediate terminal 25 includes a terminal upper portion 25A including an intermediate terminal upper surface 25S and a terminal lower portion 25B including an intermediate terminal lower surface 25R. The terminal upper portion 25A is exposed from both the third sealing side surface 65 and the fourth sealing side surface 66. The terminal lower portion 25B is recessed from the terminal upper portion 25A in the X direction and the Y direction. The intermediate terminal upper surface 25S faces the same side as the sealing upper surface 61, and the intermediate terminal lower surface 25R faces the same side as the sealing lower surface 62. The intermediate terminal lower surface 25R is exposed from the sealing lower surface 62. The intermediate terminal lower surface 25R is disposed at a distance from both the third sealing side surface 65 and the fourth sealing side surface 66. For this reason, the terminal lower portion 25B is not exposed from both the third sealing side surface 65 and the fourth sealing side surface 66. The width WC1 of the intermediate terminal upper surface 25S, which is the X-direction dimension of the intermediate terminal upper surface 25S, is smaller than the X-direction dimension of the first terminal upper surface 21S. The width WC1 of the intermediate terminal upper surface 25S is larger than the X-direction dimension XA of the light emitting element 30. The width WC1 of the intermediate terminal upper surface 25S is larger than the X-direction dimension XC of the protection diode 50. The area of the intermediate terminal upper surface 25S is larger than the area of the first terminal upper surface 21S. As shown in FIG. 3, the intermediate terminal lower surface 25R is disposed closer to the first terminal lower surface 21R than to the center of the sealing member 60 in the X direction. It can be said that the distance in the X direction between the terminal lower portion 25B and the first lower portion 21B is smaller than the distance in the X direction between the terminal lower portion 25B and the second lower portion 22B.

[0051] As shown in FIG. 5, in this embodiment, the height ZE of the intermediate terminal 25, the height ZA of the first terminal 21, and the height ZB of the second terminal 22 are equal to each other. Here, the height ZE of the intermediate terminal 25 can be defined by the distance in the Z direction between the upper surface 25S of the intermediate terminal and the lower surface 25R of the intermediate terminal. Therefore, it can be said that the distance in the Z direction between the upper surface 25S and the lower surface 25R of the intermediate terminal 25, the distance in the Z direction between the upper surface 21S and the lower surface 21R of the first terminal 21, and the distance in the Z direction between the upper surface 22S and the lower surface 22R of the second terminal 22 are equal to each other. Since each of the lower surface 21R of the first terminal, the lower surface 22R of the second terminal, and the lower surface 25R of the intermediate terminal is exposed from the sealing lower surface 62, it can be said that the upper surface 25S of the intermediate terminal 25, the upper surface 21S of the first terminal 21, and the upper surface 22S of the second terminal 22 are arranged at the same position in the Z direction.

[0052] As shown in FIG. 4, the height ZE of the intermediate terminal 25 is equal to the height ZC of the third terminal 23 and the height ZD of the fourth terminal 24. That is, the distance in the Z direction between the upper surface 25S and the lower surface 25R of the intermediate terminal 25 is equal to the distance in the Z direction between the upper surface 23S and the lower surface 23R of the third terminal 23 and the distance in the Z direction between the upper surface 24S and the lower surface 24R of the fourth terminal 24.

[0053] As shown in FIGS. 2, 4, and 5, the optical sensor 10 includes a light-shielding member 70 provided on the upper surface 25S of the intermediate terminal 25. The light-shielding member 70 is made of resin. In one example, the light-shielding member 70 is made of insulating resin. In one example, the light-shielding member 70 includes any one of epoxy resin, silicone resin, and acrylic resin as the insulating resin. In this embodiment, the light-shielding member 70 includes black epoxy resin as the insulating resin. The light-shielding member 70 is sealed by the sealing member 60. Note that the material constituting the insulating resin of the light-shielding member 70 is not limited to epoxy resin, silicone resin, and acrylic resin, and can be arbitrarily changed.

[0054] As shown in FIG. 2, the light shielding member 70 is disposed on the intermediate terminal 25 so as to cross the entire opposing region RA between the light emitting element 30 and the light receiving element 40 in a plan view. In one example, the dimension YP of the light shielding member 70 in the Y direction is larger than the dimension YA of the light emitting element 30 in the Y direction. In one example, the dimension YP of the light shielding member 70 in the Y direction is larger than the dimension YB of the light receiving element 40 in the Y direction. In one example, the dimension YP of the light shielding member 70 in the Y direction is larger than the dimension YC of the protection diode 50 in the Y direction. In one example, the dimension YP of the light shielding member 70 in the Y direction is larger than 1 / 2 of the dimension YD of the sealing member 60 in the Y direction. In this embodiment, the light shielding member 70 extends over the entire Y direction of the upper surface 25S of the intermediate terminal. For this reason, in this embodiment, the dimension YP of the light shielding member 70 in the Y direction is equal to the dimension YD of the sealing member 60 in the Y direction.

[0055] The dimension XP in the X direction of the portion of the light shielding member 70 that contacts the upper surface 25S of the intermediate terminal (hereinafter, simply referred to as the dimension XP in the X direction of the light shielding member 70) is larger than the dimension XA of the light emitting element 30 in the X direction. The dimension XP in the X direction of the light shielding member 70 is larger than the dimension XC of the protection diode 50 in the X direction. On the other hand, in this embodiment, the dimension XP in the X direction of the light shielding member 70 is smaller than the dimension XB of the light receiving element 40 in the X direction. In this embodiment, the light shielding member 70 extends over the entire X direction of the upper surface 25S of the intermediate terminal. That is, in this embodiment, the light shielding member 70 is formed over the entire upper surface of the intermediate terminal 25S.

[0056] As shown in FIGS. 4 and 5, the light-shielding member 70 has a surface 71 that is curved so as to protrude upward from the intermediate terminal 25 in the Z direction. In other words, the light-shielding member 70 has a surface 71 that is curved so as to protrude from the upper surface 25S of the intermediate terminal 25 of the intermediate terminal 25 toward the upper sealing surface 61 in the Z direction. More specifically, the light-shielding member 70 is configured to gradually become thicker from both ends in the X direction toward the center on the upper surface 25S of the intermediate terminal. In one example, the light-shielding member 70 is formed by printing a liquid insulating material (for example, liquid epoxy resin) on the upper surface 25S of the intermediate terminal. In this case, the light-shielding member 70 is formed into a curved surface in which the surface 71 protrudes upward from the upper surface 25S of the intermediate terminal due to surface tension.

[0057] As shown in FIGS. 2 and 4 to 6, the optical sensor 10 includes a groove 80. As shown in FIGS. 4 to 6, the groove 80 is provided above the intermediate terminal 25. The groove 80 extends downward from the upper sealing surface 61 when viewed from the Y direction. The groove 80 penetrates the sealing member 60 and reaches the light-shielding member 70. Thus, it can be said that the optical sensor 10 includes a groove 80 that is disposed above the intermediate terminal 25 and penetrates the sealing member 60 to reach the light-shielding member 70.

[0058] As shown in FIG. 2, the groove 80 is disposed on the intermediate terminal 25 so as to cross the entire opposing region RA of the light-emitting element 30 and the light-receiving element 40 in plan view. In one example, the dimension YQ of the groove 80 in the Y direction is larger than the dimension YA of the light-emitting element 30 in the Y direction. In one example, the dimension YQ of the groove 80 in the Y direction is larger than the dimension YB of the light-receiving element 40 in the Y direction. In one example, the dimension YQ of the groove 80 in the Y direction is larger than 1 / 2 of the dimension YD of the sealing member 60 in the Y direction. In one example, the dimension YQ of the groove 80 in the Y direction is equal to the dimension YP of the light-shielding member 70 in the Y direction. In this embodiment, the groove 80 extends over the entire Y direction of the upper surface 25S of the intermediate terminal. Therefore, it can be said that the groove 80 penetrates both the sealing member 60 and the light-shielding member 70 in the Y direction.

[0059] The groove 80 is partially formed in the upper surface 25S of the intermediate terminal in the X direction. That is, the groove 80 is formed in a strip shape extending in the Y direction in plan view. As shown in FIG. 6, the width WA of the groove 80 as the dimension of the groove 80 in the X direction is smaller than the width WC1 of the upper surface 25S of the intermediate terminal. Further, the width WA of the groove 80 is smaller than the width WC2 of the lower surface 25R of the intermediate terminal as the dimension of the lower surface 25R of the intermediate terminal in the X direction. The width WA of the groove 80 is smaller than the dimension XP of the light-shielding member 70 in the X direction. In this embodiment, the groove 80 is provided at the center in the X direction on the upper surface 25S of the intermediate terminal. Therefore, it can be said that the groove 80 is provided at the center in the X direction in the light-shielding member 70. In other words, it can be said that the groove 80 is provided in the portion of the light-shielding member 70 where the thickness is the thickest (the portion where the dimension in the Z direction is the largest).

[0060] The groove 80 includes a pair of side surfaces 84 that are opposed to each other and spaced apart in the X direction, and a bottom surface 83. In this embodiment, each side surface 84 is configured as a YZ plane. The bottom surface 83 is configured as an XY plane. A curved surface 85 is formed between the side surface 84 and the bottom surface 83 of the groove 80.

[0061] Note that the shape of the bottom surface 83 can be arbitrarily changed. In one example, the bottom surface 83 may be configured by a curved surface that is convex downward. In this case, since the bottom surface 83 and the side surface 84 are connected, the curved surface 85 is omitted. Also, the pair of side surfaces 84 may be inclined so as to approach each other as they go toward the bottom surface 83.

[0062] The groove 80 does not penetrate the light-shielding member 70 in the Z direction. That is, the light-shielding member 70 is disposed between the bottom surface 83 of the groove 80 and the intermediate terminal 25 in the Z direction. More specifically, the groove 80 includes a first part 81 that penetrates the sealing member 60 in the Z direction, and a second part 82 that communicates with the first part 81 and extends from the surface 71 of the light-shielding member 70 to the middle of the light-shielding member 70. Therefore, the first part 81 is constituted by the sealing member 60, and the second part 82 is constituted by the light-shielding member 70. The second part 82 includes the bottom surface 83 of the groove 80.

[0063] In this embodiment, the width WC of the second part 82 as the dimension in the X direction of the second part 82 is equal to the width WB of the first part 81 as the dimension in the X direction of the first part 81. The depth HC of the second part 82 as the dimension in the Z direction of the second part 82 is smaller than the depth HB of the first part 81 as the dimension in the Z direction of the first part 81.

