Substrate holding device and substrate processing apparatus

Abstract

To adsorb and hold a warped substrate well even if it is warped.SOLUTION: A substrate holding device 2 comprises a base part 30, a central part 42f provided on the base part 30 and having a holding surface 42f that contacts the central part of a substrate 100, an annulus 50 provided around the central part 42 in the base part 30 and deformable by contacting an outer circumferential part of the substrate 100 protruding radially outwardly from the central part 42 all the way around, and a suction part 60 for suctioning the space formed by the base part 30, the annulus 50, and the substrate 100.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a substrate holding device and a substrate processing device.

Background Art

[0002] When coating a resist solution or the like on the surface of a substrate such as a glass substrate, or when cleaning the substrate with a cleaning liquid, a substrate holding device that rotatably holds the substrate while sucking the substrate in a vacuum may be used. For example, Patent Document 1 discloses a configuration including a seal ring having a two-layer structure in which a core is formed of rubber and a surface layer is tetrafluoroethylene, so as to surround a suction hole opened in the holding surface of a spinner chuck. Further, Patent Document 1 discloses a configuration in which an inner seal ring and an outer seal ring are provided concentrically on the surface of a spinner chuck.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] By the way, during the manufacturing process of a substrate, the substrate may be warped. When trying to suck a warped substrate with a substrate holding device in a vacuum, a gap may occur between the holding surface of the substrate holding device and the substrate. In such a state where a gap occurs, the vacuum (negative pressure) between the substrate and the holding surface may be broken, and the substrate may not be adsorbed.

[0005] In view of the above circumstances, an object of the present invention is to provide a substrate holding device and a substrate processing device that can satisfactorily adsorb and hold even a warped substrate.

Means for Solving the Problems

[0006] In a first aspect of the present invention, there is provided a substrate holding device including a base portion, a central portion provided on the base portion and having a holding surface that contacts a central portion of a substrate, an annular portion provided on the base portion so as to surround the central portion and deformably contacting an outer peripheral portion of the substrate that protrudes radially outward from the central portion over a full circumference, and a suction portion that sucks a space formed by the base portion, the annular portion, and the substrate.

[0007] In a second aspect of the present invention, there is provided a substrate processing device including the above-described substrate holding device.

Advantages of the Invention

[0008] According to the above-described aspect, even for a warped substrate, the holding surface of the central portion provided on the base portion contacts the central portion of the substrate, and the annular portion deforms so as to contact the outer peripheral portion of the substrate that protrudes radially outward from the central portion following the warp of the substrate. With this configuration, by sucking the space formed by the base portion, the annular portion, and the substrate with the suction portion, it becomes possible to satisfactorily adsorb and hold even a warped substrate.

Brief Description of the Drawings

[0009]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Mode for Carrying Out the Invention

[0010] Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the present invention is not limited to the embodiments described below. Also, in the drawings, in order to make each configuration of the embodiment easy to understand, a part is enlarged or emphasized, or a part is simplified and shown, and there may be cases where the actual structure, shape, scale, etc. are different.

[0011] FIG. 1 is a cross-sectional view showing an example of a substrate processing apparatus 1 according to an embodiment. Here, as an example, the substrate processing apparatus 1 includes an apparatus called a spinner. FIG. 2 is a perspective view showing a main part of a substrate holding device 2 according to an embodiment. Here, as an example, the substrate holding device 2 includes an apparatus called a spinner chuck. FIG. 3 is a cross-sectional view showing a main part of the substrate holding device 2 according to an embodiment. FIG. 4 is a plan view showing a table body 31 of the substrate holding device 2. As shown in FIG. 1, the substrate processing apparatus 1 mainly includes a substrate holding device 2 and a processing unit 9. The substrate holding device 2 includes a substrate holding table 3 that adsorbs and supports a substrate from below, and a support shaft 7 that supports the substrate holding table 3. As shown in FIGS. 1 to 3, the substrate holding table 3 includes a base portion 30, an inner peripheral member 40, an annular portion 50, and a suction portion 60.

