Electronic tester

Abstract

To provide a tester used for testing microelectronic circuits.SOLUTION: A tester apparatus is described. Various components contribute to the functionality of the tester apparatus, the components including an insertion and removal apparatus, thermal posts, independent gimbaling, the inclusion of a photodetector, a combination of thermal control methods, a detection circuitry in a socket lid, through-posts with stand-offs, and voltage retargeting.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] [Cross - Reference to Related Applications]

[0001] This application claims the benefit of U.S. Provisional Patent Application No. 62 / 466,462, filed Mar. 3, 2017, and U.S. Provisional Patent Application No. 62 / 526,089, filed Jun. 28, 2017, which are hereby incorporated by reference in their entirety.

[0002] 1) Field of the Invention

[0002] The present invention relates to a tester used to test ultra - small electronic circuits.

[0003] 2) Discussion of Related Art

[0003] Microelectronic circuits are typically assembled inside and on the top surface of a semiconductor wafer. Such wafers are then “singulated” or “diced” into individual dies. Such dies are generally attached to a support plate to provide rigidity to the support plate and to communicate electronically with the integrated circuit or microelectronic circuit of the die. The final packaging can include encapsulation of the die, and the resulting package can then be shipped to the customer.

[0004]

[0004] The die or package needs to be tested before shipping to the customer. Ideally, the die needs to be tested at an early stage to identify defects that occur during the early stages of manufacturing. Wafer - level testing is performed, for which contacts are provided to a processor and a contactor, and then the wafer is moved using the processor such that the contacts on the wafer contact the contacts on the contactor. Electrical and electronic signals are then exchanged between the contactor and the microelectronic circuits formed on the wafer.

[0005]

[0005] According to various embodiments, a wafer includes a substrate such as a silicon substrate or a printed circuit board, and one or more devices assembled within or attached to the substrate.

[0006] Alternatively, the wafer can be placed within a portable cartridge equipped with an electrical connection portion (interface) and a thermal chuck. While power and signals can be exchanged between the wafer via the electrical connection portion, the temperature of the wafer is thermally controlled by heating or cooling the thermal chuck.

[0007]

[0007] After singulating the wafer, it may again be necessary to test the individual dies, or the die may again be necessary to test after attaching it to a support plate.

Summary of the Invention

[0008]

[0008] The invention provides a test apparatus, the test apparatus including a frame, a slot assembly on the frame, a slot assembly connection portion on the slot assembly, a holding structure for installing a cartridge that holds a plurality of microelectronic devices, a horizontal transfer device operable to move the cartridge horizontally from a first position to a second position into the slot assembly, a vertical transfer device operable to move the cartridge and the slot assembly relative to each other in a first vertical direction to engage the slot assembly connection portion with a cartridge connection portion on the cartridge, and a tester connected via a first slot assembly connection portion and a cartridge connection portion to supply at least power to each microelectronic device and measure the performance of the microelectronic device. The vertical transfer device is operable to move the cartridge and the slot assembly relative to each other in a second vertical direction, the second vertical direction being opposite to the first vertical direction to disengage the slot assembly connection portion from the cartridge connection portion, and the horizontal transfer device is operable to move the cartridge horizontally from the second position to the first position out of the slot assembly.

[0009]

[0009] The invention also provides a method for testing an electronic device. The testing method includes holding a cartridge that holds a plurality of microelectronic devices at a first position that is at least partially outside the slot assembly on a frame; moving the cartridge horizontally from the first position into the slot assembly to a second position; moving the cartridge and the slot assembly relative to each other in a first vertical direction to engage a slot assembly connection portion on the slot assembly with a cartridge connection portion on the cartridge; testing the microelectronic devices via the first slot assembly connection portion and the cartridge connection portion, the testing being performed by supplying at least power to each microelectronic device and measuring the performance of the microelectronic device; moving the cartridge and the slot assembly relative to each other in a second vertical direction, the second vertical direction being opposite to the first vertical direction to disengage the slot assembly connection portion from the cartridge connection portion; and moving the cartridge horizontally from the second position out of the slot assembly to the first position.

[0010]

[0010] The invention further provides a cartridge. The cartridge is a socket made of an insulating material and having an upper side and a lower side. The upper side has a first configuration for releasably holding a first electronic device and has a first socket thermal opening formed through the socket from the lower side to the upper side. The cartridge also includes a connection portion connected to the socket for connecting the first device to an electrical tester; a chuck made of a thermally conductive material; and a first thermal post attached to the chuck, the first thermal post being inserted into the first socket thermal opening and having an end thermally connected to the first device, such that heat mainly passes through and is transmitted through the first thermal post as opposed to through the insulating material of the socket between the chuck and the first electronic device.

[0011]

[0011] The invention also provides a test piece, the test piece being a socket made of an insulating material and having an upper side and a lower side, the upper side having a first configuration for releasably holding a first electronic device, the socket having a first socket thermal opening formed therethrough from the lower side to the upper side, a first thermal conductive support being insertable into the first socket thermal opening from the lower side, a socket, a first pair of tweezers held by the socket for connecting the first device to a circuit board and being elastically pushable downwards, and a lid movable relative to the socket for pushing down the first pair of tweezers to bring the first electronic device into contact with the end of the first thermal support.

[0012]

[0012] The invention further provides a test piece, the test piece including a chuck made of a thermally conductive material and a first thermal support attached to the chuck, the end of which is insertable into the first socket thermal opening with the end thereof being thermally connected to a first device, such that heat is mainly transmitted therethrough as opposed to the insulating material of the socket between the chuck and the first electronic device.

[0013]

[0013] The invention also provides a method for testing one or more electronic devices, the method including the steps of releasably holding a first device in a first configuration on an upper side of a socket made of an insulating material, connecting the first device to an electrical tester via a connection portion connected to the socket, inserting a first thermal support attached to a chuck made of a thermally conductive material into a first socket thermal opening formed through the socket from the lower side to the upper side with the end of the first thermal support being thermally connected to the first device, and conducting heat between the chuck and the first electronic device, the heat being mainly conducted through the first thermal support as opposed to the insulating material of the socket.

[0014]

[0014] The invention further provides a cartridge, the cartridge being made of an insulating material and having an upper side and a lower side, and having on the upper side a socket having a first configuration for holding a first electronic device and a second configuration for holding a second electronic device, a lid, a first pressing plate rotatably attached to the lid, and a second pressing plate rotatably attached to the lid, the lid being arrangeable across the socket and movable towards the socket, by rotatably attaching the first pressing plate, the first electronic device can rotate the first pressing plate relative to the lid, and by rotatably attaching the second pressing plate, the second electronic device can rotate the second pressing plate independently of the first pressing plate relative to the lid, a first set of contacts held by the socket and connected to the first electronic device, a first set of terminals connected to the first set of contacts, a second set of contacts held by the socket and connected to the second electronic device, and a second set of terminals connected to the second set of contacts.

[0015]

[0015] The invention also provides a method for testing one or more electronic devices, the method comprising the steps of releasably holding a first electronic device in a first configuration on an upper side of a socket made of an insulating material, releasably holding a second electronic device in a second configuration on the upper side of the socket, arranging a lid across the socket, the lid having a first pressing plate rotatably attached to the lid and a second pressing plate rotatably attached to the lid, moving the lid towards the socket, by rotatably attaching the first pressing plate, the first electronic device can rotate the first pressing plate relative to the lid, and by rotatably attaching the second pressing plate, the second electronic device can rotate the second pressing plate independently of the first pressing plate relative to the lid, and connecting the first and second electronic devices to an electrical tester via connection parts connected to the socket.

[0016]

[0016] The invention further provides a cartridge, the cartridge including an electronic device holder having a structure for removably holding an electronic device having an input contact and a light emitter, an input contact located on the electronic device holder and connected to the input contact on the electronic device, the input contact supplying input power to the input contact of the electronic device via the input contact of the electronic device holder, and the light emitter transmitting light by the input power, a photodetector attached to the electronic device holder, detecting light and generating output power according to the magnitude of the light, and an output contact connected to the photodetector and measuring the output power.

[0017]

[0017] The invention also provides a method for testing one or more electronic devices, the method including inserting an electronic device having an input contact and a light emitter into a device holder, connecting the input contact on the electronic device holder to the input contact on the electronic device, supplying input power to the input contact of the electronic device via the input contact on the electronic device holder, and the light emitter transmitting light by the input power, detecting light, converting the detected light into output power, measuring the output power via an output contact, and removing the electronic device from the electronic device holder.

[0018]

[0018] The invention further provides a test apparatus, the test apparatus including a socket having a configuration for removably holding an electronic device having an input terminal and a light emitter, an input contact on the socket connected to the input terminal on the electronic device, the input contact supplying input power to the input terminal of the electronic device via the input contact on the socket, and the light emitter transmitting light by the input power, a temperature correction device on a first side of the socket, changing the temperature during operation to generate a temperature difference and heat conduction between the temperature correction device and the electronic device, and correcting the temperature of the electronic device, a heat sink on a side of the socket opposite to the temperature correction device, having a surface for absorbing light and generating heat inside by the absorption of light, and a heat dissipation device thermally connected to the heat sink and removing heat from the heat sink.

[0019]

[0019] The invention also provides a method for testing one or more electronic devices. The method includes inserting an electronic device having input contacts and a light emitter into a socket; connecting the input contacts on the socket to the input terminals on the electronic device; supplying input power to the input terminals on the electronic device via the input contacts on the socket, and causing the light emitter to transmit light by the input power; changing the temperature of a temperature correction device on a first side of the socket to create a temperature difference and a heat conduction between the temperature correction device and the electronic device, thereby correcting the temperature of the electronic device; absorbing light at the surface of a heat sink on the side of the socket opposite to the temperature correction device, and causing the heat sink to generate heat by the absorption of light; removing heat from the heat sink using a heat dissipation device thermally connected to the heat sink; and removing the electronic device from the socket.

[0020]

[0020] The invention further provides a cartridge. The cartridge is made of an insulating material and has an upper side, a lower side, and a configuration on the upper side. The cartridge includes a socket for holding an electronic device; a set of contacts held by the socket and connected to the electronic device; a set of terminals connected to the set of contacts held by the socket; a circuit board, wherein the set of terminals connected to the set of contacts is connected to a set of contacts on the circuit board; a lid; and a detector attached to the lid. When power is supplied to the electronic device via at least one of the set of terminals held by the socket, the lid is movable and is positioned across the socket together with the detector located at a predetermined position, and the detector is for detecting the function of the electronic device. The cartridge also includes a measurement channel connecting the detector to a connection portion on the circuit board.

[0021]

[0021] The invention also provides a method for testing one or more electronic devices. The method includes releasably holding the electronic device in a socket, the socket being made of an insulating material and having an upper side, a lower side, and a configuration on the upper side for holding the electronic device; connecting a set of contacts held in the socket to the electronic device; connecting a set of terminals connected to the set of contacts to a set of contacts on a circuit board; moving a lid with a detector across the socket; connecting the detector to a connection part on the circuit board via a measurement channel; supplying power to the electronic device through at least one of the contacts held by the socket; detecting the function of the electronic device when power is supplied to the electronic device through at least one of the contacts held by the socket; and measuring the function through the connection part.

[0022]

[0022] The invention further provides a cartridge, which includes a support plate having a through pillar opening, a backing structure on a first side of the support plate and including at least a circuit board having contacts, a conductor having a contact that contacts a terminal on an electronic device positioned on a second side of the support plate opposite to the first side, a portion held by the support plate, a terminal connected to a contact on the circuit board, a spring, a force generating device on a side of the electronic device opposite to the support plate, the force generating device and the support plate being relatively movable with respect to each other, and the force generating device deforming the spring so that the electronic device approaches the support plate, a standoff on a surface in a plane spaced from a plane of the surface of the support plate and preventing the electronic device from moving closer to the support plate, a force transmission portion extending at least partially through the pillar opening from the standoff, and a force transfer portion extending from the force transmission portion, the force transfer portion including a pillar held by the backing structure.

[0023]

[0023] The invention also provides a cartridge, the cartridge comprising the steps of: disposing a backing structure including at least a circuit board having contacts on a first side of a support plate; connecting the contacts of the conductors to terminals on an electronic device located on the first side of the support plate opposite the second side, the conductors having a portion held by the support plate and a terminal connected to the contacts on the circuit board; positioning a force generating device on the opposite side of the support plate of the electronic device; moving the force generating device and the support plate relative to each other to bring the electronic device closer to the support plate and deform a spring against its spring force; preventing the movement of the electronic device towards the support plate by a support having a surface in a plane spaced from the plane of the surface of the support plate; receiving the force from the electronic device by the standoff of the support; conducting the force from the standoff at least partially through an opening to a force transmission portion of the support, the support extending through a support opening formed at least partially through the support plate from the standoff; receiving the force at a force transfer portion extending from the force transmission portion of the support, the force transfer portion being held by the backing structure; and delivering the force to the backing structure.

[0024]

[0024] The invention further provides a test apparatus, the test apparatus comprising a voltage target system, a holder for holding a plurality of electronic devices in at least a first and a second cluster, at least one voltage source connectable to the electronic devices of the first cluster for simultaneously supplying a first test voltage to the electronic devices of the first cluster, a voltage source connectable to the electronic devices of the second cluster for simultaneously supplying the first test voltage to the electronic devices of the second cluster, at least one current detector connectable to the devices of the first cluster for measuring a first test current from the devices of the first cluster, the first test current from the devices of the first cluster measured by the current detector being the total current simultaneously supplied to the devices of the first cluster, and also connectable to the devices of the second cluster for measuring a first test current from the devices of the second cluster, the first test current from the devices of the second cluster measured by the current detector being the total current simultaneously supplied to the devices of the second cluster, the voltage target system performing a first comparison by comparing the measured first test current from the devices of the first cluster with a target current, a first voltage regulator for adjusting the first test voltage to a second test voltage for the first cluster in response to the first comparison, such that the first test current from the devices of the first cluster is adjusted closer to a second test current closer to the target current, the voltage target system performing a second comparison by comparing the measured first test current from the devices of the second cluster with the target current, and a second voltage regulator for adjusting the first test voltage to a second test voltage for the second cluster in response to the second comparison, such that the first test current from the devices of the second cluster is adjusted closer to a second test current closer to the target current.

