Multilayer electronic component

Abstract

To alleviate a step occurring according to the stacking degree of internal electrodes in a capacitance formation portion and a margin portion and suppress the deterioration of moisture resistance reliability.SOLUTION: In a multilayer electronic component 100, first and second internal electrodes 121 and 122 are disposed alternately with a dielectric layer 111 therebetween in a first direction. When, in a body 110, a region where the first and second internal electrodes overlap in the first direction is a capacitance formation portion Ac, reinforcing patterns 123 and 124 are disposed respectively on one surface and the other surface of the capacitance formation portion in the first direction, are in contact with a surface of the body in a second direction, and are disposed to be spaced apart from each other in the second direction, and when each reinforcing pattern is divided into four equal portions in a third direction along from one end of the reinforcing pattern in the third direction to the other end thereof in the third direction, a length of each reinforcing pattern at a 1 / 4 point in the second direction is greater than a length of the reinforcing pattern at a 1 / 2 point in the second direction, and a length of each reinforcing pattern at a 3 / 4 point in the second direction is greater than the length of the reinforcing pattern at the 1 / 2 point in the second direction.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a multilayer electronic component.

Background Art

[0002] A multilayer ceramic capacitor (MLCC), which is one type of multilayer electronic component, is a chip-type capacitor that is mounted on printed circuit boards of various electronic products, such as video devices like liquid crystal display (LCD) devices and plasma display panel (PDP) panels, computers, smartphones, mobile phones, on-board chargers (OBCs) for electric vehicles, and circuits such as DC-DC converters, and plays a role in charging or discharging electricity.

[0003] Due to the advantages of being small in size while ensuring high capacitance and being easy to mount, multilayer ceramic capacitors can be used as components in various electronic devices. As various electronic devices such as computers and mobile devices are miniaturized and have higher power output, the requirements for miniaturization and higher capacitance of multilayer ceramic capacitors are increasing.

[0004] The external electrodes of a multilayer ceramic capacitor may be formed thinner at the corner portions compared to the central portion of the body surface. In this case, the thinner external electrodes can serve as a penetration path for moisture from the outside, so there is a possibility that the moisture resistance reliability of the multilayer ceramic capacitor may decrease.

[0005] In addition, the central portion of the body corresponds to the region where internal electrodes of different polarities overlap in the stacking direction, so steps may occur during the stacking and crimping processes. In particular, steps may occur in the margin portion that forms the side surface of the capacitance forming portion where the internal electrodes overlap. Also, since the central portion of the body is the region where the internal electrodes overlap, aggregation phenomena may occur when passing through a heat treatment process such as firing.

[0006] Therefore, there is a need for a structural improvement that can suppress a decrease in the moisture resistance reliability of the multilayer ceramic capacitor and mitigate the step difference.

SUMMARY OF THE INVENTION

PROBLEMS TO BE SOLVED BY THE INVENTION

[0007] One of several objects of the present invention is to suppress a decrease in the moisture resistance reliability of a multilayer electronic component that may occur due to the relatively thin formation of an external electrode at a corner portion of the main body.

[0008] One of several objects of the present invention is to mitigate a step difference that occurs according to the internal electrode lamination degree between the capacitance forming portion and the margin portion.

[0009] However, the problems to be solved by the present invention are not limited to the above-described content, and can be more easily understood in the process of describing specific embodiments of the present invention.

MEANS FOR SOLVING THE PROBLEMS

[0010] A multilayer electronic component according to an embodiment of the present invention includes a main body including a plurality of dielectric layers, a first internal electrode, a second internal electrode, and a reinforcing pattern, and an external electrode disposed on the main body. The first and second internal electrodes are alternately arranged in a first direction with the dielectric layers interposed therebetween. In the main body, when a region where the first and second internal electrodes overlap in the first direction is defined as a capacitance forming portion, the reinforcing pattern is disposed on one surface and the other surface of the capacitance forming portion in the first direction. When a direction perpendicular to the first direction is defined as a second direction and a direction perpendicular to the first and second directions is defined as a third direction, the reinforcing pattern is in contact with the surfaces of the main body facing each other in the second direction, is spaced apart from each other in the second direction, and when the reinforcing pattern is equally divided into four in the third direction from one end in the third direction to the other end in the third direction, the length of the reinforcing pattern in the second direction at the 1 / 4 point is greater than the length of the reinforcing pattern in the second direction at the 1 / 2 point, and the length of the reinforcing pattern in the second direction at the 3 / 4 point can be greater than the length of the reinforcing pattern in the second direction at the 1 / 2 point.

Effects of the Invention

[0011] One of the effects of the present invention is to improve the moisture resistance reliability of the multilayer electronic component by forming a reinforcing pattern on one surface and the other surface of the capacitance forming portion in the first direction and adjusting its shape.

[0012] One of the effects of the present invention is to mitigate the step of the multilayer electronic component and suppress the aggregation at the central portion of the internal electrode by causing the reinforcing pattern to be in contact with the surfaces of the main body facing each other in the second direction and spaced apart from each other in the second direction, and by making the length in the second direction gradually increase from the central portion in the third direction toward both ends in the third direction.

