Three dimension mounting apparatus and three dimension mounting method

Abstract

To irradiate solder paste with a laser beam.SOLUTION: A three dimension mounting apparatus includes a stage for holding a three dimensional substrate, a mounting head for mounting a component onto a surface of a three dimensional substrate to come into contact with solder paste applied to a surface of the three dimensional substrate, a laser head for irradiating the solder paste with a laser beam after mounting the component, and a controller. The controller includes an angle calculation section that calculates an inclination angle of the three dimensional substrate to prevent objects around the component from being irradiated with the laser beam when the solder paste in contact with the component is irradiated with the laser beam, and a stage control section that controls the stage to incline the three dimensional substrate based on the inclination angle of the three dimensional substrate.SELECTED DRAWING: Figure 20

Description

Technical Field

[0001] The technology disclosed in this specification relates to a three-dimensional mounting device and a three-dimensional mounting method.

Background Art

[0002] In the technical field related to three-dimensional mounting devices, a three-dimensional mounting device for mounting components on a three-dimensional substrate, as disclosed in Patent Document 1, is known.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The component is mounted on the surface of the three-dimensional substrate so as to contact the cream solder applied to the surface of the three-dimensional substrate. After the component is mounted, the cream solder is irradiated with laser light, whereby the cream solder melts. When the melted cream solder cools, the component is soldered to the three-dimensional substrate. When irradiating the laser light, the inclination angle of the three-dimensional substrate is adjusted so that the mounting area on the surface of the three-dimensional substrate on which the component is mounted is in a horizontal state. When irradiating the cream solder with laser light, there is a possibility that the laser light is blocked by an object around the component.

[0005] The technology disclosed in this specification aims to irradiate the cream solder with laser light without being blocked by an obstacle.

Means for Solving the Problems

[0006] This specification discloses a three-dimensional mounting apparatus including a stage for supporting a three-dimensional substrate, a mounting head for mounting components on the surface of the three-dimensional substrate so as to contact the cream solder applied to the surface of the three-dimensional substrate, a laser head for irradiating the cream solder with a laser beam after the components are mounted, and a controller. The controller includes an angle calculation unit for calculating an inclination angle of the three-dimensional substrate so that the laser beam is not blocked by an object around the component when irradiating the cream solder in contact with the component with the laser beam, and a stage control unit for controlling the stage so that the three-dimensional substrate inclines based on the inclination angle of the three-dimensional substrate.

Advantages of the Invention

[0007] According to the technology disclosed in this specification, it is possible to avoid the shielding objects of the complex three-dimensional substrate, irradiate the cream solder with a laser beam, and enable soldering.

Brief Description of the Drawings

[0008]

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[0009] Hereinafter, embodiments will be described with reference to the drawings. In the embodiments, an XYZ orthogonal coordinate system is defined, and the positional relationship of each part will be described with reference to this XYZ orthogonal coordinate system. The direction parallel to the X-axis of a predetermined plane is defined as the X-axis direction. The direction parallel to the Y-axis of a predetermined plane orthogonal to the X-axis is defined as the Y-axis direction. The direction parallel to the Z-axis orthogonal to the predetermined plane is defined as the Z-axis direction. The rotational direction or tilting direction centered on the X-axis direction is defined as the θX direction. The rotational direction or tilting direction centered on the Y-axis direction is defined as the θY direction. The rotational direction or tilting direction centered on the Z-axis direction is defined as the θZ direction. In the embodiments, the predetermined plane and the horizontal plane are parallel. The Z-axis is parallel to the vertical axis, and the Z-axis direction is the up-and-down direction. The +Z side is the upper side, and the -Z side is the lower side. Also, in the embodiments, a predetermined plane including the X-axis and the Y-axis is appropriately referred to as the XY plane.

[0010] [First Embodiment] The first embodiment will be described.

[0011] [Substrate] FIG. 1 is a perspective view showing a substrate 1 and a component 2 according to the embodiment. In the embodiment, the substrate 1 is a three-dimensional substrate. A three-dimensional substrate refers to a substrate having a non-planar surface. The surface of the substrate 1 includes a curved surface. At least a part of the surface of the substrate 1 is curved. The surface of the substrate 1 may include corners. Protrusions may be provided on the surface of the substrate 1.

[0012] An electric circuit is provided on the surface of the substrate 1. In the embodiment, the substrate 1 is formed by an in-mold molding technique. The substrate 1 includes a base material 1A having a curved surface and a film 1B joined to the surface of the base material 1A. The film 1B is flexible. The film 1B is a flexible film. The film 1B includes an electric circuit. The surface of the substrate 1 includes the surface of the film 1B.

[0013] The component 2 includes an electronic component. The component 2 may be a lead type electronic component having leads protruding from the body. The component 2 may also be a chip type electronic component having no leads. By mounting the component 2 on the surface of the substrate 1, an electronic device is manufactured.

[0014] <Palette> FIG. 2 is a perspective view showing a palette 3 for holding the substrate 1 according to the embodiment. FIG. 3 is an exploded perspective view showing the substrate 1 and the palette 3 according to the embodiment. The palette 3 holds the substrate 1. In the embodiment, the substrate 1 is handled while being held by the palette 3. The palette 3 has a support member 4 for supporting the substrate 1 and a clamp mechanism 5 for fixing the substrate 1.

[0015] The support member 4 includes a base portion 4A for supporting the substrate 1 from the -Z side, guard portions 4B provided on the +Y side and the -Y side of the base portion 4A respectively, and a plurality of pin portions 4C for supporting the substrate 1 from the +Y side and the -Y side respectively.

