Manufacturing method for multilayer electronic component and mold release film

Abstract

To provide a manufacturing method for a multilayer electronic component in which reduction in quality caused by a mold release film is prevented and provide a mold release film used for the same.SOLUTION: A manufacturing method for a multilayer electronic component 1 includes a step for coating one surface of a mold release film 100 with a ceramic slurry and forming a ceramic green sheet 10, a step for printing an internal electrode pattern 12 on the ceramic green sheet 10, a step for laminating the ceramic green sheets 10 and obtaining a laminated body 2, a step for obtaining a ceramic sintered body 4, and a step for forming an external electrode 6. The mold release film 100 includes a substrate 102 and a mold release layer 110. An intermediate layer 4000 is provided between the substrate 102 and the mold release layer 110. A material for forming the intermediate layer 4000 is a low-resilience material.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a method for manufacturing a multilayer electronic component and a release film.

Background Art

[0002] As a method for manufacturing a multilayer ceramic capacitor, which is an example of a multilayer electronic component, there is a method in which a ceramic slurry is applied to a release film to form a ceramic green sheet, an internal electrode pattern is printed on the ceramic green sheet, and then a plurality of them are laminated (for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The above method includes a step of peeling the ceramic green sheet from the release film. Therefore, a release layer is formed on the base material of the release film.

[0005] In the release film, foreign matter may enter between the base material and the release layer. Therefore, there is a technique of increasing the thickness of the release layer so that the foreign matter does not expose on the surface of the release layer. However, when the thickness of the release layer is increased, the release film is likely to warp.

[0006] When a multilayer electronic component is manufactured using a release film in which foreign matter exposes on the surface of the release layer or a warped release film, the quality of the multilayer electronic component deteriorates.

[0007] Therefore, an object of the present invention is to provide a method for manufacturing a multilayer electronic component in which a quality decrease due to a release film is suppressed, and a release film used in the manufacturing method.

Means for Solving the Problem

[0008] The method for manufacturing a multilayer electronic component of the present invention includes a step of forming a ceramic green sheet on the release film by applying a ceramic slurry on one side of the release film and drying it, a step of printing an internal electrode pattern on the ceramic green sheet, a step of laminating at least a plurality of ceramic green sheets on which the internal electrode pattern is printed to obtain a laminate, a step of firing the laminate to obtain a ceramic sintered body, and a step of forming an external electrode on the outer surface of the ceramic sintered body. The release film includes a base material and a release layer, and an intermediate layer is provided between the base material and the release layer. The material constituting the intermediate layer is a low-rebound material.

[0009] The release film of the present invention is a release film including a base material and a release layer, and an intermediate layer is provided between the base material and the release layer. The sum of the thickness of the release layer and the thickness of the intermediate layer is 2 μm or more and 20 μm or less, and the material constituting the intermediate layer is a low-rebound material.

Advantages of the Invention

[0010] According to the present invention, it is possible to provide a method for manufacturing a multilayer electronic component in which a quality degradation caused by a release film is suppressed, and a release film used in the manufacturing method.

Brief Description of the Drawings

[0011]

Figure 1

Figure 2A

Figure 2B

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Mode for Carrying Out the Invention

[0012] Before explaining the release film 100 of the present embodiment, a conventional release film 101 will be explained. (Release Film) FIG. 1 is a diagram showing a cross section of a conventional release film 101. The release film 101 includes a base material 102 and a release layer 1100. The release layer 1100 is formed on at least one surface of the base material 102.

[0013] (Base Material) An example of the material of the base material 102 is polyester. An example of a preferred material among polyesters is polyethylene terephthalate (PET). However, the material of the base material 102 is not limited to polyester.

[0014] An example of the thickness 301 of the base material 102 is 30 μm or more and 50 μm or less. However, the thickness 301 of the base material 102 is not limited.

[0015] (Release Layer) Examples of the material of the release layer 1100 are materials with low surface free energy such as silicone resin and fluororesin. In other words, examples of the material of the release layer 1100 are oil-repellent materials. However, the material of the release layer 1100 is not limited to silicone resin and the like.

