Board connector and connector device

Abstract

To effectively discharge a void generated in a solder.SOLUTION: A board connector 10 includes: a housing 11 fixed to an upward mounting surface M of a circuit board P; and a terminal fitting 20 attached to the housing 11. The terminal fitting 20 has an elongated shape extending along the mounting surface M and has a board connecting part 23 joined to the mounting surface M via a solder S, and a concave part 25 opened to an outer surface 23S of the board connecting part 23 is formed on an opposite surface 24 to the mounting surface M in the board connecting part 23. A plurality of minute voids generated in the solder S are gathered in the concave part 25 by buoyancy and merged into a void having a large volume, and the void having the large volume is discharged from the concave part 25 to the outside of the solder S on the outer surface 23S of the board connecting part 23.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present disclosure relates to a board connector and a connector device. [Background technology]

[0002] Patent Document 1 discloses a structure in which a terminal portion of a lead member is soldered to an electrode pad on the surface of a circuit board. The bonding surface of the terminal portion that is bonded to the electrode pad via solder is inclined so that the distance from the electrode pad increases from the center in the width direction toward the outer edge. This inclined shape is intended to facilitate the movement of voids generated in the molten solder in the direction in which the distance between the bonding surface and the electrode pad increases, i.e., toward the outer edge of the terminal portion. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2021-034636 Summary of the Invention [Problem to be solved by the invention]

[0004] Voids are tiny bubbles that are formed by the evaporation of solvents contained in the flux or the evaporation of moisture that occurs when the flux removes oxides from the terminals and lands through a reduction reaction. Tiny gas particles do not move smoothly.

[0005] The present disclosure was completed in light of the above circumstances, and aims to make it possible to effectively remove voids that occur in solder. [Means for solving the problem]

[0006] The board connector of the first disclosure comprises: a housing fixed to the upward mounting surface of the circuit board; a terminal metal fitting attached to the housing, the terminal fitting has an elongated shape extending along the mounting surface and has a board connecting portion joined to the mounting surface via solder, A recess that opens to an outer surface of the board connecting portion is formed on the surface of the board connecting portion that faces the mounting surface.

[0007] The connector device of the second disclosure is a circuit board that is installed with its mounting surface facing upward; The connector for a board according to claim 1 is provided. [Effects of the Invention]

[0008] According to the present disclosure, voids generated in the solder can be effectively removed. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a side cross-sectional view of a connector device according to a first embodiment. [Figure 2] FIG. 2 is a partially enlarged cross-sectional side view showing the joining structure between the terminal fitting and the circuit board. [Figure 3] FIG. 3 is a cross-sectional view taken along line AA in FIG. [Figure 4] FIG. 4 is a partially enlarged cross-sectional side view showing the joining structure between the terminal fitting and the circuit board in the second embodiment. [Figure 5] FIG. 5 is a partially enlarged cross-sectional side view showing the joining structure between a terminal fitting and a circuit board in the third embodiment. [Figure 6] FIG. 6 is a partially enlarged cross-sectional side view showing the joining structure between a terminal fitting and a circuit board in the fourth embodiment. [Figure 7] FIG. 7 is a cross-sectional view taken along line BB in FIG. [Figure 8] FIG. 8 is a cross-sectional view taken along line CC in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0010] [Description of the embodiments of the present disclosure] First, embodiments of the present disclosure will be listed and described. Any combination of the following multiple embodiments within a range that does not cause contradictions is also included in the description of the present invention. The board connector of the first disclosure comprises: (1) A solder joint includes a housing fixed to an upward mounting surface of a circuit board and terminal fittings attached to the housing, the terminal fittings having an elongated shape extending along the mounting surface and having a board connection portion joined to the mounting surface via solder, and a recess opening onto the outer surface of the board connection portion is formed on the surface of the board connection portion facing the mounting surface. According to the configuration of the first disclosure, multiple microvoids generated in the solder gather in the recess due to buoyancy and coalesce to form a void with a large volume. Since the larger the volume of a void, the easier it is to move, the larger the volume of the void is, so the larger the volume of the void is, and the larger the volume of the void is, so the larger the volume of the void is, and the larger the volume of the void is, and the larger the volume of the void is, the easier it is to move ... the larger the volume of the void is, and the larger the volume of the void is, the easier it is to move, and the larger the volume of the void is, the larger the volume of the void is, and the larger the volume of the void is, the easier it is to move, and the larger the volume of the void is, the larger the volume of the void is, and the larger the volume of the void is, the easier it is to move, and the larger the

[0011] (2) In (1), it is preferable that the recess has a guide surface that is oblique to the horizontal direction in a side view of the board connection portion from a direction opposite to the outer surface, so that microvoids can easily move along the inclined surface and gather in one place.