[0025]

[0025] The invention also provides a method for testing a plurality of electronic devices. The method includes the steps of holding a plurality of electronic devices in at least a first and a second cluster; connecting at least one voltage source to the electronic devices in the first cluster to simultaneously supply a first test voltage to the electronic devices in the first cluster and being connectable to the electronic devices in the second cluster to simultaneously supply the first test voltage to the electronic devices in the second cluster; connecting at least one voltage source to the electronic devices in the second cluster to simultaneously supply the first test voltage to the electronic devices in the second cluster. Measuring, using at least one current detector, a first test current from the devices in the second cluster, wherein the first test current measured by the current detector from the devices in the second cluster is the total current simultaneously supplied to the devices in the second cluster; measuring, using at least one current detector, a first test current from the devices in the second cluster, wherein the first test current measured by the current detector from the devices in the second cluster is the total current simultaneously supplied to the devices in the second cluster; performing a first comparison using a voltage target system, the comparison being made by comparing the measured first test current from the devices in the first cluster with a target current; adjusting, using a first voltage regulator, the first test voltage to a second test voltage for the first cluster according to the first comparison, such that as a result, the first test current from the devices in the second cluster is adjusted to a second test current closer to the target current; performing a second comparison using a voltage target system, the comparison being made by comparing the measured first test current from the devices in the second cluster with the target current; adjusting, using a second voltage regulator, the first test voltage to a second test voltage for the second cluster according to the second comparison, such that as a result, the first test current from the devices in the second cluster is adjusted closer to a second test current closer to the target current.

[0026]

[0026] The invention will be further described by way of example with reference to the accompanying drawings.

Brief Description of the Drawings

[0027]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5A

Figure 5B

Figure 5C

Figure 6

Figure 7

Figure 8A

Figure 8B

Figure 9A

Figure 9B

Figure 10

Figure 11

Figure 12

Figure 13

Figure 14A

Figure 14B

Figure 15

Figure 16

Figure 17

Figure 18A

Figure 18B

Figure 19A

Figure 19B

Figure 20A

Figure 20B

Embodiments for Carrying Out the Invention

[0028]

[0046] Figure 1 of the accompanying drawings shows a tester device 10 according to an embodiment of the present invention. The tester device 10 includes a tester 12, a frame 14, a power bus 16, first and second slot assemblies 18A and 18B, a tester cable 20, a power cable 22, a cold liquid supply line 24A, a cold liquid return line 24B, a control liquid supply line 24C, a control liquid return line 24D, a vacuum line 24E, first and second cartridges 28A and 28B, and first and second wafers 30A and 30B.

[0029]

[0047] The slot assembly 18A includes a slot assembly body 32, a thermal chuck 34, a temperature detector 36, temperature correction equipment in the form of a heating resistor 38, a first slot assembly connection portion 40, and a plurality of second slot assembly connection portions. The second slot assembly connection portions include a control connection portion 44, a power connection portion 46, and a cold liquid supply connection portion 48A, a cold liquid return connection portion 48B, a control liquid supply connection portion 48C, a control liquid return connection portion 48D, and a vacuum connection portion 48E.

[0030]

[0048] The first slot assembly connection portion 40 is disposed within the slot assembly body 32 and is attached to the slot assembly body 32. The control connection portion 44, the power connection portion 46, and the second connection portions in the form of the connection portions 48A to 48E are attached to the left wall of the slot assembly body 32.

[0031]

[0049] The slot assembly 18A can be inserted into the frame 14 from left to right and removed from the frame 14 from right to left. The tester cable 20, the power cable 22, and the lines 24A to 2IE are manually connected to the control connection portion 44, the power connection portion 46, and the connection portions 48A to 48E, respectively. Before removing the slot assembly 18A from the frame 14, the tester cable 20, the power cable 22, and the lines 24A to 24E are first manually disconnected from the control connection portion 44, the power connection portion 46, and the connection portions 48A to 48E, respectively.

[0032]

[0050] The slot assembly 18A includes a motherboard 60 having test electronic devices, a plurality of channel module boards 62 having test electronic devices, a flexible connector 64, and a connection board 66. The control connection portion 44 and the power connection portion 46 are connected to the motherboard 60, and the thermal controller 50 is attached to the motherboard 60. The channel module board 62 is electrically connected to the motherboard 60. The flexible connector 64 connects the channel module board 62 to the connection board 66. The control function is provided via a conductor connecting the control connection portion 44 to the motherboard 60. Power is supplied to the motherboard 60 via the power connection portion 46. Both power and control are supplied from the motherboard 60 to the channel module board 62 via conductors. The flexible connector 64 provides a conductor connecting the channel module board 62 to the connection board 66. The connection board 66 includes a conductor connecting the flexible connector 64 to the first slot assembly connection portion 40. This first slot assembly connection portion 40 is connected to the control connection portion 44 and the power connection portion 46 via various conductors so that power and control can be supplied to the first slot assembly connection portion 40 via the control connection portion 44 and the power connection portion 46.

[0033]

[0051] The second slot assembly 18B includes components similar to those of the first slot assembly 18A, and like reference numerals indicate like components. The second slot assembly 18B is inserted into the frame 14, and the control connection portion 44, the power connection portion 46, and the connection portions 48A - 48E of the second slot assembly 18B are manually connected respectively to a set of separate connection components including a separate test instrument cable 20, a separate power cable 22, and separate lines 24A - 24E.

[0034]

[0052] Cartridge 28A includes a cartridge body formed by a thin chuck 72 and a back plate 74. A plurality of microelectronic devices are formed on wafer 30A. Wafer 30A is inserted into the cartridge body between thin chuck 72 and back plate 74. A plurality of cartridge contacts 76 contact respective contacts (not shown) on wafer 30A. Cartridge 28A further includes a cartridge connection portion 78 on back plate 74. Conductors within back plate 74 connect cartridge connection portion 78 to cartridge contacts 76.

[0035]

[0053] Cartridge 28A has a seal 77 connected between back plate 74 and thin chuck 72. A vacuum is applied to the region defined by seal 77, back plate 74, and thin chuck 72. The vacuum holds cartridge 28A together and ensures proper contact between cartridge contacts 76 and the contacts on wafer 30A.

[0036]

[0054] Temperature detector 36 is disposed within thermal chuck 34 and is thus sufficiently close to wafer 30A, or within one of five degrees Celsius, preferably within one of two degrees Celsius, of wafer 30A to detect the temperature of wafer 30A.

[0037]

[0055] Slot assembly 18A further has a door 82 connected to slot assembly body 32 by a hinge 84. When door 82 rotates to the open position, cartridge 28A can be inserted through door opening 86 into slot assembly body 32. Cartridge 28A is then lowered onto thermal chuck 34 and door 82 is closed. Thermal chuck 34 is attached to slot assembly body 32. Thermal chuck 34 then forms a holder having essentially a test station for the wafer.

[0038]

[0056] The slot assembly 18A further has a seal 88 positioned between the thermal chuck 34 and the thin chuck 72. A vacuum is applied to the region defined by the seal 88, the thermal chuck 34, and the thin chuck 72 via the vacuum connection portion 48E and the vacuum line 90. Thereby, a good thermal connection is obtained between the thermal chuck 34 and the thin chuck 72. When heat is generated by the heating resistor 38, the heat conducts through the thermal chuck 34 and the thin chuck 72 and reaches the wafer 30A. When the temperature of the thermal chuck 34 is lower than that of the wafer 30A, the heat conducts in the opposite direction.

[0039]

[0057] The cartridge connection portion 78 is engaged with the first slot assembly connection portion 40. Power and signals are supplied to the wafer 30A via the first slot assembly connection portion 40, the cartridge connection portion 78, and the cartridge contact 76. The performance of the devices within the wafer 30A is measured via the cartridge contact 76, the cartridge connection portion 78, and the first slot assembly connection portion 40.

[0040]

[0058] The door 82 of the slot assembly 18B is shown in the closed position. A front seal 100 is attached to the upper surface of the slot assembly 18A and seals against the lower surface of the slot assembly 18B. A front seal 102 is attached to the upper surface of the slot assembly 18B and seals against the lower surface of the frame 14. The doors 82 of the slot assemblies 18A and 18B and the front seals 100 and 102 provide a continuous and sealed front wall 104.

[0041]

[0059] The slot assembly 18A further includes a thermal controller 50. The temperature detector 36 is connected to the thermal controller 50 via the temperature feedback line 52. Power is supplied to the heating resistor 38 via the power connection portion 46 and the power line 54 such that the heating resistor 38 is heated. The heating resistor 38 then heats the thermal chuck 34 and the wafer 30A on the thermal chuck 34. The heating resistor 38 is controlled by the thermal controller 50 based on the temperature detected by the temperature detector 36.

[0042]

[0060] The hot chuck 34 is formed with a hot fluid passage 224. The hot fluid passage 224 contains a hot fluid. The hot fluid is preferably a liquid rather than a gas because the liquid is incompressible and heat convects more quickly with the liquid. Different hot fluids are used for different applications, and oil is used for the application with the highest temperature.

[0043]

[0061] The supply line and return line 226 and 228 of the control liquid are connected to the cold liquid supply and return connection portions 48C and 48D at opposite ends of the hot fluid passage 224, respectively. The heating resistor ३८ serves as a heater attached at a predetermined position to heat the hot chuck 34 that heats the hot fluid. If the hot fluid is recirculated through the hot fluid passage 224, a more uniform heat distribution is provided to the hot chuck 222, ultimately to the wafer 30A, by the hot chuck 34. The temperature of the fluid can also be controlled to apply heat to the hot chuck 222 to cool the hot chuck 34.

[0044]

[0062] The tester device 10 further includes a cooling system 240, a temperature control system 242, and a vacuum pump 244. Two coolant supply lines 24A connected to the first and second slot assemblies 18A and 18B are also connected to the cooling system 240 via a manifold (not shown). A plurality of additional manifolds connect the coolant return line 24B to the cooling system 240, the control fluid supply line 24C to the temperature control system 242, the control fluid return line 24D to the temperature control system 242, and the vacuum line 24E to the vacuum pump 244. Each slot assembly 18A or 18B has a respective cooling plate 246 with a respective fluid passage 248. The cooling system 240 circulates fluid through the fluid passage 248 to cool the cooling plate 246. The cooling plate 246 then keeps the channel module board 62 in a cooled state. The temperature control system 242 circulates fluid through the hot fluid passage 224 to control the temperature of the hot chuck 34 and transfer heat to and from the wafers 30A and 30B. The vacuum pump 244 supplies air at a vacuum pressure to the vacuum line 90.

[0045]

[0063] The slot assembly 18A includes a separator seal 108 attached to the upper surface of the slot assembly body 32 above its inner wall 106. The separator seal 108 seals against the lower surface of the slot assembly 18B. The slot assembly 18B has a separator seal 110 attached to the upper surface of its slot assembly body 32. The separator seal 108 seals against the lower surface of the frame 14. The inner walls 106 of the slot assemblies 18A and 18B and the separator seals 108 and 110 provide a continuously sealed separator wall 112.

[0046]

[0064] Figure 2 is a view of the tester apparatus 10 of Figure 1 taken along line 2-2. The frame 14 defines a first closed-loop air path 120. Air inlet and outlet openings (not shown) can be opened to convert the first closed-loop air path 120 to an open air path in which room temperature air passes through the frame 14 without recirculation. A closed-loop path is particularly useful in cleanroom environments because cleanroom environments emit less particulate matter into the air.

[0047]

[0065] The tester apparatus 10 further includes temperature compensation equipment in the form of a first fan 122 , a first fan motor 124 and a water cooler 126 .

[0048]

[0066] A first fan 122 and a first fan motor 124 are mounted to the top of the first closed-loop air path 120. A water chiller 126 is mounted to the frame 14 within the top of the first closed-loop air path 120.

[0049]

[0067] Cartridges 28A and 28B are positioned with slot assemblies 18A and 18B within the bottom half of first closed-loop air path 120.

[0050]

[0068] In use, current is supplied to the first fan motor 124. The first fan motor 124 rotates the first fan 122. The first fan 122 recirculates air through the first closed-loop air path 120 in a clockwise direction.

[0051]

[0069] The water cooler 126 then cools the air in the first closed-loop air path 120. The air then flows through the slot assemblies 18A and 18B and over the cartridge 28A or 28B, which is then cooled by the convective air.

[0052]

[0070] Figure 3 is a view showing the tester device 10 of FIG. 1 along 3-3. The frame 14 defines a second closed-loop air path 150. The tester device 10 further includes temperature correction equipment in the form of a second fan 152, a second fan motor 154, and a water cooler 156. There is no electric heater or damper as shown in FIG. 2. Air inlet and outlet openings (not shown) can be opened to change the first closed-loop air path 150 into an open air path through which room-temperature air passes through the frame 14 without recirculation.

