Substrate processing device and substrate processing method

Abstract

To provide a substrate processing device and a substrate processing method which effectively remove foreign objects adhering to a nozzle guard without leaving liquid components to enable stable and high quality manufacture in the substrate processing device in which the nozzle guard is disposed forward of a slit nozzle which is moved relative to the substrate.SOLUTION: In the invention, a slit nozzle and a plate-like nozzle guard are moved relative to a substrate with a processing liquid discharged from a discharge port of the slit nozzle in a state where the discharge port is placed close to a surface of the substrate to apply the processing liquid to the surface of the substrate while preventing foreign objects from adhering to the slit nozzle with the nozzle guard provided forward of the slit nozzle in a relative movement direction in which the slit nozzle is relatively moved. Before the processing liquid is applied in this way, a dry guard cleaner suctions and removes foreign objects from the nozzle guard.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present invention relates to a substrate processing technique for supplying and applying a processing liquid from a slit nozzle to a substrate for precision electronic devices such as glass substrates for FPDs such as liquid crystal display devices and organic EL display devices, semiconductor wafers, glass substrates for photomasks, substrates for color filters, substrates for recording disks, substrates for solar cells, substrates for electronic paper, etc., and substrates for semiconductor packages (hereinafter simply referred to as "substrates").

Background Art

[0002] There is known a substrate processing apparatus for applying a processing liquid to a substrate by discharging the processing liquid from a slit nozzle while relatively moving the slit nozzle having a slit-shaped discharge port relative to the substrate. For example, in the apparatus described in Patent Document 1, the processing liquid is applied by moving the slit nozzle above the stage surface while holding the substrate on the stage surface of the stage. On the other hand, in the apparatus described in Patent Document 2, the substrate is moved in a so-called floating method while positioning the slit nozzle at a predetermined coating position above the stage surface of the stage. More specifically, the substrate is moved so as to pass through a coating region sandwiched between the slit nozzle and the stage surface while being floated by a pressure gas layer formed on the stage surface by a gas flow passing through gas holes provided on the stage surface, and the processing liquid is applied. Although the substrate conveyance methods are different in this way, nozzle guards are provided in any of the apparatuses. This is in consideration of the possibility that foreign substances or protrusions (hereinafter referred to as "foreign substances") may protrude upward on the surface side of the substrate. That is, if the application of the processing liquid is performed with these foreign substances present, the slit nozzle collides with the foreign substances, thereby inhibiting the application of the processing liquid. That is, due to the above collision, the applied processing liquid or the slit nozzle may be adversely affected. Therefore, in the above conventional apparatus, a nozzle guard is disposed on the front side of the slit nozzle in the relative movement direction in which the slit nozzle moves relative to the substrate.

[0003] By the way, when removing foreign matter with a nozzle guard, the foreign matter may adhere to the nozzle guard. Depending on the size of the foreign matter, when performing a coating process using a slit nozzle equipped with the nozzle guard, the substrate and the foreign matter may come into contact, which may cause defects. Further, if the coating process is repeated using the slit nozzle with the foreign matter attached, defects may occur continuously at the same position on several consecutive substrates.

[0004] Therefore, it has been proposed to incorporate, for example, the nozzle guard cleaning device described in Patent Document 3 into the substrate processing apparatus. This nozzle guard cleaning device supplies a rinsing liquid to the nozzle guard to remove foreign matter.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Patent Document 2

Patent Document 3

Summary of the Invention

Problems to be Solved by the Invention

[0006] The device described in Patent Document 3 above cleans and removes foreign matter adhering to the nozzle guard NG in a so-called wet method. Therefore, after performing the cleaning process of the nozzle guard, a liquid component such as a rinsing liquid may remain on the nozzle guard. Therefore, if the nozzle guard moves above the substrate integrally with the slit nozzle in that state, the liquid component may fall onto the surface of the substrate immediately before coating. If the surface of the substrate is wetted by a liquid component such as a rinsing liquid in this way, not only can the coating process not be performed well, but there is also a possibility of causing a process defect thereafter.

[0007] The present invention has been made in view of the above problems, and in a substrate processing apparatus in which a nozzle guard is disposed on the front side of a slit nozzle that moves relative to a substrate, without leaving a liquid component, effectively removes foreign matter adhering to the nozzle guard, and enables stable and high-quality production. An object is to provide a substrate processing apparatus and a substrate processing method.

Means for Solving the Problems

[0008] One aspect of the present invention is a substrate processing apparatus that applies a processing liquid to the surface of a substrate, including a slit nozzle having a slit-shaped discharge port for discharging the processing liquid, and above the substrate, with the discharge port facing downward. A nozzle moving unit that relatively moves the slit nozzle in a direction along the surface of the substrate with respect to the substrate, and a plate-shaped nozzle guard provided on the front side of the slit nozzle in the relative movement direction in which the slit nozzle relatively moves with respect to the substrate during application of the processing liquid, and integrally moves with the slit nozzle, and a foreign matter removing unit that sucks the ambient atmosphere around the nozzle guard and removes foreign matter adhering to the nozzle guard from the nozzle guard.

[0009] Another aspect of the present invention is a substrate processing method, including an application step of applying a processing liquid to the surface of a substrate while relatively moving a slit nozzle and a plate-shaped nozzle guard with respect to the substrate while discharging the processing liquid from the discharge port of the slit nozzle in a state where the discharge port is close to the surface of the substrate, and preventing adhesion of foreign matter to the slit nozzle by a nozzle guard provided on the front side of the slit nozzle in the relative movement direction in which the slit nozzle relatively moves, and a removal step of sucking the ambient atmosphere around the nozzle guard and removing foreign matter adhering to the nozzle guard from the nozzle guard before the application step.

[0010] In the invention configured as described above, the coating process is performed while removing foreign matter by means of a nozzle guard disposed on the front side of the slit nozzle moving in the relative movement direction. For this reason, foreign matter may adhere to the nozzle guard. Therefore, in the present invention, a foreign matter removing unit sucks the ambient atmosphere around the nozzle guard. As a result, foreign matter is removed from the nozzle guard.

Effect of the Invention

[0011] As described above, according to the present invention, since so-called dry foreign matter removal in which foreign matter is removed without using a liquid component is employed, the foreign matter adhering to the nozzle guard can be effectively removed without leaving the liquid component remaining, enabling stable and high-quality production.

Brief Description of the Drawings

[0012]

Figure 1

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Figure 12A

Figure 12B

Figure 13

Embodiments for Carrying out the Invention

[0013] FIG. 1 is a diagram schematically showing the overall configuration of a coating apparatus which is a first embodiment of a substrate processing apparatus according to the present invention. Further, FIG. 2 is a side view schematically showing the coating apparatus shown in FIG. 1. In FIGS. 1, 2 and each subsequent figure, an XYZ orthogonal coordinate system is appropriately attached with the Z direction as the vertical direction and the XY plane as the horizontal plane in order to clarify their directional relationships, and the dimensions and numbers of each part are exaggerated or simplified as necessary. Also, in FIG. 2, a part of the configuration such as the nozzle support is omitted.

[0014] The coating device 1A is a coating device called a slit coater that applies a processing liquid to the surface 31 of a substrate 3, which is an example of an object to be coated, using a slit nozzle 2. The processing liquid is, for example, a photoresist liquid. Further, the processing liquid may be various processing liquids in the form of a paste or slurry containing, for example, pigments for color filters, polyimide precursors, silicone agents, nano-metal inks, or conductive materials. The substrate 3 is a glass substrate having a rectangular shape in plan view. Also, the substrate 3 to be coated can be applied to various substrates such as rectangular glass substrates, semiconductor substrates, flexible substrates for film liquid crystals, substrates for photomasks, substrates for color filters, substrates for solar cells, substrates for organic EL (ElectroLuminescence), and substrates for semiconductor packages. In this specification, the "surface 31 of the substrate 3" means the main surface on the side where the processing liquid is applied among the two main surfaces of the substrate 3.