[0064] The thickness of the light-shielding member 70 increases as it goes from both end portions in the X direction of the upper surface 25S of the intermediate terminal toward the side surface 84 of the groove 80. That is, the portion of the light-shielding member 70 that constitutes the side surface 84 of the groove 80 becomes the thickest portion of the light-shielding member 70. Hereinafter, the thickness of the portion of the light-shielding member 70 that constitutes the side surface 84 of the groove 80 is defined as the maximum thickness Tmax of the light-shielding member 70.

[0065] As shown in FIG. 4, the maximum thickness Tmax of the light-shielding member 70 is equal to or greater than the thickness T1 of the conductive bonding material SD1. In one example, the maximum thickness Tmax of the light-shielding member 70 is greater than the thickness T1 of the conductive bonding material SD1. In one example, the maximum thickness Tmax of the light-shielding member 70 is equal to or greater than the thickness T2 of the conductive bonding material SD2. In one example, the maximum thickness Tmax of the light-shielding member 70 is greater than the thickness T2 of the conductive bonding material SD2. In one example, the maximum thickness Tmax of the light-shielding member 70 is equal to or greater than the thickness T3 of the conductive bonding material SD3. In one example, the maximum thickness Tmax of the light-shielding member 70 is greater than the thickness T3 of the conductive bonding material SD3.

[0066] The maximum thickness Tmax of the light-shielding member 70 is equal to or less than the distance in the Z direction between the light-emitting upper surface 31 of the light-emitting element 30 and the upper surface 21S of the first terminal. For this reason, the surface 71 of the portion that becomes the maximum thickness Tmax of the light-shielding member 70 is located below the light-emitting upper surface 31 of the light-emitting element 30 in the Z direction. In this embodiment, the maximum thickness Tmax of the light-shielding member 70 is smaller than the distance in the Z direction between the light-emitting upper surface 31 and the upper surface 21S of the first terminal. For this reason, the surface 71 of the portion that becomes the maximum thickness Tmax of the light-shielding member 70 is located below the light-emitting upper surface 31 in the Z direction.

[0067] As shown in FIG. 5, the maximum thickness Tmax of the light-shielding member 70 is equal to or less than the distance in the Z direction between the light-receiving upper surface 41 of the light-receiving element 40 and the second terminal upper surface 22S. For this reason, the surface 71 of the portion where the maximum thickness Tmax of the light-shielding member 70 is located is positioned below the light-receiving upper surface 41 of the light-receiving element 40 in the Z direction. In this embodiment, the maximum thickness Tmax of the light-shielding member 70 is thinner than the distance in the Z direction between the light-receiving upper surface 41 and the second terminal upper surface 22S. For this reason, the surface 71 of the portion where the maximum thickness Tmax of the light-shielding member 70 is located is positioned below the light-receiving upper surface 41 in the Z direction.

[0068] In one example, the maximum thickness Tmax of the light-shielding member 70 is equal to or greater than the distance in the Z direction between the diode upper surface 51 of the protection diode 50 and the first terminal upper surface 21S. For this reason, the surface 71 of the portion where the maximum thickness Tmax of the light-shielding member 70 is located is positioned at the same position as the diode upper surface 51 of the protection diode 50 in the Z direction, or closer to the sealing upper surface 61 than the diode upper surface 51.

[0069] In one example, the maximum thickness Tmax of the light-shielding member 70 is equal to or greater than the height ZE of the intermediate terminal 25. Here, the height ZE of the intermediate terminal 25 can be defined by the distance in the Z direction between the intermediate terminal upper surface 25S and the intermediate terminal lower surface 25R. In this embodiment, the maximum thickness Tmax of the light-shielding member 70 is greater than the height ZE of the intermediate terminal 25.

[0070] In one example, as shown in FIG. 6, the maximum thickness Tmax of the light-shielding member 70 is equal to or greater than 1 / 2 of the distance DA in the Z direction between the sealing upper surface 61 and the intermediate terminal upper surface 25S. In this embodiment, the maximum thickness Tmax of the light-shielding member 70 is 1 / 2 of the distance DA in the Z direction between the sealing upper surface 61 and the intermediate terminal upper surface 25S. In this way, the light-shielding member 70 includes a portion where the distance in the Z direction between the surface 71 of the light-shielding member 70 and the intermediate terminal upper surface 25S is equal to or greater than 1 / 2 of the distance DA between the sealing upper surface 61 and the intermediate terminal upper surface 25S.

[0071] In one example, the dimension of the groove 80 in the Z direction, that is, the depth HA of the groove 80, is at least 1 / 2 of the distance DA in the Z direction between the upper sealing surface 61 and the upper surface 25S of the intermediate terminal. In this embodiment, the depth HA of the groove 80 is greater than 1 / 2 of the distance DA in the Z direction between the upper sealing surface 61 and the upper surface 25S of the intermediate terminal. Therefore, it can be said that the depth HA of the groove 80 is greater than the maximum thickness Tmax of the light-shielding member 70. Here, the depth HA of the groove 80 can be defined by the distance in the Z direction between the upper sealing surface 61 and the bottom surface 83 of the groove 80.

[0072] In this embodiment, the depth HA of the groove 80 is the same throughout the Y direction of the groove 80. Note that the depth HA of the groove 80 may be different in the Y direction. In one example, the groove 80 may be formed such that the depths at both ends of the groove 80 in the Y direction are smaller than the depth at the center of the groove 80 in the Y direction. In another example, the groove 80 may be formed such that the depth at the portion crossing the opposing region RA of the groove 80 is larger than the other portions of the groove 80 in the Y direction.

[0073] [Method for manufacturing an optical sensor] With reference to FIGS. 7 to 11, an example of a method for manufacturing the optical sensor 10 will be described. The method for manufacturing the optical sensor 10 mainly includes a step of preparing a lead frame 820, a step of forming a light-shielding member 870, a step of mounting a light-emitting element 30, a light-receiving element 40, and a protection diode 50, a step of forming wires, a step of forming a sealing member 860, a step of forming a groove 880, and a step of singulating.

[0074] FIG. 7 shows the step of preparing the lead frame 820. FIG. 7 schematically shows a partial planar structure of the lead frame 820. As shown in FIG. 7, the process of preparing the lead frame 820 includes the process of preparing a flat conductive plate. The conductive plate is formed of a metal material containing, for example, Cu, Al, etc. as the conductive material. Therefore, it can be said that the conductive plate is a metal plate. Subsequently, the process of preparing the lead frame 820 includes a process of etching, for example, the conductive plate (metal plate). As a result, a lead frame 820 including a first terminal 821, a second terminal 822, a third terminal 823, a fourth terminal 824, and an intermediate terminal 825 is formed from the conductive plate (metal plate). The first to fourth terminals 821 to 824 include first to fourth upper portions 821A to 824A and first to fourth lower portions 821B to 824B. The intermediate terminal 825 includes a terminal upper portion 825A and a terminal lower portion 825B. The first to fourth upper portions 821A to 824A correspond to the first to fourth upper portions 21A to 24A of the first to fourth terminals 21 to 24 (both refer to FIG. 2). The first to fourth lower portions 821B to 824B correspond to the first to fourth lower portions 21B to 24B of the first to fourth terminals 21 to 24 (both refer to FIG. 2). The terminal upper portion 825A corresponds to the terminal upper portion 25A of the intermediate terminal 25 (refer to FIG. 2). The terminal lower portion 825B corresponds to the terminal lower portion 25B of the intermediate terminal 25 (refer to FIG. 2). The lead frame 820 may be a member including the first to fourth terminals 821 to 824 and the intermediate terminal 825 corresponding to the leads 20 of the plurality of optical sensors 10 (refer to FIG. 2). FIG. 7 schematically shows the planar structure of a portion of the lead frame 820 corresponding to the lead 20 of one of the optical sensors 10.

[0075] FIG. 8 shows the process of forming the light shielding member 870. FIG. 8 schematically shows the cross-sectional structure obtained by cutting the lead frame 820 and the light shielding member 870 along the line F8 - F8 in FIG. 7. As shown in FIG. 8, the step of forming the light-shielding member 870 includes a step of printing a light-shielding material on the upper surface 825S of the intermediate terminal 825. Thereby, the light-shielding member 870 is formed on the upper surface 825S of the intermediate terminal. As the light-shielding material, for example, an insulating resin is used. As the insulating resin, for example, an epoxy resin, a silicone resin, an acrylic resin, or the like is used. In one example, the light-shielding material is printed over the entire surface of the upper surface 825S of the intermediate terminal. Note that in the step of forming the light-shielding member 870, the light-shielding member 870 may be formed on the intermediate terminal 825 by applying the light-shielding material to the upper surface 825S of the intermediate terminal.

[0076] FIG. 9 shows a step of mounting the light-emitting element 30, the light-receiving element 40, and the protection diode 50, and a step of forming wires. FIG. 9 schematically shows a planar structure of the lead frame 820, the light-emitting element 30, the light-receiving element 40, the protection diode 50, and the first to third wires W1 to W3.

[0077] As shown in FIG. 9, the step of mounting the light-emitting element 30, the light-receiving element 40, and the protection diode 50 is, for example, a step of mounting each of the light-emitting element 30 and the protection diode 50 on the upper surface 821S of the first terminal 821 by die bonding, and mounting the light-receiving element 40 on the upper surface 822S of the second terminal 822. In one example, this mounting step includes a step of applying conductive bonding materials SD1 to SD3 (see FIG. 10), and a step of bonding the conductive bonding materials SD1 to SD3 to the light-emitting element 30, the light-receiving element 40, and the protection diode 50.

[0078] By the step of applying the conductive bonding materials SD1 to SD3, the conductive bonding material SD1 is applied to the region of the upper surface 821S of the first terminal where the light-emitting element 30 is mounted, and the conductive bonding material SD3 is applied to the region where the protection diode 50 is mounted. Also, the conductive bonding material SD2 is applied to the region of the upper surface 822S of the second terminal where the light-receiving element 40 is mounted.

[0079] Subsequently, in the step of joining the conductive bonding materials SD1 to SD3, the light-emitting element 30, the light-receiving element 40, and the protection diode 50, first, the light-emitting element 30 is disposed on the conductive bonding material SD1, the light-receiving element 40 is disposed on the conductive bonding material SD2, and the protection diode 50 is disposed on the conductive bonding material SD3. Subsequently, a reflow process is performed. As a result, after the conductive bonding materials SD1 to SD3 are melted and then solidified, the light-emitting element 30 is joined to the upper surface 821S of the first terminal by the conductive bonding material SD1, the light-receiving element 40 is joined to the upper surface 822S of the second terminal by the conductive bonding material SD2, and the protection diode 50 is joined to the upper surface 821S of the first terminal by the conductive bonding material SD3.