[0016] The base portion 4A is plate-shaped with a plurality of openings. Two holes 4D are provided in the base portion 4A. The holes 4D penetrate through the upper surface and the lower surface of the base portion 4A.

[0017] The guard portion 4B is long in the X-axis direction. A pair of guard portions 4B is provided. The pair of guard portions 4B are separated from each other in the Y-axis direction. One guard portion 4B protrudes from the +Z side from the +Y side end of the upper surface of the base portion 4A. The other guard portion 4B protrudes from the +Z side from the -Y side end of the upper surface of the base portion 4A.

[0018] Each of the plurality of pin portions 4C protrudes from the upper surface of the base portion 4A toward the +Z side. Some of the pin portions 4C are arranged on the +Y side of the center of the base portion 4A. Some of the pin portions 4C are arranged on the -Y side of the center of the base portion 4A. The plurality of pin portions 4C arranged on the +Y side of the center of the base portion 4A support the +Y side end portion of the substrate 1. The plurality of pin portions 4C arranged on the -Y side of the center of the base portion 4A support the -Y side end portion of the substrate 1.

[0019] The clamping mechanism 5 is provided on the support member 4. The clamping mechanism 5 fixes the substrate 1 to the support member 4. The clamping mechanism 5 includes a pair of support portions 5A that support the -X side end portion of the substrate 1 and a movable portion 5B that supports the +X side end portion of the substrate 1. The movable portion 5B is movable in the X-axis direction on the upper surface of the base portion 4A. With the substrate 1 disposed between the support portion 5A and the movable portion 5B, when the movable portion 5B moves in the -X direction, the substrate 1 is sandwiched between the support portion 5A and the movable portion 5B. The substrate 1 is fixed to the pallet 3 by being sandwiched between the support portion 5A and the movable portion 5B.

[0020] <Three-dimensional mounting device> FIG. 4 is a side view schematically showing the three-dimensional mounting device 10 according to the embodiment. FIG. 5 is a plan view schematically showing the three-dimensional mounting device 10 according to the embodiment. The three-dimensional mounting device 10 mounts the component 2 on the substrate 1.

[0021] The three-dimensional mounting device 10 includes a base member 18, a transfer device 19, a stage 20, a stage moving device 21, a component supply device 22, a mounting head 24 including a nozzle 23, a camera 25, a head moving device 27, a dispenser 11, a laser head 12, a chamber 29, and a controller 16.

[0022] The base member 18 supports each of the transfer device 19, the stage 20, the stage moving device 21, the component supply device 22, the mounting head 24, the dispenser 11, the laser head 12, and the head moving device 27.

[0023] The transfer device 19 transfers the pallet 3 holding the substrate 1 in the X-axis direction. The transfer device 19 transfers the pallet 3 to the processing position of the three-dimensional mounting device 10. The processing position is defined on the transfer path of the transfer device 19.

[0024] The transfer device 19 has a transfer belt 19A that transfers the pallet 3 in the X-axis direction and a guide member 19B that guides the pallet 3.

[0025] The guide member 19B is long in the X-axis direction. A pair of guide members 19B are provided. The pair of guide members 19B are separated from each other in the Y-axis direction. One guide member 19B is disposed on the +Y side of the pallet 3. The other guide member 19B is disposed on the -Y side of the pallet 3.

[0026] The transfer belt 19A is annular. A pair of transfer belts 19A are provided. The transfer belt 19A is supported by the guide member 19B via a drive pulley and a driven pulley. The transfer belt 19A is wound around the drive pulley and the driven pulley. One transfer belt 19A is supported by one guide member 19B. The other transfer belt 19A is supported by the other guide member 19B.

[0027] Of the pair of transfer belts 19A, the transfer belt 19A disposed on the +Y side supports the +Y side end of the lower surface of the pallet 3. The transfer belt 19A disposed on the -Y side supports the -Y side end of the lower surface of the pallet 3. When the drive pulley rotates by a drive motor (not shown), the pallet 3 is transferred in the X-axis direction.

[0028] By an actuator (not shown), one guide member 19B is movable in the Y-axis direction with respect to the other guide member 19B. When one guide member 19B and the other guide member 19B are separated from each other in the Y-axis direction, the support of the pallet 3 by the transfer belt 19A is released.

[0029] FIG. 6 is a perspective view showing a pallet 3 and a stage 20 according to an embodiment. FIG. 7 is an exploded perspective view showing the pallet 3 and the stage 20 according to the embodiment.

[0030] The stage 20 supports the substrate 1 via the pallet 3. The stage 20 supports the pallet 3 conveyed to the processing position from the -Z side. Two positioning members 20A are provided on the upper surface of the stage 20. The positioning member 20A is inserted into the hole 4D of the pallet 3. By inserting the positioning member 20A into the hole 4D from the -Z side of the pallet 3, the stage 20 and the pallet 3 are positioned. A hook is provided at the upper end of the positioning member 20A. The hook is hung on the pallet 3. The hook includes a ball that moves by air pressure. After the positioning member 20A is inserted into the hole 4D from the -Z side of the pallet 3, the stage 20 and the pallet 3 are fixed by hanging the ball on the pallet 3.

[0031] The stage moving device 21 moves the stage 20. In the embodiment, the stage moving device 21 moves the stage 20 in each of the Y-axis direction, Z-axis direction, θX direction, and θY direction. The stage moving device 21 includes a Y-axis motor that generates power to move the stage 20 in the Y-axis direction, a Z-axis motor that generates power to move the stage 20 in the Z-axis direction, a θX motor that generates power to rotate the stage 20 in the θX direction, and a θY motor that generates power to rotate the stage 20 in the θY direction.