[0013] However, the various and beneficial advantages and effects of the present invention are not limited to the above-described content and can be more easily understood in the process of describing specific embodiments of the present invention.

Brief Description of the Drawings

[0014]

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Figure 10

MODE FOR CARRYING OUT THE INVENTION

[0015] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Also, the embodiments of the present invention are provided to more fully explain the present invention to an ordinary technician. Therefore, the shape and size of elements in the drawings can be exaggerated for a clearer explanation, and elements denoted by the same reference numerals in the drawings are the same elements.

[0016] In order to clearly describe the present invention in the drawings, parts not related to the description are omitted. The sizes and thicknesses of the respective components shown in the drawings are arbitrarily shown for convenience of explanation, and thus the present invention is not necessarily limited to what is shown in the drawings. For components having the same functions within the same scope of idea, the same reference numerals are used for explanation. Further, throughout the specification, when a certain part says that a certain component "includes", this means that, unless otherwise stated to the contrary, it does not exclude other components, but may further include other components.

[0017] In the drawings, the first direction can be defined as the stacking direction or the thickness T direction, the second direction as the length L direction, and the third direction as the width W direction.

[0018] FIG. 1 schematically shows a perspective view of a stacked electronic component according to an embodiment of the present invention. FIG. 2 is a cross-sectional view taken along the line I-I' of FIG. 1. FIG. 3 is a cross-sectional view taken along the line II-II' of FIG. 1. FIG. 4 is a cross-sectional view taken along the line III-III' of FIG. 1. FIG. 5 is a cross-sectional view taken along the line IV-IV' of FIG. 1. FIGS. 8(a) and 8(b) are plan views showing the structure of an internal electrode according to an example. FIG. 9 is a plan view showing the structure of a reinforcing pattern according to an example.

[0019] Hereinafter, with reference to FIGS. 1 to 5, FIGS. 8 and 9, a stacked electronic component 100 according to an embodiment of the present invention will be described in detail. Also, as an example of the stacked electronic component, a multilayer ceramic capacitor (hereinafter referred to as "MLCC") will be described, but the present invention is not limited thereto, and can also be applied to various stacked electronic components using a ceramic material, for example, an inductor, a piezoelectric element, a varistor, or a thermistor.

[0020] The multilayer electronic component 100 according to an embodiment of the present invention includes a main body including a plurality of dielectric layers 111, a first internal electrode 121, a second internal electrode 122, and a reinforcing pattern, and external electrodes disposed on the main body. The first and second internal electrodes are alternately arranged in a first direction with the dielectric layers interposed therebetween. In the main body, when a region where the first and second internal electrodes overlap in the first direction is a capacitance forming portion, the reinforcing pattern is disposed on one surface and the other surface of the capacitance forming portion in the first direction. When a direction perpendicular to the first direction is a second direction and a direction perpendicular to the first direction and the second direction is a third direction, the reinforcing pattern is in contact with the surfaces of the main body facing each other in the second direction, is spaced apart from each other in the second direction, and when the reinforcing pattern is equally divided into four in the third direction from one end in the third direction to the other end in the third direction of the reinforcing pattern, the length of the reinforcing pattern in the second direction at the 1 / 4 point is larger than the length of the reinforcing pattern in the second direction at the 1 / 2 point, and the length of the reinforcing pattern in the second direction at the 3 / 4 point can be larger than the length of the reinforcing pattern in the second direction at the 1 / 2 point.

[0021] Hereinafter, each configuration of the multilayer electronic component 100 will be described in detail.

[0022] The main body 110 can include a plurality of dielectric layers 111, a first internal electrode 121, a second internal electrode 122, and margin patterns 123 and 124.

[0023] There is no particular limitation on the specific shape of the main body 110, but as shown in the figure, the main body 110 can have a hexahedron shape or a shape similar thereto. Due to the shrinkage of the ceramic powder contained in the main body 110 during the firing process, the main body 110 does not have a hexahedron shape with perfect straight lines, but can have a substantially hexahedron shape.

[0024] The main body 110 can have a first surface 1 and a second surface 2 facing each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first and second surfaces 1 and 2 and facing each other in a second direction, and a fifth surface 5 and a sixth surface 6 connected to the third and fourth surfaces 3 and 4 and facing each other in a third direction.

[0025] By overlapping the margin regions where the internal electrodes 121 and 122 are not disposed on the dielectric layer 111, a step due to the thickness of the internal electrodes 121 and 122 is generated, and the corner connecting the first surface to the third to fifth surfaces and / or the corner connecting the second surface to the third to fifth surfaces can have a form shrunk toward the central side in the first direction of the main body 110 when viewed with reference to the first surface or the second surface. Alternatively, due to the shrinkage behavior during the sintering process of the main body, the corner connecting the first surface 1 to the third to sixth surfaces 3, 4, 5, 6 and / or the corner connecting the second surface 2 to the third to sixth surfaces 3, 4, 5, 6 can have a form shrunk toward the central side in the first direction of the main body 110 when viewed with reference to the first surface or the second surface. Alternatively, in order to prevent chipping defects or the like, by performing a separate process to round the corners connecting the respective surfaces of the main body 110, the corner connecting the first surface to the third to sixth surfaces and / or the corner connecting the second surface to the third to sixth surfaces can have a rounded form.