[0080] Next, the step of forming the wires includes, for example, the step of forming the first to third wires W1 to W3 using a wire bonding apparatus. In one example, the first wire W1 is formed by the wire bonding apparatus so as to connect the upper surface electrode 34 of the light-emitting element 30 and the upper surface 823S of the third terminal 823. The second wire W2 is formed by the wire bonding apparatus so as to connect the upper surface electrode 44 of the light-receiving element 40 and the upper surface 824S of the fourth terminal 824. The third wire W3 is formed by the wire bonding apparatus so as to connect the upper surface electrode 53 of the protection diode 50 and the upper surface 823S of the third terminal.

[0081] FIG. 10 shows the step of forming the sealing member 860. FIG. 10 schematically shows a cross-sectional structure obtained by cutting the first terminal 821, the second terminal 822, the intermediate terminal 825, the light-emitting element 30, the light-receiving element 40, and the sealing member 860 along the line F10-F10 in FIG. 9.

[0082] As shown in FIG. 10, the step of forming the sealing member 860 includes, for example, a step of forming the sealing member 860 by mold molding. The sealing member 860 partially seals the light-emitting element 30, the light-receiving element 40, the protection diode 50, the light-shielding member 870, the first to third wires W1 to W3, the first to fourth terminals 821 to 824, and the intermediate terminal 825. The first to fourth terminal lower surfaces 821R to 824R of the first to fourth terminals 821 to 824 and the intermediate terminal lower surface 825R of the intermediate terminal 825 (both are shown in FIG. 9) are exposed from the sealing lower surface 862 of the sealing member 860. In this embodiment, the sealing member 860 is formed of an insulating light-transmitting material. As the light-transmitting material, for example, an epoxy resin, a silicone resin, or an acrylic resin may be used. In this embodiment, a transparent epoxy resin is used as the light-transmitting material.

[0083] FIG. 11 shows the step of forming the groove 880. FIG. 11 schematically shows the cross-sectional structure at the same cross-sectional position as FIG. 10. As shown in FIG. 11, the step of forming the groove 880 includes, for example, a step of cutting the sealing member 860 and the light-shielding member 870 by dicing using a dicing blade. Using the dicing blade, a cut is made downward from the sealing upper surface 861. As a result, the groove 880 is formed so as to penetrate the sealing member 860 and reach the light-shielding member 870. In this embodiment, the groove 880 does not penetrate the light-shielding member 870. Therefore, the light-shielding member 870 is disposed between the bottom surface 883 of the groove 880 and the intermediate terminal 825.

[0084] The groove 880 is formed by the dicing blade moving in the Y direction. Therefore, the groove 880 extends in the Y direction. The groove 880 extends in the Y direction so as to cross the entire opposing region RA (see FIG. 2) of the light-emitting element 30 and the light-receiving element 40.

[0085] Subsequently, the singulation process includes, for example, a process of cutting the sealing member 860, the light-shielding member 870, the groove 880, the first to fourth terminals 821 to 824, and the intermediate terminal 825 at the cutting line CL using a dicing blade. Thereby, the sealing member 60, the light-shielding member 70, the groove 80, the first to fourth terminals 21 to 24, and the intermediate terminal 25 (see FIGS. 2 to 5 in both cases) are formed from the sealing member 860, the first to fourth terminals 821 to 824, and the intermediate terminal 825. Through the above processes, the optical sensor 10 is manufactured.

[0086] [Operation of Embodiment] The operation of the optical sensor 10 of this embodiment will be described. When a substrate formed of an insulating material such as a glass epoxy substrate is used as a member for supporting the light-emitting element, the light-receiving element, and the protection diode, the manufacturing cost of the substrate formed of the insulating material is high, so the manufacturing cost of the optical sensor becomes high.

[0087] In this regard, in this embodiment, the lead 20 is used as a member for supporting the light-emitting element 30, the light-receiving element 40, and the protection diode 50. Since the manufacturing cost of the lead 20 is lower than the manufacturing cost of the substrate formed of the insulating material, the manufacturing cost of the optical sensor 10 can be reduced.

[0088] By the way, optical crosstalk caused by diffused light from the light-emitting element in the optical sensor is a factor that reduces the detection accuracy of the light-receiving element. As a countermeasure against this, a configuration in which a groove is provided in a portion between the light-emitting element and the light-receiving element of the translucent sealing member is known. Since the optical crosstalk caused by the diffused light from the light-emitting element is reduced by this groove, a decrease in the detection accuracy of the light-receiving element can be suppressed.

[0089] The groove needs to penetrate the sealing member in the Z direction. That is, if the groove does not penetrate the sealing member, the diffused light from the light-emitting element may reach the light-receiving element through the sealing member directly below the groove. Thereby, there is a possibility that the detection accuracy of the light-receiving element may decrease.

[0090] For example, when a groove is formed by dicing using a dicing blade, it is difficult to require processing accuracy that penetrates only the sealing member. When a substrate formed of an insulating material is used, the groove can penetrate the sealing member in the Z direction by reaching a part of the upper portion of the substrate. On the other hand, in a case where a translucent sealing member is formed so as to contact the entire upper surface of a lead formed of a conductive plate (metal plate), if only a part of the upper portion of the lead is cut by a dicing blade, burrs may occur from the lead. Therefore, in a case including a translucent sealing member that contacts the entire upper portion of the lead, it is difficult to penetrate the sealing member in the Z direction.

[0091] In this regard, the optical sensor 10 of this embodiment is provided on the intermediate terminal 25 of the lead 20 and includes a light-shielding member 70 formed of resin. The groove 80 penetrates the sealing member 60 in the Z direction and reaches the light-shielding member 70. Thereby, the groove 80 can penetrate the sealing member 60 in the Z direction without cutting a part of the upper portion of the intermediate terminal 25. Further, a light-shielding member 70 is interposed between the lower portion of the groove 80 and the intermediate terminal 25. For this reason, it is suppressed that diffused light from the light-emitting element 30 reaches the light-receiving element 40 through the Z-direction interval between the bottom surface 83 of the groove 80 and the intermediate terminal 25. Therefore, a decrease in the detection accuracy of the light-receiving element 40 can be suppressed.

[0092] [Effects of the Embodiment] According to the optical sensor 10 of this embodiment, the following effects can be obtained. (1) The optical sensor 10 includes a lead 20 including a first terminal 21, a second terminal 22 disposed at a distance from the first terminal 21 in the X direction, and an intermediate terminal 25 disposed between the first terminal 21 and the second terminal 22 in the X direction, a light-emitting element 30 mounted on the first terminal 21, a light-receiving element 40 mounted on the second terminal 22, a light-shielding member 70 provided on the intermediate terminal 25 and formed of resin, a translucent sealing member 60 that seals at least the light-emitting element 30, the light-receiving element 40, and the light-shielding member 70, and a groove 80 disposed above the intermediate terminal 25, penetrating the sealing member 60, and reaching the light-shielding member 70.

[0093] According to this configuration, the lead 20 of the optical sensor 10 includes a first terminal 21 on which the light-emitting element 30 is mounted and a second terminal 22 on which the light-receiving element 40 is mounted. Therefore, compared with the case where the light-emitting element 30 and the light-receiving element 40 are mounted on a substrate made of an insulating material, the manufacturing cost of the optical sensor 10 can be reduced. Accordingly, the cost of the optical sensor 10 can be reduced.

[0094] In addition, since the groove 80 is disposed above the intermediate terminal 25 and reaches the light-shielding member 70 through the sealing member 60, it is possible to reduce optical crosstalk caused by diffused light from the light-emitting element 30. Accordingly, it is possible to suppress a decrease in the detection accuracy of the light-receiving element 40.

[0095] (2) The groove 80 does not penetrate the light-shielding member 70, and the light-shielding member 70 is disposed between the bottom surface 83 of the groove 80 and the intermediate terminal 25. According to this configuration, it is possible to suppress the diffused light from the light-emitting element 30 from reaching the light-receiving element 40 through between the bottom surface 83 of the groove 80 and the intermediate terminal 25. Accordingly, since the optical crosstalk caused by the diffused light from the light-emitting element 30 is reduced, it is possible to suppress a decrease in the detection accuracy of the light-receiving element 40.

[0096] (3) The groove 80 includes a first part 81 that penetrates the sealing member 60 and a second part 82 that communicates with the first part 81 and extends from the surface 71 of the light-shielding member 70 to an intermediate position of the light-shielding member 70.

[0097] According to this configuration, the light-shielding member 70 is interposed between the bottom surface 83 of the groove 80 and the intermediate terminal 25, and the bottom surface 83 of the groove 80 is disposed in the light-shielding member 70 in the Z direction. Thereby, since the light-transmitting sealing member 60 is not interposed between the bottom surface 83 of the groove 80 and the light-shielding member 70, it is possible to reduce optical crosstalk caused by diffused light from the light-emitting element 30.

[0098] (4) The depth HC of the second part 82 as the dimension of the second part 82 in the Z direction is smaller than the depth HB of the first part 81 as the dimension of the first part 81 in the Z direction. According to this configuration, the bottom surface 83 of the groove 80 is likely to be formed at a position away from the intermediate terminal 25 in the Z direction. Therefore, when the groove 80 is formed, the risk of cutting the intermediate terminal 25 can be reduced.

[0099] (5) The intermediate terminal 25 extends in a direction (the Y direction in this embodiment) intersecting the X direction so as to cross the entire opposing region RA of the light-emitting element 30 and the light-receiving element 40 in plan view. The light-shielding member 70 and the groove 80 are disposed on the intermediate terminal 25 so as to cross the entire opposing region RA in a direction (the Y direction in this embodiment) intersecting the X direction.

[0100] According to this configuration, since the groove 80 and the light-shielding member 70 are provided in the opposing region RA of the light-emitting element 30 and the light-receiving element 40, it is possible to efficiently reduce optical crosstalk caused by diffused light from the light-emitting element 30.

[0101] (6) The sealing member 60 includes a first sealing side surface 63 and a second sealing side surface 64 that constitute both end surfaces in the X direction, and a third sealing side surface 65 and a fourth sealing side surface 66 that constitute both end surfaces in the Y direction. The intermediate terminal 25 extends in the Y direction from the third sealing side surface 65 to the fourth sealing side surface 66. The light-shielding member 70 and the groove 80 are disposed on the intermediate terminal 25 so as to extend in the Y direction from the third sealing side surface 65 to the fourth sealing side surface 66.

[0102] According to this configuration, the space between the light-emitting element 30 and the light-receiving element 40 in the X direction can be separated by the groove 80 and the light-shielding member 70 over the entire Y direction of the sealing member 60. Thereby, optical crosstalk caused by diffused light from the light-emitting element 30 can be reduced also at locations other than the opposing region RA of the light-emitting element 30 and the light-receiving element 40 in the Y direction. Therefore, the effect of suppressing a decrease in the detection accuracy of the light-receiving element 40 can be enhanced.

