Vertical type surface grinder

Abstract

To achieve both high output of a motor, and compactification of a column and an index table.SOLUTION: A vertical type surface grinder 1 includes a column 5 which is arranged so as to straddle the upper side of an index table 2. The column 5 has a lateral side part 51 extending in the arrangement direction of first and second positions P1 and P2, and a vertical side part 52 extending vertical to the lateral side part 51, in plan view, and is supported from below by both ends of the lateral side part 51 and at least one end of the vertical side part. The first and second grinding mechanisms 6 and 7 are supported by the lateral side part 51 and the vertical side part 52 so as to bridge the lateral side part 51 and the vertical side part 52, and feeding mechanisms 62 and 72 of the first and second grinding mechanisms 6 and 7 are positioned at corner parts 53 and 54 where the lateral side part 51 and the vertical side part 52 cross each other.SELECTED DRAWING: Figure 5B

Description

[Technical Field]

[0001] The present disclosure relates to a vertical surface grinding machine. [Background technology]

[0002] Patent Document 1 discloses a processing device as an example of a vertical surface grinding machine. Specifically, the processing device disclosed in Patent Document 1 includes an index table, a column, a rough grinding means, and a fine grinding means.

[0003] Here, the index table is provided with at least a rough grinding stage and a fine grinding stage, and moves the wafer from the rough grinding stage to the fine grinding stage. The column is provided so as to straddle above the rough grinding stage and the fine grinding stage. The rough grinding means is provided on the column above the rough grinding stage and performs rough grinding of the wafer. The fine grinding means is provided on the column above the fine grinding stage and performs fine grinding of the wafer.

[0004] According to Patent Document 1, the column has a gate shape that straddles the rough grinding stage and the fine grinding stage, and the rough grinding means and the fine grinding means are arranged side by side along the gate shape.

[0005] According to Patent Document 1, rough grinding and fine grinding of wafers can be performed continuously with high quality while suppressing axial tilt of the rough grinding means and fine grinding means caused by normal forces generated during grinding. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] International Publication No. 2017 / 094646 Summary of the Invention [Problem to be solved by the invention]

[0007] By the way, when a semiconductor member such as a wafer is used as a grinding target (workpiece), it is required to rotate the grindstone with a higher-output motor. Usually, a higher-output motor is larger and heavier than a lower-output motor.

[0008] At this time, as described in Patent Document 1, if the rough grinding means and the finish grinding means are arranged side by side, a large and heavy motor as described above will also be arranged side by side. Therefore, it may cause the column to become larger in the arrangement direction. The enlargement of the column may also cause the large pitch of the chuck located below it, and thus the enlargement of the index table.

[0009] However, the column described in Patent Document 1 is supported at both ends of the portal shape, that is, at two points. If a large and heavy motor is suspended there, it may cause distortion of the column or collapse of the column.

[0010] Also, when grinding a wafer with a higher-output motor, a great load can also be imposed on the index table. At this time, a large index table is disadvantageous in terms of table rigidity and is inconvenient for imposing a great load.

[0011] Moreover, the enlargement of the column and the index table is also disadvantageous in terms of machining accuracy.

[0012] The present disclosure has been made in view of such points, and an object thereof is to achieve both higher output of the motor and compactification of the column and the index table.

Means for Solving the Problems

[0013] A first aspect of the present disclosure relates to a vertical surface grinding machine for performing surface grinding on a workpiece. This vertical surface grinding machine has at least two chucks on which the workpiece is mounted respectively, and an index table for rotating and moving the two chucks between a first position and a second position arranged in the circumferential direction around a central axis extending in the vertical direction, a column arranged so as to straddle above the index table, a first grinding mechanism supported by the column for machining the workpiece mounted on the chuck located at the first position, and a second grinding mechanism supported by the column for machining the workpiece mounted on the chuck located at the second position.

[0014] And according to the first aspect, the column has a horizontal side portion extending along the arrangement direction of the first and second positions in a plan view along the central axis, and a vertical side portion extending perpendicularly to the horizontal side portion from the central portion of the horizontal side portion, and is supported from below by both ends of the horizontal side portion and at least one end of the vertical side portion. The first and second grinding mechanisms each have a spindle rotationally driven by a motor so as to rotate around a predetermined rotation axis, and a feed mechanism for moving the spindle in the axial direction along the rotation axis. The first and second grinding mechanisms are each supported by the horizontal side portion and the vertical side portion so as to span the horizontal side portion and the vertical side portion, and the feed mechanisms of the first and second grinding mechanisms are each located at a corner where the horizontal side portion and the vertical side portion intersect.

[0015] According to the first aspect, the first and second grinding mechanisms are each arranged so as to span a horizontal side portion and a vertical side portion. Considering the extending direction of the vertical side portion, the first and second grinding mechanisms are not arranged side by side along the horizontal side portion, but are arranged obliquely with respect to its extending direction.

[0016] By arranging the first and second grinding stone mechanisms at an angle, the horizontal sides can be made shorter than when they are arranged side by side, which allows for a more compact column, a smaller chuck pitch, and ultimately a more compact index table, even when a high-power motor is used.

[0017] Making the index table more compact contributes to improving the table's rigidity. Improved table rigidity is advantageous for grinding workpieces using a high-power motor. Furthermore, making the column and index table smaller also contributes to ensuring machining accuracy.

[0018] Furthermore, according to the first aspect, the column is supported at at least three points: both ends of the horizontal side and one end of the vertical side, so that even if a large, heavy motor is hung from the column, distortion and collapse of the column can be suppressed.

[0019] Furthermore, according to the first aspect, the feed mechanism that moves the spindle is located at the corner where the horizontal side and the vertical side intersect, so that the feed mechanism can be positioned near the center of gravity of the column.

[0020] This makes it possible to prevent the column from tilting due to distortion, even if the column is subjected to distortion. As a result, even if a high-output motor is used, it is possible to ensure the machining accuracy and prevent the column from tilting, as described above.

[0021] Furthermore, according to a second aspect of the present disclosure, the horizontal side portion is supported from below by first and second support portions located at both ends in the arrangement direction, the vertical side portion is supported from below via a third support portion located at one end opposite the horizontal side portion, the spindle of the first grindstone mechanism is located in the center of a straight line connecting the first support portion and the third support portion in the planar view, the spindle of the second grindstone mechanism is located in the center of a straight line connecting the second support portion and the third support portion in the planar view, and the feed mechanisms of the first and second grindstone mechanisms are each located inside a triangle connecting the first support portion, the second support portion, and the third support portion in the planar view.