[0032] After the pallet 3 is transported to the processing position by the transport device 19, the guide member 19B on the +Y side moves in the +Y direction so as to move away from the other guide member 19B, and the stage moving device 21 moves the stage 20 in the +Z direction. By moving the guide member 19B on the +Y side in the Y-axis direction so as to move away from the other guide member 19B, the support of the pallet 3 by the conveyor belt 19A is released. Since the support of the pallet 3 by the conveyor belt 19A is released and the stage 20 moves in the +Z direction, the pallet 3 is transferred from the transport device 19 to the stage 20. The stage moving device 21 can move the stage 20 in each of the Z-axis direction, the θX direction, and the θY direction by moving the stage 20 in the +Y direction so that the stage 20 comes to the center between the two guide members 19B while the pallet 3 is supported by the stage 20.

[0033] When transferring the pallet 3 from the stage 20 to the transport device 19, the stage 20 moves in the -Y direction until one side of the pallet 3 comes onto the conveyor belt 19A, and the guide member 19B on the +Y side moves to the -Y side until the opposite side of the pallet 3 comes onto the conveyor belt 19A. After the fixing of the hook provided at the upper end of the positioning member 20A is released, the stage moving device 21 moves the stage 20 in the -Z direction. Thereby, the support of the pallet 3 by the stage 20 is released, and the pallet 3 is supported by the conveyor belt 19A.

[0034] The component supply device 22 supplies the components 2. The component supply device 22 includes a plurality of tape feeders. The tape feeder holds a plurality of components 2. The component supply device 22 supplies at least one of the plurality of components 2 to the supply position. The component supply device 22 is arranged on the -Y side of the transport device 19. Note that the component supply device 22 may be arranged on each of the +Y side and the -Y side of the transport device 19.

[0035] The mounting head 24 mounts the component 2 on the substrate 1. The mounting head 24 supports a plurality of nozzles 23. The mounting head 24 holds the component 2 supplied from the component supply device 22 by the nozzles 23 and mounts it on the substrate 1. The mounting head 24 is movable between a supply position where the component 2 is supplied from the component supply device 22 and a processing position where the substrate 1 is disposed. The mounting head 24 holds the component 2 supplied to the supply position by the nozzles 23, moves to the processing position, and then mounts it on the surface of the substrate 1 disposed at the processing position.

[0036] The head moving device 27 moves the mounting head 24. In the embodiment, the head moving device 27 moves the mounting head 24 in each of the X-axis direction and the Y-axis direction. The head moving device 27 includes an X-axis moving device 27X that moves the mounting head 24 in the X-axis direction and a Y-axis moving device 27Y that moves the mounting head 24 in the Y-axis direction. Each of the X-axis moving device 27X and the Y-axis moving device 27Y includes an actuator. The X-axis moving device 27X is connected to the mounting head 24. By the operation of the X-axis moving device 27X, the mounting head 24 moves in the X-axis direction. The Y-axis moving device 27Y is connected to the mounting head 24 via the X-axis moving device 27X. By the operation of the Y-axis moving device 27Y causing the X-axis moving device 27X to move in the Y-axis direction, the mounting head 24 moves in the Y-axis direction.

[0037] FIG. 8 is a diagram schematically showing the mounting head 24 according to the embodiment. As shown in FIG. 8, the mounting head 24 has a plurality of nozzles 23. The nozzles 23 removably hold the component 2. The nozzles 23 are suction nozzles that suction-hold the component 2. An opening is provided at the lower end of the nozzle 23. The opening of the nozzle 23 is connected to a vacuum system. In a state where the lower end of the nozzle 23 is in contact with the component 2, by performing a suction operation from the opening provided at the lower end of the nozzle 23, the component 2 is suction-held at the lower end of the nozzle 23. By releasing the suction operation from the opening, the component 2 is released from the nozzle 23. Note that the nozzle 23 may be a gripper nozzle that holds the component 2 by sandwiching it.

[0038] The mounting head 24 has a nozzle moving device 28 that moves the nozzle 23. The nozzle moving device 28 moves the nozzle 23 in each of the Z-axis direction and the θZ direction. The nozzle moving device 28 is supported by the mounting head 24. The nozzle 23 is connected to the lower end of the shaft 23A. A plurality of shafts 23A are provided. The plurality of nozzles 23 are connected to respective ones of the plurality of shafts 23A. A plurality of nozzle moving devices 28 are provided. The plurality of nozzle moving devices 28 are connected to respective ones of the plurality of shafts 23A. The nozzle 23 is supported by the mounting head 24 via the shaft 23A and the nozzle moving device 28. The nozzle moving device 28 moves the nozzle 23 by moving the shaft 23A in the Z-axis direction and the θZ direction.

[0039] The nozzle 23 is movable in each of the X-axis direction, the Y-axis direction, the Z-axis direction, and the θZ direction by the head moving device 27 and the nozzle moving device 28. When the nozzle 23 moves, the component 2 held by the nozzle 23 is also movable in each of the X-axis direction, the Y-axis direction, the Z-axis direction, and the θZ direction.

[0040] The camera 25 images the substrate 1. In the embodiment, the camera 25 images the surface of the substrate 1 from the +Z side of the substrate 1. The camera 25 is provided on the mounting head 24. The camera 25 moves in the X-axis direction and the Y-axis direction together with the mounting head 24. The camera 25 can image the alignment marks provided on the surface of the substrate 1. The camera 25 can image the component 2 after being mounted on the substrate 1.