[0012] The base portion 30 includes a table body 31 and a base plate 32. The table body 31 is disk-shaped and extends along a plane intersecting the vertical direction. A hole 31h penetrating the table body 31 in the vertical direction is formed at the central portion of the table body 31. As shown in FIGS. 3 and 4, the table body 31 integrally has a mounting portion 34 formed at the central portion of the table body 31 and an outer peripheral plate-shaped portion 35 extending radially outward from the mounting portion 34.

[0013] The mounting portion 34 is formed on the radially outer side of the hole 31h. The mounting portion 34 protrudes upward from the upper surface of the outer peripheral plate-shaped portion 35. A plurality of recesses 36 are formed at intervals in the circumferential direction on the upper surface of the mounting portion 34. In the present embodiment, the recesses 36 are circular when viewed from the vertical direction, and, for example, six recesses 36 are formed. Each recess 36 is formed so as to be recessed downward from the upper surface of the mounting portion 34.

[0014] A plurality of grooves 37 are formed at intervals in the circumferential direction on the upper surface of the mounting portion 34. The number of the plurality of grooves 37 is the same as the number of the recesses 36, that is, for example, six grooves 37 are formed. The plurality of grooves 37 are recessed downward from the upper surface of the mounting portion 34 and extend in the radial direction of the mounting portion 34. One end of each groove 37 communicates with the inside of the hole 31h. The other end of each groove 37 communicates with each of the plurality of recesses 36.

[0015] As shown in FIGS. 1 to 3, a boss portion 33 is provided below the table body 31. The boss portion 33 is formed in a cylindrical shape extending vertically downward from the central portion of the lower surface of the table body 31. The inner peripheral surface of the boss portion 33 forms a part of the lower portion in the vertical direction of the hole 31h. The outer diameter of the table body 31 is larger than the outer diameter of the boss portion 33. The table body 31 extends radially outward from the upper end of the boss portion 33.

[0016] The base plate 32 is provided on the table body 31. As shown in FIG. 3, the outer diameter of the base plate 32 is larger than the outer diameter of the mounting portion 34, and the outer peripheral portion of the base plate 32 extends radially outward beyond the mounting portion 34. The base plate 32 has an upper surface 32f facing vertically upward. An inner peripheral base surface 32b and an outer peripheral base surface 32c are formed on the lower surface of the base plate 32.

[0017] The inner peripheral base surface 32b faces vertically downward and abuts against the upper surface of the mounting portion 34. The inner peripheral base surface 32b closes the hole 31h from above. Further, between the inner peripheral base surface 32b and the plurality of grooves 37 formed in the mounting portion 34, a radial flow path 38 that extends radially outward from the hole 31h and communicates with the plurality of recesses 36 is formed. The outer peripheral base surface 32c faces vertically downward and abuts against the upper surface of the outer peripheral plate-like portion 35.

[0018] A plurality of female screw holes 32h are formed in the base plate 32 at intervals in the circumferential direction. Each of the plurality of female screw holes 32h penetrates the base plate 32 in the vertical direction and is formed so as to communicate with the plurality of recesses 36 of the table body 31. The base plate 32 is fixed to the table body 31 by, for example, bolt joining, adhesion, welding, etc. with a plurality of bolts (not shown).

[0019] The inner peripheral member 40 is provided on the base plate 32. The inner peripheral member 40 integrally has a base plate (third layer) 41 and a central portion 42. The base plate 41 extends along the upper surface 32f of the base plate 32. The outer diameter of the base plate 41 is larger than the outer diameter of the central portion 42. The base plate 41 extends radially outward beyond the central portion 42. A plurality of bolt insertion holes 41h are formed in the base plate 41 at intervals in the circumferential direction. Each of the plurality of bolt insertion holes 41h penetrates the base plate 41 in the vertical direction and is formed so as to communicate with the plurality of female screw holes 32h of the base plate 32.

