Laminated type electronic component

Abstract

To provide a laminated type electronic component which improves interface joint force between a capacity formation part and a cover part, and improves moisture resistance reliability.SOLUTION: A laminated type electronic component includes a body including a capacity formation part including a dielectric layer and an internal electrode alternately laminated with the dielectric layer, and cover parts arranged on both end faces in the lamination direction of the capacity formation part, and an external electrode arranged on the body, wherein when a region which is drawn in an internal direction from the surface of the body and includes glass is determined to an extraction part, the extraction part can be arranged between the capacity formation part and the cover part.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a multilayer electronic component.

Background Art

[0002] A multilayer ceramic capacitor (MLCC), which is one type of multilayer electronic component, is a chip-shaped capacitor that is mounted on a printed circuit board of various electronic products such as video devices like liquid crystal display (LCD) and plasma display panel (PDP), computers, smartphones, and mobile phones, and serves to charge or discharge electricity.

[0003] Such a multilayer ceramic capacitor can be used as a component of various electronic devices due to its advantages of being small in size while ensuring high capacitance and being easy to mount. As various electronic devices such as computers and mobile devices are being miniaturized and have increased output, the requirements for miniaturization and high capacitance of multilayer ceramic capacitors are increasing.

[0004] On the other hand, in order to protect the internal electrodes that form capacitance, cover portions are arranged above and below the capacitance forming portion to protect the internal electrodes. However, moisture penetration from the outside is easy at the interface between the capacitance forming portion and the cover portion, which corresponds to a portion with vulnerable moisture resistance reliability, and various attempts to solve this are underway.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] One of the various problems to be solved by the present invention is to improve the interfacial bonding strength between the capacitance forming portion and the cover portion.

[0007] One of the various problems to be solved by the present invention is to provide a laminated electronic component with improved moisture resistance reliability.

[0008] However, the various problems to be solved by the present invention are not limited to the above-described content, and can be more easily understood in the process of describing specific embodiments of the present invention.

Means for Solving the Problems

[0009] A laminated electronic component according to an embodiment of the present invention includes a dielectric layer, a capacitance forming portion including internal electrodes laminated alternately with the dielectric layer, and a cover portion disposed on both end faces of the capacitance forming portion in the lamination direction, and a main body including the above, and an external electrode disposed on the main body. When a region including glass is drawn inward from the surface of the main body to serve as a drawing portion, the drawing portion can be disposed between the capacitance forming portion and the cover portion.

Effects of the Invention

[0010] One of the various effects of the present invention is that the interfacial bonding strength between the capacitance forming portion and the cover portion is improved.

[0011] One of the various effects of the present invention is that the moisture resistance reliability of the laminated electronic component is improved.

[0012] However, the diverse and significant advantages and effects of the present invention are not limited to the above-described content, and can be more easily understood in the process of describing specific embodiments of the present invention.

Brief Description of the Drawings

[0013]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Embodiments for Carrying Out the Invention

[0014] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into several other forms, and the scope of the present invention is not limited to the embodiments described below. Also, the embodiments of the present invention are provided to more fully explain the present invention to ordinary technicians. Therefore, for clearer explanation, elements such as the shape and size in the drawings may be enlarged, reduced (or emphasized or simplified), and elements denoted by the same reference numerals in the drawings are the same elements.

[0015] In addition, parts not related to the explanation are omitted in the drawings for clearly explaining the present invention, and the sizes and thicknesses of the illustrated components are arbitrarily shown for convenience of explanation, so the present invention is not necessarily limited by the illustration. Also, components having the same function within the scope of the same idea are described using the same reference numerals. Further, throughout the specification, when a part "includes" a certain component, it means that other components can be further included, rather than excluding other components, unless otherwise stated to the contrary.

[0016] In the drawings, the first direction can be defined as the lamination direction or the thickness (T) direction, the second direction as the length (L) direction, and the third direction as the width (W) direction.

[0017] Multilayer electronic component FIG. 1 schematically shows a perspective view of a multilayer electronic component according to an embodiment of the present invention. FIG. 2 schematically shows a separated perspective view showing the laminated structure of internal electrodes. FIG. 3 schematically shows a cross-sectional view taken along line I-I' of FIG. 1. FIG. 4 schematically shows an enlarged view of region P1 in FIG. 3. FIG. 5 schematically shows a cross-sectional view taken along line I-I' of a multilayer electronic component according to another embodiment of the present invention. FIG. 6 schematically shows an enlarged view of region P2 in FIG. 5.

[0018] Hereinafter, with reference to FIGS. 1 to 6, a multilayer electronic component 100 according to an embodiment of the present invention will be described in detail. However, although a multilayer ceramic capacitor will be described as an example of the multilayer electronic component, the present invention can also be applied to various electronic products using a dielectric composition, such as an inductor, a piezoelectric element, a varistor, or a thermistor. Further, it is clear that the description regarding the multilayer electronic component 100 according to an embodiment of the present invention can also be similarly applied to the multilayer electronic component 200 according to another embodiment of the present invention as long as there is no conflicting description.

[0019] A multilayer electronic component 100 according to an embodiment of the present invention includes a capacitance forming portion Ac including a dielectric layer 111 and internal electrodes 121 and 122 laminated alternately with the dielectric layer 111, and a main body 110 including cover portions 112 and 113 disposed on both end faces of the capacitance forming portion Ac in the lamination direction, and external electrodes 131 and 132 disposed on the main body 110. When regions including glass 150 are drawn-in portions 141, 142, 143, and 144 drawn inward from the surface of the main body 110, the drawn-in portions 141, 142, 143, and 144 can be disposed between the capacitance forming portion Ac and the cover portions 112 and 113.

[0020] In the main body 110, the dielectric layer 111 and the internal electrodes 121 and 122 can be laminated alternately.