[0041] The dispenser 11 applies cream solder to the substrate 1. The dispenser 11 moves in each of the X-axis direction, the Y-axis direction, and the Z-axis direction on the +Z side of the transfer device 19. The dispenser 11 and the mounting head 24 can move separately. After the cream solder is applied to the surface of the substrate 1 by the dispenser 11, the component 2 is mounted on the substrate 1 by the mounting head 24. The mounting head 24 mounts the component 2 on the substrate 1 to which the cream solder has been applied.

[0042] The laser head 12 irradiates the cream solder with laser light so that the cream solder melts. The laser head 12 irradiates the cream solder with laser light after the component 2 is mounted on the substrate 1 via the cream solder. The laser head 12 irradiates the cream solder with laser light to melt the cream solder. The laser head 12 moves in the X-axis direction, Y-axis direction, and Z-axis direction, respectively, on the +Z side of the transfer device 19. The laser head 12, the dispenser 11, and the mounting head 24 can move separately.

[0043] The chamber 29 has an internal space in which the base member 18, the transfer device 19, the stage 20, the stage moving device 21, the component supply device 22, the mounting head 24, the head moving device 27, the nozzle moving device 28, the dispenser 11, and the laser head 12 are respectively accommodated.

[0044] <Controller> FIG. 9 is a hardware configuration diagram of the controller 16 according to the embodiment. The controller 16 includes a computer system. The controller 16 has a processor 16A such as a CPU (Central Processing Unit), a main memory 16B including a non-volatile memory such as a ROM (Read Only Memory) and a volatile memory such as a RAM (Random Access Memory), a storage 16C, and an interface 16D including an input / output circuit. The functions of the controller 16 are stored in the storage 16C as a computer program. The processor 16A reads the computer program from the storage 16C, expands it in the main memory 16B, and executes a predetermined process according to the computer program. Note that the computer program may be distributed to the controller 16 via a network.

[0045] FIG. 10 is a functional block diagram showing a three-dimensional mounting apparatus 10 according to an embodiment. As shown in FIG. 10, the controller 16 includes a permissible angle storage unit 30, a dispenser control unit 31, a stage control unit 32, a head control unit 33, a laser control unit 34, a misalignment amount calculation unit 35, a permissible angle acquisition unit 36, an angle calculation unit 37, a determination unit 38, and a three-dimensional shape data storage unit 39.

[0046] The dispenser control unit 31 controls the dispenser 11. The dispenser control unit 31 controls the dispenser 11 so that the cream solder 60 is applied to the surface of the substrate 1.

[0047] FIG. 11 is a plan view schematically showing a substrate 1 according to an embodiment. As shown in FIG. 11, a plurality of mounting areas 50 are set on the surface of the substrate 1. The mounting area 50 is an area where the component 2 is mounted. The component 2 is mounted in each of the plurality of mounting areas 50. The dispenser control unit 31 applies the cream solder 60 to each of the plurality of mounting areas 50.

[0048] The stage control unit 32 controls the stage 20. The head control unit 33 controls the mounting head 24 so that the component 2 is mounted on the substrate 1 supported by the stage 20.

[0049] Each of FIGS. 12 and 13 is a diagram for explaining the operations of the stage 20 and the mounting head 24 according to an embodiment. A plurality of mounting areas 50 are set on the surface of the substrate 1. In the example shown in FIGS. 12 and 13, the mounting areas 50 set on the surface of the substrate 1 include a mounting area 50A, a mounting area 50B, and a mounting area 50C. The cream solder 60 is applied to each of the plurality of mounting areas 50. The component 2 includes a component 2A mounted in the mounting area 50A, a component 2B mounted in the mounting area 50B, and a component 2C mounted in the mounting area 50C.

[0050] When mounting the component 2 on the mounting area 50 set on the surface of the substrate 1, the inclination angle of the substrate 1 is adjusted so that the mounting area 50 is in a horizontal state. The stage control unit 32 controls the stage 20 so that the plurality of mounting areas 50 are sequentially in a horizontal state. The head control unit 33 controls the mounting head 24 so that the component 2 is sequentially mounted on the mounting area 50 in a horizontal state. The mounting head 24 mounts the component 2 on the surface of the substrate 1 so that the component 2 contacts the cream solder 60 applied to the surface of the substrate 1.

[0051] As shown in FIG. 12, when mounting the component 2A on the mounting area 50A, the stage control unit 32 controls the stage 20 so that the mounting area 50A is in a horizontal state. The head control unit 33 controls the mounting head 24 so that the component 2A is mounted on the mounting area 50A in a horizontal state. The component 2A is mounted on the mounting area 50A via the cream solder 60 applied to the mounting area 50A.

[0052] As shown in FIG. 13, after the component 2A is mounted on the mounting area 50A, the component 2B is mounted on the mounting area 50B. When mounting the component 2B on the mounting area 50B, the stage control unit 32 controls the stage 20 so that the mounting area 50B is in a horizontal state. The head control unit 33 controls the mounting head 24 so that the component 2B is mounted on the mounting area 50B in a horizontal state. The component 2B is mounted on the mounting area 50B via the cream solder 60 applied to the mounting area 50B.

[0053] After the component 2B is mounted on the mounting area 50B, the component 2C is mounted on the mounting area 50C. When mounting the component 2C on the mounting area 50C, the stage control unit 32 controls the stage 20 so that the mounting area 50C is in a horizontal state. The head control unit 33 controls the mounting head 24 so that the component 2C is mounted on the mounting area 50C in a horizontal state. The component 2C is mounted on the mounting area 50C via the cream solder 60 applied to the mounting area 50C.