[0053]

[0071] The closed-loop path is particularly useful in a cleanroom environment because there is less particulate matter released into the air in a cleanroom environment. The second fan 152 and the second fan motor 154 are positioned at the upper part of the second closed-loop air path 150. The water cooler 156 is disposed slightly downstream from the second fan 152 within the second closed-loop air path 150. The motherboard 60 and the channel module board 62 that form part of the slot assemblies 18A and 18B are disposed within the lower half of the second closed-loop air path 150.

[0054]

[0072] In use, current is supplied to the second fan motor 154, whereby the second fan 152 rotates. The second fan 152 then recirculates air clockwise through the second closed-loop air path 150. The air is cooled by the water cooler 156. The cooled air then passes over the motherboard 60 and the channel module board 62, and as a result, heat is conducted from the motherboard 60 and the channel module board 62 to the air by convection.

[0055]

[0073] The air recirculating through the first closed-loop air path 120 of FIG. 2 is separated from the air in the second closed-loop air path 150 of FIG. 3 by the continuous sealed partition wall 112 shown in FIG. 1. The continuous sealed front wall 104 shown in FIG. 1 prevents air from escaping from the first closed-loop air path 120.

[0056]

[0074] As shown in FIGS. 2 and 3, the same cooling system 240 used in FIG. 1 is also used to cool the water cooler 126. As shown in FIG. 4, the plenum 160 separates the first closed-loop air path 120 from the second closed-loop air path 150 in all regions except the region provided by the continuous sealed separator wall 112. The frame 14 has a left wall 162 and a right wall 164 that further define the closed-loop air paths 120 and 150.

[0057]

[0075] FIGS. 5A, 5B, and 5C show how the cartridges 30C, 30D, and 30E can be inserted or removed at any time, while all other cartridges are used to test the wafer equipment and are in various temperature gradient states. FIG. 6 shows the details of this concept. At time T1, the first cartridge is inserted into the frame 14, while the second cartridge is outside the frame 14. At T1, heating of the first cartridge begins. Between T1 and T2, the temperature of the first cartridge rises from room temperature, i.e., about 22° C., to a test temperature at T2 that is 50° C. to 150° C. higher than room temperature. At T2, power is supplied to the first cartridge and the equipment within the first cartridge is tested. At T3, the second cartridge is inserted into the frame 14 and heating of the second cartridge begins. At T4, the test of the first cartridge ends. At T4, cooling of the first cartridge also begins. At T5, the second cartridge reaches the test temperature, power is supplied to the second cartridge, and the wafer within the second cartridge is tested. At T6, the second cartridge reaches a temperature close to room temperature and is removed from the frame 14. Then, a third cartridge can be inserted in place of the first cartridge. At T7, the test of the second cartridge ends and its cooling begins. At T8, the second cartridge is cooled to room temperature or near room temperature and removed from the frame 14.

[0058]

[0076] Various tests can be performed at various temperatures. For example, a cartridge can be inserted and testing can continue at room temperature. Another test can be performed while the temperature is increased. Further testing can continue at the increased temperature. Further testing can be performed while the temperature is decreased. Two of these tests are single tests that continue from one temperature step to the next.

[0059]

[0077] 7, one slot assembly 18A can be removed from or inserted into frame 14. While slot assembly 18A can be inserted or removed, other slot assemblies in frame 14 can be used to test wafer devices, as will be described with reference to FIG.

[0060]

[0078] As shown in FIG. 8A, the backplate 74 includes a circuit board 500, a contactor 502, a plurality of pins 504, a retaining ring 506, fasteners 508, and posts 510.

[0061]

[0079] Circuit board 500 is made primarily of insulating material and has circuitry (not shown) formed therein. Contacts 512 are formed on an underside 514 of circuit board 500. Threaded openings 516 are formed on underside 514.

[0062]

[0080] The contactor 502 has a plurality of pin openings 518, post openings 520, and fastener openings 522 formed therethrough from a top side 524 to a bottom side 526. Each one of the pin openings 518 has a first area 528 and a second area 530. The first and second areas 528 and 530 are both circular when viewed in a plan view. The first area 528 has a larger diameter than the second area 530. The larger diameter of the first area 528 compared to the diameter of the second area 530 causes the first area 528 to be wider than the second area 530 when viewed in the cross-sectional side view of FIG. 8A .

[0063]

[0081] The post opening 520 has a first section 534 and a second section 536. The first section 534 and the second section 536 are both circular when viewed in plan. The diameter of the first section 534 is larger than the diameter of the second section 536. Because the diameter of the first section 534 is larger than the diameter of the second section 536, the first section 534 is wider than the second section 536 when viewed in the cross-sectional side view of FIG. 8A . The first and second sections 534 and 536 have vertical sidewalls. A horizontal landing 538 connects the vertical sidewalls of the first and second sections 534 and 536.

[0064]

[0082] Each pin 504 includes a conductive retaining portion 542, a coil spring 544, and first and second end pieces 546 and 548. The first end piece 546 has a first inner portion 550 and a first tip 552. The second end piece 548 has a second inner portion 554 and a second tip 556. The coil spring 544 and the first and second inner portions 550 and 554 are retained by the retaining portion 542, with the coil spring 544 positioned between the first and second inner portions 550 and 554. The first and second tips 552 and 556 protrude from the upper and lower ends, respectively, of the retaining portion 542.

[0065]

[0083] The upper surface of first tip 552 forms terminal 560. The lower end of second tip 556 forms contact 562. Coil spring 544 and first and second end pieces 546 and 548 are made of a metal and therefore conductive material. Coil spring 544 and first and second end pieces 546 and 548 form a conductor capable of conducting electrical current between terminal 560 and contact 562.

[0066]

[0084] Each pin is inserted through the upper surface 524 into its respective pin opening 518. The second tip 556 is slightly smaller than the second section 530 and is adapted to project from the lower side 526 through the second section 530. The retaining portion 542 is slightly narrower than the first area 528 but wider than the second area 530 to prevent the pin 504 from exiting from the lower side 526. Before the pin 504 is fully inserted into the pin opening 518 and the contactor 502 is attached to the circuit board 500, the first tip 552 still projects above the upper surface 524 of the contactor 502.

[0067]

[0085] The support post 510 has a standoff 564, a force transmission portion 566, and a force transfer portion 568. The support post 510 is made from a single piece of metal or other material selected for its strength compared to the strength and brittleness of the ceramic material of the contactor 502.

[0068]

[0086] The support post 510 is inserted through the upper side 524 into the support post opening 520. The standoff 564 and the force transmission portion 566 are slightly narrower than the second area 536. The force transfer portion 568 is slightly narrower than the first area 534 but wider than the second area 536. The lower surface 570 of the force transfer portion 568 abuts against the dance floor 538. The support post 510 is thereby prevented from slipping out from the lower side 526.

[0069]

[0087] The support post 510 has a surface 572 which, when the support post 510 is fully inserted as shown in FIG. 8A, is in a plane parallel to and below the surface of the lower side 526. When the support post 510 is fully inserted, the force transfer portion 568 has a surface 574 which is in the same plane as the upper surface 524.

[0070]

[0088] The circuit board 500 is positioned on top of the contactor 502. Each one of the contacts 512 contacts a respective one of the terminals 560. Since the terminals 560 are in a plane above the plane of the upper side 524, the lower side 514 is initially spaced apart from the upper side 524.

[0071]

[0089] The fastener 508 has a threaded shaft 578 and a head 580. The ring 506 has a ring opening 582. The ring 506 is disposed on the lower surface 584 of the contactor 502. The threaded shaft 578 is inserted from the bottom through the ring opening 582 and then through the fastener opening 522. The head 580 comes into contact with the lower surface of the ring 506. The head 580 is rotated, and then the threads of the threaded shaft 578 are screwed into the threads of the threaded opening 516. By the screwing operation, the circuit board 500 approaches the contactor 502 and the ring 506. The lower side 514 finally comes into contact with the upper side 524. The contact 512 moves the first end piece 546 downward into the pin opening 518 until the terminal 560 is in the same plane as the upper surface 524. The coil spring 544 contracts and thus deforms slightly to allow relative movement of the first end piece 546 toward the second end piece 548.

[0072]

[0090] The lower side 514 has a region that is stationary with respect to the surface 574 that forms part of the support 510. Since the support 510 abuts against the circuit board 500, the support 510 is in a position to transmit force to the circuit board 500 through the surface 572.

[0073]

[0091] A plurality of electronic devices are formed on the first wafer 32A. Each electronic device has a plurality of terminals 588 on the upper surface 590 of the first wafer 32A. When joining the backplane 74 and the first wafer 32A together, the first wafer 32A is arranged alongside the backplane 74 to ensure that each one of the terminals 588 contacts one of the contacts 562.

[0074]

[0092] While a vacuum pressure is generated in the region between the upper surface 590 and the lower side 526, the pressure below the lower surface 592 of the thin chuck 72 and above the upper surface 594 of the circuit board 500 remains at atmospheric pressure. Due to the pressure difference, equal and opposite forces F1 and F2 are generated on the circuit board 500 and the thin chuck 72.

[0075]

[0093] As shown in FIG. 8B, due to forces F1 and F2, the back plate 74 moves relatively towards the wafer 32A and the thin chuck 72. The coil spring 544 further compresses to allow the second end piece 548 to move into the pin opening 518. Each coil spring 544 deforms against its spring force, for example F3. However, the force F1 still exceeds the sum of all F3 added together. The upper surface 590 finally rests on the surface 572 of the standoff 564. Since the support post 510 abuts against the circuit board 500, the standoff 564 prevents the upper surface 590 from approaching and contacting the lower side 526 of the contactor 502. The first wafer 32A transmits a force F4 to the standoff 564. The force transmission portion 566 transmits the force F4 through the second region 536 of the support post opening 520. The force transfer portion 568 receives the force F4 from the force transmission portion 566 and transfers the force F4 to the circuit board 500 via the surface 574.

[0076]

[0094] Therefore, it can be seen that the force F4 is not transmitted by the contactor 502, thereby preventing stress that could cause damage to the brittle ceramic material of the contactor 502. Instead, the force F4 is directly transmitted from the electronic device in the form of the first wafer 32A through the support post 510 to the circuit board 500.

[0077]

[0095] In the embodiments described in FIGS. 8A and 8B, the contactor 502 serves as a support plate having a through pillar opening 520. The circuit board 500 serves as a backing structure on the first side of the support plate and includes at least one circuit board having contacts 512. The pins 504 serve as conductors having contacts 562 for contacting the terminals 588 on the electronic device, and the electronic device is positioned on the second side of the support plate opposite the first side of the support plate. The holding portion 542 serves as a part of the conductor held by the support plate. The conductor further has terminals 560 that connect to the contacts 512 on the circuit board 500. A spring in the form of a coil spring 544 is provided. The thin chuck 72 serves as a force generating device on the opposite side of the support plate among the electronic devices in the form of the first wafer 32A. The force generating device and the support plate are movable relative to each other to move the electronic device close to the support plate and deform the spring. The pillar 510 has a standoff 564 having a surface 572 in a plane spaced from the plane of the surface of the support plate to prevent the electronic device from moving close to the support plate. A force transmission portion 566 extends from the standoff 564, passes at least partially through the pillar opening 520, extends from the force transmission portion 566 to a force transfer portion 568, and the force transfer portion 568 is held by the backing structure.

[0078]

[0096] FIG. 9A shows a part of the tester device 10 used for inserting and removing the cartridge into and from each slot assembly, for example, the slot assembly 18A. The components of the tester device 10 shown in FIG. 9A include a frame 300, a part of the first slot assembly 18A, a first slot assembly connection portion 40, a holding structure 302, a horizontal transfer device 304, a vertical transfer device 306, a beam spring 308, and a lock mechanism 310.

[0079]

[0097] Frame 300 includes first and second mounts 312 and 314 that are spaced apart from each other. The horizontal transfer device 304 is a slide attached between the first and second mounts 312 and 314. The holding structure 302 is attached to slide along the horizontal transfer device 304. Opposite ends of the beam spring 308 are attached to the first and second mounts 312 and 314, respectively.

[0080]

[0098] The locking mechanism 310 includes a connection lever 316, a control lever 318, and a pressure lever 320. The control lever 318 is attached to the first mount 312 at a pivot connection 322. The vertical transfer device 306 is a rigid beam. The connection 324 connects the center points of the vertical transfer device 306 and the beam spring 308 to each other. The pressure lever 320 has a first link 326 rotatably connected to the control lever 318 and a second link 328 rotatably connected to an end of the vertical transfer device 306. In the unlocked configuration shown in FIG. 9A, a line 330 connects the pivot connection 322 to the second link 328, and the first link 326 is on the left side of the line 330.

[0081]

[0099] In use, the first cartridge 28A is placed on the holding structure 302. The first cartridge 28A then moves with the holding structure 302 from left to right to the first slot assembly 18A. The placement and movement of the first cartridge 28A can be performed manually or by a robot.

[0082]

[0100] The holding structure 302 slides along the horizontal transfer device 304. The connection lever 316 connects an end of the control lever 318 to the holding structure 302. When the holding structure 302 moves horizontally along the horizontal transfer device 304, the connection lever 316 rotates the control lever 318 counterclockwise around the pivot connection 322.

[0083]

[0101] The first link 326 rotates counterclockwise together with the control lever 318. The pressure lever 320 converts the movement of the first link 326 into a downward movement of the second link 328. Initially, the downward movement is minimal, but when the first cartridge 28A is fully inserted into the first slot assembly 18A, the vertical movement becomes more prominent, and the vertical transfer device 306 engages the first cartridge 28A with the first slot assembly 18A. The horizontal transfer device 304 is thus operable to horizontally move the first cartridge 28A from the first position to the second position and into the first slot assembly 18A, and the vertical transfer device 306 is operable to move the first cartridge 28A and the first slot assembly 18A relative to each other in a first vertical direction, whereby the slot assembly connection portion 40 engages the cartridge connection portion on the first cartridge 28A.