[0020] The central portion 42 is provided at the central portion of the base plate 41. The central portion 42 protrudes upward from the base plate 41. The central portion 42 is integrally formed with the base plate 41. The central portion 42 is formed in a circular shape when viewed from the vertical direction. As shown in FIG. 2, a plurality of relief recesses 42s that are recessed radially inward from the side surface of the central portion 42 are formed in a portion of the central portion 42 where each bolt insertion hole 41h is provided. As shown in FIGS. 2 and 3, the central portion 42 has a holding surface 42f facing vertically upward. The holding surface 42f contacts the central portion of the substrate 100 when the substrate 100 is held by the substrate holding device 2.

[0021] A plurality of groove portions 45 are formed in the holding surface 42f of the central portion 42. The plurality of groove portions 45 are recessed downward from the holding surface 42f and extend in a direction along the holding surface 42f. The plurality of groove portions 45 include a plurality of radial groove portions 45a and a plurality of concentric annular groove portions 45b. The plurality of radial groove portions 45a are formed at equal intervals or substantially equal intervals in the circumferential direction around the center of the inner peripheral member 40. The plurality of annular groove portions 45b are each annular and are provided at equal intervals or substantially equal intervals in the radial direction from the center of the inner peripheral member 40. The plurality of radial groove portions 45a extend radially outward from the center of the inner peripheral member 40. The plurality of radial groove portions 45a communicate with the plurality of annular groove portions 45b and are provided so as to reach the side surface of the central portion 42.

[0022] The inner peripheral member 40 is fixed to the base plate 32 via a plurality of fixtures 39. As shown in FIG. 3, each fixture 39 integrally has a screw shaft portion 39s that is fastened to the female screw portion of the female screw hole 32h through the bolt insertion hole 41h, and a head portion 39b that expands in diameter radially outward from the upper end of the screw shaft portion 39s. The fixture 39 fixes the inner peripheral member 40 to the base plate 32 by the screw shaft portion 39s being fastened to the female screw portion of the female screw hole 32h through the bolt insertion hole 41h and the head portion 39b abutting against the upper surface 41t of the base plate 41 on the radially outer side of the bolt insertion hole 41h. A through hole 39h that penetrates the fixture 39 vertically is formed in each fixture 39.

[0023] The annular portion 50 is provided on the base portion 30 so as to surround the central portion 42. The annular portion 50 is provided at a radially outer side and spaced apart from the central portion 42. The annular portion 50 is provided in an annular shape continuously in the circumferential direction around the center of the inner peripheral member 40. The annular portion 50 is provided so as to rise upward from the upper surface of the outer peripheral portion of the base plate 41 of the inner peripheral member 40. The tip surface 50s of the annular portion 50 is provided so as to protrude in a direction away from the base portion 30 (upward) with respect to the holding surface 42f of the central portion 42.

[0024] The dimension T in which the tip surface 50s protrudes upward from the holding surface 42f may be set according to the amount of warpage of the substrate 100 assumed for the substrate 100 held by the substrate holding device 2. For example, when it is assumed that the outer diameter of the annular portion 50 is about 100 mm, the outer diameter of the substrate 100 is about 300 mm, and the outer peripheral portion of the substrate 100 may be warped by up to about 3 with respect to the central portion of the substrate 100, the tip surface 50s preferably protrudes with a dimension T in the range of 1.0 mm to 10.0 mm with respect to the holding surface 42f.

[0025] When the substrate holding device 2 holds the substrate 100, the central portion of the substrate 100 is made capable of contacting the central portion 42. When the substrate holding device 2 holds the substrate 100, the outer peripheral portion of the substrate 100 protruding radially outward from the central portion 42 is made capable of contacting the annular portion 50 over one circumference. The annular portion 50 is made elastically deformable in the vertical direction when the outer peripheral portion of the substrate 100 comes into contact. The annular portion 50 includes a first layer 51 and a second layer 52. The first layer 51 and the second layer 52 are provided by being laminated in this order from above downward.

