Manufacturing method of laminated ceramic component

A method for manufacturing multilayer ceramic components using plasma treatment to control electrode shape and dimensions addresses the issue of moon-shaped configurations, simplifying the process and ensuring precise electrode formation.

JP2025114281APending Publication Date: 2025-08-05PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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Patent Information

Application Number
JP2024008885
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-01-24
Publication Date
2025-08-05

AI Technical Summary

Technical Problem

Existing methods for forming external electrodes on multilayer ceramic components, such as multilayer varistors, result in moon-shaped configurations due to the hydrophilicity of the ceramic body, leading to inconsistent electrode dimensions and complicating the manufacturing process.

Method used

A method involving the steps of stacking ceramic green sheets and internal electrode layers, followed by firing, plasma treatment to modify the surface, applying external electrode paste, and heat-treating to form external electrodes, thereby controlling the shape and dimensions.

Benefits of technology

This method suppresses the moon-shaped configuration of external electrodes, simplifying the manufacturing process and enabling precise control over electrode dimensions without the need for liquid immersion and drying steps.

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Abstract

To provide a manufacturing method of a multilayer ceramic component capable of forming an external electrode having a suppressed moon shape.SOLUTION: A manufacturing method of a multilayer ceramic component, includes a first step, a second step, a third step, a fourth step, and a fifth step. In the first step, a lamination body in which a plurality of ceramic green sheets and a plurality of internal electrode paste layers are laminated is prepared. In the second step, the laminated body is fired to form a ceramic body 11. In the third step, plasma treatment is performed on a surface of the ceramic body 11. In the fourth step, an external electrode paste is attached to a part of the surface of the ceramic body 11 after the third step. In the fifth step, the ceramic body 11 after the fourth step is heat-treated to form an external electrode 14.SELECTED DRAWING: Figure 1
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Description

[Technical Field]

[0001] The present disclosure relates to a method for manufacturing a multilayer ceramic component, and more particularly to a method for manufacturing a multilayer ceramic component that includes a step of forming external electrodes on the surface of a ceramic body. [Background technology]

[0002] Multilayer varistors are used to protect various electronic equipment and devices from abnormal voltages caused by lightning surges, static electricity, etc., and to prevent malfunctions of electronic equipment and devices caused by noise generated in circuits.

[0003] In such multilayer ceramic components such as multilayer varistors, external electrodes are formed by applying an external electrode paste onto a hydrophilic ceramic body and then baking it.

[0004] The external electrode paste is applied by, for example, immersing one end surface of the ceramic body in the external electrode paste. However, because the ceramic body is hydrophilic, the external electrode paste spreads while the ceramic body is immersed in the paste, and as a result, the shape of the external electrode formed becomes moon-shaped, which causes large variations in the dimensions of the external electrode or makes it difficult to match the dimensions of the external electrode to the specified values.

[0005] Patent Document 1 describes a method for manufacturing a ceramic electronic component, which includes a step of forming a pair of external electrodes on at least one of the side surfaces of a ceramic body having a substantially rectangular parallelepiped shape with a conductive metal layer inside and portions of the conductive metal layer extending to two opposing end faces, from the two opposing end faces to the ceramic body. The distance between the side edges on the side surfaces is shorter than the distance between the centers. In this manufacturing method, the laminated chip is immersed in a treatment liquid such as a silicone-based mold release agent or a fluorine-based mold release agent prepared at a desired concentration, followed by dehydration and heat treatment. Finally, an external electrode paste is applied, thereby suppressing the formation of a moon-shaped external electrode, and as described above, the distance between the side edges of the pair of external electrodes can be made shorter than the distance between the centers. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] JP 2019-91800 A Summary of the Invention [Problem to be solved by the invention]

[0007] However, the method using a release agent as in Patent Document 1 involves a step of immersing in a liquid, which requires a drying step, and therefore has the disadvantage of complicating the manufacturing process. Furthermore, in the manufacture of a multilayer varistor, external electrodes may be formed on an insulating layer with a high hydrophilicity on the surface of the ceramic element body.