[0021] More specifically, the main body 110 can include a capacitance forming portion Ac that is disposed inside the main body 110 and includes a first internal electrode 121 and a second internal electrode 122 that are alternately disposed so as to face each other with a dielectric layer 111 interposed therebetween to form a capacitance.

[0022] There is no particular limitation on the specific shape of the main body 110, but as shown in the drawing, the main body 110 can have a hexahedron shape or a shape similar thereto. Due to the shrinkage of the ceramic particles contained in the main body 110 during the firing process, the main body 110 is not a hexahedron having a perfect straight line, but can have a substantially hexahedron shape.

[0023] The main body 110 can have a first surface 1 and a second surface 2 that face each other in a first direction, a third surface 3 and a fourth surface 4 that are connected to the first surface 1 and the second surface 2 and face each other in a second direction, and a fifth surface 5 and a sixth surface 6 that are connected to the first to fourth surfaces 1, 2, 3, 4 and face each other in a third direction.

[0024] The plurality of dielectric layers 111 forming the main body 110 are in a fired state, and the boundary between adjacent dielectric layers 111 can be integrated so as to be difficult to confirm without using a scanning electron microscope (SEM).

[0025] The raw material for forming the dielectric layer 111 is not limited as long as a sufficient capacitance can be obtained. Generally, a perovskite (ABO3) - based material can be used. For example, a barium titanate - based material, a lead composite perovskite - based material, or a strontium titanate - based material can be used. The barium titanate - based material can include BaTiO3 - based ceramic particles. As examples of the ceramic particles, BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zry ) O3 (0 < x < 1, 0 < y < 1) or Ba(Ti 1-y Zr y ) O3 (0 < y < 1), etc.

[0026] Also, various ceramic additives, organic solvents, binders, dispersants, etc. can be added to the raw materials for forming the dielectric layer 111 according to the purpose of the present invention to particles such as barium titanate (BaTiO3).

[0027] The thickness of the dielectric layer 111 does not need to be particularly limited.

[0028] To ensure the reliability of the multilayer electronic component 100 under high voltage environments, the thickness of the dielectric layer 111 can be 10.0 μm or less. Also, to achieve miniaturization and high capacitance of the multilayer electronic component 100, the thickness of the dielectric layer 111 can be 3.0 μm or less, and to more easily achieve ultra-miniaturization and high capacitance, the thickness of the dielectric layer 111 can be 1.0 μm or less, preferably 0.6 μm or less, and more preferably 0.4 μm or less.

[0029] Here, the thickness of the dielectric layer 111 can mean the thickness of the dielectric layer 111 disposed between the first and second internal electrodes 121 and 122.

[0030] On the other hand, the thickness of the dielectric layer 111 can mean the size of the dielectric layer 111 in the first direction. Also, the thickness of the dielectric layer 111 can mean the average thickness of the dielectric layer 111 and can mean the average size of the dielectric layer 111 in the first direction.

[0031] The average size of the dielectric layer 111 in the first direction can be measured by scanning an image of the cross-sections of the main body 110 in the first and second directions with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, the average size of the dielectric layer 111 in the first direction can mean the average value calculated by measuring the size in the first direction at 10 equally spaced points in the second direction for one dielectric layer 111 in the scanned image. The 10 equally spaced points can be specified by the capacitance forming portion Ac. Also, when such average value measurement is extended to 10 dielectric layers 111 to measure the average value, the average size of the dielectric layer 111 in the first direction can be further generalized.

[0032] The internal electrodes 121 and 122 can be alternately laminated with the dielectric layer 111.

[0033] The internal electrodes 121 and 122 can include a first internal electrode 121 and a second internal electrode 122. The first and second internal electrodes 121 and 122 are alternately arranged facing each other with the dielectric layer 111 constituting the main body 110 therebetween, and can be respectively exposed on the third and fourth surfaces 3 and 4 of the main body 110.

[0034] More specifically, the first internal electrode 121 can be separated from the fourth surface 4 and exposed through the third surface 3, and the second internal electrode 122 can be separated from the third surface 3 and exposed through the fourth surface 4. A first external electrode 131 can be arranged on the third surface 3 of the main body 110 and connected to the first internal electrode 121, and a second external electrode 132 can be arranged on the fourth surface 4 of the main body 110 and connected to the second internal electrode 122.

[0035] That is, the first internal electrode 121 can be connected to the first external electrode 131 and not connected to the second external electrode 132, and the second internal electrode 122 can be connected to the second external electrode 132 and not connected to the first external electrode 131. At this time, the first and second internal electrodes 121 and 122 can be electrically separated from each other by the dielectric layer 111 arranged in the middle.

[0036] On the one hand, the main body 110 can be formed by alternately laminating a first ceramic green sheet printed with a first internal electrode 121 and a second ceramic green sheet printed with a second internal electrode 122, and then firing them.

[0037] The materials for forming the internal electrodes 121 and 122 are not particularly limited, and materials with excellent electrical conductivity can be used. For example, the internal electrodes 121 and 122 can include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0038] Also, the internal electrodes 121 and 122 can be formed by printing a conductive paste for internal electrodes containing one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof on the ceramic green sheet. As the printing method of the conductive paste for internal electrodes, a screen printing method, a gravure printing method, etc. can be used, but the present invention is not limited thereto.

[0039] On the one hand, the thickness of the internal electrodes 121 and 122 does not need to be particularly limited.

[0040] In order to ensure the reliability of the laminated electronic component 100 in a high-voltage environment, the thickness of the internal electrodes 121 and 122 can be 3.0 μm or less. Also, in order to achieve miniaturization and high capacitance of the laminated electronic component 100, the thickness of the internal electrodes 121 and 122 can be 1.0 μm or less, and in order to more easily achieve ultra-miniaturization and high capacitance, the thickness of the internal electrodes 121 and 122 can be 0.6 μm or less, and more preferably 0.4 μm or less.