[0026] The topmost first layer 51 contacts the lower surface of the substrate 100 when holding the substrate 100. After the first layer 51 contacts the substrate 100, when the substrate 100 separates from the first layer, it is preferably formed of a material such that no contact mark of the first layer 51 remains on the substrate 100. The first layer is preferably formed of a material that can be elastically deformed following the shape of the lower surface of the substrate 100 when the substrate 100 is warped. Also, the first layer 51 may be formed of a conductive material in order to suppress the generation of static electricity when contacting the substrate 100.

[0027] Also, the first layer 51 preferably has higher conductivity than the second layer 52. The first layer 51 preferably has higher heat resistance than the second layer 52 so that it does not soften or melt due to heat when the substrate 100 becomes hot. As a material for forming such a first layer 51, it is preferable to use a material containing at least one of, for example, polyetheretherketone, polyamideimide, and polyphenylene sulfide. The first layer 51 is preferably provided, for example, with a thickness of 0.5 mm to 1.5 mm. By setting the thickness within this range, it becomes easier to follow the warped shape of the substrate 100.

[0028] The second layer 52 is disposed between the first layer 51 and the base portion 30. The second layer 52 is preferably formed of a material having lower rigidity and being elastically deformable than the first layer 51. The second layer 52 may have conductivity and heat resistance. As a material for forming such a second layer 52, it is preferable to use a material containing at least one of, for example, fluororubber, polytetrafluoroethylene, and silicone rubber. Also, the second layer 52 is preferably a porous body made of such a material.

[0029] In porous bodies, there are generally closed-cell foams and open-cell foams. However, it is particularly preferable that the second layer 52 is a closed-cell foam among the porous bodies, in which the bubbles contained in the porous body are provided independently of each other. If it is a closed-cell foam, since the bubbles are not connected, there is little air inflow and outflow, which is suitable for adsorption applications. Further, it is easy to return to the original shape and easy to obtain a repulsive force. Also, for example, when the substrate 100 is warped by up to 3 mm, the second layer 52 is preferably provided with a thickness of 4.0 mm to 7.0 mm. By setting the thickness within this range, it is possible to cope with a large warp of the substrate 100.

[0030] Also, the base plate 41 to which the central portion 42 and the annular portion 50 are attached may be formed of the same material as the first layer 51. Further, the central portion 42 may be formed of the same material as the first layer 51. That is, the base plate 41 and the central portion 42 are preferably formed using a material containing at least one of, for example, polyetheretherketone, polyamideimide, and polyphenylene sulfide. In this case, the base plate 41 and the central portion 42 may be integrally formed.

[0031] As shown in FIG. 1, the support shaft 7 is provided below the substrate holding table 3. The support shaft 7 extends in the vertical direction. The support shaft 7 is rotatably supported around a vertical axis Cv including the center of the central portion 42 on the base 8 of the substrate processing apparatus 1. The support shaft 7 includes a rotating shaft 71 and a holding cylinder 72. That is, the base portion 30 is rotatable around a rotating shaft including the center of the central portion (around the vertical axis Cv).

[0032] The rotating shaft 71 is cylindrical and extends in the vertical direction. An axial through-hole 71h that penetrates the rotating shaft 71 in the vertical direction is formed at the center of the rotating shaft 71. The middle part of the rotating shaft 71 in the vertical direction is inserted into a holding cylinder 72 provided on the base 8. The holding cylinder 72 is cylindrical and extends in the vertical direction, and has a flange portion 72a that extends radially outward at its lower end. The lower end of the holding cylinder 72 is inserted into a holding hole 81h formed in the support plate 81 of the base 8, and is fastened and fixed to the support plate 81 by bolts or the like (not shown) with the flange portion 72a abutted against the upper surface of the support plate 81.

[0033] Bearings 75A and 75B are provided in the holding cylinder 72. The bearings 75A and 75B are provided at intervals in the vertical direction within the holding cylinder 72. The bearings 75A and 75B support the rotating shaft 71 so as to be rotatable about the vertical axis Cv at two locations in the vertical direction. The rotating shaft 71 has an annular convex portion 71c that protrudes radially outward and is continuous in the circumferential direction above the upper bearing 75A. A ring-shaped collar 76 is fitted to the rotating shaft 71 below the lower bearing 75B. By sandwiching the bearings 75A and 75B between the annular convex portion 71c and the collar 76 from both the upper and lower sides, the movement of the rotating shaft 71 in the vertical direction with respect to the holding cylinder 72 is restricted.

