Test pad

Abstract

To provide a test pad.SOLUTION: A test pad 120 of the present invention is installed on a substrate 110 with at least one circuit 130, and the test pad 120 is used to contact the probe's contact area. The test pad 120 has a groove 122 to limit the contact area to prevent a situation where the contact area slides out of the test pad 120.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present invention relates to a test pad, and more particularly to a test pad that prevents a probe from slipping out.

Background Art

[0002] A conventional circuit board 10 has a substrate 11 and a circuit layer 12. The circuit layer 12 has at least one circuit 12a and at least one test pad 12b, and a part of the circuit layer 12 is covered by a solder resist layer 13. When the substrate 11 warps, the test pad 12b follows the substrate 11 and bends or tilts (see FIGS. 1 to 3).

Summary of the Invention

Problems to be Solved by the Invention

[0003] Referring to FIGS. 2 and 3, when testing by bringing a probe 20 of a test device (for example, a probe card) into contact with the test pad 12b, if the substrate 11 is warped, the contact portion 21 of the probe 20 slips out of the test pad 12b, and the test fails. In order to prevent the contact portion 21 from slipping out of the test pad 12b, it is necessary to increase the pressing pressure of the probe 20 and crimp the probe 20 to the test pad 12b. However, the frictional force between the contact portion 21 and the test pad 12b also increases, the contact portion 21 and the test pad 12b are worn, and the lives of the probe 20 and the circuit board 10 are shortened.

[0004] Also, when the frictional force between the contact portion 21 and the test pad 12b increases, wear particles are generated on the contact portion 21 and / or the test pad 12b. When the wear particles adhere to the contact portion 21 or the test pad 12b, the test device or the circuit board 10 shorts, and the product yield and test efficiency decrease. In order to prevent short circuits, it is necessary to increase the cleaning frequency of the probe 20, but then the test efficiency decreases.

[0005] Therefore, the inventor of the present invention considered that the above-mentioned drawbacks could be improved, and as a result of intensive studies, the present invention was proposed to effectively improve the above-mentioned problems through reasonable design.

[0006] The present invention has been made in view of such circumstances, and an object thereof is to provide a test pad installed on a substrate, wherein a groove portion of the test pad prevents a contact portion of a probe from slipping out of the test pad.

Means for Solving the Problems

[0007] In order to solve the above problems, the test pad of the present invention adopts the following means. A test pad according to an aspect of the present invention is installed on a substrate together with at least one circuit, and the test pad is used to contact a contact portion of a probe. The test pad includes at least one groove portion for restricting a situation where the contact portion slips out of the test pad, and an edge end portion of the groove portion is used to contact the contact portion.

Effects of the Invention

[0008] When the contact portion of the probe contacts the test pad, the present invention prevents the contact portion from slipping out of the test pad by restricting the contact portion with the groove portion.

[0009] Other features of the present invention will be clarified by the description in this specification and the accompanying drawings.

Brief Description of the Drawings

[0010]

Figure 1

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Figure 11

Embodiments for Carrying out the Invention

[0011] Hereinafter, embodiments of the test pad of the present invention will be described with reference to the drawings. However, the present invention is not limited to these embodiments, and members, materials, etc. described below can be variously modified within the scope of the gist of the present invention.

[0012] First, the test pad according to the present invention will be described in detail with reference to FIGS. 4 to 6. The test pad 120 and at least one circuit 130 are installed on the substrate 110 and constitute the circuit board 100. The test pad 120 is connected to the circuit 130. A metal layer (not shown) installed on the substrate 110 can form the test pad 120 and the circuit 130 through an etching process, and a part of the circuit 130 is covered by the solder resist layer 140. Note that the present invention does not limit the manufacturing method of the test pad 120 and the circuit 130, and the material of the substrate 110 may be selected from polyimide (PI), polyethylene terephthalate (PET), glass, or silicon.

[0013] As shown in FIGS. 4 to 6, the test pad 120 is used to perform a test by bringing the contact portion 21 of the probe 20 of the test apparatus into contact therewith. The test pad 120 includes at least one groove portion 122, and the groove portion 122 is used to limit the contact portion 21 so as to prevent the contact portion 21 from slipping out of the test pad 120 during the test process. The shape of the groove portion 122 may be selected from various geometric shapes (see FIGS. 5 and 7 to 11). Preferably, the groove portion 122 is a closed groove, but not a circular groove. As shown in FIG. 6, the width W of the groove portion 122 is not greater than the outer diameter D of the contact portion 21 of the probe 20.

[0014] As shown in FIGS. 5 to 6, preferably, the test pad 120 further includes a main body 121 and a position limiting portion 123, and the groove portion 122 is located between the main body 121 and the position limiting portion 123. The main body 121 is connected to the circuit 130. The groove portion 122 surrounds the main body 121, the position limiting portion 123 surrounds the groove portion 122, and the position limiting portion 123 is electrically connected to the main body 121. In this embodiment, the end portion 123a of the position limiting portion 123 is connected to the circuit 130. Preferably, the area of the main body 121 is not less than the area of the groove portion 122. As shown in FIG. 7, in another embodiment, the end portion 123a of the position limiting portion 123 is connected to the main body 121.