[0054] The laser control unit 34 controls the laser head 12. After the component 2 is mounted on the mounting area 50 via the cream solder 60, the laser control unit 34 controls the laser head 12 so that the cream solder 60 is irradiated with laser light. The laser head 12 irradiates the cream solder 60 with laser light after the component 2 is mounted. When the cream solder 60 is irradiated with laser light, the cream solder 60 melts. When the melted cream solder 60 cools, the component 2 is soldered to the substrate 1.

[0055] FIG. 14 is a diagram for explaining the operation of the laser head 12 according to the embodiment. As shown in FIG. 14, the laser head 12 irradiates the cream solder 60 with laser light after the component 2 is mounted on the mounting area 50. When irradiating the cream solder 60 in the mounting area 50 where the component 2 is mounted with laser light, the tilt angle of the substrate 1 is adjusted so that the mounting area 50 is in a horizontal state. The stage control unit 32 controls the stage 20 so that the plurality of mounting areas 50 are sequentially in a horizontal state. The laser control unit 34 controls the laser head 12 so that the cream solder 60 in the horizontal mounting area 50 is sequentially irradiated with laser light.

[0056] As shown in FIG. 14, when irradiating the cream solder 60 in the mounting area 50A where the component 2A is mounted with laser light, the stage control unit 32 controls the stage 20 so that the mounting area 50A is in a horizontal state. The laser control unit 34 controls the laser head 12 so that the cream solder 60 in the horizontal mounting area 50A is irradiated with laser light. The cream solder 60 in the mounting area 50A melts by the irradiation of the laser light. When the melted cream solder 60 in the mounting area 50A is cooled, the component 2A is soldered to the mounting area 50A.

[0057] When irradiating the cream solder 60 in the mounting area 50B where the component 2B is mounted with laser light, the stage control unit 32 controls the stage 20 so that the mounting area 50B is in a horizontal state. The laser control unit 34 controls the laser head 12 so that the cream solder 60 in the horizontal mounting area 50B is irradiated with laser light. The cream solder 60 in the mounting area 50B melts by the irradiation of the laser light. When the melted cream solder 60 in the mounting area 50B is cooled, the component 2B is soldered to the mounting area 50B.

[0058] When irradiating the cream solder 60 in the mounting area 50C where the component 2C is mounted with laser light, the stage control unit 32 controls the stage 20 so that the mounting area 50C is in a horizontal state. The laser control unit 34 controls the laser head 12 so that the cream solder 60 in the horizontal mounting area 50C is irradiated with laser light. The cream solder 60 in the mounting area 50C melts by the irradiation of the laser light. When the melted cream solder 60 in the mounting area 50C is cooled, the component 2C is soldered to the mounting area 50C.

[0059] <Allowable Angle> The position deviation amount calculation unit 35 calculates the position deviation amount ΔD of the component 2 after mounting with respect to the mounting area 50. The component 2 after being mounted on the substrate 1 is imaged by the camera 25. The position deviation amount calculation unit 35 calculates the position deviation amount ΔD of the component 2 after mounting based on the image data of the component 2 after being imaged by the camera 25.

[0060] FIG. 15 is a diagram for explaining the position deviation of the component 2 according to the embodiment. After the component 2 is mounted on the mounting area 50 via the cream solder 60 and before the cream solder 60 is irradiated with laser light, the component 2 is not soldered to the mounting area 50. Therefore, as shown in FIG. 15, when the mounting area 50 is inclined with respect to the horizontal plane, the component 2 may be displaced with respect to the mounting area 50 due to the action of gravity.

[0061] For example, as shown in FIG. 13, when component 2A is mounted on mounting area 50A and then component 2B is mounted on mounting area 50B, mounting area 50A is inclined with respect to the horizontal plane. When mounting area 50A is inclined with respect to the horizontal plane, due to the action of gravity, component 2A may be displaced.

[0062] When calculating the displacement amount ΔD of component 2, after component 2 is mounted on mounting area 50 via solder paste 60 and before the solder paste 60 is irradiated with laser light, component 2 is imaged by camera 25. Displacement amount calculation unit 35 can calculate the displacement amount ΔD of component 2 based on the image data of component 2 imaged by camera 25.

[0063] Allowable angle acquisition unit 36 acquires an allowable angle θ indicating the maximum value of the inclination angle of component 2 at which the displacement amount ΔD of component 2 after mounting is suppressed to be equal to or less than a predetermined specified amount. The inclination angle of component 2 is equal to the inclination angle of mounting area 50 on which component 2 is mounted. The inclination angle of component 2 and the inclination angle of mounting area 50 are inclination angles with respect to the horizontal plane. The specified amount is a value close to zero. In the embodiment, allowable angle θ is the maximum value of the inclination angle at which component 2 is substantially not displaced.

[0064] As shown in FIG. 15, when displacement amount calculation unit 35 calculates displacement amount ΔD, stage control unit 32 inclines mounting area 50 at an arbitrary inclination angle. Stage control unit 32 gradually increases the inclination angle of mounting area 50 with respect to the horizontal plane from 0 degrees. Camera 25 images component 2 mounted on mounting area 50 whose inclination angle is gradually increasing. Displacement amount calculation unit 35 can calculate the maximum value of the inclination angle of component 2 at which displacement amount ΔD becomes equal to or less than the specified value based on the image data of component 2 mounted on mounting area 50 whose inclination angle is gradually increasing. In the embodiment, displacement amount calculation unit 35 can calculate the maximum value of the inclination angle of component 2 at which component 2 is substantially not displaced based on the image data of component 2.