[0016] (Foreign Matter) A substance that is exposed from the surface 120 of the base material 102 and is composed of a substance other than the material constituting the release layer 1100 is called a foreign matter 200. The substances constituting the foreign matter include substances derived from the environment and substances derived from materials.

[0017] Those derived from the environment include those derived from the human body and the atmosphere. Examples of substances derived from the human body are saccharides, proteins, sodium chloride, etc. Examples of substances derived from the atmosphere are silica, clay, etc.

[0018] Those derived from materials include those derived from polymerization catalysts and lubricants. Examples of substances derived from polymerization catalysts are antimony oxide, etc. Examples of substances derived from lubricants are silica, calcium carbonate, titanium dioxide, etc. Substances derived from materials exist as residual coarse particles.

[0019] When the thickness 302 of the release layer 1100 is thin, some foreign matters 200 may not be covered by the release layer 1100. The uncovered foreign matters 200 are exposed from the surface 122 of the release layer 1100. Also, some or all of the foreign matters exposed from the surface 122 of the release layer 1100 may protrude from the release layer 1100. The case where the thickness 302 of the release layer 1100 is thin means, for example, the case where the thickness 302 of the release layer 1100 is 0.1 μm or more and 2 μm or less.

[0020] (Multilayer Electronic Component) Take the multilayer ceramic capacitor 1 as an example of the multilayer electronic component. The dielectric layer included in the multilayer ceramic capacitor 1 is manufactured by applying a ceramic slurry to the release film 101. When foreign matters 200 are exposed on the surface 122 of the release layer 1100, the quality of the multilayer ceramic capacitor 1 may deteriorate. Also, when the foreign matters 200 protrude from the release layer 1100, the deterioration of the quality becomes more significant. There is a risk of causing problems such as damage to the ceramic green sheet starting from the foreign matters when peeling the ceramic green sheet from the PET film (release film), including a decrease in the smoothness of the dielectric layer. Note that peeling the ceramic green sheet from the PET film is performed, for example, before the lamination process.

[0021] (Thickness of Release Layer) Therefore, it is conceivable to increase the thickness of the release layer 1100. This is because when the thickness 302 of the release layer 1100 is increased, it becomes difficult for the foreign matter 200 to be exposed from the surface 122 of the release layer 1100.

[0022] (Warp of the release film) However, when the release layer 1100 is thickened, the release film 101 is likely to warp. This will be described with reference to FIGS. 2A and 2B. FIG. 2A shows a release film 101 in which the thickness 303 of the release layer 1100 is a standard thickness (for example, 0.1 μm or more and 2 μm or less). For the sake of explanation, the release film shown in FIG. 2A is referred to as a release film 1001 and a release film 1002. FIG. 2B shows a release film 101 in which the thickness 304 of the release layer 1200 is thick (for example, 2 μm or more and 20 μm or less). For the sake of explanation, the release film shown in FIG. 2B is referred to as a release film 1003 and a release film 1004.

[0023] (Immediately after coating) In FIGS. 2A and 2B, the release films 1001 and 1003 on the left side of the arrow 250 show the state immediately after the release layer 1100 or the material (release agent) of the release layer 1100 is coated on the base material 102. No warping has occurred in the release films 1001 and 1003.

[0024] (After a predetermined time has elapsed after the completion of curing) In FIGS. 2A and 2B, the release films 1002 and 1004 on the right side of the arrow 250 show the state after the release agent is coated on the base material 102, the curing of the release agent is completed, and then a further predetermined time has elapsed. No warping has occurred in the release film 1002. In contrast, warping has occurred in the release film 1004.

[0025] The thickness of the release layers 1100 of the release films 1001 and 1002 shown in Fig. 2A is thin enough that the stress generated when the release agent cures is small and the release films 1001 and 1002 do not warp. That is, the thickness of the release layer 1100 is such that the release films 1001 and 1002 do not warp when the release layer 1100 is formed. For example, the thickness of the release layer 1100 is 0.2 μm, but it is not limited thereto. When using the thin release layer 1100 as described above, the problem occurs that foreign matter is exposed on the surface of the release layer 1100 as described above.