[0034] The upper end portion of the rotating shaft 71 is inserted into the boss portion 33 of the base portion 30 from below. The upper end portion of the rotating shaft 71 is fixed through a notch 33k (see FIG. 2) formed at the lower end portion of the boss portion 33 so as not to be relatively displaced in the circumferential direction about the vertical axis Cv by bolts or the like (not shown). The lower end portion of the rotating shaft 71 protrudes downward from the holding cylinder 72 and is connected to a rotational drive source such as an electric motor (not shown) provided at the base of the substrate processing apparatus 1. The rotating shaft 71 is rotationally driven about the vertical axis Cv by driving this rotational drive source. With this configuration, the substrate holding table 3 (base portion 30) is rotationally driven about the vertical axis Cv integrally with the rotating shaft 71 that is rotationally driven by the rotational drive source.

[0035] A negative pressure generating source such as a vacuum pump (not shown) is connected to a shaft through-hole 71h formed in a rotating shaft 71 via a pipe (not shown). The negative pressure generated by this negative pressure generating source reaches the internal space of the boss portion 33 through the shaft through-hole 71h. The negative pressure in the boss portion 33 reaches a space S formed above a base plate 41, which will be described later, via a flow path 38, a recess 36, and a through-hole 39h.

[0036] FIG. 5 is a cross-sectional view showing a state in which a substrate 100 is placed on an annular portion 50 of a substrate holding device 2 according to an embodiment. As shown in FIG. 5, a suction portion 60 sucks a substrate 100 placed on the substrate holding device 2. A substrate 100 is carried into the substrate holding device 2 from the outside of the substrate processing device 1 by a substrate transfer mechanism (not shown) and placed on the substrate holding device 2. The inner peripheral portion of the substrate 100 is disposed on or above a central portion 42, and the outer peripheral portion thereof is placed on the annular portion 50. In this state, a space S is formed between the base portion 30, the annular portion 50, and the substrate 100.

[0037] The suction portion 60 sucks the inside of a space S formed by the base portion 30, the annular portion 50, and the substrate 100. An annular groove 61 that is recessed downward and continuous in the circumferential direction is formed between the annular portion 50 and the central portion 42. The bottom of this annular groove 61 is formed by an upper surface 41t of a base plate 41 provided on a base plate 32 of the base portion 30, and a head 39b of a fixture 39 is exposed.

[0038] A through-hole 39h is formed in a fixture 39 that fixes the base plate 41 to the base plate 32. The negative pressure generated by the negative pressure generating source reaches a space S formed between the base portion 30, the annular portion 50, and the substrate 100 through the shaft through-hole 71h, the internal space of the boss portion 33, the flow path 38, the recess 36, and the through-hole 39h of the fixture 39. With this configuration, when the substrate 100 is placed on the annular portion 50 and the annular portion 50 is closed by the substrate 100, the atmosphere in the space S is sucked by the negative pressure generated by the negative pressure generating source, and the substrate 100 is adsorbed and held by the substrate holding table 3.

[0039] As shown in FIG. 1, the processing unit 9 performs a predetermined process on the substrate 100 held by the substrate holding table 3 of the substrate holding device 2. In the present embodiment, as the processing unit 9, for example, a nozzle 91 for supplying a cleaning liquid for cleaning the substrate 100 to the surface of the substrate 100 is provided. Although FIG. shows an example in which there is one nozzle 91, a plurality of nozzles may be arranged in a row and used. Further, the nozzle 91 may be movable in the radial direction above the substrate holding table 3 by a nozzle driving unit (not shown).