[0015] As shown in FIGS. 5 to 6, when the contact portion 21 of the probe 20 contacts the test pad 120, the groove portion 122 can limit the displacement of the contact portion 21. When the probe 20 slides to the groove portion 122, the contact portion 21 contacts the edge portion 122a of the groove portion 122, and the probe 20 can perform a test on the test pad 120.

[0016] As shown in FIG. 8, in another embodiment, the end portion 123a of the position limiting portion 123 is connected to the circuit 130, and the test pad 120 further includes a connecting portion 122c whose both ends are respectively connected to the main body 121 and the position limiting portion 123. The first virtual line X passes through the position limiting portion 123, the connecting portion 122c, and the main body 121, and the second virtual line Y passes through the position limiting portion 123, the groove portion 122, and the main body 121. There is an included angle A between the first virtual line X and the second virtual line Y. FIG. 9 is different from FIG. 8 at the point where the first virtual line X is parallel to the second virtual line Y.

[0017] As shown in FIGS. 9 to 10, in another embodiment, the test pad 120 includes a plurality of groove portions 122b, and the groove portions 122b are not connected to each other. There is at least one connecting portion 122c between adjacent groove portions 122b, and both ends of the connecting portion 122c are respectively connected to the main body 121 and the position limiting portion 123. Preferably, the connecting portion 122c is located at the corner portion 121a of the main body 121 so as to increase the connection strength between the position limiting portion 123 and the main body 121.

[0018] When the contact portion 21 of the probe 20 contacts the test pad 120, the present invention restricts the contact portion 21 by the groove portion 122 so as to prevent the situation where the contact portion 21 slides out of the test pad 120. In the prior art, in order to prevent the probe from sliding, the pressing pressure of the probe increases, the contact portion and the test pad are worn, a short circuit occurs, and the cleaning frequency of the probe increases. The present invention solves these problems.

[0019] The above embodiments are for facilitating the understanding of the present invention and are not for limiting and interpreting the present invention. The present invention can be changed and improved without departing from its gist, and it goes without saying that equivalents of the present invention are included therein.

Explanation of Reference Numerals

[0020] 10 Circuit board 11 Substrate 12 Circuit layer 12a Circuit 12b Test pad 13 Solder resist layer 20 Probe 21 Contact portion 100 Circuit board 110 Substrate 120 Test pad 121 Body 121a Corner 122 Groove portion 122a Edge end portion 122b Groove portion 122c Connection portion 123 Position limiting portion 123a End portion 130 Circuit 140 Solder resist layer A Included angle D Outer diameter W Width X First virtual line Y Second virtual line

Claims

1. A test pad installed on a substrate together with at least one circuit and used for contacting a contact portion of a probe, characterized in that it comprises at least one groove portion for restricting the situation where the contact portion slides out of the test pad, and an edge end portion of the groove portion is used for contacting the contact portion.

2. The test pad according to claim 1, wherein a width of the groove portion is not larger than an outer diameter of the contact portion.

3. The test pad according to claim 1, further comprising a main body and a position limiting portion, wherein the groove portion is located between the main body and the position limiting portion.

4. The test pad according to claim 3, wherein the groove portion surrounds the main body.

5. The test pad according to claim 4, wherein the position limiting portion surrounds the groove portion.

6. The test pad according to claim 3, wherein an area of the main body is not smaller than an area of the groove portion.

7. The test pad according to claim 3, wherein the main body is connected to the circuit, and an end portion of the position limiting portion is connected to the circuit.

8. The test pad according to claim 3, wherein the main body is connected to the circuit, and an end portion of the position limiting portion is connected to the main body.

9. The test pad according to claim 3, further comprising a connection portion having both ends connected to the main body and the position limiting portion respectively, wherein an end portion of the position limiting portion is connected to the circuit, a first virtual line passes through the position limiting portion, the connection portion, and the main body, a second virtual line passes through the position limiting portion, the groove portion, and the main body, and an included angle is formed between the first virtual line and the second virtual line.

10. The test pad according to claim 3, further comprising a connection portion having both ends connected to the main body and the position limiting portion respectively, wherein an end portion of the position limiting portion is connected to the circuit, a first virtual line passes through the position limiting portion, the connection portion, and the main body, a second virtual line passes through the position limiting portion, the groove portion, and the main body, and the first virtual line is parallel to the second virtual line.

11. The test pad according to claim 3, comprising a plurality of the groove portions, each of the groove portions not being connected to each other, having at least one connecting portion between adjacent groove portions, and both ends of the connecting portion being connected to the main body and the position limiting portion respectively.

12. The test pad according to claim 9, characterized in that the connecting portion is located at a corner of the main body.

13. The test pad according to claim 1, further comprising a main body, wherein the area of the main body is not smaller than the area of the groove portion.

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