[0022] According to the second aspect, by arranging the feed mechanisms inside the triangle, the feed mechanisms can be positioned closer to the center of gravity of the column compared to a configuration in which they are positioned outside the triangle, which is more effective in preventing the column from tipping over.

[0023] Furthermore, by arranging each spindle in the center of the straight line according to the second aspect, the load exerted by each spindle on the column can be distributed in a balanced manner between the horizontal and vertical sides, thereby stabilizing support for the spindle.

[0024] Furthermore, according to a third aspect of the present disclosure, the first and second grinding stone mechanisms each support the spindle relative to the column and have a pair of linear guides aligned along a straight line passing through the rotation axis of the spindle in the planar view, one of the pair of linear guides being supported by the horizontal side portion and the other of the pair of linear guides being supported by the vertical side portion.

[0025] According to the third aspect, the spindle and the pair of linear guides can be arranged on the same straight line in a plan view, which makes it possible to prevent the spindle from tipping over due to its own weight.

[0026] Furthermore, if the spindle and a pair of linear guides are arranged in the same straight line in a plan view, there is a concern that the column will become larger. However, by arranging the first and second grinding stone mechanisms at an angle as in the first embodiment, such an increase in size can be minimized as much as possible.

[0027] That is, the third aspect works more effectively when combined with the first aspect.

[0028] Furthermore, according to a fourth aspect of the present disclosure, the base portion supporting the index table may have, in the plan view, a first chamfered portion cut out along a straight line connecting the first support portion and the third support portion, a second chamfered portion cut out along a straight line connecting the second support portion and the third support portion, and an operation surface located between the first chamfered portion and the second chamfered portion and extending along the horizontal side portion.

[0029] According to the fourth aspect, the space in front of the first chamfered portion can be used for maintenance of the first grindstone mechanism. The space in front of the second chamfered portion can be used for maintenance of the second grindstone mechanism. By arranging the first grindstone mechanism and the second grindstone mechanism at an angle, these spaces can be secured widely.

[0030] Furthermore, because the first and second chamfered portions also extend diagonally, an operating surface can be secured between the first and second chamfered portions. The space in front of this operating surface can be used, for example, to install an operating panel. This improves the usability of the vertical surface grinding machine.

[0031] Further, according to a fifth aspect of the present disclosure, the index table has three chucks on which the workpieces are mounted respectively, and the three chucks are rotationally moved between a first position and a second position arranged in the circumferential direction and a third position for exchanging the workpieces, and the horizontal side portion extends so as to connect between the first and second positions and the third position in the plan view, and the vertical side portion extends in a direction away from the third position in the plan view.

[0032] Normally, a workpiece (e.g., a wafer) is detached from and attached to the chuck moved to the third position by a robot arm or the like. Therefore, as in the fifth aspect, by extending the vertical side portion in a direction away from the third position, it becomes possible to suppress interference between the vertical side portion and the robot arm when detaching and attaching the workpiece. As a result, the usability of the vertical surface grinding machine is improved.

Advantages of the Invention

[0033] As described above, according to the present disclosure, it is possible to achieve both high output of the motor and downsizing of the column and the index table.

Brief Description of the Drawings

[0034]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5A

Figure 5B

Figure 6

Figure 7

Figure 8

[0035] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. Note that the following description is for illustrative purposes only.

[0036] (Overall composition) 1 and 2 are perspective views illustrating a vertical surface grinding machine 1. FIG. 3 is a plan view illustrating the vertical surface grinding machine 1. FIG. 4 is a plan view illustrating an index table 2. FIGS. 5A and 5B are plan views illustrating a column 5. FIG. 6 is a vertical cross-sectional view illustrating first and second grinding mechanisms 6 and 7. FIG. 7 is a diagram for explaining first and second chamfered portions 10a and 10b.

[0037] The vertical surface grinding machine 1 is a grinding device that performs single-sided surface grinding on semiconductor wafers. Specifically, as shown in Figures 1, 2, and 3, the vertical surface grinding machine 1 includes a bed 3, an index table 2, a column base 4, a column 5, a first grinding mechanism 6, a second grinding mechanism 7, a first guide pair 8, a second guide pair 9, and an operation panel 100. Hereinafter, the vertical surface grinding machine 1 may be simply referred to as the grinding machine 1.

[0038] Here, a semiconductor wafer is an example of a workpiece in this embodiment. The first grinding mechanism 6 is an example of a first grindstone mechanism, and the second grinding mechanism 7 is an example of a second grindstone mechanism.

[0039] (bed) The bed 3 is installed on the foundation (installation surface) where the grinding machine 1 is installed, such as the floor of the factory. The bed 3 has a thick plate shape extending in the vertical direction, and supports the index table 2 and the column base 4 from below by one or more legs. The bed 3 is configured to support the column 5, the first and second grinding mechanisms 6, 7, etc. via the index table 2 and the column base 4.

[0040] Here, the vertical direction refers to the direction along the central axis Ac extending perpendicular to the installation surface. Hereinafter, this direction may also be referred to as the "axial direction". In the following description, the direction of orbiting around this central axis Ac is referred to as the "circumferential direction", and the direction extending radially from the central axis Ac is referred to as the "radial direction". In addition, the "plan view" in the following description refers to the view seen from above along the axial direction.

[0041] (Index Table) The index table 2 has at least two chucks 21 on which wafers are mounted respectively. The index table 2 rotates and moves at least two (three in this embodiment) chucks 21 between the rough grinding position P1 and the finish grinding position P2 arranged in the circumferential direction around the central axis Ac (for the rough grinding position P1 and the finish grinding position P2, refer to FIGS. 2 and 4).

[0042] Specifically, the index table 2 has a substantially cylindrical shape extending in the vertical direction and is arranged at the center of the bed 3. The central axis Ac extends so as to pass through the center of this cylindrical shape. The index table 2 incorporates a first motor (not shown) for rotating the entire plurality of chucks 21.

[0043] Also, as shown in FIG. 4, the index table 2 has three chucks 21 in this embodiment. The three chucks 21 are each configured to adsorb and hold a wafer. The three chucks 21 are arranged at equal intervals at 120° intervals in the circumferential direction.