[0015] The coating device 1A includes a stage 4 that can adsorb and hold the substrate 3 in a horizontal posture, a coating processing unit 5 that performs a coating process on the substrate 3 held by the stage 4 using the slit nozzle 2, a nozzle maintenance unit 6 that performs maintenance processing on the slit nozzle 2 and the nozzle guard NG, and a control unit 10 that controls these respective units.

[0016] The stage 4 is made of a stone material such as granite having a substantially cuboid shape, and on the (-Y) direction side of its upper surface (+Z side), there is a holding surface 41 that is processed into a substantially horizontal flat surface for holding the substrate 3. A large number of vacuum suction ports (not shown) are dispersedly formed on the holding surface 41. By adsorbing the substrate 3 through these vacuum suction ports, the substrate 3 is horizontally held at a predetermined position during the coating process. Note that the holding mode of the substrate 3 is not limited to this, and for example, it may be configured to mechanically hold the substrate 3. Also, a nozzle adjustment region RA is provided on the (+Y) direction side of the region occupied by the holding surface 41 in the stage 4, and the nozzle maintenance unit 6 is arranged in this nozzle adjustment region RA.

[0017] In the slit nozzle 2, as shown in FIGS. 1 and 2, its lower end portion 2a (nozzle lip portion) has a downwardly tapered shape. And, a slit-shaped discharge port 21 is extended in the X direction on the lower surface of the lower end portion 2a, and the processing liquid pumped from a processing liquid supply portion (not shown) is discharged from the discharge port 21 onto the surface 31 of the substrate 3. Thereby, the processing liquid is applied to the surface 31 of the substrate 3.

[0018] The coating processing unit 5 has a nozzle support 51 that supports the slit nozzle 2. This nozzle support 51 has a support member 51a extending in parallel in the X direction above the stage 4, and two elevating mechanisms 51b that support the support member 51a from both sides in the X direction and raise and lower the support member 51a. The support member 51a is made of carbon fiber reinforced resin or the like and is a rod member having a rectangular cross section. The lower surface of this support member 51a serves as the mounting location 510 of the slit nozzle 2, and the support member 51a detachably supports the slit nozzle 2 at the mounting location 510. As a mechanism for attaching and detaching the slit nozzle 2 to and from the mounting location 510 of the support member 51a, various fastening mechanisms such as a latch or a screw can be appropriately used.

[0019] The two elevating mechanisms 51b are connected to both longitudinal ends of the support member 51a and each have an AC servo motor and a ball screw or the like. By these elevating mechanisms 51b, the support member 51a and the slit nozzle 2 fixed thereto are raised and lowered in the vertical direction (Z direction), and the distance between the discharge port 21 opening at the lower end of the slit nozzle 2 and the substrate 3, that is, the relative height of the discharge port 21 with respect to the substrate 3 is adjusted. The vertical position of the support member 51a can be detected, for example, by a linear encoder composed of a scale portion provided on the side surface of the elevating mechanism 51b (not shown) and a detection sensor provided on the side surface of the slit nozzle 2 or the like facing the scale portion.

[0020] The nozzle support 51 configured as described above has a cross-linked structure that spans the holding surface 41 and extends across the left and right ends of the stage 4 along the X direction, as shown in FIG. 1. The coating processing unit 5 has a nozzle moving unit 53 that moves the nozzle support 51 in the Y direction. The nozzle moving unit 53 functions as relative movement means for relatively moving the nozzle support 51 as a cross-linked structure and the slit nozzle 2 supported thereby along the Y direction with respect to the substrate 3 held on the stage 4. Specifically, the nozzle moving unit 53 includes, on each of the ±X sides, a guide rail 52 that guides the movement of the slit nozzle 2 in the Y direction, a linear motor 54 as a drive source, and a linear encoder 55 for detecting the position of the discharge port 21 of the slit nozzle 2.

[0021] The two guide rails 52 are respectively provided at both ends of the stage 4 in the X direction and extend in the Y direction so as to include the nozzle adjustment region RA and the section where the holding surface 41 is provided. And the two guide rails 52 respectively guide the movement of the two elevating mechanisms 51b in the Y direction. Also, the two linear motors 54 are respectively provided on both sides of the stage 4 and are AC coreless linear motors having a stator 54a and a mover 54b. The stator 54a is provided along the Y direction on the side surface of the stage 4 in the X direction. On the other hand, the mover 54b is fixedly provided outside the elevating mechanism 51b. The two linear motors 54 respectively drive the two elevating mechanisms 51b in the Y direction by the magnetic force generated between these stator 54a and mover 54b.

[0022] Each linear encoder 55 has a scale portion 55a and a detection portion 55b. The scale portion 55a is provided along the Y direction below the stator 54a of the linear motor 54 fixedly provided on the stage 4. On the other hand, the detection portion 55b is fixedly provided further outside the mover 54b of the linear motor 54 fixedly provided on the elevating mechanism 51b and is disposed opposite to the scale portion 55a. The linear encoder 55 detects the position of the discharge port 21 of the slit nozzle 2 in the Y direction based on the relative positional relationship between the scale portion 55a and the detection portion 55b.

[0023] The nozzle moving part 53 configured in this way can move the slit nozzle 2 between above the nozzle adjustment area RA and above the substrate 3 held on the stage 4 by driving the nozzle support 51 in the Y direction. Then, the coating device 1A forms a processing liquid layer on the surface 31 of the substrate 3 by discharging the processing liquid from the discharge port 21 of the slit nozzle 2 and moving the slit nozzle 2 in the (+Y) direction from the coating start position Pst to the coating end position Pen. Thus, in this embodiment, the (+Y) direction corresponds to an example of the "relative movement direction" of the present invention.

[0024] While the slit nozzle 2 is relatively moved in the (+Y) direction with respect to the substrate 3 in this way, the processing liquid is applied. However, if foreign matter exists on the surface 31 of the substrate 3, the discharge port 21 of the slit nozzle 2 may come into contact with the foreign matter and be damaged. Therefore, as shown in FIGS. 1 and 2, a plate-shaped nozzle guard NG is arranged on the front side of the slit nozzle 2 (the diagonally lower right side in FIG. 1 and the right hand side in FIG. 2) in the relative movement direction (+Y) direction. This nozzle guard NG has the same X-direction width as the slit nozzle 2. As shown in FIG. 2, the nozzle guard NG is attached to the side surface on the (+Y) direction side of the slit nozzle 2 in such a way that its lower end portion protrudes below the discharge port 21 of the slit nozzle 2 at a position separated by a distance D1 in the (+Y) direction from the discharge port 21 of the slit nozzle 2. For this reason, during the application of the processing liquid, the lower end portion of the nozzle guard NG approaches the surface 31 of the substrate 3 from above, protecting the discharge port 21 of the slit nozzle 2 from foreign matter on the surface 31 of the substrate 3.

[0025] After the application of the processing liquid is completed, the slit nozzle 2 further moves in the (+Y) direction and waits in the nozzle adjustment area RA. This nozzle adjustment area RA is provided at a position deviated from the holding surface 41 of the substrate 3 in the (+Y) direction. The nozzle adjustment area RA functions as a waiting place for the slit nozzle 2 during a period when coating processing is not performed on the stage 4 such as the delivery period of the substrate 3 between the coating apparatus 1A and the external transfer mechanism (the loading / unloading period of the substrate 3). Further, the nozzle maintenance unit 6 performs various maintenance operations on the slit nozzle 2 located in the nozzle adjustment area RA.