[0026] The thickness 304 of the release layer 1200 of the release film 1004 shown in Fig. 2B is thicker than that in Fig. 2A, and the stress generated when the release layer 1200 cures is larger than that in Fig. 2A. Since the stress generated when the release layer 1200 cures becomes larger than that in Fig. 2A, the warp generated in the release film 1004 becomes larger. Therefore, even after a predetermined time has elapsed after the curing is completed, the stress does not disappear and the warp remains. In the release film 1004, warps in the (+) direction of Y occur at both ends in the X direction.

[0027] The release film 100 of the present embodiment will be described with reference to Figs. 3 and 4. Figs. 3 and 4 are diagrams showing cross-sections of the release film 100. An intermediate layer 4000 is provided between the base material 102 and the release layer 110 in the release film 100 of the present embodiment.

[0028] In the release film 100 shown in Fig. 3 and the release film 100 shown in Fig. 4, the thickness of the intermediate layer 4000 and the thickness of the release layer 110 are different. The thickness 4011 of the intermediate layer 4000 in Fig. 3 is thinner than the thickness 4013 of the intermediate layer 4000 in Fig. 4. The thickness 4012 of the release layer 110 in Fig. 3 is thicker than the thickness 4014 of the release layer 110 in Fig. 4.

[0029] In the release film 100 of the present embodiment, the sum of the thickness of the intermediate layer 4000 and the thickness of the release layer 110 is greater than the thickness 302 of the release layer 110 shown in FIG. 1. For example, the sum of the thickness 4011 of the intermediate layer 4000 and the thickness 4012 of the release layer 110 in FIG. 3 is greater than the thickness 302 of the release layer 110 shown in FIG. 1. Similarly, the sum of the thickness 4011 of the intermediate layer 4000 and the thickness 4012 of the release layer 110 in FIG. 4 is greater than the thickness 302 of the release layer 110 shown in FIG. 1.

[0030] The thickness 302 of the release layer 110 shown in FIG. 1 is, for example, 0.1 μm or more and 2 μm or less. The sum of the thickness 4011 of the intermediate layer 4000 and the thickness 4012 of the release layer 110 shown in FIG. 3 is, for example, 2 μm or more and 20 μm or less. The sum of the thickness 4011 of the intermediate layer 4000 and the thickness 4012 of the release layer 110 shown in FIG. 3 is preferably 2 μm or more and 5 μm or less. Similarly, the sum of the thickness 4011 of the intermediate layer 4000 and the thickness 4012 of the release layer 110 shown in FIG. 4 is, for example, 2 μm or more and 20 μm or less. The sum of the thickness 4011 of the intermediate layer 4000 and the thickness 4012 of the release layer 110 shown in FIG. 4 is preferably 2 μm or more and 5 μm or less.

[0031] The sum of the thickness of the intermediate layer 4000 and the thickness of the release layer 110 is large. Therefore, most of the foreign matter 200 is covered by the intermediate layer 4000 and the release layer 110. In the release film 100, the foreign matter 200 is less likely to be exposed from the surface 122 of the release layer 110.

[0032] Note that the ratio of the thickness of the intermediate layer 4000 to the thickness of the release layer 110 shown in FIGS. 3 and 4 is an example. The ratio of the thickness of the intermediate layer 4000 to the thickness of the release layer 110 can be changed as appropriate.

[0033] (Intermediate layer) In the release film 100, an intermediate layer 4000 is provided between the base material 102 and the release layer 110. Therefore, the release film 100 is less likely to warp. This is because the intermediate layer 4000 suppresses the occurrence of warping as compared with the case where only the release layer 110 is provided on the base material 102.

[0034] (Relaxation of warpage) The suppression of warpage by the intermediate layer 4000 is remarkable when the material constituting the intermediate layer 4000 is a low-rebound material. When the release layer 110 is applied to the base material 102, the release layer 110 shrinks. Stress due to shrinkage occurs in the directions of arrow 501 and arrow 502 shown in FIG. 3, and in the directions of arrow 503 and arrow 504 shown in FIG. 4. This stress acts to warp the release film 100 in the Y(+) direction on both sides in the X direction of the release film 100.