[0012] (3) In (1), it is preferable that the discharge portion, which is the highest part of the recess, has a discharge surface that is inclined so as to rise from the center of the width direction of the board connection portion toward the outer surface. With this configuration, large voids that have gathered in the recess can be easily discharged from the outer surface to the outside of the solder.

[0013] (4) In (1), it is preferable that, in a side view of the board connection portion from a direction facing the outer surface, the facing surface is generally inclined with respect to the horizontal, the recess is continuously formed from the lowest end of the facing surface to a region higher than the lowest end, a stepped discharge portion is formed at an end of the recess opposite the lowest end, and the recess has a guide surface that is inclined so as to gradually increase in height from the lowest end toward the discharge portion. According to this configuration, the recess is formed in a region of the facing surface that includes the lowest end, and has a guide surface that is inclined so as to gradually increase in height from the lowest end toward the discharge portion, so that there is no risk of microvoids remaining in the entire region of the facing surface including the lowest end.

[0014] (5) In (1) to (4), it is preferable that a non-ejection region of the recess, excluding the ejection portion, which is the highest part of the recess, has a collection surface that is inclined in a width direction perpendicular to the length direction of the board connection portion so that the central part in the width direction is higher than the pair of outer surfaces. According to this configuration, the collection surface makes it easy for microvoids to collect in the non-ejection region of the recess.

[0015] The connector device of the second disclosure is (6) A circuit board is installed with the mounting surface facing upward, and the board connector according to claim 1 is included. According to the second disclosure, multiple microvoids generated in the solder gather in the recess due to buoyancy and coalesce to form a void with a large volume. The larger the volume of the void, the easier it is to move, so the large volume void is discharged from the recess to the outside of the solder on the outer surface of the board connection portion. Therefore, according to this disclosure, the voids can be effectively discharged.

[0016] [Details of the embodiments of the present disclosure] [Example 1] A first embodiment of the present disclosure will be described with reference to Figures 1 to 3. The present invention is not limited to these examples, but is defined by the claims, and includes all modifications within the meaning and scope of the claims. In this first embodiment, with regard to the front-to-back direction, the F direction in Figures 1 and 2 is defined as the front. With regard to the up-down direction, the H direction in Figures 1 to 3 is defined as the up. With regard to the left-to-right direction, the R direction in Figure 3 is defined as the right.

[0017] The connector device A of this first embodiment is configured to include a circuit board P and a board connector 10. The circuit board P is a component that is installed horizontally with a flat mounting surface M facing upward. Lands L, to which solder S is applied, are arranged on the mounting surface M.

[0018] The board connector 10 is constructed by assembling a housing 11 and a plurality of terminal fittings 20. The housing 11 has a support wall portion 12 whose thickness direction is oriented in the front-to-rear direction, and a square-tube hood portion 13 that protrudes forward from the outer peripheral edge of the support wall portion 12. The housing 11 is fixed to the mounting surface M by pegs (not shown) press-fitted into both left and right outer wall surfaces of the frame.

[0019] The terminal fitting 20 is a member formed by bending a long, thin metal rod. The terminal fitting 20 is a single part having a tab-shaped connecting portion 21, a leg portion 22, and a board connecting portion 23. The tab-shaped connecting portion 21 is a portion that extends long and thin in the front-to-rear direction. The leg portion 22 is a portion that extends downward from the rear end of the tab-shaped connecting portion 21. The board connecting portion 23 is a portion that extends cantilevered rearward from the lower end of the leg portion 22. The terminal fitting 20 is attached to the housing 11 by press-fitting the tab-shaped connecting portion 21 into the press-fit hole 14 of the support wall portion 12.