[0044] Specifically, each chuck 21 is composed of a chuck table having a disk shape. The outer diameter of the chuck table substantially coincides with the outer diameter of the wafer. The chuck table is made of porous ceramic and is connected to a vacuum source (not shown). Each chuck 21 adsorbs and holds the wafer by the negative pressure generated by the vacuum source.

[0045] Also, each chuck 21 is rotated about the central axis Ac by the motor. By this rotation, the three chucks 21 are rotationally moved between the exchange position P3 for detaching and attaching the wafer, the rough grinding position P1 for rough grinding the wafer, and the finish grinding position P2 for finish grinding the wafer (refer to FIGS. 1 and 4 for the exchange position P3).

[0046] The rough grinding position P1 is an example of the "first position" in the present embodiment, the finish grinding position P2 is an example of the "second position" in the present embodiment, and the exchange position P3 is an example of the "third position" in the present embodiment. These positions are arranged in the order of the exchange position P3, the rough grinding position P1, and the finish grinding position P2 along the clockwise direction.

[0047] Also, a second motor is individually drive-connected to each chuck 21. By driving this second motor, each chuck 21 individually rotates about a chuck rotation axis Aw passing through the center of its respective disk shape. The rotation direction at that time can be changed as appropriate.

[0048] (Column base) The column base 4 is arranged on the bed 3 in the same manner as the index table 2. The column base 4 supports the column 5 from below. The column base 4 supports the first and second grinding mechanisms 6, 7 and the first and second guide pairs 8, 9 via the column 5.

[0049] In detail, the column base 4 according to this embodiment has a U-shape that surrounds the index table 2 from the sides, and the upper surface of the U-shape supports the column 5 from below. For this reason, a first support portion 41, a second support portion 42, and a third support portion 43 are provided on the upper surface of the column base 4, as shown in FIG.

[0050] It is not necessary to provide the column base 4 separately from the bed 3. The bed 3 and the column base 4 may be integrated. Regardless of whether the bed 3 and the column base 4 are separate or integrated, they may be collectively referred to as the "base portion 10."

[0051] (column) The column 5 is disposed so as to straddle the upper part of the index table 2. The column 5 is supported from below by a column base 4, not by the index table 2.

[0052] 5A, the column 5 has a horizontal side portion 51 and a vertical side portion 52. The horizontal side portion 51 and the vertical side portion 52 form the column 5 in a T-shape.

[0053] As will be described in a modified example below, it is not essential that horizontal side portion 51 and vertical side portion 52 form a T-shape. Vertical side portion 52 may protrude from horizontal side portion 51, forming a cross shape.

[0054] 5A, the horizontal side portion 51 extends along the arrangement direction of the rough grinding position P1 and the fine grinding position P2. The "arrangement direction" here refers to the longitudinal direction of the horizontal side portion 51. For example, the left-right direction on the paper surface of FIG. 5A corresponds to the arrangement direction in the same figure.

[0055] Specifically, in plan view, the horizontal side portion 51 extends so as to span between the rough grinding position P1, the finish grinding position P2, and the replacement position P3. Although the horizontal side portion 51 is located above the rough grinding position P1, the finish grinding position P2, and the replacement position P3, it does not completely cover and hide the chucks 21 arranged at these three positions P1 to P3 in plan view. As shown in FIG. 4, at least a part of each of the three chucks 21 is exposed upward.

[0056] More specifically, as shown in FIG. 4, the horizontal side portion 51 is supported from below by first and second support portions 41 and 42 located at both ends in the arrangement direction. Here, the first support portion 41 supports one longitudinal end portion 51a of the horizontal side portion 51 from below. The second support portion 42 supports the other longitudinal end portion 51b of the horizontal side portion 51 from below. Hereinafter, the longitudinal end portion 51a may be referred to as the first end portion 51a, and the longitudinal end portion 51b may be referred to as the second end portion 51b (see FIG. 4).

[0057] The vertical side portion 52 extends perpendicularly to the horizontal side portion 51 from the central portion 51c of the horizontal side portion 51 so as to span between the rough grinding position P1 and the finish grinding position P2. The direction in which the vertical side portion 52 extends is the short side direction of the horizontal side portion 51. For example, the vertical and horizontal directions of the paper surface in FIG. 5A correspond to the direction in which the vertical side portion 52 extends in the same figure.

[0058] Also, the central portion 51c of the horizontal side portion 51 is the central portion of the horizontal side portion 51 in the arrangement direction. For example, as shown in FIG. 5A, it may be a portion including a portion passing through the symmetry line As described later.

[0059] Specifically, the vertical side portion 52 extends in a direction away from the replacement position P3 in a plan view. Although the vertical side portion 52 is located above the rough grinding position P1 and the fine grinding position P2, it does not completely cover the chucks 21 located at these two positions P1-P2 in a plan view. As shown in FIG. 4, at least a portion of each of the two chucks 21 is exposed upward. The vertical side portion 52 is not located above the replacement position P3, and is configured not to cover the chuck 21 located at the replacement position P3 from above.

[0060] More specifically, the vertical side portion 52 is supported from below by a third support portion 43 located at one end arranged on the opposite side of the horizontal side portion 51. Here, the third support portion 43 supports one longitudinal end portion 52a of the vertical side portion 52 from below. The one longitudinal end portion 52a of the vertical side portion 52 may be simply referred to as the third end portion 52a.

[0061] Also, as shown in FIG. 5B, in this embodiment, the first support portion 41, the second support portion 42, and the third support portion 43 form a right triangle in plan view, with the hypotenuse being an imaginary line connecting the first support portion 41 and the second support portion 42.

[0062] Furthermore, the column 5 is mirror-symmetric in plan view with respect to a line (the line of symmetry As in FIG. 5A) passing through the vertical side portion 52. In other words, the above-mentioned right triangle can also be considered as a right-angled isosceles triangle in which the length of the line segment connecting the first support portion 41 and the third support portion 43 is equal to the length of the line segment connecting the second support portion 42 and the third support portion 43.

[0063] Hereinafter, as shown in Figures 5A and 5B, in a plan view, the imaginary line (imaginary plane) connecting the first support portion 41 and the second support portion 42 will be referred to as the "shaded portion Lh," the imaginary line (imaginary plane) connecting the first support portion 41 and the third support portion 43 will be referred to as the "first attachment line L1," and the imaginary line (imaginary plane) connecting the second support portion 42 and the third support portion 43 will be referred to as the "second attachment line L2."