[0041] Here, the thicknesses of the internal electrodes 121 and 122 can mean the sizes of the internal electrodes 121 and 122 in the first direction. Note that the thicknesses of the internal electrodes 121 and 122 can mean the average thicknesses of the internal electrodes 121 and 122, and can mean the average sizes of the internal electrodes 121 and 122 in the first direction.

[0042] The average sizes of the internal electrodes 121 and 122 in the first direction can be measured by scanning an image of the cross-sections of the main body 110 in the first and second directions with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, the average size of one internal electrode in the first direction can be the average value calculated by measuring the sizes in the first direction at 10 equally spaced points in the second direction for one internal electrode in the scanned image. The 10 equally spaced points can be specified in the capacitance forming portion Ac. Also, when such average value measurement is extended to 10 internal electrodes to measure the average value, the average size of the internal electrodes in the first direction can be further generalized.

[0043] On the other hand, in one embodiment of the present invention, when the average thickness of at least one of the plurality of dielectric layers 111 is td and the average thickness of at least one of the plurality of internal electrodes 121 and 122 is te, td and te can satisfy 2×te < td.

[0044] In other words, the average thickness of one dielectric layer 111 can be more than twice the average thickness of one internal electrode 121 or 122. Preferably, the average thickness of the plurality of dielectric layers 111 can be greater than twice the average thickness of the plurality of internal electrodes 121 and 122.

[0045] Generally, for electronic components for high-voltage electrical equipment, the main issue is the reliability problem due to the decrease in the breakdown voltage (BDV) in a high-voltage environment.

[0046] Therefore, in order to prevent a decrease in the breakdown voltage in a high-voltage environment, by making the average thickness of the dielectric layer 111 even greater than twice the average thickness of the internal electrodes 121 and 122, the thickness of the dielectric layer, which is the distance between the internal electrodes, can be increased, and the characteristics of the breakdown voltage can be improved.

[0047] When the average thickness of the dielectric layer 111 is less than or equal to twice the average thickness of the internal electrodes 121 and 122, the average thickness of the dielectric layer, which is the distance between the internal electrodes, becomes thin, and the breakdown voltage may decrease, and there is a possibility of a short circuit occurring between the internal electrodes.

[0048] On the other hand, the main body 110 can include cover portions 112 and 113 disposed on both end-surfaces in the first direction of the capacitance forming portion Ac.

[0049] Specifically, it can include a first cover portion 112 disposed on one surface in the first direction of the capacitance forming portion Ac and a second cover portion 113 disposed on the other surface in the first direction of the capacitance forming portion Ac. More specifically, it can include an upper cover portion 112 disposed on the upper portion in the first direction of the capacitance forming portion Ac and a lower cover portion 113 disposed on the lower portion in the first direction of the capacitance forming portion Ac.

[0050] The upper cover portion 112 and the lower cover portion 113 can be formed by laminating a single dielectric layer 111 or two or more dielectric layers 111 in the first direction on the upper and lower surfaces of the capacitance forming portion Ac, and can basically play a role in preventing damage to the internal electrodes 121 and 122 due to physical or chemical stress.

[0051] The upper cover portion 112 and the lower cover portion 113 do not include the internal electrodes 121 and 122 and can include the same material as the dielectric layer 111. That is, the upper cover portion 112 and the lower cover portion 113 can include a ceramic material, for example, a barium titanate (BaTiO3)-based ceramic material.

[0052] On the other hand, the thickness of the cover portions 112 and 113 does not need to be particularly limited.

[0053] However, in order to more easily achieve miniaturization and high capacitance of the stacked electronic component, the thicknesses of the cover portions 112 and 113 can be 100 μm or less, preferably 30 μm or less, and more preferably 20 μm or less in the case of a super-small product.

[0054] Here, the thicknesses of the cover portions 112 and 113 can mean the sizes of the cover portions 112 and 113 in the first direction. Note that the thicknesses of the cover portions 112 and 113 can mean the average thicknesses of the cover portions 112 and 113, and can mean the average sizes of the cover portions 112 and 113 in the first direction.

[0055] The average size of the cover portions 112 and 113 in the first direction can be measured by scanning an image of the cross-sections of the main body 110 in the first and second directions with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, it can mean the average value calculated by measuring the sizes in the first direction at 10 equally spaced points in the second direction in an image of one scanned cover portion.

[0056] Note that the average size of the cover portion in the first direction measured by the above-described method can have substantially the same size as the average size of the cover portion in the first direction in the cross-sections of the main body 110 in the first and third directions.

[0057] On the other hand, the stacked electronic component 100 can include side margin portions disposed on both end-surfaces of the main body 110 in the third direction.

[0058] More specifically, the side margin portions can include a first side margin portion disposed on the fifth surface 5 of the main body 110 and a second side margin portion disposed on the sixth surface 6 of the main body 110.

[0059] As shown in the figure, the side margin portion can be defined as the region between the end - surfaces of the first and second internal electrodes 121 and 122 in the third direction and the boundary surface of the main body 110, based on the cross - section of the main body 110 in the first and third directions.

[0060] The side margin portion is formed by applying a conductive paste to form the internal electrodes 121 and 122, except for the area where the side margin portion is formed on the ceramic green sheet applied to the capacitance - forming portion Ac. After cutting so that the internal electrodes 121 and 122 after lamination are exposed on the fifth and sixth surfaces 5 and 6 of the main body 110 to suppress the step formed by the internal electrodes 121 and 122, a single dielectric layer 111 or two or more dielectric layers 111 can be laminated in the third direction on the end - surfaces of the capacitance - forming portion Ac in the third direction.

[0061] The side margin portion can basically play a role in preventing damage to the internal electrodes 121 and 122 due to physical or chemical stress.