[0103] (7) The intermediate terminal 25 is insulated from the first terminal 21 and the second terminal 22 and is configured to be in an electrically floating state. According to this configuration, the insulation distance between the first terminal 21 and the second terminal 22 can be increased.

[0104] (8) The light-shielding member 70 has a surface 71 that is curved so as to protrude upward from the intermediate terminal 25 in the Z direction. According to this configuration, compared with a light-shielding member having a flat surface, a portion where the light-shielding member 70 becomes thicker can be formed with the same volume. In addition, by providing the groove 80 in the thickened portion of the light-shielding member 70, the risk of shaving the intermediate terminal 25 during the formation of the groove 80 can be reduced.

[0105] (9) The light-shielding member 70 is configured to gradually thicken from both ends in the X direction to the center on the intermediate terminal upper surface 25S of the intermediate terminal 25. The groove 80 is provided at the center in the X direction on the intermediate terminal upper surface 25S.

[0106] According to this configuration, the light-shielding member 70 is thickest at the center in the X direction of the intermediate terminal upper surface 25S. Therefore, the groove 80 is provided in the thickest portion of the light-shielding member 70. Accordingly, the risk of shaving the intermediate terminal 25 during the formation of the groove 80 can be reduced.

[0107] (10) The optical sensor 10 is interposed between the light-emitting element 30 and the first terminal 21 and includes a conductive bonding material SD1 as a first bonding material for bonding the light-emitting element 30 and the first terminal 21. The maximum thickness Tmax of the light-shielding member 70 is equal to or greater than the thickness of the conductive bonding material SD1. According to this configuration, the risk of shaving the intermediate terminal 25 during the formation of the groove 80 can be reduced as compared with the case where the maximum thickness Tmax of the light-shielding member 70 is less than the thickness of the conductive bonding material SD1.

[0108] (11) The surface 71 of the portion where the maximum thickness Tmax of the light-shielding member 70 is located is positioned below the light-emitting upper surface 31 of the light-emitting element 30 in the Z direction. According to this configuration, the volume of the light-shielding member 70 can be reduced as compared with a configuration in which the surface 71 of the portion where the maximum thickness Tmax of the light-shielding member 70 is closer to the sealing upper surface 61 than the light-emitting upper surface 31. Therefore, the manufacturing cost of the optical sensor 10 can be reduced.

[0109] (12) The sealing member 60 includes a sealing upper surface 61 facing the same side as the upper surface 25S of the intermediate terminal. The distance between the surface 71 of the portion where the maximum thickness Tmax of the light shielding member 70 is located and the upper surface 25S of the intermediate terminal is equal to or more than 1 / 2 of the distance DA between the sealing upper surface 61 and the upper surface 25S of the intermediate terminal.

[0110] According to this configuration, the distance between the surface 71 of the portion where the maximum thickness Tmax of the light shielding member 70 is located and the upper surface 25S of the intermediate terminal can reduce the risk of shaving the intermediate terminal 25 when forming the groove 80 as compared with the case where the distance is less than 1 / 2 of the distance DA between the sealing upper surface 61 and the upper surface 25S of the intermediate terminal.

[0111] (13) The light shielding member 70 is made of insulating resin. According to this configuration, the material cost of the light shielding member 70 can be reduced as compared with the case where the light shielding member 70 is formed by mixing a conductive material into an insulating material.

[0112] (14) The height ZE of the intermediate terminal 25, the height ZA of the first terminal 21, and the height ZB of the second terminal 22 are equal to each other. According to this configuration, the lead 20 including the terminals 21, 22, and 25 can be easily manufactured as compared with the case where the height ZE of the intermediate terminal 25, the height ZA of the first terminal 21, and the height ZB of the second terminal 22 are different from each other.

[0113] (15) The manufacturing method of the optical sensor 10 includes preparing a lead frame 820 including a first terminal 821, a second terminal 822 disposed apart from the first terminal 821 in the X direction, and an intermediate terminal 825 disposed between the first terminal 821 and the second terminal 822 in the X direction; mounting a light-emitting element 30 on the first terminal 821; mounting a light-receiving element 40 on the second terminal 822; forming a light-shielding member 870 on the intermediate terminal 825; forming a light-transmissive sealing member 860 that seals at least the light-emitting element 30, the light-receiving element 40, and the light-shielding member 870; and forming a groove 880 across both the sealing member 860 and the light-shielding member 870 between the light-emitting element 30 and the light-receiving element 40 in the X direction. By forming the groove 880, the groove 880 is formed so as to be disposed above the intermediate terminal 825 and reach the light-shielding member 870 through the sealing member 860. According to this configuration, the optical sensor 10 can be easily manufactured.

[0114] <Modification example> The above-described embodiment can be modified and implemented as follows. Also, the following modification examples can be implemented in combination with each other within a technically non-conflicting range.

[0115] · The formation range of the light-shielding member 70 in the Y direction can be arbitrarily changed. The light-shielding member 70 only needs to be formed so as to cross at least the opposing region RA of the light-emitting element 30 and the light-receiving element 40. FIGS. 12 and 13 show an example of a modification example of the light-shielding member 70. FIG. 12 schematically shows a planar structure of the optical sensor 10 of the modification example. FIG. 13 schematically shows a cross-sectional structure of the optical sensor 10 of the modification example cut along the line F13-F13 in FIG. 12. In FIG. 13, for the sake of convenience, the second wire W2 is omitted.

[0116] As shown in FIG. 12, the light shielding member 70 is partially formed with respect to the intermediate terminal 25 in the Y direction. The light shielding member 70 is disposed at a distance from both end portions of the intermediate terminal 25 in the Y direction. That is, the light shielding member 70 is not exposed from both the third sealing side surface 65 and the fourth sealing side surface 66. In one example, the dimension YP of the light shielding member 70 in the Y direction is equal to the dimension YB of the light receiving element 40 in the Y direction. In one example, the dimension YP of the light shielding member 70 in the Y direction is larger than the dimension of the opposing region RA of the light emitting element 30 and the light receiving element 40 in the Y direction. The light shielding member 70 is disposed so as to cross the opposing region RA in the Y direction on the upper surface 25S of the intermediate terminal. Note that the dimension YP of the light shielding member 70 in the Y direction may be equal to the dimension of the opposing region RA in the Y direction.

[0117] As shown in FIG. 13, the light shielding member 70 has a surface 71 that is curved so as to be convex upward as it goes from both end portions in the Y direction toward the center in the Y direction. For this reason, the light shielding member 70 includes a portion that gradually thickens as it goes from both end portions of the light shielding member 70 in the Y direction toward the center of the light shielding member 70 in the Y direction.

[0118] The groove 80 extends in the Y direction from the third sealing side surface 65 to the fourth sealing side surface 66 of the sealing member 60. For this reason, in the first portion of the groove 80 closer to the third sealing side surface 65 than the light shielding member 70 and the second portion of the groove 80 closer to the fourth sealing side surface 66 than the light shielding member 70, it is provided only in the sealing member 60. In the first portion and the second portion, the groove 80 does not penetrate the sealing member 60 in the Z direction. That is, the groove 80 includes a portion that does not penetrate the sealing member 60 in the Z direction. Also, in the first portion and the second portion of the groove 80, the sealing member 60 is disposed between the bottom surface 83 of the groove 80 and the upper surface 25S of the intermediate terminal in the Z direction.

[0119] According to the configuration of the optical sensor 10 of the modification example shown in FIGS. 12 and 13, since the volume of the light shielding member 70 is reduced, the material cost of the light shielding member 70 can be reduced. Therefore, it is possible to reduce the manufacturing cost of the optical sensor 10.

[0120] Also, in another example, the dimension YP of the light-shielding member 70 in the Y direction may be smaller than the dimension YB of the light-receiving element 40 in the Y direction. The dimension YB of the light-shielding member 70 in the Y direction may be equal to or greater than the dimension YA of the light-emitting element 30 in the Y direction and less than the dimension YB of the light-receiving element 40 in the Y direction.

[0121] · The formation range of the light-shielding member 70 in the X direction can be arbitrarily changed. In one example, the dimension of the light-shielding member 70 in the X direction may be shorter than the dimension of the upper surface 25S of the intermediate terminal 25 of the intermediate terminal 25 in the X direction. In this case, the light-shielding member 70 may be provided, for example, at the center of the upper surface 25S of the intermediate terminal 25 in the X direction rather than at both ends of the upper surface 25S of the intermediate terminal 25 in the X direction. Also, in another example, the dimension of the light-shielding member 70 in the X direction may be equal to or less than the dimension of the light-emitting element 30 in the X direction. In one example, the dimension of the light-shielding member 70 in the X direction may be equal to or less than the dimension of the protection diode 50 in the X direction.

[0122] ·The light-shielding member 70 may be formed so as to protrude from the upper surface 25S of the intermediate terminal 25 in the X direction. In this case, since a gap is formed in the X direction between the intermediate terminal 25 and the first terminal 21 and the third terminal 23, it is difficult to form the light-shielding member 70 so as to connect the intermediate terminal 25 to the first terminal 21 and the third terminal 23. Further, since a gap is formed in the X direction between the intermediate terminal 25 and the second terminal 22 and the fourth terminal 24, it is difficult to form the light-shielding member 70 so as to connect the intermediate terminal 25 to the second terminal 22, and it becomes difficult to form the light-shielding member 70 so as to connect the intermediate terminal 25 to the fourth terminal 24. Thus, the distance in the X direction between the first terminal 21 and the intermediate terminal 25 in plan view may be set to a distance such that the first terminal 21 and the intermediate terminal 25 are not connected by the light-shielding member 70 even if the light-shielding member 70 protrudes from the upper surface 25S of the intermediate terminal. Further, the distance in the X direction between the third terminal 23 and the intermediate terminal 25 in plan view may be set to a distance such that the third terminal 23 and the intermediate terminal 25 are not connected by the light-shielding member 70 even if the light-shielding member 70 protrudes from the upper surface 25S of the intermediate terminal. Further, the distance in the X direction between the second terminal 22 and the intermediate terminal 25 in plan view may be set to a distance such that the second terminal 22 and the intermediate terminal 25 are not connected by the light-shielding member 70 even if the light-shielding member 70 protrudes from the upper surface 25S of the intermediate terminal. Further, the distance in the X direction between the fourth terminal 24 and the intermediate terminal 25 in plan view may be set to a distance such that the fourth terminal 24 and the intermediate terminal 25 are not connected by the light-shielding member 70 even if the light-shielding member 70 protrudes from the upper surface 25S of the intermediate terminal.