[0020] The board connector 10 is attached to the circuit board P by fixing the housing 11 to the mounting surface M and joining the board connection portions 23 of the terminal fittings 20 to the mounting surface M. Joining the board connection portions 23 to the mounting surface M is performed by a reflow process. In the reflow process, the board connection portions 23 are placed on solder S applied to the upper surfaces of the lands L, and the circuit board P and the board connector 10 are placed in a reflow furnace (not shown). In the reflow furnace, the molten solder S forms fillets in contact with the front, rear, and both left and right outer surfaces 23S of the board connection portions 23, and fills the gaps between the board connection portions 23 and the mounting surface M (lands L). After the reflow process, the circuit board P and the board connector 10 are cooled to solidify the solder S. In this manner, the connector device A is manufactured.

[0021] During the reflow process, voids (not shown) occur inside the molten solder S. The voids are formed by the evaporation of solvents contained in the flux (not shown) or by the evaporation of moisture that is produced when the flux removes oxides from the board connection portion 23 (terminal fitting 20) and land L through a reduction reaction. If voids remain inside the solder S, there is a risk that the bonding strength between the board connection portion 23 and the mounting surface M will decrease and the crack resistance of the solder S will decrease. As a countermeasure, the board connection portion 23 is designed to have a shape that allows voids that occur inside the solder S to be expelled to the outside of the solder S. The shape of the board connection portion 23 will be described below.

[0022] The board connection portion 23 has a shape that is elongated in the front-to-rear direction. That is, in a side view of the board connection portion 23, the board connection portion 23 has a shape that is elongated and extends along the mounting surface M. The side view is defined as a view that is parallel to the mounting surface M and that faces the left and right outer surfaces 23S of the board connection portion 23. The lower surface of the board connection portion 23 that faces the mounting surface M is defined as the facing surface 24. In the side view, the facing surface 24 as a whole is inclined with respect to the horizontal direction. That is, the facing surface 24 is inclined with respect to the horizontal plane so as to gradually become higher from the rear end 23R of the board connection portion 23 toward the front end 23F.

[0023] As shown in FIG. 2 , the board connection portion 23 has a plurality of recesses 25 formed therein. The recesses 25 are recessed portions of the facing surface 24 in a side view. The recesses 25 have a triangular shape with an obtuse apex angle in a side view. The recesses 25 are open on both the left and right outer surfaces 23S of the board connection portion 23. The recesses 25 are arranged in a row in the longitudinal direction of the board connection portion 23. The portions of the facing surface 24 other than the recesses 25, i.e., the portions where adjacent recesses 25 are connected in the front-rear direction, are defined as non-inductive portions 26. As described above, the facing surface 24 is inclined overall with respect to the horizontal direction, and therefore the imaginary plane 27 connecting the plurality of non-inductive portions 26 is also inclined so as to rise from the rear end side to the front end side of the facing surface 24.

[0024] The highest part of the recess 25 in a side view is defined as the discharge section 28. Each recess 25 has a pair of front and rear guide surfaces 29 that are inclined with respect to the mounting surface M (horizontal plane). The front guide surface 29 extending forward from the discharge section 28 is inclined so that it gradually becomes lower toward the front. The rear guide surface 29 extending rearward from the discharge section 28 is inclined so that it gradually becomes lower toward the rear. The guide surfaces 29 perform a guide function to move microvoids generated in the solder S to the discharge section 28.

[0025] The recess 25 has a discharge surface 30. As shown in FIG. 3, in a cross section of the board connection portion 23 cut along a plane perpendicular to its length, the discharge surface 30 has a bilaterally symmetrical arc shape. The height of the discharge surface 30 is lowest at the center of the recess 25 in the left-right direction and slopes to gradually increase toward both the left and right outer surfaces 23S. The discharge surface 30 is formed only in the discharge portion 28 of the recess 25 in the front-rear direction. In a cross section of the board connection portion 23 cut along a plane perpendicular to its length, the region of the facing surface 24 other than the discharge portion 28 forms a horizontal straight line.

[0026] The connector device A of the first embodiment includes a circuit board P and a board connector 10. The board connector 10 includes a housing 11 fixed to an upward-facing mounting surface M of the circuit board P, and terminal fittings 20 attached to the housing 11. The terminal fittings 20 have an elongated shape that extends in the front-to-rear direction along the mounting surface M. The terminal fittings 20 have a board connection portion 23 that is joined to the mounting surface M via solder S. An opposing surface 24 of the board connection portion 23 that faces the mounting surface M is formed with recesses 25 that open to both left and right outer side surfaces 23S of the board connection portion 23 (i.e., surfaces perpendicular to the mounting surface M).

