Manufacturing method for multilayer electronic component and mold release film

Abstract

To provide a manufacturing method for a multilayer electronic component in which reduction in quality caused by a mold release film is prevented and provide a mold release film used for the same.SOLUTION: A manufacturing method for a multilayer electronic component 1 includes a step for coating one surface of a mold release film 100 with a ceramic slurry and forming a ceramic green sheet 10, a step for printing an internal electrode pattern 12 on the ceramic green sheet 10, a step for laminating the ceramic green sheets 10 and obtaining a laminated body 2, a step for obtaining a ceramic sintered body 4, and a step for forming an external electrode 6. The mold release film 100 includes a substrate 102 and a mold release layer 110. The mold release layer 110 is formed by repeatedly coating a mold release agent on the substrate 102.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a method for manufacturing a multilayer electronic component and a release film.

Background Art

[0002] As a method for manufacturing a multilayer ceramic capacitor which is an example of a multilayer electronic component, there is a method in which a ceramic slurry is applied to a release film to form a ceramic green sheet, an internal electrode pattern is printed on the ceramic green sheet, and then a plurality of them are laminated (for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The above method includes a step of peeling the ceramic green sheet from the release film. Therefore, a release layer is formed on the base material of the release film.

[0005] In the release film, foreign matter may enter between the base material and the release layer. Therefore, there is a technique of increasing the thickness of the release layer so that foreign matter does not expose on the surface of the release layer. However, when the thickness of the release layer is increased, the release film is likely to warp.

[0006] When a multilayer electronic component is manufactured using a release film in which foreign matter exposes on the surface of the release layer, or a warped release film, the quality of the multilayer electronic component deteriorates.

[0007] Therefore, an object of the present invention is to provide a method for manufacturing a multilayer electronic component in which quality degradation due to the release film is suppressed, and a release film used in the manufacturing method.

Means for Solving the Problem

[0008] The method for manufacturing a multilayer electronic component of the present invention includes a step of forming a ceramic green sheet on the release film by applying a ceramic slurry on one side of the release film and drying it, a step of printing an internal electrode pattern on the ceramic green sheet, a step of obtaining a laminate by laminating at least a plurality of ceramic green sheets on which the internal electrode pattern is printed, a step of firing the laminate to obtain a ceramic sintered body, and a step of forming an external electrode on the outer surface of the ceramic sintered body. The release film includes a base material and a release layer, and the release layer is formed by overcoating a release agent on the base material.

[0009] Another method for manufacturing a multilayer electronic component of the present invention includes a step of forming a ceramic green sheet on the release film by applying a ceramic slurry on one side of the release film and drying it, a step of printing an internal electrode pattern on the ceramic green sheet, a step of obtaining a laminate by laminating at least a plurality of ceramic green sheets on which the internal electrode pattern is printed, a step of firing the laminate to obtain a ceramic sintered body, and a step of forming an external electrode on the outer surface of the ceramic sintered body. The release film includes a base material and a release layer, and the release layer is composed of two or more layers.

[0010] The release film of the present invention is a release film including a base material and a release layer, wherein the thickness of the release layer is 2 μm or more and 20 μm or less, and the release layer is formed by overcoating a release agent on the base material.

[0011] Another release film of the present invention is a release film including a base material and a release layer, wherein the thickness of the release layer is 2 μm or more and 20 μm or less, and the release layer is composed of two or more layers.

Advantages of the Invention

[0012] According to the present invention, it is possible to provide a method for manufacturing a laminated electronic component in which a quality degradation caused by a release film is suppressed, and a release film used in the manufacturing method.

Brief Description of the Drawings

[0013]

Figure 1

Figure 2A

Figure 2B

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Embodiments for Carrying Out the Invention

[0014] Before explaining the release film 100 of the present embodiment, the conventional release film 101 will be explained. (Release Film) FIG. 1 is a diagram showing a cross section of a conventional release film 101. The release film 101 includes a base material 102 and a release layer 1100. The release layer 1100 is formed on at least one surface of the base material 102.

[0015] (Base Material) An example of the material of the base material 102 is polyester. An example of a preferable material among polyesters is polyethylene terephthalate (PET). However, the material of the base material 102 is not limited to polyester.

[0016] An example of the thickness 301 of the base material 102 is 30 μm or more and 50 μm or less. However, the thickness 301 of the base material 102 is not limited.

[0017] (Release layer) Examples of the material of the release layer 1100 are materials with low surface free energy such as silicone resins and fluororesins. In other words, examples of the material of the release layer 1100 are oil-repellent materials. However, the material of the release layer 1100 is not limited to silicone resins and the like.

