Circuit board and semiconductor package including the same
JP2025106147A5Pending Publication Date: 2025-10-06LG INNOTEK CO LTD
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Patent Information
- Application Number
- JP2024062029
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-01-02
- Filing Date
- 2024-04-08
- Publication Date
- 2025-10-06
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Abstract
To provide a circuit board and a semiconductor package including the same that ensure space for the deflux solution to penetrate.SOLUTION: A circuit board according to an embodiment includes a build-up structure 100 including a build-up insulating layer 110 having a plurality of insulating layers 111 to 114 stacked along a vertical direction, a protective layer 140 arranged on the build-up structure, and a plurality of insulating members 160 arranged on the protective layer and spaced apart from one another.SELECTED DRAWING: Figure 1b
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