[0027] During the reflow process, multiple microvoids (not shown) generated in the molten solder S are collected in the recess 25 due to buoyancy and coalesce within the recess 25 to form a large-volume void (not shown). By collecting the microvoids in the recess 25, the size of the voids can be easily controlled. Since the larger the volume of a void, the easier it is to move, so large-volume voids are expelled from the recess 25 on the outer surface 23S of the board connection portion 23 to the outside of the solder S. If even a portion of a large-volume void detaches from the opposing surface 24, the entire void detaches from the opposing surface 24 all at once. Furthermore, in areas where the gap between the mounting surface M (land L) and the opposing surface 24 is narrow, large voids flatten and expand laterally, making them even more likely to detach from the opposing surface 24 and be expelled to the outside of the solder S. Therefore, the connector device A and the board connector 10 of the first embodiment can effectively expel voids generated in the solder S.

[0028] In a side view of the board connection portion 23 from a direction opposite to the outer surface 23S, each recess 25 has a guide surface 29 that is oblique to the horizontal. Microvoids pressed against the guide surface 29 by buoyancy move along the inclined guide surface 29, and are likely to collect in the discharge portion 28, which is the highest part of the recess 25.

[0029] Discharge portion 28, which is the highest part of recess 25, has discharge surface 30 formed therein, which is inclined so as to rise from the center in the width direction of board connection portion 23 toward outer surface 23S. This configuration makes it easier for large voids that have gathered in discharge portion 28 of recess 25 to be discharged from outer surface 23S of board connection portion 23 to the outside of solder S.

[0030] [Example 2] A second embodiment of the present disclosure will be described with reference to Figure 4. In this second embodiment, the front-to-back direction is defined as the F direction in Figure 4. The up-down direction is defined as the H direction in Figure 4. In the connector device B and the board connector 40 of this second embodiment, the recesses 44 formed in the terminal fittings 41 have a different shape in side view from those of the first embodiment. Since the other configurations are the same as those of the first embodiment, the same components are denoted by the same reference numerals, and a description of the structure, operation, and effects will be omitted.

[0031] In the second embodiment, a recess 44 is formed in an opposing surface 43 of the board connection portion 42 that faces the mounting surface M. The recess 44 has a trapezoidal shape in a side view. The recess 44 has a discharge portion 45 and a pair of front and rear guide surfaces 46. In a side view, the discharge portion 45 is a horizontal surface having a constant dimension in the front-to-rear direction. The front guide surface 46 that extends forward from the front end of the discharge portion 45 is inclined so as to gradually lower toward the front. The rear guide surface 46 that extends rearward from the rear end of the discharge portion 45 is inclined so as to gradually lower toward the rear. The discharge portion 45 of the recess 44 has a discharge surface (not shown) similar to that of the first embodiment. The discharge surface is not formed on the guide surface 46.

[0032] [Example 3] A third embodiment of the present disclosure will be described with reference to Figure 5. In this third embodiment, the front-to-rear direction is defined as the F direction in Figure 5. The up-down direction is defined as the H direction in Figure 5. The connector device C and the board connector 50 of this third embodiment have recesses 54 formed in the terminal fittings 51 with a different side view shape than those of the first embodiment. Since the other configurations are the same as those of the first embodiment, the same components are designated by the same reference numerals, and descriptions of the structure, operation, and effects will be omitted.

[0033] The board connection portion 52 of the third embodiment has a shape that is elongated in the front-rear direction. That is, in a side view of the board connection portion 52, the board connection portion 52 has a shape that is elongated and extends along the mounting surface M. An opposing surface 53 of the board connection portion 52 that faces the mounting surface M is inclined overall with respect to the horizontal direction in a side view. That is, the opposing surface 53 is inclined so as to gradually become higher from the rear end 52R of the board connection portion 52 toward the front end 52F.

[0034] The recess 54 is formed continuously in the front-rear direction from the lowest end 53L (rear end) of the opposing surface 53 to a region higher than the lowest end 53L (region forward of the lowest end 53L). A discharge portion 55 having a stepped shape in side view is formed at the front end of the recess 54 opposite the lowest end 53L. The region of the recess 54 from the lowest end to the discharge portion 55 functions as a guide surface 56 for guiding microvoids to the discharge portion 55. The guide surface 56 is inclined so as to gradually increase in height from the lowest end toward the discharge portion 55. A discharge surface (not shown) similar to that of Example 1 is formed in the discharge portion 55 of the recess 54. The discharge surface is not formed on the guide surface 56.