[0018] (Foreign matter) A substance that is exposed from the surface 120 of the base material 102 and is composed of a substance other than the material constituting the release layer 1100 is called a foreign matter 200. The substances constituting the foreign matter include substances derived from the environment and substances derived from materials.

[0019] Those derived from the environment include those derived from the human body and those derived from the atmosphere. Examples of substances derived from the human body are saccharides, proteins, sodium chloride, etc. Examples of substances derived from the atmosphere are silica, clay, etc.

[0020] Those derived from materials include those derived from polymerization catalysts and those derived from lubricants. Examples of substances derived from polymerization catalysts are antimony oxide, etc. Examples of substances derived from lubricants are silica, calcium carbonate, titanium dioxide, etc. Substances derived from materials exist as residual coarse particles.

[0021] When the thickness 302 of the release layer 1100 is thin, some of the foreign matters 200 may not be covered by the release layer 1100. The uncovered foreign matters 200 are exposed from the surface 122 of the release layer 1100. Also, some or all of the foreign matters exposed from the surface 122 of the release layer 1100 may protrude from the release layer 1100. The case where the thickness 302 of the release layer 1100 is thin means, for example, the case where the thickness 302 of the release layer 1100 is 0.1 μm or more and 2 μm or less.

[0022] (Multilayer electronic component) Take a multilayer electronic component example as multilayer ceramic capacitor 1. The dielectric layer included in the multilayer ceramic capacitor 1 is manufactured by applying a ceramic slurry onto a release film 101. When a foreign object 200 is exposed on the surface 122 of the release layer 1100, the quality of the multilayer ceramic capacitor 1 may deteriorate. Also, when the foreign object 200 protrudes from the release layer 1100, the quality deterioration becomes more significant. There is a risk of causing problems such as damage to the ceramic green sheet starting from the foreign object when peeling the ceramic green sheet from the PET film (release film), including a decrease in the smoothness of the dielectric layer. Note that peeling the ceramic green sheet from the PET film is performed, for example, prior to the lamination process.

[0023] (Thickness of the release layer) Therefore, it is conceivable to increase the thickness of the release layer 1100. This is because when the thickness 302 of the release layer 1100 is increased, it becomes difficult for the foreign object 200 to be exposed from the surface 122 of the release layer 1100.

[0024] (Warp of the release film) However, when the release layer 1100 is thickened, the release film 101 is likely to warp. This will be described with reference to FIGS. 2A and 2B. FIG. 2A shows a release film 101 in which the thickness 303 of the release layer 1100 is a standard thickness (for example, 0.1 μm or more and 2 μm or less). For the sake of explanation, the release film shown in FIG. 2A is referred to as release film 1001 and release film 1002. FIG. 2B shows a release film 101 in which the thickness 304 of the release layer 1200 is thick (for example, 2 μm or more and 20 μm or less). For the sake of explanation, the release film shown in FIG. 2B is referred to as release film 1003 and release film 1004.

[0025] (Immediately after coating) In FIGS. 2A and 2B, the release films 1001 and 1003 on the left side of the arrow 250 show the state immediately after applying the release layer 1100 or the material (release agent) of the release layer 1100 onto the base material 102. No warping has occurred in the release films 1001 and 1003.

[0026] (After a predetermined time has elapsed after the hardening is completed) In FIGS. 2A and 2B, the release films 1002 and 1004 on the right side of the arrow 250 show the state after a release agent is applied to the base material 102, the hardening of the release agent is completed, and then a further predetermined time has elapsed. No warpage has occurred in the release film 1002. In contrast, warpage has occurred in the release film 1004.

[0027] The thickness of the release layer 1100 of the release films 1001 and 1002 shown in FIG. 2A is thin enough that the stress generated when the release agent hardens is small and no warpage occurs in the release films 1001 and 1002. That is, the thickness of the release layer 1100 is such that the release films 1001 and 1002 do not warp when the release layer 1100 is formed. For example, the thickness of the release layer 1100 is 0.2 μm, but it is not limited thereto. When using the thin release layer 1100 as described above, the problem occurs that foreign matter is exposed on the surface of the release layer 1100 as described above.