[0123] ·The formation range of the light-shielding member 70 in the Z direction, in other words, the maximum thickness Tmax of the light-shielding member 70 can be arbitrarily changed. In one example, the maximum thickness Tmax of the light-shielding member 70 may be equal to or greater than the thickness of the light-emitting element 30. The surface 71 corresponding to the maximum thickness Tmax of the light-shielding member 70 may be disposed at the same position as the light-emitting upper surface 31 of the light-emitting element 30 in the Z direction, or may be disposed closer to the sealing upper surface 61 than the light-emitting upper surface 31. In one example, the maximum thickness Tmax of the light-shielding member 70 may be equal to or greater than the thickness of the light-receiving element 40. Here, the thickness of the light-emitting element 30 can be defined by the distance in the Z direction between the light-emitting upper surface 31 and the light-emitting lower surface 32. The thickness of the light-receiving element 40 can be defined by the distance in the Z direction between the light-receiving upper surface 41 and the light-receiving lower surface 42.

[0124] In another example, the maximum thickness Tmax of the light-shielding member 70 may be thinner than the thickness T1 of the conductive bonding material SD1. In one example, the maximum thickness Tmax of the light-shielding member 70 may be thinner than the thickness T2 of the conductive bonding material SD2. In one example, the maximum thickness Tmax of the light-shielding member 70 may be thinner than the thickness T3 of the conductive bonding material SD3.

[0125] In another example, the maximum thickness Tmax of the light-shielding member 70 may be less than 1 / 2 of the above distance DA. In one example, the distance between the surface 71 of the portion where the maximum thickness Tmax of the light-shielding member 70 is located and the intermediate terminal upper surface 25S may be less than 1 / 2 of the distance DA in the Z direction between the sealing upper surface 61 and the intermediate terminal upper surface 25S.

[0126] · The shape of the light-shielding member 70 can be arbitrarily changed. In one example, the light-shielding member 70 may have a flat plate shape with the Z direction as the thickness direction. · The light-shielding member 70 may contain a conductive material. In one example, the light-shielding member 70 may have a configuration in which a powdery conductive material is mixed in an insulating resin. As the conductive material, for example, Cu, Al, titanium (Ti), nickel (Ni), etc. may be used.

[0127] ·The formation range of the intermediate terminal 25 in the Y direction can be arbitrarily changed. The intermediate terminal 25 only needs to be formed so as to cross at least the facing region RA of the light emitting element 30 and the light receiving element 40. FIGS. 14 and 15 show an example of a modification of the intermediate terminal 25. FIG. 14 schematically shows the planar structure of the optical sensor 10 of the modification example. FIG. 15 schematically shows the cross-sectional structure of the optical sensor 10 of the modification example cut along the line F15-F15 in FIG. 14.

[0128] As shown in FIG. 14, the dimension YR of the intermediate terminal 25 in the Y direction may be shorter than the dimension YD of the sealing member 60 in the Y direction. In this case, the intermediate terminal 25 is disposed at a distance from both the third sealing side surface 65 and the fourth sealing side surface 66 of the sealing member 60 in the Y direction. That is, the terminal upper portion 25A of the intermediate terminal 25 is not exposed from both the third sealing side surface 65 and the fourth sealing side surface 66. The light shielding member 70 is formed over the entire upper surface 25S of the intermediate terminal 25 of the intermediate terminal 25. Therefore, the dimension YP of the light shielding member 70 in the Y direction is equal to the dimension YR of the intermediate terminal 25 in the Y direction.

[0129] In the example shown in FIGS. 14 and 15, since the light shielding member 70 is formed over the entire upper surface 25S of the intermediate terminal 25 in the X direction, the cross-sectional structure of the light shielding member 70 cut in the XZ plane is the same as, for example, the cross-sectional structure of the light shielding member 70 shown in FIG. 5. On the other hand, the light shielding member 70 has a surface 71 that is curved so as to bulge upward from both ends in the Y direction of the upper surface 25S of the intermediate terminal toward the center in the Y direction. The light shielding member 70 is formed so as to cross the facing region RA of the light emitting element 30 and the light receiving element 40.

[0130] According to the configuration of the optical sensor 10 of the modification example shown in FIGS. 14 and 15, since the volume of the light shielding member 70 is reduced, the material cost of the light shielding member 70 can be reduced. Therefore, the manufacturing cost of the optical sensor 10 can be reduced.

[0131] · The X-direction position of the groove 80 with respect to the intermediate terminal 25 and the light-shielding member 70 can be arbitrarily changed. In one example, the groove 80 may be provided closer to the light-emitting element 30 than the center of the intermediate terminal 25 in the X direction. In one example, the groove 80 may be provided closer to the light-receiving element 40 than the center of the intermediate terminal 25 in the X direction. In one example, the groove 80 may be provided at a position shifted in the X direction from the maximum thickness Tmax of the light-shielding member 70.

[0132] · The depth HA of the groove 80 can be arbitrarily changed. FIG. 16 shows an example of a modified example in which the depth HA of the groove 80 is changed. FIG. 16 schematically shows a cross-sectional structure obtained by cutting the groove 80 and its periphery in the XZ plane.

[0133] As shown in FIG. 16, the groove 80 may be formed so as to penetrate the light-shielding member 70 in the Z direction. That is, the intermediate terminal upper surface 25S of the intermediate terminal 25 may be formed so as to be exposed from the sealing member 60 and the light-shielding member 70. In this case, it can be said that the depth HB of the groove 80 is equal to the distance DA in the Z direction between the sealing upper surface 61 of the sealing member 60 and the intermediate terminal upper surface 25S of the intermediate terminal 25. Also, it can be said that the depth HC of the second part 82 of the groove 80 is equal to the maximum thickness Tmax of the light-shielding member 70.

[0134] As another example, although not shown, the side surface 84 of the groove 80 may be composed of a first part 81 that penetrates the sealing member 60 in the Z direction. That is, the groove 80 may reach the surface 71 of the light-shielding member 70 but no groove may be formed in the light-shielding member 70.

[0135] Also, although not shown, the relationship between the depth HB of the first part 81 and the depth HC of the second part 82 of the groove 80 can be arbitrarily changed. In one example, the depth HC of the second part 82 may be equal to or greater than the depth HB of the first part 81.

[0136] · The width WA of the groove 80 (the dimension of the groove 80 in the X direction) can be arbitrarily changed. FIG. 17 shows an example of a modified example in which the width WA of the groove 80 is changed. FIG. 17 schematically shows a cross-sectional structure obtained by cutting the groove 80 and its periphery in the XZ plane.

[0137] As shown in FIG. 17, the width WA of the groove 80 may be larger than the dimension XP of the light-shielding member 70 in the X direction. For this reason, the width WA of the groove 80 is larger than the width WC2 of the lower surface 25R of the intermediate terminal 25 of the intermediate terminal 25. Further, it may be larger than the width WC1 of the upper surface 25S of the intermediate terminal 25 of the intermediate terminal 25. Note that the width WA of the groove 80 may be equal to the dimension XP of the light-shielding member 70 in the X direction. Further, the width WA of the groove 80 may be equal to the width WC1 of the upper surface 25S of the intermediate terminal 25.

[0138] · The dimension YQ of the groove 80 in the Y direction can be arbitrarily changed. The dimension YQ of the groove 80 in the Y direction may be smaller than the dimension YD of the sealing member 60 in the Y direction. The dimension YQ of the groove 80 in the Y direction may be smaller than, for example, the dimension YP of the light-shielding member 70 in the Y direction. For this reason, the groove 80 may not penetrate the sealing member 60 in the Y direction, for example. The groove 80 only needs to be formed so as to cross at least the opposing region RA of the light-emitting element 30 and the light-receiving element 40. Further, in the modification examples shown in FIGS. 12 to 15, the dimension YQ of the groove 80 in the Y direction may be equal to the dimension YP of the light-shielding member 70 in the Y direction.

[0139] · The shape of the groove 80 can be arbitrarily changed. FIGS. 18 and 19 each show a modification example in which the shape of the groove 80 is changed. FIG. 20 shows another modification example in which the shape of the groove 80 is changed. Each of FIGS. 18 to 20 schematically shows a cross-sectional structure obtained by cutting the groove 80 and its periphery in the XZ plane.

[0140] As shown in FIG. 18, the width WC of the second part 82 of the groove 80 is smaller than the width WB of the first part 81. The groove 80 includes a step portion 86 provided between the first part 81 and the second part 82. In one example, the step portion 86 is provided at the upper end portion of the light-shielding member 70 in the Z direction.

[0141] As shown in FIG. 19, the first part 81 of the groove 80 may include a tapered portion 81A. The tapered portion 81A is provided at a portion of the first part 81 closer to the sealing upper surface 61. The tapered portion 81A is formed such that the width WB of the first part 81 increases as it approaches the sealing upper surface 61 in the Z direction.

[0142] As shown in FIG. 20, the groove 80 may include a tapered structure in which the width WA of the groove 80 decreases as it goes from the sealing upper surface 61 to the bottom surface 83 of the groove 80 in the Z direction. The first part 81 of the groove 80 may include a tapered structure in which the width WB of the first part 81 decreases as it goes from the sealing upper surface 61 to the second part 82 in the Z direction. The second part 82 of the groove 80 may include a tapered structure in which the width WC of the second part 82 decreases as it goes from the first part 81 to the bottom surface 83 of the groove 80 in the Z direction.

[0143] · The intermediate terminal 25 does not have to be in an electrically floating state. That is, the intermediate terminal 25 may be electrically connected to any one of the first terminal 21, the second terminal 22, the third terminal 23, and the fourth terminal 24.

[0144] · The shape of the intermediate terminal 25 can be arbitrarily changed. FIG. 21 shows an example of a modified example in which the shape of the intermediate terminal 25 is changed. FIG. 22 shows an example of a modified example in which the shape of the groove 80 is changed to the shape of the intermediate terminal 25 in FIG. 21. Each of FIG. 21 and FIG. 22 schematically shows a cross-sectional structure obtained by cutting the intermediate terminal 25, the groove 80, and its periphery by an XZ plane.

[0145] As shown in FIG. 21, the intermediate terminal 25 includes a recess 25C that is recessed downward from the upper surface 25S of the intermediate terminal. In one example, the recess 25C is formed over the entire intermediate terminal 25 in the Y direction. The recess 25C may be formed so as to be separated from the third sealing side surface 65 and the fourth sealing side surface 66 shown in FIG. 2 in the Y direction. In the example shown in FIG. 21, the recess 25C is formed in a rectangular concave shape when viewed from the Y direction. In one example, the recess 25C may be formed by etching in the process of forming the intermediate terminal 825 of the lead frame 820 shown in FIG. 7.