[0040] The cleaning liquid is supplied to the nozzle 91 through a pipe from a cleaning liquid supply source (not shown). The nozzle 91 discharges the cleaning liquid supplied from the cleaning liquid supply source downward from the discharge port. The cleaning liquid discharged from the nozzle 91 is supplied to the upper surface of the substrate 100 supported by the substrate holding table 3, and the substrate 100 is cleaned. In order to collect the cleaning liquid discharged from the nozzle 91, an appropriate tray may be provided around the substrate holding table 3.

[0041] Next, a method for processing the substrate 100 in the substrate processing apparatus 1 as described above will be described. First, outside the substrate processing apparatus 1, the substrate 100 is held by a substrate transfer mechanism (not shown). Subsequently, the held substrate 100 is placed on the substrate holding table 3 by the substrate transfer mechanism (not shown). In this state, as shown in FIG. 5, in the case of the substrate 100 without warpage or with a small warpage, the outer peripheral portion of the substrate 100 is placed on the annular portion 50, and the inner peripheral portion of the substrate 100 does not contact the holding surface 42f of the central portion 42 and is spaced above the holding surface 42f. In the present specification, the warpage of the substrate 100 is used in a meaning including not only a single convex shape but also a state in which a plurality of convex shapes are continuous and form a waveform.

[0042] Next, negative pressure generated by a negative pressure source such as a vacuum pump (not shown) is applied to a space S formed between the base portion 30, the annular portion 50, and the substrate 100. As a result, the atmosphere in the space S is sucked by the suction force generated on the inner peripheral side of the annular portion 50. FIG. 6 is a cross-sectional view showing a state in which the substrate 100 is placed on the annular portion 50 of the substrate holding device 2 according to the embodiment and sucked by the suction portion 60. As shown in FIG. 5, in the case of a substrate 100 that is not warped or has a small warp, when the atmosphere in the space S is sucked, as shown in FIG. 6, the second layer 52 of the annular portion 50 is elastically deformed in the compression direction, the volume of the space S decreases, and the central portion of the substrate 100 comes into contact with the holding surface 42f of the substrate holding table 3. Then, the suction force by the plurality of groove portions 45 formed on the holding surface 42f reaches the lower surface of the inner peripheral portion of the substrate 100, and the substrate 100 is more reliably adsorbed and held.

[0043] FIG. 7 is a cross-sectional view showing a state in which a warped substrate 100 is placed on the annular portion 50 of the substrate holding device 2 according to the embodiment. The substrate 100 shown in FIG. 7 is warped in a state of being convex downward. As shown in FIG. 7, in the case of a substrate 100 with a large warp, when the substrate 100 is placed on the substrate holding table 3, the outer peripheral portion of the substrate 100 is placed on the annular portion 50, and the central portion (inner peripheral portion) is in a state of contacting the holding surface 42f of the central portion 42.

[0044] That is, since the upper surface of the annular portion 50 is located above the holding surface 42f, even when the central portion of the substrate 100 contacts the holding surface 42f, the outer peripheral portion of the substrate 100 is in a state of contacting the annular portion 50. Or, when the substrate 100 is warped in a state of being convex downward, even when the central portion does not contact the holding surface 42f, the outer peripheral portion of the substrate 100 is in a state of contacting the annular portion 50. As a result, since the outer peripheral portion of the substrate 100 is in contact with the annular portion 50, the space S on the inner peripheral side of the annular portion 50 is in a closed state. In this state, when the atmosphere in the space S on the inner peripheral side of the annular portion 50 is sucked by the suction portion 60, as the volume in the space S shrinks, the second layer 52 of the annular portion 50 is elastically deformed in the compression direction.

[0045] When placing the substrate 100 on the substrate holding table 3, the substrate 100 may be pressed downward by a conveying device (not shown) of the substrate 100. By this operation, the outer peripheral portion of the substrate 100 can be surely brought into contact with the upper surface of the annular portion 50. At this time, the second layer 52 of the annular portion 50 may be elastically deformed in the compression direction by the outer peripheral portion of the substrate 100 pressed downward. Further, instead of pressing the substrate 100 downward by a conveying device (not shown), the substrate 100 may be pressed downward by a device different from the conveying device (not shown).