[0084]

[0102] The control lever 318 is shown in the unlocked position in FIG. 9A, where the first link 326 is on the first side of line 330 that connects the pivot connection 322 and the second link 328. The control lever 318 rotates from the unlocked position shown in FIG. 9A through the compressed position, where the beam spring 308 is deformed by the vertical transfer device 306 through the connection 324 by bending the beam spring 308 against its spring force, and the first link 326 aligns with the pivot connection 322 and the second link 328. As shown in FIGS. 9B and 10, the control lever 318 continues to rotate from the compressed position to the locked position. The first link 326 is on the right side of line 330 in the locked position, and thus on the second side opposite the first side of line 330. Since the first link 326 passes line 330 and the beam spring 308 is deformed against its spring force, the first cartridge 28A is locked in place relative to the slot assembly connection portion 40.

[0085]

[0103] The system can be unlocked by moving the holding structure 302 from right to left. The control lever 318 rotates in the clockwise direction, and the first link 326 moves from right to left and passes through the line 330. The vertical transfer device 306 moves in the upward direction, i.e., the second vertical direction opposite to the first vertical direction, to release the first cartridge 28A from the slot assembly connection portion 40. As the holding structure 302 further moves along the horizontal transfer device 304, the first cartridge 28A is removed from the first slot assembly 18A.

[0086]

[0104] FIG. 11 shows a cartridge 340 according to a further embodiment of the present invention, including a heat sub-assembly 342, a board and socket sub-assembly 344, and a plurality of lids 346.

[0087] <e

[0105] FIG. 12 shows a part of the heat sub-assembly 342, a part of the board and socket sub-assembly 344, and one of the lids 346.

[0088]

[0106] FIG. 13 shows Detail A of FIG. 12, including a part of the heat sub-assembly 342, a part of the board and socket sub-assembly 344, and a part of the lid 346. FIG. 13 further shows the first electronic device 348.

[0089]

[0107] The heat sub-assembly 342 includes a thin chuck 350, a first heat retainer 352, and a first heat support 354. The thin chuck 350 has an upper surface 356 with an opening 358 formed therein. The first heat retainer 352 and the first heat support 354 are machined from a single metal piece. Both the first heat retainer 352 and the first heat support 354 have a circular cross-section in their respective planes parallel to the axis of the first heat support 354 when viewed in plan view. The cross-section of the first heat retainer 352 is larger than the cross-section of the first heat support 354.

[0090]

[0108] The first heat retainer 352 is inserted into the opening 358 through the upper surface 356. The first heat support 354 extends upward from the first heat retainer 352. Most of the first heat support 354 is disposed above the upper surface 356. The first heat retainer 352 has an upper end with a first heat surface 360. The first heat retainer 352 is press-fitted into the opening 358 to a desired depth such that the first heat surface 360 is at a desired distance from the upper surface 356.

[0091]

[0109] Since the first heat support 354, the first heat retainer 352, and the thin chuck 350 are all made of metal, they are good heat conductors. The cross-section of the first heat retainer 352 conducts more heat from the first heat retainer 352 to the thin chuck 350 compared to the cross-section of the first heat support 354.

[0092]

[0110] The board and socket subassembly 344 includes a circuit board 362, a socket 364, a first set of pins 366 for an electronic device, and a first set of pins 368 for a detector. The pins 366 and 368 are pogo pins that include springs and can be compressed against the spring force of the springs.

[0093]

[0111] The socket 364 includes a lower part 370 and an upper part 372. One of each of the pins 366 and 368 is held within the socket 364 between the lower part 370 and the upper part 372. The upper part 372 is configured as a first recess 376 for holding the first electronic device 348. Each of the pins 366 has a respective contact 378 that extends above the surface of the first recess configuration 376. Each of the pins 368 has a respective contact 380 that extends above the upper surface 382 of the upper part 372.

[0094]

[0112] All of the contacts 380 of the pins 368 are in the same plane. All of the contacts 378 of the pins 366 are in the same plane. The plane of the contacts 380 is parallel and above the plane of the contacts 378. All of the terminals 392 of the pins 368 are in the same plane as the terminals 392 of the pins 366.

[0095]

[0113] The circuit board 362 has a circuit (not shown) formed thereon. A contact 388 is formed within the upper surface 390 of the circuit board 362.

[0096]

[0114] The socket 364 is positioned on the circuit board 362. The circuit board 362 is thus disposed between the thin chuck 350 and the socket 364. Each one of the pins 366 and 368 initially has a respective terminal 392 that extends below the lower surface 394 of the lower part 370. Each one of the terminals 392 is in contact with a respective one of the contacts 388. The pins 366 and 368 compress against their spring force until the lower surface 394 contacts the upper surface 390. The terminals 392 of the pins 366 and 368 move into the socket 364 until they are in the same plane as the lower surface 394. The socket 364 is then permanently attached to the circuit board 362.

[0097]

[0115] Socket 364 has a first socket thermal opening 398 formed to penetrate from the lower side to the upper side. Circuit board 362 has a first circuit board thermal opening 400 formed to penetrate from the lower side to the upper side. The first socket thermal opening 398 is aligned with the first circuit board thermal opening 400. As shown in FIG. 11, the thermal subassembly 342 and the board and socket subassembly 344 are initially separated from each other. The board and socket subassembly 344 is then positioned above the thermal subassembly 342. The first circuit board thermal opening 400 is positioned above the upper end of the first thermal post 354. The board and socket subassembly 344 then further descends until the first thermal post 354 passes through the first socket thermal opening 398. The lower surface 402 of the circuit board 362 rests on the upper surface 356 of the thin chuck 350. The first thermal post 354 loosely fits within the first socket thermal opening 398 and the first circuit board thermal opening 400. The first thermal post 354 extends above the upper surface 356 because it is slightly longer than the total length of the first socket thermal opening 398 and the first circuit board thermal opening 400. The first thermal surface 360 is thus disposed slightly above the upper surface of the first recess configuration 376. The contact 378 is disposed in a plane above the plane of the first thermal surface 360 at this stage.

[0098]

[0116] Socket 364 is made of an electrically and thermally insulating material. Pins 366 and 368 provide conductors through the socket 364. Circuit board 362 is also made of an electrically and thermally insulating material. Contact 388 forms part of an electrical circuit within the insulating material of the circuit board 362. The first thermal post 354 provides a heat conduction path between the first recess configuration 376 and the first heat fixture 352 connected to the thin chuck 350. The first thermal post 354 is electrically and thermally insulated from the conductors within the socket 364 and the circuit board 362. Heat conducts mainly through the first thermal post 354 as opposed to the insulating materials of the socket 364 and the circuit board 362.

[0099]

[0117] The cover 346 includes a circuit board 406 and a heat sink 408. The cartridge 340 further includes a first photodetector 410, a first adjustable component 412, and a first coil spring 414.

[0100]

[0118] The circuit board 406 is made of an electrically and thermally insulating material. Conductive terminals 416 are formed on the lower surface 418 of the circuit board 406. The terminals 416 form part of a circuit (not shown) formed within the circuit board 406.

[0101]

[0119] The first photodetector 410 is attached to the upper surface 420 of the circuit board 406. The first photodetector 410 is connected to the terminals 416 via a circuit within the circuit board 406. One of the terminals 416 can, for example, supply power to the first photodetector 410. When light strikes the first photodetector 410, the first photodetector 410 converts the energy of the light and outputs electric power. The other terminals 416 can serve as output contacts connected to the first photodetector 410 for measuring the output power.

[0102]

[0120] The first adjustable component 412 has a pressing plate 422, side walls 424 extending upward from the pressing plate 422, and a rim 426 extending outward from the side walls 424. A first opening 428 is formed in the circuit board 406. The first adjustable component 412 is inserted into the first opening 428. The pressing plate 422 then extends below the lower surface 418. The rim 426 rests on the upper surface 420. The first opening 428 is slightly larger than the width between the side walls 424. Due to the difference in width, the first adjustable component 412 is rotatable relative to the circuit board 406 by a few degrees around a first axis 432. Due to the difference in width, the first adjustable component 412 is also rotatable relative to the circuit board 406 clockwise and counterclockwise around a second axis 434 that intersects the plane of the paper and is perpendicular to the first axis 432. Such orthogonal rotation allows the first adjustable component 412 to perform a small amount of gimbal movement relative to the circuit board 406.

[0103]

[0121] The heat sink 408 has a first recess 436. The first coil spring 414 is inserted between the side walls 424. The lower end of the first coil spring 414 rests on the upper surface 438 of the pressing plate 422. The upper end of the first coil spring 414 extends above the mouth edge 426. The heat sink 408 is positioned above the circuit board 406 with the upper end of the first coil spring 414 disposed within the first recess 436. The lower surface 440 of the heat sink 408 is initially spaced from the upper surface 420. When the heat sink 408 moves toward the circuit board 406, the first coil spring 414 contracts and deforms against its spring force. The lower surface 440 contacts the upper surface 420. The heat sink 408 is then fixed to the circuit board 406 with a fastener (not shown). Due to the small force generated by the first coil spring 414, the first adjustable component 412 is then biased in a direction exiting from the lower surface 418.

[0104]

[0122] The pressing plate 422 has a first opening 442 therein. The heat sink 408 has a first cavity 444 defined therein. A light absorption coating is formed on the surface of the first cavity 444.

[0105]

[0123] In use, the first electronic device 348 is inserted into the first recess configuration 376. The lower terminals 446 of the first electronic device 348 contact the contacts 378. The lower surface 448 of the first electronic device 348 is, at this stage, spaced from the first heat surface 360.

[0106]

[0124] The lid 346 is disposed above the board and socket subassembly 344. The lid 346 then moves toward the board and socket subassembly 344. Each one of the terminals 416 contacts one of the contacts 380 respectively. The lower surface 450 of the pressing plate 422 contacts the upper surface 452 of the first electronic device 348. The lower surface 448 of the first electronic device 348 remains spaced from the first heat surface 360.

[0107]

[0125] The operator manually presses the lid 346, thereby further moving the lid 346 towards the board and socket sub-assembly 344. Each of the pins 366 and 368 compresses against its spring force, thus elastically pushing down the contacts 378 and 380 against the spring force of the springs within the pins 366 and 368. The lower surface 448 of the first electronic device 348 comes into contact with the first heat surface 360.

[0108]

[0126] If there is an angular misalignment between the first heat surface 360 and the lower surface 448 of the first electronic device 348, the first electronic device 348 is rotated by the first heat surface 360 until the lower surface 448 lies in the same plane as the first heat surface 360. By rotating the first adjustable component 412 relative to the lid 346, the lower surface 448 of the first electronic device 348 can be made to rest on the first heat surface 360. A good thermal contact between the first heat surface 360 and the lower surface 448 is thereby ensured. The first coil spring 414 compresses to adjust the height of the first electronic device 348. Further, the first adjustable component 412 is rotatably attached to the lid 346, and as a result, the first electronic device 348 can be rotated relative to the first heat surface 360 by rotating the first adjustable component 412. The lid 346 is then fixed to the board and socket sub-assembly 344.

[0109]

[0127] The socket 364 and the lid 346 together form an electronic device holder for holding the first electronic device 348. A cartridge connection portion (not shown) on the circuit board 362 exchanges power and communication with the contact 388. The pin 366 supplies power and communication to the first electronic device 348 via the terminal 446.

[0110]

[0128] The first electronic device 348 can include, for example, a laser or other optical transmitter. The first electronic device 348 can have, for example, a laser transmitter on its upper surface 452. When power and communication are supplied to one of the contacts 378 serving as an input contact and one of the terminals 446 serving as an input terminal, the laser transmitter of the first electronic device 348 transmits laser light through the first opening 442 and through the first coil spring 414 and the side wall 424 into the first cavity 444.

[0111]

[0129] Most of the light is absorbed by the light-absorbing material on the surface of the first cavity 444 and converted into heat. The heat conducts through the heat sink 408.

[0112]

[0130] A small percentage of the light is reflected at the surface of the first cavity 444 and detected by the first photodetector 410. The first photodetector 410 is supplied with power through a conductor formed by one of the contacts 388, one of the pins 368, and one of the terminals 416, and a circuit formed within the circuit board 406. When the first photodetector 410 detects light, it converts the light into power. The magnitude of the power is related to the magnitude of the light detected by the photodetector 410. The first photodetector 410 then supplies power to the circuit board 362 through the conductor, which is formed together by a circuit within the circuit board 406, one of the terminals 416, one of the pins 368, and one of the contacts 388, and the power is ultimately supplied to the cartridge connection portion on the circuit board 362.

[0113]

[0131] The circuit board 406 and the pin 368 provide a measurement channel for connecting the first photodetector 410 to the circuit board 362, even if the first photodetector 410 is on the opposite side of the first electronic device 348 instead of the circuit board 362. In a similar manner, another type of detector other than a photodetector can be used to detect functions of the electronic device other than the light sent by the electronic device. For example, it is possible to detect the current of a terminal on the upper surface of the electronic device and generate a similar measurement channel via pins located in sockets leading to the circuit board above the electronic device and the circuit board below the electronic device. In such a configuration, pins such as the pin 368 can be held by the socket and serve as detector measurement pins forming part of the measurement channel.

[0114]

[0132] The temperature of the first electronic device 348 is controlled by conducting heat through the first heat post 354. The first electronic device 348 can be heated or cooled, for example, via the first heat post 354. The first electronic device 348 can be cooled, for example, by conducting heat from the first electronic device 348 through the first heat post 354 and the first heat retainer 352 to the thin chuck 350. The first electronic device 348 can be heated by conducting heat from the thin chuck 350 through the first heat retainer 352 and the first heat post 354 to the first electronic device 348.