[0146] The recess 25C is filled with the light-shielding member 70 and is provided on the upper surface 25S of the intermediate terminal. The light-shielding member 70 includes a surface 71 that protrudes upward from the upper surface 25S of the intermediate terminal 25. In one example, the surface 71 of the portion corresponding to the maximum thickness Tmax of the light-shielding member 70 is located closer to the sealing upper surface 61 than half of the distance DA in the Z direction between the upper surface 25S of the intermediate terminal and the sealing upper surface 61. That is, the light-shielding member 70 is provided over more than half of the distance in the Z direction between the upper surface 25S of the intermediate terminal and the sealing upper surface 61. The light-shielding member 70 may extend in the Y direction from the third sealing side surface 65 to the fourth sealing side surface 66 (both shown in FIG. 2) of the sealing member 60, as in the above-described embodiment.

[0147] The groove 80 is provided at a position corresponding to the recess 25C in the X direction. The groove 80 penetrates the sealing member 60 in the Z direction and reaches the light-shielding member 70, as in the above-described embodiment. On the other hand, the depth HA of the groove 80 is smaller than the depth HA of the groove 80 in the above-described embodiment. Also, the groove 80 may penetrate the sealing member 60 in the Y direction, as in the above-described embodiment. In the modified example shown in FIG. 21, the maximum thickness Tmax of the light-shielding member 70 is larger than the depth HA of the groove 80. The maximum thickness Tmax of the light-shielding member 70 is larger than half of the distance DA in the Z direction between the sealing upper surface 61 of the sealing member 60 and the upper surface 25S of the intermediate terminal 25 and is equal to or less than the distance DA. That is, the surface 71 of the light-shielding member 70 is located below the sealing upper surface 61. Here, the maximum thickness Tmax of the light-shielding member 70 can be defined by the distance in the Z direction between the bottom surface of the recess 25C and the uppermost surface among the surfaces of the light-shielding member 70.

[0148] According to the configuration of the optical sensor 10 in the modification example shown in FIG. 21, since the light shielding member 70 is provided over at least half of the Z-direction interval between the upper surface 25S of the intermediate terminal and the upper surface 61 of the seal, light leaking from the light emitting element 30 to the light receiving element 40 is easily shielded by the light shielding member 70.

[0149] Note that the shape of the recess 25C viewed from the Y direction can be arbitrarily changed. In one example, the shape of the recess 25C viewed from the Y direction may be formed in a curved concave shape. Also, the dimension of the recess 25C in the Y direction can be arbitrarily changed. In one example, the dimension of the recess 25C in the Y direction may be smaller than the dimension of the intermediate terminal 25 in the Y direction.

[0150] In the modification example shown in FIG. 21, the depth HA of the groove 80 can be arbitrarily changed. In one example, as shown in FIG. 22, the depth HA of the groove 80 may be increased so that the bottom surface 83 of the groove 80 is located within the recess 25C in the Z direction. That is, the bottom surface 83 of the groove 80 may be located below the upper surface 25S of the intermediate terminal of the intermediate terminal 25. In this case, the depth HA of the groove 80 becomes larger than the distance DA in the Z direction between the upper surface 61 of the sealing member 60 and the upper surface 25S of the intermediate terminal of the intermediate terminal 25. Also, the depth HC of the second part 82 of the groove 80 is larger than the depth HB of the first part 81.

[0151] In the modification example shown in FIG. 21 and the modification example shown in FIG. 22, the dimension XP in the X direction of the light shielding member 70 is smaller than the width WC1 of the upper surface 25S of the intermediate terminal of the intermediate terminal 25. The dimension XP in the X direction of the light shielding member 70 is larger than the width WC2 of the lower surface 25R of the intermediate terminal. Note that in the modification example shown in FIG. 21 and the modification example shown in FIG. 22, the dimension XP in the X direction of the light shielding member 70 can be arbitrarily changed.

[0152] · The height ZE of the intermediate terminal 25 can be arbitrarily changed. In one example, as shown in FIG. 23, the height ZE of the intermediate terminal 25 may be lower than the height ZA of the first terminal 21 and the height ZB of the second terminal 22. More specifically, the upper surface 25S of the intermediate terminal of the intermediate terminal 25 may be located closer to the sealing lower surface 62 of the sealing member 60 than the upper surface 21S of the first terminal 21 and the upper surface 22S of the second terminal 22 in the Z direction. According to this configuration, it is possible to suppress the light from the light-emitting element 30 from reaching the light-receiving element 40 through the portion between the upper part 25A of the terminal of the intermediate terminal 25 and the sealing lower surface 62 in the Z direction.

[0153] Also, although not shown, the height ZE of the intermediate terminal 25 may be higher than the height ZA of the first terminal 21 and the height ZB of the second terminal 22. More specifically, the upper surface 25S of the intermediate terminal of the intermediate terminal 25 may be located closer to the sealing upper surface 61 of the sealing member 60 than the upper surface 21S of the first terminal 21 and the upper surface 22S of the second terminal 22 in the Z direction. According to this configuration, the distance in the Z direction between the surface 71 corresponding to the maximum thickness Tmax of the light-shielding member 70 and the sealing upper surface 61 can be reduced. That is, the ratio of the light from the light-emitting element 30 to the light-receiving element 40 blocked by the groove 80 decreases, and the ratio of the light blocked by the light-shielding member 70 increases. Therefore, the leakage of light from the light-emitting element 30 to the light-receiving element 40 can be reduced. Thus, the height ZE of the intermediate terminal 25 may be different from the height ZA of the first terminal 21 and the height ZB of the second terminal 22.

[0154] · The inside of the groove 80 is not limited to an air layer and may be filled with any material. FIG. 24 schematically shows a cross-sectional structure obtained by cutting the groove 80 and its periphery in the XZ plane. As shown in FIG. 24, a light-shielding embedded member 90 may be provided in the groove 80. The embedded member 90 may be filled, for example, over the entire inside of the groove 80. In the example shown in FIG. 24, the upper surface 91 of the embedded member 90 may be at the same position as the sealing upper surface 61 in the Z direction. Thereby, the dimension of the embedded member 90 in the Z direction becomes equal to the depth HA of the groove 80. Also, the dimension of the embedded member 90 in the Y direction becomes equal to the dimension of the groove 80 in the Y direction. Thereby, the embedded member 90 is exposed from both the third sealing side surface 65 and the fourth sealing side surface 66 of the sealing member 60 and is flush with both the third sealing side surface 65 and the fourth sealing side surface 66. The embedded member 90 may be made of, for example, an insulating material. In one example, the embedded member 90 may be formed of the same material as the light-shielding member 70.

[0155] Note that the dimension of the embedded member 90 in the Y direction may be smaller than the dimension of the groove 80 in the Y direction. The embedded member 90 may be provided so as to cross at least the opposing region RA (see FIG. 2) of the light-emitting element 30 and the light-receiving element 40 in the Y direction. Also, the dimension of the embedded member 90 in the Z direction may be smaller than the depth HA of the groove 80.

[0156] Also, instead of the embedded member 90, a light-shielding layer may be provided in the groove 80. The light-shielding layer is formed on the side surface 84, the bottom surface 83, and the curved surface 85 of the groove 80. Depending on the thickness of the light-shielding layer, an air layer may be formed in the groove 80.

[0157] ·The width WC1 of the upper surface 25S of the intermediate terminal corresponding to the dimension in the X direction of the upper surface 25S of the intermediate terminal for 25S and the dimension XP in the X direction of the light shielding member 70 can be arbitrarily changed. In one example, the width WC1 of the upper surface 25S of the intermediate terminal may be equal to or less than the dimension XA in the X direction of the light emitting element 30. In one example, the width WC1 of the upper surface 25S of the intermediate terminal may be equal to or less than the dimension XC in the X direction of the protection diode 50. In one example, the width WC1 of the upper surface 25S of the intermediate terminal may be equal to or greater than the dimension XB in the X direction of the light receiving element 40. In one example, the dimension XP in the X direction of the light shielding member 70 may be equal to or less than the dimension XA in the X direction of the light emitting element 30. In one example, the dimension XP in the X direction of the light shielding member 70 may be equal to or less than the dimension XB in the X direction of the protection diode 50. In one example, the dimension XP in the X direction of the light shielding member 70 may be equal to or greater than the dimension XB in the X direction of the light receiving element 40.

[0158] ·As shown in FIG. 25, the optical sensor 10 may include an integrated circuit element 100 including a light receiving element 40. The integrated circuit element 100 includes, for example, a signal processing circuit that generates a signal based on the light reception of the light receiving element 40. The light receiving element 40 is electrically connected to the signal processing circuit within the integrated circuit element 100. The integrated circuit element 100 is mounted on the second terminal 22.

[0159] The integrated circuit element 100 includes an element upper surface 101 and an element lower surface (not shown) opposite to the element upper surface 101. The element upper surface 101 includes a light receiving region 43 and a plurality of upper surface electrodes 102. The plurality of upper surface electrodes 102 are electrically connected to the signal processing circuit.

[0160] Instead of the fourth terminal 24, the lead 20 includes a plurality of circuit terminals 26. The plurality of circuit terminals 26 are arranged at a distance from the second terminal 22 in the Y direction. In one example, the plurality of circuit terminals 26 are arranged at a distance from each other in the X direction. Each circuit terminal 26 includes a circuit terminal upper portion 26A including a circuit terminal upper surface 26S and a circuit terminal lower portion 26B including a circuit terminal lower surface 26R. The circuit terminal upper surface 26S faces the same side as the sealing upper surface 61. The circuit terminal lower surface 26R is exposed from the sealing lower surface 62 (see FIG. 3).

[0161] The optical sensor 10 includes a fourth wire W4 as a fourth connection member that individually connects a plurality of upper surface electrodes 102 and a plurality of circuit terminals 26. The fourth wire W4 is connected to a circuit terminal upper surface 26S of the circuit terminal 26.

[0162] Note that the number and arrangement positions of the plurality of circuit terminals 26 with respect to the integrated circuit element 100 can be arbitrarily changed. Also, the arrangement mode of the plurality of circuit terminals 26 can be arbitrarily changed. In one example, the plurality of circuit terminals 26 may be arranged closer to the second sealing side surface 64 than the integrated circuit element 100. In this case, the plurality of circuit terminals 26 may be arranged at the same position as each other in the X direction and separated from each other in the Y direction.

[0163] · The arrangement mode of the light emitting element 30 and the light receiving element 40 in plan view can be arbitrarily changed. In one example, the light emitting element 30 and the light receiving element 40 may be arranged shifted from each other in the Y direction.

[0164] · The first connection member that electrically connects the light emitting element 30 and the third terminal 23 is not limited to the first wire W1 and can be arbitrarily changed. In one example, the first connection member may be a clip, a ribbon, or the like. Note that the second connection member that electrically connects the light receiving element 40 and the fourth terminal 24, and the third connection member that electrically connects the protection diode 50 and the third terminal 23 are also the same, not limited to the second wire W2 and the third wire W3, and may be a clip, a ribbon, or the like. Also, the fourth connection member that electrically connects the integrated circuit element 100 and the plurality of circuit terminals 26 is the same, not limited to the fourth wire W4, and may be a clip, a ribbon, or the like.