[0046] FIG. 8 is a cross-sectional view of a main part showing a state in which the warped substrate 100 as shown in FIG. 7 is placed and sucked by the suction portion 60. As shown in FIG. 8, while the central portion of the substrate 100 remains in contact with the holding surface 42f, the outer peripheral portion is displaced downward. As a result, as shown in FIG. 8, the warped substrate 100 extends in a flat plate shape along the holding surface 42f. The substrate 100 is surely adsorbed and held on the holding surface 42f by the suction force of the plurality of groove portions 45 formed on the holding surface 42f when the central portion of the substrate 100 comes into contact with the holding surface 42f of the substrate holding table 3. Further, since the substrate 100 is adsorbed along the holding surface 42f, as shown in FIG. 6, the substrate 100 is held in a flat plate shape with the warp eliminated.

[0047] FIG. 9 is a cross-sectional view showing a state in which the warped substrate 100A is placed on the annular portion 50 of the substrate holding device 2 according to the embodiment. The substrate 100A shown in FIG. 9 is warped in a convex upward state. As shown in FIG. 9, when the substrate 100A is placed on the substrate holding table 3, the outer peripheral portion of the substrate 100 is placed on the annular portion 50, and the central portion is separated from the holding surface 42f. As a result, since the outer peripheral portion of the substrate 100A is in contact with the annular portion 50, the space S on the inner peripheral side of the annular portion 50 is in a closed state. In this state, when the atmosphere of the space S on the inner peripheral side of the annular portion 50 is sucked by the suction portion 60, as the volume in the space S decreases, the second layer 52 of the annular portion 50 is elastically deformed in the compression direction.

[0048] FIG. 10 is a cross-sectional view of the main part showing a state in which the warped substrate 100A is placed as shown in FIG. 9 and sucked by the suction unit 60. As shown in FIG. 10, the central portion of the substrate 100A is drawn toward the holding surface 42f while the outer peripheral portion is displaced upward. As a result, as shown in FIG. 10, the warped substrate 100A extends in a flat plate shape along the holding surface 42f. The substrate 100A comes into contact with the holding surface 42f of the substrate holding table 3 of the substrate holding device 2 at the central portion, and the suction force due to the plurality of groove portions 45 formed in the holding surface 42f acts thereon, and the substrate 100A is surely adsorbed and held on the holding surface 42f. Further, the substrate 100A is adsorbed along the holding surface 42f, and as shown in FIG. 6, the substrate 100A is held in a flat plate shape with the warp eliminated.

[0049] In the substrate processing apparatus 1, in this way, while the substrate 100 is adsorbed and held by the substrate holding table 3 of the substrate holding device 2, the held substrate 100 is rotated around the vertical axis Cv. In this state, the processing unit 9 performs a predetermined process on the substrate 100. In the present embodiment, the nozzle discharges from the nozzle 91 to clean the upper surface of the substrate 100. After the predetermined process is performed, the rotation of the substrate holding table 3 is stopped, and the suction in the suction unit 60 is released. Then, a substrate transfer mechanism (not shown) takes out the substrate 100 held by the substrate holding table 3 and carries it out of the substrate processing apparatus 1.

[0050] As described above, according to the present embodiment, an annular portion 50 that is deformable in contact with the outer peripheral portion of the substrate 100 protruding radially outward from the central portion 42 over a full circumference is provided, and the suction unit 60 sucks the inside of the space S formed by the base portion 30, the annular portion 50, and the substrate 100. Therefore, even when the substrate 100 is warped, if the lower surface of the substrate 100 comes into contact with the annular portion 50, the substrate 100 can be adsorbed and held by sucking the inside of the space S by the suction unit 60. Moreover, when the inside of the space S is sucked by the suction unit 60 in a state where the outer peripheral portion of the substrate 100 is in contact with the annular portion 50, the annular portion 50 deforms following the lower surface of the substrate 100, so that the substrate 100 can be more surely adsorbed and held. Therefore, even a warped substrate 100 can be satisfactorily adsorbed and held.