[0008] An object of the present disclosure is to provide a method for manufacturing a multilayer ceramic component that can form external electrodes in which the moon-shaped configuration is suppressed. [Means for solving the problem]

[0009] A method for manufacturing a multilayer ceramic component according to one embodiment of the present disclosure includes a first step of preparing a laminate comprising a plurality of ceramic green sheets and a plurality of internal electrode paste layers stacked together; a second step of firing the laminate to form a ceramic body; a third step of performing plasma treatment on the surface of the ceramic body; a fourth step of applying external electrode paste to a portion of the surface of the ceramic body after the third step; and a fifth step of heat-treating the ceramic body after the fourth step to form external electrodes. [Effects of the Invention]

[0010] According to the present disclosure, by using a simple method to suppress the wetting and spreading of the external electrode paste, it is possible to form external electrodes in which the moon-shaped shape is suppressed, making it easier to control the application dimensions of the external electrodes. [Brief explanation of the drawings]

[0011] [Figure 1] Fig. 1A is a schematic perspective view of an example of a multilayer ceramic part manufactured by the present manufacturing method, and Fig. 1B is a PP cross-sectional view of the same multilayer ceramic part. [Figure 2] 2A and 2B are schematic partial perspective and cross-sectional views of another example of a multilayer ceramic part manufactured by the present manufacturing method, respectively. [Figure 3] FIG. 3 is a schematic top view showing the moon-shaped configuration of the external electrodes in the multilayer ceramic component. DETAILED DESCRIPTION OF THE INVENTION

[0012] 1. Overview Hereinafter, a method for manufacturing a multilayer ceramic component according to an embodiment of the present disclosure will be described with reference to the drawings. Note that the drawings described in the following embodiments are schematic diagrams, and the ratios of the sizes and thicknesses of the components in the drawings do not necessarily reflect the actual dimensional ratios.

[0013] The multilayer ceramic component 1 manufactured by the manufacturing method of this embodiment includes a ceramic body 11, a plurality of internal electrodes 12, and a plurality of external electrodes 14, and examples thereof include a multilayer varistor, a multilayer thermistor, and a multilayer ceramic capacitor.

[0014] In this multilayer ceramic component 1, the ceramic body 11 has end faces S11, S12 facing each other in a first direction (X direction), side faces S21, S22 facing each other in a second direction (Y direction) that intersects with the first direction (X direction), and main faces S31, S32 facing each other in a third direction (Z direction) that intersects with the first direction (X direction) and the second direction (Y direction).

[0015] 1A and 1B are diagrams showing an example of a multilayer ceramic component 1 manufactured by the manufacturing method of this embodiment. As shown in Fig. 1A, in the multilayer ceramic component 1, external electrodes 14 (14A, 14B) formed on all of the main surfaces S31, S32 and on some of the side surfaces S21, S22 each have a generally rectangular shape in a plan view. As shown in Fig. 1B, this multilayer ceramic component 1 includes a ceramic body 11, a pair of internal electrodes 12A, 12B, an insulating layer 13, and a pair of external electrodes 14A, 14B.

[0016] 2A and 2B are views showing another example of a multilayer ceramic component 1 manufactured by the manufacturing method of this embodiment. In the multilayer ceramic component 1 of Fig. 2A, the external electrodes (14C, 14D) formed on parts of the side surfaces S21, S22 and parts of the main surfaces S31, S32 each have a generally rectangular shape in plan view. As shown in Fig. 2B, this multilayer ceramic component 1 includes a ceramic body 11, three internal electrodes 12A, 12B, and 12C, an insulating layer 13, and two pairs of external electrodes 14A, 14B, 14C, and 14D.

[0017] 1A and 2B, the external electrodes 14 (14A, 14B, 14C, 14D) in the multilayer ceramic component 1 obtained by the manufacturing method of this embodiment have a suppressed moon-shape. The manufacturing method of this embodiment makes it possible to form external electrodes 14 with a suppressed moon-shape on various surfaces of the ceramic body 11 or the insulating layer 13, such as the end faces S11, S12, the side faces S21, S22, and the main faces S31, S32.