[0115]

[0133] The thin chuck 350 is on the first side of the electronic device 348 opposite to the heat sink 408. Therefore, it can be seen that the temperature of the first electronic device 348 can be controlled independently of heat dissipation by the heat sink 408 thanks to the laser light transmitted by the first electronic device 348.

[0116]

[0134] Referring back to FIG. 12, a plurality of electronic devices can be tested using one socket 364 and one lid 346. The socket 364 includes, for example, a second heat retainer 352A, a second heat post 354A, a second heat surface 360A, a second pair of tweezers 366A for a second electronic device, a second pair of tweezers 368A, a second recess configuration 376A for a second electronic device (not shown), a second socket heat opening 398A, a second circuit board heat opening 400A, a second photodetector 410A, a second adjustable component 412A, a second coil spring 414A, a second opening 428A, a second recess 436A, a second opening 442A, and a second cavity 444A. Similar reference numerals indicate similar components and functions.

[0117]

[0135] The light transmitted by the first and second electronic devices can be independently detected by the first and second photodetectors 410 and 410A. The heat caused by the light of the first and second electronic devices is dissipated through the same heat sink 408. A plurality of fins 454 are connected to the heat sink 408 and extend therefrom. Heat conducts through the fins 454 and then convects from the fins 454 to the surrounding air. The fins 454 thus serve as heat dissipating devices that are thermally connected to the heat sink 408 to remove heat from the heat sink 408.

[0118]

[0136] The temperatures of the first and second electronic devices are controlled together through the same thin chuck 350. When the electronic devices are cooled, for example, heat is transmitted through the first and second heat posts 354 and 354A to the first and second heat retainers 352 and 352A respectively, and then from the first and second heat retainers 352 and 352A to the thin chuck 350.

[0119]

[0137] The first and second electronic devices are independently rotatable so as to be in contact with the first and second heat surfaces 360 and 360A respectively. The independent rotation of the first and second electronic devices is allowed and controlled by the independent gimbal movement of the first and second adjustable components 412 and 412A with respect to the lid 346.

[0120]

[0138] Referring again to FIG. 11, sixteen sockets 364 are attached to the circuit board 362. Each socket 364 has its respective lid 346. Each lid 346 has its respective fixing structure 460, and each socket 364 has its respective fixing structure 462. The lid 346 moves towards the socket 364. As described above, the lid 346 is then pressed against the socket 364. The fixing structures 460 and 462 then engage with each other to fix the lid 346 to the socket 364 and maintain thermal and electrical integrity.

[0121]

[0139] The thin chuck 350 has a plurality of heat posts fixed thereto in sixteen groups of sixteen. Each group of heat posts is inserted through one of each of the sockets 364. The electronic devices held by all sixteen sockets 364 are maintained at their temperatures using a single thin chuck 350.

[0122]

[0140] The cartridge connection portion 464 is formed on the lower surface of the circuit board 362. The cartridge connection portion 464 is connected to the contact 388 shown in FIG. 13 via a circuit (not shown). The cartridge connection portion 464 is used to connect the cartridge 340 to an electrical tester as described above. The thin chuck 350 is thermally connected to the heat chuck as described above. The heat chuck serves as a temperature correction device that controls the heat exchanged between the thin chuck 350.

[0123]

[0141] Following the testing of the electronic device, the cartridge 340 is removed from the system, the lid 346 is removed, and the electronic device is removed from the socket 364.

[0124]

[0142] The thermal post 354 also serves as a post that transmits force in the same manner as the embodiments described in FIGS. 8A and 8B. The lid 346 serves as a force generating device. A part of the force generated by the lid 346 is balanced by the force generated by the springs in the pins 366 and 368. The remaining force not balanced by the pins 366 and 368 is absorbed by the standoff of the post 354 having the surface 360, thereby supporting the electronic device 348 and preventing the electronic device 348 from moving closer to the base of the recess configuration 376. The central portion of the post 354 serves as a force transmission portion that extends from the standoff through the opening 398. The circuit board 362 and the thin chuck 350 together form a backing structure. The lower portion of the post 354 generally delivers force to the backing structure. Specifically, the force is transmitted through the heat retainer 352 to the thin chuck 350 that forms a part of the backing structure. The press fit between the heat retainer 352 and the thin chuck 350 is strong enough to maintain its state, and as a result, the force does not move the heat retainer 352 relative to the thin chuck 350.

[0125]

[0143] FIG. 14A shows the embodiments of FIGS. 11, 12, and 13 and further shows details thereof including the fastener 600 and the post 602.

[0126]

[0144] A post opening 604 and a fastener opening 606 are formed through the socket 364. The post opening 520 has a first region 608 and a second region 610. The second region 610 is wider than the first region 608. The first region 608 can be formed, for example, through the upper portion 372, and the second region 610 can be formed through the lower portion 370. The dance floor 612 connects the first region 608 to the second region 610.

[0127]

[0145] Post 602 includes standoff 614, force transfer portion 616, and force transfer portion 618. Post 602 is inserted into post opening 604 from the bottom until surface 620 of force transfer portion 618 abuts landing 612. Threaded shaft 622 of fastener 600 is inserted through fastener opening 606 from the top. Head 624 is rotated, and then the threads on threaded shaft 622 thread into the threads of threaded opening 626 of low-profile chuck 350. Low-profile chuck 350 is made of metal, which provides an excellent fastener for fastener 600. As fastener 600 is rotated further, head 624 moves closer to circuit board 362. The spring in pin 366 compresses slightly, and the underside 630 of post 602 contacts circuit board 362.

[0128]

[0146] 14B, when the operator presses the lid 346 against the socket 364, the pusher plate 422 generates a force F1 equal to and opposite to the reaction force F2 generated by the thin chuck 350. The spring in the pin 366 compresses against its own spring force F3. The pusher plate 422 and first electronic device 348 continue to move toward the socket 364 until the bottom surface 448 of the electronic device 348 contacts the surface 632 of the standoff 614. The surface 632 prevents the electronic device 348 from moving further toward the socket 364.

[0129]

[0147] The standoff 614 receives a force F4 from the electronics 348. The force transfer portion 566 transfers the force through the first section 608 of the post opening 604. The force delivery portion 618 receives the force from the force transfer portion 566 and transfers the force to the circuit board 362. The circuit board 362 transfers the force to the thin chuck 350.

[0130]

[0148] Therefore, it can be seen that the material of the socket 364 is not subjected to the force F4, thereby eliminating damage to the socket 364.

[0131]

[0149] Socket 364 provides a support plate having a through pillar opening 604. The circuit board 362 provides a backing structure on a first side of the support plate and has contacts 388. The pin 366 forms a conductor having a contact 378, and the contact 378 contacts a terminal 446 on an electronic device 348 positioned on the opposite side of the first side of the support plate. The conductor has a portion held by the support plate and a terminal 392 connected to the contact 388 on the circuit board 362. A spring is provided within the pin 366. The pressing plate 422 forms a force generating device on the opposite side of the support plate from the electronic device 348. The force generating device and the support plate are movable relative to each other to move the electronic device 348 closer to the support plate and deform the spring. The pillar 602 has a standoff 614 having a surface 632 in a plane spaced from the plane of the surface of the support plate, thereby preventing the electronic device 348 from moving closer to the support plate. The force transmission portion 616 extends at least partially through the pillar opening 604 from the standoff 614. The force transfer portion 618 extends from the force transmission portion 616. The force transfer portion 618 is held by a backing structure.

[0132]

[0150] FIG. 15 shows further components of the test apparatus 10 used to accurately control the voltage supplied to the electronic device 634 during testing. The electronic device 634 can be disposed, for example, over the entire surface of the wafer 636 or can be individual devices held within the socket layout.

[0133]

[0151] In many semiconductor devices, a constant current source is required with respect to a constant voltage power supply. This example is the burn-in test (or aging) of a vertical cavity surface emitting laser (VCSEL) wafer. There are the following problems. · In a VCSEL wafer, there are a very large number of devices in a very small area. For example, assume a VCSEL wafer having 50,000 devices within a 7.6 cm circle. · Due to the cost of 50,000 constant current power supplies, a cost-effective burn-in test makes the system price too high. ·Routing 50,000 power lines within a 7.6 cm circle is not impossible, but it is very difficult.

[0134]

[0152] For further explanation, assume the following. ·Since the VCSEL is a diode, there is little power for a ground short circuit. ·"Open" may occur with a much higher frequency, either because the VSCELS are "open" or due to poor contact with the wafer. ·The internal resistance of the VCSEL is large (about 100 ohms per 10 mA VCSEL) and very consistent (within 1%) across the entire wafer. ·There is a very high possibility of constructing a very accurate (within 1%) voltage source. ·The current of the voltage source can be measured quite accurately. ·Most VCSEL wafers have a common cathode that limits the ability to arrange VCSELs in series. ·For the sake of explanation, assume the following. ·About 2.5 volts and 10 mA are required for the VCSEL burn-in test. ·Assume a system with 1024 power channels up to 5 volts and 200 mA per channel. ·Assume that the system can supply a constant current or a constant voltage per channel. ·Assume that the goal is to burn-in test a quarter wafer (12,500 VCSELs) in a single step.

[0135]

[0153] The following lists existing burn-in test circuit options. (1) Individual constant current sources. This supplies an accurate and measurable current to every VCSEL, but the following problems occur. ·Only about 2% of the wafer can be burn-in tested per step (1024 channels vs. 50,000 devices). · The "cost" per VCSEL is for one channel. Even if additional channels could be added, the cost remains one channel per VCSEL. · Even if the system can be expanded to 12,500 channels (the minimum number of channels required for the burn-in test at 1 / 4 of the wafer), it is impossible or costly to route 12,500 power channels within a 7.6 cm wafer area. (2) Series wiring. For this, it is necessary to arrange about 13 VCSELs in series and drive them with a constant current source, but the following problems occur. · Since all VCSELs have a common cathode, it is not possible to wire the VCSEL wafers in series. · For this, a current source of 10 mA and 30 volts or more is required. It is very difficult to protect such a high voltage from overcurrent. (3) Parallel wiring with a current source. Drive about 13 VCSELs in parallel with a constant current source. For this, a current source of 2.5 volts and 130 mA is required. This system has the following problems. · For any VCSEL with an "open" or poor probe contact, extra current is distributed among the remaining VCSELs in the group. Thus, each VCSEL receives about 8% extra current (130 mA / 12 VCSELs) for any defective VCSEL in the group. · If the voltage does not shift significantly due to an open VCSEL, it may not be known that the other 12 VCSELs received the wrong burn-in test current, so defective devices may escape detection. (4) Parallel wiring with a voltage source. Such a system drives 13 VCSELs in parallel with a constant voltage source. The voltage source is selected to be the voltage required for all 13 VCSELs to receive a current of 10 mA. This system has the following problems. · If a VCSEL is open, the total current in the group will be slightly less. For any open VCSEL, the group current will be 10 mA lower (e.g., 140 mA per group instead of 150 mA). The remaining VCSELs in the group still receive 10 mA. The current stability per VCSEL within a group is very good. In the worst case scenario, it is the voltage supply accuracy (<1%) and good VCSEL internal resistance consistency (<1% across the wafer). Thus, the current through each VCSEL is consistent within 2% across the wafer with parallel voltage supplies. If the VCSEL shorts out (very unlikely), the power channel overcurrent protection will terminate that power channel, leaving the other channels still operational.

[0136]

[0154] Therefore, existing solutions can be summarized as follows: Circuit 1 is an ideal circuit, but is ruled out due to cost and technical issues. Circuit 2 is not possible with common cathode VCSEL wafers. Circuit 3 has very poor results with the most common failure mode being an "open" device. Circuit 4 gives very good results in almost all cases and is very cost effective.

[0137]

[0155] Circuit 4 (parallel wiring with voltage source) has the following problems: The voltage supply for the VCSEL must be selected appropriately so that it receives the appropriate current. The appropriate voltage is a function of several factors. · VCSEL construction. The design of the VCSEL determines the voltage at the desired current. The VCSEL assembly process varies from wafer to wafer. Due to process variations, the voltage at a given current can vary from wafer to wafer. Variations in the VCSEL assembly process across the wafer. At a given current, the voltage can be different for devices near the wafer edge than for devices in the center of the wafer. The voltage at a specific current varies with temperature. Not only the heat applied for the burn-in test, but also internal heating of the device itself can change the voltage at a given current. · As the VCSEL ages, its voltage / current relationship shifts. Thus, even if the voltage is accurate at the start of the burn-in test cycle, the appropriate voltage at the end may be lower.

[0138]

[0156] FIG. 15 shows only the electronic devices 634 of the first group (Group 1) consisting of clusters (Clusters 1 to 4) arranged in the region near the periphery of the wafer 636 among the electronic devices 634. It should be understood that there are 16 groups of clusters (Groups 1 to 4), each group having 64 clusters, and each cluster having 12 electronic devices 634.

[0139]

[0157] The electronic devices 634 of the first cluster (Cluster 1) are connected in parallel to each other via a conductor forming part of the wafer 636 or by an external device forming part of the tester apparatus 10. Further clusters (Clusters 2 to 4) of electronic devices (not shown) are located in further regions of the first group (Group 1). Each cluster has a respective set of 12 electronic devices connected in parallel to each other. The electronic devices forming one cluster are not electrically connected to the electronic devices forming part of any other cluster.