[0026] On the other hand, in order to suppress the step due to the internal electrodes 121 and 122, after cutting so that the internal electrodes after lamination are exposed on the fifth and sixth surfaces 5 and 6 of the main body, when a single dielectric layer or two or more dielectric layers are laminated in the third direction (width direction) on both side surfaces of the capacitance forming portion Ac to form the margin portions 114 and 115, the portions connecting the first surface to the fifth and sixth surfaces and the portions connecting the second surface to the fifth and sixth surfaces do not have to have a shrunk form.

[0027] The plurality of dielectric layers 111 forming the body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated so that they are difficult to confirm without using a scanning electron microscope (SEM). The number of stacked dielectric layers is not particularly limited and can be determined in consideration of the size of the multilayer electronic component. For example, the body can be formed by stacking 400 or more dielectric layers.

[0028] The dielectric layer 111 can be formed by manufacturing a ceramic slurry containing ceramic powder, an organic solvent, and a binder, applying and drying the slurry on a carrier film to provide a ceramic green sheet, and then firing the ceramic green sheet. The ceramic powder is not particularly limited as long as sufficient capacitance can be obtained. For example, barium titanate (BaTiO3)-based powder can be used as the ceramic powder. More specifically, the ceramic powder can be one or more of BaTiO3, (Ba 1-x Ca x )TiO3 (0 ≦ x ≦ 1), Ba(Ti 1-y Ca y )O3 (0 ≦ y ≦ 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 ≦ x ≦ 1, 0 ≦ y ≦ 1), and Ba(Ti 1-y Zr y )O3 (0 ≦ y ≦ 1).

[0029] According to the present invention, even when the thickness of the plurality of dielectric layers 111 is thin, a decrease in high-temperature load life can be prevented, and when the thickness of the dielectric layer is thick, the high-temperature load life can be further improved. Therefore, the average thickness td of the dielectric layer 111 is not particularly limited and can be arbitrarily set according to desired characteristics and applications. More specifically, the average thickness of the dielectric layer 111 may be 300 nm or more and 10 μm or less. Also, the average thickness of at least one or more of the plurality of dielectric layers 111 may be 300 nm or more and 10 μm or less.

[0030] Here, the average thickness of the dielectric layer 111 can mean the average size in the first direction of the dielectric layer 111 disposed between the internal electrodes 121 and 122. The average thickness of the dielectric layer 111 can be measured by scanning cross-sections in the first and second directions of the main body 110 with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, the thickness can be measured at a number of points of one dielectric layer 111, for example, 30 points at equal intervals in the second direction, and the average value can be measured. The 30 points at the above equal intervals can be specified by the capacitance forming portion Ac described later. Further, when the measurement of such an average value is extended to 10 dielectric layers 111 to measure the average value, the average thickness of the dielectric layer 111 can be further generalized.

[0031] The internal electrodes 121 and 122 may be alternately arranged with the dielectric layer 111 in the first direction.

[0032] The internal electrodes 121 and 122 can include the first and second internal electrodes 121 and 122. The first and second internal electrodes 121 and 122 are alternately arranged so as to face each other with the dielectric layer 111 constituting the main body 110 interposed therebetween, and can be connected to the third and fourth surfaces 3 and 4 of the main body 110, respectively. Specifically, one end of the first internal electrode 121 can be connected to the third surface, and one end of the second internal electrode 122 can be connected to the fourth surface. That is, in one embodiment, the internal electrodes 121 and 122 can be in contact with the third surface 3 or the fourth surface 4.

[0033] As shown in FIGS. 8(a) and 8(b), the first internal electrode 121 is connected to the third surface 3 and spaced apart from the fourth surface 4, and the second internal electrode 122 is connected to the fourth surface 4 and spaced apart from the third surface 3. Thereby, the first internal electrode 121 can be connected to the first external electrode 130 without being connected to the second external electrode 140, and the second internal electrode 122 can be connected to the second external electrode 140 without being connected to the first external electrode 130.

[0034] The materials for forming the internal electrodes 121 and 122 are not particularly limited, and materials with excellent electrical conductivity can be used. For example, the internal electrodes 121 and 122 can contain one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0035] Also, the internal electrodes 121 and 122 can be formed by printing a conductive paste for internal electrodes containing one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof on a ceramic green sheet. As the printing method of the above conductive paste for internal electrodes, a screen printing method, a gravure printing method, or the like can be used, but the present invention is not limited thereto.