[0026] The nozzle maintenance unit 6 includes a nozzle cleaning waiting unit 7 for performing so-called pre-dispensing (pre-discharge processing), a foreign matter detection unit 8 for detecting the attachment of foreign matter to the nozzle guard NG, a nozzle cleaning unit 9 for cleaning the slit nozzle 2, and a dry guard cleaner 12 which is an example of the "foreign matter removal unit" of the present invention. These are arranged in this order in the (+Y) direction. For the purpose of explaining these positional relationships later, the positions of the nozzle cleaning waiting unit 7, the foreign matter detection unit 8, the nozzle cleaning unit 9, and the dry guard cleaner 12 in the Y direction are defined as position Ppd, position Pdt, position Pnc, and position Pgc, respectively.

[0027] Among these, the nozzle cleaning unit 9 corresponds to an example of the "nozzle cleaning unit" of the present invention, and for example, those described in Japanese Patent Laid-Open No. 2018-149468 can be used. The nozzle cleaning unit 9 includes a scraper (contact member) 91. The scraper 91 moves along the outer surface (specifically, the inclined surface of the lip portion) of the lower end portion of the slit nozzle 2 in the X direction (scraping operation) while being in contact with the outer surface by a drive mechanism (not shown). Thereby, the scraper 91 scrapes and removes the deposits adhering to the lower end portion 2a of the slit nozzle 2.

[0028] The nozzle cleaning standby unit 7 is arranged on the (-Y) direction side of the nozzle cleaning unit 9 with the foreign object detection unit 8 interposed therebetween. The nozzle cleaning standby unit 7 has a pre-dispense roller 72 partially immersed in the cleaning liquid stored in the storage tank 71. This pre-dispense roller 72 has a length equal to or greater than that of the slit nozzle 2 in the X direction. This pre-dispense roller 72 rotates by the drive of a motor (not shown). In the present embodiment, before the coating process is executed, a small amount of resist liquid (processing liquid) is discharged from the slit nozzle 2 that has moved above the pre-dispense roller 72, so that the resist liquid containing the cleaning liquid used in the nozzle cleaning unit 9 and the like is removed from within the slit nozzle 2 (pre-discharge process). By this pre-discharge process, it becomes possible to discharge a resist liquid suitable for the coating process that does not contain impurities. Then, in the nozzle cleaning standby unit 7, the slit nozzle 2 waits for the next coating process.

[0029] FIG. 3 is a perspective view showing the overall configuration and operation of the foreign object detection unit. As shown in FIG. 2, the foreign object detection unit 8 is arranged between the nozzle cleaning standby unit 7 and the nozzle cleaning unit 9. More specifically, the foreign object detection unit 8 is arranged at a foreign object detection position Pdt that is separated from the pre-dispense roller 72 by a distance D2 in the (+Y) direction. In the present embodiment, this distance D2 is the same as the distance D1 from the discharge port 21 of the slit nozzle 2 in the Y direction to the nozzle guard NG as shown in FIG. 2. Therefore, in order to perform the pre-discharge process, when the slit nozzle 2 is positioned at the pre-dispense position Ppd corresponding to the pre-dispense roller 72 (corresponding to an example of the "pre-discharge position" of the present invention), the tip of the nozzle guard NG is positioned at the foreign object detection unit 8 configured as follows, and the foreign object detection process can be executed in parallel with the pre-discharge process.

[0030] The foreign object detection unit 8 includes a light projector 81, a light receiver 82, and an amplifier unit 83. The amplifier unit 83 incorporates a light emitting section and a light quantity detection section. The light projector 81 and the light receiver 82 each have a light projection window and a light reception window with the same shape. The light projector 81 and the light receiver 82 are erected upward from the amplifier unit 83 in a state where the light projection window and the light reception window face each other and are separated from each other by a predetermined interval in the Y direction. Here, the predetermined interval is set to be slightly wider than the thickness of the tip of the nozzle guard NG, and as shown in FIG. 3, the tip of the nozzle guard NG can be sandwiched between the light projector 81 and the light receiver 82. Further, the light projector 81 makes the light emitted from the light emitting section into a parallel light beam by means of a built-in lens and then folds it back in the (+Y) direction by a built-in mirror, thereby projecting the parallel light beam toward the light receiver 82. On the other hand, the light receiver 82 receives the parallel light beam from the light projector 81, folds back the direction of the light by a built-in mirror, and then guides the light to the light quantity detection section through a built-in lens. Then, the light quantity detection section outputs a value proportional to the received light quantity (hereinafter referred to as "received light quantity information") to the control unit 10. In this embodiment, the integrated foreign object detection unit 8 including the light projector 81, the light receiver 82, and the amplifier unit 83 is used. However, the amplifier unit 83 may be separated from the light projector 81 and the light receiver 82, and the first optical fiber may be connected between the light emitting section and the light projector 81, and the second optical fiber may be connected between the light receiver 82 and the light quantity detection section.

[0031] The foreign object detection unit 8 configured as described above is provided so as to be reciprocally movable in the X direction as shown in FIG. 3. Further, the foreign object detection unit 8 is connected to a movement mechanism 84. Therefore, when the movement mechanism 84 operates in response to a movement command from the control unit 10, the foreign object detection unit 8 moves between the front position P(X1) and the back position P(Xmax) while sandwiching the tip of the nozzle guard NG. While moving in this way, the light emitting section continuously emits light or emits light at regular intervals in response to a lighting command from the control unit 10. On the other hand, the light quantity detection section outputs received light quantity information.

[0032] FIG. 4 is a diagram schematically showing the operation of the foreign object detection unit. In the figure, "sensor position" indicates the position of the foreign object detection unit 8 in the X direction, "light shielding situation" indicates the situation where the parallel light beam traveling from the light projector 81 to the light receiver 82 is shielded by the tip of the nozzle guard NG, and "light reception amount" indicates the light reception amount received by the light amount detection unit. Here, the light reception amount when the nozzle guard NG does not exist between the light projector 81 and the light receiver 82 is set to 100. Here, when the foreign object detection unit 8 moves to a position where no foreign object adheres to the tip of the nozzle guard NG (a position other than the position P(Xn) in the figure), the light reception amount decreases to 60, but when the foreign object detection unit 8 moves to a position where the foreign object F adheres (the position P(Xn) in the figure), the light reception amount further decreases by an amount corresponding to the foreign object F and becomes 50. Therefore, the control unit 10 can specify the presence or absence of the foreign object F and the adhesion position of the foreign object F based on the change in the light reception amount.

[0033] FIG. 5 is a perspective view showing the overall configuration and operation of a dry guard cleaner, which is an example of the foreign object removal unit. FIG. 6 is a diagram schematically showing the operation of the dry guard cleaner shown in FIG. 5. As shown in FIG. 2, the dry guard cleaner 12 is disposed at a guard cleaning position Pgc that is separated from the nozzle cleaning unit 9 by a distance D3 in the (+Y) direction. In the present embodiment, this distance D3 coincides with the distance D1 from the discharge port 21 of the slit nozzle 2 to the nozzle guard NG in the Y direction. Therefore, in order to clean the tip of the slit nozzle 2 with the nozzle cleaning unit 9, when the slit nozzle 2 is positioned at the nozzle cleaning position Pnc corresponding to the scraper (contact member) 91, the tip of the nozzle guard NG is positioned at the dry guard cleaner 12 configured as described below, and the dry guard cleaning process can be executed in parallel with the nozzle cleaning process.