[0065] The allowable angle acquisition unit 36 acquires, as the allowable angle θ, the maximum value of the inclination angle of the component 2 at which the amount of positional deviation ΔD of the component 2 calculated by the positional deviation amount calculation unit 35 is equal to or less than a specified amount. The positional deviation amount calculation unit 35 calculates the allowable angle θ for each of the plurality of components 2 mounted on the substrate 1. The allowable angle acquisition unit 36 acquires the allowable angle θ for each of the plurality of components 2 mounted on the substrate 1. The allowable angle θ acquired by the allowable angle acquisition unit 36 is stored in the allowable angle storage unit 30.

[0066] The angle calculation unit 37 calculates the inclination angle α of the substrate 1 so that the laser light is not irradiated onto the objects around the component 2 when irradiating the cream solder 60 in contact with the component 2 with the laser light. The objects around the component 2 include other components existing around the component 2 after mounting. The objects around the component 2 include a part of the substrate 1 existing around the component 2 after mounting. Also, the so-called surrounding objects here include all the shielding objects that become obstacles when irradiating the cream solder with the laser light.

[0067] The three-dimensional shape data storage unit 39 stores the three-dimensional shape data of each of the substrate 1, the component 2, and the objects around the component 2. The angle calculation unit 37 calculates the inclination angle α of the substrate 1 based on the three-dimensional shape data of each of the substrate 1, the component 2, and the objects around the component 2.

[0068] When irradiating the cream solder 60 in contact with the component 2 with the laser light, the stage control unit 32 controls the stage 20 so that the substrate 1 is inclined based on the inclination angle α of the substrate 1 calculated by the angle calculation unit 37.

[0069] The determination unit 38 determines whether or not the inclination angle β of the component 2 (mounting area 50) when the substrate 1 is inclined at the inclination angle α is equal to or less than the allowable angle θ. When it is determined that the inclination angle β of the component 2 (mounting area 50) is equal to or less than the allowable angle θ, the stage control unit 32 inclines the substrate 1 at the inclination angle α of the substrate 1.

[0070] <Calculation method of allowable angle> FIG. 16 is a flowchart showing a method for calculating the allowable angle θ according to the embodiment. When calculating the allowable angle θ, a test substrate 1 and test components 2 are used.

[0071] The stage control unit 32 controls the stage 20 so that the plurality of mounting areas 50 are sequentially in a horizontal state. The dispenser control unit 31 controls the dispenser 11 so that the cream solder 60 is applied to each of the plurality of mounting areas 50 of the substrate 1 (step SA1).

[0072] The head control unit 33 controls the mounting head 24 so that the components 2 are sequentially mounted on the horizontal mounting area 50 (step SA2).

[0073] The displacement amount calculation unit 35 causes the camera 25 to image the component 2 in the mounting area 50 (step SA3).

[0074] The displacement amount calculation unit 35 calculates the respective displacement amounts ΔD of the component 2 based on the image data of the component 2 imaged in step SA3 (step SA4). It is determined whether or not the displacement amount ΔD calculated by the displacement amount calculation unit 35 is equal to or less than a specified amount (step SA5).

[0075] In step SA5, when it is determined that the displacement amount ΔD is equal to or less than the specified amount (step SA5: Yes), the stage control unit 32 increases the inclination angle of the mounting area 50, and the imaging by the displacement amount calculation unit 35 and the calculation of the displacement amount ΔD are repeated (step SA6).

[0076] In step SA5, when it is determined that the displacement amount ΔD exceeds the specified amount (step SA5: No), the inclination angle before the displacement amount ΔD exceeds the specified amount is stored in the allowable angle storage unit 30 as the allowable angle θ of the inclination angle of the component 2 (step SA7).

[0077] This operation is performed for each component 2 mounted on the substrate 1. The allowable angle θ stored in the allowable angle storage unit 30 can be applied to other substrates 1 if the components 2 are the same.

[0078] FIG. 17 is a diagram schematically showing the allowable angle storage unit 30 according to the embodiment. As shown in FIG. 17, correlation data (allowable angle table) between the component 2 and the allowable angle θ is stored in the allowable angle storage unit 30. The allowable angle acquisition unit 36 stores the allowable angle θ in the allowable angle storage unit 30.

[0079] Note that the allowable angle θ may be measured by a measuring device different from the three-dimensional mounting device 10. The allowable angle θ may be calculated based on, for example, the weight of the component 2. The allowable angle θ may be calculated in consideration of not only the weight of the component 2 but also the volume of the component 2 and the physical properties of the cream solder 60.

[0080] In the following description, in the mounting of the component 2, the component 2 in which the inclination angle β after mounting is suppressed to be equal to or less than the allowable angle θ is appropriately referred to as an allowable component, and the component in which the inclination angle β after mounting exceeds the allowable angle θ in the mounting of the component 2 is appropriately referred to as a non-allowable component.

[0081] <Determination of Irradiation Conditions> FIG. 18 is a flowchart showing a method for determining the irradiation conditions of the laser light according to the embodiment. In the following description, the component 2 that contacts the cream solder 60 irradiated with the laser light is appropriately referred to as a target component. Also, it is assumed that the object around the component 2 (target component) is a component different from the target component. The component existing around the target component is appropriately referred to as a peripheral component.

[0082] The three-dimensional shape data storage unit 39 stores the three-dimensional shape data of each of the substrate 1, the target component, and the peripheral component. The angle calculation unit 37 creates a three-dimensional model based on the three-dimensional shape data of each of the substrate 1, the target component, and the peripheral component, and determines whether there is a target component whose laser light is blocked by the peripheral component when the mounting area 50 of the target component is horizontal and the laser light is irradiated onto the cream solder 60 of the target component (step SB1).