[0064] In this way, the column 5 according to this embodiment is supported at three points around the index table 2 on the upper surface of the column base 4, in a manner that straddles the index table 2. As shown in the shaded area in Fig. 5A, the column 5 has a T-shape in plan view, formed by a horizontal side portion 51 and a vertical side portion 52. The lower ends of the horizontal line (horizontal side portion 51) and vertical line (vertical side portion 52) of the T are supported from below by the first support portion 41 to the third support portion 43, and the triangle connecting the three support portions 41 to 43, or the ends supported by them, forms an isosceles right triangle.

[0065] Alternatively, instead of using the above definition, the first end 51a supported by the first support portion 41, the second end 51b supported by the second support portion 42, and the third end 52a supported by the third support portion 43 may form a right triangle with the hypotenuse being an imaginary line connecting the first end 51a and the second end 51b.

[0066] In this case, the imaginary line (imaginary plane) connecting the first end 51a and the second end 51b will be referred to as the "shaded portion Lh," the imaginary line (imaginary plane) connecting the first end 51a and the third end 52a will be referred to as the "first attachment line L1," and the imaginary line (imaginary plane) connecting the second end 51b and the third end 52a will be referred to as the "second attachment line L2."

[0067] (First grinding mechanism) The first grinding mechanism 6 is supported by the column 5. The first grinding mechanism 6 processes (roughly grinds) a wafer mounted on a chuck 21 located at a rough grinding position P1.

[0068] 2, 3, and 5A, the first grinding mechanism 6 has a first spindle 61 and a first feed mechanism 62. The first spindle 61 rotates around a predetermined first rotation axis As1. The feed mechanism 62 moves the first spindle 61 in the axial direction along the first rotation axis As1.

[0069] Specifically, as shown in FIG. 6, the first spindle 61 has a spindle case 61a, a grinding wheel shaft case 61b, and a grinding wheel 61c. The portion corresponding to the first spindle 61 in FIG. 6 is a longitudinal sectional view along the straight line L3 in FIGS. 5A and 5B.

[0070] The spindle case 61a has a cylindrical shape that houses the grinding wheel shaft case 61b and the grinding wheel 61c. The grinding wheel shaft case 61b houses a grinding wheel shaft that rotatably supports the grinding wheel 61c and a drive motor 61d that drives the grinding wheel shaft. The grinding wheel 61c is attached to the lower end of the grinding wheel shaft. The grinding wheel 61c is, for example, a cup-shaped grinding wheel in which grinding wheels are arranged in an annular shape on the bottom surface of a disk-shaped base material. The grinding wheel shaft and the grinding wheel 61c rotate around the first rotation axis As1. The rotation direction can be changed as appropriate.

[0071] On the other hand, the feed mechanism 62 has a feed motor 62a and a ball screw 62b. The feed motor 62a rotates the ball screw 62b to move the spindle case 61a up and down. The ball screw 62b functions as a feed shaft of the first spindle 61. The mounting position of the ball screw 62b, and thus the feed mechanism 62, will be described later.

[0072] In addition, the first spindle 61 is supported by a balance cylinder (not shown) with a vertically upward force. This prevents the weight of the first spindle 61 from acting on the ball screw 62b. Also, the grinding wheel shaft case 61b can adjust the inclination with respect to the spindle case 61a.

[0073] The first grinding mechanism 6 also has a pair of linear guides (first guide pair 8) that support the first spindle 61 with respect to the column 5. This first guide pair 8 is composed of a first linear guide 81 and a second linear guide 82. The first and second linear guides 81, 82 support the spindle case 61a from both sides. The mounting positions of the first and second linear guides 81, 82 will be described later.

[0074] The first and second linear guides 81 and 82 both extend in the vertical direction. The first and second linear guides 81 and 82 respectively fix the spindle case 61a of the first spindle 61 to the column 5 so that the spindle case 61a can be displaced in the vertical direction. The first and second linear guides 81 and 82 guide the vertical movement of the spindle case 61a.

[0075] In this embodiment, the first grinding mechanism 6 is supported by the horizontal side portion 51 and the vertical side portion 52 so as to span across the horizontal side portion 51 and the vertical side portion 52. More specifically, the first grinding mechanism 6 is supported by a first end portion 51a of the horizontal side portion 51 and a third end portion 52a of the vertical side portion 52.

[0076] 5B, in a plan view, the first spindle 61 is located at the center of a straight line (first attachment line L1) connecting the first support part 41 and the third support part 43. In detail, the first rotation axis As1 of the first spindle 61 is located at the center of the first attachment line L1.

[0077] To achieve this arrangement, the first linear guide 81 according to this embodiment is supported by the horizontal side portion 51, particularly the first end portion 51a. On the other hand, the second linear guide 82 according to this embodiment is supported by the vertical side portion 52, particularly the third end portion 52a. As a result, the first spindle 61 is supported by the horizontal side portion 51 and the vertical side portion 52.

[0078] Furthermore, the first and second linear guides 81 and 82 are aligned along a straight line (first attachment line L1) that passes through the first rotation axis As1 in a plan view such as FIG. 5A.

[0079] In other words, the first and second linear guides 81, 82 and the first rotation axis As1 are arranged on the same straight line along the first attachment line L1. That is, the first grinding mechanism 6 according to this embodiment is supported obliquely with respect to the directions in which the horizontal side portion 51 and the vertical side portion 52 extend.

[0080] 5B, the attachment position of the first linear guide 81 is adjacent to the first support portion 41 in a plan view. The first linear guide 81 is supported by the first end portion 51a.

[0081] Further, the attachment position of the second linear guide 82 is adjacent to the third support portion 43 in plan view. The second linear guide 82 is supported by the third end portion 52a.

[0082] (Second grinding mechanism 7) The second grinding mechanism 7 is supported by the column 5. The second grinding mechanism 7 processes (precisely grinds) a wafer mounted on a chuck 21 located at a precision grinding position P2.

[0083] The configuration of the second grinding mechanism 7 is substantially the same as the configuration of the first grinding mechanism 6, except that it has a symmetrical arrangement with respect to the first grinding mechanism 6 (particularly, a mirror-symmetric arrangement with respect to the line of symmetry As).