[0034] The dry guard cleaner 12 has a suction head 120. As shown in FIG. 6, the upper part of the suction head 120 is finished with a substantially V-shaped cross section in the YZ plane so as to cover the peripheral atmosphere SA of the tip (lower end) of the nozzle guard NG positioned at the guard cleaning position Pgc from below. This substantially V-shaped portion 120b corresponds to an example of the "atmosphere facing portion" of the present invention. In FIG. 6, dots are added to visually clarify the peripheral atmosphere SA.

[0035] This suction head 120 is provided so as to be movable along the nozzle guard NG in the longitudinal direction X of the nozzle guard NG while facing the peripheral atmosphere SA of the nozzle guard NG from below. Further, a groove extending in the X direction is formed at the central part of the upper part of the suction head 120. A plurality of suction ports are provided in this groove. Further, the suction head 120 is connected to a head moving part 120h. Further, a suction part 120a is connected to the suction head 120. Therefore, by operating the head moving part 120h and the suction part 120a according to a command from the control part 10, the suction head 120 moves in the longitudinal direction X of the nozzle guard NG while sucking the peripheral atmosphere SA of the nozzle guard NG. That is, the suction head 120 moves in the X direction along the tip of the nozzle guard NG while applying a negative pressure to the tip of the nozzle guard NG. For example, as shown in FIG. 6, the foreign matter F is sucked and removed from the nozzle guard NG by the suction head 120 passing through the position where the foreign matter F is attached (foreign matter removal process).

[0036] Such foreign object removal processing is executed at timings such as when the coating apparatus 1A is started up, after each coating process is completed, after the coating process has been executed a preset number of times, and when a nozzle cleaning request is received from the user (hereinafter referred to as "foreign object removal timing"). Further, in the present embodiment, the control unit 10 controls each part of the apparatus to move the slit nozzle 2 to the nozzle cleaning unit 9 to perform nozzle cleaning processing. By this movement, the nozzle guard NG is positioned at the dry guard cleaner 12. Therefore, it is possible to perform the foreign object removal processing in parallel with the nozzle cleaning processing. Note that, in the present embodiment, the timing at which the foreign object detection unit 8 detects the foreign object F is also included in the above-described foreign object removal timing.

[0037] In order to control each part of the coating apparatus 1A configured as described above, the control unit 10 is provided as described above. This control unit 10 has a configuration of a general computer system in which an arithmetic unit (for example, a CPU, etc.) that performs various arithmetic processes and a storage unit (for example, a ROM, a RAM, etc.) that stores a basic program and various information are connected to a bus line. The bus line is further connected to a fixed disk (for example, a hard disk drive, etc.) that stores a coating program and the like, a display unit (for example, a display, etc.) that displays various information, and an input unit (for example, a keyboard and a mouse, etc.) that receives an input from an operator. Note that, for example, a touch panel display in which the functions of the display unit and the input unit are integrated may be used. Further, the control unit 10 receives signals sent from sensors and the like provided in each part of the apparatus via an interface (not shown), and the arithmetic unit of the control unit 10 controls each part of the apparatus according to the basic program and executes the coating process described below.

[0038] FIG. 7 is a flowchart showing the coating operation executed by the coating apparatus shown in FIG. 1. In this coating apparatus 1A, after the slit nozzle 2 used for the coating process moves to the pre-dispense position Ppd, a pre-discharge process is executed (step S11). Also, in parallel with the pre-discharge process, a foreign object detection process is executed. That is, the tip of the nozzle guard NG enters between the light projector 81 and the light receiver 82 and blocks a part of the parallel light beam traveling from the light projector 81 to the light receiver 82. The light reception amount information corresponding to the light blocking situation at this time is given to the control unit 10. Such an operation is executed corresponding to the movement of the foreign object detection unit 8 in the X direction, and as shown in FIG. 4, the light reception amount information at the sensor positions P(X1),..., P(Xn),..., P(Xmax) is sequentially acquired and temporarily stored in the storage unit of the control unit 10.

[0039] Based on the light reception amount information thus obtained, the arithmetic unit of the control unit 10 determines whether a foreign object F (FIG. 4) is attached to the nozzle guard NG (step S12). Then, when foreign object attachment to the nozzle guard NG is detected (in step S12, "NO"), the arithmetic unit of the control unit 10 determines that the foreign object removal timing has been reached, and executes a foreign object removal operation (steps S13 to S15). That is, the coating process is interrupted in step S13. Subsequently to regulating the coating operation in this way, the arithmetic unit of the control unit 10 controls each part of the dry guard cleaner 12 while keeping the coating operation regulated, and executes a dry guard cleaning process for the nozzle guard NG (step S14). More specifically, as shown in FIGS. 5 and 6, the suction head 120 moves in the X direction along the tip of the nozzle guard NG while sucking the ambient atmosphere SA around the nozzle guard NG. Thereby, the foreign object F is suction-removed. Then, when the arithmetic unit of the control unit 10 confirms the completion of the guard cleaning process (in step S15, "YES"), the foreign object removal operation is terminated, and the control unit 10 returns to step S11 and the pre-discharge operation and the foreign object detection operation are repeated.

[0040] When it is detected that no foreign matter F is attached to the nozzle guard NG (i.e., "YES" in step S12), the coating process is executed as follows (steps S16 to S24). The substrate 3 is loaded into the coating apparatus 1A (step S16). More specifically, after the substrate 3 is placed on the holding surface 41 of the stage 4, it is sucked and held.

[0041] In parallel with this, with a clean resist solution adhering near the discharge port 21 by the preliminary discharge process, the slit nozzle 2 is moved from the pre-dispense position Ppd to a position above the coating start position Pst (step S17). Subsequently, the descent of the slit nozzle 2 is started. Then, the resist solution adhering near the discharge port 21 of the slit nozzle 2 comes into contact with the surface 31 of the substrate 3 at the coating start position Ps. As a result, a meniscus of the resist solution is formed on the surface 31 of the substrate 3 at the coating start position Pst. In response to the meniscus formation, the descent of the slit nozzle 2 is continued. Subsequently, the slit nozzle 2 rises by a distance corresponding to the thickness of the resist solution to adjust the distance between the discharge port 21 and the surface 31 of the substrate 3, i.e., the so-called coating gap (step S18).

[0042] Following the adjustment of the above coating gap, the coating operation is started (step S19). That is, while the slit nozzle 2 moves in the (+Y) direction, the resist solution is discharged from its discharge port 21. As a result, a coating operation in which the slit nozzle 2 applies the resist solution to the surface 31 of the substrate 3 is executed, and a coating film of a certain thickness is formed on the surface 31 of the substrate 3 by the resist solution. Thus, in the present embodiment, the (+Y) direction corresponds to the "relative movement direction" of the present invention.

[0043] The coating operation continues until the substrate 3 is conveyed to the coating end position Pen where the coating should be completed (step S20). When the substrate 3 reaches the coating end position Pen ( "YES" in step S20), the ejection of the resist liquid from the slit nozzle 2 is stopped. Thereby, the coating operation is terminated (step S21). Further, the slit nozzle 2 is detached from the coating end position Pen and returned to the pre-dispense position (step S22). In parallel with the movement of the slit nozzle 2 to the pre-dispense position, the adsorption and holding release of the substrate 3 and the substrate unloading are executed (step S23). And when there is a next substrate 3 to be processed ( "YES" in step S24), the process returns to step S11 and the same process as above is repeated. On the other hand, if there is no next substrate 3 ( "NO" in step S24), the process is terminated.