[0062] The first side margin portion and the second side margin portion do not include the internal electrodes 121 and 122 and can contain the same material as the dielectric layer 111. That is, the first side margin portion and the second side margin portion can contain a ceramic material, for example, a barium titanate (BaTiO3) - based ceramic material.

[0063] On the other hand, the widths of the first and second side margin portions do not need to be particularly limited.

[0064] However, in order to more easily achieve miniaturization and high - capacitance of the multilayer electronic component 100, the width of the side margin portion can be 100 μm or less, preferably 30 μm or less, and more preferably 20 μm or less in ultra - small products.

[0065] Here, the width of the side margin portion can mean the size of the side margin portion in the third direction. Also, the width of the side margin portion can mean the average width of the side margin portion, and can mean the average size of the side margin portion in the third direction.

[0066] The average size of the side margin portion in the third direction can be measured by scanning an image of the cross-section of the main body 110 in the first and third directions with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, in an image obtained by scanning one side margin portion, it can mean the average value calculated by measuring the size in the third direction at 10 equally spaced points in the first direction.

[0067] In one embodiment of the present invention, a structure in which the stacked electronic component 100 has two external electrodes 131 and 132 is described. However, the number, shape, etc. of the external electrodes 131 and 132 can vary according to the form of the internal electrodes 121 and 122 and other purposes.

[0068] The external electrodes 131 and 132 are disposed on the main body 110 and can be connected to the internal electrodes 121 and 122.

[0069] More specifically, the external electrodes 131 and 132 can be respectively disposed on the third and fourth surfaces 3 and 4 of the main body 110 and include first and second external electrodes 131 and 132 respectively connected to the first and second internal electrodes 121 and 122. That is, the first external electrode 131 is disposed on the third surface 3 of the main body and can be connected to the first internal electrode 121, and the second external electrode 132 is disposed on the fourth surface 4 of the main body and can be connected to the second internal electrode 122.

[0070] Furthermore, the external electrodes 131 and 132 can be arranged to extend over a part of the first and second surfaces 1 and 2 of the main body 110, or can be arranged to extend over a part of the fifth and sixth surfaces 5 and 6 of the main body 110. That is, the first external electrode 131 can be arranged on a part of the first, second, fifth, and sixth surfaces 1, 2, 5, 6 of the main body 110 and on the third surface 3 of the main body 110, and the second external electrode 132 can be arranged on a part of the first, second, fifth, and sixth surfaces 1, 2, 5, 6 of the main body 110 and on the fourth surface 4 of the main body 110.

[0071] Also, a part of the external electrodes 131 and 132 can be arranged within the lead-in portions 141, 142, 143, 144.

[0072] More specifically, the external electrodes 131 and 132 can correspond to a structure that fills at least a part of the lead-in portions 141, 142, 143, 144. However, it is not particularly limited thereto. In the structure where the glass 250 fills the lead-in portions 241 and 242 as described later, instead of a structure where the external electrodes 231 and 232 are drawn into the inside of the lead-in portions 241 and 242, it can have a structure arranged on the glass 250.

[0073] On the other hand, the external electrodes 131 and 132 can be formed using any material as long as it has electrical conductivity such as metal, and a specific material can be determined in consideration of electrical characteristics, structural stability, etc., and it can further have a multilayer structure.

[0074] For example, the external electrodes 131 and 132 can include an electrode layer arranged on the main body 110 and a plating layer arranged on the electrode layer.

[0075] To give a more specific example of the electrode layer, the electrode layer can include the first electrode layers 131a and 132a which are fired electrodes containing a first conductive metal and glass, or can include the second electrode layers 131b and 132b which are resin-based electrodes containing a second conductive metal and resin.

[0076] Here, the conductive metal contained in the first electrode layers 131a and 132a can be defined as the first conductive metal, and the conductive metal contained in the second electrode layers 131b and 132b can be defined as the second conductive metal. At this time, the first conductive metal and the second conductive metal can be the same as or different from each other. When a plurality of conductive metals are included, only a part of them can contain the same conductive metal, but it is not particularly limited thereto.

[0077] Further, the electrode layers 131a, 132a, 131b, and 132b can be in a form in which a fired electrode and a resin-based electrode are sequentially formed on the main body 110.

[0078] Further, the electrode layers 131a, 132a, 131b, and 132b can be formed by a method of transferring a sheet containing a conductive metal onto the main body, or can be formed by a method of transferring a sheet containing a conductive metal onto a fired electrode.

[0079] A material excellent in electrical conductivity can be used as the conductive metal contained in the electrode layers 131a, 132a, 131b, and 132b. For example, the conductive metal can include one or more selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof, but is not particularly limited thereto.

[0080] In one embodiment of the present invention, the electrode layers 131a, 132a, 131b, and 132b can have a two-layer structure including the first electrode layers 131a and 132a and the second electrode layers 131b and 132b. Accordingly, the external electrodes 131 and 132 can include the first electrode layers 131a and 132a containing the first conductive metal and glass, and the second electrode layers 131b and 132b disposed on the first electrode layers 131a and 132a and containing the second conductive metal and resin.

[0081] The first electrode layers 131a and 132a play a role in improving the bonding property with the main body 110 by including glass, and the second electrode layers 131b and 132b can play a role in improving the bending strength by including resin.

[0082] Here, the glass contained in the first electrode layers 131a and 132a can be a different type of glass from the glass 150 disposed in the lead-in portions 141, 142, 143, and 144, but is not particularly limited thereto, and the glass contained in the first electrode layers 131a and 132a and the glass 150 disposed in the lead-in portions 141, 142, 143, and 144 can be the same glass.

[0083] The first conductive metal contained in the first electrode layers 131a and 132a is not particularly limited as long as it is a material that can be electrically connected to the internal electrodes 121 and 122 for capacitance formation. For example, it can include one or more selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0084] The first electrode layers 131a and 132a can be formed by applying a conductive paste provided by adding glass frit to the first conductive metal particles and then firing.