[0084] 2, 3, and 5A, the second grinding mechanism 7 includes a second spindle 71 and a second feed mechanism 72. The second spindle 71 rotates around a predetermined second rotation axis As2. The second feed mechanism 72 moves the second spindle 71 in the axial direction along the second rotation axis As2.

[0085] Specifically, the second spindle 71 has a spindle case 71a, a grinding wheel shaft case 71b, and a grinding wheel 71c, as shown in Fig. 6. The portion corresponding to the second spindle 71 in Fig. 6 is a vertical cross-sectional view taken along line L4 in Figs. 5A and 5B.

[0086] The spindle case 71a houses a grinding wheel spindle case 71b and a grinding wheel 71c. The grinding wheel spindle case 71b houses a grinding wheel spindle that rotatably supports the grinding wheel 71c and a drive motor 71d that drives the grinding wheel spindle. The grinding wheel 71c is attached to the lower end of the grinding wheel spindle.

[0087] On the other hand, the feed mechanism 72 has a feed motor 72a and a ball screw 72b. The feed motor 72a rotates the ball screw 72b to move the spindle case 71a up and down. The ball screw 72b functions as a feed shaft for the second spindle 71.

[0088] The second grinding mechanism 7 also has a pair of linear guides (second guide pair 9) that support the second spindle 71 relative to the column 5. This second guide pair 9 is composed of a third linear guide 91 and a fourth linear guide 92. The third and fourth linear guides 91, 92 support the spindle case 71a of the second grinding mechanism from both sides. The mounting positions of the third and fourth linear guides 91, 92 will be described later.

[0089] The third and fourth linear guides 91, 92 both extend in the vertical direction. The third and fourth linear guides 91, 92 respectively fix the spindle case 71a of the second spindle 71 to the column 5 so that the spindle case 71a can be displaced in the vertical direction. The third and fourth linear guides 91, 92 guide the vertical movement of the spindle case 71a.

[0090] Similarly to the first grinding mechanism 6, the second grinding mechanism 7 according to this embodiment is supported by the horizontal side portion 51 and the vertical side portion 52 so as to bridge between the horizontal side portion 51 and the vertical side portion 52 in a plan view. More specifically, the second grinding mechanism 7 is supported by the second end portion 51b of the horizontal side portion 51 and the third end portion 52a of the vertical side portion 52.

[0091] 5B, in a plan view, the second spindle 71 is located at the center of a straight line (second attachment line L2) connecting the second support portion 42 and the third support portion 43. In detail, the second rotation axis As2 of the second spindle 71 is located at the center of the second attachment line L2.

[0092] To achieve this arrangement, the third linear guide 91 according to this embodiment is supported by the horizontal side portion 51, particularly the second end portion 51b. On the other hand, the fourth linear guide 92 according to this embodiment is supported by the vertical side portion 52, particularly the third end portion 52a. As a result, the second spindle 71 is supported by the horizontal side portion 51 and the vertical side portion 52.

[0093] The support positions of the third linear guide 91 and the fourth linear guide 92 are mirror-symmetrical with respect to the support positions of the first linear guide 81 and the second linear guide 82 with respect to the line of symmetry As passing through the vertical side portion 52.

[0094] The third and fourth linear guides 91, 92 are aligned along a straight line (second attachment line L2) that passes through the second rotation axis As2 in a plan view such as FIG. 5A.

[0095] In other words, the third and fourth linear guides 91, 92 and the second rotation axis As2 are arranged on the same straight line along the second attachment line L2. That is, the second grinding mechanism 7 according to this embodiment is supported obliquely with respect to both the horizontal side portion 51 and the vertical side portion 52. The second grinding mechanism 7 is also arranged so as to be a mirror image of the first grinding mechanism 6 with respect to a straight line passing through the vertical side portion 52.

[0096] 5B, the attachment position of the third linear guide 91 is adjacent to the second support portion 42 in a plan view. The third linear guide 91 is supported by the second end portion 51b.

[0097] Additionally, the mounting position of the fourth linear guide 92 is adjacent to the third support portion 43 in a plan view. That is, the third support portion 43 is located between the mounting position of the fourth linear guide 92 and the mounting position of the second linear guide 82 in a plan view. In other words, the mounting positions of the fourth linear guide 92 and the second linear guide 82 are located on both sides of the third support portion 43 in a plan view. The fourth linear guide 92 is supported by the third end portion 52a.

[0098] (Layout of the first and second feed mechanisms) 5B, the first feed mechanism 62 of the first grinding mechanism 6 is located at a first corner 53 where the horizontal side 51 and the vertical side 52 intersect. This first corner 53 is a corner that faces the first attachment line L1 in a plan view.

[0099] More specifically, the first ball screw 62b of the first feed mechanism 62 is disposed in the first corner portion 53. As shown in Fig. 5B, the first ball screw 62b is disposed so that a straight line L3 connecting the central axis Ab1 of the first ball screw 62b and the first rotation axis As1 is perpendicular to the first attachment line L1.

[0100] Similarly, the second feed mechanism 72 of the second grinding mechanism 7 is located at a second corner 54 where the horizontal side portion 51 and the vertical side portion 52 intersect. This second corner 54 is a corner that faces the second attachment line L2 in a plan view.

[0101] More specifically, the second ball screw 72b of the second feed mechanism 72 is disposed in the second corner portion 54. As shown in Fig. 5B, the second ball screw 72b is disposed so that a straight line L4 connecting the center axis Ab2 of the second ball screw 72b and the second rotation axis As2 is perpendicular to the second attachment line L2.

[0102] In other words, the first and second feed mechanisms 62, 72, particularly the first and second ball screws 62b, 72b, can also be considered to be located inside a triangle (right-angled isosceles triangle) T connecting the first support portion 41, the second support portion 42, and the third support portion 43, respectively, in a plan view. As shown by the chain line in Fig. 5B, this triangle T can be considered to be a triangle connecting the first end portion 51a, the second end portion 51b, and the third end portion 52a.

[0103] More specifically, the first ball screw 62b is located inside one side (the right side of the paper surface in FIG. 5B) obtained by dividing the triangle T by the symmetry line As, and the second ball screw 72b is located inside the other side (the left side of the paper surface in FIG. 5B) obtained by dividing the triangle T by the symmetry line As. Arranging the first and second ball screws 62b and 72b inside the triangle T respectively contributes to the compactification of the entire grinding machine 1 including the index table 2.