[0028] The thickness 304 of the release layer 1200 of the release film 1004 shown in FIG. 2B is thicker than that in FIG. 2A, and the stress generated when the release layer 1200 hardens is larger than that in FIG. 2A. Since the stress generated when the release layer 1200 hardens becomes larger than that in FIG. 2A, the warpage generated in the release film 1004 becomes larger. Therefore, even after a predetermined time has elapsed after the hardening is completed, the stress does not disappear and the warpage remains. In the release film 1004, warpage in the (+) direction of Y occurs at both ends in the X direction.

[0029] (First Embodiment) Referring to FIG. 3, the release film 100 of the first embodiment will be described. FIG. 3 is a diagram showing a cross-section of the release film 100 of the first embodiment. The thickness 305 of the release layer 110 of the release film 100 shown in FIG. 3 is thicker than the thickness 302 of the release layer 110 shown in FIG. 1. The thickness 302 of the release layer 110 shown in FIG. 1 is, for example, 0.1 μm or more and 2 μm or less. The thickness 305 of the release layer 110 shown in FIG. 3 is, for example, 2 μm or more and 20 μm or less. The thickness 305 of the release layer 110 shown in FIG. 3 is preferably 2 μm or more and 5 μm or less.

[0030] Since the thickness 305 of the release layer 110 is thicker than the thickness 302 of the release layer 1100 shown in FIG. 1, most of the foreign matter 200 is covered by the release layer 110. In the release film 100 of the first embodiment, the foreign matter 200 is less likely to be exposed from the surface 122 of the release layer 110.

[0031] (Overcoating) The release layer 110 is formed by overcoating a release agent on the base material 102. Overcoating means applying a release agent, drying and curing it, and then applying another release agent on it and drying and curing it. The number of times of applying the release agent is not particularly limited as long as it is 2 or more.

[0032] In the release film 100 of the first embodiment, the release layer 110 is formed by overcoating. Therefore, the release film 100 is less likely to warp. Overcoating makes it possible to reduce the thickness of the release layer 110 formed by a single coating. Since the thickness of the release layer 110 formed by a single coating is thin, the stress generated during the drying and curing of the release agent is likely to disappear. In overcoating, after the stress disappears, the next coating is applied. By repeating this, it is possible to obtain a release film 100 with less warping while increasing the thickness of the release layer 110.

[0033] The release layer 110 shown in FIG. 3 is formed by overcoating a release agent. One of the release layers 110 formed by overcoating is defined as a coat layer. The release layer 110 is composed of a plurality of coat layers. FIG. 3 illustrates a configuration in which the number of coat layers is four. The release layer 110 includes a first coat layer 111, a second coat layer 112, a third coat layer 113, and a fourth coat layer 114. The first coat layer 111, the second coat layer 112, the third coat layer 113, and the fourth coat layer 114 are each formed from a release agent. Note that as long as the coat layer that is the outermost surface of the release layer 110 (the fourth coat layer 114 in the example shown in FIG. 3) contains a release agent, the other coat layers (the first coat layer 111 to the third coat layer 113 in the example shown in FIG. 3) do not have to contain a release agent.

[0034] The number of coat layers constituting the release layer 110 is not limited to four. The number of coat layers may be two or more. Also, the thicknesses of the respective coat layers do not have to be the same.

[0035] The means for forming the coat layer is not limited to coating, and for example, spraying may also be used.

[0036] (Embodiment 2) Referring to FIG. 4, the release film 100 of the second embodiment will be described. The description mainly focuses on matters different from the release film 100 of the first embodiment. In the release film 100 of the first embodiment, the first coat layer 111 to the fourth coat layer 114 are formed of the same material. Specifically, the first coat layer 111 to the fourth coat layer 114 are formed of a release agent. Each coat layer in the release film 100 of the second embodiment is referred to as a first coat layer 115, a second coat layer 116, a third coat layer 117, and a fourth coat layer 114. In the release film 100 of the second embodiment, the first coat layer 115, the second coat layer 116, the third coat layer 117, and the fourth coat layer 114 include layers formed of different materials.

[0037] In the release layer 110 shown in FIG. 4, only the fourth coat layer 114 is formed of a release agent, similar to the fourth coat layer 114 shown in FIG. 3. The first coat layer 115 to the third coat layer 117 are formed of materials other than the release agent. An example of a material other than the release agent is a primer resin. Thus, the coat layer may form only the coat layer that forms the surface 122 of the release layer with a release agent.

[0038] As described above, in the release film 100 of each embodiment, even if the thickness of the release layer 110 is increased by thick coating the release layer 110 by overcoating, the release film 100 does not warp. When the thickness of the coat layer applied at one time is thin, although stress that warps the film is applied, since it is not stress of a magnitude that can deform the base material 102, a film with a non-warped coat layer is produced. Then, over time, the stress disappears (stress relaxation occurs). After stress relaxation occurs, by repeating the application of a similarly thin coat layer, a thick-coated and non-warped film can be manufactured.