[0035] In the release film 100 of the present embodiment, an intermediate layer 4000 is provided between the base material 102 and the release layer 110. Further, the material constituting the intermediate layer 4000 is a low-rebound material. Therefore, by plastic deformation of the intermediate layer 4000, the stress generated in the release layer 110 can be absorbed. As a result, warpage of the release film 100 can be suppressed. Thereby, it is possible to manufacture a release film 100 having a large sum of the thickness of the release layer 110 and the thickness of the intermediate layer 4000 and suppressed warpage.

[0036] (Thickness of the intermediate layer) The sum of the thickness of the intermediate layer 4000 and the thickness of the release layer 110 is preferably a thickness that suppresses the exposure of foreign matter from the surface of the release layer 100. Further, the thickness of the intermediate layer 4000 is preferably a thickness that can relax the stress generated in the release layer 110.

[0037] The ratio of the thickness of the intermediate layer 4000 to the thickness of the release layer 110 can be arbitrarily set. As shown in FIG. 3, when the thickness 4011 of the intermediate layer 4000 is thinner than the thickness 4012 of the release layer 110, it becomes easier to ensure the smoothness of the surface of the release layer 110. As shown in FIG. 4, when the thickness 4013 of the intermediate layer 4000 is thicker than the thickness 4014 of the release layer 110, warpage of the release film 100 is more easily suppressed. Note that the thickness of the intermediate layer 4000 and the thickness of the release layer 110 may be the same.

[0038] (Material of the intermediate layer) The material of the intermediate layer 4000 can be, for example, silicone rubber. The material of the intermediate layer 4000 may contain a plasticizer.

[0039] (Number of foreign matters) The number of foreign matters 200 exposed from the surface 122 of the release layer 110 can be counted by observing the surface 122 of the release layer 110 with a microscope or the like. The number of foreign matters 200 exposed from the surface 122 of the release layer 110 visually recognized or detected when observing the surface 122 of the release layer 110 in plan view with an optical microscope is defined as the number of foreign matters. Plan view means looking at the surface 122 along the direction perpendicular to the surface 122 of the release layer 110. Using an optical microscope, observations in a range of 100 mm × 100 mm were performed for 100 fields of view, and the number of foreign matters per unit square meter (m 2 ) was calculated. The number of foreign matters / m 2 is 10,000 pieces / m when the thickness of the release layer is 0.1 μm 2 and 10 pieces / m when the thickness of the release layer is 2 μm 2 .

[0040] (Method for manufacturing a release film) A method for manufacturing the release film 100 will be described. A material for forming the intermediate layer 4000 is coated on the surface 120 of a base material 102 such as a polyester film. An example of the material is silicone rubber. Note that the release layer and the intermediate layer are not limited to one layer.

[0041] A material (release agent) for forming the release layer 110 is coated on the intermediate layer 4000. An example of the release agent is a silicone resin. A material for forming the release layer 110 is applied in multiple layers on the intermediate layer 4000. The material for multiple-layer coating can be as follows. The material of the layer constituting the surface 122 of the release layer 110 is a release agent. The materials for constituting other layers can be appropriately selected.

[0042] The thickness of each layer after drying and curing can be, for example, 1 μm. Note that the release layer and the intermediate layer are not limited to one layer.

[0043] (Method for manufacturing a multilayer ceramic capacitor) Referring to FIGS. 5 to 8, a method for manufacturing the multilayer ceramic capacitor 1 will be described. In the method for manufacturing the multilayer ceramic capacitor 1, the above-described release film 100 is used.

[0044] FIG. 5 is a view showing a state in which the ceramic green sheet 10 and the internal electrode pattern 12 are formed on one side of the release film 100 and wound around a roller. As shown in FIG. 5, a ceramic slurry is applied to one side of the release film 100 and dried to form the ceramic green sheet 10 on the release film 100. Thereafter, the internal electrode pattern 12 is printed on the ceramic green sheet 10. The release film 100 on which the ceramic green sheet 10 and the internal electrode pattern 12 are formed is wound into a roll.

[0045] FIG. 6 is an enlarged view of the frame 260 in FIG. 5. For the sake of explanation, the n-th roll of the release film 100 is shown as the release film 1011. The (n + 1)-th roll of the release film is shown as the release film 1012. The back surface 124 of the base material 102 in the (n + 1)-th roll of the release film 1012 is in contact with the internal electrode pattern 12 formed on the n-th roll of the release film 1011.