[0018] The method for manufacturing a multilayer ceramic component of this embodiment includes a first step, a second step, a third step, a fourth step, and a fifth step. In the first step, a laminate (hereinafter also referred to as laminate L) is prepared by stacking a plurality of ceramic green sheets and a plurality of internal electrode paste layers. In the second step, the laminate L is fired to form a ceramic body 11. In the third step, a plasma treatment is performed on the surface of the ceramic body 11. In the fourth step, an external electrode paste is applied to a portion of the surface of the ceramic body 11 after the third step. In the fifth step, the ceramic body 11 after the fourth step is heat-treated to form external electrodes.

[0019] The inventors conducted extensive research to solve the above-mentioned problems and discovered that the shape of the external electrodes can be controlled by performing a specific treatment on the ceramic body, leading to the completion of the present disclosure. The method for manufacturing a multilayer ceramic component of this embodiment includes steps 1 to 5, and thereby enables the formation of external electrodes 14 in the multilayer ceramic component 1 in which the moon-shaped shape is suppressed.

[0020] The reason why the method for manufacturing a multilayer ceramic component of this embodiment, having the above configuration, achieves the above effects is thought to be, for example, that in the third step, by performing plasma treatment on the surface of the ceramic body 11 or the insulating layer 13, the contact angle can be changed or increased, thereby making it possible to suppress the wetting and spreading of the external electrode paste.

[0021] The technique using a release agent in Patent Document 1 described above involves a liquid immersion process, which requires a drying process. Furthermore, the adhesiveness of the release agent makes it easy for the element materials to adhere to each other, necessitating measures that make the manufacturing process complicated. Furthermore, residues of the release agent may remain even after firing, which may affect the characteristics of the manufactured multilayer ceramic component. Furthermore, the technique in Patent Document 1 allows the distance between the side edges of a pair of external electrodes to be shorter than the distance between their centers.

[0022] In contrast, the method for manufacturing a multilayer ceramic component according to the present embodiment simplifies the manufacturing process because the plasma treatment and other processes are dry and no measures are required to prevent adhesion between the element materials. Furthermore, any changes to the surface of the element materials due to the plasma treatment disappear during firing, and even if they remain, they do not affect the properties of the manufactured multilayer ceramic component. Furthermore, by adjusting the conditions for the plasma treatment, firing, and other processes, the planar shape of the external electrodes can be made closer to a rectangular shape.

[0023] 2.Details <Manufacturing method for multilayer ceramic components> The method for manufacturing the multilayer ceramic component of this embodiment (hereinafter also referred to as manufacturing method (I)) includes a first step, a second step, a third step, a fourth step, and a fifth step.

[0024] The manufacturing method (I) may further include a step of forming an insulating layer 13 on the surface of the ceramic body 11 after the second step (hereinafter also referred to as an insulating layer forming step) after the second step and before the third step. When the manufacturing method (I) includes the insulating layer forming step, the surface of the insulating layer 13 is subjected to plasma treatment in the third step. The manufacturing method (I) is advantageous when the insulating layer 13 has a surface that is more hydrophilic than the ceramic body 11.

[0025] Furthermore, the manufacturing method of this embodiment may further include, after the fifth step, a step of forming a plating electrode so as to cover the external electrode 14 after the fifth step (hereinafter also referred to as a plating electrode forming step). Each step will be explained below using the case where the multilayer ceramic component 1 is a multilayer varistor 1 as an example.

[0026] [1st step] In the first step, a laminate is prepared by laminating a plurality of ceramic green sheets and a plurality of internal electrode paste layers.

[0027] The ceramic green sheet contains, for example, a ceramic component, a binder component, etc. The ceramic component usually contains at least zinc oxide (ZnO), PrO 11 , Co2O3, CaO, Bi2O3, etc. Examples of binder components include polyvinyl alcohol, polyvinyl butyral, and ethyl cellulose.