[0083] In step SB1, when it is determined that there is no target component blocked by peripheral components (step SB1: No), the angle calculation unit 37 determines the irradiation conditions of the laser beam so that the laser beam is irradiated onto the cream solder 60 without tilting the mounting area 50 of the target component (step SB5). That is, as described with reference to FIG. 14, the laser beam is irradiated onto the cream solder 60 of the horizontally oriented mounting area 50.

[0084] In step SB1, when it is determined that there is a target component blocked by peripheral components (step SB1: Yes), the angle calculation unit 37 calculates the tilt angle α of the substrate 1 so that the laser beam is not irradiated onto the peripheral components for each target component blocked by the peripheral components (step SB2).

[0085] The determination unit 38 determines whether or not the tilt angle β of the component 2 (mounting area 50) when the substrate 1 is tilted at the tilt angle α is less than or equal to the allowable angle θ (step SB3).

[0086]

[0085] In step SB3, when it is determined that the tilt angle β of the component 2 is less than or equal to the allowable angle θ (step SB3: Yes), the angle calculation unit 37 determines the irradiation conditions of the laser beam so that the laser beam is irradiated onto the cream solder 60 by tilting the mounting area 50 of the target component (permissible component) (step SB4).

[0087] In step SB3, when it is determined that the tilt angle β of the component 2 exceeds the allowable angle θ (step SB3: NoYes), the angle calculation unit 37 determines the mounting conditions of the component 2 and the irradiation conditions of the laser beam so that the target component (non-permissible component) is mounted on the substrate 1 before the permissible component and the laser beam is irradiated onto the cream solder 60 that contacts the non-permissible component (step SB6).

[0088] <Laser Beam Irradiation for Permissible Components> The operation of the three-dimensional mounting apparatus 10 when irradiating the cream solder 60 that contacts the allowable component will be described below. That is, the three-dimensional mounting apparatus 10 that operates based on the irradiation conditions determined in step SB4 of FIG. 18 will be described.

[0089] Each of FIGS. 19, 20, 21, and 22 is a diagram for explaining the operation of the three-dimensional mounting apparatus 10 that irradiates the cream solder 60 that contacts the component 2 which is an allowable component according to the embodiment.

[0090] In FIG. 19, the component 2D is the target component and the component 2E is the peripheral component. When the mounting area 50 of the component 2D is in a horizontal state and the cream solder 60 of the component 2D is irradiated with laser light, the laser light is blocked by the component 2E. Each of the component 2D and the component 2E is an allowable component. Even if the substrate 1 is inclined at an inclination angle α so that the laser light is not irradiated to the component 2E, each of the component 2D and the component 2E is not substantially displaced.

[0091] In FIG. 19, the laser head 12 has an optical system 12A. The optical axis AX of the optical system 12A is parallel to the Z axis. In the example shown in FIG. 19, the height Hf of the focal point Fp of the laser light (optical system 12A) coincides with the height of the mounting area 50 of the component 2D.

[0092] As shown in FIG. 20, the stage control unit 32 controls the stage 20 so that the substrate 1 is inclined based on the inclination angle α of the substrate 1 calculated by the angle calculation unit 37. As shown in FIG. 20, when the substrate 1 is inclined, the laser light emitted from the laser head 12 is irradiated to the cream solder 60 of the component 2D without being blocked by the component 2E.

[0093] As shown in FIG. 21, the stage control unit 32 adjusts the height of the substrate 1 so that the cream solder 60 is disposed at the focal point Fp of the laser light when the substrate 1 is inclined. In the example shown in FIG. 21, the stage control unit 32 raises the stage 20 in the +Z direction from the state shown in FIG. 20.

[0094] As shown in FIG. 22, the stage control unit 32 moves the stage 20 so that the cream solder 60 in contact with the component 2D is uniformly irradiated with laser light. As shown in FIG. 22, when the laser light is not blocked by the component 2E, the stage 20 may be controlled so that the mounting area 50 of the component 2D is parallel to the horizontal plane.

[0095] <Effect> As described above, when irradiating the cream solder 60 in contact with the component 2D with laser light, if the mounting area 50 of the component 2D is in a horizontal state, the laser light may be blocked by the component 2E. In the embodiment, an inclination angle α of the substrate 1 is calculated to prevent the laser light from irradiating the component 2E around the component 2D when irradiating the cream solder 60 in contact with the component 2D with laser light. Based on the inclination angle α of the substrate 1, the stage 20 is controlled so that the substrate 1 is inclined, so that the laser head 12 can irradiate the cream solder 60 in contact with the component 2D with laser light.

[0096] [Second Embodiment] The second embodiment will be described. In the following description, the same or equivalent components as those in the above-described embodiment are denoted by the same reference numerals, and the description of those components is simplified or omitted.

[0097] Each of FIGS. 23, 24, and 25 is a diagram for explaining the operation of the three-dimensional mounting apparatus 10 that irradiates the cream solder 60 in contact with the component 2D, which is an allowable component according to the embodiment, with laser light.

[0098] In the embodiment, the laser head 120 is an area irradiation type laser head. As shown in FIG. 23, the optical system 120A of the laser head 120 forms an irradiation range larger than the outer shape of the component 2D. The irradiation range at the focal position of the laser light by the laser head 120 is rectangular. The height Hf of the image plane of the laser light (optical system 120A) coincides with the height of the mounting area 50 of the component 2D.