[0036] The average thickness of the internal electrodes 121 and 122 is not particularly limited and can be arbitrarily set according to desired characteristics and applications. For a specific example, the average thickness of the internal electrodes 121 and 122 may be 300 nm or more and 10 μm or less. Also, the average thickness of at least one or more of the plurality of internal electrodes 121 and 122 may be 300 nm or more and 10 μm or less.

[0037] The average thickness of the internal electrodes 121 and 122 is extracted from the internal electrode layer scanned by a scanning electron microscope (SEM) of the length and the cross-section in the thickness direction (L-T) cut at the central portion in the width direction of the main body 110. Among the internal electrode layers, based on one internal electrode layer at the point where the center line in the length direction of the main body and the center line in the thickness direction meet, for a total of 5 internal electrode layers of the upper 2 layers and the lower 2 layers, with the point where the center line in the length direction of the main body and the center line in the thickness direction meet as a reference, after determining 5 points of 2 points on the left side and 2 points on the right side at equal intervals around the 1 reference point, the thickness of each point can be measured and the average value can be measured.

[0038] Referring to FIGS. 3 and 5, the main body 110 can include a capacitance forming portion Ac which is a region where the first and second internal electrodes 121 and 122 overlap in the first direction. Further, the capacitance forming portion Ac is a portion that contributes to the formation of the capacitance of the capacitor, and can be formed by repeatedly laminating a plurality of first and second internal electrodes 121 and 122 with the dielectric layer 111 interposed therebetween.

[0039] Referring to FIGS. 3 to 5, a region between a cross section of the capacitance forming portion Ac in the second direction in the main body 110 and a surface of the main body 110 facing the second direction can be defined as a length-margin portion. The length-margin portion may be a region including any one of the internal electrodes 121 and 122.

[0040] Referring to FIGS. 3 to 5, cover portions 112 and 113 may be disposed on one surface and the other surface of the capacitance forming portion Ac in the first direction.

[0041] The cover portions 112 and 113 can be formed by laminating a single dielectric layer or two or more dielectric layers in the thickness direction on the upper and lower surfaces of the capacitance forming portion Ac, and can basically play a role of preventing damage to the internal electrodes due to physical or chemical stress.

[0042] The cover portions 112 and 113 do not include internal electrodes and can include the same material as the dielectric layer 111. For example, the cover portions 112 and 113 can include a ceramic material, for example, a barium titanate (BaTiO3)-based ceramic material.

[0043] On the other hand, the thickness of the cover portions 112 and 113 does not need to be particularly limited. However, in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component, the thickness of the cover portions 112 and 113 may be 15 μm or less.

[0044] The average thickness of the cover portions 112 and 113 can mean the size in the first direction, and can be a value obtained by averaging the sizes in the first direction of the cover portions 112 and 113 measured at five equally spaced points at the upper or lower part of the capacitance forming portion Ac.

[0045] Referring to FIGS. 4 to 5, margin portions 114 and 115 may be disposed on one surface and the other surface of the capacitance forming portion Ac in the third direction.

[0046] The margin portions 114 and 115 may include a first margin portion 114 disposed on the fifth surface 5 of the main body 110 and a second margin portion 115 disposed on the sixth surface 6. That is, the margin portions 114 and 115 can be disposed on both end surfaces in the width direction of the ceramic main body 110.

[0047] As shown in FIG. 5, the margin portions 114 and 115 can mean the regions between the boundaries of both ends of the first and second internal electrodes 121 and 122 and the main body 110 in a cross-section obtained by cutting the main body 110 in the width-thickness (W-T) direction.

[0048] The margin portions 114 and 115 can basically play a role in preventing damage to the internal electrodes due to physical or chemical stress.

[0049] The margin portions 114 and 115 may be formed by applying a conductive paste to form internal electrodes except for the locations where the margin portions are formed on the ceramic green sheet.

[0050] Also, in order to suppress the step difference caused by the internal electrodes 121 and 122, after cutting so that the internal electrodes after lamination are exposed on the fifth and sixth surfaces 5 and 6 of the main body, a single dielectric layer or two or more dielectric layers can be laminated on both side surfaces of the capacitance forming portion Ac in the third direction (width direction) to form the margin portions 114 and 115.

[0051] On the other hand, the width of the margin portions 114 and 115 does not need to be particularly limited. For example, the width of the margin portions 114 and 115 may be 5 to 300 μm. However, in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component, the average width of the margin portions 114 and 115 may be 15 μm or less.

[0052] The average widths of the margin portions 114 and 115 can mean the average size in the third direction of the region where the internal electrodes are separated from the fifth surface and the average size in the third direction of the region where the internal electrodes are separated from the sixth surface, and can be the value obtained by averaging the sizes in the third direction of the margin portions 114 and 115 measured at five equally spaced points on the side surface of the capacitance forming portion Ac.

[0053] Therefore, in one embodiment, the average sizes in the third direction of the regions where the internal electrodes 121 and 122 are separated from the fifth and sixth surfaces can be 15 μm or less respectively.