[0028] The ceramic green sheet can be produced, for example, by preparing a slurry containing powder of ceramic components and organic components such as a binder component and a solvent, and then molding this slurry using a coating machine, etc. The thickness of the ceramic green sheet is, for example, 20 μm or more and 50 μm or less.

[0029] The internal electrode paste layer contains, for example, metal powder, such as Pd powder or PdAg powder.

[0030] A laminate L is obtained by laminating a plurality of ceramic green sheets and a plurality of internal electrode paste layers in the third direction (Z direction).

[0031] [Second process] In the second step, the laminate L is fired to form the ceramic body 11. Specifically, the laminate L is cut in a first direction (X direction) and a second direction (Y direction) to obtain a plurality of green bodies (hereinafter also referred to as green bodies G) in which the internal electrode paste layers are partially exposed on the exposed surfaces, and then the green bodies G are fired to form a plurality of ceramic bodies 11. The shape of the green bodies G is usually a rectangular parallelepiped. The green bodies G may have rounded corners.

[0032] The laminate L is fired, for example, by heating the green body G. The heating temperature is, for example, 1300°C or lower. The heating atmosphere can be, for example, air or an inert gas atmosphere. This firing causes the binder components and the like contained in the green body G to be thermally decomposed, and then the ceramic material is sintered to obtain a plurality of ceramic bodies 11.

[0033] The ceramic body 11 obtained in the second step includes a plurality of internal electrodes 12 therein.

[0034] [Insulating layer formation process] In the insulating layer forming step, an insulating layer 13 is formed on the surface of the ceramic body 11 after the second step. For example, a precursor solution containing a glass component is applied to the surface of the ceramic body 11 obtained in the second step, and then heat treatment is performed to form the insulating layer 13 on the surface of the ceramic body 11.

[0035] The term "glass component" refers to an amorphous substance having a softening point. The term "softening point" refers to the temperature at which the glass component begins to deform due to an increase in temperature. Examples of glass components include borosilicate zincate glass. In addition to the glass component, the precursor solution may contain, for example, a binder component such as ethyl cellulose, an organic component such as a solvent, and the like. The softening point of the glass component is, for example, 300°C or higher and 500°C or lower.

[0036] The insulating layer 13 may be formed on a part of the surface of the ceramic body 11 or on the entire surface of the ceramic body 11 .

[0037] [3rd step] In the third step, a plasma treatment is performed on the surface of the ceramic body 11. If the insulating layer forming step is performed after the second step, the surface of the insulating layer 13 is subjected to a plasma treatment in the third step.

[0038] The plasma treatment can be carried out using, for example, a plasma treatment device, etc. The plasma may be atmospheric pressure plasma or vacuum plasma.

[0039] Examples of gases used in the plasma treatment include hydrocarbons, fluorocarbons, fluorine, oxygen, air, hydrogen, and inert gases. Examples of hydrocarbons include methane, Examples of fluorocarbons include C n F m (n and m are natural numbers), etc., and are CF4, C2F4, C3F6, C4F8, C4F 10 etc. Examples of the inert gas include argon and nitrogen.

[0040] The gas used in the plasma treatment is preferably carbon fluoride, more preferably C4F8, from the viewpoint of being able to increase the contact angle on the surface of the ceramic body 11 or the insulating layer 13 more easily.

[0041] The plasma treatment time is, for example, 5 seconds or more, preferably 10 seconds or more, more preferably 20 seconds or more, even more preferably 45 seconds or more, and particularly preferably 75 seconds or more. The upper limit of the plasma treatment time is not particularly limited, but is, for example, 5 minutes or less, preferably 2 minutes or less.

[0042] The plasma treatment may be performed on a part of the surface of the ceramic body 11 or the insulating layer 13, or on the entire surface of the ceramic body 11 or the insulating layer 13.

[0043] Before the plasma treatment, a cleaning pretreatment may be performed on the surface of the ceramic body 11 or the insulating layer 13. This cleaning pretreatment may be performed by, for example, argon plasma treatment for about 30 seconds.