[0140]

[0158] The tester apparatus 10 includes a cluster selection switch 638, a current detector 640, a static filter 642, an outlier filter 644, a sample size filter 646, a voltage target system 648, a voltage source 650, and first and second voltage regulators 652 and 654.

[0141]

[0159] Each cluster supplies a separate current output to the cluster selection switch 638. The cluster selection switch 638 is adjustable to selectively connect the current detector 640 to each of the current outputs 660. The current from each current output 660 passes through the current detector 640 and reaches the ground 662.

[0142]

[0160] The cluster selection switch 638 typically operates to connect each of the current outputs 660 to the current detector 640. The current detector 640 thus detects the current from each of the clusters.

[0143]

[0161] The current detector 640 supplies its output to the static filter 642. The static filter 642 is adapted to remove current readings for each cluster that are above or below a set limit. The static filter 642 generally processes data for all clusters simultaneously and removes data for clusters that have current readings above or below the set limit.

[0144]

[0162] The static filter 642 passes the data to the outlier filter 644. The outlier filter 644 removes current readings for each cluster that are far from or below the median value for a group of clusters. The outlier filter 644 passes the data to the sample size filter 646. The sample size filter 646 stops calculating the average current reading for clusters that include a cluster for which the number of channels (devices) is too small.

[0145]

[0163] The voltage source 650 is connected to the input voltage terminals of the first group of electronic devices 634 via the voltage regulator 652. The voltage source 650 is further connected to the input terminals of the second group of electronic devices via the voltage regulator 654. Similarly, the voltage source 650 is connected to further groups of electronic devices in multiple groups via additional voltage regulators (not shown).

[0146]

[0164] The voltage target system 648 receives data from the sample size filter 646 and adjusts the voltage regulators 652 and 654 based on that data.

[0147]

[0165] FIG. 16 shows a method of testing a plurality of electronic devices 634 using the components of the tester apparatus 10 of FIG. 15.

[0148]

[0166] At step 700, the plurality of electronic devices are held in a cluster as described above. At 702, the voltage source 650 is connected to the electronic device 634 of the first cluster. As described above, the voltage source 650 is connected to the electronic device 634 to simultaneously supply voltage to the plurality of electronic devices 634 of the first cluster. At 704, the voltage source 650 is connected to the electronic devices of the second cluster via the voltage regulator 652, and simultaneously supplies voltage to the plurality of electronic devices related to the second cluster. Similarly, at 706, the voltage source 650 is connected to the electronic devices of the third cluster via the voltage regulator 652, and simultaneously supplies voltage to the plurality of electronic devices related to the third cluster. The voltage source 650 can be similarly connected to further clusters of electronic devices via the voltage regulator 652, and simultaneously supply voltage to the electronic devices related to each cluster.

[0149]

[0167] Referring to FIG. 17, first, by determining the voltage estimates "A" and "B", the slope of the curve is calculated. Steps 708 to 724 in FIG. 16 correspond to the calculation of the slope.

[0150]

[0168] At 708, the first initial voltage estimate "V A " is made, and using the current detector 640 in FIG. 15, the resulting first initial current "I A " is measured. The voltage source 650 in FIG. 15 simultaneously estimates the first initial voltage for the electronic devices 634 of the first cluster. The second, third, and subsequent clusters undergo the same processing as the first cluster. For example, the voltage source 650 simultaneously estimates the first initial voltage for the electronic devices of the second cluster.

[0151]

[0169] The cluster selection switch 638 in FIG. 15 sequentially switches via the current outputs 660 from each cluster of the first group. When the cluster selection switch 638 is connected to the current output 660 of the first cluster, the current detector 640 measures the first initial current from the electronic device 634 of the first cluster. The first initial current from the electronic device 634 of the first cluster measured by the current detector 640 is the total current of the plurality of electronic devices 634 to which the voltage of the first cluster is simultaneously supplied. When the cluster selection switch 638 switches to the current output 660 of the second cluster, as shown by the dashed line between step 704 and step 710 in FIG. 16, the second cluster is processed in the same manner as the first cluster. Similarly, by continuously switching the cluster selection switch 638 to subsequent current outputs 660, the current detector 640 measures the first initial current of the electronic devices for each respective cluster.

[0152]

[0170] The current detector 640 supplies the current measurement value to the static filter 642 in FIG. 15. As is clearly shown in FIG. 16, a multi-stage filter 710 including a static filter 712, an outlier filter 714, and a sample size filter 716 is executed. As shown in FIG. 16, the static filter 642 in FIG. 15 executes the static filter at 712.

[0153]

[0171] FIG. 18 shows the details of the static filter. The individual currents from the first and second groups are displayed. The static filter removes current measurement values that are above or below the set limits, for example, current measurement values below 2 and above 6. The static filter can remove the first initial current reading values for each cluster within each group that are above and below the set limits, respectively. Any given cluster has an "open" VCSEL, and therefore may not be able to return the correct total current for all VCSELs. The current limit is used to determine whether any given reading is likely to be accurate.

[0154]

[0172] Following the static filter, the data is processed at 714 in FIG. 16, and an outlier filter is executed using the outlier filter 644 in FIG. 15. FIG. 19 shows the outlier filter in detail. By the outlier filter, data that deviates extremely from the median value of the data, for example, exceeds and falls below by + / - 20%, is removed. By the outlier filter, for example, the first initial current measurement values of each cluster that extremely exceed and fall below the median value of the group are removed. An additional filter can determine whether the first current reading value of a predetermined channel is abnormal using a statistical method.

[0155]

[0173] Following the outlier filter, the data is processed at 714 in FIG. 16, and a sample size filter is executed using the sample size filter 646 in FIG. 15. The sample size filter is shown in FIG. 20. In the sample size filter, when the number of remaining clusters is too small, for example, < 10, the calculation of the average of the first current reading values of the group is stopped. If there are too few remaining clusters for appropriate calculation in any group, the average calculation of the surrounding groups can be used. Two sample groups are included to show the progress of the filter. After the outlier filter, the second group has too few remaining clusters for a reliable calculation of the voltage. In that case, the average of other groups is used.

[0156]

[0174] At 720 in FIG. 16, a second voltage estimate "V B " is created and applied, and the resulting second initial current "I B " is measured. The second initial voltage estimate is applied in the same way as the first initial voltage estimate at 708. The second initial voltage current is measured for each one of the clusters.

[0157]

[0175] At 722, a multi-stage filter is executed on the data including the second initial current from the clusters. The multi-stage filter executed at 722 is the same as the multi-stage filter executed at 710.

[0158]

[0176] Figure 17 shows the positions after the first and second initial currents passed through the multistage filter at 710 and 722. The measured current values are displayed on the Y-axis and the time is displayed on the X-axis. The gradient of the current is given by the following equation. Gradient = (V B - V A ) / (I B - I A )

[0159]

[0177] The gradient is thus calculated by dividing the difference between the second and first initial voltages for the first group of electronic devices by the difference between the second and first initial currents for the first group of electronic devices.

[0160]

[0178] The above-described steps 708, 712, and 724 are executed by the voltage target system 648 of FIG. 15. The voltage target system 648 controls the voltage regulator 652 to supply voltage to the electronic devices of each cluster. The voltage target system 648 then stores the calculated gradient in the memory.

[0161]

[0179] Following the calculation and storage of the gradient at 724 in FIG. 17, the voltage target system 648 can set and target-change the test voltage applied to each cluster of the electronic devices 634 using the gradient. The setting and target-changing of the test voltage are shown in steps 726 to 736 of FIG. 16.

[0162]

[0180] At 726, an estimate is made for the first test voltage (V G ), and the resulting first test current (I G ) is measured. From the above description and FIG. 15, it should be understood that the voltage target system 648 sets the voltage regulator 652 to apply the first test voltage to the plurality of electronic devices 634 of the first cluster simultaneously. Further, it should be understood that the first test current from the electronic devices 634 of the first cluster measured by the current detector 640 is the total current of the electronic devices 634 applied to the first cluster simultaneously.

[0163]

[0181] The second and third clusters of the first group are processed similarly. Each additional cluster thus has a respective first test voltage applied to the cluster's device and a first test current measured from the device.

[0164]

[0182] Following the measurement of the first test current from the cluster, the data of the first test current again continues through the multistage filter 730. The multistage filter 730 is executed with the first test current in a similar manner to the multistage filter 710 executed with the first initial current from the clusters of the first group and the multistage filter 722 executed with the second initial current from the cluster.

[0165]

[0183] At 732, a first comparison is made between the first test current and the target current. Specifically, the measured first test current is subtracted from the target current. The difference is recorded as the amount of current error that needs to be corrected. FIG. 17 shows the first initial current as a result of the first initial estimate (“G”), the target current (I T ) and the current error (I T -I G ).

[0166]

[0184] At 734 in FIG. 16, a target change is executed. A second test voltage is calculated and the first test voltage is adjusted to the second test voltage. As shown in FIG. 17, the second test voltage is calculated according to the formula. V G +(I T -I G ) * Gradient

[0167]

[0185] The first comparison at 732 thus forms the basis for the voltage adjustment at 734.

[0168]

[0186] 736 in FIG. 16 indicates that the process starting at 726 can be repeated, and the repetition is performed by using the target change voltage as the first test voltage and then measuring the test current to calculate the target change voltage.

[0169]

[0187] The dashed lines from 702 and 706 in FIG. 16 indicate that the groups of the second and third clusters undergo the same processing as the group of the first cluster. In a given example, the voltage source 650 supplies voltage to the electronic devices of the second group via the voltage regulator 654. The voltages applied to the electronic devices of the first and second groups can be independently controlled in the manner described above. In a similar manner, separate voltage regulators supply voltage to separate groups of electronic devices. Although only a single current detector 640 is shown, it should be understood that multiple current detectors may be included in the system and can detect current from one or more clusters of one or more groups.

[0170]

[0188] As described above, there are distinct economic advantages to parallel wiring with a voltage source. Further, the voltage target change process ensures that, as described above, the correct voltage is applied to the devices connected using parallel wiring of the voltage source, such that the devices receive the correct current according to the specifications.

[0171]

[0189] The clusters can be selected to coincide with wafer processing (or other) factors that can affect the voltage / current relationship. ·It is not uncommon for devices near the edge of a wafer to have different characteristics than devices near the center of the wafer. ·The clusters can be selected such that the edge devices are analyzed together with other edge devices and the center devices are analyzed together with other center devices.

[0172]

[0190] The target change process is highly convergent and does not respond to minor errors. ·For example, assume that the initial voltage / current calculation is insufficient and the resulting gradient is off by 20%. ·For the first target change step, assume that the calculated voltage is off by 50% (i.e., the current is off by 50%). ·The first target change attempts to correct a 50% current error using a gradient with a 20% error. The net correction is then 10% (50% * × 20%) off. ·The next target change step then corrects this 10% error and again makes a 20% calculation error. This correction is only off by 2% (10% * 20%). ·Thus, after only two target change steps with a starting error of 50% and a gradient error of 20%, the resulting current is now within 2%. ·This shows that this target change algorithm converges rapidly. More generally, the gradient is calculated within about 5% and the initial current is within 20%. Then, only one step is needed to converge within 1% of the correct current.

[0173]

[0191] Specific exemplary embodiments have been described and shown in the accompanying drawings, but it should be understood by those skilled in the art that such embodiments are merely illustrative and do not limit the present invention, and that the present invention is not limited to the specific structures and arrangements illustrated and described.

Description of the Signs

[0174] 10 Test apparatus 12 Tester 14 Frame 18A Slot assembly 28A Cartridge 40 Slot assembly connection part 72 Chuck 302 Holding structure 304 Horizontal transfer device 306 Vertical transfer device 346 Lid 354 Heat support column 364 Socket 366A, 368A Pincers

Claims

1. A test apparatus, comprising: a frame; a slot assembly on the frame; a slot assembly connection portion on the slot assembly; a holding structure for installing a cartridge that holds a plurality of microelectronic devices; a horizontal transfer device operable to move the cartridge horizontally from a first position to a second position into the slot assembly; a vertical transfer device operable to move the cartridge and the slot assembly relative to each other in a first vertical direction and to engage the slot assembly connection portion with a cartridge connection portion on the cartridge; a tester connected via the first slot assembly connection portion and the cartridge connection portion, supplying at least power to each microelectronic device, and measuring the performance of the microelectronic device; and The vertical transfer device is operable to move the cartridge and the slot assembly relative to each other in a second vertical direction, the second vertical direction being opposite to the first vertical direction and disengaging the slot assembly connection portion from the cartridge connection portion, and the horizontal transfer device is operable to move the cartridge horizontally from the second position to the first position out of the slot assembly. A test apparatus.

2. The test apparatus according to claim 1, wherein the horizontal transfer device is a slide.

3. The test apparatus according to claim 1, wherein when the horizontal transfer device moves the cartridge to the second position, the vertical transfer device is actuated by the horizontal transfer device.

4. a spring connected between the cartridge and the slot assembly, the spring being deformed against its spring force by a first relative movement of the cartridge and the slot assembly in the vertical direction; and a locking mechanism that engages to lock the cartridge and the slot assembly in a position where the spring is deformed. The test apparatus according to claim 1, further comprising.

5. The locking mechanism includes: a control lever that rotates around a pivot connection; A pressure lever having a first link connected to the control lever and a second link connected to the spring, wherein the control lever moves from an unlocking position where the first link is on a first side of a line connecting the pivot connection and the second link, through a compression position where the spring is deformed and the first link is in line with the pivot connection and the second link, to a second locking position where the first link rotates to a second side opposite the first side with respect to the line. The test apparatus according to claim 4.