[0054] Referring to FIGS. 2 to 5, reinforcing patterns 123 and 124 may be arranged on one surface and the other surface in the first direction of the capacitance forming portion Ac. The reinforcing patterns 123 and 124 can be formed continuously in the third direction and can be in contact with the third surface 3 and the fourth surface 4 which are the surfaces of the main body 110 facing each other in the second direction respectively. At this time, the reinforcing pattern 123 in contact with the third surface 3 and the reinforcing pattern 124 in contact with the fourth surface 4 can be arranged to be separated from each other in the second direction.

[0055] The materials for forming the reinforcing patterns 123 and 124 are not particularly limited, and materials having excellent electrical conductivity can be used. For example, the internal electrodes 121 and 122 can include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0056] The external electrodes 130 and 140 can be arranged on the main body 110. Specifically, the external electrodes 130 and 140 can be arranged on the third and fourth surfaces 3 and 4 of the main body 110 respectively, and can include the first and second external electrodes 130 and 140 respectively connected to the first and second internal electrodes 121 and 122.

[0057] In this embodiment, a structure in which the stacked electronic component 100 has two external electrodes 130 and 140 is described. However, the number, shape, etc. of the external electrodes 130 and 140 can be changed according to the form of the internal electrodes 121 and 122 and other purposes.

[0058] On the other hand, the external electrodes 130 and 140 may be formed of any material as long as it has electrical conductivity, such as metal. A specific material may be determined in consideration of electrical characteristics, structural stability, etc. Further, it may have a multilayer structure.

[0059] For example, the external electrodes 130 and 140 can include an electrode layer disposed on the main body 110 and a plating layer formed on the electrode layer.

[0060] As a more specific example of the electrode layer, the electrode layer may be a fired electrode including a conductive metal and glass, or a resin-based electrode including a conductive metal and a resin.

[0061] Also, the electrode layer may be in a form in which a fired electrode and a resin-based electrode are sequentially formed on the main body. Further, the electrode layer may be formed by transferring a sheet containing a conductive metal onto the main body, or may be formed by a method of transferring a sheet containing a conductive metal onto a fired electrode. Further, the electrode layer may be formed of a plating layer or a layer formed by a vapor deposition method such as sputtering or ALD (Atomic layer deposition).

[0062] As the conductive metal contained in the electrode layer, a material having excellent electrical conductivity can be used, but it is not particularly limited. For example, the conductive metal may be one or more of nickel (Ni), copper (Cu), and their alloys.

[0063] The plating layer plays a role in improving mounting characteristics. The type of the plating layer is not particularly limited, and it may be a plating layer containing one or more of Ni, Sn, Pd, and their alloys, or may be formed of a plurality of layers.

[0064] More specific examples of the plating layer are as follows. The plating layer may be a Ni plating layer or a Sn plating layer, or may be in a form in which a Ni plating layer and a Sn plating layer are sequentially formed on the electrode layer, or may be in a form in which a Sn plating layer, a Ni plating layer, and a Sn plating layer are sequentially formed. Further, the plating layer may include a plurality of Ni plating layers and / or a plurality of Sn plating layers. Further, the plating layer may be in a form in which a Ni plating layer and a Pd plating layer are sequentially formed on the electrode layer.

[0065] The size of the multilayer electronic component 100 is not particularly limited. According to the present invention, since it is advantageous for miniaturization and high capacity, it can be applied to the size of IT products with a small size, and since high reliability can be ensured in various environments, it can also be applied to the size of automotive electrical components that require high reliability.

[0066] On the other hand, the external electrodes of conventional general multilayer electronic components may be formed thinner at the corner portions than at the central portion of the main body surface. In this case, the thinly formed external electrodes can serve as a penetration path for moisture from the outside, so there is a possibility that the moisture resistance reliability may decrease.

[0067] Moreover, since the central portion of the main body corresponds to a region where internal electrodes of different polarities overlap in the stacking direction, a step may occur in the stacking and crimping processes. In particular, a step may occur at the margin portion that forms the side surface of the capacitance forming portion where the internal electrodes overlap. Further, since the central portion of the main body is a region where the internal electrodes overlap, when passing through a heat treatment process such as firing, an aggregation phenomenon may occur.

[0068] Therefore, in one embodiment of the present invention, reinforcing patterns 123 and 124 are arranged on one surface and the other surface of the capacitance forming portion Ac in the first direction, the reinforcing patterns 123 and 124 are in contact with surfaces 3 and 4 facing the second direction of the main body 110, are arranged spaced apart from each other in the second direction, and when the reinforcing patterns 123 and 124 are equally divided into four in the third direction along one end in the third direction to the other end in the third direction of the reinforcing patterns 123 and 124, the length in the second direction of the reinforcing patterns 123 and 124 at the 1 / 4 point (1 / 4w) is larger than the length in the second direction of the reinforcing patterns 123 and 124 at the 1 / 2 point (1 / 2w), and the length in the second direction of the reinforcing patterns 123 and 124 at the 3 / 4 point (3 / 4w) is larger than the length in the second direction of the reinforcing patterns 123 and 124 at the 1 / 2 point (1 / 2w). By adjusting in this way, the moisture resistance reliability of the stacked electronic component can be improved, the step can be alleviated, and the aggregation phenomenon at the central portion of the internal electrode can also be alleviated.