[0044] As described above, according to the first embodiment, since so-called dry foreign matter removal in which foreign matter removal is performed without using a liquid component is used, the foreign matter F attached to the nozzle guard NG can be effectively removed without leaving a liquid component, and stable and high-quality production is possible.

[0045] Also, when foreign matter adhesion to the nozzle guard NG is detected, immediately, the dry guard cleaning process (removal process) of the nozzle guard NG by the dry guard cleaner 12 is executed (step S14). Therefore, the interruption of the coating process due to foreign matter adhesion to the nozzle guard NG can be eliminated in a short time, and the coating process that is not affected by the foreign matter F can be restarted. As a result, the operating rate of the coating apparatus 1A can be increased.

[0046] Also, when the dry cleaning (removal process) of the nozzle guard NG is performed, the nozzle guard NG is positioned at the guard cleaning position Pgc, and the slit nozzle 2 is positioned at the nozzle cleaning position Pnc corresponding to the scraper (contact member) 91. Therefore, cleaning of the slit nozzle 2 by the nozzle cleaning unit 9 may be executed in parallel with the dry cleaning of the nozzle guard NG. Thereby, the tact time can be shortened compared to performing the dry cleaning of the nozzle guard NG and the cleaning of the slit nozzle 2 separately.

[0047] Also, since foreign object adhesion to the nozzle guard NG is detected before the coating process is executed, it is possible to prevent the coating process from being executed while the foreign object F adheres to the nozzle guard NG. Therefore, defects due to contact between the substrate 3 and the foreign object F can be reliably prevented, and the coating process can be performed with high quality.

[0048] Also, the execution timing of the foreign object detection process is basically arbitrary as long as it is before the coating process for the next substrate. However, in the present embodiment, in the Y direction, by making the distance D1 between the discharge port 21 of the slit nozzle 2 and the nozzle guard NG and the distance D2 between the pre-dispense roller 72 and the foreign object detection unit 8 coincide, the foreign object detection process and the pre-discharge process are performed in parallel. As described above, in the present embodiment, a new configuration of combining the foreign object detection process with a coating apparatus that performs a conventionally well-known pre-discharge process is adopted, but the cycle time does not increase by the tact time required for the foreign object detection process with the addition of the foreign object detection process. As in the above-described embodiment, by completing the foreign object detection process while the pre-discharge process is being performed, it is possible to obtain the above-described operational effects without changing the cycle time. Also, even if the foreign object detection process extends before and after the pre-discharge process, it is possible to obtain the above-described operational effects while suppressing an increase in the cycle time by performing the foreign object detection process partially in parallel with the pre-discharge process.

[0049] Also, in the present embodiment, as shown in FIG. 2, the foreign object detection unit 8 is arranged using the space existing between the nozzle cleaning standby unit 7 and the nozzle cleaning unit 9. Therefore, by effectively using the above space, it is possible to add a new foreign object detection unit 8 while suppressing an increase in the apparatus size.

[0050] Furthermore, in the present embodiment, foreign objects are detected based on the light-shielding state of parallel light beams. That is, since foreign object detection is performed by an example of a non-contact method, foreign object detection can be performed without damaging the nozzle guard NG. As this non-contact method of foreign object detection, a foreign object detection method, for example, an in-line projection image measuring instrument TM-X5000 series manufactured by Keyence Corporation, a line scan camera, or the like may be adopted.

[0051] By the way, in the first embodiment, the foreign object detection unit 8 is provided, and the foreign object removal process is executed using the detection of the foreign object F by the foreign object detection unit 8 as a trigger. However, the installation of the foreign object detection unit 8 is not an essential component but an optional component. Therefore, for example, as shown in FIG. 8, a dry guard cleaner 12 may be arranged at the position of the foreign object detection unit 8 (second embodiment).

[0052] FIG. 8 is a side view schematically showing the overall configuration of a coating apparatus which is a second embodiment of a substrate processing apparatus according to the present invention. The significant difference between this second embodiment and the first embodiment is that the foreign object detection unit 8 is not provided, and the dry guard cleaner 12 is arranged using the space existing between the nozzle cleaning standby unit 7 and the nozzle cleaning unit 9. Since other configurations are the same as those in the first embodiment, the same reference numerals are given to the same configurations and the configuration description is omitted.

[0053] In the second embodiment, the dry guard cleaner 12 is disposed at a guard cleaning position Pgc that is separated from the pre-dispense roller 72 by a distance D4 in the (+Y) direction. More specifically, as shown in FIG. 8, this distance D4 is the same as the distance D1 from the discharge port 21 of the slit nozzle 2 in the Y direction to the nozzle guard NG. Therefore, in order to perform the pre-discharge process, when the slit nozzle 2 is positioned at the pre-dispense position Ppd corresponding to the pre-dispense roller 72, the tip of the nozzle guard NG is positioned at the dry guard cleaner 12, and the dry guard cleaning process can be executed in parallel with the pre-discharge process. However, since the frequency at which the dry guard cleaning process should be executed is lower than that of the pre-discharge process, in this embodiment, the arithmetic unit of the control unit 10 controls the execution of both as described below according to whether the foreign matter removal timing has been reached.

[0054] FIG. 9 is a flowchart showing the coating operation executed by the coating apparatus shown in FIG. 8. In this coating apparatus 1A, after the slit nozzle 2 used for the coating process moves to the pre-dispense position Ppd, the arithmetic unit determines whether it is the foreign matter removal timing (step S31). Then, when it is determined that it is the foreign matter removal timing (''YES'' in step S31), the pre-discharge process and the guard cleaning process are executed in parallel (step S32), and then the coating process is started. On the other hand, when it is determined that it is not the foreign matter removal timing (''NO'' in step S31), only the pre-discharge process is executed (step S33), and then the coating process is started.

[0055] The coating process is executed in the same manner as in the first embodiment (steps S16 to S23). Then, when there is a next substrate 3 to be processed (''YES'' in step S24), the process returns to step S31 and the same process as described above is repeated. On the other hand, if there is no next substrate 3 (''NO'' in step S24), the process ends.

[0056] As described above, according to the second embodiment, the dry guard cleaning process is executed at the timing when foreign matter removal is considered necessary, that is, at the foreign matter removal timing. Therefore, the same operational effects as those of the first embodiment can be obtained.

[0057] Also, the execution timing of the guard cleaning process is basically arbitrary as long as it is before the coating process for the next substrate. However, in this embodiment, in the Y direction, by making the distance D1 between the discharge port 21 of the slit nozzle 2 and the nozzle guard NG coincide with the distance D4 between the pre-dispense roller 72 and the dry guard cleaner 12, the guard cleaning process and the pre-discharge process are performed in parallel. Here, if both processes are sequentially performed in step S32, the cycle time becomes longer than the cycle time when only the pre-discharge process is performed. In contrast, in this embodiment, by completing the guard cleaning process while the pre-discharge process is being performed, it is possible to obtain the above-described operational effects without changing the cycle time. Also, even if the guard cleaning process protrudes before and after the pre-discharge process in step S32, by performing the guard cleaning process partially in parallel with the pre-discharge process, it is possible to obtain the above-described operational effects while suppressing an increase in the cycle time.

[0058] FIG. 10 is a side view schematically showing the overall configuration of a coating apparatus which is a third embodiment of a substrate processing apparatus according to the present invention. The main differences between this third embodiment and the first embodiment are that the foreign matter detection unit 8 is not provided, and accordingly, the nozzle cleaning unit 9 and the dry guard cleaner 12 are shift-arranged in the (-Y) direction while being separated by the distance D3 to reduce the size of the apparatus. Since the other configurations are the same as those of the first embodiment, the same reference numerals are given to the same configurations and the configuration description is omitted.