[0165] · The light emitting element 30 is not limited to a surface emitting laser element such as a VCSEL. For example, an LED element may be used as the light emitting element 30. · The arrangement mode of the light-emitting element 30 and the protection diode 50 in plan view can be arbitrarily changed. In one example, the light-emitting element 30 may be arranged closer to the intermediate terminal 25 (light-shielding member 70) than the protection diode 50. In one example, with the protection diode 50 arranged closer to the light-receiving element 40 than the light-emitting element 30, the protection diode 50 and the light-emitting element 30 may be arranged at the same position in the Y direction.

[0166] · The protection diode 50 may be omitted from the optical sensor 10. In this case, the third wire W3 is also omitted. According to the omission of the protection diode 50, the arrangement position of the light-emitting element 30 with respect to the upper surface 21S of the first terminal may be changed.

[0167] One or more of the various examples described in this specification can be combined within a technically non-contradictory range. The term "on" used in this disclosure includes the meanings of "on" and "above" unless the context clearly indicates otherwise. Thus, for example, the expression "the first element is arranged on the second element" may, in one embodiment, mean that the first element is in contact with the second element and directly arranged on the second element, but in other embodiments, it is intended that the first element can be arranged above the second element without contacting the second element. That is, the term "on" does not exclude a structure in which other elements are formed between the first element and the second element.

[0168] The Z direction used in this disclosure does not necessarily have to be the vertical direction and does not have to completely coincide with the vertical direction. Therefore, various structures according to this disclosure are not limited to the "up" and "down" in the Z direction described in this specification being the "up" and "down" in the vertical direction. For example, the X direction may be the vertical direction, or the Y direction may be the vertical direction.

[0169] <Appendix> The technical idea that can be grasped from the present disclosure is described below. Note that, for the purpose of assisting understanding rather than limiting, the reference numerals of the corresponding components in the above-described embodiments are attached to the components described in the appended claims. The reference numerals are shown as examples for assisting understanding, and the components described in each appended claim should not be limited to the components indicated by the reference numerals.

[0170] [Appendix 1] A lead (20) including a first terminal (21), a second terminal (22) disposed at a distance from the first terminal (21) in a first direction (X), and an intermediate terminal (25) disposed between the first terminal (21) and the second terminal (22) in the first direction (X). A light-emitting element (30) mounted on the first terminal (21). A light-receiving element (40) mounted on the second terminal (22). A light-shielding member (70) provided on the intermediate terminal (25) and made of resin. A light-transmitting sealing member (60) that seals at least the light-emitting element (30), the light-receiving element (40), and the light-shielding member (70). A groove (80) disposed above the intermediate terminal (25), passing through the sealing member (60), and reaching the light-shielding member (70). A photosensor (10) including the above.

[0171] [Appendix 2] The groove (80) does not penetrate the light-shielding member (70), and the light-shielding member (70) is disposed between the bottom surface (83) of the groove (80) and the intermediate terminal (25). The photosensor according to Appendix 1.

[0172] [Appendix 3] The groove (80) A first part (81) passing through the sealing member (60), A second part (82) communicating with the first part (81) and extending from the surface (71) of the light-shielding member (70) to an intermediate position of the light-shielding member (70). including the above The optical sensor according to Appendix 1 or 2.

[0173] [Appendix 4] The dimension (WC) of the second part (82) in the first direction (X) is equal to the dimension (WB) of the first part (81) in the first direction (X). The optical sensor according to Appendix 3.

[0174] [Appendix 5] The dimension (WC) of the second part (82) in the first direction (X) is smaller than the dimension (WB) of the first part (81) in the first direction (X). The optical sensor according to Appendix 3.

[0175] [Appendix 6] The dimension (HC) of the second part (82) in the thickness direction (Z) of the lead (20) is smaller than the dimension (HB) of the first part (81) in the thickness direction (Z). The optical sensor according to any one of Appendices 3 to 5.

[0176] [Appendix 7] The intermediate terminal (25) extends in a direction (Y) intersecting the first direction (X) so as to cross the entire opposing region (RA) of the light emitting element (30) and the light receiving element (40) when viewed from the thickness direction (Z) of the lead (20). The light shielding member (70) and the groove (80) are arranged on the intermediate terminal (25) so as to cross the entire opposing region (RA) in the direction (Y) intersecting the first direction (X). The optical sensor according to any one of Appendices 1 to 6.

[0177] [Appendix 8] The sealing member (60) The first sealing side surface (63) and the second sealing side surface (64) constituting both end surfaces in the first direction (X), The third sealing side surface (65) and the fourth sealing side surface (66) constituting both end surfaces in the second direction (Y) orthogonal to the first direction (X) when viewed from the thickness direction (Z) of the lead (20), and The intermediate terminal (25) extends in the second direction (Y) from the third sealing side surface (65) to the fourth sealing side surface (66). The light-shielding member (70) and the groove (80) are arranged on the intermediate terminal (25) so as to extend in the second direction (Y) from the third sealing side surface (65) to the fourth sealing side surface (66). The photosensor according to any one of Appendices 1 to 6.

[0178] [Appendix 9] The intermediate terminal (25) is insulated from the first terminal (21) and the second terminal (22), and is configured to be in an electrically floating state. The photosensor according to any one of Appendices 1 to 8.

[0179] [Appendix 10] The light-shielding member (70) has a surface (71) that is curved so as to protrude upward from the intermediate terminal (25) in the thickness direction (Z) of the lead (20). The photosensor according to any one of Appendices 1 to 9.

[0180] [Appendix 11] The light-shielding member (70) is configured to gradually thicken from both ends to the center of the intermediate terminal upper surface (25S) of the intermediate terminal (25) in the first direction (X). The groove (80) is provided at the center of the intermediate terminal upper surface (25S) in the first direction (X). The photosensor according to Appendix 10.

[0181] [Appendix 12] An intermediate member is interposed between the light-emitting element (30) and the first terminal (21), and includes a first bonding material (SD1) that bonds the light-emitting element (30) and the first terminal (21). The maximum thickness (Tmax) of the light-shielding member (70) is equal to or greater than the thickness of the first bonding material (SD1). The photosensor according to Appendix 10 or 11.

[0182] [Appendix 13] The surface (71) of the portion with the maximum thickness (Tmax) of the light-shielding member (70) is located below the light-emitting upper surface (31) of the light-emitting element (30) in the thickness direction (Z) of the lead (20). The optical sensor according to Appendix 12.

[0183] [Appendix 14] The intermediate terminal (25) includes an upper surface (25S) of the intermediate terminal where the light-shielding member (70) is provided. The sealing member (60) includes a sealing upper surface (61) facing the same side as the upper surface (25S) of the intermediate terminal. The distance between the surface (71) of the portion with the maximum thickness (Tmax) of the light-shielding member (70) and the upper surface (25S) of the intermediate terminal is equal to or more than 1 / 2 of the distance (DA) between the sealing upper surface (61) and the upper surface (25S) of the intermediate terminal. The optical sensor according to Appendix 10 or 11.

[0184] [Appendix 15] The light-shielding member (70) is made of insulating resin. The optical sensor according to any one of Appendices 1 to 14.

[0185] [Appendix 16] The heights of the intermediate terminal (25), the first terminal (21), and the second terminal (22) are equal to each other. The optical sensor according to any one of Appendices 1 to 15.

[0186] [Appendix 17] The lead (20) A third terminal (23) that is spaced apart from the first terminal (21) in a second direction (Y) that intersects the first direction (X) when viewed from the thickness direction (Z) of the lead (20) and is electrically connected to the light-emitting element (30); A fourth terminal (24) that is spaced apart from the second terminal (22) in the second direction (Y) and is electrically connected to the light-receiving element (40); and includes A first connection member (W1) that electrically connects the light-emitting element (30) and the third terminal (23); A second connection member (W2) that electrically connects the light-receiving element (40) and the fourth terminal (24); including The optical sensor according to any one of Appendices 1 to 16.

[0187] [Appendix 18] A light-shielding embedding member (90) is provided in the groove (80). The optical sensor according to any one of Appendices 1 to 17.

[0188] [Appendix 19] The light-emitting element (30) is a vertical cavity surface emitting laser, The light-receiving element (40) is either a photodiode or a phototransistor. The optical sensor according to any one of Appendices 1 to 18.

[0189] [Appendix 20] including an integrated circuit element (100) including the light-receiving element (40), The integrated circuit element (100) is mounted on the second terminal (22). The optical sensor according to any one of Appendices 1 to 19.

[0190] [Appendix 21] The light-shielding member (70) contains a conductive material. The optical sensor according to any one of Appendices 1 to 20.

[0191] [Appendix 22] The light-shielding member (70) contains any one of epoxy resin, silicone resin, and acrylic resin. The optical sensor according to any one of Appendices 1 to 21.

[0192] [Appendix 23] The intermediate terminal (25) includes an upper surface (25S) of the intermediate terminal where the light-shielding member (70) is provided. The dimension (WC1) of the upper surface (25S) of the intermediate terminal in the first direction (X) is larger than the dimension (XA) of the light-emitting element (30) in the first direction (X). The dimension (XP) of the portion of the light-shielding member (70) that contacts the upper surface (25S) of the intermediate terminal in the first direction (X) is larger than the dimension (XA) of the light-emitting element (30) in the first direction (X). The optical sensor according to any one of Appendices 1 to 22.

[0193] [Appendix 24] The height of the intermediate terminal (25) is higher than both the height of the first terminal (21) and the height of the second terminal (22). The optical sensor according to any one of Appendices 1 to 15.

[0194] [Appendix 25] The height of the intermediate terminal (25) is lower than both the height of the first terminal (21) and the height of the second terminal (22). The optical sensor according to any one of Appendices 1 to 15.

[0195] [Appendix 26] The dimension (WA) of the groove (80) in the first direction (X) is equal to or greater than the dimension of the light-shielding member (70) in the first direction (X). The optical sensor according to any one of Appendices 1 to 25.

[0196] [Appendix 27] The dimension (HC) of the second part (82) of the lead (20) in the thickness direction (Z) is equal to or greater than the dimension (HB) of the first part (81) in the thickness direction (Z). The optical sensor according to any one of Appendices 3 to 5.

[0197] [Appendix 28] The first part (81) includes a tapered portion (81A) whose dimension in the first direction (X) increases as it goes upward. The optical sensor according to any one of Appendices 3 to 6.