[0069] Referring to FIG. 9, as in one embodiment of the present invention, when the reinforcing patterns 123 and 124 are equally divided into four in the third direction along one end in the third direction to the other end in the third direction of the reinforcing patterns 123 and 124, the length in the second direction of the reinforcing patterns 123 and 124 at the 1 / 4 point (1 / 4w) is larger than the length in the second direction of the reinforcing patterns 123 and 124 at the 1 / 2 point (1 / 2w), and the length in the second direction of the reinforcing patterns 123 and 124 at the 3 / 4 point (3 / 4w) is larger than the length in the second direction of the reinforcing patterns 123 and 124 at the 1 / 2 point (1 / 2w). When adjusting, the reinforcing patterns 123 and 124 can have a shape in which the length in the second direction gradually increases from the central portion in the third direction toward both ends in the third direction.

[0070] Referring to FIG. 9, the reinforcing patterns 123 and 124 can be in contact with the third surface 3 and the fourth surface 4 which are surfaces facing the second direction of the main body 110 respectively, and are arranged spaced apart from each other in the second direction, and can be in a shape in which the length in the second direction gradually increases from the central portion in the third direction toward both ends in the third direction. At this time, in one example, the reinforcing patterns 123 and 124 may not overlap with the capacitance forming portion Ac in the first direction.

[0071] Referring to FIG. 9, the reinforcing patterns 123 and 124 can be continuously formed in the third direction, and the reinforcing patterns 123 and 124 can be in contact with the fifth surface 5 and the sixth surface 6, which are the surfaces of the main body 110 facing the third direction. Thereby, since the thickness of the external electrodes arranged in the region adjacent to the corner portion of the main body 110 can be formed thick enough, the moisture resistance reliability of the multilayer electronic component 100 can be further improved.

[0072] Referring to FIG. 9, the maximum length of the main body 110 in the second direction is represented as L, the maximum length of the reinforcing patterns 123 and 124 in the second direction is represented as L1, the average length of the length - margin portion in the second direction is represented as LM, the length of the reinforcing patterns 123 and 124 closest to the capacitance - forming portion Ac in the second direction is represented as L2, and the minimum length of the reinforcing patterns 123 and 124 in the second direction is represented as L3.

[0073] At this time, in one embodiment, L1 ≤ 0.22L can be satisfied. Thereby, even when the external electrodes extend and are formed on the fifth surface 5 or the sixth surface 6, the connectivity between the external electrodes 130 and 140 and the main body 110 can be improved, and external electrodes 130 and 140 with sufficient thickness can also be formed at the corner connecting the third surface 3 and the fifth and sixth surfaces 5 and 6, or at the corner connecting the fourth surface 4 and the fifth and sixth surfaces 5 and 6. Therefore, the moisture resistance reliability of the multilayer electronic component 100 can be further improved. On the other hand, since the reinforcing patterns 123 and 124 have a form in which the length in the second direction gradually increases from the central portion in the third direction toward both ends in the third direction, L2 ≤ L1 can be satisfied.

[0074] Furthermore, in one embodiment, L2 ≤ 0.95LM can be satisfied. When L2 exceeds 0.95LM, if distortion occurs during the lamination and crimping processes of the internal electrodes 121 and 122 and the reinforcing patterns 123 and 124, there may be a problem that the reliability of the multilayer electronic component 100 deteriorates due to overlapping with the capacitance forming portion Ac. Therefore, in one embodiment, by satisfying L2 ≤ 0.95LM, it is possible to prevent the overlapping of the reinforcing patterns 123 and 124 and the capacitance forming portion Ac in the first direction. On the other hand, since the reinforcing patterns 123 and 124 have a form in which the length in the second direction gradually increases from the central portion in the third direction toward both ends in the third direction, L3 ≤ L2 can be satisfied.

[0075] Also, in one embodiment, 0.05LM ≤ L3 ≤ 0.5LM can be satisfied. When L3 is less than 0.05LM, as a result, the size of the reinforcing patterns 123 and 124 in the second direction becomes excessively small, and thus the connectivity between the external electrodes 130 and 140 and the main body 110 may decrease. When L3 exceeds 0.5LM, there may be a possibility that the capacitance forming portion Ac and the reinforcing patterns 123 and 124 overlap in the first direction, and thus it may be difficult to ensure the effect of mitigating the step. Therefore, in one embodiment, by adjusting to satisfy 0.05LM ≤ L3 ≤ 0.5LM, it is possible to ensure the effect of improving the connectivity between the external electrodes 130 and 140 and the main body 110 and the effect of mitigating the step.