[0039] (Number of foreign matters) The number of foreign matters 200 exposed from the surface 122 of the release layer 110 can be counted by observing the surface 122 of the release layer 110 with a microscope or the like. The number of foreign matters exposed from the surface 122 of the release layer 110 visually recognized or detected when observing the surface 122 of the release layer 110 in plan view with an optical microscope is defined as the number of foreign matters. Plan view means looking at the surface 122 along the direction perpendicular to the surface 122 of the release layer 110. Using an optical microscope, observations were made in 100 fields of view in a range of 100 mm × 100 mm, and the number of foreign matters per unit square meter (m 2 ) was calculated. The number of foreign matters / m 2 was 10,000 pieces / m when the thickness of the release layer was 0.1 μm 2 and 10 pieces / m when the thickness of the release layer was 2 μm 2 .

[0040] (Method for manufacturing release film) A method for manufacturing a release film 100 will be described. A material for forming a release layer 110 is applied in multiple coats to a base material 102 such as a polyester film. The material for multiple coating can be prepared as follows. The material of the layer constituting the surface 122 of the release layer 110 is a release agent. The materials for forming other layers can be selected as appropriate. An example of the release agent to be applied is a silicone resin.

[0041] The thickness of each layer after drying and curing can be, for example, 1 μm. The number of layers for multiple coating can be, for example, 4 layers.

[0042] (Method for manufacturing a multilayer ceramic capacitor) With reference to FIGS. 5 to 8, a method for manufacturing a multilayer ceramic capacitor 1 will be described. In the method for manufacturing the multilayer ceramic capacitor 1, the above-described release film 100 is used.

[0043] FIG. 5 is a diagram showing a state in which a ceramic green sheet 10 and an internal electrode pattern 12 are formed on one side of a release film 100 and wound around a roller. As shown in FIG. 5, a ceramic slurry is applied to one side of the release film 100 and dried to form a ceramic green sheet 10 on the release film 100. Thereafter, an internal electrode pattern 12 is printed on the ceramic green sheet 10. The release film 100 on which the ceramic green sheet 10 and the internal electrode pattern 12 are formed is wound into a roll.

[0044] FIG. 6 is an enlarged view of the framed area 260 in FIG. 5. For the purpose of explanation, the n-th roll of the release film 100 is shown as the release film 1011. The n + 1-th roll of the release film is shown as the release film 1012. The back surface 124 of the base material 102 in the n + 1-th roll of the release film 1012 is in contact with the internal electrode pattern 12 formed on the n-th roll of the release film 1011.

[0045] FIG. 7 shows a state in which the release film 100 wound in a roll shape shown in FIG. 5 is processed into the laminate 2. The figure indicated by the arrow 281 in FIG. 7 shows a state in which the release film 100 or the like is unrolled from the roll. The ceramic green sheet 10 on the release film 100 is cut by a cutting blade into a portion to be peeled off and other portions of the ceramic green sheet 10. However, in this cutting, although the ceramic green sheet 10 is cut, the release film 100 is not completely cut. Further, the cutting position corresponds to the adjacent internal electrode patterns 12. Therefore, the ceramic green sheet 10 is cut for each internal electrode pattern 12.

[0046] The process proceeds in the order of the arrow 252 and the arrow 254. The figure indicated by the arrow 282 shows a state in which the ceramic green sheet 10 and the internal electrode pattern 12 are laminated. Before the ceramic green sheet 10 and the internal electrode pattern 12 are laminated, the release film 100 is peeled off from the ceramic green sheet 10. The release film 100 includes a release layer 110. Therefore, at the time of peeling, the release film 100 is easily peeled off from the ceramic green sheet 10. The ceramic green sheet 10 and the internal electrode pattern 12 peeled off from the ceramic green sheet 10 are laminated according to the structure of the laminate 2 and the like. After lamination, through pressing by water pressure or the like, the laminate 2 is formed. The figure indicated by the arrow 283 shows the laminate 2.

[0047] FIG. 8 is a diagram showing an outline of the multilayer ceramic capacitor 1. The laminate 2 becomes a ceramic sintered body 4 through firing. An external electrode 6 is formed on the outer surface of the ceramic sintered body 4, and the multilayer ceramic capacitor 1 is manufactured.