6. When the horizontal transfer device moves the cartridge to the second position, the movement of the control lever is actuated by the horizontal transfer device. The test apparatus according to claim 5.

7. When the horizontal transfer device moves the cartridge from the second position to the first position, the horizontal transfer device rotates the control lever from the locked position to the unlocked position. The test apparatus according to claim 6.

8. The spring is a beam spring. The test apparatus according to claim 4.

9. A thermal chuck, wherein when the cartridge and the slot assembly move relative to each other in the first vertical direction, the thermal chuck engages with the cartridge, and when the cartridge and the slot assembly move relative to each other in the second vertical direction, the thermal chuck disengages from the cartridge. During operation, the test apparatus according to claim 1 further comprises at least one temperature correction device that conducts heat between the thermal chuck and the cartridge.

10. A method for testing an electronic device, holding a cartridge holding a plurality of microelectronic devices at a first position on a frame that is at least partially outside a slot assembly; moving the cartridge horizontally from the first position into the slot assembly to a second position; moving the cartridge and the slot assembly relative to each other in a first vertical direction to engage a slot assembly connection portion on the slot assembly with a cartridge connection portion on the cartridge; testing the microelectronic devices through the first slot assembly connection portion and the cartridge connection portion, the test being performed by supplying at least power to each microelectronic device and measuring the performance of the microelectronic device. Moving the cartridge and the slot assembly relative to each other in a second vertical direction, the second vertical direction being opposite to the first vertical direction, and separating the slot assembly connection portion from the cartridge connection portion; Moving the cartridge horizontally out of the slot assembly from the second position to the first position; A method comprising: **Claim 11** Deforming a spring connected between the cartridge and the slot assembly, and moving the cartridge and the slot assembly relative to each other in the first vertical direction to deform the spring against its spring force; Further comprising engaging a locking mechanism to lock the cartridge and the slot assembly in a position where the spring is deformed. The method according to claim 10. **Claim 12** Rotating a control lever about a pivot connection to move a pressure lever having a first link connected to the control lever and a second link connected to the spring, the control lever moving from a release position where the first link is on a first side of a line connecting the pivot connection and the second link, through a compression position where the first link is in line with the pivot connection and the second link, to a lock position where the spring is deformed and the first link is on a second side of the line opposite the first side. The method according to claim 11. **Claim 13** Engaging a thermal chuck with the cartridge, such that when the cartridge and the slot assembly move relative to each other in the first vertical direction, the thermal chuck engages the cartridge, and when the cartridge and the slot assembly move relative to each other in the second vertical direction, the thermal chuck is disengaged from the cartridge; Further comprising conducting heat between the thermal chuck and the cartridge. The method according to claim 10. **Claim 14** A cartridge, A socket made of an insulating material and having an upper side and a lower side, the upper side having a first configuration for releasably holding a first electronic device, and the socket having a first socket thermal opening formed therethrough from the lower side to the upper side; A connection portion connected to the socket for connecting the first device to an electrical tester; A chuck made of a thermally conductive material; A first heat post attached to the chuck, inserted into the first socket heat opening, and having an end of the first heat post thermally connected to the first device, such that heat mainly passes through and is transmitted, in contrast to the insulating material of the socket between the chuck and the first electronic device. A cartridge comprising the first heat post. **Claim 15** The upper side has a second configuration for releasably holding a second electronic device, the socket has a second socket heat opening formed therethrough from the lower side to the upper side, and the connection portion connects the second device to the electrical tester. A second heat post attached to the chuck, inserted into the second socket heat opening, and having an end of the second heat post thermally connected to the second device, such that heat mainly passes through and is transmitted, in contrast to the insulating material of the socket between the chuck and the first electronic device. The cartridge according to claim 14, further comprising the second heat post. **Claim 16** The cartridge according to claim 14, further comprising a circuit board between the socket and the chuck, the connection portion being located on the circuit board, and the circuit board having a first circuit board heat opening through which the heat post is inserted. **Claim 17** The cartridge according to claim 16, further comprising a first set of contacts held by the socket for connecting the terminals of the first electronic device to the circuit board, the first set of contacts being elastically depressible to bring the first electronic device into contact with the end forming the first heat surface of the first heat post. **Claim 18** The cartridge according to claim 17, further comprising a plurality of pins attached to the socket, extending through the socket, and connecting the first electronic device to the circuit board. **Claim 19** The cartridge according to claim 14, further comprising a lid movable relative to the socket for depressing the first pin to bring the first electronic device into contact with the end of the first heat post. **Claim 20** The cartridge according to claim 14, further comprising a first heat retainer having a surface in contact with the chuck where the first heat post extends. **Claim 21** The first heat retainer has a larger cross-section than the first heat support pillar in each plane parallel to the axis reaching the first heat support pillar, thereby improving the thermal conductivity between the first heat retainer and the chuck. The cartridge according to claim 19.

22. The first heat retainer is inserted into an opening in the upper surface of the chuck. The cartridge according to claim 20.

23. The first heat retainer is press-fitted into the opening in the upper surface of the chuck to a selected depth. The cartridge according to claim 19.

24. The heat support pillar is loosely fitted into the first socket heat opening. The cartridge according to claim 23.

25. A test piece, A socket made of an insulating material and having an upper side and a lower side, the upper side having a first configuration for releasably holding a first electronic device, the socket having a first socket heat opening formed from the lower side through the socket to the upper side, and a first heat conductive support pillar being insertable into the first socket heat opening from the lower side. A socket, A first pair of tweezers held by the socket, connecting the first device to the circuit board, and being elastically pushable downward. A lid movable with respect to the socket, pushing down the first pair of tweezers to bring the first electronic device into contact with the end of the first heat support pillar. A test piece comprising.

26. A test piece, A chuck made of a heat conductive material, A first heat support pillar attached to the chuck, the end of which is insertable into a first socket heat opening while being thermally connected to a first device, and as a result, heat mainly passes through and is transmitted in contrast to the insulating material of the socket between the chuck and the first electronic device. A first heat support pillar. A test piece comprising.

27. A method of testing one or more electronic devices, Releasably holding a first device in a first configuration on the upper side of a socket made of an insulating material. Connecting the first device to an electrical tester via a connection portion connected to the socket. Inserting a first heat support pillar attached to a chuck made of a heat conductive material into a first socket heat opening formed from the lower side through the socket to the upper side, and the end of the first heat support pillar being thermally connected to the first device. A method comprising conducting heat between the chuck and the first electronic device, the heat being conducted mainly through the first heat support, in contrast to the insulating material of the socket.

28. A cartridge, comprising: A socket made of an insulating material and having an upper side and a lower side, the upper side having a first configuration for holding a first electronic device and a second configuration for holding a second electronic device; A lid; A first pressing plate rotatably attached to the lid; A second pressing plate rotatably attached to the lid, the lid being displaceable over and movable towards the socket, by rotatably attaching the first pressing plate, the first electronic device can rotate the first pressing plate relative to the lid, and by rotatably attaching the second pressing plate, the second electronic device can rotate the second pressing plate independently of the first pressing plate relative to the lid; A first set of contacts held by the socket and connected to the first electronic device; A first set of terminals connected to the first set of contacts; A second set of contacts held by the socket and connected to the second electronic device; A cartridge comprising a second set of terminals connected to the second set of contacts.

29. The cartridge according to claim 28, wherein the first pressing plate is rotatable about first and second orthogonal axes relative to the lid, and the second pressing plate is rotatable about first and second orthogonal axes relative to the lid.

30. A first heat surface within the first configuration, by rotation of the first pressing plate relative to the lid, the lower surface of the first electronic device can be placed on the first heat surface; A second heat surface within the second configuration, by rotation of the second pressing plate relative to the lid, the lower surface of the second electronic device can be placed on the second heat surface, the cartridge according to claim 28.

31. The cartridge according to claim 30, wherein the first set of contacts is elastically depressible to bring the first electronic device into contact with the first heat surface, and the second set of contacts is elastically depressible to bring the second electronic device into contact with the second heat surface.

32. A first spring connected between the lid and the first pressing plate, wherein the first pressing plate is linearly movable relative to the lid by the first electronic device so as to deform the first spring. A second spring connected between the lid and the second pressing plate, wherein the second pressing plate is linearly movable relative to the lid by the second electronic device so as to deform the second spring. The cartridge according to claim 28 further comprises the second spring.

33. The first pressing plate has a first pressing plate edge, the lid has a first lid shelf-like protrusion, and the first pressing plate edge rests on the first lid shelf-like protrusion to prevent the first spring from moving the first pressing plate out of the lid. The second pressing plate has a second pressing plate edge, the lid has a second lid shelf-like protrusion, and the second pressing plate edge rests on the second lid shelf-like protrusion to prevent the second spring from moving the second pressing plate out of the lid. The cartridge according to claim 32.

34. A fixing structure on the lid, A fixing structure on the socket, and the two fixing structures engage with each other to fix the lid to the socket after moving the lid towards the socket. The cartridge according to claim 28.

35. The socket has a third configuration on the upper side for holding a third device, A third pressing plate rotatably attached to the lid, wherein the rotatable attachment of the third pressing plate allows the third device to be rotated relative to the lid independently of the second pressing plate. A third terminal set held by the socket and connected to the third device, A third contact set connected to the third terminal set. The cartridge according to claim 28 further comprises the above components.

36. A method for testing one or more electronic devices, comprising: Releasably holding a first electronic device in a first configuration on the upper side of a socket made of an insulating material; Releasably holding a second electronic device in a second configuration on the upper side of the socket; Placing a lid across the socket, the lid having a first pressing plate rotatably attached to the lid and a second pressing plate rotatably attached to the lid. The step of moving the lid toward the socket, wherein by rotatably attaching the first pressing plate, the first electronic device can rotate the first pressing plate with respect to the lid, and by rotatably attaching the second pressing plate, the second electronic device can rotate the second pressing plate with respect to the lid independently of the first pressing plate; Connecting the first and second electronic devices to an electrical tester via a connection portion connected to the socket. A method comprising:

37. A cartridge, An electronic device holder having a structure for removably holding an electronic device having input contacts and a light emitter; An input contact on the electronic device holder and connected to the input contacts on the electronic device, supplying input power to the input contacts of the electronic device through the input contacts of the electronic device holder, and the light emitter transmitting light by the input power; A photodetector attached to the electronic device holder, detecting the light and generating output power according to the magnitude of the light; An output contact connected to the photodetector for measuring the output power. A cartridge comprising:

38. The cartridge according to claim 37, wherein the electronic device holder defines a cavity toward which the light is directed and through which the light passes from the light emitter to the photodetector.

39. The cartridge according to claim 38, further comprising a light absorbing film on the surface of the cavity.

40. A socket having a configuration for holding the electronic device; A lid, wherein the socket and the lid together form the electronic device holder; A pressing plate attached to move with respect to the lid, the lid being positionable across the socket and movable toward the socket, and by the movable attachment of the pressing plate, the electronic device can move the pressing plate with respect to the lid, the pressing plate having an opening through which the light is transmitted from the light emitter to the photodetector. The cartridge according to claim 37, further comprising:

41. A spring connected between the lid and the pressing plate, the pressing plate being linearly movable with respect to the lid by the first device to deform the spring, the cartridge according to claim 40, further comprising a coil spring through which the light passes and propagates.

42. A temperature correction device on a first side of the machine holder, which changes the temperature during operation to create a temperature difference and heat conduction between the temperature correction device and the electronic device to correct the temperature of the electronic device. The cartridge according to claim 37, further comprising a temperature correction device.

43. A heat sink on the opposite side of the temperature correction device in the device holder, having a surface for absorbing the light and generating heat inside by absorbing the light, and A heat dissipation device thermally connected to the heat sink to remove heat from the heat sink. The cartridge according to claim 42, further comprising a heat dissipation device.

44. A photodetector attached to the electronic device holder and positioned to detect the light and generate an output power according to the magnitude of the light, and An output contact connected to the photodetector to measure the output power. The cartridge according to claim 43, further comprising an output contact.

45. A method for testing one or more electronic devices, comprising: Inserting an electronic device having an input contact and a light emitter into a device holder; Connecting the input contact on the electronic device holder to the input contact on the electronic device; Supplying input power to the input contact on the electronic device through the input contact on the electronic device holder, and causing the light emitter to transmit light by the input power; Detecting the light; Converting the detected light into the output power; Measuring the output power through an output contact; and Removing the electronic device from the electronic device holder.

46. A test device, comprising: A socket having a configuration for removably holding an electronic device having an input terminal and a light emitter; An input contact on the socket, which is connected to the input terminal on the electronic device, supplies input power to the input terminal on the electronic device through the input contact on the socket, and causes the light emitter to transmit light by the input power; A temperature correction device on a first side of the socket, which changes the temperature during operation to create a temperature difference and heat conduction between the temperature correction device and the electronic device, and corrects the temperature of the electronic device. A heat sink that is on the side of the socket opposite to the temperature correction device, has a surface for absorbing the light, and generates heat inside due to the absorption of the light; A test device comprising a heat dissipation device that is thermally connected to the heat sink and removes the heat from the heat sink.

47. A thin chuck that forms a cartridge together with the socket, the heat sink, and the heat dissipation device; A thermal chuck, wherein the cartridge is movable to engage the thin chuck with the thermal chuck, and the thermal chuck has the temperature correction device disposed therein, the cartridge according to claim 46.

48. The cartridge according to claim 46, wherein the temperature correction device is a heater.

49. The cartridge according to claim 48, wherein the heater is a resistance heater.

50. The cartridge according to claim 47, wherein the temperature correction device is a cooler.

51. The cartridge according to claim 50, wherein the cooler is a fluid passage through which a fluid circulates.

52. The cartridge according to claim 46, further comprising a light absorption film on the surface of the heat sink.

53. The cartridge according to claim 46, wherein the heat sink defines a cavity into which the light is directed and through which the light is transmitted from the light emitter to the light absorption surface.