[0085] The second conductive metal contained in the second electrode layers 131b and 132b can play a role in being electrically connected to the first electrode layers 131a and 132a.

[0086] The conductive metal contained in the second electrode layers 131b and 132b is not particularly limited as long as it is a material that can be electrically connected to the electrode layers 131a and 132a, and can include one or more selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0087] The second conductive metal included in the second electrode layers 131b and 132b can include one or more of spherical particles and flake-like particles. That is, the second conductive metal can consist only of flake-like particles, can consist only of spherical particles, or can be in a form in which flake-like particles and spherical particles are mixed. Here, the spherical particles can include forms that are not perfectly spherical, for example, forms in which the length ratio of the major axis to the minor axis (major axis / minor axis) is 1.45 or less. The flake-like particles mean particles having a flat and elongated form, and are not particularly limited, but for example, the length ratio of the major axis to the minor axis (major axis / minor axis) can be 1.95 or more. The lengths of the major axis and the minor axis of the above spherical particles and flake-like particles can be measured from an image obtained by scanning cross-sections in the first and second directions cut at the central portion in the third direction of the multilayer electronic component with a scanning electron microscope (SEM).

[0088] The resin included in the second electrode layers 131b and 132b can play a role in ensuring bonding properties and absorbing shocks. The resin included in the second electrode layers 131b and 132b has bonding properties and shock absorbency, and is not particularly limited as long as it can be mixed with the second conductive metal particles to form a paste, and can include, for example, an epoxy resin.

[0089] Also, the second electrode layers 131b and 132b can include a plurality of second conductive metal particles, an intermetallic compound, and a resin. By including the intermetallic compound, the electrical connectivity with the first electrode layers 131a and 132a can be further improved. The intermetallic compound plays a role in connecting a plurality of metal particles to improve electrical connectivity, and can play a role in surrounding and connecting the plurality of metal particles to each other.

[0090] At this time, the intermetallic compound can contain a metal having a melting point lower than the curing temperature of the resin. That is, since the intermetallic compound contains a metal having a melting point lower than the curing temperature of the resin, the metal having a melting point lower than the curing temperature of the resin melts during the drying and curing processes, and forms a part of the metal particles and the intermetallic compound to surround the metal particles. At this time, the intermetallic compound can preferably contain a low melting point metal of 300 °C or lower.

[0091] For example, it can contain Sn having a melting point of 213 to 220 °C. Sn melts during the drying and curing processes, and the melted Sn wets the high melting point metal particles such as Ag, Ni, or Cu by capillary action and reacts with a part of the Ag, Ni, or Cu metal particles to form intermetallic compounds such as Ag3Sn, Ni3Sn4, Cu6Sn5, and Cu3Sn. Ag, Ni, or Cu not involved in the reaction remains in the form of metal particles.

[0092] Therefore, the plurality of second conductive metal particles can contain one or more of Ag, Ni, and Cu, and the intermetallic compound can contain one or more of Ag3Sn, Ni3Sn4, Cu6Sn5, and Cu3Sn.

[0093] The plating layers 131c and 132c can play a role in improving the mounting characteristics.

[0094] The types of the plating layers 131c and 132c are not particularly limited, and can be single-layer plating layers 131c and 132c containing one or more of nickel (Ni), tin (Sn), silver (Ag), palladium (Pd), and alloys thereof, and can be formed of a plurality of layers.

[0095] As a more specific example of the plating layers 131c and 132c, the plating layers 131c and 132c may be Ni plating layers or Sn plating layers, and may be formed in a form in which a Ni plating layer and a Sn plating layer are sequentially formed on an electrode layer, or in a form in which a Sn plating layer, a Ni plating layer and a Sn plating layer are sequentially formed. The plating layers 131c and 132c may also include a plurality of Ni plating layers and / or a plurality of Sn plating layers.

[0096] The size of the multilayer electronic component 100 does not need to be particularly limited.

[0097] However, in order to simultaneously achieve miniaturization and high capacity, the thickness of the dielectric layers and internal electrodes must be reduced and the number of layers must be increased, so the effects of the present invention may be more pronounced in multilayer electronic components 100 that are 3216 (length x width: 3.2 mm x 1.6 mm), 2012 (length x width: 2.0 mm x 1.2 mm), 1005 (length x width: 1.0 mm x 0.5 mm), or 0603 (length x width: 0.6 mm x 0.3 mm) or smaller in size.

[0098] The multilayer electronic component 100 according to one embodiment of the present invention will now be described in more detail.

[0099] In one embodiment of the present invention, the multilayer electronic component 100 is retracted inward from the surface of the main body 110, and when the areas including the glass 150 are defined as retracted portions 141, 142, 143, and 144, the retracted portions 141, 142, 143, and 144 can be disposed between the capacitance forming portion Ac and the cover portions 112 and 113.

[0100] Between the cover parts 112 and 113 of the capacitance forming part Ac, more specifically, the interface between the cover parts 112 and 113 of the capacitance forming part Ac is vulnerable to moisture penetration from the outside. However, the drawing-in parts 141, 142, 143, and 144 are arranged between the cover parts 112 and 113 of the capacitance forming part Ac. By including the glass 150 in the drawing-in parts 141, 142, 143, and 144, the path of moisture penetration from the outside can be blocked, and the moisture resistance reliability of the laminated electronic component 100 can be improved.

[0101] The drawing-in parts 141, 142, 143, and 144 can mean the regions drawn from the surface of the main body 110 toward the inside of the main body 110 in the main body 110, and can be a part of the shape of the main body 110.