[0059] In this third embodiment, at the foreign matter removal timing, the guard cleaning process by the dry guard cleaner 12 is executed. At this time, the nozzle guard NG is located at the guard cleaning position Pgc, and at the same time, the slit nozzle 2 is positioned at the nozzle cleaning position Pnc. Therefore, the nozzle cleaning process may be performed in parallel with the guard cleaning process of the nozzle guard NG.

[0060] As described above, according to the third embodiment, since the dry guard cleaning process is executed at the foreign matter removal timing, the same operational effects as those of the first embodiment can be obtained.

[0061] FIG. 11 is a diagram schematically showing the configuration and operation of a foreign matter removal unit provided in a coating apparatus which is a fourth embodiment of a substrate processing apparatus according to the present invention. The main difference between this fourth embodiment and the first embodiment lies in the structure of the dry guard cleaner 12. In the first embodiment, in the X direction, the suction head 120 is finished to be shorter than the nozzle guard NG, and by moving the suction head 120 in the X direction, the foreign matter F is suction-removed from the entire nozzle guard NG. On the other hand, in the fourth embodiment, the length of the suction head 120 in the X direction is the same as or longer than that of the nozzle guard NG, and a substantially V-shaped portion 120b extends in the X direction over the entire suction head 120. The substantially V-shaped portion 120b corresponds to an example of the "atmosphere facing portion" of the present invention, and it is possible to entirely cover the peripheral atmosphere SA (FIG. 6) of the tip (lower end portion) of the nozzle guard NG from the lower side. This suction head 120 is fixedly arranged at the guard cleaning position Pgc. Since the other configurations are the same as those of the first embodiment, the same reference numerals are given to the same configurations and the configuration description is omitted.

[0062] In the fourth embodiment, as shown by the dashed line in the figure, when the slit nozzle 2 and the nozzle guard NG are integrally moved in the (+Y) direction and the nozzle guard NG is positioned at the guard cleaning position Pgc, the entire peripheral atmosphere of the tip of the nozzle guard NG is covered from below by the substantially V-shaped portion 120b. In this state, when the suction unit 120a operates in response to a command from the control unit 10, the entire peripheral atmosphere becomes a negative pressure, and the foreign matter F attached to the tip of the nozzle guard NG is collectively sucked and removed by the suction unit 120a.

[0063] FIGS. 12A and 12B are diagrams schematically showing the configuration and operation of a foreign matter removal unit provided in a coating apparatus which is a fifth embodiment of a substrate processing apparatus according to the present invention. The fifth embodiment is significantly different from the fourth embodiment in that a brush member 120c is added to the upper surface of the suction head 120 and that brush cleaning using the brush member 120c is used in combination. Since the other configurations are the same as those in the fourth embodiment, the same reference numerals are given to the same configurations and the configuration description is omitted.

[0064] In this embodiment, brush members 120c and 120c are erected toward the nozzle guard NG at the (+Y)-direction side end and the (-Y)-direction side end of the substantially V-shaped portion 120b on the upper surface of the suction head 120. Then, as shown by the dashed line in FIG. 12A, when the slit nozzle 2 and the nozzle guard NG are integrally moved in the (+Y) direction and the nozzle guard NG is positioned at the guard cleaning position Pgc, the entire peripheral atmosphere of the tip of the nozzle guard NG is covered from below by the substantially V-shaped portion 120b. At the same time, in the Z direction, the tops of the brush members 120c and 120c are positioned so as to overlap the tip of the nozzle guard NG. In this state, the slit nozzle 2 and the nozzle guard NG swing integrally in the Y direction in response to a swing command from the control unit 10 (see reference numeral AR in FIG. 12B). At this time, the tips of the brush members 120c and 120c rub against the tip of the nozzle guard NG, and brush cleaning is performed. As a result, foreign matter F is peeled off from the nozzle guard NG. Also, in parallel with this brush cleaning, the suction unit 120a operates in response to a command from the control unit 10, and the foreign matter F is collectively sucked and removed by the suction unit 120a. Therefore, the foreign matter F peeled off from the nozzle guard NG by the brush cleaning can be surely sucked and removed, and it is possible to surely prevent the foreign matter F from scattering around the guard cleaning position Pgc.

[0065] As described above, according to the fifth embodiment, similar to the first embodiment, foreign matter F adhering to the nozzle guard NG is removed in a so-called dry method, and the same operational effects as those of the first embodiment can be obtained. Also, the brush members 120c and 120c are in contact with the foreign matter F adhering to the nozzle guard NG and are peeled off from the nozzle guard NG. That is, by using brush cleaning and suction cleaning in combination, the foreign matter removal effect can be enhanced.

[0066] In the fifth embodiment, the brush members 120c are provided on both the front side and the rear side with respect to the substantially V-shaped portion 120b in the relative movement direction Y, but only one of them may be provided.

[0067] Incidentally, in the above-described first to fifth embodiments, the present invention is applied to a coating apparatus 1A in which the slit nozzle 2 moves relative to the substrate 3 to apply a resist solution (processing solution). However, as described in Patent Document 2, the present invention can also be applied to a coating apparatus in which the substrate moves relative to a slit nozzle fixedly arranged to apply a resist solution (processing solution). Hereinafter, a fifth embodiment of the present invention will be described with reference to FIG. 13.

[0068] FIG. 13 is a diagram schematically showing the overall configuration of a coating apparatus which is a sixth embodiment of a substrate processing apparatus according to the present invention. This coating apparatus 1B is a slit coater that applies a resist solution (processing solution) to the surface 31 of a substrate 3 conveyed in a horizontal posture from the left hand side to the right hand side in FIG. 13. In FIG. 13, in order to clarify the arrangement relationship of each part of the apparatus, right-handed XYZ orthogonal coordinates are set as shown in the figure. The conveyance direction of the substrate 3 is defined as the "X direction", the horizontal direction from the left hand side to the right hand side in FIG. 13 is referred to as the "+X direction", and the opposite direction is referred to as the "-X direction". Further, among the horizontal directions Y orthogonal to the X direction, the front side of the apparatus (the front side in the figure) is referred to as the "-Y direction", and the back side of the apparatus is referred to as the "+Y direction". Furthermore, the upward and downward directions in the vertical direction Z are referred to as the "+Z direction" and the "-Z direction", respectively.

[0069] In the coating apparatus 1B, along the conveyance direction Dt of the substrate 3, that is, the (+X direction), an input conveyor 100, an input transfer unit 200, a floating unit 300, an output transfer unit 400, and an output conveyor 110 are arranged in this order in proximity. As will be described in detail below, a conveyance path of the substrate 3 extending in a substantially horizontal direction is formed by these components.

[0070] The substrate 3 to be processed is carried into the input conveyor 100 from the left side in FIG. 13. The input conveyor 100 includes a roller conveyor 101 and a rotation drive mechanism 102 for rotationally driving the same. By the rotation of the roller conveyor 101, the substrate 3 is conveyed in the downstream direction, that is, in the (+X) direction, in a horizontal posture. The input transfer unit 200 includes a roller conveyor 221 and a rotation / elevation drive mechanism 222 having a function of rotationally driving the same and a function of elevating the same. By the rotation of the roller conveyor 221, the substrate 3 is further conveyed in the (+X) direction. Also, by the elevation of the roller conveyor 221, the vertical position of the substrate 3 is changed. By the input transfer unit 200 configured as described above, the substrate 3 is transferred from the input conveyor 100 to the floating unit 300.