[0044] After the third step, the surface of ceramic body 11 or insulating layer 13 is preferably hydrophobized by plasma treatment. "Hydrophobized" means that the contact angle of water on the surface of ceramic body 11 or insulating layer 13 after plasma treatment (hereinafter also referred to as the contact angle after plasma treatment) is larger than that before plasma treatment (hereinafter also referred to as the contact angle before plasma treatment).

[0045] The contact angle increase before and after plasma treatment (=contact angle after plasma treatment - contact angle before plasma treatment) is, for example, 60° or more, preferably 65° or more, more preferably 70° or more, and even more preferably 75° or more. There is no particular limitation on the upper limit of the contact angle increase, but it is, for example, 90° or less.

[0046] The contact angle after plasma treatment is, for example, 100° or more, preferably 105° or more, more preferably 110° or more, even more preferably 113° or more, and particularly preferably 115° or more. The upper limit of the contact angle after plasma treatment is not particularly limited, but is, for example, 130° or less, preferably 120° or less.

[0047] [4th step] In the fourth step, the external electrode paste is applied to a part of the surface of the ceramic body 11 after the third step. If the insulating layer forming step is performed after the second step, in the fourth step, the external electrode paste is applied to a part of the surface of the insulating layer 13 after the third step. According to manufacturing method (I), it is possible to suppress the wetting and spreading of the external electrode paste in the fourth step.

[0048] The external electrode paste contains metal powder, such as Ag powder, AgPd powder, AgPt powder, etc. The external electrode paste may further contain glass components such as Bi2O3, SiO2, and B2O3, resin components, and solvents.

[0049] Examples of methods for applying the external electrode paste include a dipping method in which the ceramic body 11 or the insulating layer 13 is dipped into the external electrode paste in a container, and a roller transfer method in which the external electrode paste attached to a convex plate is applied to the ceramic body 11 or the insulating layer 13 by pressing it against the ceramic body 11 or the insulating layer 13.

[0050] There are no particular limitations on the locations on the ceramic body 11 or the insulating layer 13 where the external electrode paste is applied, and it may be on the end faces S11, S12, the side faces S21, S22, or the main faces S31, S32.

[0051] In this way, the manufacturing method (I) can be applied to the formation of both the end surface external electrodes 14A, 14B and the side surface external electrodes 14C, 14D.

[0052] [5th step] In the fifth step, the ceramic body 11 after the fourth step is heat-treated to form the external electrodes 14. If the insulating layer formation step is performed after the second step, the insulating layer 13 after the fourth step is heat-treated in the fifth step to form the external electrodes 14. According to manufacturing method (I), fluorine atoms bonded to or attached to the ceramic body 11 or the insulating layer 13 can be removed by the heat treatment in the fifth step.

[0053] Specifically, the heat treatment is carried out by heating the external electrode paste to a temperature of, for example, 700°C or higher and 800°C or lower.

[0054] It is preferable that no fluorine atoms are present in the surface layer of the ceramic body 11 after the fifth step in the portion where the external electrodes 14 are not formed. If the insulating layer forming step is performed after the second step, it is preferable that no fluorine atoms are present in the surface layer of the insulating layer 13 after the fifth step in the portion where the external electrodes 14 are not formed. The absence of fluorine atoms in the surface layer of the ceramic body 11 or the insulating layer 13 allows for smooth plating in the plating electrode forming step described below without any problems caused by the buoyancy of the object to be plated.

[0055] "No fluorine atoms are present in the surface layer" means that there are substantially no fluorine atoms present. "Surface layer" generally refers to a region within 10 nm from the surface, and this distance corresponds to the detection depth of X-ray fluorescence (XRF) analysis. "Substantially no fluorine atoms are present" means that the concentration of fluorine atoms is below the lower detection limit of XRF analysis.