[0048] As described above, an example of the multilayer electronic component has been described as the multilayer ceramic capacitor 1. The multilayer electronic component is not limited to the multilayer ceramic capacitor. Other examples of the multilayer electronic component include a ceramic piezoelectric element, a thermistor element, and an inductor element.

[0049] The embodiments of the present invention have been described above. The present invention is not limited to the above-described embodiments, and various changes, modifications, and combinations are possible.

[0050] <1>A step of applying a ceramic slurry onto one side of a release film and drying it to form a ceramic green sheet on the release film; A step of printing an internal electrode pattern on the ceramic green sheet; A step of obtaining a laminate by laminating at least a plurality of ceramic green sheets on which the internal electrode pattern is printed; A step of firing the laminate to obtain a ceramic sintered body; A step of forming an external electrode on the outer surface of the ceramic sintered body, comprising: The release film includes a base material and a release layer, The release layer is formed by overcoating a release agent on the base material. A method for manufacturing a multilayer electronic component.

[0051] <2>A step of applying a ceramic slurry onto one side of a release film and drying it to form a ceramic green sheet on the release film; A step of printing an internal electrode pattern on the ceramic green sheet; A step of obtaining a laminate by laminating at least a plurality of ceramic green sheets on which the internal electrode pattern is printed; A step of firing the laminate to obtain a ceramic sintered body; A step of forming an external electrode on the outer surface of the ceramic sintered body, comprising: The release film includes a base material and a release layer, The release layer is composed of two or more layers. A method for manufacturing a multilayer electronic component.

[0052] <3>The thickness of the release layer is 2 μm or more and 20 μm or less. The method for manufacturing a multilayer electronic component according to <1> or <2>.

[0053] <4>A release film including a base material and a release layer, wherein the thickness of the release layer is 2 μm or more and 20 μm or less, and the release layer is formed by overcoating a release agent on the base material. Release film.

[0054] <5>A release film including a base material and a release layer, wherein the thickness of the release layer is 2 μm or more and 20 μm or less, and the release layer is composed of two or more layers. Release film.

[0055] <6>In the two or more layers, the layer constituting the surface of the release layer is composed of a release agent, and at least one of the remaining other layers is composed of something other than a release agent. The release film according to <5>.

[0056] <7>The number of foreign matters exposed from the surface of the release layer is 10 or less per m 2 in a plan view. The release film according to any one of <4> to <6>.

Explanation of Signs

[0057] 1 Multilayer electronic component (multilayer ceramic capacitor) 2 Laminate 4 Ceramic sintered body 6 External electrode 10 Ceramic green sheet 12 Internal electrode pattern 100 Release film 102 Base material 110 Release layer

Claims

1. A step of forming a ceramic green sheet on the release film by applying a ceramic slurry on one side of the release film and drying it; A step of printing an internal electrode pattern on the ceramic green sheet; A step of obtaining a laminate by laminating at least a plurality of ceramic green sheets on which the internal electrode pattern is printed; A step of firing the laminate to obtain a ceramic sintered body; A step of forming an external electrode on the outer surface of the ceramic sintered body, comprising: The release film includes a base material and a release layer, The release layer is formed by overcoating a release agent on the base material, A method for manufacturing a multilayer electronic component.

2. A step of forming a ceramic green sheet on the release film by applying a ceramic slurry on one side of the release film and drying it; A step of printing an internal electrode pattern on the ceramic green sheet; A step of obtaining a laminate by laminating at least a plurality of ceramic green sheets on which the internal electrode pattern is printed; A step of firing the laminate to obtain a ceramic sintered body; A step of forming an external electrode on the outer surface of the ceramic sintered body, comprising: The release film includes a base material and a release layer, The release layer is composed of two or more layers, A method for manufacturing a multilayer electronic component.

3. The thickness of the release layer is 2 μm or more and 20 μm or less, The method for manufacturing a multilayer electronic component according to claim 1 or 2.

4. A release film including a base material and a release layer, The thickness of the release layer is 2 μm or more and 20 μm or less, The release layer is formed by overcoating a release agent on the base material, Release film.

5. A release film including a base material and a release layer, The thickness of the release layer is 2 μm or more and 20 μm or less, The release layer is composed of two or more layers, Release film.

6. In the two or more layers, the layer constituting the surface of the release layer is composed of a release agent, At least one of the remaining other layers is composed of something other than a release agent, The release film according to claim 5.

7. The number of foreign matters exposed from the surface of the release layer is 10 pieces / m in plan view ２ or less The release film according to claim 4 or 5.

Images