[0071] The floating unit 300 has an upstream floating stage 301, a central floating stage 302, and a downstream floating stage 303. Both the upstream floating stage 301 and the downstream floating stage 303 are formed such that a large number of air ejection holes are dispersed in a matrix over the entire surface of a single plate-shaped stage surface. Then, by supplying compressed air to each ejection hole, the substrate 3 is floated by the gas flow caused by the ejection of compressed air from each ejection hole. As a result, in the upstream floating stage 301 and the downstream floating stage 303, the substrate 3 floats by a predetermined floating height, for example, 10 to 500 micrometers, from the stage surface. In order to supply compressed air to each ejection hole, as shown in FIG. 13, a floating control mechanism 335 is provided.

[0072] Further, the downstream floating stage 303 has a plurality of lift pins in addition to the ejection holes. Also, a lift pin drive mechanism 334 is provided to raise and lower the lift pins. The plurality of lift pins are provided so as to be able to face the entire back surface of the substrate 3 at a predetermined interval, sewing between the ejection holes. Then, the lift pins are driven to move up and down in the vertical direction (Z-axis direction) by the lift pin drive mechanism 334 installed below the stage surface. That is, when descending, the tip of the lift pin descends to the (-Z) direction side from the stage surface of the downstream floating stage 303, and when ascending, the tip of the lift pin ascends to the position where the substrate 3 is delivered to a transfer robot (not shown). Since the lower surface of the substrate 3 is supported and lifted by the lift pins thus raised, the substrate 3 rises from the stage surface of the downstream floating stage 303. As a result, the unloading of the substrate 3 from the coating apparatus 1B by the transfer robot becomes possible.

[0073] On the one hand, the central floating stage 302 is configured as follows and has a higher floating accuracy than the upstream floating stage 301 and the downstream floating stage 303. That is, the central floating stage 302 has a rectangular plate-shaped stage surface. A plurality of holes are dispersed in a matrix pattern on this stage surface at a pitch narrower than the ejection holes provided in the upstream floating stage 301 and the downstream floating stage 303. Also, unlike the upstream floating stage 301 and the downstream floating stage 303, in the central floating stage 302, half of the holes function as ejection holes for compressed air, and the remaining half function as suction holes. That is, compressed air is ejected from the ejection holes toward the back surface of the substrate 3 to send the compressed air into the space between the stage surface and the back surface of the substrate 3. On the other hand, it is configured to suck air from the space through the suction holes. By ejecting and sucking air with respect to the above space in this way, in the above space, the gas flow of the compressed air ejected from each ejection hole spreads in the horizontal direction and is then sucked from the suction hole adjacent to the ejection hole. The pressure balance in the air layer (pressure gas layer) spreading in the above space becomes more stable, and the floating height of the substrate 3 can be controlled with high precision and stably. Note that the supply of compressed air to each ejection hole and the suction of air from the suction holes are controlled by the floating control mechanism 335.

[0074] The substrate 3 carried into the floating unit 300 via the input transfer unit 200 is given a propulsive force in the (+X) direction by the rotation of the roller conveyor 221 and is conveyed onto the upstream floating stage 301. The upstream floating stage 301, the central floating stage 302, and the downstream floating stage 303 support the substrate 3 in a floating state but do not have the function of moving the substrate 3 in the horizontal direction. The conveyance of the substrate 3 in the floating unit 300 is performed by a substrate conveyance unit 500 disposed below the upstream floating stage 301, the central floating stage 302, and the downstream floating stage 303.

[0075] The substrate transfer unit 500 includes a chuck mechanism 551 that supports the substrate 3 from below by partially contacting the peripheral portion of the lower surface of the substrate 3, and a suction / drive control mechanism 552 that applies negative pressure to a suction pad (not shown) provided on the suction member at the upper end of the chuck mechanism 551 to suck and hold the substrate 3 and has a function of reciprocating the chuck mechanism 551 in the X direction. When the chuck mechanism 551 holds the substrate 3, the back surface of the substrate 3 is positioned higher than the surface of each stage of the floating portion 300. Therefore, the substrate 3 maintains a horizontal posture as a whole by the buoyancy applied from the floating portion 300 while the peripheral portion is sucked and held by the chuck mechanism 551. In addition, a sensor SN for measuring the plate thickness is arranged near the roller conveyor 221 in order to detect the vertical position of the surface of the substrate 3 at the stage when the back surface of the substrate 3 is partially held by the chuck mechanism 551. By positioning a chuck (not shown) that does not hold the substrate 3 directly below this sensor SN, the sensor SN can detect the vertical position of the surface of the suction member, that is, the suction surface.

[0076] The chuck mechanism 551 holds the substrate 3 carried into the floating portion 300 from the input transfer unit 200. In this state, when the chuck mechanism 551 moves in the (+X) direction, the substrate 3 is conveyed from above the upstream floating stage 301, via above the central floating stage 302, to above the downstream floating stage 303. The conveyed substrate 3 is delivered to the output transfer unit 400 arranged on the (+X) side of the downstream floating stage 303.

[0077] The output transfer unit 400 includes a roller conveyor 441 and a rotation / lift drive mechanism 442 that has a function of rotationally driving the roller conveyor 441 and a function of lifting it. By rotating the roller conveyor 441, a propulsive force in the (+X) direction is applied to the substrate 3, and the substrate 3 is further conveyed along the conveyance direction Dt. Also, by lifting the roller conveyor 441, the vertical position of the substrate 3 is changed. By the output transfer unit 400, the substrate 3 is transferred from above the downstream floating stage 303 to the output conveyor 110.

[0078] The output conveyor 110 includes a roller conveyor 111 and a rotary drive mechanism 112 that rotationally drives the roller conveyor 111. By the rotation of the roller conveyor 111, the substrate 3 is further conveyed in the (+X) direction and finally discharged out of the coating apparatus 1B. Note that the input conveyor 100 and the output conveyor 110 may be provided as a part of the configuration of the coating apparatus 1B, or may be separate from the coating apparatus 1B. For example, a substrate discharge mechanism of a separate unit provided upstream of the coating apparatus 1B may be used as the input conveyor 100. Also, a substrate receiving mechanism of a separate unit provided downstream of the coating apparatus 1B may be used as the output conveyor 110.

[0079] On the conveyance path of the substrate 3 conveyed as described above, a coating mechanism 700 for applying a resist solution to the surface 31 of the substrate 3 is arranged. The coating mechanism 700 has a slit nozzle 2 having the same configuration as that of the first embodiment. Also, as shown in FIG. 13, a nozzle drive mechanism 800 is connected to the slit nozzle 2, and the slit nozzle 2 is positioned at a coating position above the central floating stage 302 (the position shown by the solid line in FIG. 13), an upper position away from the coating position upward, or a maintenance position by the nozzle drive mechanism 800. Further, a coating liquid supply mechanism (not shown) is connected to the slit nozzle 2, and a resist solution is supplied from the coating liquid supply mechanism, and the resist solution is discharged as a processing liquid from a discharge port 21 that opens downward at the lower part of the nozzle.

[0080] This slit nozzle 2 has its discharge port 21 extending in the Y direction and is supported by a nozzle support portion (not shown) so that a resist liquid can be discharged vertically downward (-Z side). The nozzle support portion is connected to a nozzle drive mechanism 800. In particular, when supplying the resist liquid to the surface 31 of the substrate 3 by the slit nozzle 2, as shown by the one-dot chain line in FIG. 4, after the discharge port 21 is moved to a position above the coating position, the slit nozzle 2 descends until the distance (gap) between the discharge port 21 and the substrate 3 reaches a predetermined value. Thereby, the slit nozzle 2 is positioned at the coating position. Thereafter, while discharging the resist liquid from the discharge port 21 toward the surface 31 of the substrate 3 in this positioned state, the substrate 3 is conveyed in the (+X) direction. That is, the slit nozzle 2 moves relative to the substrate 3 in the (-X) direction to perform a coating process. That is, in the present embodiment, the (-X) direction corresponds to the "relative movement direction" of the present invention. Further, a nozzle guard NG is attached to the front side in the relative movement direction (-X) of the slit nozzle 2.