[0056] 3 is a diagram showing the moon-shaped external electrodes 14 (14A, 14B) formed on parts of the main surface S31 of the ceramic body 11 in the multilayer ceramic component 1. In Fig. 3, L1 is the maximum length in the second direction (Y direction) of the moon-shaped external electrode 14B (the length in the second direction (Y direction) of the external electrode 14B at the center in the first direction (X direction) of the external electrode 14B), and L1s is the minimum length in the second direction (Y direction) of the external electrode 14B (the length in the second direction (Y direction) of the external electrode 14B at both ends in the first direction (X direction) of the external electrode 14B).

[0057] In the external electrodes 14 of the multilayer ceramic component 1 after the fifth step, the value of (L1-L1s) (hereinafter also referred to as the moon shape difference M) is a numerical value that indicates the degree of moon shape of the external electrodes 14.

[0058] The measured values of the moon shape difference M (arithmetic mean value at any 10 points) and the surface water contact angle N of the multilayer ceramic part 1 after the fifth step by manufacturing method (I) were (M: 0.060, N: 38°) when no plasma treatment was performed, whereas when plasma treatment was performed in the presence of carbon fluoride, the values were (M: 0.021, N: 108°) at plasma treatment times of 15 seconds, (M: 0.026, N: 108°) at 30 seconds, (M: 0.021, N: 115°) at 60 seconds, and (M: 0.019, 118°) at 90 seconds.

[0059] In this way, according to the manufacturing method (I), it is possible to prevent the external electrodes 14 (14A, 14B, 14C, 14D) of the multilayer ceramic component 1 from having a moon shape. This makes it easier to control the application dimensions of the external electrodes 14.

[0060] In the manufacturing method (I), the fourth and fifth steps may be repeated to form a secondary external electrode as the external electrode 14 in addition to the primary external electrode.

[0061] [Plating electrode formation process] In the plating electrode forming step, plating electrodes are formed so as to cover the external electrodes 14 .

[0062] The plating electrode can be formed, for example, by electrolytic plating or by sequentially plating Ni and Sn.

[0063] As described above, manufacturing method (I) can produce a multilayer varistor 1 in which the ceramic body 11 contains zinc oxide as a main component and the external electrodes 14 are suppressed from forming a moon-shaped configuration. Manufacturing method (I) can also be suitably used for a multilayer varistor 1 that may have an insulating layer 13 with a highly hydrophilic surface.

[0064] Furthermore, by the manufacturing method (I), it is possible to manufacture a multilayer thermistor, a multilayer ceramic capacitor, etc. having external electrodes 14 in which the moon-shaped configuration is suppressed, similar to the above-mentioned multilayer varistor.

[0065] In the multilayer thermistor, the ceramic body 11 contains, for example, Mn, Co, Fe, Al, Cu, etc., the internal electrode paste layers contain, for example, Pd, etc., and the external electrode paste contains, for example, Cu, etc.

[0066] The multilayer ceramic capacitor has a ceramic body 11 containing, for example, BaTiO3, CaZrO3, CaTiO3, SrTiO3, etc. as a main component, and MgO, Dy2O3, SiO2, MnO2, etc. as a secondary component, an internal electrode paste layer containing, for example, Pt, Pd, Ag, Au, Ni, Cu, Sn, etc., and an external electrode paste containing, for example, Cu, Ni, Al, Zn, Cu-Ni, etc.

[0067] (summary) As is clear from the above embodiments, the present disclosure includes the following aspects. In the following, reference numerals are given in parentheses only to clarify the correspondence with the embodiments.

[0068] The method for manufacturing a multilayer ceramic component according to the first aspect includes a first step, a second step, a third step, a fourth step, and a fifth step. In the first step, a laminate (L) is prepared by laminating a plurality of ceramic green sheets and a plurality of internal electrode paste layers. In the second step, the laminate (L) is fired to form a ceramic body (11). In the third step, a plasma treatment is performed on the surface of the ceramic body (11). In the fourth step, an external electrode paste is applied to a portion of the surface of the ceramic body (11) after the third step. In the fifth step, the ceramic body (11) after the fourth step is heat-treated to form external electrodes (14).