[0099] As shown in FIG. 24, the stage control unit 32 controls the stage 20 so that the substrate 1 is inclined based on the inclination angle α of the substrate 1 calculated by the angle calculation unit 37. As shown in FIG. 24, when the substrate 1 is inclined, the laser light emitted from the laser head 120 is irradiated onto the cream solder 60 of the component 2D without being blocked by the component 2E.

[0100] As shown in FIG. 25, the stage control unit 32 adjusts the height of the substrate 1 so that the cream solder 60 is disposed on the image plane of the laser light when the substrate 1 is inclined. In the example shown in FIG. 25, the stage control unit 32 raises the stage 20 in the +Z direction from the state shown in FIG. 24.

[0101] FIG. 26 is a plan view showing the component 2D according to the embodiment. As shown in FIG. 26, the component 2D has a plurality of electrodes 220. The component 2D is mounted on the substrate 1 such that each of the plurality of electrodes 220 contacts the cream solder 60. The electrode 220 and the substrate 1 are joined by the cream solder 60.

[0102] When adjusting the height of the stage 20, the stage control unit 32 adjusts the height of the substrate 1 so that the average height of the plurality of electrodes 220 is disposed on the image plane of the laser light when the substrate 1 is inclined. That is, when the stage control unit 32 changes the stage 20 from the state shown in FIG. 24 to the state shown in FIG. 25, the stage control unit 32 controls the stage 20 so that the height of the image plane of the laser light coincides with the average height of the plurality of electrodes 220.

[0103] As described above, also in the embodiment, the laser light is irradiated onto the cream solder 60 that contacts the component 2D.

Explanation of Signs

[0104] 1…Substrate, 1A…Base material, 1B…Film, 2…Component, 2A…Component, 2B…Component, 2C…Component, 2D…Component, 2E…Component, 3…Palette, 4…Support member, 4A…Base part, 4B…Guard part, 4C…Pin part, 4D…Hole, 5…Clamping mechanism, 5A…Support part, 5B…Movable part, 10…Three-dimensional mounting device, 11…Dispenser, 12…Laser head, 12A…Optical system, 16…Controller, 16A…Processor, 16B…Main memory, 16C…Storage, 16D…Interface, 18…Base member, 19…Conveyor, 19A…Conveyor belt, 19B…Guide member, 20…Stage, 20A…Positioning member, 21…Stage moving device, 22…Component supply device, 23…Nozzle, 23A…Shaft, 24…Mounting head, 25…Camera, 27…Head moving device, 27X…X-axis moving device, 27Y…Y-axis moving device, 28…Nozzle moving device, 29…Chamber, 30…Allowable angle memory unit, 31…Dispenser control unit, 32…Stage control unit, 33…Head control unit, 34…Laser control unit, 35…Position deviation amount calculation unit, 36…Allowable angle acquisition unit, 37…Angle calculation unit, 38…Judgment unit, 39…Three-dimensional shape data memory unit, 50…Mounting area, 50A…Mounting area, 50B…Mounting area, 50C…Mounting area, 60…Solder cream, 120…Laser head, 120A…Optical system, 220…Electrode, AX…Optical axis, Fp…Focus.

Claims

1. A stage for supporting a three-dimensional substrate, a mounting head for mounting components on the surface of the three-dimensional substrate so as to contact the cream solder applied to the surface of the three-dimensional substrate, a laser head for irradiating the cream solder with a laser beam after mounting the components, and a controller, wherein the controller, an angle calculation unit that calculates an inclination angle of the three-dimensional substrate so that the laser beam is not irradiated to an object around the component when irradiating the cream solder in contact with the component with the laser beam, has a stage control unit that controls the stage so that the three-dimensional substrate is inclined based on the inclination angle of the three-dimensional substrate, A three-dimensional mounting apparatus.

2. The controller, has a three-dimensional shape data storage unit that stores three-dimensional shape data of each of the three-dimensional substrate, the component, and the object, and the angle calculation unit calculates the inclination angle of the three-dimensional substrate based on the three-dimensional shape data. The three-dimensional mounting apparatus according to claim 1.

3. The controller, has a tolerance angle acquisition unit that acquires a tolerance angle indicating a maximum value of an inclination angle of the component in which a displacement amount after mounting is suppressed to be equal to or less than a specified amount, and a determination unit that determines whether or not the inclination angle of the component is equal to or less than the tolerance angle, wherein the stage control unit inclines the three-dimensional substrate at the inclination angle of the three-dimensional substrate when it is determined that the inclination angle of the component is equal to or less than the tolerance angle. The three-dimensional mounting apparatus according to claim 1.

4. The object is another component existing around the component. The three-dimensional mounting apparatus according to claim 1.

5. The stage control unit adjusts the height of the three-dimensional substrate so that the cream solder is disposed at the focal point of the laser beam when the three-dimensional substrate is inclined. The three-dimensional mounting apparatus according to claim 1.

6. The component includes a plurality of electrodes, the component is mounted so that each of the plurality of electrodes contacts the cream solder, and the stage control unit adjusts the height of the three-dimensional substrate so that an average height of the plurality of electrodes is disposed at an image plane of the laser beam when the three-dimensional substrate is inclined. The three-dimensional mounting apparatus according to claim 5.

7. Mounting components on the surface of a three-dimensional substrate so as to contact the cream solder applied to the surface of the three-dimensional substrate, Calculating an inclination angle of the three-dimensional substrate for preventing a laser beam from irradiating an object around the component when irradiating a cream solder in contact with the component with the laser beam; Based on the inclination angle of the three-dimensional substrate, inclining the three-dimensional substrate; and A three-dimensional mounting method.

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