[0081] In order to perform predetermined maintenance on the slit nozzle 2 configured as described above, as shown in FIG. 13, the coating mechanism 700 is provided with a nozzle maintenance unit 6 having the same configuration as that of the first embodiment. That is, a nozzle cleaning standby unit 7 for performing so-called pre-dispensing, a foreign matter detection unit 8 for detecting the attachment of foreign matter to the nozzle guard NG, a nozzle cleaning unit 9 for cleaning the slit nozzle 2, and a dry guard cleaner 12 which is an example of the "foreign matter removal unit" of the present invention. These are arranged in this order along the relative movement direction (-X). And, similar to the first embodiment, before the coating process, the control unit 10 determines whether or not foreign matter (reference numeral F in FIG. 4) is attached to the nozzle guard NG. As a result of this determination, if it is determined that foreign matter is attached to the nozzle guard NG, the control unit 10 restricts the coating process and then immediately executes a dry guard cleaning process for the foreign matter F by the dry guard cleaner 12.

[0082] As described above, also in the sixth embodiment, similar to the first embodiment, foreign matter adhesion to the nozzle guard NG is detected before the coating process is executed. For this reason, the same operational effects as those of the first embodiment, such as preventing the coating process from being executed while the foreign matter F adheres to the nozzle guard NG, can be obtained.

[0083] As described above, in the sixth embodiment, the suction and travel control mechanism 552 corresponds to an example of the "nozzle moving part" of the present invention.

[0084] Note that the present invention is not limited to the above-described embodiments, and various modifications other than those described above can be made without departing from the spirit thereof. For example, in the sixth embodiment, the present invention is applied to a so-called floating type substrate processing apparatus, but the dry guard cleaner 12 provided in the fourth and fifth embodiments may be applied as the foreign matter removing part.

Industrial Applicability

[0085] This invention is applicable to the entire substrate processing technology of supplying and coating a processing liquid from a slit nozzle to a substrate in a state where a nozzle guard is arranged on the front side of the slit nozzle that relatively moves with respect to the substrate.

Explanation of Signs

[0086] 1A, 1B... Coating apparatus (substrate processing apparatus) 2... Slit nozzle 3... Substrate 7... Nozzle cleaning standby part (preliminary discharge part) 9... Nozzle cleaning part (nozzle cleaning part) 10... Control part 12... Dry guard cleaner (foreign matter removing part) 21... Discharge port (of the slit nozzle) 31... Surface (of the substrate) 53... Nozzle moving part 120... Suction head 120a... Suction part 120b... Substantially V-shaped part (atmosphere facing part) 120c... Brush member 552…Suction and Travel Control Mechanism (Nozzle Movement Section) D1…Distance (from the slit nozzle to the nozzle guard) D3…Distance (from the nozzle cleaning section to the foreign matter removal section) D4…Distance (from the preliminary discharge section to the foreign matter removal section) F…Foreign Matter NG…Nozzle Guard SA…Surrounding Atmosphere (of the nozzle guard)

Claims

1. A substrate processing apparatus for applying a processing liquid to the surface of a substrate, comprising: a slit nozzle having a slit-shaped discharge port for discharging the processing liquid; a nozzle moving unit that moves the slit nozzle, with the discharge port facing downward, relative to the substrate in a direction along the surface of the substrate above the substrate; a plate-shaped nozzle guard provided on the front side of the slit nozzle in the relative movement direction in which the slit nozzle moves relative to the substrate by the nozzle moving unit during application of the processing liquid, and moving integrally with the slit nozzle; a foreign matter removing unit that sucks the ambient atmosphere around the nozzle guard to remove foreign matter adhering to the nozzle guard from the nozzle guard; A substrate processing apparatus characterized by comprising the above.

2. The substrate processing apparatus according to claim 1, wherein the foreign matter removing unit includes: a suction head movably provided along the longitudinal direction of the nozzle guard while facing the ambient atmosphere around the nozzle guard from below; a suction unit that sucks the ambient atmosphere around the nozzle guard through the suction head; a head moving unit that moves the suction head in the longitudinal direction of the nozzle guard while the ambient atmosphere around the nozzle guard is being sucked by the suction unit; A substrate processing apparatus having the above.

3. The substrate processing apparatus according to claim 1, wherein the foreign matter removing unit includes: a suction head provided to face the entire ambient atmosphere around the nozzle guard positioned at a preset guard cleaning position in the longitudinal direction of the nozzle guard from below; a suction unit that sucks the entire ambient atmosphere around the nozzle guard through the suction head; A substrate processing apparatus having the above.

4. The substrate processing apparatus according to claim 3, wherein the suction head includes: an atmosphere facing portion facing the entire ambient atmosphere around the nozzle guard positioned at the guard cleaning position; a brush member erected toward the nozzle guard on at least one of the front side and the rear side of the atmosphere facing portion in the relative movement direction; and has the slit nozzle and the nozzle guard move relative to the brush member in the relative movement direction such that the brush member and the nozzle guard are in sliding contact with each other, thereby sweeping foreign matter from the nozzle guard toward the atmosphere facing portion.

5. A substrate processing apparatus according to any one of claims 1 to 4, a preliminary discharge unit that discharges a preset amount of the processing liquid from the discharge port of the slit nozzle at a preliminary discharge position away from the substrate and waits before discharging the processing liquid from the discharge port of the slit nozzle toward the surface of the substrate; a control unit that controls the preliminary discharge unit and the foreign matter removal unit; comprising: the foreign matter removal unit is provided at a position separated from the preliminary discharge unit by the same distance as the distance from the slit nozzle to the nozzle guard on the front side of the preliminary discharge unit in the relative movement direction; the control unit controls the preliminary discharge unit and the foreign matter removal unit so that the discharge or standby of the processing liquid in the preliminary discharge unit and the removal of the foreign matter in the foreign matter removal unit are performed at least partially in parallel. A substrate processing apparatus.

6. A substrate processing apparatus according to any one of claims 1 to 4, a nozzle cleaning unit that cleans the slit nozzle; a control unit that controls the nozzle cleaning unit and the foreign matter removal unit; comprising: the foreign matter removal unit is provided at a position separated from the nozzle cleaning unit by the same distance as the distance from the slit nozzle to the nozzle guard on the front side of the nozzle cleaning unit in the relative movement direction; the control unit controls the nozzle cleaning unit and the foreign matter removal unit so that the cleaning of the slit nozzle by the nozzle cleaning unit and the removal of the foreign matter by the foreign matter removal unit are performed at least partially in parallel. A substrate processing apparatus.

7. A coating step of applying the processing liquid to the surface of the substrate while relatively moving the slit nozzle and the plate-shaped nozzle guard with respect to the substrate while discharging the processing liquid from the discharge port of the slit nozzle in a state where the discharge port of the slit nozzle is close to the surface of the substrate, and preventing foreign matter from adhering to the slit nozzle by the nozzle guard provided on the front side of the slit nozzle in the relative movement direction in which the slit nozzle relatively moves; a removal step of sucking the ambient atmosphere around the nozzle guard and removing foreign matter adhering to the nozzle guard from the nozzle guard before the coating step; A substrate processing method characterized by comprising:

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