[0104] In addition, as shown in FIG. 4, the chuck rotation axis Aw is closer to the central axis Ac of the index table 2 than the first rotation axis As1. In other words, in the plan view of FIG. 4, the distance between the chuck rotation axis Aw and the central axis Ac of the index table 2 is shorter than the distance between the first rotation axis As1 and the central axis Ac.

[0105] Also, the central axis Ab1 of the first ball screw 62b is closer to the central axis Ac of the index table 2 than the chuck rotation axis Aw. In other words, in the plan view of FIG. 4, the distance between the central axis Ab1 of the first ball screw 62b and the central axis Ac of the index table 2 is shorter than the distance between the chuck rotation axis Aw and the central axis Ac.

[0106] Similarly, as shown in FIG. 4, the chuck rotation axis Aw is closer to the central axis Ac of the index table 2 than the second rotation axis As2. In other words, in the plan view of FIG. 4, the distance between the chuck rotation axis Aw and the central axis Ac of the index table 2 is shorter than the distance between the second rotation axis As2 and the central axis Ac.

[0107] Also, the central axis Ab2 of the second ball screw 72b is closer to the central axis Ac of the index table 2 than the chuck rotation axis Aw. In other words, in the plan view of FIG. 4, the distance between the central axis Ab2 of the second ball screw 72b and the central axis Ac of the index table 2 is shorter than the distance between the chuck rotation axis Aw and the central axis Ac.

[0108] (Operation panel) The operation panel 100 is a control unit for operating the grinding machine 1. As shown in Fig. 3, this operation panel 100 is basically arranged facing the vertical side portion 52. Further, as shown by the phantom line in the same figure, the operation panel 100 is movable between a first operation position Px1 facing the user U located at the first chamfered portion 10a described later, a second operation position Px2 facing the user U located at the second chamfered portion 10b described later, and a basic position Px3 facing the operation surface 10c.

[0109] (Other configurations) As described above, the bed 3 and the column base 4 constitute the pedestal portion 10 that supports the index table 2. In the plan view of Fig. 3, this pedestal portion 10 has a first chamfered portion 10a cut along the first attachment line L1, a second chamfered portion 10b cut along the second attachment line L2, an operation surface 10c located between the first chamfered portion 10a and the second chamfered portion 10b and extending along the horizontal side portion 51.

[0110] (Specific example of the grinding process) When grinding with the grinding machine 1, first, the first wafer is mounted on the chuck 21 at the exchange position P3. The first wafer is sucked and held by the chuck 21.

[0111] Subsequently, the index table 2 rotates 120° clockwise, and the chuck 21 and the first wafer are arranged at the rough grinding position P1.

[0112] Subsequently, the first spindle 61 of the first grinding mechanism 6 cuts into the first wafer, and rough grinding is performed. At the same time, the second wafer is mounted and sucked and held by another chuck 21 located at the exchange position P3.

[0113] When the rough grinding is completed, the index table 2 rotates 120° clockwise, and the first wafer moves to the finish grinding position P2 together with the chuck 21, and the second wafer moves to the rough grinding position P1 together with the chuck 21.

[0114] Next, the second spindle 71 of the second grinding mechanism 7 cuts into the first wafer to perform fine grinding. At the same time, the first spindle 61 of the first grinding mechanism 6 cuts into the second wafer to perform rough grinding. At the same time, a third wafer is loaded onto and held by suction on yet another chuck 21 located at exchange position P3.

[0115] When the processing of the first and second wafers is completed, the index table 2 rotates counterclockwise (reversely) by 240°, and the first wafer moves together with the first chuck 21 to the exchange position P3, and the second wafer moves together with the second chuck 21 to the fine grinding position P2. In addition, the third wafer moves together with the third chuck 21 to the rough grinding position P1.

[0116] Thereafter, the second spindle 71 of the second grinding mechanism 7 cuts into the second wafer to perform fine grinding. At the same time, the first spindle 61 of the first grinding mechanism 6 cuts into the third wafer to perform rough grinding. At the same time, the first wafer is removed from the first chuck 21 located at the exchange position P3, and a fourth wafer is mounted on the chuck 21 and held by suction.

[0117] As shown in (a) of Figure 7, when it becomes necessary to perform maintenance or other work on the first grinding mechanism 6, the user U faces the first grinding mechanism 6 through the first chamfered portion 10a and, as necessary, operates the operation panel 100 located at the first operation position Px1.

[0118] Similarly, as shown in (b) of Figure 7, when it becomes necessary to perform maintenance or other work on the second grinding mechanism 7, the user U faces the second grinding mechanism 7 through the second chamfered portion 10b and, as necessary, operates the operation panel 100 located at the second operation position Px2.

[0119] (summary) As described above, in the embodiment, the first and second grinding mechanisms 6 and 7 are disposed so as to bridge the horizontal side portion 51 and the vertical side portion 52. Considering the extension direction of the vertical side portion 51, the first and second grinding mechanisms 6 and 7 are not disposed side by side along the horizontal side portion 51, but are disposed obliquely relative to the extension direction. This is also illustrated in Figures 5A and 5B.

[0120] Furthermore, by arranging the first and second grinding mechanisms 6, 7 at an angle, the horizontal side 51 can be made shorter than in a configuration in which they are arranged side by side. As a result, even if high-output motors are used for the drive motors 61d, 71d of the spindles 61, 71, it is possible to make the column 5 compact, reduce the pitch of the chucks 21, and ultimately make the index table 2 compact.

[0121] The compactness of the index table 2 contributes to improving the table rigidity. The improved table rigidity is advantageous for grinding wafers using high-output drive motors 61d and 71d. Furthermore, the miniaturization of the column 5 and index table 2 also contributes to ensuring processing accuracy.

[0122] 5B, the column 5 is supported at least at three points: both ends 51a and 51b of the horizontal side 51 and one end 52a of the vertical side 52. Therefore, even if a large and heavy drive motor 61d is hung thereon, distortion and tipping of the column 5 can be suppressed.

[0123] 5B and other figures, the first and second feed mechanisms 62, 72 that move the first and second spindles 61, 71 are located at the first and second corners 53, 54 where the horizontal side 51 and the vertical side 52 intersect. By arranging the first and second feed mechanisms 62, 72 in this manner, the first and second feed mechanisms 62, 72 can be disposed near the center of gravity of the column 5.