[0035] Microvoids generated in the molten solder S are pressed against the guide surface 56 by buoyancy, and move toward the discharge section 55 in front due to the inclination of the guide surface 56. Multiple microvoids coalesce as they move. In the discharge section 55, a single void with a large volume is generated where many microvoids gather and coalesce. Large voids in the discharge section 55 move along the discharge surface to the outer surface (not shown) of the board connection section 52 and are discharged to the outside of the solder S.

[0036] In Example 3, the opposing surface 53 of the board connection portion 52 is generally inclined relative to the horizontal direction in a side view. The recess 54 is formed continuously from the lowest end 53L of the opposing surface 53 to a region higher than the lowest end 53L. A stepped discharge portion 55 is formed at the end of the recess 54 opposite the lowest end 53L. The recess 54 has a guide surface 56 that is inclined so as to gradually increase in height from the lowest end 53L toward the discharge portion 55. With this configuration, the recess 54 is formed in a region of the opposing surface 53 that includes the lowest end 53L, and has the guide surface 56 that is inclined so as to gradually increase in height from the lowest end 53L toward the discharge portion 55. Therefore, there is no risk of microvoids remaining in the entire region of the opposing surface 53, including the lowest end 53L.

[0037] [Example 4] A fourth embodiment of the present disclosure will be described with reference to Figures 6 to 8. In this fourth embodiment, the front-to-rear direction is defined as the F direction in Figure 6. The up-down direction is defined as the H direction in Figures 6 to 8. The left-to-right direction is defined as the R direction in Figures 7 and 8. In the connector device D and the board connector 60 of this fourth embodiment, the recesses 64 formed on the opposing surfaces 63 of the terminal fittings 61 have a different configuration from that of the third embodiment. Since the other configurations are the same as those of the third embodiment, the same components are denoted by the same reference numerals, and a description of the structure, operation, and effects will be omitted.

[0038] The board connection portion 62 of Example 4 also has a shape that is elongated in the front-to-rear direction, similar to Example 3. In a side view of the board connection portion 62, the board connection portion 62 has a shape that is elongated along the mounting surface M. An opposing surface 63 of the board connection portion 62 that faces the mounting surface M is inclined overall with respect to the horizontal direction in a side view. That is, the opposing surface 63 is inclined so as to gradually become higher from the rear end 62R of the board connection portion 62 toward the front end 62F.

[0039] The recess 64 is formed continuously in the front-rear direction from the lowest end 63L (rear end) of the opposing surface 63 to a region higher than the lowest end 63L (a region forward of the lowest end 63L). A discharge portion 65 having a stepped shape in a side view is formed at the front end of the recess 64 opposite the lowest end 63L. The region of the recess 64 from the lowest end to the discharge portion 65 functions as a guide surface 66 for guiding microvoids to the discharge portion 65. The guide surface 66 is inclined so as to gradually rise from the lowest end toward the discharge portion 65.

[0040] The entire area of the recess 64 (guiding surface 66) excluding the discharge portion 65, which is the highest part, (the entire area on the lowest end 63L side of the discharge portion 65) is defined as the non-discharge area 67. As shown in Figures 6 and 7, a collection surface 68 is formed in the non-discharge area 67. The collection surface 68 is a bilaterally symmetrical surface that slopes gradually downward from the center in the width direction (left-right direction) perpendicular to the length direction of the substrate connection portion 62 toward both left and right outer surfaces 62S of the substrate connection portion 62. In other words, the collection surface 68 is a surface that slopes upward so that the widthwise center is higher than the pair of left and right outer surfaces 62S in the width direction. The collection surface 68 functions to collect microvoids in the widthwise center.

[0041] Microvoids generated in the molten solder S are pressed against the guide surface 66 by buoyancy and move toward the discharge section 65 in front due to the inclination of the guide surface 66. Multiple microvoids coalesce as they move along the guide surface 66. Microvoids generated on the outer side of the guide surface 66 in the width direction (the area close to the outer surface 62S) move along the guide surface 66 and gather in the center of the width direction due to the inclination of the collection surface 68. In the non-discharge region 67 of the recess 64, the collection surface 68 makes it easier for microvoids to collect. Therefore, the rate at which microvoids gather in the recess 64 in Example 4 progresses faster than in Example 3. In the discharge section 65, a single void with a large volume is generated, where multiple microvoids gather and coalesce. When part of a large void in the discharge section 65 protrudes from the outer surface 62S of the board connection section 62, the large void moves from the discharge section 65 toward the outside of the board connection section 62 and is discharged to the outside of the solder S.