[0046] FIG. 7 shows a state in which the roll-wound release film 100 shown in FIG. 5 and the like are processed into the laminate 2. The view indicated by the arrow 281 in FIG. 7 shows a state in which the release film 100 and the like are unwound from the roll. The ceramic green sheet 10 on the release film 100 is cut by a cutting blade into a portion to be peeled off of the ceramic green sheet 10 and other portions. However, in this cutting, although the ceramic green sheet 10 is cut, the release film 100 is not completely cut. Also, the cutting position corresponds to the adjacent internal electrode patterns 12. Therefore, the ceramic green sheet 10 is cut for each internal electrode pattern 12.

[0047] The process proceeds in the order of arrow 252 and arrow 254. The figure indicated by arrow 282 shows a state in which the ceramic green sheet 10 and the internal electrode pattern 12 are laminated. Before the ceramic green sheet 10 and the internal electrode pattern 12 are laminated, the release film 100 is peeled off from the ceramic green sheet 10. The release film 100 includes a release layer 110. Therefore, at the time of peeling, the release film 100 is easily peeled off from the ceramic green sheet 10. The ceramic green sheet 10 and the internal electrode pattern 12 peeled off from the ceramic green sheet 10 are laminated according to the structure of the laminate 2 and the like. After lamination, the laminate 2 is formed through pressing by water pressure or the like. The figure indicated by arrow 283 shows the laminate 2.

[0048] FIG. 8 is a diagram showing an outline of the multilayer ceramic capacitor 1. The laminate 2 becomes a ceramic sintered body 4 through firing. An external electrode 6 is formed on the outer surface of the ceramic sintered body 4, and the multilayer ceramic capacitor 1 is manufactured.

[0049] As described above, an example of the multilayer electronic component has been described as the multilayer ceramic capacitor 1. The multilayer electronic component is not limited to the multilayer ceramic capacitor. Other examples of the multilayer electronic component include ceramic piezoelectric elements, thermistor elements, and inductor elements.

[0050] As described above, embodiments of the present invention have been described. The present invention is not limited to the above-described embodiments, and various changes, modifications, and combinations are possible.

Explanation of Reference Numerals

[0051] 1 Multilayer electronic component (multilayer ceramic capacitor) 2 Laminate 4 Ceramic sintered body 6 External electrode 10 Ceramic green sheet 12 Internal electrode pattern 100 Release film 101 Conventional release film 102 Base material 110 Release layer 120 Surface of the substrate 122 Surface of the release layer 124 Back surface of the substrate 200 Foreign matter 250 Arrow 260 Frame 270 Cutting line 301 Thickness of the substrate 302 Thickness of the release layer 303 Thickness of the release layer 304 Thickness of the release layer 305 Thickness of the release layer 4000 Intermediate layer

Claims

1. A step of forming a ceramic green sheet on the release film by applying a ceramic slurry on one side of the release film and drying it; A step of printing an internal electrode pattern on the ceramic green sheet; A step of obtaining a laminate by laminating at least a plurality of ceramic green sheets on which the internal electrode pattern is printed; A step of firing the laminate to obtain a ceramic sintered body; A step of forming an external electrode on the outer surface of the ceramic sintered body, comprising: The release film includes a base material and a release layer; An intermediate layer is provided between the base material and the release layer; The material constituting the intermediate layer is a low-rebound material; A method for manufacturing a multilayer electronic component.

2. The sum of the thickness of the release layer and the thickness of the intermediate layer is 2 μm or more and 20 μm or less; The method for manufacturing a multilayer electronic component according to Claim 1.

3. A release film including a base material and a release layer, wherein: An intermediate layer is provided between the base material and the release layer; The sum of the thickness of the release layer and the thickness of the intermediate layer is 2 μm or more and 20 μm or less; The material constituting the intermediate layer is a low-rebound material; A release film.

4. The number of foreign substances exposed from the surface of the release layer is 10 pieces / m in a plan view ２ or less The release film according to Claim 3.

Images