[0124] This makes it possible to prevent the column 5 from falling over due to distortion of the column 5. As a result, even if high-output drive motors 61d, 71d are used, it is possible to ensure the machining accuracy and prevent the column 5 from falling over at the same time, as described above.

[0125] 5B, by arranging the feed mechanisms 62, 72 inside the isosceles right triangle T, the feed mechanisms 62, 72 can be positioned closer to the center of gravity of the column 5 compared to a configuration in which they are positioned outside the triangle. This is more advantageous in preventing the column 5 from tipping over.

[0126] Furthermore, by arranging the first spindle 61 at the center of the first attachment line L1 and the second spindle 71 at the center of the second attachment line L2, the load that each spindle 61, 71 exerts on the column 5 can be distributed in a balanced manner between the horizontal side portion 51 and the vertical side portion 52. This allows the support of each spindle 61, 71 to be stabilized.

[0127] 5B and other figures, the first spindle 61 and the first and second linear guides 81, 82 are arranged on the same straight line in a plan view, and the second spindle 71 and the third and fourth linear guides 91, 92 are arranged on the same straight line in a plan view, thereby preventing the spindles 61, 71 from tipping over due to their own weight.

[0128] Furthermore, if the spindles 61, 71 and the pair of linear guides 8, 9 are arranged in the same straight line in a plan view, there is a concern that the column 5 will become larger. However, by arranging the first and second grinding mechanisms 6, 7 at an angle as in this embodiment, such an increase in size can be suppressed as much as possible.

[0129] Further, as illustrated in FIG. 3, the space located in front of the first chamfering portion 10a can be used for the maintenance of the first grinding mechanism 6. The space located in front of the second chamfering portion 10b can be used for the maintenance of the second grinding mechanism 7. By arranging the first grinding mechanism 6 and the second grinding mechanism 7 obliquely, these spaces can be secured widely.

[0130] Also, since the first chamfering portion 10a and the second chamfering portion 10b also extend obliquely, an operation surface 10c can be secured between the first chamfering portion 10a and the second chamfering portion 10b. The space located in front of this operation surface 10c can be used as, for example, the installation space for the operation panel 100. Thereby, the usability of the grinding machine 1 is improved.

[0131] Also, usually, a wafer is to be detached from and attached to the chuck 21 moved to the exchange position P3 by a robot arm or the like. Therefore, as illustrated in FIG. 4, by extending the vertical side portion 52 in a direction away from the exchange position P3, it becomes possible to suppress the interference between the vertical side portion 52 and the robot arm when detaching and attaching the wafer. Thereby, the usability of the grinding machine 1 is improved.

[0132] <Modification Example of Grinding Machine> FIG. 8 is a view corresponding to FIG. 3 showing a modification example of the vertical surface grinding machine 1. In FIG. 8, elements denoted by the symbol "10○○" have the same configuration and function as the elements denoted by the symbol "○○" in FIGS. 1 to 7, except where otherwise noted.

[0133] In the above embodiment, a configuration having three chucks 21 and two grinding mechanisms 6 and 7 was illustrated. However, as shown in FIG. 8, the present disclosure also includes a configuration having four chucks 1021 and three grinding mechanisms 1006, 1007, and 1011.

[0134] The grinding machine 1001 according to the modified example includes four chucks 1021 arranged at 90° intervals in the circumferential direction. One of the four chucks 1021 (lower left in the drawing) is used for wafer replacement in the same manner as in the above embodiment. The remaining three chucks 1021 are arranged in association with each of the three grinding mechanisms 1006, 1007, 1011.

[0135] Similar to column 5 of the above embodiment, column 1005 according to the modified example has a horizontal side portion 1051 extending in the arrangement direction of the first grinding mechanism 1006 and the second grinding mechanism 1007, and a vertical side portion 1052 extending vertically from the central portion of the horizontal side portion 51. Column 1005 according to the modified example has a cross shape in plan view.

[0136] The three grinding mechanisms 1006, 1007, 1011 are arranged at 90° intervals in the circumferential direction, and are arranged in the order of the first grinding mechanism 1006, the second grinding mechanism 1007, and the third grinding mechanism 1011 along the circumferential direction.

[0137] Also, the three grinding mechanisms 1006, 1007, 1011 each have a spindle 1061, 1071, 1111 and a feed mechanism 1062, 1072, 1112.

[0138] First, in this modified example, the first grinding mechanism 1006 is configured in the same manner as the first grinding mechanism 6 in the above embodiment, and the second grinding mechanism 1007 is configured in the same manner as the second grinding mechanism 7 in the above embodiment.

[0139] That is, the two grinding mechanisms 1006, 1007 are each supported by the horizontal side portion 1051 and the vertical side portion 1052 so as to span the upper half of the paper surface of the vertical side portion 1052.

[0140] The spindles 1061 and 1071 of the two grinding mechanisms 1006 and 1007 are supported on both sides by a first guide pair 1008 and a second guide pair 1009. These spindles 1061 and 1071 are arranged along the hypotenuse of a triangle connecting both ends of the horizontal side 1051 on the paper surface and the upper end of the vertical side 1052 on the paper surface.

[0141] Further, the feed mechanisms 1062 and 1072 of the two grinding mechanisms 1006 and 1007 are located at the corner where the horizontal side portion 1051 and the vertical side portion 1052 intersect. The two feed mechanisms 1062 and 1072 are arranged inside the triangle.

[0142] The same applies even if the second grinding mechanism 1007 is regarded as the first grinding mechanism 6 in the above embodiment, and the third grinding mechanism 1011 is regarded as the second grinding mechanism 7 in the above embodiment.

[0143] That is, the two grinding mechanisms 1007 and 1011 are supported by the horizontal side portion 1051 and the vertical side portion 1052 so as to span the right half of the horizontal side portion 1051 on the page and the vertical side portion 1052, respectively.

[0144] The spindles 1071 and 1111 of the two grinding mechanisms 1007 and 1011 are supported on both sides by the second guide pair 1009 and the third guide pair 1012. These spindles 1071 and 1111 are arranged along the hypotenuse of a triangle connecting the right end of the horizontal side 1051 on the paper surface and both ends of the vertical side 1052 on the paper surface.

[0145] Further, the feed mechanisms 1072 and 1112 of the two grinding mechanisms 1007 and 1011 are located at the corner where the horizontal side portion 1051 and the vertical side portion 1052 intersect. The two feed mechanisms 1072 and 1112 are arranged inside the triangle.