[0069] According to the first aspect, it is possible to obtain a multilayer ceramic component (1) having external electrodes (14) that are suppressed from spreading and have a moon-shaped configuration by suppressing the wetting of the external electrode paste, thereby making it easier to control the application dimensions.

[0070] In the method for producing a multilayer ceramic part of the second aspect, the plasma treatment in the third step of the first aspect is carried out in the presence of a carbon fluoride.

[0071] According to the second aspect, the contact angle of the surface after the plasma treatment can be further increased by the plasma treatment using fluorocarbon, and the moon-shaped shape of the external electrode (14) can be further suppressed.

[0072] In the method for producing a multilayer ceramic part of the third aspect, in the first or second aspect, the surface of the ceramic body (11) after the third step has been made hydrophobic by plasma treatment.

[0073] According to the third aspect, the surface is made hydrophobic by plasma treatment, so that the moon shape of the external electrode (14) can be further suppressed.

[0074] In the method for manufacturing a multilayer ceramic component of the fourth aspect, in the second or third aspect, no fluorine atoms are present in the surface layer of the ceramic body (11) after the fifth step in the portion where the external electrodes (14) are not formed.

[0075] According to the fourth aspect, since no fluorine atoms are present in the surface layer, there are no problems due to the buoyancy of the object to be plated in the plating electrode formation step, and the plating operation can be carried out smoothly.

[0076] In the fifth aspect of the method for manufacturing a multilayer ceramic part, in any one of the first to fourth aspects, after the second step and before the third step, a step of forming an insulating layer (13) on the surface of the ceramic body after the second step is further included, and in the third step, the surface of the insulating layer (13) is subjected to plasma treatment.

[0077] According to the fifth aspect, the method for manufacturing the multilayer ceramic component (1) of the present disclosure is highly advantageous when employed in the case where the insulating layer (13) has a surface that is more hydrophilic than the ceramic body (11).

[0078] In the method for manufacturing a multilayer ceramic component of the sixth aspect, in any one of the first to fifth aspects, the multilayer ceramic component (1) is a multilayer varistor (1) in which the ceramic body (11) contains zinc oxide as a main component.

[0079] According to the sixth aspect, the method for manufacturing the multilayer ceramic component (1) of the present disclosure can also be suitably used for a multilayer varistor (1) that may have an insulating layer (13) with a highly hydrophilic surface. [Explanation of symbols]

[0080] 1. Multilayer ceramic parts 11 Ceramic body 12A, 12B, 12C internal electrode 13 Insulating layer 14A, 14B, 14C, 14D external electrode

Claims

1. A first step of preparing a laminate in which a plurality of ceramic green sheets and a plurality of internal electrode paste layers are laminated; a second step of firing the laminate to form a ceramic body; a third step of performing a plasma treatment on the surface of the ceramic body; a fourth step of applying an external electrode paste to a portion of the surface of the ceramic body after the third step; a fifth step of heat-treating the ceramic body after the fourth step to form external electrodes; Equipped with Manufacturing method for multilayer ceramic components.

2. The plasma treatment in the third step is carried out in the presence of fluorocarbon. The method for producing a multilayer ceramic part according to claim 1 .

3. The surface of the ceramic body after the third step is made hydrophobic by the plasma treatment. The method for manufacturing a multilayer ceramic part according to claim 1 or 2.

4. After the fifth step, no fluorine atoms are present in the surface layer of the ceramic body in the portion where the external electrodes are not formed. The method for producing a multilayer ceramic part according to claim 2 .

5. After the second step and before the third step, forming an insulating layer on the surface of the ceramic body after the second step; Furthermore, In the third step, the surface of the insulating layer is subjected to the plasma treatment. The method for manufacturing a multilayer ceramic part according to claim 1 or 2.

6. The multilayer ceramic component is a multilayer varistor in which the ceramic body contains zinc oxide as a main component. The method for producing a multilayer ceramic part according to claim 5 .

Citation Information

Patent Citations

  • Ceramic electronic component and method of manufacturing the same

    JP2019091800A