[0102] Referring to FIG. 3 for explanation, the main body 110 includes the regions drawn from the surface of the main body 110 toward the inside at the interface between the capacitance forming part Ac and the cover parts 112 and 113, and the corresponding regions can be the drawing-in parts 141, 142, 143, and 144.

[0103] More specifically, the drawing-in parts 141, 142, 143, and 144 can include the first and second drawing-in parts 141 and 142 arranged between the capacitance forming part Ac and the first cover part 112, and the third and fourth drawing-in parts 143 and 144 arranged between the capacitance forming part Ac and the second cover part 113. The first and third drawing-in parts 141 and 143 can be arranged at positions adjacent to the third surface 3, and the second and fourth drawing-in parts 142 and 144 can be arranged at positions adjacent to the fourth surface 4.

[0104] In FIG. 3, the lead-in portions 141, 142, 143, 144 are formed in all of the four regions which are the interfaces between the capacitance forming portion Ac and the cover portions 112, 113. However, the present invention is not particularly limited thereto, and the moisture resistance reliability of the multilayer electronic component 100 can be improved even if the lead-in portions are formed in only at least one of the four regions. For example, in FIG. 5 schematically showing a multilayer electronic component 200 according to another embodiment of the present invention, it can be confirmed that the lead-in portions 241, 242 are formed in two regions between the capacitance forming portion Ac and the first cover portion 212.

[0105] The lead-in portions 141, 142, 143, 144 can be disposed only between the capacitance forming portion Ac and the cover portions 112, 113.

[0106] That is, the lead-in portions 141, 142, 143, 144 can be formed such that no lead-in portion is formed on the surface of the main body 110 between the extension surfaces of the end-surfaces of the capacitance forming portion Ac. For example, between the internal electrodes 121, 122 disposed in the outermost layer in the first direction in both directions among the internal electrodes 121, 122, no lead-in portion can be formed. This is to suppress the formation of lead-in portions unnecessary for improving the moisture resistance reliability, suppress the generation of cracks that may occur due to an external impact, and protect the capacitance forming portion Ac.

[0107] At least a part of the glass 150 included in the lead-in portions 141, 142, 143, 144 can be arranged to be in contact with one or more of the cover portions 112, 113 and the capacitance forming portion Ac.

[0108] Of the lead-in portions 141, 142, 143, 144 drawn into the main body 110, at least a part of the cover portions 112, 113 corresponding to a part of the surface of the main body 110 and at least a part of the capacitance forming portion Ac can be arranged such that the glass 150 is in contact therewith.

[0109] At this time, the thickness of the glass 150 arranged to be in contact with one or more of the cover portions 112, 113 and the capacitance forming portion Ac can be 0.1 μm or more.

[0110] When the thickness of the glass 150 is 0.1 μm or more, moisture penetration from the outside can be effectively suppressed, and the moisture resistance reliability of the laminated electronic component 100 can be improved. The upper limit of the thickness is not particularly limited, and as described later, the glass can fill the recessed portions.

[0111] In the laminated electronic component 200 according to an embodiment of the present invention, the recessed portions 241 and 242 can also be filled with the glass 250.

[0112] By the glass 250 filling the recessed portions 241 and 242, moisture penetration from the outside can be more effectively suppressed, and the moisture resistance reliability of the laminated electronic component 200 can be further improved. As described above, in the drawing, only the first and second recessed portions 241 and 242 are formed between the capacitance forming portion Ac and the first cover portion 212, and it is shown that the glass 250 fills the first and second recessed portions 241 and 242. However, it is not particularly limited thereto. It is obvious to an ordinary technician that the recessed portion can be formed between the capacitance forming portion Ac and the second cover portion 213 and can be filled with the glass.

[0113] On the other hand, the glass 150 can be further disposed in a layer on the surface of the main body 110.

[0114] At this time, the layered glass 150 is disposed along the surface of the main body 110 and can be disposed between the extension lines EL1 and EL2 of both end - surfaces in the lamination direction.

[0115] Here, the meaning that the layered glass 150 is arranged along the surface of the main body 110 can mean that, including the drawing-in parts 141, 142, 143, 144, on a configuration of the main body 110 such as the cover parts 112, 113, and the dielectric layer 111, the glass 150 with a certain thickness is arranged on the main body 110 from the main body 110. At this time, when the layered glass 150 has a certain thickness, the thickness of the layered glass 150 can be 0.1 μm or more, where the thickness can mean the average thickness.

[0116] More specifically, the layered glass 150 can be arranged between the extension lines EL1, EL2 of the first and second surfaces and cannot be arranged on the first and second surfaces 1, 2 with reference to the first direction. That is, the layered glass 150 is not arranged below the extension line EL1 of the first surface and can be arranged above the extension line EL1 of the first surface, and is not arranged above the extension line EL2 of the second surface and can be arranged below the extension line EL2 of the second surface.

[0117] At this time, the layered glass 150 can be arranged within a 50% region facing each other from the extension lines EL1, EL2 of both end-surfaces in the stacking direction of the main body 110.

[0118] Referring to FIG. 4 and giving a more specific example for explanation, the layered glass 150 formed adjacent to the second surface 2 extends from the extension line EL2 of the second surface along the surface of the main body 110 of the region of the second recess 142 formed adjacent to the edge of the first cover portion 112 and the fourth surface 4 between the capacitance forming portion Ac and the first cover portion 112, and is arranged up to the region GET2 where the second internal electrode 122 arranged in the outermost layer (uppermost layer) in the upper part in the first direction is in contact. At this time, when the size in the first direction of the layered glass 150 arranged from the extension line EL2 of the second surface up to the region GET2 where the second internal electrode 122 arranged in the outermost layer (uppermost layer) in the upper part in the first direction is in contact is t2, it can be meant that t2 is 50% or less of the size in the first direction of the extension lines EL1 and EL2 of the first and second surfaces. Here, the size in the first direction of the extension lines EL1 and EL2 of the first and second surfaces can mean the size in the first direction between the first and second surfaces 1 and 2, and can also mean the size in the first direction of the main body 110.