[0146] Even with this configuration, it is possible to obtain the same effects as in the above embodiment. That is, the grinding machine 1001 according to the modified example can achieve both high output of the drive motors for the spindles 1061, 1071, and 1111 and compact size of the column 1005 and index table 1002.

[0147] <Other embodiments> In the above embodiment, a semiconductor wafer is exemplified as the workpiece, but the object to be machined by the grinding machine 1 is not limited to a semiconductor wafer. The workpiece may be, for example, a metal part.

[0148] Furthermore, in the above embodiment, the first grinding mechanism 6 is exemplified as the first grinding stone mechanism, and the second grinding mechanism 7 is exemplified as the second grinding stone mechanism, but the present disclosure is not limited to such a configuration. The first and second grinding stone mechanisms may be any mechanisms that perform any processing using grinding stones. For example, the first grinding stone mechanism may be a grinding mechanism that performs fine grinding similar to the above embodiment, and the second grinding stone mechanism may be a polishing mechanism that polishes the workpiece. Furthermore, the first grinding stone mechanism and the second grinding stone mechanism may be mechanisms that perform the same type of processing, such as rough grinding of the workpiece. In other words, the first and second grinding stone mechanisms are not limited to mechanisms that perform grinding, but may be general mechanisms equipped with grinding stones.

[0149] Alternatively, the vertical surface grinding machine 1 may be a multi-tasking machine that combines outer diameter grinding, inner diameter grinding, and end face grinding, for example.

[0150] In the above embodiment, each chuck 21 is configured to attract and hold a workpiece (wafer), but the present disclosure is not limited to such a configuration. For example, each chuck 21 may be an electrostatic chuck, a magnetic chuck, or a claw-type chuck. [Explanation of symbols]

[0151] 1. Grinding machine (vertical surface grinding machine) 2 Index Table 21 Zipper 3 beds 4 Column stand 41 1st support part 42 Second support part 43 Third support part 5. Column 51 Side part 51a First end 51b Second end 52 Vertical side 52a 3rd end 53 First corner (corner) 54 Second corner (corner) 6 First grinding mechanism (first grindstone mechanism) 61 First spindle (spindle) 62 First feed mechanism (feed mechanism) 7 Second grinding mechanism (second grindstone mechanism) 71 Second spindle (spindle) 72 Second feed mechanism (feed mechanism) 8. First guide pair (a pair of linear guides) 81 First linear guide (one of the linear guides) 82 Second linear guide (the other linear guide) 9 Second guide pair (a pair of linear guides) 91 Third linear guide (one of the linear guides) 92 4th linear guide (other linear guide) 10 Base 10a First chamfer 10b 2nd chamfer Ac central axis As1 First rotation axis (spindle rotation axis) As2 Second rotation axis (spindle rotation axis) L1 First mounting line (a straight line connecting the first support part and the third support part) L2 Second mounting line (a straight line connecting the second support part and the third support part) P1 Rough grinding position (1st position) P2 Fine grinding position (2nd position) P3 replacement position (3rd position) Px1 1st operating position Px2 2nd operating position 100 Operation Panel

Claims

1. A vertical surface grinding machine for performing surface grinding on a workpiece, comprising: at least two chucks on which the workpiece is mounted respectively, and an index table for rotationally moving the two chucks between a first position and a second position arranged in a circumferential direction around a central axis extending in the vertical direction; a column arranged so as to straddle above the index table; a first grinding wheel mechanism supported by the column for machining the workpiece mounted on the chuck located at the first position; a second grinding wheel mechanism supported by the column for machining the workpiece mounted on the chuck located at the second position, wherein the column, in a plan view along the central axis, has a horizontal side portion extending along the arrangement direction of the first and second positions; and a vertical side portion extending perpendicularly to the horizontal side portion from the central portion of the horizontal side portion; is supported from below by both ends of the horizontal side portion and at least one end of the vertical side portion; the first and second grinding wheel mechanisms each have a spindle rotationally driven by a motor so as to rotate around a predetermined rotation axis; and a feed mechanism for moving the spindle in an axial direction along the rotation axis; the first and second grinding wheel mechanisms are each supported by the horizontal side portion and the vertical side portion so as to span the horizontal side portion and the vertical side portion; the feed mechanisms of the first and second grinding wheel mechanisms are each located at a corner where the horizontal side portion and the vertical side portion intersect. A vertical surface grinding machine characterized by the above.

2. In the vertical surface grinding machine according to Claim 1, the horizontal side portion is supported from below by first and second support portions located at both ends in the arrangement direction; the vertical side portion is supported from below by a third support portion located at one end arranged on the opposite side of the horizontal side portion; the spindle of the first grinding wheel mechanism is located at the central portion of a straight line connecting the first support portion and the third support portion in the plan view; the spindle of the second grinding wheel mechanism is located at the central portion of a straight line connecting the second support portion and the third support portion in the plan view; the feed mechanisms of the first and second grinding wheel mechanisms are each located inside a triangle formed by connecting the first support portion, the second support portion, and the third support portion in the plan view. A vertical surface grinding machine characterized by the above.

3. In the vertical surface grinding machine according to Claim 2, the first and second grinding wheel mechanisms each have Supports the spindle with respect to the column, and has a pair of linear guides arranged along a straight line passing through the rotation axis of the spindle in the plan view. One of the pair of linear guides is supported by the horizontal side portion. The other of the pair of linear guides is supported by the vertical side portion. A vertical surface grinding machine characterized by the above.

4. In the vertical surface grinding machine according to claim 2, The pedestal portion that supports the index table, in the plan view, A first chamfered portion cut along a straight line connecting the first support portion and the third support portion; A second chamfered portion cut along a straight line connecting the second support portion and the third support portion; It is located between the first chamfered portion and the second chamfered portion, and has an operation surface extending along the horizontal side portion. A vertical surface grinding machine characterized by the above.

5. In the vertical surface grinding machine according to claim 1, The index table has three chucks on which the workpieces are mounted, and rotates and moves the three chucks between a first position and a second position arranged in the circumferential direction and a third position for exchanging the workpieces respectively. The horizontal side portion extends so as to sew between the first and second positions and the third position in the plan view. The vertical side portion extends in a direction away from the third position in the plan view. A vertical surface grinding machine characterized by the above.

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