54. The cartridge according to claim 46, wherein the heat dissipation device includes a plurality of fins, and heat is conducted from the heat sink to the fins and convected from the fins.

55. A method for testing one or more electronic devices, comprising: Inserting an electronic device having input contacts and a light emitter into a socket; Connecting the input contacts on the socket to input terminals on the electronic device; Supplying input power to the input terminals on the electronic device through the input contacts on the socket, and causing the light emitter to transmit light by the input power; Changing the temperature of a temperature correction device on a first side of the socket to create a temperature difference and heat conduction between the temperature correction device and the electronic device, and correcting the temperature of the electronic device; Absorbing the light on a surface of a heat sink on the side of the socket opposite to the temperature correction device, and generating heat in the heat sink by the absorption of the light. Removing the heat from the heat sink using a heat dissipation device thermally connected to the heat sink; Removing the electronic device from the socket. A method comprising these steps. **Claim 56** A cartridge, Made of an insulating material, having an upper side, a lower side, and a configuration on the upper side, and a socket for holding an electronic device; A set of contacts held by the socket and connected to the electronic device; A set of terminals connected to the set of contacts held by the socket; A circuit board, wherein the set of terminals connected to the set of contacts is connected to a set of contacts on the upper surface; A lid; A detector attached to the lid, wherein when power is supplied to the electronic device through at least one of the set of terminals held by the socket, the lid is movable and positioned across the socket together with the detector located at a predetermined position, and the detector for detecting the function of the electronic device; A measurement channel connecting the detector to a connection portion on the circuit board. A cartridge comprising these components. **Claim 57** The cartridge according to claim 56, wherein the detector is an optical detector. **Claim 58** The cartridge according to claim 57, wherein the optical detector converts optical power into electricity, the measurement channel is a conductor, and the connection portion on the circuit board is an electrical contact. **Claim 59** A first set of pincers held by the socket, wherein opposite ends of each one thereof form one of the contacts held by the socket and one of the terminals connected to the respective terminal; The cartridge according to claim 56, further comprising a detector measurement pin held by the socket and forming part of the measurement channel. **Claim 60** The cartridge according to claim 59, further comprising a terminal on the lid, and the detector measurement pin has a contact that engages with the terminal on the lid. **Claim 61** The cartridge according to claim 60, wherein the contacts of the first set of pincers are in a first plane, and the contacts on the detector measurement pin are in a second plane parallel to and spaced from the first plane. **Claim 62** The cartridge according to claim 61, wherein the measurement pin has a terminal at its end opposite the contact, and the terminals on the first set of pincers and the terminals on the measurement pin are in the same plane. **Claim 63** The cartridge according to claim 62, wherein the first tweezers and the measurement pin can be simultaneously pushed down by moving the lid toward the socket.

64. The cartridge according to claim 63, further comprising a detector power pin held by the socket and supplying power to the detector.

65. A method for testing one or more electronic devices, comprising: loosely holding an electronic device in a socket, the socket being made of an insulating material and having an upper side, a lower side, and a configuration on the upper side for holding the electronic device; connecting a set of contacts held by the socket to the electronic device; connecting a set of terminals connected to the set of contacts to a set of contacts on a circuit board; moving a lid with a detector attached thereover across the socket; connecting the detector to a connection portion on the circuit board via a measurement channel; supplying power to the electronic device through at least one of the contacts held by the socket; detecting the function of the electronic device when power is supplied to the electronic device through at least one of the contacts held by the socket; measuring the function through the connection portion.

66. A cartridge, comprising: a support plate having a through-going pillar opening; a backing structure on a first side of the support plate and including at least a circuit board having contacts; a conductor having a contact that contacts a terminal on an electronic device positioned on a second side of the support plate opposite the first side, a portion held by the support plate, and a terminal connected to the contact on the circuit board; a spring; a force generating device on a side of the electronic device opposite the support plate, the force generating device and the support plate being relatively movable with respect to each other, and the force generating device deforming the spring so that the electronic device approaches the support plate; a pillar including a stand-off on a surface in a plane spaced from a plane of a surface of the support plate and preventing the electronic device from moving closer to the support plate, a force transmission portion extending at least partially through the pillar opening from the stand-off, and a force transfer portion extending from the force transmission portion, the force transfer portion being a pillar held by the backing structure.

67. A pin, comprising the spring, and first and second tips opposite to the spring, and further comprising a pin that compresses the spring when the first and second tips move toward each other, the cartridge according to claim 66.

68. The contact point of the conductor is the end of the first tip, the cartridge according to claim 67.

69. The terminal of the conductor is the end of the second tip, the cartridge according to claim 67.

70. The force transfer portion is wider than the force transmission portion, the cartridge according to claim 66.

71. The support column is prevented from coming out of the opening due to the fact that the force transfer portion is wider than the force transmission portion, the cartridge according to claim 70.

72. The support column opening has a first area and a second area wider than the first area, and as a result, a dance floor is defined between the first area and the second area, and the force transfer portion is in contact with the dance floor, the cartridge according to claim 71.

73. The support column has a surface on the force transfer portion and a surface opposite to the surface of the standoff of the support column, and the surface on the force transfer portion contacts the backing structure to transmit the force, the cartridge according to claim 66.

74. The spring deforms against its spring force, the cartridge according to claim 66.

75. During use, the standoff receives a force from the electronic device, the force transmission portion transmits the force from the standoff at least partially through the opening, and the force transfer portion receives the force from the force transmission portion and delivers the force to the backing structure, the cartridge according to claim 66.

76. The force generating device is a chuck located below a wafer having a plurality of electronic devices, the support plate is a contactor, the circuit board has a plurality of contact points, and the cartridge is A plurality of conductors, each conductor comprising a respective contact point that contacts a respective terminal on one of the electronic devices, a respective portion held by the contactor, and a respective terminal connected to one of the respective contact points on the circuit board, the cartridge according to claim 66.

77. The support plate is a socket having a configuration for holding the electronic device, the force generating device is a lid located above the electronic device, the backing structure includes a chuck made of a thermally conductive material, and the circuit board is supported by the chuck. The cartridge according to claim 66.

78. The column is a heat column that passes through an opening in the circuit board and is supported by the chuck. The cartridge according to claim 77.

79. The cartridge according to claim 78, further comprising a heat retainer held by the chuck, and the heat column extending from the heat retainer.

80. The column has a surface on the force transfer portion and on the side of the column opposite the standoff, and the surface on the force transfer portion abuts against the backing structure to transmit the force. The cartridge according to claim 77.

81. A cartridge, placing a backing structure including at least a circuit board having contacts on a first side of a support plate; connecting the contacts of the conductor to terminals on an electronic device located on a first side of the support plate opposite a second side, the conductor having a portion held by the support plate and a terminal connected to the contacts on the circuit board; positioning a force generating device on the opposite side of the support plate from the electronic device; relatively moving the force generating device and the support plate to bring the electronic device closer to the support plate and deforming a spring against its spring force; preventing the movement of the electronic device towards the support plate by a column having a standoff with a surface in a plane spaced from the plane of the surface of the support plate; receiving the force from the electronic device at the standoff of the column; conducting the force from the standoff at least partially through the opening to a force transfer portion of the column, the column extending through a column opening formed at least partially through the support plate from the standoff; receiving the force at a force transfer portion extending from the force transfer portion of the column, the force transfer portion being held by the backing structure; delivering the force to the backing structure. A method comprising.

82. A tester device, a voltage target system, a holder for holding a plurality of electronic devices in at least first and second clusters, At least one voltage source connectable to the electronic device of the first cluster, which simultaneously supplies a first test voltage to the electronic device of the first cluster, is connectable to the electronic device of the second cluster, and simultaneously supplies the first test voltage to the electronic device of the second cluster. At least one current detector, which is connectable to the device of the first cluster to measure a first test current from the device of the first cluster, and the first test current from the device of the first cluster measured by the current detector is the total current simultaneously supplied to the device of the first cluster. Also, it is connectable to the device of the second cluster to measure the first test current from the device of the second cluster, and the first test current from the device of the second cluster measured by the current detector is the total current simultaneously supplied to the device of the second cluster. The voltage target system performs a first comparison by comparing the measured first test current from the device of the first cluster with a target current. A first voltage regulator that adjusts the first test voltage to a second test voltage for the first cluster according to the first comparison, so that the first test current from the device of the first cluster is adjusted closer to a second test current closer to the target current. The voltage target system performs a second comparison by comparing the measured first test current from the device of the second cluster with a target current. A second voltage regulator that adjusts the first test voltage to a second test voltage for the second cluster in response to the second comparison, so that the first test current from the device of the second cluster is adjusted closer to a second test current closer to the target current. A tester device comprising.

83. The tester according to claim 82, further comprising a static filter for removing first test current reading values for each cluster above and below a set limit.

84. The tester according to claim 82, further comprising an outlier filter that removes a first test current measurement value that extremely exceeds or falls below the median value for the group of clusters for each cluster.

85. The tester according to claim 82, further comprising a sample size filter that stops calculating the average of the first test current reading values of the surrounding clusters when the number of electronic devices in the first cluster is too small.

86. The voltage target system stores the gradient for the first cluster representing the relationship between voltage and current, determines a first current difference for the first cluster, the determination being made by subtracting the target current from the first test current for the device of the first cluster, determines a voltage difference for the first cluster, the determination being made by multiplying the first current difference for the first cluster by the gradient for the first cluster, and the voltage regulator adjusts the first test voltage from the device of the first cluster to the second test voltage for the device of the first cluster by the voltage difference for the first cluster. The tester according to claim 82.

87. The voltage target system estimates a first initial voltage for the device of the first cluster, the at least one current detector measures a first initial current for the device of the first cluster as a result of the first initial voltage estimation for the device of the first cluster, the voltage target system estimates a second initial voltage for the device of the first cluster, the at least one current detector measures a second initial current for the device of the first cluster as a result of the first initial voltage estimation for the device of the first cluster, the voltage target system calculates the gradient for the first cluster, the calculation being performed by dividing the difference between the second and first initial voltages for the device of the first cluster by the difference between the second and first initial currents for the device of the first cluster. The tester according to claim 86.

88. The voltage target system stores the gradient for the second cluster representing the relationship between voltage and current, Determining a first current difference for the second cluster by subtracting the target current from the first test current for the device of the second cluster; Determining a voltage difference for the second cluster by multiplying the first current difference for the second cluster by the gradient for the second cluster, the voltage regulator adjusting a first test voltage from the device of the second cluster to a second test voltage for the device of the second cluster by the voltage difference for the second cluster, the tester according to claim 87.

89. The voltage target system estimates a first initial voltage for the device of the second cluster; The at least one current detector measures a first initial current for the device of the second cluster as a result of the first initial voltage estimation for the device of the second cluster; The voltage target system estimates a second initial voltage for the device of the second cluster; The at least one current detector measures a second initial current for the device of the second cluster as a result of the first initial voltage estimation for the device of the second cluster; The voltage target system calculates the gradient for the second cluster, the calculation being performed by dividing the difference between the second and first initial voltages for the device of the second cluster by the difference between the second and first initial currents for the device of the second cluster, the tester according to claim 88.

90. The tester according to claim 89, further comprising a static filter that removes first initial current measurements for each cluster that are above and below a set limit.

91. The tester according to claim 89, further comprising an outlier filter that removes first initial current measurements for each cluster that are extremely above or below the median for the group of clusters.

92. The tester according to claim 89, further comprising a sample size filter that stops calculating the average of the first initial current measurements for surrounding clusters when the number of electronic devices in the first cluster is too small.

93. The tester according to claim 89, further comprising a static filter that removes second initial current readings for each cluster that are above and below a set limit.

94. The tester according to claim 89, further comprising an outlier filter that removes second initial current measurement values for each cluster that extremely exceeds or falls below the median value for the group of the clusters.

95. The tester according to claim 89, further comprising a sample size filter that stops calculating the average of the second initial current measurement values of the surrounding clusters when the number of electronic devices in the first cluster is too small.

96. A method for testing a plurality of electronic devices, comprising: holding the plurality of electronic devices in at least first and second clusters; connecting the at least one voltage source to the electronic devices in the first cluster to simultaneously supply a first test voltage to the electronic devices in the first cluster, and being connectable to the electronic devices in the second cluster to simultaneously supply the first test voltage to the electronic devices in the second cluster; connecting the at least one voltage source to the electronic devices in the second cluster to simultaneously supply a first test voltage to the electronic devices in the second cluster; measuring a first test current from the devices in the second cluster using at least one current detector, wherein the first test current measured by the current detector from the devices in the second cluster is the total current simultaneously supplied to the devices in the second cluster; measuring a first test current from the devices in the second cluster using at least one current detector, wherein the first test current measured by the current detector from the devices in the second cluster is the total current simultaneously supplied to the devices in the second cluster; performing a first comparison using a voltage target system, the comparison being performed by comparing the measured first test current from the devices in the first cluster with a target current; adjusting the first test voltage to a second test voltage for the first cluster according to the first comparison using a first voltage regulator, such that the first test current from the devices in the second cluster is adjusted to a second test current closer to the target current; performing a second comparison using the voltage target system, the comparison being performed by comparing the measured first test current from the devices in the second cluster with a target current; A method comprising: using a second voltage regulator to adjust the first test voltage to the second test voltage for the second cluster according to the second comparison, such that the first test current from the device of the second cluster is adjusted closer to a second test current closer to the target current.

Images