[0076] On the other hand, in one embodiment, at least two or more of the conditions of L2 ≤ L1 ≤ 0.22L, L3 ≤ L2 ≤ 0.95LM, and 0.05LM ≤ L3 ≤ 0.5LM can be satisfied. Thereby, in the multilayer electronic component 100, the effect of improving the connectivity between the external electrodes 130 and 140 and the main body 110 and the effect of mitigating the step can be further improved.

[0077] The method for measuring the above LM, L1, L2, and L3 is not particularly limited. In FIG. 9, for the sake of convenience of explanation, each dimension is represented by a cross-section in the second direction and the third direction, but the present invention is not limited thereto, and the measurement can be performed on cross-sections in the first direction and the second direction polished up to a specific point in the third direction of the multilayer electronic component 100.

[0078] Specifically, in the case of L1, after polishing the multilayer electronic component 100 in the third direction so that the fifth surface 5 is exposed, it can be measured by the length in the second direction at the ends of the exposed reinforcing patterns 123 and 124. On the other hand, when a plurality of reinforcing patterns 123 and 124 are formed, the average value of the values measured in two or more layers can be taken.

[0079] Also, L2 can be measured by the length in the second direction at the ends of the exposed reinforcing patterns 123 and 124 in cross-sections in the first direction and the second direction where the multilayer electronic component 100 is polished in the third direction to expose the cross-section in the third direction of the capacitance forming portion Ac. On the other hand, when a plurality of reinforcing patterns 123 and 124 are formed, the average value of the values measured in two or more layers can be taken.

[0080] Also, L3 can be measured by the length in the second direction at the ends of the exposed reinforcing patterns 123 and 124 in cross-sections in the first direction and the second direction where the multilayer electronic component 100 is polished up to the central portion in the third direction. On the other hand, when a plurality of reinforcing patterns 123 and 124 are formed, the average value of the values measured in two or more layers can be taken.

[0081] Also, LM can be measured by the length in the second direction in which the second internal electrode 122 and the third surface 3 are separated in cross-sections in the first direction and the second direction where the multilayer electronic component 100 is polished up to the central portion in the third direction. On the other hand, LM can be a value obtained by taking the average of values measured at three or more points equally spaced in the first direction.

[0082] FIG. 6 schematically shows a cross-section corresponding to the cross-section taken along line II-II' of FIG. 1 in a stacked electronic component according to an embodiment, and FIG. 7 schematically shows a cross-section corresponding to the cross-section taken along line II-II' of FIG. 1 in a stacked electronic component according to an embodiment.

[0083] Referring to FIG. 6, the capacitance forming portion of the stacked electronic component 100' according to an embodiment may include a first capacitance forming portion Ac1 adjacent to one surface of the main body 110 in the first direction, and a second capacitance forming portion Ac2 adjacent to the other surface of the main body 110 in the first direction. At this time, in one embodiment, the reinforcing patterns 123 and 124 may also be disposed between the first capacitance forming portion Ac1 and the second capacitance forming portion Ac2.

[0084] Referring to FIG. 7, the capacitance forming portion of the stacked electronic component 100'' according to an embodiment may include a first capacitance forming portion Ac1 adjacent to one surface of the main body 110 in the first direction, a second capacitance forming portion Ac2 adjacent to the other surface of the main body 110 in the first direction, and a third capacitance forming portion Ac3 disposed between the first capacitance forming portion Ac1 and the second capacitance forming portion Ac2. At this time, in one embodiment, the reinforcing patterns 123 and 124 may also be disposed between the first capacitance forming portion and the third capacitance forming portion, and between the third capacitance forming portion and the second capacitance forming portion. Thereby, not only the upper and lower portions of the capacitance forming portion but also between the plurality of capacitance forming portions, by forming a connection surface with the external electrodes 130 and 140, the moisture resistance reliability of the stacked electronic component 100' can be further improved.

[0085] FIGS. 10(a) and (b) are plan views showing the structure of a reinforcing pattern according to an embodiment.

[0086] Referring to FIG. 10(a), the reinforcing patterns 123' and 124' according to an embodiment may have substantially the same length in the second direction in a region exceeding the cross-section in the third direction of the capacitance forming portion Ac. In this case, it may be advantageous in forming the reinforcing patterns 123' and 124' so as not to be exposed in a stacked electronic component in which the band portion of the external electrode is formed short.

[0087] Referring to FIG. 10(b), the side surfaces of the reinforcement patterns 123'' and 124'' corresponding to the capacitance forming portions according to an embodiment may have a rounded shape. Thereby, even if printing bleeding or condensation occurs during the printing, lamination, pressure bonding, and sintering processes, the phenomenon that the reinforcement patterns 123'' and 124'' and the capacitance forming portion Ac overlap in the first direction can be effectively prevented. At this time, the side surfaces of the reinforcement patterns 123'' and 124'' corresponding to the capacitance forming portion Ac may mean the side surfaces that do not contact the surface of the main body 110 among the side surfaces of the reinforcement patterns 123'' and 124''.