[0042] [Other Examples] The present invention is not limited to the examples described above and illustrated in the drawings, but is defined by the claims. The present invention includes the meaning equivalent to the claims and all modifications within the scope of the claims, including the following embodiments. The shape of the recess in side view is not limited to the triangle of the first embodiment or the trapezoid of the second embodiment, but may be a sine curve, a semicircle, or the like, or may be a rectangle without a guide surface. The number of recesses in the first and second embodiments is not limited to a plurality of recesses, and may be only one. The cross-sectional shape of the discharge surface in the first and second embodiments is not limited to an arc shape, but may be an ellipse, a trapezoid, a triangle, or the like. In the first and second embodiments, the opposing surface may have a shape that does not include a discharge surface. The formation area of the ejection surface in Examples 1 to 3 is not limited to the ejection portion alone, but may extend over the entire area of the recess in the length direction of the board connection portion. The cross-sectional shape of the ejection surface in Examples 1 to 3 may be different at each position along the length of the board connection part. The discharge surfaces of the first to third embodiments can be applied to the discharge portion of the fourth embodiment. In the fourth embodiment, the collecting surface may be formed only in a part of the non-ejection region in the length direction of the substrate connecting portion. The collecting surface of the fourth embodiment can be applied to the non-ejection areas of the first to third embodiments. [Explanation of symbols]

[0043] 10...Board connector 11. Housing 12...Support wall part 13...Hood section 14...Press-fit hole 20...Terminal fitting 21...Tab-shaped connection part 22...legs 23...Board connection part 23F...Front end of board connection part 23R...Rear end of board connection part 23S…Outer surface 24...Opposite surface 25...recess 26…Non-induced site 27...Virtual surface 28…Discharge section 29…Guiding surface 30…Discharge surface 40...Board connector 41...Terminal fitting 42...Board connection part 43...Opposite surface 44...recess 45...Discharge section 46…Guidance surface 50...Board connector 51...Terminal fitting 52...Board connection part 52F...Front end of board connection part 52R...Rear end of board connection part 53...Opposite surface 53L...Lowest end of opposing surface 54...recess 55...Discharge section 56…Guiding surface 60...Board connector 61...Terminal fitting 62...Board connection part 62F...Front end of board connection part 62R...Rear end of board connection part 62S…Outer surface 63...Opposite surface 63L...Lowest end of opposing surface 64...recess 65...Discharge section 66…Guidance surface 67…Non-emission area 68...Aggregation surface A...Connector device B...Connector device C...Connector device D...Connector device L…Land M…Mounting surface P...Circuit board S...Solder

Claims

1. a housing fixed to the upward mounting surface of the circuit board; a terminal metal fitting attached to the housing, the terminal fitting has an elongated shape extending along the mounting surface and has a board connecting portion joined to the mounting surface via solder, The board connector has a recess formed on the surface of the board connection portion facing the mounting surface, the recess opening to an outer surface of the board connection portion.

2. 2. The board connector according to claim 1, wherein the recess has a guide surface that is oblique to the horizontal direction in a side view of the board connection portion from a direction facing the outer surface.

3. 2. A board connector as described in claim 1, wherein the ejection portion, which is the highest part of the recess, has an ejection surface that is inclined so as to rise from the center of the width of the board connection portion toward the outer surface.

4. In a side view of the board connection portion from a direction facing the outer surface, the facing surface is inclined as a whole with respect to a horizontal direction, the recess is formed continuously from the lowest end of the opposing surface to a region higher than the lowest end, a step-shaped discharge portion is formed at an end portion of the recess opposite to the lowest end, 2. The board connector according to claim 1, wherein the recess has a guide surface that is inclined so as to gradually increase in height from the lowest end toward the discharge portion.

5. A connector for a board as described in any one of claims 1 to 4, wherein in the non-ejection area excluding the ejection portion which is the highest part of the recess, a collective surface is formed which is inclined in the width direction perpendicular to the longitudinal direction of the board connection portion so that the center of the width direction is higher than the pair of outer surfaces.

6. a circuit board that is installed with its mounting surface facing upward; A connector device comprising the board connector according to claim 1.

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