[0119] Similarly, the layered glass 150 formed adjacent to the first surface 1 extends from the extension line EL1 of the first surface along the surface of the main body 110 of the region of the fourth recess 144 formed adjacent to the edge of the second cover portion 113 and the fourth surface 4 between the capacitance forming portion Ac and the second cover portion 113, and is arranged up to the upper part GET4 of the second internal electrode 122 arranged in the outermost layer (lowermost layer) in the lower part in the first direction. At this time, when the size in the first direction of the layered glass 150 arranged from the extension line EL1 of the first surface up to the upper part GET4 of the second internal electrode 122 arranged in the outermost layer (lowermost layer) in the lower part in the first direction is t4, it can be meant that t4 is 50% or less of the size in the first direction of the extension lines EL1 and EL2 of the first and second surfaces.

[0120] In this description, only the glass 150 arranged in the adjacent regions of the second and fourth recesses 142 and 144 has been described, but it is obvious to an ordinary technician that the same description can be applied to the glass 150 arranged in the adjacent regions of the first and third recesses 141 and 143.

[0121] Here, when t2 and t4 are respectively 50% of the magnitudes in the first direction of the extension lines EL1 and EL2 of the first and second surfaces, it can mean the case where the layered glass 150 is formed by one layered glass 150 between the first and second surfaces 1 and 2.

[0122] On the other hand, in the present invention, the layered glass 150 can indicate a single layer state, but is not particularly limited thereto, and is not limited to a structure without a region cut by a fine structure. When the layered glass 150 is disposed along the surface of the main body 110 from the extension lines EL1 and EL2 of the first and second surfaces to a region where the layered glass 150 is formed and exceeds 50% of the surface of the main body 110, it can be said that the layered glass 150 is sufficiently formed.

[0123] On the other hand, the layered glass 150 cannot be disposed on the regions of the third and fourth surfaces 3 and 4 where the internal electrodes 121 and 122 are exposed. More specifically, the layered glass 150 can be disposed on the surface of a dielectric material such as the cover portions 112 and 113 or the dielectric layer 111.

[0124] This can be because, due to the characteristics of the glass material, it has excellent wettability with the dielectric material and is more excellent in bonding property with the surface of the dielectric material than the surface of the internal electrodes 121 and 122 which are metal materials. However, it is not particularly limited thereto, and it can also be disposed on a part of the surfaces of the internal electrodes 121 and 122, but it is preferably not disposed so as to cover the entire surfaces of the internal electrodes 121 and 122 for the connection with the external electrodes 131 and 132.

[0125] The glass 150 included in the lead-in portions 141, 142, 143, 144 or the layered glass 150 disposed on the surface of the main body 110 can be the same glass.

[0126] On the one hand, in the present invention, before applying the external electrodes 131 and 132, a separate glass paste is preferably applied to the surface of the main body 110, focusing on the recessed portions 141, 142, 143, and 144 between the capacitance forming portion Ac and the cover portions 112 and 113, and the external electrode paste is applied thereon to form the external electrodes 131 and 132 on the glass 150. However, it is not particularly limited thereto, and the glass contained in the first electrode layers 131a and 132a can be adsorbed on the surface of the main body 110 to form the glass 150.

[0127] On the other hand, the first electrode layers 131a and 132a can be arranged such that the glass 150 is formed by applying a separate glass paste, or the glass 150 is formed without applying a separate glass paste, or the glass 150 is disposed on the surface of the main body 110 and the first electrode layers 131a and 132a are disposed on the glass 150.

[0128] On the one hand, in the laminated electronic component 100 according to an embodiment of the present invention, one end portions of the internal electrodes 121 and 122 are connected to one surfaces 3 and 4 in the length direction of the main body 110, and the other end portions IEL1 and IEL2 of the internal electrodes 121 and 122 are disposed apart from the other surfaces 4 and 3 in the length direction of the main body 110. When the length from the other end portions IEL1 and IEL2 of the internal electrodes 121 and 122 to the other surfaces 4 and 3 in the length direction of the main body 110 is defined as the lengthwise margin portion, and the average length of the lengthwise margin portion is LM and the maximum length of the recessed portions 141, 142, 143, and 144 is GL, 10% ≦ GL / LM ≦ 100% can be satisfied.

[0129] By satisfying 10% ≦ GL / LM ≦ 100%, it becomes difficult for moisture to penetrate from the outside, and the moisture resistance reliability of the laminated electronic component 100 can be improved.

[0130] More specifically, one end of the first internal electrode 121 is connected to the third surface 3, the other end IEL1 of the first internal electrode 121 is disposed at a distance from the fourth surface 4, and when the length from the other end IEL1 of the first internal electrode 121 to the fourth surface 4 is defined as the first margin portion in the length direction, the average length of the first margin portion in the length direction can be designated as LM2. When the maximum length of the second drawing portion 142 is GL2 and the maximum length of the fourth drawing portion 144 is GL4, 10% ≦ GL2 / LM2 ≦ 100% can be satisfied, and 10% ≦ GL4 / LM2 ≦ 100% can be satisfied. Similarly, one end of the second internal electrode 122 is connected to the fourth surface 4, the other end IEL2 of the second internal electrode 122 is disposed at a distance from the third surface 3, and when the length from the other end IEL2 of the second internal electrode 122 to the third surface 3 is defined as the second margin portion in the length direction, the average length of the second margin portion in the length direction can be designated as LM1. When the maximum length of the first drawing portion 141 is GL1 and the maximum length of the third drawing portion 143 is GL3, 10% ≦ GL1 / LM1 ≦ 100% can be satisfied, and 10% ≦ GL3 / LM1 ≦ 100% can be satisfied.