[0088] As described above, the embodiments of the present invention have been described in detail. However, the present invention is not limited by the above-described embodiments and the accompanying drawings, but is limited by the appended claims. Therefore, various forms of substitution, modification, and change can be made by those having ordinary knowledge in the technical field without departing from the technical idea of the present invention described in the claims, and it can be said that this also belongs to the scope of the present invention.

[0089] In addition, the expression "an embodiment" used in the present disclosure does not mean the same embodiment, but is provided to emphasize and explain each different unique feature. However, the above-presented embodiment does not exclude being implemented in combination with the features of another embodiment. For example, even if a matter described in a specific embodiment is not described in another embodiment, it can be understood and related to the description of the other embodiment as long as there is no description contrary to or conflicting with that matter in the other embodiment.

[0090] The terms used in the present disclosure are merely used to describe an embodiment and are not intended to limit the present disclosure. At this time, the singular expression includes the plural expression unless the context clearly indicates a different meaning.

Description of Reference Numerals

[0091] 100, 100', 100'': Multilayer electronic component 110: Body 111: Dielectric layer 112, 113: Cover part 114, 115: Margin part 121, 122: Internal electrode 123: Reinforcing pattern 130, 140: External electrode

Claims

1. A main body including a plurality of dielectric layers, a first internal electrode, a second internal electrode, and a reinforcing pattern, and an external electrode disposed on the main body, wherein the first and second internal electrodes are alternately arranged in a first direction with the dielectric layer interposed therebetween, and in the main body, when a region where the first and second internal electrodes overlap in the first direction is a capacitance forming portion, the reinforcing pattern is disposed on one surface and the other surface of the capacitance forming portion in the first direction, when a direction perpendicular to the first direction is a second direction and a direction perpendicular to the first direction and the second direction is a third direction, the reinforcing pattern is in contact with the surfaces of the main body facing each other in the second direction, respectively, and is disposed spaced apart from each other in the second direction, when the reinforcing pattern is equally divided into four in the third direction along the other end in the third direction from one end in the third direction of the reinforcing pattern, the length of the reinforcing pattern in the second direction at the 1 / 4 point is larger than the length of the reinforcing pattern in the second direction at the 1 / 2 point, and the length of the reinforcing pattern in the second direction at the 3 / 4 point is larger than the length of the reinforcing pattern in the second direction at the 1 / 2 point, a multilayer electronic component.

2. The multilayer electronic component according to claim 1, wherein the reinforcing pattern does not overlap with the capacitance forming portion in the first direction.

3. When the maximum length of the main body in the second direction is L, and the maximum length of the reinforcing pattern in the second direction is L1, the multilayer electronic component according to claim 1, satisfying L1≤0.22L.

4. In the main body, a region between a cross section of the capacitance forming portion in the second direction and the surface of the main body facing the second direction is a length - margin portion, the average length of the length - margin portion in the second direction is LM, and when the length of the reinforcing pattern in the second direction of the reinforcing pattern closest to the capacitance forming portion is L2, the multilayer electronic component according to claim 1, satisfying L2≤0.95LM.

5. In the main body, a region between a cross section of the capacitance forming portion in the second direction and the surface of the main body facing the second direction is a length - margin portion, the average length of the length - margin portion in the second direction is LM, and when the minimum length of the reinforcing pattern in the second direction is L3, the multilayer electronic component according to claim 1, satisfying 0.05LM≤L3≤0.5LM.

6. In the body, the region between the cross-section of the capacitance forming portion in the second direction and the surface of the body facing the second direction is defined as the length-margin portion. Let the maximum length of the body in the second direction be L, the average length of the length-margin portion in the second direction be LM, the maximum length of the reinforcing pattern in the second direction be L1, the size of the portion of the reinforcing pattern closest to the capacitance forming portion in the second direction be L2, and the minimum length of the reinforcing pattern in the second direction be L3. Then, The multilayer electronic component according to claim 1, satisfying L2 ≤ L1 ≤ 0.22L, L3 ≤ L2 ≤ 0.95LM, and 0.05LM ≤ L3 ≤ 0.5LM.

7. The multilayer electronic component according to claim 1, wherein the reinforcing pattern is in contact with one surface and the other surface of the body in the third direction.

8. The capacitance forming portion includes a first capacitance forming portion adjacent to one surface of the body in the first direction and a second capacitance forming portion adjacent to the other surface of the body in the first direction. The reinforcing pattern is also disposed between the first capacitance forming portion and the second capacitance forming portion. The multilayer electronic component according to claim 1.

9. The multilayer electronic component according to claim 1, wherein the length of the reinforcing pattern in the second direction is substantially the same in a region exceeding the cross-section of the capacitance forming portion in the third direction.

10. The multilayer electronic component according to claim 1, wherein the reinforcing pattern has a shape recessed in the second direction.

11. The multilayer electronic component according to claim 1, wherein the side surface of the reinforcing pattern facing the capacitance forming portion has a rounded shape.

12. The multilayer electronic component according to claim 1, wherein a plurality of the reinforcing patterns are disposed on one surface and the other surface of the capacitance forming portion in the first direction.

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