[0198] [Appendix 29] The intermediate terminal (25) is an upper surface (25S) of the intermediate terminal where the light shielding member (70) is provided, a recess (25C) recessed downward from the upper surface (25S) of the intermediate terminal, and includes the light shielding member (70) is filled in the recess (25C) and provided on the upper surface (25S) of the intermediate terminal The photosensor according to any one of Appendices 1 to 28.

[0199] [Appendix 30] The groove (80) is provided at a position corresponding to the recess (25C) in the first direction (X), a bottom surface (83) of the groove (80) is located below the upper surface (25S) of the intermediate terminal The photosensor according to Appendix 29.

[0200] [Appendix 31] Preparing a lead frame (820) including a first terminal (821), a second terminal (822) arranged at a distance from the first terminal (821) in a first direction (X), and an intermediate terminal (825) arranged between the first terminal (821) and the second terminal (822) in the first direction (X), Mounting a light emitting element (30) on the first terminal (821), Mounting a light receiving element (40) on the second terminal (822), Forming a light shielding member (870) on the intermediate terminal (825), Forming a light-transmissive sealing member (860) for sealing at least the light emitting element (30), the light receiving element (40), and the light shielding member (870), Forming a groove (880) across both the sealing member (860) and the light shielding member (870) between the light emitting element (30) and the light receiving element (40) in the first direction (X), and includes By forming the groove (880), the groove (880) is formed so as to be disposed above the intermediate terminal (825) and reach the light-shielding member (870) through the sealing member (860). Method for manufacturing an optical sensor (10).

[0201] [Appendix 32] By forming the groove (880), the groove (880) is formed by dicing. Method for manufacturing an optical sensor according to Appendix 31.

[0202] [Appendix 33] By forming the light-shielding member (870), the light-shielding member (870) is formed by printing a light-shielding resin on the intermediate terminal (825). Method for manufacturing an optical sensor according to Appendix 31 or 32.

[0203] [Appendix 34] By forming the light-shielding member (870), the light-shielding member (870) is formed by applying a light-shielding resin to the intermediate terminal (825). Method for manufacturing an optical sensor according to Appendix 31 or 32.

[0204] The above description is merely illustrative. Those skilled in the art will recognize that many more possible combinations and substitutions are possible other than the components and methods (manufacturing processes) listed for the purpose of explaining the technology of the present disclosure. The present disclosure is intended to encompass all alternatives, modifications, and variations included within the scope of the present disclosure, including the claims.

Explanation of Reference Numerals

[0205] 10…Optical sensor 20…Lead 21…First terminal 21A…First upper part 21B…First lower part 21S…Upper surface of the first terminal 21R…Lower surface of the first terminal 22…Second terminal 22A…Second upper part 22B…Second lower part 22S…Second terminal upper surface 22R…Second terminal lower surface 23…Third terminal 23A…Third upper part 23B…Third lower part 23S…Third terminal upper surface 23R…Third terminal lower surface 24…Fourth terminal 24A…Fourth upper part 24B…Fourth lower part 24S…Fourth terminal upper surface 24R…Fourth terminal lower surface 25…Intermediate terminal 25A…Terminal upper part 25B…Terminal lower part 25C…Recess 25S…Intermediate terminal upper surface 25R…Intermediate terminal lower surface 26…Circuit terminal 26A…Circuit terminal upper part 26B…Circuit terminal lower part 26S…Circuit terminal upper surface 26R…Circuit terminal lower surface 30…Light-emitting element 31…Light-emitting upper surface 32…Light-emitting lower surface 33…Light-emitting region 34…Upper electrode 35…Lower electrode 40…Light-receiving element 41…Light-receiving upper surface 42…Light-receiving lower surface 43…Light-receiving region 44…Upper electrode 45…Lower electrode 50…Protection diode 51…Diode upper surface 52…Diode lower surface 53…Upper electrode 54…Lower electrode 60…Sealing member 61…Sealing upper surface 62…Sealing lower surface 63~66…First to fourth sealing side surfaces 70…Light-shielding member 71…Surface 80…Groove 81…First part 81A…Tapered part 82…Second part 83…Bottom surface 84…Side surface 85…Curved surface 86…Step part 90…Embedded member 91…Upper surface 100…Integrated circuit element 101…Element upper surface 102…Upper surface electrode 820…Lead frame 821…First terminal 821A…First upper part 821B…First lower part 821S…First terminal upper surface 822…Second terminal 822A…Second upper part 822B…Second lower part 822S…Second terminal upper surface 823…Third terminal 823A…Third upper part 823B…Third lower part 823S…Third terminal upper surface 824…Fourth terminal 824A…Fourth upper part 824B…Fourth lower part 824S…Fourth terminal upper surface 825…Intermediate terminal 825A…Terminal upper part 825B…Terminal lower part 825S…Intermediate terminal upper surface 825R…Intermediate terminal lower surface 860…Sealing member 861…Sealing upper surface 862…Sealing lower surface 870…Light shielding member 880…Groove 883…Bottom surface SD1…Conductive bonding material (first bonding material) SD2…Conductive bonding material (second bonding material) SD3…Conductive bonding material (third bonding material) W1~W4…First to fourth wires RA…Opposite region XA…Dimension of the light-emitting element in the X direction XB…Dimension of the light-receiving element in the X direction XC…Dimension of the protection diode in the X direction XP…Dimension of the light-shielding member in the X direction YA…Dimension of the light-emitting element in the Y direction YB…Dimension of the light-receiving element in the Y direction YC…Dimension of the protection diode in the Y direction YD…Dimension of the sealing member in the Y direction YP…Dimension of the light-shielding member in the Y direction YQ…Dimension of the groove in the Y direction YR…Dimension of the intermediate terminal in the Y direction WA…Width of the groove WB…Width of the first part WC…Width of the second part WC1…Width of the upper surface of the intermediate terminal of the intermediate terminal WC2…Width of the lower surface of the intermediate terminal of the intermediate terminal DA…Distance in the Z direction between the upper sealing surface and the upper surface of the intermediate terminal HA…Depth of the groove HB…Dimension in the Z direction of the first part (depth of the first part) HC…Dimension in the Z direction of the second part (depth of the second part) Tmax…Maximum thickness of the light-shielding member T1…Thickness of the conductive bonding material SD1 T2…Thickness of the conductive bonding material SD2 T3…Thickness of the conductive bonding material SD3 ZA…Height of the first terminal ZB…Height of the second terminal ZC…Height of the third terminal ZD…Height of the fourth terminal ZE…Height of the intermediate terminal CL…Cutting line

Claims

1. A lead including a first terminal, a second terminal disposed at a distance from the first terminal in a first direction, and an intermediate terminal disposed between the first terminal and the second terminal in the first direction; A light-emitting element mounted on the first terminal; A light-receiving element mounted on the second terminal; A light-shielding member provided on the intermediate terminal and made of resin; A light-transmissive sealing member that seals at least the light-emitting element, the light-receiving element, and the light-shielding member; A groove disposed above the intermediate terminal and reaching the light-shielding member through the sealing member; A photosensor including the above.

2. The groove does not penetrate the light-shielding member, and the light-shielding member is disposed between the bottom surface of the groove and the intermediate terminal. The photosensor according to Claim 1.

3. The groove includes: A first part penetrating the sealing member; A second part communicating with the first part and extending from the surface of the light-shielding member to an intermediate position of the light-shielding member. Including. The photosensor according to Claim 1.

4. The dimension of the second part in the first direction is equal to the dimension of the first part in the first direction. The photosensor according to Claim 3.

5. The dimension of the second part in the first direction is smaller than the dimension of the first part in the first direction. The photosensor according to Claim 3.

6. The dimension of the second part in the thickness direction of the lead is smaller than the dimension of the first part in the thickness direction. The photosensor according to Claim 3.

7. The intermediate terminal extends in a direction intersecting the first direction so as to cross the entire opposing region of the light-emitting element and the light-receiving element when viewed from the thickness direction of the lead, The light-shielding member and the groove are disposed on the intermediate terminal so as to cross the entire opposing region in a direction intersecting the first direction. The photosensor according to Claim 1.

8. The sealing member includes: A first sealing side surface and a second sealing side surface constituting both end surfaces in the first direction; A third sealing side surface and a fourth sealing side surface constituting both end surfaces in a second direction orthogonal to the first direction when viewed from the thickness direction of the lead. Including, The intermediate terminal extends in the second direction from the third sealing side surface to the fourth sealing side surface, The light-shielding member and the groove are disposed on the intermediate terminal so as to extend in the second direction from the third sealing side surface to the fourth sealing side surface. The photosensor according to Claim 1.

9. The intermediate terminal is insulated from the first terminal and the second terminal and is configured to be electrically in a floating state. The optical sensor according to claim 1.

10. The light shielding member has a surface curved so as to be convex upward from the intermediate terminal in the thickness direction of the lead. The optical sensor according to claim 1.

11. The light shielding member is configured to gradually thicken from both ends in the first direction toward the center on the upper surface of the intermediate terminal of the intermediate terminal. The groove is provided at the center in the first direction on the upper surface of the intermediate terminal. The optical sensor according to claim 10.

12. An intermediate member is interposed between the light emitting element and the first terminal and includes a first bonding material that bonds the light emitting element and the first terminal. The maximum thickness of the light shielding member is equal to or greater than the thickness of the first bonding material. The optical sensor according to claim 10.

13. The surface of the portion having the maximum thickness of the light shielding member is located below the light emitting upper surface of the light emitting element in the thickness direction of the lead. The optical sensor according to claim 12.

14. The intermediate terminal includes the upper surface of the intermediate terminal where the light shielding member is provided. The sealing member includes a sealing upper surface facing the same side as the upper surface of the intermediate terminal. The distance between the surface of the portion having the maximum thickness of the light shielding member and the upper surface of the intermediate terminal is equal to or greater than 1 / 2 of the distance between the sealing upper surface and the upper surface of the intermediate terminal. The optical sensor according to claim 10.

15. The light shielding member is made of an insulating resin. The optical sensor according to claim 1.

16. The height of the intermediate terminal, the height of the first terminal, and the height of the second terminal are equal to each other. The optical sensor according to claim 1.

17. The lead A third terminal spaced apart from the first terminal in a second direction intersecting the first direction as viewed from the thickness direction of the lead and electrically connected to the light emitting element. A fourth terminal spaced apart from the second terminal in the second direction and electrically connected to the light receiving element. including A first connection member that electrically connects the light emitting element and the third terminal. A second connection member that electrically connects the light receiving element and the fourth terminal. including The optical sensor according to claim 1.

18. The groove is provided with a light shielding embedded member. The optical sensor according to claim 1.

19. The light emitting element is a vertical cavity surface emitting laser. The light receiving element is either a photodiode or a phototransistor. The optical sensor according to claim 1.

20. including an integrated circuit element including the light receiving element, the integrated circuit element is mounted on the second terminal The optical sensor according to claim 1.

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