[0131] Here, the average length of the first margin portion in the length direction can mean a value obtained by measuring and averaging the lengths from the end IEL1 of the plurality of first internal electrodes 121 to the adjacent fourth surface 4, and the average length of the second margin portion in the length direction can be obtained in the same manner.

[0132] On the other hand, in the multilayer electronic component 100 according to an embodiment of the present invention, when the average thickness of the main body 110 is T and the maximum thicknesses of the drawing portions 141, 142, 143, 144 are GT, 10% ≦ GT / T ≦ 30% can be satisfied.

[0133] Here, the maximum thicknesses of the drawing portions 141, 142, 143, 144 can mean that the thickness is the maximum among the shapes of the drawing portions 141, 142, 143, 144, and the point where the drawing starts in the inner direction of the main body 110, for example, the thickness at the entrances of the drawing portions 141, 142, 143, 144 can correspond to the maximum thicknesses of the drawing portions 141, 142, 143, 144, but it is not particularly limited thereto.

[0134] More specifically, when the maximum thickness of the first recessed portion 141 is GT1, 10% ≦ GT1 / T ≦ 30% can be satisfied; when the maximum thickness of the second recessed portion 142 is GT2, 10% ≦ GT2 / T ≦ 30% can be satisfied; when the maximum thickness of the third recessed portion 143 is GT3, 10% ≦ GT3 / T ≦ 30% can be satisfied; when the maximum thickness of the fourth recessed portion 144 is GT4, 10% ≦ GT4 / T ≦ 30% can be satisfied.

[0135] By satisfying 10% ≦ GT / T ≦ 30%, moisture penetration from the outside can be effectively prevented, and the moisture resistance reliability of the stacked electronic component 100 can be improved.

[0136] When GT / T < 10%, the glass 150 cannot be sufficiently arranged in the recessed portions 141, 142, 143, 144, and there is a possibility that the target moisture resistance reliability cannot be achieved. When 30% < GT / T, the sizes of the recessed portions 141, 142, 143, 144 are too large and sufficient glass 150 cannot be arranged, and there is a possibility that the target moisture resistance reliability cannot be achieved. Also, generation of cracks inside the main body 110 due to external impact is easy, and there is a possibility that the mechanical properties deteriorate.

[0137] As described above in detail for the embodiments of the present invention, the present invention is not limited by the above-described embodiments and the attached drawings, but is limited by the attached claims. Therefore, within the scope not departing from the technical idea of the present invention described in the claims, various forms of substitution, modification, and change are possible by those having ordinary knowledge in the technical field, and it can be said that these also belong to the scope of the present invention.

[0138] In addition, the expression "one embodiment" used in the present disclosure does not mean the same embodiment as each other, but is provided to emphasize and explain each different unique feature. However, the above-presented one embodiment does not exclude being implemented in combination with the features of other one embodiments. For example, even if the matter described in a specific one embodiment is not described in other one embodiments, it can be understood as an explanation related to other one embodiments as long as there is no explanation contrary to or conflicting with that matter in other one embodiments.

[0139] The terms used in the present disclosure are merely used to explain one embodiment and are not intended to limit the present disclosure. At this time, the singular expression includes the plural expression unless it clearly means something different in the context.

Description of Reference Numerals

[0140] 100 Multilayer electronic component 110 Body 111 Dielectric layer 112, 113 Cover part 121, 122 Internal electrode 131, 132 External electrode 141, 142, 143, 144 Pull-in part 150 Glass

Claims

1. A main body including a dielectric layer, a capacitance forming portion including internal electrodes laminated alternately with the dielectric layer, and cover portions disposed on both end faces of the capacitance forming portion in the lamination direction; an external electrode disposed on the main body, wherein when a region including glass drawn inward from the surface of the main body is defined as a drawing portion, the drawing portion is disposed between the capacitance forming portion and the cover portion, the multilayer electronic component.

2. The multilayer electronic component according to claim 1, wherein the drawing portion is disposed only between the capacitance forming portion and the cover portion.

3. The multilayer electronic component according to claim 1, wherein at least a part of the glass included in the drawing portion is disposed so as to be in contact with one or more of the cover portion and the capacitance forming portion.

4. The multilayer electronic component according to claim 3, wherein an average thickness of the glass disposed so as to be in contact with one or more of the cover portion and the capacitance forming portion is 0.1 μm or more.

5. The multilayer electronic component according to claim 1, wherein the drawing portion is filled with glass.

6. The glass is further disposed in a layer on the surface of the main body, and the layered glass is disposed between extension lines of both end faces of the main body in the lamination direction, the multilayer electronic component according to claim 1.

7. The multilayer electronic component according to claim 6, wherein the layered glass is disposed within a region of 50% from the extension lines of both end faces of the main body in the lamination direction toward each other.

8. The multilayer electronic component according to claim 6, wherein the layered glass is disposed on the surface of the dielectric layer.

9. One end portion of the internal electrode is connected to one surface in the length direction of the main body, the other end portion of the internal electrode is disposed apart from the other surface in the length direction of the main body, and a length from the other end portion of the internal electrode to the other surface in the length direction of the main body is defined as a margin portion in the length direction. When an average length of the margin portion in the length direction is LM and a maximum length of the drawing portion is GL, the multilayer electronic component according to claim 1, satisfying 10% ≤ GL / LM ≤ 100%.

10. When an average thickness of the main body is T and a maximum thickness of the drawing portion is GT, the multilayer electronic component according to claim 1, satisfying 10% ≤ GT / T ≤ 30%.

11. The multilayer electronic component according to claim 1, wherein a part of the external electrode is disposed in the drawing portion.

12. The length of the multilayer electronic component is 0.6 mm or less, and the width is 0.3 mm or less. The multilayer electronic component according to claim 1.

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