[0051] As described above, the embodiments of the present invention have been explained. However, the technical scope of the present invention is not limited to the aspects described in the above embodiments and the like. It is obvious to those skilled in the art that various changes or improvements can be made to the above-described embodiments. Also, forms with such changes or improvements are included in the technical scope of the present invention. One or more of the requirements described in the above embodiments may be omitted. Also, the requirements described in the above embodiments can be combined as appropriate. Also, the execution order of each operation shown in the embodiment can be realized in any order as long as the result of the previous operation is not used in the subsequent operation. Also, regarding the operations in the above-described embodiments, even if they are described for convenience using "first", "next", "subsequently", etc., it is not essential to carry out in this order.

[0052] In the above-described embodiment, as the processing unit, a cleaning process for cleaning the substrate is performed, but it is not limited to this form. As the processing unit, for example, a configuration including a spin coater or the like for applying a coating liquid to the surface of the substrate may be used. That is, the substrate holding device 2 may be provided in the substrate processing device 1.

[0053] Also, in the above-described embodiment, the form in which the substrate holding device 2 is provided in the substrate processing device 1 is described as an example, but it is not limited to this form. The above-described substrate holding device 2 may be provided, for example, in a substrate transfer device (not shown) that transfers the substrates 100 and 100A. In such a substrate transfer device (not shown), for example, the above-described substrate holding device 2 is provided on the movable end side of a robot arm, a manipulator, or the like, and the substrates 100 and 100A can be transferred in a state where the upper surface or the lower surface of the substrates 100 and 100A is adsorbed and held by this substrate holding device 2.

Explanation of Reference Numerals

[0054] 1 ··· Substrate processing device 2 ··· Substrate holding device 30 ··· Base part 39 ··· Fixture 39h ··· Through hole 41 ··· Base plate (third layer) 42 ··· Central part 42f ··· Holding surface 45 ··· Groove part 50 ··· Annular part 50s ··· End face 51 ··· First layer 52 ··· Second layer 60 ··· Suction part 71 ··· Rotation axis 100, 100A ··· Substrate S ··· Space

Claims

1. A base portion, a central portion provided on the base portion and having a holding surface that contacts the central portion of the substrate, an annular portion provided on the base portion so as to surround the central portion and contacting and deformable around the outer peripheral portion of the substrate protruding radially outward from the central portion, and a suction portion that suctions the space formed by the base portion, the annular portion, and the substrate, the substrate holding device.

2. The front end surface of the annular portion is provided so as to protrude in a direction away from the base portion with respect to the holding surface of the central portion, the substrate holding device according to Claim 1.

3. The annular portion is arranged to be separated radially outward from the central portion, the substrate holding device according to Claim 1.

4. The annular portion, a first layer that contacts the substrate, and a second layer that is arranged between the first layer and the base portion and has lower rigidity and is elastically deformable than the first layer, and is provided by laminating, the substrate holding device according to Claim 1.

5. The first layer has higher conductivity than the second layer and has higher heat resistance than the second layer, the substrate holding device according to Claim 4.

6. The first layer is formed of a material containing at least one of polyetheretherketone, polyamideimide, and polyphenylene sulfide, the substrate holding device according to Claim 5.

7. The second layer is formed of a material containing at least one of fluororubber, polytetrafluoroethylene, and silicone rubber, the substrate holding device according to Claim 4.

8. The second layer is a porous body, the substrate holding device according to Claim 7.

9. The central portion and the annular portion are attached to the base portion via a third layer formed of the same material as the first layer, the substrate holding device according to Claim 4.

10. The central portion is formed of the same material as the first layer, the substrate holding device according to Claim 4.

11. The central portion is attached to the base portion by a fixture, and the suction portion suctions the space through a through hole provided in the fixture, the substrate holding device according to Claim 1.

12. The central portion includes a plurality of groove portions that reach the side surface of the central portion at the holding surface, the substrate holding device according to Claim 11.

13. The base portion is rotatable around a rotation axis including the center of the central portion, the substrate holding device according to Claim 1.

14. A substrate processing apparatus comprising the substrate holding apparatus according to claim 1.

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